Electronic product shell and preparation method thereof, electronic product

Abstract

The application relates to the technical field of electronic products, in particular to an electronic product shell and a preparation method thereof, and an electronic product. The electronic product shell comprises an inner layer with a low thermal conductivity coefficient (lower than 10 W / mK) and a metal appearance layer which are laminated and attached, the inner layer is arranged towards the inside of the electronic product, the metal appearance layer has a non-metal partition structure, and the metal appearance layer is divided into multiple regions by the non-metal partition structure. In the electronic product shell, the inner layer serves as a heat insulation layer, the speed of heat transfer from the inside to the metal appearance layer is delayed, and the shell is prevented from sharply rising in temperature due to short-time high load. The non-metal partition structure can reduce mutual heat transfer between the metals, effectively block the rapid diffusion of heat on the whole interface of the metal appearance layer, reduce the risk of direct contact of a user with a high-temperature region, and reduce the "hot hand feeling". The metal appearance layer is diversified in design through surface treatment, so that the electronic product shell presents rich appearance effects and the high-end texture of the electronic product shell is improved.

Description

Technical Field

[0001] This application belongs to the field of electronic product technology, and in particular relates to an electronic product casing and its manufacturing method, as well as an electronic product. Background Technology

[0002] Currently, the casings of electronic products such as mobile phones, tablets, and smartwatches are mostly made of single materials such as glass, ceramics, plastics, resins, fiberglass, and metals. Among them, metal casings have a better texture, and metals (such as aluminum and titanium) have good ductility, allowing for diverse surface treatments and a variety of appearance designs to achieve diverse aesthetic effects. However, metal casings have poor thermal comfort; at the same temperature, a metal casing feels hotter to the user than a casing made of glass, fiberglass, ceramics, or plastics at the same temperature. Meanwhile, casings made of glass, ceramics, plastics, resins, and fiberglass are brittle, difficult to process, have limited color and texture options, and restricted surface treatments, making it difficult to achieve diverse industrial designs and thus limiting the variety of aesthetic effects available to meet the application needs of different products.

[0003] Therefore, it is particularly important to develop an electronic product casing that combines the texture of metal, the ID effect, and the thermal feel of non-metallic materials. Summary of the Invention

[0004] The purpose of this application is to provide an electronic product casing and its manufacturing method, as well as an electronic product, which aims to solve the problems of poor thermal feel of existing electronic product casings made of metal materials and poor appearance of non-metal material casings.

[0005] To achieve the above-mentioned objectives, the technical solution adopted in this application is as follows:

[0006] The first aspect of this application provides an electronic product casing, including an inner layer with a thermal conductivity of less than 10 W / mK and a metal outer layer that are laminated together. The inner layer is disposed facing the interior of the electronic product, and the metal outer layer has a non-metallic partition structure that divides the metal outer layer into multiple regions.

[0007] The electronic product casing provided in this application features an inner layer with low thermal conductivity, serving as a heat insulation layer to slow down the transfer of heat from the interior to the metal outer layer. This reduces the direct conduction of high internal temperatures to the casing surface, preventing the casing from rapidly heating up under short-term high loads and avoiding the problem of the metal outer layer becoming too hot to touch under high loads. The metal material in the outer layer possesses high thermal conductivity and hardness, making it resistant to deformation or cracking. It can disperse impact forces and effectively resist daily collisions, squeezing, or drops, reducing the risk of damage to internal components (such as screens and motherboards). Furthermore, the metal outer layer can be customized through surface treatments, allowing for diverse designs, such as rich colors and textures, enhancing the high-end feel of the electronic product casing. The metal outer layer is divided into multiple independent metal areas by a non-metallic partition structure. This non-metallic partition structure physically isolates high-temperature areas, reducing heat transfer between metals and limiting heat conduction paths. It effectively blocks the rapid diffusion of heat across the entire interface of the metal outer layer, concentrating heat through partitioning and reducing the heat-affected zone, preventing the overall casing temperature from becoming too high, reducing the risk of users directly contacting high-temperature areas, and minimizing the "scalding" sensation. Furthermore, by dividing areas using non-metallic partition structures, unshielded areas can be reserved for critical components such as antennas and sensors while retaining the shielding performance of the metal outer layer, thus balancing electromagnetic protection and communication performance. The non-metallic partition structure can also be embedded as a reinforcing rib into the metal outer layer, improving the shell's resistance to bending and impact, and reducing deformation caused by drops or compression. Additionally, the non-metallic partition structure facilitates the design of anti-slip textures or soft rubber coatings, increasing friction, reducing the risk of device slippage, and providing a more ergonomic grip experience. Simultaneously, the lightweight non-metallic materials in the partition structure reduce the overall weight of the electronic product shell and provide shock absorption, while the metal outer layer enhances the shell's rigidity; the combination of these two achieves a balance between strength and weight.

[0008] As one possible implementation of the electronic product casing in this application, the thermal conductivity of the metal outer layer is 10 W / mK higher than that of the inner layer. In this case, a balance between efficient heat dissipation and tactile comfort is achieved through the rapid heat conduction of the high thermal conductivity metal outer layer and the heat insulation buffer of the low thermal conductivity inner layer, which is especially suitable for electronic products with high requirements for heat dissipation performance and user experience.

[0009] As one possible implementation of the electronic product casing in this application, the thermal conductivity of the metal outer layer is 10 W / mK higher than that of the non-metallic partition structure. In this case, the thermal insulation buffer of the low thermal conductivity non-metallic partition structure and the rapid heat conduction of the high thermal conductivity metal outer layer can better balance efficient heat dissipation and tactile comfort.

[0010] As some possible implementations of the electronic product casing of this application, the material of the metal outer layer includes at least one of aluminum, aluminum alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, copper, copper alloy, or stainless steel. These metal materials all have high thermal conductivity and good texture, feel, and touch.

[0011] As some possible implementations of the electronic product casing of this application, the inner layer material includes at least one of glass, ceramic, plastic, resin, glass fiber, or metal with a thermal conductivity of less than 10 W / mK. These materials all have low thermal conductivity, and due to their unique physical and chemical properties, they can provide a variety of performance advantages, especially in terms of thermal management, structural support, and cost control, which can complement the metal outer layer.

[0012] As some possible implementations of the electronic product casing of this application, the material of the non-metallic partition structure includes at least one of glass, ceramic, plastic, resin, or glass fiber. These materials all have low thermal conductivity, and as a partition structure, they can act as a thermal buffer, absorbing instantaneous heat, reducing the sudden temperature rise of the metal outer layer, and slowly releasing the absorbed heat to balance temperature fluctuations and prevent the casing from feeling too hot to the touch.

[0013] As some possible implementations of the electronic product casing of this application, the shape of the non-metallic partition structure includes at least one of the following: rectangle, rhombus, trapezoid, triangle, polygon, circle, ellipse, star, heart, leaf, cloud, spiral, mountain, snowflake, or hand-drawn graphic. In this case, the non-metallic partition structure of these shapes can divide the metal outer layer into areas of different shapes, effectively blocking the rapid diffusion of heat across the entire interface of the metal outer layer, preventing the overall casing temperature from becoming too high, reducing the risk of users directly contacting high-temperature areas, and minimizing the "scalding sensation." It also allows the electronic product casing to present different patterns, giving it a richer aesthetic design effect.

[0014] As some possible implementations of the electronic product casing of this application, the thickness of the inner layer is 0.1mm to 1mm; with this thickness, it can play a good role as a heat insulation layer, slow down the speed at which heat is transferred from the inside to the metal outer layer, reduce the direct conduction of high internal temperature to the casing surface, avoid the casing from heating up rapidly due to short-term high load, and avoid the problem of the metal outer layer getting too hot to the touch under high load.

[0015] As some possible implementations of the electronic product casing of this application, the thickness of the metal outer layer is 0.1mm to 1mm; with this thickness, the metal outer layer can quickly transfer the heat generated by the internal components to the surface of the casing, and dissipate heat through air convection or radiation, so that the surface temperature of the casing is closer to the ambient temperature, and the user will not feel a significant difference between hot and cold when touching it.

[0016] As some possible implementations of the electronic product casing of this application, the thickness of the non-metallic partition structure is no greater than the thickness of the metallic outer layer.

[0017] As some possible implementations of the electronic product casing of this application, the spacing between two adjacent metal regions in the metal outer layer is 50μm to 2mm. In this case, the non-metallic partition area between two adjacent metal regions in the metal outer layer can play a good role in heat buffering, absorbing instantaneous heat, reducing the sudden temperature rise of the metal outer layer, and slowly releasing the absorbed heat to balance temperature fluctuations and prevent the casing from feeling too hot to the touch.

[0018] As some possible implementations of the electronic product casing of this application, the metallic outer layer is divided into multiple regions by the non-metallic partition structure, which is in contact with the inner layer. In this case, the metallic regions in the metallic outer layer are completely separated, achieving better heat insulation.

[0019] As some possible implementations of the electronic product casing of this application, the surface of the metal region in the metal outer layer has a micro-texture structure; by setting a micro-texture structure on the surface of the metal region in the metal outer layer, the heat transfer area between the casing surface and the user's skin can be reduced, thereby improving the user's thermal sensation.

[0020] As some possible implementations of the electronic product casing of this application, the microtexture structure includes at least one of the following: pyramid structure, wedge structure, pit structure, groove structure, protrusion structure, biomimetic structure, microneedle structure, or random structure.

[0021] As one possible implementation of the electronic product casing of this application, the surface roughness of the microtexture structure is 10µm to 100µm. In this case, the surface roughness of the microtexture structure reduces the heat transfer area between the casing surface and the user's skin, thereby improving the user's thermal comfort.

[0022] As some possible implementations of the electronic product casing of this application, the surface of the metal outer layer facing away from the inner layer in the electronic product casing also has a surface treatment layer. By performing surface treatment on the surface of the metal outer layer to form a surface treatment layer, the electronic product casing can present different appearance effects and textures, better meeting the application needs of electronic products.

[0023] As some possible implementations of the electronic product casing of this application, the surface treatment layer includes at least one of a sandblasted layer, an anodized layer, a vapor deposition layer, or a sprayed layer.

[0024] As some possible implementations of the electronic product casing in this application, the thickness of the surface treatment layer is 2μm to 50μm. At this thickness, the appearance and texture of the electronic product casing can be sufficiently ensured.

[0025] Secondly, this application provides a method for preparing an electronic product casing, comprising the following steps:

[0026] The inner layer and the metal layer are laminated together with a thermal conductivity of less than 10 W / mK;

[0027] A non-metallic partition structure is prepared in the metal layer to divide the metal layer into multiple regions. A metallic outer layer is formed on the surface of the inner layer to obtain an electronic product casing.

[0028] This application discloses a method for manufacturing an electronic product casing. An inner layer with a thermal conductivity below 10 W / mK and a metal layer are laminated together. A non-metallic partition structure is fabricated within the metal layer, dividing it into multiple regions. This forms a metallic outer layer on the surface of the inner layer, resulting in the electronic product casing. The manufacturing process is simple and suitable for large-scale industrial production and application. In the fabricated electronic product casing, the low thermal conductivity of the inner layer acts as a heat insulation layer, slowing the transfer of heat from the interior to the metallic outer layer and preventing the metal outer layer from becoming too hot to the touch under high loads. The metallic outer layer can be customized through surface treatment, allowing for diverse designs, including rich colors and textures, enhancing the high-end feel of the electronic product casing. The non-metallic partition structure in the metallic outer layer physically isolates high-temperature areas, reducing heat transfer between metals and effectively preventing rapid heat diffusion across the entire interface of the metallic outer layer. This reduces the heat-affected zone, preventing the overall casing temperature from becoming too high, lowering the risk of direct contact with high-temperature areas, reducing the "scalding sensation," and providing a better thermal experience.

[0029] As some possible implementations of the method for preparing the electronic product casing of this application, the inner layer and the metal layer are directly bonded together or bonded together using an adhesive material.

[0030] As some possible implementations of the method for preparing the casing of the electronic product in this application, the step of preparing a non-metallic partition structure in the metal layer includes: processing a plurality of partition grooves in the metal layer, and filling the partition grooves with non-metallic material to form the non-metallic partition structure.

[0031] As some possible implementations of the method for manufacturing the electronic product casing of this application, the processing method of the partition groove includes at least one of chemical etching, laser processing, or mechanical processing. These methods can all process several partition grooves in a metal layer.

[0032] As some possible implementations of the method for preparing the electronic product casing of this application, it also includes a step of microtexturing the surface of the metal layer, forming a microtextured structure at least on the surface of the metal layer opposite to the inner layer.

[0033] As some possible implementations of the method for preparing the electronic product casing of this application, it also includes the step of: performing a surface treatment process on the surface of the metal outer layer opposite to the inner layer to form a surface treatment layer.

[0034] As some possible implementations of the method for preparing the electronic product casing of this application, the microtexturing process includes at least one of machining, chemical etching, laser processing, electrochemical processing or vapor deposition.

[0035] As some possible implementations of the method for preparing the electronic product casing of this application, the surface treatment process includes at least one of sandblasting, anodizing, vapor deposition, or spraying.

[0036] Thirdly, this application provides an electronic product, which includes the above-described electronic product casing or the electronic product casing prepared by the above-described preparation method.

[0037] The electronic product described in this application includes a casing with an inner layer and a metal outer layer. The metal outer layer ensures the metallic texture and aesthetic appeal of the casing, while the low thermal conductivity inner layer and non-metallic barrier structure suppress rapid heat conduction, ensuring a better thermal experience. Therefore, it significantly improves the user experience of the electronic product.

[0038] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the electronic product casing provided in an embodiment of this application;

[0040] Figure 2 This is a schematic diagram of a micro-texture structure included in the casing of an electronic product provided in this application embodiment. Figure 1 ;

[0041] Figure 3 This is a schematic diagram of a micro-texture structure included in the casing of an electronic product provided in this application embodiment. Figure 2 ;

[0042] Figure 4This is a schematic diagram showing that the electronic product casing provided in this application includes a microtexture structure and a surface treatment layer;

[0043] Figure 5 This is a schematic flowchart of the method for preparing the electronic product casing provided in the embodiments of this application;

[0044] Figure 6 This is a schematic flowchart of the method for preparing the mobile phone casing provided in Embodiment 1 of this application;

[0045] Figure 7 This is a schematic flowchart of the method for preparing the mobile phone casing provided in Embodiment 2 of this application;

[0046] Figure 8 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 3 of this application;

[0047] Figure 9 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 4 of this application;

[0048] Figure 10 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 5 of this application;

[0049] Figure 11 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 6 of this application;

[0050] Figure 12 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 7 of this application;

[0051] Figure 13 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 8 of this application;

[0052] Figure 14 This is a schematic diagram of the metal outer layer in the mobile phone casing provided in Embodiment 9 of this application;

[0053] Figure 15 This is a schematic diagram of the connection method between the mobile phone casing and the mobile phone frame provided in Embodiment 10 of this application;

[0054] Figure 16 This is a schematic diagram of the mobile phone casing provided in Comparative Example 1 of this application;

[0055] Figure 17 This is a schematic diagram of the mobile phone casing provided in Comparative Example 2 of this application;

[0056] Figure 18 This is a schematic diagram of the mobile phone casing provided in Comparative Example 3 of this application;

[0057] The following are the labeling elements in the figure:

[0058] 10—Electronic product casing; 11—Inner layer; 12—Metal outer layer; 120—Metal layer

[0059] 121—Non-metallic partition structure; 122—Metallic area; 13—Microtexture structure; 14—Surface treatment layer

[0060] 20—Middle frame; 30—Sealing adhesive. Detailed Implementation

[0061] To make the technical problems, technical solutions, and beneficial effects of this application clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0062] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0063] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can both mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0064] It should be understood that in the various embodiments of this application, the order of the above processes does not imply the order of execution. Some or all steps may be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0065] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0066] The term "ID effect" refers to the abbreviation of "Industrial Design," which refers to the comprehensive design language of a product's appearance, form, materials, colors, and surface treatment. The purpose is to ensure the product's appearance quality through visual and tactile experiences, convey brand tone, enhance user appeal, and achieve a balance between function and aesthetics.

[0067] The term "CNC" is an abbreviation for "Computer Numerical Control," which refers to computer numerical control machining. It uses pre-programmed digital instructions (G-code) to control the movement trajectory of machine tool cutting tools to perform precision machining such as cutting, drilling, and milling on materials.

[0068] The term "thermal sensation" refers to the temperature characteristics of an electronic product's casing as perceived by the user through touch. Essentially, it's the result of thermal interaction between the material and the environment (human body, air, device heat). It not only affects grip comfort but is also closely related to product safety, performance release, and user experience. For example, a metal casing at the same temperature (say, 41°C) will feel hotter to the touch than a non-metallic casing such as glass / fiberglass at the same temperature.

[0069] The term "perceived temperature" refers to the temperature of an electronic product's casing that a user directly senses through their skin when using it. This sensation is not only related to the actual temperature value but is also influenced by a combination of factors. Perceived temperature consists of: actual temperature (the true temperature of the electronic product's casing, determined by internal chip heating, ambient temperature, and heat dissipation efficiency; for example, a mobile phone's casing temperature may reach 45°C when operating under high load, but the perceived temperature may vary depending on the heat dissipation design), heat dissipation efficiency, ambient temperature, and individual user differences (different people have different sensitivities to temperature).

[0070] Currently, the casings of electronic products such as mobile phones, tablets, and smartwatches are mostly made of single materials such as glass, ceramics, plastics, resins, fiberglass, and metals. Among them, metal casings offer a better texture, and metals (such as aluminum and titanium) have good ductility and flexible forming processes. Complex curved surfaces can be quickly formed through stamping, or ultra-thin bezels and irregularly shaped holes can be achieved through CNC precision cutting. Furthermore, metal casings offer diverse surface treatments, allowing for varied appearance designs and diverse aesthetic effects. However, metal casings have poor thermal comfort; that is, at the same temperature, a metal casing will feel hotter to the user than a casing made of glass, fiberglass, ceramics, or plastic at the same temperature, resulting in a more noticeable burning sensation during use.

[0071] To alleviate the poor thermal feel of metal casings, some technologies utilize non-metallic materials such as glass, ceramics, plastics, resins, and fiberglass as the casing for electronic products, improving thermal comfort. However, glass's transparency or monochromatic properties rely on coating or lamination processes to achieve color variations, which is costly and offers limited options. Ceramic is typically white, black, or glazed, with textures dependent on sintering processes, making it difficult to achieve rich gradient effects like metals through anodizing or spraying. Furthermore, glass and ceramics are brittle materials, prone to breakage during cutting, drilling, or complex molding, hindering the creation of sharp edges, intricate cutouts, or complex curved surfaces. Fiberglass, composed of resin and glass fibers, often exhibits fibrous textures on its surface after molding, requiring additional coating to conceal them. However, even after coating, it still falls short of achieving the smooth texture of metal or the translucency of glass. Additionally, fiberglass is typically molded using compression molding or injection molding, resulting in poor flowability, making it difficult to fill thin walls or complex details, and prone to burrs at the edges. Designs must simplify the structure to accommodate the manufacturing process, limiting structural complexity. Therefore, the shells made of materials such as glass, ceramics, plastics, resins, and fiberglass are difficult to process and have limited surface treatment, making it difficult to carry out diversified industrial designs. This makes it difficult to create shells with more appearance effects to meet the application needs of different products.

[0072] Based on the above considerations, and to address the issues of poor thermal feel and poor aesthetics of non-metallic casings in electronic products, this application proposes an electronic product casing comprising an inner layer with a thermal conductivity of less than 10 W / mK and a metal outer layer, laminated together. The metal outer layer incorporates non-metallic partition structures to divide it into multiple regions. This casing achieves a balance between the texture and aesthetics of metal and the thermal feel of non-metallic materials.

[0073] For ease of understanding, this application is specifically described through the following embodiments. It should be understood that the following embodiments are only used to further illustrate the solution of this application and are not intended to limit the scope of this application.

[0074] In a first aspect, embodiments of this application provide an electronic product casing 10, such as... Figure 1 As shown, the device includes an inner layer 11 with a thermal conductivity of less than 10 W / mK and a metal outer layer 12, which are laminated together. The inner layer 11 is disposed facing the interior of the electronic product. The metal outer layer 12 has a non-metallic partition structure 121, which divides the metal outer layer 12 into multiple regions.

[0075] Thus, the electronic product casing 10 provided in this application embodiment has at least the following advantages:

[0076] Firstly, the inner layer 11 has a thermal conductivity of less than 10W / mK, which can serve as a heat insulation layer, slowing down the rate at which heat is transferred from the inside to the metal outer layer 12, reducing the direct conduction of high internal temperature to the outer shell surface, and preventing the outer shell from heating up rapidly due to short-term high load, thus avoiding the problem of the metal outer layer 12 becoming too hot to the touch under high load.

[0077] Secondly, the metal material in the metal outer layer 12 has high thermal conductivity and high hardness, making it less prone to deformation or cracking. It can disperse impact force and effectively resist daily collisions, squeezing, or drops, reducing the risk of damage to internal components of electronic products (such as screens and motherboards). In addition, the metal outer layer 12 can also achieve diversified designs through surface treatment, giving the electronic product casing 10 rich colors and textures, enhancing the high-end feel of the electronic product casing 10.

[0078] Thirdly, the metal outer layer 12 is divided into multiple independent metal areas 122 by a non-metallic partition structure 121. The non-metallic partition structure 121 can physically isolate high-temperature areas, reduce heat transfer between metals, limit heat conduction paths, and effectively block the rapid diffusion of heat across the entire interface of the metal outer layer 12. By dispersing and concentrating heat through partitioning, the heat-affected zone is reduced, preventing the overall temperature of the casing from becoming too high, reducing the risk of users directly contacting high-temperature areas, and reducing the "scalding sensation." Furthermore, by dividing the area through the non-metallic partition structure 121, unshielded areas can be reserved for key components such as antennas and sensors while maintaining the shielding performance of the metal outer layer 12, balancing electromagnetic protection and communication performance. The non-metallic partition structure 121 can also be embedded as a reinforcing rib into the metal outer layer 12, improving the casing's resistance to bending and impact, and reducing deformation caused by drops or compression. In addition, the non-metallic partition structure 121 is also conducive to designing anti-slip textures or soft rubber coatings, increasing friction, reducing the risk of device slippage, and providing a more ergonomic grip experience. Meanwhile, the non-metallic materials in the non-metallic partition structure 121 are lightweight, which can reduce the overall weight of the electronic product casing 10 and provide shock absorption, while the metallic outer layer 12 enhances the rigidity of the casing. The combination of the two achieves a balance between strength and weight.

[0079] Therefore, the electronic product casing 10 in this embodiment of the application, through the combination of the inner layer 11 and the metal outer layer 12, not only ensures the metallic texture and ID effect of the casing through the metal outer layer 12, but also suppresses the rapid conduction of heat through the inner layer 11 with low thermal conductivity and the non-metallic partition structure 121, thus ensuring a better thermal experience for the casing.

[0080] In some possible implementations, the thermal conductivity of the metal outer layer 12 is 10 W / mK higher than that of the inner layer 11. Exemplarily, the thermal conductivity of the metal outer layer 12 is 10 W / mK, 11 W / mK, 12 W / mK, 13 W / mK, 14 W / mK, 15 W / mK, 16 W / mK, 17 W / mK, 18 W / mK, 19 W / mK, 20 W / mK, 22 W / mK, 24 W / mK, 25 W / mK, 30 W / mK, etc., which are typical but not limiting values ​​or ranges between any two values. In this case, a balance between efficient heat dissipation and tactile comfort is achieved through the rapid heat conduction of the high thermal conductivity metal outer layer 12 and the thermal insulation buffering of the low thermal conductivity inner layer 11, making it particularly suitable for electronic products with high requirements for heat dissipation performance and user experience. The design process requires optimization of material selection and heat dissipation schemes based on specific application scenarios to achieve optimal overall performance.

[0081] In some possible implementations, the thermal conductivity of the metallic outer layer 12 is 10 W / mK higher than that of the non-metallic partition structure 121. Exemplarily, the thermal conductivity of the metallic outer layer 12 may be 10 W / mK, 11 W / mK, 12 W / mK, 13 W / mK, 14 W / mK, 15 W / mK, 16 W / mK, 17 W / mK, 18 W / mK, 19 W / mK, 20 W / mK, 22 W / mK, 24 W / mK, 25 W / mK, 30 W / mK, or any typical but non-limiting point value or a range between any two points, where the thermal conductivity of the metallic outer layer 12 is higher than that of the non-metallic partition structure 121. In this case, a better balance can be achieved between efficient heat dissipation and tactile comfort through the thermal insulation buffering of the low thermal conductivity non-metallic partition structure 121 and the rapid heat conduction of the high thermal conductivity metallic outer layer 12.

[0082] In some possible implementations, the material of the metal outer layer 12 includes at least one of aluminum, aluminum alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, copper, copper alloy, or stainless steel. These metal materials all have high thermal conductivity and good texture, feel, and touch. Aluminum and aluminum alloys readily form an aluminum oxide passivation layer on their surface, and anodizing further enhances corrosion resistance and color diversity. They also have good processing ductility, making them suitable for stamping, extrusion, CNC machining, etc. Titanium and titanium alloys have strength close to steel, low density, making them suitable for lightweight and durable applications, and possess characteristics such as corrosion resistance, high temperature resistance, matte gray metallic luster, and a unique high-end feel. Magnesium and magnesium alloys have excellent die-casting performance, good fluidity, and diverse surface treatments, including electroplating and spraying (such as imitation gold and antique bronze effects). Copper and copper alloys (brass, bronze, etc.) have high thermal conductivity, approximately 400W / mK, suitable for high heat dissipation requirements, and after polishing, they exhibit a golden or red luster, presenting a high-end retro style. Stainless steel is extremely corrosion resistant, has high hardness, is scratch resistant, and has a high-end texture. After polishing or brushing, it can present a mirror or matte effect.

[0083] In some possible implementations, the material of the inner layer 11 includes at least one of glass, ceramic, plastic, resin, glass fiber, or a metal with a thermal conductivity of less than 10 W / mK. These materials all have low thermal conductivity. In some embodiments, the material of the inner layer 11 is selected from at least one of glass, ceramic, plastic, resin, or glass fiber metal. In the design of the inner layer 11 of the electronic product casing 10, materials such as glass, ceramic, plastic, resin, and glass fiber offer various performance advantages due to their unique physical and chemical properties, especially in terms of thermal management, structural support, and cost control, where they can complement the metal outer layer 12. Glass and ceramic, in particular, possess high hardness and scratch resistance (protecting internal components from physical damage), excellent insulation (suitable for circuit areas with high insulation requirements), high thermal stability, and chemical inertness, and have low thermal conductivity (approximately 1 W / mK). As a heat insulation layer inside the casing, they can slow down the rate at which heat is transferred from the interior to the metal outer layer 12, preventing the casing from feeling overheated. They also act as a thermal buffer, absorbing instantaneous heat (such as short-term high loads) and reducing the sudden temperature rise of the metal outer layer 12. Resins and plastics, with their low density, significantly reduce equipment weight; they offer high insulation and corrosion resistance; and their high flexibility provides cushioning and shock absorption, protecting precision components. Furthermore, their extremely low thermal conductivity makes them an efficient heat insulation layer, preventing rapid heat transfer from the internal structure to the metal casing, slowing down temperature changes, and improving comfort during extended use. They also slowly release absorbed heat, balancing temperature fluctuations. When reinforced with glass fiber, their tensile strength approaches that of metal, but their density is only 1-2 g / cm³. 3 It has high strength and low weight ratio, as well as fatigue resistance, corrosion resistance and thermal stability, which can provide moderate heat insulation for the metal outer layer 12 while avoiding excessive heat accumulation.

[0084] In some possible implementations, the material of the non-metallic partition structure 121 includes at least one of glass, ceramic, plastic, resin, or glass fiber. These materials all have low thermal conductivity, and as a partition structure, they can act as a thermal buffer, absorbing instantaneous heat, reducing the sudden temperature rise of the metal outer layer 12, and slowly releasing the absorbed heat to balance temperature fluctuations and prevent the casing from feeling overheated. Furthermore, these non-metallic materials are lightweight, reducing the overall weight of the electronic product casing 10 and providing shock absorption, while the metal outer layer 12 enhances the rigidity of the casing; the combination of the two achieves a balance between strength and weight. In the embodiments of this application, the material of the non-metallic partition structure 121 can be the same as or different from the material of the inner layer 11.

[0085] In some embodiments, the material of the non-metallic partition structure 121 includes plastics, resins, etc., which offer greater industrial flexibility and facilitate industrial production.

[0086] In some possible implementations, the shape of the non-metallic partition structure 121 includes at least one of the following: rectangle, rhombus, trapezoid, triangle, polygon, circle, ellipse, star, heart, leaf, cloud, spiral, mountain, snowflake, and hand-drawn graphic. Hand-drawn graphics refer to drawings created randomly without fixed geometric features. In this case, the non-metallic partition structure 121 of these shapes can divide the metal outer layer 12 into areas including rectangles, rhombuses, trapezoids, triangles, polygons, circles, ellipses, stars, hearts, leaves, clouds, spirals, mountains, snowflakes, and hand-drawn graphics. This effectively blocks the rapid diffusion of heat across the entire interface of the metal outer layer 12, disperses and concentrates heat through partitions, reduces the heat-affected zone, prevents the overall temperature of the casing from becoming too high, reduces the risk of users directly contacting high-temperature areas, and minimizes the "scalding sensation." It also allows the electronic product casing 10 to present different patterns, giving it a richer aesthetic design.

[0087] In some possible implementations, the thickness of the inner layer 11 is 0.1 mm to 1 mm; for example, the thickness of the inner layer 11 can be any typical but non-limiting point value or a range between any two points, such as 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm. The thickness of the inner layer 11 in this embodiment is related to the overall thickness of the electronic product casing 10, and the thickness of the inner layer 11 can be flexibly adjusted according to application requirements in practical applications. At this thickness, it can act as a good heat insulation layer, slowing down the rate at which heat is transferred from the interior to the metal outer layer 12, reducing the direct conduction of high internal temperatures to the casing surface, preventing the casing from heating up rapidly due to short-term high loads, and avoiding the problem of the metal outer layer 12 becoming too hot to the touch under high loads.

[0088] In some possible implementations, the thickness of the metal outer layer 12 is 0.1mm to 1mm; for example, the thickness of the inner layer 11 can be any typical but non-limiting point value or a range between any two points, such as 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm. The thickness of the metal outer layer 12 in this embodiment is related to the overall thickness of the electronic product casing 10, and the thickness of the metal outer layer 12 can be flexibly adjusted according to application requirements in practical applications. With this thickness, the metal outer layer 12 can quickly transfer the heat generated by the internal components to the casing surface and dissipate heat through air convection or radiation, making the casing surface temperature closer to the ambient temperature, so that the user will not feel a significant difference in temperature when touching it. Furthermore, diverse designs can be achieved through surface treatment, allowing the electronic product casing 10 to present rich colors and textures, enhancing the high-end feel of the electronic product casing 10.

[0089] In some possible implementations, the thickness of the non-metallic partition structure 121 is no greater than the thickness of the metallic outer layer 12. The thickness of the non-metallic partition structure 121 can be flush with the thickness of the metallic outer layer 12 (i.e., equal, the surface partition structure of the electronic product casing 10 is flush with the high thermal conductivity metallic outer layer 12), increasing the smoothness of the casing surface, or it can be less than the thickness of the metallic outer layer 12, increasing the texture of the casing surface.

[0090] In some possible implementations, the spacing between two adjacent metal regions 122 in the metal outer layer 12 is 50 μm to 2 mm. Exemplarily, the spacing between two adjacent metal regions 122 in the metal outer layer 12 can be any typical but non-limiting point value or a range between any two points, such as 50 μm, 100 μm, 200 μm, 500 μm, 800 μm, 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.8 mm, or 2 mm. In this case, the non-metallic partition area between two adjacent metal regions 122 in the metal outer layer 12 can act as a good thermal buffer, absorbing instantaneous heat, reducing the sudden temperature rise of the metal outer layer 12, and slowly releasing the absorbed heat to balance temperature fluctuations and prevent the outer casing from feeling overheated.

[0091] In some possible implementations, the metallic outer layer 12 is divided into multiple regions by a non-metallic partition structure 121, which is disposed in contact with the inner layer 11. In this case, the metallic regions 122 in the metallic outer layer 12 are completely separated, which can achieve better heat insulation effect.

[0092] In some possible implementations, the surface of the metal region 122 in the metal outer layer 12 has a microtextured structure 13, as shown in the attached figure. Figure 2 and Figure 3 As shown. In this case, by providing a microtexture structure 13 on the surface of the metal region 122 in the metal outer layer 12, the heat transfer area between the outer shell surface and the user's skin can be reduced, thereby improving the user's thermal sensation.

[0093] In some possible implementations, the microtexture structure 13 includes at least one of the following: pyramid structure, wedge structure, pit structure, groove structure, protrusion structure, biomimetic structure, microneedle structure, and random structure. These microtexture structures 13 can all reduce the heat transfer area between the shell surface and the user's skin, improving the user's thermal sensation. Specifically, the pyramid structure has tiny pyramidal structures on its surface; the wedge structure has tiny wedge-shaped structures on its surface; the groove structure has regular or irregular grooves on its surface, which can be parallel, intersecting, or grid-like; the pit structure has tiny pits distributed on its surface, which can be circular, square, or other geometric shapes; the protrusion structure has tiny protrusions or particles on its surface, which can be spherical, columnar, or other shapes; the biomimetic structure mimics the surface structures of organisms in nature, such as the superhydrophobic structure of lotus leaves or the nanostructure of butterfly wings; the microneedle structure has tiny needle-like structures on its surface, typically in the micrometer range in height and diameter; and the random structure has an irregularly distributed surface texture, exhibiting randomness.

[0094] In some possible implementations, the surface roughness of the microtexture structure 13 is 10µm to 100µm; exemplaryly, the surface roughness of the microtexture structure 13 can be any typical but non-limiting point value or a range between any two point values, such as 10µm, 20µm, 30µm, 40µm, 50µm, 60µm, 70µm, 80µm, 90µm, 100µm. In this case, the surface roughness of the microtexture structure 13 reduces the heat transfer area between the outer shell surface and the user's skin, thereby improving the user's thermal comfort.

[0095] In some possible implementations, the surface of the metal outer layer 12 facing away from the inner layer 11 in the electronic product casing 10 also has a surface treatment layer 14. By performing a surface treatment on the surface of the metal outer layer 12 to form the surface treatment layer 14, the electronic product casing 10 can present different appearance effects and textures, better meeting the application requirements of electronic products. For example, different color effects can be presented by surface treatment of the casing.

[0096] In some possible implementations, the electronic product casing 10 is as shown in the attached diagram. Figure 4As shown, the material includes an inner layer 11 with a thermal conductivity of less than 10 W / mK and a metal outer layer 12, which are laminated together. The metal outer layer 12 has a non-metallic partition structure 121, which divides the metal outer layer 12 into multiple regions. The surface of the metal region 122 in the metal outer layer 12 has a microtextured structure 13. The surface of the metal outer layer 12 facing away from the inner layer 11 also has a surface treatment layer 14.

[0097] In some possible implementations, the surface treatment layer 14 includes at least one of a sandblasting layer, an anodized layer, a vapor deposition layer, and a sprayed layer. These surface treatment layers 14 can further optimize the performance of the electronic product casing 10. Anodized layers, formed on a metal surface using electrochemical methods, increase the casing's wear resistance, corrosion resistance, and insulation; they can also give the casing a matte or glossy texture, enhancing its premium feel. Sprayed layers are formed by spraying paint onto the surface of the outer layer and curing it; they offer rich colors and gloss levels (matte / high gloss), enabling special effects such as gradients and textures, and protecting the metal outer layer 12 from scratches and corrosion. Vapor deposition layers, such as physical vapor deposition layers, deposit metal or compound layers through vacuum deposition, forming ultra-hard coatings and allowing the deposition of decorative metallic colors (such as titanium gold, rose gold), improving both wear resistance and aesthetics. Sandblasting layers are formed by high-speed jetting of abrasive particles (such as sand, glass beads, alumina, etc.) impacting the material surface. The sandblasting layer can form a uniform and delicate matte surface, reduce reflection, and enhance the high-end texture. By adjusting the abrasive particle size and spray pressure, a variety of texture effects, from fine sanding to coarse grains, can also be achieved.

[0098] In some embodiments, polysiloxane / polysilazane / polyester coating PU / epoxy resin UV, etc. are sprayed to form a surface polymer layer on the surface of the metal appearance layer 12. The surface polymer improves the appearance of the outer shell and enhances the infrared emissivity.

[0099] In some possible implementations, the thickness of the surface treatment layer 14 is 2 μm to 50 μm. Exemplarily, the thickness of the surface treatment layer 14 can be any typical but non-limiting point value or a range between any two points, such as 2 μm, 4 μm, 5 μm, 8 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm. With this thickness, the appearance and texture of the electronic product casing 10 can be sufficiently ensured. In practical applications, the thickness of the surface treatment layer 14 can be flexibly adjusted according to the positioning of the electronic product and the thickness of the casing.

[0100] In some possible implementations, in the electronic product casing 10, the metal outer layer 12 is divided into multiple independent metal regions 122 by a non-metallic partition structure 121, and the four edges of the metal outer layer 12 are non-metallic partition regions. In this case, the four edges of the non-metallic material have better bonding performance with the electronic product's frame 20, body and other components.

[0101] In some embodiments, in electronic products, both the inner layer 11 of the outer casing and the metal outer layer 12 are disposed in contact with the middle frame 20 to improve bonding stability.

[0102] The electronic product casing 10 of the above embodiments of this application can be obtained by the following methods.

[0103] Secondly, embodiments of this application provide a method for preparing an electronic product casing 10, as shown in the attached figure. Figure 5 As shown, it includes the following steps:

[0104] S10. The inner layer 11 with a thermal conductivity of less than 10 W / mK and the metal layer 120 are laminated together;

[0105] S20. A non-metallic partition structure 121 is prepared in the metal layer 120, and the metal layer 120 is divided into multiple regions by the non-metallic partition structure 121. A metallic outer layer 12 is formed on the surface of the inner layer 11 to obtain the electronic product casing 10.

[0106] The method for manufacturing an electronic product casing 10 according to this application involves laminating an inner layer 11 with a thermal conductivity lower than 10 W / mK and a metal layer 120. A non-metallic partition structure 121 is fabricated within the metal layer 120, dividing the metal layer 120 into multiple regions. This forms a metallic outer layer 12 on the surface of the inner layer 11, thus obtaining the electronic product casing 10. The manufacturing process is simple and suitable for large-scale industrial production and application. In the fabricated electronic product casing 10, the low thermal conductivity of the inner layer 11 acts as a heat insulation layer, slowing down the transfer of heat from the interior to the metallic outer layer 12 and preventing the metallic outer layer 12 from becoming too hot to handle under high loads. The metallic outer layer 12 can be customized through surface treatment, allowing the electronic product casing 10 to exhibit rich colors and textures, enhancing its premium feel. The non-metallic partition structure 121 in the metal outer layer 12 can physically isolate high-temperature areas, reduce heat transfer between metals, effectively block the rapid diffusion of heat across the entire interface of the metal outer layer 12, reduce the heat-affected zone, prevent the overall temperature of the casing from becoming too high, reduce the risk of users directly contacting high-temperature areas, reduce the "scalding sensation", and provide a better thermal experience for the casing.

[0107] In step S10 above:

[0108] In some possible implementations, the inner layer 11 and the metal layer 120 are directly bonded together or adhered to each other using an adhesive material. When the inner layer 11 is made of materials such as plastic or resin, the formed inner layer 11 itself has certain adhesive properties and can be directly bonded to the metal layer 120. The inner layer 11 and the metal layer 120 can also be adhered to each other using an adhesive material.

[0109] In some embodiments, the adhesive material includes at least one of epoxy adhesive, cyanoacrylate adhesive, or polyurethane adhesive, all of which can firmly bond the inner layer 11 and the metal layer 120 together.

[0110] In some embodiments, the thickness of the adhesive layer between the inner layer 11 and the metal layer 120 is 0.01 mm to 0.5 mm. Exemplarily, it can be any typical but non-limiting point value or a range between any two points, such as 0.01 mm, 0.02 mm, 0.05 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm. With this thickness, the inner layer 11 and the metal layer 120 can be firmly bonded together to form a stable composite structure.

[0111] In some possible implementations, the material of the metal layer 120 includes at least one of aluminum, aluminum alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, copper, copper alloy, or stainless steel. These metal materials all have high thermal conductivity and good texture, feel, and touch.

[0112] In some possible implementations, the material of the inner layer 11 includes at least one of glass, ceramic, plastic, resin, glass fiber, or a metal with a thermal conductivity of less than 10 W / mK. These materials all have low thermal conductivity, and in the design of the inner layer 11 of the electronic product casing 10, materials such as glass, ceramic, plastic, resin, and glass fiber can provide a variety of performance advantages due to their unique physical and chemical properties, especially in terms of thermal management, structural support, and cost control, which can complement the metal outer layer 12.

[0113] In step S20 above:

[0114] In some possible implementations, the step of fabricating a non-metallic partition structure 121 in the metal layer 120 includes: processing a plurality of partition grooves in the metal layer 120, and filling the partition grooves with non-metallic material to form the non-metallic partition structure 121. The metal outer layer 12 is divided into multiple independent metal regions 122 by the non-metallic partition structure 121. The non-metallic partition structure 121 can physically isolate high-temperature regions, reduce heat transfer between metals, effectively block the rapid diffusion of heat across the entire interface of the metal outer layer 12, reduce the heat-affected zone, prevent the overall temperature of the casing from becoming too high, reduce the risk of users directly contacting high-temperature regions, and reduce the "hot-hand feeling". Furthermore, by dividing the regions by the non-metallic partition structure 121, unshielded areas can be reserved for key components such as antennas and sensors while retaining the shielding performance of the metal outer layer 12, balancing electromagnetic protection and communication performance. The non-metallic partition structure 121 can also be embedded as a reinforcing rib in the metal outer layer 12 to improve the casing's resistance to bending and impact, and reduce deformation caused by drops or compression. In addition, the non-metallic partition structure 121 is also conducive to the design of anti-slip textures or soft rubber coatings, increasing friction, reducing the risk of equipment slipping, and providing a more ergonomic grip experience.

[0115] In some possible implementations, the shape of the non-metallic partition structure 121 includes at least one of the following: rectangle, rhombus, trapezoid, triangle, polygon, circle, ellipse, star, heart, leaf, cloud, spiral, mountain, snowflake, or hand-drawn graphic. These non-metallic partition structures 121 can divide the metal layer 120 into metal regions 122, including shapes such as rectangle, rhombus, trapezoid, triangle, polygon, circle, ellipse, star, heart, leaf, cloud, spiral, mountain, snowflake, and hand-drawn graphic. This effectively blocks the rapid diffusion of heat across the entire interface of the metal outer layer 12, reducing the risk of users directly contacting high-temperature areas and minimizing the "hot touch" sensation. It also allows the electronic product casing 10 to display different patterns, providing a richer aesthetic design.

[0116] In some possible implementations, the partition groove is filled with a non-metallic material including at least one of glass, ceramic, plastic, resin, or glass fiber. These materials all have low thermal conductivity, and as a partition structure, they act as a thermal buffer, absorbing instantaneous heat, reducing the sudden temperature rise of the metal outer layer 12, and slowly releasing the absorbed heat to balance temperature fluctuations and prevent the outer shell from feeling overheated. In this embodiment, the non-metallic material filling the partition groove can be the same as or different from the material of the inner layer 11.

[0117] In some possible implementations, the fabrication methods for the partition grooves include at least one of chemical etching, laser processing, or machining. These methods can all fabricate a plurality of partition grooves in the metal layer 120. Chemical etching involves transferring a pattern from a mask to the surface of the metal layer 120 using photolithography, followed by selective etching with a wet etching solution (such as hydrofluoric acid or nitric acid) to form grooves (i.e., partition grooves). Machining includes milling, which uses a milling machine and a rotating milling cutter to precisely remove metal material, creating high-precision partition grooves, suitable for small-batch production where extremely high precision is required. Laser processing includes laser etching, which, through program design, uses a short focal length objective lens to drill holes, resulting in a regular and uniform distribution of laser-etched partition grooves on the metal substrate. The parameters of laser etching (such as current and frequency) are adjustable, making it suitable for fabricating micron-level partition grooves. Laser processing also includes laser irradiation, which uses laser beams emitted from multiple laser oscillators to irradiate the metal surface through a scanning mirror, forming partition grooves.

[0118] In some possible implementations, a step of microtexturing the surface of the metal layer 120 is also included, forming a microtextured structure 13 at least on the surface of the metal layer 120 facing away from the inner layer 11. By providing the microtextured structure 13 on the surface of the metal region 122 in the metal outer layer 12, the heat transfer area between the outer shell surface and the user's skin can be reduced, thereby improving the user's thermal comfort.

[0119] In some possible implementations, the microtexturing process includes at least one of machining, chemical etching, laser processing, electrochemical processing, or vapor deposition. These microtexturing processes can create microtextured structures 13 on the surface of the metal layer 120. Different processes can be selected depending on the texture type and actual application requirements, or multiple processes can be used in combination. Machining processes include: embossing, which uses mechanical equipment to emboss on a metal plate, creating raised or recessed patterns on the surface; mechanical etching, which uses tools or abrasives to carve regular or irregular grooves, trenches, or grid structures on the metal surface, achieving high-precision processing and suitable for preparing micron-level textures; and chemical etching processes, including: photochemical etching, which involves exposure to form a plate, development, and removal of the protective film, allowing the metal surface to come into contact with a chemical solution for dissolution and corrosion, forming raised or hollow structures, capable of creating complex patterns, suitable for processing consumer products such as aluminum plate patterns and text; and chemical wet etching, which uses a chemical solution to selectively etch the metal surface, forming micron-level pits or trenches, offering low cost and high efficiency, suitable for large-area processing. Laser processing technologies include: laser engraving, which uses a laser to irradiate a metal surface, causing it to melt and vaporize instantaneously, forming grooves or patterns with micron-level linewidths; and laser irradiation, where a laser beam emitted from multiple laser oscillators is used to irradiate a metal surface through a scanning mirror, forming regular or irregular grooves, suitable for high-speed assembly line production and minimizing heat impact. Electrochemical processing technologies include: electrical discharge machining (EDM), which uses the electro-erosion effect generated by pulsed discharge between two electrodes immersed in a working fluid to remove conductive materials and form microstructures; micro-arc oxidation, which, in an electrolyte solution, applies a high voltage to create a microporous structure with a ceramic-like texture on the metal surface; physical vapor deposition (PVD), which, in a vacuum environment, uses low-voltage, high-current arc discharge technology to evaporate and deposit the target material onto the metal surface, forming nanoscale textures; and chemical vapor deposition (CVD), which utilizes gaseous precursors to undergo chemical reactions on the metal surface, depositing thin films or nanostructures.

[0120] In some possible implementations, the microtexture structure 13 includes at least one of a pyramid structure, wedge structure, pit structure, groove structure, protrusion structure, biomimetic structure, microneedle structure, or random structure. These microtexture structures 13 can all reduce the heat transfer area between the outer shell surface and the user's skin, improving the user's thermal comfort.

[0121] In some possible implementations, the surface roughness of the microtexture structure 13 is 10um to 100um; in this case, the surface roughness of the microtexture structure 13 reduces the heat transfer area between the outer shell surface and the user's skin, which can better improve the user's thermal sensation.

[0122] In some possible implementations, after forming the metal outer layer 12, the process further includes performing a surface treatment process on the surface of the metal outer layer 12 facing away from the inner layer 11 to form a surface treatment layer 14. By performing a surface treatment process on the surface of the metal outer layer 12 to form the surface treatment layer 14, the electronic product casing 10 can present different appearance effects and textures, better meeting the application needs of electronic products.

[0123] For example, anodizing can achieve rich colors, micro-arc oxidation can create gradient effects, and electroplating can impart high-end textures such as mirror finish, imitation gold, and imitation copper. Metal surfaces can also be combined with processes such as sandblasting (matte), brushing (stripes), laser engraving (logo or texture), and nano-injection molding (antenna seams) to present multi-layered visual effects on the same component.

[0124] In some possible implementations, the surface treatment process includes at least one of sandblasting, anodizing, vapor deposition, or spraying. These surface treatment layers 14 can further optimize the performance of the electronic product casing 10. Anodizing, through an electrochemical method, generates an oxide layer on the metal surface, increasing the casing's wear resistance, corrosion resistance, and insulation; it can also give the casing a matte or glossy texture, enhancing its premium feel. Spraying involves applying paint to the surface of the outer layer, which then cures to form a coating. This provides rich colors and gloss levels (matte / high gloss), enabling special effects such as gradients and textures, and protecting the metal outer layer 12 from scratches and corrosion. Vapor deposition, such as physical vapor deposition, deposits metal or compound layers through vacuum deposition, forming an ultra-hard coating. It can also deposit decorative metallic colors (such as titanium gold, rose gold), improving both wear resistance and enhancing texture and aesthetics. Sandblasting is a coating formed by high-speed jetting of abrasive particles (such as sand, glass beads, alumina, etc.) impacting the material surface. Sandblasting can create a uniform and delicate matte surface, reduce reflections, and enhance the high-end texture. By adjusting the abrasive particle size and blasting pressure, a variety of texture effects, from fine matte to coarse grain, can also be achieved.

[0125] In some possible implementations, the thickness of the surface treatment layer 14 is 2 μm to 50 μm. This thickness is sufficient to ensure the appearance and texture of the electronic product casing 10. In practical applications, the thickness of the surface treatment layer 14 can be flexibly adjusted according to the positioning of the electronic product and the thickness of the casing.

[0126] In some possible implementations, the thickness of the inner layer 11 is 0.1 mm to 1 mm; at this thickness, it can serve as a good heat insulation layer, slowing down the rate at which heat is transferred from the inside to the metal outer layer 12, reducing the direct conduction of high internal temperature to the outer shell surface, preventing the outer shell from heating up rapidly due to short-term high load, and avoiding the problem of the metal outer layer 12 becoming too hot to the touch under high load.

[0127] In some possible implementations, the thickness of the metal outer layer 12 is 0.1 mm to 1 mm. At this thickness, the metal outer layer 12 can quickly transfer heat generated by the internal components to the surface of the casing and dissipate heat through air convection or radiation, making the surface temperature of the casing closer to the ambient temperature, so that the user will not feel a significant difference in temperature when touching it. Furthermore, diverse designs can be achieved through surface treatment, allowing the electronic product casing 10 to exhibit rich colors and textures, enhancing its premium feel.

[0128] In some possible implementations, the thickness of the non-metallic partition structure 121 is no greater than the thickness of the metallic outer layer 12. The thickness of the non-metallic partition structure 121 can be flush with the thickness of the metallic outer layer 12 (i.e., equal, the surface partition structure of the electronic product casing 10 is flush with the high thermal conductivity metallic outer layer 12), increasing the smoothness of the casing surface, or it can be less than the thickness of the metallic outer layer 12, increasing the texture of the casing surface.

[0129] In some possible implementations, the spacing between two adjacent metal regions 122 in the metal outer layer 12 is 50 μm to 2 mm. In this case, the non-metallic partition area between two adjacent metal regions 122 in the metal outer layer 12 can play a good role in heat buffering, absorbing instantaneous heat, reducing the sudden temperature rise of the metal outer layer 12, and slowly releasing the absorbed heat to balance temperature fluctuations and prevent the outer casing from feeling too hot to the touch.

[0130] In some possible implementations, the electronic product casing 10 includes products such as mobile phone back covers, tablet back covers, personal computer casings, smartwatch back covers, and VR (virtual reality) glasses casings.

[0131] Thirdly, embodiments of this application provide an electronic product, which includes the electronic product casing 10 described above or the electronic product casing 10 prepared by the above-described method.

[0132] The electronic product in this application embodiment includes the aforementioned electronic product casing 10. This casing is equipped with an inner layer 11 and a metal outer layer 12. The metal outer layer 12 ensures the metallic texture and ID effect of the casing, while the low thermal conductivity inner layer 11 and the non-metallic partition structure 121 suppress rapid heat conduction, ensuring a better thermal experience for the casing. Therefore, the user experience of the electronic product can be significantly improved.

[0133] In some possible implementations, the electronic products include mobile phones, tablets, personal computers, smartwatches, VR (virtual reality) glasses, and other products. For example, the back cover of a mobile phone, a tablet, a personal computer, a smartwatch, or a VR (virtual reality) glasses may utilize the aforementioned electronic product housing 10.

[0134] Example

[0135] The following description uses specific embodiments. These embodiments are exemplary and are only used to explain this application, and should not be construed as limiting the application. Where specific techniques or conditions are not specified in the embodiments, they are performed according to the techniques or conditions described in the literature in this field or according to the product instructions. Reagents or instruments used, unless otherwise specified, are all commercially available conventional products.

[0136] Example 1

[0137] This application provides a mobile phone case, as shown in the attached figure. Figure 6 As shown, its preparation includes the following steps:

[0138] 1. The inner layer 11 of glass fiber (0.2mm thick) and the aluminum metal layer 120 (0.2mm thick) are bonded together using 0.1mm glue to form a stable structure; as shown in the attached figure. Figure 6 As shown in Figure (a).

[0139] 2. Isolation grooves are machined in the metal layer 120 using an etching process. The depth of the isolation grooves is 0.2mm (i.e., flush with the thickness of the aluminum layer), and the width is 0.5mm; the distance between adjacent isolation grooves is 10mm; as shown in the attached figure. Figure 6 As shown in Figure (b).

[0140] 3. Fill the partition groove with glue, then polish the surface to form a non-metallic partition structure 121, as shown in the attached document. Figure 6 As shown in Figure (c), at this point, the metal layer 120 is divided into multiple square shapes with a size of 9.5mm * 9.5mm, resulting in the metal outer layer 12; as shown in the attached figure. Figure 6 As shown in Figure (d).

[0141] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 10um, forming a microtexture structure 13.

[0142] 5. Spray polysiloxane onto the surface of the metal outer layer 12 with a thickness of 5μm to form a surface treatment layer 14, thus obtaining the mobile phone casing, as shown in the attached figure. Figure 6 As shown in Figure (e).

[0143] Example 2

[0144] This application provides a mobile phone case, as shown in the attached figure. Figure 7 As shown, its preparation includes the following steps:

[0145] 1. The inner layer 11 of glass fiber (0.2mm thick) and the titanium metal layer 120 (0.2mm thick) are bonded together using 0.1mm glue to form a stable structure; as shown in the attached figure. Figure 7 As shown in Figure (a).

[0146] 2. An etching process is used to machine a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.2mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.5mm; as shown in the attached figure. Figure 7 As shown in Figure (b).

[0147] 3. Fill the partition groove with glue, then polish the surface to form a non-metallic partition structure 121, as shown in the attached document. Figure 7 As shown in Figure (c); at this point, the metal layer 120 is divided into multiple rhomboid shapes to obtain the metal outer layer 12; as shown in the attached figure. Figure 7 As shown in Figure (d).

[0148] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 10um, forming a microtexture structure 13.

[0149] 5. Perform vapor deposition on the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing, as shown in the attached figure. Figure 7 As shown in Figure (e).

[0150] Example 3

[0151] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0152] 1. The inner ceramic layer 11 with a thickness of 0.3 mm and the magnesium metal layer 120 with a thickness of 0.3 mm are bonded together with 0.1 mm glue to form a stable structure.

[0153] 2. An etching process is used to process a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.3mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.3mm.

[0154] 3. Fill the partition groove with resin, and then polish the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple triangular shapes to obtain the metal outer layer 12; as shown in the attached figure. Figure 8 As shown.

[0155] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0156] 5. Sandblasting is performed on the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0157] Example 4

[0158] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0159] 1. The inner layer 11 of resin with a thickness of 0.3 mm and the metal layer 120 of titanium alloy with a thickness of 0.3 mm are bonded together to form a stable structure.

[0160] 2. An etching process is used to process a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.3mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.3mm.

[0161] 3. Fill the partition groove with resin, and then polish the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple heart shapes to obtain the metal outer layer 12; as shown in the attached figure. Figure 9 As shown.

[0162] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0163] 5. Sandblasting is performed on the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0164] Example 5

[0165] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0166] 1. Use 0.1mm glue to bond the inner glass layer 11 (0.2mm thick) and the stainless steel metal layer 120 (0.3mm thick) together to form a stable structure.

[0167] 2. An etching process is used to process a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.3mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.4mm.

[0168] 3. Fill the partition groove with resin, and then polish the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple circles to obtain the metal outer layer 12; as shown in the attached figure. Figure 10 As shown.

[0169] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0170] 5. Sandblasting is performed on the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0171] Example 6

[0172] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0173] 1. The inner plastic layer 11 with a thickness of 0.2mm and the metal layer 120 of aluminum alloy with a thickness of 0.2mm are bonded together to form a stable structure.

[0174] 2. An etching process is used to process a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.2mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.6mm.

[0175] 3. Fill the partition groove with resin, and then polish the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple polygons to obtain the metal outer layer 12; as shown in the attached figure. Figure 11 As shown.

[0176] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0177] 5. Sandblasting is performed on the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0178] Example 7

[0179] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0180] 1. The inner plastic layer 11 with a thickness of 0.2 mm and the metal layer 120 of magnesium alloy with a thickness of 0.2 mm are bonded together to form a stable structure.

[0181] 2. An etching process is used to process a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.2mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.6mm.

[0182] 3. Fill the partition groove with resin, and then polish the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple star shapes to obtain the metal outer layer 12; as shown in the attached figure. Figure 12 As shown.

[0183] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0184] 5. Sandblasting is performed on the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0185] Example 8

[0186] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0187] 1. The inner ceramic layer 11 with a thickness of 0.2 mm and the metal layer 120 of magnesium alloy with a thickness of 0.2 mm are bonded together with 0.1 mm glue to form a stable structure.

[0188] 2. An etching process is used to process a partition groove in the metal layer 120, wherein the depth of the partition groove is 0.2mm (i.e., flush with the thickness of the metal layer 120) and the width is 0.5mm.

[0189] 3. Fill the partition groove with resin, and then polish the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple irregular shapes to obtain the metal outer layer 12; as shown in the attached figure. Figure 13 As shown.

[0190] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0191] 5. Spray coating is applied to the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0192] Example 9

[0193] This application provides a mobile phone casing, the preparation of which includes the following steps:

[0194] 1. The inner layer 11 of glass fiber with a thickness of 0.2mm and the metal layer 120 of magnesium alloy with a thickness of 0.2mm are bonded together with 0.1mm glue to form a stable structure.

[0195] 2. Using an etching process, a partition groove with a hand-drawn graphic is machined in the metal layer 120. The partition groove has a depth of 0.2mm (i.e., flush with the thickness of the metal layer 120) and a width of 0.5mm.

[0196] 3. Fill the partition groove with glue, then polish the surface to form a non-metallic partition structure 121. At this point, the partition groove with the hand-drawn graphic of the metal layer 120 is divided into multiple areas, resulting in the metal outer layer 12; as shown in the attached diagram. Figure 14 As shown.

[0197] 4. A texture is etched on the metal layer 120 after the partition, with a texture depth of 25um, forming a microtexture structure 13.

[0198] 5. Spray coating is applied to the surface of the metal outer layer 12 to form a surface treatment layer 14, thus obtaining the mobile phone casing.

[0199] Example 10

[0200] This application provides a method for connecting a mobile phone casing to a mobile phone mid-frame 20, as shown in the attached figure. Figure 15 As shown, the edge of the phone casing is in contact with the phone frame 20. A sealant 30 can also be provided between the phone casing and the phone frame 20 to improve the overall airtightness.

[0201] Example 11

[0202] This application provides a mobile phone casing, the structure of which is shown in the attached figure. Figure 1 As shown, its preparation includes the following steps:

[0203] 1. The inner layer 11 of glass fiber with a thickness of 0.2mm and the aluminum metal layer 120 with a thickness of 0.2mm are bonded together with 0.1mm glue to form a stable structure.

[0204] 2. An etching process is used to process partition grooves in the metal layer 120. The depth of the partition groove is 0.2mm (i.e., flush with the thickness of the aluminum layer) and the width is 0.5mm. The distance between adjacent partition grooves is 10mm.

[0205] 3. Fill the partition groove with glue, and then use a polishing process to smooth the surface to form a non-metallic partition structure 121. At this time, the metal layer 120 is divided into multiple square shapes with a size of 9.5mm*9.5mm to obtain the metal outer layer 12, thus obtaining the mobile phone shell.

[0206] Comparative Example 1

[0207] This application's comparative example uses a 0.4mm thick pure aluminum metal layer 120 as the mobile phone casing, as shown in the attached figure. Figure 16 As shown.

[0208] Comparative Example 2

[0209] The comparative example of this application uses a pure glass fiber inner layer 11 with a thickness of 0.4mm as the mobile phone shell, as shown in the attached figure. Figure 17 As shown.

[0210] Comparative Example 3

[0211] This application compares the two applications by bonding a 0.2mm thick glass fiber inner layer 11 and a 0.2mm thick aluminum metal layer 120 together using 0.1mm glue to form a stable structure, resulting in a mobile phone casing, as shown in the attached figure. Figure 18 As shown.

[0212] To verify the advancement of the embodiments of this application, thermal comfort effect tests were conducted on the mobile phone casings prepared in the above embodiments and comparative examples:

[0213] Using the temperature of a pure aluminum mobile phone casing at 41°C as a benchmark, after the skin touches the material at this temperature, the temperature change of the nerve endings under the skin is observed, and the temperature of the nerve endings under the skin at 10 seconds of contact is used as the basis for judging the perceived temperature.

[0214] The test results are shown in Table 1 below:

[0215] Table 1

[0216]

[0217]

[0218] The test results show that when the outer shell of Comparative Example 1 is made of pure aluminum, the perceived temperature is 40.6℃, which is slightly lower than the actual temperature of 41℃. This is mainly due to the fact that the thickness of the test product is only 0.4mm. The thinness of the product allows the user's body to conduct and dissipate heat instantaneously to the area of ​​the outer shell in contact with it, resulting in a slightly lower perceived temperature than the actual temperature. When the outer frame of Comparative Example 2 is made of pure fiberglass, the perceived temperature is only 38℃. Comparing Comparative Example 1 and Comparative Example 2 shows that, under the same actual temperature, the perceived temperature of Comparative Example 2 (fiberglass) is significantly lower than that of Comparative Example 1 (pure aluminum), indicating that different materials result in significant differences in perceived thermal comfort. Compared to the pure aluminum shell of Comparative Example 1, the thermal perceived gain of the fiberglass shell of Comparative Example 2 is 40.6℃-38℃=2.6℃. At this time, if the actual temperature of the fiberglass shell of Comparative Example 2 is raised to (41+2.6)℃=43.6℃, ​​then the perceived temperature of the pure fiberglass shell of Comparative Example 2 felt by the nerve endings at 10 seconds will be very close to or the same as the perceived temperature of the pure aluminum shell of Comparative Example 1 with an actual temperature of 41℃.

[0219] The electronic product casing provided in this application includes a low thermal conductivity inner layer 11, a metal outer layer 12, and a non-metallic partition structure 121, significantly reducing the perceived temperature of the casing. This is mainly attributed to the fact that the inner layer 11 acts as a heat insulation layer, slowing down the rate at which heat is transferred from the interior to the metal outer layer 12, thus preventing the casing from rapidly heating up due to short-term high load. The non-metallic partition structure 121 reduces heat transfer between metals, effectively blocking the rapid diffusion of heat across the entire interface of the metal outer layer 12, reducing the risk of users directly contacting high-temperature areas, and lowering the perceived temperature of the casing. The metal outer layer 12 achieves diverse designs through micro-texture structures and surface treatments, giving the electronic product casing a rich aesthetic appearance and enhancing its premium feel. Specifically, in Example 1, compared to Comparative Example 3, the perceived temperature is reduced by 0.4°C due to the inclusion of a 0.5mm wide adhesive partition structure, a micro-texture structure, and a surface treatment layer. In Example 6, compared to Comparative Example 3, the perceived temperature is reduced by 0.5°C due to the replacement of the inner layer 11 material and the widening of the partition structure. Compared to Comparative Example 3, Example 11 reduced the perceived temperature by 0.3°C due to the inclusion of a 0.5mm wide adhesive partition structure. In Examples 2 and 4-5, the metal outer layer 12 was made of titanium or stainless steel, which has high thermal conductivity, thus reducing the perceived temperature of the casing. In Examples 3 and 7-9, the metal outer layer 12 was made of magnesium or magnesium alloy, which has relatively low thermal conductivity. Combined with different inner layers 11 and partition structures, the perceived temperature of the casing was relatively higher than in other examples with metal casings.

[0220] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. The protection scope of this application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. An electronic product casing, characterized in that, The device includes an inner layer with a thermal conductivity of less than 10 W / mK and a metal outer layer, which are laminated together. The inner layer is disposed facing the interior of the electronic product. The metal outer layer has a non-metallic partition structure, which divides the metal outer layer into multiple regions.

2. The electronic product casing as described in claim 1, characterized in that, The thermal conductivity of the metal outer layer is 10 W / mK higher than that of the inner layer; And / or, the thermal conductivity of the metal outer layer is 10 W / mK higher than that of the non-metallic partition structure.

3. The electronic product casing as described in claim 2, characterized in that, The material of the metal outer layer includes at least one of aluminum, aluminum alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, copper, copper alloy, or stainless steel. And / or, the material of the inner layer includes at least one of glass, ceramic, plastic, resin, glass fiber, or metal with a thermal conductivity of less than 10 W / mK; And / or, the material of the non-metallic partition structure includes at least one of glass, ceramic, plastic, resin or glass fiber.

4. The electronic product casing as described in any one of claims 1 to 3, characterized in that, The shape of the non-metallic partition structure includes at least one of the following: rectangle, rhombus, trapezoid, triangle, polygon, circle, ellipse, star, heart, leaf, cloud, spiral, mountain, snowflake, or hand-drawn graphic.

5. The electronic product casing as described in any one of claims 1 to 4, characterized in that, The thickness of the inner layer is 0.1 mm to 1 mm; And / or, the thickness of the metal outer layer is 0.1 mm to 1 mm; And / or, the thickness of the non-metallic partition structure is not greater than the thickness of the metallic outer layer; And / or, the spacing between two adjacent metal regions in the metal outer layer is 50μm to 2mm.

6. The electronic product casing as described in claim 5, characterized in that, The metallic outer layer is divided into multiple regions by the non-metallic partition structure, which is in contact with the inner layer.

7. The electronic product casing as described in any one of claims 1 to 6, characterized in that, The surface of the metal region in the metal outer layer has a micro-textured structure; And / or, in the electronic product housing, the surface of the metal outer layer facing away from the inner layer also has a surface treatment layer.

8. The electronic product casing as described in claim 7, characterized in that, The microtexture structure includes at least one of the following: pyramid structure, wedge structure, pit structure, groove structure, protrusion structure, biomimetic structure, microneedle structure, or random structure. And / or, the surface roughness of the microtextured structure is 10µm to 100µm; And / or, the surface treatment layer includes at least one of a sandblasting layer, an anodized layer, a vapor deposition layer, or a sprayed layer; And / or, the thickness of the surface treatment layer is 2μm to 50μm.

9. A method for preparing an electronic product casing, characterized in that, Includes the following steps: The inner layer and the metal layer are laminated together with a thermal conductivity of less than 10 W / mK; A non-metallic partition structure is prepared in the metal layer to divide the metal layer into multiple regions. A metallic outer layer is formed on the surface of the inner layer to obtain an electronic product casing.

10. The method for preparing an electronic product casing as described in claim 9, characterized in that, The inner layer and the metal layer are directly bonded together or bonded together using an adhesive material; And / or, the step of preparing a non-metallic partition structure in the metal layer includes: processing a plurality of partition grooves in the metal layer, and filling the partition grooves with non-metallic material to form the non-metallic partition structure.

11. The method for preparing an electronic product casing as described in claim 10, characterized in that, The processing method for the partition groove includes at least one of chemical etching, laser processing, or mechanical processing.

12. The method for preparing an electronic product casing as described in any one of claims 9 to 11, characterized in that, It also includes a step of microtexturing the surface of the metal layer, forming a microtextured structure at least on the surface of the metal layer opposite to the inner layer; And / or, it further includes the step of: performing a surface treatment process on the surface of the metal outer layer opposite to the inner layer to form a surface treatment layer.

13. The method for preparing an electronic product casing as described in claim 12, characterized in that, The microtexturing process includes at least one of machining, chemical etching, laser processing, electrochemical processing, or vapor deposition. And / or, the surface treatment process includes at least one of sandblasting, anodizing, vapor deposition, or spraying.

14. An electronic product, characterized in that, The electronic product includes an electronic product casing as described in any one of claims 1 to 8 or an electronic product casing prepared by the preparation method described in any one of claims 9 to 13.

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