Feeding device, antenna and communication device

Abstract

The application relates to a feeding device, an antenna and a communication device, and relates to the technical field of antennas. A structure similar to a balun is integrated on a metal plate of a cavity for accommodating a feeding circuit of the feeding device, balanced feeding can be realized, and thus the structure of the cavity for accommodating the feeding network can be simplified, and production is facilitated.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and more specifically, to a feeding device, an antenna, and a communication device. Background Technology

[0002] In wireless communication systems, communication devices transmit or receive information via antennas. The maximum radiation direction of the antenna's beam can be continuously adjusted, making network coverage more flexible. The feed circuit in the communication device is a key component for achieving electrical downtilt, supplying power to the antenna. While communication devices typically use metal cavities to house the feed circuit, current metal cavity structures are complex, hindering device manufacturing. Summary of the Invention

[0003] This application provides a feeding device, antenna, and communication equipment. By integrating the protrusion for balancing the feeding into a metal plate for housing the feeding circuit, the structure of the cavity for housing the feeding circuit can be simplified.

[0004] In a first aspect, a power supply device is provided, comprising: a first metal plate, a second metal plate, and a power supply section. The first metal plate includes a first opening; the second metal plate includes a protrusion located on a first side of the first metal plate, and the second metal plate divides a second side of the first metal plate into a first region and a second region; the power supply section includes a first power supply circuit and a first power supply piece, the first power supply circuit being located in the first region, the first power supply piece passing through the first opening, the first power supply piece being spaced apart from the protrusion in a first direction and at least partially overlapping the protrusion in the first direction, a first end of the first power supply piece being coupled to the first power supply circuit, and the first direction being perpendicular to the second metal plate.

[0005] The power supply device provided in this application integrates the protrusion for balancing the power supply onto a metal plate of a cavity for accommodating the power supply circuit, which simplifies the structure of the cavity for accommodating the power supply circuit and improves the production efficiency of the power supply device.

[0006] For example, the protrusions mentioned above may be baluns, or structures that function the same as baluns, thereby achieving balanced power supply.

[0007] For example, the first metal plate and the second metal plate described in this application intersect.

[0008] In some implementations of the first aspect, the first power supply circuit and the first power supply piece are integrally formed.

[0009] One possible implementation is that the first power supply circuit and the first power supply piece are integrally formed, which can be that the first phase shifter in the first power supply circuit and the first power supply piece are integrally formed.

[0010] The power supply device provided in this application can also increase the integration of the power supply section and eliminate the need for soldering between the power supply chip and the power supply circuit, thereby reducing signal transmission loss caused by solder joints.

[0011] In some implementations of the first aspect, the aforementioned second metal plate is integrally formed.

[0012] The power supply device provided in this application can avoid additional connection processes, which can not only reduce costs but also reduce signal transmission loss.

[0013] In some implementations of the first aspect, the first metal plate and the second metal plate are integrally formed.

[0014] This application integrates the first metal plate and the aforementioned second metal plate into a single piece, eliminating the need for welding processes and reducing signal transmission losses.

[0015] In some implementations of the first aspect, the aforementioned protrusions are comb-shaped.

[0016] The comb-shaped protrusions provided in this application can achieve better electrical performance, that is, better balance of electrical signals.

[0017] In some implementations of the first aspect, the first feed plate is arranged parallel to the protrusion.

[0018] This application arranges the feed plate and the protrusion parallel to each other to facilitate the transmission of electromagnetic waves and to better balance the electrical signal.

[0019] In some implementations of the first aspect, the first metal plate further includes a second opening, and the power supply portion further includes a second power supply circuit and a second power supply piece, the second power supply circuit being located in the second region; the second power supply piece passing through the second opening, the second power supply piece being spaced apart from the protrusion in a first direction and at least partially overlapping the protrusion in the first direction, and the first end of the second power supply piece being coupled to the second power supply circuit.

[0020] The power supply device provided in this application can deploy different power supply circuits in different areas, which can avoid mutual interference between different power supply circuits and achieve a compact layout.

[0021] One possible implementation is that the second feeding circuit and the second feeding plate are integrally formed. The integral formation of the second feeding circuit and the second feeding plate can be achieved by integrally forming the second phase shifter in the second feeding circuit with the second feeding plate.

[0022] In some implementations of the first aspect, the power supply device further includes a first cover plate and a second cover plate, wherein the second metal plate and the first cover plate form a first region, and the second metal plate and the second cover plate form a second region.

[0023] The power supply device provided in this application can form two enclosed cavities for accommodating the power supply circuit, which can better prevent signal leakage; and the design of the cover plate can also facilitate the inspection of the power supply circuit.

[0024] In some implementations of the first aspect, the first cover plate includes a fourth opening, the second cover plate includes a fifth opening, the first feed plate passes through the first opening and the fourth opening, and the second feed plate passes through the second opening and the fifth opening.

[0025] The openings on the first and second cover plates of this application can be used for quick positioning during assembly, facilitating assembly.

[0026] In some implementations of the first aspect, the power supply device further includes an insulating layer located between the first cover plate and the second side of the first metal plate, and / or, the insulating layer located between the first cover plate and the first side of the second metal plate; the insulating layer is also located between the second cover plate and the second side of the first metal plate, and / or, the insulating layer is also located between the second cover plate and the second side of the second metal plate.

[0027] The aforementioned insulating layer can prevent other metal plates from resonating with the cavity housing the power supply circuit, thus ensuring the efficiency of signal transmission.

[0028] In some implementations of the first aspect, the first metal plate is bent toward a second side of the first metal plate to form a first region and a second region with the second metal plate.

[0029] The power supply device provided in this application can form two semi-enclosed cavities for accommodating the power supply circuit, which makes the overall power supply device lighter.

[0030] In some implementations of the first aspect, the second metal plate further includes a third metal plate that extends in a direction parallel to the first metal plate.

[0031] In one example, if the power supply device uses a first cover plate and a second cover plate to form a first region and a second region, the aforementioned third metal plate can be installed without welding using the first cover plate and the second cover plate, thus reducing process complexity.

[0032] In another example, if the power supply device forms a first region and a second region by bending the first metal plate toward the second side of the first metal plate, the aforementioned third metal plate can be arranged so that the two semi-enclosed cavities for accommodating the power supply circuit form two fully enclosed cavities for accommodating the power supply circuit, preventing signal leakage.

[0033] In some implementations of the first aspect, the power supply section further includes a second power supply circuit and a second power supply piece, the second power supply circuit being located in the second region; the second power supply piece passing through the first opening, the second power supply piece being spaced apart from the protrusion in a first direction and at least partially overlapping the protrusion in the first direction, and the first end of the second power supply piece being coupled to the second power supply circuit.

[0034] The power supply device provided in this application can reduce the number of openings on the first metal plate and reduce process complexity.

[0035] In some implementations of the first aspect, the first feed piece and the second feed piece are the same.

[0036] For example, the first feed plate and the second feed plate described above can be at least one of the following:

[0037] They use the same materials, have the same manufacturing process, the same shape, and the same size.

[0038] The same feeder design in the above-mentioned power supply device can simplify the feeder manufacturing process and improve the production efficiency of the power supply device.

[0039] In some implementations of the first aspect, the first power supply circuit and the first power supply piece form a first polarized electromagnetic wave, and the second power supply circuit and the second power supply piece form a second polarized electromagnetic wave, wherein the first polarized electromagnetic wave and the second polarized electromagnetic wave are orthogonal.

[0040] The power supply device provided in this application can deploy power supply circuits with different polarizations in different areas to achieve isolation of circuits with different polarizations and reduce interference from electromagnetic wave signals with different polarizations.

[0041] In some implementations of the first aspect, the operating frequency bands of the first power supply circuit and the second power supply circuit include 690MHz to 960MHz, or the operating frequency bands of the first power supply circuit and the second power supply circuit include 1470MHz to 2690MHz.

[0042] In a second aspect, an antenna is provided, comprising a feeding device as described in the first aspect and any possible implementation thereof, and a plurality of radiators, the feeding device and at least one of the plurality of radiators being coupled.

[0043] In some implementations of the second aspect, the antenna further includes a reflector, and the first or second metal plate of the feeding device further includes a fixing part connected to the reflector.

[0044] Thirdly, a communication device is provided, including the antenna described in the second aspect and any possible implementation thereof.

[0045] In one possible implementation, the aforementioned communication equipment may include a base station, a radar device, or a device equipped with an antenna, without limitation.

[0046] In some implementations of the third aspect, the communication device also includes a radio frequency circuit connected to an antenna.

[0047] In some implementations of the third aspect, the communication device also includes a signal processor.

[0048] Fourthly, a communication system is provided, which includes the communication devices described in the third aspect and any possible implementation thereof. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the structure of the communication device provided in the embodiments of this application;

[0050] Figure 2 This is a schematic diagram of an example of the power supply device provided in the embodiments of this application;

[0051] Figure 3 This is a schematic diagram of an example structure of the separately manufactured first metal plate 10 and second metal plate 20 provided in the embodiments of this application;

[0052] Figure 4 This is a schematic diagram of an example of the integrally formed first metal plate 10 and second metal plate 20 provided in the embodiments of this application;

[0053] Figure 5 This is a schematic diagram of the integrated first power supply circuit 303 and the first power supply piece 301 provided in the embodiments of this application;

[0054] Figure 6 This is a schematic diagram of an example structure of the second metal plate 20 provided in an embodiment of this application;

[0055] Figure 7 This is a schematic diagram showing the positional relationship between the protrusion 201 and the first feed plate 301 provided in an embodiment of this application;

[0056] Figure 8 This is another structural schematic diagram of the power supply device provided in the embodiments of this application;

[0057] Figure 9 This is a schematic diagram of an example of the first opening 101 provided in an embodiment of this application;

[0058] Figure 10This is another schematic diagram of the first opening 101 provided in the embodiments of this application;

[0059] Figure 11 This is another schematic diagram of the first opening 101 provided in the embodiments of this application;

[0060] Figure 12 This is a schematic diagram of an example of the first cover plate 40 and the second cover plate 50 provided in an embodiment of this application;

[0061] Figure 13 This is another schematic diagram of the first cover plate 40 and the second cover plate 50 provided in the embodiments of this application;

[0062] Figure 14 This is another schematic diagram of the first cover plate 40 and the second cover plate 50 provided in the embodiments of this application;

[0063] Figure 15 This is another schematic diagram of the first cover plate 40 and the second cover plate 50 provided in the embodiments of this application;

[0064] Figure 16 This is another schematic diagram of the first cover plate 40 or the second cover plate 50 provided in the embodiments of this application;

[0065] Figure 17 This is another structural schematic diagram of the power supply device provided in the embodiments of this application;

[0066] Figure 18 This is another example of a structural schematic diagram of the power supply device provided in the embodiments of this application;

[0067] Figure 19 This is an example disassembled diagram of the power supply device provided in this application embodiment;

[0068] Figure 20 This is another example of a structural schematic diagram of the power supply device provided in the embodiments of this application;

[0069] Figure 21 This is a schematic diagram of the fixed flange provided in an embodiment of this application;

[0070] Figure 22 This is a schematic diagram of an example structure of the antenna provided in an embodiment of this application;

[0071] Figure 23 This is another structural schematic diagram of the antenna provided in the embodiments of this application;

[0072] Figure 24 This is another example of the antenna structure provided in the embodiments of this application. Detailed Implementation

[0073] The following explains some of the terms that appear in the embodiments of this application.

[0074] Coupling can be understood as direct coupling or indirect coupling. "Coupled connection" can be understood as either direct or indirect coupling. Direct coupling, also known as "electrical connection," refers to the physical contact and electrical conduction of components; it can also be understood as the connection between different components in a circuit structure via physical lines such as copper foil or wires on a printed circuit board (PCB) capable of transmitting electrical signals. "Indirect coupling" can be understood as two conductors conducting electricity through a gap / non-direct contact. In one possible implementation, indirect coupling can also be called capacitive coupling, for example, using the coupling between the gaps between two conductive components to form an equivalent capacitance to achieve signal transmission.

[0075] Radiator: A radiator is a device in an antenna used to receive / transmit electromagnetic wave radiation. It converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The radiator can also convert electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0076] End / Point: The "end" in the first / second end of the feed sheet can be understood as an endpoint or end that is physically disconnected from other conductive structures, or it can be considered as a point or segment on a continuous feed sheet. In one possible implementation, "end" can include a connection / coupling region on the feed sheet that is coupled to other conductive structures. For example, the first end of the feed sheet can be a coupling region on the feed sheet that is coupled to the feed circuit (e.g., a region facing a part of the feed circuit).

[0077] A balun is used to switch between balanced and unbalanced transmission lines and can be applied in antennas, RF circuits, audio equipment, etc. Due to current imbalance, impedance mismatch, and common-mode interference between different conductive components, direct connection can lead to high signal-to-noise ratio and severe signal loss. A balun can be placed between these different conductive components to balance the power supply and reduce interference.

[0078] Communication band / operating band: The range of frequencies in which the antenna operates, or the bandwidth. For example, an antenna that supports the B40 band operates within the frequency range of 2300MHz to 2400MHz, or in other words, the antenna's operating band includes the B40 band.

[0079] Antenna: The antennas involved in the embodiments of this application can be network-side antennas, terminal-side antennas, base station antennas, small station / indoor antennas, microwave antennas, active antennas or passive antennas, etc., and this application does not limit them.

[0080] An antenna mainly consists of one or more of the following: radiators, reflectors, feeding circuits, and radomes. The feeding circuit provides the power supply. In the antenna field, feeding can refer to supplying power to the antenna, or in other words, providing energy. The function of the feeding circuit is to feed signals with a certain amplitude and phase to the various radiators of the antenna, or to feed signals received from the various radiators to the signal processor of the communication equipment with a certain amplitude and phase.

[0081] For example, the power supply circuit involved in this application can also be understood as a power supply network or a power distribution network.

[0082] Communication equipment: For example, communication equipment can be a base station, which can be a device used to communicate with terminal equipment. For example, communication equipment can be a base transceiver station (BTS) in a Global System for Mobile Communication (GSM) or Code Division Multiple Access (CDMA) system; a Node B (NB) in a Wideband Code Division Multiple Access (WCDMA) system; an Evolutionary Node B (eNB or eNodeB) or Transmission Reception Point (TRP) in a Long Term Evolution (LTE) system; a Next Generation Node B (gNodeB or gNB) in a 5th Generation (5G) or New Radio (NR) system; access network equipment in an Open RAN (O-RAN or ORAN) system; a radio controller in a Cloud Radio Access Network (CRAN); or a wireless... Access nodes in a Wi-Fi system, next-generation base stations in future mobile communication systems, servers, vehicles, in-vehicle equipment, wearable devices, or base stations in vehicle-to-everything (V2X) technology (e.g., roadside units, RSUs), etc., are not specifically limited in this application.

[0083] Figure 1 This is a schematic diagram of a communication device. For example... Figure 1 As shown, the communication equipment includes: antenna 01, antenna adjustment bracket 02, mounting bracket 03, cable 04, radio frequency circuit 05, signal processor 06, grounding assembly 07, and connector seal 08.

[0084] In practical applications, antenna 01 can be mounted on mounting bracket 03 via antenna adjustment bracket 02. Antenna adjustment bracket 02 is used to adjust the downtilt angle of antenna 01 to facilitate signal reception or transmission. In one possible implementation, the communication device may not include antenna adjustment bracket 02, but only a bracket capable of mounting antenna 01 onto mounting bracket 03; this bracket may not have downtilt angle adjustment functionality. In another possible implementation, antenna 01 can be directly mounted on mounting bracket 03.

[0085] For example, the mounting bracket 03 can be a pole or a tower, etc.

[0086] Antenna 01 includes radome 09. The radome has good electromagnetic wave penetration characteristics in terms of electrical performance and can withstand the influence of harsh external environments in terms of mechanical performance, thus protecting the components inside the radome 09 from the influence of the external environment.

[0087] Antenna 01 can be connected to radio frequency circuit 05 via cable 04'.

[0088] Grounding component 07 is installed on cable 04. Grounding component 07 can perform functions such as electrical grounding, lightning protection, overvoltage protection, and maintenance of equipment performance, which helps to ensure the stability and safety of communication equipment operation.

[0089] The connector seal 08 can be located at the connection between the antenna radome 09 of the antenna 01 and the cable 04', and / or, the connector seal 08 can be located at the connection between the grounding component 07 and the cable 04, to provide insulation and sealing. For example, the connector seal 08 can be insulating sealing tape or polyvinyl chloride (PVC) insulating adhesive. The connector seal 08 can also have other structures and is not limited to the form of tape.

[0090] The components located inside the radome 09 in antenna 01 can be connected to the signal processor 06 via the radio frequency circuit 05. The signal processor 06 can also be connected to these components via the radio frequency circuit 05. Thus, the radio frequency circuit 05 can perform frequency selection, amplification, and down-conversion processing on the signal received by antenna 01, converting it into an intermediate frequency (IF) signal or a baseband signal and sending it to the signal processor 06. Alternatively, the radio frequency circuit 05 can up-convert and amplify the signal from the signal processor 06 or the IF signal, converting it into electromagnetic waves through antenna 01 and transmitting it.

[0091] In wireless communication systems, communication devices transmit or receive information via antennas. The feed circuit within the antenna is a key component for adjusting the electrical downtilt angle. While communication devices currently use metal cavities to house the feed circuit, these cavities are structurally complex, hindering device manufacturing. Therefore, this application provides a feed device, antenna, and communication device. By integrating the structure for balancing the feed into the cavity structure housing the feed circuit, the overall structure of the feed device is simplified, improving production efficiency.

[0092] The feeding device, antenna, and communication equipment of the present application will now be described with reference to the accompanying drawings.

[0093] by Figure 2 Taking the power supply device shown as an example, the power supply device provided in this application embodiment includes a first metal plate 10, a second metal plate 20, and a power supply section 30. The first metal plate 10 includes a first opening 101. The second metal plate 20 includes a protrusion 201, which is located on the first side of the first metal plate 10, and the second metal plate 20 divides the second side of the first metal plate 10 into a first region and a second region. In other words, a portion of the second metal plate 20 is disposed on the second side of the first metal plate 10, or, in other words, the portion of the second metal plate 20 other than the protrusion 201 is disposed on the second side of the first metal plate 10.

[0094] The power supply section 30 includes a first power supply piece 301 and a first power supply circuit 303. The first power supply circuit 303 is located in a first region, and the first end of the first power supply piece 301 is coupled to the first power supply circuit 303. Alternatively, the first power supply circuit 303 is located in a first region on the second side of the first metal plate 10, and is located on the same side as a portion of the second metal plate 20.

[0095] The first end of the first feed piece 301 is coupled to the first feed circuit 303 at the first opening 101; or it can be located in the first region and close to the first opening 101.

[0096] If the first end of the first feed piece 301 is coupled to the first feed circuit 303 at the first opening 101, the first feed piece 301 is disposed on the first side of the first metal plate 10; if the first end of the first feed piece 301 is coupled to the first feed circuit 303 at the first region and close to the first opening 101, a part of the first feed piece 301 is disposed on the first side of the first metal plate 10 and another part is disposed on the second side of the first metal plate 10.

[0097] The first feed plate 301 is spaced apart from the protrusion 201 in a first direction and at least partially overlaps with the protrusion 201 in the first direction, and the first direction is perpendicular to the second metal plate 20.

[0098] by Figure 2 For example, the first side of the first metal plate 10 can be the side corresponding to the positive Z-axis direction, and the second side of the first metal plate 10 can be the side corresponding to the negative Z-axis direction. The first direction can be... Figure 2 Given the direction of the Y-axis, the first region can be understood as the region of the second metal plate 20 along the positive direction of the Y-axis, and the second region can be understood as the region of the second metal plate 20 along the negative direction of the Y-axis.

[0099] The first metal plate and the second metal plate of the power supply device provided in this application embodiment can form a cavity structure for accommodating the power supply circuit, and the protrusion for balancing the power supply is integrated on the second metal plate for accommodating the power supply circuit, which simplifies the overall structure of the power supply device and can improve production efficiency.

[0100] Figure 2 The structure shown can be manufactured using different processes.

[0101] One possible implementation is that the first metal plate 10 and the second metal plate 20 can be manufactured separately and spliced ​​together, that is, the two metal plates are produced using a non-integral molding process when combined. Figure 3 (a) shows an example structural schematic of a separately fabricated first metal plate 10 and second metal plate 20. In this implementation, the first metal plate 10 may further include a third opening 103, such as... Figure 3 As shown in (b), the protrusion 201 on the second metal plate 20 passes through the third opening 103 on the first metal plate 10 and is joined together with the first metal plate 10. The protrusion 201 is located on the first side of the first metal plate 10. Furthermore, the second metal plate 20 is integrally formed, that is, the protrusion 201 on the second metal plate 20 may be formed on a single metal plate; or, the second metal plate 20 may be formed by joining the protrusion 201 with another metal plate. The above process can be selected according to requirements, and this application is not limited thereto.

[0102] The above implementation involves creating a first opening 101 for the first feed piece 301 and a third opening 103 for the protrusion 201 on the first metal plate 10. Alternatively, only one opening can be created on the first metal plate 10, allowing both the first feed piece 301 and the protrusion 201 to pass through, such as... Figure 17 and Figure 18 As shown.

[0103] Another possible implementation is that the first metal plate 10 and the second metal plate 20 are integrally formed, that is, any component of the first metal plate 10 and the second metal plate 20 is manufactured using an integral forming process. Figure 4 (a) shows a schematic diagram of an example structure of a one-piece molded first metal plate 10 and a second metal plate 20. That is, Figure 4 Neither the first metal plate 10 nor any part of the second metal plate 20 shown in (a) is detachable. In this implementation, there is no need to create a third opening 103 on the first metal plate 10 for the protrusion 201 to pass through. Figure 4 (b) shows the projection of the first opening 101 on the first metal plate 10 and the protrusion 201 on the second metal plate 20 onto the first metal plate 10.

[0104] The first metal plate 10 and the second metal plate 20 of this application can form a cross-shaped structure. The first metal plate 10 can be considered as the horizontal part of the cross-shaped structure, and the second metal plate 20 can be considered as the vertical part of the cross-shaped structure. This cross-shaped structure can be an open profile.

[0105] The first metal plate 10 or the second metal plate 20 provided in this application, whether or not they are integrally formed, can be obtained by sheet metal stamping processes.

[0106] Not only can the manufacturing processes of the first metal plate 10 and the second metal plate 20 be arbitrarily selected, but the manufacturing process of the power supply section 30 can also be flexibly selected. The first power supply circuit 303 and the first power supply piece 301 included in the power supply section 30 can also be manufactured using an integral molding process, such as... Figure 5 As shown. The power supply section 30 can also be manufactured using a non-integrated molding process, that is, the first power supply circuit 303 and the first power supply piece 301 are connected by a separate connection process.

[0107] The power supply unit provided in this application, regardless of whether its internal components are integrally molded, can all be processed separately using sheet metal stamping technology.

[0108] The first feed piece 301 can be a stripline or a microstrip line, and the first feed circuit 303 can also be a stripline or a microstrip line. In one possible implementation, the feed section 30 may further include a first dielectric substrate and a second dielectric substrate, with the first feed piece 301 located between the first and second dielectric substrates to form a stripline structure. Alternatively, it may include only one dielectric substrate, with the first feed piece 301 located on the surface of this dielectric substrate to form a microstrip line structure. The first feed circuit 303 can be implemented with reference to the first feed piece 301, and will not be described further.

[0109] For example, the first power supply circuit 303 may include any one or more of the following devices: phase shifter, power divider, coupler, combiner, filter, etc., which are not limited in this application.

[0110] In this application, the specific methods of integral molding can be die casting, casting, etc.

[0111] Combination Figures 2 to 4 , Figure 6 A schematic diagram of one structure of the second metal plate 20 described above is shown. Figure 6 The dotted line outlines the protrusion 201 on the second metal plate 20. Exemplarily, the protrusion 201 can be a balun, or a structure with the same function as a balun, thereby achieving balanced power supply. Exemplarily, the shape of the protrusion 201 can be... Figure 2 , Figure 3 , Figure 4 or Figure 6 The comb-like shape shown can also be Figure 5 The application does not limit the shape to other shapes such as flat plates shown. Figure 5 The flat, raised portion 201 shown may be formed on the second metal plate 20, or... Figure 5 The flat, raised portion 201 shown can be joined with another metal plate to form a second metal plate 20.

[0112] Combination Figures 2 to 6 One possible implementation is that the first feed plate 301 and the protrusion 201 are spaced apart, or arranged in parallel. This arrangement can improve the efficiency of electromagnetic wave transmission between the first feed plate 301 and the protrusion 201. The distance between the first feed plate 301 and the protrusion 201 in the first direction can be arbitrarily set. For example, the distance between the first feed plate 301 and the protrusion 201 in the first direction can be 2mm, 5mm, etc. Figure 7 As shown, the plane where the protrusion 201 is located is parallel to the plane formed by the X-axis and the Z-axis, and the plane where the first feed plate 301 is located is also parallel to the plane formed by the X-axis and the Z-axis. Therefore, the positional relationship between the first feed plate 301 and the protrusion 201 is that they are set in parallel.

[0113] One possible implementation is that the first feed plate 301 and the protrusion 201 partially overlap in the first direction. This can also be understood as the projections of the first feed plate and the protrusion 201 in the first direction overlapping. This ensures that the protrusion effectively balances the power supply.

[0114] Combination Figures 2 to 7 In one possible implementation, the power supply unit 30 in this embodiment may further include a second power supply piece 302 and a second power supply circuit 304. Figure 8(Not shown in the image), the second power supply circuit 304 is located in the second region, and the first end of the second power supply piece 302 is coupled to the second power supply circuit 304. It can also be understood that the second power supply circuit 304 is located in the second region of the second side of the first metal plate 10, and is located on the same side as a portion of the second metal plate 20.

[0115] The first metal plate 10 may further include a second opening 102, wherein the first end of the second feed piece 302 is coupled to the second feed circuit 304. Figure 3 (b) and Figure 4 As shown in (b).

[0116] The first end of the second feed piece 302 is coupled to the second feed circuit 304 at the second opening 102; or it can be located in the second region and close to the second opening 102.

[0117] If the first end of the second feed piece 302 is coupled to the second feed circuit 304 at the second opening 102, the second feed piece 302 is disposed on the first side of the first metal plate 10; if the first end of the second feed piece 302 is coupled to the second feed circuit 304 at the second region and close to the second opening 102, a part of the second feed piece 302 is disposed on the first side of the first metal plate 10 and another part is disposed on the second side of the first metal plate 10.

[0118] The second feed plate 302 is disposed at a distance from the protrusion 201 in the first direction and at least partially overlaps with the protrusion 201 in the first direction. The positional relationship between the second feed plate 302 and the protrusion 201 can be referred to the positional relationship between the first feed plate 301 and the protrusion 201 described above, and will not be repeated here.

[0119] The manufacturing processes of the second power supply circuit 304 and the second power supply piece 302 included in the power supply unit 30 are similar to those of the first power supply circuit 303 and the first power supply piece 301 included in the power supply unit 30, and can be flexibly selected. For example, the second power supply circuit 304 and the second power supply piece 302 can be manufactured using an integral molding process, or the power supply connection can be achieved through a separate connection process.

[0120] The second feed piece 302 can be a stripline or a microstrip line, and the second feed circuit 304 can also be a stripline or a microstrip line. In one possible implementation, the feed section 30 may further include a third dielectric substrate and a fourth dielectric substrate, with the second feed piece 302 located between the third and fourth dielectric substrates to form a stripline structure. Alternatively, it may include only one dielectric substrate, with the second feed piece 302 located on the surface of this dielectric substrate to form a microstrip line structure. The implementation of the second feed circuit 304 can be referenced to that of the second feed piece 302 and will not be described further.

[0121] For example, the second power supply circuit 304 may include any one or more of the following devices: phase shifter, power divider, coupler, combiner, filter, etc., which are not limited in this application.

[0122] For example, the first feed piece 301 and the second feed piece 302 are identical. Further, the integrally formed first feed circuit 303 and the first feed piece 301 are identical to the integrally formed second feed circuit 304 and the second feed piece 302. The similarity can be at least one of the following: identical materials, identical manufacturing processes, identical shapes, identical dimensions, etc.

[0123] In one possible implementation, the first feed plate 301 and the second feed plate 302 in this application can be symmetrically arranged about the plane where the protrusion 201 is located. The protrusion 201 can be used simultaneously for power balancing of the first and second feed plates, improving the efficiency of power balancing.

[0124] against Figures 2 to 8 The embodiments of this application may also provide various shapes of openings (e.g., the first opening 101 or the second opening 102). Taking the first opening 101 as an example, Figures 9 to 11 A schematic diagram of various first openings 101 is shown.

[0125] Figure 9 The first opening 101 shown can be U-shaped. Similarly, the second opening 102 can also be U-shaped. Alternatively, the first opening 101 or the second opening 102 can also be understood as a semi-open U-shaped groove.

[0126] Figure 10 The first opening 101 shown can be circular, that is, the first opening 101 is a circular hole opened on the first metal plate 10. Similarly, the second opening 102 can also be circular.

[0127] Figure 11 The first opening 101 shown can be wavy. Similarly, the second opening 102 can also be wavy. Alternatively, the first opening 101 or the second opening 102 can also be understood as a wavy groove.

[0128] Apart from Figures 9 to 11 As shown, the shape of the first opening 101 or the second opening 102 on the first metal plate 10 can be arbitrary, and this application does not limit it.

[0129] The various shapes of the first openings provided in the embodiments of this application can meet different needs. For example, a U-shaped opening has the advantages of being easy to open and easy to assemble the feed plate, a circular hole opening has the advantage of being easy to fix the feed plate, and a wavy opening can simultaneously have the advantages of being easy to assemble and easy to fix the feed plate.

[0130] In this embodiment of the application, the number of first openings 101 is greater than or equal to the number of first feed plates 301, and the number of second openings 102 is greater than or equal to the number of second feed plates 302.

[0131] In the case where the power supply unit 30 also includes a second power supply piece 302 and a second power supply circuit 304, it can be understood that the power supply unit 30 may include a first power supply unit 30A and a second power supply unit 30B. The first power supply unit 30A includes a first power supply piece 301 and a first power supply circuit 303, and the second power supply unit 30B includes a second power supply piece 302 and a second power supply circuit 304.

[0132] In this embodiment of the application, the first feed circuit 303 and the first feed piece 301 can generate electromagnetic waves with a first polarization, and the second feed circuit 304 and the second feed piece 302 can generate electromagnetic waves with a second polarization. The electromagnetic waves with the first polarization are orthogonal to the electromagnetic waves with the second polarization. For example, the first polarization can be one of horizontal polarization and vertical polarization, and the second polarization can be another polarization method different from the first polarization, either horizontal or vertical. It can also be understood that the first feed part 30A can generate electromagnetic waves with the first polarization, and the second feed part 30B can generate electromagnetic waves with the second polarization.

[0133] In this embodiment, the first feed circuit 303 for forming an electromagnetic wave of the first polarization can be placed in a first region, and the second feed circuit 304 for forming an electromagnetic wave of the second polarization can be placed in a second region, thereby improving the isolation between the two circuits. For example, to allow the first feed section 30A and the second feed section 30B to form electromagnetic waves of different polarizations, the assembly position of the first feed section 30A and the assembly position of the second feed section 30B can be such that the first feed section 30A and the second feed section 30B are rotationally symmetrical, such as... Figure 19 As shown.

[0134] The first metal plate 10 in this embodiment can be considered as an isolation plate between the first feed piece 301 and the first feed circuit 303, and / or, the first metal plate 10 can be considered as an isolation plate between the second feed piece 302 and the second feed circuit 304. The second metal plate 20 in this embodiment can be used as an isolation plate between the first feed section 30A and the second feed section 30B.

[0135] The first feed piece 301 and the protrusion 201 described above are considered as a feed group (if a second feed piece exists in the feed device, then the second feed piece is also considered as part of this feed group). The feed device provided in this embodiment can be provided with multiple feed groups at intervals, and the interval between adjacent feed groups in the multiple feed groups can be arbitrarily set. In one possible implementation, the first feed circuit 303 can be coupled to the first feed piece 301 of each of the multiple feed groups. If the feed section 30 also includes a second feed piece 302 and a second feed circuit 304, each of the multiple feed groups also includes a second feed piece 302, and the second feed circuit 304 can be coupled to the second feed piece 302 of each of the multiple feed groups.

[0136] The first and second regions of the power supply device provided in this application embodiment can be implemented in various ways.

[0137] In one possible implementation, the power supply device provided in this application embodiment may include cover plates for forming the first region and the second region, such as a first cover plate 40 and a second cover plate 50. The first cover plate 40 and the second metal plate 20 can form the first region, and the second cover plate 50 and the second metal plate 20 can form the second region.

[0138] To facilitate coupling between the first feed plate 301 and the first feed circuit 303, the first cover plate 40 also includes a fourth opening 401, such as... Figure 19 As shown in (a), the first feed plate 301 can pass through the first opening 101 and the fourth opening 401. Similarly, to facilitate the coupling connection of the second feed plate 302 and the second feed circuit 304, the second cover plate 50 also includes a fifth opening 501, as shown in (a). Figure 19 As shown in (b), the second feed plate 302 can pass through the second opening 102 and the fifth opening 501. Exemplarily, the shape of the fourth opening 401 can be arbitrary, and this application is not limited thereto. For example, the shape of the fourth opening 401 can be the same as the shape of the first opening 101 described above.

[0139] For example, the shape of the fifth opening 501 can be arbitrary, and this application does not limit it. For instance, the shape of the fifth opening 501 can be the same as the shape of the second opening 102 described above.

[0140] The first cover plate 40 and the second cover plate 50 can be obtained by sheet metal stamping process.

[0141] The first cover plate 40 and the second cover plate 50 not only form two fully enclosed cavities to accommodate the power supply circuit and prevent signal leakage, but also facilitate disassembly and inspection of the power supply circuit. The openings provided on the first cover plate 40 and the second cover plate 50 can be used as positioning ports during assembly, facilitating accurate and rapid assembly.

[0142] The cross-section of the first cover plate 40 or the second cover plate 50 along the plane formed by the Z-axis and Y-axis is C-shaped, such as... Figure 12 , 13 As shown in Figure 15; or, the cross-section of the first cover plate 40 or the second cover plate 50 along the plane formed by the Z-axis and Y-axis is G-shaped, as shown in Figure 15. Figure 14 As shown; or, the cross-section of the first cover plate 40 or the second cover plate 50 along the plane formed by the Z-axis and Y-axis can also be any other arbitrary shape, for example Figure 16 The M-shape shown Figure 16 The right side can also be understood as an I-shape), an isosceles trapezoid ( Figure 16 It can be a circle (left side), or even a semi-circle (not shown in the figure), or any other shape. Any structure that can form a closed cavity is acceptable. Figure 12 The two dashed lines in the image define the first region formed by the first cover plate 40 and the first side of the second metal plate 20, and the second region formed by the second cover plate 50 and the second side of the second metal plate 20, respectively. Other shapes of cover plates and the second metal plate 20 do not define the first or second region. Figure 12 The cover plate shown is similar to the first and second regions formed by the second metal plate 20.

[0143] The cross-section of the first cover plate 40 or the second cover plate 50 along the plane formed by the Z-axis and Y-axis can be C-shaped. Therefore, the first cover plate 40 or the second cover plate 50 can also be referred to as a C-shaped cavity, which can be a thin plate structure. The power supply device forms a first region or a second region through the first cover plate 40 or the second cover plate 50, which can be understood as the power supply device including a single C-shaped cavity; the power supply device forms a first region and a second region through the first cover plate 40 and the second cover plate 50, which can be understood as the power supply device including a double C-shaped cavity.

[0144] It should be understood that the cross-section of the first cover plate 40 or the second cover plate 50 on the plane formed by the Z-axis and the Y-axis is symmetrical along the second metal plate 20, or it may be asymmetrical. For example, the cross-section of the first cover plate 40 on the plane formed by the Z-axis and the Y-axis may be C-shaped, and the cross-section of the second cover plate 50 on the plane formed by the Z-axis and the Y-axis may be G-shaped. Those skilled in the art will understand that the cross-sections of the two cover plates on the plane formed by the Z-axis and the Y-axis may be of any shape, and this application does not limit them.

[0145] Furthermore, the second metal plate 20 in the power supply device provided in this application may also include a third metal plate 30. For example... Figure 15As shown. Figure 15 For example, the third metal plate 30 extends in a direction parallel to the first metal plate 10 (e.g., along the plane formed by the X and Y axes). Figure 15 In this application, the first cover plate 40 and the second cover plate 50 can be connected to the power supply device via an interference fit. In addition to... Figure 15 Other types of cover plates may also be equipped with a third metal plate 30, but this application is not limited to this.

[0146] The third metal plate 30 and the second metal plate 20 can be manufactured using an integral molding process; or, they can be manufactured using a non-integral molding process, that is, the third metal plate 30 and the second metal plate 20 can be manufactured separately and spliced ​​together.

[0147] When the power supply device provided in this application includes a cover plate for forming the aforementioned first and second regions, the power supply device may further be provided with an insulating layer 60. The insulating layer can prevent other metal plates from resonating with the first and second regions, ensuring the efficiency of signal transmission. The location of the insulating layer is as follows: Figures 12 to 15 As shown. The insulating layer 60 in this embodiment can be any insulating medium, and this application does not limit it.

[0148] The insulating layer 60 can be disposed between the first cover plate 40 and the metal plate to be contacted, depending on the shape of the first cover plate 40. Similarly, the insulating layer 60 can also be disposed between the second cover plate 50 and the metal plate to be contacted, depending on the shape of the second cover plate 50.

[0149] The insulating layer 60 is located between the first cover plate 40 and the second side of the first metal plate 10, and / or, the insulating layer 60 is located between the first cover plate 40 and the first side of the second metal plate 20. Similarly, the insulating layer 60 is located between the second cover plate 50 and the second side of the first metal plate 10, and / or, the insulating layer 60 is located between the second cover plate 50 and the second side of the second metal plate 20.

[0150] The following is based on Figures 12 to 15 Taking the shape of the cover plate shown as an example, the method of setting the insulating layer 60 is introduced.

[0151] Figure 12 The insulating layer 60 shown is located between the first cover plate 40 and the second side of the first metal plate 10. Similarly, the insulating layer 60 is also located between the second cover plate 50 and the second side of the first metal plate 10.

[0152] Figure 12The contact point 1 between the first cover plate 40 and the second metal plate 20 needs to be connected. For example, the contact point 1 between the first cover plate 40 and the second metal plate 20 can be connected by dispensing glue or welding. Similarly, the contact point 2 between the second cover plate 50 and the second metal plate 20 needs to be connected. For example, the contact point 2 between the second cover plate 50 and the second metal plate 20 can also be connected by dispensing glue or welding.

[0153] Figure 13 The insulating layer 60 shown is located between the first cover plate 40 and the first side of the second metal plate 20. Similarly, the insulating layer 60 is located between the second cover plate 50 and the second side of the second metal plate 20.

[0154] Figure 14 The insulating layer 60 shown is located between the first cover plate 40 and the second side of the first metal plate 10, and between the first cover plate 40 and the first side of the second metal plate 20. Similarly, the insulating layer 60 is also located between the second cover plate 50 and the second side of the first metal plate 10, and between the second cover plate 50 and the second side of the second metal plate 20.

[0155] Figure 15 The insulating layer 60 shown is located between the first cover plate 40 and the second side of the first metal plate 10, and between the first cover plate 40 and the first side of the third metal plate 30. Similarly, the insulating layer 60 is also located between the second cover plate 50 and the second side of the first metal plate 10, and between the second cover plate 50 and the first side of the third metal plate 30.

[0156] Alternatively, it can be understood that the insulating layer 60 is disposed in the coupling area between the cross-shaped structure formed by the first metal plate 10 and the second metal plate 20 and the first cover plate 40 and the second cover plate 50. Specifically, the insulating layer 60 can be disposed in the coupling area (or lateral coupling) between the transverse portion of the cross-shaped structure and the first cover plate 40 and the second cover plate 50, and / or, the insulating layer 60 can be disposed in the coupling area (or vertical coupling) between the vertical portion of the cross-shaped structure and the first cover plate 40 and the second cover plate 50.

[0157] Combination Figure 12 The vertical portion of the cross-shaped structure can form a T-shaped structure at the connection point with the first cover plate 40 and the second cover plate 50. Combined with... Figure 13 and Figure 14 The first cover plate 40 and the second cover plate 50 can form an L-shaped structure or an L-shaped sheet metal part at the connection with the vertical part of the cross-shaped structure.

[0158] In another possible implementation, the first metal plate 10 in the power supply device provided in this application embodiment is bent toward the second side of the first metal plate 10, and can form the first region and the second region mentioned above with the second metal plate 20.

[0159] by Figure 17 For example, the first metal plate 10 is bent toward the second side of the first metal plate 10 to form an inverted C-shaped cavity. The C-shaped cavity forms a first region with the first side of the second metal plate 20, and the C-shaped cavity forms a second region with the second side of the second metal plate 20.

[0160] The bending of the first metal plate 10 can form an inverted C-shaped cavity, which can be understood as the power supply device including a single C-shaped cavity.

[0161] Figure 17 The power supply device shown is composed of an inverted C-shaped cavity and a second metal plate 20 spliced ​​together. The second metal plate 20 can be understood as a straight cavity.

[0162] Using an off-the-shelf first metal plate, two semi-enclosed cavities are formed to house the power supply circuitry, eliminating the need for additional cover plates and making the power supply device lighter.

[0163] exist Figure 17 Based on the provided power supply device, the power supply device provided in this application embodiment may further include a third metal plate 30. The first metal plate 10 in the power supply device is bent toward the second side of the first metal plate 10, and can form the aforementioned first region and the aforementioned second region with the second metal plate 20 and the third metal plate 30, such as Figure 18 Another example of the power supply device shown is illustrated. The third metal plate 30 extends in a direction parallel to the first metal plate 10 (e.g., along the plane formed by the X and Y axes). This implementation allows the third metal plate 30 to form a closed cavity, achieving better signal isolation and shielding.

[0164] The first metal plate 10 is bent toward its second side to form an inverted C-shaped cavity. This C-shaped cavity, together with the first side of the second metal plate 20 and the first side of the third metal plate 30, forms a first region, and the C-shaped cavity, together with the second side of the second metal plate 20 and the first side of the third metal plate, forms a second region. Figure 18 For example, the first side of the third metal plate 10 can be the side corresponding to the positive direction of the Z-axis.

[0165] The third metal plate 30 and the second metal plate 20 can be manufactured using an integral molding process; or, they can be manufactured using a non-integral molding process, that is, the third metal plate 30 and the second metal plate 20 can be manufactured separately and spliced ​​together.

[0166] Figure 18 The power supply device shown is composed of an inverted C-shaped cavity, a second metal plate 20 and a third metal plate 30 spliced ​​together. The combination of the second metal plate 20 and the third metal plate 30 can be understood as a T-shaped cavity.

[0167] The third metal plate 30 can be connected to the C-shaped cavity. For example, the fixing part 104 of the third metal plate 30 and the C-shaped cavity can be connected by welding, riveting, bonding, snap-fitting, etc.

[0168] Figure 18 The power supply device shown can form two fully enclosed cavities to house the power supply circuit. Figure 17 The power supply device shown is Figure 18 Compared to the power supply device shown, Figure 17 The power supply device shown is suitable for processing lower frequency signals. Figure 18 The power supply device shown can be used for processing higher frequency signals, and various implementation forms of the power supply device provided in the embodiments of this application can be flexibly selected under different communication frequency bands.

[0169] Combination Figures 2 to 16 To more clearly illustrate the power supply device provided in the embodiments of this application, Figure 19 A disassembled diagram of an example power supply device provided in an embodiment of this application is shown.

[0170] Figure 19 The power supply device, including the first cover plate 40 and the second cover plate 50, is disassembled as an example.

[0171] As mentioned above, the first metal plate 10 and the second metal plate 20 can be manufactured separately. The disassembly of the corresponding power supply device under this implementation is as follows: Figure 19 As shown in (a), it can be generally disassembled into a first metal plate 10, a second metal plate 20, a first cover plate 40, a second cover plate 50, a first power supply section 30A, and a second power supply section 30B.

[0172] As mentioned above, the first metal plate 10 and the second metal plate 20 can also be integrally formed. The disassembly of the corresponding power supply device in this implementation is as follows: Figure 19 As shown in (b), it can be generally disassembled into a first metal plate 10 and a second metal plate 20, a first cover plate 40, a second cover plate 50, a first power supply section 30A, and a first power supply section 30B, all integrally formed.

[0173] from Figure 19 The disassembly diagram of the power supply device also shows that the positional relationship between the first power supply unit 30A and the second power supply unit 30B is rotationally symmetrical.

[0174] The power supply device provided in this application embodiment can place the first power supply circuit 303 only in the first region, or place the second power supply circuit 304 only in the second region. Therefore, the cover plate mentioned above can be set only in the part where the power supply circuit is set, and the corresponding power supply plate and the design matching the power supply circuit can refer to the aforementioned design, and will not be repeated here.

[0175] The operating frequency band of the first power supply circuit 303 and the second power supply circuit 304 in the embodiments of this application can be 690MHz to 960MHz or 1470MHz to 2690MHz or other frequency bands, which are not limited by this application.

[0176] Combination Figures 2 to 19 The power supply device provided in this application embodiment may further include a fixing part. When the power supply device forms a first region and a second region through the first cover plate 40 and the second cover plate 50, the fixing part may be disposed on the first metal plate 10. When the power supply device forms a first region and a second region through the bending of the first metal plate 10, the fixing part may be disposed on the second metal plate 20.

[0177] In one possible implementation, the fixing part of the power supply device provided in this application embodiment can be disposed on the first metal plate 10, denoted as fixing part 104, as follows: Figure 20 The diagram shows an example of a power supply device. Exemplarily, the first metal plate 10 can be bent toward a first side to form a fixing flange that connects to the reflector 80. For example, a cross-sectional view showing the product form of the fixing part 104 and the first metal plate 10 can be found... Figure 21 of (a), Figure 21 (b) and Figure 21 As shown in (c).

[0178] Another possible implementation is that the fixing part of the power supply device provided in this application embodiment can be disposed on the second metal plate 20, denoted as fixing part 203, as follows. Figure 17 or Figure 18 As shown. For example, the fixing part 104 or the fixing part 203 can be used to connect to the reflector 80 in the antenna. For example, the connection can be achieved by welding, riveting, bonding, snap-fitting, etc.

[0179] This application also provides an antenna, such as... Figure 22 As shown. The antenna includes the feeding device described above. The antenna also includes a plurality of radiators 70, and the feeding device is coupled to at least one of the plurality of radiators 70.

[0180] Figure 22The plurality of radiators 70 shown include a first radiator 701, a second radiator 702, a third radiator 703, a fourth radiator 704, a fifth radiator 705, a sixth radiator 706, a seventh radiator 707, and an eighth radiator 708. The antenna provided in the embodiments of this application may also include more or fewer radiators, and this application does not limit this.

[0181] In one possible implementation, the first feed plate 301 and the protrusion 201 in the feeding device are coupled to at least one of the plurality of radiators 70. For example, the feeding device may include eight feed groups, each feed group including a first feed plate 301 and a protrusion 201 (and may also include a second feed plate corresponding to the first feed plate 301). The first feed group of the feeding device is coupled to the first radiator 701, the second feed group of the feeding device is coupled to the second radiator 702, the third feed group of the feeding device is coupled to the third radiator 703, and so on.

[0182] Exemplarily, the radiator involved in this application may include a conductor with a specific shape and size, such as a wire or sheet, etc., and this application does not limit the specific shape. A wire radiator may be simply referred to as a wire antenna. For example, a wire radiator may be implemented with a conductive frame, and may also be called a frame antenna. Yet another example is that a wire radiator may be implemented with a support conductor, and may also be called a support antenna. Exemplarily, the main forms of wire antennas include dipole antennas, half-wave dipole antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFA, Inverted F Antenna).

[0183] The antenna provided in this application embodiment may further include a reflector 80, and the fixing part on the feeding device may be connected to the reflector 80, such as... Figure 23 As shown, Figure 23 The illustration takes the connection between the fixing part 104 on the first metal plate 10 and the reflector 80 as an example. For example, the fixing part on the feeding device and the reflector 80 can be connected by welding, riveting, bonding, snap-fitting, etc. The reflector 80 can be understood as a base plate, antenna panel, or metal plate.

[0184] The antenna provided in this application embodiment may include multiple feeding devices described above, such as Figure 24 As shown, Figure 24 The example given is an antenna comprising four feed devices as described above, each feed device comprising eight feed groups.

[0185] Each of the multiple power supply devices is connected to the reflector 80 via a fixing part.

[0186] Each of the multiple power supply devices is coupled to at least one of the multiple radiators 70.

[0187] The antenna provided in this application embodiment may also include an antenna radome, which is disposed on the outermost layer of the antenna and is used to cover or wrap various components inside the antenna, such as radiators, reflectors, and feed circuits.

[0188] The antenna provided in this application embodiment may also include radio frequency circuitry.

[0189] It should be understood that radio frequency circuitry can be integrated with the antenna to form an active antenna.

[0190] For example, the radio frequency circuit involved in this application may be a remote radio unit (RRU).

[0191] This application also provides a communication device, which includes the antenna described above.

[0192] In one possible implementation, the communication device provided in this application embodiment may further include a radio frequency circuit.

[0193] It should be understood that the antenna and radio frequency circuit in a communication device are integrated, and the antenna included in the communication device is an active antenna; or, the antenna and radio frequency circuit in a communication device are set up independently, and the antenna included in the communication device is a passive antenna.

[0194] In one possible implementation, the communication device provided in this application embodiment may further include a signal processor.

[0195] For example, the signal processor involved in this application may be a baseband unit (BBU).

[0196] This application also provides a communication system, which includes a core network device and the aforementioned communication device, and the core network device and the aforementioned communication device are connected in communication.

[0197] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power supply device, characterized in that, The power supply device includes: A first metal plate, including a first opening; The second metal plate includes a protrusion located on a first side of the first metal plate, and the second metal plate divides a second side of the first metal plate into a first region and a second region. The power supply unit includes a first power supply circuit and a first power supply plate, wherein the first power supply circuit is located in the first region; The first feed plate is spaced apart from the protrusion in a first direction and at least partially overlaps the protrusion in the first direction. The first end of the first feed plate is coupled to the first feed circuit. The first direction is perpendicular to the second metal plate.

2. The power supply device according to claim 1, characterized in that, The first power supply circuit and the first power supply piece are integrally formed.

3. The power supply device according to claim 1 or 2, characterized in that, The second metal plate is integrally formed.

4. The power supply device according to any one of claims 1 to 3, characterized in that, The first metal plate and the second metal plate are integrally formed.

5. The power supply device according to any one of claims 1 to 4, characterized in that, The protrusions are comb-shaped.

6. The power supply device according to any one of claims 1 to 5, characterized in that, The first feed plate is arranged parallel to the protrusion.

7. The power supply device according to any one of claims 1 to 6, characterized in that, The first metal plate further includes a second opening, and the power supply section further includes a second power supply circuit and a second power supply plate, wherein the second power supply circuit is located in the second region. The second feed plate passes through the second opening, the second feed plate is spaced apart from the protrusion in the first direction and at least partially overlaps the protrusion in the first direction, and the first end of the second feed plate is coupled to the second feed circuit.

8. The power supply device according to claim 7, characterized in that, The power supply device also includes a first cover plate and a second cover plate. The second metal plate and the first cover plate form the first region, and the second metal plate and the second cover plate form the second region.

9. The power supply device according to claim 8, characterized in that, The first cover plate includes a fourth opening, and the second cover plate includes a fifth opening. The first feed plate passes through the first opening and the fourth opening, and the second feed plate passes through the second opening and the fifth opening.

10. The power supply device according to claim 8 or 9, characterized in that, The power supply device also includes an insulating layer. The insulating layer is located between the first cover plate and the second side of the first metal plate, and / or the insulating layer is located between the first cover plate and the first side of the second metal plate; The insulating layer is also located between the second cover plate and the second side of the first metal plate, and / or the insulating layer is also located between the second cover plate and the second side of the second metal plate.

11. The power supply device according to any one of claims 1 to 7, characterized in that, The first metal plate is bent toward the second side of the first metal plate, forming the first region and the second region together with the second metal plate.

12. The power supply device according to any one of claims 1 to 11, characterized in that, The second metal plate also includes a third metal plate, which extends in a direction parallel to the first metal plate.

13. The power supply device according to any one of claims 7 to 12, characterized in that, The first feed piece and the second feed piece are the same.

14. The power supply device according to any one of claims 7 to 13, characterized in that, The first feeding circuit and the first feeding plate form a first polarized electromagnetic wave, and the second feeding circuit and the second feeding plate form a second polarized electromagnetic wave. The first polarized electromagnetic wave and the second polarized electromagnetic wave are orthogonal.

15. The power supply device according to any one of claims 7 to 14, characterized in that, The operating frequency bands of the first power supply circuit and the second power supply circuit include 690MHz to 960MHz, or the operating frequency bands of the first power supply circuit and the second power supply circuit include 1470MHz to 2690MHz.

16. An antenna, characterized in that, The antenna includes a feeding device according to any one of claims 1 to 15 and a plurality of radiators, the feeding device being coupled to at least one of the plurality of radiators.

17. The antenna according to claim 16, characterized in that, The antenna also includes a reflector, and the first or second metal plate of the feeding device also includes a fixing part, which is connected to the reflector.

18. A communication device, characterized in that, The communication device includes the antenna as described in claim 16 or 17.

19. The communication device according to claim 18, characterized in that, The communication device further includes a radio frequency circuit, which is connected to the antenna.

20. A communication system, characterized in that, Includes the communication device as described in claim 18 or 19.

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