Speaker and electronic device

Abstract

The application discloses a loudspeaker and an electronic device, and belongs to the technical field of loudspeakers. The loudspeaker comprises a basket, a diaphragm assembly, an electromagnetic driving module, a memory alloy module and a transmission member. The diaphragm assembly is connected to one side of the basket. The electromagnetic driving module comprises a magnetic member and a voice coil. The voice coil is connected to the diaphragm assembly. When the voice coil is electrified, magnetic force is generated between the voice coil and the magnetic member, so that the voice coil drives the diaphragm assembly to vibrate. The memory alloy module is connected to the basket. The memory alloy module is configured to deform due to heating when electrified. The transmission member is connected to the memory alloy module. The memory alloy module drives the voice coil to vibrate through the transmission member, so that the voice coil drives the diaphragm assembly to vibrate.

Description

Technical Field

[0001] This application belongs to the field of loudspeaker technology, specifically relating to a loudspeaker and an electronic device. Background Technology

[0002] Currently, most electronic device speakers use a moving coil structure. Due to the limited size of the magnetic circuit, the low-frequency extension capability of the speaker is limited. If the magnetic circuit is enlarged to improve low-frequency performance, it will directly lead to an increase in speaker size, which cannot meet the requirements of thinner and lighter electronic devices. Summary of the Invention

[0003] This application aims to provide a loudspeaker and electronic device that solves the problem of limited low-frequency extension capability of loudspeakers in the current trend of thinner and lighter electronic devices.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide a loudspeaker, comprising:

[0006] Sink stand;

[0007] The diaphragm assembly is attached to one side of the frame;

[0008] The electromagnetic drive module includes a magnetic component and a voice coil. The voice coil is connected to the diaphragm assembly. When the voice coil is energized, a magnetic force is generated between the voice coil and the magnetic component, causing the voice coil to drive the diaphragm assembly to vibrate.

[0009] A shape memory alloy module is attached to the basin frame and is configured to deform upon heating when energized.

[0010] The transmission component is connected to the shape memory alloy module. The shape memory alloy module drives the voice coil to vibrate through the transmission component, so that the voice coil drives the diaphragm assembly to vibrate.

[0011] Secondly, embodiments of this application provide an electronic device, which includes the speaker described in the first aspect.

[0012] In the embodiments of this application, a shape memory alloy module is introduced as an auxiliary power source for the low-frequency range. The shape memory alloy module is connected to the frame. When the shape memory alloy module is heated to above the phase transformation temperature, it undergoes a transformation from martensite to austenite, resulting in significant shrinkage deformation. Since the shape memory alloy module does not act directly on the diaphragm assembly, but is connected to the voice coil through a transmission component, the driving force generated by the deformation of the shape memory alloy module first acts on the voice coil, and then is transmitted to the diaphragm assembly by the voice coil. This design cleverly utilizes the voice coil as a force coupling node, avoiding local stress concentration or diaphragm segmentation vibration that may be caused by the shape memory alloy module being directly connected to the diaphragm. At the same time, it can be combined with the original vibration of the electromagnetic drive module to achieve effective superposition of driving force, so that the speaker can achieve deeper low-frequency extension by taking advantage of the displacement characteristics of the shape memory alloy module while maintaining the original mid-high frequency performance.

[0013] Memory alloy modules can generate a driving force far greater than that of traditional dynamic coils with a very small cross-sectional area. Therefore, within a limited space, the tiny deformation of the memory alloy module itself can drive the voice coil and diaphragm to produce large-amplitude vibrations far exceeding the limits of traditional dynamic coils. This expands the low-frequency extension of the speaker without increasing its size, effectively compensating for the sound pressure level attenuation of traditional dynamic units in the sub-100Hz frequency range. This allows even thinner and lighter electronic devices to output excellent deep bass, while avoiding the increased power consumption and magnetic leakage risks caused by increasing the weight of the magnetic circuit, significantly improving the user experience.

[0014] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 This is one of the exploded views of a loudspeaker according to an embodiment of this application;

[0017] Figure 2 This is one of the schematic diagrams of a speaker according to an embodiment of this application;

[0018] Figure 3 This is a second schematic diagram of a loudspeaker according to an embodiment of this application;

[0019] Figure 4 This is a third schematic diagram of a loudspeaker according to an embodiment of this application;

[0020] Figure 5 This is a second exploded view of a loudspeaker according to an embodiment of this application;

[0021] Figure 6 This is a fourth schematic diagram of a loudspeaker according to an embodiment of this application;

[0022] Figure 7 This is a schematic diagram of the rigid connecting part, the flexible connecting part, and the voice coil according to an embodiment of this application;

[0023] Figure 8 This is a schematic diagram of the deformation group according to an embodiment of this application.

[0024] Figure label:

[0025] 100 Speaker, 110 Basket, 111 Basket Body, 112 Mounting Plate, 120 Diaphragm Assembly, 130 Electromagnetic Drive Module, 131 Magnetic Component, 132 Voice Coil, 133 Electrical Connector, 134 Spring, 135 Flexible Circuit Board, 140 Shape Memory Alloy Module, 141 Deformation Assembly, 142 Shape Memory Alloy Deformation Component, 150 Transmission Component, 151 Rigid Connection, 152 Flexible Connection, 153 Connection Assembly, 154 Connecting Rib, 160 Thermally Conductive Insulating Component. Detailed Implementation

[0026] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] The following is combined with Figures 1-8 This application describes a speaker and an electronic device according to embodiments thereof.

[0031] Combination Figure 1 and Figure 2 As shown, in some embodiments of this application, a loudspeaker 100 is provided. The loudspeaker 100 includes: a frame 110, a diaphragm assembly 120, an electromagnetic drive module 130, a shape memory alloy module 140, and a transmission component 150. The diaphragm assembly 120 is connected to one side of the frame 110. The electromagnetic drive module 130 includes a magnetic element 131 and a voice coil 132. The voice coil 132 is connected to the diaphragm assembly 120. When the voice coil 132 is energized, a magnetic force is generated between the voice coil 132 and the magnetic element 131, causing the voice coil 132 to drive the diaphragm assembly 120 to vibrate. The shape memory alloy module 140 is connected to the frame 110 and is configured to deform due to heating when energized. The transmission component 150 is connected to the shape memory alloy module 140. The shape memory alloy module 140 drives the voice coil 132 to vibrate through the transmission component 150, thereby causing the voice coil 132 to drive the diaphragm assembly 120 to vibrate.

[0032] The frame 110 is typically made of metal or high-strength plastic. An internal cavity is formed within the frame 110. The frame 110 not only mounts and secures the diaphragm assembly 120 and the shape memory alloy module 140, but also shields against external electromagnetic interference and protects internal precision components from physical damage. The diaphragm assembly 120 is connected to one side of the frame 110, and its edge is sealed to the frame 110, thus forming a closed acoustic chamber inside the frame 110. The primary function of the diaphragm assembly 120 is to convert mechanical vibrations into sound waves that are radiated into the air.

[0033] The electromagnetic drive module 130 specifically includes a magnetic component 131 and a voice coil 132. The magnetic component 131 is used to form a stable static magnetic field within the frame 110. The voice coil 132 is a hollow coil wound with enameled wire. The voice coil 132 is rigidly connected to the diaphragm assembly 120 by adhesive bonding or mechanical snap-fit. When the energized voice coil 132 is in the magnetic field, it is subjected to a magnetic force. Since the voice coil 132 is connected to the diaphragm assembly 120, the voice coil 132, subjected to the magnetic force, drives the diaphragm assembly 120 to reciprocate, thereby generating sound waves of the corresponding frequency. This process is suitable for reproducing mid-to-high frequency signals.

[0034] Based on this, this application introduces a shape memory alloy module 140 as an auxiliary power source for the low-frequency band. The shape memory alloy module 140 is connected to the frame 110. When the shape memory alloy module 140 is heated to above the phase transformation temperature, it undergoes a martensitic to austenitic transformation, resulting in significant shrinkage deformation. Since the shape memory alloy module 140 does not directly act on the diaphragm assembly 120, but is connected to the voice coil 132 through the transmission component 150, the driving force generated by the deformation of the shape memory alloy module 140 first acts on the transmission component 150, and then... The force is transmitted through the transmission component 150 to the voice coil 132, and then from the voice coil 132 to the diaphragm assembly 120. This design cleverly utilizes the voice coil 132 as a coupling node for the force, avoiding the local stress concentration or diaphragm segmentation vibration that may result from the direct connection of the shape memory alloy module 140 to the diaphragm. At the same time, it can combine with the original vibration of the electromagnetic drive module 130 to achieve effective superposition of the driving force, so that the speaker 100 can achieve a deeper low-frequency extension by taking advantage of the displacement characteristics of the shape memory alloy module 140 while maintaining its original mid-high frequency performance.

[0035] The shape memory alloy module 140 can generate a driving force far greater than that of a traditional dynamic coil electromagnetic force with a very small cross-sectional area. Therefore, within a limited space, the shape memory alloy module 140 can drive the voice coil 132 and the diaphragm to produce a large amplitude vibration far exceeding the limit of a traditional dynamic coil by only the slight deformation of the module itself. This expands the low-frequency extension of the speaker 100 without increasing its size, effectively compensating for the sound pressure level attenuation of traditional dynamic units in the frequency range below 100 Hz. This allows even thinner and lighter electronic devices to output excellent deep bass, while avoiding the increase in power consumption and the risk of magnetic leakage caused by increasing the weight of the magnetic circuit, significantly improving the user experience.

[0036] Combination Figure 1 and Figure 2 As shown, in one possible embodiment, the basin frame 110 includes a basin frame body 111 and a fixing plate 112, with the fixing plate 112 and the diaphragm assembly 120 respectively fixed to both ends of the basin frame body 111.

[0037] The shape memory alloy module 140 is connected between the fixed plate 112 and the transmission component 150. One end of the magnetic component 131 is fixed to the transmission component 150, and an electrical connector 133 is provided between the other end of the magnetic component 131 and the voice coil 132. The voice coil 132 is electrically connected to an external power source through the electrical connector 133. The amplitude generated by the deformation of the shape memory alloy module 140 is transmitted to the voice coil 132 through the transmission component 150, the magnetic component 131 and the electrical connector 133.

[0038] The basin frame body 111 forms the main support frame. The fixing plate 112 is fixed to the end of the basin frame body 111 by means of snap-fit, welding or bonding. The fixing plate 112 and the diaphragm assembly 120 are located on both sides of the basin frame body 111, thereby jointly enclosing the internal space of the basin frame body 111. The fixing plate 112 not only plays a sealing role, but also provides a stable mounting anchor point for the shape memory alloy module 140.

[0039] In this embodiment, a transmission component 150 is added inside the frame body 111. One end of the shape memory alloy module 140 is connected to the fixed plate 112, and the other end is connected to the transmission component 150. This arrangement allows the shape memory alloy to pull the transmission component 150 to generate displacement when it contracts. The magnetic component 131 is typically a ring magnet or a magnetic steel assembly, with one end fixed to the transmission component 150. An electrical connector 133 is provided between the other end of the magnetic component 131 away from the transmission component 150 and the voice coil 132. The electrical connector 133 is the channel for the transmission of electrical signals in the voice coil 132. Current from the external power supply reaches the voice coil 132 through the electrical connector 133, completing the input of electrical energy. Electrical connector 133 also serves as a force transmission medium. When the shape memory alloy module 140 contracts due to heat, the driving force generated by the shape memory alloy module 140 is transmitted to the magnetic component 131 through the transmission component 150. Since the magnetic component 131 is fixedly connected to the transmission component 150, the slight displacement of the magnetic component 131 is further transmitted to the voice coil 132 through the electrical connector 133, and finally the voice coil 132 drives the diaphragm assembly 120 to vibrate. This step-by-step transmission mechanism through the transmission component 150, the magnetic component 131, and then the electrical connector 133 constructs a rigid force transmission chain, ensuring that the large thrust generated by the shape memory alloy module 140 can be efficiently converted into diaphragm vibration, giving the speaker 100 good low-frequency performance.

[0040] Combination Figure 1 , Figure 2 and Figure 4 As shown, in one possible embodiment, the electrical connector 133 includes a spring 134, or the electrical connector 133 includes a spring 134 and a flexible circuit board 135, with the flexible circuit board 135 attached to the surface of the spring 134.

[0041] One implementation of the electrical connector 133 includes a spring 134, which not only provides a stable restoring force for the voice coil 132 using its own elasticity, but also serves as a conductive path for transmitting audio current through its own conductivity.

[0042] The second form of the electrical connector 133 includes a spring 134 and a flexible circuit board 135. The spring 134 provides a stable reset force for the voice coil 132, and the flexible circuit board 135 is responsible for low-loss transmission of electrical signals. The flexible circuit board 135 is attached to the surface of the spring 134, and the two can be bonded together by adhesive bonding or hot pressing. Attaching the flexible circuit board 135 to the surface of the spring 134 effectively utilizes the rigidity of the spring 134 to support the flexible circuit board, preventing the flexible circuit board 135 from wrinkling or breaking when it reciprocates at high frequencies with the voice coil 132.

[0043] Combination Figure 5 , Figure 6 and Figure 7As shown, in one possible embodiment, the basin frame 110 includes a basin frame body 111 and a fixing plate 112, with the fixing plate 112 and the diaphragm assembly 120 respectively fixed to both ends of the basin frame body 111.

[0044] The transmission component 150 includes a rigid connection part 151 and a flexible connection part 152. The rigid connection part 151 is connected to the frame 110, and the flexible connection part 152 is connected between the voice coil 132 and the rigid connection part 151. The shape memory alloy module 140 is connected between the fixed plate 112 and the flexible connection part 152. The amplitude generated by the deformation of the shape memory alloy module 140 is transmitted to the voice coil 132 through the flexible connection part 152.

[0045] In this embodiment, the spring 134 between the magnetic component 131 and the voice coil 132 is eliminated. The transmission component 150 integrates a rigid connection portion 151 and a flexible connection portion 152. The rigid connection portion 151 is usually made of a material with good rigidity, such as a metal reinforcing plate or hard plastic. The outer edge of the rigid connection portion 151 is connected to the frame body 111. The flexible connection portion 152 is the inner ring part of the transmission component 150. The flexible connection portion 152 is connected between the voice coil 132 and the rigid connection portion 151. The flexible connection portion 152 is usually made of a material such as polyimide with good flexibility, thereby allowing the voice coil 132 to make a large axial displacement.

[0046] One end of the shape memory alloy module 140 is connected to the fixed plate 112, and the other end is directly connected to the flexible connector 152. This arrangement allows the contraction force of the shape memory alloy to act directly on the flexible connector 152. When the shape memory alloy module 140 is heated and undergoes contraction deformation, the tension generated by the shape memory alloy module 140 first pulls the flexible connector 152 to undergo elastic deformation. Since the flexible connector 152 is directly connected to the voice coil 132, this deformation force is directly transmitted to the voice coil 132 through the flexible connector 152, thereby driving the diaphragm assembly 120 to vibrate. Compared with the scheme of transmitting force through the magnetic component 131 and the spring 134, this scheme shortens the force transmission path, reduces energy loss during transmission, and the flexible connector 152 itself has lower stiffness and mass, enabling it to respond more sensitively to the drive of the shape memory alloy module 140, thereby achieving higher vibration conversion efficiency.

[0047] Combination Figure 5 , Figure 6 and Figure 7 As shown, in one possible embodiment, the flexible connection 152 includes a plurality of connection groups 153, the plurality of connection groups 153 being arranged circumferentially along the voice coil 132. Figure 1 (The arrow at point C points to) The connecting group 153 is distributed at intervals and includes at least two connecting ribs 154. The connecting ribs 154 have a multi-segment bending structure and are connected between the voice coil 132 and the rigid connecting part 151.

[0048] In this embodiment, the flexible connection 152 is not a solid ring, but is composed of multiple connection groups 153. These connection groups 153 are evenly distributed along the circumferential spacing of the voice coil 132. This distributed design helps to disperse the concentrated force applied by the shape memory alloy to multiple positions of the voice coil 132, thereby preventing the voice coil 132 from tilting or twisting due to uneven force and ensuring the concentricity of the voice coil 132 in the magnetic gap.

[0049] Each connection group 153 includes at least two connecting ribs 154. These connecting ribs 154 can be arranged in a meandering serpentine shape or a multi-segmented S-shape. One end of each connecting rib 154 is connected to the voice coil 132, and the other end is connected to the rigid connection part 151. The multi-segmented bending structure of the connecting ribs 154 provides high flexibility, allowing them to be easily stretched or compressed. This provides sufficient vibration stroke for the voice coil 132 and the diaphragm assembly 120, enabling the connecting ribs 154 to generate significant displacement in response to low-frequency signals. Furthermore, using at least two connecting ribs 154 to form a connection group 153 creates a redundant mechanical support structure. Even if one connecting rib 154 breaks due to fatigue or accident, the other can still provide some support, improving the product's yield and durability.

[0050] In one possible embodiment, the frequency of the input audio signal of the speaker 100 and the memory alloy module 140 satisfy the following relationship: when the frequency of the input audio signal of the speaker 100 is lower than a preset threshold, the memory alloy module 140 is powered on.

[0051] The shape memory alloy module 140 is configured to heat up only when the frequency of the input audio signal is below a preset threshold. For example, the preset threshold can be set between 100Hz and 200Hz, such as 150Hz. When the audio signal contains components with frequencies below the preset threshold, it means that a low-frequency signal is being played. Such signals typically require greater driving power and amplitude to achieve a satisfactory listening experience. Traditional electromagnetic drive modules often perform poorly in this frequency range due to insufficient stroke or excessive nonlinear distortion. At this time, the control unit detects the low-frequency signal and immediately supplies power to the shape memory alloy module 140. The large displacement characteristic of the shape memory alloy module 140 due to heating upon power application is used to drive the diaphragm assembly 120, compensating for the low-frequency shortcomings of the electromagnetic drive module 130.

[0052] When the frequency of the input audio signal exceeds a preset threshold, i.e., when playing mid-to-high frequency signals, the shape memory alloy module 140 remains de-energized and does not deform. This allows the faster electromagnetic drive module 130 to operate independently. This not only avoids the negative impact of the shape memory alloy's inertial hysteresis on mid-to-high frequency clarity but also significantly reduces the overall power consumption of the system. This crossover drive strategy achieves complementary advantages between the two drive sources, enabling the speaker 100 to exhibit superior performance across the entire frequency range.

[0053] Of course, the electromagnetic drive module 130 and the memory alloy module 140 can also be controlled to work simultaneously according to the frequency of the audio signal.

[0054] Combination Figure 1 , Figure 2 and Figure 8 As shown, in one possible embodiment, the shape memory alloy module 140 includes a plurality of shape memory alloy deformable elements 142, which are distributed circumferentially along the voice coil 132, and the shape memory alloy deformable elements 142 have a two-way shape memory effect.

[0055] The shape memory alloy module 140 includes multiple shape memory alloy deformable elements 142. Exemplarily, the shape memory alloy deformable elements 142 can be nitinol wires. These elements are uniformly distributed circumferentially along the voice coil 132. This circumferential array arrangement avoids tilting or polarization of the voice coil 132 caused by unilateral force, ensuring that the diaphragm assembly 120 always maintains a reasonable piston-like vibration mode. These shape memory alloy deformable elements 142 exhibit a two-way shape memory effect, a characteristic that distinguishes them from ordinary shape memory alloys. The shape memory alloy deformable elements 142 with this two-way effect can remember one shape (e.g., a contracted state) when heated and automatically return to another shape (e.g., an extended state) after cooling, without requiring external mechanical force for reset. In the loudspeaker 100 application, this means that when the audio current is interrupted and the shape memory alloy deformable elements 142 cool, they can automatically return to their initial length, preparing for the next heating and contraction, thus achieving reversible reciprocating drive. This self-resetting characteristic simplifies the structural design of the speaker 100, eliminating the need for auxiliary components such as the reset spring 134 required in traditional single-pass memory alloy applications, thus reducing the complexity and cost of the system.

[0056] By employing multiple shape memory alloy deformation elements 142 with two-way effect working in concert, the loudspeaker 100 can obtain continuous, stable and controllable large amplitude low-frequency output, overcoming the defect of insufficient driving force in the low-frequency band of traditional loudspeakers 100.

[0057] Combination Figure 1 , Figure 2 and Figure 8As shown, in one possible embodiment, the shape memory alloy module 140 includes multiple deformation groups 141, each deformation group 141 including multiple shape memory alloy deformation elements 142, which are uniformly distributed circumferentially along the voice coil 132. When the frequency of the input audio signal is lower than a preset threshold, the multiple shape memory alloy deformation elements 142 in the same deformation group 141 are simultaneously energized, and configured to either energize only a single deformation group 141 or energize multiple deformation groups 141 sequentially according to a preset timing sequence.

[0058] The shape memory alloy module 140 is divided into multiple deformation groups 141. Each deformation group 141 contains multiple shape memory alloy deformation elements 142 that are evenly distributed around the voice coil 132. In this embodiment, the overall operating frequency of the system is improved through the coordinated cooperation of multiple deformation groups 141.

[0059] When the frequency of the input audio signal is lower than a preset threshold, multiple shape memory alloy deformation elements 142 within the same deformation group 141 are simultaneously energized and heated. This intra-group synchronous drive ensures the symmetry of the force, keeping the voice coil 132 in a balanced driving state. Based on this, the system is configured with two operating modes: the first is to energize only a single deformation group 141. This mode is suitable for lower frequency audio signals, where the reciprocating frequency of a single deformation group 141 is sufficient to match the signal frequency, resulting in relatively low system power consumption. The second mode controls multiple deformation groups 141 to be energized sequentially according to a preset timing sequence. For example, when the target low-frequency frequency is 60Hz, the natural response frequency of a single deformation group 141 may not be achievable. In this case, six deformation groups 141 can be triggered sequentially at intervals of approximately 2.78 milliseconds. Through this time-division multiplexing, the diaphragm assembly 120 is continuously driven multiple times per unit time, thereby synthesizing high-frequency vibrations with frequencies much higher than those of a single shape memory alloy deformation element 142, effectively expanding the effective bandwidth of the shape memory alloy module 140.

[0060] like Figure 3 As shown, in one possible embodiment, the shape memory alloy module 140 further includes a thermally conductive insulating element 160, which covers the shape memory alloy deformable element 142.

[0061] A thermally conductive insulating component 160 covers the exterior of each shape memory alloy deformation component 142, forming a continuous protective barrier on the surface of the shape memory alloy deformation component 142. The shape memory alloy deformation component 142 carries an electrical potential when energized, while the speaker 100 contains numerous other conductive components, such as the leads of the voice coil 132 and the frame 110. The presence of the thermally conductive insulating component 160 effectively prevents electrical contact between the shape memory alloy deformation component 142 and these adjacent metal components, avoiding the risk of short circuits and ensuring the stable operation of the drive circuit.

[0062] The thermally conductive insulating component 160 is made of an insulating material with a high thermal conductivity, such as polyimide film, ceramic paper, or Teflon. The thermally conductive insulating component 160 not only provides electrical insulation but also rapidly conducts the Joule heat generated by the shape memory alloy deformation component 142 when energized to the surrounding air, preventing heat accumulation on the surface of the shape memory alloy deformation component 142. This is crucial for protecting the temperature-sensitive components inside the speaker 100. Furthermore, the thermally conductive insulating component 160 also provides physical protection for the shape memory alloy deformation component 142, preventing it from wearing down and breaking due to friction with surrounding components during repeated expansion and contraction movements. It also blocks moisture and corrosive gases from the environment from eroding the surface of the shape memory alloy deformation component 142, extending its service life.

[0063] In some possible embodiments, the thermally conductive insulator 160 may also be designed to have a specific color or reflectivity to help regulate the heat dissipation rate of the shape memory alloy, thereby fine-tuning the response frequency and dynamic characteristics of the shape memory alloy deformable element 142.

[0064] This application proposes a loudspeaker 100 that utilizes both SMA (Shape Memory Alloy) and electromagnetic dual-drive technology. Through a novel structural design, it overcomes performance bottlenecks caused by limitations in unit size and materials, improving the performance of the loudspeaker 100 within a small size. This solution employs a linked design, where the deformation of the shape memory alloy drives the dynamic coil unit to vibrate the diaphragm assembly 120 at a specific frequency, thereby propelling air to produce sound.

[0065] In the first embodiment, the dual drive consists of an inner electromagnetic drive module 130 and an outer shape memory alloy module 140. The inner electromagnetic drive module 130 includes a voice coil 132, a spring 134 (for conduction; the spring 134 may also have a flexible circuit board 135 on its surface), and a magnetic component 131. The edge of the diaphragm assembly 120 is connected to the frame 110, and the voice coil 132 is connected to the inner side of the diaphragm assembly 120. When the voice coil 132 is energized, it is driven by an Ampere force to produce sound. The outer shape memory alloy module 140 includes a shape memory alloy deformable component 142 (with a thermally conductive insulating component 160 attached to its outer side), a transmission component 150, and a fixing plate 112. The bottom of the shape memory alloy deformable component 142 is connected to the fixing plate 112, which may be conductive (or may have a circuit board attached for conductivity). The top of the shape memory alloy deformable part 142 is combined with the transmission part 150 (the transmission part 150 is a rigid plate), which can drive the electromagnetic drive module 130 to move as a whole, thereby driving the diaphragm assembly 120 to generate low-frequency signals.

[0066] The shape memory alloy deformation component 142 can be made of a metal with a two-way shape memory effect. The phase transformation temperature of the shape memory alloy deformation component 142 is slightly higher than the room temperature. The shape memory alloy deformation component 142 is martensite in its normal state. When the shape memory alloy deformation component 142 is heated by electricity, it triggers an austenitic phase transformation to generate a contraction force.

[0067] The shape memory alloy deformation element 142 adopts the shape of a spring. The shape memory alloy deformation element 142 is symmetrically arranged with respect to the voice coil 132 to ensure uniform force on the diaphragm assembly 120 and to ensure symmetry. The shape memory alloy deformation element 142 is covered with a thermally conductive insulating element 160. The material of the thermally conductive insulating element 160 is a heat-insulating organic film or ceramic paper, which can achieve electrical insulation and prevent short circuit between the shape memory alloy deformation element 142 and adjacent metal parts. The thermally conductive insulating element 160 can also conduct heat, conducting away the heat generated by the shape memory alloy deformation element 142 when it is energized, and preventing heat accumulation from affecting the internal components of the terminal.

[0068] When the audio signal contains low-frequency components (below 100Hz), the shape memory alloy deformation element 142 heats up upon the application of an electrical signal, triggering a martensitic phase transformation and causing contraction displacement. This contraction force is transmitted to the electromagnetic drive module 130, thereby applying an inward (or outward) driving force to the diaphragm assembly 120. The shape memory alloy module 140 vibrates in coordination with the driving force of the electromagnetic drive module 130, causing the diaphragm assembly 120 to produce a larger amplitude and achieve low-frequency extension. Because the frequency of a single shape memory alloy deformation element 142 is limited, the drive circuit adopts a time-division multiplexing strategy, allowing multiple sets of deformation groups 141 to be used in combination to control the overall frequency. Taking the control of 10Hz by a single shape memory alloy deformation element 142 as an example, considering symmetry, four shape memory alloy deformation elements 142 are set as a group. When controlling 60Hz, at least six sets of deformation groups 141 are required, with a total period T = 1 / 60 ≈ 16.67ms and a trigger interval of ≈ 2.78ms per group.

[0069] In the second implementation, the vibration system quality in implementation one may be limited. Compared to implementation one, this implementation eliminates the spring 134 and replaces the transmission component 150 with a flexible connecting part 152. The edge of the transmission component 150 is a rigid connecting part 151, which is connected to the inner side of the frame 110. The inner area of ​​the transmission component 150 is a flexible connecting part 152, which is connected to the voice coil 132. The shape memory alloy module 140 is fixed on the flexible connecting part 152, and the stroke of the flexible connecting part 152 needs to be greater than the stroke of the shape memory alloy deformable part 142. Under normal conditions, the voice coil 132 is energized, driving the diaphragm assembly 120 to vibrate, and the flexible connecting part 152 acts as a balancer for the voice coil 132. When the low-frequency component reaches a set value, the shape memory alloy deformable part 142 is heated and deformed, and the flexible connecting part 152 is subjected to tension, causing the voice coil 132 to move.

[0070] In the embodiments of this application, an electronic device is proposed, which includes the speaker in any of the above embodiments and can achieve the same technical effect, which will not be described again here.

[0071] For example, the electronic device can be a mobile phone, tablet computer, or smart wearable device.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0073] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A loudspeaker, characterized in that, include: Sink stand; A diaphragm assembly is connected to one side of the frame; An electromagnetic drive module includes a magnetic component and a voice coil. The voice coil is connected to the diaphragm assembly. When the voice coil is energized, a magnetic force is generated between the voice coil and the magnetic component, causing the voice coil to drive the diaphragm assembly to vibrate. A shape memory alloy module is connected to the basin frame, the shape memory alloy module being configured to deform upon heating when energized; A transmission component is connected to the memory alloy module, and the memory alloy module drives the voice coil to vibrate through the transmission component, so that the voice coil drives the diaphragm assembly to vibrate.

2. The loudspeaker according to claim 1, characterized in that, The basin frame includes a basin frame body and a fixing plate, wherein the fixing plate and the diaphragm assembly are respectively fixed to both ends of the basin frame body; The shape memory alloy module is connected between the fixed plate and the transmission component. One end of the magnetic component is fixed to the transmission component, and an electrical connector is provided between the other end of the magnetic component and the voice coil. The voice coil is electrically connected to an external power source through the electrical connector. The amplitude generated by the deformation of the shape memory alloy module is transmitted to the voice coil through the transmission component, the magnetic component, and the electrical connector.

3. The loudspeaker according to claim 2, characterized in that, The electrical connector includes a spring, or the electrical connector includes a spring and a flexible circuit board, the flexible circuit board being attached to the surface of the spring.

4. The loudspeaker according to claim 1, characterized in that, The basin frame includes a basin frame body and a fixing plate, wherein the fixing plate and the diaphragm assembly are respectively fixed to both ends of the basin frame body; The transmission component includes a rigid connection part and a flexible connection part. The rigid connection part is connected to the frame, and the flexible connection part is connected between the voice coil and the rigid connection part. The shape memory alloy module is connected between the fixed plate and the flexible connection part. The amplitude generated by the deformation of the shape memory alloy module is transmitted to the voice coil through the flexible connection part.

5. The loudspeaker according to claim 4, characterized in that, The flexible connection includes multiple connection groups, which are distributed circumferentially along the voice coil. Each connection group includes at least two connecting ribs, which have a multi-segment bending structure and are connected between the voice coil and the rigid connection.

6. The loudspeaker according to any one of claims 1 to 5, characterized in that, The frequency of the input audio signal of the speaker and the memory alloy module satisfy the following relationship: when the frequency of the input audio signal of the speaker is lower than a preset threshold, the memory alloy module is powered on.

7. The loudspeaker according to claim 6, characterized in that, The shape memory alloy module includes multiple shape memory alloy deformation elements, which are distributed circumferentially along the voice coil, and the shape memory alloy deformation elements have a two-way shape memory effect.

8. The loudspeaker according to claim 7, characterized in that, The shape memory alloy module includes multiple deformation groups, each deformation group includes multiple shape memory alloy deformation elements, and the multiple shape memory alloy deformation elements in the deformation group are evenly distributed along the circumference of the voice coil. When the frequency of the input audio signal is lower than the preset threshold, multiple shape memory alloy deformation elements in the same deformation group are simultaneously energized, and are configured to either energize only a single deformation group or energize multiple deformation groups sequentially according to a preset timing sequence.

9. The loudspeaker according to claim 7, characterized in that, The shape memory alloy module also includes a thermally conductive insulating component, which covers the shape memory alloy deformation component.

10. An electronic device, characterized in that, include: The loudspeaker as claimed in any one of claims 1 to 9.

Images