AIP architecture-based multi-beam phased array antenna

Abstract

The application provides a multi-beam phased array antenna based on an AIP architecture, comprising a multi-beam dual circularly polarized antenna module, the multi-beam dual circularly polarized antenna module comprising an antenna layer, a power combining network layer and a radio frequency layer which are sequentially crimped from top to bottom and a hole structure connected in the antenna layer, the power combining network layer and the radio frequency layer.The application adopts an AIP packaging architecture, vertically stacks components such as antennas and radio frequency circuits in a multi-layer packaging substrate, and replaces traditional complex brick or tile independent TR components.The application realizes a thin and compact system, improves portability and optimizes array performance;the application adopts power division and multi-channel amplitude and phase chips, and can dynamically form multiple independent and reconfigurable beams.The application overcomes the single defect of traditional phased array beams, and adapts to complex signal scenarios;in the application, the antenna and the radio frequency circuit adopt crimping and back drilling processes, reduce the use of cable connectors, reduce additional loss, and ensure high gain of the antenna;the subarray of the application can be expanded to a large array, and the performance is reliable.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and more specifically to a multi-beam phased array antenna based on the AIP architecture. Background Technology

[0002] With the acceleration of global informatization, the satellite communication field is rapidly developing towards high throughput, low latency, wide coverage, and flexible access. Phased array antenna technology based on receiving terminals has become crucial for improving overall system performance. Current phased array receiving systems, especially those designed for mobile platforms or requiring simultaneous reception of multiple beams, face the following prominent technical bottlenecks: Limitations of traditional mechanical antennas and single-beam electronically scanned antennas: Traditional parabolic mechanical antennas are bulky, slow in attitude adjustment, and have high wind resistance, making it difficult to meet the requirements of stable reception and high dynamic tracking for high-speed mobile platforms. Although existing single-beam electronically scanned phased array antennas can achieve electronic beam agility, they cannot simultaneously form and maintain multiple independent beams pointing in different directions, thus failing to achieve multi-beam common-view and multi-service concurrent application scenarios.

[0003] Challenges of multi-beam phased array system integration: In conventional designs, antenna arrays and radio frequency transceiver (T / R) components are often designed and optimized as two independent modules, interconnected via interfaces. This "split" design leads to challenges in signal integrity, low packaging efficiency, and high manufacturing costs. Antenna-in-package (AIP) technology draws on advanced integrated circuit packaging concepts, directly integrating antenna radiating elements, some passive components, and RF chips onto the same package substrate. This enables ultra-short interconnects, excellent high-frequency electrical performance, superior heat dissipation paths, and extremely high integration. The aperture and spacing of isolation vias in different crosstalk risk areas are independently optimized. In sensitive areas, the aperture is reduced, and the spacing is increased to construct a highly isolated coaxial shielding structure. In non-sensitive areas, the vias are arranged sparsely to free up wiring space.

[0004] Current research on AIP technology largely focuses on small-scale arrays in millimeter-wave mobile signals or radar. The challenge lies in innovatively applying the AIP architecture to large-scale phased array systems that support broadband operation and efficiently form multiple independent receiving beams, while simultaneously addressing the significant crosstalk issue arising from high-density chip arrangement in the Ku band. In particular, mature and efficient solutions are currently lacking for communication signal reception applications.

[0005] The existing patent "An AIP Packaging Component" (Patent No.: 202411815058.1) addresses the signal crosstalk problem that commonly occurs in existing AIP packaging components. This patent primarily reduces crosstalk by spacing the chips between them and adding a shielding structure inside the antenna housing to shield the antenna radiator from the chips. However, this method has limited application scenarios. Adding isolation cavities significantly increases the size of individual antenna elements and their corresponding RF chips, making it difficult to handle the smaller element spacing and denser size requirements associated with large scanning angles in large-scale arrays.

[0006] The existing patent, "Multi-beam Phased Array Antenna" (Patent No.: 202210557155.X), realizes a common-aperture multi-beam phased array antenna in a packaged form. This patent primarily utilizes multi-layer PCB lamination, employing single-beam receiving and transmitting chips, interconnected with the receiving antenna radiating / transmitting antenna elements via vertical feed vias. The network and chips are integrated within the network component layer. Combined with the use of a transition matching layer, this avoids the drawbacks of excessive layers, such as difficulty in reducing profile height and surface density, reduced network component layer thickness and manufacturing complexity, large vertical interconnect spans between layers, and difficulty in improving integration. It offers advantages such as low profile and ease of assembly and maintenance. However, the transmit and receive antenna used in this patent is arranged in a cross-layout of transmit and receive frequency bands. Common multi-beam chips are around 5mm in size. In practice, it is difficult to apply to Ku and above frequency bands. The spacing between antenna elements in the Ku band is about ten millimeters. This cross-layout method of transmit and receive elements results in a small chip layout space and greater constraints, thus making the requirements for the application frequency band more stringent.

[0007] Therefore, a multi-beam phased array antenna based on the AIP architecture is needed. Summary of the Invention

[0008] This invention addresses the problems of single-beam design and significant crosstalk in high-density Ku-band chip arrangement of existing phased array antennas. It provides a multi-beam phased array antenna based on an AIP (Air-In-Package) architecture. This AIP architecture highly integrates the antenna array, low-noise amplifier, phase-shifting attenuation network, power supply network, and other components within a multi-layer packaged substrate, reducing interconnect losses and parasitic effects, optimizing array performance, and achieving miniaturization and lightweight design. The phased array designed in this invention achieves wide-angle scanning and miniaturization by reducing element spacing, while maintaining good electrical scanning characteristics, meeting the high-performance requirements of modern and future satellite communication systems for receiving terminals.

[0009] This invention provides a multi-beam phased array antenna based on the AIP architecture, characterized in that it includes a multi-beam dual-circular polarization antenna module, which includes an antenna layer, a power combining network layer, an RF layer, and a hole structure connected in the antenna layer, the power combining network layer, and the RF layer, pressed together from top to bottom. The antenna layer includes an antenna layer dielectric substrate and a radiating patch, a bridge feed network, and an antenna layer GND network connected to the antenna layer dielectric substrate. The beamforming network layer includes a beamforming network layer dielectric substrate and a beamforming network ground layer connected in the beamforming network layer dielectric substrate. The radio frequency (RF) layer includes an RF layer dielectric substrate, a receiver module, a power supply and control module, an RF ground layer, and an output RF connector connected to the RF layer dielectric substrate. The receiving component module includes a low-noise amplifier, a switching chip, a beam splitter network, and a multi-channel amplitude and phase chip connected in sequence to the lower surface of the radio frequency layer dielectric substrate and the bridge feed network. The output of the multi-channel amplitude and phase chip is connected to the beam combining network. The antenna layer dielectric substrate, the power combining network layer dielectric substrate, and the radio frequency layer dielectric substrate are all multilayer substrates. The hole structure includes blind holes and through holes. The radiating patch, the bridge feed network, the receiving component module, the power supply and control module, and the beam combining network are interconnected through the hole structure. The internal wiring of the receiving component module is located on the lower surface of the radio frequency layer dielectric substrate and in the substrate below the radio frequency layer dielectric substrate.

[0010] This invention provides a multi-beam phased array antenna based on AIP architecture. In a preferred embodiment, the radiating patch is n dual-circularly polarized antenna radiating patches, the low-noise amplifier is a dual-channel low-noise amplifier, and the number of multi-channel amplitude and phase chips is 2, with each channel having n, where n≥2. After the spatial signal is received by the radiating patch, it is transmitted to the low noise amplifier via the bridge feed network. After polarization selection by the switching chip, it is split into two paths by the beam power divider network. The two signals enter two multi-channel amplitude and phase chips respectively for pointing adjustment and generate 2*n beam signals. Each beam signal, together with the signals from other multi-beam dual circular polarized antenna modules, enters the corresponding beam combining network to obtain multiple independent receiving beams. The multi-beam dual circularly polarized antenna module operates in the Ku band.

[0011] This invention provides a multi-beam phased array antenna based on the AIP architecture. As a preferred embodiment, the aperture structure includes antenna layer through-holes, antenna layer blind holes, antenna-to-RF layer blind holes, RF layer through-holes, RF layer blind holes, RF layer through-holes, RF layer through-holes, RF layer through-holes, and RF layer to power combining layer blind holes. The antenna layer vias are grounding vias of the antenna layer. The antenna elements are connected to the bridge feed network through the antenna layer blind vias. The bridge feed network is connected to the low-noise amplifier through the antenna-to-RF layer blind vias. The RF layer vias are grounding vias and connect the power supply and control module and the receiver module. The receiver modules are connected to each other through the RF layer blind vias. The multi-channel amplitude and phase chip is connected to the beamforming network through the RF layer-to-power combining layer blind vias. The beamforming network is connected to the output RF connector through the RF layer-to-power combining layer vias. It also includes PP boards for connecting dielectric substrates.

[0012] This invention provides a multi-beam phased array antenna based on an AIP architecture. As a preferred embodiment, the lamination and aperture-opening method for the multi-beam phased array antenna includes the following steps: S1. Complete the fabrication of the antenna layer, power combining network layer and radio frequency layer respectively; S2. Fabricate antenna layer vias, antenna layer blind vias, radio frequency layer vias, and radio frequency layer blind vias respectively; S3. Press the power bonding network layer and the radio frequency layer together to create vias from the radio frequency layer to the power bonding layer and blind vias from the radio frequency layer to the power bonding layer. S4. Laminate the antenna layer onto the top of the power combining network layer and fabricate blind holes from the antenna to the RF layer.

[0013] This invention provides a multi-beam phased array antenna based on an AIP architecture. In a preferred embodiment, the antenna layer dielectric substrate is a five-layer dielectric board, including a first antenna layer made of three layers of dielectric boards laminated together, and a second antenna layer and a feed layer sequentially laminated below the first antenna layer. The antenna layer is a dual-layer microstrip patch dual-circularly polarized antenna, with radiating patches etched on the upper surface of the antenna layer and the upper surface of the second antenna layer, respectively. The bridge feed network is a 90° bridge located on the upper surface of the feed layer, and performs feed conversion. The antenna layer GND network is connected to the lower surface of the second antenna layer and the lower surface of the feed layer.

[0014] This invention provides a multi-beam phased array antenna based on an AIP architecture. In a preferred embodiment, the beamforming network is encapsulated in the inner layer of the power combining network layer dielectric substrate and isolated by the power combining network ground layer; the beamforming network is an equiphase trace.

[0015] This invention provides a multi-beam phased array antenna based on an AIP architecture. In a preferred embodiment, the radio frequency layer dielectric substrate includes a first radio frequency layer dielectric substrate, a second radio frequency layer dielectric substrate, a third radio frequency layer dielectric substrate, a fourth radio frequency layer dielectric substrate, and a fifth radio frequency layer dielectric substrate, which are sequentially laminated together from top to bottom by a PP plate. The low-noise amplifier, switching chip, beam splitter network, and multi-channel amplitude and phase chip are all connected to the lower surface of the fifth RF layer dielectric substrate; The receiving component module has traces on the lower surface and inside of the fifth RF layer dielectric substrate, the lower surface and inside of the fourth RF layer dielectric substrate, and the lower surface of the third RF layer dielectric substrate. The upper surfaces of the third RF layer dielectric substrate and the upper surfaces of the fourth RF layer dielectric substrate are both RF ground layers.

[0016] This invention provides a multi-beam phased array antenna based on an AIP architecture. As a preferred embodiment, the two traces from the antenna feed port of the bridge feed network to the input port of the low-noise amplifier are of equal amplitude and in phase. All the multiple traces from the beam splitter network to the multi-channel amplitude and phase chip are of equal amplitude and in phase.

[0017] This invention provides a multi-beam phased array antenna based on AIP architecture. As a preferred method, the crosstalk risk area in the multi-beam phased array antenna is determined by simulation and divided into sensitive and non-sensitive areas. The size and arrangement spacing of the isolation ground holes are optimized. In the sensitive area, the aperture of the isolation ground holes is reduced and the spacing of the isolation ground holes is increased. In the non-sensitive area, the isolation ground holes are sparsed. The diameter of the isolation via is 0.15~0.3mm, and the spacing between the isolation vias is 1 / 20~1 / 10 of the wavelength.

[0018] This invention provides a multi-beam phased array antenna based on the AIP architecture. As a preferred embodiment, multiple antenna modules are expanded and arrayed to obtain a Ku-band multi-beam phased array antenna that can perform ±60° wide-angle scanning. The number of power combining network layers increases accordingly during arraying. The element spacing of the antenna layer is 11~13mm.

[0019] This invention provides a Ku-band phased array antenna with integrated RF front-end, specifically a design scheme for a Ku-band multi-beam phased array antenna based on an antenna-in-package (AIP) architecture. This design highly integrates the antenna array, low-noise amplifier, phase-shifting attenuation network, power supply, and other components within a multi-layer package substrate, reducing interconnect losses and parasitic effects, optimizing array performance, and achieving a miniaturized and lightweight system design. The phased array designed in this invention achieves wide-angle scanning and miniaturization by reducing element spacing, while maintaining good electrical scanning characteristics, meeting the high-performance requirements of modern and future satellite communication systems for receiving terminals.

[0020] The present invention has the following advantages: (1) High integration and miniaturized system architecture: The AIP packaging architecture is adopted to vertically stack and integrate components such as antennas and RF circuits into a multi-layer packaging substrate, replacing the traditional complex brick-type or tile-type independent TR components. This achieves a thin and compact system, improves portability and optimizes array performance.

[0021] (2) Flexible multi-beam capability: It adopts power divider and multi-channel amplitude and phase chip, which can dynamically form multiple independent and reconfigurable beams. It overcomes the single beam defect of traditional phased array and adapts to complex signal scenarios.

[0022] (3) Solving the line loss problem: In this invention, the antenna and the radio frequency circuit adopt a pressing and back drilling process, which reduces the use of cable connectors, reduces additional losses, and ensures the high gain of the antenna.

[0023] (4) High reliability: The present invention is a phased array based on AIP packaging architecture. The subarray can be expanded into a large array, making it more flexible in actual use. The modular design facilitates maintenance and replacement, and the performance is more reliable. Attached Figure Description

[0024] Figure 1 This is a stacked design diagram of a multi-beam phased array antenna based on the AIP architecture; Figure 2 This is a cross-sectional schematic diagram of a multi-beam phased array antenna based on the AIP architecture; Figure 3 This is a top view of a 2*4 antenna element module of a multi-beam phased array antenna based on the AIP architecture; Figure 4 This is a schematic diagram of 2*4 element radio frequency transmission for a multi-beam phased array antenna based on AIP architecture; Figure 5 This is a schematic diagram of a 2*4 element RF link design for a multi-beam phased array antenna based on an AIP architecture. Figure 6 A schematic diagram of a Wilkinson power divider model for a multi-beam phased array antenna based on the AIP architecture; Figure 7 This is a schematic diagram of a grounding hole in the layout of a multi-beam phased array antenna based on an AIP architecture. Figure 8 This is a scanning characteristic diagram of an array element in an embodiment of a multi-beam phased array antenna based on an AIP architecture. Figure 9 An exploded view of the array design of an embodiment of a multi-beam phased array antenna based on an AIP architecture; Figure 10 This is a physical fabrication diagram of an antenna surface embodiment of a multi-beam phased array antenna based on an AIP architecture; Figure 11 This is a physical fabrication diagram of an embodiment of a multi-beam phased array antenna based on the AIP architecture.

[0025] Figure label: 1. Antenna Layer; 11. Antenna Layer Dielectric Substrate; 12. Radiating Patch; 13. Bridge Feed Network; 14. Antenna Layer GND Network; 2. Power Combining Network Layer; 21. Power Combining Network Layer Dielectric Substrate; 22. Beamforming Network; 23. Power Combining Network Ground Layer; 3. RF Layer; 31. RF Layer Dielectric Substrate; 32. Receiver Module; 321. Low Noise Amplifier; 322. Switching Chip; 323. Beam Divider Network; 324. Multi-channel Amplitude and Phase Chip; 33. Power Supply and Control Module; 34. RF Ground Layer; 4. Hole Structure; 41. Antenna Layer Through-hole; 42. Antenna Layer Blind Via; 43. Antenna to RF Layer Blind Via; 44. RF Layer Through-hole; 45. RF Layer Blind Via; 46. RF Layer to Power Combining Layer Through-hole; 47. RF Layer to Power Combining Layer Blind Via; 5. PP Board. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Example 1

[0027] like Figures 1-11 As shown, a multi-beam phased array antenna based on an AIP architecture is an integrated antenna and RF structure, mainly comprising an antenna layer 1, a power combining network layer 2, an RF layer 3, a via structure 4, and a PP board 5. The antenna layer dielectric substrate 11 is made of M6-2116 material, the power combining network layer dielectric substrate 21 is made of M6-5775G material, and the RF layer dielectric substrate 31 is made of M6-5775G material. The dielectric substrates are connected using corresponding M6 PP material (i.e., PP board 5).

[0028] The antenna module adopts a dual circularly polarized antenna, mainly including a radiating patch 12 and an antenna feed network 13. The radiating patch 12 is a dual-layer microstrip patch antenna, which is located on the top layer of the packaging substrate. The antenna bridge feed network 13 is located below the antenna layer, which completes the feed conversion from the antenna to the radio frequency device and realizes effective signal radiation. The antenna layer GND network 14 is located between the dual-layer microstrip patch antenna and the bridge feed network 13 and below the bridge feed network 13. To meet the requirements of grating lobe suppression under wide-angle scanning, the antenna element needs to be compressed in size, so a high dielectric constant substrate is selected. To balance loss performance, a three-layer 0.5mm M6-2116 substrate with a dielectric constant of 3.63 and a three-layer 0.25mm M6-PP substrate are laminated together in the lower layer of the radiating antenna, effectively balancing miniaturization and low loss.

[0029] The receiving component module 32 mainly realizes the multi-beam function of the array in the analog domain, including a low-noise amplifier 321, a switching chip 322, a beam splitter network 323, a multi-channel amplitude and phase chip 324, and an output RF connector. Among them, the low-noise amplifier 321, the switching chip 322, the beam splitter network 323, the multi-channel amplitude and phase chip 324, and the output RF connector are located on the lower surface of the packaging substrate, and the beamforming network is located in the inner layer of the packaging substrate. The routing of the receiver module 32 in RF layer 3 is mainly concentrated in the top and bottom layers, separated by the RF ground layer 34 to ensure that the RF signal has a complete ground plane. The power supply and control module 33 routing layer is located below the RF routing layer.

[0030] In multi-beam dual-polarization mode, multiple channels are required. To integrate high-density device layout and routing, the aperture and spacing of isolation vias in different crosstalk risk areas are independently optimized. In sensitive areas, the aperture is reduced and the spacing is increased to construct a highly isolated coaxial shielding structure. In non-sensitive areas, the vias are arranged more sparsely to free up wiring space; the aperture is reduced from 0.3mm to 0.15mm. Encryption spacing, from 1 / 10 wavelength to 1 / 20 wavelength.

[0031] The connection between the antenna and the receiving component module is achieved by back-drilling coaxial holes in the packaging substrate, which reduces interconnection loss. After the signal enters from the antenna module, it first passes through the dual-channel low-noise amplifier 321 to reduce the noise figure of the entire array and save space for the components. The beam splitter network 323 uses a Wilkins power divider, located on the lower surface of the RF layer dielectric substrate 31. The front-end device is a low-noise amplifier 321, and the back-end device is a multi-channel amplitude and phase chip 324. The routing path is the shortest, reducing losses. In the Wilkins power divider, such as Figure 6 The square structure shown occupies a smaller space, making it more suitable for the complex wiring and compatibility of this invention. The power supply and control module 33 mainly completes the power supply and beam control of the array, including the control network, power supply network, and low-frequency connector. The control network and power supply network traces are located in the inner layer of the RF layer dielectric substrate 31, and the low-frequency connector is located on the lower surface of the RF layer dielectric substrate 31. The beamforming network 22 includes a first-level beamforming network and a second-level beamforming network.

[0032] This invention employs a complex serpentine topology for integrating dual beams on a single layer. Multiple independent beamforming networks are routed in pairs on different inner layers of the power combining network substrate 21 using striplines. The RF trace layers are separated by a power combining network ground layer 23. It primarily utilizes multi-stage equally divided Wilkins power dividers and employs a grouped serpentine routing strategy for equi-phase routing. Resistors are buried in the inner layer to save surface space. The complex topology optimizes the overall stack-up. The lines from the feeds of all antenna elements to the chip form one group. The power divider from the first stage to the second stage forms a second group, and so on.

[0033] The use of multi-stage Wilkins power combiners allows for equal-length layout and routing avoidance of all branches of two beams within a single cabling plane. The resistors are buried in the inner layer, saving surface space and simplifying the overall stack-up. To achieve the stacked optimization design, the beamforming network 22 is distributed in two independent layers. The RF traces are designed to be of equal amplitude and in phase by winding the RF lines in groups, and the group delay deviation is reduced. At the same time, the RF lines of different beams are isolated by staggered high-density ground holes to form a "fence" shield, which helps to ensure the isolation between different beams. After the signal is output from the low-noise amplifier 321, it is polarized by the switching chip 322, and then split into two paths by the beam splitter network 323. The two signals then enter two "n-channel amplitude and phase chips" (multi-channel amplitude and phase chips 324) for pointing adjustment to generate 2*n beam signals. Each beam signal, together with other antennas, enters its respective beam combining network 22 to obtain multiple independent receiving beams. The RF output connectors for n beams use n SSMP connectors, and the low-frequency connectors use high-density rectangular connectors located in the middle of the array on the lower surface. The array consists of 16*16 array elements. The RF layout, wiring size and antenna size are consistent. The array can be expanded into a large array as a subarray to realize ultra-large array applications.

[0034] This embodiment uses a dual-beam output multi-channel amplitude and phase chip, and designs a 16*16 scalable four-beam phased array subarray with a Ku-band frequency. This is not limited to a single chip; based on the characteristics of other multi-beam amplitude and phase chips, more beams can be achieved.

[0035] In this embodiment, an antenna module consists of 2*4 antenna elements. Each antenna module has 5 microstrip antenna layers, 4 power and network layers, and 10 radio frequency (RF) layers from top to bottom. The RF layer 3 contains RF signal and power supply control signal traces.

[0036] In this embodiment, antenna layer 1 employs a dual-fed circularly polarized antenna composed of two layers of radiating patches, with a 90° bridge as the feed network. The antenna is located on the upper layer of the packaging substrate to achieve effective signal radiation. The 90° bridge is located between the antenna radiating portion and the RF layer dielectric substrate 31, facilitating the connection between the antenna feed port and the RF traces.

[0037] In this embodiment, the receiving component module mainly implements the multi-beam function of the entire array in the analog domain, using 2*4 antennas as a group. Each antenna element has two feed ports: a left-hand circular polarization (LHCP) port and a right-hand circular polarization (RHCP) port. These feed ports are connected to the RF layer 3 via a coaxial structure. The signal is first amplified and the noise figure is improved by a dual-channel low-noise amplifier chip. Then, the left-hand and right-hand circular polarization is switched by a switching chip 322. Next, a 1-to-2 beam splitter network 323 is used to divide the single channel into two channels to match two 8-channel input dual-beam multi-channel amplitude and phase chips 324. Finally, the two 8-channel input dual-beam multi-channel amplitude and phase chips 324 are combined to generate four beams.

[0038] In this embodiment, the receiving component module adopts an equal amplitude and in-phase design for the two paths from the antenna feed port to the dual-channel low-noise amplifier chip input port, and the 16 paths from the beam power divider network 323 to the dual-beam multi-channel amplitude and phase chip 324.

[0039] In this embodiment, the receiving component module employs a high-density device layout and RF traces due to the requirements of multi-beam and dual polarization. To optimize the PCB design, a non-uniform isolation via design based on crosstalk risk partitioning is adopted. Strong crosstalk sensitive areas are identified through whole-board electromagnetic field simulation. In these areas, a dense array of metallized vias with reduced aperture and increased spacing is used to construct an electromagnetic isolation structure that approximates a coaxial shielding cavity, effectively blocking near-field coupling paths. In low-risk areas, a sparse design with increased aperture and increased spacing is used to free up wiring channels. This achieves decoupling optimization of isolation performance and wiring density.

[0040] like Figure 7 As shown in the diagram, the aperture and sparsity of the grounding vias are the results of optimization after simulation. Different colors represent different layers.

[0041] In this embodiment, after the aforementioned layout design, each 2*4 antenna group has 4 beam outputs. Using 16*16 as the basic array for scalable arrays, it is necessary to synthesize the 4 beam outputs of 32 2*4 antenna groups separately.

[0042] In this embodiment, the power and network of each pair of beams occupy one layer of space in the inner layer of the packaging substrate, adopting the CPW-G form. Each beam requires a total of 5 power and network levels. The main component is a Wilkinson power divider, and its resistance can be achieved using the process of embedding thin film resistors.

[0043] In this embodiment, the low-noise amplifier 321 chip, beam splitter network 323, multi-channel amplitude and phase chip 324, and output RF connector are located on the lower surface of the package substrate and are surface-mount soldered.

[0044] In this embodiment, the control and power supply traces of all chips are arranged in the inner layer of the packaging substrate through optimized stack-up layout.

[0045] In this embodiment, the connection between the antenna and the receiving component module is achieved by back-drilling the packaging substrate (a coaxial hole-like hole that penetrates a multilayer board). Optimized anti-soldering pads are provided on each layer to eliminate parasitic capacitance and reduce interconnection loss.

[0046] In this embodiment, to reduce processing costs, the hole types are optimized, reducing the number of hole types and the number of pressing operations. It includes antenna layer through-hole 41, antenna layer blind hole 42, antenna-to-RF layer blind hole 43, RF layer through-hole 44 and RF layer blind hole 45, RF layer-to-power-combining layer through-hole 46 and RF layer-to-power-combining layer blind hole 47.

[0047] In this embodiment, the AIP array printed circuit board adopts a step-by-step lamination and drilling process: First, the antenna layer 5-layer board, the power bonding layer 4-layer board, and the radio frequency layer 10-layer board are processed respectively, and antenna layer through-hole 41, antenna layer blind via 42, radio frequency layer through-hole 44, and radio frequency layer blind via 45 are fabricated; then the power bonding layer and the radio frequency layer are laminated together to fabricate radio frequency layer through-hole 46 and radio frequency layer blind via 47; finally, antenna layer 1 is laminated together to complete the fabrication of antenna to radio frequency layer blind via 43.

[0048] In this embodiment, the shape and size of the double-layer radiating patch of the antenna element are optimized to effectively avoid the feed point of the bridge layer, and the near-coaxial interconnection from the antenna to the radio frequency layer is achieved through a blind via with more reliable process, avoiding the problems of high cost and poor connection reliability caused by copper paste sintering.

[0049] In this embodiment, the RF output connectors for the four beams are four surface-mount SSMP connectors, and the low-frequency connector is a high-density rectangular connector located in the middle of the array on the lower surface.

[0050] This embodiment achieves ±60° wide-angle scanning in the Ku band, which requires miniaturization of the antenna elements to reduce the spacing between them. This design compresses the spacing between the 2*4 antenna elements to 11.5mm. Under the constraint of compact size, the RF section completes a complex multi-beam design.

[0051] This embodiment designs 16*16 arrays based on the above design method. The RF layout, wiring size and antenna size are consistent. 32 8*8 arrays are selected and assembled by structural combination. Then, 4 5-level power combining networks are added and connected by SSMP connectors to obtain an expandable 16*16 array.

[0052] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A multi-beam phased array antenna based on AIP architecture, characterized in that: The multi-beam dual-circular polarized antenna module includes an antenna layer (1), a power combining network layer (2), a radio frequency layer (3) and a hole structure (4) connected in the antenna layer (1), the power combining network layer (2), and the radio frequency layer (3) in sequence from top to bottom. The antenna layer (1) includes an antenna layer dielectric substrate (11) and a radiating patch (12), a bridge feed network (13), and an antenna layer GND network (14) connected to the antenna layer dielectric substrate (11). The beamforming network layer (2) includes a beamforming network layer dielectric substrate (21) and a beamforming network (22) and a beamforming network ground layer (23) connected in the beamforming network layer dielectric substrate (21). The radio frequency layer (3) includes a radio frequency layer dielectric substrate (31), a receiving component module (32), a power supply and control module (33), a radio frequency ground layer (34), and an output radio frequency connector connected to the radio frequency layer dielectric substrate (31). The receiving component module (32) includes a low-noise amplifier (321), a switching chip (322), a beam splitter network (323), and a multi-channel amplitude and phase chip (324) connected to the lower surface of the radio frequency layer dielectric substrate (31) and sequentially connected to the bridge feed network (13). The output terminal of the multi-channel amplitude and phase chip (324) is connected to the beamforming network (22). The antenna layer dielectric substrate (11), the power combining network layer dielectric substrate (21), and the radio frequency layer dielectric substrate (31) are all multilayer substrates. The hole structure (4) includes blind holes and through holes. The radiating patch (12), the bridge feed network (13), the receiving component module (32), the power supply and control module (33), and the beam combining network (22) are interconnected through the hole structure (4). The traces inside the receiving component module (32) are located on the lower surface of the radio frequency layer dielectric substrate (31) and in the lower substrate of the radio frequency layer dielectric substrate (31).

2. The multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The radiating patch (12) is n dual-circularly polarized antenna radiating patches, the low-noise amplifier (32) is a dual-channel low-noise amplifier, and the number of multi-channel amplitude and phase chips (324) is 2, with each channel having n channels, where n≥2; After being received by the radiating patch (12), the spatial signal is transmitted to the low-noise amplifier (321) via the bridge feed network (13). After polarization selection by the switching chip (322), it is split into two paths by the beam power divider network (323). The two signals enter the two multi-channel amplitude and phase chips (324) respectively for pointing adjustment and generate 2*n beam signals. Each beam signal, together with the signals of the other multi-beam dual circular polarized antenna modules, enters the corresponding beamforming network (22) to obtain multiple independent receiving beams. The multi-beam dual circularly polarized antenna module operates in the Ku band.

3. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The hole structure (4) includes an antenna layer through hole (41), an antenna layer blind hole (42), an antenna to RF layer blind hole (43), an RF layer through hole (44), an RF layer blind hole (45), an RF layer to power combining layer through hole (46), and an RF layer to power combining layer blind hole (47). The antenna layer via (41) is the grounding hole of the antenna layer (1). The radiating patch (12) is connected to the bridge feed network (13) through the antenna layer blind via (42). The bridge feed network (13) is connected to the low noise amplifier (321) through the antenna-to-RF layer blind via (43). The RF layer via (44) is the grounding hole and connects the power supply and control module (33) and the receiving component module (32). The receiving component modules (32) are connected to each other through the RF layer blind via (45). The multi-channel amplitude and phase chip (324) is connected to the beamforming network (22) through the RF layer-to-power combining layer blind via (47). The beamforming network (22) is connected to the output RF connector through the RF layer-to-power combining layer via (46). It also includes a PP board (5) for connecting the dielectric substrate.

4. A multi-beam phased array antenna based on AIP architecture according to claim 3, characterized in that: The lamination and aperture-opening method for the multi-beam phased array antenna includes the following steps: S1. Complete the fabrication of the antenna layer (1), the power combining network layer (2), and the radio frequency layer (3) respectively; S2. Fabricate the antenna layer via (41), the antenna layer blind via (42), the radio frequency layer via (44), and the radio frequency layer blind via (45) respectively. S3. Press the power bonding network layer (2) and the radio frequency layer (3) together to create the radio frequency layer to power bonding layer via (46) and the radio frequency layer to power bonding layer blind via (47). S4. Press the antenna layer (1) onto the upper part of the power network layer (2) and process the antenna to the radio frequency layer blind hole (43).

5. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The antenna layer dielectric substrate (11) is a five-layer dielectric substrate, including a first antenna layer made of three layers of dielectric substrates pressed together and a second antenna layer and a feed layer pressed together in sequence at the bottom of the first antenna layer; The antenna layer (1) is a dual-layer microstrip patch dual-circularly polarized antenna, and the radiating patches (12) are respectively etched on the upper surface of the antenna layer and the upper surface of the second antenna layer; The bridge feed network (13) is a 90° bridge and is located on the upper surface of the feed layer to perform feed conversion; The antenna layer GND network (14) is connected to the lower surface of the second antenna layer and the lower surface of the feed layer.

6. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The beamforming network (22) is encapsulated in the inner layer of the power combining network layer dielectric substrate (21) and isolated by the power combining network ground layer (23); the beamforming network (22) is an equal phase trace.

7. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The radio frequency layer dielectric substrate (31) includes a first radio frequency layer dielectric substrate, a second radio frequency layer dielectric substrate, a third radio frequency layer dielectric substrate, a fourth radio frequency layer dielectric substrate and a fifth radio frequency layer dielectric substrate, which are pressed together from top to bottom by a PP plate (5). The low-noise amplifier (32), the switch chip (33), the beam splitter network (34), and the multi-channel amplitude and phase chip (35) are all connected to the lower surface of the fifth radio frequency layer dielectric substrate; The receiving component module (32) has traces on the lower surface and inside of the fifth RF layer dielectric substrate, the lower surface and inside of the fourth RF layer dielectric substrate, and the lower surface of the third RF layer dielectric substrate. The upper surface of the third RF layer dielectric substrate and the upper surface of the fourth RF layer dielectric substrate are both the RF ground layer (34).

8. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The two traces from the antenna feed port of the bridge feed network (13) to the input port of the low noise amplifier (321) are of equal amplitude and in phase; All the multiple traces from the beam power divider network (323) to the multi-channel amplitude and phase chip (324) are of equal amplitude and in phase.

9. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: The crosstalk risk area in the multi-beam phased array antenna is determined by simulation and divided into sensitive and non-sensitive areas. The size and arrangement spacing of the isolation holes are optimized. In the sensitive area, the diameter of the isolation holes is reduced and the spacing of the isolation holes is increased. In the non-sensitive area, the isolation holes are reduced. The diameter of the isolation holes is 0.15~0.3mm, and the spacing between the isolation holes is 1 / 20~1 / 10 of the wavelength.

10. A multi-beam phased array antenna based on AIP architecture according to claim 1, characterized in that: Multiple antenna modules are expanded and arrayed to obtain a Ku-band multi-beam phased array antenna that can perform ±60° wide-angle scanning. The number of power combining network layers (2) increases accordingly during arraying. The element spacing of the antenna layer (1) is 11~13mm.

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