Optical drive base and method of manufacture

Abstract

The application discloses an optical drive base and a preparation method thereof. The optical drive base comprises an insulating body, a connecting terminal and an electronic element. The insulating body is provided with a mounting cavity. The connecting terminal comprises a main body part and a connecting part. The connecting part comprises a connecting surface and a matching surface. The connecting surface is exposed in the mounting cavity to be welded and fixed with the electronic element by soldering. The connecting part is plastically deformed to form a flat surface on the connecting surface. The thickness of the connecting part is smaller than that of the main body part. The optical drive base and the preparation method thereof can improve the flatness of the connecting surface in the connecting part and ensure the connecting effect of the connecting terminal and the electronic element.

Description

[0001] This application is a divisional application of the invention patent application filed on April 28, 2025, with application number CN202510543483.8 and invention title "An Optical Driving Base and Preparation Method". Technical Field

[0002] This invention relates to the field of motor technology, and in particular to an optical drive base and its manufacturing method. Background Technology

[0003] Camera modules are typically found in devices such as mobile phones and tablets to enable shooting functions. A camera module generally includes a motor and a camera. The motor connects to the camera and is used to implement functions such as image stabilization and focusing. The motor usually includes an optical drive base that houses electronic components. The optical drive base contains an insulating body and multiple connection terminals that connect to the electronic components.

[0004] The connectors in an optical drive base are typically stamped from a strip. To ensure the independence of multiple connectors, at least the connecting portions are stamped and cut to separate them. Because the connectors are relatively thin, the impact force generated during stamping and cutting can cause warping deformation due to impact stress. This results in an uneven connecting surface for connection with electronic components. For example... Figure 1 As shown, the connecting portion 22' of the connecting terminal 2' forms a higher first region 223' on the side away from the stamping position, while the side of the connecting portion 22' adjacent to the stamping position is concave or warped due to impact stress, forming a second region 224'. Figure 2 As shown, when the insulating body 1' is injection molded, the higher first region 223' of the connecting part 22' is exposed to the insulating body 1', while the lower second region 224' of the connecting part 22' is covered by the insulating body 1'. This results in the connecting part 22' being only partially exposed to the insulating body 1'. The reduction in the exposed area directly leads to a significant decrease in the reliability of the connection when the connecting part 22' is welded and fixed to the electronic component. Furthermore, due to the influence of impact stress, it is difficult to control the exposed area of ​​the connecting parts 22' of multiple connecting terminals 2'. When the exposed areas of multiple connecting parts 22' differ significantly, it will further affect the connection effect between the connecting terminal 2' and the electronic component.

[0005] Chinese utility model patent CN216625430U provides a voice coil motor base that uses stamping to form a convex structure for the welded portion, or a single stamping and tearing process at the weld foot end to control the size of the welded portion area and thus ensure the welding effect of electronic components. Both stamping and tearing methods require additional stamping operations on the welded portion of the terminal, which exacerbates the degree and risk of terminal warping and deformation, and still results in inconsistent exposed areas of multiple welded portions, affecting the connection effect between the terminal and the electronic component. Summary of the Invention

[0006] The purpose of this invention is to provide an optical driving base and its manufacturing method, which improves the flatness of the connecting surface in the connecting part and ensures the connection effect between the connecting terminal and the electronic component.

[0007] The objective of this invention is achieved through the following technical solution:

[0008] An optical driving base includes an insulating body, a connecting terminal embedded in the insulating body, and electronic components. The insulating body has a mounting cavity for accommodating the electronic components. The connecting terminal includes an integrally formed main body and a connecting portion. The connecting portion includes a connecting surface and a mating surface opposite each other along the thickness direction. The connecting surface is exposed in the mounting cavity for soldering and fixing to the electronic components. The connecting portion is plastically deformed to form a flat surface on the connecting surface, and the thickness of the connecting portion is less than the thickness of the main body.

[0009] Preferably, the connecting portion is located at the end of the main body and is formed by forging along the thickness direction and then plastically deforming.

[0010] Preferably, the thickness of the main body is 0.05 to 0.2 mm, and the thickness of the connecting part after plastic deformation is 80% to 95% of the thickness of the main body.

[0011] Preferably, the width of the connecting portion near one end of the main body is greater than the width of the main body near one end of the connecting portion.

[0012] Preferably, the main body includes a first end face and a second end face disposed opposite to each other along the thickness direction; the connecting surface is flush with the first end face along the thickness direction, and the mating surface is concave relative to the second end face along the thickness direction so that a step is formed between the mating surface and the second end face in the thickness direction.

[0013] Preferably, the mating surface and the first end face are embedded in the insulating body, and the insulating body includes a positioning hole extending from the mating surface to penetrate the insulating body along the thickness direction.

[0014] Preferably, the connecting surface is flush with the bottom of the mounting cavity, and the first end face is at least partially exposed in the mounting cavity and flush with the bottom of the mounting cavity.

[0015] Preferably, at least a portion of the connection portion of the connection terminal forms a tear-off portion at the connection with the main body portion. The tear-off portion is recessed inward along the thickness direction into the connection surface to form a blocking groove at the connection between the connection portion and the main body portion. The blocking groove is filled by the insulating body. The tear-off portion is used to control the area of ​​the connection portion exposed to the insulating body.

[0016] A method for fabricating an optical driving base, comprising:

[0017] Step S01: Provide a strip of material, and form a plurality of connecting terminals having a main body and a connecting part on the strip of material. Separate the connecting parts of the plurality of connecting terminals from each other by stamping. The connecting part includes a connecting surface and a mating surface that are opposite to each other along the thickness direction.

[0018] Step S03: Forging the connecting part to plastically deform the connecting part so that the connecting surface forms a flat surface, wherein the thickness of the connecting part after forging is less than the thickness of the main body;

[0019] Step S04: Insulating body is injection molded on the connecting terminal, the insulating body having a mounting cavity, and the connecting surface being exposed in the mounting cavity;

[0020] Step S05: Provide electronic components, install the electronic components into the mounting cavity, and fix them to the connection surface by soldering.

[0021] Preferably, step S03 specifically includes: using the mating surface as a forging surface for forging, so that the connecting part is plastically deformed and the mating surface is concave, the main body includes a first end face and a second end face disposed opposite to each other along the thickness direction, and at least a portion of the mating surface of the connecting terminal and the second end face form a step in the thickness direction.

[0022] Compared with the prior art, the beneficial effects of the present invention include at least the following:

[0023] By reducing the thickness of the connecting part, such as by forging, the connecting part is plastically deformed to form a flat connecting surface. When the insulating body is injection molded, the connecting surface can fit tightly with the mold, thereby ensuring the area of ​​the connecting surface exposed on the insulating body and ensuring the connection effect between the connecting part and the electronic component. Attached Figure Description

[0024] Figure 1 This is a partial structural diagram of the connecting terminals in the prior art;

[0025] Figure 2 This is a partial structural diagram of an optical drive base in the prior art;

[0026] Figure 3 This is a schematic diagram of the structure of the optical driving base according to an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the optical driving base from another perspective according to an embodiment of the present invention;

[0028] Figure 5 This is an exploded perspective view of the optical driving base according to an embodiment of the present invention;

[0029] Figure 6 This is a partial structural schematic diagram of the optical driving base according to an embodiment of the present invention;

[0030] Figure 7 This is a partial structural schematic diagram of the connection terminal according to an embodiment of the present invention;

[0031] Figure 8 This is a partial structural schematic diagram of the connection terminal from another perspective in an embodiment of the present invention;

[0032] Figure 9 This is a partial structural schematic diagram of an optical driving base according to another embodiment of the present invention;

[0033] Figure 10 This is a partial structural schematic diagram of the connection terminal according to another embodiment of the present invention;

[0034] Figure 11 This is a partial structural schematic diagram of the connection terminal according to another embodiment of the present invention;

[0035] Figure 12 This is a partial structural schematic diagram of the connection terminal according to another embodiment of the present invention;

[0036] Figure 13 This is a partial cross-sectional view of an optical driving base according to another embodiment of the present invention;

[0037] Figure 14 This is another partial structural schematic diagram of the optical driving base according to an embodiment of the present invention.

[0038] In the figure: 1, 1', Insulating body; 11, Mounting cavity; 115, Barrier part; 12, Recessed cavity; 13, Positioning hole; 2, 2', Connecting terminal; 21, Main body; 211, First end face; 212, Second end face; 22, 22', Connecting part; 221, Connecting surface; 222, Mating surface; 223', First region; 224', Second region; 23, Tear-off part; 231, Blocking groove; 24, Mounting part; 241, Chamfer; 3, Electronic component. Detailed Implementation

[0039] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided to make the invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0040] The terms used to express position and direction in this invention are illustrated with reference to the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this invention.

[0041] like Figures 3 to 14 As shown, this invention provides an optical driving base that can be applied in the optical driving mechanism of a camera module and used to drive optical components such as lens assemblies or aperture assemblies. The optical driving base can be a focus motor base, an image stabilization motor base, an aperture assembly base, a periscope motor base, a voice coil motor base, etc. The optical driving base includes an insulating body 1, connecting terminals 2 embedded in the insulating body 1, and electronic components 3.

[0042] Reference Figure 3 , Figure 5 and Figure 6 The insulating body 1 can be formed from insulating material through one-time injection molding or two-time injection molding, and the insulating body 1 can be provided with a mounting cavity 11 for accommodating the electronic component 3. A portion of the connecting terminal 2 can be exposed in the mounting cavity 11 and connected to the electronic component 3. The electronic component 3 can be a Hall sensor, an integrated circuit (IC), a tunnel magnetoresistive (TMR), etc. The connecting terminal 2 and the electronic component 3 can be connected by soldering. Solder is first applied to the connecting terminal 2, the electronic component 3 is mounted to the insulating body 1 and overlapped to the corresponding connecting terminal 2, and then fixed by soldering with solder.

[0043] Reference Figure 6 and Figure 7 The connecting terminal 2 includes a main body 21 and a connecting portion 22, with the main body 21 being integrally formed with the connecting portion 22. The connecting portion 22 is located at the end of the main body 21 and is exposed in the mounting cavity 11 to connect with the electronic component 3. The main body 21 may extend from the connecting portion 22 to protrude from the insulating body 1, and the portion of the main body 21 protruding from the insulating body 1 may form a mounting portion 24 for connecting external components; alternatively, the main body 21 may extend from one connecting portion 22 to the other connecting portion 22, i.e., the two ends of the main body 21 are respectively connected to the connecting portion 22, and each connecting portion 22 is used to connect with a corresponding electronic component 3, with the two electronic components 3 connected through the connecting terminal 2 having two connecting portions 22; alternatively, the main body 21 may extend within the insulating body 1, with the end of the main body 21 away from the connecting portion 22 embedded within the insulating body 1.

[0044] The connecting portion 22 includes two opposing end faces along its thickness direction, namely a connecting surface 221 and a mating surface 222. The connecting surface 221 is exposed to the insulating body 1 and is used for connection with the electronic component 3. When molding the insulating body 1, a mold is used to abut against the connecting surface 221, and other molds are used in conjunction to allow multiple molds to work together and restrict a space with the same shape as the insulating body 1. Molten liquid insulating material is filled into this space, and the liquid insulating material cools and solidifies to form the insulating body 1. When the connecting surface 221 of the connecting portion 22 is uneven, the mold cannot fit tightly against the connecting portion 22. The mold abuts against the higher part of the connecting portion 22, while there are gaps between the mold and other parts of the connecting portion 22. When molding the insulating body 1, the liquid insulating material fills the gaps between the mold and the connecting portion 22, so that the insulating body 1 covers a portion of the connecting surface 221 of the connecting portion 22, and only the higher part of the connecting portion 22 is exposed to the insulating body 1. Since the connecting part 22 is partially covered by the insulating body 1, the area of ​​the connecting part 22 exposed to the insulating body 1 is reduced, and the connection area between the connecting part 22 and the electronic component 3 is reduced. When the connection is fixed by soldering, the bonding area between the solder and the connecting part 22 is reduced, which in turn leads to a decrease in the bonding force between the connecting part 22 and the electronic component 3, and the electronic component 3 is easy to fall off from the corresponding connecting part 22. Furthermore, since the deformation degree of the connecting surface 221 on the connecting part 22 of the multiple connecting terminals 2 is uncontrollable, the exposed area of ​​the connecting surface 221 on the multiple connecting parts 22 may be different, resulting in a poor connection effect between the connecting part 22 and the electronic component 3.

[0045] To improve the surface flatness of the connecting surface 221 of the connecting portion 22, the connecting portion 22 can undergo plastic deformation to form a flat surface on the connecting surface 221. Specifically, a clamping force can be applied to the connecting portion 22 to cause it to undergo permanent plastic deformation under pressure. At this time, the connecting portion 22 becomes thinner and its thickness is less than that of the main body 21. During the plastic deformation process, the clamping force used for plastic deformation will correct the position of the connecting portion 22 and flatten the connecting portion 22, so that a flat connecting surface 221 can be formed after the connecting portion 22 undergoes plastic deformation.

[0046] After the connecting part 22 undergoes plastic deformation, the connecting surface 221 becomes a flat surface. During the molding of the insulating body 1, the connecting surface 221 can fit tightly against the mold, and there is essentially no gap between the connecting surface 221 and the mold. Therefore, the liquid insulating material will not flow between the connecting surface 221 and the mold. The part of the connecting surface 221 that is covered by the mold can be completely exposed on the insulating body 1 after molding and is flush with the bottom of the mounting cavity 11. Therefore, the connecting surface 221 is essentially not covered by the insulating body 1, and the connection area between the connecting part 22 and the electronic component 3 is large, which can ensure the bonding force after the connecting part 22 and the electronic component 3 are connected. Furthermore, the exposed area of ​​the connecting surface 221 can be the same as the predetermined exposed area. The exposed area of ​​the connecting surface 221 is controllable, and the exposed areas of multiple connecting surfaces 221 can be set to be basically the same, thereby ensuring the connection effect between the connecting terminal 2 and the electronic component 3. The predetermined exposed area is controlled by the contact area between the mold and the connecting surface 221. The area of ​​the mold covering the connecting surface 221 is the predetermined exposed area. The exposed area of ​​the connecting surface 221 can be adjusted by adjusting the structure of the mold.

[0047] In existing technologies, methods to ensure the connection between the connector 22 and the electronic component 3 generally involve stamping to form a convex bulge, the surface of which is used to connect with the electronic component 3, or tearing to form a welded portion to control the area of ​​the welded portion. Both stamping and tearing methods are equivalent to a secondary stamping of the connector terminal 2, making the connector 22 more prone to skewing and deformation, resulting in poorer surface flatness of the connector surface 221 and failing to effectively ensure the connection between the connector 22 and the electronic component 3. Furthermore, the tearing method for forming the welded portion is more difficult and costly to meet mass production requirements.

[0048] This application causes plastic deformation of the connecting part 22. During the plastic deformation process, the clamping force generated by the plastic deformation corrects the position of the connecting part 22, so that the connecting part 22 after plastic deformation can be in a flat state and the connecting surface 221 of the connecting part 22 is a flat surface. This can ensure the connection effect between the connecting part 22 and the electronic component 3. Furthermore, the plastic deformation processing method is easier to achieve than the tearing processing method and can be applied to the mass production requirements of industry.

[0049] The connecting part 22 can be forged along its thickness direction to achieve plastic deformation through forging. Specifically, forging the connecting part 22 can be performed by using one or more end faces of the connecting part 22 along its thickness direction as forging surfaces, and then using components such as hydraulic presses or mechanical presses to forge the forging surfaces.

[0050] Reference Figure 7 and Figure 8 After forging, the connecting part 22 becomes thinner and wider. Flat surfaces are formed on the opposite ends of the connecting part 22 along its thickness direction. Therefore, the connecting surface 221 and the mating surface 222 at opposite ends of the connecting part 22 along its thickness direction are flat surfaces. Furthermore, the width of the connecting part 22 increases after forging, and the width of the connecting part 22 near the main body 21 is greater than the width of the main body 21 near the connecting part 22. The increase in the width of the connecting part 22 can increase the area of ​​the connecting surface 221, thereby increasing the connection area between the connecting surface 221 and the electronic component 3. When fixed connection is made by soldering, the welding area between the solder and the connecting surface 221 increases, further enhancing the connection effect between the connecting terminal 2 and the electronic component 3.

[0051] The thickness of the main body 21 connected to the connecting part 22 can be 0.05 to 0.2 mm. Before plastic deformation, the thickness of the connecting part 22 is the same as the thickness of the main body 21. After plastic deformation, the thickness of the connecting part 22 can be 80% to 95% of the thickness of the main body 21. When the thickness of the connecting part 22 after plastic deformation is too thin, the strength of the connecting part 22 will be reduced, making it easy for the connecting part 22 to deform during the manufacturing process. If the thickness change of the connecting part 22 after plastic deformation is small, the connecting part 22 may not be able to be effectively flattened, which will make it difficult to meet the flatness requirements of the connecting surface 221 of the connecting part 22. By controlling the thickness of the connecting part 22 after plastic deformation to 80% to 95% of the thickness of the main body 21, the strength of the connecting part 22 can be ensured while flattening the connecting part 22.

[0052] Reference Figure 7In some specific embodiments, when the connecting part 22 is forged, the connecting surface 221 of the connecting part 22 can be placed on a platform, and then the mating surface 222 of the connecting part 22 is used as the forging surface. A clamping force is applied to the mating surface 222 of the connecting part 22 so that the mating surface 222 of the connecting part 22 is concave relative to the corresponding end face of the main body 21, thereby realizing the plastic deformation of the connecting part 22. At this time, the connecting surface 221 of the connecting part 22 is flush with the corresponding end face of the main body 21. The main body 21 has a first end face 211 and a second end face 212 along its thickness direction. Before forging, the mating surface 222 of the connecting portion 22 is flush with the second end face 212 of the main body 21, and the second end face 212 of the main body 21 corresponds to the mating surface 222 of the connecting portion 22. Furthermore, the connecting surface 221 of the connecting portion 22 is flush with the first end face 211 of the main body 21, and the first end face 211 of the main body 21 corresponds to the connecting surface 221 of the connecting portion 22. After forging, the mating surface 222 of the connecting portion 22 becomes concave to the second end face 212, and a step is formed between the mating surface 222 and the second end face 212.

[0053] In existing optical drive bases, after molding the insulating body 1, the connecting surface 221 of the connecting part 22 can be flush with the bottom of the mounting cavity 11 in the insulating body 1. Therefore, when molding the insulating body 1, a mold can be used to abut against the connecting surface 221 and the bottom of the mounting cavity 11 at the same time. In this application, by using the mating surface 222 of the connecting part 22 as the forging surface, the connecting surface 221 of the connecting part 22 can be kept flush with the corresponding first end face 211 of the main body 21. At this time, even if the width of the connecting part 22 increases, the connecting surface 221 of the connecting part 22 still remains flush with the bottom of the mounting cavity 11 in the insulating body 1. At this time, an existing mold can be used to abut against the connecting part 22, without the need for additional processing of the corresponding mold, reducing the demand for molds and lowering the cost of molds.

[0054] When the connecting portion 22 of the connecting terminal 2 is connected to the electronic component 3, solder or other welding materials are added to the connecting surface 221 of the connecting portion 22. Then, the electronic component 3 is installed in the mounting cavity 11. The electronic component 3 can directly contact the connecting surface 221 of the connecting portion 22 and be soldered. Specifically, the electronic component 3 may have a protrusion that mates with the connecting surface 221. The apex of the protrusion of the electronic component 3 abuts against the connecting surface 221 of the connecting portion 22 to improve the connection reliability between the electronic component 3 and the connecting portion 22. Solder covers the connecting surface 221 and the outer periphery of the protrusion to facilitate the soldering of the connecting portion 22 and the electronic component 3.

[0055] Reference Figure 10In some other specific embodiments, when the connecting part 22 is forged, the mating surface 222 of the connecting part 22 can be placed on a platform. Then, the connecting surface 221 of the connecting part 22 is used as the forging surface, and a clamping force is applied to the connecting surface 221 of the connecting part 22 so that the connecting surface 221 of the connecting part 22 is concave relative to the corresponding first end face 211 of the main body 21, thereby realizing the plastic deformation of the connecting part 22. A step is formed between the connecting surface 221 of the connecting part 22 and the first end face 211. At this time, the mating surface 222 of the connecting part 22 is flush with the corresponding second end face 212 in the main body 21.

[0056] Reference Figure 9 The main body 21 of the connecting terminal 2 can be flush with the bottom of the mounting cavity 11, and the insulating body 1 is provided with a recessed cavity 12 formed by further recessing from the mounting cavity 11. The bottom of the recessed cavity 12 is at least flush with or lower than the recessed connecting surface 221, so that at least a portion of the connecting surface 221 can be accommodated in the recessed cavity 12 and exposed to the recessed cavity 12. The insulating body 1 forms a barrier portion 115 around the periphery of the recessed cavity 12 at the bottom of the mounting cavity 11. Most of the connecting surface 221 of the connecting portion 22 is exposed in the recessed cavity 12. The portion of the connecting portion 22 adjacent to the main body 21 is covered by the barrier portion 115 of the insulating body 1. The surface of the barrier portion 115 is flush with the first end face 211 of the main body 21 along the thickness direction and is higher than the connecting surface 221 of the connecting portion 22. When the connecting portion 22 of the connecting terminal 2 is connected to the electronic component 3, solder or other welding materials are added to the connecting surface 221 of the connecting portion 22. Then, the electronic component 3 is installed in the mounting cavity 11, and the electronic component 3 and the connecting portion 22 are connected by solder. The barrier portion 115 of the insulating body 1 covers the connecting surface 221 to prevent the solder from flowing toward the body portion 21, so that the solder is concentrated on the connecting surface 221. It can also better control the exposed area of ​​the connecting surfaces 221 of the multiple connecting terminals 2, so that the size of their exposed areas is as consistent as possible, so as to better ensure the welding effect with the electronic component. In addition, the recessed cavity 12 can be used to contain the solder, so as to reduce the risk of excessive solder overflow caused by the pressure of the electronic component 3, resulting in short circuits or poor welding.

[0057] Reference Figure 11In some specific embodiments, when forging the connecting part 22, the connecting surface 221 and the mating surface 222 of the connecting part 22 can both be used as forging surfaces for forging. The connecting surface 221 and the mating surface 222 are forged to plastically deform the connecting part 22 and thus form concave shapes relative to the first end face 211 and the second end face 212 of the main body 21. At this time, a step is formed between the connecting surface 221 and the first end face 211, and a step is formed between the mating surface 222 and the second end face 212. The insulating body 1 is provided with a recessed cavity 12 formed by further recessing from the mounting cavity 11. At least a portion of the recessed connecting surface 221 is contained in the recessed cavity 12 and can be exposed to the recessed cavity 12.

[0058] When connecting part 22 to electronic component 3, solder will creep on the connecting surface 221 of connecting part 22, which will exert a certain pulling force on electronic component 3. The pulling force of solder on electronic component 3 during solder creep is related to the area of ​​the connecting surface 221 on which the solder is attached. When the exposed areas of multiple connecting surfaces 221 connected to the same electronic component 3 are basically the same, the pulling force of the solder on multiple connecting surfaces 221 on electronic component 3 is roughly the same and can cancel each other out. At this time, the position of electronic component 3 can remain basically unchanged. However, if the exposed areas of multiple connecting surfaces 221 connected to the same electronic component 3 are significantly different, the pulling forces of the solder on multiple connecting surfaces 221 on electronic component 3 are different and cannot cancel each other out. At this time, electronic component 3 will be pulled and move, causing the position of electronic component 3 to shift.

[0059] Reference Figure 12 and Figure 13To ensure that the exposed areas of multiple connection surfaces 221 connected to the same electronic component 3 are approximately the same, a number of connection terminals 2 can be torn to form a tear portion 23. The tear portion 23 is located at the connection between the connection portion 22 and the main body portion 21. The tear portion 23 is recessed in the connection surface 221 along the thickness direction to form a blocking groove 231 between the connection portion 22 and the main body portion 21, and the tear portion 23 is used to control the exposed area of ​​the connection surface 221. Specifically, among the multiple connection surfaces 221 connected to the same electronic component 3, when a large area of ​​a number of connection surfaces 221 is exposed to the insulating body 1, the portion of the connection portion 22 adjacent to the main body portion 21 can be recessed by tearing to form the tear portion 23. The portion of the connection surface 221 of the connection portion 22 that is not used to form the tear portion 23 is connected to the electronic component 3. The tear portion 23 is covered by the insulating body 1 when the insulating body 1 is formed. When a portion of the connecting surface 221 is recessed to form the tear-off portion 23, the area of ​​the connecting surface 221 exposed to the insulating body 1 becomes smaller. By controlling the area of ​​the connecting surface 221 of the connecting portion 22 used to form the tear-off portion 23, the area of ​​the connecting surface 221 in the connecting portion 22 used to connect with the electronic component 3 can be controlled, thereby making the connecting surfaces 221 of multiple connecting portions 22 connected to the same electronic component 3 substantially identical. The exposed area of ​​the connecting surface 221 is the area of ​​the connecting surface 221 exposed to the insulating body 1. The tear-off portion 23 can be formed only by a partial recess in the structure of the connecting portion 22, or the tear-off portion 23 can be formed by a partial recess in both the connecting portion 22 and the main body portion 21, which are connected.

[0060] Reference Figure 4 During the molding of the insulating body 1, a positioning fixture is used to fix the connecting terminal 2 to ensure accurate positioning. The positioning fixture abuts against the mating surface 222 of the connecting part 22. Through the combined action of the positioning fixture and the mold abutting against the connecting surface 221 of the connecting part 22, the connecting part 22 is clamped, thereby fixing the connecting part 22. After the insulating body 1 is formed, the positioning fixture is removed, and the insulating body 1 forms a positioning hole 13 extending from the mating surface 222 to penetrate the insulating body 1 along the thickness direction. The positioning hole 13 is a hole for accommodating the positioning fixture that mates with the connecting part 22.

[0061] In addition, refer to Figure 14Alternatively, a positioning fixture can be used to position the mounting portion 24 of the connecting terminal 2. To prevent metal shavings from being generated at the corners of the mounting portion 24 when the positioning fixture positions it, the mounting portion 24 can be processed to form a chamfer 241 before forming the insulating body 1 and after the multiple connecting terminals 2 are separated by stamping. Specifically, the corners of the mounting portion 24 are pressed to form a beveled chamfer. Pre-processing the chamfer 241 on the mounting portion 24 can effectively prevent metal shavings from being generated at the corners of the mounting portion 24 when the positioning fixture positions it.

[0062] The present invention also provides a method for fabricating an optical driving base, which is used to prepare the aforementioned optical driving base. The method for fabricating the optical driving base includes steps S01 to S05.

[0063] Step S01: Provide a strip of material, form multiple connecting terminals 2 on the strip, and separate the connecting portions 22 of the multiple connecting terminals 2 from each other by stamping. The connecting portions 22 of the multiple connecting terminals 2 may warp or deform after stamping.

[0064] Step S02: A tearing portion 23 is formed at the connection position between the connecting portion 22 and the main body portion 21 to control the exposed area of ​​the connecting surface 221 in the connecting portion 22. This step S02 can be performed when the areas of multiple connecting surfaces 221 connected to the same terminal element differ significantly; it can be omitted when the area differences are small. At least a portion of the tearing portion 23 is formed by a recess in the connecting portion 22 to reduce the area of ​​the connecting surface 221 of the connecting portion 22 connected to the electronic component 3. By reducing the area of ​​the larger connecting surface 221 connected to the electronic component 3, the areas of multiple connecting surfaces 221 connected to the same electronic component 3 are made approximately the same.

[0065] Step S03: Forging the connecting portion 22 to plastically deform the connecting portion 22 and form a flat connecting surface 221. Specifically, the connecting surface 221 of the connecting portion 22 can be used as the forging surface, with the connecting surface 221 being concave to plastically deform the connecting portion 22; alternatively, the mating surface 222 of the connecting portion 22 can be used as the forging surface, with the mating surface 222 being concave to plastically deform the connecting portion 22; or, both the connecting surface 221 and the mating surface 222 can be used as the forging surfaces, with both surfaces being concave to plastically deform the connecting portion 22. After plastic deformation, the connecting portion 22 is flattened to eliminate the warping deformation generated during stamping, thereby forming a flat surface on the connecting surface 221 of the connecting portion 22.

[0066] Step S04: Injection mold the insulating body 1 and expose the connecting surface 221 to the insulating body 1. When the connecting part 22 and the main body 21 form a tear 23 at the connection position, the insulating body 1 covers the tear 23. When the connecting surface 221 is a forged surface and is recessed relative to the corresponding end face of the main body 21, the insulating body 1 forms a recessed groove, which is used to accommodate at least part of the recessed connecting surface 221. Before forming the insulating body 1, the mounting part 24 can be chamfered; a space identical to the insulating body 1 is defined by a mold, and the connecting terminal 2 is positioned by a positioning jig, and then the insulating body 1 is injection molded.

[0067] Step S05: After the insulating body 1 is formed, the electronic component 3 is installed in the mounting cavity 11 and welded to the connection part 22 of the connecting terminal 2.

[0068] The insulating body 1 can be formed by one-time injection molding or two-time injection molding. When the insulating body 1 is formed by two-time injection molding, a part of the structure of the insulating body 1 is first injection molded, the electronic component 3 is installed on the part of the structure and soldered to the connection terminal 2, and then the remaining part of the structure of the insulating body 1 is injection molded. Thus, the electronic component 3 can be integrated on the optical drive base during the process of two-time injection molding of the insulating body 1.

[0069] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the invention without departing from the principles and spirit of the invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. An optical driving base, comprising an insulating body (1), a connecting terminal (2) embedded in the insulating body (1), and an electronic component (3), wherein the insulating body (1) is provided with a mounting cavity (11) for accommodating the electronic component (3), and the connecting terminal (2) comprises an integrally formed main body portion (21) and a connecting portion (22), characterized in that, The connecting part (22) includes a connecting surface (221) and a mating surface (222) that are opposite each other in the thickness direction. The connecting surface (221) is exposed in the mounting cavity (11) to be fixed to the electronic component (3) by soldering. The connecting part (22) is plastically deformed to make the connecting surface (221) form a flat surface, and the thickness of the connecting part (22) is less than the thickness of the main body (21).

2. The optical driving base according to claim 1, characterized in that, The connecting part (22) is located at the end of the main body (21) and the connecting part (22) is forged along the thickness direction and formed by plastic deformation.

3. The optical driving base according to claim 1, characterized in that, The thickness of the main body (21) is 0.05 to 0.2 mm, and the thickness of the connecting part (22) after plastic deformation is 80% to 95% of the thickness of the main body (21).

4. The optical driving base according to claim 1, characterized in that, The width of the connecting portion (22) near the end of the main body portion (21) is greater than the width of the main body portion (21) near the end of the connecting portion (22).

5. The optical driving base according to claim 1, characterized in that, The main body (21) includes a first end face (211) and a second end face (212) disposed opposite each other along the thickness direction; the connecting surface (221) is flush with the first end face (211) along the thickness direction, and the mating surface (222) is concave relative to the second end face (212) along the thickness direction so that a step is formed between the mating surface (222) and the second end face (212) in the thickness direction.

6. The optical driving base according to claim 5, characterized in that, The mating surface (222) and the first end face (211) are embedded in the insulating body (1), and the insulating body (1) includes a positioning hole (13) extending from the mating surface (222) to penetrate the insulating body (1) along the thickness direction.

7. The optical driving base according to claim 5, characterized in that, The connecting surface (221) is flush with the bottom of the mounting cavity (11), and the first end face (211) is at least partially exposed to the mounting cavity (11) and is flush with the bottom of the mounting cavity (11).

8. The optical driving base according to claim 1, characterized in that, At least a portion of the connecting portion (22) of the connecting terminal (2) forms a tear-off portion (23) at the connection point with the main body portion (21). The tear-off portion (23) is recessed in the thickness direction into the connecting surface (221) to form a blocking groove (231) at the connection point of the connecting portion (22) and the main body portion (21). The blocking groove (231) is filled by the insulating body (1). The tear-off portion (23) is used to control the area of ​​the connecting portion (22) exposed to the insulating body (1).

9. A method for fabricating an optical driving base, characterized in that, include: Step S01: Provide a strip of material, and form a plurality of connecting terminals (2) having a main body (21) and a connecting part (22) on the strip of material. Separate the connecting parts (22) of the plurality of connecting terminals (2) from each other by stamping. The connecting part (22) includes a connecting surface (221) and a mating surface (222) that are opposite to each other in the thickness direction. Step S03: Forging the connecting part (22) to plastically deform the connecting part (22) so that the connecting surface (221) forms a flat surface, wherein the thickness of the connecting part (22) after forging is less than the thickness of the main body part (21); Step S04: Insulating body (1) is injection molded on the connecting terminal (2), the insulating body (1) having a mounting cavity (11) and the connecting surface (221) being exposed in the mounting cavity (11); Step S05: Provide electronic component (3), install the electronic component (3) into the mounting cavity (11) and fix it to the connection surface (221) by soldering.

10. The method for fabricating the optical driving base according to claim 9, characterized in that, Step S03 specifically includes: using the mating surface (222) as the forging surface for forging, so that the connecting part (22) is plastically deformed and the mating surface (222) is concave. The main body (21) includes a first end face (211) and a second end face (212) arranged opposite to each other along the thickness direction. At least part of the mating surface (222) of the connecting terminal (2) and the second end face (212) form a step in the thickness direction.

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