Extruded electrode copper bar and injection molding process thereof

Abstract

The application relates to the technical field of electrode copper bar processing, and discloses an extruded electrode copper bar, which comprises a plastic-coated copper bar, the plastic-coated copper bar comprises a copper bar body and an insulating outer skin wrapped outside the copper bar body, positioning holes and locking holes are arranged on the copper bar body, the insulating outer skin is integrally extruded and formed on the outside of the copper bar body, after the copper bar body is integrally extruded and insulated, the insulating outer skin of a to-be-injection-molded area is partially removed, and end supports and mounting supports are respectively injection molded on the same copper bar body; through the composite molding process of integral extrusion full-coating and partial skin-removing step-by-step injection molding, the traditional process limitations are broken, the integral insulation coating of the copper bar is completed first, various specifications of copper bars are adapted, the generality is high, repeated mold opening is not needed, the production cost is effectively reduced, meanwhile, a modular molding module assembly with a main body and replaceable cavity is adopted, different supports can be formed by only replacing the cavity, and the mold reuse rate and the processing precision are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of electrode copper busbar processing technology, and in particular to an extruded electrode copper busbar and its injection molding process. Background Technology

[0002] Electrode copper busbars are widely used in electrical connection scenarios such as energy storage and power batteries. To ensure insulation performance, it is usually necessary to cover the outside of the copper busbar conductor with an insulating layer and injection mold a connection support at a designated position on the copper busbar for assembly, fixation and electrical connection.

[0003] Existing similar electrode copper busbar processing solutions mostly adopt an integrated injection molding process, in which the copper busbar's external insulation covering, end supports, and intermediate mounting supports are injection molded in one go. This molding method is limited by the mold cavity, and one set of molds can only adapt to copper busbar products with fixed lengths and fixed shapes. When the length or bending shape of the copper busbar changes, the entire mold needs to be remade. The mold has poor versatility, high production costs, and long product iteration cycles. Summary of the Invention

[0004] This invention addresses the shortcomings of existing technologies by providing an extruded copper electrode busbar and its injection molding process. By combining extrusion and injection molding in separate processes, the product's adaptability and mold versatility are improved. At the same time, it achieves anti-displacement of the support and water-proof sealing of the joint gap, thereby improving the overall performance of the product.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An extruded electrode copper busbar includes a plastic-coated copper busbar, comprising a copper busbar body and an insulating outer sheath covering the outside of the copper busbar body. The copper busbar body has positioning holes and locking holes. The insulating outer sheath is integrally extruded and formed onto the outside of the copper busbar body. After the copper busbar body is integrally extruded and insulated, the insulating outer sheath in the area to be injection molded is partially removed, and end supports and mounting supports are injection molded on the same copper busbar body. The end supports and mounting supports are injection molded using molding die components with a universal main structure but different molding cavities. The injection melt fills the locking holes to form an integrated anti-slip locking structure with the supports. The joint gaps between the end supports, mounting supports, and the insulating outer sheath are all equipped with split-type sealing frames to achieve water-proof sealing of the joint gaps.

[0006] Preferably, both the end support and the mounting support have a receiving cavity inside, and the inner wall of the receiving cavity has a snap-fit ​​groove. The sealing frame is a split upper and lower assembly structure, and the sealing frame surrounds and encloses the copper busbar and is embedded inside the receiving cavity.

[0007] Preferably, the sealing frame has a deformation groove, and an elastic and deformable snap-fit ​​part is integrally formed at the deformation groove. The snap-fit ​​part and the snap-fit ​​groove are elastically snapped together to achieve the pre-positioning of the sealing frame. The space between the sealing frame and the inner wall of the receiving cavity is filled with sealant. The elastic snap-fit ​​structure enables the sealing frame to be quickly pre-positioned, and the sealant fills the gap, effectively sealing the joint gap and achieving a water-proof and dustproof sealing effect.

[0008] An injection molding process for producing extruded copper electrode busbars includes the following steps: S1. Overall extrusion coating: The copper bus body 11 with positioning holes 14 and locking holes 13 is subjected to overall extrusion processing, and an insulating outer skin 12 is formed on the outer periphery of the copper bus body 11 to obtain a fully encapsulated plastic-coated copper bus 1. S2. Partial insulation cutting: The insulation skin 12 of the corresponding positioning hole 14, locking hole 13 and support injection area on the plastic-coated copper bus 1 is partially cut off to expose the injection molding area of ​​the copper bus body 11. S3, Step-by-step in-situ injection molding: Using a molding mold component 5 that is universal for the main module and replaceable for the cavity, first injection mold the end supports 2 at both ends of the copper busbar 11, and after curing, cut the insulation outer skin 12 of the corresponding area of ​​the mounting support 3, then injection mold the mounting support 3, and fill the locking hole 13 with the injection plastic to form an integrated anti-slip locking structure. S4. Sealing and assembly: After the support is completely cured, the sealing frame 24 is installed and sealed at the joint between each support and the insulating outer skin 12 to complete the finished product preparation.

[0009] Preferably, the molding assembly includes a main module one, a main module two, a sub-module one, and a sub-module two. The ends of sub-module one and sub-module two facing the main module one extend into the cavity formed by the main module one and the main module two. The molding assembly of the end support and the molding assembly of the mounting support are only different in the cavity molding shape, while the structure and assembly position of the other modules are the same.

[0010] Preferably, the main module two and the sub-module two constitute a fixed mold, and the main module one and the sub-module one constitute a moving mold. When closing the mold, the sub-module is first driven to move down to close the mold, and then the main module is driven to move down to complete the overall mold closing.

[0011] Preferably, during injection molding positioning, the fixed mold is arranged on the lower side, the sub-module two supports the plastic-coated copper busbar, and the positioning protrusion on the main module two is inserted and engaged with the positioning hole of the copper busbar body to achieve pre-injection positioning. By limiting the positioning through the insertion of the protrusion and the positioning hole, and in conjunction with the mold support structure, the positioning and placement of the copper busbar before injection molding can be achieved.

[0012] Preferably, the sealing frame is assembled by joining the upper and lower sides of the copper busbar and enclosing the copper busbar into the receiving cavity. The snap-fit ​​part snaps into the snap-fit ​​groove. The upper and lower split assembly method is adapted to the closed support structure, avoiding the inability to assemble the integral sealing frame.

[0013] Preferably, after the sealing frame is assembled in place, the gap between the sealing frame and the receiving cavity is filled with sealant to seal the joint between the insulating outer skin and the support. The sealant filling the gap can completely seal the structural gap, prevent moisture and impurities from entering, and ensure the insulation performance of the copper busbar and the safety of the internal structure.

[0014] Compared with the prior art, the present invention has the following beneficial effects: This invention breaks through the limitations of traditional processes by using a composite molding process that combines overall extrusion full coverage with partial peeling and step-by-step injection molding. It first completes the overall insulation coverage of the copper busbar, adapts to various specifications of copper busbars, has strong versatility, does not require repeated mold opening, and effectively reduces production costs. At the same time, it adopts a modular molding mold component with a universal main body and replaceable cavities. Different supports can be formed by simply changing the cavity, which greatly improves the mold reuse rate and processing accuracy. The integrated anti-slip locking structure is formed by filling the locking holes with injection molten metal, which firmly connects the support to the copper busbar, preventing the support from slipping and loosening under equipment vibration and temperature change conditions, and improving structural stability. Then, the upper and lower split-type sealing frame, together with sealant, seals the gap between the support and the insulation outer skin, which can effectively prevent water vapor and dust from entering. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a view showing the end support and the plastic-coated copper busbar separated in this invention; Figure 3 This is a structural view of the end support of the present invention; Figure 4 This is a structural view of the sealing frame of the present invention; Figure 5 This is a view showing the end support and mounting support position of the present invention; Figure 6 For the present invention Figure 5 Enlarged view at point A in the middle; Figure 7This is a separate view of the mounting bracket and the plastic-coated copper busbar of the present invention; Figure 8 This is a structural view of the molding die assembly of the present invention; Figure 9 This is a positional view of submodule one and submodule two of the present invention.

[0017] Drawing number explanation: 1. Plastic-coated copper busbar; 11. Copper busbar body; 12. Insulating outer sheath; 13. Locking hole; 14. Positioning hole; 2. End support; 21. Thickened end; 22. Receiving cavity; 23. Snap-fit ​​groove; 24. Sealing frame; 25. Deformation groove; 26. Snap-fit ​​part; 3. Mounting support; 31. Closed end; 4. Closed block; 5. Molding mold assembly; 51. Main module one; 52. Main module two; 53. Sub-module one; 54. Sub-module two; 55. Positioning protrusion. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings.

[0019] The following description is intended to disclose the invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious modifications will be apparent to those skilled in the art. The basic principles of the invention defined in the following description can be used in other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0020] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the orientation or positional relationship shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing this invention and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this invention.

[0021] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0022] Example: Please see Figure 1-9An extruded electrode copper busbar and its injection molding process are disclosed. The extruded electrode copper busbar includes a plastic-coated copper busbar 1, which is composed of a copper busbar body 11 and an insulating outer sheath 12. The copper busbar body 11 is a conductive substrate. Locking holes 13 and positioning holes 14 are provided near both ends of the copper busbar body 11 and at the positions corresponding to the mounting supports 3 between the two ends. The locking holes 13 are used to form an anti-displacement locking structure, and the positioning holes 14 are used for precise positioning during injection molding.

[0023] The copper busbar is manufactured using a composite molding process that involves first fully extruding and then partially peeling and injection molding in stages. The specific implementation process is as follows: S1, integral extrusion coating The copper busbar body 11 with pre-drilled positioning holes 14 and locking holes 13 is subjected to integral extrusion processing using an extrusion machine. An insulating outer skin 12 is continuously formed and coated on the entire outer circumference surface of the copper busbar body 11, so that the entire copper busbar body 11 is completely wrapped by the insulating layer, resulting in a fully encapsulated plastic-coated copper busbar 1, which achieves overall basic insulation protection for the copper busbar. This extrusion process can be adapted to copper busbar bodies 11 of different lengths and shapes, and has high versatility.

[0024] S2, Partial Insulation Cutting After the overall extrusion is completed, a precise local cutting operation is carried out on the area where the support needs to be injected: the insulating skin 12 at the positioning hole 14 and locking hole 13 on the coated copper busbar 1 is cut off around the hole. At the same time, the insulating skin 12 at both ends and the middle section of the copper busbar body 11 corresponding to the injection area where the support 3 is installed is cut off, so as to completely expose the metal substrate surface of the copper busbar body 11, avoid residual insulating film from blocking the injection area, and ensure that the subsequent injection melt can be directly and tightly bonded to the copper busbar body 11.

[0025] S3, Step-by-step in-situ injection molding The molding mold assembly 5, which is universal in its main module and replaceable in its cavity, is used for step-by-step injection molding. The overall structure, module composition, and assembly position of the molding mold assembly 5, which is used for molding end support 2 and mounting support 3, are completely consistent, with only the shape of the internal molding cavity being different.

[0026] The molding assembly 5 includes a main module 1 51, a main module 2 52, a sub-module 1 53, and a sub-module 2 54. The main module 2 52 and the sub-module 2 54 constitute a fixed mold, the main module 1 51 and the sub-module 1 53 constitute a moving mold, and the sub-module 1 53 and the sub-module 2 54 extend into the cavity at the ends facing the main module 1 51 to assist in product molding.

[0027] When the workpiece is placed and positioned, the fixed mold is arranged on the lower side, and the plastic-coated copper busbar 1 is supported by the sub-module 2 54. At the same time, the positioning protrusion 55 on the main module 2 52 is inserted and engaged with the positioning hole 14 of the copper busbar body 11 to achieve precise positioning before injection molding and prevent injection offset.

[0028] The injection molding mold closing process adopts a step-by-step mold closing method. First, the sub-module 53 is driven to move downward to complete the initial alignment and mold closing. Then, the main module 51 is driven to move downward as a whole to complete the overall mold closing, effectively avoiding alignment deviations and mold collisions.

[0029] First, the end supports 2 at both ends of the copper busbar body 11 are injection molded. After the end supports 2 are completely cured, the insulation outer skin 12 of the corresponding area of ​​the middle section mounting support 3 is partially cut again. Finally, the mounting support 3 in the middle section is injection molded. During the injection molding process, the molten injection melt completely fills the locking hole 13. After cooling and solidification, an integrated anti-slip locking column structure is formed through the locking hole 13, so that the support and the copper busbar body 11 are firmly connected to prevent the support from slipping and loosening.

[0030] S4, Sealing assembly molding After the end support 2 and the mounting support 3 are fully injection molded and cured, the sealing assembly is carried out. The end of the end support 2 and both ends of the mounting support 3 are integrally provided with thickened ends 21. The thickened ends 21 are thickened and reinforced at the corresponding positions of the support mounting sealing frame 24, which effectively improves the structural strength of the support assembly position and avoids cracking and deformation of the sealing frame 24 during long-term stress. At the same time, it can provide sufficient structural space for the opening of the receiving cavity 22, ensuring the stable assembly of the sealing frame 24 and the reliable sealing structure. The end support 2 and the mounting support 3 are both provided with receiving cavities 22, and the inner wall of the receiving cavity 22 is provided with a snap-fit ​​groove 23.

[0031] During assembly, the two separate structures of the sealing frame 24 are closed from the upper and lower sides of the copper busbar 11 respectively, enclosing the outside of the copper busbar 11 and pushing it into the receiving cavity 22. The sealing frame 24 is provided with a deformation groove 25 and an integrally formed snap-fit ​​part 26. During the assembly process, the snap-fit ​​part 26 relies on the elastic deformation of the deformation groove 25 to snap into the snap-fit ​​groove 23 to achieve quick pre-positioning and prevent the sealing frame 24 from loosening and shifting.

[0032] Before assembly, sealant is evenly filled into the gap between the sealing frame 24 and the receiving cavity 22. After the sealant cures, it completely seals the joint between the insulating outer sheath 12 and the support, preventing water vapor and dust from entering the support and achieving long-term water-proof sealing.

[0033] The mounting bracket 3 is integrally formed with a closed end 31, and the closed end 31 is fitted with a threaded sealing block 4. Since the forming position of the mounting bracket 3 corresponds to the positioning hole 14 of the copper busbar 11, the positioning hole 14 cannot be completely sealed and filled during the injection molding process, which will form an exposed channel and pose a safety hazard of moisture and impurities entering. Therefore, by setting a closed end 31 on the mounting bracket 3 and matching it with a detachable threaded sealing block 4, the residual hole in the forming is sealed and closed, completely eliminating the use risk caused by the exposed hole and ensuring the internal airtightness and use safety of the mounting bracket 3.

[0034] When in use, the extruded electrode copper busbar is transported to the electrical equipment assembly station. The integrity of the overall insulation sheath 12 of the copper busbar, the molding firmness of the end support 2 and the mounting support 3, and the sealing status of the sealing frame 24 are checked. Assembly can only be carried out after confirming that there is no damage, no looseness, and the seal is intact.

[0035] Subsequently, the end supports 2 at both ends of the copper busbar are used to achieve the docking and electrical connection of the copper busbar ends. The mounting support 3 in the middle section of the copper busbar is used to achieve the overall installation, fixation and limiting support of the copper busbar, thus completing the positioning and installation of the copper busbar inside the equipment. During the long-term operation of the equipment, the copper busbar will be continuously affected by external factors such as vibration, temperature fluctuations, and humidity. The integrated locking column structure formed by the locking hole 13 can always ensure that there is no relative slippage between the end supports 2, the mounting support 3 and the copper busbar body 11, avoiding problems such as loose connection and poor contact. At the same time, the sealing frame 24 at the docking position of the support and the insulating outer skin 12, together with the sealant, forms a long-lasting sealing layer, which can effectively prevent water vapor and moisture in the air from entering the interior of the support, avoiding oxidation and corrosion of the copper busbar body 11 and moisture failure of the insulation layer, ensuring the long-term stable conductivity and insulation safety of the copper busbar.

[0036] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments, and any modifications or variations of the embodiments of the present invention may be made without departing from the stated principles.

Claims

1. An extruded copper electrode busbar, characterized in that, The system includes a plastic-coated copper busbar (1), which includes a copper busbar body (11) and an insulating outer skin (12) covering the outside of the copper busbar body (11). The copper busbar body (11) is provided with positioning holes (14) and locking holes (13). The insulating outer skin (12) is fully covered and formed on the outside of the copper busbar body (11) by an integral extrusion process. After the copper busbar body (11) is fully extruded and insulated, the insulating outer skin (12) of the area to be injected is partially removed, and end supports (2) and mounting supports (3) are respectively injection molded on the same copper busbar body (11). The end supports (2) and mounting supports (3) are injection molded using molding mold components (5) with universal main structure and different molding cavities. The injection melt fills the locking holes (13) to form an anti-slip locking structure integrated with the supports. The end support (2), the mounting support (3) and the insulating outer skin (12) are all fitted with split-type sealing frames (24) to achieve water-proof sealing of the joint.

2. The extruded copper electrode busbar according to claim 1, characterized in that: Both the end support (2) and the mounting support (3) are provided with a receiving cavity (22). The inner wall of the receiving cavity (22) is provided with a snap-fit ​​groove (23). The sealing frame (24) is a split structure that fits together. The sealing frame (24) surrounds and encloses the copper busbar (11) and is embedded in the receiving cavity (22).

3. The extruded copper electrode busbar according to claim 2, characterized in that: The sealing frame (24) is provided with a deformation groove (25), and an elastic and deformable snap-fit ​​part (26) is integrally formed at the deformation groove (25). The snap-fit ​​part (26) and the snap-fit ​​groove (23) are elastically snap-fitted together to realize the pre-positioning of the sealing frame (24). The sealing frame (24) and the inner wall of the receiving cavity (22) are filled with sealant.

4. An injection molding process for extruded copper electrode busbars, characterized in that, The method for preparing the extruded electrode copper busbar according to any one of claims 1 to 3 comprises the following steps: S1. Overall extrusion coating: The copper bus body (11) with positioning holes (14) and locking holes (13) is subjected to overall extrusion processing, and an insulating outer skin (12) is formed on the outer periphery of the copper bus body (11) to obtain a fully encapsulated plastic-coated copper bus (1). S2, Partial insulation cutting: Partially cut and remove the insulation skin (12) of the corresponding positioning hole (14), locking hole (13) and support injection area on the plastic-coated copper bus (1) to expose the injection molding area of ​​the copper bus body (11); S3, Step-by-step in-situ injection molding: Using a molding mold assembly (5) that is universal for the main module and replaceable for the cavity, first injection mold the end supports (2) at both ends of the copper busbar (11), and after curing, cut the insulation outer skin (12) of the corresponding area of ​​the installation support (3) again, and then injection mold the installation support (3), and fill the locking hole (13) with the injection plastic to form an integrated anti-slip locking structure. S4. Sealing and assembly: After the support is completely cured, a sealing frame (24) is installed and sealed at the joint between each support and the insulating outer skin (12) to complete the preparation of the finished product.

5. The injection molding process for an extruded copper electrode busbar according to claim 4, characterized in that: The molding assembly (5) includes a main module one (51), a main module two (52), a sub-module one (53) and a sub-module two (54). The ends of the sub-module one (53) and the sub-module two (54) facing the main module one (51) extend into the cavity formed by the main module one (51) and the main module two (52). The molding assembly (5) of the end support (2) and the molding assembly (5) of the mounting support (3) are different only in the cavity molding shape, while the structure and assembly position of the other modules are the same.

6. The injection molding process for an extruded copper electrode busbar according to claim 5, characterized in that: The main module 2 (52) and sub-module 2 (54) constitute a fixed mold, and the main module 1 (51) and sub-module 1 (53) constitute a moving mold. When the mold is closed, sub-module 1 (53) is driven to move down to close the mold first, and then the main module 1 (51) is driven to move down to complete the overall mold closure.

7. The injection molding process for an extruded copper electrode busbar according to claim 5, characterized in that: During injection molding positioning, the fixed mold is arranged on the lower side, the sub-module two (54) supports the plastic-coated copper busbar (1), and the positioning protrusion (55) on the main module two (52) is inserted and matched with the positioning hole (14) of the copper busbar body (11) to realize pre-injection positioning.

8. The injection molding process for an extruded copper electrode busbar according to claim 4, characterized in that: The sealing frame (24) is assembled from the upper and lower sides of the copper busbar (11) and encloses the copper busbar (11) and is embedded in the receiving cavity (22). The snap-fit ​​part (26) snaps into the snap-fit ​​groove (23).

9. The injection molding process for an extruded copper electrode busbar according to claim 8, characterized in that: After the sealing frame (24) is assembled in place, the gap between the sealing frame (24) and the receiving cavity (22) is filled with sealant to seal the joint gap between the insulating outer skin (12) and the support.

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