Photosensitive assembly, camera module and electronic device

Abstract

Embodiments of the present application provide a photosensitive assembly, a camera module and an electronic device, and belong to the technical field of camera modules. The photosensitive assembly comprises a circuit board, a filter support, an image sensor, a filter and a connecting piece. The image sensor is fixedly connected to the circuit board, and the image sensor and the filter are oppositely arranged along the thickness direction of the circuit board. The filter support is fixedly connected to the circuit board, and the filter support comprises a support body and an outer wing. The support body carries the filter and is fixedly connected to the outer wing. The outer wing is spaced apart from the circuit board along a direction perpendicular to the thickness direction of the circuit board. At least part of the connecting piece is arranged between the inner side surface of the outer wing and the outer side surface of the circuit board. The inner side surface of the outer wing is fixedly connected to the outer side surface of the circuit board through the connecting piece. In this way, the size of the photosensitive assembly in the direction perpendicular to the thickness direction of the circuit board can be reduced, which is helpful for the miniaturization design of the photosensitive assembly.

Description

Technical Field

[0001] This application relates to the field of camera module technology, and in particular to a photosensitive component, camera module and electronic device. Background Technology

[0002] Camera modules are commonly found in electronic devices such as mobile phones and tablets, enabling them to take pictures. In related technologies, a camera module includes a lens assembly and a photosensitive assembly. The photosensitive assembly is located on the light-emitting side of the lens assembly and includes a circuit board, an image sensor, a filter, adhesive components, and a filter holder. The image sensor, filter holder, filter, and adhesive components are located on the same side of the circuit board. The circuit board supports the filter holder and image sensor, and the filter holder supports the filter. The bottom surface of the filter holder is bonded to the top surface of the circuit board using adhesive components. However, in related technologies, the photosensitive assembly has a relatively large dimension in the direction perpendicular to the thickness of the circuit board. Summary of the Invention

[0003] This application provides a photosensitive component, a camera module, and an electronic device, which can reduce the size of the photosensitive component in the direction perpendicular to the thickness of the circuit board, thus contributing to the miniaturization design of the photosensitive component.

[0004] In a first aspect, embodiments of this application provide a photosensitive component, which includes a circuit board, a filter holder, an image sensor, a filter, and a connector. The image sensor is fixedly connected to the circuit board, and the image sensor and the filter are disposed opposite each other along the thickness direction of the circuit board. The filter holder is fixedly connected to the circuit board, and the filter holder includes a holder body and an outer wing. The holder body carries the filter and is fixedly connected to the outer wing. The outer wing is spaced apart from the circuit board along a direction perpendicular to the thickness direction of the circuit board. At least a portion of the connector is disposed between the inner side of the outer wing and the outer side of the circuit board, and the inner side of the outer wing is fixedly connected to the outer side of the circuit board through the connector.

[0005] In this embodiment, the outer wing is fixedly connected to the outer side of the circuit board via a connector, which ensures the reliability of the fixed connection between the filter holder and the circuit board. At the same time, it avoids the requirements of the existing Holder Mount solution for bonding width and clearance in the direction perpendicular to the thickness of the circuit board. This reduces the distance between the outer side of the outer wing and the side of the image sensor in the direction perpendicular to the thickness of the circuit board, thereby reducing the size of the photosensitive component in the direction perpendicular to the thickness of the circuit board and contributing to the miniaturization design of the photosensitive component.

[0006] In some possible implementations, a portion of the connector is located between the top surface of the circuit board and the filter holder, and covers a portion of the top surface of the circuit board, which is fixedly connected to the filter holder via the connector.

[0007] In this way, the filter holder is connected to the outer and top surfaces of the circuit board through connectors, which increases the connection area between the filter holder and the circuit board and further improves the reliability of the connection between the filter holder and the circuit board.

[0008] In some possible implementations, the image sensor and the circuit board are stacked along the thickness direction of the circuit board, and the connector is located between the side of the image sensor and the filter holder. The side of the image sensor is fixedly connected to the filter holder through the connector.

[0009] In this way, the filter holder is connected to the outer side of the circuit board, the top surface of the circuit board, and the side of the image sensor through the connector, which increases the equivalent area of ​​the connection between the circuit board and the filter holder and the circuit board, and can further increase the reliability of the connection between the circuit board and the filter holder.

[0010] In some possible implementations, a portion of the connector is located between the top surface of the image sensor and the support body, and covers a portion of the top surface of the image sensor, which is fixedly connected to the support body via the connector.

[0011] In this way, the filter holder is connected to the outer side of the circuit board, the top surface of the circuit board, the side of the image sensor, and the top surface of the image sensor through the connector, which further increases the equivalent connection area between the circuit board and the filter holder, and further increases the reliability of the connection between the circuit board and the filter holder.

[0012] In some possible implementations, the connector is the first adhesive component. Along the thickness direction of the circuit board, the side of the bracket body facing the image sensor has an overflow groove for accommodating adhesive overflowing from the top surface of the image sensor and the bracket body.

[0013] In this way, during the bonding process between the circuit board and the filter holder, the adhesive between the top surface of the image sensor and the holder body can overflow into the adhesive overflow groove, preventing adhesive from overflowing into the photosensitive area of ​​the image sensor and ensuring the function of the image sensor. Additionally, this increases the bonding area between the first adhesive component and the holder body, improving the reliability of the bonding between the first adhesive component and the filter holder.

[0014] In some possible implementations, the connector is the first glued component.

[0015] In this way, during the assembly of the photosensitive component, adhesive can be applied to the connection between the outer wing and the support body by dispensing, and then the circuit board and the filter support are pressed together. After the adhesive cures, the first adhesive component is formed. Therefore, the process for preparing the first adhesive component is simple, reducing the manufacturing difficulty and cost of the photosensitive component.

[0016] In some possible implementations, the support body is made of a non-metallic material, the outer wing is made of a metallic material, and the outer wing is partially embedded inside the support body.

[0017] This increases the strength of the outer wing, further improving its reliability. Additionally, it reduces the weight of the filter support.

[0018] In some possible implementations, the filter holder also includes a reinforcing rib structure, at least partially disposed on the outer wing.

[0019] This further enhances the strength and reliability of the outer wing. Additionally, it reduces the weight of the filter support.

[0020] In some possible implementations, the connector and the filter holder are integrally injection molded structures.

[0021] In this way, by directly injection molding the connector and filter holder into an integral structure on the circuit board through injection molding, the distance between the outer side of the circuit board and the outer side of the outer wing in the direction perpendicular to the thickness of the circuit board can be further reduced, which can further reduce the size of the photosensitive component.

[0022] In some possible implementations, along the thickness direction of the circuit board, the end face of the outer wing furthest from the filter is flush with the bottom surface of the circuit board; or, the bottom surface of the circuit board is located between the filter and the end face of the outer wing furthest from the filter. The bottom surface of the circuit board is the surface of the circuit board furthest from the filter along the thickness direction of the circuit board.

[0023] This increases the connection area between the connector and the inner side of the outer wing and the outer side of the circuit board, further increasing the reliability of the connection between the outer wing and the circuit board.

[0024] In some possible implementations, the photosensitive component also includes a reinforcing plate, which, along with the filter, is located on opposite sides of the circuit board, with the reinforcing plate fixedly connected to the circuit board. A connector is located between the inner side of the outer wing and the outer side of the reinforcing plate, with the inner side of the outer wing fixedly connected to the outer side of the reinforcing plate via the connector.

[0025] This increases the equivalent connection area between the outer wing and the circuit board, further increasing the reliability of the connection between the circuit board and the filter support.

[0026] In some possible implementations, the connector covers a portion of the bottom surface of the circuit board, which is then fixedly connected to the inner side of the outer wing via the connector.

[0027] This increases the connection area between the circuit board and the outer wing, which further increases the reliability of the connection between the circuit board and the filter holder.

[0028] In some possible implementations, the connector covers a portion of the bottom surface of the reinforcing plate, and the bottom surface of the reinforcing plate is fixedly connected to the inner surface of the outer wing via the connector.

[0029] This increases the connection area between the reinforcing plate and the outer wing, thereby increasing the equivalent connection area between the outer wing and the circuit board, which further increases the reliability of the connection between the circuit board and the filter support.

[0030] In some possible implementations, both the outer wing and the reinforcing plate are made of metal, and the outer wing is welded to the reinforcing plate.

[0031] In this way, welding is used to improve the connection strength between the outer wing and the reinforcing plate.

[0032] In some possible implementations, the photosensitive component further includes two wire groups, which are respectively disposed on opposite sides of the image sensor along a first direction. Each wire group includes at least one connecting wire that electrically connects the image sensor and the circuit board. The filter holder includes two outer wings, which are respectively disposed on opposite sides of the holder body along a second direction. The first direction, the second direction, and the thickness direction of the circuit board are perpendicular to each other.

[0033] In this way, the connecting line is decoupled from the outer wing, which can further reduce the size of the circuit board in the second direction, thereby reducing the size of the photosensitive component in the second direction, and further reducing the size of the camera module in the second direction.

[0034] In some possible implementations, the photosensitive component further includes two second adhesive components spaced apart along a first direction. Along the thickness direction of the circuit board, the second adhesive components are located between the top surface of the circuit board and the support body, and the top surface of the circuit board is bonded to the support body through the second adhesive components.

[0035] In this way, the bonding scheme between the two opposite sides of the filter holder in the first direction and the two opposite sides of the circuit board in the second direction is a Holder Mount bonding scheme, which can reduce the difficulty of connecting the filter holder and the circuit board.

[0036] In some possible implementations, the photosensitive component further includes a first electronic component disposed on the top surface of the circuit board and located between the two outer wings. The support body has a receiving groove for accommodating the first electronic component.

[0037] This avoids the first electronic component affecting the thickness of the photosensitive component in the thickness direction of the circuit board, which helps in the miniaturization design of the photosensitive component. Furthermore, the first electronic component does not affect the dimensions of the circuit board in the second direction, allowing for a reduction in the circuit board's dimensions in that direction, which in turn helps to reduce the dimensions of the photosensitive component in that direction.

[0038] Secondly, embodiments of this application also provide a camera module, which includes a lens assembly and a photosensitive component as described in any of the first aspects. The photosensitive component is disposed on the light-emitting side of the lens assembly.

[0039] Thirdly, embodiments of this application provide an electronic device, which includes a housing and a camera module as described in the first aspect. The camera module is disposed within the housing. Attached Figure Description

[0040] Figure 1 An exploded view of an electronic device provided in an embodiment of this application;

[0041] Figure 2 A schematic diagram of the first type of camera module provided in the embodiments of this application;

[0042] Figure 3 This is a schematic diagram of a second type of camera module provided in an embodiment of this application;

[0043] Figure 4 A schematic diagram of a third type of camera module provided in the embodiments of this application;

[0044] Figure 5 A schematic diagram of the fourth type of camera module provided in the embodiments of this application;

[0045] Figure 6 A three-dimensional structural schematic diagram of the first photosensitive component provided in the embodiments of this application;

[0046] Figure 7 for Figure 6 The diagram shows an exploded view of the photosensitive component.

[0047] Figure 8 for Figure 6 A three-dimensional sectional view along the CC direction;

[0048] Figure 9 for Figure 6 A cross-sectional view along the CC direction;

[0049] Figure 10 for Figure 6 A cross-sectional view along the DD direction;

[0050] Figure 11 This is a cross-sectional schematic diagram of a photosensitive component in a related technology;

[0051] Figure 12 for Figure 6 A three-dimensional sectional view of the filter holder in the image;

[0052] Figure 13 for Figure 9 A schematic diagram at point A in the middle;

[0053] Figure 14 for Figure 6 A three-dimensional structural diagram of the filter holder in the image;

[0054] Figure 15 for Figure 10 A schematic diagram at point B in the middle;

[0055] Figure 16 A cross-sectional schematic diagram of a second photosensitive component provided in an embodiment of this application;

[0056] Figure 17 A cross-sectional schematic diagram of a third type of photosensitive component provided in an embodiment of this application;

[0057] Figure 18 A cross-sectional schematic diagram of the fourth photosensitive component provided in the embodiments of this application;

[0058] Figure 19 A cross-sectional schematic diagram of the fifth photosensitive component provided in the embodiments of this application;

[0059] Figure 20 A cross-sectional schematic diagram of the sixth photosensitive component provided in the embodiments of this application;

[0060] Figure 21 A three-dimensional structural schematic diagram of the seventh photosensitive component provided in the embodiments of this application;

[0061] Figure 22 for Figure 21 A front view schematic diagram of the photosensitive component shown;

[0062] Figure 23 for Figure 22 A cross-sectional view along the EE direction;

[0063] Figure 24 for Figure 23 A schematic diagram at point F in the middle;

[0064] Figure 25 for Figure 21 A schematic diagram of the reinforcing plate in the middle;

[0065] Figure 26 A cross-sectional schematic diagram of the eighth photosensitive component provided in the embodiments of this application;

[0066] Figure 27This is a cross-sectional schematic diagram of the ninth photosensitive component provided in the embodiments of this application.

[0067] Explanation of reference numerals in the attached figures:

[0068] 10. Housing; 11. Back cover; 12. Mid-frame;

[0069] 20. Display screen;

[0070] 30. Camera module;

[0071] 31. Photosensitive component;

[0072] 32. Lens assembly;

[0073] 33. Optical path conversion component;

[0074] 34. Secondary optical path conversion component;

[0075] 40. Battery;

[0076] 50. Motherboard;

[0077] 100. Circuit board;

[0078] 200, Filter holder; 210, Outer wing; 220, Holder body; 230, Light transmission hole; 240, Mounting groove; 250, Glue overflow groove; 260, Receiving groove;

[0079] 300. Filter;

[0080] 400. Image sensor;

[0081] 500. Connectors;

[0082] 610. Second glued component;

[0083] 620. Third adhesive component;

[0084] 630, DA glue;

[0085] 700. Connecting cable;

[0086] 800. First Electronic Components;

[0087] 910. Reinforcing plate; 911. Main body; 912. Protrusion;

[0088] 920. Adhesive component; 930. Second electronic component; 940. Clearance hole. Detailed Implementation

[0089] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0090] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, point-of-sale (POS) machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, etc. The electronic device may be a foldable device, such as a foldable mobile phone. It may also be a non-foldable device, such as a candybar mobile phone. This application uses a candybar mobile phone as an example for illustration.

[0091] Figure 1 This is an exploded view of an electronic device provided in an embodiment of this application.

[0092] like Figure 1 As shown in the embodiment of this application, the electronic device includes a housing 10 and a camera module 30. The camera module 30 is disposed on the housing 10, and the housing 10 can serve to support and protect the camera module 30. The camera module 30 is used to capture images.

[0093] In some examples, the electronic device may also include a display screen 20 disposed on a housing 10, the display screen 20 and the housing 10 being used to enclose a device mounting cavity, and at least a portion of a camera module 30 being disposed within the device mounting cavity enclosed by the display screen 20 and the housing 10.

[0094] In other examples, the electronic device may also include a housing 10 but not a display screen 20, the housing 10 may be self-enclosed to form a device mounting cavity, and at least a portion of the camera module 30 may be disposed within the device mounting cavity formed by the housing 10 itself.

[0095] The following description uses an electronic device, including a display screen 20 and a housing 10, as an example.

[0096] For example, such as Figure 1 As shown, the housing 10 may include a middle frame 12 and a rear cover 11. The rear cover 11 and the display screen 20 are respectively covered on both sides of the middle frame 12. The rear cover 11, the middle frame 12 and the display screen 20 form a device mounting cavity. The camera module 30 can be fixed to the middle frame 12, and the middle frame 12 can support the camera module 30.

[0097] In some examples, the middle frame 12 and the back cover 11 can be separate structures, and the middle frame 12 and the back cover 11 can be fixedly connected by means of adhesive, snap-fit, fastener connection, etc.

[0098] In other examples, the middle frame 12 and the back cover 11 can also be a single structure, that is, the middle frame 12 and the back cover 11 can be integrated into a single structural component.

[0099] The electronic device also includes a motherboard 50 and a battery 40, both of which are housed within the housing 10. The battery 40 is electrically connected to the motherboard 50, and the motherboard 50 is electrically connected to the camera module 30.

[0100] Figure 2 This is a schematic diagram of a first type of camera module provided in an embodiment of this application.

[0101] For example, such as Figure 2 As shown, the camera module 30 includes a light path conversion component 33, a lens assembly 32, and a photosensitive component 31. The photosensitive component 31 includes an image sensor 400. The light path conversion component 33 is disposed on the light-inlet side of the lens assembly 32, and the photosensitive component 31 is disposed on the light-outlet side of the lens assembly 32. The light path conversion component 33 is used to fold and redirect the light path before it enters the lens assembly 32. The light from the light-inlet side of the light path conversion component 33 passes through the light path conversion component 33 and the lens assembly 32 and then reaches the image sensor 400 of the photosensitive component 31, so that the image sensor 400 can collect the light and thus capture an image. By setting the light path conversion component 33 to fold and redirect the light path, the overall light path of the camera module 30 can be made longer while the size of the camera module 30 in the light-inlet direction is smaller.

[0102] Lens assembly 32 may include one or more lens components. When lens assembly 32 includes multiple lens components, the multiple lens components are arranged along the optical axis of lens assembly 32. Each lens component may include one or more lenses.

[0103] For example, the optical path conversion component 33 may include a reflective structure for reflecting light to achieve folding and redirection of the optical path. For instance, the reflective structure may include at least one of a prism, a plane mirror, etc.

[0104] In some examples, the optical path conversion component 33 may further include a first lens, which is a positive power lens. The first lens is disposed on the light-incident side of the reflecting structure to allow more light to reach the reflecting structure. In this case, the light-incident surface of the first lens is the light-incident surface of the optical path conversion component 33. Exemplarily, the first lens may be bonded to the reflecting structure, or the first lens may be connected to the reflecting structure via a bracket, or the first lens may be an integral part of the reflecting structure.

[0105] In some examples, the light path conversion component 33 may further include a second lens, which is a negative power lens. The second lens is disposed on the light-emitting side of the reflecting structure to allow more light reflected by the reflecting structure to reach the lens assembly 32. In this case, the light-emitting surface of the second lens is the light-emitting surface of the light path conversion component 33. Exemplarily, the second lens may be bonded to the reflecting structure, or the second lens may be connected to the reflecting structure via a bracket, or the second lens may be an integral part of the reflecting structure.

[0106] Figure 3 This is a schematic diagram of a second type of camera module provided in an embodiment of this application.

[0107] Of course, in addition to the camera module 30, Figure 2 In addition to the vertical telephoto camera module shown, in some embodiments, the camera module 30 can also omit the optical path conversion component 33. In this case, such as... Figure 3 As shown, the camera module 30 includes a lens assembly 32 and a photosensitive assembly 31. The camera module 30 is a sensor-type horizontal main camera module.

[0108] Figure 4 This is a schematic diagram of the third type of camera module provided in the embodiments of this application. Figure 5 This is a schematic diagram of a fourth type of camera module provided in an embodiment of this application.

[0109] In some embodiments, such as Figure 4 , Figure 5 As shown, the camera module 30 also includes a secondary optical path conversion component 34 disposed between the lens assembly 32 and the photosensitive assembly 31. The secondary optical path conversion component 34 is disposed on the light-emitting side of the lens assembly 32, and the photosensitive assembly 31 is disposed on the light-emitting side of the secondary optical path conversion component 34. The secondary optical path conversion component 34 is used to fold and redirect the optical path between the lens assembly 32 and the photosensitive assembly 31. In this way, the overall optical path of the camera module 30 can be further increased, and the arrangement of the photosensitive element can be made more flexible.

[0110] In some embodiments, the secondary optical path conversion component 34 may include at least one of a prism, a plane mirror, etc., while, as Figure 4 As shown, the photosensitive component 31 is arranged horizontally, making the camera module 30 a horizontal telephoto camera module.

[0111] In some embodiments, such as Figure 5 As shown, the secondary optical path conversion component 34 may include a Schmidt prism. The Schmidt prism refracts and tilts the optical path, thereby tilting the photosensitive component 31 and making the camera module 30 a sensor tilting camera module.

[0112] In some embodiments, the camera module 30 further includes an autofocus (AF) motor (not shown in the figure), which carries the lens assembly 32. The AF motor is used to drive the lens component of the lens assembly 32 to move along the optical axis of the lens assembly 32 to achieve functions such as autofocus and zoom.

[0113] The number of AF motors can be one or more. Furthermore, the AF motor can be a voice coil motor (VCM), a shape memory alloy (SMA) motor, or a piezoelectric motor.

[0114] In some embodiments, the camera module 30 further includes an OIS motor (not shown in the figure), which carries the optical path conversion component 33 and drives the optical path conversion component 33 to achieve optical image stabilization.

[0115] In some embodiments, the camera module 30 further includes an OIS motor, which carries the photosensitive component 31 and drives the photosensitive component 31 to achieve optical image stabilization.

[0116] The photosensitive component 31 provided in this application embodiment will be described in detail below with reference to specific embodiments.

[0117] Example 1

[0118] Figure 6 This is a three-dimensional structural diagram of the first type of photosensitive component provided in the embodiments of this application. Figure 7 for Figure 6 The diagram shown is an exploded view of the photosensitive component. Figure 8 for Figure 6 A three-dimensional sectional view along the CC direction. In each figure, the X-axis represents the first direction, the Y-axis represents the second direction, and the Z-axis represents the thickness direction of the circuit board 100. The first direction, the second direction, and the thickness direction of the circuit board 100 are perpendicular to each other. In some embodiments, the first direction is defined as the length direction of the circuit board 100, and the second direction is defined as the width direction of the circuit board 100.

[0119] like Figure 7 As shown, the photosensitive assembly 31 includes a circuit board 100, an image sensor 400, a filter holder 200, and a filter 300. Among them, as... Figure 8 As shown, circuit board 100 supports image sensor 400 and filter holder 200, with filter holder 200 supporting filter 300. Along the thickness direction of circuit board 100 (e.g.) Figure 8 In the Z-direction, the image sensor 400 and the circuit board 100 are stacked together, and the image sensor 400 and the filter 300 are positioned opposite each other.

[0120] In some embodiments, circuit board 100 is a printed circuit board (PCB).

[0121] In some embodiments, the circuit board 100 is a rigid-flex board with the characteristics of both a printed circuit board and a flexible printed circuit board (FPC). For example, the circuit board 100 includes a rigid portion and a flexible portion extending from the rigid portion, the rigid portion being used to support the filter holder 200 and the image sensor 400.

[0122] Image sensor 400 can also be called photosensitive element. Image sensor 400 can be a charge-coupled device (CCD), a complementary metal-oxide-semiconductor (CMOS), or other devices that can realize photoelectric conversion function.

[0123] Figure 9 for Figure 6 A cross-sectional view along the CC direction.

[0124] In some embodiments, the image sensor 400 can be attached to the circuit board 100 using a die attach (DA) process, specifically, as shown in... Figure 8 , Figure 9 As shown, the photosensitive component 31 also includes DA adhesive 630, which is located between the circuit board 100 and the image sensor 400. The image sensor 400 is fixedly connected to the circuit board 100 via the DA adhesive 630.

[0125] Figure 10 for Figure 6 A cross-sectional view along the DD direction.

[0126] For example, such as Figure 10 As shown, the photosensitive component 31 also includes a connecting line 700, through which the image sensor 400 is electrically connected to the circuit board 100, thereby realizing the electrical connection between the image sensor 400 and the circuit board 100.

[0127] In some embodiments, the connecting wire 700 may also be referred to as a gold wire.

[0128] It should be noted that, in addition to being stacked along the thickness direction of the circuit board 100, in some embodiments, the image sensor 400 and the circuit board 100 may also have mounting holes that penetrate the circuit board 100, with at least a portion of the image sensor 400 located inside the mounting holes. In this case, the image sensor 400 is mounted in a recessed sensor attachment manner.

[0129] The filter 300 is located between the image sensor 400 and the lens assembly 32. The filter 300 is used to filter stray light in the light incident on the image sensor 400, thereby ensuring that the image captured by the camera module 30 has better clarity.

[0130] The filter 300 can be, but is not limited to, a blue glass filter. For example, the filter 300 can also be a reflective infrared filter, or a dual-pass filter (a dual-pass filter allows visible and infrared light from ambient light to pass through simultaneously, or allows visible light from ambient light to pass through simultaneously with other specific wavelengths of light (e.g., ultraviolet light), or allows infrared light to pass through simultaneously with other specific wavelengths of light (e.g., ultraviolet light).

[0131] like Figure 9 As shown, the filter holder 200 is spaced apart from the circuit board 100 and the image sensor 400 to avoid collision between the filter holder 200 and the image sensor 400 and the circuit board 100, thus preventing damage to the image sensor 400 and the circuit board 100.

[0132] like Figure 8 As shown, the filter holder 200 has a light-transmitting hole 230 that penetrates the filter holder 200. Along the thickness direction of the circuit board 100, one end of the light-transmitting hole 230 is set opposite to the photosensitive surface of the image sensor 400, and the other end is set opposite to the filter 300. The light emitted from the filter 300 enters the photosensitive surface of the image sensor 400 through the light-transmitting hole 230.

[0133] Figure 11 This is a cross-sectional schematic diagram of a photosensitive component in a related technology.

[0134] In related technologies, the connection between the filter holder 901 and the circuit board 902 is a holder mount bonding method. Specifically, as shown... Figure 11 As shown, the photosensitive assembly includes a filter 905, a filter holder 901, an image sensor 904, a circuit board 902, and an adhesive component 903. Along the thickness direction of the circuit board 902, the filter holder 901 is located on one side of the circuit board 902. An annular adhesive component 903 is provided between the bottom surface of the filter holder 901 facing the circuit board 902 and the top surface of the circuit board 902 near the filter 960. The bottom surface of the filter holder 901 is bonded to the top surface of the circuit board 902 through the adhesive component 903.

[0135] However, to ensure the reliability of the bonding between the filter holder 901 and the circuit board 902, along the direction perpendicular to the thickness direction of the circuit board 902 (such as... Figure 11 In the Y-direction, the bonding width between the filter holder 901 and the circuit board 902 needs to be greater than 0.45mm. Furthermore, to prevent the filter holder 901 from colliding with the image sensor 904 and the gold wires, the clearance between the filter holder 901 and the side of the image sensor 904 or the gold wires along the thickness direction perpendicular to the circuit board 902 needs to be greater than 0.15mm. Therefore, the distance between the outer side of any side of the circuit board 902 and the side of the image sensor 904 must be at least greater than or equal to 0.6mm, resulting in a larger size of the photosensitive component in the direction perpendicular to the thickness direction of the circuit board 902, and a larger volume of the photosensitive component. Additionally, when the overall size of the photosensitive component is fixed, the upper limit of the size of the image sensor 904 is relatively small, making it difficult to design a large target surface for the image sensor 904.

[0136] Figure 12 for Figure 6 A three-dimensional sectional view of the filter holder in the middle. Figure 13 for Figure 9 A schematic diagram of point A in the middle.

[0137] Based on this, in the embodiments of this application, such as Figure 12 As shown, the filter holder 200 includes a holder body 220 and outer wings 210. Wherein, as... Figure 13 As shown, the bracket body 220 carries the filter 300 and is fixedly connected to the outer wing 210, along a direction perpendicular to the thickness direction of the circuit board 100 (e.g., Figure 13 (In the Y direction), the outer wing 210 is spaced apart from the circuit board 100. For example... Figure 8 , Figure 13 As shown, the photosensitive assembly 31 also includes a connector 500, at least a portion of which is disposed between the inner side of the outer wing 210 and the outer side of the circuit board 100. The inner side of the outer wing 210 is fixedly connected to the outer side of the circuit board 100 via the connector 500.

[0138] This ensures the reliability of the fixed connection between the filter holder 200 and the circuit board 100. At the same time, it avoids the requirements of the existing Holder Mount solution for bonding width and clearance in the thickness direction perpendicular to the circuit board 100. This reduces the distance between the outer side of the outer wing 210 and the side of the image sensor 400 in the thickness direction perpendicular to the circuit board 100, thereby reducing the size of the photosensitive component 31 in the thickness direction perpendicular to the circuit board 100 and contributing to the miniaturization design of the photosensitive component 31.

[0139] In addition, when the overall size of the photosensitive component 31 is fixed, the distance between the outer side of the outer wing 210 and the side of the image sensor 400 in the direction perpendicular to the thickness of the circuit board 100 becomes smaller. This can increase the size of the image sensor 400 in the direction perpendicular to the thickness of the circuit board 100, thereby increasing the target area of ​​the image sensor 400, realizing a large target area design, and thus improving the image quality captured by the camera module 30.

[0140] In this embodiment, the top surface of the circuit board 100 is along the thickness direction of the circuit board 100 (e.g., ...). Figure 13 The surface of the circuit board 100 is close to the filter 300 in the Z-direction. The bottom surface of the circuit board 100 is the surface of the circuit board 100 away from the filter 300 along the thickness direction of the circuit board 100. The outer surface of the circuit board 100 is the direction perpendicular to the thickness direction of the circuit board 100 (e.g., in the Z-direction). Figure 13 The outer surface of the circuit board 100 (in the Y direction) connects the top edge of the circuit board 100 to the bottom edge of the circuit board 100.

[0141] In this embodiment, the inner surface of the outer wing 210 is the direction along which the outer wing 210 is perpendicular to the thickness direction of the circuit board 100 (e.g., Figure 13 The outer surface of the outer wing 210 is located near the surface of the circuit board 100 in the Y direction, and the outer surface of the outer wing 210 is in the direction perpendicular to the thickness direction of the circuit board 100 (e.g., in the Y direction). Figure 13 (In the Y direction) away from the surface of the circuit board 100.

[0142] In this embodiment, the connector 500 is a first adhesive component. The outer side of the circuit board 100 is bonded to the inner side of the outer wing 210 through the first adhesive component, thereby fixing the outer wing 210 to the outer side of the circuit board 100. During the assembly of the photosensitive component 31, adhesive can be applied to the connection between the outer wing 210 and the bracket body 220 by dispensing, and then the circuit board 100 and the filter bracket 200 are pressed together. After the adhesive cures, the first adhesive component is formed. Therefore, the process of preparing the first adhesive component is simple, which can reduce the manufacturing difficulty and cost of the photosensitive component 31.

[0143] In some possible implementations, such as Figure 13 As shown, along the thickness direction of the circuit board 100, the end face of the outer wing 210 away from the filter 300 is flush with the bottom surface of the circuit board 100.

[0144] This increases the bonding area between the first adhesive component and the inner surface of the outer wing 210 and the outer surface of the circuit board 100, further increasing the reliability of the bonding between the outer wing 210 and the circuit board 100. Additionally, it reduces the impact of the outer wing 210 on the dimensions of the photosensitive component 31 in the thickness direction of the circuit board 100.

[0145] In some possible configurations, along the thickness direction of the circuit board 100, the bottom surface of the circuit board 100 is located between the filter 300 and the end face of the outer wing 210 away from the filter 300. That is, the end face of the outer wing 210 away from the filter 300 protrudes from the bottom surface of the circuit board 100. This can also increase the bonding area between the first adhesive component and the inner side of the outer wing 210 and the outer side of the circuit board 100, thereby further increasing the reliability of the bonding between the outer wing 210 and the circuit board 100.

[0146] It should be noted that, in addition to being flush with or protruding from the bottom surface of the circuit board 100, the end face of the outer wing 210 away from the filter 300 may also be located between the bottom surface of the circuit board 100 and the filter 300 in some embodiments.

[0147] In some possible implementations, such as Figure 13 As shown, the first glued component (such as...) Figure 13 The portion shown in Figure 500 is located between the top surface of the circuit board 100 and the filter holder 200, and covers the top surface of the circuit board 100. The top surface of the circuit board 100 is bonded to the filter holder 200 by a first adhesive component.

[0148] In this way, the filter holder 200 is bonded to the outer side and top surface of the circuit board 100 through the first adhesive component, which can increase the bonding area between the filter holder 200 and the circuit board 100 and further improve the reliability of the connection between the filter holder 200 and the circuit board 100.

[0149] In this embodiment, the top surface of the image sensor 400 is along the thickness direction of the circuit board 100 (e.g., the top surface of the image sensor 400 is the thickness direction of the image sensor 400). Figure 13 The surface of the image sensor 400 is close to the filter 300 in the Z-direction, and the bottom surface of the image sensor 400 is along the thickness direction of the circuit board 100 (e.g., in the Z-direction). Figure 13 The surface of the image sensor 400 away from the filter 300 (in the Z direction) is perpendicular to the thickness direction of the circuit board 100 (e.g., in the Z direction). Figure 13 The surface in the Y direction of the image sensor 400 is connected to the top edge of the image sensor 400 and the bottom edge of the image sensor 400.

[0150] In some possible implementations, such as Figure 13 As shown, the first glued component (such as...) Figure 13 The portion shown in Figure 500 is disposed between the side of the image sensor 400 and the filter holder 200, and the side of the image sensor 400 is bonded to the filter holder 200 by a first adhesive component.

[0151] In this way, the filter holder 200 is bonded to the outer side of the circuit board 100, the top surface of the circuit board 100, and the side of the image sensor 400 through the first adhesive component, which increases the equivalent area of ​​the bonding between the circuit board 100 and the filter holder 200 and the circuit board 100, and can further increase the reliability of the bonding between the circuit board 100 and the filter holder 200.

[0152] In some possible implementations, such as Figure 13 As shown, along the thickness direction of the circuit board 100, the first adhesive component (such as...) Figure 13 The portion shown in Figure 500 is located between the top surface of the image sensor 400 and the bracket body 220, and covers the top surface of the image sensor 400. The top surface of the image sensor 400 is bonded to the bracket body 220 by a first adhesive component.

[0153] In this way, the filter holder 200 is bonded to the outer side of the circuit board 100, the top surface of the circuit board 100, the side surface of the image sensor 400, and the top surface of the image sensor 400 through the first adhesive component, which further increases the equivalent bonding area between the circuit board 100 and the filter holder 200, and further increases the reliability of the bonding between the circuit board 100 and the filter holder 200.

[0154] In this embodiment, the orthographic projection of the first adhesive component does not coincide with the orthographic projection of the photosensitive area of ​​the image sensor 400 in a plane perpendicular to the thickness direction of the circuit board 100, thereby avoiding the first adhesive component from affecting the photosensitive area of ​​the image sensor 400.

[0155] In some embodiments, during the assembly of the photosensitive component 31, adhesive can be applied to the connection between the outer wing 210 and the support body 220 by dispensing. That is, adhesive is applied to the step formed between the outer wing 210 and the support body 220. Then, the circuit board 100 and the filter support 200 are aligned and pressed together. During the pressing process, part of the adhesive at the step flows to the outer side of the circuit board 100 and the inner side of the outer wing 210, and another part flows to the area between the top surface of the image sensor 400 and the support body 220. After the adhesive cures, a first adhesive component is formed that contacts the top and side surfaces of the image sensor 400, the outer side of the circuit board 100, and the inner side of the outer wing 210.

[0156] The spacing between the outer side of the circuit board 100 and the inner side of the outer wing 210 in the direction perpendicular to the thickness of the circuit board 100 is not limited here. The spacing between the outer side of the circuit board 100 and the inner side of the outer wing 210 can be designed from the following two aspects: 1. Sufficient alignment clearance is provided for the circuit board 100 and the filter holder 200 to be aligned and installed; 2. During the pressing process between the filter holder 200 and the circuit board 100, the adhesive can flow between the outer side of the circuit board 100 and the inner side of the outer wing 210, reducing the amount of adhesive overflowing between the top surface of the image sensor 400 and the holder body 220, ensuring that the outer side of the circuit board 100 and the inner side of the outer wing 210 are tightly filled with adhesive, thereby improving the process yield.

[0157] In some embodiments, along a direction perpendicular to the thickness direction of the circuit board 100 (e.g. Figure 13 In the Y direction, the distance between the outer side of the circuit board 100 and the inner side of the outer wing 210 can be 0.15mm. This satisfies the requirement of adhesive overflowing onto the bottom surface of the circuit board 100 while ensuring that the circuit board 100 and the filter bracket 200 are aligned and installed.

[0158] Of course, the distance between the outer side of the circuit board 100 and the inner side of the outer wing 210 can also be less than or equal to 0.15mm.

[0159] In this embodiment, the wall thickness of the outer wing 210 in the direction perpendicular to the thickness direction of the circuit board 100 is not limited. For example, the wall thickness of the outer wing 210 can be 0.12 mm, which allows the outer wing 210 to be designed as a thin-walled structure. Of course, the thickness of the outer wing 210 can also be greater than or less than 0.12 mm.

[0160] In some possible implementations, combining Figure 12 and Figure 13 It can be seen that, along the thickness direction of the circuit board 100, the bracket body 220 is provided with an overflow groove 250 on the side facing the image sensor 400. The overflow groove 250 is used to contain the glue overflowing from the top surface of the image sensor 400 and the bracket body 220.

[0161] In this way, during the pressing process between the circuit board 100 and the filter holder 200, the adhesive between the top surface of the image sensor 400 and the holder body 220 can overflow into the adhesive overflow groove 250, preventing adhesive from overflowing into the photosensitive area of ​​the image sensor 400 and ensuring the function of the image sensor 400. Additionally, increasing the bonding area between the first adhesive component and the holder body 220 improves the reliability of the bonding between the first adhesive component and the filter 300.

[0162] In some possible implementations, such as Figure 13As shown, the outer wing 210 is integrally formed with the support body 220, making the filter support 200 a one-piece structure. It can be manufactured through one-piece molding processes such as injection molding, insert molding, and metal injection molding (MIM).

[0163] It should be noted that there may be no clear boundary between the outer wing 210 and the support body 220, such as... Figure 13 As shown. Alternatively, when the filter holder 200 is manufactured by insert injection molding, the outer wing 210 and the holder body 220 are two structural components.

[0164] In some possible implementations, the support body 220 and the outer wing 210 can also be separate structures, and the outer wing 210 can be fixedly connected to the support body 220 by welding, bonding or other processes.

[0165] In some possible implementations, the support body 220 is made of a non-metallic material, while the outer wing 210 is made of a metallic material, with a portion of the outer wing 210 embedded inside the support body 220. This further enhances the strength and reliability of the outer wing 210. Additionally, it reduces the weight of the filter support 200.

[0166] When the outer wing 210 is made of metal, the material of the support body 220 can be non-metallic or, in some embodiments, metallic. In this case, part of the outer wing 210 can be located inside the support body 220 or outside the support body 220.

[0167] When the outer wing 210 is made of metal and the support body 220 is made of non-metal, in addition to being located inside the support body 220, in some embodiments the outer wing 210 may also be located outside the support body 220.

[0168] In some possible implementations, the filter holder 200 may also include a reinforcing rib structure, at least partially disposed on the outer wing 210. This can further improve the strength of the outer wing 210 and further improve the reliability of the outer wing 210 itself.

[0169] In some embodiments, a portion of the reinforcing rib structure is disposed on the outer wing 210 and another portion is disposed on the support body 220, which further improves the strength of the outer wing 210 and improves the reliability of the connection between the support body 220 and the outer wing 210.

[0170] In some embodiments, the reinforcing rib structure may be provided on the outer wing 210.

[0171] In some embodiments, the reinforcing rib structure is disposed on the outer wing 210 close to the inner side of the circuit board 100 along a direction perpendicular to the thickness direction of the circuit board 100. The reinforcing rib structure contacts the first adhesive component, which can increase the equivalent bonding area between the first adhesive component and the outer wing 210, and can further increase the equivalent bonding area between the circuit board 100 and the filter support 200.

[0172] Figure 14 for Figure 6 A three-dimensional structural diagram of the filter holder 200 in the diagram.

[0173] In some possible implementations, the photosensitive component 31 includes two sets of lines, the two sets of lines being along a first direction (e.g., Figure 10 The X-axis and the line group are respectively positioned on opposite sides of the image sensor 400, and the line group includes at least one connecting line 700. Therefore, as... Figure 10 As shown, the image sensor 400 has connecting lines 700 arranged on opposite sides in the first direction. (As...) Figure 14 As shown, the filter holder 200 includes two outer wings 210, which are respectively disposed on the holder body 220 along a second direction (e.g., Figure 14 On opposite sides of the Y-direction, the circuit board 100 is located between the two outer wings 210 along the second direction (e.g., in the Y direction). Figure 9 As shown, the circuit board 100 is bonded to the two outer wings 210 on opposite sides in the second direction by two first adhesive components.

[0174] In this way, the connecting line 700 is decoupled from the outer wing 210, which can further reduce the size of the circuit board 100 in the second direction, thereby reducing the size of the photosensitive component 31 in the second direction, and further reducing the size of the camera module 30 in the second direction.

[0175] It should be noted that, in addition to being located on different sides of the circuit board 100, the connecting line 700 and the outer wing 210 are also connected to the outer wing 210 on at least one side of the circuit board 100 where the connecting line 700 is located, in some embodiments.

[0176] It should be noted that the number of outer wings 210 can be more or less than two, in addition to being two. In some embodiments, the number of outer wings 210 is one, in which case one side of the circuit board 100 is bonded to the outer wing 210 by a first adhesive component. In some embodiments, the number of outer wings 210 can also be four, and the four sides of the circuit board 100 are bonded to the four outer wings 210 by four first adhesive components respectively.

[0177] Therefore, the area and position of the outer wing 210 covering the outer side of the circuit board 100 can be flexibly set. For example, for size-sensitive directions, the outer wing 210 can be bonded to the outer side of the circuit board 100 in that size-sensitive direction. For non-sensitive dimensions or non-sensitive directions, the outer wing 210 can be bonded to the outer side of the circuit board 100. Alternatively, other bonding schemes can be used for non-sensitive dimensions or non-sensitive directions, such as the Holder Mount bonding scheme.

[0178] Figure 15 for Figure 10 A schematic diagram at point B in the middle.

[0179] In some possible implementations, such as Figure 10 As shown, the photosensitive component 31 also includes two second adhesive elements 610, which are arranged along a first direction (e.g., Figure 10 (Interval setting in the X direction). For example... Figure 15 As shown, along the thickness direction of the circuit board 100 (e.g.) Figure 15 In the Z direction, the second adhesive component 610 is located between the top surface of the circuit board 100 and the bracket body 220, and the top surface of the circuit board 100 is bonded to the bracket body 220 through the second adhesive component 610.

[0180] In this way, the bonding scheme between the opposite sides of the filter holder 200 in the first direction and the opposite sides of the circuit board 100 in the second direction is a Holder Mount bonding scheme, which can reduce the difficulty of connecting the filter holder 200 and the circuit board 100.

[0181] Of course, besides the Holder Mount bonding method, the filter holder 200 can also be connected to the circuit board 100 on opposite sides in the first direction using other connection methods. For example, the holder body 220 has receiving grooves on opposite sides in the first direction, and a portion of the second adhesive 610 fills the interior of the receiving grooves and wraps the connecting wire 700. The second adhesive 610 covers a portion of the top surface of the circuit board 100 and a portion of the top surface of the image sensor 400. In this case, the connection method between the holder body 220 and the circuit board 100 on opposite sides in the first direction is a Frame On Golden Wire bonding method.

[0182] In some possible implementations, such as Figure 15 As shown, the photosensitive assembly 31 also includes a first electronic component 800, which is disposed on the top surface of the circuit board 100 and located between the two outer wings 210. The bracket body 220 has a receiving groove 260 for receiving the first electronic component 800.

[0183] This avoids the first electronic component 800 affecting the thickness of the photosensitive component 31 in the thickness direction of the circuit board 100, which helps to miniaturize the photosensitive component 31. In addition, the first electronic component 800 does not affect the size of the circuit board 100 in the second direction, which can reduce the size of the circuit board 100 in the second direction, and thus help to reduce the size of the photosensitive component 31 in the second direction.

[0184] For example, such as Figure 14 As shown, there are three recesses 260. Of course, the number of recesses 260 can be more or less than three.

[0185] Any of the receiving grooves 260 can be used to receive at least one first electronic component 800. For example, the receiving groove 260 can be used to receive two first electronic components 800.

[0186] The First Electronic Components 800 can be used for components such as resistors, capacitors, and inductors.

[0187] In some possible implementations, the first electronic component 800 can also be disposed on the bottom surface of the circuit board 100, which can also avoid the first electronic component 800 affecting the size of the circuit board 100 in the direction perpendicular to the thickness of the circuit board 100, and help to reduce the size of the circuit board 100 in the direction perpendicular to the thickness of the circuit board 100.

[0188] In some possible implementations, combining Figure 12 and Figure 13 As can be seen, along the thickness direction of the circuit board 100, a mounting groove 240 is provided on the side of the support body 220 away from the image sensor 400. The filter 300 is disposed inside the mounting groove 240 and at the bottom of the groove. This reduces the stacking size of the filter 300 and the filter support 200 in the thickness direction of the circuit board 100. In addition, the sidewall of the mounting groove 240 can also protect the filter 300.

[0189] In the embodiments of this application, such as Figure 13 As shown, the bracket body 220 has a light-transmitting hole 230, through which the image sensor 400 receives the light emitted from the filter 300.

[0190] In some embodiments, such as Figure 9 As shown, along the direction from the filter 300 to the image sensor 400, the aperture of the light-transmitting hole 230 gradually increases, which can reduce the overall weight of the filter holder 200.

[0191] In some embodiments, such as Figure 13As shown, the photosensitive component 31 also includes a third adhesive component 620, which is disposed between the bottom of the mounting groove 240 and the filter 300. The filter 300 is bonded to the filter holder 200 through the third adhesive component 620.

[0192] Example 2

[0193] Figure 16 This is a cross-sectional schematic diagram of a second type of photosensitive component provided in an embodiment of this application. Figure 16 In this diagram, the dividing line P is only used to illustrate the connector 500 and the filter holder 200, to show the relative positional relationship between the outer wing 210 and the circuit board 100. At the same time, the dividing line P does not constitute a limitation on the specific structure of the connector 500 and the filter holder 200.

[0194] The difference between Example 2 and Example 1 is that, as Figure 16 As shown, the connector 500 and the filter holder 200 are integrally injection molded structures. In this way, by directly injection molding the connector 500 and the filter holder 200 into an integral structure on the circuit board 100 through the injection molding process, the distance between the outer side of the circuit board 100 and the outer side of the outer wing 210 in the direction perpendicular to the thickness direction of the circuit board 100 can be further reduced, which can further reduce the size of the photosensitive component 31.

[0195] Specifically, the assembled image sensor 400 and circuit board 100 are placed into the cavity of the injection mold, and then the injection material is injected into the cavity. After the injection material is cured, it can form a connector 500 and filter bracket 200 with an integral injection molding structure.

[0196] In some embodiments, the material of the connector 500 can be the same as the material of the filter holder 200; for example, both the connector 500 and the filter holder 200 can be made of resin. This reduces the difficulty of injection molding the connector 500 and the filter holder 200.

[0197] Since the connector 500 and the filter holder 200 are integrally injection molded structures, when the materials of the connector 500 and the filter holder 200 are the same, there is no obvious boundary interface between the connector 500 and the filter holder 200.

[0198] At least one side of the circuit board 100 can be fixedly connected to the outer wing 210 by the connector 500. For example, there are two connectors 500 and two outer wings 210, with one outer wing 210 corresponding to the connector 500, and the circuit board 100 is located between the two outer wings 210 along the second direction.

[0199] It should be noted that when at least one side of the circuit board 100 is not connected to the filter 300 through the connector 500 and the outer wing 210, since the filter holder 200 is integrally injection molded, the holder body 220 of the filter holder 200 directly contacts and is fixedly connected to the top surface of the circuit board 100.

[0200] In some possible implementations, such as Figure 16 As shown, part of the connector 500 is located between the top surface of the circuit board 100 and the filter holder 200, and covers the top surface of the circuit board 100. The top surface of the circuit board 100 is fixedly connected to the filter holder 200 through the connector 500.

[0201] In this way, the filter holder 200 is bonded to the outer side and top surface of the circuit board 100 through the connector 500, which increases the bonding area between the filter holder 200 and the circuit board 100 and further improves the reliability of the connection between the filter holder 200 and the circuit board 100.

[0202] In some possible implementations, such as Figure 16 As shown, the image sensor 400 and the circuit board 100 are stacked along the thickness direction of the circuit board 100. A portion of the connector 500 is located between the side of the image sensor 400 and the filter holder 200. The side of the image sensor 400 is fixedly connected to the filter holder 200 through the connector 500.

[0203] In this way, the filter holder 200 is bonded to the outer side of the circuit board 100, the top surface of the circuit board 100 and the side of the image sensor 400 through the connector 500, which increases the equivalent area of ​​the bonding between the circuit board 100 and the filter holder 200 and the circuit board 100, and can further increase the reliability of the bonding between the circuit board 100 and the filter holder 200.

[0204] In some possible implementations, such as Figure 16 As shown, part of the connector 500 is located between the top surface of the image sensor 400 and the bracket body 220, and covers part of the top surface of the image sensor 400. The top surface of the image sensor 400 is fixedly connected to the bracket body 220 through the connector 500.

[0205] In this way, the filter holder 200 is bonded to the outer side of the circuit board 100, the top surface of the circuit board 100, the side surface of the image sensor 400, and the top surface of the image sensor 400 through the connector 500, which further increases the equivalent bonding area between the circuit board 100 and the filter holder 200, and further increases the reliability of the bonding between the circuit board 100 and the filter holder 200.

[0206] In this embodiment, the orthographic projection of the connector 500 does not coincide with the orthographic projection of the photosensitive surface of the image sensor 400 in a plane perpendicular to the thickness direction of the circuit board 100. Therefore, the connector 500 does not cover the photosensitive area of ​​the image sensor 400, thus ensuring the photosensitive area of ​​the image sensor 400.

[0207] Example 3

[0208] Figure 17 This is a cross-sectional schematic diagram of a third type of photosensitive component provided in an embodiment of this application.

[0209] The difference between Example 3 and Example 1 is that, as Figure 17 As shown, the photosensitive component 31 also includes a reinforcing plate 910, which and the filter 300 are located on opposite sides of the circuit board 100, and the reinforcing plate 910 is fixedly connected to the circuit board 100. This can improve the strength of the circuit board 100.

[0210] The reinforcing plate 910 can be made of metallic or non-metallic materials, for example, the reinforcing plate 910 is stainless steel.

[0211] In some embodiments, such as Figure 16 As shown, the photosensitive component 31 also includes an adhesive 920, which is disposed between the circuit board 100 and the reinforcing plate 910. The reinforcing plate 910 is bonded to the bottom surface of the circuit board 100 through the adhesive 920, thereby achieving a fixed connection between the circuit board 100 and the reinforcing plate 910.

[0212] In this embodiment, the top surface of the reinforcing plate 910 is along the thickness direction of the circuit board 100 (e.g., ...). Figure 17 The surface of the reinforcing plate 910 is close to the filter 300 in the Z-direction. The bottom surface of the reinforcing plate 910 is the surface of the reinforcing plate 910 away from the filter 300 along the thickness direction of the circuit board 100. The outer surface of the reinforcing plate 910 is the direction of the reinforcing plate 910 perpendicular to the thickness direction of the circuit board 100 (e.g., in the Z-direction). Figure 17 The outer surface of the reinforcing plate 910 in the Y direction is connected to the top edge of the reinforcing plate 910 and the bottom edge of the reinforcing plate 910.

[0213] Figure 18 This is a cross-sectional schematic diagram of the fourth photosensitive component provided in the embodiments of this application.

[0214] In some possible implementations, such as Figure 18 As shown, part of the connector 500 is located between the inner side of the outer wing 210 and the outer side of the reinforcing plate 910, and the inner side of the outer wing 210 is fixedly connected to the outer side of the reinforcing plate 910 through the connector 500.

[0215] This increases the equivalent connection area between the outer wing 210 and the circuit board 100, further increasing the reliability of the connection between the circuit board 100 and the filter support 200.

[0216] Figure 19 This is a cross-sectional schematic diagram of the fifth photosensitive component 31 provided in the embodiments of this application.

[0217] In some possible implementations, such as Figure 19 As shown, the connector 500 covers the bottom surface of the circuit board 100, and the bottom surface of the circuit board 100 is fixedly connected to the inner side of the outer wing 210 through the connector 500.

[0218] This increases the connection area between the circuit board 100 and the outer wing 210, which further increases the reliability of the connection between the circuit board 100 and the filter holder 200.

[0219] Figure 20 This is a cross-sectional schematic diagram of the sixth photosensitive component 31 provided in the embodiments of this application.

[0220] In some possible implementations, the connector 500 covers a portion of the bottom surface of the reinforcing plate 910, and the bottom surface of the reinforcing plate 910 is fixedly connected to the inner surface of the outer wing 210 via the connector 500.

[0221] This increases the connection area between the reinforcing plate 910 and the outer wing 210, thereby increasing the equivalent connection area between the outer wing 210 and the circuit board 100, which further increases the reliability of the connection between the circuit board 100 and the filter support 200.

[0222] In some possible implementations, both the outer wing 210 and the reinforcing plate 910 are made of metal, and the outer wing 210 is welded to the reinforcing plate 910. In this way, the connection strength between the outer wing 210 and the reinforcing plate 910 is improved by welding.

[0223] In some embodiments, when the outer wing 210 is welded to the reinforcing plate 910, no connector 500 is provided between the inner side of the outer wing 210 and the reinforcing plate 910, that is, the connector 500 does not connect the outer wing 210 and the reinforcing plate 910.

[0224] Figure 21 This is a three-dimensional structural diagram of the seventh photosensitive component 31 provided in the embodiments of this application. Figure 22 for Figure 21 The diagram shows a front view of the photosensitive component 31. Figure 23 for Figure 22 A cross-sectional view along the EE direction. Figure 24 for Figure 23 A schematic diagram at point F in the middle. Figure 25 for Figure 21A schematic diagram of the reinforcing plate 910 in the diagram.

[0225] In some embodiments, when the reinforcing plate 910 is welded to the outer wing 210, such as Figure 23 , Figure 24 As shown, the outer wing 210 can also be fixedly connected to the reinforcing plate 910 via the connector 500. This further improves the reliability of the connection between the filter holder 200 and the circuit board 100.

[0226] In some embodiments, such as Figure 25 As shown, the reinforcing plate 910 includes a main body 911 and a protrusion 912. The protrusion 912 is disposed on the outer surface of the main body 911 and is used for welding to the outer wing 210. Figure 23 As shown, a portion of the connector 500 is disposed between the outer side of the main body 911 and the inner side of the outer wing 210, and the outer side of the main body 911 is fixedly connected to the inner side of the outer wing 210 through the connector 500.

[0227] There is no limit to the number of protrusions 912. For example Figure 25 As shown, the number of protrusions 912 can be 6.

[0228] In some possible implementations, such as Figure 21 As shown, the photosensitive component 31 also includes a second electronic component 930, which is disposed on the bottom surface of the circuit board 100 and electrically connected to the circuit board 100. The reinforcing plate 910 has a clearance hole 940 that penetrates the reinforcing plate 910 along the thickness direction of the circuit board 100. The clearance hole 940 is used to accommodate the second electronic component.

[0229] In this way, by avoiding the second electronic component 930 through the clearance hole 940, the stacking size of the reinforcing plate 910 and the circuit board 100 can be reduced, which helps to miniaturize the photosensitive component 31.

[0230] like Figure 21 As shown, there is one clearance hole 940, but there can also be multiple clearance holes 940. When there are multiple clearance holes 940, any one clearance hole 940 is used to accommodate at least one second electronic component 930.

[0231] The second electronic component 930 can be a resistor, capacitor, inductor, or other similar component.

[0232] In some embodiments, when the connector 500 is connected to the surface of the reinforcing plate 910, the connector 500 can contact the surface of the image sensor 400, such as... Figure 18 As shown, the connector 500 contacts the side and top surfaces of the image sensor 400.

[0233] Figure 26 This is a cross-sectional schematic diagram of the eighth photosensitive component 31 provided in the embodiments of this application. Figure 27 This is a cross-sectional schematic diagram of the ninth photosensitive component 31 provided in the embodiments of this application.

[0234] In some embodiments, when the connector 500 is connected to the surface of the reinforcing plate 910, the connector 500 may also not be in contact with the surface of the image sensor 400, for example... Figure 26 or Figure 27 As shown.

[0235] In some embodiments, the connector 500 may be a first adhesive component, for example... Figure 18 , Figure 19 , Figure 21 , Figure 20 , Figure 23 As shown.

[0236] In some embodiments, the connector 500 and the filter holder 200 can be an integral injection-molded structure.

[0237] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0238] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A photosensitive component (31), characterized in that, Includes a circuit board (100), a filter holder (200), an image sensor (400), a filter (300), and a connector (500); The image sensor (400) is fixedly connected to the circuit board (100), and the image sensor (400) and the filter (300) are arranged opposite to each other along the thickness direction of the circuit board (100); The filter holder (200) is fixedly connected to the circuit board (100). The filter holder (200) includes a holder body (220) and an outer wing (210). The holder body (220) carries the filter (300) and is fixedly connected to the outer wing (210). The outer wing (210) is spaced apart from the circuit board (100) along a direction perpendicular to the thickness direction of the circuit board (100). At least a portion of the connector (500) is disposed between the inner side of the outer wing (210) and the outer side of the circuit board (100). The inner side of the outer wing (210) is fixedly connected to the outer side of the circuit board (100) through the connector (500).

2. The photosensitive component (31) according to claim 1, characterized in that, A portion of the connector (500) is located between the top surface of the circuit board (100) and the filter holder (200), and covers a portion of the top surface of the circuit board (100). The top surface of the circuit board (100) is fixedly connected to the filter holder (200) via the connector (500).

3. The photosensitive component (31) according to claim 1 or 2, characterized in that, The image sensor (400) and the circuit board (100) are stacked along the thickness direction of the circuit board (100). A portion of the connector (500) is located between the side of the image sensor (400) and the filter holder (200). The side of the image sensor (400) is fixedly connected to the filter holder (200) through the connector (500).

4. The photosensitive component (31) according to claim 3, characterized in that, A portion of the connector (500) is located between the top surface of the image sensor (400) and the bracket body (220), and covers the top surface of the image sensor (400). The top surface of the image sensor (400) is fixedly connected to the bracket body (220) through the connector (500).

5. The photosensitive component (31) according to claim 4, characterized in that, The connector (500) is a first adhesive component. Along the thickness direction of the circuit board (100), the bracket body (220) facing the image sensor (400) is provided with an overflow groove (250). The overflow groove (250) is used to accommodate the adhesive overflowing from the top surface of the image sensor (400) and the bracket body (220).

6. The photosensitive component (31) according to any one of claims 1-4, characterized in that, The connector (500) is the first adhesive component.

7. The photosensitive component (31) according to claim 5 or 6, characterized in that, The support body (220) is made of non-metallic material, and the outer wing (210) is made of metallic material. Part of the outer wing (210) is embedded inside the support body (220).

8. The photosensitive component (31) according to claim 5 or 6, characterized in that, The filter holder (200) also includes a reinforcing rib structure, at least a portion of which is disposed on the outer wing (210).

9. The photosensitive component (31) according to any one of claims 1-4, characterized in that, The connector (500) and the filter holder (200) are integrally injection molded structures.

10. The photosensitive component (31) according to any one of claims 1-9, characterized in that, Along the thickness direction of the circuit board (100), the end face of the outer wing (210) away from the filter (300) is flush with the bottom surface of the circuit board (100), or the bottom surface of the circuit board (100) is located between the filter (300) and the end face of the outer wing (210) away from the filter (300); The bottom surface of the circuit board (100) is the surface of the circuit board (100) away from the filter (300) along the thickness direction of the circuit board (100).

11. The photosensitive component (31) according to any one of claims 1-9, characterized in that, The photosensitive component (31) further includes a reinforcing plate (910), the reinforcing plate (910) and the filter (300) are respectively located on opposite sides of the circuit board (100), and the reinforcing plate (910) is fixedly connected to the circuit board (100); A portion of the connector (500) is located between the inner side of the outer wing (210) and the outer side of the reinforcing plate (910), and the inner side of the outer wing (210) is fixedly connected to the outer side of the reinforcing plate (910) through the connector (500).

12. The photosensitive component (31) according to claim 11, characterized in that, The connector (500) covers a portion of the bottom surface of the circuit board (100), and the bottom surface of the circuit board (100) is fixedly connected to the inner side surface of the outer wing (210) through the connector (500).

13. The photosensitive component (31) according to claim 11 or 12, characterized in that, The connector (500) covers a portion of the bottom surface of the reinforcing plate (910), and the bottom surface of the reinforcing plate (910) is fixedly connected to the inner side surface of the outer wing (210) through the connector (500).

14. The photosensitive component (31) according to any one of claims 11-13, characterized in that, The outer wing (210) and the reinforcing plate (910) are both made of metal, and the outer wing (210) is welded to the reinforcing plate (910).

15. The photosensitive component (31) according to any one of claims 1-14, characterized in that, The photosensitive component (31) further includes two wire groups, which are respectively disposed on opposite sides of the image sensor (400) along a first direction. Each wire group includes at least one connecting wire (700), which is electrically connected to the image sensor (400) and the circuit board (100). The filter holder (200) includes two outer wings (210), which are respectively disposed on opposite sides of the holder body (220) along the second direction. The first direction, the second direction and the thickness direction of the circuit board (100) are perpendicular to each other.

16. The photosensitive component (31) according to claim 15, characterized in that, The photosensitive component (31) further includes two second adhesive components (610), which are spaced apart along the first direction. Along the thickness direction of the circuit board (100), the second adhesive components (610) are located between the top surface of the circuit board (100) and the bracket body (220), and the top surface of the circuit board (100) is bonded to the bracket body (220) through the second adhesive components (610).

17. The photosensitive component (31) according to claim 15 or 16, characterized in that, The photosensitive component (31) further includes a first electronic component (800), which is disposed on the top surface of the circuit board (100) and located between the two outer wings (210); The bracket body (220) has a receiving groove (260) for receiving the first electronic component (800).

18. A camera module (30), characterized in that, Includes a lens assembly (32) and a photosensitive assembly (31) as described in any one of claims 1-17; The photosensitive component (31) is disposed on the light-emitting side of the lens assembly (32).

19. An electronic device, characterized in that, Includes a housing (10) and a camera module (30) as described in claim 18; The camera module (30) is disposed on the housing (10).

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