A cleaning device for circuit board processing and a control method thereof

Abstract

The application discloses a kind of for circuit board processing cleaning device and control method thereof, belong to circuit board processing auxiliary equipment technical field, including closed cleaning bin, from top to bottom in bin is sequentially arranged cleaning unit, placement unit and dust collection unit;Cleaning unit is driven brush by lifting assembly and X / Y direction translation component to realize full coverage cleaning of circuit board surface, placement unit uses vacuum adsorption platform to fix workpiece, cooperates with inclined transition connecting piece and edge encircling dust suction hole to avoid structural gap dust, dust collection unit uses inverted taper negative pressure dust suction bin and pull-out type collection bin to realize dust efficient collection.Its control method includes feeding fixation, height adaptation, plane cleaning, negative pressure dust collection and discharging steps, and single-sided or double-sided cleaning can be completed in a closed environment.The application can inhibit dust overflow, clean without dead angle, collect dust completely, can be connected to continuous production line, improve cleaning efficiency and job safety.

Description

Technical Field

[0001] This invention relates to the field of auxiliary equipment for circuit board processing, and in particular to a cleaning device for circuit board processing and its control method. Background Technology

[0002] As the core carrier of electronic components, the circuit board (PCB) undergoes multiple processes including drilling, etching, and soldering. During these processes, processing dust, metal shavings, and excess solder residue can easily remain on the PCB surface. If these residues are not cleaned in time, they will directly affect the processing accuracy of subsequent coating and soldering processes, and in severe cases, may cause quality defects such as short circuits and reduced insulation performance.

[0003] Current circuit board cleaning methods mostly rely on manual handheld brushes and vacuum cleaners, resulting in low cleaning efficiency and poor cleaning uniformity. Furthermore, dust easily spreads into the workshop environment during cleaning, harming the respiratory health of operators and causing secondary pollution. Many automated cleaning devices have open structures, leading to poor dust collection and accumulation of dust at platform edges and seams, making thorough cleaning difficult. Additionally, most existing devices only support single-sided cleaning; flipping requires opening the compartment, causing dust spillage. Moreover, their loading and unloading structures are poorly integrated with production lines, making them unsuitable for continuous processing requirements. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board processing cleaning device and its control method, which realizes automated and comprehensive cleaning of circuit boards in a closed environment, improves cleaning efficiency and dust collection effect, avoids dust overflow, and is suitable for continuous processing and double-sided cleaning requirements.

[0005] To achieve the above objectives, the present invention provides a circuit board processing cleaning device. The cleaning chamber contains, from top to bottom, a cleaning unit, a placement unit, and a dust collection unit. The cleaning unit includes a lifting assembly, a translation assembly, and a brush. The lifting assembly is fixed to the top of the cleaning chamber and drives the translation assembly and brush to move vertically. The translation assembly drives the brush to move horizontally. The placement unit includes a vacuum adsorption platform and a placement plate. The vacuum adsorption platform is used to fix the circuit board to be cleaned. The dust collection unit includes a dust suction assembly and a dust collection chamber assembly for collecting dust generated during cleaning. The side walls of the cleaning chamber have observation windows and closed operation openings corresponding to the positions of the vacuum adsorption platform. The two side walls of the cleaning chamber have symmetrical placement openings corresponding to the positions of the vacuum adsorption platform.

[0006] Preferably, the translation component includes an X-axis control structure and a Y-axis control structure; the X-axis control structure includes a first base, the first base having a first guide groove formed along the horizontal X-axis, a first drive screw being arranged in the first guide groove along the groove direction, one end of the first drive screw being rotatably connected to the inner wall of one side of the first guide groove via a bearing, and the other end being fixedly connected to the output shaft of a first drive motor through the inner wall of the other side of the first guide groove, the first drive motor being located in a first motor protection compartment on the corresponding side of the first base; a first slider being threadedly connected to the surface of the first drive screw, a first connecting plate being vertically fixed on both sides of the first slider, the outer end of the first connecting plate passing through a first limiting groove formed on the corresponding side of the first base, the first limiting groove being parallel to the first guide groove; the first slider being connected to a first U-shaped connector via the first connecting plates on both sides, the lower end of the first U-shaped connector being fixedly connected to the Y-axis control structure.

[0007] Preferably, the Y-axis control structure includes a second base, which is arranged along the horizontal Y-axis and fixed to the lower end of the first U-shaped connector. A second guide groove is formed inside the second base along its length. A second drive screw is arranged in the second guide groove along the groove direction. One end of the second drive screw is rotatably connected to the inner wall of one side of the second guide groove via a bearing, and the other end passes through the inner wall of the other side of the second guide groove and is fixedly connected to the output shaft of a second drive motor. The second drive motor is located in a second motor protection compartment on the corresponding side of the second base. A second slider is threaded onto the surface of the second drive screw. Second connecting plates are vertically fixed on both sides of the second slider. The outer end of the second connecting plate passes through a second limiting groove formed on the corresponding side of the second base. The second limiting groove is parallel to the second guide groove. The second slider is connected to a second U-shaped connector via the second connecting plates on both sides. The lower end of the second U-shaped connector is detachably connected to the upper end of the brush. The length direction of the brush is arranged along the horizontal X-axis.

[0008] Preferably, the upper surface of the vacuum adsorption platform is uniformly provided with a plurality of adsorption holes, and the side of the vacuum adsorption platform is provided with a connection hole, which is connected to a vacuum generator outside the cleaning chamber through a sealed pipe; the lower surface of the vacuum adsorption platform is fixedly connected to the middle of the upper surface of the placement plate by an inclined transition connector, the four sides of the placement plate are fixedly connected to the inner wall of the cleaning chamber, and the upper surface of the placement plate is uniformly provided with a plurality of dust suction holes along the edge, which are arranged along the lower edge of the inclined transition connector, and the inclined transition connector is used to prevent dust accumulation at the connection point.

[0009] Preferably, the dust collection assembly includes a negative pressure dust collection chamber, which is an inverted cone-shaped structure with an upper opening larger than a lower opening. The upper opening of the negative pressure dust collection chamber is adapted to and sealed to the lower surface of the placement plate, and an exhaust fan is installed on the side wall of the lower opening. The exhaust fan passes through the side wall of the cleaning chamber through an exhaust duct.

[0010] Preferably, the dust collection chamber assembly includes a pull-out collection chamber, the upper opening of which corresponds to the lower opening of the negative pressure dust collection chamber; a fixing plate is connected to a slot that penetrates the side wall of the cleaning chamber on one side of the collection chamber, a sealing ring is provided along the edge of the side of the fixing plate facing the cleaning chamber, and a sealing groove adapted to the sealing ring is provided along the outer periphery of the slot on the side wall of the cleaning chamber; magnetic blocks are symmetrically arranged on the upper and lower surfaces of the end of the collection chamber near the fixing plate, and magnetic grooves adapted to the magnetic blocks are symmetrically provided on the upper and lower walls of the slot on the side wall of the cleaning chamber.

[0011] Preferably, an operating glove is sealed and installed at the closed operating opening for use in flipping circuit boards and assisting in loading and unloading.

[0012] Preferably, the placement openings on both sides of the cleaning chamber are the loading port and the unloading port, respectively, both of which are connected to the adjacent process via conveyor belts, and the placement openings are connected to openable and closable baffles via damping shafts.

[0013] The present invention also discloses a control method for a circuit board processing and cleaning device, specifically including the following steps: S1. Loading and fixing: The circuit board to be cleaned is conveyed to the vacuum adsorption platform through the placement port. The vacuum generator is started, and the circuit board is adsorbed and fixed through the adsorption holes. S2. Height Adaptation: The lifting component drives the translation component and brush to descend to the preset cleaning working height; S3. Planar cleaning: The translation component drives the brush to reciprocate in the horizontal plane to thoroughly clean the upper surface of the circuit board. S4. Negative pressure dust collection: During the cleaning process, the dust collection component continuously generates negative pressure, which draws the dust that is swept off into the dust collection chamber component through the dust collection hole for storage; S5. Unloading and Discharging: After cleaning is completed, the lifting component drives the brush to rise and reset, the vacuum adsorption platform releases adsorption, and the cleaned circuit board is sent out through the placement port.

[0014] Preferably, before step S5, a flipping and cleaning step is included, in which the circuit board is flipped over by using an operating glove that closes the operating opening, and steps S2 to S4 are repeated to complete the cleaning of the other side of the circuit board.

[0015] Therefore, the present invention, employing the above-described circuit board processing cleaning device and its control method, has the following technical advantages: (1) The present invention adopts a closed cleaning chamber structure and is equipped with a negative pressure dust collection system. The cleaning process is completed in the chamber. Combined with the baffle structure of the placement port and the sealed glove design of the operation opening, it not only meets the needs of operation and loading and unloading, but also effectively prevents dust from spreading to the external environment, improves the workshop working environment, and protects the health of operators.

[0016] (2) The present invention uses a translation component composed of X-axis and Y-axis screw transmission structure, combined with the height adjustment of the lifting component, to drive the brush to complete the full board coverage cleaning in the horizontal plane according to the preset path, with good cleaning uniformity and adaptable to circuit boards of different sizes and specifications; the brush adopts a detachable connection, which is convenient for maintenance and replacement.

[0017] (3) The vacuum adsorption platform and the placement plate of the present invention are connected by an inclined transition connector to avoid dust accumulation caused by right-angle gaps; the edge of the placement plate is surrounded by dust suction holes, which can directly receive the dust that falls off during cleaning. With the guiding effect of the inverted cone-shaped negative pressure dust suction chamber, the dust can fall smoothly into the pull-out collection chamber below; the collection chamber adopts a magnetic sealing structure, which is convenient to disassemble and clean, and has reliable sealing performance.

[0018] (4) The present invention uses a pair of operation gloves with a closed operation opening to complete the circuit board flipping operation without opening the chamber or damaging the internal negative pressure environment, thus achieving double-sided cleaning; the two side placement ports can be directly connected to the upstream and downstream conveyor belts, and with the opening and closing control of the baffle, it can be adapted to the circuit board continuous processing production line to improve the overall processing efficiency.

[0019] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the first overall structure of a circuit board processing and cleaning device according to the present invention; Figure 2 This is a schematic diagram of the second overall structure of a circuit board processing and cleaning device according to the present invention; Figure 3 This is a front view of the internal structure of the cleaning chamber of a circuit board processing cleaning device according to the present invention; Figure 4 This is a schematic diagram of the internal structure of the cleaning chamber of a circuit board processing cleaning device according to the present invention; Figure 5 This is a schematic diagram of the X-direction control structure of a circuit board processing and cleaning device according to the present invention; Figure 6 This is a schematic diagram of the Y-axis control structure of a circuit board processing and cleaning device according to the present invention; Figure 7 This is a schematic diagram of the collection chamber structure of a circuit board processing cleaning device according to the present invention; Figure 8 This is a schematic diagram of a sealing groove structure for a circuit board processing and cleaning device according to the present invention.

[0021] Figure Labels 1. Cleaning chamber; 11. Observation window; 12. Closed operation opening; 13. Operating gloves; 14. Placement port; 15. Baffle; 16. Sealing groove; 2. Cleaning unit; 21. Lifting assembly; 22. Translation assembly; 221. X-axis control structure; 2211. First base; 2212. First guide groove; 2213. First drive screw; 2214. First drive motor; 2215. First motor protection chamber; 2216. First slider; 2217. First connecting plate; 2218. First limit groove; 2219. First U-shaped connector; 222. Y-axis control structure; 2221. Second base; 2222. Second guide groove; 2223. 2224 Second drive screw; 2225 Second drive motor; 2226 Second motor protection chamber; 2227 Second slider; 2228 Second connecting plate; 2229 Second limiting groove; 2220 Second U-shaped connector; 23 Brush; 3 Placement unit; 31 Vacuum adsorption platform; 311 Adsorption hole; 312 Connecting hole; 32 Placement plate; 321 Dust suction hole; 33 Inclined transition connector; 4 Dust collection unit; 41 Dust suction assembly; 411 Negative pressure dust suction chamber; 412 Exhaust fan; 413 Exhaust duct; 42 Dust collection chamber assembly; 421 Collection chamber; 422 Fixing plate; 423 Sealing ring; 424 Magnetic block. Detailed Implementation

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] like Figures 1 to 8 As shown, a cleaning device for circuit board processing includes a cleaning chamber 1 with a closed box structure. Inside the cleaning chamber 1, a cleaning unit 2, a placement unit 3 and a dust collection unit 4 are arranged sequentially from top to bottom, forming a top-to-bottom cleaning-receiving-dust collection working space.

[0025] The cleaning unit 2 includes a lifting assembly 21, a translation assembly 22, and a brush 23. The lifting assembly 21 is fixedly installed on the inner top wall of the cleaning chamber 1, with its output end facing downwards and fixedly connected to the translation assembly 22. It drives the translation assembly 22 and the brush 23 to move vertically as a whole to accommodate circuit boards of different thicknesses, and also lifts them to avoid obstructions during loading and unloading. The lifting assembly 21 can be any of an electric push rod, a cylinder, or a screw lifting mechanism. In this embodiment, two sets of symmetrically arranged electric push rods are used to ensure the stability of the lifting process.

[0026] The translation component 22 is used to drive the brush 23 to move in the X and Y directions in the horizontal plane, so as to achieve full coverage cleaning of the circuit board surface. The translation component 22 includes an X-direction control structure 221 and a Y-direction control structure 222.

[0027] Specifically, the X-axis control structure 221 includes a first base 2211, which is horizontally positioned and its top is fixedly connected to the output end of the lifting assembly 21. A first guide groove 2212 is formed inside the first base 2211 along the horizontal X-direction. A first drive screw 2213 is arranged within the first guide groove 2212 along the groove direction. One end of the first drive screw 2213 is rotatably connected to one side inner wall of the first guide groove 2212 via a bearing, and the other end passes through the other side inner wall of the first guide groove 2212 and is coaxially fixedly connected to the output shaft of the first drive motor 2214. The first drive motor 2214 is fixedly installed inside a first motor protection chamber 2215 on the corresponding side surface of the first base 2211 to prevent dust from entering the motor and affecting its service life.

[0028] The first drive screw 2213 has a first slider 2216 threaded onto its rod surface. Both sides of the first slider 2216 are vertically fixedly connected to first connecting plates 2217. The side walls of the first base 2211 have corresponding first limiting grooves 2218. The groove direction of the first limiting grooves 2218 is parallel to the groove direction of the first guide groove 2212. The outer ends of the two first connecting plates 2217 pass through the corresponding first limiting grooves 2218 and extend outwards. The upper open end of the first U-shaped connector 2219 is fixedly connected to the lower outer surface of the two first connecting plates 2217. The lower closed end of the first U-shaped connector 2219 faces downwards and is fixedly connected to the Y-axis control structure 222 below. When the first drive motor 2214 is running, the first drive screw 2213 rotates, driving the first slider 2216 to reciprocate along the X direction, and then driving the Y-direction control structure 222 to move along the X direction as a whole through the first connecting plate 2217 and the first U-shaped connector 2219.

[0029] The Y-axis control structure 222 includes a second base 2221, which is arranged along the horizontal Y-direction. The middle of its upper surface is fixedly connected to the lower end of the first U-shaped connector 2219. A second guide groove 2222 is formed inside the second base 2221 along its length. A second drive screw 2223 is arranged within the second guide groove 2222 along the groove direction. One end of the second drive screw 2223 is rotatably connected to one side of the inner wall of the second guide groove 2222 via a bearing, and the other end passes through the other side of the inner wall of the second guide groove 2222 and is coaxially fixedly connected to the output shaft of the second drive motor 2224. The second drive motor 2224 is fixedly installed inside a second motor protection chamber 2225 on the corresponding side surface of the second base 2221.

[0030] The second drive screw 2223 has a threaded connection to a second slider 2226 on its rod surface. Both sides of the second slider 2226 are vertically fixedly connected to second connecting plates 2227. The side walls of the second base 2221 have corresponding second limiting grooves 2228. The groove direction of the second limiting grooves 2228 is parallel to the groove direction of the second guide groove 2222. The outer ends of the two second connecting plates 2227 pass through the corresponding second limiting grooves 2228 and extend outwards. The upper open end of the second U-shaped connector 2229 is fixedly connected to the lower outer surface of the two second connecting plates 2227. The lower closed end of the second U-shaped connector 2229 is detachably connected to the upper end of the brush 23. The detachable connection can be achieved by bolt connection or snap-fit ​​connection, facilitating replacement of the brush 23 after wear. In this embodiment, the length direction of the brush 23 is set along the horizontal X-axis, resulting in a large coverage area in a single cleaning operation. Combined with Y-axis feeding, it can quickly complete the cleaning of the entire board.

[0031] The placement unit 3 includes a vacuum adsorption platform 31 and a placement plate 32. The vacuum adsorption platform 31 is horizontally arranged in the middle of the cleaning chamber 1 and is used to support and fix the circuit board to be cleaned. The upper surface of the vacuum adsorption platform 31 is evenly provided with a plurality of adsorption holes 311, and the side surface is provided with connection holes 312. The connection holes 312 are connected to a vacuum generator outside the cleaning chamber 1 through a sealed connecting pipe. After the vacuum generator is started, a negative pressure is generated at the adsorption holes 311, which firmly adsorbs the circuit board onto the platform surface. The fixing method will not damage the circuit board surface and is suitable for circuit boards of different sizes.

[0032] The four sides of the placement plate 32 are fixedly connected to the inner wall of the cleaning chamber 1, and the lower surface of the vacuum adsorption platform 31 is fixedly connected to the middle of the upper surface of the placement plate 32 through an inclined transition connector 33. The side wall of the inclined transition connector 33 has an inclined slope structure, which can avoid the formation of right-angle dust accumulation gaps between the platform and the placement plate, and the dust that falls off can slide down the slope to the edge area of ​​the placement plate 32. Several dust suction holes 321 are evenly opened along the edge of the upper surface of the placement plate 32, and the several dust suction holes 321 are arranged around the lower edge of the inclined transition connector 33, which can directly suck up the sliding dust and reduce the dust residue on the surface of the placement plate 32.

[0033] The dust collection unit 4 includes a dust collection assembly 41 and a dust collection chamber assembly 42, used to generate negative pressure airflow and collect dust generated during cleaning. The dust collection assembly 41 includes a negative pressure dust collection chamber 411, which is an inverted cone-shaped structure with a large opening at the top and a small opening at the bottom. Its upper opening is adapted to and sealed to the lower surface of the placement plate 32, so that the dust collection hole 321 on the placement plate 32 communicates with the interior of the negative pressure dust collection chamber 411. An exhaust fan 412 is installed on the side wall of the lower opening of the negative pressure dust collection chamber 411. The exhaust end of the exhaust fan 412 is connected to an exhaust duct 413, which extends through the side wall of the cleaning chamber 1 to the outside. When the exhaust fan 412 is running, a negative pressure environment is formed inside the negative pressure dust collection chamber 411. External air carrying dust enters the chamber through the dust collection hole 321, and the airflow is discharged through the exhaust duct 413. The dust falls into the dust collection chamber assembly 42 below under the action of gravity and airflow guidance.

[0034] The dust collection chamber assembly 42 includes a pull-out collection chamber 421, which is a box structure with an open top. The upper opening of the collection chamber 421 corresponds vertically to the lower opening of the negative pressure dust collection chamber 411, and is used to collect falling dust. A slot is provided on one side wall of the cleaning chamber 1 for the collection chamber 421 to be pulled out. The outer end of the collection chamber 421 passes through this slot and is fixedly connected to a fixing plate 422. A sealing ring 423 is provided along the edge of the side surface of the fixing plate 422 facing the side wall of the cleaning chamber 1. A sealing groove 16, adapted to the sealing ring 423, is provided along the outer periphery of the slot on the side wall of the cleaning chamber 1. When the collection chamber 421 is pushed into place, the sealing ring 423 is embedded in the sealing groove 16, ensuring the seal at the connection and preventing dust leakage.

[0035] The collection chamber 421, near the fixed plate 422, has magnetic blocks 424 symmetrically arranged on its upper and lower surfaces. Corresponding positions on the upper and lower walls of the side wall of the cleaning chamber 1 are provided with magnetic grooves that fit the magnetic blocks 424. Through the adsorption and engagement of the magnetic blocks 424 and the magnetic grooves, the collection chamber 421 can be positioned and fixed, preventing it from accidentally slipping out. It is also easy to pull out and disassemble, facilitating regular emptying of dust.

[0036] An observation window 11 and a sealed operation opening 12 are provided on the front side wall of the cleaning chamber 1, corresponding to the vacuum adsorption platform 31. The observation window 11 is made of transparent tempered glass, which allows the operator to observe the cleaning status inside the chamber. An operating glove 13 is sealed and installed at the sealed operation opening 12, allowing the operator to put their hands inside the operating glove 13 to adjust the position, flip, and assist in loading and unloading operations of the circuit boards without opening the chamber or damaging the internal sealed environment.

[0037] The left and right side walls of the cleaning chamber 1 are symmetrically provided with placement openings 14. The height of the two placement openings 14 corresponds to the height of the upper surface of the vacuum adsorption platform 31, serving as the loading and unloading openings respectively. Both can be connected to upstream and downstream processing steps via conveyor belts to achieve continuous conveying of circuit boards. The top of each placement opening 14 is connected to an openable baffle 15 via a damping shaft. When the circuit boards are conveyed, the baffle 15 is pushed open, and after conveying, the baffle 15 closes under the action of gravity and damping to reduce dust spillage.

[0038] The present invention also discloses a control method for a circuit board processing cleaning device, which, based on the above-mentioned cleaning device, includes the following steps: S1 Loading and Fixing: The circuit board to be cleaned is transported from the upstream conveyor belt to the vacuum adsorption platform 31 through the placement port 14 on one side. After it is in place, the external vacuum generator is activated, and negative pressure is generated through the adsorption holes 311 on the surface of the vacuum adsorption platform 31 to firmly adsorb and fix the circuit board. The baffle 15 of the placement port 14 closes automatically.

[0039] S2 Height Adaptation: Based on the thickness parameters of the circuit board, the lifting component 21 is activated, driving the translation component 22 and the brush 23 to descend as a whole until the lower end of the brush bristles of the brush 23 reaches the preset contact pressure with the upper surface of the circuit board, then the descent stops, completing the cleaning height adaptation.

[0040] S3 Plane Cleaning: The translation component 22 is activated, and the X-axis control structure 221 and the Y-axis control structure 222 work together to drive the brush 23 to reciprocate along a preset S-shaped full-coverage path in the horizontal plane, uniformly cleaning the entire upper surface of the circuit board and sweeping off the dust and debris attached to the surface.

[0041] S4 Negative Pressure Dust Collection: During the cleaning process, the exhaust fan 412 runs continuously, forming a stable negative pressure in the negative pressure dust collection chamber 411. The dust that is swept off enters the negative pressure dust collection chamber 411 with the airflow through the dust collection holes 321 on the edge of the placement plate 32. Under the guidance of the inverted cone-shaped chamber and the action of gravity, the dust falls into the collection chamber 421 below for storage. The filtered airflow is discharged outside the chamber through the exhaust pipe 413.

[0042] S5 Flip-over cleaning (optional): If double-sided cleaning of the circuit board is required, after cleaning one side, the lifting component 21 drives the brush 23 to raise to a safe height. The operator flips the circuit board through the operating gloves 13 that close the operating opening 12. Then, steps S2 to S4 are repeated to complete the cleaning of the other side of the circuit board.

[0043] S6 Unloading and Discharging: After all cleaning is completed, the lifting component 21 drives the brush 23 to rise and reset, the vacuum generator is turned off, and the adsorption and fixation of the circuit board is released; the baffle of the downstream placement port 14 is opened, and the cleaned circuit board is sent out through the unloading port by the conveyor belt to enter the next processing step.

[0044] When the dust in the collection chamber 421 accumulates to a certain amount, the fixing plate 422 can be pulled outward to overcome the attraction force of the magnetic block 424 and the collection chamber 421 can be pulled out for cleaning. After cleaning, the collection chamber 421 is pushed into the slot, the magnetic block 424 is attracted and positioned, and the sealing ring 423 is embedded in the sealing groove 16 to achieve sealing, so it can be used again.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A cleaning device for circuit board processing, characterized in that: The cleaning chamber contains, from top to bottom, a cleaning unit, a placement unit, and a dust collection unit. The cleaning unit includes a lifting assembly, a translating assembly, and a brush. The lifting assembly is fixed to the top of the cleaning chamber and drives the translating assembly and brush to move vertically. The translating assembly drives the brush to move horizontally. The placement unit includes a vacuum adsorption platform and a placement plate. The vacuum adsorption platform is used to fix the circuit board to be cleaned. The dust collection unit includes a dust suction assembly and a dust collection chamber assembly for collecting dust generated during cleaning. The side walls of the cleaning chamber have observation windows and closed operation openings corresponding to the vacuum adsorption platform positions. The two side walls of the cleaning chamber have symmetrical placement openings corresponding to the vacuum adsorption platform positions.

2. The circuit board processing cleaning device according to claim 1, characterized in that: The translation component includes an X-axis control structure and a Y-axis control structure. The X-axis control structure includes a first base, with a first guide groove formed inside the first base along the horizontal X-axis. A first drive screw is arranged in the first guide groove along the groove direction. One end of the first drive screw is rotatably connected to the inner wall of one side of the first guide groove via a bearing, and the other end passes through the inner wall of the other side of the first guide groove and is fixedly connected to the output shaft of a first drive motor. The first drive motor is located in a first motor protection compartment on the corresponding side of the first base. A first slider is threaded onto the surface of the first drive screw. First connecting plates are vertically fixed on both sides of the first slider. The outer end of the first connecting plate passes through a first limiting groove formed on the corresponding side of the first base. The first limiting groove is parallel to the first guide groove. The first slider is connected to a first U-shaped connector via the first connecting plates on both sides. The lower end of the first U-shaped connector is fixedly connected to the Y-axis control structure.

3. The circuit board processing cleaning device according to claim 2, characterized in that: The Y-axis control structure includes a second base, which is arranged along the horizontal Y-axis and fixed to the lower end of the first U-shaped connector. A second guide groove is formed inside the second base along its length. A second drive screw is arranged within the second guide groove along the groove direction. One end of the second drive screw is rotatably connected to the inner wall of one side of the second guide groove via a bearing, and the other end passes through the inner wall of the other side of the second guide groove and is fixedly connected to the output shaft of a second drive motor. The second drive motor is located in a second motor protection compartment on the corresponding side of the second base. A second slider is threaded onto the surface of the second drive screw. Second connecting plates are vertically fixed to both sides of the second slider. The outer end of the second connecting plate passes through a second limiting groove formed on the corresponding side of the second base. The second limiting groove is parallel to the second guide groove. The second slider is connected to a second U-shaped connector via the second connecting plates on both sides. The lower end of the second U-shaped connector is detachably connected to the upper end of the brush. The length direction of the brush is arranged along the horizontal X-axis.

4. The circuit board processing cleaning device according to claim 3, characterized in that: The vacuum adsorption platform has a plurality of adsorption holes evenly distributed on its upper surface. The vacuum adsorption platform has a connection hole on its side, which is connected to a vacuum generator outside the cleaning chamber through a sealed pipe. The lower surface of the vacuum adsorption platform is fixedly connected to the middle of the upper surface of the placement plate through an inclined transition connector. The placement plate is fixedly connected to the inner wall of the cleaning chamber around its perimeter. The upper surface of the placement plate has a plurality of dust suction holes evenly distributed along its edge. The dust suction holes are arranged along the lower edge of the inclined transition connector, which is used to prevent dust accumulation at the connection point.

5. The circuit board processing cleaning device according to claim 4, characterized in that: The dust collection assembly includes a negative pressure dust collection chamber, which is an inverted cone-shaped structure with an upper opening larger than a lower opening. The upper opening of the negative pressure dust collection chamber is adapted to and sealed to the lower surface of the placement plate, and an exhaust fan is installed on the side wall of the lower opening. The exhaust fan passes through the side wall of the cleaning chamber through an exhaust duct.

6. The circuit board processing cleaning device according to claim 5, characterized in that: The dust collection chamber assembly includes a pull-out collection chamber, the upper opening of which corresponds to the lower opening of the negative pressure dust collection chamber; a fixed plate is connected to a slot that runs through the side wall of the cleaning chamber on one side of the collection chamber, and a sealing ring is provided along the edge of the side of the fixed plate facing the cleaning chamber; a sealing groove adapted to the sealing ring is provided along the outer periphery of the slot on the side wall of the cleaning chamber; magnetic blocks are symmetrically arranged on the upper and lower surfaces of the end of the collection chamber near the fixed plate, and magnetic grooves adapted to the magnetic blocks are symmetrically provided on the upper and lower walls of the slot on the side wall of the cleaning chamber.

7. The circuit board processing cleaning device according to claim 6, characterized in that: The closed operating opening is sealed with an operating glove for use in flipping circuit boards and assisting in loading and unloading.

8. The circuit board processing cleaning device according to claim 7, characterized in that: The placement openings on both sides of the cleaning chamber are the loading port and the unloading port, respectively. Both are connected to the adjacent process via conveyor belts, and the placement openings are connected to baffles with opening and closing functions via damping shafts.

9. A control method for a circuit board processing cleaning device, based on the cleaning device of claim 8, characterized in that, Includes the following steps: S1. Loading and fixing: The circuit board to be cleaned is conveyed to the vacuum adsorption platform through the placement port. The vacuum generator is started, and the circuit board is adsorbed and fixed through the adsorption holes. S2. Height Adaptation: The lifting component drives the translation component and brush to descend to the preset cleaning working height; S3. Planar cleaning: The translation component drives the brush to reciprocate in the horizontal plane to thoroughly clean the upper surface of the circuit board. S4. Negative pressure dust collection: During the cleaning process, the dust collection component continuously generates negative pressure, which draws the dust that is swept off into the dust collection chamber component through the dust collection hole for storage; S5. Unloading and Discharging: After cleaning is completed, the lifting component drives the brush to rise and reset, the vacuum adsorption platform releases adsorption, and the cleaned circuit board is sent out through the placement port.

10. A control method for a circuit board processing cleaning device according to claim 9, characterized in that: Before step S5, there is also a flipping cleaning step, in which the circuit board is flipped over by using an operating glove that closes the operating opening, and steps S2 to S4 are repeated to complete the cleaning of the other side of the circuit board.

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