A through-hole capacitor

Abstract

The application provides a through-hole capacitor, which comprises a first main electrode, a second main electrode, a ground bus, two first Y capacitor cores and two second Y capacitor cores; the first main electrode and the second main electrode are both arranged through the ground bus, and the first Y capacitor core and the second Y capacitor core are both arc-shaped or arc-like; the two first Y capacitor cores enclose a first accommodating space for the first main electrode to pass through, and one end of the two first Y capacitor cores is electrically connected to the ground bus through a gold-plated surface, and the other end is electrically connected to the first main electrode through a gold-plated surface; the two second Y capacitor cores enclose a second accommodating space for the second main electrode to pass through, and one end of the two second Y capacitor cores is electrically connected to the ground bus through a gold-plated surface, and the other end is electrically connected to the second main electrode through a gold-plated surface. The through-hole capacitor can effectively reduce the inductance of a filter circuit, improve the high-frequency filtering performance, reduce the filter stage number and save the volume and cost.

Description

Technical Field

[0001] This invention relates to the field of capacitor technology, and more specifically to a feedthrough capacitor. Background Technology

[0002] Power electronic devices (such as IGBTs) generate high-frequency common-mode noise during high-speed switching. This noise needs to be suppressed or eliminated by filtering circuits; otherwise, it will interfere with the normal operation of other circuits. Feedthrough capacitors are the core components of filtering circuits. Ideally, a feedthrough capacitor, due to its low capacitive reactance in high-frequency environments, can conduct current to ground, thereby bypassing noise signals. However, in practical applications, feedthrough capacitors and their connecting circuits inevitably contain inductance. This inductance causes the circuit to exhibit inductive characteristics above the resonant frequency, significantly weakening the overall filtering performance of the filter. Therefore, reducing the overall inductance of the feedthrough capacitor and its connecting circuits is crucial for effectively suppressing and eliminating high-frequency interference signals.

[0003] Feedthrough capacitors, as key components for suppressing common-mode noise, are connected between the positive and negative terminals of the circuit and ground, effectively suppressing common-mode interference. To maintain the low impedance characteristics of feedthrough capacitors at higher frequencies, the inductance of the entire connection loop needs to be minimized. Currently, conventional filter designs often use leaded feedthrough capacitors (see Appendix). Figure 1 This method results in an excessively long current path from the positive and negative terminals of the circuit to the ground, directly leading to excessive loop inductance and a subsequent decrease in filter performance. To meet the filtering requirements, it was necessary to add multiple stages of filtering structure, which not only increased the overall size of the filter but also raised production and application costs. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the aforementioned technologies. Therefore, the object of the present invention is to provide a feedthrough capacitor that can effectively reduce the inductance of the filter circuit, improve high-frequency filtering performance, reduce the number of filter stages, and save on size and cost.

[0005] To achieve the above objectives, the present invention proposes a feedthrough capacitor, which includes a first main electrode, a second main electrode, a grounding busbar, two first Y capacitor cores and two second Y capacitor cores; Both the first main electrode and the second main electrode are disposed on the grounding busbar. The first Y capacitor core and the second Y capacitor core are both arc-shaped or near-arc-shaped. The two first Y capacitor cores enclose a first accommodating space for the first main electrode to pass through. One end of the gold-plated surface of the two first Y capacitor cores is electrically connected to the grounding busbar, and the other end of the gold-plated surface is electrically connected to the first main electrode. The two second Y capacitor cores enclose a second accommodating space for the second main electrode to pass through. One end of the gold-plated surface of the two second Y capacitor cores is electrically connected to the grounding busbar, and the other end of the gold-plated surface is electrically connected to the second main electrode.

[0006] According to the present invention, a feedthrough capacitor employs an arc-shaped or near-arc-shaped first Y-capacitor core and a second Y-capacitor core structure. Two first Y-capacitor cores form a group that tightly surrounds a first main electrode, forming a first accommodating space for the first main electrode to pass through. Two second Y-capacitor cores form a group that tightly surrounds a second main electrode, forming a second accommodating space for the second main electrode to pass through. This allows the Y-capacitor cores and their corresponding main electrodes to be closely enclosed. The two main electrodes are connected to a grounding busbar, and the gold-plated surfaces of each group of cores are electrically connected to the grounding busbar and the corresponding surrounded main electrode, constituting the core's core-enclosed electrode structure design.

[0007] In addition, the feedthrough capacitor proposed in the above embodiments of the present invention may also have the following additional technical features: Optionally, the grounding busbar is provided with a first through hole for the first main electrode to pass through, a second through hole for the second main electrode to pass through, a first connecting part for connecting the gold-plated surface of the first Y capacitor core, and a second connecting part for connecting the gold-plated surface of the second Y capacitor core. The first connecting part and the second connecting part are located on the periphery of the first through hole and the second through hole respectively.

[0008] Furthermore, both the first connecting portion and the second connecting portion are hollowed out, with the first connecting portion connected to the first through hole and the second connecting portion connected to the second through hole.

[0009] Optionally, it also includes a first adapter busbar and a second adapter busbar, wherein the first main electrode is electrically connected to the gold-plated surface of the first Y capacitor core through the first adapter busbar, and the second main electrode is electrically connected to the gold-plated surface of the second Y capacitor core through the second adapter busbar.

[0010] Furthermore, the first main electrode and the second main electrode are provided with a first connection hole and a second connection hole in a one-to-one correspondence, and the first adapter busbar and the second adapter busbar are provided with a third connection hole and a fourth connection hole in a one-to-one correspondence, wherein the third connection hole is provided in correspondence with the first connection hole, and the second connection hole is provided in correspondence with the fourth connection hole.

[0011] Furthermore, the first adapter busbar includes a third connecting portion and a fourth connecting portion connecting the third connecting portion. The third connecting hole is disposed on the third connecting portion, the third connecting portion is clamped to the first main electrode, and the fourth connecting portion is used to connect to the gold-plated surface of the first Y capacitor core. The second adapter busbar includes a fifth connecting portion and a sixth connecting portion connecting the fifth connecting portion. The fourth connecting hole is disposed on the fifth connecting portion, the fifth connecting portion is clamped to the second main electrode, and the sixth connecting portion is used to connect to the gold-plated surface of the second Y capacitor core. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of an existing filter capacitor; Figure 2 This is a schematic diagram of the structure of a feedthrough capacitor according to an embodiment of the present invention; Figure 3 for Figure 2 Partial structural diagram; Figure 4 for Figure 2 Partial structural diagram; Figure 5 A comparison of the simulated ground inductance values ​​of existing filter capacitors and the feedthrough capacitors in this embodiment; Explanation of reference numerals in the attached figures: First main electrode 1, first connecting hole 11, second main electrode 2, second connecting hole 21, grounding busbar 3, first through hole 31, second through hole 32, first connecting part 33, second connecting part 34, first Y capacitor core 4, second Y capacitor core 5, first adapter busbar 6, third connecting hole 61, third connecting part 62, fourth connecting part 63, second adapter busbar 7, fourth connecting hole 71, fifth connecting part 72, sixth connecting part 73. Detailed Implementation

[0013] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0014] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the invention to those skilled in the art.

[0015] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0016] The following is for reference. Figures 1-5 The implementation of the feedthrough capacitor proposed in the embodiments of the present invention will be described in detail.

[0017] According to an embodiment of the present invention, a feedthrough capacitor includes: a first main electrode 1, a second main electrode 2, a ground busbar 3, two first Y capacitor cores 4 and two second Y capacitor cores 5; The first main electrode 1 and the second main electrode 2 are both installed through the grounding busbar 3. The first Y capacitor core 4 and the second Y capacitor core 5 are both arc-shaped or quasi-arc-shaped. The two first Y capacitor cores 4 enclose a first receiving space for the first main electrode 1 to pass through. One end of the gold-plated surface of the two first Y capacitor cores 4 is electrically connected to the grounding busbar 3, and the other end of the gold-plated surface is electrically connected to the first main electrode 1. The two second Y capacitor cores 5 enclose a second receiving space for the second main electrode 2 to pass through. One end of the gold-plated surface of the two second Y capacitor cores 5 is electrically connected to the grounding busbar 3, and the other end of the gold-plated surface is electrically connected to the second main electrode 2.

[0018] In other words, the feedthrough capacitor includes a first main electrode 1, a second main electrode 2, a grounding busbar 3, two first Y-capacitor cores 4, and two second Y-capacitor cores 5. The first main electrode 1 and the second main electrode 2 are spaced apart from each other on the grounding busbar 3, with an insulation distance between them and the grounding busbar 3 to avoid short circuits. The first Y-capacitor cores 4 and the second Y-capacitor cores 5 are both arc-shaped or near-arc-shaped structures, which can closely surround the outer periphery of the corresponding main electrode. The two first Y-capacitor cores 4 symmetrically enclose to form a first accommodating space for the first main electrode 1 to pass through, and the two second Y-capacitor cores 5 symmetrically enclose to form a second accommodating space for the second main electrode 2 to pass through. Insulation distances are maintained between the first Y-capacitor core 4 and the first main electrode 1, and between the second Y-capacitor core 5 and the second main electrode 2. Both sides of the Y capacitor core are provided with gold-plated surfaces. One end of the gold-plated surface of the two first Y capacitor cores 4 is electrically connected to the grounding busbar 3, and the other end of the gold-plated surface is electrically connected to the first main electrode 1. One end of the gold-plated surface of the two second Y capacitor cores 5 is electrically connected to the grounding busbar 3, and the other end of the gold-plated surface is electrically connected to the second main electrode 2.

[0019] In this design, one of the first main electrode 1 and the second main electrode 2 is a positive electrode, and the other is a negative electrode; they can have the same structure. The first Y capacitor core 4 and the second Y capacitor core 5 can have the same structure. Both the first Y capacitor core 4 and the second Y capacitor core 5 are made by winding a metallized film, and the substrate of the metallized film is an existing material such as PET or BOPP. During the manufacturing process, the first Y capacitor core 4 and the second Y capacitor core 5 can be made into a cylindrical shape first, and then shaped into an arc or near-arc irregular shape using special tooling. The Y capacitor cores and the grounding busbar 3, as well as the corresponding main electrodes, can all be connected using existing processes such as welding or bonding with conductive adhesive.

[0020] Therefore, this feedthrough capacitor employs an arc-shaped or near-arc-shaped first Y-capacitor core 4 and a second Y-capacitor core 5 structure. Two first Y-capacitor cores 4 form a group that tightly surrounds the first main electrode 1, creating a first accommodating space for the first main electrode 1 to pass through. Similarly, two second Y-capacitor cores 5 form a group that tightly surrounds the second main electrode 2, creating a second accommodating space for the second main electrode 2 to pass through. This allows the Y-capacitor cores to achieve a close and enclosed arrangement with their corresponding main electrodes. The two main electrodes are connected to the grounding busbar 3, and the gold-plated surfaces of each group of cores are electrically connected to the grounding busbar 3 and the corresponding surrounded main electrode, constituting the core structure design that tightly encloses the electrode.

[0021] Optionally, the grounding busbar 3 is provided with a first through hole 31 for the first main electrode 1 to pass through, a second through hole 32 for the second main electrode 2 to pass through, a first connecting part 33 for connecting the gold-plated surface of the first Y capacitor core 4, and a second connecting part 34 for connecting the gold-plated surface of the second Y capacitor core 5. The first connecting part 33 and the second connecting part 34 are located on the periphery of the first through hole 31 and the second through hole 32 respectively. Understandably, this structural design allows each functional area of ​​the grounding busbar 3 to achieve precise positional matching with the first main electrode 1, the second main electrode 2, and the Y capacitor core. The first through hole 31 allows the first main electrode 1 to pass through, and the second through hole 32 allows the second main electrode 2 to pass through. The first connecting part 33 and the second connecting part 34 on the periphery provide stable electrical connection points for the first Y capacitor core 4 and the second Y capacitor core 5, respectively. This allows the connection end of the Y capacitor core and the grounding busbar 3 to be closer to the main electrode, significantly shortening the current transmission path from the core to the grounding busbar 3. At the same time, it ensures the assembly and positioning accuracy of each component and avoids the problem of increased inductance caused by connection misalignment.

[0022] Furthermore, both the first connecting portion 33 and the second connecting portion 34 are hollowed out. The first connecting portion 33 communicates with the first through hole 31, and the second connecting portion 34 communicates with the second through hole 32. Understandably, the hollowed-out first connecting portion 33 communicating with the first through hole 31 and the second connecting portion 34 communicating with the second through hole 32 facilitates integral stamping with the corresponding through hole, improving the processing efficiency and structural integrity of the grounding busbar 3. This design, while ensuring the conductivity and structural strength of the grounding busbar 3, reduces the use of metal materials, achieving product lightweighting. Simultaneously, by integrating the first connecting portion 33, the second connecting portion 34, and the corresponding through hole into an integrated structural layout, the connection position of the Y capacitor core and the grounding busbar 3 is closer to the main electrode, further shortening the current transmission path and reserving reasonable space for core installation, thus optimizing the overall assembly compactness.

[0023] Optionally, the system also includes a first adapter busbar 6 and a second adapter busbar 7. The first main electrode 1 is electrically connected to the gold-plated surface of the first Y capacitor core 4 via the first adapter busbar 6, and the second main electrode 2 is electrically connected to the gold-plated surface of the second Y capacitor core 5 via the second adapter busbar 7. Understandably, the first adapter busbar 6 and the second adapter busbar 7 serve as transitional connection components between the first main electrode 1, the second main electrode 2, and the corresponding Y capacitor cores. This effectively solves the problem of directly connecting the arc-shaped gold-plated surface of the Y capacitor core to the straight main electrode, adapting to their different structural forms, increasing the electrical contact area, improving the stability and efficiency of current transmission, and making the connection between the first main electrode 1 and the first Y capacitor core 4, and the second main electrode 2 and the second Y capacitor core 5, more flexible, reducing the difficulty of assembly operations, and facilitating mass production.

[0024] Furthermore, the first main electrode 1 and the second main electrode 2 are provided with a first connecting hole 11 and a second connecting hole 21 corresponding to each other, and the first adapter busbar 6 and the second adapter busbar 7 are provided with a third connecting hole 61 and a fourth connecting hole 71 corresponding to each other. The third connecting hole 61 is provided in correspondence with the first connecting hole 11, and the second connecting hole 21 is provided in correspondence with the fourth connecting hole 71. Understandably, the one-to-one correspondence of each connection hole enables precise and detachable connection between the first main electrode 1 and the first adapter busbar 6, and between the second main electrode 2 and the second adapter busbar 7. By using fasteners with matching first connection holes 11 and 61, and second connection holes 21 and 71, the first adapter busbar 6 and the second adapter busbar 7 can be quickly fixed to the first main electrode 1 and the second main electrode 2 respectively. This effectively avoids relative displacement between components during assembly, ensuring the stability of the electrical connection between the first main electrode 1 and the first adapter busbar 6, and between the second main electrode 2 and the second adapter busbar 7. At the same time, the standardized connection hole layout makes the overall assembly process more standardized and facilitates the subsequent disassembly, maintenance, and individual replacement of each component, further improving the practical usability of the entire feedthrough capacitor.

[0025] Furthermore, the first adapter busbar 6 includes a third connecting portion 62 and a fourth connecting portion 63 connecting the third connecting portion 62. A third connecting hole 61 is provided on the third connecting portion 62. The third connecting portion 62 is clamped to the first main electrode 1. The fourth connecting portion 63 is used to connect to the gold-plated surface of the first Y capacitor core 4. The second adapter busbar 7 includes a fifth connecting portion 72 and a sixth connecting portion 73 connecting the fifth connecting portion 72. A fourth connecting hole 71 is provided on the fifth connecting portion 72. The fifth connecting portion 72 is clamped to the second main electrode 2. The sixth connecting portion 73 is used to connect to the gold-plated surface of the second Y capacitor core 5. Understandably, the third connecting part 62 is connected to the first main electrode 1 by a clamping method, which increases the contact area with the first main electrode 1. The fifth connecting part 72 is connected to the second main electrode 2 by a clamping method, which increases the contact area with the second main electrode 2, ensuring smooth current transmission between the main electrode and the adapter busbar. The fourth connecting part 63 and the sixth connecting part 73 are respectively adapted to the gold-plated surfaces of the first Y capacitor core 4 and the second Y capacitor core 5, achieving a tight connection with the core, balancing the strength of the connection and the adaptability of the structure. Among them, the fourth connecting part 63 and the sixth connecting part 73 can both be E-shaped; the cross-sections of the first main electrode 1 and the second main electrode 2 can both be rectangular, and the third connecting part 62 and the fifth connecting part 72 can be U-shaped and clamped at one end of the main electrode that protrudes from the receiving space.

[0026] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0031] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A feedthrough capacitor, characterized in that, include: The first main electrode, the second main electrode, the grounding busbar, two first Y capacitor cores and two second Y capacitor cores; Both the first main electrode and the second main electrode are disposed on the grounding busbar. The first Y capacitor core and the second Y capacitor core are both arc-shaped or near-arc-shaped. The two first Y capacitor cores enclose a first accommodating space for the first main electrode to pass through. One end of the gold-plated surface of the two first Y capacitor cores is electrically connected to the grounding busbar, and the other end of the gold-plated surface is electrically connected to the first main electrode. The two second Y capacitor cores enclose a second accommodating space for the second main electrode to pass through. One end of the gold-plated surface of the two second Y capacitor cores is electrically connected to the grounding busbar, and the other end of the gold-plated surface is electrically connected to the second main electrode.

2. The feedthrough capacitor as described in claim 1, characterized in that, The grounding busbar is provided with a first through hole for the first main electrode to pass through, a second through hole for the second main electrode to pass through, a first connecting part for connecting the gold-plated surface of the first Y capacitor core, and a second connecting part for connecting the gold-plated surface of the second Y capacitor core. The first connecting part and the second connecting part are located on the periphery of the first through hole and the second through hole respectively.

3. The feedthrough capacitor as described in claim 2, characterized in that, Both the first connecting part and the second connecting part are hollowed out. The first connecting part is connected to the first through hole, and the second connecting part is connected to the second through hole.

4. The feedthrough capacitor as described in claim 1, characterized in that, It also includes a first adapter busbar and a second adapter busbar, wherein the first main electrode is electrically connected to the gold-plated surface of the first Y capacitor core through the first adapter busbar, and the second main electrode is electrically connected to the gold-plated surface of the second Y capacitor core through the second adapter busbar.

5. The feedthrough capacitor as described in claim 4, characterized in that, The first main electrode and the second main electrode are provided with a first connection hole and a second connection hole in a one-to-one correspondence. The first adapter busbar and the second adapter busbar are provided with a third connection hole and a fourth connection hole in a one-to-one correspondence. The third connection hole is provided in correspondence with the first connection hole, and the second connection hole is provided in correspondence with the fourth connection hole.

6. The feedthrough capacitor as described in claim 5, characterized in that, The first adapter busbar includes a third connecting portion and a fourth connecting portion connecting the third connecting portion. The third connecting hole is provided on the third connecting portion. The third connecting portion is clamped to the first main electrode. The fourth connecting portion is used to connect to the gold-plated surface of the first Y capacitor core. The second adapter busbar includes a fifth connecting portion and a sixth connecting portion connecting the fifth connecting portion. The fourth connecting hole is provided on the fifth connecting portion. The fifth connecting portion is clamped to the second main electrode. The sixth connecting portion is used to connect to the gold-plated surface of the second Y capacitor core.

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