Key structure and method of manufacturing the same

Abstract

The application provides a key structure, which comprises a substrate, a first touch pad, insulating liquid, a movable part and a second touch pad. The substrate is provided with a cavity, and the cavity has a first volume. The first touch pad is arranged on the substrate and is spaced apart from the cavity. The insulating liquid is arranged in the cavity, and the insulating liquid has a second volume, wherein the second volume is smaller than the first volume, so that a gap is formed between the liquid surface of the insulating liquid and the wall surface of part of the cavity, and the gap is used for accommodating air. The movable part comprises a pushing part and a force receiving part connected with the pushing part. The pushing part is movably arranged in the cavity, and the force receiving part is located outside the substrate. The force receiving part is used for receiving external force and driving the pushing part to move. The second touch pad is arranged on the force receiving part and corresponds to the first touch pad. In addition, the application also provides a manufacturing method of the key structure.

Description

Technical Field

[0001] This application relates to the field of buttons, and more particularly to a button structure and its manufacturing method. Background Technology

[0002] Typically, button structures use metal springs as elastic conductive elements. Pressing the metal spring causes elastic deformation, thus enabling the circuit to be connected. However, the elastic deformation of the metal spring is prone to plastic deformation during long-term use, leading to a decrease in elastic performance. This, in turn, affects the stability and reliability of the conduction, shortening the effective lifespan of the button module. Summary of the Invention

[0003] In view of this, this application proposes a button structure and its manufacturing method to solve the above problems.

[0004] A button structure includes a substrate, a first contact pad, a movable member, and a second contact pad. A cavity is formed within the substrate, the cavity having a first volume. The first contact pad is disposed on the substrate, spaced apart from the cavity. An insulating liquid is disposed within the cavity, the insulating liquid having a second volume smaller than the first volume, such that a gap is formed between the liquid surface of the insulating liquid and a portion of the cavity wall, the gap being for accommodating air. The movable member includes a pushing part and a force-receiving part connected to the pushing part. The pushing part is movably disposed within the cavity, the force-receiving part is located outside the substrate, and the force-receiving part is used to receive external force and drive the pushing part to move in a predetermined direction. The second contact pad is disposed on the force-receiving part, and viewed along the predetermined direction, the second contact pad corresponds to the first contact pad. When the force-receiving part is pressed by an external force, the pushing part squeezes the insulating liquid along the predetermined direction, and the insulating liquid compresses the air in the gap. The second contact pad contacts the first contact pad and becomes conductive. When the force-receiving part is not pressed by an external force, the air in the gap expands and performs work. The pushing part pushes out of the force-receiving part in the opposite direction of the predetermined direction, and the second contact pad disconnects from the first contact pad.

[0005] A method for manufacturing a button structure includes the following steps:

[0006] A substrate is provided, wherein a cavity is disposed within the substrate, the cavity having a first volume, and a first contact pad is provided on one side of the substrate, the first contact pad being disposed at a distance from the cavity;

[0007] An insulating liquid is disposed within the cavity. The insulating liquid has a second volume, which is smaller than the first volume, such that a gap is formed between the liquid surface of the insulating liquid and a portion of the wall of the cavity, and the gap is used to accommodate air.

[0008] A movable component is provided in the cavity. The movable component includes a pushing part and a force-receiving part connected to the pushing part. The pushing part is movably disposed in the cavity. The force-receiving part is located outside the substrate. The force-receiving part is used to receive external force and drive the pushing part to move in a predetermined direction. The force-receiving part is provided with a second touch pad. When viewed from the predetermined direction, the second touch pad is provided corresponding to the first touch pad, thus obtaining the button structure.

[0009] When the force-receiving part is pressed by an external force, the pushing part squeezes the insulating liquid along the predetermined direction, the insulating liquid compresses the air in the gap, and the second contact pad contacts the first contact pad to conduct electricity;

[0010] When the force-receiving part is not pressed by an external force, the air in the gap expands and works, the pushing part pushes out of the force-receiving part in the opposite direction of the predetermined direction, and the second contact pad disconnects from the first contact pad.

[0011] The button structure provided in this application utilizes an insulating liquid with a volume smaller than the cavity volume within the substrate cavity to form an air gap. When the pressing part is pressed, the insulating liquid compresses the air to store energy, and when the external force is released, the air expands to perform work and reset. This achieves stable conduction and rebound through a non-metallic elastic mechanism, reducing the performance degradation caused by the plastic deformation of the metal spring and significantly improving the contact reliability and service life of the button. At the same time, the incompressible nature of the insulating liquid ensures that the pressure is efficiently transmitted to the air gap, and the buffering effect formed by the difference in gap volume can absorb mechanical vibration, further enhancing the anti-interference ability and touch accuracy. Attached Figure Description

[0012] Figure 1 This is a cross-sectional schematic diagram of a first circuit board provided in an embodiment of this application.

[0013] Figure 2 This is a cross-sectional schematic diagram of a second circuit board provided in an embodiment of this application.

[0014] Figure 3 For pressing Figure 1 The first circuit board shown and Figure 2 The second circuit board is shown in a cross-sectional schematic diagram of the substrate formed therefrom.

[0015] Figure 4 for Figure 3 The diagram shows a cross-sectional view of the insulating fluid disposed within the cavity of the substrate.

[0016] Figure 5 for Figure 4 The diagram shows a cross-sectional view of the cavity containing the pushing part.

[0017] Figure 6 for Figure 5The diagram shows a cross-sectional view of the push-press section, which includes a base plate and side plates.

[0018] Figure 7 for Figure 6 The diagram shows a cross-section of the base plate after the first buffer pad has been installed.

[0019] Figure 8 for Figure 7 The diagram shows a cross-sectional view of the substrate after the chip has been installed.

[0020] Figure 9 for Figure 8 The diagram shows a cross-section of the chip after the second buffer pad has been installed.

[0021] Figure 10 for Figure 9 The diagram shows a cross-sectional view of the button structure obtained after the top plate is installed on the side panel, before it is pressed.

[0022] Figure 11 for Figure 10 The diagram shows a cross-sectional view of the button structure after it has been pressed.

[0023] Explanation of main component symbols

[0024] Button structure 100

[0025] Substrate 10

[0026] Cavity 11

[0027] First touch pad 12

[0028] solder pad 13

[0029] First slot 111

[0030] Second slot 112

[0031] First through hole 113

[0032] Second through hole 114

[0033] First circuit board 20

[0034] First dielectric layer 21

[0035] First Line Layer 22

[0036] Second circuit board 30

[0037] Second dielectric layer 31

[0038] Second line layer 32

[0039] Adhesive layer 40

[0040] Insulating liquid 50

[0041] 60 active items

[0042] Pushing part 61

[0043] Fixed sleeve 611

[0044] Sealed piston 612

[0045] Link 613

[0046] Force-bearing part 62

[0047] Base plate 621

[0048] Opening 621a

[0049] Top plate 622

[0050] Side panel 623

[0051] Extension 624

[0052] Containment space 625

[0053] Second touch pad 63

[0054] Chip 70

[0055] Solder ball 71

[0056] First cushioning pad 72

[0057] Second cushioning pad 73

[0058] The following detailed description, in conjunction with the accompanying drawings, further illustrates the embodiments of this application. Detailed Implementation

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of this application pertain. The terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the embodiments of this application. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply.

[0060] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0061] It will be understood that when a layer is referred to as "on" another layer, it can be directly on that other layer or there may be an intermediate layer in between. Conversely, when a layer is referred to as "directly on" another layer, there is no intermediate layer. When a component is referred to as "attached to," "mounted to," "set on," or "connected to" another component, it can be directly on that other component or there may be an intervening component. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0062] Furthermore, the use of terms such as "first," "second," etc., in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] Embodiments of this application are described herein with reference to cross-sectional views, which are schematic diagrams of idealized embodiments (and intermediate configurations) of this application. Therefore, variations in the shapes illustrated due to manufacturing processes and / or tolerances are foreseeable. Consequently, embodiments of this application should not be construed as limited to the specific shapes of the areas illustrated herein, but should include, for example, deviations in shape due to manufacturing processes. The areas shown in the figures are merely illustrative, and their shapes are not intended to represent the actual shapes of the illustrated devices, nor are they intended to limit the scope of this application.

[0064] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0065] Please see Figures 1 to 11 One embodiment of this application provides a method for manufacturing a button structure 100, including the following steps:

[0066] S1: Please see Figure 3 A substrate 10 is provided, and a cavity 11 is provided inside the substrate 10. The cavity 11 has a first volume V1. A first contact pad 12 is provided on one side of the substrate 10, and the first contact pad 12 is spaced apart from the cavity 11.

[0067] Please see Figure 3, in this embodiment, the substrate 10 has a thickness direction A. When viewed along the thickness direction A, the cross section of the cavity 11 is substantially in a "hill" shape. The cavity 11 includes a first slot 111, a second slot 112, a first through hole 113 and a second through hole 114. The first slot 111 and the second slot 112 communicate with each other to form an inverted "T" shaped structure. The first slot 111 is located below the second slot 112, and the cross-sectional width of the first slot 111 is greater than the cross-sectional width of the second slot 112. One end of the first through hole 113 communicates with one end of the first slot 111, and the other end of the first through hole 113 is exposed on the substrate 10. The first through hole 113 and the second through hole 114 are arranged at intervals. One end of the second through hole 114 communicates with the other end of the first slot 111, and the other end of the second through hole 114 is exposed on the substrate 10. The cross-sectional width of the first through hole 113 and the cross-sectional width of the second through hole 114 are substantially the same, and both are smaller than the cross-sectional width of the second slot 112.

[0068] In this embodiment, the substrate 10 is formed by lamination and pressing. Specifically, in step S1, the manufacturing method of the substrate 10 includes:

[0069] S11: Please refer to Figure 1 , a first circuit substrate 20 is provided. The first circuit substrate 20 includes a first dielectric layer 21 and a first circuit layer 22 embedded in the first dielectric layer 21. The first circuit substrate 20 is provided with the first slot 111. The depth of the first slot 111 is smaller than the thickness of the first dielectric layer 21. The cross-sectional width of the first slot 111 along the thickness direction A of the first circuit substrate 20 is W1. The material of the first dielectric layer 21 includes one of polyimide, benzocyclobutene or polytetrafluoroethylene.

[0070] S12: Please refer to Figure 2A second circuit board 30 is provided. The second circuit board 30 includes a second dielectric layer 31 and a second circuit layer 32 embedded in the second dielectric layer 31. The second circuit board 30 is provided with a first through hole 113, a second through hole 114, and a first slot 111. The first through hole 113 and the second through hole 114 are spaced apart. Both the first through hole 113 and the second through hole 114 penetrate the second dielectric layer 31. The first slot 111 is located between the first through hole 113 and the second through hole 114. The depth of the first slot 111 is less than the thickness of the second dielectric layer 31. The distance between the first through hole 113 and the second through hole 114 is W2, and W1 = W2. The material of the second dielectric layer 31 is approximately the same as the material of the first dielectric layer 31.

[0071] In this embodiment, two first contact pads 12 and a plurality of solder pads 13 are embedded on one side of the second dielectric layer 31. The two first contact pads 12 are spaced apart. The plurality of solder pads 13 are arranged side by side and spaced apart between the two first contact pads. Along the thickness direction A of the second dielectric layer 31, the plurality of solder pads 13 are arranged corresponding to the first slot 111. One first contact pad 12 is located on the side of the first through hole 113 opposite to the second through hole 114. The other first contact pad 12 is located on the side of the second through hole 114 opposite to the first through hole 113.

[0072] S13: Please see Figure 3 The first circuit board 20 and the second circuit board 30 are aligned. The projection of the first circuit board 20 along the thickness direction A coincides with the second circuit board 30. The opening side of the first slot 111 corresponds to the opening side of the second slot 112, so that the first slot 111 and the second slot 112 are connected. The first through hole 113 is connected to one end of the first slot 111, and the second through hole 114 is connected to the other end of the second slot 112.

[0073] S14: Please see again Figure 3 The first circuit board 20 and the second circuit board 30 are connected to obtain the substrate 10. Specifically, an adhesive layer 40 is provided between the first circuit board 20 and the second circuit board 30. The adhesive layer 40 has a second through hole 114 corresponding to the first through hole 113. Thus, the first slot 111, the second slot 112, and the two first through holes 113 form the cavity 11.

[0074] S2: Please see Figure 4An insulating liquid 50 is disposed within the cavity 11. The insulating liquid 50 has a second volume V2, which is smaller than the first volume V1, such that a gap S is formed between the liquid surface of the insulating liquid 50 and a portion of the wall surface of the cavity 11. This gap S is used to accommodate air. Specifically, when the thickness direction A of the substrate 10 is parallel to the vertical direction, the bottom of the second groove 112 is not filled with the insulating liquid 50, thereby forming the gap S.

[0075] In this embodiment, the insulating liquid 50 is used to improve the dielectric properties of the substrate 10 and enhance its heat dissipation capacity. The insulating liquid 50 includes at least one of mineral insulating oil, synthetic insulating oil, and vegetable oil. Specifically, the mineral insulating oil includes one of naphthenic oil and paraffinic oil. The synthetic insulating oil includes one of alkylbenzene, silicone oil, and ester oil. The vegetable oil includes one of rapeseed oil, soybean oil, and palm oil.

[0076] S3: Please see Figure 10 A movable member 60 is provided in the cavity 11. The movable member 60 includes a pushing part 61 and a force-receiving part 62 connected to the pushing part 61, thereby obtaining the button structure 100. The pushing part 61 is movably disposed in the cavity 11, and the force-receiving part 62 is located outside the substrate 10. The force-receiving part 62 is used to receive external force and drive the pushing part 61 to move along a predetermined direction Y. The force-receiving part 62 is provided with a second touch pad 63. When viewed along the predetermined direction Y, the second touch pad 63 is provided corresponding to the first touch pad 12, thereby obtaining the button structure 100.

[0077] When the force-receiving part 62 is pressed by an external force, the pushing part 61 squeezes the insulating liquid 50 along the predetermined direction Y. The insulating liquid 50 compresses the air in the gap S to store energy, and the second contact pad 63 contacts the first contact pad 12 to conduct electricity.

[0078] When the force-receiving part 62 is not pressed by an external force, the air in the gap S expands and does work, and the pushing part 61 pushes out of the force-receiving part 62 in the opposite direction of the predetermined direction Y, and the second contact pad 63 is disconnected from the first contact pad 12.

[0079] In this embodiment, the pushing part 61 is generally a piston structure, and the force-receiving part 62 is generally a box-shaped structure. The step "providing the movable part 60 in the cavity 11" includes:

[0080] S31: Please see Figure 5A pushing part 61 is provided in the cavity 11. The pushing part 61 includes a fixing sleeve 611, a sealing piston 612, and a connecting rod 613. The fixing sleeve 611 is fixed to the first through hole 113. The sealing piston 612 is movably disposed within the fixing sleeve 611, and one end of the connecting rod 613 is connected to the side of the piston away from the cavity 11. Specifically, the fixing sleeve 611 is fixed to the first through hole 113 by adhesive. The sealing piston 612 and the fixing sleeve 611 are sealed together.

[0081] In this embodiment, the step of "providing a pushing part 61 in the cavity 11" specifically includes:

[0082] S311: The fixing sleeves 611 are respectively provided in the first through hole 113 and the second through hole 114. The adhesive seals the gaps between the fixing sleeves 611 and the through holes (first through hole 113, second through hole 114). Thus, the insulating liquid 50 will not flow out from the gaps between the fixing sleeves 611 and the through holes.

[0083] S312: The sealing pistons 612 are respectively disposed within the two fixed sleeves 611. The sealing pistons 612 are movably disposed along the predetermined direction Y. One side of the two sealing pistons 612 faces the insulating liquid 50 to push the insulating liquid 50 to move, to compress the air in the gap S, or the sealing pistons 612 are displaced to adapt to changes in air pressure in the gap S.

[0084] S313: Connecting rods 613 are respectively provided on the side of the two sealing pistons 612 away from the insulating liquid 50.

[0085] S32: Please refer to Figure 10 A force-receiving part 62 is provided on the pushing part 61. The force-receiving part 62 is generally box-shaped and includes a bottom plate 621, a top plate 622, and a plurality of side plates 623. The bottom plate 621 and the top plate 622 are spaced apart, and the side plates 623 are connected between the bottom plate 621 and the top plate 622 to form a receiving space 624. The other end of the connecting rod 613 is located on the side of the bottom plate 621 opposite to the receiving space 624, and the second contact pad 63 is located on the side of the bottom plate 621 opposite to the receiving space 624. When the force-receiving part 62 is not pressed by an external force, there is a first distance S1 between the second contact pad 63 and the first contact pad 12.

[0086] In this embodiment, the button structure 100 further includes a chip 70 and a plurality of solder balls 71. The step "providing a force-receiving part 62 on the pushing part 61" includes:

[0087] S321: Please refer to Figure 6 A base plate 621 is provided at the other end of the connecting rod 613. The base plate 621 has an extension 624 facing the connecting rod, and the extension 624 is connected to the other end of the connecting rod 613 by conductive adhesive. The base plate 621 has a through opening 621a. When viewed along the predetermined direction Y, the opening 621a corresponds to a plurality of solder pads 13. A plurality of side plates 623 are provided around the periphery of the base plate 621. The plurality of side plates 623 extend away from the substrate 10 along the predetermined direction Y. The base plate 621 and the plurality of side plates 623 surround and form a receiving space 625.

[0088] S322: Please refer to Figure 7 A first buffer pad 72 is provided on the side of the base plate 621 facing the receiving space 625. The first buffer pad 72 has perforations corresponding to the opening 621a. The first buffer pad 72 is used to buffer the impact force between the chip 70 and the base plate 621. The material of the first buffer pad 72 includes one of silicone rubber, nitrile rubber, polyurethane foam, and thermoplastic polyurethane.

[0089] S232: Please see Figure 8 The chip 70 is disposed within the receiving space 625, and the chip 70 is positioned on the first buffer pad 72. The chip 70 is connected to a plurality of solder pads 13 via a plurality of solder balls 71. That is, the plurality of solder balls 71 pass through the opening 621a. A third distance S3, which is 100 micrometers to 200 micrometers, is maintained between the side plate 623 and the chip, thereby reducing frictional damage between the chip and the side plate 623.

[0090] S323: Please refer to Figure 9 A second buffer pad 73 is disposed on the side of the chip 70 opposite to the first buffer pad 72. The second buffer pad 73 is made of the same material as the first buffer pad 72.

[0091] S324: Please refer to Figure 10 A top plate 622 is provided on the side of the plurality of side plates 623 opposite to the bottom plate 621. The top plate 622 connects the plurality of side plates 623 with conductive adhesive and encloses the receiving space 625. That is, the bottom plate 621, the top plate 622, and the plurality of side plates 623 surround and form the receiving space 625. The second buffer pad 73 is used to buffer the impact force between the chip 70 and the top plate 622. When the force-bearing part 62 is not pressed by external force, there is a second distance S2 between the top plate 622 and the second buffer pad 73, and the second distance S2 is not less than the first distance S1.

[0092] The manufacturing method of the button structure 100 provided in this application has the following advantages:

[0093] (i) By setting an insulating liquid 50 with a volume smaller than that of the cavity 11 in the substrate 10 cavity 11 and forming an air gap S, the insulating liquid 50 stores energy when the push part 61 is pressed and the air expands to do work and reset when the external force is released, thereby achieving stable conduction and rebound through a non-metallic elastic mechanism, reducing the performance degradation problem caused by the plastic deformation of the metal spring sheet, and significantly improving the contact reliability and service life of the button.

[0094] (ii) The chip 70 is integrated within the housing space 625 of the movable part 60 and is vertically interconnected with the solder pads 13 of the substrate 10 through solder balls 71 to achieve a three-dimensional stacked layout, reducing the lateral space occupation; the integrated motion design of the movable part 60 and the chip 70 simplifies the assembly tolerance chain and improves structural stability; the opening of the base plate 621 matches the solder balls 71 to avoid mechanical interference and ensure the accuracy of the pressing stroke; the enclosed housing of the chip 70 reduces the risk of environmental dust pollution and enhances long-term reliability.

[0095] (III) The insulating liquid 50 has both dielectric and high thermal conductivity properties. Through internal circulation, it accelerates the diffusion of heat from the chip 70 to the cavity 11 wall. When under pressure, the insulating liquid 50 dynamically fills the gaps in the cavity 11, uniformly transmits pressure and suppresses arc discharge. The incompressibility of the liquid enables rapid force feedback, while the gas-liquid coupling buffers impact vibration. The insulating liquid 50 seals and isolates the solder joints from moisture erosion, extending the life of the button's electrical contact.

[0096] Please see Figure 10 This application also provides a button structure 100, including a substrate 10, a first contact pad 12, an insulating liquid 50, a movable member 60, and a second contact pad 63. A cavity 11 is disposed within the substrate 10, and the cavity 11 has a first volume V1. The first contact pad 12 is disposed on the substrate 10, and the first contact pad 12 is spaced apart from the cavity 11. The insulating liquid 50 is disposed within the cavity 11, and the insulating liquid 50 has a second volume V2, which is smaller than the first volume V1, such that a gap S is formed between the liquid surface of the insulating liquid 50 and a portion of the wall surface of the cavity 11, the gap S being used to accommodate air. The movable member 60 includes a pushing part 61 and a force-receiving part 62 connected to the pushing part 61. The pushing part 61 is movably disposed within the cavity 11, and the force-receiving part 62 is located outside the substrate 10. The force-receiving part 62 is used to receive external force and drive the pushing part 61 to move along a predetermined direction Y. The second touch pad 63 is disposed on the force-receiving portion 62. Viewed along the predetermined direction Y, the second touch pad 63 corresponds to the first touch pad 12. See also... Figure 11When the force-receiving part 62 is pressed by an external force, the pushing part 61 squeezes the insulating liquid 50 along the predetermined direction Y. The insulating liquid 50 compresses the air in the gap S, and the second contact pad 63 contacts the first contact pad 12 to conduct electricity. Please refer to [link to relevant documentation]. Figure 10 When the force-receiving part 62 is not pressed by an external force, the air in the gap S expands and works, the pushing part 61 pushes out of the force-receiving part 62 in the opposite direction of the predetermined direction Y, and the second touch pad 63 disconnects from the first touch pad 12.

[0097] Please see Figure 9 and Figure 10 In this embodiment, the force-receiving part 62 includes a bottom plate 621, a top plate 622, and a plurality of side plates 623. The bottom plate 621 and the top plate 622 are spaced apart. The side plates 623 are connected between the bottom plate 621 and the top plate 622 to form a receiving space 625. The pushing part 61 is located on the side of the bottom plate 621 away from the receiving space 625. The second touch pad 63 is located on the side of the bottom plate 621 away from the receiving space 625. When the force-receiving part 62 is not pressed by an external force, there is a first distance between the second touch pad 63 and the first touch pad 12.

[0098] In this embodiment, the button structure 100 further includes a chip 70, a plurality of solder balls 71, and a plurality of solder pads 13. The solder pads 13 are disposed on the side of the substrate 10 facing the bottom plate 621. The solder balls 71 are connected between the chip 70 and the solder pads 13. The bottom plate 621 is provided with a first opening that communicates with the receiving space 625. The chip 70 is received in the receiving space 625. The solder balls 71 pass through the first opening. When the force-receiving part 62 is not pressed by external force, there is a second distance between the chip 70 and the top plate 622. The first distance is not greater than the second distance.

[0099] In this embodiment, the pushing part 61 includes a fixed sleeve 611, a sealing piston 612, and a connecting rod 613. The cavity 11 includes through holes (a first through hole 113 and a second through hole 114), and the fixed sleeve 611 is fixed to the through holes. The sealing piston 612 is movably disposed within the fixed sleeve 611, and one end of the connecting rod 613 is connected to the side of the piston away from the cavity 11, and the other end is connected to the base plate 621.

[0100] The above description describes some specific embodiments of this application, but in actual applications, the application should not be limited to these embodiments. For those skilled in the art, other modifications and alterations made based on the technical concept of this application should fall within the protection scope of this application.

Claims

1. A button structure, characterized in that, include: A substrate, wherein a cavity is disposed within the substrate, the cavity having a first volume; A first contact pad is disposed on the substrate and spaced apart from the cavity; An insulating liquid is disposed within the cavity. The insulating liquid has a second volume, which is smaller than the first volume, such that a gap is formed between the liquid surface of the insulating liquid and a portion of the wall of the cavity, the gap being used to accommodate air. The movable component includes a pushing part and a force-receiving part connected to the pushing part. The pushing part is movably disposed in the cavity, and the force-receiving part is located outside the substrate. The force-receiving part is used to receive external force and drive the pushing part to move in a predetermined direction. The second contact pad is disposed on the force-receiving part, and when viewed along the predetermined direction, the second contact pad is disposed corresponding to the first contact pad; When the force-receiving part is pressed by an external force, the pushing part squeezes the insulating liquid along the predetermined direction. The insulating liquid compresses the air in the gap, and the second contact pad contacts the first contact pad to achieve conductivity. When the force-receiving part is not pressed by an external force, the air in the gap expands and works, the pushing part pushes out of the force-receiving part in the opposite direction of the predetermined direction, and the second contact pad disconnects from the first contact pad.

2. The button structure as described in claim 1, characterized in that, The force-bearing part includes a bottom plate, a top plate, and multiple side plates. The bottom plate and the top plate are spaced apart. The side plates are connected between the bottom plate and the top plate to form a receiving space. The pushing part is located on the side of the bottom plate away from the receiving space. The second touch pad is located on the side of the bottom plate away from the receiving space. When the force-bearing part is not pressed by an external force, there is a first distance between the second touch pad and the first touch pad.

3. The button structure as described in claim 2, characterized in that, The button structure also includes a chip, multiple solder balls, and multiple solder pads. The solder pads are disposed on the side of the substrate facing the bottom plate. The solder balls connect the chip and the solder pads. The bottom plate has a first opening that communicates with the receiving space. The chip is received in the receiving space. The solder balls pass through the first opening. When the force-receiving part is not pressed by external force, there is a second distance between the chip and the top plate. The first distance is not greater than the second distance.

4. The button structure as described in claim 3, characterized in that, The force-bearing part further includes a first buffer pad and a second buffer pad. The first buffer pad is disposed on the side of the top plate facing the receiving space, and the second buffer pad is disposed corresponding to the first buffer pad. Both the first buffer pad and the second buffer pad are used to buffer the contact between the chip and the force-bearing part.

5. The button structure as described in claim 3, characterized in that, The pressing part includes a fixed sleeve, a sealing piston, and a connecting rod. The base plate is provided with a second opening, which communicates with the cavity. The fixed sleeve is fixed to the second opening. The sealing piston is movably disposed in the fixed sleeve. One end of the connecting rod is connected to the side of the piston away from the cavity, and the other end is connected to the base plate.

6. The button structure as described in claim 1, characterized in that, The cavity includes a first slot, a second slot, a first through hole, and a second through hole. The first slot and the second slot are interconnected. One end of the first through hole is connected to one end of the first slot, and the other end of the first through hole is exposed on the substrate. One end of the second through hole is connected to the other end of the first slot, and the other end of the second through hole is exposed on the substrate.

7. A method for manufacturing a button structure, characterized in that, Including the following steps: A substrate is provided, wherein a cavity is disposed within the substrate, the cavity having a first volume, and a first contact pad is provided on one side of the substrate, the first contact pad being disposed at a distance from the cavity; An insulating liquid is disposed within the cavity. The insulating liquid has a second volume, which is smaller than the first volume, such that a gap is formed between the liquid surface of the insulating liquid and a portion of the wall of the cavity, and the gap is used to accommodate air. A movable component is provided in the cavity. The movable component includes a pushing part and a force-receiving part connected to the pushing part. The pushing part is movably disposed in the cavity. The force-receiving part is located outside the substrate. The force-receiving part is used to receive external force and drive the pushing part to move in a predetermined direction. The force-receiving part is provided with a second touch pad. When viewed from the predetermined direction, the second touch pad is provided corresponding to the first touch pad, thus obtaining the button structure. When the force-receiving part is pressed by an external force, the pushing part squeezes the insulating liquid along the predetermined direction. The insulating liquid compresses the air in the gap, and the second contact pad contacts the first contact pad to achieve conductivity. When the force-receiving part is not pressed by an external force, the air in the gap expands and works, the pushing part pushes out of the force-receiving part in the opposite direction of the predetermined direction, and the second contact pad disconnects from the first contact pad.

8. The manufacturing method of the button structure as described in claim 7, characterized in that, The method for manufacturing the substrate includes the following steps: A first circuit board is provided, the first circuit board having a first slot; A second circuit board is disposed on one side of the first circuit board. The second circuit board is provided with a second slot and a through hole. The second slot and the through hole are spaced apart. The second window is connected to the first slot. The through hole is connected to the first slot to form the cavity, thereby obtaining the board.

9. The manufacturing method of the button structure as described in claim 8, characterized in that, The step of "installing a movable component in the cavity" includes: A pushing part is provided in the through hole. The pushing part includes a fixed sleeve, a sealing piston and a connecting rod. The base plate is provided with a second opening. The second opening communicates with the cavity. The fixed sleeve is fixed in the second opening. The sealing piston is movably disposed in the fixed sleeve. One end of the connecting rod is connected to the side of the piston away from the cavity. A pressure-bearing part is provided at the other end of the connecting rod. The pressure-bearing part includes a bottom plate, a top plate, and a plurality of side plates. The bottom plate and the top plate are spaced apart, and the side plates are connected between the bottom plate and the top plate to form a receiving space.

10. The method for manufacturing the button structure as described in claim 9, characterized in that, The button structure also includes a chip, multiple solder balls, and multiple solder pads. The solder pads are disposed on the side of the substrate facing the base plate, and the solder balls connect the chip and the solder pads. The step "providing a pressure-bearing part at the other end of the connecting rod" includes: The other end of the connecting rod is connected to a base plate, and the base plate has a first opening through which the welding ball passes; Multiple side plates are provided around the periphery of the base plate; A top plate is provided on the side plate, and the top plate, the bottom plate and the plurality of side plates are arranged to form a receiving space, and the chip is located in the receiving space.

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