A power amplifier

Abstract

This invention provides a power amplifier, including a circuit board, a heat dissipation connection assembly, a first connector, a second connector, a power supply module assembly, and a power amplifier module assembly. The heat dissipation connection assembly includes a body board, a first connection terminal, and a second connection terminal. The first connector is electrically connected to the circuit board and combines with the first connection terminal to form a first connection structure. The second connector is electrically connected to the circuit board and combines with the second connection terminal to form a second connection structure. The first voltage output terminal of the power supply module supplies power to the circuit board via the first connector, and the second voltage output terminal is electrically connected to the first connection terminal. The voltage input terminal of the power amplifier module is electrically connected to the second connection terminal, and the signal input terminal and signal output terminal are respectively connected to the circuit board via the second connector. The heat of the module assembly is transferred to the body board via the connection terminal. This power amplifier uses the heat dissipation connection assembly as a power bus, and simultaneously realizes the module replacement function, improving the compatibility between the power module and the power supply module.

Description

Technical Field

[0001] This invention relates to the field of audio power amplification technology, and more particularly to a power amplifier. Background Technology

[0002] A power amplifier (PA) is a core device in an audio system used to amplify weak audio signals to drive speakers. As audio equipment develops towards higher power and greater integration, internal heat management and power supply reliability have become key factors limiting the performance and lifespan of power amplifiers. In current technology, power amplifiers typically employ an integrated design, with core components such as the power supply module, amplifier module, and DSP processing module all fixedly soldered onto the same circuit board. Some manufacturers have proposed modular power amplifier solutions, designing amplifier modules as pluggable, independent plug-ins that users can replace as needed.

[0003] To ensure compatibility with power amplifier modules of different power ratings, manufacturers typically design power supply modules with a higher rated power, requiring a corresponding increase in the PCB layout space. Furthermore, power amplifier modules of different power ratings generally require different supply voltages, while the power supply lines to the power amplifier modules are relatively fixed. On one hand, the interference of power supply lines on other lines varies under different supply voltages, increasing the overall design complexity of the circuit board. On the other hand, under high voltage / high power conditions, heat loss in the power supply lines is severe, potentially causing copper foil detachment, solder joint cracking, and other problems. Existing technologies typically employ methods such as widening the traces, increasing copper thickness, using multilayer boards, or adding heat dissipation vias, but these methods all increase the PCB area and cost and cannot fundamentally eliminate the inherent limitations of narrow traces.

[0004] Furthermore, in modular power amplifiers, as the power consumption of the power amplifier module increases, it is also necessary to consider solving the heat dissipation problem of the power amplifier module. In conventional designs, if the power consumption of the power amplifier module is large, a separate heat sink needs to be added to the power amplifier module. The increase in size and installation complexity brought about by the heat sink will affect the ease of replacement of the power amplifier module. Summary of the Invention

[0005] The purpose of this invention is to provide a power amplifier that uses a heat dissipation connection component as a power bus, utilizing the large cross-section and low resistance characteristics of the heat dissipation connection component to carry the large current of the power amplifier module, thereby replacing the narrow printed lines on the circuit board and avoiding overheating of the lines; at the same time, the power module and the power amplifier module adopt a detachable plug-in form, which is convenient for matching and independent replacement and maintenance.

[0006] Accordingly, the present invention discloses a power amplifier, including a circuit board, a heat dissipation connection component, a first connector, a second connector, a power supply plug-in component, and a power amplifier plug-in component. An audio input module, a DSP integrated module, and an audio output module are arranged on the circuit board. The audio input module is signal-connected to the DSP integrated module. A power amplifier module is integrated in the power amplifier plug-in component, and a power supply module is integrated in the power supply plug-in component.

[0007] The heat dissipation connection assembly includes a main body plate and a first connection end and a second connection end extending from the main body plate. The first connection member is electrically connected to the circuit board and is combined with the first connection end to form a first connection structure. The second connection member is electrically connected to the circuit board and is combined with the second connection end to form a second connection structure. The power plug-in assembly is detachably connected to the first connection structure, and the power amplifier plug-in assembly is detachably connected to the second connection structure. The power module has a first voltage output terminal and a second voltage output terminal. When the power plug-in assembly is connected to the first connection structure, the first voltage output terminal supplies power to the circuit board through the first connector. The second voltage output terminal is electrically connected to the first connection terminal, and the heat of the power plug-in assembly is transferred to the main board through the first connection terminal. The power amplifier module has a voltage input terminal, a signal input terminal, and a signal output terminal. When the power amplifier plug-in assembly is connected to the second connection structure, the signal input terminal and the signal output terminal are respectively connected to the circuit board via the second connector. The voltage input terminal is electrically connected to the second connection terminal, and the heat of the power amplifier plug-in assembly is transferred to the main board via the second connection terminal.

[0008] In an optional embodiment, the first connector includes a first base and a first electrical connection pair embedded in the first base. The first base has a vertically arranged first clearance hole, the first connection end extends into the first clearance hole, the beginning end of the first electrical connection pair is disposed on the surface of the first base, and the end end of the first electrical connection pair is electrically connected to the circuit board. And / or the second connector includes a second base and a second electrical connection pair embedded in the second base. The second base has a vertically arranged second clearance hole. The second connection end extends into the second clearance hole. The beginning end of the second electrical connection pair is disposed on the surface of the second base. The end end of the second electrical connection pair is electrically connected to the circuit board.

[0009] In an optional implementation, the starting end of the first electrical connection pair is located on the inner wall of the first clearance hole; And / or the beginning of the second electrical connection pair is located on the inner wall of the second clearance hole.

[0010] In an optional embodiment, the first base has a first stepped surface located in the middle, the ends of the first electrical connection pair are disposed on the stepped surface, the bottom of the first base is fixed on the heat dissipation connection assembly, the circuit board passes through the upper end of the first base based on a first through hole pre-set on the circuit board and is mounted on the first stepped surface, and the ends of the first electrical connection pair are contacted and bonded to the circuit board. And / or the second base has a second stepped surface located in the middle, the end of the second electrical connection pair is disposed on the stepped surface, the bottom of the second base is fixed on the heat dissipation connection assembly, the circuit board passes through the upper end of the second base based on a second through hole pre-set on the circuit board and is mounted on the second stepped surface, and the end of the second electrical connection pair contacts and bonds with the circuit board.

[0011] In an optional embodiment, the circuit board is inverted and mounted on the first step surface and / or the second step surface, with the front of the circuit board facing the first step surface and / or the second step surface, and the audio input module, DSP integrated module and audio output module are respectively disposed on the front of the circuit board.

[0012] In an optional implementation, the body plate, the first connecting end, and the second connecting end are an integral structure in the heat dissipation connection assembly; Alternatively, in the heat dissipation connection assembly, the heat dissipation connection assembly may further include a first connecting piece and a second connecting piece, the leading end of the first connecting piece and the leading end of the second connecting piece being connected to the body plate, the leading end of the first connecting piece forming the first connecting end, and the leading end of the second connecting piece forming the second connecting end; Alternatively, the heat dissipation connection assembly may further include a first heat pipe and a second heat pipe, with the first end of the first heat pipe and the first end of the second heat pipe respectively attached to the body plate, the end of the first heat pipe forming the first connection end, and the end of the second heat pipe forming the second connection end.

[0013] In an optional implementation, the power supply module includes a first plug-in interface, which includes a first plug-in socket, a first circuit board, and a first heat-conducting component. The outer contour of the head of the first plug-in socket is adapted to the first clearance hole and has a first socket that matches the first connection end. The first circuit board is fixed on the tail of the first plug-in socket. The power plug-in module is installed on the first clearance hole through the first plug-in socket. The first connection end extends into the first socket. The first heat-conducting element is used to transfer the heat of the power module to the first connection end.

[0014] In an optional implementation, the first connecting end protrudes from the first clearance hole and protrudes from the first plug-in seat; During the process of installing the power plug module into the first clearance hole through the first plug socket, the first connecting end cooperates with the first socket for installation guidance.

[0015] In an optional implementation, the power amplifier plug-in module includes a second plug-in interface, which includes a second plug-in socket, a second circuit board, and a second heat-conducting component. The outer contour of the head of the second plug-in socket is adapted to the second clearance hole and has a second socket that matches the second connection end. The second circuit board is fixed on the tail of the second plug-in socket. The power amplifier module is installed on the second clearance hole through the second plug-in socket. The second connection end extends into the second socket. The second heat-conducting component is used to transfer the heat of the power amplifier module to the second connection end.

[0016] In an optional embodiment, the second connecting end protrudes from the second clearance hole and protrudes from the second plug-in seat; During the process of installing the power amplifier plug-in module into the second clearance hole through the second plug-in socket, the second connection end cooperates with the second socket for installation guidance.

[0017] To address the technical problems of overheating caused by narrow printed circuit boards carrying high currents in existing power amplifiers, and the redundancy resulting from the separation of heat dissipation and power supply structures in modular power amplifiers, this invention provides a power amplifier that uses a heat dissipation connection component (including a main board and a first and second connection terminal extending from it) as a power bus, utilizing its large cross-section and low resistance characteristics to carry the high currents of the power amplifier module, thus replacing the narrow printed circuit boards. Furthermore, a first connection structure formed by combining a first connector and a first connection terminal, and a second connection structure formed by combining a second connector and a second connection terminal, are detachably connected to a power supply plug-in assembly integrating a power module and a power amplifier plug-in assembly integrating a power amplifier module, respectively. This allows the plug-in assembly to simultaneously complete mechanical fixing, power supply and signal connection to the circuit board, power supply to the heat sink, and heat conduction in a single insertion action. This technical solution fundamentally avoids the overheating problem of narrow PCB circuits under high current conditions, significantly improves the reliability and lifespan of the power amplifier, and simultaneously achieves modular replacement of the core module, reducing maintenance costs and the use of independent power buses, thus simplifying the internal structure of the equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the electronic circuit structure of a power amplifier according to an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the power supply circuit structure of the power supply module according to an embodiment of the present invention.

[0020] Figure 3 This is a three-dimensional structural diagram of the power amplifier according to an embodiment of the present invention.

[0021] Figure 4 This is a three-dimensional structural diagram of the heat dissipation component according to an embodiment of the present invention.

[0022] Figure 5 This is a three-dimensional structural diagram of the first connector and the second connector according to an embodiment of the present invention.

[0023] Figure 6 This is a schematic diagram of the three-dimensional structure of the circuit board according to an embodiment of the present invention.

[0024] Figure 7 This is a three-dimensional structural diagram of the power supply plug-in module according to an embodiment of the present invention.

[0025] Figure 8 This is a cross-sectional structural diagram of the power supply plug-in module according to an embodiment of the present invention. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Figure 1 This is a schematic diagram of the electronic circuit structure of the power amplifier according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the power supply circuit structure of the power supply module according to an embodiment of the present invention.

[0028] This invention discloses an overall technical solution for a power amplifier, which includes six core components with physical structures: a circuit board 2, a heat dissipation connection component 4, a first connector 3, a second connector 5, a power supply plug-in component 1, and a power amplifier plug-in component.

[0029] Combination Figure 1The schematic diagram of the electronic circuit structure of the power amplifier shows that, in terms of functionality, the power amplifier includes an audio input module 1001, a DSP integrated module 1002, a power amplifier module, and an audio output module 1004. The audio input module 1001 mainly integrates various types of audio input hardware based on the selection of the DSP integrated module 1002, such as various types of wireless input hardware and various types of wired input hardware with different interfaces. The DSP integrated module 1002 is mainly an audio signal processing module based on a DSP integrated chip; the DSP integrated chip used in this embodiment is model JL7034A. The amplifier module is used to amplify the audio signal processed by the DSP integrated module 1002 to meet the driving requirements of the back-end equipment. Specifically, the digital amplifier module is generally built based on a digital amplifier chip. Each digital amplifier chip and its integrated peripheral circuit are responsible for the output of one audio signal. In this embodiment of the invention, the digital amplifier chip is exemplified by ACM8816. The maximum driving power of the ACM8816 digital amplifier chip can reach 270 watts (under 4Ω load and 48V power supply conditions). The audio output module 1004 is the hardware for connecting audio playback devices.

[0030] Correspondingly, in a power amplifier, at least some integrated modules need to be powered, combined with Figure 1 Schematic diagram of the electronic circuit structure of a power amplifier and Figure 2 The schematic diagram illustrates the power supply circuit structure of the power supply module. The output voltage of the power supply module generally includes a standard 12V supply voltage and a special supply voltage of Vx. The standard supply voltage can be converted to common voltages such as 5V and 3.3V as needed to power the audio input module 1001, DSP integrated module 1002, audio output module 1004, and common peripheral devices (such as cooling fans, displays, and indicator lights). The special supply voltage is mainly set according to the selected power amplifier module. For example, the supply voltage of the ACM8816 chip can be 24V, 36V, 48V, etc., and different power amplifier chips may also use voltage values ​​such as 12V, 18V, and 22V. It should be noted that the implementation method of the ground wire (zero point) is not specifically described in this embodiment. In specific implementations, the ground wire can be implemented along with the corresponding power supply line (wire with supply voltage). This embodiment does not provide further explanation.

[0031] An audio input module 1001, a DSP integrated module 1002, and an audio output module 1004 are arranged on the circuit board 2. The audio input module 1001 is connected to the DSP integrated module 1002 to form an audio signal input and processing channel.

[0032] In this embodiment of the invention, the power amplifier plug-in component integrates a power amplifier module, and the power supply plug-in component 1 integrates a power supply module 1005. The purpose is to independently package the two core modules of the power amplifier in the form of plug-ins, improve the switchability performance of the power amplifier module, and ensure that the power supply module 1005 can be well adapted to the power amplifier module without generating excessive power redundancy, thereby reducing the user's purchase and usage costs.

[0033] The heat dissipation connection assembly 4 includes a body plate 400 and a first connection end 401 and a second connection end 402 extending from the body plate 400. The phrase "extending from the body plate 400" means that the first connection end 401 and the second connection end 402 have a continuous physical connection with the body plate 400. They can be extensions of the body plate 400 or independent components assembled on the body plate 400 by a fixed connection.

[0034] The first connector 3 is electrically connected to the circuit board 2 and combines with the first connection end 401 to form a first connection structure. The second connector 5 is electrically connected to the circuit board 2 and combines with the second connection end 402 to form a second connection structure. The actual meaning of this combination is that the first connector 3 and the first connection end 401 (and the second connector 5 and the second connection end 402), after the entire power amplifier is assembled, together constitute a multifunctional composite interface structure with mechanical fixing function, electrical connection function, and heat conduction function.

[0035] The connection between the power supply module 1 and the first connection structure is detachable, and the connection between the power amplifier module and the second connection structure is detachable, thereby realizing the modular replacement function of the power supply module 1005 and the power amplifier module.

[0036] In terms of electrical connection, the power module 1005 has a first voltage output terminal and a second voltage output terminal. When the power plug-in assembly 1 is connected to the first connection structure, the first voltage output terminal supplies power to the circuit board 2 via the first connector 3, and the second voltage output terminal is electrically connected to the first connector 401. This means that the power module 1005 undertakes different power supply tasks through two independent output terminals. The first voltage output terminal is responsible for supplying power to the low-power functional modules (such as the audio input module 1001, the DSP integrated module 1002, and the audio output module 1004) on the circuit board 2. Since the structure of the low-power functional modules on the circuit board 2 is fixed, the first voltage output terminals of different power modules 1005 are the same. In actual implementation... It is advisable to set the voltage value of the first voltage output terminal to 12V, and then arrange 12V to 5V and 12V to 3.3V voltage drop circuits on the circuit board 2 to ensure that the power supply plug-in assembly 1 is compatible with most power amplifiers. The second voltage output terminal is electrically connected to the body board 400 of the heat dissipation connection assembly 4 through the first connection terminal 401, making the body board 400 part of the power supply conduction path. In practical applications, the power amplifier plug-in module and the power supply plug-in assembly 1 are selected in combination. During the selection process, in addition to the rated power of the power amplifier module needing to meet the requirements of the power amplifier module, the second voltage output terminal of the power supply module 1005 also needs to meet the selection requirements of the power amplifier module. At the same time, the heat of the power supply plug-in assembly 1 will also be transferred to the body board 400 through the first connection terminal 401, realizing the overlap of the heat dissipation path and the power supply path in physical structure.

[0037] The power amplifier module has a voltage input terminal, a signal input terminal, and a signal output terminal. When the power amplifier plug-in assembly is connected to the second connection structure, the signal input terminal and the signal output terminal are respectively signal-connected to the circuit board 2 via the second connector 5, and the voltage input terminal is electrically connected to the second connector 402. Correspondingly, the power supply of the power amplifier module does not pass through the printed circuit on the circuit board 2, but directly obtains power from the heat dissipation connection assembly 4 through the second connector 402. At the same time, the audio signal input terminal and the audio signal output terminal of the power amplifier module are electrically connected to the circuit board 2 via the second connector 5. Simultaneously, the heat from the power amplifier plug-in assembly is transferred to the main board 400 via the second connector 402, thus achieving physical overlap of the heat dissipation and power supply paths.

[0038] In the above power amplifier technical solution, the power amplifier module and power supply module 1005 of this embodiment are designed in a modular manner, which can ensure the matching of the power amplifier module and power supply module 1005 and reduce waste. By designing the module interface and the power bus structure from the power supply module 1005 to the power amplifier module, the large cross-section and low resistance characteristics of the heat dissipation connection component 4 are utilized, and it is also used as a power bus. The large current output of the power supply module 1005 is directly transmitted to the power amplifier module through the main board 400, bypassing the printed narrow lines on the circuit board 2, thereby avoiding the problem of overheating of the line caused by the large current. At the same time, the relatively independent power bus line can effectively reduce the interference of the power bus to other lines under different operating conditions. In addition to performing the function of electrical conduction, the heat dissipation connection component 4 also has the function of auxiliary heat dissipation for the plug-in module, so that the plug-in module can use the inherent heat dissipation structure of the heat dissipation connection component 4 for heat dissipation, avoiding the external installation of heat dissipation structure / heat dissipation equipment and improving the installation convenience of the plug-in module.

[0039] Figure 3 This is a three-dimensional structural diagram of the power amplifier according to an embodiment of the present invention.

[0040] Specifically, the following provides a specific power amplifier implementation structure for reference. The structure of each individual component will be explained first, and then the overall structure of the power amplifier will be introduced and explained again.

[0041] Heat dissipation components Figure 4 This is a three-dimensional structural diagram of the heat dissipation component according to an embodiment of the present invention.

[0042] In this embodiment of the invention, the heat dissipation connection component 4 has the following functions: auxiliary heat dissipation, power bus between the power amplifier module and the power module 1005, mounting support for the first connector 3 and the second connector 5, and component function that forms a first connection structure with the first connector 3 and a second connection structure with the second connector 5.

[0043] Basically, the heat dissipation connection assembly 4 includes a body plate 400 and a first connection end 401 and a second connection end 402 extending from the body plate 400. In this embodiment of the invention, three specific implementation methods are provided for reference.

[0044] In the first embodiment, the body plate 400, the first connecting end 401 and the second connecting end 402 are an integral structure, for example, formed by stamping or bending the same metal sheet, which has the best electrical continuity and thermal conductivity.

[0045] In the second embodiment, the heat dissipation connection assembly 4 further includes a first connecting piece and a second connecting piece disposed independently of the body plate 400. The first end of the first connecting piece and the first end of the second connecting piece are connected to the body plate 400, and the ends are respectively formed as the first connecting end 401 and the second connecting end 402.

[0046] In the third embodiment, the heat dissipation connection component 4 further includes a first heat pipe and a second heat pipe. The first end of the first heat pipe and the first end of the second heat pipe are respectively attached to the body plate 400, and the ends are respectively formed as the first connection end 401 and the second connection end 402. The heat pipe form can further improve the efficiency of heat transfer from the plug-in component to the body plate 400.

[0047] As for the body board 400, it is typically made of aluminum, copper, or their alloys. Alternatively, the body board 400 can be manufactured by covering the circuit board with a metal heat dissipation layer. Taking copper as an example, its resistivity is approximately 1.75 × 10⁻⁶. -8 Ω·m, if the thickness of the body plate 400 is 0.5mm, the width is 50mm, and the length is 100mm, then its resistance is approximately 1.17 × 10 Ω·m. -6 Ω. In contrast, the printed copper foil trace on circuit board 2, with a thickness of 35μm (1oz copper), a width of 1mm, and a length of 100mm, has a resistance of approximately 4.9 × 10⁻⁶. - The resistances of the two are approximately four orders of magnitude different, with a difference of 2Ω.

[0048] When the power amplifier module operates at a current of 10A, the voltage drop across the main board 400 is only approximately 1.17 × 10⁻⁶. -5 The voltage drop across the narrow PCB line is negligible; however, the voltage drop across the narrow PCB line can reach approximately 0.49 V, generating 4.9 W of Joule heat, which is sufficient to cause a significant increase in line temperature. Therefore, using the heat dissipation connection component 4 as the power bus can eliminate the root cause of overheating in high-current lines from a physical perspective.

[0049] Furthermore, since the heat sink is set independently of circuit board 2, compared to arranging the power bus directly on circuit board 2, even if the voltage of the power amplifier module changes, it will not interfere with other lines, thus ensuring the stability of the audio signal processing.

[0050] For fixing the first connector 3 and the second connector 5, pin holes 403 are provided on the heat sink, which can be used to install the first connector 3 and the second connector 5 by plug-in method or by soldering.

[0051] First connector 3 and second connector 5 Figure 5This is a three-dimensional structural diagram of the first connector 3 and the second connector 5 according to an embodiment of the present invention.

[0052] Specifically, the first connector 3 includes a first base 301 and a first electrical connection pair 304 embedded in the first base 301. The first base 301 serves as an insulating support, providing a carrier for fixing and insulating the electrical connection pair. The first base 301 has a vertically arranged first clearance hole 302, into which the first connection end 401 extends. The first clearance hole 302 provides space for the first connection end 401 to extend, avoiding structural interference between the connection end and other parts of the base. The starting end of the first electrical connection pair 304 is disposed on the surface of the first base 301 for contacting the corresponding terminal of the power plug assembly 1; the ending end of the first electrical connection pair 304 is electrically connected to the circuit board 2 for transmitting electrical energy to the circuit board 2.

[0053] In this embodiment of the invention, the starting end of the first electrical connection pair 304 is located on the inner sidewall of the first clearance hole 302, so as to avoid the first electrical connection pair 304 being exposed in an easily accessible position and improve the safety of use.

[0054] Furthermore, in this embodiment of the invention, the first base 301 has a first stepped surface 303 located in the middle, and the end of the first electrical connection pair 304 is disposed on the stepped surface. The bottom of the first base 301 is fixed to the body plate 400 of the heat dissipation connection assembly 4, and the circuit board 2 passes through the upper end of the first base 301 based on a first through hole pre-set on the circuit board 2 and is mounted on the first stepped surface 303. The stepped surface provides a stable support surface for the circuit board 2, and the first through hole can cooperate with the upper end of the base to realize the placement and positioning of the circuit board 2. After the circuit board 2 is placed in place, the end of the first electrical connection pair 304 can be made to contact and bond with the circuit board 2 through post-processing to achieve a reliable electrical connection.

[0055] Similarly, the implementation structure of the second connector 5 is similar to that of the first connector 3. The second connector 5 includes a second base 501 and a second electrical connection pair 504 embedded in the second base 501. The second base 501 has a vertically arranged second clearance hole 502. The second connection end 402 extends into the second clearance hole 502. The beginning end of the second electrical connection pair 504 is disposed on the surface of the second base 501. The end end of the second electrical connection pair 504 is electrically connected to the circuit board 2. The second electrical connection pair 504 is used to realize the signal connection between the power amplifier module and the circuit board 2.

[0056] The beginning of the second electrical connection 504 is located on the inner wall of the second clearance hole 502.

[0057] The second base 501 has a second stepped surface 503 located in the middle. The end of the second electrical connection pair 504 is disposed on the stepped surface. The bottom of the second base 501 is fixed on the heat dissipation connection assembly 4. The circuit board 2 passes through the upper end of the second base 501 based on a second through hole pre-set on the circuit board 2 and is mounted on the second stepped surface 503. The end of the second electrical connection pair 504 contacts and bonds with the circuit board 2.

[0058] Circuit Board 2 Figure 6 This is a three-dimensional structural diagram of the circuit board 2 according to an embodiment of the present invention.

[0059] Specifically, in this embodiment of the invention, the circuit board 2 is inverted and mounted on the first stepped surface 303 and / or the second stepped surface 503, with the front side of the circuit board 2 facing the first stepped surface 303 and / or the second stepped surface 503. The audio input module 1001, the DSP integrated module 1002, and the audio output module 1004 are respectively disposed on the front side of the circuit board 2. The inverted mounting of the circuit board 2 is mainly to adapt to the requirements of the manufacturing process, which will be further explained in subsequent steps. In addition, theoretically, the heat generated by the heat-generating devices such as the audio input module 1001, the DSP integrated module 1002, and the audio output module 1004 can be conducted through the substrate of the circuit board 2 to the first base 301, and then diffused to the main body board 400 through the first base 301.

[0060] First connection structure and second connection structure Combination Figure 1 and Figure 5 The illustrated structure shows that the first connection structure is formed by combining a first connector 3 and a first connection end 401. The first connector 3 includes a first base 301 and a first electrical connection pair 304 embedded in the first base 301. The first base 301 is injection molded from an insulating material (such as PBT plastic, nylon, or ceramic) and has a vertically penetrating first clearance hole 302. The diameter of the first clearance hole 302 is larger than the outer diameter of the first connection end 401, allowing the first connection end 401 to extend smoothly while maintaining an appropriate gap between them.

[0061] The first electrical connector 304 is made of a conductive material (such as phosphor bronze, beryllium copper, or brass), and its surface can be plated with gold or nickel to improve conductivity and corrosion resistance. The first electrical connector 304 is embedded in the first housing 301, with its starting end exposed on the inner wall of the first clearance hole 302, forming an arc-shaped or sheet-like contact spring; its end extends to the first stepped surface 303 in the middle of the first housing 301, forming a flat welding surface or elastic contact surface. The bottom of the first housing 301 is fixed to the body plate 400 of the heat dissipation connection assembly 4 by means of clips, screws, or adhesive.

[0062] The circuit board 2 has a pre-set first through hole, the diameter of which matches the outer diameter of the upper end of the first base 301. During assembly, the circuit board 2 is inserted into the upper end of the first base 301, so that the upper end of the first base 301 passes through the first through hole, and the circuit board 2 sinks and rests on the first stepped surface 303. At this time, the end of the first electrical connection pair 304 is aligned with the corresponding pad or contact area on the front side of the circuit board 2, and electrical connection is achieved through soldering, crimping, or elastic contact. The front side of the circuit board 2 faces the first stepped surface 303, which theoretically allows the heat generated by heat-generating devices such as the audio input module 1001, DSP integrated module 1002, and audio output module 1004 to be conducted to the first base 301 through the substrate of the circuit board 2, and then diffused to the main board 400 through the first base 301.

[0063] The first connecting end 401 extends from the body plate 400 and enters the first clearance hole 302. In the integrally formed embodiment, the first connecting end 401 is formed by partially stamping and bending the body plate 400, and has a continuous metal lattice structure with the body plate 400, resulting in extremely low electrical connection resistance and thermal conductivity resistance. In the connecting piece embodiment, the first connecting end 401 is composed of an independent elastic metal sheet, with its head connected to the body plate 400 by riveting or welding, and its tail forming an elastic contact head. In the heat pipe embodiment of the present invention, the first connecting end 401 is composed of the condenser end of a heat pipe, with its head fitting against the body plate 400, and its tail forming a columnar structure that matches the first insertion hole 102.

[0064] The implementation of the second connection structure is similar to that of the first connection structure, and will not be described in detail here.

[0065] Power Supply Component 1 Figure 7 This is a three-dimensional structural diagram of the power plug-in component 1 according to an embodiment of the present invention.

[0066] Figure 8 This is a cross-sectional structural diagram of the power plug-in assembly 1 according to an embodiment of the present invention.

[0067] The power supply component 1 includes a first plug-in interface, which comprises a first plug-in socket 101, a first circuit board 106, and a first heat-conducting element 108. The outer contour of the head of the first plug-in socket 101 is adapted to the first clearance hole 302 for easy insertion and positioning. The first plug-in socket 101 has a first insertion hole 102 that matches the first connection end 401. The first circuit board 106 is fixed to the tail of the first plug-in socket 101, and the power module 1005 is integrated on the first circuit board 106. The power supply component 1 is installed onto the first clearance hole 302 via the first plug-in socket 101, the first connection end 401 extends into the first insertion hole 102, and the first heat-conducting element 108 is used to transfer heat from the power module 1005 to the first connection end 401.

[0068] Specifically, in conjunction with the implementation of the first connection structure, in this embodiment of the invention, the power plug-in assembly 1 includes a first plug-in interface, which includes a first plug-in socket 101, a first circuit board 106, and a first heat-conducting element 108. The first plug-in socket 101 is made of insulating material, and its head outer contour is adapted to the inner contour of the first clearance hole 302 to form a precise plug-in fit.

[0069] The first circuit board 106 is fixed to the rear of the first plug-in socket 101, and the power module 1005 (such as a switching power supply chip, transformer, rectifier bridge, etc.) is integrated on the first circuit board 106. The first circuit board 106 is also provided with output terminals corresponding to the first voltage output terminal and the second voltage output terminal. The output terminal 103 of the first voltage output terminal will eventually form a connection point on the surface of the first plug-in socket 101. When the first plug-in socket 101 is inserted into the first clearance hole 302, the output terminal on the first circuit board 106 contacts the beginning of the first electrical connection pair 304 to achieve electrical connection.

[0070] Furthermore, a first socket 102 is provided on the first plug-in base 101, and the inner diameter of the first socket 102 matches the outer diameter of the first connecting end 401. A first heat-conducting element 108 is disposed on the inner wall or bottom of the first socket 102, and may be a thermally conductive silicone pad, a thermally conductive grease layer, or a metal sheet. When the first plug-in base 101 is inserted into place, the first connecting end 401 extends into the first socket 102 and comes into close contact with the first heat-conducting element 108. The heat generated by the power module 1005 is transferred to the body board 400 through the first circuit board 106, the first heat-conducting element 108, and the first connecting end 401.

[0071] Furthermore, considering the need for power transmission through the first connection terminal 401, this embodiment of the invention provides a metal post 109 for supplying power to the first connection terminal 401 at the rear end of the first socket 102 (with reference to the insertion direction of the first connection terminal 401). A spring contact is provided on the surface of the metal post 109, which will contact the spring contact of the metal post 109 after the first connection terminal 401 passes through the first socket 102. The metal post 109 is connected to the output terminal of the second voltage output terminal of the power module 1005 on the first circuit board 106 for power supply.

[0072] In a preferred embodiment, the first connecting end 401 protrudes from the first clearance hole 302 and protrudes from the first plug-in base 101. The depth of the first socket 102 is greater than the protruding length of the first connecting end 401, so that the first connecting end 401 gradually enters the first socket 102 during insertion, forming a guiding fit. This design allows the first connecting end 401 to not only serve as a heat-conducting and electrical-conducting element, but also as a plug-in guide post, improving the installation accuracy and operational convenience of the plug-in assembly.

[0073] Furthermore, in this embodiment of the invention, in order to improve the safety of the power plug-in assembly 1, the power plug-in assembly 1 also includes a power plug-in housing 104, which is used to surround and protect components such as the first circuit board 106 and the first heat-conducting component 108. In addition, based on the consideration of improving plug-in reliability, in actual implementation, the first slot 105 for the first base body 301 to cooperate and limit can be formed by the cooperative structure design of the power plug-in housing 104 and the first plug-in base 101.

[0074] Inside the power supply housing 104, to accommodate the component structure on the first circuit board, the first heat-conducting element 108 is generally designed with an irregular shape. Components 111 on the first circuit board can transfer heat to the first heat-conducting element 108 through direct or indirect contact. In actual implementation, since the first heat-conducting element 108 will conduct electricity in contact with the first connection terminal, to ensure its insulation performance, components 111 generally need to transfer heat to the first heat-conducting element 108 through a layer of insulating thermal pad 107.

[0075] Amplifier plug-in module Specifically, the implementation structure of the power amplifier plug-in module is similar to that of the power supply plug-in component 1, and no further illustrations are provided in this embodiment of the invention.

[0076] Specifically, the power amplifier plug-in module includes a second plug-in interface, which includes a second plug-in socket, a second circuit board, and a second heat-conducting component. The outer contour of the head of the second plug-in socket is adapted to the second clearance hole 502 and has a second socket that matches the second connection end 402. The second circuit board is fixed on the tail of the second plug-in socket. The power amplifier module is installed on the second clearance hole 502 through the second plug-in socket. The second connection end 402 extends into the second socket. The second heat-conducting component is used to transfer the heat of the power amplifier module to the second connection end 402.

[0077] In an optional embodiment, the second connecting end 402 protrudes from the second clearance hole 502 and protrudes from the second plug-in seat; During the process of installing the power amplifier plug-in module into the second clearance hole 502 through the second plug-in socket, the second connection end 402 cooperates with the second socket for installation guidance.

[0078] Specifically, after the power amplifier is assembled, the power amplifier of the present invention has two parallel power supply paths and two parallel heat dissipation paths.

[0079] Power supply path one: the first voltage output terminal of the power module 1005, the first electrical connection pair 304 of the first connector 3, the circuit board 2, the transformer module that may exist on the circuit board 2, the audio input module 1001, the DSP integrated module 1002, and the audio output module 1004. The power module 1005 provides the working voltage to the low-power module through this path. The current is small and the printed circuit on the circuit board 2 is sufficient to carry it.

[0080] Power supply path two: the second voltage output terminal of power module 1005, the first connection terminal 401, the main board 400, the second connection terminal 402, and the voltage input terminal of the power amplifier module. Power module 1005 provides a high current operating voltage to the power amplifier module through this power supply path. Due to the large cross-section and low resistance characteristics of the main board 400, this path does not need to pass through the narrow lines on the circuit board 2, thus avoiding overheating.

[0081] Heat dissipation path one: heat generated by power module 1005, first heat conduction component 108, first connection end 401, main body plate 400, heat dissipation structure that may exist on main body plate 400, heat dissipation equipment.

[0082] Heat dissipation path two: heat generated by the power amplifier module, second heat conduction component, second connection terminal 402, main board 400, heat dissipation structure that may exist on the main board 400, and heat dissipation equipment.

[0083] It should be noted that the second power supply path and the first and second heat dissipation paths are highly overlapping in physical structure: the first connection terminal 401 and the second connection terminal 402 serve as both conductive terminals and heat dissipation terminals, and the main board 400 serves as both a power bus and a heat dissipation substrate. In high-power audio equipment, power transmission and heat transfer are often concentrated at the same nodes (i.e., the power module 1005 and the power amplifier module). Therefore, physically integrating the power supply path and the heat dissipation path will not only prevent mutual interference, but also reduce structural redundancy and improve system integration.

[0084] In actual assembly, the manufacturing process of the power amplifier in this embodiment of the invention includes: Step 1: Prepare heat dissipation connection component 4.

[0085] Aluminum or copper plates are selected as the material of the body plate 400. The first connecting end 401 and the second connecting end 402 are formed by stamping, cutting and bending processes (integral molding method), or the connecting piece / heat pipe is adjusted to a suitable shape and the beginning of the connecting piece / heat pipe is fixed to the body plate 400 in the corresponding manner.

[0086] Step 2: Prepare the first connector 3 and the second connector 5.

[0087] The first base 301 and the second base 501 are prepared by injection molding, and the required electrical connection pair structure and the bottom pin structure are pre-embedded during the injection molding process of the first base 301 and the second base 501.

[0088] Step 3: Secure the first connector 3 and the second connector 5.

[0089] The bottoms of the first base 301 and the second base 501 are fixed to the main body plate 400 by means of pin welding, and the first connecting end 401 is simultaneously inserted into the first clearance hole 302, and the second connecting end 402 is inserted into the second clearance hole 502.

[0090] Step 4: PCB substrate mounting The relevant components are placed onto the substrate of circuit board 2 (the bare board of circuit board 2) using a pick-and-place machine. Then, the first connector 3, the second connector 5 and the heat dissipation connection assembly 4 (the integral unit) are flipped onto the substrate of circuit board 2 and processed by wave soldering.

[0091] It should be noted that before this process is implemented, the upper ends of the first connector 3 and the second connector 5 need to be shielded using a cover.

[0092] Step 5: Prepare power supply plug-in component 1 and power amplifier plug-in component 1.

[0093] Step Six: Plugin Component Installation and Testing.

[0094] Insert the power supply plug-in assembly 1 into the first clearance hole 302, so that the first connection end 401 extends into the first socket 102, and the first heat-conducting component 108 contacts the first connection end 401; insert the power amplifier plug-in assembly into the second clearance hole 502, so that the second connection end 402 extends into the second socket, and the second heat-conducting component contacts the second connection end 402.

[0095] After the matching power supply module 1 and power amplifier module 1 are installed, the performance of the entire power amplifier is tested.

[0096] To address the technical problems of overheating due to the narrow printed lines on the circuit board 2 of existing power amplifiers carrying the large current of the power amplifier module, and the redundancy caused by the separation of the heat dissipation structure and the power supply structure in modular power amplifiers, this invention provides a power amplifier that uses the heat dissipation connection component 4 (including the main board 400 and the first connection terminal 401 and the second connection terminal 402 led out from it) as a power bus, utilizing its large cross-section and low resistance characteristics to carry the large current of the power amplifier module, thereby replacing the narrow printed lines on the circuit board 2; and through the first connection structure formed by the combination of the first connector 3 and the first connection terminal 401, the second connector 5 and the second The second connection structure formed by the connection terminals 402 is detachably connected to the power plug-in assembly 1 integrating the power module 1005 and the power amplifier plug-in assembly integrating the power amplifier module, respectively. This allows the plug-in assembly to simultaneously complete functions such as mechanical fixation, power supply and signal connection of the circuit board 2, power supply of the heat sink, and heat conduction in a single insertion action. This technical solution fundamentally avoids the overheating problem of narrow PCB lines under high current conditions, significantly improves the reliability and service life of the power amplifier, and realizes modular replacement of the core module, reduces maintenance costs, reduces the use of independent power bus, and simplifies the internal structure of the equipment.

[0097] The power amplifier provided by the embodiments of the present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A power amplifier, characterized in that, The device includes a circuit board, a heat dissipation connection component, a first connector, a second connector, a power supply plug-in component, and a power amplifier plug-in component. An audio input module, a DSP integrated module, and an audio output module are arranged on the circuit board. The audio input module is signal-connected to the DSP integrated module. A power amplifier module is integrated in the power amplifier plug-in component, and a power supply module is integrated in the power supply plug-in component. The heat dissipation connection assembly includes a main body plate and a first connection end and a second connection end extending from the main body plate. The first connection member is electrically connected to the circuit board and is combined with the first connection end to form a first connection structure. The second connection member is electrically connected to the circuit board and is combined with the second connection end to form a second connection structure. The power plug-in assembly is detachably connected to the first connection structure, and the power amplifier plug-in assembly is detachably connected to the second connection structure. The power module has a first voltage output terminal and a second voltage output terminal. When the power plug-in assembly is connected to the first connection structure, the first voltage output terminal supplies power to the circuit board through the first connector. The second voltage output terminal is electrically connected to the first connection terminal, and the heat of the power plug-in assembly is transferred to the main board through the first connection terminal. The power amplifier module has a voltage input terminal, a signal input terminal, and a signal output terminal. When the power amplifier plug-in assembly is connected to the second connection structure, the signal input terminal and the signal output terminal are respectively connected to the circuit board via the second connector. The voltage input terminal is electrically connected to the second connection terminal, and the heat of the power amplifier plug-in assembly is transferred to the main board via the second connection terminal.

2. The power amplifier as described in claim 1, characterized in that, The first connector includes a first base and a first electrical connection pair embedded in the first base. The first base has a vertically arranged first clearance hole. The first connection end extends into the first clearance hole. The beginning end of the first electrical connection pair is disposed on the surface of the first base. The end end of the first electrical connection pair is electrically connected to the circuit board. And / or the second connector includes a second base and a second electrical connection pair embedded in the second base. The second base has a vertically arranged second clearance hole. The second connection end extends into the second clearance hole. The beginning end of the second electrical connection pair is disposed on the surface of the second base. The end end of the second electrical connection pair is electrically connected to the circuit board.

3. The power amplifier as described in claim 2, characterized in that, The starting end of the first electrical connection pair is located on the inner wall of the first clearance hole; And / or the beginning of the second electrical connection pair is located on the inner wall of the second clearance hole.

4. The power amplifier as described in claim 2, characterized in that, The first base has a first stepped surface located in the middle, the ends of the first electrical connection pair are disposed on the stepped surface, the bottom of the first base is fixed on the heat dissipation connection assembly, the circuit board passes through the upper end of the first base based on a first through hole pre-set on the circuit board and is mounted on the first stepped surface, and the ends of the first electrical connection pair are contacted and bonded to the circuit board. And / or the second base has a second stepped surface located in the middle, the end of the second electrical connection pair is disposed on the stepped surface, the bottom of the second base is fixed on the heat dissipation connection assembly, the circuit board passes through the upper end of the second base based on a second through hole pre-set on the circuit board and is mounted on the second stepped surface, and the end of the second electrical connection pair contacts and bonds with the circuit board.

5. The power amplifier as described in claim 4, characterized in that, The circuit board is inverted and mounted on the first step surface and / or the second step surface, with the front of the circuit board facing the first step surface and / or the second step surface. The audio input module, the DSP integrated module, and the audio output module are respectively disposed on the front of the circuit board.

6. The power amplifier as described in claim 1, characterized in that, In the heat dissipation connection assembly, the main body plate, the first connection end, and the second connection end are an integral structure; Alternatively, in the heat dissipation connection assembly, the heat dissipation connection assembly may further include a first connecting piece and a second connecting piece, the leading end of the first connecting piece and the leading end of the second connecting piece being connected to the body plate, the leading end of the first connecting piece forming the first connecting end, and the leading end of the second connecting piece forming the second connecting end; Alternatively, the heat dissipation connection assembly may further include a first heat pipe and a second heat pipe, with the first end of the first heat pipe and the first end of the second heat pipe respectively attached to the body plate, the end of the first heat pipe forming the first connection end, and the end of the second heat pipe forming the second connection end.

7. The power amplifier as described in claim 2, characterized in that, The power supply module includes a first plug-in interface, which includes a first plug-in socket, a first circuit board, and a first heat-conducting component. The outer contour of the head of the first plug-in socket is adapted to the first clearance hole and has a first socket that matches the first connection end. The first circuit board is fixed on the tail of the first plug-in socket. The power plug-in module is installed on the first clearance hole through the first plug-in socket. The first connection end extends into the first socket. The first heat-conducting element is used to transfer the heat of the power module to the first connection end.

8. The power amplifier as described in claim 7, characterized in that, The first connecting end protrudes from the first clearance hole and protrudes from the first plug-in seat; During the process of installing the power plug module into the first clearance hole through the first plug socket, the first connecting end cooperates with the first socket for installation guidance.

9. The power amplifier as described in claim 2, characterized in that, The power amplifier plug-in module includes a second plug-in interface, which includes a second plug-in socket, a second circuit board, and a second heat-conducting component. The outer contour of the head of the second plug-in socket is adapted to the second clearance hole and has a second socket that matches the second connection end. The second circuit board is fixed on the tail of the second plug-in socket. The power amplifier module is installed on the second clearance hole through the second plug-in socket. The second connection end extends into the second socket. The second heat-conducting component is used to transfer the heat of the power amplifier module to the second connection end.

10. The power amplifier as claimed in claim 9, characterized in that, The second connecting end protrudes from the second clearance hole and protrudes from the second plug-in seat; During the process of installing the power amplifier plug-in module into the second clearance hole through the second plug-in socket, the second connection end cooperates with the second socket for installation guidance.

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