A method for manufacturing a buried PCB device and a circuit board

Abstract

The application discloses a manufacturing method of a buried PCB device and a circuit board, and relates to the technical field of printed circuit board manufacturing. The manufacturing method comprises the following steps: manufacturing a through hole on a substrate to be buried with a PCB device, and performing a metalization treatment on the inner wall of the through hole; filling the through hole with a filling material, and manufacturing an intersecting support hole and a depth control groove on the filling material; burying the PCB device in the depth control groove, and pressing a prepreg and a copper foil on both sides of the substrate to complete the manufacturing; wherein, during the pressing process of the prepreg, the prepreg enters a gap between the depth control groove and the PCB device along the support hole, and fills the support hole and the depth control groove. The application can simplify the burying process of the PCB device, and improve the feasibility of the burying method.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and in particular to a method for manufacturing embedded PCB devices and a circuit board. Background Technology

[0002] With the continuous advancement of integrated circuit chip manufacturing processes, electronic products are rapidly developing towards higher speeds, higher integration, and higher reliability, placing increasingly higher demands on integrated circuit manufacturing processes. Currently, PCB boards with embedded components include active components such as memory chips, power chips, and logic chips, as well as passive components such as surface-mount capacitors, resistors, and inductors. The thickness of embedded components with different properties often varies, and even components with the same properties can differ in thickness due to variations in component model. Existing PCB embedded component installation methods require tooling, which is not only complex but also difficult to adapt to the wide range of thicknesses of embedded components. Therefore, a design solution capable of supporting embedded components is urgently needed to improve the feasibility of the embedding method. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for manufacturing embedded PCB devices and a circuit board, so as to simplify the PCB device embedding process and improve the feasibility of the embedding method.

[0004] To achieve the above objectives, the present invention is implemented using the following technical solution: In a first aspect, the present invention provides a method for manufacturing embedded PCB devices, comprising: Through holes are fabricated on the substrate into which PCB devices are to be embedded, and the inner walls of the through holes are metallized. The through hole is filled with a filler material, and intersecting support holes and depth control grooves are made on the filler material; The PCB components are embedded in the depth-controlled trench, and prepreg and copper foil are laminated on both sides of the substrate to complete the fabrication. During the pressing process, the prepreg enters the gap between the probe groove and the PCB device along the support hole, filling the support hole and the probe groove.

[0005] Optionally, the substrate fabrication process includes: The circuit board is manufactured according to the circuit board structure dimensions, and corresponding graphic circuits are etched on each circuit board. According to the circuit board structure sequence, the circuit boards are pressed together in sequence using prepreg to form the substrate.

[0006] Optionally, the metallization process includes chemical copper plating or electroplating.

[0007] Optionally, the copper layer formed by the metallization process has a thickness greater than 20 μm.

[0008] Optionally, the inner wall of the depth-controlled groove is adapted to the outer wall design of the PCB device, so that the PCB device is embedded according to the design requirements.

[0009] Optionally, the support holes are provided in multiple portions and distributed around the perimeter of the depth control groove.

[0010] Optionally, the through hole, the support hole, and the depth control groove are all manufactured by CNC drilling.

[0011] Secondly, the present invention provides a circuit board for embedding PCB devices, which is manufactured using the manufacturing method described above.

[0012] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: This invention provides a method for manufacturing embedded PCB devices and a circuit board. The method involves drilling holes in a substrate and filling them with filler material to lay the foundation for subsequent PCB device embedding. In subsequent steps, intersecting support holes and depth control grooves are fabricated on the filler material. The depth control grooves are used to embed the PCB devices, thus allowing for customization based on the dimensions of the PCB devices and improving adaptability to different PCB devices. The support holes are used during the lamination process to allow the prepreg to melt under heat and pressure, flow into the gap between the depth control groove and the PCB device, and then solidify. This is equivalent to in-situ potting of the PCB device with the resin of the prepreg, improving structural stability and reliability. Furthermore, compared to traditional methods, the manual / jig-based embedding method is modified to a lamination-integrated molding process, simplifying the process and improving manufacturing efficiency. Attached Figure Description

[0013] Figure 1 This is a flowchart of a method for fabricating embedded PCB devices according to an embodiment of the present invention; Figure 2 This is a schematic diagram illustrating the manufacturing process of the method for fabricating embedded PCB devices provided in this embodiment of the invention. Detailed Implementation

[0014] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0015] Example 1

[0016] like Figure 1 and Figure 2 As shown, this embodiment of the invention provides a method for fabricating embedded PCB devices, including the following steps: Step S1: Create through holes on the substrate where the PCB device is to be embedded, and metallize the inner wall of the through holes.

[0017] Specifically, in this embodiment, the substrate fabrication process includes: The circuit boards are manufactured according to their structural dimensions, and corresponding graphic circuits are etched on each circuit board. The circuit boards are then pressed together in sequence using prepregs to form a substrate.

[0018] Metallization processes include chemical copper plating or electroplating, and the copper layer formed by the metallization process is thicker than 20 μm.

[0019] Step S2: Fill the through hole with filler material, and make intersecting support holes and depth control grooves on the filler material.

[0020] In this embodiment, the filling material is a resin material, which serves as both a via-sealing agent and a base for secondary processing. The resin material is homologous to the PCB substrate (epoxy system), with CTE matching and no interface cracking; it has moderate hardness, can be drilled, milled, and laser-processed, and offers good secondary processing quality.

[0021] The inner wall of the depth-controlled groove is designed to fit the outer wall of the PCB device, allowing the PCB device to be embedded according to the design requirements. The fit design not only ensures that the PCB device can enter the depth-controlled groove smoothly, but also ensures that the depth-controlled groove provides good support for the PCB device and ensures that the force is evenly distributed.

[0022] Multiple support holes are provided and distributed around the depth control groove to facilitate the entry of the semi-cured sheet into the depth control groove during the subsequent pressing process.

[0023] Step S3: Embed the PCB components into the depth control trench, and press the prepreg and copper foil onto both sides of the substrate to complete the fabrication; During the prepreg pressing process, the prepreg enters the gap between the probe groove and the PCB device along the support hole, filling the support hole and the probe groove.

[0024] Compared to traditional methods, this invention modifies the manual / jig-based embedding method to a lamination-integrated molding process, achieving multiple improvements in structural stability, process simplification, and reliability. Depending on the thickness of the PCB components, depth-controlled grooves can be fabricated on the filler material, enhancing the adaptability of the embedding method. Simultaneously, during the lamination process, the prepreg melts under heat and pressure, flows into the gaps, and solidifies, effectively performing an in-situ potting of the PCB components with the prepreg resin. This achieves structural fixation, prevents displacement, and improves insulation and moisture resistance. The resin phase of the prepreg has a certain degree of toughness, absorbing some CTE mismatch and reducing the risk of PCB component or solder joint cracking. The prepreg resin completely fills the support holes and depth-controlled grooves, preventing localized depressions in the through-hole area caused by subsequent lamination. The through-holes, support holes, and depth-controlled grooves are all fabricated using CNC drilling, thereby improving drilling accuracy.

[0025] Example 2

[0026] Based on the method for manufacturing embedded PCB devices provided in Embodiment 1, this embodiment of the invention provides a circuit board with embedded PCB devices, which is manufactured using the method described above.

[0027] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for fabricating embedded PCB components, characterized in that, include: Through holes are fabricated on the substrate into which PCB devices are to be embedded, and the inner walls of the through holes are metallized. The through hole is filled with a filler material, and intersecting support holes and depth control grooves are made on the filler material; The PCB components are embedded in the depth-controlled trench, and prepreg and copper foil are laminated on both sides of the substrate to complete the fabrication. During the pressing process, the prepreg enters the gap between the probe groove and the PCB device along the support hole, filling the support hole and the probe groove.

2. The method for fabricating embedded PCB devices according to claim 1, characterized in that, The substrate fabrication process includes: The circuit board is manufactured according to the circuit board structure dimensions, and corresponding graphic circuits are etched on each circuit board. According to the circuit board structure sequence, the circuit boards are pressed together in sequence using prepreg to form the substrate.

3. The method for fabricating embedded PCB devices according to claim 1, characterized in that, The metallization process includes chemical copper plating or electroplating.

4. The method for fabricating embedded PCB devices according to claim 1, characterized in that, The copper layer formed by the metallization process has a thickness greater than 20 μm.

5. The method for fabricating embedded PCB devices according to claim 1, characterized in that, The inner wall of the depth-controlled groove is adapted to the outer wall design of the PCB device, so that the PCB device is embedded according to the design requirements.

6. The method for fabricating embedded PCB devices according to claim 1, characterized in that, The support holes are provided in multiple portions and distributed around the perimeter of the depth control groove.

7. The method for fabricating embedded PCB devices according to claim 1, characterized in that, The through hole, the support hole, and the depth control groove are all manufactured by CNC drilling.

8. A circuit board for embedding PCB devices, characterized in that, It is manufactured using the manufacturing method described in any one of claims 1-7.

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