Partitioned cooperative temperature control system and method for a laser

Abstract

The application discloses a kind of partition collaborative temperature control system and method of laser, it is related to laser heat control technical field.The system includes the refrigerant circulation loop being arranged in optical path component, the air cooling circuit being arranged in circuit control component, the semiconductor refrigeration circuit being arranged in laser output component and temperature control component;Each circuit is equipped with temperature sensor, the signal of each temperature sensor is uniformly accessed the main control unit of temperature control component;Temperature deviation hierarchical response logic is built-in in main control unit: when the deviation of measured temperature of laser output component and set target temperature is greater than first preset threshold, it is determined as transient large heat load, simultaneously increase refrigerant circulation flow when starting semiconductor refrigeration module, the cooling water path of laser output component is pre-cooled by plate heat exchanger, share the heat load of semiconductor refrigeration module.The application realizes the efficient collaborative heat management of laser multi-heat source component by partition differentiation temperature control and hierarchical response linkage.

Description

Technical Field

[0001] This application relates to the field of laser thermal control technology, specifically to a zoned collaborative temperature control system and method for a laser. Background Technology

[0002] Existing laser cutting temperature control systems mostly use a single heat dissipation method to uniformly control the temperature of the entire machine, which is difficult to match with the different heating characteristics and temperature control accuracy requirements of the optical path, circuit, and laser output components. Optical path components are sensitive to temperature fluctuations, and thermal effects can easily lead to beam quality degradation and wavelength drift; excessive temperature rise in circuit control components accelerates device aging and increases the risk of failure; temperature fluctuations in laser output components directly affect the stability of output power, resulting in problems such as reduced cutting accuracy and rough cut surfaces.

[0003] To address the aforementioned issues, existing technologies have proposed solutions for independent temperature control in different zones. These solutions involve setting up separate heat dissipation structures for the pump source zone, optical path zone, and electrical zone, and centrally controlling them through a unified main control unit. However, in existing zoned temperature control schemes, the actuators for each zone are of a single type, resulting in insufficient matching for zones with different thermal characteristics. Each zone still operates independently, lacking an effective thermal coupling and coordination mechanism. When a zone experiences a transient high heat load, relying on a single actuator makes a rapid response difficult, easily leading to localized temperature runaway.

[0004] Furthermore, due to the significant differences in the response characteristics of different temperature control actuators (such as the response speed of mechanical flow control valves being much lower than that of semiconductor refrigeration modules), existing solutions are prone to problems of asynchronous control commands and actual actions under dynamic operating conditions, affecting temperature control accuracy and response speed, and making it difficult to meet the dual requirements of high-power laser cutting for the speed and stability of the temperature control system. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a zoned collaborative temperature control system and method for lasers. By linking zoned differentiated temperature control with graded response, it achieves efficient collaborative thermal management of multiple heat source components in the laser, effectively improving the temperature control response speed and system stability under transient high heat load conditions.

[0006] In a first aspect, the present invention provides a zoned collaborative temperature control system for a laser, comprising: A refrigerant circulation loop is provided at the optical path component of the laser to cool the optical path component; a first temperature sensor is provided on the refrigerant circulation loop; An air-cooling circuit is installed at the circuit control component of the laser to dissipate heat from the circuit control component; a second temperature sensor is installed on the air-cooling circuit. A semiconductor cooling circuit is disposed at the laser output component of the laser for bidirectional constant temperature control of the laser output component; a third temperature sensor is disposed on the semiconductor cooling circuit; an electrothermal module connected to the temperature control component is also disposed at the laser output component. Temperature control components are connected to the refrigerant circulation loop, air-cooled loop, and semiconductor refrigeration loop respectively, and are used to perform differentiated independent temperature control on each loop; The temperature signals from the first, second, and third temperature sensors are all connected to the main control unit of the temperature control component; the main control unit has built-in temperature deviation graded response logic for controlling the temperature of the laser output component. When the deviation between the measured temperature of the third temperature sensor and the set target temperature is greater than the first preset threshold, it is determined to be a transient large heat load. At the same time as starting the semiconductor cooling module, the refrigerant circulation flow rate of the optical path component is increased, and the cooling water path of the laser output component is pre-cooled through the plate heat exchanger to share the heat load of the semiconductor cooling module and prevent the hot end of the semiconductor cooling module from saturating. When the deviation is less than the first preset threshold but greater than the second preset threshold, only the semiconductor cooling module is activated; When the deviation is less than the second preset threshold and greater than zero, the semiconductor cooling module is turned off and the current refrigerant circulation flow rate is maintained; When the deviation is less than zero, the electric heating module is activated for heating compensation.

[0007] As a preferred embodiment of the technical solution of the present invention, the main control unit also has built-in compensation logic based on response delay differences: When the first preset threshold is triggered, the main control unit advances the issuance time of the refrigerant flow adjustment command by a first delay time to compensate for the response delay caused by mechanical action in the refrigerant circulation loop. When the second preset threshold is triggered, the timing of the semiconductor cooling module start command is advanced by a second delay time, where the second delay time is less than the first delay time.

[0008] The main control unit incorporates compensation logic based on response delay differences. Different advance command issuance times are set for different actuators to address their varying response characteristics, ensuring that the actual action of each actuator is synchronized with the moment when the temperature deviation reaches the preset value. This solves the problem of asynchronous control commands and actual actions caused by different actuator response delays in traditional temperature control systems, further improving the timeliness of graded response control and the accuracy of temperature regulation.

[0009] As a preferred embodiment of the present invention, the refrigerant circulation loop of the optical path component includes a compressor, a condenser, an electronic expansion valve, and a gas-liquid separator; the temperature control component adjusts the opening of the electronic expansion valve according to the real-time temperature of the first temperature sensor to adjust the refrigerant flow rate and evaporation temperature entering the optical path component; the gas-liquid separator is arranged before the compressor suction port to separate the evaporated gaseous refrigerant from the incompletely evaporated liquid refrigerant.

[0010] By incorporating a compressor, condenser, electronic expansion valve, and gas-liquid separator in the refrigerant circulation loop of the optical path components, and adjusting the opening of the electronic expansion valve based on the real-time temperature reading from the first temperature sensor using a temperature control component, precise regulation of the refrigerant flow rate and evaporation temperature of the optical path components is achieved. This effectively suppresses the thermal effect of the optical elements and ensures the stability of beam transmission. The gas-liquid separator is positioned before the compressor suction port, effectively preventing liquid refrigerant from entering the compressor and causing liquid slugging damage, thus improving the reliability of system operation.

[0011] As a preferred embodiment of the present invention, the outlet pipe of the condenser is divided into two parallel branches: The first branch is connected to the refrigerant heat exchange tube built into the optical path component after being throttled by the electronic expansion valve. The second branch is throttled by another electronic expansion valve and then connected to the refrigerant side of the plate heat exchanger. The water side of the plate heat exchanger is connected to the cooling water circuit of the laser output component.

[0012] The condenser outlet pipe is divided into two parallel branches. The first branch is throttled by an electronic expansion valve and then connected to the refrigerant heat exchange tube built into the optical path component. The second branch is throttled by another electronic expansion valve and then connected to the refrigerant side of the plate heat exchanger. The water side of the plate heat exchanger is connected to the cooling water circuit of the laser output component. This dual-branch parallel structure enables a single cold source to simultaneously serve the direct cooling of the optical path component and the water cooling of the laser output component. The two branches independently adjust the refrigerant flow through their respective electronic expansion valves, without interfering with each other. This allows for the coordinated cooling and heating under transient high heat load conditions.

[0013] As a preferred embodiment of the present invention, the air-cooling circuit of the circuit control component is provided with a directional air duct, the air outlet of the directional air duct faces the concentrated area of ​​electrical heating devices, and a variable frequency fan is provided at the air inlet; the temperature control component adjusts the speed of the variable frequency fan according to the real-time temperature of the second temperature sensor.

[0014] By setting a directional air duct inside the air-cooling circuit of the circuit control component, the air outlet is directed towards the concentrated area of ​​electrical heat-generating devices. The speed of the variable frequency fan at the air inlet is adjusted by the temperature control component according to the real-time temperature of the second temperature sensor, thus achieving precise air-cooling of the circuit control component and avoiding accelerated aging and increased failure rate of electrical components due to high temperature.

[0015] As a preferred embodiment of the present invention, the variable frequency fan is located on the top of the system frame, and the airflow from the variable frequency fan serves the heat dissipation of both the air-cooling circuit and the condenser; the system is integrated into a frame with casters, and the condenser and the variable frequency fan are located on the top of the frame.

[0016] The system is integrated into a frame with casters, and the condenser and variable frequency fan are located on the top of the frame, which facilitates equipment relocation and rapid heat dissipation. The airflow of the variable frequency fan serves both the air-cooling circuit and the condenser, achieving dual heat dissipation function of a single fan, reducing the number of system components, and lowering the overall energy consumption and manufacturing cost.

[0017] As a preferred embodiment of the present invention, the third temperature sensor is a negative temperature coefficient thermistor, and the temperature control component acquires the resistance change of the negative temperature coefficient thermistor through a bridge circuit to obtain the real-time temperature of the laser output component.

[0018] A negative temperature coefficient thermistor is used as the third temperature sensor. Its resistance change is collected by a bridge circuit to obtain the real-time temperature of the laser output component. This temperature measurement method has the advantages of fast response speed and high sensitivity.

[0019] Secondly, the present invention also provides a zoned collaborative temperature control method for a laser, applied to the zoned collaborative temperature control system for the laser described in the first aspect, comprising the following steps: Real-time acquisition of zoned temperature data for optical path components, circuit control components, and laser output components; Calculate the deviation between the measured temperature of the laser output component and the set target temperature; When the deviation value is greater than the first preset threshold, it is determined to be a transient large heat load. At the same time, the semiconductor cooling module of the laser output component is activated for cooling, the refrigerant circulation flow of the optical path component is increased, and the cooling water path of the laser output component is pre-cooled through a plate heat exchanger to share the heat load of the semiconductor cooling module and prevent the hot end of the semiconductor cooling module from becoming saturated. When the deviation value is less than the first preset threshold but greater than the second preset threshold, only the semiconductor cooling module is activated for cooling. When the deviation value is less than the second preset threshold and greater than zero, the semiconductor cooling module is turned off and the current refrigerant circulation flow rate is maintained. When the deviation value is less than or equal to zero, the electrothermal module of the laser output component is activated for heating compensation. The heat dissipation intensity of the air-cooling circuit is adjusted according to the real-time temperature of the circuit control component.

[0020] By collecting real-time temperature data of each component zone and calculating the temperature deviation of the laser output component, graded response control is performed according to the different threshold ranges of the deviation. Under transient high heat load conditions, the coordinated linkage of TEC cooling and refrigerant precooling can be achieved, which can systematically improve the thermal management efficiency and temperature control accuracy of the laser under multiple heat sources and variable operating conditions.

[0021] As a preferred embodiment of the technical solution of the present invention, when issuing control commands, asymmetric delay compensation logic based on hierarchical response is also executed: When the first preset threshold is triggered, since the mechanical delay of refrigerant circulation flow regulation is greater than the electrical response delay of the semiconductor refrigeration module, the issuance time of the refrigerant flow regulation command is advanced by the first delay time. When the second preset threshold is triggered, only a semiconductor cooling command is issued, and the issuance time is advanced by a second delay time, which is less than the first delay time.

[0022] In the delay compensation method, a longer advance issuance time is set for the refrigerant flow adjustment command when the first preset threshold is triggered, and a shorter advance issuance time is set for the semiconductor refrigeration command when the second preset threshold is triggered. This achieves asymmetric delay compensation based on the difference in actuator type, ensuring that different actuators can achieve precise timing actions at different stages of graded response.

[0023] As a preferred embodiment of the technical solution of the present invention, when adjusting the heat dissipation intensity of the air-cooling circuit according to the real-time temperature of the circuit control component: When the measured temperature of the circuit control component increases, the speed of the inverter fan is increased to enhance air cooling; when the measured temperature of the circuit control component decreases, the speed of the inverter fan is decreased to reduce energy consumption.

[0024] When adjusting the heat dissipation intensity of the air-cooling circuit according to the real-time temperature of the circuit control components, the variable frequency fan speed is increased to enhance heat dissipation when the measured temperature rises, and the variable frequency fan speed is reduced to reduce energy consumption when the measured temperature falls. This achieves on-demand supply of air-cooling heat dissipation and avoids the noise and energy consumption problems caused by long-term high-speed operation of the fan.

[0025] As can be seen from the above technical solutions, this application has the following advantages: by setting independent temperature control loops and temperature sensors for the optical path components, circuit control components and laser output components, it realizes zoned and differentiated independent temperature control for different thermal characteristic components of the laser, overcoming the shortcomings of traditional single heat dissipation methods that are difficult to match the different temperature control accuracy requirements of each component.

[0026] The main control unit incorporates a temperature deviation graded response logic. When the deviation between the measured temperature of the laser output component and the set target temperature exceeds the first preset threshold, it is determined to be a transient high heat load. At the same time as activating the semiconductor cooling module, the refrigerant circulation flow rate of the optical path component is increased, and the cooling water path of the laser output component is pre-cooled through the plate heat exchanger. This creates a synergistic linkage between TEC electrical cooling and refrigerant circulation mechanical cooling, effectively improving the temperature control response speed and system stability under transient high heat load conditions. Attached Figure Description

[0027] To more clearly illustrate the technical solution of this application, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a system structure diagram provided for an embodiment of the present invention.

[0029] Figure 2 This is the schematic diagram of the system control logic.

[0030] Figure 3 A diagram illustrating the overall thermal management architecture of the system. Detailed Implementation

[0031] To make the purpose, features, and advantages of this application more apparent and understandable, specific embodiments and accompanying drawings will be used to clearly and completely describe the technical solution protected by this application. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this application and in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0033] like Figure 1 As shown, this embodiment of the invention provides a zoned collaborative temperature control system for a laser, including a refrigerant circulation loop, an air-cooled loop, a semiconductor refrigeration loop, and a temperature control component 4. The system is integrated into a frame with casters, and the condenser and variable frequency fan are located on the top of the frame, facilitating rapid heat dissipation and equipment relocation.

[0034] The refrigerant circulation loop is located at the optical path component 1 and is used to cool the optical path component 1. The optical path component 1 is a laser transmission optical assembly, which integrates a refrigerant heat exchange tube. The optical path component 1 is connected to the refrigerant circulation compression system 7, which includes a compressor, a condenser, an electronic expansion valve, and a gas-liquid separator, forming a closed refrigerant circulation loop. The refrigerant circulation compression system 7 drives the refrigerant to continuously circulate within the loop, directly carrying away the heat generated by the optical element as it flows through the optical path component 1. A first temperature sensor is installed on the refrigerant circulation loop.

[0035] The air-cooling circuit is located at the circuit control component 2 and is used to dissipate heat from the circuit control component 2. The circuit control component 2 is located on the left side of the frame and is equipped with a variable frequency fan 3. A directional air duct is pre-set inside the circuit control component, with the air outlet of the directional air duct facing the area where electrical heat-generating devices are concentrated. The variable frequency fan 3 is located at the air inlet of the directional air duct, and the fan directs airflow along the directional air duct, with the air outlet of the directional air duct facing the electrical heat-generating devices. A second temperature sensor is installed on the air-cooling circuit.

[0036] The semiconductor cooling circuit is located at the laser output component 5 and is used for bidirectional constant temperature control of the laser output component 5. The laser output component 5 is externally connected to a water-cooled dual-temperature control component 6. The water-cooled dual-temperature control component 6 integrates a semiconductor cooling module, an electric heating module, and a temperature sensor, forming a bidirectional temperature control unit. The water-cooled dual-temperature control component 6 is connected to the cooling cavity of the laser output component 5 through water cooling pipes, and the water circulation removes heat from the laser output component and the hot end of the semiconductor cooling module, achieving bidirectional constant temperature control through cooling and heating. A third temperature sensor is installed on the semiconductor cooling circuit; an electric heating module connected to the temperature control component is also installed at the laser output component.

[0037] Temperature control component 4 is connected to the refrigerant circulation loop, air-cooled loop, and semiconductor refrigeration loop respectively, for differentiated and independent temperature control of each loop. Temperature control component 4 has a built-in main control unit, and the temperature signals from the first, second, and third temperature sensors are uniformly connected to the main control unit to realize synchronous acquisition and coordinated control of temperatures in each zone.

[0038] The system implements coordinated temperature control across the entire unit: the zoned temperature signals from optical path component 1, circuit control component 2, and laser output component 5 are uniformly connected to the main control unit of temperature control component 4. Based on the overall operating conditions and the temperature rise priority of each component, the main control unit coordinates the operating status of the refrigerant circulation compression system 7, the variable frequency fan 3, and the water-cooled dual temperature control component 6 to achieve coordinated temperature control across multiple components, avoiding overheating of a single component or temperature control conflicts, and improving the overall temperature control stability and operational reliability.

[0039] The refrigerant cooling of the optical path component 1 is achieved by the refrigerant circulation compression system 7. The core components of the refrigerant circulation compression system 7 include a compressor, a condenser, a variable frequency fan, an electronic expansion valve, a refrigerant heat exchange tube built into the optical path component, and a gas-liquid separator.

[0040] The refrigerant piping is equipped with two parallel throttling branches: First branch: Condenser outlet - First electronic expansion valve - Refrigerant heat exchange tube built into the optical path component - Low-pressure return gas main. In this branch, the two-phase refrigerant evaporates inside the heat exchange tube of the optical path component, directly carrying away the heat from the pump source chip and optical elements, and the refrigerant evaporates into a low-pressure gaseous state.

[0041] The second branch: condenser outlet - second branch electronic expansion valve - plate heat exchanger refrigerant side - low-pressure return main pipe. In this branch, the two-phase refrigerant evaporates in the refrigerant channel of the plate heat exchanger, absorbing heat from the cooling water circuit of the laser output component, completing the cooling of the water circuit, and the refrigerant evaporates into a low-pressure gaseous state.

[0042] After the two gaseous refrigerants are combined, they pass through a gas-liquid separator and flow back to the compressor suction end, completing one complete thermodynamic cycle.

[0043] The complete four-step phase change cycle of refrigerant is as follows: Low-temperature, low-pressure gaseous refrigerant is drawn into the compressor, where it is compressed and performs work to form high-temperature, high-pressure superheated gaseous refrigerant, which is then transported to the condenser. This high-temperature, high-pressure gaseous refrigerant enters the condenser's heat exchange lines, where a variable-frequency fan drives airflow across the condenser fins. The refrigerant releases heat and condenses from a gaseous state into a room-temperature, high-pressure liquid refrigerant. The high-pressure liquid refrigerant then splits into two independent branches, each passing through a corresponding electronic expansion valve. The refrigerant pressure and temperature drop rapidly, forming a low-temperature, low-pressure gas-liquid two-phase refrigerant.

[0044] In the first branch, the two-phase refrigerant evaporates inside the heat exchange tubes of the optical path components, directly carrying away heat from the optical elements; in the second branch, the two-phase refrigerant evaporates inside the plate heat exchanger channels, absorbing heat from the cooling water path of the laser output components. The two refrigerants converge after evaporating into a low-pressure gaseous state.

[0045] Temperature control component 4 independently adjusts the opening of each branch's electronic expansion valve based on the real-time temperature from the first temperature sensor: when the first temperature sensor detects an increase in the temperature of the optical path component, the main control unit increases the opening of the first electronic expansion valve, increasing the refrigerant flow rate and evaporation temperature entering the refrigerant heat exchange tube of the optical path component, thus enhancing the cooling effect; conversely, it decreases the opening. The opening of the second branch's electronic expansion valve is adjusted according to the temperature requirements of the laser output component 5 and the graded response logic.

[0046] The laser output component 5 is connected to an external water-cooled dual temperature control component 6. The water-cooled dual temperature control component 6 integrates a semiconductor cooling module, an electric heating module, and a third temperature sensor, forming a bidirectional temperature control unit.

[0047] The third temperature sensor is located at the cooling water outlet of the water-cooled dual temperature control component 6 or at the cooling cavity of the laser output component 5. It is a negative temperature coefficient thermistor (NTC). The temperature control component 4 obtains the real-time temperature of the laser output component by acquiring the resistance change of the NTC thermistor through a bridge circuit. This provides timely and accurate temperature data input for the temperature deviation graded response logic.

[0048] The water-cooled dual-temperature control component 6 is connected to the cooling cavity of the laser output component 5 via water-cooling pipelines. Its working principle is as follows: the semiconductor cooling module (TEC) operates based on the thermoelectric cooling effect. When current flows through the TEC cooling chip, the cold end absorbs heat from the cooling water in the water-cooling pipeline to achieve cooling, while the hot end releases heat. The electrothermal module uses resistance heating; when heating compensation is required, it is energized to heat the cooling water in the water-cooling pipeline.

[0049] The heat dissipation of the hot end of the semiconductor cooling module is accomplished through the following water circulation: the cooling water path of the water-cooled dual temperature control component 6 is coupled to the second branch of the refrigerant circulation compression system 7 via a plate heat exchanger. The cooling water exchanges heat with the refrigerant side on the water side of the plate heat exchanger. The cooled water then enters the cooling chamber of the water-cooled dual temperature control component 6, carrying away the heat from the hot end of the semiconductor cooling module and preventing the cooling efficiency from decreasing due to excessively high hot end temperature. The cooled water continues to circulate to the cooling chamber of the laser output component 5, carrying away the heat generated by the laser output component itself.

[0050] The circuit control components are located on the left side of the rack, and their air-cooling circuit has a pre-set directional air duct. The design of the directional air duct is based on the spatial distribution analysis of electrical heat-generating devices—the concentrated area of ​​heat-generating devices inside the circuit control components is determined through CFD simulation or thermal imaging measurement, and the air outlet is precisely oriented towards this area.

[0051] A variable frequency fan 3 is installed at the air inlet. The airflow from the variable frequency fan serves to cool both the air-cooling circuit and the condenser. Specifically, part of the airflow from the variable frequency fan enters the circuit control component 2 along the directional air duct for forced convection cooling, carrying away the heat generated by the electrical heating devices; the other part passes over the condenser fins, assisting the condenser in completing the condensation and heat release of the refrigerant.

[0052] The temperature control unit adjusts the speed of the variable frequency fan 3 based on the system condensing pressure and the real-time temperature of the circuit control unit: when the second temperature sensor detects that the internal temperature of the circuit control unit rises or the condensing pressure rises, the main control unit outputs a PWM speed control signal to increase the speed of the variable frequency fan, while strengthening the heat dissipation of the condenser and the air cooling of the electrical module; when both temperatures are within the safe range, the speed of the variable frequency fan is reduced to reduce energy consumption and noise.

[0053] Combination Figure 3In this embodiment, the optical path component 1 includes an optical module 22, an electric heating assembly, and a first temperature sensor t1. The optical module 22 integrates a refrigerant heat exchange tube, serving as the main heat-receiving component for direct refrigerant cooling. The circuit control component 2 includes an electrical module 21. The electrical module 21 is the main heat-generating unit within the circuit control component, integrating a drive power supply, a control motherboard, and power switching devices. The heat dissipation intensity is adjusted by the temperature control component 4 based on the real-time temperature. The overall thermal management architecture of this system is divided into three main functional units: Refrigerant circulation heat exchange unit: Compressor 11 compresses low-temperature, low-pressure gaseous refrigerant into high-temperature, high-pressure superheated gaseous refrigerant, which is then delivered to condenser 12. Condenser 12 uses top variable frequency fan 3 to force air cooling and condense the refrigerant into liquid. After being throttled by the first electronic expansion valve 13, the liquid refrigerant becomes a low-temperature, low-pressure gas-liquid two-phase state and enters the refrigerant heat exchange tube of optical module 22. During the evaporation process, the two-phase refrigerant absorbs heat from the optical path components, becomes low-pressure gas, and returns to compressor 11, completing the refrigerant circulation.

[0054] Output head heat exchange unit: Cooling water is stored in water tank 61, which integrates semiconductor cooling module 31 and electric heating module 32; water pump 62 provides power for water circulation; cooling water is pumped to the cooling cavity of laser output component 5 by water pump, which removes heat from laser output component and TEC hot end; the cooled water after absorbing heat flows back to water tank, where it is actively cooled by semiconductor cooling chip or heated by electric heater to achieve closed-loop regulation of cooling water temperature.

[0055] Forced convection heat exchange unit: A directional air duct is installed inside the circuit control component. The electrical module 21 is located at the air outlet of the directional air duct, and a variable frequency fan at the air inlet of the directional air duct generates forced airflow. The airflow is divided into two paths: one path enters the circuit control component along the directional air duct to provide forced convection cooling for the electrical module 21; the other path passes over the condenser 12 fins to assist in the condensation and heat release of the refrigerant circulation heat exchange unit. The variable frequency fan is located on the top of the frame, and its speed is adjusted by the temperature control component based on the temperature of the circuit control component and the system condensation pressure.

[0056] The main control unit incorporates a temperature deviation graded response logic to control the temperature of the laser output component. This logic executes different control strategies in four levels based on the deviation between the measured temperature of the third temperature sensor t3 in the water-cooled dual-temperature control component and the set target temperature: When the deviation between the measured temperature of the third temperature sensor t3 and the set target temperature exceeds the first preset threshold, the main control unit determines it to be a transient high heat load condition. At this time, two operations are executed simultaneously: The semiconductor cooling module 31 with water-cooled dual temperature control components is activated to provide forced cooling at 100% of its rated power; Increase the refrigerant flow rate in the first branch of the refrigerant circulation compression system. Increase the opening of the first electronic expansion valve 13 to increase the refrigerant flow rate into the refrigerant heat exchange tube of the optical path component, enhance the heat exchange effect of the plate heat exchanger, and pre-cool the cooling water circuit of the water-cooled dual temperature control component.

[0057] The principle behind this collaborative mechanism is that while the semiconductor refrigeration module has a fast response speed and high temperature control accuracy, its cooling capacity is limited. Under transient high heat loads, it is prone to a sharp drop in cooling efficiency due to insufficient heat dissipation at the hot end. At this time, by increasing the refrigerant circulation flow rate, enhancing the pre-cooling effect of the plate heat exchanger, and lowering the base water temperature of the cooling water circuit in advance, the heat load of the semiconductor refrigeration module is shared, preventing hot end saturation, and ensuring that the TEC always operates in the high-efficiency range.

[0058] When the deviation is less than the first preset threshold but greater than the second preset threshold, the main control unit determines it to be a medium heat load condition and only activates the semiconductor refrigeration module 31 to perform cooling at 30% to 60% of its rated power, without linking the refrigerant flow adjustment. Within this deviation range, the TEC's cooling capacity is sufficient to handle the heat load, without the need for additional mechanical refrigeration power consumption for refrigerant circulation, thus achieving energy-saving operation.

[0059] When the deviation is less than the second preset threshold and greater than zero, the main control unit determines that the operating condition is close to the target temperature and shuts down the semiconductor cooling module 31 to maintain the current refrigerant circulation flow. During this stage, the system relies on the basic cooling of the refrigerant circulation loop of the optical path components to maintain thermal balance, avoiding energy consumption and lifespan loss caused by frequent TEC start-stop.

[0060] When the deviation is less than or equal to zero, the main control unit determines that it is undercooled and starts the electric heating module 32 to perform heating compensation, so that the temperature rises back to the set target value.

[0061] Because the response characteristics of different temperature control actuators vary significantly, the main control unit also has built-in compensation logic based on the difference in response delay.

[0062] Specifically, the flow regulating actuator in the refrigerant circulation loop (i.e., the electronic expansion valve in this embodiment) is a mechanical actuator, which exhibits a significant mechanical response delay from receiving the command to actually completing the opening change; while the semiconductor refrigeration module is an electrical response actuator, with an extremely short time delay from receiving the command to starting refrigeration. This difference in response delay may lead to a discrepancy between the actual action time of each actuator and the time when the temperature deviation reaches the preset value in hierarchical response control, affecting control accuracy.

[0063] To address this issue, the main control unit sets compensation amounts for different triggering conditions: When the first preset threshold is triggered, the main control unit advances the issuance time of the refrigerant flow adjustment command by the first delay time to compensate for the response delay caused by the mechanical action of the refrigerant circulation loop, so that the actual time of the refrigerant flow increase is synchronized with the actual time of TEC start-up.

[0064] When the second preset threshold is triggered, the main control unit advances the timing of the semiconductor cooling module start command by a second delay time, which is less than the first delay time.

[0065] This asymmetric delay compensation logic sets compensation amounts for different actuator types, ensuring that each actuator can achieve precise timing actions at different stages of the graded response, so that the actual temperature control effect is consistent with expectations.

[0066] like Figure 2 As shown, the complete workflow of the system during operation is as follows: Step 1: The temperature control component collects the zoned temperature data of the optical path component, circuit control component and laser output component in real time through the first temperature sensor t1, the second temperature sensor t2 and the third temperature sensor t3, and all temperature signals are uniformly connected to the main control unit.

[0067] Step 2: The main control unit calculates the deviation between the measured temperature of the laser output component and the set target temperature, and determines the current operating condition type based on the threshold range of the deviation.

[0068] Step 3: When the deviation is greater than the first preset threshold, the semiconductor cooling module is started at 100% of its rated power, the opening of the first electronic expansion valve is increased to increase the refrigerant flow, and the cooling water circuit of the laser output component is pre-cooled through the plate heat exchanger to share the TEC heat load.

[0069] When the deviation is less than the first preset threshold but greater than the second preset threshold, only the semiconductor cooling module is activated to cool at 30% to 60% of its rated power.

[0070] When the deviation is between 0 and the second preset threshold, the semiconductor cooling module is turned off to maintain the current refrigerant flow.

[0071] When the deviation is less than or equal to 0, the electric heating module is activated for heating compensation.

[0072] Step 4: When issuing control commands to each actuator, the main control unit sets different advance issuance times according to the actuator type and triggering conditions: the refrigerant flow adjustment command is issued with a first delay time in advance, and the TEC start command is issued with a second delay time in advance.

[0073] Step 5: The temperature control component synchronously adjusts the speed of the variable frequency fan according to the real-time temperature of the second temperature sensor t2. When the temperature rises, the speed is increased to enhance heat dissipation, and when the temperature drops, the speed is decreased to reduce energy consumption.

[0074] Step Six: In the next control cycle, the main control unit re-collects temperature data for each area and repeats the above steps to form a continuous closed-loop temperature control.

[0075] As a preferred embodiment of the present invention, the setting of the thresholds at each level in the above-mentioned temperature deviation graded response logic can be optimized using the following parameter tuning method: Turn off the integral and derivative terms, and keep only the proportional term. Gradually adjust the proportional coefficient Kp from small to large until the temperature response of the laser output component shows a small constant amplitude oscillation. Record the proportional coefficient Kp and the oscillation period Tu at this time.

[0076] An integral term is added to the proportional term, and the integral coefficient Ki is gradually increased from a small value to eliminate the steady-state temperature difference, so that the static difference between the measured temperature and the set target temperature approaches zero, ensuring that the temperature falls accurately at the set value.

[0077] By adding the differential term and gradually increasing the differential coefficient Kd from a small value, temperature overshoot is suppressed, making the temperature response curve smooth without sharp peaks and avoiding oscillations when the deviation crosses the threshold boundary.

[0078] Based on the above parameters, fine-tuning is performed to balance the heating rate, anti-interference ability, and long-term isotropic stability, so as to obtain the optimal combination of control parameters.

[0079] Through the above tuning method, the response thresholds at each level (first preset threshold, second preset threshold) can be linked with the PID control parameters to ensure that the actuator can respond with optimal dynamic characteristics in different deviation ranges.

[0080] In a preferred embodiment of the present invention, the main control unit, when executing the temperature deviation graded response logic, also executes a feedforward control strategy based on operating parameters: While collecting temperature data from each component in real time, the main control unit also acquires the current processing parameters of the laser in real time. These processing parameters include at least the laser power setting and the cutting speed. When a step increase in the laser power setting is detected, and the increase exceeds a preset power change threshold, the main control unit initiates the pre-cooling mode of the semiconductor cooling module before the temperature deviation reaches a first preset threshold. This mode operates at 50% to 80% of the rated power to pre-cool the cooling water circuit. When the temperature deviation subsequently reaches the first preset threshold, the semiconductor cooling module switches to 100% of the rated power and simultaneously triggers an increase in the refrigerant circulation flow rate, further pre-cooling the cooling water circuit through the plate heat exchanger.

[0081] This feedforward control mechanism intervenes in temperature control in advance by anticipating changes in operating conditions. Compared with passive regulation that relies solely on temperature deviation feedback, it can further shorten the temperature control response time under transient high heat load conditions and effectively suppress temperature overshoot.

[0082] In a preferred embodiment of the present invention, when the main control unit controls the semiconductor refrigeration module based on the temperature deviation graded response logic, the refrigeration power corresponding to each level of response threshold is determined using the following PID parameter segmented tuning method: The cooling power of the semiconductor cooling module corresponding to each response threshold is determined using the following PID parameter tuning method: When the deviation between the measured temperature and the set target temperature is greater than the first preset threshold, the first set of PID parameters is used, where the proportional coefficient is taken as 80% to 100% of the proportional coefficient that makes the system temperature response exhibit small, constant-amplitude oscillations, in order to prioritize meeting the rapid cooling requirement; when the deviation is less than the first preset threshold but greater than the second preset threshold, the system switches to the second set of PID parameters, where the integral coefficient is greater than the integral coefficient of the first set of PID parameters, in order to prioritize eliminating the steady-state temperature difference; when the deviation is less than the second preset threshold and greater than zero, the system switches to the third set of PID parameters, where the derivative coefficient is greater than the derivative coefficient of the first set of PID parameters, in order to prioritize suppressing temperature overshoot.

[0083] By using the above-mentioned segmented tuning method for PID parameters, the response thresholds at each level are linked with the PID control parameters, ensuring that the actuator can respond with optimal dynamic characteristics in different deviation ranges.

[0084] In a preferred embodiment of the present invention, the main control unit performs an integral separation strategy when calculating the temperature deviation: When the absolute value of the deviation is greater than the first preset threshold, the integral term in the PID control is turned off, and only the proportional and derivative terms are used for control to prevent overshoot caused by integral saturation; when the absolute value of the deviation is less than or equal to the second preset threshold, the integral term is activated to eliminate the steady-state temperature difference.

[0085] Furthermore, as a preferred embodiment of the present invention, when the main control unit executes the compensation logic based on the response delay difference, the first delay time is dynamically set according to the measured value of the response delay time of the electronic expansion valve in the refrigerant circulation loop, and the second delay time is dynamically set according to the measured value of the electrical response delay time of the semiconductor refrigeration module; the difference between the first delay time and the second delay time is not less than the measured difference between the mechanical response delay of the refrigerant circulation loop and the electrical response delay of the semiconductor refrigeration module.

[0086] As one of the preferred embodiments of the present invention, in the refrigerant circulation loop of the optical path component, the gas-liquid separator is arranged before the compressor suction port to separate the evaporated gaseous refrigerant from the incompletely evaporated liquid refrigerant, allowing only the gaseous refrigerant to enter the compressor and preventing liquid refrigerant from entering the compressor and causing liquid slugging damage.

[0087] In one preferred embodiment of the present invention, the variable frequency fan is disposed on the top of the frame, and its exhaust airflow serves the heat dissipation of both the air-cooling circuit and the condenser; the temperature control component adjusts the speed of the variable frequency fan based on the system condensing pressure and the real-time temperature of the circuit control component.

[0088] Based on the system embodiments provided above, this invention also provides a method for zoned collaborative temperature control of a laser, comprising the following steps: S1. Real-time acquisition of zoned temperature data for optical path components, circuit control components, and laser output components; S2. Calculate the deviation between the measured temperature of the laser output component and the set target temperature; S3. When the deviation value is greater than the first preset threshold, it is determined to be a transient large heat load. At the same time, the semiconductor cooling module of the laser output component is started to cool, the refrigerant circulation flow of the optical path component is increased, and the cooling water path of the laser output component is pre-cooled through the plate heat exchanger to share the heat load of the semiconductor cooling module and prevent the hot end of the semiconductor cooling module from becoming saturated. S4. When the deviation value is less than the first preset threshold but greater than the second preset threshold, only the semiconductor cooling module is activated for cooling. S5. When the deviation value is less than the second preset threshold and greater than zero, the semiconductor cooling module is turned off and the current refrigerant circulation flow rate is maintained; S6. When the deviation value is less than or equal to zero, the electrothermal module of the laser output component is activated for heating compensation. S7. Adjust the heat dissipation intensity of the air-cooling circuit according to the real-time temperature of the circuit control component.

[0089] It should be noted that when issuing control commands, asymmetric delay compensation logic based on tiered response is also executed: When the first preset threshold is triggered, since the mechanical delay of refrigerant circulation flow regulation is greater than the electrical response delay of the semiconductor refrigeration module, the issuance time of the refrigerant flow regulation command is advanced by the first delay time. When the second preset threshold is triggered, only a semiconductor cooling command is issued, and the issuance time is advanced by a second delay time, which is less than the first delay time.

[0090] In addition, when adjusting the heat dissipation intensity of the air-cooling circuit according to the real-time temperature of the circuit control component: When the measured temperature of the circuit control component increases, the speed of the inverter fan is increased to enhance air cooling; when the measured temperature of the circuit control component decreases, the speed of the inverter fan is decreased to reduce energy consumption.

[0091] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A zoned collaborative temperature control system for a laser, characterized in that, include: A refrigerant circulation loop is provided at the optical path component of the laser to cool the optical path component; a first temperature sensor is provided on the refrigerant circulation loop; An air-cooling circuit is installed at the circuit control component of the laser to dissipate heat from the circuit control component; a second temperature sensor is installed on the air-cooling circuit. A semiconductor cooling circuit is disposed at the laser output component of the laser for bidirectional constant temperature control of the laser output component; a third temperature sensor is disposed on the semiconductor cooling circuit; an electrothermal module connected to the temperature control component is also disposed at the laser output component. Temperature control components are connected to the refrigerant circulation loop, air-cooled loop, and semiconductor refrigeration loop respectively, and are used to perform differentiated independent temperature control on each loop; The temperature signals from the first, second, and third temperature sensors are all connected to the main control unit of the temperature control component; the main control unit has built-in temperature deviation graded response logic for controlling the temperature of the laser output component. When the deviation between the measured temperature of the third temperature sensor and the set target temperature exceeds the first preset threshold, it is determined to be a transient large heat load. At the same time as starting the semiconductor cooling module, the refrigerant circulation flow rate of the optical path component is increased, and the cooling water path of the laser output component is pre-cooled through the plate heat exchanger to share the heat load of the semiconductor cooling module and prevent the hot end of the semiconductor cooling module from saturating. When the deviation is less than the first preset threshold but greater than the second preset threshold, only the semiconductor cooling module is started. When the deviation is less than the second preset threshold and greater than zero, the semiconductor cooling module is turned off and the current refrigerant circulation flow rate is maintained; When the deviation is less than zero, the electric heating module is activated for heating compensation.

2. The zoned collaborative temperature control system for a laser according to claim 1, characterized in that, The main control unit also has built-in compensation logic based on response latency differences: When the first preset threshold is triggered, the main control unit advances the issuance time of the refrigerant flow adjustment command by a first delay time to compensate for the response delay caused by mechanical action in the refrigerant circulation loop. When the second preset threshold is triggered, the timing of the semiconductor cooling module start command is advanced by a second delay time, where the second delay time is less than the first delay time.

3. The zoned collaborative temperature control system for a laser according to claim 1, characterized in that, The refrigerant circulation loop of the optical path component includes a compressor, a condenser, an electronic expansion valve, and a gas-liquid separator; the temperature control component adjusts the opening of the electronic expansion valve according to the real-time temperature of the first temperature sensor to regulate the refrigerant flow rate and evaporation temperature entering the optical path component; the gas-liquid separator is arranged before the compressor suction port to separate the evaporated gaseous refrigerant from the incompletely evaporated liquid refrigerant.

4. The zoned collaborative temperature control system for a laser according to claim 3, characterized in that, The outlet pipe of the condenser is divided into two parallel branches: The first branch is connected to the refrigerant heat exchange tube built into the optical path component after being throttled by the electronic expansion valve. The second branch is throttled by another electronic expansion valve and then connected to the refrigerant side of the plate heat exchanger. The water side of the plate heat exchanger is connected to the cooling water circuit of the laser output component.

5. The zoned collaborative temperature control system for a laser according to claim 4, characterized in that, The air-cooling circuit of the circuit control component is equipped with a directional air duct, the air outlet of the directional air duct faces the concentrated area of ​​electrical heat-generating devices, and a variable frequency fan is installed at the air inlet; the temperature control component adjusts the speed of the variable frequency fan according to the real-time temperature of the second temperature sensor.

6. The zoned collaborative temperature control system for a laser according to claim 5, characterized in that, The variable frequency fan is located on the top of the system rack, and the airflow from the variable frequency fan serves to cool both the air-cooling circuit and the condenser. The system is integrated into a rack with casters, and the condenser and variable frequency fan are located on the top of the rack.

7. The zoned collaborative temperature control system for a laser according to claim 1, characterized in that, The third temperature sensor is a negative temperature coefficient thermistor. The temperature control component acquires the resistance change of the negative temperature coefficient thermistor through a bridge circuit to obtain the real-time temperature of the laser output component.

8. A method for zoned collaborative temperature control of a laser, applied to the zoned collaborative temperature control system of the laser as described in any one of claims 1-7, characterized in that, Includes the following steps: Real-time acquisition of zoned temperature data for optical path components, circuit control components, and laser output components; Calculate the deviation between the measured temperature of the laser output component and the set target temperature; When the deviation value is greater than the first preset threshold, it is determined to be a transient large heat load. At the same time, the semiconductor cooling module of the laser output component is activated for cooling, the refrigerant circulation flow of the optical path component is increased, and the cooling water path of the laser output component is pre-cooled through a plate heat exchanger to share the heat load of the semiconductor cooling module and prevent the hot end of the semiconductor cooling module from becoming saturated. When the deviation value is less than the first preset threshold but greater than the second preset threshold, only the semiconductor cooling module is activated for cooling. When the deviation value is less than the second preset threshold and greater than zero, the semiconductor cooling module is turned off and the current refrigerant circulation flow rate is maintained. When the deviation value is less than or equal to zero, the electrothermal module of the laser output component is activated for heating compensation. The heat dissipation intensity of the air-cooling circuit is adjusted according to the real-time temperature of the circuit control component.

9. The partitioned collaborative temperature control method for a laser according to claim 8, characterized in that, When issuing control commands, asymmetric delay compensation logic based on tiered response is also executed: When the first preset threshold is triggered, since the mechanical delay of refrigerant circulation flow regulation is greater than the electrical response delay of the semiconductor refrigeration module, the issuance time of the refrigerant flow regulation command is advanced by the first delay time. When the second preset threshold is triggered, only a semiconductor cooling command is issued, and the issuance time is advanced by a second delay time, which is less than the first delay time.

10. The partitioned collaborative temperature control method for a laser according to claim 9, characterized in that, When adjusting the heat dissipation intensity of the air-cooling circuit according to the real-time temperature of the circuit control component: When the measured temperature of the circuit control component increases, the speed of the inverter fan is increased to enhance air cooling; when the measured temperature of the circuit control component decreases, the speed of the inverter fan is decreased to reduce energy consumption.

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