Stacked element and capacitor

Abstract

The application provides a laminated element and a capacitor. The laminated element comprises spacer films and substrates which are alternately laminated; each substrate is connected with a tab on the side edge; the tab comprises a root and an extension; the root is an integral molded part with the substrate; the root is plate-shaped, and the edge is connected with the edge of the substrate and is arranged in parallel with the substrate; the extension is strip-shaped, one end of the extension is connected with one side of the root, and the other end is at least partially distributed to the direction of the tab of the adjacent substrate to be electrically connected with the tab of the adjacent substrate; a receiving groove is arranged on the root, and the extension enters the receiving groove to be connected with the root; the groove bottom of the receiving groove exposes the core material of the root. Therefore, the laminated element can improve the specific capacity of the capacitor.

Description

Technical Field

[0001] This application relates to the field of capacitors, specifically to a stacked element and a capacitor. Background Technology

[0002] With the development of intelligent industries, new requirements have been placed on capacitors. For example, AI servers need to accommodate as many processors as possible within a limited space. If the processors are too sparsely distributed, it will cause difficulties in information transmission between them. Therefore, the components surrounding the processors also need to be highly compact; otherwise, they will encroach on the installation space, forcing the processors to be placed far away. Existing capacitors are insufficient for such applications requiring high space utilization. Therefore, it is necessary to improve the specific capacitance of capacitors to adapt them to applications with high space utilization requirements. Summary of the Invention

[0003] The purpose of this application is to improve the specific capacitance of capacitors.

[0004] To address the aforementioned problems, in a first aspect, this application provides a stacked element comprising alternately stacked spacer films and substrates; each substrate has a tab connected to its side; each tab includes a root and an extension; the root and the substrate are integrally formed; the root is plate-shaped, with its edge connected to the edge of the substrate and arranged parallel to the substrate; the extension is strip-shaped, with one end connected to one side of the root, and the other end at least partially distributed in the direction of the tab of an adjacent substrate, so as to be electrically connected to the tab of the adjacent substrate; a receiving groove is provided on the root, and the extension enters the receiving groove to connect with the root; the bottom of the receiving groove exposes the core material of the root.

[0005] Optionally, the extension is bent in the direction of the tab on the adjacent substrate, so as to overlap with the tab on the adjacent substrate.

[0006] Optionally, the extension is also plate-shaped; the extension is twisted about an axis parallel to its own length direction to be distributed in the direction of the tabs of the adjacent substrate.

[0007] Optionally, the tab further includes a bump connected to one end of the extension away from the root, and protruding from the extension toward the tab of the adjacent substrate.

[0008] Optionally, at least a portion of the bumps on the substrate are flush with each other on the side opposite to the tab, and the flushing direction is along the length direction of the extension; the flush bumps are bonded and / or welded together to form a receiving surface.

[0009] Optionally, the stacked element further includes a lead-out foil strip, one end of which is connected to the receiving surface, and the other end of which is used to connect to the lead-out terminal of the capacitor.

[0010] Optionally, the bump abuts against the root.

[0011] Optionally, the root protrudes from the edge of the substrate by a height greater than or equal to 2 mm and less than or equal to 20 mm.

[0012] Optionally, the orthogonal projection of the spacer membrane onto the root is at least partially within the root.

[0013] Secondly, this application also provides a capacitor comprising the aforementioned stacked elements.

[0014] To electrically connect each substrate, tabs need to be connected. However, there is a spacer between the substrates, which creates a distance between adjacent substrates. If the tabs are directly pressed together along the lamination direction and then connected, the tabs need to have a large extension length from the side of the substrate along the tangent direction of the substrate surface. If this length is small, the tabs need to be tilted at a large angle towards adjacent tabs during the pressing process to make contact and establish an electrical connection. This would excessively compress the spacer, causing it to thin or crack, which could lead to capacitor breakdown and damage. However, long tabs would also occupy a lot of space, resulting in a smaller specific capacitance of the capacitor. In the technical solution of this application, the tabs are distributed towards adjacent tabs. This way, even if the tabs are short, they can make contact with adjacent tabs with less tilting, thus completing the electrical connection without the space-consuming nature of excessively long tabs, thereby increasing the specific capacitance of the capacitor. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0016] Figure 1 A stereoscopic structural diagram of a first embodiment of the stacked elements provided in this application; Figure 2 A schematic diagram of the frontal view structure of the first embodiment of the stacked elements provided in this application; Figure 3 A stereoscopic structural diagram of a second embodiment of the stacked elements provided in this application; Figure 4A top-view structural diagram of the third embodiment of the stacked elements provided in this application; Figure 5 The third embodiment of the stacked elements provided in this application is in Figure 4 Schematic diagram of the cross-sectional structure in the AA direction; Figure 6 The fourth embodiment of the stacked elements provided in this application is in Figure 4 Schematic diagram of the cross-sectional structure in the AA direction; Figure 7 The fifth embodiment of the stacked elements provided in this application is in Figure 4 Schematic diagram of the cross-sectional structure in the AA direction; Figure 8 The sixth embodiment of the stacked elements provided in this application Figure 4 Schematic diagram of the cross-sectional structure in the AA direction; Figure 9 The seventh embodiment of the stacked elements provided in this application is in Figure 4 Schematic diagram of the cross-sectional structure in the AA direction; Figure 10 A top-view structural diagram of the eighth embodiment of the stacked elements provided in this application; Figure 11 A schematic diagram of the tab structure of the third embodiment of the stacked elements provided in this application; Figure 12 This is an exploded structural diagram of a first embodiment of the capacitor provided in this application. Figure 13 A top-view structural diagram of a second embodiment of the capacitor provided in this application; Figure 14 The second embodiment of the capacitor provided in this application is in Figure 13 Schematic diagram of the cross-sectional structure in the middle BB direction; Figure 15 The second embodiment of the capacitor provided in this application is in Figure 14 A magnified structural diagram of section C.

[0017] The reference numerals in the attached figures are as follows: Capacitor 102; Stacked elements 10; Substrate 11; Anode substrate 111; Cathode substrate 112; 12 septum membranes; Tab 13; Anode tab 131; Cathode tab 132; Root 133; Receiving groove 1331; Extension 134; Protrusion 135; Receiving surface 136; Oxide film 1371; Core material 1372; Shaft X4; Lead-out foil 14; anode lead-out foil 141; cathode lead-out foil 142; 15 pieces of adhesive tape were used to fix the tape. 20. Sealing cap; 21. Support layer; 22. Inner film layer; 23. Outer film layer; 24. Anode lead-out terminal; 25. Cathode lead-out terminal; 26. Injection molded part; 30; housing space 31; opening 32; Elastic element 40. Detailed Implementation

[0018] The following will refer to the appendices in this application. Figure 1 To be continued Figure 12 The technical solutions in this application are clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] The technical solution of this application is applicable to electrolytic capacitors, such as aluminum electrolytic capacitors. Among them, aluminum electrolytic capacitors, due to their self-healing, high specific capacitance, aging resistance, and high cost performance, can be widely used in precision electronic equipment such as AI servers.

[0021] In the context of multilayer capacitors, "multilayer" is a concept relative to "winding" in wound capacitors. Specifically, it refers to the shape of the capacitor's core (or core). Wound capacitors have a coiled core, with the cathode and anode foils wound into a cylindrical shape; typically, only one cathode and anode foil are used. In contrast, multilayer capacitors have a cathode substrate (in sheet form) and an anode substrate stacked together, usually with multiple cathode and anode substrates. It should be noted that in this application, "multilayer" is used to describe the shape of the capacitor's core and does not limit the type of capacitor; the capacitor can be solid, semi-solid, or liquid, etc.

[0022] Among them, multilayer capacitors are favored by technicians in the field of precision electronic equipment due to their smaller ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance).

[0023] However, the specific capacitance (capacitance per unit volume) of multilayer capacitors needs further improvement. In traditional multilayer capacitors, the lead foil is directly nailed or soldered to the substrate surface. When the substrates are stacked, the lead foil occupies the space between adjacent substrates (the space along the normal direction of the substrate surface), preventing the substrates from being stacked tightly. This results in a reduction in the number of substrates that can be stacked in the same space, thus reducing the capacitance and causing a decrease in specific capacitance.

[0024] To solve the above problems, please refer to Figure 1 , Figure 2 and Figure 3 In one aspect, this application provides a stacked element 10, including alternately stacked spacer films 12 and substrates 11; each substrate has a tab 13 connected to its side; please refer to the reference. Figure 4 and Figure 5 The electrode tab includes a root portion 133 and an extension portion 134; the root portion and the substrate are integrally formed; the root portion is plate-shaped, and its edge is connected to the edge of the substrate and is arranged parallel to the substrate; the extension portion is strip-shaped, one end of the extension portion is connected to one side of the root portion, and the other end is at least partially distributed in the direction of the electrode tab of the adjacent substrate, so as to electrically connect with the electrode tab of the adjacent substrate; please refer to the reference. Figure 11 A receiving groove 1331 is provided on the root, and the extension enters the receiving groove to connect with the root; the bottom of the receiving groove exposes the core material of the root.

[0025] The substrate consists of an anode substrate and a cathode substrate. The substrate can be made by electrochemically etching a high-purity aluminum substrate to form numerous micron-sized tunnels and a honeycomb porous structure on the surface. Then, an anodic oxidation is performed on the etched aluminum foil surface to form an extremely thin and dense aluminum oxide insulating film. The anode substrate, spacer film, and cathode substrate are alternately stacked and combined with electrolyte or conductive polymer to form the core energy storage structure of the aluminum electrolytic capacitor.

[0026] A capacitor cell is the smallest unit in a capacitor that can produce capacitance. A single capacitor cell is formed by stacking a cathode substrate and an anode substrate (with sufficient spacing between them to prevent short circuits). In use, the anode substrate is connected to the anode of the external circuit, and the cathode substrate is connected to the cathode of the external circuit. When there is a potential difference between the anode and cathode, charge can be stored between the anode and cathode substrates, forming a capacitor.

[0027] visible Figure 1 and Figure 2 The image shown represents a single capacitor cell. Stacking individual capacitor cells together forms a stacked element. Please refer to [reference needed]. Figure 3 That is, to adopt Figure 1 and Figure 2The stacked elements are formed by stacking individual capacitor cells in the capacitor.

[0028] Please refer to Figure 2 A spacer membrane, typically electrolytic paper, is placed between the cathode substrate and the anode substrate. This spacer membrane can absorb the electrolyte. In this case, the cathode substrate guides the distribution of the electric field. The actual capacitor is formed between the anode substrate and the electrolyte. That is, the dielectric of the capacitor is the oxide layer on the surface of the anode substrate. Positive charges accumulate on the side of the oxide layer closer to the core material of the anode substrate, and negative charges accumulate on the side closer to the electrolyte.

[0029] A tab is a component that connects to a substrate and is used to connect the substrate to an external circuit. Therefore, a cathode substrate has a cathode tab, and an anode substrate has an anode tab. The cathode tabs of different cathode substrates are connected to each other, thereby electrically connecting the cathode substrates to each other; the anode tabs of different anode substrates are connected to each other, thereby electrically connecting the anode substrates to each other.

[0030] Please refer to Figure 2 In this application, the substrate refers to the cathode substrate 112 and the anode substrate 111, and the tab refers to the cathode tab 132 and the anode tab 131. The extension of each tab is electrically connected to the extension of the adjacent tab, meaning that the extensions of the cathode tabs are electrically connected to each other, and the extensions of the anode tabs are electrically connected to each other. However, the extensions of the cathode tabs and the extensions of the anode tabs are not connected; that is, the anode substrate and the cathode substrate cannot be electrically connected, otherwise a short circuit would occur.

[0031] Therefore, the fact that at least one end of the extension is distributed in the direction of the tab on the adjacent substrate for electrical connection with the tab on the adjacent substrate also refers to the relationship between tabs of the same polarity. Taking a cathode tab as an example, the extension of the cathode tab is distributed in the direction of the cathode tab on the adjacent cathode substrate. In this application, unless otherwise specified, descriptions of the relationship between tabs, the relationship between substrates, and the relationship between a tab and a substrate refer to the relationship between components of the same polarity (anode or cathode). Furthermore, for ease of expression, Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 The examples all use the cathode as an example; the anode can be set up similarly.

[0032] The substrate is a plate-shaped component, with its sides being its edges. Connecting tabs to the sides of the substrate means that the tabs are not connected to the surface of the substrate, but rather to the side of the substrate. The connection can be achieved through soldering or bonding (using conductive adhesive), etc. Since the tabs do not penetrate the surface of the substrate, they do not occupy space between the substrates.

[0033] "The extension is distributed in the direction of the tabs on the adjacent substrate" means that the extension of the tabs connected to one substrate extends at least partially from the plane of that substrate to the plane of the adjacent substrate. For an example, please refer to... Figure 5 and Figure 6 , Figure 5 The diagram shows two cathode substrates, each connected to a cathode tab. The cathode tabs have extensions connected to protrusions 135 that extend tangentially to the surface of the cathode substrates, i.e., in the negative y-axis direction. Figure 6 In the example shown, the extension is bent so that it extends along the tangential direction of the cathode substrate surface, and in both examples, adjacent extensions are connected.

[0034] As can be seen, the distribution of the extension towards the tabs of the adjacent substrate includes two possible scenarios: one is that the extension itself is distributed towards the tabs of the adjacent substrate, and the other is that the extension is connected to other components (such as the protrusions mentioned above) which are distributed towards the tabs of the adjacent substrate.

[0035] Of course, the extension can extend in the direction of the adjacent tab as follows: Figure 5 As shown, it can extend only to the adjacent tab on one side, or it can extend to both tabs on both sides.

[0036] It is evident that for electrodes that are simply strip-shaped and not distributed in the direction of adjacent electrodes, in order for the electrodes to come into contact with each other, the electrodes need to be bent at a large angle so that the ends of the electrodes away from the substrate can approach and contact each other, thus connecting the various electrodes.

[0037] Thus, the end of a simple strip-shaped tab near the substrate will compress the spacer membrane, causing it to crack. Therefore, the tabs must be made very long to reduce the bending angle required for them to come into close contact with each other, thus preventing the tabs from crushing the spacer membrane. However, the substrate is what generates capacitance; the tabs generate virtually no capacitance. The large space occupied by the tabs leads to a decrease in the specific capacitance (capacitance generated per unit volume).

[0038] In the technical solution of this application, since the tabs are distributed in the direction of the tabs on the adjacent substrate, even if the tabs are short, the end of the tab closest to the substrate can remain unbent or be bent at a small angle, so that the tabs will not break the spacer membrane and will not occupy too much space.

[0039] In one example, please refer to Figure 4 and Figure 5 It can be seen that in Figure 5 In this embodiment, the root 133 and the extension 134 of the tab are both distributed along the y-axis direction and do not bend towards the x-axis direction, which is an embodiment that does not compress the septum membrane at all.

[0040] It is evident that the technical solution of this application allows the tab to occupy less space without compressing the spacer, thereby increasing the specific capacitance of the capacitor.

[0041] The substrate and the root are integrally molded parts. That is, when the substrate is manufactured using processes such as shearing or punching, a portion of the structure protruding from the edge of the substrate is retained as a tab. Since the substrate is plate-shaped and the root is also plate-shaped, there is no need to form the root a second time, and the edge of the root naturally connects with the edge of the substrate.

[0042] "One end of the extension connects to one side of the root" means that the extension connects to the side of the root. For an example, please refer to [reference needed]. Figure 5 It can be seen that the extension is connected to the side of the root. It should be noted that "one end of the extension" is interpreted in a broad sense here, that is, the part of the extension whose orthogonal projection onto the root is inside the root is one end of the extension; while the part of the extension whose orthogonal projection onto the root is outside the root is the other end of the extension.

[0043] It is evident that the tab is divided into at least two parts: the root and the extension. The root is integrally formed with the substrate, which is equivalent to having a protrusion on the substrate for connecting the extension. This way, the extension does not need to be connected to the substrate surface, thus not affecting the stacking thickness between substrates. If the extension were connected to the substrate surface, it can be understood that in the stacking direction (for...), Figure 5 The thickness shown in the embodiment (i.e., in the x-axis direction) varies at different positions along the tangent direction of the substrate; that is, the thickness is greater at the position where the extension is provided and less at the position where the extension is not provided.

[0044] This is equivalent to the extension encroaching on the substrate's mounting space, which will reduce the capacitor's specific capacitance.

[0045] In the embodiments of this application, since the extension can be connected to the root without entering between the substrates to connect with the substrate surface, the thickness in the stacking direction can be consistent at different positions, thereby not encroaching on the substrate's installation space and improving the specific capacitance of the capacitor.

[0046] Furthermore, the extension is distributed in the direction of the tabs of the adjacent substrate. Since the extension does not have to be integrally formed with the substrate, the shape of the extension is easier to configure (if it is integrally formed with the substrate, only a plate shape is easier to configure). This simplifies the manufacturing process of the stacked elements.

[0047] Looking further, a receiving groove is also provided at the root. This groove allows for a tight connection between the extension and the root, as the bottom of the groove exposes the core material of the substrate. For an example, please refer to... Figure 11As can be seen, since the root and the substrate are integrally formed, an oxide film 1371, which serves as a dielectric, will be formed on the surface of the root. The core material 1372 of the substrate refers to the material covered under the oxide layer.

[0048] The oxide film has insulating properties; direct connection would result in high contact resistance. Exposing the core material via the receiving groove allows the extension to connect directly to the core, significantly reducing contact resistance. This provides a basis for connecting the extension to the side of the root; otherwise, the extension might need to connect to the side of the root, where the oxide film might not be covering the root. However, even with a side connection avoiding the oxide film, the small contact area makes it difficult to achieve low contact resistance. Furthermore, the small contact area makes connection extremely difficult; traditional nailing is almost impossible, and welding rarely produces high-quality welds.

[0049] Therefore, the design of the receiving slot allows the stacked elements to have a high specific capacitance while having a low equivalent resistance.

[0050] Please refer to Figure 6 Optionally, the extension is bent, and the bending direction is towards the tab of the adjacent substrate, so as to overlap with the tab of the adjacent substrate.

[0051] Bending the connection is different from pulling the tab away from the substrate to force it to bend. Because pulling forces the tab to bend, the bending location is uncontrollable. Obviously, the entire tab, or even part of the substrate, will bend under the pulling action.

[0052] The bending and overlapping of the extensions actually allows the root to bend less or not at all compared to a forced bending method. Essentially, the extensions take on most of the bending task, thus reducing the degree of bending required at the root.

[0053] In one example, please refer to Figure 6 It can be seen that the extension is bent on the side away from the substrate, so that the rest of the extension is not bent, thereby avoiding pressure on the spacer membrane.

[0054] It is evident that the simple structure of bending the extension achieves the effect of avoiding pressure on the spacer membrane, which helps to reduce the manufacturing cost of the stacked elements.

[0055] It should be noted that conductive adhesive can be applied to the overlapping positions of the extensions, or the parts can be welded together to provide a stable electrical connection.

[0056] It should be noted that there are multiple ways to bend the wire. For an example, please refer to [link / reference needed]. Figure 6 and Figure 7 As you can see, the bending angles are different, but all achieve overlap; for another example, please refer to... Figure 8 and Figure 9 ,visible Figure 8 The middle extension is coiled and bent. Figure 9 The middle extension bends repeatedly, and all of them are overlapped.

[0057] Please refer to Figure 7 Optionally, the extension is also plate-shaped; the extension is twisted about an axis parallel to its own length direction to be distributed in the direction of the tabs of the adjacent substrate.

[0058] The axis of torsion around which the extension rests has its length direction along the tangent direction of the substrate, and it is positioned along the direction in which the tab protrudes from the substrate. For one example, please refer to... Figure 10 , Figure 10 The torsional axes of the two extensions in the figure are marked with X4.

[0059] It should be noted that, in other embodiments, the torsion axis is not limited to being located at the middle position of the extension (i.e., Figure 10 (As shown in the figure), the torsion axis can be set at the edge of the extension or even outside the extension.

[0060] The extensions twist towards each other and are distributed in the direction of the tabs on adjacent substrates, so that they can approach each other and overlap. The overlap can be formed by bonding with conductive adhesive or by welding, thereby forming a conductive connection. It should be noted that in embodiments where the twisted extensions can cause the root to twist, but because the extensions are close to each other, the twist angle of the tabs relative to the substrate does not need to increase with the increase of the number of substrate layers.

[0061] As can be seen, the twisting of the extension can keep the pressure of the tab on the spacer within a limited range, preventing the spacer from being broken. This also ensures that it does not occupy too much space on the substrate, thus guaranteeing a larger specific capacitance. At the same time, the twisting process is relatively simple, which can reduce the production cost of the capacitor.

[0062] Please refer to Figure 5 Optionally, the tab also includes a bump that is connected to the end of the extension away from the root and protrudes from the extension toward the tab of the adjacent substrate.

[0063] A bump is a block-shaped component. It can be integrally molded with the extension, or it can be molded separately and then connected to the extension by welding or bonding. Bumps offer high overall integrity, and connecting adjacent tabs with bumps improves the overall connection strength.

[0064] Furthermore, it should be noted that for a single polarity of a stacked element, only a portion of the tab's extension may be distributed in the direction of the tab on the adjacent substrate. This is because having only a portion of the tabs satisfying this requirement may be sufficient to ensure that there is no point in the entire stacked element that exerts significant pressure on the spacer membrane. Alternatively, all the tab extensions may be distributed in the direction of the tab on the adjacent substrate.

[0065] Please refer to Figure 13 , Figure 14 and Figure 15 Optionally, at least some of the substrate bumps are flush with each other on the side opposite to the tab, and the flushing direction is along the length direction of the extension; the flush bumps are bonded and / or welded together to form a receiving surface 136.

[0066] The flush direction, along the length of the extension, refers to the direction along which the extension extends beyond the substrate, and this direction is also along the tangent direction of the substrate surface. Flush means that the sides of the different bumps facing away from the tabs are on a plane perpendicular to the flush direction. For an example, please refer to... Figure 15 In this embodiment, the flush direction is the x-axis direction in the figure. It can be seen that the side of the bump facing away from the substrate is on the same plane, and this plane is perpendicular to the x-axis. Therefore, this plane... Figure 15 The cross-section shown is presented as a straight line parallel to the y-axis (that is, the bearing surface is a straight line parallel to the y-axis).

[0067] The receiving surface is the flat surface of the bump facing away from the tab. The formation of the receiving surface also means that multiple bumps are connected to each other as a whole. This allows the bumps to be connected to form a solid receiving platform. When pressure is applied to the platform, the platform can distribute the pressure relatively evenly to different substrates, thereby avoiding local deformation when under stress.

[0068] The force that the bonding surface can withstand may come from multiple sources. In one possible example, it could come from the lead-out terminal. For a clearer illustration of this possibility, please refer to [reference needed]. Figure 12 , Figure 12 A capacitor is provided as an embodiment of this application.

[0069] Figure 12 The image exemplifies the components that a capacitor may include, wherein an opening 32 is provided on the housing 30, through which stacked elements can be inserted into the housing. Please refer to the reference. Figure 14The stacked elements are visible within the containment space 31 formed inside the outer casing. A sealing cap 20 is used to seal the opening on the outer casing, thus closing it. The sealing cap includes an anode lead-out terminal 24, a cathode lead-out terminal 25, and a support layer 21. The support layer forms the body of the sealing cap. Both the anode and cathode lead-out terminals pass through the support layer, with one end located within the containment space electrically connected to the stacked elements, and the other end located outside the containment space electrically connected to the outside environment, thereby connecting the stacked elements to an external circuit.

[0070] The leads (anode leads or cathode leads) can abut against the receiving surface to compress the stacked elements and ensure that the stacked elements do not move within the housing. Therefore, the receiving surface can withstand the pressure from the leads.

[0071] In yet another example, please refer to Figure 12 It can be seen that the stacked element can also be provided with an elastic element 40. The elastic element can simultaneously abut against the sealing cap and the stacked element to press the stacked element into the shell and prevent the stacked element from shaking. The elastic element can also abut against the receiving surface.

[0072] In another example, please refer to Figure 12 The anode lead-out terminal can be connected to the anode of the stacked element through the anode lead-out foil 141, and the cathode lead-out terminal can be connected to the cathode of the stacked element through the cathode lead-out foil 142. The receiving surface can also receive the anode lead-out foil and the cathode lead-out foil.

[0073] It is evident that the design of the bearing surface allows the stacked elements to better withstand external forces and avoid deformation.

[0074] Please refer to Figure 12 and Figure 15 Optionally, the stacked element also includes a lead-out foil 14, one end of which is connected to the receiving surface, and the other end of which is used to connect to the lead-out terminal of the capacitor.

[0075] Lead-out foils refer to anode lead-out foils and cathode lead-out foils, while lead-out terminals refer to anode lead-out terminals and cathode lead-out terminals. It should be noted that the connection of one end of the lead-out foil to the receiving surface and the other end to the lead-out terminal means that the anode lead-out foil is connected to the corresponding receiving surface of the anode substrate and to the anode lead-out terminal, and the cathode lead-out foil is connected to the corresponding receiving surface of the cathode substrate and to the cathode lead-out terminal.

[0076] Since the receiving surface is formed by multiple protrusions, it has a large surface area. Connecting the lead-out foil strip to the receiving surface helps to increase the contact area, thereby reducing the contact resistance.

[0077] Please refer to Figure 5 Optional, the bump abuts against the root.

[0078] Since the bump protrudes from the extension towards the tab of the adjacent substrate, and the direction of the adjacent tab is also the thickness direction of the substrate, it can be seen that the size of the bump in the thickness direction of the substrate is larger than that of the substrate, and is generally larger than the size of the extension in the thickness direction of the substrate.

[0079] Meanwhile, the bump is also located at the end of the extension that is far from the root. Therefore, the contact between the bump and the root makes the distance between the bump and the substrate as small as possible. This can prevent the root of the electrode from bending due to the weight of the bump, and can also reduce the space occupied by the bump outside the substrate, thereby increasing the specific capacitance of the capacitor.

[0080] Please refer to Figure 2 Optionally, the root protrudes from the edge of the substrate by a height greater than or equal to 2 mm and less than or equal to 20 mm.

[0081] Figure 2 Taking the root of the anode tab as an example, T9 is used to indicate the height at which the root protrudes from the substrate.

[0082] The direction in which the root protrudes from the edge of the substrate can be along the tangent direction of the substrate surface, or it can be perpendicular to the extension direction of the side of the substrate where the root is located. The extension direction of the side of the substrate where the root is located refers to the tangent direction at the point where the side of the substrate connects to the root. When the tangent direction is difficult to determine, the extension direction can be determined by the line connecting the two points at the point where the root connects to the substrate, where the maximum size of the root is determined. In some embodiments, the substrate is rectangular, and the extension direction is the conventional extension direction of the side of the substrate where the root is located (e.g., Figure 2 As shown, the substrate is rectangular.

[0083] The root is the component that connects to the extension. If the root protrusion is too small, the contact area between the root and the extension will be too small, and the contact resistance will be relatively large. If the root protrusion is too large, it will occupy too much space outside the substrate, making it difficult to improve the specific capacitance. When the root protrusion is greater than or equal to 2mm and less than or equal to 20mm, it can have a sufficient contact area with the extension without occupying too much space, thus ensuring that the specific capacitance is improved.

[0084] Please refer to Figure 2 and 5 Optionally, the orthogonal projection of the septum onto the root is at least partially within the root.

[0085] exist Figure 5 In the example shown, the orthographic projection of the septum onto the root is the projection along the x-direction. It can be seen that the orthographic projection of the septum onto the root is partially within the root, meaning the septum and the root at least partially overlap. It should be noted that the projection relationship refers to the relationship between the septum and the adjacent root.

[0086] The proposed technical solution allows the tabs to operate with minimal pressure on the spacer, enabling the spacer to partially overlap with the tabs. Otherwise, the spacer might need to be flush with the edge of the substrate, and at most adjacent to the portion of the tab protruding from the substrate. The spacer prevents contact between the cathode and anode substrates, thus avoiding short circuits. Therefore, extending the spacer beyond the substrate along the surface normal on the side with the root, so that it is at least partially projected into the root, improves capacitor reliability.

[0087] Please refer to Figure 12 Secondly, this application also provides a capacitor 102, comprising the aforementioned stacked elements.

[0088] Figure 12 The text also exemplarily illustrates other elements that a capacitor may include, wherein the fixing tape 15 is used to wrap around the outside of the stacked elements to prevent the multiple substrates and spacer film from spreading out. Of course, in other embodiments, the stacked elements may be fixed solely by the housing.

[0089] Figure 12 In the illustrated embodiment, the sealing cap further includes an inner film layer 22, an outer film layer 23, and an injection molded part 26. The inner film layer is used to insulate the anode of the capacitor, the outer film layer is used to insulate the external circuit of the capacitor, and the injection molded part is used to separate the anode lead-out terminal and the support layer. In some embodiments, the support layer can be made of a conductor and electrically connected to the cathode lead-out terminal. The injection molded part can prevent short circuits.

[0090] It should be noted that the stacked elements and capacitors in the embodiments of this application are different subjects under the same inventive concept. Features not described in detail in each embodiment can be referred to in the description of other embodiments. Under the premise of no conflict, the embodiments can be combined arbitrarily, and the combined solution is also within the protection scope of the embodiments of this application.

[0091] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. The term "connection" in this application generally refers to a direct connection between two components or an indirect connection achieved through other components. In the various figures, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the figures are not drawn to scale. Additionally, some related parts may not be shown in the figures.

[0092] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0093] It is understood that those skilled in the art can combine various implementation methods in the above embodiments under the guidance of the above examples to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0094] The stacked elements and capacitors provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A stacked element, characterized in that, Includes spacer films and substrates that are alternately stacked; Each of the substrates has a tab connected to its side; The tab includes a root and an extension; the root and the substrate are integrally formed; the root is plate-shaped and its edge is connected to the edge of the substrate and is arranged parallel to the substrate; the extension is strip-shaped, one end of the extension is connected to one side of the root, and the other end extends in the direction of the tab of the adjacent substrate, and extends to overlap with the tab of the adjacent substrate of the same polarity, and electrical connection is achieved through the overlap. A receiving groove is provided on the root, and part of the core material is exposed at the bottom of the receiving groove. One end of the extension extends into the receiving groove and is welded to the core material exposed at the bottom of the receiving groove.

2. The stacked element according to claim 1, characterized in that, The extension is bent and the bending direction is toward the direction of the tab of the adjacent substrate, so as to overlap with the tab of the adjacent substrate.

3. The stacked element according to claim 1, characterized in that, The extension is also plate-shaped; the extension is twisted about an axis parallel to its own length direction to be distributed in the direction of the tabs of the adjacent substrate.

4. The stacked element according to claim 1, characterized in that, The tab also includes a bump that is connected to one end of the extension away from the root and protrudes from the extension toward the tab of the adjacent substrate.

5. The stacked element according to claim 4, characterized in that, At least a portion of the bumps on the substrate are flush with each other on the side opposite to the tab, and the flushing direction is along the length direction of the extension; the flush bumps are bonded and / or welded together to form a receiving surface.

6. The stacked element according to claim 5, characterized in that, The stacked element also includes a lead-out foil strip, one end of which is connected to the receiving surface, and the other end of which is used to connect to the lead-out terminal of the capacitor.

7. The stacked element according to claim 4, characterized in that, The protrusion abuts against the root.

8. The stacked element according to claim 1, characterized in that, The root protrudes from the edge of the substrate by a height greater than or equal to 2 mm and less than or equal to 20 mm.

9. The stacked element according to claim 1, characterized in that, The orthogonal projection of the spacer membrane onto the root is at least partially within the root.

10. A capacitor, characterized in that, Including the stacked elements as described in any one of claims 1-9.

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