Flexible circuit board and display module

Abstract

The application provides a flexible circuit board and a display module. The flexible circuit board comprises a body, the body comprises a first body, a second body and a third body connected with each other, the first body comprises a first end and a second end, the second body comprises a third end and a fourth end, and the third body comprises a fifth end and a sixth end. The third end of the second body is connected with the first end of the first body, the fifth end of the third body is connected with the first end of the first body, and the third body is located on one side of the first body or one side of the second body. The body of the flexible circuit board comprises a substrate layer, a wiring layer and a protective layer, the wiring layer is located on one side of the substrate layer, and the protective layer is located on the side of the wiring layer away from the substrate layer. The sixth end of the third body is provided with a golden finger, and the fourth end of the second body is provided with a grounding contact point. The signal wiring in the wiring layer is connected with the golden finger, and the grounding wiring in the wiring layer is connected with the grounding contact point. The flexible circuit board has increased flexibility of bonding and can adapt to different bonding scenes.

Description

Technical Field

[0001] This application relates to the field of display module manufacturing, and more specifically, to a flexible circuit board and a display module. Background Technology

[0002] Flexible printed circuit boards (FPCs) are printed circuit boards with circuit connection functions made of flexible substrates. They can be bent, folded, or rolled up and are widely used in the display module manufacturing industry. However, the bonding methods of flexible circuit boards currently on the market are limited. Summary of the Invention

[0003] In order to overcome the technical problems mentioned in the above technical background, this application provides a flexible circuit board and a display module.

[0004] In a first aspect, this application provides a flexible circuit board, the flexible circuit board including a body, the body including a first body, a second body and a third body connected to each other, the first body including a first end and a second end, the second body including a third end and a fourth end, and the third body including a fifth end and a sixth end;

[0005] The third end of the second body is connected to the first end of the first body, and the fifth end of the third body is connected to the first end of the first body, wherein the third body is located on one side of the first body or on one side of the second body.

[0006] The body of the flexible circuit board includes:

[0007] Substrate layer;

[0008] A trace layer is located on one side of the substrate layer, wherein the trace layer includes signal traces and ground traces;

[0009] A protective layer is located on the side of the trace layer away from the substrate layer;

[0010] The sixth end of the third body is provided with a gold finger, and the fourth end of the second body is provided with a ground contact. The signal traces in the trace layer are connected to the gold finger, and the ground traces in the trace layer are connected to the ground contact.

[0011] In one possible embodiment of this application, the third body is located on one side of the first body, the gold finger is located on the side of the third body away from the first body, the third body can be bent toward the second body, wherein, after the third body is bent, at least a portion of the third body is located on the first side of the second body, and the grounding contact is located on the second body on the second side opposite to the first side.

[0012] In one possible embodiment of this application, the third body is located on one side of the second body, the gold finger is located on the side of the third body facing the second body, and the grounding contact is located on the side of the second body away from the third body;

[0013] Preferably, the second body extends away from the first body relative to the third body.

[0014] In one possible embodiment of this application, the signal traces are distributed in the first body and the third body, and the signal traces are electrically connected to the gold fingers;

[0015] The grounding trace includes a first grounding trace and a second grounding trace. The first grounding trace is distributed in the first body and the third body, and the second grounding trace is distributed in the second body and the third body. The first grounding trace and the second grounding trace are respectively connected to the grounding contact.

[0016] A second aspect of this application provides a display module, the display module comprising:

[0017] A flexible screen body, the flexible screen body including a display area, a bending area and a bonding area, the bending area connecting the display area and the bonding area, the flexible screen body including a first side and a second side opposite to each other, the flexible screen body corresponding to the bonding area bending towards the first side of the flexible screen body through the bending area and bending to the first side of the flexible screen body corresponding to the display area, the bonding area including a bonding electrode.

[0018] A flexible circuit board is located on the backlight side of the flexible screen. The flexible circuit board includes a body, which includes a first body, a second body, and a third body connected to each other. The first body includes a first end and a second end, the second body includes a third end and a fourth end, and the third body includes a fifth end and a sixth end. The third end of the second body is connected to the first end of the first body, and the fifth end of the third body is connected to the first end of the first body. The third body is located on one side of the first body or on one side of the second body. The body of the flexible circuit board includes: a substrate layer; a wiring layer located on one side of the substrate layer, wherein the wiring layer includes signal wiring and ground wiring; and a protective layer located on the side of the wiring layer away from the substrate layer.

[0019] The sixth end of the third body is provided with a gold finger, and the fourth end of the second body is provided with a ground contact. The signal traces in the trace layer are connected to the gold finger, and the ground traces in the trace layer are connected to the ground contact.

[0020] The gold fingers on the third body are bonded to the bonding electrode, and the second body is located between the flexible screen corresponding to the bonding area and the flexible screen corresponding to the display area near the bending area.

[0021] In one possible embodiment of this application, the display module further includes:

[0022] The first support film layer is located on the backlight side of the flexible screen and is in contact with the flexible screen.

[0023] The composite tape layer is located on the side of the first support film layer away from the flexible screen.

[0024] The flexible circuit board is located on the side of the composite tape layer away from the flexible screen body, wherein the grounding contact is located on the side of the second body facing the composite tape layer, and the grounding contact is in contact with the composite tape layer.

[0025] In one possible embodiment of this application, the display module further includes:

[0026] The second support film layer is located between the second body and the flexible screen corresponding to the bonding area;

[0027] Preferably, the display module further includes a driver chip, which is located on the second side of the flexible screen corresponding to the bonding area;

[0028] Preferably, the bonding electrode is located on the second side of the flexible screen corresponding to the bonding area.

[0029] In one possible embodiment of this application, the display module further includes:

[0030] A polarizer is located on the second side of the flexible screen corresponding to the display area;

[0031] An optical adhesive layer is located on the side of the polarizer away from the flexible screen.

[0032] The cover plate is located on the side of the optical adhesive layer away from the flexible screen.

[0033] In one possible embodiment of this application, the third body is located on one side of the first body, the gold finger is located on the side of the third body away from the first body, the third body is bent toward the second body, and in the bent state, the gold finger on the third body is bonded to the bonding electrode of the bonding area.

[0034] In one possible embodiment of this application, the third body is located on one side of the second body, the gold finger is located on the side of the third body facing the second body, and the gold finger on the third body is bonded to the bonding electrode of the bonding area.

[0035] This application provides a flexible circuit board and a display module. The flexible circuit board includes a body, which includes a first body, a second body, and a third body connected to each other. The first body includes a first end and a second end, the second body includes a third end and a fourth end, and the third body includes a fifth end and a sixth end. The third end of the second body is connected to the first end of the first body, and the fifth end of the third body is connected to the first end of the first body. The third body is located on one side of the first body or on one side of the second body. The body of the flexible circuit board includes a substrate layer, a wiring layer, and a protective layer. The wiring layer is located on one side of the substrate layer, and the protective layer is located on the side of the wiring layer away from the substrate layer. A gold finger is provided on the sixth end of the third body, and a ground contact is provided on the fourth end of the second body. The signal traces in the wiring layer are connected to the gold finger, and the ground traces in the wiring layer are connected to the ground contact. Thus, the first, second, and third bodies of the aforementioned flexible circuit board form a layered structure. The gold fingers of the flexible circuit board are located on the third body, and the grounding contacts are located on the second body. In other words, the grounding contacts and gold fingers of the flexible circuit board are located on different layers of the flexible circuit board body. When using the flexible circuit board for bonding, flexible bonding can be performed according to actual needs, increasing the bonding flexibility and adapting to different bonding scenarios. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is one of the schematic diagrams of a flexible circuit board provided in this embodiment;

[0038] Figure 2 This is a second schematic diagram of a flexible circuit board provided in this embodiment;

[0039] Figure 3 A comparison diagram of the flexible circuit board provided for related technologies and the flexible circuit board provided in this embodiment;

[0040] Figure 4 This is one of the schematic diagrams of a display module provided in this embodiment;

[0041] Figure 5 This is a second schematic diagram of a display module provided in this embodiment;

[0042] Figure 6 A schematic diagram of a display module provided for related technologies.

[0043] Icons: 1-Flexible circuit board, 2-Display module, 10-First body, 20-Second body, 21-Grounding contact, 30-Third body, 31-Gold finger, 40-Flexible screen, 50-First support film layer, 60-Composite tape layer, 70-Second support film layer, 80-Driver chip, 90-Polarizer, 100-Optical adhesive layer, 110-Cover plate. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0045] In the description of this application, it should be noted that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0046] Through research, the inventors discovered that the design of the flexible circuit board 1 currently on the market has limitations. Specifically, the grounding contact 21 or gold finger 31 used to connect signals in the flexible circuit board 1 are all located at the same end of the flexible circuit board 1. When using the flexible circuit board 1 for bonding, the wiring method in the flexible circuit board 1 is fixed, which leads to a single bonding method for the flexible circuit board 1.

[0047] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solution, the specific implementation of which will be described in detail below with reference to the accompanying drawings.

[0048] It should be noted that the defects in the solutions in the prior art are all the result of the inventors’ practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by the embodiments of this application in the following text should be the inventors’ contributions to this application in the process of invention and creation, and should not be understood as technical content known to those skilled in the art.

[0049] Please refer to Figure 1 and Figure 2 , Figure 1 This is one of the schematic diagrams of a flexible circuit board 1 provided in this embodiment. Figure 2 This is a second schematic diagram of a flexible circuit board 1 provided in this embodiment. The flexible circuit board 1 includes a body, which includes a first body 10, a second body 20, and a third body 30 connected to each other. The first body 10 includes a first end and a second end, the second body 20 includes a third end and a fourth end, and the third body 30 includes a fifth end and a sixth end. The third end of the second body 20 is connected to the first end of the first body 10, and the fifth end of the third body 30 is connected to the first end of the first body 10. The third body 30 is located on one side of the first body 10 or on one side of the second body 20. In this embodiment, the first body 10 and the second body 20 extend in the same direction. In a cross-section perpendicular to the extending directions of the first body 10 and the second body 20, the thickness of the first body 10 can be the same as the thickness of the second body 20, or the thickness of the first body 10 can be greater than the thickness of the second body 20, or the thickness of the first body 10 can be less than the thickness of the second body 20.

[0050] It is worth noting that the specific thicknesses of the first body 10 and the second body 20 are not specifically limited here and need to be set according to the actual situation. The first body 10, the second body 20 and the third body 30, which are interconnected by the flexible circuit board 1, are integrally formed. The connected flexible circuit board 1 can be used as a complete product in the manufacturing process of the display module 2.

[0051] The flexible circuit board 1 in this embodiment includes a substrate layer, a wiring layer, and a protective layer. The wiring layer is located on one side of the substrate layer and includes signal traces and ground traces. The protective layer is located on the side of the wiring layer away from the substrate layer. The substrate layer, wiring layer, and protective layer of the flexible circuit board 1 are typically stacked. The substrate layer, as the basic support structure of the flexible circuit board 1, is usually made of a material with good flexibility and insulation. The signal traces in the wiring layer are used to transmit various signals, and the ground traces are used to provide ground signals. The main function of the protective layer is to protect the substrate layer and wiring layer. On the one hand, it prevents the substrate layer and wiring layer from external mechanical damage; on the other hand, it prevents corrosion from various chemicals in the operating environment, thereby extending the service life of the flexible circuit board 1 and ensuring its stable operation. In addition, the protective layer usually also has a certain electromagnetic shielding function, which can effectively reduce the impact of external electromagnetic interference on the signal traces.

[0052] Please refer to this again. Figure 1 and Figure 2In this embodiment, the sixth end of the third body 30 is provided with a gold finger 31, and the fourth end of the second body 20 is provided with a ground contact 21. The gold finger 31 serves as the electrical connection interface between the flexible circuit board 1 and other modules (such as the flexible screen 40), and its surface is plated with a conductive layer, which is usually a gold layer, to ensure good electrical connectivity. The signal traces in the wiring layer are connected to the gold finger 31 to ensure that the signals of the flexible circuit board 1 are transmitted through the gold finger 31, and the ground traces in the wiring layer are connected to the ground contact 21.

[0053] In this embodiment, the first body 10, the second body 20, and the third body 30 of the flexible circuit board 1 form a layered structure. Gold fingers 31 are disposed on the third body 30, and grounding contacts 21 are disposed on the second body 20. The third body 30 extends relative to the plane containing the first body 10 and the second body 20. That is, the grounding contacts 21 and gold fingers 31 of the flexible circuit board 1 are respectively disposed on bodies of different layers of the flexible circuit board 1. Thus, when bonding using the flexible circuit board 1, flexible bonding can be performed according to actual needs, increasing the bonding flexibility of the flexible circuit board 1 and enabling it to adapt to different bonding scenarios.

[0054] In one embodiment of this example, please refer to Figure 1 The third body 30 is located on one side of the first body 10, and the gold finger 31 is located on the side of the third body 30 away from the first body 10. The third body 30 can be bent toward the second body 20. After the third body 30 is bent, at least part of the third body 30 is located on the first side of the second body 20, and the grounding contact 21 is located on the second side of the second body 20 opposite to the first side.

[0055] In this embodiment, the third body 30 can be divided into a first connecting part body and a first bonding part body connected to the first connecting part body. The first connecting part body is connected to the third end of the second body 20, and an angle is formed between the first connecting part body and the first body 10. For example, this angle is an acute angle. The gold fingers 31 are located on the side of the first bonding part body away from the first body 10. The extension direction of the first bonding part body is the same as the extension direction of the first body 10 and the second body 20, and the gold fingers 31 on the first bonding part body are disposed on the surface of the flexible circuit board 1, simplifying the manufacturing process of the flexible circuit board 1. The gold fingers 31 on the first bonding part body can be bent towards the second body 20 through the first connecting part body. At this time, the gold fingers 31 and the ground contact 21 are located on different levels of the flexible circuit board 1 body, increasing the bonding flexibility.

[0056] In this embodiment, after the third body 30 is bent, at least a portion of the third body 30 is located on the first side of the second body 20, that is, either a portion of the third body 30 or all of the third body 30 is located on the first side of the second body 20. In this case, if a portion of the third body 30 is located on the first side of the second body 20, the second body 20 extends relative to the third body 30. Please refer to... Figure 3 , Figure 3 A comparison diagram of the flexible circuit board 1 provided for related technologies and the flexible circuit board 1 provided in this embodiment. Figure 3 The first schematic diagram from top to bottom shows the flexible circuit board 1 provided in the related art, and the second schematic diagram shows the flexible circuit board 1 provided in this embodiment. Figure 3 As shown, the flexible circuit board 1 in this embodiment is longer than the flexible circuit board 1 in related technologies. The extended part can replace the design of the shim block in the manufacturing process of the display module 2, which simplifies the manufacturing process of the display module 2 and reduces the production cost.

[0057] In another embodiment of this example, please refer to Figure 2 The third body 30 is located on one side of the second body 20, and the gold finger 31 is located on the side of the third body 30 facing the second body 20. The grounding contact 21 is located on the side of the second body 20 away from the third body 30.

[0058] In this embodiment, the third body 30 can be divided into a second connecting part body and a second bonding part body connected to the second connecting part body. The second connecting part is connected to the third end of the second body 20, and an angle is formed between the second connecting part body and the second body 20. For example, this angle is an acute angle. The gold finger 31 is located on the side of the second bonding part body facing the second body 20. The extension direction of the second bonding part body is the same as the extension direction of the first body 10 and the second body 20. At this time, the gold finger 31 on the first bonding part body is disposed on the inner side of the flexible circuit board 1. In this embodiment, the gold finger 31 and the ground contact 21 are also located on different layers of the flexible circuit board 1 body, which can increase the flexibility of the bonding method.

[0059] Furthermore, in this embodiment, the second body 20 extends away from the first body 10 relative to the third body 30. The length of the flexible circuit board 1 in the prior art is typically the sum of the length of the first body 10 and a portion of the length of the third body 30 in this embodiment. However, the length of the flexible circuit board 1 in this embodiment is greater than that of existing flexible circuit boards. Therefore, during the fabrication of the display module 2, the extended length of the flexible circuit board 1 in this embodiment can replace the design of the shim block 3, simplifying the fabrication process of the display module 2 and reducing manufacturing costs. Simultaneously, the extended portion of the third body 30 relative to the first body 10 provides a larger installation area for the grounding contact 21, ensuring stable grounding of the flexible circuit board 1.

[0060] Further, please refer to Figure 1 and Figure 2 In this embodiment, the signal traces are distributed in the first body 10 and the third body 30, and are electrically connected to the gold fingers 31. The signal traces serve as signal transmission channels in the flexible circuit board 1, allowing signals from the flexible circuit board 1 to be transmitted to other modules (e.g., the flexible screen 40) via the gold fingers 31, thus achieving information interaction and collaborative operation. If the flexible circuit board 1 is connected to the flexible screen 40 in the display module 2, the flexible circuit board 1 can transmit signals from the driver chip 80 to the flexible screen 40, enabling the flexible screen 40 to display normally.

[0061] The grounding traces in this embodiment include a first grounding trace and a second grounding trace. The first grounding trace is distributed in the first body 10 and the third body 30, and the second grounding trace is distributed in the second body 20 and the third body 30. The first and second grounding traces are respectively connected to the grounding contact 21. The first and second grounding traces help to shield electromagnetic interference (e.g., electrostatic discharge) and improve the stability and accuracy of signal transmission. If the flexible circuit board 1 is connected to the flexible screen 40 in the display module 2, the arrangement of the first and second grounding traces helps to avoid display abnormalities and information misjudgment caused by external electromagnetic interference to the flexible screen 40.

[0062] Based on the same inventive concept, this embodiment also provides a display module 2, please refer to... Figure 4 and Figure 5 , Figure 4 This is one of the schematic diagrams of a display module 2 provided in this embodiment. Figure 5This is a second schematic diagram of a display module 2 provided in this embodiment. The display module 2 includes a flexible screen 40 and a flexible circuit board 1. The flexible screen 40 includes a display area A1, a bending area A2, and a bonding area A3. The bending area A2 is connected between the display area A1 and the bonding area A3. The flexible screen 40 includes a first side and a second side opposite to each other. The flexible screen 40 corresponding to the bonding area A3 is bent towards the first side of the flexible screen 40 through the bending area A2 and then bent to the first side of the flexible screen 40 corresponding to the display area A1. The bonding area A3 includes a bonding electrode (not shown in the figure).

[0063] In this embodiment, the flexible screen 40, as a key component of the display module 2, directly undertakes the image display function. The flexible screen 40 corresponding to display area A1 typically includes a large number of pixel units. These pixel units emit light upon receiving a driving signal, thereby displaying images or text information on the light-emitting side of the flexible screen 40. In the flexible screen 40 corresponding to display area A1, the emission of light from different pixel units can be controlled by signals input from the flexible circuit board 1 (signals from the driver chip 80). The flexible screen 40 corresponding to bending area A2 has flexibility and bendability to ensure that the display effect of the flexible screen 40 corresponding to display area A1 is not affected during bending. The bonding electrodes of the flexible screen 40 corresponding to bonding area A3 achieve electrical connection between the flexible screen 40 and the flexible circuit board 1 or other modules (e.g., driver chip 80).

[0064] The flexible circuit board 1 provided in this embodiment is disposed on the backlight side of the flexible screen 40. The first side of the flexible screen 40 is the backlight side, and the second side is the light-emitting side. The flexible circuit board 1 includes a body, which includes a first body 10, a second body 20, and a third body 30 connected to each other. The first body 10 includes a first end and a second end, the second body 20 includes a third end and a fourth end, and the third body 30 includes a fifth end and a sixth end. The third end of the second body 20 is connected to the first end of the first body 10, and the fifth end of the third body 30 is connected to the first end of the first body 10. The third body 30 is located on one side of the first body 10 or on one side of the second body 20. The body of the flexible circuit board 1 includes a substrate layer, a wiring layer, and a protective layer. The wiring layer is located on one side of the substrate layer and includes signal wiring and ground wiring. The protective layer is located on the side of the wiring layer away from the substrate layer.

[0065] In this embodiment, the substrate layer of the flexible circuit board 1 serves as the basic support structure of the flexible circuit board 1. The signal traces in the wiring layer are used to transmit the signals of the flexible circuit board 1 to the flexible screen 40. The grounding traces are used to provide grounding signals. The protective layer is used to protect the substrate layer and wiring layer of the flexible circuit board 1. On the one hand, it can prevent the substrate layer and wiring layer from being damaged by external mechanical forces. On the other hand, it can prevent the corrosion of various chemical substances in the usage environment, thereby extending the service life of the flexible circuit board 1, ensuring the stable operation of the flexible circuit board 1, and thus ensuring the product quality of the display module 2.

[0066] The sixth end of the third body 30 is provided with a gold finger 31, and the fourth end of the second body 20 is provided with a ground contact 21. Signal traces in the wiring layer are connected to the gold finger 31, and ground traces in the wiring layer are connected to the ground contact 21. The gold finger 31 on the third body 30 is bonded to the bonding electrode. The second body 20 is located between the flexible screen 40 corresponding to the bonding area A3 and the flexible screen 40 corresponding to the display area A1 near the bending area A2. The bonding electrode of the flexible screen 40 corresponding to the bonding area A3 is bent towards the first side of the flexible screen 40 through the bending area A2 and then bent to the first side of the flexible screen 40 corresponding to the display area A1, where it is electrically connected to the gold finger 31 of the flexible circuit board 1.

[0067] In this embodiment, the gold finger 31 serves as the electrical connection interface between the flexible circuit board 1 and the flexible screen 40. Its surface is plated with a conductive layer, which is typically a gold layer, to ensure good electrical connectivity. The signal traces in the wiring layer are connected to the gold finger 31 to ensure that the signals from the flexible circuit board 1 are transmitted to the flexible screen 40 via the gold finger 31. The grounding traces in the wiring layer are connected to the grounding contact 21.

[0068] In related technologies, please refer to Figure 6 , Figure 6 This is a schematic diagram of the display module 2 provided for related technologies. The traditional flexible circuit board 1 has a "long strip" structure, with the gold fingers located at one end, and the grounding contact on the same side as the gold fingers. To ensure the bending radius of the flexible screen 40 corresponding to the bonding area A3 when it bends towards the first side of the flexible screen 40 through the bending area A2, it is usually necessary to add a shim block 3 to support the flexible screen 40 corresponding to the bonding area A3, such as... Figure 6 As shown, the shim 3 is positioned below the flexible screen 40 corresponding to the bonding area A3. However, this method requires the separate fabrication of the flexible circuit board 1 and the shim 3, which not only increases the complexity of the process but also raises the manufacturing cost of the display module 2. Alternatively, in related technologies, the shim 3 can be replaced by directly increasing the length of the flexible circuit board 1; however, this method requires bonding electrodes to be placed on both opposite sides of the flexible screen 40 corresponding to the bonding area A3, significantly increasing the complexity of the process.

[0069] Compared to the related technologies mentioned above, please refer to Figure 4 and Figure 5 In this embodiment, the flexible circuit board 1 adopts a layered structure design, placing the gold fingers 31 and grounding contacts 21 at different levels of the flexible circuit board 1, increasing the bonding flexibility. When the flexible circuit board 1 is applied to the manufacturing process of the display module 2, the second body 20 of the flexible circuit board 1 can support the flexible screen 40 corresponding to the bent area A2 after bending, and the gold fingers 31 of the third body 30 of the flexible circuit board 1 can be bonded to the bonding electrodes, realizing the electrical connection between the flexible screen 40 and the flexible circuit board 1. Therefore, the second body 20 of the flexible circuit board 1 in this embodiment can not only replace the shim block 3 to provide support, but also simultaneously achieve electrical connection with the flexible screen 40, greatly reducing the complexity of the process and the manufacturing cost.

[0070] Further, please refer to Figure 4 and Figure 5 The display module 2 in this embodiment further includes a first support film layer 50 and a composite tape layer 60. The first support film layer 50 is located on the backlight side of the flexible screen 40 and is in contact with the flexible screen 40. The composite tape layer 60 is located on the side of the first support film layer 50 away from the flexible screen 40. The flexible circuit board 1 is located on the side of the composite tape layer 60 away from the flexible screen 40. The grounding contact 21 is located on the side of the second body 20 facing the composite tape layer 60 and is in contact with the composite tape layer 60. The first support film layer 50 and the composite tape layer 60 are stacked on the backlight side of the flexible screen 40. The first support film layer 50 provides support and protection for the flexible screen 40, enhancing the overall stability and durability of the display module 2. One side of the composite tape layer 60 is adhered to the first support film layer 50, and the other side is adhered to the flexible circuit board 1. The grounding contact 21 of the flexible circuit board 1 is connected to the grounding point of the composite tape layer 60. The grounding contact 21 and the grounding point are typically made of copper. The grounding contact 21 is usually formed using a design with exposed copper.

[0071] In existing technologies, the grounding contact 21 or gold finger 31 of the flexible circuit board 1 occupies a certain space when formed by etching. Traditionally, the main body area (i.e., the non-bonding area) of the flexible circuit board 1 requires a separate design for the grounding contact 21, and the grounding contact 21 and the gold finger 31 are designed on the same side of the flexible circuit board 1. This method occupies the usable space of the main body area of ​​the flexible circuit board 1. However, in this embodiment, the main body area (i.e., the first body 10 area) of the flexible circuit board 1 does not need to form the grounding contact 21 by etching. The grounding contact 21 is designed on the second body 20, and the gold finger 31 is designed on the third body 30, which greatly saves the usable space of the main body area of ​​the flexible circuit board 1.

[0072] It is worth noting that the first support film layer 50 can be made of polyimide (PI) film or acrylic polymer film, etc. Polyimide (PI) film has excellent heat resistance, mechanical strength, and flexibility, providing good support and protection for the flexible screen 40, while also possessing good electrical insulation properties, thus not interfering with the electrical performance of the display module 2. Acrylic polymer film has good optical properties, flexibility, and adhesion, allowing it to adhere tightly to the flexible screen 40, providing support and fixation, and effectively transferring stress, reducing the impact on the flexible screen 40 during bending.

[0073] The composite tape layer 60 can be made of acrylic double-sided tape, polyester double-sided tape, or polyurethane double-sided tape, etc.

[0074] Further, please refer to Figure 4 and Figure 5 The display module 2 in this embodiment also includes a second support film layer 70, which is located between the second body 20 and the flexible screen 40 corresponding to the bonding area A3. The length of the second support film layer 70 is less than the length of the first support film layer 50. The second support film layer 70 and the second body 20 of the flexible circuit board 1 provide support and protection for the flexible screen 40 corresponding to the bonding area A3. In the display module 2, the flexible screen 40 corresponding to the bonding area A3 is a key area for electrical connection between the flexible screen 40 and the flexible circuit board 1 or other modules (e.g., driver chip 80). The second support film layer 70 can effectively reduce the stress on the flexible screen 40 corresponding to the bonding area A3, reduce the risk of damage to the flexible screen 40 corresponding to the bonding area A3, thereby improving the reliability and durability of the display module 2 and extending its service life.

[0075] Furthermore, please refer to again Figure 4 and Figure 5 The display module 2 in this embodiment also includes a driver chip 80, which is located on the second side of the flexible screen 40 corresponding to the bonding area A3. The orthographic projection of the driver chip 80 on the display module 2 does not overlap with the orthographic projection of the gold fingers 31 of the third body 30 of the flexible circuit board 1 on the display module 2. The driver chip 80 is responsible for receiving display signals from the external control circuit, processing and converting them, and then transmitting them to the flexible screen 40 through the flexible circuit board 1 to control the corresponding pixel units, thereby realizing the display of images or text on the flexible screen 40.

[0076] For example, the driver chip 80 can control the on / off state and brightness of each pixel unit on the flexible screen 40, thereby achieving accurate image display on the flexible screen 40. For example, the driver chip 80 can also control the on / off sequence of pixels on the flexible screen 40 according to the refresh rate and resolution of the display module 2, ensuring synchronous updating and dynamic display of images on the flexible screen 40.

[0077] Preferably, the bonding electrode is located on the second side of the flexible screen 40 corresponding to the bonding area A3. The gold fingers 31 on the third body 30 of the flexible circuit board 1 and the driving chip 80 are electrically connected to the bonding electrode on the second side of the flexible screen 40 corresponding to the bonding area A3, thereby realizing electrical interaction and information transmission between the flexible circuit board 1, the driving chip 80 and the flexible screen 40.

[0078] Furthermore, please refer to again Figure 4 and Figure 5 The display module 2 in this embodiment also includes a polarizer 90, an optical adhesive layer 100, and a cover plate 110. The polarizer 90 is located on the second side of the flexible screen 40 corresponding to the display area A1, the optical adhesive layer 100 is located on the side of the polarizer 90 away from the flexible screen 40, and the cover plate 110 is located on the side of the optical adhesive layer 100 away from the flexible screen 40. The polarizer 90, the optical adhesive layer 100, and the cover plate 110 are stacked on the light-emitting side opposite to the backlight side of the flexible screen 40.

[0079] The polarizer 90 in the display module 2 filters out light from non-specific directions, allowing only light from specific directions to pass through, thus improving the clarity and contrast of the flexible screen 40. Simultaneously, the polarizer 90 reduces ambient light reflected from the light-emitting side of the flexible screen 40. Furthermore, the polarizer 90 controls the polarization direction of light, optimizing the optical performance of the display module 2 and ensuring the uniformity of color and brightness of the image displayed on the flexible screen 40. The polarizer 90 is typically made of polyvinyl alcohol (PVA) and cellulose triacetate (TAC).

[0080] The optical clear adhesive layer 100 (OCA) effectively transmits light in the display module 2, exhibiting excellent transparency and optical properties. Furthermore, the OCA typically possesses good flexibility and durability, maintaining stable adhesion under varying temperature and humidity conditions, thus extending the lifespan of the display module 2. The OCA is usually made of acrylic or silicone-based materials, which possess good optical transparency and mechanical properties.

[0081] The cover glass 110 (CG) primarily provides physical protection for the display module 2, preventing scratches, impacts, and damage from the external environment. The cover glass 110 typically possesses high transparency and good optical properties, further enhancing the display effect of the flexible screen 40. For example, the cover glass 110 can increase light transmittance and reduce light reflection. The cover glass 110 (CG) is usually made of high-strength glass or plastic, materials with good impact resistance and optical properties.

[0082] In one embodiment of this example, please refer to Figure 4 When the third body 30 of the flexible circuit board 1 is located on one side of the first body 10, and the gold finger 31 is located on the side of the third body 30 away from the first body 10, the third body 30 of the flexible circuit board 1 is bent toward the second body 20, so that the gold finger 31 on the third body 30 is bonded to the bonding electrode of the bonding area A3, thereby realizing the electrical connection between the flexible circuit board 1 and the flexible screen 40.

[0083] Specifically, in the manufacturing process of display module 2, firstly, a flexible screen body 40 is provided. The flexible screen body 40 includes a display area A1, a bending area A2, and a bonding area A3. The bending area A2 is connected between the display area A1 and the bonding area A3. The flexible screen body 40 includes a first side and a second side opposite to each other. The bonding area A3 includes a bonding electrode.

[0084] Next, a polarizer 90 is provided and attached to the second side of the flexible screen 40 corresponding to the display area A1.

[0085] Next, a driver chip 80 is provided, and the driver chip 80 is bonded to the bonding electrode on the second side of the flexible screen body 40 corresponding to the bonding area A3.

[0086] Then, an optical adhesive layer 100 and a cover plate 110 are provided. The optical adhesive layer 100 is attached to the side of the polarizer 90 away from the flexible screen 40, and the cover plate 110 is attached to the side of the optical adhesive layer 100 away from the flexible screen 40.

[0087] Next, a first support film layer 50 and a composite tape layer 60 are provided. The first support film layer 50 is attached to the backlight side of the flexible screen body 40, and the composite tape layer 60 is attached to the side of the first support film layer 50 away from the flexible screen body 40.

[0088] Finally, a flexible circuit board 1 as described above is provided. The flexible circuit board 1 is attached to the side of the composite tape layer 60 away from the flexible screen body 40. The grounding contact 21 of the flexible circuit board 1 is electrically connected to the composite tape layer 60. The third body 30 of the flexible circuit board 1 is bent toward the second body 20. At the same time, the flexible screen body 40 corresponding to the bonding area A3 is bent toward the first side of the flexible screen body 40 through the bending area A2 and bent to the first side of the flexible screen body 40 corresponding to the display area A1. The gold fingers 31 of the third body 30 are bonded to the bonding electrodes on the flexible screen body 40 corresponding to the bonding area A3.

[0089] In another embodiment of this example, please refer to Figure 5 When the third body 30 is located on one side of the second body 20, the gold finger 31 is located on the side of the third body 30 facing the second body 20, so that the gold finger 31 on the third body 30 is directly bonded to the bonding electrode on the flexible screen 40 corresponding to the bonding area A3, thereby realizing the electrical connection between the flexible circuit board 1 and the flexible screen 40.

[0090] In summary, the flexible circuit board and display module provided in this embodiment include a body, which comprises a first body, a second body, and a third body interconnected with each other. The first body includes a first end and a second end, the second body includes a third end and a fourth end, and the third body includes a fifth end and a sixth end. The third end of the second body is connected to the first end of the first body, and the fifth end of the third body is connected to the first end of the first body. The third body is located on one side of the first body or on one side of the second body. The body of the flexible circuit board includes a substrate layer, a wiring layer, and a protective layer. The wiring layer is located on one side of the substrate layer, and the protective layer is located on the side of the wiring layer away from the substrate layer. A gold finger is provided on the sixth end of the third body, and a ground contact is provided on the fourth end of the second body. Signal traces in the wiring layer are connected to the gold finger, and ground traces in the wiring layer are connected to the ground contact. Thus, the first, second, and third bodies of the aforementioned flexible circuit board form a layered structure. The gold fingers of the flexible circuit board are located on the third body, and the grounding contacts are located on the second body. In other words, the grounding contacts and gold fingers of the flexible circuit board are located on different layers of the flexible circuit board body. When using the flexible circuit board for bonding, flexible bonding can be performed according to actual needs, increasing the bonding flexibility and adapting to different bonding scenarios.

[0091] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A flexible circuit board, characterized in that, The flexible circuit board includes a body, which includes a first body, a second body, and a third body that are connected to each other. The first body includes a first end and a second end, the second body includes a third end and a fourth end, and the third body includes a fifth end and a sixth end. The third end of the second body is connected to the first end of the first body, and the fifth end of the third body is connected to the first end of the first body, wherein the third body is located on one side of the first body or on one side of the second body. The body of the flexible circuit board includes: Substrate layer; A trace layer is located on one side of the substrate layer, wherein the trace layer includes signal traces and ground traces; A protective layer is located on the side of the trace layer away from the substrate layer; The sixth end of the third body is provided with a gold finger, and the fourth end of the second body is provided with a ground contact. The signal traces in the trace layer are connected to the gold finger, and the ground traces in the trace layer are connected to the ground contact.

2. The flexible circuit board as described in claim 1, characterized in that, The third body is located on one side of the first body, the gold finger is located on the side of the third body away from the first body, the third body can be bent toward the second body, wherein, after the third body is bent, at least part of the third body is located on the first side of the second body, and the grounding contact is located on the second body on the second side opposite to the first side.

3. The flexible circuit board as described in claim 1, characterized in that, The third body is located on one side of the second body, the gold finger is located on the side of the third body facing the second body, and the grounding contact is located on the side of the second body away from the third body; Preferably, the second body extends away from the first body relative to the third body.

4. The flexible circuit board as described in claim 1, characterized in that, The signal traces are distributed in the first body and the third body, and the signal traces are electrically connected to the gold fingers. The grounding trace includes a first grounding trace and a second grounding trace. The first grounding trace is distributed in the first body and the third body, and the second grounding trace is distributed in the second body and the third body. The first grounding trace and the second grounding trace are respectively connected to the grounding contact.

5. A display module, characterized in that, The display module includes: A flexible screen body, the flexible screen body including a display area, a bending area and a bonding area, the bending area connecting the display area and the bonding area, the flexible screen body including a first side and a second side opposite to each other, the flexible screen body corresponding to the bonding area bending towards the first side of the flexible screen body through the bending area and bending to the first side of the flexible screen body corresponding to the display area, the bonding area including a bonding electrode. A flexible circuit board is located on the backlight side of the flexible screen. The flexible circuit board includes a body, which includes a first body, a second body, and a third body connected to each other. The first body includes a first end and a second end, the second body includes a third end and a fourth end, and the third body includes a fifth end and a sixth end. The third end of the second body is connected to the first end of the first body, and the fifth end of the third body is connected to the first end of the first body. The third body is located on one side of the first body or on one side of the second body. The body of the flexible circuit board includes: a substrate layer; a wiring layer located on one side of the substrate layer, wherein the wiring layer includes signal wiring and ground wiring; and a protective layer located on the side of the wiring layer away from the substrate layer. The sixth end of the third body is provided with a gold finger, and the fourth end of the second body is provided with a ground contact. The signal traces in the trace layer are connected to the gold finger, and the ground traces in the trace layer are connected to the ground contact. The gold fingers on the third body are bonded to the bonding electrode, and the second body is located between the flexible screen corresponding to the bonding area and the flexible screen corresponding to the display area near the bending area.

6. The display module as described in claim 5, characterized in that, The display module also includes: The first support film layer is located on the backlight side of the flexible screen and is in contact with the flexible screen. The composite tape layer is located on the side of the first support film layer away from the flexible screen. The flexible circuit board is located on the side of the composite tape layer away from the flexible screen body, wherein the grounding contact is located on the side of the second body facing the composite tape layer, and the grounding contact is in contact with the composite tape layer.

7. The display module as described in claim 6, characterized in that, The display module also includes: The second support film layer is located between the second body and the flexible screen corresponding to the bonding area; Preferably, the display module further includes a driver chip, which is located on the second side of the flexible screen corresponding to the bonding area; Preferably, the bonding electrode is located on the second side of the flexible screen corresponding to the bonding area.

8. The display module as described in claim 5, characterized in that, The display module also includes: A polarizer is located on the second side of the flexible screen corresponding to the display area; An optical adhesive layer is located on the side of the polarizer away from the flexible screen. The cover plate is located on the side of the optical adhesive layer away from the flexible screen.

9. The display module as described in any one of claims 5-8, characterized in that, The third body is located on one side of the first body, and the gold finger is located on the side of the third body away from the first body. The third body is bent toward the second body. In the bent state, the gold finger on the third body is bonded to the bonding electrode of the bonding area.

10. The display module as described in any one of claims 5-8, characterized in that, The third body is located on one side of the second body, and the gold finger is located on the side of the third body facing the second body. The gold finger on the third body is bonded to the bonding electrode of the bonding area.

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