Power conversion apparatus and energy storage system
Patent Information
- Application Number
- CN202510542824.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-27
- Publication Date
- 2026-10-30
AI Technical Summary
目前,功率变换设备通常采用液冷散热,由于功率变换设备内的电子器件的种类、发热量等各不相同,依靠将各类电子器件集中贴装在液冷板上难以满足功率变换设备的实际散热需求
[0034]根据本申请的第二方面,提供一种储能系统,包括上述功率变换设备。
Smart Images

Figure CN123021589A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of energy storage technology, and in particular to a power conversion device and energy storage system. Background Technology
[0002] As the energy storage capacity of energy storage systems increases, the power conversion equipment also needs to provide greater power, which in turn increases the heat dissipation pressure. Currently, power conversion equipment typically uses liquid cooling. However, since the types of electronic components and their heat generation vary within the power conversion equipment, simply mounting all the various electronic components together on a liquid cooling plate is insufficient to meet the actual heat dissipation requirements of the power conversion equipment. Summary of the Invention
[0003] This application provides a power conversion device to at least partially solve the above-mentioned technical problems.
[0004] To achieve the above objectives, according to a first aspect of this application, a power conversion device is provided, comprising:
[0005] The first cold plate has the first heat exchange surface;
[0006] Multiple side plates are connected to the first cold plate and enclose a receiving cavity with an opening, and the first heat exchange surface is located inside the receiving cavity;
[0007] A cover is provided over the opening;
[0008] An electronic device unit is at least partially disposed on the first heat exchange surface;
[0009] The accommodating cavity is divided into multiple chambers, and at least one side plate is divided into at least one refrigerant channel and at least one air-cooling channel. At least one air-cooling channel connects to at least one of the chambers, and the power conversion device is provided with a first fan, which is configured to drive air circulation connecting the air-cooling channel and the chamber connecting the air-cooling channel.
[0010] Optionally, the plurality of side plates include a first side plate, the plurality of chambers include a first chamber, the air-cooling channel includes a first air-cooling channel, the first air-cooling channel is disposed on the first side plate, and the first chamber is connected to the first air-cooling channel;
[0011] The electronic device unit includes a power device, which is disposed in the first chamber and attached to the first heat exchange surface.
[0012] Optionally, the first chamber is divided into a first sub-chamber and a second sub-chamber, the power device is disposed in the first sub-chamber, the electronic device unit further includes a second device, the second device is disposed in the second sub-chamber, and at least one of the air-cooling channels communicates with the second sub-chamber.
[0013] Optionally, the power conversion device further includes a first partition, which is disposed in the first chamber to separate and form a first sub-chamber and a second sub-chamber. The first partition is provided with a first vent, which connects the first sub-chamber and the second sub-chamber, and the second sub-chamber is connected to the first air-cooling channel.
[0014] Optionally, the second device is configured as a capacitor and attached to the first heat exchange surface. The first side plate is provided with a first air outlet and a first air inlet. The first air outlet and the first air inlet are respectively connected to the first air-cooling channel. The first air outlet, the second sub-chamber, the first sub-chamber and the first air inlet are connected in sequence.
[0015] Optionally, the power conversion device further includes a second partition and a second fan. The second partition is disposed in the first chamber and spaced between the power device and the cover to separate the first chamber in a first direction and form an upper space and a lower space.
[0016] The electronic device unit further includes a third device located in the upper space, and the second fan is configured to air-cool the third device.
[0017] Optionally, the plurality of side panels further include a second side panel connected to the first side panel, and the air-cooling channel further includes a second air-cooling channel disposed on the second side panel and connected to the upper space. The second fan is configured to drive air circulation connecting the upper space and the second air-cooling channel.
[0018] Optionally, the plurality of chambers further includes a second chamber, the second chamber and the first chamber being distributed in a second direction, the second side plate facing the first chamber and the second chamber in a third direction, and the first direction and the second direction intersecting, the electronic device unit further includes a fourth device, the fourth device being disposed in the second chamber;
[0019] The second side panel is provided with a second air outlet and a second air inlet. The second air outlet and the second air inlet are respectively connected to the second air-cooling channel, and the second air outlet, the second chamber, the upper space and the second air inlet are connected in sequence.
[0020] Optionally, the power conversion device further includes a third partition, which is disposed in the receiving cavity to separate the first chamber and the second chamber. The third partition is located between the second air outlet and the second air inlet in the second direction. The third partition is provided with a second ventilation opening, which connects the upper space and the second chamber.
[0021] And / or, the power conversion device further includes an isolation enclosure that covers the first fan to separate the first fan from the upper space.
[0022] Optionally, the power conversion device further includes a baffle plate disposed in the upper space. The baffle plate is connected to the third partition and the second partition respectively. The baffle plate is spaced between the second vent and the second air inlet, and the baffle plate has a gap with the first side plate in the third direction.
[0023] Optionally, the plurality of chambers may further include a third chamber, and the electronic device unit may further include a fifth device disposed in the third chamber.
[0024] Optionally, the side plate further includes a third side plate connected to the first side plate. The power conversion device further includes a fourth partition, which is disposed in the receiving cavity. The fourth partition is connected to the first side plate and the third partition in the second direction, so as to form the third chamber with the third side plate in the third direction.
[0025] Optionally, the power conversion device further includes a second cold plate, which is disposed in the third chamber and heat-exchange connected to the fifth device.
[0026] Optionally, at least one of the refrigerant channels is disposed on the third side plate, and the refrigerant channel is configured to exchange heat with the third chamber.
[0027] Optionally, the side plate further includes a fourth side plate, which is connected to the second side plate and the third side plate respectively, and the fourth side plate and the first side plate are spaced apart in the second direction. The first side plate, the second side plate, the third side plate, the fourth side plate and the first cold plate enclose the receiving cavity, and the fourth side plate is configured to be able to provide wiring terminals.
[0028] Optionally, at least one of the side plates includes an inner sidewall and a first heat exchanger. The inner sidewall connects the first cold plate and the cover to enclose and form the receiving cavity. The first heat exchanger is located on the side of the inner sidewall opposite to the receiving cavity. The refrigerant channel and the air-cooling channel are respectively located inside the first heat exchanger.
[0029] Optionally, at least one of the side plates further includes an outer side wall connecting the first cold plate and the cover, and the first heat exchanger is disposed between the outer side wall and the inner side wall.
[0030] Optionally, the first heat exchanger has at least two of the air-cooled channels;
[0031] At least one of the air-cooled channels is located on the side of the refrigerant channel facing the receiving cavity;
[0032] Alternatively, the air-cooled channel may be located on the side of the refrigerant channel opposite to the receiving cavity.
[0033] Optionally, the first heat exchanger is provided with a heat dissipation protrusion in the air-cooled channel.
[0034] According to a second aspect of this application, an energy storage system is provided, including the power conversion device described above.
[0035] Beneficial Effects: The power conversion device of this application embodiment includes a first cold plate, multiple side plates, a cover, and electronic device units. The first cold plate has a first heat exchange surface, and the multiple side plates are connected to the first cold plate and enclose an open receiving cavity, with the first heat exchange surface located inside the receiving cavity. The cover is disposed over the opening, and at least a portion of the electronic device units is disposed on the first heat exchange surface. The receiving cavity is divided into multiple chambers, and at least one side plate is divided into at least one refrigerant channel and at least one air-cooled channel. The at least one air-cooled channel connects to at least one chamber. The power conversion device is equipped with a first fan, which is configured to drive air circulation connecting the air-cooled channel and the chamber connected to the air-cooled channel. The electronic device units can be flexibly arranged in each chamber as needed to reduce the mutual heat dissipation impact between electronic devices. While the first cold plate provides heat dissipation for at least some electronic devices, the first fan can drive the air in the chamber to circulate into the air-cooled channel for heat exchange with the refrigerant in the refrigerant channel, thereby realizing circulating air cooling of the electronic devices in the chamber connected to the air-cooled channel, which is beneficial to further improve the heat dissipation effect of the electronic devices.
[0036] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0038] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.
[0039] Figure 1 This is a schematic diagram of the power conversion device provided in the embodiments of this application;
[0040] Figure 2 This is an exploded structural diagram of the power conversion device provided in the embodiments of this application;
[0041] Figure 3 This is a schematic diagram of the structure of the lower space of the first chamber provided in an embodiment of this application;
[0042] Figure 4 This is a schematic diagram of the upper space of the first chamber provided in an embodiment of this application;
[0043] Figure 5 This is a schematic diagram of the distribution structure of the first heat exchanger and the second heat exchanger provided in the embodiments of this application;
[0044] Figure 6 This is a schematic diagram of the structure of the first heat exchanger provided in the embodiment of this application;
[0045] Figure 7 This is a cross-sectional view of the first heat exchanger provided in the embodiment of this application;
[0046] Figure 8 This is a schematic diagram of the structure from the top view of the opening provided in an embodiment of this application;
[0047] Figure 9 This is a schematic diagram of the structure of the first heat exchanger provided in another embodiment of this application;
[0048] Figure 10 This is a cross-sectional view of a first heat exchanger provided in another embodiment of this application.
[0049] Explanation of reference numerals in the attached figures:
[0050] 1-First cold plate; 10-First heat exchange surface; 11-Support; 12-First liquid inlet; 13-First liquid outlet;
[0051] 2-Side panel; 2a-First side panel; 2b-Second side panel; 2c-Third side panel; 2d-Fourth side panel; 20-Refrigerant passage; 21-Air-cooled passage; 210-First air-cooled passage; 211-Second air-cooled passage; 22-First air outlet; 23-First air inlet; 24-Second air outlet; 25-Second air inlet; 26-Inner wall; 27-First heat exchanger; 270-Heat dissipation protrusion; 271-Connecting pipe; 272-Second liquid inlet; 273-Second liquid outlet; 274-Allowing opening; 28-Outer wall; 280-End face; 281-Terminal; 282-Handle; 29-Second heat exchanger;
[0052] 3-Cap;
[0053] 4-Electronic device unit; 40-Power device; 41-Second device; 42-Third device; 43-Fourth device; 44-Fifth device;
[0054] 5-Accommodation cavity; 50-Opening; 51-Cavity; 510-First chamber; 5100-First sub-chamber; 5101-Second sub-chamber; 5102-Upper space; 5103-Lower space; 511-Second chamber; 512-Third chamber; 52-First partition; 520-First vent; 53-Second partition; 54-Baffle; 55-Third partition; 550-Second vent; 56-Fourth partition;
[0055] 6-First fan; 60-Isolation cover;
[0056] 7-Second fan;
[0057] 8-Second cold plate;
[0058] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation
[0059] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.
[0060] Power conversion equipment typically uses liquid cooling. However, since the types of electronic components and their heat generation vary, simply mounting all the electronic components on a liquid cooling plate is insufficient to meet the actual heat dissipation requirements of the power conversion equipment.
[0061] In view of the above, embodiments of this application provide a power conversion device and an energy storage system to overcome at least one of the above-mentioned technical problems.
[0062] Reference Figure 1 and Figure 2 The power conversion device includes a first cold plate 1, multiple side plates 2, a cover 3, and an electronic device unit 4.
[0063] It should be noted that in the following embodiments of this application, a first direction X, a second direction Y, and a third direction Z intersect each other. Specifically, the first cold plate 1 and the cover 3 are arranged at intervals along the first direction X, the second direction Y is approximately parallel to the width direction of the first cold plate 1, and the third direction Z is approximately parallel to the length direction of the first cold plate 1.
[0064] Taking the first cold plate 1 as an example of a liquid-cooled plate, the first cold plate 1 has a plate-like structure. The first cold plate 1 extends in the horizontal plane formed by the second direction Y and the third direction Z. The top of the first cold plate 1 is the side with the largest area, which is the first heat exchange surface 10. (Refer to...) Figure 2 Multiple side plates 2 are connected to the first cold plate 1 and enclose a cavity 5 with an opening 50. The first heat exchange surface 10 is located inside the cavity 5. A cover 3 is placed over the opening 50, and at least a portion of the electronic device unit 4 is disposed on the first heat exchange surface 10. The first heat exchange surface 10 and the cover 3 serve as the upper and lower enclosure surfaces, respectively, and the multiple side plates 2 serve as the side enclosure surfaces, forming a cavity as shown in the figure. Figure 1 The hexahedral structure shown has a hollow interior forming the aforementioned receiving cavity. For example... Figure 3 As shown, the receiving cavity 5 is divided into multiple chambers 51. The side plate 2 is divided into at least one refrigerant channel 20 and at least one air-cooled channel 21. The at least one air-cooled channel 21 connects to at least one chamber 51. The power conversion device includes a first fan 6, which is configured to drive air circulation between the air-cooled channel 21 and the chambers 51 connected to the air-cooled channel 21. One or more chambers 51 may be connected to one air-cooled channel 21, or multiple chambers 51 may be connected to multiple air-cooled channels 21 in a one-to-one correspondence, or one chamber 51 may be connected to multiple air-cooled channels 21.
[0065] Electronic device units 4 can be flexibly arranged in each chamber 51 as needed to reduce the mutual heat dissipation impact between electronic devices. The first cold plate 1 provides heat dissipation for at least some electronic devices. At the same time, the first fan 6 can drive the air in the chamber 51 to circulate into the air-cooled channel 21 to exchange heat with the refrigerant in the refrigerant channel 20, thereby realizing the circulating air cooling of the electronic devices in the chamber 51 connected to the air-cooled channel 21, which is beneficial to further improve the heat dissipation effect of the electronic devices. It should be noted that the first cold plate 1, multiple side plates 2, and cover 3 form a box structure, and the three can be fixed to each other by welding or other methods. The first cold plate 1 is provided with brackets 11 on both sides in the third direction Z to fix the first cold plate 1 and facilitate the connection of the side plates 2. The refrigerant can be a phase change refrigerant such as R32, R410, etc., or water, ethylene glycol, transformer oil, etc., or a mixture thereof. By adjusting the type of refrigerant, the side plates 2 and the first cold plate 1 can be used to cool or heat the power conversion equipment.
[0066] In some embodiments, refer to Figure 3 and Figure 4 Multiple side panels 2 include a first side panel 2a, multiple chambers 51 include a first chamber 510, and an air-cooling channel 21 includes a first air-cooling channel 210. The first air-cooling channel 210 is disposed on the first side panel 2a, and the first chamber 510 is connected to the first air-cooling channel 210. Specifically, the side of the first side panel 2a facing the first chamber 510 is provided with a first air outlet 22 and a first air inlet 23, and as shown... Figure 3 As shown, the first fan 6 is fixed at the first air outlet 22. The first fan 6 can draw air from the first air-cooling channel 210 and introduce it into the first chamber 510. It is understood that in other embodiments, the installation position of the first fan 6 can also be flexibly adjusted as needed to ensure that it can drive air circulation to connect the first chamber 510 and the first air-cooling channel 210.
[0067] It should be noted that in other embodiments, the first fan 6 can also be set at the first air inlet 23 or other positions in the first chamber 510. Setting the first fan 6 at the first air outlet 22 results in lower air temperature flowing through the first fan 6, which is beneficial to extending the service life of the first fan 6.
[0068] Electronic device unit 4 includes a first device, which is configured as a power device 40. The power device 40 can be an IGBT, MOSFET, or other similar device. The power device 40 is located in the first chamber 510 and is attached to the first heat exchange surface 10. Prioritizing both liquid cooling heat exchange from the first cold plate 1 and air cooling heat dissipation from the first air cooling channel 210, the power device 40 is provided with improved heat dissipation, thereby controlling the power device 40 to operate at an optimal temperature.
[0069] In some embodiments, refer to Figure 3 The first chamber 510 is divided into a first sub-chamber 5100 and a second sub-chamber 5101. The power device 40 is located in the first sub-chamber 5100. The electronic device unit 4 also includes a second device 41, which is located in the second sub-chamber 5101. At least one air-cooling channel 21 connects to the second sub-chamber 5101. It is understood that the air-cooling channel 21 connecting to the second sub-chamber 5101 can be the aforementioned first air-cooling channel 210, or it can be another air-cooling channel 21 formed within the side plate 2, independent of the first air-cooling channel 210. The second device 41 and the power device 40 are spaced apart in different sub-chambers 51, which helps to reduce mutual thermal radiation effects.
[0070] In some embodiments, refer to Figure 2 , Figure 3 The power conversion device also includes a first separator 52, a third separator 55, and a fourth separator 56. Multiple side plates 2 include a first side plate 2a, a second side plate 2b, a third side plate 2c, and a fourth side plate 2d. The four side plates are connected end-to-end on the plane formed by the third direction Z and the second direction Y, forming a U-shaped structure. The first side plate 2a and the fourth side plate 2d are spaced apart and parallel to each other in the second direction Y. The length directions of the first side plate 2a and the fourth side plate 2d are parallel to the third direction Z, the width directions are parallel to the first direction X, and the thickness directions are parallel to the second direction Y. The second side plate 2b and the third side plate 2c are spaced apart and parallel to each other in the third direction Z. The length directions of the second side plate 2b and the third side plate 2c are parallel to the second direction Y, the width directions are parallel to the first direction X, and the thickness directions are parallel to the third direction Z. The second side plate 2b and the third side plate 2c are respectively connected to the two ends of the first side plate 2a in the third direction Z and the two ends of the fourth side plate 2d in the third direction Z to form an overall frame structure. The first side plate 2a, the second side plate 2b, the third side plate 2c and the fourth side plate 2d are respectively connected to the first cold plate 1 and the cover 3 to form the box structure with the receiving cavity 5. Among them, the third partition 55 is connected between the relative inner walls of the second side plate 2b and the third side plate 2c in the third direction Z, and the fourth partition 56 is connected between the first side plate 2a and the third partition 55 in the second direction Y. The first chamber 510, the second chamber 511 and the third chamber 512 are formed by the separation of the third partition 55 and the fourth partition 56. The first chamber 510 and the third chamber 512 are separated by the fourth partition 56 in the second direction Y, and the first chamber 510 and the second chamber 511 are separated by the third partition 55 in the third direction Z.
[0071] Reference Figure 3The first partition 52 is disposed in the first chamber 510, and the first partition 52 is connected to the first side plate 2a and the third partition 55 along the second direction Y, thereby dividing the first chamber 510 into a first sub-chamber 5100 and a second sub-chamber 5101 distributed sequentially in the third direction.
[0072] Furthermore, to simplify the structure of the air-cooling channel 21 and improve the reliability of the power conversion equipment, the first partition 52 is provided with a first ventilation opening 520. The first ventilation opening 520 connects the first sub-chamber 5100 and the second sub-chamber 5101, and the second sub-chamber 5101 connects to the first air-cooling channel 210. In this embodiment, the first sub-chamber 5100 and the second sub-chamber 5101 share the first air-cooling channel 210, and air circulation between the first sub-chamber 5100 and the second sub-chamber 5101 is achieved through the first ventilation opening 520. It can be understood that the aforementioned first ventilation opening 520 is located at the end of the first partition 52 away from the first air outlet 22 and the first air inlet 23, so that air can flow fully through the power device 40 and the second device 41, thereby improving the heat dissipation effect on the power device 40 and the second device 41.
[0073] In some embodiments, refer to Figure 3 , Figure 6 and Figure 7 The second device 41 is configured as a capacitor and attached to the first heat exchange surface 10. The first air outlet 22 and the first air inlet 23 are arranged on opposite sides of the first separator 52 in the third direction Z. The first air outlet 22, the second sub-chamber 5101, the first sub-chamber 5100, and the first air inlet 23 are connected in sequence. Figure 3 As indicated by multiple black arrows, air from the first fan 6 passes through the second sub-chamber 5101 to cool the second device 41, then enters the first sub-chamber 5100 through the first vent 520 to cool the power device 40, and is subsequently introduced into the first air-cooling channel 210 through the first air inlet 23. It should be noted that capacitors have higher temperature requirements than power devices. By controlling the air exiting the first air-cooling channel 210 to preferentially pass through the capacitors, it is beneficial to maintain the capacitors at an optimal operating temperature and improve their protection.
[0074] In some embodiments, refer to Figure 2 and Figure 4The power conversion device also includes a second partition 53 and a second fan 7. The second partition 53 is disposed in the first chamber 510 and spaced between the power device 40 and the cover 3. The second partition 53 is arranged parallel to the horizontal plane formed by the third direction Z and the second direction Y, so as to separate the first chamber 510 in the first direction X and form an upper space 5102 and a lower space 5103. The electronic device unit 4 also includes a third device 42, which is disposed in the upper space 5102, and the second fan 7 is configured to air-cool the third device 42. It should be noted that the second fan 7 can be used for internal circulation air cooling of the upper space 5102, and the third device 42 can be an electronic device with lower heat dissipation requirements than the power device and capacitor. The setting position of the second fan 7 can be flexibly adjusted to meet the air cooling needs of the third device 42 in the upper space 5102. In other embodiments, the upper space 5102 may also share the first air-cooling channel 210 with the lower space 5103. In this case, the second fan 7 can drive the air in the upper space 5102 to circulate into the first air-cooling channel 210, which will not be described in detail here.
[0075] In addition, refer to Figure 2 and Figure 4 The power conversion device also includes an isolation cover 60, which covers the top of the first fan 6 and is connected to the second partition 53. This effectively encloses the first fan 6 in the lower space 5103, isolating the first fan 6 from the upper space 5102. Understandably, due to the size limitations of the first fan 6 and the first side plate 2a in the first direction X, a portion of the first fan 6 may encroach upon the upper space 5102 in the first direction X. In this case, the isolation cover 60 covers the portion of the first fan 6 protruding into the upper space 5102, working in conjunction with the second partition 53 to separate the first fan 6 and prevent the first fan 6 from affecting the airflow in the upper space 5102.
[0076] In some embodiments, refer to Figure 7 The air-cooling aisle 21 also includes a second air-cooling aisle 211, which is located within the second side plate 2b and communicates with the upper space 5102. The second fan 7 is configured to drive air circulation connecting the upper space 5102 and the second air-cooling aisle 211. The independent second air-cooling aisle 211 within the second side plate 2b, in conjunction with the second fan 7, further enhances the air-cooling effect on the upper space 5102.
[0077] In some embodiments, refer to Figure 4The electronic device unit 4 also includes a fourth device 43, which is located in the second chamber 511. The third partition 55 is also provided with a second vent 550, and the second side plate 2b is provided with a second air outlet 24 and a second air inlet 25. In this embodiment, the second air outlet 24 connects to the second chamber 511, and the second vent 550 is located on the third direction Z at the end of the second partition 53 away from the second fan 7. The second air outlet 24 and the second air inlet 25 are respectively connected to the second air-cooling channel 211. The second air outlet 24, the second chamber 511, the second vent 550, the upper space 5102, and the second air inlet 25 are sequentially connected. The fourth device 43 generates more heat than the third device 42. By arranging the fourth device 43 in the second chamber 511, such as... Figure 4 As indicated by the black arrow, the air in the second cooling duct preferentially cools the fourth device 43, and then enters the upper space 5102 through the second vent 550 to cool the third device 42, thus achieving cyclic air cooling of the fourth device 43 and the third device 42. In addition, the fourth device 43 can also be attached to the first heat exchange surface 10 to improve the heat dissipation effect of the fourth device 43.
[0078] In some embodiments, refer to Figure 4 The power conversion device also includes a baffle 54, which is disposed within the upper space 5102. The baffle 54 is connected to the second partition 53 and to the third partition 55 in the second direction Y. The baffle 54 is spaced between the second vent 550 and the second air inlet 25, and a gap is provided between the end of the baffle 54 away from the third partition 55 and the first side plate 2a in the second direction Y. Figure 4 As indicated by the black arrow, the baffle 54 helps to guide air to flow fully through the fourth device 43 distributed in the upper space 5102, thereby improving the heat dissipation effect on the fourth device 43 in the upper space 5102.
[0079] In some embodiments, refer to Figure 4 and Figure 8 The electronic device unit 4 also includes a fifth device 44, which is disposed in the third chamber 512. The fifth device 44 can be configured as a reactive device. By independently placing the fifth device 44 in the third chamber 512, the impact of heat radiation on other devices can be reduced. The fifth device 44 can also be attached to the first heat exchange surface 10 to ensure the heat dissipation effect of the fifth device 44.
[0080] In some embodiments, refer to Figure 5 and Figure 8At least one refrigerant channel 20 is configured to exchange heat with the third chamber 512. For example, a refrigerant channel 20 can be provided in the third side plate 2c to achieve direct heat exchange with the air in the third chamber 512 via the side wall of the third side plate 2c, which is beneficial to control the temperature in the third chamber 512 and improve the heat dissipation effect of the fifth device 44.
[0081] To further improve the heat dissipation effect for the fifth device 44, refer to Figure 8 The power conversion device also includes a second cold plate 8, which is located in the third chamber 512 and connected to the fifth device 44 for heat exchange. It is understood that, as... Figure 4 As shown, the second cold plate 8 can be a liquid cooling plate structure that is attached to the fifth device 44, or it can be a heat exchange component such as a liquid cooling cover that is placed on the outside of the fifth device 44. The purpose is to improve the heat dissipation effect on the fifth device 44. The structural principles of liquid cooling plates, liquid cooling covers and the like are existing technologies and will not be described in detail here.
[0082] In some embodiments, refer to Figures 5 to 8 At least one side plate 2 includes an inner sidewall 26 and a first heat exchanger 27. The inner sidewall 26 connects the first cold plate 1 and the cover 3 to enclose and form the aforementioned receiving cavity 5. The first heat exchanger 27 is located on the side of the inner sidewall 26 away from the receiving cavity 5, and a refrigerant channel 20 and an air-cooling channel 21 are respectively located within the first heat exchanger 27. In this embodiment, the first heat exchanger 27 corresponding to the first side plate 2a has a first air-cooling channel 210 and a refrigerant channel 20, and the first heat exchanger 27 corresponding to the second side plate 2b has a second air-cooling channel 211 and a refrigerant channel 20. It can be understood that the first heat exchanger 27 has a second liquid inlet 272 and a second liquid outlet 273 at both ends along its length, and multiple first heat exchangers 27 can be interconnected through connecting pipes 271 to communicate with each other via their respective refrigerant channels 20. In this embodiment, two first heat exchangers 27 are configured. One first heat exchanger 27 is fitted to the inner wall portion of the first air outlet 22 and the first air inlet 23, so that the first air-cooling channel 210 connects the first air outlet 22 and the first air inlet 23. The other first heat exchanger 27 is fitted to the inner wall portion of the second air outlet 24 and the second air inlet 25, so that the second air-cooling channel 211 connects the second air outlet 24 and the second air inlet 25. In this embodiment, as shown... Figure 5 and Figure 8 As shown, unlike the first heat exchanger 27, the third side plate 2c includes a second heat exchanger 29. The second heat exchanger 29 may only contain a refrigerant channel 20, sufficient to allow heat exchange with the inner wall 26 of the third side plate 2c. The second heat exchanger 29 and the refrigerant channel 20 of the first heat exchanger 27 are connected in series to facilitate centralized input and output of external cooling medium.
[0083] In some embodiments, refer to Figure 2 , Figure 4 and Figure 8 At least one side plate 2 also includes an outer side wall 28, which connects the first cold plate 1 and the cover 3, and the first heat exchanger 27 is disposed between the outer side wall 28 and the inner side wall 26. The outer side wall 28 and the inner side wall 26 form a protective enclosure for the first heat exchanger 27 and the second heat exchanger 29, which helps to improve the protection of the first heat exchanger 27 and the second heat exchanger 29, and at the same time reduces the risk of refrigerant leakage and damage to the electronic device unit 4 in the housing cavity 5. It is understood that in other embodiments, the first heat exchanger 27, the second heat exchanger 29, the outer side wall 28 and the inner side wall 26 can also be integrally formed. In this case, the first side plate 2a and the second side plate 2b can be an integral frame structure with built-in air-cooling channel 21 and refrigerant channel 20, etc., and the third side plate 2c can be an integral structure with built-in refrigerant channel 20, etc., which will not be described in detail here.
[0084] It should be noted that, referring to Figure 4 The fourth side plate 2d has an end face 280 on one side in the second direction Y. The end face 280 is connected to the outer wall 28 of the first side plate 2a, the second side plate 2b, and the third side plate 2c, and is adjacent to the second chamber 511. The end face 280 can centrally arrange structures such as wiring terminals 281 and handles 282, aiming to centralize wiring and improve the convenience of wiring operations. When the fourth side plate 2d is used as the wiring side, in some embodiments, the first side plate 2a, the second side plate 2b, and the third side plate 2c can adopt an integral molding structure, such as forming an integral C-shaped structure and welding the fourth side plate 2d together, so as to facilitate the installation of the first heat exchanger 27 and the second heat exchanger 29. In addition, the first liquid inlet 12 and the first liquid outlet 13 for the circulation of refrigerant in the first cold plate 1 can also be provided through the end face 280. Terminal block 281 provides external wiring for electronic device unit 4. Terminal block 281 may include DC terminals, AC terminals, communication terminals, etc. The structural principle of terminal block 281 is existing technology and will not be described in detail here. It is understood that end face 280 serves as the wiring side, and the first heat exchanger 27 and the second heat exchanger 29, as... Figure 8 The method shown is only provided on the inner sidewalls corresponding to the first side plate 2a, the second side plate 2b, and the third side plate 2c to improve the protection of the mating line.
[0085] In other embodiments, the fourth side plate 2d may also incorporate a liquid cooling structure to achieve heat exchange with the second chamber 511. In this case, the mounting structure such as the wiring terminal 281 can be arranged to avoid the liquid cooling structure. For example, the wiring terminal 281 can be centrally located in the middle of the fourth side plate 2d in the third direction Z, and the liquid cooling structure can be arranged at both ends of the fourth side plate 2d in the third direction Z. This will not be elaborated further here.
[0086] In some embodiments, refer to Figure 2 , Figure 6 and Figure 7 The first heat exchanger 27 has at least two air-cooled channels 21, and at least one air-cooled channel 21 is located on the side of the refrigerant channel 20 facing the receiving cavity 5. In this embodiment, all air-cooled channels 21 are located on the side of the refrigerant channel 20 facing the receiving cavity 5, so that the air-cooled channel 21 is directly connected to the receiving cavity 5 by the first air outlet 22 and the first air inlet 23.
[0087] In some embodiments, refer to Figure 2 , Figure 9 and Figure 10 The air-cooled channel 21 is located on the side of the refrigerant channel 20 away from the receiving cavity 5. At this time, the portion of the first heat exchanger 27 where the refrigerant channel 20 is located needs to have a clearance opening 274. This ensures the airtightness of the refrigerant channel 20 while connecting the first air outlet 22, the first air inlet 23, and the corresponding air-cooled channel 21 through the clearance opening 274. It can be understood that through the above arrangement, the refrigerant channel 20 can be set flush against the inner wall 26. In this case, the refrigerant channel 20 can simultaneously exchange heat with the air in the receiving cavity 5 through the inner wall 26, which is beneficial for fully utilizing the two heat exchange sides of the refrigerant channel 20 opposite to each other, improving the refrigerant utilization rate and the heat dissipation effect within the receiving cavity 5.
[0088] It is understood that in other embodiments, the arrangement of the air-cooled channel 21 and the refrigerant channel 20 can be flexibly adjusted as needed. For example, if air-cooled channels 21 are provided on both opposite sides of the refrigerant channel 20, then an avoidance opening 274 can be provided on the first heat exchanger 27 to ensure that the air-cooled channel 21 located on the side of the refrigerant channel 20 away from the inner wall 26 can connect the first air outlet 22 and the first air inlet 23. This will not be elaborated further here.
[0089] In some embodiments, refer to Figure 7 The first heat exchanger 27 is located in the air-cooled channel 21 and has a heat dissipation protrusion 270. This heat dissipation protrusion 270 divides the air into multiple independent air-cooled channels 21, thereby increasing the heat exchange area and improving the heat exchange effect between the air and the refrigerant in the air-cooled channel 21. In other embodiments, the heat dissipation protrusion 270 can also be provided within the refrigerant channel 20. Furthermore, the heat dissipation protrusion 270 can be configured as other raised structures such as heat exchange fins, cones, or spherical protrusions, as long as the heat exchange area can be increased.
[0090] A second aspect of this application provides an energy storage system including the aforementioned power conversion device. It is understood that this energy storage system may possess all the technical features and effects of the aforementioned power conversion device, which will not be elaborated upon here.
[0091] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0092] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0093] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.
[0094] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. A power conversion device, characterized in that, include: The first cold plate (1) has a first heat exchange surface (10); Multiple side plates (2) are connected to the first cold plate (1) and enclosed to form a receiving cavity (5) with an opening (50), and the first heat exchange surface (10) is located inside the receiving cavity (5); Cover (3), which covers the opening (50); Electronic device unit (4) is at least partially disposed on the first heat exchange surface (10); The receiving cavity (5) is divided into multiple chambers (51), and at least one side plate (2) is divided into at least one refrigerant channel (20) and at least one air-cooling channel (21). At least one air-cooling channel (21) connects to at least one chamber (51), and the power conversion device is provided with a first fan (6), which is configured to drive air circulation connecting the air-cooling channel (21) and the chamber (51) connecting the air-cooling channel (21).
2. The power conversion device according to claim 1, characterized in that, The plurality of side plates (2) include a first side plate (2a), the plurality of chambers (51) include a first chamber (510), the air-cooling channel (21) includes a first air-cooling channel (210), the first air-cooling channel (210) is disposed on the first side plate (2a), and the first chamber (510) is connected to the first air-cooling channel (210); The electronic device unit (4) includes a power device (40), which is disposed in the first chamber (510) and attached to the first heat exchange surface (10).
3. The power conversion device according to claim 2, characterized in that, The first chamber (510) is divided into a first sub-chamber (5100) and a second sub-chamber (5101). The power device (40) is disposed in the first sub-chamber (5100). The electronic device unit (4) further includes a second device (41), which is disposed in the second sub-chamber (5101). At least one of the air-cooling channels (21) is connected to the second sub-chamber (5101).
4. The power conversion device according to claim 3, characterized in that, The power conversion device further includes a first partition (52), which is disposed in the first chamber (510) to separate and form a first sub-chamber (5100) and a second sub-chamber (5101). The first partition (52) is provided with a first vent (520), which connects the first sub-chamber (5100) and the second sub-chamber (5101), and the second sub-chamber (5101) connects to the first air-cooling channel (210).
5. The power conversion device according to claim 4, characterized in that, The second device (41) is configured as a capacitor and attached to the first heat exchange surface (10). The first side plate (2a) is provided with a first air outlet (22) and a first air inlet (23). The first air outlet (22) and the first air inlet (23) are respectively connected to the first air-cooling channel (210). The first air outlet (22), the second sub-chamber (5101), the first sub-chamber (5100) and the first air inlet (23) are connected in sequence.
6. The power conversion device according to claim 2, characterized in that, The power conversion device further includes a second partition (53) and a second fan (7). The second partition (53) is disposed in the first chamber (510) and spaced between the power device (40) and the cover (3) to separate the first chamber (510) in a first direction (X) and form an upper space (5102) and a lower space (5103). The electronic device unit (4) further includes a third device (42) disposed in the upper space (5102), and the second fan (7) is configured to air-cool the third device (42).
7. The power conversion device according to claim 6, characterized in that, The plurality of side plates (2) further include a second side plate (2b), which is connected to the first side plate (2a). The air-cooling channel (21) further includes a second air-cooling channel (211), which is disposed on the second side plate (2b) and communicates with the upper space (5102). The second fan (7) is configured to drive air circulation to communicate between the upper space (5102) and the second air-cooling channel (211). And / or, the power conversion device further includes an isolation cover (60) that covers the first fan (6) to separate the first fan (6) from the upper space (5102).
8. The power conversion device according to claim 7, characterized in that, The plurality of chambers (51) further includes a second chamber (511), the second chamber (511) and the first chamber (510) are distributed in a second direction (Y), the second side plate (2b) faces the first chamber (510) and the second chamber (511) in a third direction (Z), and the first direction (X), the second direction (Y) and the third direction (Z) intersect each other, the electronic device unit (4) further includes a fourth device (43), the fourth device (43) is disposed in the second chamber (511); The second side plate (2b) is provided with a second air outlet (24) and a second air inlet (25). The second air outlet (24) and the second air inlet (25) are respectively connected to the second air-cooling channel (211), and the second air outlet (24), the second chamber (511), the upper space (5102) and the second air inlet (25) are connected in sequence.
9. The power conversion device according to claim 8, characterized in that, The power conversion device further includes a third partition (55), which is disposed in the receiving cavity (5) to separate the first chamber (510) and the second chamber (511). The third partition (55) is located between the second air outlet (24) and the second air inlet (25) in the second direction (Y). The third partition (55) is provided with a second ventilation opening (550), which connects the upper space (5102) and the second chamber (511).
10. The power conversion device according to claim 9, characterized in that, The power conversion device further includes a baffle (54), which is disposed in the upper space (5102). The baffle (54) is connected to the third partition (55) and the second partition (53) respectively. The baffle (54) is spaced between the second vent (550) and the second air inlet (25), and the baffle (54) has a gap with the first side plate (2a) in the third direction (Z).
11. The power conversion device according to claim 9, characterized in that, The plurality of chambers (51) further include a third chamber (512), and the electronic device unit (4) further includes a fifth device (44), which is disposed in the third chamber (512).
12. The power conversion device according to claim 11, characterized in that, The side plate (2) further includes a third side plate (2c), which is connected to the first side plate (2a). The power conversion device further includes a fourth partition (56), which is disposed in the receiving cavity (5). The fourth partition (56) is connected to the first side plate (2a) and the third partition (55) in the second direction (Y) respectively, so as to form the third chamber (512) with the third side plate (2c) in the third direction (Z).
13. The power conversion device according to claim 11, characterized in that, The power conversion device further includes a second cold plate (8), which is disposed in the third chamber (512) and heat-exchange connected to the fifth device (44).
14. The power conversion device according to claim 12, characterized in that, At least one of the refrigerant channels (20) is provided on the third side plate (2c), and the refrigerant channel (20) is configured to exchange heat with the third chamber (512).
15. The power conversion device according to claim 12, characterized in that, The side plate (2) further includes a fourth side plate (2d), which is connected to the second side plate (2b) and the third side plate (2c) respectively. The fourth side plate (2d) and the first side plate (2a) are spaced apart in the second direction (Y). The first side plate (2a), the second side plate (2b), the third side plate (2c), the fourth side plate (2d) and the first cold plate (1) enclose the receiving cavity (5). The fourth side plate (2d) is configured to be able to provide a wiring terminal (281).
16. The power conversion device according to any one of claims 1 to 15, characterized in that, At least one of the side plates (2) includes an inner sidewall (26) and a first heat exchanger (27). The inner sidewall (26) connects the first cold plate (1) and the cover (3) to enclose and form the receiving cavity (5). The first heat exchanger (27) is located on the side of the inner sidewall (26) away from the receiving cavity (5). The refrigerant channel (20) and the air-cooled channel (21) are respectively located in the first heat exchanger (27).
17. The power conversion device according to claim 16, characterized in that, At least one of the side plates (2) further includes an outer side wall (28) that connects the first cold plate (1) and the cover (3), and the first heat exchanger (27) is disposed between the outer side wall (28) and the inner side wall (26).
18. The power conversion device according to claim 16, characterized in that, The first heat exchanger (27) has at least two of the aforementioned air-cooled channels (21); At least one of the air-cooled channels (21) is located on the side of the refrigerant channel (20) facing the receiving cavity (5); Alternatively, the air-cooled channel (21) may be located on the side of the refrigerant channel (20) away from the receiving cavity (5).
19. The power conversion device according to claim 18, characterized in that, The first heat exchanger (27) is located in the air-cooled channel (21) and has a heat dissipation protrusion (270).
20. An energy storage system, characterized in that, Includes the power conversion device as described in any one of claims 1 to 19.
