Display module and display device

Abstract

The application relates to a display module and a display device, wherein the display module comprises: a first display panel comprising a functional area and a plurality of hollow areas, the functional area comprising a first driving layer and a first chip array, and the first chip array comprising a plurality of first light-emitting chips; a second display panel comprising a second driving layer and a second chip array, the second chip array comprising a plurality of second light-emitting chips which are distributed at intervals on the second driving layer, and light emitted by the second light-emitting chips passing through the hollow areas and being emitted through a display surface; and a light shielding piece arranged on a side of the first display panel facing the second display panel, the light shielding piece being arranged around each second light-emitting chip, the display module having a first display state and a second display state, at least the first light-emitting chips emitting light in the first display state, and the second light-emitting chips emitting light in the second display state. The display module provided by the application can realize switching between a peep-proof state and a sharing state, and has a simple and reliable structure.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] Existing privacy display panels typically achieve privacy functionality by attaching an external privacy film or placing a light-shielding layer on top of the light-emitting unit. If further conversion between shared and privacy states is required, reversible color-changing materials are usually needed. However, the above structures and methods are mainly applied to OLED display panels. If the conversion between privacy and shared states needs to be achieved in Micro LED or Mini LED display panels, due to the fundamental differences in their pixel structure, driving method, and packaging form compared to OLED, directly transplanting the above privacy structures can easily lead to problems such as difficulty in matching the light-shielding structure with the independent chip array, obstruction of driving traces, difficulty in controlling the side light emission of the chips, and excessive structural complexity leading to increased display panel thickness.

[0003] Therefore, there is an urgent need for a display module that uses Micro LED or Mini LED as the light-emitting element, which can switch between privacy mode and sharing mode, as well as a corresponding display device. Summary of the Invention

[0004] This application provides a display module and display device. The display module can switch between a privacy mode and a shared mode for display modules using Micro LED or Mini LED, and has a simple and reliable structure.

[0005] In a first aspect, an embodiment of this application provides a display module, including a first substrate, a second substrate, and a display surface disposed opposite to each other. The display surface is located on the side of the first substrate facing away from the second substrate. The display module further includes: a first display panel, including a functional area and multiple cutout areas. The functional area includes a first driving layer and a first chip array. The first driving layer includes multiple first routing lines, multiple first column routing lines, and a first welding portion that at least partially overlaps with the intersection of the multiple first routing lines and the multiple first column routing lines. The first chip array includes multiple first light-emitting chips, each of which is disposed in the first welding portion; and a second display panel, including a second driving layer and a second chip array. The array, the second chip array includes a plurality of second light-emitting chips spaced apart on the second driving layer. The orthographic projection of the plurality of second light-emitting chips on the first display panel falls into the corresponding cutout areas. The light emitted from the second light-emitting chips passes through the cutout areas and is emitted through the display surface. The first display panel and the second display panel are both disposed between the first substrate and the second substrate. The side of the first display panel facing the second display panel is also provided with a light-shielding member, which is arranged around each of the second light-emitting chips. The display module has a first display state and a second display state. In the first display state, at least the first light-emitting chip emits light. In the second display state, the second light-emitting chip emits light.

[0006] According to one aspect of the present application, in a second display state, the spacing between the first chip array and the first substrate is smaller than the spacing between the second chip array and the first substrate.

[0007] According to one aspect of the embodiments of this application, a second light-emitting chip is connected and disposed on a second substrate, and a light-shielding member is connected between a first light-emitting chip plate and a second substrate; along the thickness direction, the extension dimension of the light-shielding member is greater than the distance between the surface of the second light-emitting chip away from the second substrate and the second substrate.

[0008] According to one aspect of the embodiments of this application, the light-shielding member includes an elastic substrate layer, and / or the light-shielding member includes an elastic adhesive.

[0009] According to one aspect of the embodiments of this application, a first driving layer is disposed on the side surface of the light-shielding member away from the second substrate. Along the thickness direction, the orthographic projection of the light-shielding member is staggered from the orthographic projection of the hollow area, and the light-shielding member is disposed around each of the second light-emitting chips.

[0010] According to one aspect of the embodiments of this application, the display module further includes a buffer layer, the thickness of which is equal to the distance between the first substrate and the second substrate along the thickness direction, and the buffer layer covers the first light-emitting chip, the second light-emitting chip and the light-shielding member.

[0011] According to one aspect of the embodiments of this application, a first display panel and a second display panel are respectively disposed on the first substrate and the second substrate on the side facing each other; the display module further includes a connection layer disposed on the first substrate and covering the first display panel therein, so that the first display panel is connected to the first substrate.

[0012] According to one aspect of the embodiments of this application, a first chip array is disposed between a first driving layer and a first substrate; or, the first driving layer is disposed between the first substrate and the first chip array, and the display module further includes a reflective layer, which is disposed on the surface of the connecting layer away from the first substrate, and along the thickness direction, the orthographic projection of the reflective layer covers the orthographic projection of each first light-emitting chip, so that the light emitted by the first light-emitting chip is reflected by the reflective layer and then emitted through the display surface.

[0013] According to one aspect of the embodiments of this application, a first driving layer is disposed between a first substrate and a first chip array. In a cross-section perpendicular to its own extension direction, the cross-sectional pattern formed by the connecting layer is trapezoidal, and the length of the side edge of the cross-sectional pattern close to the first substrate is greater than the length of the side edge of the cross-sectional pattern away from the first substrate.

[0014] According to one aspect of the embodiments of this application, a first driving layer is disposed between a first substrate and a first chip array, and a reflective layer is at least partially reused as a light-shielding element.

[0015] According to one aspect of the embodiments of this application, in a first display state, both the first light-emitting chip and the second light-emitting chip emit light; the spacing between one of the first chip array and the second chip array and the first substrate is adjustable, while the spacing between the other and the first substrate is relatively fixed, and along the thickness direction, the spacing between the first chip array and the second chip array in the first display state is smaller than the spacing between the first chip array and the second chip array in the second display state.

[0016] According to one aspect of the embodiments of this application, along the thickness direction, the distance between the first substrate and the second substrate in the first display state is smaller than the distance between the first substrate and the second substrate in the second display state.

[0017] According to one aspect of the embodiments of this application, the display module further includes a driving component, which is at least partially connected between the first substrate and the second substrate, and is configured to drive one of the first substrate and the second substrate to move relative to the other in a thickness direction, so that one of the first chip array and the second chip array moves relative to the other in a thickness direction.

[0018] According to one aspect of the embodiments of this application, a second display panel is connected to a second substrate, and a light-shielding member is connected between the first display panel and the second substrate; the light-shielding member is at least partially elastic, and the first substrate can be pressed against the light-shielding member by a first light-emitting chip, so that the light-shielding member is compressed or stretched in the thickness direction.

[0019] According to one aspect of the embodiments of this application, the display module further includes a buffer layer disposed on the side surface of the first substrate facing the second substrate, and the buffer layer is at least partially sandwiched between the first chip array and the first substrate.

[0020] According to one aspect of the embodiments of this application, in a first display state, along the thickness direction, the second light-emitting chip protrudes at least partially from the light-shielding member on the side where the first substrate is located.

[0021] According to one aspect of the embodiments of this application, each first light-emitting chip and each second light-emitting chip include a display driver chip, a plurality of sub-light-emitting units and a package, wherein the sub-light-emitting units are electrically connected to the display driver chip, and the package encapsulates the display driver chip and the sub-light-emitting units.

[0022] Secondly, according to embodiments of this application, a display device is provided, including the display module in any embodiment of the first aspect.

[0023] The display module provided in this embodiment includes a first substrate, a second substrate, and a first display panel and a second display panel located between the two substrates. The first display panel has a functional area for setting a driving layer and a light-emitting chip, as well as a cutout area enclosed by the functional area. By setting a light-shielding member on the side of the first display panel facing the second display panel and ensuring that the second light-emitting chip can only emit light through the cutout area, the light emission angle of the second light-emitting chip can be limited within a certain range. Therefore, by activating different display panels in the first and second display states, it is possible to conveniently switch between a shared state and a privacy state. The structure is simple and reliable and suitable for display modules using Micro LED and Mini LED. Attached Figure Description

[0024] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0025] Figure 1 This is a schematic diagram of the structure of a display module provided in one embodiment of this application; Figure 2 yes Figure 1 An enlarged view of region P shown; Figure 3 This is a cross-sectional structural schematic diagram of a display module provided in one embodiment of this application; Figure 4This is a cross-sectional view of a display module provided in another embodiment of this application; Figure 5 This is a cross-sectional view of a display module provided in another embodiment of this application; Figure 6 This is a cross-sectional view of a display module provided in another embodiment of this application; Figure 7 This is a cross-sectional view of a display module provided in another embodiment of this application; Figure 8 yes Figure 3 A magnified view of region Q shown; Figure 9 This is a schematic diagram of the structure of a display device provided in one embodiment of this application.

[0026] in: 100 - Display module; 200 - Display device; 101 - First substrate; 102 - Second substrate; 103 - Display surface; 10-First display panel; 20-Second display panel; 30-Light shield; 40-Buffer layer; 50-Connecting layer; 60-Reflective layer; 11-Functional area; 12-Drilled-out area; 13-First driving layer; 14-First chip array; 21-Second driving layer; 22-Second chip array; 131-First routing line; 132-First column routing line; 141-First light-emitting chip; 142-Display driver chip; 143-Sub-light-emitting unit; 144-Package; 221-Second light-emitting chip; X - Thickness direction.

[0027] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0028] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0030] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0031] It should be understood that although the terms "first" and "second" may be used to describe the form of the display device in the embodiments of this application, these forms should not be limited to these terms, which are only used to distinguish these forms from each other. For example, without departing from the scope of the embodiments of this application, the first form may also be referred to as the second form, and similarly, the second form may also be referred to as the first form.

[0032] The features and exemplary embodiments of various aspects of this application will now be described in detail. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0033] With the development of display technology, users' demands for display panel functions are gradually increasing. In order to balance the protection of personal privacy with the requirements of display power consumption and brightness, some existing display panels have emerged that can switch between privacy mode and sharing mode.

[0034] Based on this, the inventors discovered that existing privacy-protecting display panels generally use OLED display technology. Each pixel in an OLED panel consists of an organic light-emitting layer and electrodes. Privacy protection solutions typically rely on setting up light-shielding barriers, black matrices, etc., inside or above the OLED light-emitting layer, or using the waveguide characteristics between the organic light-emitting layer and the encapsulation structure to control the light emission angle.

[0035] Similar to OLED display panels, Micro LED and Mini LED display panels are also widely used in the market. However, their pixel structure, driving method, and packaging form are fundamentally different from OLED. Micro LED and Mini LED display panels typically use a large number of independent micro inorganic light-emitting chips, which are arranged on the driving substrate through mass transfer, welding, or mounting. There are obvious physical gaps between pixels, and the light-emitting chips are rigid solid devices, lacking the continuous organic light-emitting layer of OLED.

[0036] Therefore, if the privacy protection structure based on OLED is directly transplanted into Micro LED or Mini LED panels, problems such as difficulty in matching the light-shielding structure with the independent chip array, obstruction of the driving traces, and difficulty in controlling the side light emission of the chip will easily occur. It is also not convenient to switch between privacy protection and sharing modes.

[0037] To address the aforementioned technical problems, embodiments of this application provide a display module and display device that can provide a module structure adapted to the structure of a display panel using Micro LED or Mini LED, enabling switching between privacy and sharing modes.

[0038] Furthermore, to better understand this application, the following will be combined with... Figures 1 to 9 The display panel, the driving method for the display panel, and the display device provided in the embodiments of this application will be described in detail.

[0039] Please refer to the following: Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 2 yes Figure 1 An enlarged view of region P shown. Figure 3 This is a cross-sectional structural diagram of a display module provided in one embodiment of this application.

[0040] In a first aspect, according to an embodiment of this application, a display module 100 is provided, including a first substrate 101, a second substrate 102, and a display surface 103 disposed opposite to each other. The display surface 103 is located on the side of the first substrate 101 facing away from the second substrate 102. The display module 100 further includes: a first display panel 10, including a functional area 11 and a plurality of hollow areas 12. The functional area 11 includes a first driving layer 13 and a first chip array 14. The first driving layer 13 includes a plurality of first routing lines 131, a plurality of first column routing lines 132, and a first welding portion that at least partially overlaps with the intersection of the plurality of first routing lines 131 and the plurality of first column routing lines 132. The first chip array 14 includes a plurality of first light-emitting chips 141, each of the first light-emitting chips 141 being disposed in the first welding portion; and a second display panel 20, including a second driving layer 21 and a second driving layer 22. The second chip array 22 includes a plurality of second light-emitting chips 221 spaced apart on the second driving layer 21. The projections of the plurality of second light-emitting chips 221 onto the first display panel 10 fall into the corresponding cutout areas 12. The light emitted from the second light-emitting chips 221 passes through the cutout areas 12 and is emitted through the display surface 103. The first display panel 10 and the second display panel 20 are both disposed between the first substrate 101 and the second substrate 102. A light-shielding member 30 is also disposed on the side of the first display panel 10 facing the second display panel 20. The light-shielding member 30 is disposed around each of the second light-emitting chips 221. The display module 100 has a first display state and a second display state. In the first display state, at least the first light-emitting chip 141 emits light. In the second display state, the second light-emitting chip 221 emits light.

[0041] This application first provides a display module 100, which includes a first substrate 101 and a second substrate 102 disposed opposite to each other, and has a display surface 103 located on the side of the first substrate 101 facing away from the second substrate 102, that is, the light-emitting surface of the display module 100. The first substrate 101 and the second substrate 102 can be rigid substrates made of materials such as glass or flexible substrates made of materials such as PI (Polyimide). The display surface 103 is the surface from which light is finally emitted and for the user to observe. The materials, dimensions, and thicknesses of the first substrate 101 and the second substrate 102 can be the same or different. The first substrate 101 and the second substrate 102 can be used to provide support and protection, and the first display panel 10 and the second display panel 20 are both disposed between the first substrate 101 and the second substrate 102.

[0042] Furthermore, the display module 100 also includes a first display panel 10 and a second display panel 20, each of which includes a light-emitting chip for display. The first display panel 10 can be divided into a functional area 11 and multiple cutout areas 12. The functional area 11 contains a first driving layer 13 and a first chip array 14, while the cutout areas 12 are offset from the aforementioned structure. Optionally, the cutout areas 12 can be enclosed by the functional areas 11.

[0043] The first driving layer 13 has multiple first walking lines 131 and multiple first column lines 132, which extend along two intersecting directions, or more preferably, perpendicularly, for example, along the row and column directions of the display module 100, to facilitate precise control of each light-emitting chip. Thus, the first walking lines 131 and first column lines 132 at least partially overlap at their intersections, forming a first solder joint at the intersection. The first solder joint may include multiple pads. The first chip array 14 includes multiple first light-emitting chips 141, each first light-emitting chip 141 being bonded to a corresponding first solder joint and electrically connected to the first walking lines 131 and the first column lines 132. The first solder joints and the first light-emitting chips 141 may be configured in a one-to-one correspondence, and the electrical signals transmitted through the first walking lines 131 and the first column lines 132 control the display of each first light-emitting chip 141.

[0044] Optionally, the second display panel 20 includes a second driving layer 21 and a second chip array 22. The second chip array 22 includes a plurality of second light-emitting chips 221 spaced apart on the second driving layer 21. The second light-emitting chips 221 and the second driving layer 21 are optionally bonded together via pads. It is understood that the second driving layer 21 may include routing lines and column routing lines similar to the first driving layer 13, and the second light-emitting chips 221 are connected at the intersection of the two types of routing lines.

[0045] Based on this, the orthographic projections of multiple second light-emitting chips 221 on the first display panel 10 fall into their respective corresponding cutout areas 12. That is, along the thickness direction X, the cutout areas 12 on the first display panel 10 and the second light-emitting chips 221 are arranged facing each other, optionally in a one-to-one arrangement. Furthermore, the light emitted from the second light-emitting chips 221 can and can only pass through the cutout areas 12 and exit through the display surface 103, so that the light emission angle of the second light-emitting chips 221 can be controlled by the first display panel 10 and the light-shielding member 30 disposed on the first display panel 10.

[0046] Specifically, a light-shielding member 30 is also provided on the side of the first display panel 10 facing the second display panel 20. The light-shielding member 30 is arranged around each of the second light-emitting chips 221, forming a barrier extending circumferentially along the second light-emitting chips 221. Optionally, the light-shielding member 30 can be provided separately from the first display panel 10, or the light-shielding member 30 can be formed by reusing the opaque structure in the first display panel 10. Thus, in this application, the first display panel 10 and the second display panel 20 can be optionally at least partially staggered in the thickness direction X, so that the light-shielding member 30 located on the side of the first display panel 10 facing the second display panel 20 blocks the lateral light emission of the second light-emitting chips 221, so that only the positive portion of the light emitted by the second light-emitting chips 221 that can pass through the hollow area 12 can be emitted through the display surface 103.

[0047] Furthermore, the display module 100 has a first display state and a second display state. In the first display state, at least the first light-emitting chip 141 emits light, and the second display chip may or may not emit light. In this state, the first light-emitting chip 141, which is closer to the display surface 103 and has a wider light-emitting angle, emits light, enabling the display module 100 to switch to a shared state. In the second display state, only the second light-emitting chip 221 emits light, while the first light-emitting chip 141 is off and does not emit light. In this state, only the second display chip, which has a narrower light-emitting angle and can only emit light from the front, emits light, enabling the display module 100 to switch to a privacy mode. Thus, by switching the on / off states of the first and second sets of light-emitting chips, the display module 100 can be conveniently switched between a shared state and a privacy mode.

[0048] Optionally, the first light-emitting chip 141 and the second light-emitting chip 221 can be Micro LED chips or Mini LED chips, the first driving layer 13 and the second driving layer 21 can be thin film transistor driving arrays or printed circuit board substrates, and the routing lines and column routing lines can be transparent conductive materials or metal materials commonly used in the display surface 103 board.

[0049] In this embodiment, the display module 100 arranges the first light-emitting chip 141 and the second light-emitting chip 221 in layers along the thickness direction X of the display module 100, and uses the hollow area 12 on the first display panel 10 to allow the light emitted from the second light-emitting chip 221 to pass through. The display module 100 can arrange the two sets of light-emitting chips in a staggered manner in space, thereby limiting the light emission angle of the second chip array 22 without causing mutual occlusion.

[0050] Specifically, a light-shielding member 30, disposed on the side of the first display panel 10 facing the second display panel 20, surrounds the second light-emitting chip 221, thus limiting the light emission angle of the second light-emitting chip 221. Therefore, in the second display state, when only the second light-emitting chip 221 emits light, the light can only be emitted through the cutout area 12 with a small divergence angle, giving the display module 100 a narrow viewing angle privacy effect. In the first display state, at least the first light-emitting chip 141 emits light. Since the first light-emitting chip 141 is located above the second light-emitting chip 221 and is not blocked by the light-shielding member 30, its light emission is not limited by the light-shielding member 30, enabling the display module 100 to present a wide viewing angle sharing effect. Thus, this solution does not rely on the specific structure of OLED, can be adapted to independent chip arrays of Micro LED or Mini LED, has a simple structure and high reliability, and can easily switch display states.

[0051] In some alternative embodiments, in the second display state, the spacing between the first chip array 14 and the first substrate 101 is smaller than the spacing between the second chip array 22 and the first substrate 101.

[0052] Optionally, in the second display state, i.e., the privacy state, the spacing between the first chip array 14 and the first substrate 101 can be smaller than the spacing between the second chip array 22 and the first substrate 101. Also, in the privacy state, the first chip array 14 and the second chip array 22 can be staggered, with the first chip array 14 located closer to the light-emitting side of the first substrate 101 than the second chip array 22, forming a structure where the first chip array 14 is on the upper layer and the second chip array 22 is on the lower layer.

[0053] Based on this, the cutout area 12 of the first display panel 10 is located above the second chip array 22, so that the light shield 30 can be set at least partially on the same layer as the lower second light-emitting chip 221, providing better lateral light shielding, so that the light emitted by the second light-emitting chip 221 can pass through the cutout area 12 of the first display panel 10 and be emitted.

[0054] By placing the first chip array 14 on the upper layer close to the display surface 103, even when the first chip array 14 is not emitting light in the second display state, the driving layer, wiring, and chip structure in the first display panel 10 can still be kept above the second chip array 22, and together with the light shield 30, restrict the emitted light from the second light-emitting chip 221. Furthermore, by lowering the second light-emitting chip 221, the light emission angle of the second chip array 22 can be further limited, resulting in a smaller light emission angle in the privacy mode. Simultaneously, in the first display state, when the first light-emitting chip 141 emits light, its closer proximity to the display surface 103 reduces the optical path length required for the emitted light, which is beneficial for improving the luminous efficiency in the shared state.

[0055] In some optional embodiments, the second light-emitting chip 221 is connected to the second substrate 102, and the light-shielding member 30 is connected between the first light-emitting chip 141 plate and the second substrate 102; along the thickness direction X, the extension dimension of the light-shielding member 30 is greater than the distance between the side surface of the second light-emitting chip 221 away from the second substrate 102 and the second substrate 102.

[0056] Optionally, the second light-emitting chip 221 can be connected to the second substrate 102, for example, it can be indirectly connected to the second substrate 102 through the second driving layer 21. For example, when manufacturing the display module 100, the second driving layer 21 can be directly formed on the side surface of the second substrate 102 facing the first substrate 101, and then the second light-emitting chip 221 can be bonded to the second driving layer 21, thereby connecting the second display panel 20 to the second substrate 102.

[0057] Meanwhile, the light-shielding member 30 can be connected between the first display panel 10 and the second substrate 102. That is, the first display panel 10 can also be supported by the second substrate 102, and the connection between the two can be achieved through the light-shielding member 30. It can be understood that in the embodiment where the first driving layer 13 includes the first walking line 131 and the first column walking line 132, and the second driving layer 21 also includes walking lines and column walking lines, the walking lines in the two display panels can have areas where they intersect each other. Specifically, each intersection point in the grid-like first driving layer 13 and the second driving layer 21 can be staggered, while the walking lines partially intersect each other, so that the forward light emission of the first light-emitting chip 141 and the second light-emitting chip 221 is smooth.

[0058] At the locations where traces intersect, the traces in the two driving layers should be insulated from each other. For example, the traces in the first driving layer 13 can include an insulating substrate film and conductive traces disposed on the film layer. The insulating substrate film can directly cover the traces in the second driving layer 21 and maintain the same thickness everywhere to facilitate processing; or, the thickness of the substrate film can be reduced at the locations where it intersects with the traces in the second driving layer 21 to keep the conductive traces above flat.

[0059] Furthermore, along the thickness direction X, the extension dimension of the light-shielding member 30 can be greater than the distance between the surface of the second light-emitting chip 221 away from the second substrate 102 and the second substrate 102. That is, the light-shielding member 30 is higher than the height of the top surface of the second light-emitting chip 221 relative to the second substrate 102, so that the light-shielding member 30 protrudes at least partially from the side where the first substrate 101 is located from the second chip array 22. Thus, the second light-emitting chip 221 can be completely blocked by the light-shielding member 30 within the space enclosed by the second substrate 102, the light-shielding member 30, and the first display panel 10. The dimension of the light-shielding member 30 above the top surface of the second light-emitting chip 221 can provide a more reliable light-shielding effect.

[0060] By making the height of the light-shielding member 30 greater than the top surface height of the second light-emitting chip 221, the light-shielding member 30 can better block large-angle side light from the periphery of the second light-emitting chip 221. In the privacy mode, the second light-emitting chip 221 can only emit small-angle light through the upper hollow area 12, further enhancing the privacy effect. Furthermore, the light-shielding member 30 acts as a supporting connection between the second substrate 102 and the first display panel 10, allowing the first chip array 14 and the second chip array 22 to be staggered without the need for additional separate support pillars, thus making the module structure more compact. Simultaneously, by directly or indirectly placing both the first display panel 10 and the second display panel 20 on the second substrate 102, the display module 100 can be easily processed and assembled.

[0061] In some alternative embodiments, the light-shielding element 30 includes a resilient substrate layer, and / or the light-shielding element 30 includes a resilient adhesive.

[0062] Optionally, the light-shielding member 30 in this embodiment can be made of an elastic material. For example, the light-shielding member 30 includes an elastic substrate layer, which can be made of an elastomer material such as silicone, foam, or rubber, and preferably an insulating material. The elastic substrate layer and the second substrate 102 can have good bonding performance, and the elastic substrate layer can provide a stable, reliable, and easy-to-mold support for the upper first display panel 10.

[0063] Alternatively, the light-shielding element 30 in this embodiment may include an elastic adhesive, such as a mesh adhesive with multiple through holes. In embodiments where the light-shielding element 30 includes an elastic adhesive, a dam can be formed around the second light-emitting chip 221 by dispensing or printing, and the adhesive generally retains a certain degree of elasticity after curing. In particular, the mesh adhesive can further enhance the elasticity through a satellite-like three-dimensional mesh frame structure.

[0064] Alternatively, the light-shielding member 30 may also include an elastic substrate layer and an elastic adhesive, for example, the elastic adhesive may be coated on at least one of the upper and lower surfaces of the elastic substrate layer to bond with the first display panel 10 and the second substrate 102.

[0065] By employing an elastic substrate layer and elastic adhesive as the light-shielding component 30, it can achieve the light-shielding function while absorbing the deformation stress of the display module 100 caused by external forces or thermal expansion and contraction through its own elasticity, thereby reducing the risk of damage to the first display panel 10, the second display panel 20, and the light-emitting chip. Furthermore, the elastic adhesive can also provide a certain positional adjustment margin during assembly, improving alignment accuracy and product yield.

[0066] In some optional embodiments, the first driving layer 13 is disposed on the side surface of the light-shielding member 30 away from the second substrate 102. Along the thickness direction X, the orthographic projection of the light-shielding member 30 is offset from the orthographic projection of the hollow area 12, and the light-shielding member 30 is disposed around each of the second light-emitting chips 221.

[0067] Optionally, the first driving layer 13 can be completely disposed on the surface of the light-shielding member 30 facing away from the second substrate 102. That is, the shape of the light-shielding member 30 can be set according to the extension direction and position of the traces in the first driving layer 13. In this case, the first chip array 14 can be further disposed on the side of the first driving layer 13 facing away from the light-shielding member 30. At the same time, along the thickness direction X, the orthographic projection of the light-shielding member 30 and the orthographic projection of the cutout area 12 can be staggered, and the orthographic projection of the light-shielding member 30 can completely surround the orthographic projection of each second light-emitting chip 221.

[0068] Specifically, the first driving layer 13 of the first display panel 10 can be attached to or directly fabricated on the upper surface of the light-shielding member 30, using the light-shielding member 30 as a supporting substrate for the first driving layer 13. Simultaneously, the orthogonal projection of the light-shielding member 30 onto the second substrate 102 can be offset from the cutout area 12, meaning the light-shielding member 30 can be perfectly conformally positioned to the supporting first driving layer 13 and the first chip array 14, thereby providing comprehensive and reliable support for the first display panel 10 while ensuring unobstructed light emission from the area above the second light-emitting chip 221. Furthermore, the light-shielding member 30 can form a completely encircling closed enclosure around each of the second light-emitting chips 221, with the interior of the enclosure corresponding to the cutout area 12, to fully define the light emission angle of the second light-emitting chip 221 from various angles, preventing light leakage in any direction.

[0069] Therefore, by setting the light-shielding member 30 to the above structure, the possibility of the light-shielding member 30 interfering with the forward light of the second light-emitting chip 221 can be reduced, while the side light can be completely blocked, ensuring the narrow viewing angle characteristic in the privacy mode, and further improving the overall privacy display effect of the display module 100.

[0070] In some optional embodiments, the display module 100 further includes a buffer layer 40 along the thickness direction X. The thickness of the buffer layer 40 is equal to the distance between the first substrate 101 and the second substrate 102, and the buffer layer 40 covers the first light-emitting chip 141, the second light-emitting chip 221 and the light-shielding member 30.

[0071] Optionally, the display module 100 may further include a buffer layer 40 filled between the first substrate 101 and the second substrate 102, the buffer layer 40 at least partially covering the structure between the two substrates.

[0072] Specifically, the extension dimension of the buffer layer 40 along the thickness direction X can be equal to the distance between the first substrate 101 and the second substrate 102, that is, the buffer layer 40 can completely fill the space between the first substrate 101 and the second substrate 102, including filling the gaps other than the light-emitting chip, the driving layer and the light-shielding member 30. At this time, the upper surface of the buffer layer 40 can contact the first substrate 101 and the lower surface can contact the second substrate 102.

[0073] Optionally, the buffer layer 40 may be made of transparent encapsulating adhesive, such as epoxy resin, silicone, UV-curable adhesive or optically transparent adhesive, and may be formed by hot pressing or potting processes depending on the material used.

[0074] By setting a fully filled buffer layer 40 with the same thickness as the substrate spacing, the first light-emitting chip 141, the second light-emitting chip 221, and the light-shielding component 30 can be completely enclosed, forming a more reliable overall protection. This reduces the possibility of external moisture, oxygen, dust, impurities, etc., intruding and causing adverse effects on the internal electronic components, while also improving the module's resistance to mechanical shock. Furthermore, the buffer layer 40 can also serve as a uniform support layer between the first substrate 101 and the second substrate 102, reducing local stress concentration and improving the overall compressive strength and reliability of the display module 100.

[0075] Optionally, in embodiments where it is inconvenient to completely cover the first display panel 10, the second display panel 20, and the light-shielding member 30 with the buffer layer 40, the buffer layer 40 can be configured as a structure similar to frame adhesive. That is, a buffer layer 40 is only provided around the edge of the substrate, and the buffer layer 40, together with the first substrate 101 and the second substrate 102, forms a well-sealed space, and the first display panel 10, the second display panel 20, and the light-shielding member 30 are all located within this space. In this case, the width of the buffer layer 40 can be set according to its material, specific structure, and sealing requirements, etc., and this application does not impose specific limitations on it.

[0076] Please refer to the following: Figure 4 and Figure 5 , Figure 4 This is a cross-sectional view of a display module provided in another embodiment of this application. Figure 5 This is a cross-sectional structural diagram of a display module provided in another embodiment of this application.

[0077] In some optional embodiments, the first display panel 10 and the second display panel 20 are respectively disposed on the side of the first substrate 101 and the second substrate 102 facing each other; the display module 100 further includes a connecting layer 50, which is disposed on the first substrate 101 and covers the first display panel 10 therein, so that the first display panel 10 is connected to the first substrate 101.

[0078] Unlike the aforementioned embodiment where both the first display panel 10 and the second display panel 20 are connected to the second substrate 102, the first display panel 10 and the second display panel 20 in this application may also be disposed on the side of the first substrate 101 and the second substrate 102 facing each other, respectively.

[0079] Specifically, the first display panel 10 can be directly formed or attached to the inner surface of the first substrate 101, and the second display panel 20 can be formed or attached to the inner surface of the second substrate 102, with the two arranged opposite each other along the thickness direction X. In this embodiment, to ensure stable connection of the first display panel 10 to the bottom surface of the first substrate 101, the display module 100 may further include a connecting layer 50. The connecting layer 50 is disposed on the first substrate 101 and encloses the first display panel 10 inside, thereby fixing the relative positions of the two. The connecting layer 50 may be made of a transparent organic material, such as PI, epoxy resin, or optical adhesive, and may cover the surface of the first display panel 10 and fill its perimeter to provide a certain degree of protection while making the connection.

[0080] In this embodiment, the first display panel 10 and the second display panel 20 are respectively connected and fixed to the first substrate 101 and the second substrate 102. The light-shielding member 30 is connected to the first display panel 10 and indirectly connected and fixed to the first substrate 101 through the first display panel 10. Optionally, when manufacturing the display module 100, the first display panel 10 and the second display panel 20 can be formed on the first substrate 101 and the second substrate 102 respectively, and then the two substrates can be snapped together and connected to form the desired display module 100.

[0081] By having the upper and lower substrates respectively carry the corresponding driving layer and chip array, it is convenient to manufacture and test them independently. At the same time, by covering the first display panel 10 with the connection layer 50, the protection performance and the connection reliability between it and the first substrate 101 can be improved, which helps to simplify the module assembly process.

[0082] In some optional embodiments, the first chip array 14 is disposed between the first driving layer 13 and the first substrate 101; or, the first driving layer 13 is disposed between the first substrate 101 and the first chip array 14, and the display module 100 further includes a reflective layer 60, which is disposed on the surface of the connecting layer 50 away from the first substrate 101, and along the thickness direction X, the orthographic projection of the reflective layer 60 covers the orthographic projection of each first light-emitting chip 141, so that the light emitted by the first light-emitting chip 141 is reflected by the reflective layer 60 and then emitted through the display surface 103.

[0083] In an embodiment where two display panels are respectively connected and disposed on two substrates, the first chip array 14 near the display surface 103 can adopt a variety of different structural forms, such as different light emission directions.

[0084] For example, the first chip array 14 can be disposed between the first driving layer 13 and the first substrate 101, that is, the first light-emitting chip array 14 is disposed on the side of the first driving layer 13 closer to the display surface 103, so that the first light-emitting chip 141 can emit light directly toward the first substrate 101. This can shorten the light emission path and reduce light loss.

[0085] It is understood that in the embodiment where the first chip array 14 emits light directly in the forward direction, the first display panel 10 can be formed on another substrate first, and then the first display panel 10 can be peeled off from the formed substrate and then connected to the first substrate 101 through the connecting layer 50.

[0086] Alternatively, for example, the first driving layer 13 can be disposed between the first substrate 101 and the first chip array 14, in which case the first chip array 14 is located on the side of the first driving layer 13 away from the first substrate 101, that is, the first light-emitting chip 141 emits light towards the side where the second substrate 102 is located. To change the final light emission direction of the first display panel 10, the display module 100 may further include a reflective layer 60, which is disposed on the surface of the connecting layer 50 away from the first substrate 101, and can reflect the light emitted by the first chip array 14 and irradiated by the connecting layer 50 onto the reflective layer 60, so that the light is emitted through the display surface 103.

[0087] Specifically, along the thickness direction X, the orthographic projection of the reflective layer 60 can cover the orthographic projection of each of the first light-emitting chips 141. More preferably, the orthographic projection of the reflective layer 60 can completely cover the orthographic projection of the connecting layer 50, including the sides of the connecting layer 50, to improve the light extraction efficiency. The reflective layer 60 can be made of a metallic material, such as aluminum, silver, or a high-reflectivity dielectric film, and can be formed by sputtering, evaporation, or deposition processes.

[0088] It is understandable that in the embodiment where the first chip array 14 emits light in the forward direction after reflection, the first driving layer 13 can be directly formed on the first substrate 101, and then the first chip array 14 can be connected to the first driving layer 13, that is, the first display panel 10 can be directly formed on the first substrate 101. Subsequently, a connecting layer 50 is provided for reinforcement and a reflective layer 60 is added to change the light emission direction. This structure simplifies the manufacturing process of the display module 100 and improves the uniformity of light emission.

[0089] In some optional embodiments, the first driving layer 13 is disposed between the first substrate 101 and the first chip array 14. In a cross-section perpendicular to its own extension direction, the cross-sectional pattern formed by the connecting layer 50 is trapezoidal, and the length of the side edge of the cross-sectional pattern close to the first substrate 101 is greater than the length of the side edge of the cross-sectional pattern away from the first substrate 101.

[0090] In the embodiment where the first driving layer 13 is disposed between the first substrate 101 and the first chip array 14, the cross-sectional pattern formed by the connecting layer 50 can be trapezoidal in the cross-section perpendicular to its own extension direction, that is, perpendicular to the extension direction of the first routing line 131 or the first column routing line 132 in the first driving layer 13. Specifically, it can be an inverted trapezoid, that is, the length of the side edge of the cross-sectional pattern closer to the first substrate 101 is greater than the length of the side edge of the cross-sectional pattern away from the first substrate 101.

[0091] Therefore, the connecting layer 50 is wider on the side closer to the first substrate 101 and narrower on the side farther from the first substrate 101, forming an inverted trapezoidal cross-section. The reflective layer 60 covers each surface of the connecting layer 50 that does not contact the first substrate 101, that is, it covers the top and side walls of the trapezoid, to form an oblique reflective structure. Optionally, the connecting layer 50 with the trapezoidal cross-section can be obtained by methods such as imprinting, exposure development, or molding.

[0092] By employing a trapezoidal cross-section connecting layer 50 and making the trapezoidal cross-section wider on the side closer to the first substrate 101, the reflective layer 60 can better directionally reflect the emitted light from the first light-emitting chip 141 along the inclined sidewall, reflecting light that might otherwise propagate to the side and downward toward the display surface 103, thereby further improving light utilization. Simultaneously, this structure avoids excessive obstruction of the light-transmitting area of ​​the display area by the connecting layer 50, thus better balancing optical performance and structural strength.

[0093] In some alternative embodiments, the first driving layer 13 is disposed between the first substrate 101 and the first chip array 14, and the reflective layer 60 is at least partially reused as a light-shielding element 30.

[0094] Optionally, in embodiments where a reflective layer 60 is provided, the reflective layer 60 can be at least partially reused as a light-shielding element 30. Specifically, in addition to surrounding the bottom and sides of the first light-emitting chip 141 to reflect light, the reflective layer 60 can also extend partially along the thickness direction X to the vicinity of the second light-emitting chip 221, forming a shielding structure surrounding the second chip array 22.

[0095] For example, in this application, the reflective layer 60 is disposed on the surface of the connecting layer 50. When the reflective layer 60 is a coating, the relative position of the reflective layer 60 and the second chip array 22 can be adjusted by extending the extension dimension of the connecting layer 50 in the thickness direction X. When the reflective layer 60 is a structure that can be shaped independently, the size of the reflective layer 60 can be directly adjusted to change its relative position with the second chip array 22.

[0096] It is understood that in at least a portion of the area where the reflective layer 60 is reused as the light-shielding member 30, the reflective layer 60 may have the same reflective function as the side facing the first chip array 14, so that the light irradiated by the second chip array 22 onto the reflective layer 60 is also reflected; or, the reflective layer 60 may form a light-shielding surface on its outer peripheral surface, such as coating a light-absorbing material in a local area or forming a black matrix layer, etc.

[0097] By reusing at least part of the reflective layer 60 as a light-shielding element 30, the number of independent light-shielding elements 30 and the processing steps can be reduced, simplifying the module structure and manufacturing process, and improving the structural integration of the display module 100.

[0098] Please refer to the following: Figure 6 and Figure 7 , Figure 6 This is a cross-sectional view of a display module provided in another embodiment of this application. Figure 7 This is a cross-sectional structural diagram of a display module provided in another embodiment of this application.

[0099] In some optional embodiments, in the first display state, both the first light-emitting chip 141 and the second light-emitting chip 221 emit light; the spacing between one of the first chip array 14 and the second chip array 22 and the first substrate 101 is adjustable, while the spacing between the other and the first substrate 101 is relatively fixed, and along the thickness direction X, the spacing between the first chip array 14 and the second chip array 22 in the first display state is smaller than the spacing between the first chip array 14 and the second chip array 22 in the second display state.

[0100] The display module 100 in this embodiment can switch between two display states. Optionally, in the first display state, i.e. the shared state, the display module 100 can be configured so that both the first light-emitting chip 141 and the second light-emitting chip 221 emit light. At this time, the second display state is still the privacy-protected state in which only the second light-emitting chip 221 emits light.

[0101] Furthermore, in the display module 100, the spacing between one of the first chip array 14 and the second chip array 22 and the first substrate 101 is adjustable, while the spacing between the other and the first substrate 101 is relatively fixed. Thus, the relative position ratio between the two chip arrays along the thickness direction X is adjustable. Specifically, along the thickness direction X, the spacing between the first chip array 14 and the second chip array 22 in the first display state is smaller than the spacing in the second display state. That is, in the shared state, the two sets of chip arrays are relatively close, while in the privacy-protected state, the two sets of chip arrays are relatively far apart. Due to this change in relative position, the light emission angle of the second light-emitting chip 221 in the shared state can be greater than that in the feedback state.

[0102] With the second light-emitting chip 221 also possessing a large light emission angle, by enabling both sets of light-emitting chips to emit light simultaneously in a shared state, the pixels formed by the first light-emitting chip 141 and the second light-emitting chip 221 can jointly participate in the display, thereby increasing pixel density and improving the resolution and brightness of the display module 100 during the display process. Furthermore, reducing the thickness direction X-spacing of the two chip arrays in the first display state allows their light emission positions to be closer in the depth direction, reducing the possibility of visual misalignment between pixels caused by staggered layering, thus improving pixel density while optimizing image quality at wide viewing angles.

[0103] In some alternative embodiments, the distance between the first substrate 101 and the second substrate 102 in the thickness direction X is smaller than the distance between the first substrate 101 and the second substrate 102 in the second display state.

[0104] As previously described, in the first display state, the spacing between the first chip array 14 and the second chip array 22 can be compressed to increase the pixel density of this shared state. Furthermore, when the spacing between the two chip arrays decreases, the spacing between the two substrates can be reduced synchronously.

[0105] Specifically, along the thickness direction X, the distance between the first substrate 101 and the second substrate 102 in the first display state is smaller than the distance in the second display state. That is, when changing the distance between the two chip arrays, the distance between the first chip array 14 and the second chip array 22 can be changed by adjusting the distance between the first substrate 101 and the second substrate 102 as a whole. When switching to a shared state, the two substrates are brought closer together; when switching to a privacy state, the two substrates are moved further apart. The amount of change in the distance between the two substrates can be the same as or proportional to the required change in the chip array distance.

[0106] By adjusting the spacing between the first substrate 101 and the second substrate 102, the chip array spacing can be changed, which simplifies the internal structure of the first display panel 10 and the second display panel 20. Furthermore, it allows the spacing between the first chip array 14 and the display surface 103 to remain constant or change only slightly, thus facilitating stable display performance.

[0107] In some alternative embodiments, the display module 100 further includes a driving component at least partially connected between the first substrate 101 and the second substrate 102, and the driving component is configured to drive one of the first substrate 101 and the second substrate 102 to move relative to the other in the thickness direction X, so that one of the first chip array 14 and the second chip array 22 moves relative to the other in the thickness direction X.

[0108] Optionally, the display module 100 may further include a driving component connected between the first substrate 101 and the second substrate 102 and configured to drive at least one of them to move relative to the other along the thickness direction X, thereby causing one of the first chip array 14 and the second chip array 22 to move relative to the other along the thickness direction X through a pressing or linkage structure, etc.

[0109] Optionally, the driving component can be any of a micro motor, piezoelectric ceramic actuator, electromagnet, shape memory alloy, or pneumatic / hydraulic drive unit. The driving component can be located at the edge of the module or in the internal support area and electrically connected to an external control circuit or a control chip in the display module 100. To ensure that the first substrate 101 and the second substrate 102 maintain a stable, parallel moving trajectory during relative position changes, and to reduce the possibility of uneven chip pressure due to substrate tilting, the display module 100 can have multiple driving components, or the same driving component can be simultaneously connected to multiple locations on the substrate.

[0110] By setting up the driving components, the spacing between the first substrate 101 and the second substrate 102 can be automatically and precisely controlled, improving response speed and repeatability, and making it suitable for application scenarios that require frequent switching between privacy and sharing modes.

[0111] In some optional embodiments, the second display panel 20 is connected to the second substrate 102, and the light-shielding member 30 is connected between the first display panel 10 and the second substrate 102; the light-shielding member 30 is at least partially elastic, and the first substrate 101 can press against the light-shielding member 30 through the first light-emitting chip 141 so that the light-shielding member 30 is compressed or stretched in the thickness direction X.

[0112] In an embodiment where the second display panel 20 is disposed on the second substrate 102 and the light-shielding member 30 is connected between the first display panel 10 and the second substrate 102, the light-shielding member 30 may be at least partially configured as an elastic member, so that the light-shielding member 30 can at least partially undergo elastic deformation along the thickness direction X. Optionally, the light-shielding member 30 may be made of materials such as elastic adhesive, elastic substrate, sponge, or rubber.

[0113] Specifically, during the movement of the first substrate 101 relative to the second substrate 102, the first substrate 101 can press against the light-shielding member 30 through the first light-emitting chip 141, causing the extension dimension of the light-shielding member 30 along the thickness direction X to decrease or increase with the change in the substrate spacing. That is, the second display panel 20 is fixed relative to the second substrate 102, and the first display panel 10 is suspended above the second display panel 20 through the elastic light-shielding member 30. When the first substrate 101 moves towards the second substrate 102, the first substrate 101 transmits pressure to the light-shielding member 30 through the first light-emitting chip 141 and the first driving layer 13, causing the light-shielding member 30 to be compressed and the distance between the first display panel 10 and the second display panel 20 to decrease; when the first substrate 101 moves away from the second substrate 102, the light-shielding member 30 extends under the action of elastic restoring force, so that the original spacing between the two display panels is restored.

[0114] By setting the light-shielding element 30 as an elastic element, it can provide buffering and reset functions during the state switching process of the display module 100. This allows for the smooth and continuous change of the spacing between the two chip arrays and the spacing between the two substrates through a simple structure. This facilitates the realization of various intermediate display states and reduces the impact on the light-shielding function of the light-shielding element 30.

[0115] In some alternative embodiments, the display module 100 further includes a buffer layer 40 disposed on the side surface of the first substrate 101 facing the second substrate 102, and the buffer layer 40 is at least partially sandwiched between the first chip array 14 and the first substrate 101.

[0116] Optionally, in an embodiment where the first chip array 14 is moved by the compression light-shielding member 30, the display module 100 may further include a buffer layer 40 disposed on the side surface of the first substrate 101 facing the second substrate 102, and at least partially sandwiched between the first chip array 14 and the first substrate 101.

[0117] Optionally, the buffer layer 40 can be a transparent elastic cushioning pad, foam, or gel material. Its thickness can be less than or equal to the initial spacing between the top of the first chip array 14 and the first substrate 101, so that it is sandwiched between the two; or, the maximum thickness of the buffer layer 40 can be greater than the initial spacing, so that the first chip array 14 is at least partially embedded in the buffer layer 40.

[0118] By providing a buffer layer 40 between the first substrate 101 and the first chip array 14, when the first substrate 101 presses down against the first light-emitting chip 141 and pushes it to move, the buffer layer 40 can provide buffering and pressure dispersion, avoiding local stress concentration that could cause the light-emitting chip to crack or the solder joints between it and the driving layer to fall off, thereby improving the service life of the display module 100.

[0119] In some alternative embodiments, in the first display state, along the thickness direction X, the second light-emitting chip 221 is at least partially protruding from the light-shielding member 30 toward the side where the first substrate 101 is located.

[0120] In the first display state, along the thickness direction X, the light-shielding member 30 can be compressed such that at least part of the second light-emitting chip 221 protrudes from the light-shielding member 30 toward the side where the first substrate 101 is located. That is, in the shared state, the light-shielding member 30 is compressed such that its top height is lower than the top surface of the second light-emitting chip 221, so that at least the top region of the second light-emitting chip 221 is exposed from the light-shielding member 30, thereby allowing the light emission angle of the second light-emitting chip 221 to be sufficiently expanded.

[0121] The specific compression stroke of the light-shielding member 30 can be designed according to the spacing between adjacent first light-emitting chip 141 and second light-emitting chip 221, so that the second light-emitting chip 221 is exposed at a certain height to meet the final light emission angle requirements of the second light-emitting chip 221.

[0122] By making the second light-emitting chip 221 at least partially protrude from the light-shielding member 30 in the shared state, the light emitted from its side is no longer completely blocked by the light-shielding member 30, and its light emission angle is expanded. Therefore, in the shared mode, the brightness uniformity under a large viewing angle can be improved, and the brightness of the display screen will not change abruptly within a certain viewing angle range due to excessive blocking by the light-shielding member 30 when both the first chip array 14 and the second chip array 22 are emitting light. Thus, while increasing the pixel density, the display effect of the display module 100 in the first state can be further improved.

[0123] Please see Figure 8 , Figure 8 yes Figure 3 A magnified view of region Q shown.

[0124] In some optional embodiments, each first light-emitting chip 141 and each second light-emitting chip 221 includes a display driver chip 142, a plurality of sub-light-emitting units 143 and a package 144. The sub-light-emitting units 143 are electrically connected to the display driver chip 142, and the package 144 encapsulates the display driver chip 142 and the sub-light-emitting units 143.

[0125] Optionally, each of the first light-emitting chips 141 and each of the second light-emitting chips 221 in the embodiments of this application may include a display driver chip 142, a plurality of sub-light-emitting units 143 and a package 144. Each sub-light-emitting unit 143 is electrically connected to the display driver chip 142, and the package 144 simultaneously covers and encapsulates the display driver chip 142 and the sub-light-emitting units 143.

[0126] Therefore, each light-emitting chip can be an integrated packaged miniature light-emitting device, wherein the display driver chip 142 is used to receive driving signals and provide the required current or voltage to the sub-light-emitting unit 143. The sub-light-emitting unit 143 may include three types of sub-light-emitting units 143: red, green, and blue, each used to emit corresponding monochromatic light to mix and form the desired color. The package 144 encapsulates the display driver chip 142 and the sub-light-emitting unit 143 into a single unit, forming an independent pixel unit. The package 144 can be made of molding resin, epoxy resin, or silicone material, etc., and its top can be formed into planar, spherical, or other shapes as needed, as long as it can achieve the required connection and light-emitting effect.

[0127] By employing an integrated light-emitting chip that encapsulates the display driver chip 142 and multiple sub-light-emitting units 143, the number of external driving traces can be reduced, improving the integration of the pixel array and display uniformity. Simultaneously, the package 144 protects the internal display driver chip 142 and sub-light-emitting units 143, reducing the possibility of mechanical damage and environmental contamination during subsequent processes, thereby improving the overall reliability of the display module 100.

[0128] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of a display device provided in one embodiment of this application.

[0129] Secondly, according to embodiments of this application, a display device 200 is provided, including the display module 100 in any embodiment of the first aspect.

[0130] This application also provides a display device 200 that uses the aforementioned display module 100. The display device 200 can be any product that uses Micro LED and Mini LED, such as a mobile phone, tablet computer, laptop computer, e-reader, or vehicle display terminal.

[0131] The display device 200 provided in this application embodiment has all the beneficial effects of the aforementioned display module 100. For details, please refer to the specific descriptions of the display module 100 in the above embodiments. This embodiment will not repeat them here.

[0132] It is understood that the above description and details are merely exemplary and explanatory, and do not constitute a limitation on this application. Those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display module comprising a first substrate, a second substrate and a display surface, the display surface being located on a side of the first substrate facing away from the second substrate, characterized in that The display module also includes: The first display panel includes a functional area and multiple cutout areas. The functional area includes a first driving layer and a first chip array. The first driving layer includes multiple first walking lines, multiple first column lines, and a first welding part that at least partially overlaps with the intersection of the multiple first walking lines and the multiple first column lines. The first chip array includes multiple first light-emitting chips, and each first light-emitting chip is disposed in the first welding part. The second display panel includes a second driving layer and a second chip array. The second chip array includes a plurality of second light-emitting chips spaced apart on the second driving layer. The orthographic projection of the plurality of second light-emitting chips on the first display panel falls into the corresponding cutout areas. The light emitted from the second light-emitting chips passes through the cutout areas and is emitted through the display surface. Both the first display panel and the second display panel are disposed between the first substrate and the second substrate. The first display panel is provided with a light-shielding member on the side facing the second display panel. The light-shielding member is arranged around each of the second light-emitting chips. The display module has a first display state and a second display state. In the first display state, at least the first light-emitting chip emits light. In the second display state, the second light-emitting chip emits light.

2. The display module of claim 1, wherein, In the second display state, the spacing between the first chip array and the first substrate is smaller than the spacing between the second chip array and the first substrate.

3. The display module according to claim 1 or 2, characterized in that, The second light-emitting chip is connected and disposed on the second substrate, and the light-shielding member is connected between the first light-emitting chip plate and the second substrate; Along the thickness direction of the display module, the extension dimension of the light-shielding member is greater than the distance between the surface of the second light-emitting chip away from the second substrate and the second substrate.

4. The display module according to claim 3, characterized in that, The light-shielding element includes an elastic substrate layer, and / or the light-shielding element includes an elastic adhesive.

5. The display module according to claim 3, characterized in that, The first driving layer is disposed on the side surface of the light-shielding member away from the second substrate. Along the thickness direction, the orthographic projection of the light-shielding member is staggered from the orthographic projection of the hollow area, and the light-shielding member is disposed around each of the second light-emitting chips.

6. The display module according to claim 3, characterized in that, The display module further includes a buffer layer. Along the thickness direction, the thickness of the buffer layer is equal to the distance between the first substrate and the second substrate, and the buffer layer covers the first light-emitting chip, the second light-emitting chip, and the light-shielding element.

7. The display module according to claim 1 or 2, characterized in that, The first display panel and the second display panel are respectively disposed on the first substrate and the second substrate on one side facing each other; The display module further includes a connection layer, which is disposed on the first substrate and covers the first display panel therein, so that the first display panel is connected to the first substrate.

8. The display module according to claim 7, characterized in that, The first chip array is disposed between the first driving layer and the first substrate; Alternatively, the first driving layer is disposed between the first substrate and the first chip array, and the display module further includes a reflective layer disposed on the surface of the connection layer away from the first substrate, and along the thickness direction of the display module, the orthographic projection of the reflective layer covers the orthographic projection of each of the first light-emitting chips, so that the light emitted by the first light-emitting chips is reflected by the reflective layer and then emitted through the display surface.

9. The display module according to claim 8, characterized in that, The first driving layer is disposed between the first substrate and the first chip array. In a cross-section perpendicular to its extension direction, the cross-sectional pattern formed by the connecting layer is trapezoidal, and the length of the side edge of the cross-sectional pattern close to the first substrate is greater than the length of the side edge of the cross-sectional pattern away from the first substrate.

10. The display module according to claim 8, characterized in that, The first driving layer is disposed between the first substrate and the first chip array, and the reflective layer is at least partially reused as the light-shielding element.

11. The display module according to claim 1, characterized in that, In the first display state, both the first light-emitting chip and the second light-emitting chip emit light; The spacing between one of the first chip array and the second chip array and the first substrate is adjustable, while the spacing between the other chip array and the first substrate is relatively fixed. Furthermore, along the thickness direction of the display module, the spacing between the first chip array and the second chip array in the first display state is smaller than the spacing between the first chip array and the second chip array in the second display state.

12. The display module according to claim 11, characterized in that, Along the thickness direction, the distance between the first substrate and the second substrate in the first display state is smaller than the distance between the first substrate and the second substrate in the second display state.

13. The display module according to claim 11, characterized in that, The display module further includes a driving component, which is at least partially connected between the first substrate and the second substrate, and is configured to drive one of the first substrate and the second substrate to move relative to the other along the thickness direction, so that one of the first chip array and the second chip array moves relative to the other along the thickness direction.

14. The display module according to claim 11, characterized in that, The second display panel is connected to the second substrate, and the light-shielding member is connected between the first display panel and the second substrate; The light-shielding element is at least partially elastic, and the first substrate can be pressed against the light-shielding element by the first light-emitting chip, so that the light-shielding element is compressed or stretched along the thickness direction.

15. The display module according to claim 14, characterized in that, The display module further includes a buffer layer, which is disposed on the side surface of the first substrate facing the second substrate, and the buffer layer is at least partially sandwiched between the first chip array and the first substrate.

16. The display module according to claim 14, characterized in that, In the first display state, along the thickness direction, the second light-emitting chip protrudes at least partially from the light-shielding member toward the side where the first substrate is located.

17. The display module according to claim 1, characterized in that, Each of the first light-emitting chips and each of the second light-emitting chips includes a display driver chip, a plurality of sub-light-emitting units and a package. The sub-light-emitting units are electrically connected to the display driver chip, and the package encapsulates the display driver chip and the sub-light-emitting units.

18. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 17.

Images