Control system, method and computer program for an ion milling system, ion milling system

Abstract

The invention relates to a control system, method and computer program for an ion milling system, and an ion milling system comprising the control system. The control system is configured to acquire image data of an imaging device of the ion milling system, the image data showing a sample (10) to be milled using ions emitted by at least one ion emitter (130) in the ion milling system, generate a view of the sample based on the image data, provide a user interface for a display device, the user interface comprising the view of the sample, and the user interface comprising an input mechanism for selecting a portion of the sample using a pointing device, acquire a user input related to a selection (40) of the portion of the sample, and control a region to be milled using ions emitted by the at least one ion emitter based on the portion of the sample selected by the user.

Description

Technical Field

[0001] The present invention relates to a control system, method and computer program for an ion milling system, and an ion milling system including the control system. Background Technology

[0002] In an ion milling machine, an ion beam (e.g., an argon ion beam) is used to treat a sample to create a flawless surface for subsequent analysis using an electron microscope. For this purpose, the sample is mounted on a sample stage opposite the ion source. A mask partially shields the ion beam. The ion source, mask, and sample are adjusted relative to each other to ensure good results are obtained by irradiating the sample with ions.

[0003] During alignment, the relative positions of the sample, mask, and ion source are adjusted using an optical microscope. In some ion milling machines, the user then defines how the sample moves in front of the ion beam by defining parameters of the motorized sample stage. The user also defines the ion beam parameters and processing time to determine the processing depth. This process requires expertise and experience and is typically performed by a skilled operator.

[0004] There may be a need for an improved mechanism for setting up samples for ion milling that requires less skill and experience from the operator. Summary of the Invention

[0005] This need is addressed by the subject matter described in the independent claims.

[0006] The various examples disclosed herein are based on the finding that a combination of a high-resolution imaging device and a high-precision motorized sample stage can be used to automatically determine the parameters required for controlling the area to be milled. The proposed concept provides a user interface that allows the user to visually select the portion of the sample to be milled using an ion beam. By translating the user's selection into corresponding parameters for positioning and / or moving the sample (and mask) relative to the ion beam and / or for irradiating the sample, the area to be milled can be controlled based on the selection performed through the user interface. In this way, even less experienced users can precisely control the area to be milled.

[0007] Some aspects of this disclosure relate to a control system for an ion milling system. The control system includes one or more processors and one or more storage devices. The control system is configured to acquire image data from an imaging device of the ion milling system. The image data displays a sample to be milled using ions emitted by at least one ion emitter of the ion milling system. The control system is configured to generate a view of the sample based on the image data. The control system is configured to provide a user interface to a display device. The user interface includes a view of the sample. The user interface includes an input mechanism for selecting a portion of the sample by pointing to the device. The control system is configured to acquire user input related to the selection of the portion of the sample. The control system is configured to control the area to be milled using ions emitted by at least one ion emitter based on the portion of the sample selected by the user. By providing a view of the sample to the user interface and the input mechanism, the user is able to select the sample area to be milled. This selection can then be used to control the area to be milled, allowing even less experienced users to precisely control the area to be milled.

[0008] In most cases, geometrically constrained selection (e.g., rectangular selection) facilitates the selection of regions of a sample. For example, a control system can be configured to provide an input mechanism to a user interface that operates to select a rectangular portion of a sample using a pointing device. By defining two corners of the region, a rectangular portion of the sample can be easily selected, while providing sufficient flexibility for common sample types.

[0009] Rectangular selection is an example of selecting a closed two-dimensional portion of a sample view. More generally, a control system can be configured to provide an input mechanism to a user interface that can be operated to select a closed two-dimensional portion of a sample view. In addition to rectangular selection, users can be able to select any area, which increases the flexibility of the selection mechanism.

[0010] In the proposed concept, the area to be milled is selected by the user through a user interface. This selection is translated into corresponding parameters for the ion milling system components to perform ion milling on the selected area. To aim the ion emitter at the selected area, a mechanical positioning system (e.g., an electric sample stage or aiming mechanism for the ion emitter) is used to adjust the relative position and / or orientation of the ion emitter and the sample. Therefore, the control system can be configured to control the mechanical positioning system, which is configured to adjust at least one of the lateral, vertical, or directional positions of at least one ion emitter or the sample stage carrying the sample to control the area to be milled. In this way, the relative position of the sample and the ion emitter can be adjusted so that the ion beam irradiates the selected area of ​​the sample.

[0011] Typically, imaging equipment is precisely aligned with a sample (e.g., a sample stage) so that the pixels of the image data match the display world coordinates of the sample stage. This relationship between the pixels of the image data and the real-world coordinates can be used to target areas of the sample. For example, a control system can be configured to control a mechanical positioning system based on a predefined relationship between the image data pixels and the corresponding lateral, vertical, and / or directional positions of at least one ion emitter or sample stage. For example, for a given position, orientation, and width of the ion beam relative to the coordinate system of the ion milling system, the real-world coordinates of the ion beam being irradiated are known. The predefined relationship can be used to move the sample to a position where the portion of the sample displayed by the pixels is irradiated by the ion beam. Similarly, for a given position and orientation in the ion milling system of the sample, the position and / or orientation of the ion emitter can be changed such that the portion of the sample displayed by the pixels is irradiated by the ion beam.

[0012] In many cases, the width of the ion beam may not be sufficient to mill the entire selected area in a single pass. Furthermore, to avoid localized deformation due to heat, care must be taken not to irradiate the same point of the sample for too long. To address this issue, the sample can be irradiated according to a milling path to ensure uniform irradiation of the selected area. In other words, the control system can be configured to determine the milling path based on a sample portion selected by the user. The milling path indicates a sequence of adjustments to the lateral, vertical, and / or directional positions of at least one ion emitter or sample stage based on the user-selected sample portion.

[0013] When an argon ion beam bombards a sample, the ion distribution typically follows a Gaussian distribution, meaning the ion concentration is highest at the center and gradually decreases towards the edge of the beam spot. This distribution is influenced by factors such as beam energy, focusing optics, and incident angle. The ion distribution affects the amount of material removed by the ion beam and can therefore be taken into account when irradiating the sample. For example, the control system can be configured to determine the milling path based on the spatial distribution of ions within the ion beam and / or based on the kinetic energy of the ions emitted by the ion emitter. In this way, the desired milling depth can be ensured to be consistent across the region.

[0014] In addition to the selected area, the depth to be milled is also related to determining the milling path. For example, the control system can be configured to determine the milling path based on the desired depth of material to be removed by ion milling. In this way, the milling path can be selected such that material is removed uniformly from the corresponding portion of the area to be milled according to the desired depth.

[0015] In some examples, the exact effect of the ion beam on the material may be difficult to predict. Furthermore, minute misalignments between the ion beam and the sample may occur over time. To account for these uncertainties, the control system can monitor the progress of the ion milling and use this progress to adjust (or maintain, if the progress is as expected) the milling path. Accordingly, the control system can be configured to acquire additional image data from the imaging device, which shows the progress of the ion milling of the sample. The control system can be configured to maintain or adjust the milling path based on the progress of the ion milling of the sample as shown in the additional image data.

[0016] In an ion milling system, the sample is partially shielded by a mask, for example, to prevent damage to certain parts of the sample, the sample holder, and / or the sample stage by the ion beam. For example, image data may also display the mask used to shield other parts of the sample, with the user interface including a view of the mask relative to the sample. In this way, the user can check which parts of the sample are being exposed to the ion beam. While the purpose of the mask is to shield the sample from ion beam irradiation, its lifespan can be increased by minimizing irradiation. Therefore, the control system can be configured to exclude the mask from the area to be milled. However, due to the Gaussian distribution of ions in the ion beam, some irradiation will occur on the mask.

[0017] There are various user interface modalities available for selecting the area to be milled. For example, the control system can be configured to provide a user interface to the touchscreen of the ion milling system and receive user input via the touchscreen. This eliminates the need for peripheral equipment, allowing the ion milling system to require less space.

[0018] Alternatively or additionally, the control system may be configured to provide a user interface via the computer system of the ion milling system, and to receive user input via a mouse, touchpad, or trackball of the computer system. The mouse, touchpad, or trackball enables high-precision selection of the area to be milled.

[0019] In some examples, the selection does not necessarily take place at the ion milling system. Instead, the user interface can be provided to a remote device, for example, as a web application. For instance, the control system can be configured to provide a user interface to a client device via a computer network and to receive user input from the client device. This allows for the use of a larger, existing screen to perform the selection.

[0020] Another aspect of this disclosure relates to an ion milling system comprising the aforementioned control system, imaging equipment, and at least one ion emitter.

[0021] For example, as described above, an ion milling system may include a mechanical positioning system configured to adjust at least one of the following: the lateral position, vertical position, or orientation of at least one ion emitter or a sample stage carrying the sample. Using the mechanical positioning system, the relative position between the sample and the ion emitter can be adjusted such that the ion beam irradiates a selected area of ​​the sample.

[0022] Some aspects of this disclosure relate to a corresponding method for controlling an ion milling system. The method includes acquiring image data from an imaging device of the ion milling system. The image data displays a sample to be milled using ions emitted by at least one ion emitter in the ion milling system. The method includes generating a view of the sample based on the image data. The method includes providing a user interface for a display device. The user interface includes the view of the sample. The user interface includes an input mechanism for selecting a portion of the sample using a pointing device. The method includes acquiring user input related to the selection of the portion of the sample. The method includes controlling the area to be milled using ions emitted by at least one ion emitter based on the portion of the sample selected by the user.

[0023] Another aspect of this disclosure relates to a computer program having program code that, when executed on a processor, performs the methods described above. Attached Figure Description

[0024] The following will describe some examples of apparatus and / or methods by way of example and in conjunction with the accompanying drawings, wherein:

[0025] Figure 1a A schematic diagram of an ion milling system is shown during ion milling of a sample;

[0026] Figure 1b A schematic diagram of the ion milling system during sample observation is shown;

[0027] Figure 1c A schematic diagram of an example view of a sample is shown, which is used to select the area to be milled;

[0028] Figure 1d A schematic diagram showing an example of a view of a sample during irradiation;

[0029] Figure 2 A flowchart illustrating an example method for an ion milling system is shown; and

[0030] Figure 3 A schematic diagram of a system including imaging equipment and a computer system is shown. Detailed Implementation

[0031] The various examples will now be described more fully with reference to the accompanying drawings, which illustrate some of them. In the drawings, the thickness of lines, layers, and / or areas may be exaggerated for clarity.

[0032] This disclosure relates to ion milling. Ion milling is a technique that uses an ion beam emitted from an ion source (such as an argon ion source) to etch or clean the surface of a material. Ion milling works by directing a high-energy ion beam toward the surface of a sample. As these ions collide with atoms on the material surface, they effectively sputter away atoms, gradually eroding the surface. This process is known for its precision and is often used in scenarios where conventional mechanical or chemical methods might be too coarse or imprecise.

[0033] This technique is widely used to prepare samples for electron microscopy, where a clean, smooth surface is crucial for accurate imaging. It is also used in the microelectronics industry to thin semiconductor samples for detailed analysis. Furthermore, ion milling is used in materials science research, where it is beneficial for understanding the composition and structure of materials at the microscopic level.

[0034] Figure 1a A schematic diagram of an example of an ion milling system 100 during ion milling of sample 10 is shown. The ion milling system 100 typically includes several components. These components include at least one ion emitter 130, which includes an ion source for generating an ion beam (typically using argon gas) and ion optics for guiding the beam 135 onto sample 10. A mechanical ion beam positioning system 140a is used to aim at the sample by adjusting at least one of the lateral position, vertical position, or orientation of at least one ion emitter 130.

[0035] The sample stage 150 holds and precisely positions the sample during the process. The sample 10 is attached to the sample holder 20, which is mounted to the sample stage 150. A mask 30 partially obscures the sample 10 during ion milling. A mechanical sample stage positioning system 140b is used to position the sample stage 150 with the sample 10 relative to the ion beam 135, wherein the mechanical sample stage positioning system 140b is configured to adjust at least one of the lateral, vertical, or directional positions of the sample stage 150 (and thus the sample 10). The ion milling system 100 may also utilize vacuum equipment to maintain a controlled environment, which is useful for reducing or minimizing contamination and ensuring consistent results. Finally, the control system 110 controls the operation and parameters of the ion milling process, allowing adjustments for different applications and material types. The control system 110 can be controlled via a touchscreen display 160 coupled to the control system 110.

[0036] exist Figures 1a to 1dIn the illustrated ion milling system 100, a digital or hybrid microscope 120 allows the user to examine a sample 10 placed on a sample stage 150. A control system 110 uses image data from the microscope 120, which performs imaging device functions. Alternatively, a camera can be placed within the chamber of the ion milling system 100 and used to monitor the sample before and after ion milling. Because sputtering causes material removed from the sample to deposit on components within the ion milling chamber, the camera can be shielded outside the sample chamber during ion milling, for example, using a retractable shield that can be periodically or occasionally removed to allow monitoring of the progress of the ion milling process.

[0037] The proposed concept involves the visual programming of an ion milling system 100. A software tool is provided to the user, allowing them to define the area to be milled, for example by defining the dimensions of the milling recess (e.g., diameter for planar milling, or width and depth for cross-sectional patterns). The software tool then sets the parameters required to execute the process, enabling the user to efficiently process samples without the risk of human error.

[0038] In the proposed concept, the region to be processed can be visualized and programmed, for example by... Figure 1c and 1d The rectangular outline 40 is shown in the figure. In the proposed concept, an imaging device (camera, microscope 120) observes the sample, where the image data of the imaging device is calibrated (pixel unit is micrometer). The image's position reference source and mask are shown. In the graphical overlay displayed in the user interface, the user can define the areas to be exposed and etched / polished using the ion milling system 100.

[0039] Therefore, the control system 110 uses image data from the microscope 120 or camera to help the user select the sample area to be milled. Accordingly, the control system 110 is configured to acquire image data from the imaging device (e.g., microscope 120 or camera) of the ion milling system 100. The image data shows the sample 10 to be milled by ions emitted by at least one ion emitter 130 in the ion milling system 100. Depending on the placement of the imaging device, image data can be acquired in situ, i.e., when the sample is positioned opposite at least one ion emitter 130; or, as... Figure 1b As shown, the sample stage can be moved (e.g., tilted) toward the imaging device for observation. Figure 1b A schematic diagram of an example of an ion milling system 100 during sample observation using a microscope 120 as an imaging device is shown. To allow observation of the sample, the sample stage is tilted upwards by 90 degrees so that the side of the sample that faced the ion emitter now faces the microscope 120. Since the sample is partially obscured by a mask 30, the image data also shows the mask 30 used to obscure other parts of the sample 10.

[0040] The control system 110 displays image data of the sample and mask as part of the user interface to the user. The control system 110 is configured to generate a digital view of the sample based on the image data. In other words, the control system 110 is configured to generate an image to be included in the user interface, the image displaying the sample (and mask). The control system 110 then provides a user interface to a display device (e.g., touchscreen 160), the user interface including the view of the sample. The user interface is used not only to display the sample (and mask) to the user (including alignment between the mask and the sample), but also to enable the user to visually select a portion of the sample to be milled by the ion milling system 100. For this purpose, the user interface is provided with an input mechanism for selecting a portion of the sample using a pointing device. In this context, a pointing device is an input hardware component used to interact with and control the computer's user interface by moving a cursor or pointer on the screen. Common examples include touchscreens, touchpads, mice, and trackballs. For example, the control system 110 may be configured to provide a user interface to the touchscreen 160 of the ion milling system 100 and to receive user input via the touchscreen. In this example, the user's finger interacts with the pointing device because the finger is sensed by the touchscreen 160. Alternatively or additionally, the control system 110 may be configured to provide a user interface via a computer system of the ion milling system 100. For example, the control system 110 may be a computer system that can be controlled using input peripherals. In this case, the control system 110 may be configured to receive user input via a mouse, touchpad, or trackball (where the mouse, touchpad, or trackball is a pointing device in this case) of the computer system. Alternatively or additionally, the user interface may be provided to a client device. In other words, the control system 110 may be configured to provide a user interface to a client device via a computer network and receive user input through the client device. For example, the user interface may be provided to an internet browser or application on the client device, such as a web application.

[0041] Various input mechanisms suitable for selecting portions of a sample to be milled within a view of the sample can be used with such a pointing device. For example, a click-and-drag input mechanism can be used, where a user clicks a point in the view and drags (while holding down the pointing device, such as a mouse button) to another point to create a rectangular (or freeform) selection, similar to using a selection tool. Alternatively, a user can click once to define a corner and a second time to define another corner, where a rectangle is defined between the two corners. Thus, the control system 110 can be configured to provide an input mechanism to the user interface operable to select rectangular portions of the sample using a pointing device (e.g., using a click-and-drag operation or a double-click operation). Other input mechanisms exist for selecting areas of a sample by selecting a closed two-dimensional portion of the sample's view. For example, a lasso tool can be used to draw a freehand shape around the area to be milled by repeatedly clicking / dragging the pointing device. Alternatively or additionally, a magic wand tool can be used to automatically select areas based on color similarity, allowing the user to click within the view to select contiguous areas of similar color. Therefore, in summary, the control system 110 can be configured to provide an input mechanism to a user interface operable to select a closed two-dimensional portion of a view of the sample. The control system 110 is configured to acquire user input related to the selection of a portion of the sample via the user interface's input mechanism. For example, the control system 110 can be configured to acquire the coordinates of the selected area via / from the user interface.

[0042] exist Figure 1c and Figure 1d An example is provided where the rectangular portion 40 of sample 10 is selected using a click-and-drag operation. Figure 1c This is a schematic diagram illustrating an example view of sample 10, used to select the area to be milled. Figure 1c and Figure 1d In the sample 10, which is an integrated circuit, it includes a lower portion with a larger width, an upper portion with a smaller width, and bonding lines shown on the top. The sample is partially hidden by a mask 30, which is arranged between the sample and at least one ion emitter 130. A user clicks and drags a pointer device 50 (e.g., a finger on a touchscreen, a mouse) to move within the user interface to select a rectangular portion 40 of the sample's view, and thus select the area to be milled.

[0043] Figure 1dA schematic diagram illustrating an example of a (simulated) view of sample 10 during irradiation of sample 10 by ion beam 135 from ion emitter 130 is shown. As sample stage 150 and ion emitter 130 move relative to each other, ion beam 135 sequentially targets different portions of selected region 40. For example, control system 110 can be configured to adjust milling time and stage movement (e.g., using corresponding mechanical positioning systems 140a and 140b to move sample stage 150 and / or ion emitter 130) to process the selected region.

[0044] The control system 110 is configured to control the area to be milled using ions emitted by at least one ion emitter 130 based on a portion of the sample selected by the user (e.g., a portion of a view of the sample). To this end, the control system 110 converts the user's input into stage movement parameters, taking into account the characteristics of the ion source, such that the defined area is exposed after processing. Therefore, the control system 110 can be configured to control mechanical positioning systems 140a, 140b, which are configured to adjust at least one of the lateral, vertical, or directional positions (based on the stage movement parameters) of at least one ion emitter 130 or the sample stage 150 to control the area to be milled.

[0045] To this end, the control system 110 can be configured to map a selected portion (i.e., pixels) of the view to real-world coordinates using a known transformation between pixels and a real-world coordinate system. The control system 110 can then calculate the required displacement of the sample stage 150 or the ion emitter 130 such that a portion of the selected area is aligned with the emission axis of the ion emitter 130. Therefore, the control system 110 can be configured to control the mechanical positioning system based on a predefined relationship between pixels in the image data and the corresponding lateral, vertical, and / or directional positions of at least one ion emitter or sample stage. As described above, this can be a two-part transformation between pixels and their corresponding lateral, vertical, and / or directional positions: first, calculating the coordinates of the region in the real-world coordinate system, and then calculating the vertical, lateral, or angular displacement required to aim the ion beam at that region. Both calculations are based on the aforementioned predefined relationship between pixels and real-world coordinates.

[0046] In many cases, the ion beam is not wide enough and does not have uniform intensity across its width, making it impossible to irradiate the entire area without relative movement of the ion emitter 130 and the sample stage 150. Instead, a milling path can be defined that specifies the relative movement between the ion emitter 130 and the sample stage 150 (in most cases, by moving the sample stage). In other words, the control system 110 can be configured to determine the milling path based on a portion of the sample selected by the user. The milling path indicates a sequence of adjustments to the lateral, vertical, and / or directional positions of at least one ion emitter or sample stage based on the portion of the sample selected by the user. To determine the milling path for uniform material removal in ion milling, a grating pattern of the system (e.g., a grid-based pattern or a serpentine pattern) can be used in the milling path to ensure uniform beam distribution over the defined area. The milling path can be selected such that the entire area receives the same amount of ion beam irradiation, depending on the spatial distribution of ions in the ion beam.

[0047] Usually, such as Figure 1a and Figure 1d As shown, the ion beam has a certain width because it expands as it moves away from the ion emitter 130. The width of the ion beam when it impacts the sample depends in particular on the characteristics of the ion source and focusing system (e.g., aperture size, divergence angle, lens setup, electric / magnetic field, etc.), the kinetic energy of the ions (caused by the accelerating voltage), and the working distance. The highest concentration of ions impacts the sample near the center of the ion beam, and the ion concentration drops rapidly, resulting in a Gaussian distribution of the ion beam. This distribution (which can be influenced primarily by setting the kinetic energy of the ions during operation) can be taken into account when determining the stage movement parameters based on the selected portion of the view. In particular, the kinetic energy of the emitted ions and the spatial distribution of the ions determine how much radiation a given portion of the sample receives, and therefore how much material is removed. To ensure that the entire area receives the same amount of ion beam irradiation, the spatial distribution of ions in the ion beam (affected by the accelerating voltage and the resulting ion kinetic energy) can be considered when planning the milling path, by selecting overlaps between adjacent paths so that the decrease in intensity is compensated by the overlap with adjacent paths. More generally, the control system 110 can be configured to determine the milling path based on the spatial distribution of ions within the ion beam and / or based on the kinetic energy of ions emitted by the ion emitter.

[0048] Another factor to consider when determining the milling path is the desired depth of the material to be removed. For example, the control system 110 may be configured to determine the milling path based on the desired depth of the material to be removed by ion milling. In particular, the control system 110 may be configured to control the number of paths or dwell time / scan speed based on the depth of the material to be removed.

[0049] Typically, a mask is used to shield parts of the sample (and sample stage). To avoid wasting energy and time, and to prevent mask wear, the control system 110 can be configured to exclude the mask from the area to be milled. However, due to the width of the ion beam, the mask will still be hit by the off-axis portion of the ion beam.

[0050] In some examples, the control system 110 may be configured to autonomously identify and monitor whether the area has been exposed as desired. This can be accomplished by analyzing additional image data (periodically or occasionally) to determine whether the material removed from the sample matches the milling path. For example, the control system 110 may be configured to acquire additional image data from an imaging device that shows the progress of ion milling of the sample. When a microscope 120 is used as the imaging device, this can be accomplished by tilting the sample stage upward (e.g., using a motorized tilting mechanism) and generating additional image data using the optical imaging sensor of the microscope 120. If a camera located within the chamber is used, the camera shield may be temporarily removed to acquire additional image data. The control system 110 may be configured to determine a match or mismatch between the milling path and the material removed from the sample by comparing the image data with additional image data. Based on this analysis, the control system 110 may maintain or adjust the milling path (e.g., to adjust for offsets or misalignments visible in the comparison of the image data with additional image data). In other words, the control system 110 may be configured to maintain or adjust the milling path based on the progress of ion milling of the sample as shown in the additional image data.

[0051] The proposed concept allows users to quickly and efficiently define etched areas without needing in-depth knowledge of the control system 110. Users receive direct visual feedback on the settings via a rectangular box 40, and can therefore immediately see whether the instrument has been successfully programmed. This improves the success rate and avoids excessively long sample processing, thus saving time.

[0052] Generally, the control system 110 may be a computer system. The control system 110 includes one or more processors 114 and one or more storage devices 116. Optionally, the control system 110 may also include one or more interfaces 112. The one or more processors 114 are coupled to the one or more storage devices 116 and the one or more interfaces 112. Generally, the functionality of the control system 110 may be provided by the one or more processors 114 in conjunction with one or more interfaces 112 (for exchanging data / information with one or more other components within the ion milling system 100 and devices external to the ion milling system 100 (e.g., imaging device 120, ion emitter 130, mechanical positioning devices 140a, 140b and / or touchscreen display 160), and utilizing one or more storage devices 116 (for storing information, such as machine-readable instructions of a computer program executed by the one or more processors). Generally, the functionality of the one or more processors 114 may be implemented by the one or more processors 114 executing machine-readable instructions. Therefore, any feature belonging to the one or more processors 114 may be defined by one or more instructions from a plurality of machine-readable instructions. The control system 110 may include machine-readable instructions, for example, within one or more storage devices 116.

[0053] The control system 110 is configured to provide a user interface for displaying samples. For example, the control system 110 may be configured to output display signals to a touchscreen display 160 or a monitor 160 of the ion milling system 100, wherein the display signals include a user interface. For example, the display signals may be signals for driving (e.g., controlling) a corresponding monitor. For example, the display signals may include video data and / or control commands for driving the monitor. For example, the display signals may be provided through one or more interfaces 112 of the control system 110. Accordingly, the control system 110 may include a video interface 112 adapted to provide display signals to the display device 160 of the ion milling system 100.

[0054] In the proposed ion milling system 100, an optical imaging sensor of the imaging device 120 is used to provide the aforementioned image data. Accordingly, an optical imaging sensor, which may be part of the imaging device 120 (e.g., a microscope or camera), can be configured to generate image data. For example, the optical imaging sensor of the imaging device 120 or camera may include or be an APS (Active Pixel Sensor) based imaging sensor or a CCD (Charge-Coupled Device) based imaging sensor. For example, in an APS-based imaging sensor, light is recorded at each pixel using a photodetector and an active amplifier of the pixel. APS-based imaging sensors are typically based on CMOS (Complementary Metal-Oxide-Semiconductor) or S-CMOS (Scientific CMOS) technology. In a CCD-based imaging sensor, incident photons are converted into electronic charges at the semiconductor-oxide interface, and these electronic charges are then moved by the circuitry of the imaging sensor through a capacitive storage cell in the imaging sensor to perform imaging. For example, the control system 110 may be configured to acquire image data from the imaging device 120, for example, by receiving image data from the imaging device 120 or by reading image data from the imaging device 120.

[0055] One or more interfaces 112 of the control system 110 may correspond to one or more inputs and / or outputs for receiving and / or sending information within a module, between modules, or between modules of different entities. This information may be digital (bit) values ​​based on specified codes. For example, one or more interfaces 112 may include interface circuitry configured to receive and / or send information. One or more processors 114 of the control system 110 may be implemented using one or more processing units, one or more processing devices, or any processing means (e.g., processors, computers, or programmable hardware components that can operate in conjunction with appropriate adaptive software). In other words, the functions of the one or more processors 114 may also be implemented in software, which is then executed on one or more programmable hardware components. Such hardware components may include general-purpose processors, digital signal processors (DSPs), microcontrollers, etc. One or more storage devices 116 of the control system 110 may include at least one element of the following: computer-readable storage media (e.g., magnetic or optical storage media, such as hard disk drives, flash memory, floppy disks, random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) or network storage.

[0056] Further details and aspects of the ion milling system 100 and the control system 110 are mentioned in the concepts or one or more examples presented above or below (e.g., Figures 2 to 3The ion milling system 100 and control system 110 may include additional optional features corresponding to one or more aspects of the proposed concept or one or more examples described above or below.

[0057] Figure 2 A system for ion grinding (e.g.) is shown. Figures 1a to 1d A flowchart illustrating an example of a corresponding method for an ion grinding system 100. For example, the method may be derived from... Figure 1a And / or the control system 110 of 1b is executed. Combined Figures 1a to 1d The features discussed in the control system 110 and / or ion milling system 100 may also include those in Figure 2 In the corresponding methods.

[0058] The method includes acquiring image data from an imaging device of an ion milling system 100. The image data displays a sample to be milled using ions emitted by at least one ion emitter of the ion milling system 100. The method includes generating a view of the sample based on the image data. The method includes providing a user interface for a display device. The user interface includes the view of the sample. The user interface includes an input mechanism for selecting a portion of the sample using a pointing device. The method includes acquiring user input related to the selection of a portion of the sample. The method includes controlling an area to be milled using ions emitted by at least one ion emitter based on the portion of the sample selected by the user.

[0059] Further details and aspects of the method are mentioned in connection with the proposed concept or one or more examples described above or below (e.g. Figures 1a to 1d ,and Figure 3 The method may include additional optional features corresponding to one or more aspects of the proposed concept or one or more examples described above or below.

[0060] As used herein, the term “and / or” includes any and all combinations of one or more of the listed related items and may be abbreviated as “ / ”.

[0061] Although some aspects have already been described above in the context of the apparatus, these aspects clearly also represent descriptions of the corresponding methods, where a block or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent descriptions of corresponding blocks, items, or features in the corresponding apparatus.

[0062] Some embodiments relate to as a combination Figures 1a to 2 An imaging device that is part of the system described in one or more of the figures. Figure 3A schematic diagram of a system 300 configured to perform the methods described herein is shown. System 300 includes an imaging device 310 and a computer system 320. The imaging device 310 is configured to capture images and is connected to the computer system 320. The computer system 320 is configured to perform at least a portion of the methods described herein. The computer system 320 may be configured to execute machine learning algorithms. The computer system 320 and the imaging device 310 may be separate entities or integrated together in a common housing. The computer system 320 may be part of the central processing system of the imaging device 310 and / or the computer system 320 may be part of a sub-component of the imaging device 310 (e.g., sensors, actuators, cameras, or illumination units of the imaging device 310).

[0063] Computer system 320 may be a local computer device (e.g., a personal computer, laptop, tablet, or mobile phone) having one or more processors and one or more storage devices, or it may be a distributed computer system (e.g., a cloud computing system having one or more processors and one or more storage devices distributed in various locations, such as at local clients and / or one or more remote server clusters and / or data centers). Computer system 320 may include any circuitry or combination of circuitry. In one embodiment, computer system 320 may include one or more processors, which may be of any type. As used herein, a processor may refer to any type of computing circuitry, such as, but not limited to, a microprocessor, microcontroller, complex instruction set computing (CISC) microprocessor, reduced instruction set computing (RISC) microprocessor, very long instruction word (VLIW) microprocessor, graphics processor, digital signal processor (DSP), multi-core processor, field-programmable gate array (FPGA), for example, a processor in an imaging device or imaging device component (e.g., a camera), or any other type of processor or processing circuitry. Other types of circuitry included in KEYI of computer system 320 may be custom circuits, application-specific integrated circuits (ASICs), etc., such as one or more circuits (e.g., communication circuits) used in wireless devices such as mobile phones, tablets, laptops, two-way radios, and similar electronic systems. Computer system 320 may include one or more storage devices, which may contain one or more memory elements suitable for a particular application, such as main memory in the form of random access memory (RAM), one or more hard disk drives, and / or one or more drives that process removable media (e.g., optical discs (CDs), flash memory cards, digital video discs (DVDs), etc.). Computer system 320 may also include a display device, one or more speakers, and a keyboard and / or controller, which may include a mouse, trackball, touchscreen, voice recognition device, or any other device that allows a system user to input and receive information from computer system 320.

[0064] All or part of the method steps may be performed by (or using) hardware devices, such as processors, microprocessors, programmable computers, or electronic circuits. In some embodiments, one or more of the most important method steps may be performed by such devices.

[0065] Depending on specific implementation requirements, embodiments of the present invention can be implemented in hardware or software. It can be executed using non-volatile storage media (e.g., digital storage media), such as floppy disks, DVDs, Blu-ray discs, CDs, ROMs, PROMs, EPROMs, EEPROMs, or flash memory, storing electronically readable control signals that work (or are capable of working with) a programmable computer system to execute the corresponding methods. Therefore, the digital storage medium can be computer-readable.

[0066] Some embodiments of the invention include a data carrier having electronically readable control signals, which is capable of cooperating with a programmable computer system to perform one of the methods described herein.

[0067] Generally, embodiments of the present invention can be implemented as a computer program product having program code that, when run on a computer, is operable to perform one of the methods. The program code may, for example, be stored on a machine-readable medium.

[0068] Other embodiments include a computer program stored on a machine-readable medium for performing one of the methods described herein.

[0069] In other words, therefore, an embodiment of the present invention is a computer program having program code for performing one of the methods described herein when the computer program is run on a computer.

[0070] Therefore, another embodiment of the invention is a storage medium (or data carrier, or computer-readable medium) having a computer program stored thereon, the computer program being used to perform one of the methods described herein when executed by a processor. Data carriers, digital storage media, or recording media are generally tangible and / or non-transitory. Another embodiment of the invention is an apparatus including a processor and a storage medium as described herein.

[0071] Therefore, another embodiment of the invention represents a data stream or signal sequence for performing one of the methods described herein. The data stream or signal sequence may, for example, be configured to be transmitted via a data communication connection (e.g., via the Internet).

[0072] Another embodiment includes processing means, such as a computer or programmable logic device, configured or adapted to perform one of the methods described herein.

[0073] Another embodiment includes a computer on which a computer program for performing one of the methods described herein is installed.

[0074] Another embodiment of the invention includes an apparatus or system configured to transmit (e.g., electronically or optically) a computer program for performing one of the methods described herein to a receiver. The receiver may be, for example, a computer, a mobile device, a storage device, etc. The apparatus or system may, for example, include a file server for transmitting the computer program to the receiver.

[0075] In some embodiments, a programmable logic device (e.g., a field-programmable gate array) may be used to perform some or all of the functions of the methods described herein. In some embodiments, the field-programmable gate array may cooperate with a microprocessor to perform one of the methods described herein. Generally, these methods are preferably performed by any hardware device.

[0076] Reference number list

[0077] 10: Sample

[0078] 20: Sample holder

[0079] 30: Mask

[0080] 40: Selected region of the sample (e.g., rectangular outline)

[0081] 50: Pointing device

[0082] 100: Ion Milling System

[0083] 110: Control System

[0084] 112: Interface

[0085] 114: Processor

[0086] 116: Storage devices

[0087] 120: Microscope (Imaging Equipment)

[0088] 130: Ion emitter (ion source)

[0089] 135: Ion beam

[0090] 140a: Mechanical ion beam positioning system

[0091] 140b: Mechanical Sample Stage Positioning System

[0092] 150: Sample Stage

[0093] 160: Touchscreen display (display device)

[0094] 210: Acquire image data

[0095] 220: View of generated samples

[0096] 230: Provide a user interface

[0097] 240: Get User Input

[0098] 250: Controls the area to be milled

[0099] 300: System

[0100] 310: Imaging equipment

[0101] 320: Computer System

Claims

1. A control system (110) for an ion milling system (100), the control system comprising one or more processors and one or more storage devices, wherein, The control system is configured as follows: Image data is acquired from the imaging device (120) of the ion milling system, the image data showing a sample (10) to be milled using ions emitted by at least one ion emitter (130) of the ion milling system. A view of the sample is generated based on the image data; A user interface is provided for a display device, the user interface including the view of the sample, wherein the user interface includes an input mechanism for selecting a portion of the sample using a pointing device; Obtain user input related to the selection (40) of the portion of the sample; Based on the portion of the sample selected by the user, control the area to be milled using ions emitted by at least one ion emitter.

2. The control system according to claim 1, wherein, The control system is configured to provide the user interface with an input mechanism that allows it to operate to select a rectangular portion of the sample using the pointing device.

3. The control system according to claim 1, wherein, The control system is configured to provide the user interface with an input mechanism that allows it to operate to select a closed two-dimensional portion of the view of the sample.

4. The control system according to any one of claims 1 to 3, wherein, The control system is configured to control a mechanical positioning system (140a, 140b) that is configured to adjust at least one of the lateral position, vertical position, or orientation of the at least one ion emitter (130) or the sample stage (150) carrying the sample to control the area to be milled.

5. The control system according to claim 4, wherein, The control system is configured to control the mechanical positioning system based on a predefined relationship between the pixels of the image data and the corresponding lateral, vertical, and / or directional positions of the at least one ion emitter or sample stage.

6. The control system according to any one of claims 4 to 6, wherein, The control system is configured to determine a milling path based on the portion of the sample selected by the user, wherein the milling path indicates a sequence of adjustments to the lateral position, vertical position, and / or orientation of the at least one ion emitter or sample stage based on the portion of the sample selected by the user.

7. The control system according to claim 6, wherein, The control system is configured to determine the milling path based on the spatial distribution of ions within the ion beam and / or based on the kinetic energy of ions emitted by the ion emitter.

8. The control system according to any one of claims 6 or 7, wherein, The control system is configured to also determine the milling path based on the desired depth of the material to be removed by ion milling.

9. The control system according to any one of claims 7 or 8, wherein, The control system is configured to acquire additional image data from the imaging device, the additional image data showing the progress of ion milling of the sample, and is configured to maintain or adjust the milling path based on the ion milling progress of the sample shown in the additional image data.

10. The control system according to any one of claims 1 to 9, wherein, The image data also displays a mask (30) used to obscure other parts of the sample (10), wherein the user interface includes the mask and a view on the sample.

11. The control system according to any one of claims 1 to 10, wherein, The control system is configured to exclude the mask from the area to be milled.

12. The control system according to any one of claims 1 to 11, wherein, The control system is configured to provide the user interface to the touchscreen of the ion milling system and to acquire the user input via the touchscreen. Alternatively, the control system is configured to provide the user interface via the computer system of the ion milling system, and to acquire user input via a mouse, touchpad, or trackball of the computer system. Alternatively, the control system is configured to provide the user interface to a client device via a computer network and to acquire the user input via the client device.

13. An ion milling system (100) comprising a control system (110) according to any one of claims 1 to 12, an imaging device (120) and at least one ion emitter (130).

14. A method for controlling an ion milling system, the method comprising: Acquire image data from the imaging device of the ion milling system (210), the image data showing a sample to be milled using ions emitted by at least one ion emitter of the ion milling system; (220) A view of the sample is generated based on the image data; Provide a (230) user interface for the display device, the user interface including the view of the sample, wherein the user interface includes an input mechanism for selecting a portion of the sample using a pointing device; Obtain (240) user input related to the selection of said portion of said sample; Based on the portion of the sample selected by the user, control (250) the area to be milled using ions emitted by at least one ion emitter.

15. A computer program having program code, which, when executed on a processor, is used to perform the method according to claim 14.

Images