Filter port structure

Abstract

The application relates to a filter port structure, which comprises a circuit board, a resonant cavity and a coupling assembly. The resonant cavity comprises a cavity and a resonant column arranged in the cavity. The circuit board is mounted on the side wall of the cavity, and the circuit board is connected with the resonant column through the coupling assembly to realize signal transmission in a capacitive coupling mode. The filter port structure can replace the tap welding mode in the related art, effectively avoids stress generated by deformation of various components, and improves the reliability and intermodulation stability of products.

Description

Technical Field

[0001] This application relates to the field of mobile communication technology, and in particular to filter port structures. Background Technology

[0002] Antenna Filter Units (AFUs) are integrated modules that combine an antenna and a filter, consisting of an AU (antenna) and a FU (filter). In mobile communications, AFUs primarily address two major pain points of traditional base station architectures: signal loss and space occupation, stemming from the separate design of antennas and filters. In mainstream AFU products, the connection between the metal cavity filter and the antenna PCB is typically achieved through tap soldering to ensure signal transmission. However, this tap-soldering method has drawbacks: lower reliability and intermodulation levels in AFU products. Summary of the Invention

[0003] Therefore, it is necessary to provide a filter port structure that can effectively connect the filter and the antenna, reduce performance degradation, improve the reliability of the AFU, and enhance the stability of intermodulation, in order to solve at least one of the problems in the related technologies.

[0004] This application provides a filter port structure, including:

[0005] Circuit board;

[0006] A resonant cavity, the resonant cavity including a cavity body and a resonant column disposed within the cavity body;

[0007] and coupling components;

[0008] The circuit board is mounted on the side wall of the cavity, and the circuit board and the resonant post are connected through the coupling component to achieve signal transmission by capacitive coupling.

[0009] In one embodiment, the physical connection between the coupling component and the circuit board is a non-contact connection, and the connection between the coupling component and the resonant cavity is also a non-contact connection.

[0010] In one embodiment, the sidewall of the cavity is provided with a coupling window; the coupling assembly includes a first coupling member, which passes through the coupling window and extends into the cavity to be coupled to the resonant column, and the first coupling member is also coupled to the circuit board; or, the coupling assembly includes a first coupling member and a second coupling member, the first coupling member passes through the coupling window and extends into the cavity to be coupled to the resonant column, the first coupling member is also coupled to the second coupling member, and the second coupling member is soldered to the circuit board.

[0011] In one embodiment, the resonant column is provided with a coupling hole, the coupling hole is arranged opposite to the coupling window, and the first coupling member includes a coupling rod, which passes through the coupling window and extends into the coupling hole to be coupled to the resonant column.

[0012] In one embodiment, the coupling assembly further includes a first dielectric element disposed within the coupling hole and located between the coupling rod and the hole wall of the coupling hole, so that the coupling rod and the hole wall of the coupling hole are mutually insulated and isolated.

[0013] In one embodiment, the first coupling element includes a coupling disk, and a microstrip line is provided on the side of the circuit board away from the cavity. The coupling disk abuts against the side of the circuit board facing the cavity, and the coupling disk is coupled to the microstrip line.

[0014] In one embodiment, the circuit board has a first recess on the side facing the cavity, and the coupling disk is at least partially or completely embedded in the first recess.

[0015] In one embodiment, the coupling disk is adapted to the shape of the first recess.

[0016] In one embodiment, the circuit board has a second recess on the side facing away from the cavity, the inner wall of the second recess has a conductive layer, the conductive layer is electrically connected to the microstrip line, the coupling disk is aligned with the second recess along the thickness direction of the circuit board, and the coupling disk is coupled to the conductive layer.

[0017] In one embodiment, a microstrip line is provided on the side of the circuit board away from the cavity, and the second coupling member is soldered to the microstrip line by reflow soldering.

[0018] In one embodiment, one of the second coupling member and the first coupling member includes a conductive sleeve, and the other of the second coupling member and the first coupling member is disposed in the conductive sleeve.

[0019] In one embodiment, the coupling component further includes a second medium disposed between the first coupling component and the second coupling component.

[0020] In one embodiment, the second coupling member includes a conductive sleeve connected to either side of the circuit board along its thickness direction.

[0021] In one embodiment, the filter port structure further includes a debug connector connected to the circuit board.

[0022] In the aforementioned filter port structure, the circuit board and resonant cavity transmit signals through a coupling component. Therefore, it can replace the tapped soldering method in related technologies, effectively avoiding stress caused by deformation of various components and improving product reliability and intermodulation stability. Attached Figure Description

[0023] Figure 1 This is a cross-sectional view of the filter port structure according to the first embodiment of this application.

[0024] Figure 2 for Figure 1 The diagram shows the exploded structure of the filter port.

[0025] Figure 3 for Figure 2 Another perspective view of the decomposed structure of the filter port shown.

[0026] Figure 4 This is a cross-sectional view of the filter port structure according to the second embodiment of this application.

[0027] Figure 5 for Figure 4 The diagram shows the exploded structure of the filter port.

[0028] Figure 6 for Figure 5 Another perspective view of the decomposed structure of the filter port shown.

[0029] Figure 7 This is a cross-sectional view of the filter port structure according to the third embodiment of this application.

[0030] Figure 8 for Figure 7 The diagram shows the exploded structure of the filter port.

[0031] Figure 9 for Figure 7 The diagram shows the structure of the filter port.

[0032] Figure 10 for Figure 7The diagram shows the structure of the filter port where the circuit board is fixed to the side wall of the cavity by fasteners.

[0033] Figure 11 This is a cross-sectional view of the filter port structure according to the fourth embodiment of this application.

[0034] Figure 12 for Figure 11 The diagram shows the exploded structure of the filter port.

[0035] Figure 13 This is a cross-sectional view of the filter port structure according to the fifth embodiment of this application.

[0036] Figure 14 for Figure 13 The diagram shows the exploded structure of the filter port.

[0037] Figure 15 This is a structural diagram of the filter port structure according to the sixth embodiment of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 10. Circuit board; 11. First recess; 12. Second recess; 20. Resonant cavity; 21. Cavity; 211. Coupling window; 22. Resonant pillar; 221. Coupling hole; 23. Fastener; 24. Partition; 30. Coupling assembly; 31. First coupling element; 311. Coupling rod; 312. Coupling disk; 32. Second coupling element; 33. First dielectric element; 34. Conductive sleeve; 35. Coupling rod; 36. Second dielectric element; 40. Debug connector. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] As described in the background section, the low reliability and intermodulation levels of AFU products in related technologies are due to several factors. Firstly, tap soldering typically employs manual or wave soldering methods, resulting in uncontrollable temperatures and degraded solder joint quality, thus affecting intermodulation. Secondly, the difference in temperature coefficients between the filter's metal cavity and the antenna's circuit board leads to varying degrees of thermal expansion and contraction, causing internal stress that cannot be released. Over time, this results in solder joint aging and deformation, ultimately impacting product reliability and intermodulation levels. This is particularly true for active antennas in MIMO configurations, which contain 32 / 64 RF channels with interconnected stress points and numerous solder joints, leading to lower product reliability and intermodulation levels.

[0042] Based on the above reasons, this application provides a filter port structure that enables effective connection between the cavity filter and the antenna circuit board, reduces performance degradation, improves the reliability of the AFU, and enhances the stability of intermodulation.

[0043] For example, a filter serves to select frequency bands; specifically, it can be a simplexer, duplexer, splitter, or combiner, etc., without limitation.

[0044] The following will combine Figures 1 to 15 The filter port structure of the embodiments of this application will be described in detail.

[0045] Please see Figures 1 to 3 , Figures 4 to 6 , Figures 7 to 10 , Figures 11 to 12 or Figures 13 to 14 The filter port structure of any embodiment of the present application includes a circuit board 10, a resonant cavity 20 and a coupling component 30.

[0046] For example, circuit board 10 integrates the antenna element, feed network, etc. Circuit board 10 can be obtained by printing circuit layers on a dielectric substrate. Circuit board 10 has various functions such as radiating and receiving antenna signals. The specific structure is not elaborated here, but can be flexibly adjusted and set according to actual needs.

[0047] It should be noted that when the filter port structure is used in an antenna, especially in an AFU antenna, circuit board 10 is the antenna's circuit board. Specifically, circuit board 10 is a PCB board.

[0048] The resonant cavity 20 includes a cavity 21 and a resonant post 22 disposed within the cavity 21. A coupling window 211 is provided on the side wall of the cavity 21, and the circuit board 10 is mounted on the side wall of the cavity 21. The circuit board 10 can be fixed to the side wall of the cavity 21 by various fasteners 23 such as screws, pins, and rivets, or it can be fixed to the side wall of the cavity 21 by adhesive bonding; no limitation is imposed here.

[0049] For example, the circuit board 10 is coupled to the resonant pillar 22 via the coupling component 30.

[0050] Please refer to Figures 1 to 3 or Figures 4 to 6 The coupling component 30 includes a first coupling element 31. The first coupling element 31 passes through the coupling window 211 and extends into the cavity 21, coupling with the resonant pillar 22. The first coupling element 31 is also coupled with the circuit board 10. Specifically, a microstrip line is provided on the side of the circuit board 10 away from the cavity 21. The microstrip line can be understood as a connection point on the circuit board 10 used for signal transmission with the resonant cavity 20. The first coupling element 31 abuts against the side of the circuit board 10 facing the cavity 21, thereby achieving coupling with the microstrip line. Thus, the first coupling element 31 is coupled with both the circuit board 10 and the resonant pillar 22, realizing signal transmission between the circuit board 10 and the resonant pillar 22.

[0051] Of course, you can also refer to Figures 7 to 9 or Figures 11 to 14 Compared to Figures 1 to 3 In the illustrated embodiment, the difference lies in that the first coupling member 31 is not coupled to the circuit board 10. The coupling assembly 30 includes not only the first coupling member 31 but also the second coupling member 32. The first coupling member 31 passes through the coupling window 211 and extends into the cavity 21 to be coupled to the resonant pillar 22. The first coupling member 31 is also coupled to the second coupling member 32. The second coupling member 32 is specifically soldered to the circuit board 10 by reflow soldering.

[0052] In the aforementioned filter port structure, the circuit board 10 and the resonant cavity 20 transmit signals through the coupling component 30, achieving a coupled connection between the cavity filter and the antenna circuit board. Specifically, the first coupling component 31 uses capacitive coupling to couple signals from the circuit board 10 into the cavity 21 of the resonant cavity 20 or from the cavity 21 back to the circuit board 10. The physical connection between the first coupling component 31 and the circuit board 10 and the resonant cavity 20 is a non-contact connection, replacing traditional tapped soldering. This avoids problems such as reduced solder joint quality, lower product reliability, and lower intermodulation levels caused by traditional tapped soldering, thus improving product reliability and intermodulation stability.

[0053] Of course, the first coupling member 31 is connected to the second coupling member 32, and the second coupling member 32 is soldered to the circuit board 10 by reflow soldering, which can also replace the traditional tap soldering. The solder joint quality of reflow soldering is better. Therefore, it reduces the risk of solder joint aging and deformation under high and low temperature environments, effectively avoids the stress caused by the deformation of various components, and improves the reliability and intermodulation stability of the product.

[0054] Please see Figure 1 , Figure 4 , Figure 7 or Figure 13 For example, the resonant column 22 is provided with a coupling hole 221. The coupling hole 221 can be a through hole penetrating the resonant column 22 or a blind hole not penetrating the resonant column 22; there is no limitation here. In order to facilitate coupling connection with the resonant column 22, the coupling hole 221 is arranged opposite to the coupling window 211. The first coupling member 31 includes a coupling rod 311, which passes through the coupling window 211 and extends into the coupling hole 221, thereby realizing coupling connection with the resonant column 22. Of course, in some optional solutions, the first coupling member 31 can also achieve coupling connection by having a gap between its end face and the side wall of the resonant column 22. In order to improve the stable coupling effect between the first coupling member 31 and the resonant column 22, and to realize the fixation of the first coupling member 31, this embodiment will specifically take the first coupling member 31 including the coupling rod 311 and the coupling rod 311 being disposed in the coupling hole 221 as an example, but this is not a limitation.

[0055] Based on the aforementioned embodiments, the coupling assembly 30 further includes a first dielectric element 33. The first dielectric element 33 is disposed within the coupling hole 221 and located between the coupling rod 311 and the hole wall of the coupling hole 221, so that the coupling rod 311 and the hole wall of the coupling hole 221 are mutually insulated and isolated.

[0056] The first dielectric element 33 includes, but is not limited to, a dielectric sleeve. The dielectric sleeve is fixed within the coupling hole 221, and the coupling rod 311 passes through the dielectric sleeve. In this way, the first coupling element 31 can be securely mounted on the resonant pillar 22. Furthermore, the dielectric sleeve effectively prevents direct contact between the coupling rod 311 and the resonant pillar 22, ensuring a coupled connection between them. Moreover, by changing the sidewall thickness of the dielectric sleeve, the amount of coupling between the coupling rod 311 and the resonant pillar 22 can be adjusted.

[0057] Please see Figures 1 to 3 or Figures 4 to 6Based on the aforementioned embodiments, the first coupling element 31 includes a coupling disk 312. The coupling disk 312 is coupled to the microstrip line. The coupling disk 312 has a large area and a large coupling amount with the microstrip line. Furthermore, the coupling disk 312 is connected to the circuit board 10 through coupling, simplifying the soldering process of the circuit board 10, thereby improving production efficiency and enhancing product reliability and intermodulation stability. When the first coupling element 31 also includes a coupling rod 311, one end of the coupling disk 312 is connected to the coupling rod 311, and the other end of the coupling rod 311 extends through the coupling window 211 into the cavity 21 and couples with the resonant pillar 22.

[0058] Please see Figures 1 to 3 Based on the aforementioned embodiment, the circuit board 10 has a first recess 11 on the side facing the cavity 21. The coupling disk 312 is at least partially or completely embedded in the first recess 11. In this way, the first recess 11 can reduce the thickness of the circuit board 10, thereby reducing the distance between the coupling disk 312 and the microstrip line, and thus improving the coupling effect between the coupling disk 312 and the microstrip line.

[0059] Please see Figures 1 to 3 Based on the aforementioned embodiments, the coupling disk 312 is adapted to the shape of the first recess 11. The first recess 11 can support the first coupling member 31, so that the coupling disk 312 is stably disposed in the first recess 11, thereby ensuring product performance.

[0060] Optionally, the outer periphery of the coupling disk 312 may include, but is not limited to, a circle, a rectangle, or other regular or irregular shapes. The inner periphery of the first recess 11 has the same shape and size as the outer periphery of the coupling disk 312.

[0061] Please see Figures 4 to 6 In some embodiments, the circuit board 10 has a second recess 12 on the side facing away from the cavity 21. The inner wall of the second recess 12 is provided with a conductive layer. The conductive layer is electrically connected to the microstrip line. A coupling disk 312 is aligned with the second recess 12 along the thickness direction of the circuit board 10, and the coupling disk 312 is coupled to the conductive layer. Thus, the second recess 12 reduces the thickness of the circuit board 10, resulting in a larger coupling between the conductive layer and the coupling disk 312, allowing the conductive layer to transmit the coupled signal with the coupling disk 312 to the microstrip line.

[0062] Please see Figures 7 to 14 In some embodiments, one of the second coupling member 32 and the first coupling member 31 includes a conductive sleeve 34, and the other of the second coupling member 32 and the first coupling member 31 includes, for example, a coupling rod 35. The coupling rod 35 passes through the conductive sleeve 34. For details, please refer to [link to relevant documentation]. Figure 7 and Figure 8 or Figure 13 and Figure 14 The second coupling element 32 is configured as a conductive sleeve 34, which can be a metallized sleeve or a sleeve made of metal. The end of the first coupling element 31 furthest from the resonant post 22 has a coupling rod 35, which passes through the conductive sleeve 34, thereby achieving coupling between the first coupling element 31 and the second coupling element 32. Alternatively, see [reference needed]. Figure 11 and Figure 12 The first coupling member 31 has a metal sleeve at the end away from the resonant column 22. The second coupling member 32 is specifically configured as a coupling rod 35, and the second coupling member 32 passes through the metal sleeve, thereby realizing the coupling connection between the first coupling member 31 and the second coupling member 32.

[0063] Based on the foregoing embodiments, to improve the coupling stability between the first coupling member 31 and the second coupling member 32, the coupling assembly 30 further includes a second medium member 36, which is disposed between the first coupling member 31 and the second coupling member 32. Thus, the first coupling member 31 is connected to the second coupling member 32 through the second medium member 36, effectively preventing direct contact between the first coupling member 31 and the second coupling member 32, thereby ensuring a stable distance between them and achieving a stable coupling connection.

[0064] Optionally, the second dielectric element 36 may include, but is not limited to, a dielectric sleeve. The second dielectric element 36 is disposed on the inner wall of the metal sleeve and is sleeved over the coupling rod 35.

[0065] In some embodiments, the second coupling member 32 includes a conductive sleeve 34. The conductive sleeve 34 is connected to either side of the circuit board 10 along its thickness direction. That is, as shown... Figures 7 to 10 As shown, the second coupling element 32 includes a conductive sleeve 34, which can be connected to the side of the circuit board 10 facing the resonant pillar 22. Furthermore, the second coupling element 32 is electrically connected to the microstrip line through a metallized via. The second coupling element 32 is also sleeved outside the first coupling element 31, and a second dielectric element 36 is disposed between the second coupling element 32 and the first coupling element 31. (See reference...) Figure 13 and Figure 14 Compared to Figures 7 to 10 The main difference in the structure shown is that the conductive sleeve 34 can also be connected to the side of the circuit board 10 away from the resonant pillar 22. The first coupling member 31 includes a coupling rod 35, which passes through the circuit board 10 and is inserted into the conductive sleeve 34, and is coupled to the conductive sleeve 34.

[0066] Please see Figures 1 to 14In some embodiments, the filter port structure further includes a debugging connector 40, such as a SAM connector. The debugging connector 40 is connected to the circuit board 10. The signal received by the debugging connector 40 can be transmitted to the resonant cavity 20 through the circuit board 10 and the coupling component 30, and can also receive feedback signals from the resonant cavity 20, thus enabling the debugging and testing of the resonant cavity 20.

[0067] Please see Figures 1 to 14 In some embodiments, the resonant cavity 20 further includes a partition 24. The partition 24 divides the cavity 21 into an upper chamber and a lower chamber. Two resonant pillars 22 are provided, located in the upper chamber and the lower chamber, respectively. One of the resonant pillars 22 is coupled to the coupling assembly 30. The partition 24 enhances the structural strength of the cavity 21 and serves to achieve signal isolation between the upper and lower chambers.

[0068] In some embodiments, the coupling component 30 is not limited to one, but may be two, three, or more. See also Figure 15 , Figure 15 The illustration shows a specific example where there are two coupling components 30, but this is not a limitation. The circuit board 10 is coupled to the two resonant pillars 22 of the resonant cavity 20 one-to-one through the two coupling components 30.

[0069] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0070] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0071] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0072] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0073] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A filter port structure, characterized in that, include: Circuit board; A resonant cavity, the resonant cavity including a cavity body and a resonant column disposed within the cavity body; and coupling components; The circuit board is mounted on the side wall of the cavity, and the circuit board and the resonant post are connected through the coupling component to achieve signal transmission by capacitive coupling.

2. The filter port structure according to claim 1, characterized in that, The physical connection between the coupling component and the circuit board is a non-contact connection, and the connection between the coupling component and the resonant cavity is also a non-contact connection.

3. The filter port structure according to claim 1, characterized in that, The cavity has a coupling window on its side wall; the coupling assembly includes a first coupling member, which passes through the coupling window and extends into the cavity to be coupled to the resonant column, and is also coupled to the circuit board; or, the coupling assembly includes a first coupling member and a second coupling member, which passes through the coupling window and extends into the cavity to be coupled to the resonant column, and is also coupled to the second coupling member, and is soldered to the circuit board.

4. The filter port structure according to claim 3, characterized in that, The resonant column is provided with a coupling hole, which is arranged opposite to the coupling window. The first coupling element includes a coupling rod, which passes through the coupling window and extends into the coupling hole to couple with the resonant column.

5. The filter port structure according to claim 4, characterized in that, The coupling assembly further includes a first dielectric element disposed within the coupling hole and located between the coupling rod and the hole wall of the coupling hole, so that the coupling rod and the hole wall of the coupling hole are mutually insulated and isolated.

6. The filter port structure according to any one of claims 3 to 5, characterized in that, The first coupling element includes a coupling disk. A microstrip line is provided on the side of the circuit board away from the cavity. The coupling disk abuts against the side of the circuit board facing the cavity, and the coupling disk is coupled to the microstrip line.

7. The filter port structure according to claim 6, characterized in that, The circuit board has a first recess on the side facing the cavity, and the coupling disk is at least partially or completely embedded in the first recess.

8. The filter port structure according to claim 7, characterized in that, The coupling disk is adapted to the shape of the first recess.

9. The filter port structure according to claim 6, characterized in that, The circuit board has a second recess on the side facing away from the cavity. The inner wall of the second recess has a conductive layer. The conductive layer is electrically connected to the microstrip line. The coupling disk is aligned with the second recess along the thickness direction of the circuit board and is coupled to the conductive layer.

10. The filter port structure according to claim 3, characterized in that, The circuit board has a microstrip line on the side away from the cavity, and the second coupling member is soldered to the microstrip line by reflow soldering.

11. The filter port structure according to claim 10, characterized in that, One of the second coupling member and the first coupling member includes a conductive sleeve, and the other of the second coupling member and the first coupling member is inserted into the conductive sleeve.

12. The filter port structure according to claim 11, characterized in that, The coupling component further includes a second medium element disposed between the first coupling component and the second coupling component.

13. The filter port structure according to claim 11, characterized in that, The second coupling element includes a conductive sleeve, which is connected to any side of the circuit board along its thickness direction.

14. The filter port structure according to any one of claims 1 to 5 and 10 to 13, characterized in that, The filter port structure also includes a debugging connector, which is connected to the circuit board.

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