A laminated conductive assembly and a method of manufacturing the same

Abstract

The application discloses a laminated conductive assembly and a manufacturing method thereof. The laminated conductive assembly comprises a laminated body and an insulating edge sealing structure. The laminated body comprises a plurality of conductive plates, each of which is provided with an insulating film on both sides. The conductive plate has a first closed surface and a second closed surface. The laminated body comprises a flat plate section and a bent plate section. The first closed surface is located on the outer circumferential side of the flat plate section, and the second closed surface is located on the outer circumferential side of the bent plate section. The insulating edge sealing structure comprises a first insulating edge sealing part and a second insulating edge sealing part, which are in a split structure and are connected to each other. The first insulating edge sealing part is in close contact with the first closed surface, and the second insulating edge sealing part is in close contact with the second closed surface. The edge sealing is performed through the insulating edge sealing structure, so that the risk of bulging caused by the edge sealing of the insulating film is reduced. The first and second insulating edge sealing parts are in a split structure and are connected to each other. Different forming and assembling modes can be adopted according to the structural characteristics of the flat plate section and the bent plate section, so that the insulating performance and processing efficiency are considered.

Description

Technical Field

[0001] This application relates to the field of stacked conductive components technology, specifically to a stacked conductive component and its manufacturing method. Background Technology

[0002] Stacked conductive components typically consist of multiple stacked conductive plates, with insulating films on both sides of each conductive plate along its thickness direction to achieve insulation isolation.

[0003] In related technologies, laminated conductive components also utilize insulating films to seal the outer edges of the conductive plates. However, under thermal cycling or continuous high temperatures, laminated conductive components using insulating films for edge sealing are prone to bulging in the sealed area, reducing the insulation reliability of the sealed area and consequently affecting the long-term reliability of the laminated conductive components.

[0004] Therefore, how to reduce the risk of bulging in the edge sealing area of ​​laminated conductive components and improve the long-term reliability of laminated conductive components is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a laminated conductive component and its manufacturing method, reducing the risk of bulging in the edge-sealing area of ​​the laminated conductive component and improving the long-term reliability of the laminated conductive component. The specific solution is as follows: A laminated conductive component includes a laminated body and an insulating edge sealing structure; The stacked body includes a plurality of conductive plates stacked along a first direction. Each conductive plate has an insulating film on both sides along the first direction. The conductive plate has a first sealing surface and a second sealing surface. The stacked body includes at least two flat plate segments and a bent plate segment connecting two adjacent flat plate segments. The two adjacent flat plate segments are arranged at an angle. The first sealing surface is located on the outer periphery of the flat plate segment, and the second sealing surface is located on the outer periphery of the bent plate segment. The insulating edge sealing structure includes a first insulating edge sealing portion and a second insulating edge sealing portion provided corresponding to each of the conductive plates. For any of the conductive plates, the first insulating edge portion and the second insulating edge portion are both located between the two insulating films on both sides of the conductive plate along the first direction. The first insulating edge portion is attached to the first sealing surface, and the second insulating edge portion is attached to the second sealing surface. The first insulating edge portion and the second insulating edge portion are separate structures that are connected to each other.

[0006] In some embodiments, the first insulating edge sealing portion is an insulating plate, and the conductive plate, the two insulating films located on both sides of the conductive plate along the first direction, and the corresponding first insulating edge sealing portion are an integral hot-pressed structure.

[0007] In some embodiments, two insulating films are provided between two adjacent conductive plates, and the laminated body further includes an adhesive layer that connects at least a portion of the two insulating films between the two adjacent conductive plates located in the straight plate segment.

[0008] In some embodiments, the first insulating edge sealing portion is an insulating plate, the second sealing surface, the side of the first insulating edge sealing portion near the bent plate segment, and the corresponding two insulating films together define a potting area, and the second insulating edge sealing portion fills the potting area.

[0009] In some embodiments, the stacked conductive assembly further includes at least one insulating support assembly connected to the outer periphery of the corresponding bent plate segment, the insulating support assembly having a potting area, and an open end communicating with the potting area at one end of the insulating support assembly opposite to the corresponding bent plate segment. The insulating support assembly has its sidewalls facing away from each other along the first direction respectively attached to the insulating film on the corresponding side. The end of the insulating support assembly near the first insulating sealing portion has a connecting hole. A portion of the second insulating sealing portion is filled in the potting area, and a portion of the second insulating sealing portion passes through the connecting hole and connects to the first insulating sealing portion.

[0010] In some embodiments, the insulating support assembly includes two support plate portions, each of which is connected to a corresponding bent plate segment and is spaced apart along the first direction. The sidewalls of the two support plate portions facing away from each other are bonded to the insulating film on the corresponding side, and the potting area is formed between the two support plate portions. At least one of the support plate portions has a folded portion at its end near the first insulating sealing portion, and there is a gap between the free end of the folded portion and the other support plate portion to form the communicating hole.

[0011] In some embodiments, the insulating support assembly has a positioning structure that extends from the open end toward the corresponding bent plate segment, the positioning structure being configured to engage with a support liner inserted into the potting area.

[0012] In some embodiments, the end of the insulating support assembly near the first insulating edge portion is spaced apart from the first insulating edge portion to form a connecting potting space between the insulating support assembly and the first insulating edge portion, a portion of the second insulating edge portion is filled in the connecting potting space, and the connecting hole connects the potting area and the connecting potting space.

[0013] In some embodiments, the plurality of conductive plates include two end plates located at the ends in the first direction, and a middle plate located between the two end plates along the first direction. At least one of the end plates has an overlap joint on its surface facing away from the middle plate along the first direction. The overlap joint is spaced from the edge of the corresponding end plate along the second direction. The first direction and the second direction are perpendicular to each other. The stacked conductive component further includes a first pin, which extends along the second direction. One end of the first pin along the second direction is connected to the corresponding lap joint. Except for the portion of the first pin connected to the lap joint, the remaining portion of the first pin is spaced apart from the corresponding end plate.

[0014] In some embodiments, the first pin includes a fixed end, a transition section, and a terminal connected sequentially in the extension direction. The fixed end is connected to the lap joint, and the terminal is located outside the edge of the corresponding end plate along the second direction. The transition section protrudes in the first direction away from the end plate, compared to the fixed end and the terminal.

[0015] In some embodiments, the first insulating sealing portion includes a plurality of connecting portions, and two interconnected connecting portions are defined as a first connecting portion and a second connecting portion, wherein the first connecting portion and the second connecting portion are arranged sequentially along the outer periphery of the straight plate segment corresponding to the conductive plate; The first connecting portion has a first fitting wall and a protrusion, wherein the first fitting wall protrudes in a direction close to the second connecting portion to form the protrusion; The second connecting portion has a second fitting wall and a recess that matches the protrusion, the second fitting wall being recessed in a direction away from the first connecting portion to form the recess; The first and second fitting walls are fitted together, and the protrusions and the recesses are inserted into each other.

[0016] In some embodiments, the protrusion has a plug-in end face and a plug-in side face, the concave portion has a concave bottom face and a concave side face, and the plug-in end face and the plug-in side face, as well as the concave bottom face and the concave side face, are respectively connected by arc transition surfaces; And / or, the insertion side is connected to the first mating wall, and the concave side is connected to the second mating wall, respectively, through the arc transition surface.

[0017] A method for manufacturing a stacked conductive component, used to manufacture the stacked conductive component described in any of the foregoing embodiments, the method comprising: An insulating film is provided on both sides of each conductive plate along the first direction, and a first insulating sealing portion is provided between the two insulating films on both sides of the conductive plate, so that the first insulating sealing portion and the first sealing surface of the conductive plate are in contact. The conductive plate, the two insulating films located on both sides of the conductive plate along the first direction, and the corresponding first insulating sealing portion are hot-pressed to form a conductive plate assembly; The conductive plate assembly is bent to form straight plate segments and bent plate segments; Multiple conductive plate assemblies are stacked and connected along the first direction; Insulating potting compound is injected into the potting area corresponding to the outer periphery of the bent plate segment, so that the insulating potting compound is connected to the first insulating edge portion, and the insulating potting compound forms at least a portion of the second insulating edge portion after curing.

[0018] In some embodiments, injecting insulating potting compound into the potting area includes: The insulating potting compound is injected from the lower end of the potting area along the direction of gravity, so that the insulating potting compound fills the potting area from bottom to top; when injecting the insulating potting compound, the potting area is evacuated, or the insulating potting compound is injected into the potting area in a vacuum environment.

[0019] In some embodiments, the manufacturing method further includes: Before the insulating film is respectively disposed on both sides of each of the conductive plates along the first direction, the insulating support assembly is connected to the outer periphery of the predetermined bending area corresponding to the conductive plate. After the insulating film is respectively disposed on both sides of the conductive plate along the first direction, the sidewalls of the insulating support assembly that are opposite to each other along the first direction are respectively attached to the insulating film on the corresponding side. Before bending the conductive plate assembly, the support liner is inserted into the potting area of ​​the insulating support assembly; When the conductive plate assembly is bent, the supporting liner is bent together with the conductive plate assembly.

[0020] In some embodiments, the manufacturing method further includes, prior to inserting the support liner into the potting area of ​​the insulating support assembly: Insulating oil is applied to the location where the support liner contacts the insulating support assembly.

[0021] In some embodiments, a connecting potting space is formed between the insulating support assembly and the first insulating sealing portion, and the insulating support assembly has a connecting hole connecting the potting area and the connecting potting space; After inserting the support liner into the potting area and before bending the conductive plate assembly, the manufacturing method further includes: Insulating potting compound is injected into the connecting potting space, and after the insulating potting compound cures, it forms the first part of the second insulating sealing portion; After stacking and connecting the plurality of said conductive plate assemblies along the first direction, and before injecting insulating potting compound into the potting area, the manufacturing method further includes: The support liner is removed from the insulating support assembly; Insulating potting compound is injected into the potting area. After the insulating potting compound cures, it forms a second part of the second insulating edge sealing portion. The second part of the second insulating edge sealing portion passes through the connecting hole and connects with the first part of the second insulating edge sealing portion.

[0022] In some embodiments, the manufacturing method further includes, prior to injecting insulating potting compound into the connection potting space: A release agent is applied to the surface of the support liner corresponding to the connecting potting space.

[0023] In some embodiments, the stacking and connecting of the plurality of conductive plate assemblies along the first direction includes: The two insulating films between two adjacent conductive plates are bonded together.

[0024] In this application, each conductive plate is provided with an insulating film on both sides along the first direction. The insulating film enables insulation isolation between adjacent conductive plates. The insulating sealing structure includes a first insulating sealing part and a second insulating sealing part. The first insulating sealing part and the second insulating sealing part are both located between the two insulating films on both sides of the corresponding conductive plate and are respectively attached to the first sealing surface and the second sealing surface of the conductive plate. This makes the outer periphery of the conductive plate no longer dependent on the insulating film for sealing, which helps to reduce the risk of bulging caused by the insulating film sealing.

[0025] Meanwhile, the first insulating edge sealing part is set for the straight plate segment, and the second insulating edge sealing part is set for the bent plate segment. The first and second insulating edge sealing parts are separate structures that are interconnected. Therefore, different forming and assembly methods can be adopted according to the structural characteristics of the straight and bent plate segments. Specifically, the straight plate segment has a more regular shape, and the first insulating edge sealing part can use a prefabricated insulating board to improve the dimensional stability and processing efficiency of the edge sealing. However, the outer perimeter of the bent plate segment has a more complex shape, and the second insulating edge sealing part can be formed by potting to adapt to the outer perimeter shape of the bent plate segment, improving the continuity and sealing reliability of the edge sealing in the bending area, thus balancing insulation performance and processing efficiency. Attached Figure Description

[0026] Figure 1This is a schematic diagram of the structure of a first specific embodiment of the stacked conductive component provided in this application; Figure 2 for Figure 1 A schematic diagram of the structure after the stacked conductive components conceal the second insulating edge; Figure 3 for Figure 2 A schematic diagram of the structure of the stacked conductive components before bonding and after the first insulating edge sealing portion is hidden; Figure 4 This is a schematic diagram of the structure of one of the conductive plate components in the assembled state, where the insulating film on one side of the conductive plate component is hidden and the supporting liner is supported in the second specific embodiment of the stacked conductive component provided in this application. Figure 5 for Figure 4 Schematic diagram of the structure after concealing the inner supporting liner; Figure 6 for Figure 4 Enlarged view of region A in the middle; Figure 7 for Figure 6 A schematic diagram of the split structure; Figure 8 This is a schematic diagram of a third specific embodiment of the stacked conductive component provided in this application; Figure 9 for Figure 8 A structural diagram of the second angle; Figure 10 for Figure 8 A magnified view of the first pin and its corresponding lap joint in the connected state; Figure 11 for Figure 1 A partial structural diagram of the first and second connecting parts of the first insulating sealing portion in the stacked conductive assembly at the connection position; Figure 12 for Figure 11 Schematic diagram of the structure of the second connecting part; Explanation of reference numerals in the attached figures: Layered main body 10; flat plate segment 101; first closed surface 1011; bent plate segment 102; second closed surface 1021; conductive plate 11; end electrode plate 11A; middle electrode plate 11B; positive electrode plate 111; intermediate electrode plate 112; negative electrode plate 113; insulating film 12; adhesive layer 13; overlapping joint 14; first pin 15; fixed end 151; transition section 152; wiring terminal 153; second pin 16; insulating support assembly 17; support plate part 171; folded part 172; connecting structure 173; connecting hole 17a; open end 17b; connecting potting space 17c; positioning structure 17d; Insulating edge sealing structure 20; first insulating edge sealing portion 21; connecting portion 21A; first connecting portion 211; first mating wall 2111; protrusion 2112; insertion end face 21121; insertion side face 21122; second connecting portion 212; second mating wall 2121; recess 2122; concave bottom surface 21221; concave side surface 21222; arc transition surface 213; second insulating edge sealing portion 22; potting area 23; Support liner 001; Liner handle 002; Installation positioning line 003. Detailed Implementation

[0027] Research has found that in related technologies, laminated conductive components that use insulating films for edge sealing are prone to bulging in the sealed area. The main causes include stress concentration generated during the curing process of the insulating film edge sealing, which, under thermal cycling or continuous high temperature, leads to local deformation or even cracking of the sealing material, thus causing bulging.

[0028] Based on this, embodiments of this application provide a stacked conductive component and a method for manufacturing the same. The stacked conductive component is not limited to a busbar structure, but can also be other stacked conductive structures that require current transmission.

[0029] To enable those skilled in the art to better understand the technical solutions of this application, specific embodiments of this application will be further described below with reference to the accompanying drawings. It should be understood that the following embodiments are for illustrative purposes only and do not constitute a limitation on the scope of protection of this application. Unless otherwise specified, the various embodiments and technical features described in this application can be combined with each other.

[0030] In the description of this application, the terms "first," "second," etc., are used only to distinguish different technical features and do not indicate quantity, order, or importance. The term "connection" should be interpreted broadly, and can refer to direct connection or indirect connection through an intermediate structure; it can refer to fixed connection or connection formed by means of bonding, pressing, potting, curing, etc. The term "multiple" refers to two or more. "First direction" refers to the stacking direction of the conductive plates.

[0031] Please refer to Figures 1-3 , Figure 1 This is a schematic diagram of a specific embodiment of the stacked conductive component provided in this application; Figure 2 for Figure 1 A schematic diagram of the structure after the stacked conductive components conceal the second insulating edge; Figure 3 for Figure 2 A schematic diagram of the structure of the stacked conductive components before bonding and after the first insulating edge is hidden.

[0032] In this embodiment of the application, the stacked conductive component includes a stacked body 10 and an insulating edge sealing structure 20.

[0033] The stacked main body 10 includes a plurality of conductive plates 11 stacked along a first direction. The conductive plates 11 can be copper busbars, aluminum busbars, or other conductive metal plates, and the plurality of conductive plates 11 perform the function of current transmission at different potentials. For example, in some embodiments, the plurality of conductive plates 11 include a positive electrode plate 111, an intermediate electrode plate 112, and a negative electrode plate 113, which are stacked along the first direction. Among them, the positive electrode plate 111 and the negative electrode plate 113 are end electrodes 11A, and the intermediate electrode plate 112 is a middle electrode plate 11B.

[0034] Each conductive plate 11 has an insulating film 12 on both sides along the first direction, meaning that both surfaces of each conductive plate 11 are covered by the insulating film 12. Thus, when multiple conductive plates 11 are stacked along the first direction, adjacent conductive plates 11 can be insulated from each other by the insulating film 12 located between them. The insulating film 12 may include a base layer and an adhesive layer, the adhesive layer being used to bond and adhere to the conductive plates 11 during hot pressing.

[0035] The conductive plate 11 has a first sealing surface 1011 and a second sealing surface 1021. Both the first sealing surface 1011 and the second sealing surface 1021 are the outer peripheral sides of the conductive plate 11 that need to be insulated and sealed.

[0036] The laminated body 10 includes at least two flat plate segments 101 and a bent plate segment 102 connecting two adjacent flat plate segments 101, with the two adjacent flat plate segments 101 arranged at an included angle. The flat plate segment 101 is the portion of the laminated body 10 that is generally flat or extends in a basically straight manner, while the bent plate segment 102 is the portion of the laminated body 10 that connects two flat plate segments 101 and undergoes a bend or transition. It can be an arc-shaped bend or an angled structure. The included angle between two adjacent flat plate segments 101 can be set according to the actual installation space and electrical connection requirements, and can be an obtuse angle, a right angle, or an acute angle.

[0037] The first sealing surface 1011 is located on the outer periphery of the straight plate section 101. It is usually relatively regular in shape, which makes it easy to set a stable insulating edge sealing part. The second sealing surface 1021 is located on the outer periphery of the bent plate section 102. Due to the influence of the bending shape, its shape is relatively complex. If a pre-formed edge sealing structure is used to directly close it, problems such as discontinuous edge sealing may easily occur.

[0038] Therefore, this application provides a first insulating sealing portion 21 and a second insulating sealing portion 22 at the first sealing surface 1011 and the second sealing surface 1021, respectively.

[0039] Specifically, the insulating edge sealing structure 20 includes a first insulating edge sealing portion 21 and a second insulating edge sealing portion 22 corresponding to each conductive plate 11. The first insulating edge sealing portion 21 and the second insulating edge sealing portion 22 are separate structures that are connected to each other. In other words, the first insulating edge sealing portion 21 and the second insulating edge sealing portion 22 are formed independently, respectively corresponding to different areas and connected to each other in adjacent positions, thereby jointly constituting the insulating edge sealing structure 20.

[0040] For any conductive plate 11, the first insulating edge sealing portion 21 and the second insulating edge sealing portion 22 are both located between the two insulating films 12 on both sides of the conductive plate 11 along the first direction. The first insulating edge sealing portion 21 is in contact with the first sealing surface 1011 of the conductive plate 11. After the first insulating edge sealing portion 21 is in contact with the first sealing surface 1011, it can insulate and seal the outer periphery of the straight plate segment 101, preventing the edge of the conductive plate 11 at the straight plate segment 101 from being exposed.

[0041] The second insulating sealing part 22 is attached to the second sealing surface 1021 of the conductive plate 11. The second insulating sealing part 22 is used to insulate and seal the outer periphery of the bent plate segment 102 to prevent the edge of the conductive plate 11 at the bent plate segment 102 from being exposed.

[0042] Unlike the method of covering the outer periphery of the conductive plate 11 with an insulating film 12, the embodiment of this application seals the outer periphery of the conductive plate 11 with an insulating sealing structure 20. This allows the insulating film 12 to mainly serve as an insulating layer between the conductive plates 11, rather than serving as an outer periphery sealing layer. This reduces residual air inside the stacked conductive components, reduces stress concentration caused by bending of the insulating film 12 in the sealing area, and lowers the risk of bulging in the sealing area.

[0043] Meanwhile, in this embodiment, the first insulating edge sealing part 21 and the second insulating edge sealing part 22 are separate structures. Different forming and assembly methods can be adopted according to the forming characteristics of the straight plate segment 101 and the bent plate segment 102. The outer peripheral shape of the straight plate segment 101 is relatively regular. Therefore, the first insulating edge sealing part 21 can be a prefabricated plate structure with stable dimensions, easy processing and positioning, and easy assembly. The outer peripheral shape of the bent plate segment 102 is relatively complex. The second insulating edge sealing part 22 can be formed by potting after bending to adapt to the shape of the outer peripheral shape of the bent plate segment 102 and avoid the edge sealing structure formed in advance during bending being damaged by pulling. After the first insulating edge sealing part 21 and the second insulating edge sealing part 22 are connected to each other, the continuity of the outer peripheral edge sealing of the conductive plate 11 can still be guaranteed, and the sealing reliability of the stacked conductive components can be improved.

[0044] In some embodiments, the first insulating edge sealing portion 21 is an insulating plate, which can be a plate-shaped insulating component pre-processed into a preset shape. The conductive plate 11, the two insulating films 12 located on both sides of the conductive plate 11 along the first direction, and the corresponding first insulating edge sealing portion 21 are an integral hot-pressed structure.

[0045] In other words, in the finished product, the conductive plate 11, the insulating film 12 located on both sides of the conductive plate 11, and the first insulating sealing portion 21 are connected as a whole by hot pressing. In this way, the relative position of the first insulating sealing portion 21 at the flat plate section 101 is more stable and less prone to loosening or displacement. During the hot pressing process, the adhesive layer of the insulating film 12 can form an adhesive connection between the conductive plate 11 and the first insulating sealing portion 21, improving structural stability.

[0046] In some embodiments, the first insulating sealing portion 21 is made of insulating material to provide an insulating seal to the outer periphery of the straight plate segment 101.

[0047] For example, the first insulating sealing portion 21 can be made of epoxy board. Epoxy board has good mechanical strength, heat resistance and insulation properties, and can adapt to the hot pressing and long-term high-temperature operation of laminated conductive components, thereby improving the sealing reliability at the first sealing surface 1011.

[0048] Of course, the material of the first insulating edge sealing portion 21 is not limited to epoxy board. In other embodiments, the first insulating edge sealing portion 21 can also be made of GPO-3 polyester glass fiber mat laminate, SMC (Sheet Molding Compound), PPS (Polyphenylene Sulfide), PEEK (Polyether Ether Ketone), glass fiber reinforced PA66 (Polyamide 66) or PI (Polyimide) glass fiber composite board, etc., all of which can play the role of insulating edge sealing.

[0049] Since each conductive plate 11 has an insulating film 12 on both sides, when multiple conductive plates 11 are stacked, two insulating films 12 will be formed between adjacent conductive plates 11. Therefore, the stacked body 10 also includes an adhesive layer 13. The adhesive layer 13 connects at least the portion of the two insulating films 12 located in the straight section 101 between two adjacent conductive plates 11. In other words, the portions of the two insulating films 12 located in the bent section 102 can be bonded or not, both allowing the multiple conductive plate assemblies to form a whole after stacking, reducing misalignment of the stacked body 10 during use. The adhesive layer 13 can be double-sided adhesive film, etc.

[0050] Please continue to refer to this. Figure 2In some embodiments, the second sealing surface 1021, the first insulating sealing portion 21 near the side of the bent plate segment 102, and the corresponding two insulating films 12 together define the potting area 23, and the second insulating sealing portion 22 fills the potting area 23.

[0051] The potting area 23 is the space to be filled formed on the outer periphery of the bent plate segment 102 after bending. This space to be filled is defined by the second closed surface 1021 of the bent plate segment 102, the two insulating films 12 in the first direction, and the side of the first insulating sealing portion 21 near the bent plate segment 102. By forming the second insulating sealing portion 22 in the potting area 23, the second insulating sealing portion 22 can be matched with the actual bending shape of the bent plate segment 102, thereby improving the sealing reliability of the bending area.

[0052] The second insulating sealing portion 22 can be formed by curing an insulating potting compound. The insulating potting compound can be epoxy resin or other potting materials with insulating properties. Epoxy resin, in particular, has good adhesive strength, insulating properties, and heat resistance, making it suitable for laminated conductive components in high-temperature environments. The potting compound has a certain degree of fluidity before curing and forms a stable insulating sealing portion after curing, thereby achieving reliable sealing at the bent plate segment 102.

[0053] Since the second insulating edge sealing portion 22 is formed within the potting area 23, it can form an adhesive relationship with the second sealing surface 1021, the insulating film 12, and the side of the first insulating edge sealing portion 21 near the bent plate segment 102. It can not only seal the edge of the conductive plate 11 at the bent plate segment 102, but also connect the first insulating edge sealing portion 21, so that the first insulating edge sealing portion 21 and the second insulating edge sealing portion 22 together form the insulating edge sealing structure 20, reducing the problem of discontinuous edge sealing.

[0054] Please refer to Figures 4-7 , Figure 4 This is a schematic diagram of the structure of one of the conductive plate components in the assembled state, where the insulating film on one side of the conductive plate component is hidden and the supporting liner is supported in the second specific embodiment of the stacked conductive component provided in this application. Figure 5 for Figure 4 Schematic diagram of the structure after concealing the inner supporting liner; Figure 6 for Figure 4 Enlarged view of region A in the middle; Figure 7 for Figure 6 A schematic diagram of its split structure.

[0055] In some embodiments, the stacked conductive assembly further includes at least one insulating support assembly 17, which is connected to the outer periphery of the corresponding bent plate segment 102. The insulating support assembly 17 has a potting area 23, and one end of the insulating support assembly 17 facing away from the corresponding bent plate segment 102 has an open end 17b, which communicates with the potting area 23.

[0056] The insulating support component 17 can be made of a bendable material that can maintain its shape after bending and has insulating properties, such as PC (Polycarbonate), PET (Polyethylene Terephthalate), modified PC, and PEI (Polyetherimide). After manufacturing, the insulating support component 17 is retained in the laminated conductive component as part of the laminated conductive component.

[0057] The insulating support assembly 17 has its sidewalls facing away from each other along the first direction respectively attached to the corresponding insulating film 12, thereby supporting the insulating film 12 on both sides of the bending area during the bending process, reducing the degree of deformation of the insulating film 12 into the potting area 23 during the bending process, so that space for potting can still be reserved on the outer periphery of the second sealing surface 1021 after bending.

[0058] The end of the insulating support assembly 17 near the first insulating edge sealing portion 21 has a connecting hole 17a. A portion of the second insulating edge sealing portion 22 fills the potting area 23, and a portion of the second insulating edge sealing portion 22 passes through the connecting hole 17a to connect with the first insulating edge sealing portion 21. This makes the edge sealing at the bent plate segment 102 and the edge sealing at the straight plate segment 101 continuously connected, reducing the problem of discontinuous edge sealing.

[0059] To reduce the degree of deformation of the insulating support assembly 17 into the potting space during bending, such as Figure 6 and Figure 7 As shown, before bending the conductive plate to form the bent plate segment 102, at least a portion of the support liner 001 can be inserted into the potting area 23 of the insulating support assembly 17. The shape of the support liner 001 can be adapted to the potting area 23 and can be bent together with the conductive plate assembly.

[0060] Before injecting insulating potting compound into the potting area 23, the support liner 001 is removed from the insulating support assembly 17. Therefore, the support liner 001 does not constitute part of the final stacked conductive assembly. Since the insulating support assembly 17 can maintain its bent shape, after removing the support liner 001, the insulating support assembly 17 can still maintain the potting area 23 for subsequent potting.

[0061] Depend on Figure 6 and Figure 7 As can be seen, the support liner 001 includes a liner handle 002. When the support liner 001 is inserted into the potting area 23 of the insulating support assembly 17, the liner handle 002 is exposed outside the insulating support assembly 17, which makes it easy to pull out the support liner 001 after bending.

[0062] The support liner 001 can also be provided with an installation positioning line 003 to determine whether the support liner 001 is inserted in place. For example, when the support liner 001 is inserted into the potting area 23 of the insulating support assembly 17, the installation positioning line 003 is flush with the open end of the insulating support assembly 17, which indicates that the support liner 001 is inserted in place.

[0063] Please continue to refer to this. Figure 6 and Figure 7 In some embodiments, the end of the insulating support assembly 17 near the first insulating edge portion 21 is spaced apart from the first insulating edge portion 21, thereby forming a connecting potting space 17c between the insulating support assembly 17 and the first insulating edge portion 21. The connecting hole 17a connects the potting area 23 and the connecting potting space 17c, and a portion of the second insulating edge portion 22 fills the connecting potting space 17c.

[0064] The second insulating sealing portion 22 filled in the potting space 17c is defined as the first part of the second insulating sealing portion 22, and the second insulating sealing portion 22 filled in the potting area 23 is defined as the second part of the second insulating sealing portion 22. Thus, the first part of the second insulating sealing portion 22 can fill the gap between the insulating support assembly 17 and the first insulating sealing portion 21, and connect to the second part of the second insulating sealing portion 22 through the connecting hole 17a, so that the first insulating sealing portion 21 and the second insulating sealing portion 22 form a continuous insulating sealing structure, reducing the problem of discontinuous sealing.

[0065] During the molding process, the first part of the second insulating edge sealing part 22 and the second part of the second insulating edge sealing part 22 are formed in steps. First, insulating potting compound is injected into the connecting potting space 17c to form the first part of the second insulating edge sealing part 22, and then insulating potting compound is injected into the potting area 23 to form the second part of the second insulating edge sealing part 22, so as to minimize the possibility of a gap between the insulating support assembly 17 and the first insulating edge sealing part 21.

[0066] When the insulating potting compound is injected into the connecting potting space 17c, the support liner 001 is still inserted in the potting area 23 of the insulating support assembly 17.

[0067] Please continue to refer to this. Figure 7 In this embodiment of the application, the insulating support assembly 17 includes two support plate portions 171, both of which are connected to the corresponding bent plate segments 102 and are distributed at intervals along the first direction. The sidewalls of the two support plate portions 171 that are opposite to each other are attached to the insulating film 12 on the corresponding side to support the insulating film 12 on both sides of the bent area respectively. A potting area 23 is formed between the two support plate portions 171.

[0068] At least one support plate portion 171 has a folded portion 172 near the end of the first insulating edge portion 21. There is a gap between the free end of the folded portion 172 and another support plate portion 171, which forms a connecting hole 17a to facilitate the passage of the second insulating edge portion 22 through the first insulating edge portion 21.

[0069] The folding portion 172 serves two purposes: firstly, it limits the position of the support liner 001, ensuring that the support liner 001 is stably inserted into the potting area 23; secondly, the folding portion 172 also isolates the support liner 001 from the first part of the second insulating sealing portion 22, reducing the contact area between the support liner 001 and the first part of the second insulating sealing portion 22, reducing the resistance encountered by the support liner 001 during the pull-out process, and improving the smoothness of the pull-out process.

[0070] As mentioned earlier, both support plate sections 171 are connected to corresponding bent plate sections 102, specifically... Figure 6 and Figure 7 In the embodiment shown, both support plate portions 171 have a connecting structure 173, which is generally T-shaped. The bent plate segment 102 is provided with a corresponding T-shaped connecting groove. The connecting structure 173 is inserted into the corresponding T-shaped connecting groove to achieve a reliable connection between the support plate portion 171 and the corresponding bent plate segment 102.

[0071] Please continue to refer to this. Figure 6 and Figure 7 In some embodiments, the insulating support assembly 17 has a positioning structure 17d that extends from the open end 17b toward the corresponding bent plate segment 102. When the support liner 001 is inserted into the potting area 23 from the open end 17b, the positioning structure 17d is used to position and engage with the matching positioning structure on the support liner 001, thereby limiting the position of the support liner 001 relative to the insulating support assembly 17, so that the support liner 001 can be inserted into a predetermined position and remain stable during bending.

[0072] Figure 6 and Figure 7 In the illustrated embodiment, the positioning structure 17d is a positioning notch, and the mating positioning structure on the support liner 001 is a protrusion that can enter the positioning notch. The positioning structure 17d at least partially overlaps with the connecting hole 17a. In other words, the connecting hole 17a allows the insulating potting compound to pass through while also forming a positioning fit with the support liner 001.

[0073] In other embodiments, the positioning structure 17d can also be a positioning groove or a positioning protrusion, etc. The positioning groove can open at least to one side of the potting area 23, and the positioning protrusion can protrude toward the potting area 23. Accordingly, the mating positioning structure on the support liner 001 can adopt a protrusion, groove, notch, etc. that are adapted to the positioning structure 17d, as long as it can form a positioning fit when the support liner 001 is inserted into the potting area 23.

[0074] Please refer to Figures 8-10 , Figure 8 This is a schematic diagram of a third specific embodiment of the stacked conductive component provided in this application; Figure 9 for Figure 8 A structural diagram of the second angle; Figure 10 for Figure 8 A magnified view of the first pin and its corresponding lap joint in the connected state.

[0075] In some embodiments, the plurality of conductive plates 11 include two end plates 11A located at the ends in a first direction, and a middle plate 11B located between the two end plates 11A along the first direction. At least one of the end plates 11A has an overlap joint 14 on its surface facing away from the middle plate 11B along the first direction. The overlap joint 14 is spaced from the edge of the corresponding end plate 11A along a second direction. The first direction and the second direction are perpendicular to each other.

[0076] The stacked conductive component also includes a first pin 15, which extends along a second direction. One end of the first pin 15 along the second direction is connected to a corresponding lap joint 14. Except for the part of the first pin 15 connected to the lap joint 14, the remaining part of the first pin 15 is spaced from the corresponding end plate 11A.

[0077] Depend on Figure 8 It can be seen that the stacked conductive component also includes a second pin 16, which is connected to the central electrode plate 11B and extends along the second direction. The first pin 15 and the second pin 16 are arranged adjacent to each other in the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0078] As configured above, since the overlap joint 14 is spaced from the edge of the end plate 11A along the second direction, and the first pin 15, except for the part connected to the overlap joint 14, is spaced from the corresponding end plate 11A, the electrical connection position between the first pin 15 and the end plate 11A is recessed from the edge of the end plate 11A. This causes the creepage path between the first pin 15 and the adjacent second pin 16 to no longer be bounded by the edge of the end plate 11A, but needs to extend further along the insulating surface to the location of the overlap joint 14, thereby increasing the length of the creepage path.

[0079] In some embodiments, a rivet screw can be provided at the lap joint 14, and the first pin 15 is connected to the corresponding end plate 11A through the rivet screw, so that the first pin 15 can be processed as an independent component and then connected to the corresponding conductive plate 11.

[0080] like Figure 10 As shown, in some embodiments, the first pin 15 includes a fixed end 151, a transition section 152 and a terminal 153 connected sequentially in the extending direction. The fixed end 151 is connected to the lap joint 14, and the terminal 153 is located outside the edge of the corresponding end plate 11A in the second direction. Compared to the fixed end 151 and the terminal 153, the transition section 152 protrudes in the first direction away from the end plate 11A.

[0081] In this way, the distance between the transition section 152 and the end plate 11A along the first direction can be increased, so that the transition section 152 and the end plate 11A are kept apart, and the contact between the transition section 152 of the first pin 15 and the end plate 11A is avoided as much as possible. As a result, the creepage path between the first pin 15 and the adjacent second pin 16 needs to extend along the insulating surface to the connection position between the fixed end 151 and the lap joint 14, thereby lengthening the creepage path and increasing the creepage distance between the first pin 15 and the adjacent second pin 16.

[0082] Please refer to Figures 11-12 , Figure 11 for Figure 1 A partial structural diagram of the first and second connecting parts of the first insulating sealing portion in the stacked conductive assembly at the connection position; Figure 12 for Figure 11 A schematic diagram of the structure of the second connecting part.

[0083] In some embodiments of this application, the first insulating edge sealing portion 21 includes a plurality of connecting portions 21A. Two interconnected connecting portions 21A are defined as the first connecting portion 211 and the second connecting portion 212, which are sequentially arranged along the outer periphery of the straight plate segment 101 of the corresponding conductive plate 11. It can be seen that the first insulating edge sealing portion 21 can be formed by splicing multiple connecting portions. Using a method of splicing multiple connecting portions can reduce the processing difficulty of the first insulating edge sealing portion 21.

[0084] The first connecting portion 211 has a first fitting wall 2111 and a protrusion 2112. The first fitting wall 2111 protrudes towards the second connecting portion 212 to form the protrusion 2112. The second connecting portion 212 has a second fitting wall 2121 and a recess 2122 that matches the protrusion 2112. The second fitting wall 2121 is recessed away from the first connecting portion 211 to form the recess 2122. The first fitting wall 2111 and the second fitting wall 2121 fit together, and the protrusion 2112 and the recess 2122 are inserted into each other.

[0085] Through the interlocking of the protrusion 2112 and the recess 2122, the connection between the first connecting portion 211 and the second connecting portion 212 is no longer a simple straight-line connection, but rather a connection structure with a bent path. The creepage path generated along the joint boundary of the first connecting portion 211 and the second connecting portion 212 needs to bypass the mating area of ​​the protrusion 2112 and the recess 2122, and its path length is greater than that of a simple planar connection. Therefore, this structure can improve the creepage distance at the edge-sealing connection position without significantly increasing the overall size of the stacked conductive components.

[0086] In addition, the insertion and mating of the protrusion 2112 and the recess 2122 also has a positioning function. When the first connecting part 211 and the second connecting part 212 are assembled, the protrusion 2112 extends into the recess 2122, which can limit the relative offset between the two, improve the splicing accuracy of the first insulating sealing part 21, reduce the gap at the sealing connection position, and reduce the risk of partial discharge.

[0087] like Figure 11 and Figure 12 As shown, the protrusion 2112 has a plug-in end face 21121 and a plug-in side face 21122. The plug-in end face 21121 is the side surface of the protrusion 2112 near the bottom of the groove of the recess 2122, and the plug-in side face 21122 is the surface of the protrusion 2112 along at least one side of the plugging direction. The recess 2122 has a concave bottom face 21221 and a concave side face 21222. The concave bottom face 21221 is the side surface of the recess 2122 away from the groove opening, and the concave side face 21222 can be the surface of the recess 2122 along at least one side of the concave direction. The protrusion 2112 and the recess 2122 form a plugging structure through the cooperation of the plug-in end face 21121, the plug-in side face 21122, the concave bottom face 21221, and the concave side face 21222.

[0088] The insertion end face 21121 and the insertion side face 21122 can be connected by an arc transition surface 213, and the concave bottom face 21221 and the concave side face 21222 can be connected by an arc transition surface 213. By setting the arc transition surface 213, sharp corners can be avoided at the corner positions of the protrusion 2112 and the concave part 2122. Sharp corners are prone to partial discharge. The arc transition surface 213 can smoothly connect adjacent surfaces, reduce the possibility of partial discharge, and improve the insulation reliability of the sealing connection position.

[0089] In some embodiments, the insertion side 21122 is connected to the first mating wall 2111 via an arc transition surface 213, and the concave side 21222 is connected to the second mating wall 2121 via an arc transition surface 213. This arrangement can further reduce the sharp angles at the connection points of the first connection portion 211 and the second connection portion 212, further reduce the possibility of partial discharge, and reduce the risk of stress concentration.

[0090] The radius of the arc transition surface 213 can be from 1mm to 3mm. If the radius of the arc transition surface 213 is less than 1mm, the radius is small and the improvement of partial discharge is not significant; if the radius of the arc transition surface 213 is greater than 3mm, the radius is large and may affect the mating strength of the protrusion 2112 and the concave portion 2122. Based on this, the radius of the arc transition surface 213 has the above-mentioned range of values, specifically 1mm, 1.3mm, 1.5mm, 1.8mm, 2mm, 2.5mm, 2.8mm, 3mm, etc., to achieve a balance between improving partial discharge and increasing mating strength.

[0091] Along the protruding direction of the protrusion 2112 relative to the first mating wall 2111, the distance between the insertion end face 21121 and the first mating wall 2111 is L, and the value of L can be in the range of 5mm to 10mm. This distance L is the protruding length of the protrusion 2112 relative to the first mating wall 2111. If L is less than 5mm, the protruding length of the protrusion 2112 relative to the first mating wall 2111 is small, the path length of the mating area between the protrusion 2112 and the recess 2122 is small, the effect of increasing the creepage distance is weak, and the mating strength may be insufficient; if L is greater than 10mm, the protruding length of the protrusion 2112 relative to the first mating wall 2111 is large, which may weaken the structural strength of the connection position. Based on this, L has the above range of values, specifically 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, etc., to achieve a balance between increasing the creepage distance and improving the structural strength of the connection position.

[0092] This application also provides a method for manufacturing a stacked conductive component, which can be used to manufacture the stacked conductive component in any of the foregoing embodiments. The manufacturing method includes: Insulating films 12 are respectively provided on both sides of each conductive plate 11 along the first direction. A first insulating sealing portion 21 is disposed between the two insulating films 12 on both sides of the conductive plate 11, so that the first insulating sealing portion 21 and the first sealing surface 1011 of the conductive plate 11 are in contact. By setting the first insulating sealing portion 21 to the required position before hot pressing, the first insulating sealing portion 21, the conductive plate 11 and the insulating film 12 can be fixed synchronously during hot pressing, thereby improving assembly efficiency and sealing accuracy.

[0093] Subsequently, the conductive plate 11, the two insulating films 12 located on both sides of the conductive plate 11 along the first direction, and the corresponding first insulating sealing portion 21 are hot-pressed to form a conductive plate assembly. During the hot-pressing process, the insulating film 12 can adhere to the conductive plate 11 and form a connection with the first insulating sealing portion 21. The hot-pressed conductive plate assembly has good integrity, and the first insulating sealing portion 21 is stable in position relative to the conductive plate 11, which facilitates subsequent bending and stacking.

[0094] Next, the conductive plate assembly is bent to form a straight plate segment 101 and a bent plate segment 102. Since the first insulating edge sealing portion 21 is mainly set corresponding to the straight plate segment 101, the potting area 23 can be retained at the bent plate segment 102. Therefore, during the bending process, the bent plate segment 102 will not generate large stress due to the pre-set edge sealing structure, and the problem of the edge sealing material being stretched is not easy to occur. After bending, the conductive plate assembly has formed the shape required for actual use, and the subsequent potting can better adapt to the required shape.

[0095] Multiple conductive plate assemblies are then stacked and connected along the first direction. The multiple conductive plate assemblies may include a positive electrode plate assembly, an intermediate electrode plate assembly, and a negative electrode plate assembly. Each conductive plate assembly can be hot-pressed and bent separately, and then stacked and connected by the adhesive layer 13. By preparing the conductive plate assemblies separately and then stacking and connecting them, the process difficulty of bending the entire multi-layer conductive plate at one time can be reduced.

[0096] Finally, insulating potting compound is injected into the potting area 23 on the outer periphery of the corresponding bent plate segment 102, so that the insulating potting compound is connected to the first insulating edge sealing portion 21. After the insulating potting compound cures, it forms at least a portion of the second insulating edge sealing portion 22.

[0097] Because the insulating potting compound has a certain fluidity before curing, it can fill the potting area 23 on the outer periphery of the bent plate segment 102 according to the actual shape after bending. After curing, it forms a stable insulating potting part, thereby achieving reliable edge sealing at the bent plate segment 102. Furthermore, the insulating potting compound is connected to the first insulating edge sealing part 21, making the insulating edge sealing at the straight plate segment 101 and the bent plate segment 102 continuous, reducing the problem of discontinuous edge sealing.

[0098] In some embodiments, injecting insulating potting compound into the potting area 23 specifically includes: Insulating potting compound is injected from the lower end of the potting area 23 along the direction of gravity, so that the insulating potting compound fills the potting area 23 from bottom to top; when injecting the insulating potting compound, the potting area 23 can be vacuumed, or the insulating potting compound can be injected into the potting area 23 in a vacuum environment.

[0099] During the bottom-up filling process, the insulating potting compound can push the gas in the potting area 23 upward to escape, reduce the residual air bubbles, and further reduce the gas being trapped inside the insulating potting compound.

[0100] Vacuum treatment or injection under vacuum conditions can further reduce the gas content in the potting area 23, allowing the insulating potting compound to fill the potting area 23 more fully, reducing air bubbles inside the second insulating sealing edge 22 after curing, thereby reducing the risk of bulging caused by gas expansion under high temperature conditions.

[0101] In the embodiment where the insulating support assembly 17 is provided, before the insulating film 12 is provided on both sides of each conductive plate 11 along the first direction, the insulating support assembly 17 can be connected to the outer periphery of the predetermined bending area of ​​the corresponding conductive plate 11.

[0102] The predetermined bending area refers to the area where the conductive plate assembly forms the bent plate segment 102 after subsequent bending. In this way, the insulating support assembly 17 can undergo subsequent hot pressing and bending processes together with the conductive plate 11, and retain the potting area 23 after bending.

[0103] After insulating films 12 are respectively provided on both sides of the conductive plate 11 along the first direction, the insulating support assembly 17 is made to adhere to the insulating films 12 on the corresponding sides along the opposite sides of the first direction, so that the insulating films 12 on both sides of the bending area can be supported during the bending process, reducing the degree of deformation of the insulating films 12 into the potting area 23 during the bending process.

[0104] Before bending the conductive plate assembly, the support liner 001 is inserted into the potting area 23 of the insulating support assembly 17 from the open end 17b. When the conductive plate assembly is bent, the support liner 001 can bend along with the conductive plate assembly. In this way, the support liner 001 can support the insulating support assembly 17 during the bending process, reducing the degree of deformation of the insulating support assembly 17 into the potting space during the bending process.

[0105] In some embodiments, before inserting the support liner 001 into the potting area 23 of the insulating support assembly 17, insulating oil may be applied to the contact area between the support liner 001 and the insulating support assembly 17. The insulating oil reduces friction between the support liner 001 and the insulating support assembly 17, making it easier for the support liner 001 to be pulled out of the potting area 23 after bending.

[0106] In an embodiment where a connecting potting space 17c is formed between the insulating support assembly 17 and the first insulating sealing portion 21, the insulating support assembly 17 has a connecting hole 17a that connects the potting region 23 and the connecting potting space 17c. The manufacturing method further includes, after the support liner 001 is inserted into the potting region 23 and before the conductive plate assembly is bent: Insulating potting compound is injected into the connecting potting space 17c. After the insulating potting compound cures, it forms the first part of the second insulating sealing portion 22. This first part of the second insulating sealing portion 22 can fill the gap between the insulating support assembly 17 and the first insulating sealing portion 21.

[0107] Subsequently, the conductive plate assembly is bent, and after multiple conductive plate assemblies are stacked and connected along the first direction, and before insulating potting compound is injected into the potting area 23, the manufacturing method further includes: The support liner 001 is removed from the insulating support assembly 17. Since the insulating support assembly 17 itself can maintain its bent shape, and the first part of the second insulating sealing edge 22 has been formed in the connecting potting space 17c, the potting area 23 can still maintain its structural shape after the support liner 001 is removed, so as to be used for subsequent potting.

[0108] Subsequently, insulating potting compound is injected into the potting area 23. After curing, the insulating potting compound forms the second part of the second insulating edge sealing portion 22. The insulating potting compound in the potting area 23 can contact the already cured first part in the connecting potting space 17c through the connecting hole 17a, allowing the second part to pass through the connecting hole 17a and connect with the first part. Thus, through the first potting before bending and the second potting after the support liner 001 is removed, the gap between the insulating support assembly 17 and the first insulating edge sealing portion 21, as well as the potting area 23, can be filled simultaneously, improving the continuity of the insulating edge sealing.

[0109] Before injecting insulating potting compound into the connecting potting space 17c, a release agent can be applied to the surface of the support liner 001 corresponding to the connecting potting space 17c. The release agent is located between the support liner 001 and the first part of the second insulating sealing edge portion 22 formed by the initial potting, which can reduce the adhesion between the two, thereby facilitating the removal of the support liner 001 after the first part has cured and been bent.

[0110] In some embodiments, when multiple conductive plate assemblies are stacked and connected along a first direction, it specifically includes bonding two insulating films 12 between two adjacent conductive plates 11.

[0111] Bonding can be achieved through adhesive layer 13, which can be, for example, a double-sided adhesive film. By bonding two adjacent insulating films 12, multiple conductive plate assemblies can be stacked to form a stable whole, and the possibility of relative misalignment of the conductive plate assemblies during subsequent potting process can be reduced.

[0112] By combining the above-mentioned structure and process, the risk of edge bulging or cracking of laminated conductive components under high temperature aging, thermal cycling or continuous high temperature environment can be reduced, thereby improving the insulation performance and long-term reliability of laminated conductive components.

[0113] The stacked conductive components in this application have undergone high-temperature storage, rapid temperature change aging, and double 85 tests, which have reduced edge bulging, ensured stable electrical performance, and met high reliability requirements for structural strength.

[0114] Among them, the high-temperature storage test refers to storing the laminated conductive components in an environment of 130°C for 96 hours; the rapid temperature change aging test refers to placing the laminated conductive components in a test environment where the temperature is first reduced from 0°C to -40°C at a rate of 10°C / min, stored at -40°C for 30 minutes, and then the temperature is increased from -40°C to 130°C at a rate of 10°C / min, stored at 130°C for 30 minutes, and then the test environment is gradually restored to 0°C, thus completing one cycle, and 100 cycles are performed to complete the test; the double 85 test refers to storing the laminated conductive components in a test environment with 85% humidity and 85°C for 96 hours.

[0115] The above are only some embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A stacked conductive component, characterized in that, It includes a laminated body (10) and an insulating edge sealing structure (20); The stacked body (10) includes a plurality of conductive plates (11) stacked along a first direction. Each conductive plate (11) has an insulating film (12) on both sides along the first direction. The conductive plate (11) has a first sealing surface (1011) and a second sealing surface (1021). The stacked body (10) includes at least two flat plate segments (101) and a bent plate segment (102) connecting two adjacent flat plate segments (101). The two adjacent flat plate segments (101) are arranged at an angle. The first sealing surface (1011) is located on the outer periphery of the flat plate segment (101), and the second sealing surface (1021) is located on the outer periphery of the bent plate segment (102). The insulating edge sealing structure (20) includes a first insulating edge sealing portion (21) and a second insulating edge sealing portion (22) provided corresponding to each of the conductive plates (11). For any of the conductive plates (11), the first insulating edge sealing portion (21) and the second insulating edge sealing portion (22) are located between the two insulating films (12) on both sides of the conductive plate (11) along the first direction. The first insulating edge sealing portion (21) is attached to the first sealing surface (1011), and the second insulating edge sealing portion (22) is attached to the second sealing surface (1021). The first insulating edge sealing portion (21) and the second insulating edge sealing portion (22) are separate structures and connected to each other.

2. The stacked conductive component according to claim 1, characterized in that, The first insulating sealing part (21) is an insulating plate, and the conductive plate (11), the two insulating films (12) located on both sides of the conductive plate (11) along the first direction, and the corresponding first insulating sealing part (21) are an integral hot-pressed structure.

3. The stacked conductive component according to claim 1, characterized in that, The stacked body (10) includes two insulating films (12) between two adjacent conductive plates (11) and an adhesive layer (13) that connects at least the portion of the two insulating films (12) between two adjacent conductive plates (11) located in the flat plate segment (101).

4. The stacked conductive assembly according to claim 1, characterized in that, The first insulating edge sealing portion (21) is an insulating board, the second sealing surface (1021), the side of the first insulating edge sealing portion (21) near the bent plate segment (102), and the corresponding two insulating films (12) together define the potting area (23), and the second insulating edge sealing portion (22) fills the potting area (23).

5. The laminated conductive assembly according to any one of claims 1 to 3, characterized in that, The stacked conductive assembly further includes at least one insulating support assembly (17), which is connected to the outer periphery of the corresponding bent plate segment (102). The insulating support assembly (17) has a potting area (23), and one end of the insulating support assembly (17) opposite to the corresponding bent plate segment (102) has an open end (17b) communicating with the potting area (23). The insulating support assembly (17) has its sidewalls facing away from each other along the first direction respectively attached to the insulating film (12) on the corresponding side. The insulating support assembly (17) has a connecting hole (17a) at the end near the first insulating sealing portion (21). A portion of the second insulating sealing portion (22) is filled in the potting area (23), and a portion of the second insulating sealing portion (22) passes through the connecting hole (17a) and connects to the first insulating sealing portion (21).

6. The stacked conductive component according to claim 5, characterized in that, The insulating support assembly (17) includes two support plate portions (171), each of which is connected to a corresponding bent plate segment (102) and is distributed at intervals along the first direction. The sidewalls of the two support plate portions (171) that are opposite to each other are attached to the insulating film (12) on the corresponding side, and the potting area (23) is formed between the two support plate portions (171). At least one of the support plate portions (171) has a folded portion (172) at the end near the first insulating sealing portion (21), and there is a gap between the free end of the folded portion (172) and the other support plate portion (171) to form the connecting hole (17a).

7. The stacked conductive component according to claim 5, characterized in that, The insulating support assembly (17) has a positioning structure (17d) that extends from the open end (17b) toward the corresponding bent plate segment (102) and is configured to engage with the support liner (001) inserted into the potting area (23).

8. The stacked conductive component according to claim 5, characterized in that, The end of the insulating support assembly (17) near the first insulating edge portion (21) is spaced apart from the first insulating edge portion (21) to form a connecting potting space (17c) between the insulating support assembly (17) and the first insulating edge portion (21). A portion of the second insulating edge portion (22) fills the connecting potting space (17c). The connecting hole (17a) connects the potting area (23) and the connecting potting space (17c).

9. The laminated conductive assembly according to any one of claims 1 to 4, characterized in that, The plurality of conductive plates (11) include two end plates (11A) located at the ends in the first direction, and a middle plate (11B) located between the two end plates (11A) along the first direction. At least one of the end plates (11A) has an overlap joint (14) on its surface facing away from the middle plate (11B) along the first direction. The overlap joint (14) is spaced from the edge of the corresponding end plate (11A) along the second direction. The first direction and the second direction are perpendicular to each other. The stacked conductive component further includes a first pin (15) which extends along the second direction. One end of the first pin (15) along the second direction is connected to the corresponding lap joint (14). Except for the part of the first pin (15) connected to the lap joint (14), the remaining part of the first pin (15) is spaced from the corresponding end plate (11A).

10. The stacked conductive assembly according to claim 9, characterized in that, The first pin (15) includes a fixed end (151), a transition section (152) and a terminal (153) connected in sequence in the extension direction. The fixed end (151) is connected to the lap joint (14). The terminal (153) is located outside the edge of the corresponding end plate (11A) in the second direction. Compared with the fixed end (151) and the terminal (153), the transition section (152) protrudes in the first direction away from the end plate (11A).

11. The stacked conductive assembly according to any one of claims 1 to 4, characterized in that, The first insulating sealing part (21) includes a plurality of connecting parts (21A). Two connecting parts (21A) that are connected to each other are defined as the first connecting part (211) and the second connecting part (212). The first connecting part (211) and the second connecting part (212) are arranged sequentially along the outer periphery of the straight plate segment (101) corresponding to the conductive plate (11). The first connecting portion (211) has a first fitting wall (2111) and a protrusion (2112), wherein the first fitting wall (2111) protrudes in a direction close to the second connecting portion (212) to form the protrusion (2112). The second connecting portion (212) has a second fitting wall (2121) and a recess (2122) that matches the protrusion (2112), wherein the second fitting wall (2121) is recessed in a direction away from the first connecting portion (211) to form the recess (2122). The first fitting wall (2111) and the second fitting wall (2121) fit together, and the protrusion (2112) and the recess (2122) are inserted into each other.

12. The stacked conductive assembly according to claim 11, characterized in that, The protrusion (2112) has a plug-in end face (21121) and a plug-in side face (21122), and the recess (2122) has a concave bottom face (21221) and a concave side face (21222). The plug-in end face (21121) and the plug-in side face (21122), and the concave bottom face (21221) and the concave side face (21222) are respectively connected by arc transition surfaces (213). And / or, the insertion side (21122) is connected to the first mating wall (2111), and the concave side (21222) is connected to the second mating wall (2121) through the arc transition surface (213).

13. A method for manufacturing a stacked conductive component, characterized in that, The method for manufacturing a multilayer conductive assembly according to any one of claims 1 to 12, comprising: Insulating films (12) are respectively provided on both sides of each conductive plate (11) along the first direction. The first insulating sealing part (21) is disposed between the two insulating films (12) on both sides of the conductive plate (11) so that the first insulating sealing part (21) and the first sealing surface (1011) of the conductive plate (11) are attached. The conductive plate (11), the two insulating films (12) located on both sides of the conductive plate (11) along the first direction, and the corresponding first insulating sealing portion (21) are hot-pressed to form a conductive plate assembly; The conductive plate assembly is bent to form a straight plate segment (101) and a bent plate segment (102). Multiple conductive plate assemblies are stacked and connected along the first direction; Insulating potting compound is injected into the potting area (23) corresponding to the outer periphery of the bent plate segment (102) so that the insulating potting compound is connected to the first insulating edge sealing portion (21). After the insulating potting compound is cured, it forms at least a portion of the second insulating edge sealing portion (22).

14. The manufacturing method according to claim 13, characterized in that, The injection of insulating potting compound into the potting area (23) corresponding to the outer periphery of the bent plate segment (102) includes: The insulating potting compound is injected from the lower end of the potting area (23) along the direction of gravity, so that the insulating potting compound fills the potting area (23) from bottom to top; when injecting the insulating potting compound, the potting area (23) is evacuated, or the insulating potting compound is injected into the potting area (23) in a vacuum environment.

15. The manufacturing method according to claim 13, characterized in that, The manufacturing method further includes: Before the insulating film (12) is respectively disposed on both sides of each of the conductive plates (11) along the first direction, the insulating support assembly (17) is connected to the outer periphery of the predetermined bending area corresponding to the conductive plate (11); After the insulating film (12) is respectively disposed on both sides of the conductive plate (11) along the first direction, the insulating support assembly (17) is made to have its sidewalls facing away from each other along the first direction respectively attached to the insulating film (12) on the corresponding side. Before bending the conductive plate assembly, the support liner (001) is inserted into the potting area (23) of the insulating support assembly (17); When the conductive plate assembly is bent, the support liner (001) bends together with the conductive plate assembly.

16. The manufacturing method according to claim 15, characterized in that, Before inserting the support liner (001) into the potting area (23) of the insulating support assembly (17), the manufacturing method further includes: Insulating oil is applied to the location where the support liner (001) contacts the insulating support assembly (17).

17. The manufacturing method according to claim 15, characterized in that, The insulating support assembly (17) forms a connecting potting space (17c) between the first insulating sealing portion (21), and the insulating support assembly (17) has a connecting hole (17a) connecting the potting area (23) and the connecting potting space (17c). After inserting the support liner (001) into the potting region (23) and before bending the conductive plate assembly, the manufacturing method further includes: Insulating potting compound is injected into the connecting potting space (17c), and the insulating potting compound cures to form the first part of the second insulating sealing edge (22); After the plurality of the conductive plate assemblies are stacked and connected along the first direction, and before the insulating potting compound is injected into the potting area (23), the manufacturing method further includes: The support liner (001) is pulled out from the insulating support assembly (17); Insulating potting compound is injected into the potting area (23). After the insulating potting compound cures, it forms the second part of the second insulating edge sealing part (22). The second part of the second insulating edge sealing part (22) passes through the connecting hole (17a) and connects with the first part of the second insulating edge sealing part (22).

18. The manufacturing method according to claim 17, characterized in that, The manufacturing method further includes, prior to injecting insulating potting compound into the connection potting space (17c): A release agent is applied to the surface of the support liner (001) corresponding to the connecting potting space (17c).

19. The manufacturing method according to claim 13, characterized in that, The step of stacking and connecting multiple conductive plate assemblies along the first direction includes: The two insulating films (12) between two adjacent conductive plates (11) are bonded together.

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