Adapter plate, circuit board assembly and manufacturing method of circuit board assembly

Abstract

The application relates to the technical field of printed circuit boards, and discloses an adapter plate, a circuit board assembly and a manufacturing method of the circuit board assembly. The adapter plate comprises a main body part, a first branch part and a second branch part. The first branch part and the second branch part are convex to the main body part along a first direction and are connected with the main body part. The first branch part and the second branch part are arranged at intervals along a second direction. The second direction is perpendicular to the first direction. At least one of the first branch part and the second branch part is provided with a connecting pad. The adapter plate further comprises a reinforcing part. The reinforcing part is located on the side of the first branch part away from the main body part. The first branch part and the second branch part are connected with the reinforcing part. The adapter plate, the circuit board assembly and the manufacturing method of the circuit board assembly provided by the application are used to solve the problem that the connecting pad of the adapter plate is prone to warping deformation in the process of aligning and welding the connecting pad of the adapter plate with a bearing pad of a main board.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to an adapter board, a circuit board assembly, and a method for manufacturing the circuit board assembly. Background Technology

[0002] In recent years, flexible printed circuit boards (FPCs) have been widely used in new energy batteries. These FPCs are relatively large and require the soldering of electronic components. For example, since new energy batteries generate heat during use, their temperature changes are measured by the change in resistance of the NTC (Negative Temperature Coefficient). Currently, the NTC is directly soldered onto an adapter board made of a flexible circuit board. One end of the adapter board is soldered to the NTC, and the other end is designed to connect to a pad and be directly soldered to the carrier pad (PAD) on the main board of the new energy battery. If the NTC malfunctions, the pads soldered between the adapter board and the main board can be melted and removed for replacement.

[0003] In related technologies, during the process of connecting the adapter board to the motherboard's carrier pads, the connecting pads are prone to warping and deformation, which in turn prevents the connecting pads from fitting smoothly and evenly with the motherboard's carrier pads. Summary of the Invention

[0004] This application provides an adapter board, a circuit board assembly, and a method for manufacturing the circuit board assembly, which solves the problem in the prior art where the connecting pads of the adapter board are prone to warping and deformation during the alignment and soldering process of the connecting pads of the adapter board and the bearing pads of the motherboard.

[0005] In a first aspect, embodiments of this application provide an adapter board, the adapter board including a main body, a first branch and a second branch, the first branch and the second branch both protruding from the main body along a first direction and both connected to the main body, the first branch and the second branch being spaced apart along a second direction, the second direction being perpendicular to the first direction, at least one of the first branch and the second branch being provided with a connection pad; the adapter board further includes a reinforcing portion, the reinforcing portion being located on the side of the first branch away from the main body, the first branch and the second branch both being connected to the reinforcing portion.

[0006] In some embodiments, the reinforcing portion is provided with positioning holes, which are spaced apart from the connecting pads.

[0007] In some embodiments, multiple positioning holes are provided, and the multiple positioning holes are distributed at intervals.

[0008] In some embodiments, the connecting pads are provided with through holes on both sides in the second direction, and the connecting pads define a portion of the inner wall of the through holes.

[0009] In some embodiments, the first branch is provided with the connecting pad, and a first slot is formed between the first branch and the second branch. The first slot is corresponding to the connecting pad provided on the first branch and is connected to the corresponding through hole; and / or, the reinforcing part is provided with a second slot, the second slot penetrates the reinforcing part, and the second slot is corresponding to the connecting pad provided on the second branch and is connected to the corresponding through hole.

[0010] In some embodiments, both the first branch and the second branch are provided with the connecting pads, and the connecting pads provided in the first branch protrude from or are recessed from the connecting pads provided in the second branch along the first direction.

[0011] Secondly, embodiments of this application provide a circuit board assembly, the circuit board assembly comprising: The adapter board as described in the first aspect; The motherboard has a carrier pad, which is soldered to the connecting pad.

[0012] Thirdly, embodiments of this application provide a method for manufacturing a circuit board assembly, including: An adapter board and a motherboard are provided. The adapter board includes a main body, a first branch, and a second branch. Both the first branch and the second branch protrude from the main body along a first direction and are connected to the main body. The first branch and the second branch are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch and the second branch is provided with a connection pad. The adapter board also includes a reinforcing portion located on the side of the first branch away from the main body. Both the first branch and the second branch are connected to the reinforcing portion. The motherboard is provided with a support pad. The carrier pad is soldered to the connecting pad.

[0013] In some embodiments, the motherboard is provided with stop holes, the reinforcing part is provided with positioning holes, and the positioning holes are spaced apart from the connecting pads; the step of soldering the carrier pads to the connecting pads specifically includes: A fixture is provided, wherein the fixture is provided with positioning posts; The motherboard is placed on the fixture, and the positioning post passes through the stop hole, with solder provided on the bearing pad; The adapter board is placed on the motherboard, with the solder located between the connecting pad and the bearing pad, and the positioning post passing through the positioning hole. A cover plate is pressed onto the adapter plate, and the cover plate is provided with a clearance hole, which exposes the area where the connection pad is located; The solder is heated by a laser through the clearance hole, so that the carrier pad and the connecting pad are welded together by the solder.

[0014] In some embodiments, the connecting pads are provided with through holes on both sides in the second direction, and the connecting pads define a portion of the inner wall of the through holes; when the solder is heated by a laser through the relief hole, so that the carrier pad and the connecting pad are welded together by the solder, a portion of the solder flows into the through holes.

[0015] The adapter board provided in this application has the following advantages: Since the adapter board includes a main body, a first branch, and a second branch, both the first branch and the second branch protrude from the main body along a first direction and are connected to the main body, the first branch and the second branch are spaced apart along a second direction, the second direction being perpendicular to the first direction, at least one of the first branch and the second branch is provided with a connecting pad, and the adapter board also includes a reinforcing part, the reinforcing part being located on the side of the first branch away from the main body, both the first branch and the second branch being connected to the reinforcing part, the overall structural rigidity of the first branch and the second branch can be improved by the reinforcing part, avoiding the problem of easy warping and deformation of the connecting pad due to deformation of the first branch and / or the second branch, and enabling the connecting pad to fit flatly and closely with the bearing pad on the motherboard, resulting in a better welding effect.

[0016] The advantages of the circuit board assembly and the method for manufacturing the circuit board assembly provided in this application compared with the prior art can be found in the description of the advantages of the adapter board provided in this application compared with the prior art, which will not be repeated here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the circuit board assembly in one embodiment of this application; Figure 2 yes Figure 1A magnified view of a section at point A in the middle; Figure 3 yes Figure 2 A schematic diagram of the adapter board in the circuit board assembly shown; Figure 4 yes Figure 3 A magnified view of a section at point B in the middle; Figure 5 This is a flowchart of a method for manufacturing a circuit board assembly in one embodiment of this application; Figure 6 This is a schematic diagram of the circuit board assembly, fixture, and cover plate in one embodiment of this application.

[0019] The markings in the diagram mean: 10. Adapter board; 101. Connecting pad; 1011. Through hole; 102. First slot; 103. Second slot; 11. Main body; 12. First branch; 13. Second branch; 14. Reinforcing part; 141. Positioning hole; 20. Motherboard; 201, Support pad; 21, Stop hole; 30. Fixtures; 31. Positioning post; 40. Cover plate; 41. Alternating hole. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0024] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0025] Please refer to Figures 1 to 4 This application provides an adapter board 10, which includes a main body 11, a first branch 12, and a second branch 13. The first branch 12 and the second branch 13 both protrude from the main body 11 along a first direction and are both connected to the main body 11. The first branch 12 and the second branch 13 are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch 12 and the second branch 13 is provided with a connecting pad 101.

[0026] The main body 11, the first branch 12, and the second branch 13 can be integrally formed, and electronic components such as NTCs can be connected to the main body 11. The first direction can be... Figure 3 and Figure 4 The direction indicated by the middle arrow M, the second direction can be... Figure 3 and Figure 4 The direction indicated by the middle arrow N. The connecting pad 101 may be provided at the end of the first branch 12 and / or the end of the second branch 13, or it may be provided at other locations in the first branch 12 and / or the second branch 13.

[0027] The adapter plate 10 also includes a reinforcing part 14, which is located on the side of the first branch 12 away from the main body 11. Both the first branch 12 and the second branch 13 are connected to the reinforcing part 14.

[0028] The main body 11, the first branch 12, the second branch 13 and the reinforcing part 14 can be integrally formed.

[0029] It should be noted that if the reinforcing part 14 is not provided, since the first branch 12 and the second branch 13 both protrude from the main body 11 along the first direction to form a cantilever structure, the overall structural rigidity is relatively weak. Regardless of whether the connecting pad 101 is provided in the first branch 12 or the second branch 13, at least two sides of the connecting pad 101 are suspended. When the connecting pad 101 is provided at the end of the first branch 12 and / or the end of the second branch 13, the connecting pad 101 is only connected to one side of the circuit of the main body 11, and three sides of the connecting pad 101 are suspended. Therefore, the connecting pad 101 is prone to warping and deformation during subsequent soldering.

[0030] The adapter plate 10 provided in this embodiment forms an extended structure by setting a reinforcing part 14, which is equivalent to extending the support structure for the connecting pad 101, improving the overall structural rigidity of the first branch 12 and the second branch 13, and enabling better support and fixation of the connecting pad 101. This fundamentally improves the problem of warping and uneven fit of the connecting pad 101 under stress, providing a structural foundation for high-quality welding.

[0031] The adapter board 10 provided in this application embodiment includes a main body 11, a first branch 12, and a second branch 13. Both the first branch 12 and the second branch 13 protrude from the main body 11 along a first direction and are connected to the main body 11. The first branch 12 and the second branch 13 are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch 12 and the second branch 13 is provided with a connecting pad 101. The adapter board 10 also includes a reinforcing part 14, which is located on the side of the first branch 12 away from the main body 11. Both the first branch 12 and the second branch 13 are connected to the reinforcing part 14. Therefore, the overall structural rigidity of the first branch 12 and the second branch 13 can be improved by the reinforcing part 14, avoiding the problem of easy warping and deformation of the connecting pad 101 due to deformation of the first branch 12 and / or the second branch 13. This allows the connecting pad 101 to fit flatly and closely with the bearing pad 201 on the motherboard 20, resulting in better soldering effect.

[0032] The length of the reinforcing part 14 along the first direction can be 2.5mm-15mm to ensure that the reinforcing part 14 itself has high strength, thereby improving the overall structural rigidity of the first branch 12 and the second branch 13 through the reinforcing part 14.

[0033] The reinforcing part 14 is rectangular in shape. The first and last ends of the reinforcing part 14 are connected to the ends of the first branch 12 and the second branch 13, respectively, to connect the connecting pads 101 at the ends of the first branch 12 and the second branch 13 in series. The reinforcing part 14 may not retain the circuit layer (such as copper layer) on the substrate. The total thickness here is 0.145±0.05mm. The other two sides of the connecting pads 101 are flush with the shape of the main body 11. The reinforcing part 14 does not change the area of ​​the connecting pads 101.

[0034] Please refer to Figures 1 to 5 This application embodiment also provides a circuit board assembly, which includes an adapter board and a main board 20 as described above. The main board 20 is provided with a carrier pad 201, which is soldered to a connecting pad 101.

[0035] The method for manufacturing a circuit board assembly provided in this application includes: S100: An adapter board 10 and a main board 20 are provided. The adapter board 10 includes a main body 11, a first branch 12 and a second branch 13. The first branch 12 and the second branch 13 both protrude from the main body 11 along a first direction and are both connected to the main body 11. The first branch 12 and the second branch 13 are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch 12 and the second branch 13 is provided with a connecting pad 101. The adapter board 10 also includes a reinforcing part 14. The reinforcing part 14 is located on the side of the first branch 12 away from the main body 11. The first branch 12 and the second branch 13 are both connected to the reinforcing part 14. The main board 20 is provided with a bearing pad 201.

[0036] Both the adapter board 10 and the main board 20 can be flexible circuit boards, and an NTC can be installed on the adapter board 10.

[0037] S200: Solder the carrier pad 201 to the connecting pad 101.

[0038] The carrier pad 201 and the connecting pad 101 can be welded together by laser welding.

[0039] The circuit board assembly and its manufacturing method provided in this application embodiment are as follows: the adapter plate 10 includes a main body 11, a first branch 12, and a second branch 13. Both the first branch 12 and the second branch 13 protrude from the main body 11 along a first direction and are connected to it. The first branch 12 and the second branch 13 are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch 12 and the second branch 13 is provided with a connecting pad 101. The adapter plate 10 also includes a reinforcing portion 14. Located on the side of the first branch 12 away from the main body 11, both the first branch 12 and the second branch 13 are connected to the reinforcing part 14. Therefore, when the carrier pad 201 is soldered to the connecting pad 101, the overall structural rigidity of the first branch 12 and the second branch 13 can be improved by the reinforcing part 14, avoiding the problem of easy warping and deformation of the connecting pad 101 due to the deformation of the first branch 12 and / or the second branch 13. This allows the connecting pad 101 to fit flatly and closely with the carrier pad 201 on the motherboard 20, resulting in a better soldering effect.

[0040] Multiple connecting pads 101 and multiple carrier pads 201 can be set, and the connecting pads 101 and the carrier pads 201 are set in a one-to-one correspondence.

[0041] This configuration ensures a tight connection between the adapter board 10 and the main board 20, while also meeting electrical conductivity requirements.

[0042] Please refer to Figures 1 to 6 In some embodiments, the reinforcing part 14 is provided with positioning holes 141, which are spaced apart from the connecting pads 101.

[0043] By adopting the above scheme, the reinforcing part 14 can be positioned through the positioning hole 141, thereby positioning the entire adapter plate 10, which facilitates the control of the positional accuracy of the connecting pad 101 and facilitates subsequent welding operations.

[0044] For example, the distance between the positioning hole 141 and the connecting pad 101 is greater than 2 mm.

[0045] This design prevents the positioning hole 141 from affecting the strength of the connecting pad 101.

[0046] Optionally, multiple positioning holes 141 are provided, and the multiple positioning holes 141 are distributed at intervals.

[0047] With this configuration, the reinforcing part 14 can be better positioned through the positioning hole 141, thereby positioning the entire adapter plate 10. This facilitates control over the positional accuracy of the connecting pad 101, prevents the adapter plate 10 from shifting or misaligning during subsequent welding, avoids defects such as cold welding and incomplete welding from the process end, and significantly improves the precision of laser welding and assembly consistency.

[0048] For example, two positioning holes 141 with a diameter of 1.0 mm can be symmetrically opened.

[0049] As an implementable method, the motherboard 20 is provided with a stop hole 21, and the reinforcing part 14 is provided with a positioning hole 141, the positioning holes 141 and the connecting pads 101 being spaced apart; the carrier pads 201 and the connecting pads 101 are soldered together, specifically including: First, a fixture 30 is provided, which is provided with a positioning post 31.

[0050] Next, the motherboard 20 is placed on the fixture 30, and the positioning pin 31 is inserted through the stop hole 21, and solder is provided on the bearing pad 201.

[0051] The solder can be a tin-based solder, such as solder paste, solder wire or solder balls, or other solders.

[0052] Next, the adapter board 10 is placed on the motherboard 20, with the solder positioned between the connecting pad 101 and the carrying pad 201, and the positioning pin 31 passing through the positioning hole 141.

[0053] The adapter plate 10 can be installed on the feeding box as required. The placement equipment can be adjusted to automatically pick up the adapter plate 10, rotate in the correct direction and identify the optical point reference of the adapter plate 10, and accurately fit the adapter plate 10 onto the positioning post 31 of the fixture 30.

[0054] Then, a cover plate 40 is pressed onto the adapter plate 10. The cover plate 40 is provided with a clearance hole 41, which exposes the area where the connecting pad 101 is located.

[0055] The cover plate 40 can press the reinforcing portion 14, the first branch portion 12, and the second branch portion 13 together to prevent the reinforcing portion 14, the first branch portion 12, and the second branch portion 13 from moving or wrinkling, thereby better controlling the positional accuracy of the connecting pad 101. After the cover plate 40 is pressed onto the adapter plate 10, the connecting pad 101 and the carrier pad 201 can be brought into contact.

[0056] Finally, the solder is heated by a laser through the clearance hole 41, so that the carrier pad 201 and the connecting pad 101 are welded together by the solder.

[0057] Among them, the carrier pad 201 and the connecting pad 101 can be welded together by laser welding.

[0058] By adopting the above solution, the positioning pins 31 can be inserted through the stop holes 21 and 141 to prevent the reinforcing part 14 from warping, shifting, or deforming. This achieves precise positioning and fixation of the connecting pad 101 of the adapter plate 10 and the bearing pad 201 of the main board 20 during the welding process, effectively avoiding problems such as offset, loosening, and misalignment of the adapter plate 10 during welding. It also reduces the likelihood of welding defects such as cold welding, incomplete welding, and poor fit, significantly improving welding accuracy and assembly reliability without affecting overall production yield and operational stability. At the same time, the cover plate 40 assists in constraining the deformation of the connecting pad 101, preventing warping and deformation of the connecting pad 101.

[0059] It should be noted that after the solder is heated by the laser through the relief hole 41, so that the carrier pad 201 and the connecting pad 101 are soldered together, the soldering condition of the connecting pad 101 and the carrier pad 201 can be checked first to see if the contact is good or if the soldering is poor. Then, the soldered connecting pad 101 is wrapped with glue to protect it from the influence of the external environment. Then, special equipment is used for testing to confirm that it meets the quality requirements.

[0060] It is understood that the circuit board assembly manufacturing method provided in this application systematically solves core problems such as soldering warpage, poor fit, and uneven tinning of the connecting pads 101 through the structural optimization of the adapter board 10 and the synergistic effect of the assembly fixture 30. This significantly reduces the risk of soldering process, effectively improves soldering yield, assembly reliability and mass production stability, and adapts to the modular, low-cost and standardized industry production needs while ensuring performance.

[0061] For example, the adapter board 10 can be manufactured through processes such as cutting the substrate FCCL (Flexible Copper Clad Laminate), circuit fabrication, applying cover film, drilling, surface treatment, testing, die cutting, SMT (Surface Mount Technology) for soldering NTC devices, applying reinforcement, dispensing, testing, die cutting, and packaging for later use.

[0062] Optionally, the connecting pad 101 has through holes 1011 on both sides in the second direction, and the connecting pad 101 defines a portion of the inner wall of the through hole 1011.

[0063] In this process, when the solder is heated by a laser through the clearance hole 41, and the carrier pad 201 and the connecting pad 101 are welded together by the solder, some of the solder flows into the through hole 1011.

[0064] This configuration allows the through-hole 1011 to form a solder climbing channel, enabling solder to be evenly applied to both sides of the connecting pad 101 during the welding process, improving the fullness of the weld and the consistency of the connection, and optimizing the laser welding forming effect.

[0065] For example, when the solder is tin-based, the through holes 1011 connecting both sides of the solder pad 101 can form a tin-climbing channel structure to achieve uniform tin application on both sides of the solder pad 101 during the soldering process.

[0066] It should be noted that the through hole 1011 can be a semi-circular hole or an elliptical hole, etc.

[0067] As an implementable method, the first branch 12 is provided with a connecting pad 101, and a first slot 102 is formed between the first branch 12 and the second branch 13. The first slot 102 is correspondingly provided with the connecting pad 101 provided in the first branch 12 and is connected to the corresponding through hole 1011.

[0068] This configuration allows the first slot 102 and the through hole 1011 to form a solder climbing channel, enabling the solder to be evenly applied to both sides of the connecting pad 101 during the welding process, improving the fullness of the weld and the consistency of the connection, and further optimizing the laser welding forming effect.

[0069] As an implementable method, and / or, the reinforcing part 14 is provided with a second slot 103, the second slot 103 penetrates the reinforcing part 14, the second slot 103 is correspondingly provided with the connecting pad 101 provided in the second branch part 13 and is connected to the corresponding through hole 1011.

[0070] This configuration allows the second slot 103 and the through hole 1011 to form a solder climbing channel, enabling the solder to be evenly applied to both sides of the connecting pad 101 during the welding process, improving the fullness of the weld and the consistency of the connection, and further optimizing the laser welding forming effect.

[0071] Optionally, both the first branch 12 and the second branch 13 are provided with connecting pads 101, and the connecting pads 101 provided in the first branch 12 are convex or concave to the connecting pads 101 provided in the second branch 13 along the first direction.

[0072] This configuration allows the connecting pads 101 on the first branch 12 and the connecting pads 101 on the second branch 13 to be staggered in the first direction. This prevents stress concentration when the connecting pads 101 on the first branch 12 and the connecting pads 101 on the second branch 13 are soldered together with different carrier pads 201 on the motherboard 20. The connecting pads 101 and the corresponding carrier pads 201 are less likely to separate when the motherboard 20 or the adapter board 10 is bent.

[0073] It should be noted that both the first slot 102 and the second slot 103 can be set as elliptical slots.

[0074] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An adapter board, characterized in that, The adapter plate includes a main body, a first branch, and a second branch. Both the first branch and the second branch protrude from the main body along a first direction and are connected to the main body. The first branch and the second branch are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch and the second branch is provided with a connection pad. The adapter plate also includes a reinforcing portion located on the side of the first branch away from the main body. Both the first branch and the second branch are connected to the reinforcing portion.

2. The adapter board according to claim 1, characterized in that, The reinforcing part is provided with positioning holes, which are spaced apart from the connecting pads.

3. The adapter plate according to claim 2, characterized in that, Multiple positioning holes are provided, and the multiple positioning holes are distributed at intervals.

4. The adapter plate according to any one of claims 1 to 3, characterized in that, The connecting pad has through holes on both sides in the second direction, and the connecting pad defines part of the inner wall of the through hole.

5. The adapter board according to claim 4, characterized in that, The first branch is provided with the connecting pad, and a first slot is formed between the first branch and the second branch. The first slot is corresponding to the connecting pad provided in the first branch and is connected to the corresponding through hole; and / or, the reinforcing part is provided with a second slot, the second slot penetrates the reinforcing part, and the second slot is corresponding to the connecting pad provided in the second branch and is connected to the corresponding through hole.

6. The adapter plate according to any one of claims 1 to 3, characterized in that, Both the first branch and the second branch are provided with the connecting pads, and the connecting pads provided in the first branch are convex or concave to the connecting pads provided in the second branch along the first direction.

7. A circuit board assembly, characterized in that, The circuit board assembly includes: The adapter board as described in any one of claims 1 to 6; The motherboard has a carrier pad, which is soldered to the connecting pad.

8. A method for manufacturing a circuit board assembly, characterized in that, include: An adapter board and a motherboard are provided. The adapter board includes a main body, a first branch, and a second branch. Both the first branch and the second branch protrude from the main body along a first direction and are connected to the main body. The first branch and the second branch are spaced apart along a second direction, which is perpendicular to the first direction. At least one of the first branch and the second branch is provided with a connection pad. The adapter board also includes a reinforcing portion located on the side of the first branch away from the main body. Both the first branch and the second branch are connected to the reinforcing portion. The motherboard is provided with a support pad. The carrier pad is soldered to the connecting pad.

9. The method for manufacturing a circuit board assembly according to claim 8, characterized in that, The motherboard is provided with stop holes, and the reinforcing part is provided with positioning holes, the positioning holes being spaced apart from the connecting pads; the step of soldering the carrier pads to the connecting pads specifically includes: A fixture is provided, wherein the fixture is provided with positioning posts; The motherboard is placed on the fixture, and the positioning post passes through the stop hole, with solder provided on the bearing pad; The adapter board is placed on the motherboard, with the solder located between the connecting pad and the bearing pad, and the positioning post passing through the positioning hole. A cover plate is pressed onto the adapter plate, and the cover plate is provided with a clearance hole, which exposes the area where the connection pad is located; The solder is heated by a laser through the clearance hole, so that the carrier pad and the connecting pad are welded together by the solder.

10. The method for manufacturing a circuit board assembly according to claim 9, characterized in that, The connecting pad has through holes on both sides in the second direction, and the connecting pad defines part of the inner wall of the through hole; when the solder is heated by a laser through the relief hole, so that the carrier pad and the connecting pad are welded together by the solder, part of the solder flows into the through hole.

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