Active driven LED transmissive screen

CN123016883APending Publication Date: 2026-10-30ENNOSTAR CORP
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Patent Information

Application Number
CN202610500255.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-04-29
Filing Date
2026-04-16
Publication Date
2026-10-30

AI Technical Summary

Technical Problem

数据线电连接主动式LED像素封装体

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Abstract

The application discloses an active driving LED transparent sound screen. The active driving LED transparent sound screen comprises a circuit substrate, a plurality of active LED pixel packages, a plurality of data lines, a plurality of clock pulse lines and a plurality of holes. The active LED pixel packages are arranged on the circuit substrate. The data lines are electrically connected with the active LED pixel packages. The clock pulse lines are electrically connected with the active LED pixel packages. The holes penetrate through the circuit substrate and are formed in a perforable area of the circuit substrate which does not overlap with positions of the active LED pixel packages, the data lines and the clock pulse lines. The perforable area accounts for at least 8.0% of the circuit substrate.
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Description

Technical Field

[0001] Some embodiments of the present invention relate to acoustically transparent screens, and more particularly to acoustically transparent screens utilizing actively driven light-emitting diodes (LEDs). Background Technology

[0002] Acoustic-transparent screens have holes, allowing sound to travel through to the viewer's ears. However, current acoustic-transparent screens are not satisfactory in all aspects. For example, the current perforation ratio of LED acoustic-transparent screens is insufficient, potentially leading to poor sound transmission. The Digital Cinema Initiatives (DCI) specification requires a perforation ratio of 4.0% to 6.3%. Summary of the Invention

[0003] Some embodiments of the present invention provide an active-drive LED acoustically transparent screen. The active-drive LED acoustically transparent screen includes a circuit board, multiple active-drive LED pixel packages, multiple data lines, multiple clock pulse lines, and multiple holes. The active-drive LED pixel packages are disposed on the circuit board. The data lines are electrically connected to the active-drive LED pixel packages. The clock pulse lines are electrically connected to the active-drive LED pixel packages. The holes penetrate the circuit board and are formed in a perforable area on the circuit board that does not overlap with the positions of the active-drive LED pixel packages, data lines, or clock pulse lines. The perforable area occupies at least 8.0% of the circuit board.

[0004] In some embodiments, the vias occupy at least 6.0% of the circuit board. In some embodiments, the perforable area occupies at least 30.0% of the circuit board, and the vias occupy at least 25.0% of the circuit board. In some embodiments, the size of one of the active LED pixel packages is smaller than the size of one of the vias. In some embodiments, the active LED pixel packages are arranged in multiple columns, and the active LED pixel packages in the same column are arranged with the same first pitch. In some embodiments, the first pitch is between 2.00 mm and 6.00 mm. In some embodiments, the size of any one of the vias is at most the first pitch minus 0.90 mm. In some embodiments, the vias are arranged in multiple columns, and the vias in the same column are arranged with the same second pitch. In some embodiments, the second pitch is different from the first pitch. In some embodiments, the ratio of the second pitch to the first pitch is between 1.5 and 2.5.

[0005] In some embodiments, each of the active LED pixel package includes one or more red sub-pixels, one or more green sub-pixels, one or more blue sub-pixels, and an LED driving control element. In some embodiments, the active-drive LED acoustically transparent screen further includes a display driving IC element, wherein the active LED pixel package and the display driving IC element are respectively disposed on opposite surfaces of the circuit board, and the position of the display driving IC element does not overlap with the perforated area. Attached Figure Description

[0006] To make the features or advantages of the present invention more apparent and understandable, some embodiments are provided below in conjunction with the accompanying drawings for detailed description. It should be noted that the various features are not necessarily drawn to scale. In fact, the dimensions of various features may be arbitrarily enlarged or reduced, and they may be drawn schematically.

[0007] Figure 1 This is a schematic diagram of the architecture of an image system according to some embodiments of the present invention;

[0008] Figure 2A as well as Figure 2B These are front and rear views of an actively driven LED acoustically transparent screen according to some embodiments of the present invention.

[0009] Figure 3 This is a side view of an actively driven LED acoustically transparent screen according to some embodiments of the present invention;

[0010] Figure 4A , Figure 4B , Figure 4C , Figure 4D This is a schematic diagram of an active LED pixel package according to some embodiments of the present invention;

[0011] Figure 5 This is a side view of an active LED pixel package according to some embodiments of the present invention;

[0012] Figure 6 This is a partially enlarged schematic diagram of an actively driven LED acoustically transparent screen according to some embodiments of the present invention;

[0013] Figures 7A to 7D This is a partially enlarged schematic diagram of an actively driven LED acoustically transparent screen according to some embodiments of the present invention.

[0014] Symbol Explanation

[0015] 100: Image System

[0016] 110: Input device

[0017] 120: Signal processing device

[0018] 130: Timing control device

[0019] 200: Active-drive LED acoustically transparent screen

[0020] 200A: Active-Driven LED Acoustic Screen

[0021] 200B: Active-Driven LED Acoustic Screen

[0022] 200C: Active-Driven LED Acoustic Screen

[0023] 200D: Active-Driven LED Acoustic Screen

[0024] 210: Circuit board

[0025] 220: Clock pulse line

[0026] 230: Data cable

[0027] 240: Active LED pixel package

[0028] 240A: Active LED Pixel Package

[0029] 240B: Active LED Pixel Package

[0030] 240C: Active LED Pixel Package

[0031] 240D: Active LED Pixel Package

[0032] 240S: Dimensions of active-matrix LED pixel package

[0033] 240T: Packaging thickness of active LED pixel package

[0034] 241: Base

[0035] 241A: Substrate

[0036] 241B: Substrate

[0037] 241C: Substrate

[0038] 241D: Substrate

[0039] 242: LED

[0040] 242A: Red subpixel

[0041] 242B: Red subpixel

[0042] 242C: Red subpixel

[0043] 242D: Red subpixel

[0044] 243A: Green subpixel

[0045] 243B: Green subpixel

[0046] 243C: Green subpixel

[0047] 243D: Green Subpixel

[0048] 244A: Blue subpixel

[0049] 244B: Blue subpixel

[0050] 244C: Blue subpixel

[0051] 244D: Blue subpixel

[0052] 245: LED driver control element

[0053] 245A: LED driver control element

[0054] 245B: LED driver control element

[0055] 245D: LED driver control element

[0056] 245Da: Electrode of LED driver control element

[0057] 245Db: Electrode of LED driver control element

[0058] 246B: Covering layer

[0059] 246C: Cover layer

[0060] 250: Display driver IC component

[0061] 260: Hole

[0062] 260A: Hole

[0063] 260B: Hole

[0064] 260C: Hole

[0065] 260CS: Dimensions of hole 260C

[0066] 260CS1: Dimensions of hole 260C

[0067] 260D: Hole

[0068] 260S: Hole size 260

[0069] 2421: First Blue LED Chip

[0070] 2421a: Electrode of the first blue LED chip

[0071] 2421b: Electrode of the first blue LED chip

[0072] 2422: First Light Adjustment Department

[0073] 2422a: First light extraction layer

[0074] 2422b: First wavelength conversion layer

[0075] 2422c: First filter layer

[0076] 2431: Second blue LED chip

[0077] 2431a: Electrode of the second blue LED chip

[0078] 2431b: Electrode of the second blue LED chip

[0079] 2432: Second Light Adjustment Unit

[0080] 2432a: Second light extraction layer

[0081] 2432b: Second wavelength conversion layer

[0082] 2432c: Second filter layer

[0083] 2441: Third blue LED chip

[0084] 2441a: Electrode of the third blue LED chip

[0085] 2441b: Electrode of the third blue LED chip

[0086] 2442: Third Light Adjustment Unit

[0087] 2442a: Third light extraction layer

[0088] 2442b: Transparent light-collecting layer

[0089] D1: First spacing

[0090] D2: Second spacing

[0091] D3: Third spacing

[0092] D4: Fourth spacing

[0093] D5: Fifth spacing

[0094] D6: Sixth spacing

[0095] PL: Signal transmission path length Detailed Implementation

[0096] This specification provides many different embodiments or examples to implement different features of the invention. If this specification describes a first feature formed "on" a second feature, it means that it may include embodiments in which the first feature and the second feature are in direct contact, or embodiments in which an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact.

[0097] Furthermore, in this specification, relative spatial terms may be used to describe the arrangement of the various features. These relative spatial terms are used to facilitate the description of the positional relationship of one feature relative to other features in the accompanying drawings. In addition to the orientations shown in the drawings, these spatial terms are intended to encompass different orientations of the device in use or operation. The device may be rotated to different orientations (90 degrees or other orientations), and the relative spatial terms used herein can be interpreted in the same way. For example, if the drawings are flipped so that the device is upside down, the feature "above" will become the feature "below".

[0098] In this specification, terms such as "comprising" and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, the terms "comprising" and "having" specify the presence of corresponding features, areas, steps, operations, and / or elements, but do not exclude the presence of one or more corresponding features, areas, steps, operations, and / or elements.

[0099] The ordinal numbers in the specification and claims, such as "first," "second," etc., do not have a sequential relationship; they are only used to distinguish two different features with the same name. Therefore, the first feature referred to in the specification may be referred to as the second feature in the claims. Furthermore, similar and / or corresponding symbols or letters may be used in different embodiments of the invention. The use of these similar and / or corresponding symbols or letters is merely for the purpose of simply and clearly describing some embodiments of the invention and does not imply any association between the different embodiments and / or configurations discussed.

[0100] Please refer to Figure 1 In order to understand an image system 100. Figure 1 This is the architecture of an image system 100 according to some embodiments of the present invention. The image system 100 includes an input device 110, a signal processing device 120, a timing control device 130, and an active-drive LED acoustically transparent screen 200. In this invention, the term "active-drive" means control using digital signals without the need for scan lines.

[0101] Input device 110 can serve as an image source and can transmit image signals to signal processing device 120 via a transmission method such as High Definition Multimedia Interface (HDMI). Signal processing device 120 can process the received image signals. If necessary, signal processing device 120 can convert the received image signals into a suitable format. Signal processing device 120 can transmit image signals to timing control device 130 via a transmission method such as Serial Peripheral Interface (SPI) and / or Low-Voltage Differential Signaling (LVDS).

[0102] The timing control device 130 can be used to control the timing and / or synchronization of the light-emitting units (such as the plurality of active LED pixel packages 240 described below) on the active-driven LED acoustically transparent screen 200. Specifically, the timing control device 130 can generate digital signals, including clock (CLK) signals and data signals, to drive the light-emitting units located on the active-driven LED acoustically transparent screen 200. The timing control device 130 can ensure that the digital signals in the active drive are transmitted in a suitable and relatively accurate manner.

[0103] Next, please refer to the following: Figure 2A , Figure 2B , Figure 3 To understand the active-drive LED acoustically transparent screen 200. Figure 2A as well as Figure 2B These are front and rear views of an actively driven LED acoustically transparent screen 200 according to some embodiments of the present invention. Figure 3 This is a side view of an actively driven LED acoustically transparent screen 200 according to some embodiments of the present invention.

[0104] The active-drive LED acoustically transparent screen 200 may include a circuit board 210, multiple clock pulse lines 220, multiple data lines 230, multiple active-drive LED pixel packages 240, at least one display driver IC (DDIC) component 250, and multiple holes 260 for transmitting sound. For ease of explanation, Figure 2A , Figure 2B , Figure 3 Hole 260 is not shown. (To be matched) Figure 6 as well as Figures 7A to 7DThe aperture 260 is described further. In some embodiments, an audio device may be disposed on the back side of the actively driven LED acoustically transparent screen 200 (i.e., the side facing away from the viewer), and sound can be amplified through the aperture 260.

[0105] In some embodiments, the circuit board 210 may be a flexible board, a metal substrate, a semiconductor substrate, or other substrates with circuitry. In some embodiments, the circuit board 210 has an even number of layers; for example, the circuit board 210 may have four, six, or eight layers.

[0106] Clock pulse lines 220 are electrically connected to active LED pixel packages 240. In some embodiments, each clock pulse line 220 corresponds to an active LED pixel package 240 in the same column. Clock pulse lines 220 can control the timing of data transmission.

[0107] Data lines 230 are electrically connected to active LED pixel packages 240. In some embodiments, each data line 230 corresponds to an active LED pixel package 240 in the same row. Data lines 230 can carry pixel information.

[0108] like Figure 2A As shown, multiple active-matrix LED pixel packages 240 are disposed on the circuit board 210. The active-matrix LED pixel packages 240 can be arranged in multiple rows and columns. In some embodiments, the active-matrix LED pixel packages 240 are arranged in a matrix. In some embodiments, the active-matrix LED pixel package 240 includes a substrate 241 and multiple LEDs 242 (in... Figure 3 Due to the viewing angle, only one LED driver control element 245 is displayed.

[0109] In some embodiments, LED242 may be a small-sized sub-millimeter light-emitting diode (mini LED) or micro LED. A micro LED may include an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer, wherein the light-emitting layer is disposed between the N-type and P-type semiconductor layers. The light emitted by the micro LED chip is determined by the light-emitting layer.

[0110] The N-type semiconductor layer may include group II-VI materials (e.g., zinc selenide (ZnSe)) or group III-V materials (e.g., gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), indium gallium nitride (InGaN), aluminum gallium nitride (AlGaN), or aluminum indium gallium nitride (AlInGaN)), and the N-type semiconductor layer may include dopants such as silicon (Si) or germanium (Ge), but the present invention is not limited thereto.

[0111] The light-emitting layer may include at least one undoped semiconductor layer or at least one lightly doped layer. For example, the light-emitting layer may be a quantum well (QW) layer, which may include indium gallium nitride (In... x Ga 1-x The light-emitting layer may be gallium nitride (GaN), aluminum gallium nitride (AlGaN), or aluminum indium gallium nitride (AlInGaN), but the invention is not limited thereto. Alternatively, the light-emitting layer may also be a multiple quantum well (MQW) layer.

[0112] The P-type semiconductor layer may include group II-VI materials (e.g., zinc selenide (ZnSe)) or group III-V materials (e.g., gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), indium gallium nitride (InGaN), aluminum gallium nitride (AlGaN), or aluminum indium gallium nitride (AlInGaN)), and the P-type semiconductor layer may include dopants such as magnesium (Mg) and carbon (C), but the present invention is not limited thereto. Furthermore, the N-type and P-type semiconductor layers may be single-layer or multi-layer structures.

[0113] In some embodiments, the LED driving control element 245 is a component (e.g., a diode, transistor, integrated circuit) capable of controlling the execution of a predetermined electronic function, used to control the operation of the LED 242. In some embodiments, the LED driving control element 245 may also be a microchip made of silicon or semiconductor-on-insulator (SOI) wafers (wafers) for logic or memory applications, or a microchip made of gallium arsenide (GaAs) wafers for RF communication applications, but the invention is not limited thereto. The LED driving control element 245 may include a power pin for receiving power and a driving pin for connecting the LED 242.

[0114] In some embodiments, the package thickness 240T of the active LED pixel package 240 is less than 0.15 mm. In some embodiments, the dimensions 240S (e.g., length and / or width) of the active LED pixel package 240 are between 0.15 mm and 0.40 mm, for example, about 0.20 mm, or about 0.30 mm.

[0115] The display driver IC element 250 is disposed on the circuit board 210. In some embodiments, the active LED pixel package 240 and the display driver IC element 250 are respectively disposed on opposite surfaces of the circuit board 210. For example, the active LED pixel package 240 may be disposed on the front side of the circuit board 210 (i.e., the side facing the viewer), while the display driver IC element 250 may be disposed on the back side of the circuit board 210 (i.e., the side facing away from the viewer).

[0116] Because the LED acoustically transparent screen of this invention uses an active LED pixel package, which is controlled by digital signals and requires no scan lines, this invention simplifies circuit routing and effectively utilizes space compared to traditional passive driving that requires scan lines. Furthermore, passive driving, due to the need for scan lines, may produce flickering, while active driving can provide higher uniformity and / or higher stability.

[0117] Furthermore, because the LED driving control element 245 for controlling the operation of LED 242 is packaged within the active LED pixel package 240, the signal transmission path length PL is relatively short; for example, the signal transmission path length PL can be approximately 0.01 mm. Compared to passive drives, where the signal transmission path length is typically between 1.50 mm and 15.00 mm, this invention effectively shortens the signal transmission path, thereby improving the performance of the active-driven LED acoustically transparent screen 200, including but not limited to contrast and clarity. That is, because the LED driving control element 245 is located within the active LED pixel package 240, the overall wiring of the LED acoustically transparent screen 200 can be simplified, increasing the perforable area for forming the holes 260 for sound transmission.

[0118] Figures 4A to 4D as well as Figure 5 These are different embodiments used to illustrate the active LED pixel package 240, and the same or similar elements will be referred to by the same or similar reference numerals. Figure 4A , Figure 4B , Figure 4C , Figure 4D These are schematic diagrams of active LED pixel packages 240A, 240B, 240C, and 240B according to some embodiments of the present invention. Figure 5 This is a side view of an active LED pixel package 240D according to some embodiments of the present invention. Specifically, the active LED pixel package 240 may include, but is not limited to, the configurations shown in active LED pixel packages 240A, 240B, 240C, and 240D.

[0119] exist Figure 4AIn the illustrated embodiment, each of the active LED pixel package 240A includes a substrate 241A, a red sub-pixel 242A, a green sub-pixel 243A, a blue sub-pixel 244A, and an LED driving control element 245A, wherein the red sub-pixel 242A, green sub-pixel 243A, blue sub-pixel 244A, and LED driving control element 245A are disposed on the same side of the substrate 241A. For example, the red sub-pixel 242A, green sub-pixel 243A, blue sub-pixel 244A, and LED driving control element 245A are all disposed on the front side (upper surface) of the substrate 241A.

[0120] exist Figure 4B as well as Figure 4D In the illustrated embodiment, each of the active LED pixel package 240B includes a substrate 241B, a red sub-pixel 242B, a green sub-pixel 243B, a blue sub-pixel 244B, and an LED driving control element 245B, wherein the red sub-pixel 242B, green sub-pixel 243B, blue sub-pixel 244B, and LED driving control element 245B are disposed on opposite sides of the substrate 241B. For example, the red sub-pixel 242B, green sub-pixel 243B, and blue sub-pixel 244B may be disposed on the front side (upper surface) of the substrate 241B, while the LED driving control element 245B is disposed on the back side (lower surface) of the substrate 241B.

[0121] exist Figure 4C In the illustrated embodiment, each of the active LED pixel package 240C includes a substrate 241C, a plurality of red sub-pixels 242C, a plurality of green sub-pixels 243C, a plurality of blue sub-pixels 244C, and an LED driving control element (not shown due to viewing angle). The red sub-pixels 242C, green sub-pixels 243C, blue sub-pixels 244C, and the LED driving control element are disposed on opposite sides of the substrate 241C. For example, the red sub-pixels 242C, green sub-pixels 243C, and blue sub-pixels 244C may be disposed on the front side (upper surface) of the substrate 241C, while the LED driving control element may be disposed on the back side (lower surface) of the substrate 241C.

[0122] exist Figure 4A , Figure 4B , Figure 4D In the illustrated embodiment, since a single LED driver control element 245A, 245B drives a group of RGB pixels, this can be referred to as one-to-one control. Figure 4C In the illustrated embodiment, since a single LED driver control element drives multiple groups of RGB pixels, it can be referred to as one-to-many control.

[0123] In addition, such as Figures 4B to 4DAs shown, the active LED pixel packages 240B and 240C may further include a cover layer 246B and 246C. In some embodiments, the cover layers 246B and 246C include a light-transmitting material. Cover layer 246B covers the red sub-pixel 242B, the green sub-pixel 243B, and the blue sub-pixel 244B. Cover layer 246C covers the red sub-pixel 242C, the green sub-pixel 243C, and the blue sub-pixel 244C. If necessary, Figure 4A The active LED pixel package 240A may also include a cover layer covering the red sub-pixel 242A, the green sub-pixel 243A, and the blue sub-pixel 244A.

[0124] In some embodiments, the red sub-pixel (such as the red sub-pixels 242A, 242B, and 242C described above) includes a red LED chip, the green sub-pixel (such as the green sub-pixels 243A, 243B, and 243C described above) includes a green LED chip, and the blue sub-pixel (such as the blue sub-pixels 244A, 244B, and 244C described above) includes a blue LED chip, but the present invention is not limited thereto.

[0125] exist Figure 5 In the illustrated embodiment, each of the active LED pixel package 240D includes a substrate 241D, a red sub-pixel 242D, a green sub-pixel 243D, a blue sub-pixel 244D, and an LED driving control element 245D. In some embodiments, the red sub-pixel 242D includes a first blue LED chip 2421 and a first light adjustment unit 2422, the green sub-pixel 243D includes a second blue LED chip 2431 and a second light adjustment unit 2432, and the blue sub-pixel 244D includes a third blue LED chip 2441 and a third light adjustment unit 2442. The first blue LED chip 2421, the second blue LED chip 2431, and the third blue LED chip 2441 emit blue light.

[0126] The first blue LED chip 2421 has two electrodes 2421a and 2421b, one of which serves as a positive electrode and is electrically connected to the P-type semiconductor layer of the first blue LED chip 2421, and the other serves as a negative electrode and is electrically connected to the N-type semiconductor layer of the first blue LED chip 2421. The second blue LED chip 2431 has two electrodes 2431a and 2431b, one of which serves as a positive electrode and is electrically connected to the P-type semiconductor layer of the second blue LED chip 2431, and the other serves as a negative electrode and is electrically connected to the N-type semiconductor layer of the second blue LED chip 2431. The third blue LED chip 2441 has two electrodes 2441a and 2441b, one of which serves as a positive electrode and is electrically connected to the P-type semiconductor layer of the third blue LED chip 2441, and the other serves as a negative electrode and is electrically connected to the N-type semiconductor layer of the third blue LED chip 2441.

[0127] Electrodes 2421a, 2421b, 2431a, 2431b, 2441a, and 2441b comprise conductive materials, such as metals, metal silicides, similar materials, or combinations thereof, but the invention is not limited thereto. For example, the metal may include gold (Au), nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), copper (Cu), similar materials, alloys of the aforementioned metals, or combinations thereof, but the invention is not limited thereto.

[0128] The first light adjustment unit 2422 includes a first light extraction layer 2422a, a first wavelength conversion layer 2422b, and a first filter layer 2422c. The first light extraction layer 2422a is disposed on the first blue LED chip 2421, the first wavelength conversion layer 2422b is located between the first light extraction layer 2422a and the first filter layer 2422c, and the first filter layer 2422c is disposed on the first wavelength conversion layer 2422b.

[0129] The second light adjustment unit 2432 includes a second light extraction layer 2432a, a second wavelength conversion layer 2432b, and a second light filter layer 2432c. The second light extraction layer 2432a is disposed on the second blue LED chip 2431, the second wavelength conversion layer 2432b is located between the second light extraction layer 2432a and the second light filter layer 2432c, and the second light filter layer 2432c is disposed on the second wavelength conversion layer 2432b.

[0130] The third light adjustment unit 2442 includes a third light extraction layer 2442a and a transparent light extraction layer 2442b, wherein the third light extraction layer 2442a is disposed on the third blue LED chip 2441, and the transparent light extraction layer 2442b is disposed on the third light extraction layer 2442a.

[0131] The first light extraction layer 2422a, the second light extraction layer 2432a, and the third light extraction layer 2442a may be transparent layers and may be made of the same material. Furthermore, the transparent light extraction layer 2442b may include the same or similar material as the third light extraction layer 2442a.

[0132] In some embodiments, the first wavelength conversion layer 2422b and the second wavelength conversion layer 2432b each include a phosphor, a quantum dot material, or a combination thereof. For example, the first wavelength conversion layer 2422b may include a red phosphor, a red quantum dot material, or a combination thereof, while the second wavelength conversion layer 2432b may include a green phosphor, a green quantum dot material, or a combination thereof, but the invention is not limited thereto.

[0133] In some embodiments, the first wavelength conversion layer 2422b absorbs a portion of the blue light emitted by the first blue LED chip 2421 and converts it into red light, while the second wavelength conversion layer 2432b absorbs a portion of the blue light emitted by the first blue LED chip 2421 and converts it into green light. The blue light emitted by the third blue LED chip 2441 can be emitted through the transparent light-collecting layer 2442b.

[0134] Furthermore, the first filter layer 2422c and the second filter layer 2432c can, for example, filter out unconverted blue light, making the color of the light converted by the first wavelength conversion layer 2422b or the second wavelength conversion layer 2432b closer to the color of the phosphor, quantum dot material, or combination thereof included therein, but the invention is not limited thereto. In some embodiments, the first filter layer 2422c and the second filter layer 2432c may be omitted.

[0135] LED driver control element 245D can be used to control a first blue LED chip 2421, a second blue LED chip 2431, and a third blue LED chip 2441. In some embodiments, LED driver control element 245D may have two electrodes 245Da and 245Db, but the present invention is not limited thereto.

[0136] Next, please refer to Figure 6 To understand a perforated area 210 and multiple holes 260 on the circuit board. Figure 6 This is a partially enlarged schematic diagram of an actively driven LED acoustically transparent screen 200 according to some embodiments of the present invention. For ease of explanation, Figure 6 The display driver IC element 250, which is disposed on the back side of the circuit board 210, is shown in a rather schematic manner, and is indicated by dashed lines.

[0137] The hole 260 is formed through the circuit board 210. To reduce the possibility that the hole 260 may cause damage or malfunction to other components, the hole 260 can only be formed in a perforable area on the circuit board 210 that does not overlap with the location of any other component. In some embodiments, the perforable area is an area on the circuit board 210 that does not overlap with the location of the clock pulse line 220, data line 230, active LED pixel package 240, or display driver IC component 250. Specifically, from Figure 6 It can be seen that the area overlapping with the display driver IC component 250 is not a perforable area, and no hole 260 is formed therein.

[0138] In some embodiments, the active-drive LED acoustically transparent screen 200 also includes a plurality of magnetic elements that can provide magnetic force to attract other devices. In such embodiments, the perforable area is an area on the circuit board 210 that does not overlap with the positions of the clock pulse line 220, data line 230, active-drive LED pixel package 240, display driver IC element 250, and magnetic elements.

[0139] Because this invention employs active driving, its circuit routing is relatively simple. The proportion of the perforable area on the actively driven LED acoustically transparent screen 200 can be relatively high, and the ratio of the holes 260 to the circuit board 210 (i.e., the hole ratio) can easily meet relevant specifications and satisfy the requirements of the acoustically transparent screen. Moreover, because the proportion of the perforable area is relatively high, the design flexibility of the holes 260 formed in the perforable area is increased, while also taking into account the overall strength of the actively driven LED acoustically transparent screen 200, especially the strength of the circuit board 210. Specifically, compared to acoustically transparent screens using passive driving, this invention can effectively increase the proportion of the perforable area and / or the hole ratio on the actively driven LED acoustically transparent screen 200.

[0140] In some embodiments, the perforated region occupies at least 8.0% of the circuit board 210. In some embodiments, the perforated region occupies at least 10.0% of the circuit board 210. In some embodiments, the perforated region occupies at least 25.0% of the circuit board 210. In some embodiments, the perforated region occupies at least 30.0% of the circuit board 210.

[0141] The proportion of the via 260 to the circuit board 210 is less than or equal to the proportion of the perforated area to the circuit board 210. In some embodiments, the via 260 occupies at least 6.0% of the circuit board 210. In some embodiments, the via 260 occupies at least 8.0% of the circuit board 210. In some embodiments, the via 260 occupies at least 20.0% of the circuit board 210. In some embodiments, the via 260 occupies at least 25.0% of the circuit board 210.

[0142] exist Figure 6 In the illustrated embodiment, in the perforated area, the holes 260 of the active LED pixel package 240 are arranged in alternating rows and columns. That is, for the active LED pixel package 240, if one column of active LED pixel packages 240 has a hole 260 between it and the adjacent upper column, then that column will not have a hole 260 between it and the adjacent lower column. Moreover, if one row of active LED pixel packages 240 has a hole 260 between it and the adjacent left row, then that row will not have a hole 260 between it and the adjacent right row.

[0143] In some embodiments, active-matrix LED pixel packages 240 in the same column are arranged with the same first pitch D1. In some embodiments, the first pitch D1 is the distance between the center points of adjacent active-matrix LED pixel packages 240 in the same column. In some embodiments, the first pitch D1 is between 2.00 mm and 6.00 mm, for example, approximately 2.56 mm, or approximately 5.12 mm. Furthermore, in some embodiments, active-matrix LED pixel packages 240 in the same row are also arranged with the same first pitch D1.

[0144] In some embodiments, the holes 260 in the same column are arranged with the same second spacing D2. In some embodiments, the second spacing D2 is the distance between the center points of adjacent holes 260 in the same column. In some embodiments, the second spacing D2 is between 2.00 mm and 9.00 mm. Furthermore, in some embodiments, the holes 260 in the same column are also arranged with the same second spacing D2, but the invention is not limited thereto.

[0145] The second spacing D2 may be the same as or different from the first spacing D1. In some embodiments, the ratio of the second spacing D2 to the first spacing D1 is between 1.5 and 2.5. That is, the distance between the holes 260 is greater than the distance between the active LED pixel packages 240.

[0146] In some embodiments, a dimension of one of the active LED pixel packages 240 is smaller than a dimension (e.g., diameter) of one of the holes 260. In some embodiments, the dimension of each of the active LED pixel packages 240 is smaller than the dimension of each of the holes 260. In some embodiments, a dimension 260S of any of the holes 260 is greater than 1.50 mm.

[0147] In some embodiments, the size 260S of any of the holes 260 is related to the first spacing D1. In some embodiments, the size 260S of any of the holes 260 is at most the first spacing D1 minus 0.90 mm. For example, if the first spacing D1 is 5.12 mm, the size 260S of any of the holes 260 is at most 4.22 mm.

[0148] In some embodiments, when the first pitch D1 is 5.12 mm and the size 260S of any of the holes 260 is slightly larger than 1.50 mm, the hole ratio on the active-drive LED acoustically transparent screen 200 is approximately 6.3%.

[0149] Next, please refer to Figures 7A to 7D To understand the different configurations of hole 260, the same or similar components will use the same or similar designations. Figures 7A to 7D This is a partially enlarged schematic diagram of active-drive LED acoustically transparent screens 200A, 200B, 200C, and 200D according to some embodiments of the present invention. Active-drive LED acoustically transparent screens 200A, 200B, 200C, and 200D each include multiple holes 260A, 260B, 260C, and 260D.

[0150] exist Figure 7A In the illustrated embodiment, in the perforated region, for the active LED pixel package 240, the holes 260A are arranged between adjacent rows and adjacent columns. That is, for the active LED pixel package 240, each column of active LED pixel packages 240 has a hole 260A between it and the adjacent upper column, each column of active LED pixel packages 240 also has a hole 260A between it and the adjacent lower column, each row of active LED pixel packages 240 has a hole 260A between it and the adjacent left row, and each row of active LED pixel packages 240 also has a hole 260A between it and the adjacent right row.

[0151] In some embodiments, the active-matrix LED pixel packages 240 in the same column are arranged with the same third pitch D3. In some embodiments, the holes 260A in the same column are arranged with the same fourth pitch D4. In some embodiments, the third pitch D3 may be substantially the same as the fourth pitch D4. In some embodiments, when the third pitch D3 is 2.56 mm and the size of any of the holes 260A is slightly larger than 1.50 mm, the hole occupancy rate on the active-matrix LED acoustically transparent screen 200A is approximately 25.0%.

[0152] exist Figure 7BIn the illustrated embodiment, in the perforated region, the holes 260B of the active LED pixel package 240 are staggered. The active LED pixel packages 240 in the same column are arranged with the same fifth pitch D5, and the holes 260B in the same column are arranged with the same sixth pitch D6. In some embodiments, the sixth pitch D6 is greater than the fifth pitch D5.

[0153] exist Figure 7C In the illustrated embodiment, the aperture 260C has different sizes 260CS and 260CS1 in the perforable area. For example, to reduce the possibility of damaging the display driver IC element 250, the size 260CS of the aperture 260C farther from the display driver IC element 250 can be designed to be different from the size 260CS1 of the aperture 260C closer to the display driver IC element 250. For example, the size 260CS of the aperture 260C is larger than the size 260CS1 of the aperture 260C, but the invention is not limited thereto.

[0154] exist Figure 7D In the illustrated embodiment, the hole 260D in the perforable region is quadrilateral in shape. Because the area between the four active LED pixel packages 240 is also quadrilateral, this design simplifies the manufacturing process for forming the hole. However, the hole 260D can also include other shapes, such as arbitrary polygons, ellipses, etc.

[0155] It should be noted that features of the various embodiments described above can be combined. For example, in the perforated area, holes of different sizes and shapes may be included in a dense or staggered arrangement.

[0156] In summary, some embodiments of the present invention provide an actively driven LED acoustically transparent screen, comprising multiple actively driven LED pixel packages, each of which encapsulates an LED driving control element. Active driving utilizes digital signals for control, eliminating the need for scan lines. Compared to passive driving, which requires scan lines, the present invention simplifies circuit routing and effectively utilizes space. Furthermore, passive driving, due to the need for scan lines, may produce flickering, while active driving can provide higher uniformity and / or higher stability.

[0157] Furthermore, active driving can shorten the signal transmission path, thereby improving the performance of the active-driven LED acoustically transparent screen, including but not limited to contrast and clarity. Moreover, because this invention uses active driving, its circuit wiring is relatively simple, and the proportion of perforable areas on the active-driven LED acoustically transparent screen is relatively high, thus increasing the flexibility in designing holes while maintaining the overall strength of the active-driven LED acoustically transparent screen. This invention can effectively increase the proportion of perforable areas and / or the proportion of holes on the active-driven LED acoustically transparent screen. In addition, this invention also provides various possible configurations of holes on the active-driven LED acoustically transparent screen, including arrangement, size, and shape.

[0158] The foregoing overview of several embodiments enables those skilled in the art to better understand various aspects of the invention. It should be understood by those skilled in the art that the invention can be readily used as the basis for designing or modifying other manufacturing processes and structures to achieve the same purpose or have the same effects as the embodiments described herein. It should be understood by those skilled in the art that such equivalent configurations do not depart from the spirit and scope of the invention, and that various changes, substitutions, and modifications can be made to the invention without departing from its spirit and scope.

Claims

1. An actively driven LED acoustically transparent screen, comprising: Circuit board; Multiple active LED pixel packages are disposed on the circuit board; Multiple data lines electrically connect to the multiple active LED pixel packages; Multiple clock pulse lines are electrically connected to the multiple active LED pixel packages; as well as Multiple holes penetrate the circuit board and are formed in a perforable area on the circuit board that does not overlap with the positions of the multiple active LED pixel packages, the multiple data lines, and the multiple clock pulse lines. The perforable area occupies at least 8.0% of the circuit board. Each of the plurality of active LED pixel packages includes one or more red sub-pixels, one or more green sub-pixels, one or more blue sub-pixels, and LED driving control elements.

2. The active-drive LED acoustically transparent screen as claimed in claim 1, wherein the plurality of holes occupy at least 6.0% of the circuit board.

3. The active-drive LED acoustically transparent screen as claimed in claim 1, wherein the perforated area occupies at least 30.0% of the circuit board, and the plurality of holes occupy at least 25.0% of the circuit board.

4. The active-drive LED acoustically transparent screen as claimed in claim 1, wherein the size of one of the plurality of active LED pixel packages is smaller than the size of one of the plurality of holes.

5. The active-drive LED acoustically transparent screen as claimed in claim 1, wherein the plurality of active LED pixel packages are arranged in multiple columns, and the plurality of active LED pixel packages in the same column are arranged with the same first spacing.

6. The active-drive LED acoustically transparent screen as described in claim 5, wherein the size of any one of the plurality of holes is at most the first spacing minus 0.90 mm.

7. The active-drive LED acoustically transparent screen as claimed in claim 5, wherein the plurality of holes are arranged in multiple columns, and the plurality of holes in the same column are arranged with the same second spacing.

8. The active-drive LED acoustically transparent screen as described in claim 7, wherein the second pitch is different from the first pitch.

9. The active-drive LED acoustically transparent screen as described in claim 7, wherein the ratio of the second pitch to the first pitch is between 1.5 and 2.

5.

10. The active-drive LED acoustically transparent screen as claimed in claim 1, further comprising a display driver IC element, wherein the plurality of active-drive LED pixel packages and the display driver IC element are respectively disposed on opposite surfaces of the circuit substrate, and the position of the display driver IC element does not overlap with the perforated area.