Adsorption hole electrode coupling structure and plasma processing apparatus

Abstract

The application relates to the technical field of plate-level packaging equipment, and particularly relates to a suction hole electrode coupling structure and a plasma processing device, which comprises a suction electrode, a water-electricity integrated interface, a vacuum suction pipeline, an electric field isolation component and a filtering component. The suction electrode is electrically connected with a radio frequency power supply, so as to simultaneously serve as a vacuum suction loading platform and a radio frequency discharge electrode. The water-electricity integrated interface is symmetrically arranged on the suction electrode. One end of the vacuum suction pipeline is communicated with the suction electrode, and the other end is externally connected with a vacuum device. The electric field isolation component comprises an isolation pressing frame and an isolation pressing plate. The isolation pressing frame is installed at the edge of the suction electrode, and the isolation pressing plate is arranged below the suction electrode. The filtering component is arranged between the suction electrode and the vacuum suction pipeline. The application integrates the design of the suction loading platform and the radio frequency discharge electrode. While realizing the stable vacuum suction of a substrate, the application can also serve as a discharge electrode to excite plasma, reduces the electric field interference caused by the additional loading platform structure, and guarantees the uniformity of plasma processing.

Description

Technical Field

[0001] This invention relates to the field of board-level packaging equipment technology, specifically to an adsorption hole electrode coupling structure and plasma treatment equipment used in the board-level packaging adhesive removal process, which is particularly suitable for plasma adhesive removal of large-size ultra-thin panels. Background Technology

[0002] Board-level packaging (FOPLP) is the mainstream development direction of advanced semiconductor packaging. Compared with traditional wafer-level packaging, the area utilization rate is increased from 85% to over 95%, which has the advantages of high efficiency and low cost, and can widely replace traditional packaging processes.

[0003] Panel-level packaging uses large-size ultra-thin resin or glass panel substrates such as 600×600mm and 510×515mm. The substrates are thin, weak, and easy to warp. Furthermore, the panel surface is prepared with precision structures such as micron-level RDL redistribution lines, micro SAP microvias, and UBM pads, which places extremely high demands on the uniformity, precision, and non-destructiveness of the process.

[0004] Traditional panel plasma processing equipment mostly adopts a fixed grounded platform structure and a low-power radio frequency power supply scheme, which has the following technical defects: (1) Traditional equipment relies solely on the upper electrode to excite plasma. The carrier plate has no radio frequency bias function, which cannot form a directional ion bombardment effect. It can only rely on gas free radicals to achieve simple chemical cleaning, which is difficult to completely remove carbonized residues and organic residues from the bottom of the micropore and the sidewalls of the circuit.

[0005] (2) Large-size panels have large capacitive loads on their electrodes, and traditional low-power RF power supplies have insufficient output energy, resulting in uneven plasma density distribution across the entire panel, weak edge discharge, and poor consistency in panel surface treatment.

[0006] (3) Traditional structures cannot export the surface charge generated by plasma bombardment, which easily causes electrostatic damage to micro and nano circuits.

[0007] (4) During the plasma treatment process, byproduct particles generated by processes such as etching and modification of the substrate surface are easily drawn back into the gas path system through the adsorption holes, causing gas path blockage and chamber contamination. Summary of the Invention

[0008] To address the deficiencies mentioned in the background section, this invention provides an adsorption pore electrode coupling structure and a plasma processing device, which integrates vacuum adsorption leveling, radio frequency electric field excitation, and electrostatic protection, thereby improving the uniformity and accuracy of plasma processing for large-size ultra-thin panels.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: An adsorption pore electrode coupling structure, comprising: The adsorption electrode is electrically connected to the radio frequency power supply to serve as both a vacuum adsorption stage and a radio frequency discharge electrode. A water-electricity integrated interface is symmetrically arranged on the adsorption electrode, which is used to simultaneously connect the cooling medium and the radio frequency power supply; A vacuum adsorption pipe, one end of which is connected to the adsorption electrode, and the other end of which is connected to a vacuum device; An electric field isolation assembly includes an isolation frame and an isolation plate. The isolation frame is installed on the edge of the adsorption electrode to eliminate electric field distortion in the edge region of the adsorption electrode. The isolation plate is disposed below the adsorption electrode for insulating and isolating the adsorption electrode from the cavity of the plasma processing equipment. The filter assembly is located between the adsorption electrode and the vacuum adsorption pipe to intercept byproduct particles generated during plasma treatment. The filter assembly is composed of multiple layers of honeycomb filter blocks stacked in an alternating manner. Each layer of the honeycomb filter block has uniformly distributed airflow holes. The airflow holes of adjacent layers are staggered on the vertical projection plane to form a tortuous airflow path and constitute a multi-stage interception structure.

[0010] Preferably, the surface of the adsorption electrode is divided into an inner adsorption region and an outer adsorption region, and the inner adsorption region and the outer adsorption region are sealed and isolated by a sealing ring to form an independently controllable dual-zone vacuum adsorption structure; and the adsorption pressure of the inner adsorption region and the outer adsorption region are independently adjustable.

[0011] Preferably, multiple adsorption pores are formed in the inner adsorption region and the outer adsorption region, and the adsorption pores in each region are evenly distributed in an array to form a negative pressure channel for vacuum adsorption.

[0012] Preferably, the pore size of the adsorption pores varies in a gradient along the surface of the adsorption electrode, with the pore size in the region of higher electric field strength being smaller than that in the region of lower electric field strength, and the pore size of the adsorption pores being negatively correlated with the local electric field strength.

[0013] Preferably, the adsorption electrode is provided with cooling water channels inside, the cooling water channels are distributed in a meandering manner inside the adsorption electrode, and the diameter of the cooling water channels increases layer by layer from the center to the edge of the adsorption electrode.

[0014] Preferably, the adsorption electrode has several water outlets equidistantly spaced at its end, and each of the water outlets is connected to a cooling water channel, and a sealing plug is provided on the water outlet.

[0015] Preferably, the water-electricity integrated interface integrates a radio frequency input terminal and a cooling medium input / output terminal, wherein the radio frequency input terminal is electrically connected to the adsorption electrode; and the cooling medium input / output terminal is connected to the cooling water channel.

[0016] Preferably, the shape of the isolation frame matches the edge contour of the adsorption electrode, and the side of the isolation frame facing the center of the adsorption electrode is provided with an arc transition surface or a slope.

[0017] Preferably, the isolation pressure plate has clearance through holes at the positions corresponding to the vacuum adsorption pipe and the water and electricity integrated interface, and the clearance through holes and the vacuum adsorption pipe and the water and electricity integrated interface are filled with insulating and sealing filler.

[0018] A plasma processing device includes a cavity and an adsorption pore electrode coupling structure disposed within the cavity.

[0019] In summary, the beneficial effects of the present invention are as follows: 1. This invention integrates the adsorption stage with the radio frequency discharge electrode, achieving stable vacuum adsorption of the substrate while also serving as a discharge electrode to excite plasma. This reduces electric field interference caused by the additional stage structure and ensures the uniformity of plasma processing.

[0020] 2. This invention, through symmetrically arranged integrated water and electricity interfaces, can uniformly introduce cooling medium to cool the adsorption electrodes during operation, maintain stable electrode operating temperature, and simultaneously complete the connection of radio frequency power supply, simplifying external wiring and pipeline layout. This enables uniform input of electric field and rapid discharge of static electricity throughout the entire domain, eliminating electrostatic damage to micro-nano circuits. Furthermore, the vacuum adsorption and plasma discharge coupling synergy is high, resulting in extremely strong process stability.

[0021] 3. By setting up an electric field isolation component, this invention can constrain and isolate the electric field at the edge of the discharge area, preventing the electric field from spreading outward and affecting the discharge stability, thus improving the process consistency of plasma treatment. At the same time, the edge electric field weakening pressure frame, combined with the global partition adsorption structure, can effectively eliminate the problems of edge electric field distortion and field strength unevenness, and achieve highly uniform electric field coupling discharge on the plate surface.

[0022] 4. This invention, by setting up a filter component, can effectively intercept by-product debris generated during the process, preventing these particles from entering the vacuum adsorption pipeline and causing pipeline blockage, ensuring the long-term stability of vacuum adsorption, and reducing the frequency of equipment maintenance; at the same time, it prevents plasma in the cavity from spreading into the vacuum pipeline through the adsorption holes, reducing the possibility of secondary arcing; and it can throttle the internal and external adsorption areas, balance the pumping rate, avoid damage to the product due to excessive suction, and ensure that the substrate and adsorption electrode are tightly bonded. Attached Figure Description

[0023] Figure 1 This is an overall assembly diagram of the adsorption pore electrode coupling structure of the present invention; Figure 2 This is a schematic diagram of the adsorption pore electrode coupling structure of the present invention; Figure 3This is an exploded view of the adsorption pore electrode coupling structure of the present invention; Figure 4 This is a top view of the adsorption pore electrode coupling structure of the present invention; Figure 5 This is a side view of the adsorption pore electrode coupling structure of the present invention; Figure 6 for Figure 5 Cross-sectional view of surface AA; Figure 7 for Figure 5 A cross-sectional view of the BB plane; Figure 8 for Figure 5 Cross-sectional view of the C-plane; Figure 9 for Figure 6 Enlarged view of the filter component at point a; Figure 10 for Figure 7 Enlarged view of the external adsorption region at point b; Figure 11 for Figure 7 A magnified view of the adsorption region at point c.

[0024] Explanation of the reference numerals in the figure: 1. Adsorption electrode; 11. Inner adsorption area; 12. Outer adsorption area; 13. Sealing ring; 14. Water outlet; 15. Sealing plug; 2. Water and electricity integrated interface; 21. Radio frequency input terminal; 22. Cooling medium input and output terminal; 3. Vacuum adsorption pipe; 4. Electric field isolation component; 41. Isolation pressure frame; 42. Isolation pressure plate; 421. Clearance hole; 5. Filter component; 51. Honeycomb filter block; 52. Air flow hole; 6. Adsorption hole; 7. Cooling water channel; 8. Cavity. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0026] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention.

[0027] In the description of this invention, the use of terms such as "a number" means one or more, with "more than" meaning two or more. Terms like "greater than," "less than," and "exceeding" are understood to exclude the stated number, while terms like "above," "below," and "within" are understood to include the stated number. The use of terms like "first," "second," and "third" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, the number of indicated technical features, or the sequential relationship between indicated technical features.

[0028] The following is in conjunction with the appendix Figure 1-11 The present invention will be further described in detail with respect to an adsorption pore electrode coupling structure and a plasma treatment device.

[0029] An adsorption pore electrode coupling structure, such as Figure 1-3 As shown, it includes an adsorption electrode 1, an integrated water and electricity interface 2, a vacuum adsorption pipe 3, an electric field isolation component 4, and a filter component 5.

[0030] The adsorption electrode 1 is the core component of this invention. It has a plate-like structure and its size is adapted to the large-size substrates (such as 600×600mm or 510×515mm) used in panel-level packaging. The adsorption electrode 1 is made of conductive material (such as aluminum alloy or stainless steel) and serves as both a platform for supporting the substrate and a lower electrode for radio frequency discharge.

[0031] In some implementations, such as Figure 4 , 6 As shown in Figures 10 and 11, the surface of the adsorption electrode 1 is divided into an inner adsorption region 11 and an outer adsorption region 12 (the dashed box indicates the dividing boundary). The inner adsorption region 11 roughly corresponds to the central region of the substrate, and the outer adsorption region 12 is arranged around the inner adsorption region 11. Multiple adsorption holes 6 are formed in both the inner and outer adsorption regions 11, and the adsorption holes 6 in each region are evenly distributed in an array. A sealing ring 13 is provided between the inner adsorption region 11 and the outer adsorption region 12 for regional isolation. Through this dual-zone independent sealing structure, both the inner adsorption region 11 and the outer adsorption region 12 are connected to the same vacuum source, achieving independent pressure adjustment. This allows for flexible adjustment of the adsorption force for different areas of a large-size warped panel, ensuring that the entire surface of the substrate is tightly fitted with the adsorption electrode 1, and preventing gaps caused by warping from affecting the uniformity of plasma processing.

[0032] Furthermore, in practical applications, a large-size ultra-thin panel substrate is placed on the upper surface of the adsorption electrode 1. Based on the substrate's warpage, the vacuum adsorption pressure of the inner adsorption region 11 and the outer adsorption region 12 are adjusted respectively, causing the substrate to be adsorbed and flattened under negative pressure, tightly adhering to the surface of the adsorption electrode 1. This dual-zone independent control method effectively addresses warpage differences in different areas of the large-size substrate, achieving precise flattening. Simultaneously, vacuum adsorption also prevents substrate drift, ensuring the substrate's positional accuracy during plasma processing.

[0033] In some embodiments, the pore size of the adsorption pore 6 varies in a gradient along the surface of the adsorption electrode 1. Specifically, in regions with high electric field strength (typically the central region of the adsorption electrode 1 and its vicinity), the pore size of the adsorption pore 6 is set to a smaller size; in regions with low electric field strength (typically the edge region of the adsorption electrode 1 and its vicinity), the pore size of the adsorption pore 6 is set to a larger size. That is, the pore size of the adsorption pore 6 is negatively correlated with the local electric field strength.

[0034] Furthermore, the presence of the adsorption holes 6 will, to some extent, disturb the local electric field distribution. The larger the hole diameter, the more pronounced the disturbance effect on the electric field, and the greater the change in local electric field intensity. By setting smaller-diameter adsorption holes 6 in areas with high electric field intensity, the electric field disturbance of the adsorption holes 6 in high-field-intensity areas can be reduced; by setting larger-diameter adsorption holes 6 in areas with low electric field intensity, the weak enhancement effect of the pore size on the electric field can be used to compensate for the insufficient edge electric field intensity while ensuring the adsorption effect. Thus, the electric field disturbance effect of the adsorption holes 6 is actively utilized as an auxiliary means of electric field homogenization, forming a triple electric field homogenization mechanism together with the edge electric field weakening design of the electric field isolation component 4 and the dual-zone independent adsorption structure, further improving the uniformity of the electric field on the board surface.

[0035] Furthermore, the adsorption pores 6 can reduce the electric field intensity at the pore edges, effectively suppressing plasma sheath distortion and reducing product deposition at the pore openings. In addition, the small pores can reduce the adsorption gas flow velocity, preventing high-speed gas flow from carrying product particles that impact the pore walls, thus reducing the probability of product accumulation. At the same time, the increased spacing between adsorption pores satisfies the leveling function while reducing the number of adsorption pores, further suppressing plasma sheath distortion.

[0036] In some implementations, such as Figure 3 and Figure 6 As shown, the electric field isolation assembly 4 includes an isolation frame 41 and an isolation plate 42. The isolation frame 41 is installed on the edge of the adsorption electrode 1 to eliminate electric field distortion in the edge region of the adsorption electrode 1. The isolation plate 42 is disposed below the adsorption electrode 1 to provide insulation between the adsorption electrode 1 and the plasma processing equipment cavity 8, preventing radio frequency power leakage to the cavity 8.

[0037] Furthermore, both the isolation frame 41 and the isolation plate 42 are made of insulating material. The shape of the isolation frame 41 matches the edge contour of the adsorption electrode 1, and the edge structure of the isolation frame 41 has undergone electric field optimization and weakening design. Specifically, the isolation frame 41 has an arc transition surface or slope on the side facing the center of the adsorption electrode 1 to reduce the electric field concentration effect in the edge area, making the electric field distribution in the adsorption area closer to the requirements of uniform discharge. The isolation plate 42 has a clearance through hole 421 corresponding to the position of the vacuum adsorption pipe 3. The inner diameter of the clearance through hole 421 is larger than the outer diameter of the vacuum adsorption pipe 3, and the space between the clearance through hole 421 and the vacuum adsorption pipe 3 is filled with insulating sealing filler. Through the setting of the isolation frame 41 and the isolation plate 42, the problem of arc discharge caused by excessive electric field or distortion at the electrode edge is effectively eliminated, ensuring the consistent plasma treatment effect in the edge area of ​​large-size panels.

[0038] In some implementations, such as Figure 5 and Figure 8 As shown, the adsorption electrode 1 is provided with cooling water channels 7 inside. The cooling water channels 7 are distributed in a meandering manner inside the adsorption electrode 1. The diameter of the channels is designed to increase layer by layer from the central region to the edge region of the adsorption electrode 1 (that is, the diameter of the cooling water channels 7 in the central region is smaller, the diameter of the cooling water channels 7 in the middle region is medium, and the diameter of the cooling water channels 7 in the edge region is larger).

[0039] Furthermore, taking the adsorption electrode 1 adapted to a 600×600mm panel as an example, the cooling channels 7 are distributed in a serpentine pattern inside the adsorption electrode 1. The diameter of the cooling channels 7 increases in three levels from the center area to the edge area of ​​the adsorption electrode 1: the diameter of the cooling channels 7 in the center area (0-200mm from the center) is 6mm; the diameter of the cooling channels 7 in the middle area (200-400mm from the center) is 8mm; and the diameter of the cooling channels 7 in the edge area (400-300mm from the center) is 10mm. The cooling medium is deionized water, with an inlet temperature of 20±1℃ and a flow rate of 10-15L / min. Under the above parameters, the deviation between the measured temperature and the average temperature at each point on the surface of the adsorption electrode 1 can be controlled within ±3℃.

[0040] The principle behind this gradient diameter water channel design is as follows: During plasma processing of large-size panels, the central area has relatively poor heat dissipation conditions and accumulates more heat, requiring a smaller pipe diameter to increase the flow rate of the cooling medium and enhance the heat exchange effect; the edge area has relatively better heat dissipation conditions, and a larger pipe diameter can meet the heat dissipation requirements. Through the above design, the temperature uniformity of the entire surface of the adsorption electrode 1 can be controlled within ±3℃, effectively avoiding uneven stress and warping problems caused by thermal deformation of the substrate.

[0041] It should be noted that the above-mentioned pipe diameter classification and specific values ​​are only exemplary descriptions of this embodiment. Those skilled in the art can make adaptive adjustments to the pipe diameter distribution and cooling medium parameters of the cooling water channel 7 according to the actual panel size, material and process requirements, all of which fall within the protection scope of this invention.

[0042] In some implementations, such as Figure 3 As shown, the adsorption electrode 1 has several outlets 14 equidistantly spaced at its end. The outlets 14 are connected to the cooling water channel 7, and a sealing plug 15 is provided on each outlet 14.

[0043] Furthermore, the outlet 14 can be sealed by the sealing plug 15. During routine maintenance or when the cooling water channel 7 needs to be dredged and cleaned, the sealing plug 15 at the corresponding position can be removed to flush out the residual scale and impurities in the cooling water channel 7, which facilitates the maintenance of the cooling system and extends the service life of the electrodes.

[0044] In some embodiments, the adsorption electrode 1 is connected to the water-electricity integrated interface 2, which integrates an RF input terminal 21 and a cooling medium input / output terminal 22. The RF input terminal 21 is electrically connected to the adsorption electrode 1 to transmit the RF power output from the RF power supply to the adsorption electrode 1 and to establish a capacitive RF electric field on the adsorption electrode 1. Simultaneously, a plasma sheath layer is generated on the substrate surface, causing it to generate a DC self-bias voltage to control the ion energy and incident direction. The cooling medium input / output terminal 22 is connected to the inlet and outlet of the cooling water channel 7 to circulate the cooling medium (such as cooling water or cooling oil) into the cooling water channel 7.

[0045] Furthermore, the integrated design of the water and electricity interface 2 simplifies the layout of equipment pipelines and lines, while realizing the dual functions of radio frequency power input and electrostatic charge discharge. The charge accumulated on the adsorption electrode 1 can be discharged through the radio frequency input terminal 21 to ground, avoiding electrostatic damage to the micro-nano circuits on the substrate surface.

[0046] In some implementations, such as Figure 6 and Figure 9 As shown, a filter assembly 5 is installed below the inner adsorption region 11 and the outer adsorption region 12, between the adsorption hole 6 and the vacuum adsorption pipe 3. This assembly is used to intercept byproduct particles generated during the plasma treatment process, such as those produced by etching and modification of the substrate surface, preventing these particles from being sucked into the vacuum adsorption pipe 3 and causing blockage. Simultaneously, it prevents plasma within the cavity from diffusing into the vacuum pipe 3 through the adsorption hole, reducing the possibility of secondary arcing. Furthermore, it throttles the flow between the inner and outer adsorption regions, balancing the pumping rate and preventing damage to the product due to excessive suction, ensuring a tight fit between the substrate and the adsorption electrode.

[0047] Furthermore, the filter assembly 5 is composed of multiple layers of honeycomb filter blocks 51 stacked in an alternating manner. Each layer of honeycomb filter block 51 has uniformly distributed airflow holes 52. The airflow holes 52 of adjacent layers are staggered on the vertical projection plane to form a tortuous airflow path. The multi-layer structure constitutes a multi-stage interception structure, and the pore diameter of the airflow holes 52 is smaller than the pore diameter of the adsorption holes 6. In this embodiment, the honeycomb filter blocks 51 are preferably five layers, all of which are plate-shaped structures, and their planar dimensions match the adsorption area of ​​the adsorption electrode 1. Each layer of honeycomb filter block 51 is detachably installed below the adsorption electrode 1, which facilitates periodic removal for cleaning or replacement, further reducing the maintenance cost of the equipment. The horizontal offset between two adjacent layers of honeycomb filter blocks 51 is half a pore spacing, so that the through holes of the upper layer filter block and the airflow holes 52 of the lower layer filter block are staggered on the vertical projection plane. The staggered layout of the airflow holes 52 does not significantly increase the flow resistance of the airflow, ensuring the response speed of vacuum adsorption.

[0048] It should be noted that this staggered and layered structural design allows the airflow to form a meandering path when passing through the multi-layered honeycomb filter blocks 51. When the byproduct particles generated during the plasma treatment process are drawn towards the adsorption pores 6 by the airflow, the byproduct particles are captured by inertial collisions and interception in the meandering path, thereby avoiding blockage of the vacuum adsorption pipe 3 and contamination of the plasma treatment equipment chamber.

[0049] This embodiment provides a plasma processing device including the above-mentioned adsorption pore 6 electrode coupling structure, such as... Figure 1 and Figure 3 As shown, the plasma processing equipment includes a sealed cavity 8, an upper electrode, a gas introduction system, a vacuum system, and an adsorption pore 6 electrode coupling structure as described in this invention.

[0050] Furthermore, the adsorption hole electrode coupling structure is located inside the lower part of the cavity 8, serving as a substrate stage and a lower electrode. The upper electrode is located inside the upper part of the cavity 8, opposite to the adsorption electrode 1. A gas introduction system is used to introduce process gases (such as oxygen, argon, carbon tetrafluoride, etc.) into the cavity 8. A vacuum system is used to evacuate the cavity 8 and maintain the process pressure. The radio frequency power supply is electrically connected to the adsorption electrode 1 through the water-electricity integrated interface 2.

[0051] The working principle of this embodiment: During operation, a large-size ultra-thin panel substrate is placed on the upper surface of the adsorption electrode 1. The vacuum adsorption system is activated, and the substrate is leveled and fixed through independent adsorption in the inner adsorption region 11 and the outer adsorption region 12. The cavity 8 is evacuated to the process pressure using the vacuum system, and then process gas is introduced into the cavity 8 through the gas introduction system. The radio frequency power supply is activated, and radio frequency power is input to the adsorption electrode 1 through the water-electricity integrated interface 2, which excites plasma between the adsorption electrode 1 and the upper electrode to remove the adhesive from the substrate surface. During the process, the cooling medium is circulated into the cooling water channel 7 through the water-electricity integrated interface 2 to control the temperature of the adsorption electrode 1 and the substrate. Byproduct particles generated during the process are intercepted by multi-layer honeycomb filter blocks 51 before passing through the adsorption holes 6, and the clean airflow is discharged through the vacuum adsorption pipe 3. After the process is completed, the radio frequency power supply is turned off, the vacuum adsorption is stopped, and the substrate is removed.

[0052] In summary, the plasma processing equipment of this embodiment is particularly suitable for the plasma adhesive removal process of large-size ultra-thin resin or glass panels in the panel-level packaging (FOPLP) process, and can effectively solve the technical problems of uneven electric field, substrate warping, temperature runaway, electrostatic damage and pipeline blockage that exist in traditional equipment.

[0053] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. An adsorption pore electrode coupling structure, characterized in that, include: The adsorption electrode is electrically connected to the radio frequency power supply to serve as both a vacuum adsorption stage and a radio frequency discharge electrode. A water-electricity integrated interface is symmetrically arranged on the adsorption electrode, which is used to simultaneously connect the cooling medium and the radio frequency power supply; A vacuum adsorption pipe, one end of which is connected to the adsorption electrode, and the other end of which is connected to a vacuum device; An electric field isolation assembly includes an isolation frame and an isolation plate. The isolation frame is installed on the edge of the adsorption electrode to eliminate electric field distortion in the edge region of the adsorption electrode. The isolation plate is disposed below the adsorption electrode for insulating and isolating the adsorption electrode from the cavity of the plasma processing equipment. The filter assembly is located between the adsorption electrode and the vacuum adsorption pipe to intercept byproduct particles generated during plasma treatment. The filter assembly is composed of multiple layers of honeycomb filter blocks stacked in an alternating manner. Each layer of the honeycomb filter block has uniformly distributed airflow holes. The airflow holes of adjacent layers are staggered on the vertical projection plane to form a tortuous airflow path and constitute a multi-stage interception structure.

2. The adsorption pore electrode coupling structure according to claim 1, characterized in that, The surface of the adsorption electrode is divided into an inner adsorption region and an outer adsorption region. The inner adsorption region and the outer adsorption region are sealed and isolated by a sealing ring to form an independent and controllable dual-zone vacuum adsorption structure. The adsorption pressure of the inner adsorption region and the outer adsorption region can be adjusted independently.

3. The adsorption pore electrode coupling structure according to claim 2, characterized in that, Multiple adsorption pores are formed in the inner and outer adsorption regions, and the adsorption pores in each region are evenly distributed in an array to form a negative pressure channel for vacuum adsorption.

4. The adsorption pore electrode coupling structure according to claim 3, characterized in that, The pore size of the adsorption pores varies in a gradient along the surface of the adsorption electrode. The pore size in the region with higher electric field strength is smaller than that in the region with lower electric field strength. The pore size of the adsorption pores is negatively correlated with the local electric field strength.

5. The adsorption pore electrode coupling structure according to claim 1, characterized in that, The adsorption electrode is provided with cooling water channels inside. The cooling water channels are distributed in a meandering manner inside the adsorption electrode, and the diameter of the cooling water channels increases layer by layer from the center to the edge of the adsorption electrode.

6. The adsorption pore electrode coupling structure according to claim 5, characterized in that, The adsorption electrode has several water outlets equidistantly spaced at its end. Each of the water outlets is connected to a cooling water channel and a sealing plug is provided on the water outlet.

7. The adsorption pore electrode coupling structure according to claim 5, characterized in that, The integrated water and electricity interface has a radio frequency input terminal and a cooling medium input / output terminal. The radio frequency input terminal is electrically connected to the adsorption electrode. The cooling medium input / output terminal is connected to the cooling water channel.

8. The adsorption pore electrode coupling structure according to claim 1, characterized in that, The shape of the isolation frame matches the edge contour of the adsorption electrode, and the side of the isolation frame facing the center of the adsorption electrode is provided with an arc transition surface or a slope.

9. The adsorption pore electrode coupling structure according to claim 1, characterized in that, The isolation pressure plate has clearance through holes at the positions corresponding to the vacuum adsorption pipe and the water and electricity integrated interface. The clearance through holes and the vacuum adsorption pipe and the water and electricity integrated interface are filled with insulating and sealing filler.

10. A plasma treatment device, characterized in that, It includes a cavity and an adsorption pore electrode coupling structure disposed within the cavity as described in any one of claims 1-9.

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