Top electrode assembly and semiconductor process equipment

Abstract

The application discloses an upper electrode assembly and a semiconductor process equipment, and belongs to the technical field of semiconductor processing. The disclosed upper electrode assembly is used for a process chamber of a semiconductor process equipment, and comprises a first driving mechanism, a second driving mechanism, a first magnetron and a second magnetron. The first magnetron and the second magnetron are arranged at the top of the process chamber in a spaced mode. The first driving mechanism is connected with the first magnetron, and the second driving mechanism is connected with the second magnetron. The first driving mechanism and the second driving mechanism can respectively and independently drive the first magnetron and the second magnetron to rotate, so as to move close to or away from the center of a target material. The above scheme can solve the problem that the related art upper electrode assembly is prone to reducing product yield.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to an upper electrode assembly and semiconductor process equipment. Background Technology

[0002] In semiconductor manufacturing processes, wafers are typically processed in process chambers of semiconductor process equipment. The upper electrode assembly of the semiconductor process equipment is usually mounted on top of the process chamber. The upper electrode assembly typically includes a magnetron and a drive mechanism that controls the rotation of the magnetron around the center of the target, i.e., around the center of the process chamber.

[0003] When the magnetron is far from the center of the target and rotates under the action of the drive mechanism, a sputtering deposition process can be achieved on the wafer. When the magnetron is close to the center of the target and rotates under the action of the drive mechanism, a process for modifying the film layer deposited on the wafer surface can be achieved. However, at this time, since the magnetic field of the magnetron is mainly distributed in the center of the target, there will be more sputtered particles in the middle of the target than at the edge. As a result, after the wafer modification process, the wafer is prone to having a thicker center and a thinner edge, that is, the film layer thickness on the wafer surface is uneven, which can easily reduce the yield of the product.

[0004] In summary, the upper electrode assembly involved in the relevant technologies has the problem of easily reducing product yield. Summary of the Invention

[0005] This application discloses an upper electrode assembly and semiconductor process equipment to solve the problem that the upper electrode assembly involved in the related technology can easily reduce product yield.

[0006] To solve the above-mentioned technical problems, this application adopts the following technical solution: An upper electrode assembly is used in a process chamber of a semiconductor process equipment. The upper electrode assembly includes a first driving mechanism, a second driving mechanism, a first magnetron, and a second magnetron. The first magnetron and the second magnetron are spaced apart at the top of the process chamber. The first drive mechanism is connected to the first magnetron, and the second drive mechanism is connected to the second magnetron. The first drive mechanism and the second drive mechanism can drive the first magnetron and the second magnetron to rotate, moving closer to or away from the center of the target material, respectively and independently.

[0007] A semiconductor process apparatus includes a process chamber and the upper electrode assembly described above, wherein the upper electrode assembly is mounted in the process chamber.

[0008] The technical solution adopted in this application can achieve the following beneficial effects: In this application, since the first and second magnetrons are spaced apart and positioned at the top of the process chamber, and the first and second driving mechanisms can drive the first and second magnetrons to rotate independently, allowing them to move closer to or further away from the center of the target, a process for modifying the film deposited on the wafer surface can be achieved when one magnetron is close to the center of the target and the other is far away. Furthermore, because the magnetic fields of the first and second magnetrons are distributed between the center and the distance from the center of the target, the sputtered particles are more uniform throughout the target, resulting in a more uniform film thickness on the wafer surface, thereby improving product yield. Therefore, the upper electrode assembly disclosed in this application solves the problem of reduced product yield associated with upper electrode assemblies in related technologies. Attached Figure Description

[0009] Figure 1 and Figure 2 This is a cross-sectional view of the upper electrode assembly disclosed in an embodiment of this application; Figure 3 This is a schematic cross-sectional view of the mating structure of the first drive shaft, the second drive shaft, and the fixed shaft disclosed in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the rotating bracket disclosed in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the first connecting plate or the second connecting plate disclosed in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the upper electrode assembly disclosed in the embodiments of this application when the improved process is carried out; Figure 7 This is a schematic diagram of the upper electrode assembly disclosed in the embodiments of this application during the target cleaning process; Figure 8 This is a schematic diagram of the upper electrode assembly disclosed in the embodiments of this application during the sputtering process.

[0010] Explanation of reference numerals in the attached figures: 100 - Cover body, 110 - Receiving cavity; 200-First drive mechanism, 210-First drive source, 220-First drive shaft, 230-Driven shaft, 231-Second limiting protrusion, 240-First transmission belt, 250-First driving pulley, 260-First driven pulley, 270-Second driving pulley, 280-Second driven pulley, 290-Second transmission belt; 300 - Second drive mechanism, 310 - Second drive source, 320 - Second drive shaft, 330 - Third driving wheel, 340 - Third driven wheel, 350 - Third transmission belt; 410-First magnetron, 420-Second magnetron, 430-Target material, 440-First counterweight, 450-Second counterweight, 460-First support frame, 470-Second support frame; 510-Rotating bracket, 511-Second limiting block, 512-Third limiting block, 513-Inner cavity, 514-First through hole, 515-Second through hole, 520-First connecting plate, 522-First mounting hole, 523-First positioning post, 524-Second mounting hole, 525-Fifth mounting hole, 530-Second connecting plate, 531-First limiting block, 532-Third mounting hole, 533-Second positioning post, 534-Fourth mounting hole, 535-Sixth mounting hole, 540-First sealing seat, 541-First sealing ring, 542-Second sealing ring, 550-Fixed shaft, 560-Second sealing seat, 561-Third sealing ring, 562-Fourth sealing ring; 610-First bearing, 620-First bushing, 630-Second bearing, 640-First stop, 650-Second stop, 660-Third bearing, 670-Third stop, 680-Fourth bearing, 690-Second bushing; 710 - First threaded connector, 720 - Third threaded connector, 730 - Seventh threaded connector, 740 - Eighth threaded connector, 750 - Ninth threaded connector, 760 - Tenth threaded connector, 770 - Eleventh threaded connector; 810 - First seal, 820 - First expansion sleeve, 830 - Second expansion sleeve, 840 - Second seal, 850 - Third seal. Detailed Implementation

[0011] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0012] The upper electrode assembly disclosed in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0013] Please refer to Figures 1-8 This application discloses an upper electrode assembly, which includes a first driving mechanism 200, a second driving mechanism 300, a first magnetron 410, and a second magnetron 420.

[0014] The upper electrode assembly disclosed in this application is used in the process chamber of semiconductor process equipment to facilitate the semiconductor process equipment to process wafers.

[0015] Both the first magnetron 410 and the second magnetron 420 are magnetic components, and the first magnetron 410 and the second magnetron 420 are spaced apart and disposed at the top of the process chamber so that the first magnetron 410 and the second magnetron 420 can both face the target material 430 used for processing the wafer. The first drive mechanism 200 and the second drive mechanism 300 both have drive functions, and the first drive mechanism 200 is connected to the first magnetron 410 so that the first drive mechanism 200 can drive the first magnetron 410 to move. The second drive mechanism 300 is connected to the second magnetron 420 so that the second drive mechanism 300 can drive the second magnetron 420 to move.

[0016] The first driving mechanism 200 and the second driving mechanism 300 can drive the first magnetron 410 and the second magnetron 420 to rotate separately and independently, so that the first magnetron 410 and the second magnetron 420 can move closer to or further away from the center of the target material 430, respectively. That is, the first driving mechanism 200 can drive the first magnetron 410 to move closer to or further away from the center of the target material 430, and the second driving mechanism 300 can drive the second magnetron 420 to move closer to or further away from the center of the target material 430, so that the first magnetron 410 and the second magnetron 420 can rotate independently, that is, they do not constrain each other or affect each other.

[0017] Please refer to Figure 1 and Figure 8 When both the first magnetron 410 and the second magnetron 420 are located far from the center of the target 430, this application rotates both the first magnetron 410 and the second magnetron 420 around the center line of the target 430 (specifically, this can be achieved through the rotating support 510 described later) to facilitate a more uniform sputtering deposition process on the wafer. At the same time, since both the first magnetron 410 and the second magnetron 420 can control the sputtering of particles on the target 430, this application has a relatively higher sputtering rate compared to conventional solutions that use a single magnetron for sputtering. That is, the particle deposition rate on the wafer surface is relatively fast per unit time. Therefore, for depositing the same film thickness on the wafer, this application requires a relatively shorter deposition time during the sputtering deposition process, which can help improve the productivity of semiconductor process equipment.

[0018] Optionally, to further improve sputtering deposition efficiency, this application can make the magnetic field strength generated by the first magnetron 410 and the second magnetron 420 both higher, so that the magnetic field generated by the first magnetron 410 and the second magnetron 420 can cover the entire surface of the target material 430, so as to improve the sputtering uniformity of the wafer while improving the sputtering deposition efficiency.

[0019] Please refer to Figure 6 When one of the first magnetron 410 and the second magnetron 420 is close to the center of the target 430 and the other is far away from the center of the target 430, that is, when one of the first magnetron 410 and the second magnetron 420 is close to the center of the target 430 and the other is far away from the center of the target 430, the magnetic field generated by the first magnetron 410 and the second magnetron 420 is distributed between the center and the edge of the target 430. At this time, even if the magnetic field strength generated by the first magnetron 410 and the second magnetron 420 is low, by rotating the first magnetron 410 and the second magnetron 420 around the center line of the target 430, the magnetic field generated by the first magnetron 410 and the second magnetron 420 can cover the entire surface of the target 430. This makes the sputtered particles from all parts of the target 430 more uniform, thereby improving the process effect of modifying the film layer deposited on the wafer surface. In addition, this setup can make the film thickness more uniform across the wafer surface, which can improve product yield.

[0020] Optionally, in the process of modifying the film deposited on the wafer surface, this application can apply a lower power to the target 430 than that used in the sputtering deposition process, i.e., apply a lower power, so that the target 430 can sputter a small amount of metal particles, such as Cu, Ta, Al, and W particles. By extending the process time, a more uniform modification process can be achieved on the film deposited on the wafer surface, i.e., the film thickness is more uniform throughout the wafer surface, thereby improving the product yield. Of course, in other embodiments, the power applied to the target 430 in this application can also be equal to or greater than the power used in the sputtering deposition process, i.e., apply a higher power, thereby improving process efficiency.

[0021] Please refer to Figure 7 When both the first magnetron 410 and the second magnetron 420 are positioned close to the center of the target 430, this application allows both magnetrons 410 and 420 to rotate around the centerline of the target 430, thereby facilitating a more uniform cleaning process on the target 430. Optionally, to further improve cleaning efficiency, this application can make the magnetic field strength generated by the first magnetron 410 and the second magnetron 420 both higher, so that the magnetic field generated by the first magnetron 410 and the second magnetron 420 can cover the entire surface of the target 430, thereby improving both cleaning efficiency and the uniformity of cleaning the target 430.

[0022] Optionally, in the process of cleaning the target 430, this application can apply a higher power to the target 430 than that used in the sputtering deposition process, i.e., apply a higher power, so that the ionized argon ions can rapidly bombard the target 430, causing the loose metal film and metal nitride film on the target 430 to fall onto a dummy wafer with a similar size and shape to the wafer, thereby achieving a rapid cleaning effect on the target 430. Simultaneously, since both the first magnetron 410 and the second magnetron 420 are located close to the center of the target 430, the magnetic fields generated by the first magnetron 410 and the second magnetron 420 are superimposed near the center of the target 430, thereby ionizing more argon ions, further shortening the cleaning time of the target 430, and thus increasing the throughput of the semiconductor process equipment. Of course, in other embodiments, the power applied to the target 430 in this application can also be equal to or less than the power used in the sputtering deposition process.

[0023] Optionally, in the above-mentioned sputtering deposition, film modification and cleaning of target 430 processes, the magnetic field strength generated by the first magnetron 410 and the second magnetron 420 can be the same or different. This application embodiment does not impose specific limitations on this.

[0024] In this application, since the first magnetron 410 and the second magnetron 420 are spaced apart and disposed at the top of the process chamber, and the first driving mechanism 200 and the second driving mechanism 300 can drive the first magnetron 410 and the second magnetron 420 to rotate independently, so that the first magnetron 410 and the second magnetron 420 can move closer to or further away from the center of the target 430, when one of the first magnetron 410 and the second magnetron 420 is close to the center of the target 430 and the other is far away from the center of the target 430, a process for modifying the film layer deposited on the wafer surface can be realized. Simultaneously, since the magnetic fields of the first magnetron 410 and the second magnetron 420 are distributed between the center and the distance from the center of the target 430, the sputtered particles at all points on the target 430 are relatively uniform, and correspondingly, the film layer thickness at all points on the wafer surface is relatively uniform, thereby improving the product yield. Therefore, the upper electrode assembly disclosed in this application can solve the problem that upper electrode assemblies in related technologies easily reduce product yield.

[0025] Furthermore, in this application, since the positions of the first magnetron 410 and the second magnetron 420 can be controlled by the first drive mechanism 200 and the second drive mechanism 300 respectively, the first magnetron 410 and the second magnetron 420 can be combined to form more motion trajectories, thereby meeting more process requirements.

[0026] Alternatively, please refer to Figures 1 to 3The first drive mechanism 200 may include a first drive shaft 220, and the second drive mechanism 300 may include a second drive shaft 320. Both the first drive shaft 220 and the second drive shaft 320 have a driving function. The first drive shaft 220 is sleeved on the second drive shaft 320, and the first drive shaft 220 and the second drive shaft 320 can rotate relative to each other. The first end of the first drive shaft 220 is connected to the first magnetron 410 to drive the first magnetron 410 to rotate, and the first end of the second drive shaft 320 is connected to the second magnetron 420 to drive the second magnetron 420 to rotate.

[0027] In this embodiment, since the first drive shaft 220 is sleeved on the second drive shaft 320, and the first drive shaft 220 and the second drive shaft 320 can rotate relative to each other, that is, the first drive shaft 220 and the second drive shaft 320 do not affect each other. This allows the first magnetron 410 and the second magnetron 420 to rotate independently. Simultaneously, this arrangement improves the structural compactness of the first drive mechanism 200 and the second drive mechanism 300, thereby reducing the overall space occupied by the first drive shaft 220 and the second drive shaft 320. Of course, in other embodiments, the first drive shaft 220 and the second drive shaft 320 may not have a sleeved relationship; that is, the first drive shaft 220 and the second drive shaft 320 may be spaced apart.

[0028] Optionally, since the first drive shaft 220 is sleeved outside the second drive shaft 320, in order to facilitate the relative rotation between the first drive shaft 220 and the second drive shaft 320, a first bearing 610 is provided between the first drive shaft 220 and the second drive shaft 320. Specifically, the first bearing 610 is sleeved outside the second drive shaft 320, and in the axial direction of the first drive shaft 220 and the second drive shaft 320, the first bearing 610 is limited to the first drive shaft 220 and the second drive shaft 320, which makes it easier to realize the relative rotation between the first drive shaft 220 and the second drive shaft 320.

[0029] Optionally, to facilitate the first bearing 610 being positioned between the first drive shaft 220 and the second drive shaft 320 along their axial directions, a first limiting protrusion may be provided on the opposing surfaces of the first drive shaft 220 and the second drive shaft 320. The first limiting protrusion can limit the first bearing 610. Of course, this embodiment does not impose specific limitations on this.

[0030] Optionally, the number of first bearings 610 can be at least two, with each first bearing 610 spaced apart axially from the first drive shaft 220 and the second drive shaft 320, making it easier for the first drive shaft 220 and the second drive shaft 320 to rotate relative to each other. Optionally, each first bearing 610 can be spaced apart by a first bushing 620, that is, the first bushing 620 is sleeved on the second drive shaft 320, and the first bushing 620 can space apart two adjacent first bearings 610, that is, limit two adjacent first bearings 610. This limiting method is relatively simple, and there is no need to provide too many first limiting protrusions on the opposing surfaces of the first drive shaft 220 and the second drive shaft 320, so as to simplify the structural complexity of the first drive shaft 220 and the second drive shaft 320.

[0031] Optionally, the upper electrode assembly may further include a cover 100, which is connected to the target 430 to form a receiving cavity 110, i.e., the receiving cavity 110 is a closed space. The first magnetron 410 and the second magnetron 420 are spaced apart within the receiving cavity 110 so that the first magnetron 410 and the second magnetron 420 face the target 430. At the same time, the cover 100 can protect the first magnetron 410 and the second magnetron 420. The first end of the first drive shaft 220 can pass through the cover 100 and be connected to the first magnetron 410. The first end of the second drive shaft 320 can pass through the cover 100 and be connected to the second magnetron 420. In this case, the cover 100 can provide a mounting base for the first drive shaft 220, the second drive shaft 320, the first magnetron 410, and the second magnetron 420.

[0032] In this embodiment, the receiving cavity 110 may be filled with cooling water, such as deionized water, for cooling the target 430 during the process, to prevent the target 430 from being affected by excessively high temperature, thus ensuring the process effect. Of course, in other embodiments, the upper electrode assembly may not include the cover 100, or the upper electrode assembly may include the cover 100, and the receiving cavity 110 may not be filled with cooling water.

[0033] Optionally, the first drive mechanism 200 may further include a first drive source 210 and a first transmission component. The first drive source 210 is connected to the first drive shaft 220 so that the first drive source 210 can provide driving force to the first drive shaft 220. The second drive mechanism 300 may further include a second drive source 310 and a second transmission component. The second drive source 310 is connected to the second drive shaft 320 so that the second drive source 310 can provide driving force to the second drive shaft 320. The first drive source 210 and the second drive source 310 are spaced apart outside the cover 100 to facilitate heat dissipation of the first drive source 210 and the second drive source 310.

[0034] The first transmission assembly and the second transmission assembly are spaced apart within the receiving cavity 110. The first end of the first drive shaft 220 is connected to the first magnetron 410 through the first transmission assembly. That is, the first drive source 210, the first drive shaft 220 and the first transmission assembly are connected in sequence. The first end of the second drive shaft 320 is connected to the second magnetron 420 through the second transmission assembly. That is, the second drive source 310, the second drive shaft 320 and the second transmission assembly are connected in sequence. Since the first transmission assembly and the second transmission assembly are spaced apart within the receiving cavity 110, this facilitates the spaced arrangement of the first magnetron 410 and the second magnetron 420 without affecting each other.

[0035] In this embodiment, the first transmission component can output a relatively stable driving force to the first magnetron 410 to ensure the motion stability of the first magnetron 410, and the second transmission component can output a relatively stable driving force to the second magnetron 420 to ensure the motion stability of the second magnetron 420. Of course, in other embodiments, the first drive mechanism 200 may not include the first transmission component. In this case, the first end of the first drive shaft 220 can be directly connected to the first magnetron 410, and the second drive mechanism 300 may not include the second transmission component. In this case, the first end of the second drive shaft 320 can be directly connected to the second magnetron 420.

[0036] Optionally, the upper electrode assembly may further include a rotating bracket 510, which is rotatably disposed within the receiving cavity 110, and the rotation axis of the rotating bracket 510 coincides with the center line of the target material 430. The first transmission component and the second transmission component are both rotatably disposed on the rotating bracket 510, that is, the first transmission component and the second transmission component can both rotate relative to the rotating bracket 510, and the two are spaced apart, so that the first transmission component can drive the first magnetron 410 to rotate and move closer to or away from the center of the target material 430, and the second transmission component can drive the second magnetron 420 to rotate and move closer to or away from the center of the target material 430.

[0037] During the rotation of the rotating support 510, the rotating support 510 can drive the first magnetron 410 to rotate around the center line of the target 430 via the first transmission component, and can drive the second magnetron 420 to rotate around the center line of the target 430 via the second transmission component. This allows the first magnetron 410 and the second magnetron 420 to move away from or closer to the center of the target 430, while the rotating support 510 enables the first magnetron 410 and the second magnetron 420 to rotate simultaneously around the center line of the target 430. This further ensures the sputtering deposition and modification effect on the wafer, as well as the cleaning effect on the target 430. Of course, in other embodiments, the upper electrode assembly may not include the rotating support 510.

[0038] Alternatively, please refer to Figure 1 and Figure 5 The upper electrode assembly may further include a first connecting plate 520. The first transmission assembly is connected to the first magnetron 410 through the first connecting plate 520. Specifically, the first transmission assembly and the first connecting plate 520 can be connected through a first threaded connector 710. That is, one end of the first threaded connector 710 passes through the first mounting hole 522 on the first connecting plate 520 and is connected to the first transmission assembly (specifically, to the driven shaft 230 of the first transmission assembly, as described later). Optionally, to facilitate the connection between the first transmission assembly and the first connecting plate 520, a first positioning post 523 may protrude from the first connecting plate 520. The first positioning post 523 engages with the first positioning hole on the first transmission assembly (specifically, the driven shaft 230 of the first transmission assembly, as described later) to facilitate the connection between the first transmission assembly and the first connecting plate 520.

[0039] The first connecting plate 520 and the first magnetron 410 can be connected via a second threaded connector. One end of the second threaded connector passes through the second mounting hole 524 on the first connecting plate 520 and connects to the first magnetron 410. The first magnetron 410 is eccentrically positioned relative to the first connecting plate 520. During the movement of the first connecting plate 520 driven by the first transmission assembly, the eccentric positioning of the first magnetron 410 relative to the first connecting plate 520 facilitates its movement closer to or further from the center of the target material 430. Simultaneously, the first connecting plate 520 enhances the stability of the first magnetron 410's placement. Of course, in other embodiments, the upper electrode assembly may not include the first connecting plate 520.

[0040] Alternatively, please refer to Figure 1 and Figure 5 The upper electrode assembly may further include a second connecting plate 530. The second transmission assembly is connected to the second magnetron 420 through the second connecting plate 530. Specifically, the second transmission assembly and the second connecting plate 530 can be connected through a third threaded connector 720. One end of the third threaded connector 720 passes through a third mounting hole 532 on the second connecting plate 530 and is connected to the second transmission assembly (specifically, to the driven shaft 230 of the second transmission assembly, described later). Optionally, to facilitate the connection between the second transmission assembly and the second connecting plate 530, a second positioning post 533 may protrude from the second connecting plate 530. The second positioning post 533 engages with a second positioning hole on the second transmission assembly (specifically, the driven shaft 230 of the second transmission assembly, described later) to facilitate the connection between the second transmission assembly and the second connecting plate 530.

[0041] The second connecting plate 530 and the second magnetron 420 can be connected via a fourth threaded connector. One end of the fourth threaded connector passes through the fourth mounting hole 534 on the second connecting plate 530 and connects to the second magnetron 420. The second magnetron 420 is eccentrically positioned relative to the second connecting plate 530. During the movement of the second connecting plate 530 driven by the second transmission assembly, the eccentric positioning of the second magnetron 420 relative to the second connecting plate 530 facilitates its movement closer to or further from the center of the target material 430. Simultaneously, the second connecting plate 530 enhances the stability of the second magnetron 420's placement. Of course, in other embodiments, the upper electrode assembly may not include the second connecting plate 530.

[0042] Alternatively, please refer to Figure 1 and Figures 5 to 8 To facilitate force balance on the first connecting plate 520, the upper electrode assembly may further include a first counterweight 440. The first counterweight 440 is eccentrically positioned relative to the first connecting plate 520, and the first counterweight 440 and the first magnetron 410 are respectively located on both sides of the first connecting plate 520. This facilitates force balance on the first connecting plate 520, enabling stable movement of the first connecting plate 520 under the action of the first transmission assembly. Consequently, the first magnetron 410 can rotate stably, ensuring that the distance between all points of the first magnetron 410 and the target material 430 is equal. Of course, in other embodiments, the upper electrode assembly may not include the first counterweight 440.

[0043] Optionally, the first connecting plate 520 and the first counterweight 440 can be connected via a fifth threaded connector, wherein one end of the fifth threaded connector passes through the fifth mounting hole 525 on the first connecting plate 520 and is connected to the first counterweight 440. Of course, this embodiment does not impose specific limitations on this.

[0044] Alternatively, please refer to Figure 1 and Figures 5 to 8 To facilitate force balance on the second connecting plate 530, the upper electrode assembly may further include a second counterweight 450. The second counterweight 450 is eccentrically positioned relative to the second connecting plate 530, and the second counterweight 450 and the second magnetron 420 are respectively located on both sides of the second connecting plate 530. This ensures force balance on the second connecting plate 530, allowing for stable movement of the second connecting plate 530 under the action of the second transmission assembly. Consequently, the second magnetron 420 can rotate stably, ensuring that the distance between all points of the second magnetron 420 and the target material 430 is equal. Of course, in other embodiments, the upper electrode assembly may not include the second counterweight 450.

[0045] Optionally, the second connecting plate 530 and the second counterweight 450 can be connected via a sixth threaded connector, wherein one end of the sixth threaded connector passes through the sixth mounting hole 535 on the second connecting plate 530 and is connected to the second counterweight 450. Of course, this embodiment does not impose specific limitations on this.

[0046] Optionally, this application can drive the rotating bracket 510 to rotate via a third driving mechanism, thereby achieving the effect of the first magnetron 410 and the second magnetron 420 rotating around the center line of the target material 430.

[0047] In another embodiment, please refer to Figure 4 and Figure 5 One of the first connecting plate 520 and the second connecting plate 530 is provided with a first limiting block 531 on the side facing the rotating bracket 510, and the rotating bracket 510 is provided with a second limiting block 511. During the rotation of one of the first connecting plate 520 and the second connecting plate 530, that is, during the process of one of the first connecting plate 520 and the second connecting plate 530 driving the corresponding first magnetron 410 or second magnetron 420 to approach or move away from the center of the target material 430, the first limiting block 531 and the second limiting block 511 limit each other so that one of the first connecting plate 520 and the second connecting plate 530 drives the rotating bracket 510 to rotate through the first limiting block 531 and the second limiting block 511.

[0048] Therefore, in this embodiment, the first connecting plate 520 and the second connecting plate 530 can not only drive the corresponding first magnetron 410 or second magnetron 420 to rotate independently, but also drive the rotating bracket 510 to rotate, thereby driving the corresponding first magnetron 410 or second magnetron 420 to rotate around the center line of the target material 430. That is, this application can achieve the effect of driving the rotating bracket 510 to be rotatably disposed in the receiving cavity 110 by using only one of the existing first connecting plate 520 and second connecting plate 530, which can simplify the structural complexity to a certain extent. Of course, the first connecting plate 520 and the second connecting plate 530 can also drive the rotating bracket 510 to rotate simultaneously.

[0049] Alternatively, please refer to Figure 5The rotating bracket 510 may also be provided with a third limiting block 512. The third limiting block 512 is spaced apart from the second limiting block 511. When one of the first connecting plate 520 and the second connecting plate 530 drives the first magnetron 410 or the second magnetron 420 to approach the center of the target material 430, the first limiting block 531 and the second limiting block 511 are engaged in a limiting cooperation. At this time, one of the first connecting plate 520 and the second connecting plate 530 stops rotating relative to the rotating bracket 510, and the first magnetron 410 or the second magnetron 420 stops rotating relative to the rotating bracket 510 and is in a position close to the center of the target material 430.

[0050] Since the first limiting block 531 and the second limiting block 511 are in a limiting engagement, under the driving action of one of the first transmission components and the second transmission components, one of the first connecting plate 520 and the second connecting plate 530 can be driven by the limiting action of the first limiting block 531 and the second limiting block 511 to drive the rotating bracket 510 to rotate around the center line of the target material 430 in the first direction. At this time, the rotating bracket 510 can drive the first magnetron 410 and the second magnetron 420 to rotate around the center line of the target material 430 in the first direction.

[0051] When one of the first connecting plate 520 and the second connecting plate 530 drives the first magnetron 410 or the second magnetron 420 away from the center of the target material 430, the first limiting block 531 and the third limiting block 512 engage in a limiting cooperation. At this time, one of the first connecting plate 520 and the second connecting plate 530 stops rotating relative to the rotating bracket 510, and the first magnetron 410 or the second magnetron 420 stops rotating relative to the rotating bracket 510 and is located away from the center of the target material 430. Since the first limiting block 531 and the third limiting block 512 are in a limiting engagement, under the driving action of one of the first transmission components and the second transmission components, one of the first connecting plate 520 and the second connecting plate 530 can be driven by the limiting action of the first limiting block 531 and the third limiting block 512 to drive the rotating bracket 510 to rotate around the center line of the target material 430 in a second direction, which is opposite to the first direction. At the same time, the rotating bracket 510 can drive the first magnetron 410 and the second magnetron 420 to rotate around the center line of the target material 430 in the second direction.

[0052] Therefore, in this embodiment, the first limiting block 531, through its limiting cooperation with the second limiting block 511 and the third limiting block 512, can stop the first magnetron 410 or the second magnetron 420 from rotating at different positions, thereby achieving different process types. Simultaneously, it can cause the rotating support 510 to rotate in different directions, thus enabling the rotating support 510 to drive the first magnetron 410 and the second magnetron 420 to rotate around the center line of the target material 430 in different directions, ensuring the process effects of different process types. Of course, in other embodiments, the rotating support 510 may not have the third limiting block 512.

[0053] Optionally, the rotating bracket 510 has an inner cavity 513 and is provided with a first through hole 514 and a second through hole 515 spaced apart. At least one of the first end of the first drive shaft 220 and the first end of the second drive shaft 320 passes through the first through hole 514 and extends into the inner cavity 513. At least one of the first transmission assembly and the second transmission assembly includes a driven shaft 230. The driven shaft 230 is rotatably disposed in the second through hole 515 and is connected to the first magnetron 410 or the second magnetron 420. The first through hole 514 and the second through hole 515 are connected through the inner cavity 513 so that at least one of the first end of the first drive shaft 220 and the first end of the second drive shaft 320 is connected to the driven shaft 230, thereby facilitating the driven shaft 230 to drive the first magnetron 410 or the second magnetron 420 to rotate.

[0054] In this embodiment, since the driven shaft 230 is rotatably disposed within the second through hole 515, i.e., the driven shaft 230 is located within the rotating bracket 510, at least one of the first transmission assembly and the second transmission assembly is located within the rotating bracket 510. This can, to some extent, improve the structural compactness of the first transmission assembly and the at least one of the second transmission assembly and the rotating bracket 510, thereby reducing the space occupied by the first transmission assembly and the at least one of the second transmission assembly and the rotating bracket 510 as a whole. Of course, in other embodiments, the driven shaft 230 may also be rotatably disposed outside the second through hole 515, i.e., outside the rotating bracket 510.

[0055] Optionally, to facilitate the connection between at least one of the first end of the first drive shaft 220 and the first end of the second drive shaft 320 and the driven shaft 230, a first meshing tooth may be provided on the first end of the first drive shaft 220 and the first end of the second drive shaft 320, and a second meshing tooth may be provided on the driven shaft 230. The first meshing tooth and the second meshing tooth mesh together so that at least one of the first end of the first drive shaft 220 and the first end of the second drive shaft 320 can drive the driven shaft 230 to rotate.

[0056] In another embodiment, at least one of the first transmission assembly and the second transmission assembly may further include a first transmission belt 240. The first transmission belt 240 is sleeved on the first drive shaft 220 and the driven shaft 230, or the first transmission belt 240 is sleeved on the second drive shaft 320 and the driven shaft 230. That is, the first transmission belt 240 transmits force between the first drive shaft 220 and the driven shaft 230, or the first transmission belt 240 transmits force between the second drive shaft 320 and the driven shaft 230. Since the first transmission belt 240 is sleeved on the first drive shaft 220 or the second drive shaft 320 and the driven shaft 230, this ensures the stability of the first transmission belt 240, thereby ensuring that the first transmission belt 240 can stably transmit force during long-term operation. At the same time, since the first transmission belt 240 is located in the inner cavity 513, this can further reduce the space occupied by at least one of the first transmission assembly and the second transmission assembly and the rotating bracket 510 as a whole.

[0057] Optionally, to facilitate the rotatable mounting of the driven shaft 230 in the second through hole 515, the driven shaft 230 can be rotatably engaged with the second through hole 515 via at least two second bearings 630, i.e., rotatably engaged with the rotating bracket 510. Specifically, the at least two second bearings 630 are spaced apart and sleeved on the driven shaft 230, and one of the at least two second bearings 630 can be positioned near one end of the driven shaft 230, while the other of the at least two second bearings 630 can be positioned near the other end of the driven shaft 230, thereby realizing relative rotation between the driven shaft 230 and the rotating bracket 510. At the same time, the at least two second bearings 630 make it easier for the driven shaft 230 to rotate relative to the rotating bracket 510.

[0058] Optionally, to prevent the at least two second bearings 630 and the driven shaft 230 from detaching from the second through hole 515, the upper electrode assembly may further include a first stop 640 and a second stop 650. The first stop 640 is connected to the outer surface of the rotating bracket 510 and is used to restrict the second bearing 630 located near the end of the driven shaft 230, thereby preventing the second bearing 630 from detaching from the second through hole 515. The second stop 650 is connected to one end of the driven shaft 230 via a seventh threaded connector 730. Furthermore, the second stop 650 and the second bearing 630 are engaged in an axial upper limit fit with the driven shaft 230 to prevent the driven shaft 230 from falling out of the second through hole 515; the other end of the driven shaft 230 is located outside the rotating bracket 510, and a second limiting protrusion 231 protrudes from the other end of the driven shaft 230 in the circumferential direction. The second limiting protrusion 231 engages with the outer surface of the rotating bracket 510 to limit the driven shaft 230 from falling out of the second through hole 515 under the action of the second limiting protrusion 231 and the second stop 650. Optionally, to simplify the structural complexity, the second limiting protrusion 231 can be used to limit the second bearing 630 located near the other end of the driven shaft 230 to prevent the second bearing 630 from falling out of the second through hole 515.

[0059] Optionally, at least one of the first transmission assembly and the second transmission assembly may further include a first driving wheel 250 and a first driven wheel 260. The first driving wheel 250 is rotatably disposed in the first through hole 514 and connected to the first drive shaft 220 or the second drive shaft 320. The first driven wheel 260 is sleeved on the driven shaft 230 and connected to the driven shaft 230. Specifically, the first driven wheel 260 and the driven shaft 230 can be connected by a flat key. Specifically, one of the first driven wheel 260 and the driven shaft 230 may have a protruding flat key, and the other of the first driven wheel 260 and the driven shaft 230 may have a groove. The groove cooperates with the flat key to connect the first driven wheel 260 and the driven shaft 230. At the same time, the cooperation between the groove and the flat key can make the first driven wheel 260 transmit force to the driven shaft 230 more reliably.

[0060] The first transmission belt 240 is sleeved on the first driving pulley 250 and the first driven pulley 260. The first driving pulley 250 and the first driven pulley 260 can cooperate more reliably with the first transmission belt 240, thereby reducing transmission losses and increasing the linear speed of the first transmission belt 240. This, in turn, increases the rotational speed of the first magnetron 410 or the second magnetron 420 corresponding to the driven shaft 230 via the driven shaft 230, so that the first magnetron 410 or the second magnetron 420 can rotate to the process position more quickly. Of course, in other embodiments, the first transmission assembly and the second transmission assembly may not include the first driving pulley 250 and the first driven pulley 260.

[0061] Optionally, when both the first transmission assembly and the second transmission assembly include a first driving wheel 250 and a first driven wheel 260, to facilitate the connection between the first driving wheel 250 of the first transmission assembly and the first drive shaft 220, the first driving wheel 250 of the first transmission assembly and the first drive shaft 220 can be connected by an eighth threaded connector 740, and a first seal 810 can be provided between the first driving wheel 250 of the first transmission assembly and the first drive shaft 220. The first seal 810 can prevent cooling water from entering between the first drive shaft 220 and the second drive shaft 320, thereby avoiding safety problems such as electrical short circuits; to facilitate the connection between the first driving wheel 250 of the second transmission assembly and the second drive shaft 320, the first driving wheel 250 of the second transmission assembly and the second drive shaft 320 can be connected by a first tightening sleeve 820.

[0062] Optionally, to facilitate the rotation of the first drive wheel 250 relative to the rotating bracket 510, a third bearing 660 may be provided between the first drive wheel 250 and the rotating bracket 510. The third bearing 660 is sleeved on the outside of the first drive wheel 250, thereby facilitating the relative rotation of the first drive wheel 250 and the rotating bracket 510. Optionally, to prevent the third bearing 660 from falling off the rotating bracket 510, the upper electrode assembly may also include a third stop 670, which is connected to the outer surface of the rotating bracket 510 to restrict the movement of the third bearing 660, thereby preventing the third bearing 660 from falling off the rotating bracket 510.

[0063] Alternatively, please refer to Figure 2 The upper electrode assembly may also include a first sealing seat 540. The first sealing seat 540 may include a first sealing ring 541 sleeved between the second drive shaft 320 and the first drive wheel 250 of the first transmission assembly, and a second sealing ring 542 sleeved between the second drive shaft 320 and the first drive wheel 250 of the second transmission assembly. The first sealing ring 541 can rotate relative to the second drive shaft 320 and the first drive wheel 250 of the first transmission assembly, and the second sealing ring 542 can rotate relative to the first sealing ring 541, and the two are sealed together.

[0064] In this embodiment, the first sealing ring 541 ensures the sealing between the second drive shaft 320 and the first drive wheel 250 of the first transmission assembly, and the second sealing ring 542 ensures the sealing between the second drive shaft 320 and the first drive wheel 250 of the second transmission assembly. The contact between the first sealing ring 541 and the second sealing ring 542 further achieves a rotary seal effect. This arrangement can further improve the sealing between the second drive shaft 320 and the first drive wheel 250 of the first transmission assembly, as well as between the second drive shaft 320 and the first drive wheel 250 of the second transmission assembly, thereby preventing cooling water from entering between the second drive shaft 320 and the first drive wheel 250 of the first transmission assembly, and further preventing cooling water from entering between the first drive shaft 220 and the second drive shaft 320, thus further preventing safety problems such as electrical short circuits. Of course, in other embodiments, the upper electrode assembly may not include the first sealing seat 540, or the first sealing ring 541 and the second sealing ring 542 may be arranged alternately.

[0065] Optionally, the number of the second through holes 515 can be at least two, and each second through hole 515 can be spaced apart and located on both sides of the first through hole 514. Both the first transmission assembly and the second transmission assembly can include a driven shaft 230, a first transmission belt 240, a first driving pulley 250, and a first driven pulley 260. The driven shaft 230 of the first transmission assembly and the driven shaft 230 of the second transmission assembly are rotatably disposed within different second through holes 515. The driven shaft 230 of the first transmission assembly is connected to the first magnetron 410, and the driven shaft 230 of the second transmission assembly is connected to the second magnetron 420. The first driving pulley 250 of the first transmission assembly and the first driving pulley 250 of the second transmission assembly are spaced apart and rotatably disposed within the same first through hole 514. Optionally, the arrangement direction of the first driving pulley 250 of the first transmission assembly and the first driving pulley 250 of the second transmission assembly can be parallel to the extension direction of the centerline of the target material 430.

[0066] Optionally, the length of the second drive shaft 320 can be greater than the length of the first drive shaft 220, so that the first end of the second drive shaft 320 can pass through the first through hole 514 and extend into the inner cavity 513, while the first end of the first drive shaft 220 can face the first through hole 514 but not extend into the inner cavity 513. Of course, the first end of the first drive shaft 220 can also extend into the inner cavity 513. It should be noted that the length of the part of the second drive shaft 320 located in the inner cavity 513 can be greater than the length of the part of the first drive shaft 220 located in the inner cavity 513.

[0067] The first drive wheel 250 of the first transmission assembly is rotatably sleeved on the second drive shaft 320 and connected to the first drive shaft 220 through the aforementioned eighth threaded connector 740. The first driven wheel 260 of the first transmission assembly is sleeved on the driven shaft 230 of the first transmission assembly and connected to the driven shaft 230 of the first transmission assembly. The first transmission belt 240 of the first transmission assembly is sleeved on the first drive wheel 250 and the first driven wheel 260 of the first transmission assembly, so that the first drive shaft 220 drives the first magnetron 410 to rotate and move closer to or away from the center of the target material 430 through the first drive wheel 250, the first transmission belt 240, the first driven wheel 260 and the driven shaft 230 of the first transmission assembly in sequence.

[0068] Similarly, the first driving wheel 250 of the second transmission assembly is sleeved on the second drive shaft 320 and connected to the second drive shaft 320 via the aforementioned first tightening sleeve 820. The first driven wheel 260 of the second transmission assembly is sleeved on the driven shaft 230 of the second transmission assembly and connected to the driven shaft 230 of the second transmission assembly. The first transmission belt 240 of the second transmission assembly is sleeved on the first driving wheel 250 and the first driven wheel 260 of the second transmission assembly, so that the second drive shaft 320 can drive the second magnetron 420 to rotate and move closer to or away from the center of the target material 430 via the first driving wheel 250, the first transmission belt 240, the first driven wheel 260, and the driven shaft 230 of the second transmission assembly in sequence. Of course, in other embodiments, only one of the above-mentioned first transmission assembly and second transmission assembly may include the driven shaft 230, the first transmission belt 240, the first driving wheel 250, and the first driven wheel 260.

[0069] Optionally, the first drive mechanism 200 may further include a third transmission assembly. The third transmission assembly may include a second driving wheel 270, a second driven wheel 280, and a second transmission belt 290. The second driving wheel 270 is connected to the first drive source 210. The second driven wheel 280 is rotatably sleeved on the second end of the second drive shaft 320 and connected to the second end of the first drive shaft 220, specifically through a ninth threaded connector 750. The second transmission belt 290 is sleeved on the second driving wheel 270 and the second driven wheel 280, so that the first drive source 210 can stably drive the first drive shaft 220 to rotate via the third transmission assembly, thereby stably driving the first magnetron 410 to rotate. Of course, in other embodiments, the first drive source 210 and the first drive shaft 220 may be connected via a first gear set.

[0070] Optionally, the second drive mechanism 300 may further include a fourth transmission assembly. The fourth transmission assembly may include a third driving wheel 330, a third driven wheel 340, and a third transmission belt 350. The third driving wheel 330 is connected to the second drive source 310, and the third driven wheel 340 is fixedly sleeved on the second end of the second drive shaft 320. Specifically, this fixed connection can be achieved through a second tightening sleeve 830. The second transmission belt 290 is sleeved on the third driving wheel 330 and the third driven wheel 340, so that the second drive source 310 can stably drive the second drive shaft 320 to rotate through the fourth transmission assembly, thereby stably driving the second magnetron 420 to rotate. Of course, in other embodiments, the second drive source 310 and the second drive shaft 320 may be connected via a second gear set.

[0071] Optionally, the upper electrode assembly may further include a fixed shaft 550, which is connected to and sealed to the cover 100. Specifically, the fixed shaft 550 can be connected to the cover 100 via a tenth threaded connector 760, and a second seal 840 can be provided between the fixed shaft 550 and the cover 100 to prevent cooling water leakage. The fixed shaft 550 is sleeved on the first drive shaft 220, and the first drive shaft 220 and the fixed shaft 550 are mutually restrictive in the axial direction of the first drive shaft 220. The second drive shaft 320 is also mutually restrictive in the first drive shaft 220.

[0072] In this embodiment, the fixed shaft 550 protects the first drive shaft 220 and the second drive shaft 320. Simultaneously, the fixed shaft 550 securely mounts the first drive shaft 220 and the second drive shaft 320 in a designated position to prevent them from moving relative to the cover 100 during the process. Of course, in other embodiments, the upper electrode assembly may not include the fixed shaft 550.

[0073] Optionally, the first end of the fixed shaft 550 passes through the cover 100 and extends into the receiving cavity 110, so that the fixed shaft 550 can be more stably positioned on the cover 100, thereby further improving the assembly stability of the fixed shaft 550 and the cover 100. Of course, in other embodiments, the first end of the fixed shaft 550 may also be located outside the receiving cavity 110.

[0074] Optionally, the upper electrode assembly may further include a second sealing seat 560, which is sleeved between the first end of the fixed shaft 550 and the first drive shaft 220. The second sealing seat 560 includes a third sealing ring 561 connected to the fixed shaft 550 and a fourth sealing ring 562 connected to the first drive shaft 220. The fixed shaft 550 and the third sealing ring 561 can be connected by an eleventh threaded connector 770. A third sealing element 850 may be provided between the fixed shaft 550 and the third sealing ring 561 to prevent cooling water from entering between the fixed shaft 550 and the third sealing ring 561.

[0075] In this embodiment, the fourth sealing ring 562 is rotatable relative to the third sealing ring 561, and the two are sealed together to ensure that the first drive shaft 220 can rotate relative to the fixed shaft 550 while preventing cooling water from entering between the first drive shaft 220 and the fixed shaft 550, thereby improving the sealing performance of the upper electrode assembly. Of course, in other embodiments, the upper electrode assembly may not include the second sealing seat 560.

[0076] Optionally, the first sealing element 810, the second sealing element 840, and the third sealing element 850 can all be sealing rings, specifically sealing elements made of soft materials such as rubber rings. The first sealing element 810, the second sealing element 840, and the third sealing element 850 are compressed to achieve the sealing effect.

[0077] Optionally, to facilitate the rotation of the first drive shaft 220 relative to the fixed shaft 550, a fourth bearing 680 may be provided between the first drive shaft 220 and the fixed shaft 550. The fourth bearing 680 is specifically sleeved on the outside of the first drive shaft 220, and in the axial direction of the first drive shaft 220 and the fixed shaft 550, the fourth bearing 680 is limited to the space between the first drive shaft 220 and the fixed shaft 550, so that the relative rotation between the first drive shaft 220 and the fixed shaft 550 can be realized.

[0078] Optionally, to facilitate the fourth bearing 680 being positioned between the first drive shaft 220 and the fixed shaft 550 along the axial direction of the first drive shaft 220 and the fixed shaft 550, a third limiting protrusion may be provided on the opposing surfaces of the first drive shaft 220 and the fixed shaft 550 to limit the fourth bearing 680. Of course, this embodiment does not impose specific limitations on this.

[0079] Optionally, the number of fourth bearings 680 can be at least two, with each fourth bearing 680 spaced apart axially between the first drive shaft 220 and the fixed shaft 550, making it easier for the first drive shaft 220 and the fixed shaft 550 to rotate relative to each other. Optionally, each fourth bearing 680 can be spaced apart by a second bushing 690, that is, the second bushing 690 is sleeved on the outside of the first drive shaft 220, and the second bushing 690 can space apart two adjacent fourth bearings 680, that is, limit two adjacent fourth bearings 680. This limiting method is relatively simple, and there is no need to provide multiple third limiting protrusions on the opposing surfaces of the first drive shaft 220 and the fixed shaft 550, so as to simplify the structural complexity of the first drive shaft 220 and the fixed shaft 550.

[0080] Optionally, the cover 100 can be an insulating cover, meaning the material of the cover 100 can be an insulating material, so that the cavity 110 formed by the cover 100 and the target 430 is an insulating cavity, thus preventing the cover 100 from becoming charged due to electrical short circuits, thereby preventing leakage of current in the upper electrode assembly. Of course, in other embodiments, the material of the cover 100 may not be an insulating material. In this case, an insulating material can be sprayed onto the cover 100 to prevent leakage of current in the upper electrode assembly.

[0081] Optionally, the upper electrode assembly may further include a first support frame 460 and a second support frame 470, which are spaced apart from the cover 100 and both are located outside the receiving cavity 110. A first driving source 210 is disposed on the first support frame 460, and a second driving source 310 is disposed on the second support frame 470. That is, the first support frame 460 can support the first driving source 210, and the second support frame 470 can support the second driving source 310, so as to ensure the stability of the first driving source 210 and the second driving source 310, thereby ensuring the stability of the first driving mechanism 200 and the second driving mechanism 300. Of course, in other embodiments, the upper electrode assembly may not include the first support frame 460 and the second support frame 470.

[0082] Optionally, this application also discloses a semiconductor process apparatus, including a process chamber and the upper electrode assembly described above. The upper electrode assembly is installed in the process chamber, specifically on the top of the process chamber. The top of the process chamber is typically provided with the aforementioned target 430 for processing wafers, i.e., the target 430 is located between the upper electrode assembly and the process chamber.

[0083] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0084] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. An upper electrode assembly for a process chamber of a semiconductor process equipment, characterized in that, The upper electrode assembly includes a first drive mechanism (200), a second drive mechanism (300), a first magnetron (410), and a second magnetron (420). The first magnetron (410) and the second magnetron (420) are spaced apart at the top of the process chamber. The first drive mechanism (200) is connected to the first magnetron (410), and the second drive mechanism (300) is connected to the second magnetron (420). The first drive mechanism (200) and the second drive mechanism (300) can drive the first magnetron (410) and the second magnetron (420) to rotate, moving closer to or away from the center of the target material (430), respectively and independently.

2. The upper electrode assembly according to claim 1, characterized in that, The first drive mechanism (200) includes a first drive shaft (220), and the second drive mechanism (300) includes a second drive shaft (320). The first drive shaft (220) is sleeved on the second drive shaft (320), and the first drive shaft (220) and the second drive shaft (320) can rotate relative to each other. The first end of the first drive shaft (220) is connected to the first magnetron (410) to drive the first magnetron (410) to rotate. The first end of the second drive shaft (320) is connected to the second magnetron (420) to drive the second magnetron (420) to rotate.

3. The upper electrode assembly according to claim 2, characterized in that, The upper electrode assembly further includes a cover (100) for connecting with the target material (430) to form a receiving cavity (110). The first magnetron (410) and the second magnetron (420) are spaced apart in the receiving cavity (110). The first end of the first drive shaft (220) passes through the cover (100) and is connected to the first magnetron (410). The first end of the second drive shaft (320) passes through the cover (100) and is connected to the second magnetron (420).

4. The upper electrode assembly according to claim 3, characterized in that, The first drive mechanism (200) further includes a first drive source (210) and a first transmission assembly. The first drive source (210) is connected to the first drive shaft (220). The second drive mechanism (300) further includes a second drive source (310) and a second transmission assembly. The second drive source (310) is connected to the second drive shaft (320). The first drive source (210) and the second drive source (310) are spaced apart outside the cover (100). The first transmission assembly and the second transmission assembly are spaced apart inside the receiving cavity (110). The first end of the first drive shaft (220) is connected to the first magnetron (410) through the first transmission assembly. The first end of the second drive shaft (320) is connected to the second magnetron (420) through the second transmission assembly.

5. The upper electrode assembly according to claim 4, characterized in that, The upper electrode assembly further includes a rotating bracket (510), the rotation axis of which coincides with the center line of the target material (430). The first transmission component and the second transmission component are rotatably mounted on the rotating bracket (510). During the rotation of the rotating bracket (510), the rotating bracket (510) can drive the first magnetron (410) to rotate around the center line of the target material (430) through the first transmission component, and can drive the second magnetron (420) to rotate around the center line of the target material (430) through the second transmission component.

6. The upper electrode assembly according to claim 5, characterized in that, The upper electrode assembly further includes a first connecting plate (520), the first transmission assembly is connected to the first magnetron (410) through the first connecting plate (520), and the first magnetron (410) is eccentrically disposed relative to the first connecting plate (520); and / or, the upper electrode assembly further includes a second connecting plate (530), the second transmission assembly is connected to the second magnetron (420) through the second connecting plate (530), and the second magnetron (420) is eccentrically disposed relative to the second connecting plate (530).

7. The upper electrode assembly according to claim 6, characterized in that, The upper electrode assembly further includes a first counterweight (440), which is eccentrically disposed relative to the first connecting plate (520), and the first counterweight (440) and the first magnetron (410) are respectively disposed on both sides of the first connecting plate (520); and / or, the upper electrode assembly further includes a second counterweight (450), which is eccentrically disposed relative to the second connecting plate (530), and the second counterweight (450) and the second magnetron (420) are respectively disposed on both sides of the second connecting plate (530).

8. The upper electrode assembly according to claim 6 or 7, characterized in that, One of the first connecting plate (520) and the second connecting plate (530) is provided with a first limiting block (531) on the side facing the rotating bracket (510), and the rotating bracket (510) is provided with a second limiting block (511). During the rotation of the first connecting plate (520) and the second connecting plate (530), the first limiting block (531) and the second limiting block (511) are engaged in a limiting cooperation so that the first connecting plate (520) and the second connecting plate (530) drive the rotating bracket (510) to rotate through the first limiting block (531) and the second limiting block (511).

9. The upper electrode assembly according to claim 8, characterized in that, The rotating bracket (510) is also provided with a third limiting block (512), which is spaced apart from the second limiting block (511). When one of the first connecting plate (520) and the second connecting plate (530) drives the first magnetron (410) or the second magnetron (420) to approach the center of the target material (430), the first limiting block (531) and the second limiting block (511) are in a limiting cooperation. When one of the first connecting plate (520) and the second connecting plate (530) drives the first magnetron (410) or the second magnetron (420) away from the center of the target material (430), the first limiting block (531) and the third limiting block (512) are in a limiting cooperation.

10. The upper electrode assembly according to claim 5, characterized in that, The rotating bracket (510) has an inner cavity (513) and is provided with a first through hole (514) and a second through hole (515) spaced apart. At least one of the first end of the first drive shaft (220) and the first end of the second drive shaft (320) passes through the first through hole (514) and extends into the inner cavity (513). At least one of the first transmission assembly and the second transmission assembly includes a driven shaft (230) and a first transmission belt (240). The driven shaft (230) is rotatably disposed in the second through hole (515) and connected to the first magnetron (410) or the second magnetron (420). The first transmission belt (240) is sleeved on the first drive shaft (220) and the driven shaft (230), or the first transmission belt (240) is sleeved on the second drive shaft (320) and the driven shaft (230).

11. The upper electrode assembly according to claim 10, characterized in that, At least one of the first transmission assembly and the second transmission assembly further includes a first driving wheel (250) and a first driven wheel (260). The first driving wheel (250) is rotatably disposed in the first through hole (514) and connected to the first drive shaft (220) or the second drive shaft (320). The first driven wheel (260) is sleeved on the driven shaft (230) and connected to the driven shaft (230). The first transmission belt (240) is sleeved on the first driving wheel (250) and the first driven wheel (260).

12. The upper electrode assembly according to claim 11, characterized in that, The upper electrode assembly further includes a first sealing seat (540), which includes a first sealing ring (541) sleeved between the second drive shaft (320) and the first drive wheel (250) of the first transmission assembly, and a second sealing ring (542) sleeved between the second drive shaft (320) and the first drive wheel (250) of the second transmission assembly. The first sealing ring (541) is rotatable relative to the second drive shaft (320) and the first drive wheel (250) of the first transmission assembly, and the second sealing ring (542) is rotatable relative to the first sealing ring (541), and the two are sealed together.

13. The upper electrode assembly according to claim 4, characterized in that, The first drive mechanism (200) further includes a third transmission assembly, which includes a second drive wheel (270), a second driven wheel (280), and a second transmission belt (290). The second drive wheel (270) is connected to the first drive source (210), the second driven wheel (280) is rotatably sleeved on the second end of the second drive shaft (320) and connected to the second end of the first drive shaft (220), and the second transmission belt (290) is sleeved on the second drive wheel (270) and the second driven wheel (280). The second drive mechanism (300) further includes a fourth transmission assembly, which includes a third drive wheel (330), a third driven wheel (340), and a third transmission belt (350). The third drive wheel (330) is connected to the second drive source (310), the third driven wheel (340) is fixedly sleeved on the second end of the second drive shaft (320), and the second transmission belt (290) is sleeved on the third drive wheel (330) and the third driven wheel (340).

14. The upper electrode assembly according to claim 3, characterized in that, The upper electrode assembly further includes a fixed shaft (550), which is connected to and sealed to the cover (100). The fixed shaft (550) is sleeved on the first drive shaft (220), and the first drive shaft (220) and the fixed shaft (550) are in a limiting fit along the axial direction of the first drive shaft (220). The second drive shaft (320) is in a limiting fit with the first drive shaft (220).

15. The upper electrode assembly according to claim 14, characterized in that, The first end of the fixed shaft (550) passes through the cover (100) and extends into the receiving cavity (110); The upper electrode assembly further includes a second sealing seat (560), which is sleeved between the first end of the fixed shaft (550) and the first drive shaft (220). The second sealing seat (560) includes a third sealing ring (561) connected to the fixed shaft (550) and a fourth sealing ring (562) connected to the first drive shaft (220). The fourth sealing ring (562) is rotatable relative to the third sealing ring (561), and the two are sealed together.

16. The upper electrode assembly according to claim 3, characterized in that, The cover (100) is an insulating cover, and the receiving cavity (110) is an insulating cavity.

17. A semiconductor process apparatus, characterized in that, It includes a process chamber and an upper electrode assembly as described in any one of claims 1-16, wherein the upper electrode assembly is mounted in the process chamber.

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