Heat dissipation module and electronic device

Abstract

Embodiments of the present application provide a heat dissipation module and an electronic device. The heat dissipation module is applied to the electronic device, and the electronic device further includes a shell assembly and a heating electronic component located in the shell assembly. The shell assembly is provided with an air inlet and an air outlet. The heat dissipation module includes a heat sink, a first ion wind generator, a second ion wind generator and an air duct. The heat sink is used for heat exchange with the heating electronic component. The first ion wind generator is arranged adjacent to the air inlet and is used for forming a first directional ion wind blowing into the air inlet. The second ion wind generator is arranged adjacent to the air outlet and is used for forming a second directional ion wind blowing out of the air outlet. The air duct is connected to the air inlet and the air outlet. The heating electronic component is located outside the air duct, and at least a part of the heat sink is located in the air duct. According to the design and application of the heat dissipation module, the efficiency of heat dissipation of the heating electronic component of the electronic device can be improved, and the heat dissipation effect of the electronic device can be improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat dissipation module and electronic device. Background Technology

[0002] With the increasing integration of the electronics industry, the performance of electronic devices is constantly improving, and some electronic devices are being designed to be smaller and more portable. At the same time, the power consumption and heat generation of these electronic devices are also increasing dramatically. Currently, traditional air-cooled heat dissipation modules are approaching their heat dissipation capacity limits, making it difficult to compactly arrange them inside electronic devices and failing to meet the heat dissipation requirements of electronic devices in scenarios with higher heat power density. Summary of the Invention

[0003] This application provides a heat dissipation module and an electronic device to improve the efficiency of heat dissipation for heat-generating electronic components, thereby improving the heat dissipation effect of the electronic device.

[0004] According to one aspect of this application, a heat dissipation module is provided. The heat dissipation module is applied to an electronic device, which further includes a housing assembly and a heat-generating electronic component located within the housing assembly. The housing assembly has an air inlet and an air outlet. The heat dissipation module includes a heat sink, a first ion wind generator, a second ion wind generator, and an air duct, wherein: the heat sink is used for heat exchange with the heat-generating electronic component; the first ion wind generator is disposed adjacent to the air inlet and is used to generate a first directional ion wind blown in from the air inlet; the second ion wind generator is disposed adjacent to the air outlet and is used to generate a second directional ion wind blown out from the air outlet; the air duct connects the air inlet and the air outlet, the heat-generating electronic component is located outside the air duct, and at least a portion of the heat sink is located inside the air duct. Under the action of the first and second directional ion winds, a heat dissipation airflow passing through the heat sink is formed in the air duct.

[0005] According to the technical solution of this application embodiment, on the one hand, under the synergistic effect of the first ion wind generator and the second ion wind generator, a rapid and continuous heat dissipation airflow can be formed in the air duct, thereby enabling rapid and continuous heat exchange with the heat sink and achieving efficient heat dissipation of the heat-generating electronic components. On the other hand, the maximum airflow of the first and second directional ion winds can be designed and adjusted by specifically designing the first and second ion wind generators, such as by selecting specific electrode structures or voltage parameters, without significantly increasing the space occupied by the first and second ion wind generators. Furthermore, based on the structural characteristic of the ion wind generator having no moving parts, the first and second ion wind generators occupy relatively little space in the electronic device, thus adapting to the small size or thin design characteristics of the electronic device. Therefore, the heat dissipation module design can improve the efficiency of heat dissipation of the heat-generating electronic components of the electronic device, thereby improving the heat dissipation effect of the electronic device and helping to meet the heat dissipation requirements of the electronic device in scenarios with higher heat power density.

[0006] In some embodiments, the first directional ion wind and the second directional ion wind have the same airflow direction. For example, the first ion wind generator and the second ion wind generator can be arranged opposite each other, which facilitates the creation of a smoother airflow path between the air inlet and the air outlet.

[0007] In some embodiments, the wind directions of the first directional ion wind and the second directional ion wind intersect. For example, the wind directions of the first directional ion wind and the second directional ion wind can be orthogonal or form an acute angle.

[0008] In some embodiments, the heat dissipation module includes multiple first ion wind generators, the first directional ion winds generated by the multiple first ion wind generators having the same airflow direction; and / or, the heat dissipation module includes multiple second ion wind generators, the second directional ion winds generated by the multiple second ion wind generators having the same airflow direction. Having multiple first ion wind generators can increase the air intake volume; having multiple second ion wind generators can increase the airflow rate of the heat dissipation airflow. These features help improve the efficiency of heat exchange between the heat dissipation airflow and the heat sink, achieving more efficient heat dissipation for heat-generating electronic components.

[0009] In some embodiments, the heat dissipation module further includes a third ion air generator, which is disposed within the air duct and used to accelerate the heat dissipation airflow within the air duct. The acceleration of the heat dissipation airflow within the air duct by the third ion air generator can improve the efficiency of heat exchange between the heat dissipation airflow and the heat sink, achieving more efficient heat dissipation for heat-generating electronic components. In addition, since the third ion air generator is disposed within the air duct, the space occupied by the heat dissipation module is basically not increased, making the internal structure of the electronic device more compact.

[0010] In some embodiments, both the first ion wind generator and the second ion wind generator include an emitting electrode, a collecting electrode, and an insulating medium, wherein: the emitting electrode is in the shape of an orifice plate and includes a plurality of first holes; the collecting electrode is spaced apart from the emitting electrode and is also in the shape of an orifice plate and includes a plurality of second holes; the insulating medium is located between the emitting electrode and the collecting electrode, and the orthogonal projection of the insulating medium on the emitting electrode does not overlap with the plurality of first holes, and the orthogonal projection of the insulating medium on the collecting electrode does not overlap with the plurality of second holes.

[0011] In these embodiments, the first ion wind generator and the second ion wind generator exhibit a stacked structure, which is compact, small, structurally stable, and has good mechanical strength. The overall shape of the first ion wind generator and the second ion wind generator can be strip-shaped, square-shaped, rectangular-shaped, or circular-shaped, and is not limited to these shapes.

[0012] In some embodiments, a plurality of first holes are paired with a plurality of second holes, wherein the orthographic projection of each first hole onto the collecting electrode coincides with or overlaps with the corresponding second hole in area. This design helps to reduce the resistance of the inner wall of the holes to the ion airflow, allowing the ion airflow to be blown out more smoothly from the second holes.

[0013] In some embodiments, the plurality of first holes include circular holes, strip holes, or polygonal holes; and / or, the plurality of second holes include circular holes, strip holes, or polygonal holes. The plurality of first holes may be designed with the same shape or may include multiple shapes. The plurality of second holes may be designed with the same shape or may include multiple shapes. Furthermore, when the plurality of first holes and the plurality of second holes are designed with the same shape, the shapes of the first holes and the second holes may be the same or different.

[0014] In some embodiments, the heat dissipation module further includes: a first insulating mesh disposed at the air inlet or on the surface of the first ionizer exposed at the air inlet; and a second insulating mesh disposed at the air outlet or on the surface of the second ionizer exposed at the air outlet. The first and second insulating meshes can serve as shielding elements to protect the ionizer, allowing airflow to pass freely, effectively preventing accidental electric shock, and providing structural reinforcement and aesthetic enhancement. The materials for the first and second insulating meshes can be, for example, rubber, ceramic, plastic, or glass.

[0015] In some embodiments, the heat dissipation module further includes an air duct component, which is assembled and connected to the housing assembly, and the air duct is formed in the air duct component. For example, the air duct component may be welded, snap-fitted, fastened, or bonded to the housing assembly, etc.

[0016] In some embodiments, at least a portion of the air duct is formed within the housing assembly. In these embodiments, integrating at least a portion of the air duct structure into the housing assembly not only allows for a more compact internal structure of the electronic device but also helps reduce production and assembly costs.

[0017] In some embodiments, the heat sink structure includes at least one of heat dissipation fins, a vapor chamber, a heat pipe, a metal heat sink, or a graphene heat sink. Different heat dissipation structures have different structural characteristics, heat dissipation principles, heat dissipation performance, and processing costs, and the design can be flexibly selected according to specific layout space and heat dissipation requirements.

[0018] According to one aspect of this application, an electronic device is provided, which includes a display module, a housing assembly, a heat-generating electronic component, and a heat dissipation module of any of the foregoing embodiments, wherein: the housing assembly is provided with an air inlet and an air outlet, and the housing assembly includes a middle frame and a back cover, the display module is connected to one side of the middle frame, the back cover is connected to the other side of the middle frame, and the heat-generating electronic component is located between the display module and the back cover.

[0019] The electronic device of this application embodiment has a better heat dissipation effect based on the above-described design of the heat dissipation module, thereby having a higher heat power density carrying capacity.

[0020] In some embodiments, the mid-frame has a recessed portion, and the portion of the rear cover opposite to the recessed portion encloses the recessed portion to form an air duct, wherein the air duct is sealed and isolated from the space where the heat-generating electronic components are located. In these embodiments, the air duct is formed by the partial structure of the mid-frame and the rear cover, which not only makes the internal structure of the electronic device more compact, but also helps to reduce production and assembly costs.

[0021] In some embodiments, both the air inlet and the air outlet are located on the middle frame. For example, the air inlet and the air outlet can be located on two opposite long sides of the middle frame and arranged opposite each other, which facilitates the creation of a smoother airflow path between the air inlet and the air outlet.

[0022] In some embodiments, both the air inlet and the air outlet are located on the rear cover.

[0023] In some embodiments, one of the air inlet and the air outlet is located in the middle frame, and the other is located in the rear cover. The specific locations of the air inlet and the air outlet are designed to create a proper airflow channel between them. Furthermore, when the air inlet and / or the air outlet is located in the rear cover, its opening is not limited to facing away from the display module. For example, it can also be located on the side of the raised structure by utilizing the raised structure design of the rear cover.

[0024] In some embodiments, the back cover includes a protrusion that protrudes from the back of the display module. The protrusion includes a top portion and a side portion, wherein both the air inlet and the air outlet are located on the side portion. For example, the air inlet and the air outlet can be arranged opposite each other, which facilitates the construction of a smoother airflow path; or, one of the air inlet and the air outlet is located on the middle frame and the other is located on the side portion, with the design purpose of constructing an appropriate air duct between the air inlet and the air outlet.

[0025] In some embodiments, the back cover includes a protrusion that projects away from the display module. The protrusion includes a top portion and a side portion, wherein a portion of the heat sink is located within the space defined by the protrusion. This provides ample space for the heat sink, allowing for the selection of heat dissipation designs that offer higher heat dissipation efficiency or are slightly larger but less expensive, as needed.

[0026] In some embodiments, the back cover includes a protrusion protruding from the back of the display module, the protrusion including a top portion and a side portion; the housing assembly is provided with two air inlets and two air outlets, the two air inlets being a first air inlet located on the middle frame and a second air inlet located on the side portion, and the two air outlets being a first air outlet located on the middle frame and a second air outlet located on the side portion, wherein the first air inlet is opposite to the first air outlet, and the second air inlet is opposite to the second air outlet; the heat dissipation module includes two first ion wind generators and two second ion wind generators, the two first ion wind generators being correspondingly located at the first air inlet and the second air inlet, and the two second ion wind generators being correspondingly located at the first air outlet and the second air outlet, and the wind direction of the first directional ion wind generated by the two first ion wind generators is the same as the wind direction of the second directional ion wind generated by the two second ion wind generators.

[0027] In these embodiments, heat-generating electronic components can be cooled by using two sets of ion wind generators sharing a single air duct and heat sink. This improves the efficiency of heat exchange between the cooling airflow and the heat sink, resulting in more efficient heat dissipation for the heat-generating electronic components.

[0028] In some embodiments, the electronic device further includes a camera module located between the display module and the back cover, with its lens facing the protrusion. The air duct and the space containing the camera module are sealed and isolated, and the area of ​​the protrusion opposite the camera module is a light-transmitting area. The protrusion on the back cover corresponding to the camera module can be modified to construct, for example, a partial structure of an air inlet, air outlet, air duct, or a sealed partition structure. For example, the side portion of the protrusion can be a decorative ring; if an air inlet and / or air outlet are to be provided on it, only corresponding structural modifications are needed. Attached Figure Description

[0029] Figure 1AA schematic diagram of the disassembled structure of an electronic device according to some embodiments of this application is shown;

[0030] Figure 1B The heat dissipation module according to some embodiments of this application is shown in general. Figure 1A Schematic diagram of the cross-sectional structure at the PP section;

[0031] Figure 2 A schematic diagram of the main view structure and the cross-sectional structure at AA of a first ion wind generator or a second sub-wind generator according to some embodiments of this application is shown.

[0032] Figure 3 A schematic diagram showing the main view structure and the cross-sectional structure at BB of a first ion wind generator or a second sub-wind generator according to some embodiments of this application is shown.

[0033] Figure 4 A schematic diagram of the disassembled structure of an electronic device according to some embodiments of this application is shown;

[0034] Figure 5 A schematic diagram of the disassembled structure of an electronic device according to some embodiments of this application is shown;

[0035] Figure 6 A schematic diagram of the disassembled structure of an electronic device according to some embodiments of this application is shown;

[0036] Figure 7 A schematic diagram of the cross-sectional structure of the air inlet and air outlet of the housing assembly according to some embodiments of this application is shown.

[0037] Figure label:

[0038] 600 - Electronic equipment; 100 - Housing assembly; 200 - Heat-generating electronic components; 300 - Heat dissipation module; 400 - Display module; 500 - Camera module;

[0039] 110 - Mid-frame; 120 - Back cover; 310 - Heat sink; 101 - Air inlet; 1011 - First air inlet; 1012 - Second air inlet; 102 - Air outlet;

[0040] 1021 - First air outlet; 1022 - Second air outlet; 320 - First ion generator; 330 - Second ion generator; 360 - Air duct;

[0041] 340 - First directional ion wind; 350 - Second directional ion wind; 370 - Heat dissipation airflow; 380 - Third ion wind generator; 21 - Emitting electrode;

[0042] 210 - First hole; 22 - Collecting electrode; 220 - Second hole; 23 - Insulating medium; 24 - First insulating mesh; 25 - Second insulating mesh;

[0043] 111 - Recessed portion; 121 - Protrusion; 211 - Top surface portion; 212 - Side portion; 215 - Transparent area; 390 - Sealant. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings.

[0045] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0046] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0047] With the increasing integration of the electronics industry, the performance of electronic devices is constantly improving, and some electronic devices are being designed to be smaller and more portable. At the same time, the power consumption and heat generation of these electronic devices are also increasing dramatically. Typically, electronic devices need to be equipped with heat dissipation components to cool their main heat-generating electronic components.

[0048] Taking a mobile phone as an example, a type of electronic device, due to design requirements for thinness and portability, the overall shape of a mobile phone is relatively thin and compact. Its main structure can include: a mid-frame, a display module located on one side of the mid-frame and connected to it, a back cover located on the other side of the mid-frame and connected to it, and some electronic components and heat dissipation components located between the display module and the back cover. Electronic components can include circuit board assemblies, wireless charging modules, and batteries, etc. Heat dissipation components are used to dissipate heat from electronic components that generate a lot of heat (referred to as heat-generating electronic components in this document) to the external environment of the mobile phone. These heat-generating electronic components can be, for example, processor chips on the circuit board assembly. The mid-frame and back cover, as main supporting components, can support, install, or limit the movement of other components. Furthermore, as exterior structural components, the mid-frame and back cover can bear a certain degree of heat conduction.

[0049] In the aforementioned technologies, the heat dissipation component utilizes a vapor chamber (VC). A vapor chamber is a cavity structure with a capillary structure on its inner wall and filled with a working fluid. It typically includes an evaporation zone, an adiabatic zone, and a condensation zone. In the evaporation zone, the liquid working fluid absorbs heat conducted by the heat source electronic devices and transforms into a vapor phase. In the condensation zone, the vapor phase working fluid condenses, releasing heat and transforming back into a liquid phase. The liquid working fluid then flows back to the evaporation zone through the capillary action of the capillary structure, continuously circulating in this manner. Because the vapor chamber can conduct heat in two dimensions, it has high heat dissipation efficiency. Its thin and compact structure makes it suitable for use in confined spaces. Therefore, the vapor chamber is a passive heat dissipation component that utilizes natural heat dissipation. Heat generated by the heat-generating electronic components is conducted to the vapor chamber, then diffused in two dimensions through the vapor chamber, and finally dissipated into the external environment of the phone through external structural components such as the mid-frame or back cover.

[0050] The technical drawback of the aforementioned technologies is that passive cooling solutions easily reach their design limits in confined spaces, thus failing to meet the heat dissipation requirements of electronic devices in scenarios with higher heat power density. Heat power density can be understood as the rate of heat transfer per unit volume per unit time.

[0051] In view of this, embodiments of this application provide a heat dissipation module and an electronic device to improve the efficiency of heat dissipation for heat-generating electronic components, thereby improving the heat dissipation effect of the electronic device. The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0052] In the embodiments of this application, the specific product type of the electronic device may include, but is not limited to, mobile phones, tablets, personal computers, smart wearables, in-vehicle devices, communication devices, power modules, or servers. Furthermore, depending on the specific product type of the electronic device, it may be foldable, candybar, or box-type, and is not limited to these design forms.

[0053] Figure 1A A schematic diagram showing the exploded structure of an electronic device 600 according to some embodiments of this application is provided, wherein the electronic device 600 is exemplified by a mobile phone. Figure 1A As shown, the electronic device 600 may include a housing assembly 100, a heat-generating electronic component 200 located within the housing assembly 100, and a heat dissipation module 300.

[0054] The housing assembly 100 can serve to support, mount, or limit the movement of certain components. Figure 1AIn this embodiment, the main structure of the housing assembly 100 includes a middle frame 110 and a rear cover 120. In other embodiments not illustrated in the accompanying drawings, the housing assembly may have other shape and structural features, such as being a closed or open box-shaped component, etc., which are not specifically limited in this embodiment.

[0055] exist Figure 1A In this example, the heat-generating electronic component 200 is a processor chip in a mobile phone. It is understood that the specific type of the heat-generating electronic component 200 may vary depending on the specific product type of the electronic device 600. For example, in other embodiments not illustrated in the accompanying drawings, the heat-generating electronic component may also be a memory module, network card, antenna, power supply, power amplifier, or hard drive, etc., which require heat dissipation. This application does not specifically limit the type of component in this way.

[0056] The heat dissipation module 300 of this application embodiment is used to dissipate heat from the heat-generating electronic components 200 of the electronic device 600. For example... Figure 1A As shown, the housing assembly 100 of the electronic device 600 is provided with an air inlet 101 and an air outlet 102. The main structure of the heat dissipation module 300 may include a heat sink 310, a first ion wind generator 320, a second ion wind generator 330, and an air duct 360. The heat sink 310 is used for heat exchange with the heat-generating electronic component 200. The first ion wind generator 320 is disposed adjacent to the air inlet 101 and is used to generate a first directional ion wind 340 blown in from the air inlet 101. The second ion wind generator 330 is disposed adjacent to the air outlet 102 and is used to generate a second directional ion wind 350 blown out from the air outlet 102. The air duct 360 connects the air inlet 101 and the air outlet 102.

[0057] like Figure 1B As shown, it illustrates a heat dissipation module 300 according to some embodiments of this application, which is generally located in... Figure 1A A schematic diagram of the cross-sectional structure at the PP section shows that the heat-generating electronic component 200 is located outside the air duct 360, while at least a portion of the heat sink 310 is located inside the air duct 360. For example... Figure 1A As shown, under the action of the first directional ion wind 340 and the second directional ion wind 350, a heat dissipation airflow 370 passing through the radiator 310 is formed in the air duct 360.

[0058] In the embodiments of this application, an air duct can be understood as a spatial channel formed by one or more structural surfaces for guiding airflow. An air duct can be formed from a single structural component or by several structural components enclosing it. Furthermore, an air duct can have a regular or irregular shape; the embodiments of this application do not specifically limit this.

[0059] An ion wind generator is a device that uses a high-voltage electric field to ionize air molecules and generate airflow. Its core principle is the hydrodynamic effect induced by corona discharge and ion migration. An ion wind generator typically includes an emitting electrode and a collecting electrode. The emitting electrode is usually connected to a high voltage to generate a strong electric field to ionize the air. The collecting electrode is generally grounded or connected to a low potential to create a potential difference with the emitting electrode, driving ion migration. Typically, the emitting electrode is designed to include a surface area with significant curvature, such as near sharp points or edges. When a high-voltage electric field is established between the emitting and collecting electrodes, the surface area with significant curvature of the emitting electrode has a high charge density, resulting in denser electric field lines and a strong electric field. This strong electric field ionizes surrounding air molecules, forming charged ions. Under the influence of the high-voltage electric field, these charged ions accelerate towards the collecting electrode and collide with neutral air molecules during their movement, transferring momentum to form a directional airflow, i.e., directional ion wind. It is evident that the ion wind generator can convert electrical energy into air kinetic energy without the need for moving parts. It has advantages such as simple structure, small size, no moving parts, low energy consumption, short response time, reliable operation, easy maintenance or even no maintenance required.

[0060] According to the technical solution of the embodiments of this application, at least the following technical effects can be obtained:

[0061] On the one hand, when the first ion wind generator 320 is working, it generates a first directional ion wind 340 that is blown in from the air inlet 101, that is, it sends air into the air duct 360. The second ion wind generator 330 is used to generate a second directional ion wind 350 that is blown out from the air outlet 102, that is, it draws the air in the air duct 360 outward. In this way, under the synergistic effect of the first ion wind generator 320 and the second ion wind generator 330, a fast and continuous heat dissipation airflow 370 can be formed in the air duct 360, so that heat exchange with the heat sink 310 can be carried out quickly and continuously, and efficient heat dissipation of the heat-generating electronic component 200 can be achieved.

[0062] On the other hand, the maximum air volume of the first directional ion wind 340 and the second directional ion wind 350 can be adjusted by specifically designing the first ion wind generator 320 and the second ion wind generator 330, such as by specifically selecting and designing the electrode structure or voltage parameters, and this will not cause the space occupied by the first ion wind generator 320 and the second ion wind generator 330 to increase.

[0063] On the other hand, based on the structural feature of the ion wind generator having no moving parts, the first ion wind generator 320 and the first ion wind generator 320 occupy relatively little space in the electronic device 600. Therefore, they can adapt to the small size or thin design features of the electronic device 600.

[0064] Therefore, according to the design scheme of the heat dissipation module 300 in the embodiments of this application, the efficiency of heat dissipation of the heat-generating electronic components 200 of the electronic device 600 can be improved, thereby improving the heat dissipation effect of the electronic device 600, thus helping to meet the heat dissipation requirements of the electronic device 600 in scenarios with higher heat power density.

[0065] According to Definition 2.1 of GB / T 2900.50-2008, high-voltage electricity refers to service connections with AC voltage above 1000 volts or DC voltage above 1500 volts. In the embodiments of this application, the high-voltage electricity provided to the ion wind generator can be understood with reference to the above standard, and it can be DC high-voltage electricity or AC high-voltage electricity. The specific AC / DC type and voltage value can be determined based on the operational design requirements of the ion wind generator.

[0066] For example, in some embodiments of this application, the first ion wind generator 320 and the second ion wind generator 330 can be supplied with high-voltage DC power, while the electronic device 600 is powered by an internal low-voltage DC power supply. The electronic device 600 can internally incorporate a DC boost module, such as a boost converter, charge pump, or flyback converter. The boost converter uses switching elements and inductors to store energy, boosting the input low-voltage DC to a higher voltage. The charge pump uses switching elements and capacitors to store energy, boosting the input low-voltage DC to a higher voltage. The flyback converter uses a transformer and switching elements to generate high voltage through electromagnetic induction. Taking a mobile phone as an example, its lithium-ion battery typically outputs low-voltage DC power of 3.7V to 4.2V, which can be obtained through the aforementioned DC boost module to power the ion wind generator. The DC boost module can be dedicated to powering the ion wind generator, or it can also power the ion wind generator and other devices in the electronic device 600 that require high-voltage DC power (such as flashlights).

[0067] For example, in some other embodiments of this application, the first ion wind generator 320 and the second ion wind generator 330 can be supplied with high-voltage AC power, and the electronic device 600 is powered by an internal low-voltage DC power supply. The electronic device 600 may internally include a DC-to-high-voltage module and a high-voltage inverter module. The DC-to-high-voltage module may be, for example, a boost converter, a charge pump, or a flyback converter, and the high-voltage inverter module may be, for example, an inverter used to convert high-voltage DC power into high-voltage AC power.

[0068] like Figure 2 As shown, it illustrates a front view structural schematic diagram of a structural design form that the first ion wind generator 320 or the second sub-wind generator 330 according to some embodiments of this application can adopt, as well as a cross-sectional structural schematic diagram at AA of the front view structure.

[0069] In these embodiments, the first ion wind generator 320 and the second ion wind generator 330 include an emitting electrode 21, a collecting electrode 22, and an insulating medium 23. The emitting electrode 21 is perforated and includes a plurality of first holes 210. The collecting electrode 22 is spaced apart from the emitting electrode 21 and includes a plurality of second holes 220. The insulating medium 23 is located between the emitting electrode 21 and the collecting electrode 22. The orthographic projection of the insulating medium 23 on the emitting electrode 21 does not overlap with the plurality of first holes 210, and the orthographic projection of the insulating medium 23 on the collecting electrode 22 does not overlap with the plurality of second holes 220.

[0070] Based on the wind direction design of the first directional ion wind 340 formed by the first ion wind generator 320, the first ion wind generator 320 can be arranged such that its emitting electrode 21 is located on the side of the collecting electrode 22 further away from the air duct 360, the edge of the first hole 210 of the emitting electrode 21 serves as a surface area with a large curvature to form a strong electric field to ionize the surrounding air molecules, and the second hole 220 of the collecting electrode 22 is used to allow the directional ion wind to pass through, thereby forming the first directional ion wind 340 blown in from the air inlet 101. The insulating medium 23 is located between the emitting electrode 21 and the collecting electrode 22, which can serve as an insulating spacer and support. In addition, since it does not obstruct the multiple first holes 210 and multiple second holes 220, it allows the airflow to pass through smoothly.

[0071] Accordingly, based on the wind direction design of the second directional ion wind 350 formed by the second ion wind generator 330, the second ion wind generator 330 can be arranged such that its collecting electrode 22 is located on the side of the emitting electrode 21 further away from the air duct 360, the edge of the first hole 210 of the emitting electrode 21 serves as a surface area with a large curvature to form a strong electric field to ionize the surrounding air molecules, and the second hole 220 of the collecting electrode 22 is used to allow the directional ion wind to pass through, thereby forming the second directional ion wind 350 blown out from the air outlet 102. The insulating medium 23 is located between the emitting electrode 21 and the collecting electrode 22, which can serve as an insulating spacer and support. In addition, since it does not obstruct the multiple first holes 210 and multiple second holes 220, it allows the airflow to pass through smoothly.

[0072] In these embodiments, the first ion wind generator 320 and the second ion wind generator 330 exhibit a stacked structure, which is compact, small, structurally stable, and has good mechanical strength. The overall shape of the first ion wind generator 320 and the second ion wind generator 330 can be designed with reference to the shapes of the air inlet 101 and the air outlet 102, for example, they can be in the shape of... Figure 2The strip-shaped plate shown is not limited to the shapes illustrated in the accompanying drawings. In other embodiments not shown in the drawings, the overall shape of the first ion wind generator and the second ion wind generator may also be square, rectangular, or circular, and is not limited to these shapes.

[0073] Continue to refer to Figure 2 As shown, in some embodiments of this application, a plurality of first holes 210 are one-to-one with a plurality of second holes 220, such that the orthographic projection of each first hole 210 on the collecting electrode 22 completely coincides with or overlaps with a second hole 220. This design helps to reduce the resistance of the inner wall of the holes to the ion airflow, allowing the ion airflow to be blown out more smoothly from the second holes 220.

[0074] In the embodiments of this application, the specific shapes of the first hole 210 and the second hole 220 are not specifically limited.

[0075] For example, in some embodiments, the first hole 210 can be a circular hole (e.g., Figure 2 The first holes 210 (as shown in the diagram) are not limited to these shapes, such as strip holes or polygonal holes. Multiple first holes 210 can be designed with the same shape or can include multiple shapes.

[0076] For example, in some embodiments, the second hole 220 can be a circular hole (e.g., Figure 2 The shapes shown are strip-shaped holes or polygonal holes, but are not limited to these shapes. Multiple second holes 220 can be designed with the same shape or can include multiple shapes.

[0077] For example, in some embodiments, when multiple first holes 210 are designed with the same shape and multiple second holes 220 are designed with the same shape, the shapes of the first holes 210 and the second holes 220 can be the same (e.g., Figure 2 As shown in the figure, it can also be different (this design embodiment is not shown in the figure).

[0078] like Figure 3 The diagram shows a front view of one possible structural design for the first ion wind generator 320 or the second sub-wind generator 330 according to some embodiments of this application, as well as a cross-sectional view at point BB of the front view. In these embodiments, each first hole 210 and each second hole 220 is a strip-shaped hole.

[0079] It should be noted that in other embodiments not illustrated in the accompanying drawings of this application, the emitting electrodes of the first ion wind generator and / or the second ion wind generator may also adopt conventional needle-shaped, spike-shaped, or fine wire-shaped structures, and this application does not specifically limit them.

[0080] In the embodiments of this application, the air duct 360 can be constructed in various structural forms, and its shape can be regular or irregular, as long as it is conducive to guiding airflow. The embodiments of this application do not make specific limitations in this regard.

[0081] In some embodiments not illustrated in the accompanying drawings, the heat dissipation module may include an air duct component, which may be formed on the air duct component and may be independent of and assembled with the housing assembly. For example, the air duct component may be welded, snap-fitted, fastened, or glued to the housing assembly, etc.

[0082] In other embodiments of this application, at least a portion of the air duct may be formed in the housing assembly. For example... Figure 1A As shown, in these embodiments, the middle frame 110 is provided with a recess 111, and the portion of the rear cover 120 opposite to the recess 111 surrounds the recess 111 to form an air duct 360. In these embodiments, at least a portion of the structure of the air duct 360 is integrated into the housing assembly 100, which not only makes the internal structure of the electronic device 600 more compact, but also helps to reduce production and assembly costs.

[0083] In this embodiment of the application, the specific wind direction of the first directional ion wind 340 and the second directional ion wind 350 is not limited, and the wind directions of the two can be the same or intersect.

[0084] like Figure 1A As shown, in these embodiments, the wind direction of the first directional ion wind 340 and the second directional ion wind 350 can be the same, and the first ion wind generator 320 and the second ion wind generator 330 are arranged opposite to each other, which facilitates the construction of a relatively smooth airflow path between the air inlet 101 and the air outlet 102.

[0085] like Figure 4 As shown, it illustrates a split structural diagram of an electronic device 600 according to some embodiments of this application, wherein the electronic device 600 is exemplified by a mobile phone. In these embodiments, the wind directions of the first directional ion wind 340 and the second directional ion wind 350 can be orthogonal, as shown in the diagram. Figure 4 As shown in the diagram, the air inlet 101 is located on the middle frame 110, and the air outlet 102 is located on the rear cover 120. Alternatively, in some embodiments not shown in the diagram, the air inlet is located on the rear cover, and the air outlet is located on the middle frame. Furthermore, in some embodiments not shown in the diagram, the wind directions of the first directional ion wind 340 and the second directional ion wind 350 may also form an acute angle.

[0086] like Figure 5The diagram illustrates a split structure of an electronic device 600 according to some embodiments of this application, where the electronic device 600 is exemplified by a mobile phone. In these embodiments, the heat dissipation module 300 may include a plurality of first ion wind generators 320 and / or a plurality of second ion wind generators 330. When the heat dissipation module 300 includes a plurality of first ion wind generators 320, the first directional ion winds 340 formed by the plurality of first ion wind generators 320 have the same wind direction and can be distributed near a plurality of air inlets 101 (e.g., Figure 5 The first air inlet 1011 and the second air inlet 1012 shown in the figure can be arranged in a single air inlet (this design is not illustrated in the figure). When the heat dissipation module 300 includes multiple second ion wind generators 330, the wind direction of the second directional ion wind 350 formed by the multiple second ion wind generators 330 is the same, and they can be distributed near multiple air outlets 102 (e.g., Figure 5 The first air outlet 1021 and the second air outlet 1022 shown in the figure can be arranged in one air outlet (this design is not shown in the figure). When the number of air inlets 101 and / or air outlets 102 is set to multiple, the air duct 360 can be connected to each air inlet 101 and each air outlet 102.

[0087] Multiple first ion air generators 320 can be configured to increase the air intake volume; multiple second ion air generators 330 can be configured to increase the air outlet speed of the heat dissipation airflow 370. These features help improve the efficiency of heat exchange between the heat dissipation airflow 370 and the heat sink 310, achieving more efficient heat dissipation for the heat-generating electronic components 200.

[0088] like Figure 6 The diagram illustrates a split-structure schematic of an electronic device 600 according to some embodiments of this application, where the electronic device 600 is exemplified by a mobile phone. In these embodiments, the heat dissipation module 300 may further include a third ion wind generator 380, which is disposed within the air duct 360 for accelerating the heat dissipation airflow 370 within the air duct 360. In these embodiments, the third ion wind generator 380 may have the same or different structural design as the aforementioned first ion wind generator 320 or second ion wind generator 330, and the arrangement of its emitting electrode and collecting electrode should conform to the flow direction of the heat dissipation airflow 370.

[0089] The third ion air generator 380 can be installed between the radiator 310 and the air outlet 102 (e.g.) Figure 6(As shown in the diagram), or positioned between the air inlet 101 and the heat sink 310 (this design is not illustrated in the diagram). Depending on the specific design of the air duct 360 and the specific heat dissipation requirements, the number of third ion air generators 380 can be one or more. The acceleration effect of the third ion air generator 380 on the heat dissipation airflow 370 within the air duct 360 can improve the efficiency of heat exchange between the heat dissipation airflow 370 and the heat sink 310, achieving more efficient heat dissipation for the heat-generating electronic components 200. Furthermore, since the third ion air generator 380 is positioned within the air duct 360, the space occupied by the heat dissipation module 300 is basically not increased, making the internal structure of the electronic device 600 more compact.

[0090] like Figure 7 The diagram shows a schematic cross-sectional structure of the air inlet 101 and air outlet 102 of the housing assembly 100 according to some embodiments of this application. It can be seen that in these embodiments, the first ionizer 320 is embedded in the air inlet 101 of the housing assembly 100, and the second ionizer 330 is embedded in the air outlet 102 of the housing assembly 100.

[0091] In some other embodiments not illustrated in the accompanying drawings, the first ion wind generator may also be located inside the housing assembly and arranged directly opposite the air inlet, and the second ion wind generator may also be located inside the housing assembly and arranged directly opposite the air outlet.

[0092] Reference Figure 7 As shown, in some embodiments of this application, the heat dissipation module 300 may further include a first insulating mesh 24 and a second insulating mesh 25. The first insulating mesh 24 may be disposed at the air inlet 101, for example... Figure 7 As shown, it can be embedded in the air inlet 101 or integrally formed with the housing assembly 100; or, in some embodiments not illustrated in the drawings, the first insulating mesh can be disposed on the surface of the first ionizing wind generator facing the outside of the housing assembly, for example, attached to the surface of the first ionizing wind generator facing the outside of the housing assembly. Similarly, the second insulating mesh 25 can be disposed at the air outlet 102, for example... Figure 7 As shown, it can be embedded in the air outlet 102 or integrally formed with the housing assembly 100; or, in some embodiments not shown in the drawings, the second insulating mesh can be provided on the surface of the second ion wind generator facing the outside of the housing assembly, for example, attached to the surface of the second ion wind generator facing the outside of the housing assembly.

[0093] As described above, the ionization wind generator requires a high-voltage electric current to ionize air molecules and generate airflow using a high-voltage electric field. In these embodiments, the first insulating mesh 24 and the second insulating mesh 25 can serve as shielding elements to protect the ionization wind generator, allowing airflow to pass freely while effectively preventing accidental electric shock. They also provide structural reinforcement, protection, and aesthetic appeal. The materials of the first insulating mesh 24 and the second insulating mesh 25 can include, but are not limited to, insulating materials such as rubber, ceramics, plastics, or glass.

[0094] In the embodiments of this application, such as Figure 1B As shown, at least a portion of the heat sink 310 is located within the air duct 360 to exchange heat with the cooling airflow 370. The heat-generating electronic component 200 can have direct or indirect thermal contact with the heat sink 310. For example, in some embodiments, a portion of the heat sink 310 is located within the air duct 360, and another portion is located outside the air duct 360; the heat-generating electronic component 200 can have direct contact with the heat sink 310 or through a thermally conductive intermediary such as thermally conductive adhesive. For example, in other embodiments, the entire heat sink 310 is located within the air duct 360; the heat-generating electronic component 200 can have thermal contact with the heat sink 310 through a thermally conductive intermediary.

[0095] In this embodiment, the heat sink 310 can adopt various structural forms, and its structural components may include at least one of heat dissipation fins, a heat spreader, a heat pipe, a metal heat sink, or a graphene heat sink. Different heat dissipation structures have different structural characteristics, heat dissipation principles, heat dissipation performance, and processing costs, and can be selected according to specific layout space and heat dissipation requirements. This embodiment does not specifically limit this. Figure 1A , Figure 4 , Figure 5 or Figure 6 As shown, in these embodiments, the heat sink 310 employs heat dissipation fins. In other embodiments not illustrated in the accompanying drawings, the heat sink may also employ a vapor chamber. In still other embodiments not illustrated in the accompanying drawings, the heat sink may also employ a three-dimensional vapor chamber, which is a three-dimensional heat conduction structure constructed by combining heat pipes, a vapor chamber, and heat dissipation fins.

[0096] Reference Figure 1A , Figure 4 , Figure 5 or Figure 6 As shown, according to some embodiments of this application, an electronic device 600 is provided, which includes a housing assembly 100, a heat-generating electronic component 200 located within the housing assembly 100, and a heat dissipation module 300 as described in the foregoing embodiments located within the housing assembly 100.

[0097] The specific product types of electronic devices 600 may include, but are not limited to, mobile phones. Figure 1A , Figure 4 , Figure 5 and Figure 6 (This example uses only one form factor of mobile phone), tablet computers, personal computers, smart wearables, in-vehicle devices, communication devices, power modules, or servers, etc. Furthermore, depending on the specific product type of the electronic device 600, the electronic device can be a candybar type (…). Figure 1A , Figure 4 , Figure 5 and Figure 6 The design is not limited to, but can be a candybar phone, a foldable phone, or a box-type phone. Depending on the specific product type of the electronic device 600, the specific type of the heat-generating electronic component 200 can also vary. For example, the heat-generating electronic component 200 can be a chip that requires heat dissipation. Figure 1A , Figure 4 , Figure 5 and Figure 6 The examples used here are only mobile phone processor chips, memory, network cards, antennas, power supplies, power amplifiers, or hard drives, etc., and this application does not specifically limit these.

[0098] The electronic device 600 of this application embodiment has a better heat dissipation effect based on the above design of the heat dissipation module 300, thereby having a higher heat power density carrying capacity.

[0099] Reference Figure 1A , Figure 4 , Figure 5 or Figure 6 As shown, in these embodiments, the electronic device 600 includes a display module 400, a housing assembly 100, a heat-generating electronic component 200, and a heat dissipation module 300. The display module 400 is used to implement display functions or touch display functions. The housing assembly 100 includes a middle frame 110 and a rear cover 120, and the housing assembly 100 is provided with an air inlet 101 and an air outlet 102. The display module 400 is connected to one side of the middle frame 110, and the rear cover 120 is connected to the other side of the middle frame 110. The middle frame 110 and the rear cover 120, as main support components, can play a role in supporting, installing, or limiting some components (not shown in the figure), wherein, in Figure 1A , Figure 4 , Figure 5 and Figure 6 The image shows only a portion of the structure of the middle frame 110.

[0100] The heat-generating electronic component 200 is located between the display module 400 and the back cover 120. Figure 1AIn this example, the heat-generating electronic component 200 is a processor chip in a mobile phone. The heat sink 310 of the heat dissipation module 300 is used for heat exchange with the heat-generating electronic component 200. A first ion wind generator 320 of the heat dissipation module 300 is disposed adjacent to the air inlet 101 to generate a first directional ion wind 340 blown in from the air inlet 101. A second ion wind generator 330 of the heat dissipation module 300 is disposed adjacent to the air outlet 102 to generate a second directional ion wind 350 blown out from the air outlet 102. An air duct 360 connects the air inlet 101 and the air outlet 102. The heat-generating electronic component 200 is located outside the air duct 360, and at least a portion of the heat sink 310 is located inside the air duct 360. Under the action of the first directional ion wind 340 and the second directional ion wind 350, a cooling airflow 370 passing through the heat sink 310 can be formed in the air duct 360.

[0101] In these embodiments, the electronic device 600 can be, for example, a mobile phone, tablet computer, personal computer, or smart wearable device with a display screen. The electronic device 600, based on the above-described design of the heat dissipation module 300, has better heat dissipation performance, thereby enabling it to have a higher heat power density carrying capacity.

[0102] In some embodiments not illustrated in the accompanying drawings, the heat dissipation module may include air duct components for forming air ducts, which may be assembled on the mid-frame. For example, the air duct components may be welded, snap-fitted, fastened, or glued to the mid-frame, etc.

[0103] like Figure 1A As shown, in some embodiments of this application, the middle frame 110 has a recessed portion 111, and the portion of the rear cover 120 opposite to the recessed portion 111 encloses the recessed portion 111 to form an air duct 360, wherein the air duct 360 is sealed and isolated from the space where the heat-generating electronic component 200 is located. In these embodiments, the air duct 360 is formed by the partial structure of the middle frame 110 and the rear cover 120, which not only makes the internal structure of the electronic device 600 more compact, but also helps to reduce production and assembly costs. Figure 1B As shown, the air duct 360 is sealed and isolated from the space where the heat-generating electronic component 200 is located. This can be achieved by filling some structural gaps with sealant 390 or setting a sealing gasket (the sealing gasket is not shown in the figure), etc. This application embodiment does not specifically limit this.

[0104] like Figure 1A As shown, in some embodiments of this application, the air inlet 101 and the air outlet 102 can both be located on the middle frame 110. For example, the air inlet 101 and the air outlet 102 can be located on two opposite long sides of the middle frame 110 and arranged opposite each other, which facilitates the construction of a relatively smooth airflow path between the air inlet 101 and the air outlet 102.

[0105] like Figure 4As shown, in some other embodiments of this application, one of the air inlet 101 and the air outlet 102 (such as air inlet 101) is located on the middle frame 110, and the other (such as air outlet 102) is located on the rear cover 120, with the design purpose of creating a suitable air duct 360 between the air inlet 101 and the air outlet 102. When the air inlet 101 and / or the air outlet 102 are located on the rear cover 120, their openings are not limited to facing away from the display module. For example, in the embodiments described below, the raised structure design of the rear cover 120 can also be utilized to locate them on the side of the raised structure.

[0106] In some embodiments not illustrated in the accompanying drawings, the air inlet and air outlet may both be located on the rear cover.

[0107] like Figure 5 As shown, in some embodiments of this application, the back cover 120 may include a protrusion 121 protruding from the back of the display module 400. The protrusion 121 includes a top portion 211 and a side portion 212, wherein the side portion 212 is provided with an air inlet 101 and an air outlet 102. For example, the air inlet 101 and the air outlet 102 of the side portion 212 may be arranged opposite to each other, which facilitates the construction of a more unobstructed airflow path.

[0108] In some embodiments not illustrated in the accompanying drawings, one of the air inlet and air outlet may be located on the middle frame, and the other on the side portion of the protrusion of the rear cover, with the design purpose of creating a suitable air duct between the air inlet and air outlet.

[0109] Continue to refer to Figure 5 As shown, in some embodiments of this application, the heat sink 310 may protrude from the middle frame 110 so that a portion of it enters the space defined by the protrusion 121. In this way, the arrangement space of the heat sink 310 is relatively ample, and a heat dissipation design scheme with higher heat dissipation efficiency or slightly larger size but lower cost can be selected as needed.

[0110] Reference Figure 5As shown, in some embodiments of this application, the housing assembly 100 may be provided with two air inlets 101 and two air outlets 102. The two air inlets 101 are respectively a first air inlet 1011 provided on the middle frame 110 and a second air inlet 1012 provided on the side portion 212. The two air outlets 102 are respectively a first air outlet 1021 provided on the middle frame 110 and a second air outlet 1022 provided on the side portion 212. The first air inlet 1011 is opposite to the first air outlet 1021, and the second air inlet 1012 is opposite to the second air outlet 1022. The heat dissipation module 300 may include two first ion wind generators 320 and two second ion wind generators 330. The two first ion wind generators 320 are respectively disposed at the first air inlet 1011 and the second air inlet 1012, and the two second ion wind generators 330 are respectively disposed at the first air outlet 1021 and the second air outlet 1022. Furthermore, the wind direction of the first directional ion wind 340 formed by the two first ion wind generators 320 is the same as the wind direction of the second directional ion wind 350 formed by the two second ion wind generators 330.

[0111] In these embodiments, the heat-generating electronic component 200 can be cooled by two sets of ion wind generators sharing a common air duct 360 and heat sink 310, thereby improving the efficiency of heat exchange between the heat dissipation airflow 370 and the heat sink 310, and achieving more efficient heat dissipation of the heat-generating electronic component 200.

[0112] like Figure 5 As shown, in some embodiments, the electronic device 600 may further include a camera module 500, which is located between the display module 400 and the back cover 120, and the lens of the camera module 500 faces the protrusion 121. In some embodiments, the camera module 500 may be fixed to the mid-frame 110. Accordingly, the area of ​​the protrusion 121 opposite to the lens of the camera module 500 is a light-transmitting area 215. In these embodiments, the air duct 360 is sealed and isolated from the space where the camera module 500 is located, for example, by filling some structural gaps with sealant or setting sealing gaskets, etc., which is not specifically limited in this application embodiment. In some embodiments, electronic components with high protection requirements, such as the camera module 500 and the processor chip, may be located in the same sealed space.

[0113] The protrusion 121 is not limited to being in the shape of Figure 5 The rectangle shown can also be circular, for example. In some embodiments, the protrusion corresponding to the camera module on the back cover can be modified to construct, for example, a partial structure of an air inlet, air outlet, air duct, or a sealing partition structure. For example, the side portion of the protrusion can be a decorative ring, and if an air inlet and / or air outlet are to be provided thereon, only corresponding structural modifications need to be made.

[0114] like Figure 5 As shown, in these embodiments, the area of ​​the protrusion 121 opposite to the lens of the camera module 500 is a light-transmitting area 215. Specifically, a protective glass can be provided in this light-transmitting area 215, or the top surface of the protrusion can be entirely provided with protective glass; this application embodiment does not specifically limit this.

[0115] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation module applied to an electronic device, the electronic device further comprising a housing assembly and heat-generating electronic components located within the housing assembly, wherein, The housing assembly is provided with an air inlet and an air outlet, characterized in that the heat dissipation module includes: A heat sink is used for heat exchange with the heat-generating electronic components; A first ion wind generator is disposed adjacent to the air inlet and is used to generate a first directional ion wind blown in from the air inlet. A second ion wind generator, disposed adjacent to the air outlet, is used to generate a second directional ion wind blown out from the air outlet; and An air duct connects the air inlet and the air outlet, wherein the heat-generating electronic component is located outside the air duct, and at least a portion of the heat sink is located inside the air duct. Under the action of the first directional ion wind and the second directional ion wind, a heat dissipation airflow is formed in the air duct that passes through the heat sink.

2. The heat dissipation module according to claim 1, characterized in that, The first directional ion wind and the second directional ion wind have the same wind direction; or The wind directions of the first directional ion wind and the second directional ion wind intersect.

3. The heat dissipation module according to claim 1 or 2, characterized in that, The heat dissipation module includes multiple first ion wind generators, and the first directional ion winds generated by the multiple first ion wind generators have the same wind direction; and / or The heat dissipation module includes multiple second ion wind generators, and the second directional ion winds generated by the multiple second ion wind generators have the same wind direction.

4. The heat dissipation module according to any one of claims 1 to 3, characterized in that, Also includes: A third ion wind generator is located inside the air duct and is used to accelerate the heat dissipation airflow inside the air duct.

5. The heat dissipation module according to any one of claims 1 to 4, characterized in that, Both the first ion wind generator and the second ion wind generator include: The emitting electrode is in the shape of a perforated plate, which includes multiple first holes; A collecting electrode, spaced apart from the emitting electrode, is in the form of a perforated plate and includes a plurality of second holes; and An insulating medium is located between the emitting electrode and the collecting electrode; Wherein, the orthographic projection of the insulating medium on the emitting electrode does not overlap with the plurality of first holes, and the orthographic projection of the insulating medium on the collecting electrode does not overlap with the plurality of second holes.

6. The heat dissipation module according to claim 5, characterized in that, The plurality of first holes are paired with the plurality of second holes one by one, wherein, The orthographic projection of each first hole onto the collecting electrode coincides with or overlaps in area with the corresponding second hole.

7. The heat dissipation module according to claim 5 or 6, characterized in that, The plurality of first holes include circular holes, strip holes, or polygonal holes; and / or The plurality of second holes include circular holes, strip holes, or polygonal holes.

8. The heat dissipation module according to any one of claims 1 to 7, characterized in that, Also includes: A first insulating mesh is provided at the air inlet or on the surface of the first ion wind generator exposed at the air inlet. as well as The second insulating mesh is disposed at the air outlet or on the surface of the second ion wind generator exposed at the air outlet.

9. The heat dissipation module according to any one of claims 1 to 8, characterized in that, The heat dissipation module further includes an air duct component, which is assembled and connected to the housing assembly, and the air duct is formed in the air duct component; or At least a portion of the air duct is formed in the housing assembly.

10. The heat dissipation module according to any one of claims 1 to 9, characterized in that, The heat sink's structure includes at least one of the following: heat dissipation fins, a heat spreader, a heat pipe, a metal heat sink, or a graphene heat sink.

11. An electronic device, characterized in that, include: Display module; The housing assembly is provided with an air inlet and an air outlet, and the housing assembly includes a middle frame and a back cover, wherein the display module is connected to one side of the middle frame and the back cover is connected to the other side of the middle frame; A heat-generating electronic component is located between the display module and the back cover; and The heat dissipation module according to any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The middle frame is provided with a groove, and the portion of the back cover opposite to the groove surrounds the groove to form the air duct, wherein the air duct is sealed and isolated from the space where the heating electronic component is located.

13. The electronic device according to claim 11 or 12, characterized in that, Both the air inlet and the air outlet are located in the middle frame; or Both the air inlet and the air outlet are located on the rear cover; or One of the air inlet and the air outlet is located in the middle frame, and the other is located in the rear cover.

14. The electronic device according to claim 11 or 12, characterized in that, The rear cover includes a protrusion that projects outwards from the display module. The protrusion includes a top portion and a side portion. Both the air inlet and the air outlet are located on the side portion; or One of the air inlet and the air outlet is located in the middle frame, and the other is located in the side portion.

15. The electronic device according to claim 11 or 12, characterized in that, The rear cover includes a protrusion that projects outwards from the display module. The protrusion includes a top portion and a side portion. A portion of the heat sink is located within the space defined by the protrusion.

16. The electronic device according to claim 11, 12 or 15, characterized in that, The back cover includes a protrusion that protrudes away from the display module, and the protrusion includes a top surface portion and a side surface portion; The outer casing assembly is provided with two air inlets and two air outlets. The two air inlets are respectively a first air inlet located on the middle frame and a second air inlet located on the side portion. The two air outlets are respectively a first air outlet located on the middle frame and a second air outlet located on the side portion. The first air inlet is opposite to the first air outlet, and the second air inlet is opposite to the second air outlet. The heat dissipation module includes two first ion wind generators and two second ion wind generators. The two first ion wind generators are respectively disposed at the first air inlet and the second air inlet, and the two second ion wind generators are respectively disposed at the first air outlet and the second air outlet. Furthermore, the wind direction of the first directional ion wind generated by the two first ion wind generators is the same as the wind direction of the second directional ion wind generated by the two second ion wind generators.

17. The electronic device according to any one of claims 14 to 16, characterized in that, Also includes: A camera module is located between the display module and the back cover, and the lens of the camera module faces the protrusion. The air duct is sealed and isolated from the space where the camera module is located, and the area of ​​the protrusion opposite to the camera module is a light-transmitting area.

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