Dsp chip and optical module

Abstract

The embodiment of the application discloses a DSP chip and an optical module, the DSP chip is applied to a high-speed optical module, the DSP chip is used for sending a modulation signal to a modulation module in the optical module in a service idle stage, the DSP chip is also used for outputting a bias control signal, the modulation module is controlled to work at a maximum light transmission bias point, so that the modulation module forms a dark pulse probe light signal with a concave light power on continuous background light output by a laser in the service idle stage, a service data signal and the modulation signal are time-division multiplexed on a same signal transmission link. The DSP chip is also used for receiving a fiber reflection signal fed back by the optical module, and determining fault information of a fiber link according to the fiber reflection signal. The scheme can realize normal online fault detection, and reduces hardware cost.

Description

Technical Field

[0001] This invention relates to the field of optical fiber communication technology, and more particularly to a DSP chip and an optical module. Background Technology

[0002] In fiber optic communication, a fiber optic link is composed of multiple single-mode fiber segments cascaded through connectors. Problems such as aging and poorly connected fiber optic connectors, dirty end faces, and cable compression and bending can introduce additional reflections and losses, degrade the signal-to-noise ratio, and induce MPI (multipath interference). In severe cases, this can cause service errors and link interruptions. Therefore, real-time online fault monitoring of fiber optic links is a necessity.

[0003] Currently, mainstream fault detection methods in the industry fall into two main categories: offline testing and external, standalone OTDRs (Optical Time Domain Reflectometers). Offline testing requires disconnecting the service optical path and shutting down the fiber, which cannot meet the operational standards for 24 / 7 uninterrupted service operation in data centers, and batch link inspections can result in huge downtime losses. Traditional online OTDRs rely on instantaneous high-light pulse detection; these high-light spikes can easily excite nonlinear effects such as four-wave mixing and cross-phase modulation in optical fibers, causing signal crosstalk during normal operations. Furthermore, standalone OTDRs require dedicated hardware circuitry, which is detrimental to the miniaturized integration design of optical modules. Summary of the Invention

[0004] This invention provides a DSP chip and optical module to eliminate the need for an external, independent OTDR and achieve online detection.

[0005] According to one aspect of the present invention, a DSP chip is provided.

[0006] The DSP chip is applied to the optical module, and the DSP chip is used to send a modulation signal to the optical module during the service idle period so that the optical module generates a probe light signal;

[0007] The DSP chip is also used to receive the optical fiber reflection signal fed back by the optical module, and to determine the fault information of the optical fiber link based on the optical fiber reflection signal.

[0008] Optionally, the modulation signal is a pulse signal;

[0009] The detection optical signal is a dark pulse signal with reduced optical power.

[0010] Optionally, the DSP chip includes a signal transmission module and a main control module, and the optical module further includes a modulation module and a reflected signal receiving module; the service frame period of the DSP chip includes a service data transmission phase and a service idle phase.

[0011] The output terminal of the signal transmitting module is connected to the first input terminal of the modulation module. The signal transmitting module is used to transmit service data signals during the service data transmission phase and to transmit the modulation signal during the service idle phase.

[0012] The reflected signal receiving module is used to receive the optical fiber reflected signal fed back by the modulation module and output sampled data; the main control module is used to determine the fault information of the optical fiber link based on the sampled data.

[0013] Optionally, the main control module is also connected to the modulation module, and the main control module is also used to control the modulation module to work at the maximum light transmission bias point.

[0014] The modulation module includes a Mach-Zehnder modulator.

[0015] Optionally, the DSP chip further includes a signal processing module, the input of which is connected to the output of the reflected signal receiving module, and the output of which is connected to the main control module. The signal processing module is used to process the sampled data and send the processed sampled data to the main control module.

[0016] Optionally, the signal processing module includes a variable gain amplification unit, a first analog-to-digital conversion unit, and a storage unit;

[0017] The input terminal of the variable gain amplifier unit is connected to the output terminal of the reflected signal receiving module, the output terminal of the variable gain amplifier unit is connected to the input terminal of the first analog-to-digital converter unit, the output terminal of the first analog-to-digital converter unit is connected to the input terminal of the storage unit, and the output terminal of the storage unit is connected to the main control module.

[0018] Optionally, the reflected signal receiving module includes a first photoelectric conversion unit and a transimpedance amplifier. The input terminal of the first photoelectric conversion unit is connected to the output terminal of the modulation module, the output terminal of the first photoelectric conversion unit is connected to the input terminal of the transimpedance amplifier, and the output terminal of the transimpedance amplifier is connected to the main control module.

[0019] Optionally, the signal transmission module includes a signal transmission unit and a digital-to-analog converter unit, the digital-to-analog converter unit being connected between the signal transmission unit and the modulation module, and the signal transmission unit being used to transmit the service data signal and the modulation signal in a time-division multiplexing manner;

[0020] The optical module further includes a second photoelectric conversion unit, and the DSP chip further includes a signal receiving module. The signal receiving module includes a signal receiving unit and a second analog-to-digital conversion unit. The input terminal of the second photoelectric conversion unit is connected to the output terminal of the opposite optical module, the output terminal of the second photoelectric conversion unit is connected to the input terminal of the second analog-to-digital conversion unit, the output terminal of the second analog-to-digital conversion unit is connected to the input terminal of the signal receiving unit, and the output terminal of the signal receiving unit is connected to the main control module.

[0021] According to another aspect of the present invention, an optical module is provided, the optical module comprising the DSP chip provided in any embodiment of the present invention.

[0022] Optionally, the optical module further includes a modulation module, a reflected signal receiving module, a first AC coupling capacitor, and a second AC coupling capacitor;

[0023] The first AC coupling capacitor is connected between the DSP chip and the first input terminal of the modulation module; the second input terminal of the modulation module is connected to the laser, the output terminal of the modulation module is connected to the optical fiber, the feedback terminal of the modulation module is connected to the input terminal of the reflected signal receiving module, and the output terminal of the reflected signal receiving module is connected to the DSP chip via the second AC coupling capacitor.

[0024] The technical solution provided in this embodiment transmits service data signals and modulation signals in a time-division manner by reusing the transmission link, and ensures that the modulation signal falls entirely within the blank gap after the service data transmission is completed, thus avoiding the occupation of effective service bandwidth. Furthermore, it eliminates the need for additional transmission links, completely abandons the external OTDR structure, and achieves normalized online fault detection, which helps to reduce hardware costs and overall power consumption.

[0025] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of an optical module with fiber optic link fault detection function provided in an embodiment of the present invention;

[0028] Figure 2This is a schematic diagram of another optical module with fiber optic link fault detection function provided in an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of the structure of another optical module with fiber optic link fault detection function provided in an embodiment of the present invention;

[0030] Figure 4 A schematic diagram of another optical module with fiber optic link fault detection function provided in an embodiment of the present invention;

[0031] Figure 5 A schematic diagram of an optical module with fiber optic link fault detection function is provided for an embodiment of the present invention.

[0032] Figure 6 A waveform diagram of a modulation signal provided in an embodiment of the present invention;

[0033] Figure 7 A waveform diagram of a dark pulse generated by a modulation module is provided in an embodiment of the present invention;

[0034] Figure 8 A waveform diagram of the current signal output by the first photoelectric conversion unit;

[0035] Figure 9 This is a waveform diagram of the voltage signal output by a transimpedance amplifier provided in this embodiment;

[0036] Figure 10 A waveform diagram of the voltage signal output by a variable gain amplifier unit provided in an embodiment of the present invention;

[0037] Figure 11 This is a waveform diagram of the sampled data output by a first analog-to-digital conversion unit, provided in an embodiment of the present invention.

[0038] Figure 12 This is a waveform diagram of a fault detection result provided in an embodiment of the present invention;

[0039] Figure 13 A flowchart illustrating a fiber optic link fault detection method for an optical module provided in an embodiment of the present invention;

[0040] Figure 14 A flowchart of another optical module fiber optic link fault detection method provided in an embodiment of the present invention. Detailed Implementation

[0041] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0043] Figure 1 This is a schematic diagram of the structure of an optical module with fiber optic link fault detection function provided in an embodiment of the present invention, with reference to... Figure 1 The DSP chip 10 is used in high-speed optical modules, such as high-speed optical communication scenarios with speeds of 800G and above. The optical module 100 includes the DSP chip 10, which is used to send modulation signals to the optical module 100 during idle periods to enable the optical module 100 to generate probe optical signals. The DSP chip 10 is also used to receive fiber optic reflection signals fed back by the optical module 100 and determine fiber optic link fault information based on the fiber optic reflection signals.

[0044] In the optical communication system, the optical module 100 serves as the transceiver carrier, the optical fiber serves as the transmission medium, and the two optical modules 100 (such as the first optical module 11 and the second optical module 12) are connected by optical fiber.

[0045] In this embodiment, the optical module 100 includes a DSP chip 10, which can be used to output a modulation signal. The optical module 100 can perform optical modulation based on the received modulation signal to generate a probe optical signal. For example, the optoelectronic devices inside the optical module 100 receive the modulation signal and output a corresponding probe optical signal. The probe optical signal can be used to probe the optical fiber link.

[0046] The technical solution provided by this invention, by setting time slot scheduling logic within the DSP chip 10, allows the DSP chip 10 to output modulation signals only during service idle periods. This ensures that the probe optical signal falls entirely within the service's idle time slots, avoiding the occupation of effective service bandwidth and enabling uninterrupted detection during service transmission. Furthermore, the DSP chip 10 can also diagnose fiber optic link faults based on the fiber reflection signal fed back by the optical module 100, without requiring additional hardware structures. This completely eliminates the need for an external OTDR structure, achieving routine online fault detection, which helps reduce hardware costs and overall power consumption.

[0047] Figure 2 This is a schematic diagram of another optical module with fiber optic link fault detection function provided in an embodiment of the present invention. Specifically, it shows the application structure of the DSP chip 10 in the optical module 100. (Refer to...) Figure 2 The DSP chip 10 provided in this embodiment includes a signal transmitting module 101 and a main control module 102. The optical module 100 also includes a modulation module 20 and a reflected signal receiving module 40. The service frame period of the DSP chip 10 includes a service data transmission phase and a service idle phase. The signal transmitting module 101 is used to transmit service data signals during the service data transmission phase and to transmit modulation signals during the service idle phase. The reflected signal receiving module 40 is used to receive the optical fiber reflected signal fed back by the modulation module 20 and output sampled data. The main control module 102 is used to determine the fault information of the optical fiber link based on the sampled data.

[0048] Specifically, the output of the signal transmitting module 101 is connected to the first input of the modulation module 20. The signal transmitting module 101 is used to send service data signals to the modulation module 20 during the service data transmission phase and to send modulation signals to the modulation module 20 during the service idle phase. The second input of the modulation module 20 is connected to the laser 30. The laser 30 is used to provide background light. The modulation module 20 is used to convert the service data signals into service optical signals and to combine the service optical signals and background light before transmitting them to the optical fiber. The modulation module 20 is also used to form a probe light signal inside the background light when it receives the modulation signal.

[0049] The input terminal of the reflection signal receiving module 40 is connected to the output terminal of the modulation module 20. The modulation module 20 is also used to extract the reflection signal of the optical fiber. The reflection signal receiving module 40 is used to process the extracted reflection signal and output the sampled data.

[0050] The main control module 102 is connected to the output of the reflected signal receiving module 40. The main control module 102 is used to determine the fault information of the optical fiber link based on the sampled data.

[0051] Each optical module 100 includes a signal transmission link, a service reception link (not shown in the figure), and a reflection reception link. The signal transmission link includes a signal transmission module 101 and a modulation module 20; the reflection reception link includes a reflection signal reception module 40. The service data signal and the modulation signal are time-division multiplexed on the same signal transmission link.

[0052] In optical communication, a service cycle includes a service data transmission phase and a service idle phase. Time slot scheduling logic can be added inside the DSP chip 10 to send service data signals only during the service data transmission phase and to send modulation signals during the idle phase after service data transmission is completed, thereby achieving timing control of the modulation signals.

[0053] During the service data transmission phase, the signal transmitting module 101 normally transmits service data signals, which are electrical pulse signals. The modulation module 20 generates service optical signals under the drive of the service data signals. The modulation module 20 combines the service optical signals and background optical signals and outputs them to the optical fiber, which then transmits them to the optical module 100 at the other end.

[0054] During idle periods, the signal transmitting module 101 sends a modulated signal, which is an electrical pulse signal. Driven by the modulated signal, the modulation module 20 forms a probe light signal within the background light and outputs it to the optical fiber. The signal reflected back from the optical fiber is extracted by the modulation module 20 and sent to the reflected signal receiving module 40 (as shown by the red dashed line in the figure). The reflected signal receiving module 40 processes the extracted reflected signal and outputs sampled data. The main control module 102 can perform fault analysis based on the received sampled data.

[0055] In this embodiment, the service idle phase refers to the blank interval after the service data transmission is completed, such as the Ethernet frame interval.

[0056] The technical solution provided in this embodiment transmits service data signals and modulation signals in a time-division manner by reusing the transmission link, and ensures that the modulation signal falls entirely within the blank gap after the service data transmission is completed, thus avoiding the occupation of effective service bandwidth. Furthermore, it eliminates the need for additional transmission links, completely abandons the external OTDR structure, and achieves normalized online fault detection, which helps to reduce hardware costs and overall power consumption.

[0057] Optionally, in this embodiment, the main control module 102 is also connected to the modulation module 20 (not shown in the figure). The main control module 102 sends a bias control signal to the modulation module 20 to control the modulation module 20 to operate at the maximum transmittance bias point. The modulation module 20 has the highest transmittance and the highest output optical power, and the laser 30 continuously outputs continuous background light. When transmitting service data, the service data signal sent by the signal transmitting module 101 is superimposed on the maximum transmittance bias point of the modulation module 20 to modulate the continuous background light, thereby generating a service optical signal.

[0058] During the idle period, the modulation signal sent by the signal transmitting module 101 is superimposed on the modulation module 20. The modulation signal can cause a momentary dip in the output optical power of the modulation module 20, thereby forming a dark pulse as a probe light signal within the continuous background light.

[0059] Traditional bright pulse OTDRs exhibit instantaneous peak power much higher than the average optical power across the entire link, easily triggering nonlinear effects in the light and causing channel crosstalk between multiple channels. In contrast, the dark pulse probe signal used in this application does not have any instantaneous high light spikes; the optical power only dips slightly from the continuous background light, preventing power jumps at the receiver and maintaining a essentially constant average optical power across the entire link. This physically eliminates fiber nonlinear effects and channel crosstalk, preventing disruption to normal service data transmission.

[0060] Optionally, the modulation module 20 includes a Mach-Zehnder modulator.

[0061] Figure 3 This is a schematic diagram of the structure of another optical module with fiber optic link fault detection function provided in an embodiment of the present invention, referred to... Figure 3 Based on the above embodiments, optionally, the optical module 100 further includes a first AC coupling capacitor C1, which is connected between the output terminal of the signal transmitting module 101 and the first input terminal of the modulation module 20. The electrical signal output by the signal transmitting module 101 is loaded onto the modulation module 20 via the first AC coupling capacitor C1. The first AC coupling capacitor C1 is used to isolate the DC component and transmit only the AC component. When transmitting the modulation signal, the DC path between the signal transmitting module 101 and the modulation module 20 can be interrupted to ensure that the modulation signal does not change the DC bias voltage of the modulation module 20, and to ensure that the static operating point of the modulation module 20 is always stable at the maximum transmission bias point, thus avoiding affecting the stability of the background light. In addition, the first AC coupling capacitor C1 only allows the AC transition component of the modulation signal to pass through, and only generates a momentary voltage bias when loaded onto the modulation module 20, ensuring that the optical power dip forms a dark pulse and does not introduce a continuous power offset.

[0062] Optionally, the reflected signal receiving module 40 includes a first photoelectric conversion unit 401 and a transimpedance amplifier 402 (TIA). The input terminal of the first photoelectric conversion unit 401 is connected to the output terminal of the modulation module 20, the output terminal of the first photoelectric conversion unit 401 is connected to the input terminal of the transimpedance amplifier 402, and the output terminal of the transimpedance amplifier 402 is connected to the main control module 102.

[0063] In this embodiment, the first photoelectric conversion unit 401 can be a photodiode, used to convert the optical signal reflected from the optical fiber into a corresponding current signal, enabling precise capture of weak reflected signals. The transimpedance amplifier 402 is used to convert the current signal output by the first photoelectric conversion unit 401 into a voltage signal.

[0064] Optionally, the optical module 100 further includes a second AC coupling capacitor C2, which is connected to the output terminal of the reflection signal receiving module 40. The second AC coupling capacitor C2 is used to filter out the DC component in the output signal of the reflection signal receiving module 40, allowing only the transient AC change signal corresponding to the dark pulse to pass through, which is beneficial for extracting weak target signals (sampled data) and improving the detection signal-to-noise ratio.

[0065] Figure 4 This is a schematic diagram of another optical module with fiber optic link fault detection function provided in an embodiment of the present invention, referred to... Figure 4 Based on the above embodiments, optionally, the DSP chip 10 further includes a signal processing module 103. The input terminal of the signal processing module 103 is connected to the output terminal of the reflected signal receiving module 40 (specifically, the output terminal of the reflected signal receiving module 40 is connected through the second AC coupling capacitor C2). The output terminal of the signal processing module 103 is connected to the main control module 102. The signal processing module 103 is used to process the sampled data and send the processed sampled data to the main control module 102.

[0066] Specifically, since the distance of the fault location in the optical fiber is different, the intensity of the reflected signal received by the reflected signal receiving module is different. Therefore, a signal processing module 103 is added to the back end of the reflected signal receiving module 40 to improve the fault location accuracy.

[0067] Figure 5 A schematic diagram of an optical module with fiber optic link fault detection function is provided for an embodiment of the present invention, referring to... Figure 5 Based on the above embodiments, the signal processing module 103 may optionally include a variable gain amplifier unit 113 (VGA), a first analog-to-digital converter unit 123 (ADC1), and a storage unit 133.

[0068] The input terminal of the variable gain amplifier unit 113 is connected to the output terminal of the reflected signal receiving module 40, specifically through the second AC coupling capacitor C2. The output terminal of the variable gain amplifier unit 113 is connected to the input terminal of the first analog-to-digital converter unit 123. The output terminal of the first analog-to-digital converter unit 123 is connected to the input terminal of the storage unit 133. The output terminal of the storage unit 133 is connected to the main control module 102.

[0069] The variable gain amplifier unit 113 can be used to dynamically adjust the gain according to the detection distance of the fault location. For example, when a near-distance fault occurs, the reflected signal strength is strong, so the gain can be appropriately reduced to avoid saturation of the subsequent circuitry. When a far-distance fault occurs, the reflected signal strength is weak, so the gain can be increased to ensure that the signal amplitude matches the sampling range of the downstream circuitry. The first analog-to-digital converter unit 123 is used to convert the signal output by the variable gain amplifier unit 113 into a digital signal. The storage unit 133 is used to store the sampling data obtained by the first analog-to-digital converter unit 123 for subsequent calculation by the main control module 102.

[0070] Continue to refer to Figure 5 The signal transmission module 101 includes a signal transmission unit 111 and a digital-to-analog converter (DAC) unit 112. The DAC unit 112 is connected between the signal transmission unit 111 and the modulation module 20. Specifically, the DAC unit 112 is connected to the modulation module 20 through a first AC coupling capacitor C1. The signal transmission unit 111 is used to transmit service data signals and modulation signals in a time-division multiplexing manner.

[0071] Optionally, the optical module 100 further includes a second photoelectric conversion unit 50, and the DSP chip 10 further includes a signal receiving module 104. The signal receiving module 104 includes a signal receiving unit 114 and a second analog-to-digital converter unit 124 (ADC2). The input terminal of the second photoelectric conversion unit 50 is connected to the output terminal of the opposite optical module 100, the output terminal of the second photoelectric conversion unit 50 is connected to the input terminal of the second analog-to-digital converter unit 124, the output terminal of the second analog-to-digital converter unit 124 is connected to the input terminal of the signal receiving unit 114, and the output terminal of the signal receiving unit 114 is connected to the main control module 102.

[0072] The second photoelectric conversion unit 50 and the signal receiving module 104 together form a service receiving link, used to receive service optical signals sent from the peer optical module 100. The second photoelectric conversion unit 50 converts the service optical signals sent from the peer optical module 100 into current signals, and the second analog-to-digital conversion unit 124 converts the photoelectric converted current signals into digital signals for processing by the signal receiving unit 114. The signal receiving unit 114 can be used to perform equalization, decoding, forward error correction, clock recovery, and other processing on the sampled service digital signals to recover the original service data and complete the entire process of digital signal processing for service reception.

[0073] In this embodiment, the service receiving link and the reflection receiving link are completely physically isolated, and the fault detection process will not affect service reception.

[0074] Optionally, the signal transmitting unit 111 and the signal receiving unit 114 can be the digital processing section of the DSP chip 10. The variable gain amplifier unit 113, the first analog-to-digital converter unit 123 (ADC1), the storage unit 133, the digital-to-analog converter unit 112, the first analog-to-digital converter unit 123, the second analog-to-digital converter unit 124, and the main control module 102 are all functional modules within the DSP chip 10. The timing control of the modulation signal, data acquisition, and fault calculation are all integrated within the DSP chip 10, fully reusing the existing chip hardware structure without the need for additional components. The DSP chip 10 integrates multi-level noise reduction and peak selection algorithms. After smoothing and denoising the sampled data, it filters effective fault features and calculates the fault location by combining the optical propagation rate.

[0075] Taking an 800G DR / FR optical module communication system as an example, the optical fiber link experiences faults at locations of 300m, 800m, 1200m, 1600m, and 1900m. Combined with... Figures 1-5 The working process of this scheme is explained in detail with the pulse waveforms of each node. Figure 6 This is a waveform diagram of a modulation signal provided in an embodiment of the present invention. Figure 7 This is a waveform diagram of a dark pulse generated by a modulation module according to an embodiment of the present invention. Figure 8 This is a waveform diagram of the current signal output by the first photoelectric conversion unit. Figure 9 This is a waveform diagram of the voltage signal output by a transimpedance amplifier provided in this embodiment. Figure 10 This is a waveform diagram of the voltage signal output by a variable gain amplifier unit provided in an embodiment of the present invention. Figure 11 This is a waveform diagram of the sampled data output by a first analog-to-digital conversion unit according to an embodiment of the present invention. Figure 12 This is a waveform diagram of a fault detection result provided in an embodiment of the present invention.

[0076] Combination Figures 6-12 Specifically, during the idle phase of the service cycle, the control signal transmitting module 101 sends a modulation signal. After the DC component is filtered out by the first AC coupling capacitor C1, the modulation signal is transmitted to the modulation module 20. The modulation module 20 generates a dark pulse probe light signal within the background light based on the modulation signal and outputs it to the optical fiber. The probe light signal is reflected at the location of the optical fiber fault. The modulation module 20 can extract the corresponding reflected signal through an optical coupler and send it to the first photoelectric conversion unit 401. The first photoelectric conversion unit 401 converts the reflected light signal into a corresponding current signal and sends it to the transimpedance amplifier 402. The transimpedance amplifier 402 converts the current signal output by the first photoelectric conversion unit 401 into a voltage signal.

[0077] The voltage signal output by the transimpedance amplifier 402 is filtered by the second AC coupling capacitor C2 to remove the DC component before being sent to the variable gain amplifier unit 113 for gain adjustment. The adjusted signal is then sampled by the first analog-to-digital converter unit 123 and stored in the storage unit 133, which buffers the sampled data. After the sampled data is reported to the main control module 102 for averaging, filtering, and detection, the main control module 102 calculates the fault location based on the optical propagation speed, thus obtaining the following... Figure 11 The fault detection results shown are accurate and reflect only the true reflection characteristics of the fiber optic link.

[0078] The technical solution provided in this embodiment transmits service data signals and modulation signals in a time-division multiplexing manner by reusing the transmission link. This does not occupy effective service bandwidth, does not interrupt service transmission, and, combined with dark pulse detection, avoids high-light spike interference, thus achieving... 24 / 7 uninterrupted online monitoring significantly reduces economic losses caused by data center downtime. Furthermore, this solution abandons the traditional external OTDR hardware solution, reusing all existing business DSPs, drastically reducing the cost of optical modules 100 and facilitating the miniaturization and standardized mass production of 800G optical modules.

[0079] Optionally, embodiments of the present invention also provide a method for detecting optical fiber link faults in optical modules, used to detect faults in the optical fiber links of optical modules provided in any of the above embodiments. Figure 13 A flowchart illustrating a fiber optic link fault detection method for an optical module provided in an embodiment of the present invention, combined with... Figure 1 and Figure 13 The detection method includes:

[0080] S110. During the idle period, control the DSP chip to send a modulation signal to the optical module so that the optical module generates a probe optical signal.

[0081] S120: The control optical module receives the optical fiber reflection signal reflected back from the probe optical signal through the optical fiber, and the control main control module determines the fault information of the optical fiber link based on the optical fiber reflection signal.

[0082] The technical solution provided in this embodiment transmits service data signals and modulation signals in a time-division manner by reusing the transmission link, and ensures that the modulation signal falls entirely within the blank gap after the service data transmission is completed, thus avoiding the occupation of effective service bandwidth. Furthermore, it eliminates the need for additional transmission links, completely abandons the external OTDR structure, and achieves normalized online fault detection, which helps to reduce hardware costs and overall power consumption.

[0083] Figure 14 A flowchart of another optical module fiber link fault detection method provided in an embodiment of the present invention is shown below. Figure 14 The detection method includes:

[0084] S210, the control modulation module is fixed at the maximum light transmission bias point.

[0085] S1101. During the idle period, the control signal transmitting module sends a modulation signal, loads the modulation signal onto the modulation module, and drives the modulation module to form a dark pulse signal with reduced optical power on the background light.

[0086] S1201, Control the reflected signal receiving module to process the reflected signal extracted by the modulation module and output the sampled data.

[0087] S1202, The main control module determines the fault information of the optical fiber link based on the sampled data.

[0088] in, Figure 14 The specific working process of the detection method shown can be referred to the relevant descriptions in the above embodiments, and will not be repeated here, and has the same beneficial effects.

[0089] Optionally, this embodiment of the invention also provides an optical module, which includes the DSP chip provided in any embodiment of the invention. Therefore, the optical module provided in this embodiment also has the beneficial effects described in the above embodiments.

[0090] Combination Figure 4 The optical module provided in this embodiment also includes a modulation module 20, a reflection signal receiving module 40, a first AC coupling capacitor C1, and a second AC coupling capacitor C2.

[0091] The first AC coupling capacitor C1 is connected between the DSP chip 10 (e.g., the output of the signal transmitting module 101 inside the DSP chip 10) and the first input of the modulation module 20; the second input of the modulation module 20 is connected to the laser 30, the output of the modulation module 20 is connected to the optical fiber, the feedback of the modulation module 20 is connected to the input of the reflected signal receiving module 40, and the output of the reflected signal receiving module 40 is connected to the DSP chip 10 via the second AC coupling capacitor C2, such as to the input of the signal processing module 103 inside the DSP chip 10.

[0092] The specific working principle of the optical module provided in this embodiment will not be repeated here; please refer to the relevant descriptions in the above embodiments.

[0093] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0094] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A DSP chip, characterized in that, The DSP chip is applied to a high-speed optical module. The service frame period of the DSP chip includes a service data transmission phase and a service idle phase. The DSP chip is used to send service data signals during the service data transmission phase and to send modulation signals to the modulation module in the optical module during the service idle phase. The DSP chip is also used to output a bias control signal to control the modulation module to work at the maximum transmission bias point, so that the modulation module forms a dark pulse detection light signal with reduced optical power on the continuous background light output by the laser during the service idle period; the service data signal and the modulation signal are time-division multiplexed on the same signal transmission link; The DSP chip is also used to receive the optical fiber reflection signal fed back by the optical module, and to determine the fault information of the optical fiber link based on the optical fiber reflection signal.

2. The DSP chip according to claim 1, characterized in that, The modulation signal is a pulse signal.

3. The DSP chip according to claim 1, characterized in that, The DSP chip includes a signal transmitting module and a main control module, and the optical module also includes a reflected signal receiving module; The output terminal of the signal transmitting module is connected to the first input terminal of the modulation module. The signal transmitting module is used to transmit service data signals during the service data transmission phase and to transmit the modulation signal during the service idle phase. The reflected signal receiving module is used to receive the optical fiber reflected signal fed back by the modulation module and output sampled data; The main control module is used to determine the fault information of the optical fiber link based on the sampled data.

4. The DSP chip according to claim 3, characterized in that, The modulation module includes a Mach-Zehnder modulator.

5. The DSP chip according to claim 3, characterized in that, The DSP chip also includes a signal processing module. The input terminal of the signal processing module is connected to the output terminal of the reflected signal receiving module, and the output terminal of the signal processing module is connected to the main control module. The signal processing module is used to process the sampled data and send the processed sampled data to the main control module.

6. The DSP chip according to claim 5, characterized in that, The signal processing module includes a variable gain amplification unit, a first analog-to-digital conversion unit, and a storage unit; The input terminal of the variable gain amplifier unit is connected to the output terminal of the reflected signal receiving module, the output terminal of the variable gain amplifier unit is connected to the input terminal of the first analog-to-digital converter unit, the output terminal of the first analog-to-digital converter unit is connected to the input terminal of the storage unit, and the output terminal of the storage unit is connected to the main control module.

7. The DSP chip according to claim 3, characterized in that, The reflected signal receiving module includes a first photoelectric conversion unit and a transimpedance amplifier. The input terminal of the first photoelectric conversion unit is connected to the feedback terminal of the modulation module, the output terminal of the first photoelectric conversion unit is connected to the input terminal of the transimpedance amplifier, and the output terminal of the transimpedance amplifier is connected to the main control module.

8. The DSP chip according to claim 3, characterized in that, The signal transmission module includes a signal transmission unit and a digital-to-analog converter unit. The digital-to-analog converter unit is connected between the signal transmission unit and the modulation module. The signal transmission unit is used to transmit the service data signal and the modulation signal in a time-division multiplexing manner. The optical module further includes a second photoelectric conversion unit, and the DSP chip further includes a signal receiving module. The signal receiving module includes a signal receiving unit and a second analog-to-digital conversion unit. The input terminal of the second photoelectric conversion unit is connected to the output terminal of the opposite optical module, the output terminal of the second photoelectric conversion unit is connected to the input terminal of the second analog-to-digital conversion unit, the output terminal of the second analog-to-digital conversion unit is connected to the input terminal of the signal receiving unit, and the output terminal of the signal receiving unit is connected to the main control module.

9. An optical module, characterized in that, Includes the DSP chip according to any one of claims 1-8.

10. The optical module according to claim 9, characterized in that, The optical module also includes a modulation module, a reflected signal receiving module, a first AC coupling capacitor, and a second AC coupling capacitor; The first AC coupling capacitor is connected between the DSP chip and the first input terminal of the modulation module; The second input terminal of the modulation module is connected to the laser, the output terminal of the modulation module is connected to the optical fiber, the feedback terminal of the modulation module is connected to the input terminal of the reflected signal receiving module, and the output terminal of the reflected signal receiving module is connected to the DSP chip via the second AC coupling capacitor.

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