A heat dissipation cold plate device and electronic equipment

Abstract

The present application relates to the technical fields of electronic device cooling, and a heat dissipation cold plate device and electronic equipment, comprising a flow channel assembly, a plurality of flow channel grooves extending along a first direction are arranged inside the flow channel assembly; a separation block is arranged in each flow channel groove, and the separation block separates the flow channel groove into a plurality of working cavities which are distributed along the first direction and independent of each other; each working cavity is provided with a liquid inlet and a liquid outlet, and along the liquid inlet-to-liquid outlet direction of the working cavity, a cavitation induction assembly and a Venturi tube structure are sequentially arranged in the working cavity, the cavitation induction assembly is used for inducing hydraulic cavitation to generate cavitation bubbles, and the inner diameter of the Venturi tube structure gradually decreases and then gradually increases along the liquid inlet-to-liquid outlet direction; the flow channel groove is separated into a plurality of independent working cavities, so that each working cavity independently completes cavitation induction and collapse strengthening heat exchange, the temperature accumulation of the cooling liquid along the flow channel is avoided, the independent and differentiated response to the heat dissipation requirements of different regions of the chip is realized, and the uniformity of the chip surface temperature and the overall heat dissipation efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, specifically to a heat dissipation cold plate device and electronic equipment. Background Technology

[0002] As the power consumption of high-performance chips such as GPUs and CPUs continues to rise, the heat flux density of chips has exceeded 500W / cm² and is developing towards 1000W / cm² and above. Traditional air cooling cannot meet the heat dissipation requirements, and direct chip liquid cooling has become the mainstream solution in the industry, with its core heat exchange component being a heat dissipation plate.

[0003] In related technologies, heat dissipation cold plates typically have continuously extending flow channels on a thermally conductive substrate, with the entire flow channel forming a continuous heat exchange chamber. In this structure, the temperature of the coolant gradually increases along the flow direction during operation, and the temperature of the coolant near the outlet of the flow channel is significantly higher than that near the inlet, resulting in uneven temperature distribution on the chip surface and difficulty in effectively cooling the latter half of the chip. Furthermore, the existing technology has poor cooling efficiency of the coolant in the cooling tank for the chip, which cannot meet the heat dissipation requirements.

[0004] Therefore, how to prevent the temperature from accumulating step by step as the coolant flows along the flow channel, which would lead to a decrease in the heat dissipation capacity of the chip in the latter half of the process, and how to improve the cooling efficiency, are key technical problems that urgently need to be solved in this field. Summary of the Invention

[0005] The present invention provides a heat dissipation cold plate device and an electronic device to solve the problem that the temperature of the coolant accumulates step by step along the flow channel in the existing heat dissipation cold plate, resulting in a decrease in the heat dissipation capacity of the chip in the latter half of the process, uneven surface temperature distribution and poor cooling efficiency.

[0006] A heat dissipation plate device for chip heat dissipation, comprising: A flow channel assembly having multiple flow channel grooves inside, the flow channel grooves extending along a first direction; Each of the flow channel grooves is provided with an isolation block, which divides the flow channel groove into multiple independent working chambers distributed along a first direction. Each of the working chambers is provided with an inlet and an outlet. Along the inlet to outlet direction of the working chamber, a cavitation induction component and a Venturi tube structure are sequentially provided in the working chamber. The cavitation induction component is used to induce hydraulic cavitation to generate cavitation bubbles. The Venturi tube structure has a gradually narrowing and then gradually increasing inner diameter along the inlet to outlet direction.

[0007] Furthermore, the flow channel assembly includes: A thermally conductive substrate has a first surface and a second surface disposed opposite to each other along its thickness direction. The first surface is in contact with the chip. The second surface is provided with a plurality of flow channel grooves, and the groove openings of the flow channel grooves are located on the second surface. The flow channel baffle has a third side and a fourth side arranged opposite to each other along its thickness direction. The third side is in contact with the second side of the thermally conductive substrate to seal the opening of the flow channel groove. The third side of the flow channel baffle is provided with a plurality of isolation blocks, all of which are embedded in the flow channel groove.

[0008] Furthermore, the flow channel partition is provided with an inlet pipe and an outlet pipe, the inlets of multiple working chambers are connected in parallel to the inlet pipe, and the outlets of multiple working chambers are connected in parallel to the outlet pipe.

[0009] Furthermore, the liquid inlet pipeline includes a distribution chamber, a first pipeline, and a second pipeline; the distribution chamber is disposed inside the flow channel partition; the first pipeline connects the distribution chamber and an external liquid supply device; and the second pipeline connects the distribution chamber and the working chamber.

[0010] Furthermore, the liquid outlet pipeline includes a collecting chamber, a third pipeline, and a fourth pipeline; the collecting chamber is disposed inside the flow channel baffle; the third pipeline connects the collecting chamber to an external liquid return device; and the fourth pipeline connects the collecting chamber to the working chamber.

[0011] Furthermore, the distribution cavity and the collection cavity are staggered, the second pipeline passes through the collection cavity, and the portion of the second pipeline inside the collection cavity is an isolation pipe. The first end of the isolation pipe is connected to the end of the collection cavity near the distribution cavity; the second end of the isolation pipe is connected to the other end of the collection cavity. Alternatively, the fourth conduit may pass through the distribution cavity, and the portion of the fourth conduit located within the distribution cavity may be an isolation pipe, with the first end of the isolation pipe connected to the end of the distribution cavity near the collection cavity, and the second end of the isolation pipe connected to the other end of the distribution cavity.

[0012] Furthermore, along the liquid inlet to liquid outlet direction of the working chamber, a flow regulating component is provided between the liquid inlet of the working chamber and the cavitation induction component, the flow regulating component being used to regulate the flow rate within the working chamber.

[0013] Furthermore, a first mounting groove is provided on the third surface of the flow channel baffle; the flow regulating component is placed in the first mounting groove.

[0014] Furthermore, the flow regulating component is a piezoelectric proportional valve; the body of the piezoelectric proportional valve is embedded in the first mounting groove; the valve core of the piezoelectric proportional valve can extend and retract in the flow channel groove.

[0015] Furthermore, a second mounting groove is provided on the third surface of the flow channel baffle; the cavitation inducing component is placed in the second mounting groove.

[0016] Furthermore, the cavitation induction component includes a retainer and a microporous throttling plate assembly; the flow channel groove has a first portion opposite to the second mounting groove, the retainer has a first end and a second end opposite to each other, the first end of the retainer is embedded in the second mounting groove, the second end of the retainer is in contact with or has a gap with the first portion, and the microporous throttling plate assembly is connected between the first end and the second end of the retainer.

[0017] Furthermore, the microporous throttling plate assembly is detachably connected to the cage.

[0018] Furthermore, along the liquid inlet to liquid outlet direction, the flow channel between the flow regulating component and the cavitation induction component is configured as a flat DC channel, and the sidewall of the flat DC channel is parallel to the first direction.

[0019] Furthermore, the third surface of the flow channel partition is provided with a first protruding structure that protrudes in the direction of the flow channel groove along the first direction and a first recessed structure that extends upward away from the flow channel groove from the first protruding structure; the first protruding structure, the first recessed structure and the flow channel groove form the Venturi tube structure.

[0020] Furthermore, each of the flow channels is provided with at least three working cavities spaced apart along the first direction, and the working cavity located at or near the center along the first direction has a length along the first direction that is greater than the length of the other working cavities.

[0021] Furthermore, the thermally conductive substrate is provided with multiple temperature measuring components for measuring the temperature of the chip; the multiple temperature measuring components are used to detect the temperature of different heat-generating areas of the chip.

[0022] Furthermore, a mounting hole is provided at one end of the flow channel near the chip; the temperature measuring component is disposed in the mounting hole; the internal space of the mounting hole is isolated from the flow channel.

[0023] Furthermore, it also includes an upper cover plate; having a fifth surface and a sixth surface arranged opposite to each other along its thickness direction; the fifth surface of the upper cover plate is connected to the fourth surface of the flow channel partition; the upper cover plate is provided with an inlet manifold cavity and an outlet manifold cavity; one end of the inlet manifold cavity is connected to the external liquid supply device, and the other end of the inlet manifold cavity is connected to the first pipeline; One end of the outlet manifold is connected to the external return liquid device, and the other end of the outlet manifold is connected to the third pipeline.

[0024] Furthermore, it also includes a fixing frame; having a seventh surface and an eighth surface arranged opposite to each other along its thickness direction; the seventh surface of the fixing frame abuts against the sixth surface of the upper cover plate; the fixing frame is connected to the module assembly that fixes the chip via a spring screw assembly.

[0025] An electronic device includes a chip and a heat dissipation plate assembly, wherein the heat dissipation plate assembly is thermally connected to the chip.

[0026] This invention divides the flow channel into multiple independent working chambers distributed along a first direction using isolation blocks. Each working chamber has an independent liquid inlet and outlet, and cavitation induction components and Venturi tube structures are sequentially arranged along the liquid inlet to outlet direction. Therefore, the coolant independently completes the cavitation induction process and the collapse-enhanced heat transfer process in each working chamber, avoiding the gradual accumulation of temperature as the coolant flows along the entire flow channel. Thus, it can solve the technical problem of the gradual accumulation of coolant temperature in existing heat dissipation plates, which leads to a decrease in the heat dissipation capacity of the chip in the latter half and uneven surface temperature distribution, thereby achieving the technical effect of improving the uniformity of chip surface temperature and overall heat dissipation efficiency. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the assembly structure of the heat dissipation cold plate device provided in an embodiment of the present invention; Figure 2 This is a perspective view of the assembly structure of the heat dissipation cold plate device provided in an embodiment of the present invention; Figure 3 An exploded view of the heat dissipation cold plate device provided in an embodiment of the present invention; Figure 4 This is an isometric view of the fixed pressure frame provided in an embodiment of the present invention; Figure 5 This is a top view of the fixed pressure frame provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the cross-sectional structure of the fixed pressure frame provided in an embodiment of the present invention; Figure 7 An isometric view of the upper cover plate provided in an embodiment of the present invention; Figure 8 A perspective axonometric view of the upper cover plate provided in an embodiment of the present invention; Figure 9 This is a perspective top view of the upper cover plate provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of the cross-sectional structure of the upper cover plate provided in an embodiment of the present invention; Figure 11 This is an isometric view of the flow channel baffle provided in an embodiment of the present invention; Figure 12 This is an isometric view of the bottom of the flow channel baffle provided in an embodiment of the present invention; Figure 13 This is a top view of the flow channel baffle provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of the cross-sectional structure of the flow channel baffle provided in an embodiment of the present invention; Figure 15 A schematic diagram of a miniature piezoelectric proportional valve provided in an embodiment of the present invention; Figure 16 A perspective isometric view of a microporous throttling plate assembly provided in an embodiment of the present invention; Figure 17 This is a front view of the microporous throttling plate assembly provided in an embodiment of the present invention; Figure 18 This is a schematic cross-sectional view of the microporous throttling plate assembly provided in an embodiment of the present invention; Figure 19 This is an isometric view of a thermally conductive substrate provided in an embodiment of the present invention; Figure 20 This is a top view of a thermally conductive substrate provided in an embodiment of the present invention; Figure 21 This is a schematic diagram of the cross-sectional structure of the thermally conductive substrate provided in an embodiment of the present invention; Figure 22 This is a schematic diagram of the cross-sectional structure of the thermally conductive substrate from another angle, as provided in an embodiment of the present invention. Figure 23 This is a cross-sectional structural schematic diagram of the heat dissipation cold plate device provided in an embodiment of the present invention; Figure 24 This is a cross-sectional structural diagram of the heat dissipation cold plate device from another angle, provided in an embodiment of the present invention; Figure 25 A cross-sectional structural diagram of the heat dissipation cold plate device from another angle provided in an embodiment of the present invention; Figure 26 A working fluid flow diagram for the heat dissipation cold plate device provided in an embodiment of the present invention; Figure 27 A flowchart of the coolant flow process provided in this embodiment of the invention; Figure 28 The adaptive temperature control flowchart is provided for an embodiment of the present invention.

[0029] Explanation of reference numerals in the attached figures: In the diagram: 1: Fixed pressure frame; 1-1: Mounting ear; 1-2: Circular countersunk hole; 1-3: Circular groove; 2: Spring screw assembly; 2-1: Fixing screw; 2-2: Flat washer; 2-3: Helical spring; 2-4: Limiting sleeve; 3: Top cover plate; 3-1: Fastening screw; 3-2: Liquid inlet; 3-3: Liquid outlet; 3-4: Boss; 3-5: Liquid inlet manifold cavity inlet; 3-6: Liquid outlet manifold cavity inlet; 3-7: Liquid inlet manifold cavity; 3-8: Liquid outlet manifold cavity; 4: Flow channel baffle; 4-1: Circular sealing ring; 4-2: Micro-orifice throttling plate assembly; 4-2-1: Cage; 4-2-2: Circular micro-orifice throttling plate; 4-2-3: Circular through hole; 4-3: Miniature piezoelectric proportional valve; 4-3-1: Miniature piezoelectric proportional valve body; 4-3-2: Miniature... 4-4: Piezoelectric proportional valve core; 4-5: Liquid inlet; 4-6: Liquid outlet; 4-7: Liquid supply hole; 4-8: First mounting groove; 4-9: Venturi tube structure outline of the first-stage cavitation unit; 4-10: Venturi tube structure outline of the second-stage cavitation unit; 4-11: Venturi tube structure outline of the third-stage cavitation unit; 4-12: Isolation block; 4-13: Rectangular sealing shallow groove; 4-14: Distribution chamber; 4-15: Collection chamber; 4-16: Return hole; 5: Thermal conductive substrate; 5-1: O-ring seal; 5-2: Thin-film thermocouple temperature sensor; 5-3: Rectangular sealing groove; 5-4: Rectangular flow channel groove; 5-5: Rib wall; 5-6: Return hole of the third cavity; 5-7: Temperature sensor mounting blind hole; 6: Chip; 7: Chip module. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] To address the problem that the temperature of the coolant accumulates gradually along the flow channel in existing heat dissipation plates, resulting in reduced heat dissipation capacity in the latter half of the chip, uneven surface temperature distribution, and poor cooling efficiency, this invention provides a heat dissipation plate device and an electronic device.

[0034] The following is combined with Figures 1 to 28 This describes a heat dissipation cold plate device and an electronic device provided in an embodiment of the present invention.

[0035] A heat dissipation plate device, such as Figures 1-28 As shown, the heat dissipation for chip 6 includes: The flow channel assembly has multiple flow channel grooves inside, which extend along a first direction; Each flow channel is provided with an isolation block 4-12, which divides the flow channel into multiple independent working chambers distributed along the first direction. Each working chamber is equipped with an inlet and an outlet. Along the inlet to outlet direction of the working chamber, a cavitation induction component and a Venturi tube structure are sequentially arranged inside the working chamber. The cavitation induction component is used to induce hydraulic cavitation to generate cavitation bubbles. The Venturi tube structure has a gradually narrowing and then gradually increasing inner diameter along the inlet to outlet direction.

[0036] In some embodiments provided by the present invention, the overall structure of the heat dissipation cold plate device is a rectangular flat plate with external dimensions of 100mm×100mm×30mm, which can be adapted to a high-performance server CPU / GPU chip 6 with a package size of 50mm×50mm.

[0037] In this embodiment, each flow channel is divided into multiple independent working chambers distributed along the first direction by isolation blocks 4-12. Each working chamber has an independent liquid inlet and outlet. Cavitation induction components and Venturi tube structures are sequentially arranged in each working chamber along the liquid inlet to liquid outlet direction to increase cooling efficiency. The coolant independently completes the process of cavitation induction using the cavitation induction components and the process of collapsing heat transfer using the Venturi tube structure in each working chamber. This avoids the problem of gradual temperature accumulation of the coolant during the flow of the entire flow channel, which leads to a decrease in the heat dissipation capacity of the chip 6 in the latter half. At the same time, the liquid inlet and outlet of each working chamber do not interfere with each other. The flow rate of each working chamber can be independently adjusted according to the heat dissipation needs of different areas of the chip 6, so as to achieve independent and differentiated response to the heat dissipation needs of different areas of the chip 6, thereby improving the temperature uniformity of the chip 6 surface and the overall heat dissipation efficiency.

[0038] Furthermore, the flow channel assembly includes: a thermally conductive substrate 5, such as... Figures 19-22 As shown, it has a first surface and a second surface that are arranged opposite to each other along its thickness direction. The first surface is attached to the chip 6. The second surface is provided with a plurality of flow channel grooves, and the groove openings of the flow channel grooves are located on the second surface.

[0039] In some embodiments of the present invention, the thermally conductive substrate 5 is made of a material with high thermal conductivity, specifically oxygen-free copper, and its external dimensions can be 80mm × 80mm × 6mm. The first surface of the thermally conductive substrate 5 is the chip bonding surface, which is polished to reduce surface roughness. During assembly, it is filled with thermal grease and tightly pressed onto the heat dissipation chip 6. The specific pressing process is as follows: First, a thin layer of thermal grease is uniformly coated on the side of the chip 6 that is in contact with the first surface of the thermally conductive substrate 5. The coating thickness is usually controlled at about 0.05 to 0.1 mm. Then, the first surface of the thermally conductive substrate 5 is aligned with the chip 6 and slowly pressed down, so that the thermal grease spreads naturally between the two and fills the tiny gaps caused by the microscopic unevenness of the surface. The thermal grease can eliminate the air between the contact surfaces, reduce the interface contact thermal resistance, and thus improve the efficiency of heat transfer from the chip 6 to the thermally conductive substrate 5.

[0040] In some embodiments provided by the present invention, the number of flow channel grooves is odd and is symmetrical about the central axis of the thermally conductive substrate 5 in the first direction.

[0041] In some embodiments provided by the present invention, the cross-section of the channel groove is rectangular, the width and depth ratio of the rectangle is 1:2, the width of the rib wall 5-5 between adjacent channel grooves is the same as the width of the channel groove; the length of each channel groove can be adjusted according to the actual size of the chip 6, the chip 6 is located in the middle of the channel groove, and the two sides of the channel groove extend 0~10mm beyond the outer edge of the chip 6 in the first direction.

[0042] In some embodiments provided by the present invention, 11 parallel flow channel grooves are processed on the second surface of the heat-conducting substrate 5. The flow channel grooves extend along the first direction and are rectangular flow channel grooves 5-4, that is, the cross-section of the flow channel groove is rectangular, and the ratio of the width to the depth of the rectangle is 1:2. In this embodiment, the width is 1mm and the depth is 2mm. The length of each flow channel groove covers the projection area of ​​the heat dissipation chip 6 in the first direction and extends to both ends by about 0~10mm. In the present invention, the length of the flow channel groove can be 56mm. The width of the rib wall 5-5 between adjacent flow channel grooves is the same as the width of the flow channel groove, which can be 1mm. The second direction is perpendicular to the first direction, and the flow channel grooves are symmetrical about the center of the heat-conducting substrate 5 in the second direction. The total span can be 21mm (flow channel width 1mm×11 + rib wall 5-5 width 1mm×10).

[0043] The flow channel assembly also includes flow channel baffle 4, such as Figures 11-18 As shown, the flow channel baffle 4 has a third surface and a fourth surface that are arranged opposite to each other along its thickness direction. The third surface is in contact with the second surface of the heat-conducting substrate 5 to seal the opening of the flow channel groove. The third surface of the flow channel baffle 4 is provided with a plurality of isolation blocks 4-12, all of which are embedded in the flow channel groove.

[0044] In some embodiments provided by the present invention, the flow channel baffle 4 is made of copper material and its external dimensions are consistent with those of the heat-conducting substrate 5 in the first and second directions.

[0045] In some embodiments provided by the present invention, a rectangular sealing groove 5-3 is provided on the second surface of the heat-conducting substrate 5 around the flow channel groove area, and a rectangular sealing shallow groove 4-13 corresponding to and cooperating with the rectangular sealing groove 5-3 is provided on the third surface of the flow channel partition 4. An O-ring 5-1 is placed in the rectangular sealing groove 5-3 and the rectangular sealing shallow groove 4-13, and the O-ring is used to seal the flow channel groove and to assemble and position the heat-conducting substrate 5 and the flow channel partition 4.

[0046] In some embodiments provided by the present invention, an isolation block 4-12 is provided on the third surface of the flow channel partition 4 corresponding to the flow channel groove position. The isolation block 4-12 protrudes in the direction of the flow channel groove and has the same width as the flow channel groove. During assembly, it is embedded in the flow channel groove of the heat-conducting substrate 5 to divide each flow channel groove into an independent working cavity.

[0047] Furthermore, the flow channel partition 4 is provided with an inlet pipe and an outlet pipe, with the inlets of multiple working chambers connected in parallel to the inlet pipe and the outlets of multiple working chambers connected in parallel to the outlet pipe.

[0048] The supply and drainage of coolant in each working chamber are independent and do not interfere with each other. Compared with the series architecture, the parallel supply of coolant ensures that the temperature of the coolant entering each working chamber is consistent, avoiding the problem that the temperature of the coolant gradually accumulates as it flows along the flow channel, which leads to a decrease in the temperature difference of the subsequent working chambers and a decrease in heat dissipation capacity.

[0049] Furthermore, the liquid inlet pipeline includes a distribution chamber 4-14, a first pipeline, and a second pipeline; the distribution chamber 4-14 is located inside the flow channel partition 4; the first pipeline connects the distribution chamber 4-14 to the external liquid supply device; and the second pipeline connects the distribution chamber 4-14 to the working chamber.

[0050] In some embodiments provided by the present invention, the distribution cavity 4-14 is a rectangular cavity with a thickness of 1mm. Its horizontal dimensions (first direction and second direction) are consistent with the outer dimensions of the area occupied by all flow channel grooves, covering the distribution area of ​​all flow channel grooves.

[0051] Furthermore, the liquid outlet pipeline includes a collecting chamber 4-15, a third pipeline, and a fourth pipeline; the collecting chamber 4-15 is located inside the flow channel partition 4; the third pipeline connects the collecting chamber 4-15 to the external liquid return device; and the fourth pipeline connects the collecting chamber 4-15 to the working chamber.

[0052] In some embodiments provided by the present invention, the outer dimensions of the collecting cavity 4-15 and the distributing cavity 4-14 are the same, and the thickness of the collecting cavity 4-15 can be 1 mm.

[0053] Furthermore, the distribution chamber 4-14 and the collection chamber 4-15 are staggered. The second pipeline passes through the collection chamber 4-15, and the portion of the second pipeline within the collection chamber 4-15 is an isolation pipe. The first end of the isolation pipe is connected to the end of the collection chamber 4-15 near the distribution chamber 4-14, and the second end of the isolation pipe is connected to the other end of the collection chamber 4-15. Alternatively, the fourth pipeline passes through the distribution chamber 4-14, and the portion of the fourth pipeline within the distribution chamber 4-14 is an isolation pipe. The first end of the isolation pipe is connected to the end of the distribution chamber 4-14 near the collection chamber 4-15, and the second end of the isolation pipe is connected to the other end of the distribution chamber 4-14.

[0054] In some embodiments provided by the present invention, the distribution cavity 4-14 is located inside the flow channel partition 4 and close to the fourth side of the distribution cavity 4-14. The distribution cavity 4-14 is located directly above the collection cavity 4-15. The two overlap in the horizontal projection and are separated from each other in the vertical direction to ensure that there is no crossflow.

[0055] In some embodiments of the present invention, the distribution cavity 4-14 is machined with a plurality of vertically downward liquid supply holes 4-6, which serve as the second pipeline; there are three working chambers, each of which is connected to three liquid supply holes 4-6 in a flow channel groove, corresponding to the three working chambers respectively, and the 11 flow channel grooves are connected to the 33 liquid supply holes 4-6. The liquid supply holes 4-6 extend vertically downward from the end face of the distribution cavity 4-14 near the collection cavity 4-15, pass through the area of ​​the collection cavity 4-15, and finally open into each working chamber, serving as the liquid inlet of the working chamber.

[0056] Two isolation blocks 4-12 are provided in the flow channel to divide the flow channel into three working chambers; along the first direction, the liquid inlet of the first working chamber is opened at a position away from the isolation block 4-12; the liquid inlets of the second and third working chambers are opened on the isolation block 4-12; for example, along the first direction, the three working chambers are the first working chamber, the second working chamber and the third working chamber; the two isolation blocks 4-12 are the first isolation block 4-12 and the second isolation block 4-12; the liquid supply hole 4-6 extends downward to the first isolation block 4-12, and opens from the first isolation block 4-12 near the second working chamber as the liquid inlet of the second working chamber, so as to facilitate the flow of low temperature coolant into the second working chamber.

[0057] Within the section passing through the collecting chamber 4-15, the supply holes 4-6 within the collecting chamber 4-15 are composed of isolation tubes. The height of the isolation tubes is equal to the height of the collecting chamber 4-15, and both ends of the isolation tubes are sealed to the two end faces of the collecting chamber 4-15. The isolation tubes ensure that the low-temperature coolant in the supply holes 4-6 and the high-temperature coolant in the collecting chamber 4-15 are completely isolated in space, thus preventing fluid mixing. The end face of the collecting chamber 4-15 near the working chamber is provided with the same number of return holes 4-16 as the supply holes 4-6. Each flow channel groove is connected to 3 return holes 4-16, corresponding to 3 working chambers respectively. The return holes 4-16 are the fourth pipeline. The diameter of the return holes 4-16 is the same as the diameter of the supply holes 4-6. The position where the return holes 4-16 connect to the working chamber serves as the outlet of the working chamber. The return holes 4-16 extend horizontally first and then vertically upward, passing through the flow channel partition 4 and opening on the end face of the collecting chamber 4-15 near the working chamber.

[0058] The outlets of the first and second working chambers are both located on the first and second isolation blocks 4-12; the reflux hole 4-16 extends downward to the first isolation block 4-12 and opens near the first working chamber as the outlet of the first working chamber; the reflux hole 4-16 extends downward to the second isolation block 4-12 and opens near the second working chamber as the outlet of the second working chamber; the outlet of the third working chamber is located away from the second isolation block 4-12, i.e., the reflux hole 5-6 of the third chamber, as shown below. Figures 19-20As shown; the reflux hole 4-16 opens horizontally and then vertically upward from the liquid outlet of each working chamber onto the end face of the collecting chamber 4-15 near the working chamber, and is used to receive the high-temperature coolant after heat exchange.

[0059] Furthermore, along the liquid inlet to liquid outlet direction of the working chamber, a flow regulating component is provided between the liquid inlet of the working chamber and the cavitation induction component. The flow regulating component is used to regulate the flow rate in the working chamber.

[0060] This invention provides a flow regulation component between the liquid inlet of the working chamber and the cavitation induction component, allowing the coolant flow rate of each working chamber to be independently adjusted. This enables the flow rate of the corresponding working chamber to be individually adjusted according to the real-time heat load of different areas of the chip 6, thereby changing the flow velocity and cavitation intensity through the cavitation induction component. This achieves independent dynamic control of the heat dissipation capacity of each working chamber, accurately responds to local hot spots of the chip 6, and reduces unnecessary flow and pump power consumption under low load.

[0061] Furthermore, a first mounting groove 4-7 is provided on the third surface of the flow channel baffle 4; a flow regulating component is placed in the first mounting groove 4-7.

[0062] Furthermore, the flow regulating component is a piezoelectric proportional valve; the body of the piezoelectric proportional valve is embedded in the first mounting groove 4-7; the valve core of the piezoelectric proportional valve can extend and retract in the flow channel groove.

[0063] In some embodiments provided by the present invention, the groove of the first mounting groove 4-7 is a rectangular blind groove, and the piezoelectric proportional valve uses a miniature piezoelectric proportional valve 4-3; the miniature piezoelectric proportional valve 4-3 consists of a miniature piezoelectric proportional valve body 4-3-1 and a miniature piezoelectric proportional valve core 4-3-2. The miniature piezoelectric proportional valve body 4-3-1 is embedded in the first mounting groove 4-7, and the miniature piezoelectric proportional valve core 4-3-2 extends out from the miniature piezoelectric proportional valve body 4-3-1. In the normally open state, the miniature piezoelectric proportional valve core 4-3-2 retracts. When a voltage is applied, the internal piezoelectric stack drives the miniature piezoelectric proportional valve core 4-3-2 to extend towards the flow channel groove through the flexible hinge amplification mechanism, thereby changing the effective flow height in the flow channel groove and realizing continuous proportional regulation of the flow rate.

[0064] Furthermore, a second mounting groove 4-8 is provided on the third surface of the flow channel baffle 4; a cavitation inducing component is placed in the second mounting groove 4-8.

[0065] Furthermore, the cavitation induction component includes a retainer 4-2-1 and a microporous throttling plate assembly 4-2; the flow channel groove is provided with a first part opposite to the second mounting groove 4-8, the retainer 4-2-1 has a first end and a second end opposite to each other, the first end of the retainer 4-2-1 is embedded in the second mounting groove 4-8, the second end of the retainer 4-2-1 is in contact with or has a gap with the first part, and the microporous throttling plate assembly 4-2 is connected between the first end and the second end of the retainer 4-2-1.

[0066] In some embodiments provided by the present invention, the second mounting groove 4-8 is a rectangular blind groove, the width of the second mounting groove 4-8 is slightly larger than the width of the flow channel groove, and it is used to install the cavitation induction component; the retainer 4-2-1 is a T-shaped structure, the first end of the retainer 4-2-1 is wider, and the second end of the retainer 4-2-1 is narrower; the first end of the retainer 4-2-1 is embedded in the second mounting groove 4-8, and the width of the second end of the retainer 4-2-1 is the same as the width of the flow channel groove.

[0067] Furthermore, the microporous throttling plate assembly 4-2 is detachably connected to the retainer 4-2-1.

[0068] In some embodiments provided by the present invention, the microporous throttling plate assembly 4-2 includes a circular microporous throttling plate 4-2-2 and a circular through hole 4-2-3 disposed thereon; a circular countersunk hole 1-2 is provided between the first end and the second end of the retainer 4-2-1, and a through hole with a diameter smaller than that of the microporous throttling plate is machined at one end of the circular countersunk hole 1-2 for mounting the circular microporous throttling plate 4-2-2; five circular through holes 4-2-3 can be machined on the circular micro-throttling plate, one of which is located at the geometric center of the throttling plate, and the other four are evenly distributed around the circumference; the diameter of the circular through hole 4-2-3 can be 100μm, and the edges of the circular through hole 4-2-3 are kept sharp and without chamfering, so that when the coolant passes through at high speed, strong flow separation is generated at the edge of the circular through hole 4-2-3, forming a local low-pressure area; when the local low pressure drops below the saturated vapor pressure of the coolant, the coolant undergoes a phase change and generates a large number of micron to submillimeter-sized cavitation bubbles.

[0069] Furthermore, along the liquid inlet to liquid outlet direction, the flow channel between the flow regulation component and the cavitation induction component is set as a flat DC channel, and the sidewall of the flat DC channel is parallel to the first direction.

[0070] In some embodiments provided by the present invention, this transition section is a straight rectangular flow channel, which facilitates the restoration of the fluid after adjustment by the micro piezoelectric proportional valve 4-3 to a stable flow state, avoids the disturbance of the micro piezoelectric proportional valve core 4-3-2 from being directly transmitted to the downstream microporous throttling plate, and ensures the stability of cavitation bubble generation.

[0071] Furthermore, the third surface of the flow channel baffle 4 is provided with a first protruding structure that protrudes in the direction of the flow channel groove along the first direction and a first recessed structure that moves upward away from the flow channel groove from the first protruding structure; the first protruding structure, the first recessed structure and the flow channel groove form a Venturi tube structure.

[0072] In some embodiments provided by this invention, the Venturi tube structure specifically comprises, along the first direction, a tapering acceleration section, a throat, and a sudden expansion and collapse zone; the tapering acceleration section is a downward bulge of the third surface of the flow channel baffle 4, forming a slope that linearly narrows from the full height of the flow channel to the height of the throat; the bulge profile is a downward sloping plane, partially extending into the flow channel groove; the height of this section of the flow channel groove can linearly decrease from 2 mm to 0.2 mm, the effective flow area of ​​the coolant gradually decreases along the flow direction, the flow velocity gradually increases, the static pressure continuously decreases, and the cavitation bubbles generated from the circular micro-orifice throttling plate 4-2-2 remain stable in the low-pressure environment and are carried downstream by the high-speed fluid, without premature collapse; the throat is the narrowest section of the flow channel, where the third surface of the flow channel baffle 4 reaches its lowest point, and the height of the flow channel groove here is... At a depth of 0.2 mm, the fluid velocity reaches its maximum value, and the static pressure drops to its minimum. Cavitation bubbles are squeezed through this slit and enter the downstream bursting and collapse zone. The bursting and collapse zone is adjacent to the downstream of the throat, and the effective flow cross-sectional area of ​​the flow channel suddenly increases by several to ten times. This bursting effect can be achieved by the third surface of the flow channel baffle 4 suddenly retracting upward after the throat (forming a recessed cavity). After the high-speed fluid jet enters the space after the bursting and collapse, it decelerates rapidly, and the kinetic energy is converted into pressure energy, causing the static pressure to surge instantly. This violent pressure change induces the cavitation bubbles to burst in the entrance area of ​​the bursting and collapse zone. The high-speed micro-jet and shock wave generated by the collapse impact the bottom surface of the flow channel of the heat-conducting substrate 5, violently disturbing and destroying the heat transfer boundary layer, and achieving a significant improvement in the local heat transfer coefficient.

[0073] Furthermore, each flow channel is provided with at least three working chambers spaced apart along the first direction, and the working chamber located at or near the center along the first direction has a length along the first direction that is greater than the length of the other working chambers.

[0074] In some embodiments provided by the present invention, such as Figure 14 As shown, each flow channel is divided into three independent working chambers of different levels: a first-level working chamber, a second-level working chamber, and a third-level working chamber. Each of the three working chambers is equipped with a cavitation unit of three levels, namely, a first-level cavitation unit, a second-level cavitation unit, and a third-level cavitation unit. The first protruding structure and the first recessed structure extending upward from the first protruding structure away from the flow channel constitute the outline of the Venturi tube structure. The first-level cavitation unit is equipped with the Venturi tube structure outline 4-9, the second-level cavitation unit is equipped with the Venturi tube structure outline 4-10, and the third-level cavitation unit is equipped with the Venturi tube structure outline 4-11.

[0075] The second working cavity is located near the center of chip 6 and its overall length is greater than that of the first and third working cavities, which can achieve efficient heat dissipation in high-power areas.

[0076] In some embodiments provided by the present invention, for the throat height, the three levels of cavitation units in the flow channel groove adopt a differentiated throat height design. The throat height in the first-level cavitation unit is 0.6mm, the throat height in the second-level cavitation unit is 0.2mm, and the throat height in the third-level cavitation unit is 0.8mm. This makes the heat dissipation capacity spatially matched with the different thermal load characteristics of the front, middle and rear regions of the chip 6.

[0077] In some embodiments provided by the present invention, the end of the rib 5-5 of the heat-conducting substrate 5 that overlaps with the second surface of the heat-conducting substrate 5 is the top surface of the rib 5-5; the two isolation blocks 4-12 can be reliably isolated from the top surface of the rib 5-5 by means of a sealing gasket.

[0078] Furthermore, the thermally conductive substrate 5 is equipped with multiple temperature measuring components for measuring the temperature of the chip 6; the multiple temperature measuring components are used to detect the temperature of different heat-generating areas of the chip 6.

[0079] This invention can detect the temperature distribution of each region of chip 6 in real time and provide independent temperature feedback signals for the flow regulation components of each working cavity. This allows for independent adjustment of the coolant flow rate of the corresponding working cavity according to the actual heat load of different regions of chip 6, achieving precise response and differentiated cooling of local hot spots on chip 6, and avoiding local overheating from affecting the performance and reliability of chip 6.

[0080] Furthermore, a mounting hole is provided on one end of the flow channel near the chip 6; a temperature measuring component is installed inside the mounting hole; the internal space inside the mounting hole is isolated from the flow channel.

[0081] In some embodiments provided by the present invention, temperature is measured in three areas of chip 6. Nine mounting holes are provided inside the thermally conductive substrate 5 corresponding to the three temperature measurement areas of chip 6. These mounting holes are blind holes 5-7 for temperature sensors. The distance between the blind holes 5-7 and the first surface of the thermally conductive substrate 5 is 1 mm, used to embed temperature measurement components. In this embodiment, the temperature measurement components are thin-film thermocouple temperature sensors 5-2. The layout of the thin-film thermocouple temperature sensors 5-2 is symmetrical about the center of chip 6. Three temperature measurement components are arranged in the three working cavities (which are also the three temperature measurement areas of chip 6) corresponding to the flow channel grooves. A temperature measurement matrix is ​​formed on the thermally conductive substrate 5 to sense the temperature of each area of ​​chip 6 in real time. After the temperature measurement components are embedded in the blind holes 5-7, they are encapsulated and isolated with epoxy resin. The leads of the temperature measurement components converge into the wiring groove on the side of the thermally conductive substrate 5 through the lead channel on the side wall of the blind holes 5-7.

[0082] In some embodiments provided by the present invention, the present invention also includes a centralized controller, which independently adjusts the position of each valve core according to the data of the corresponding temperature measurement area, that is, controls the opening degree of the valve and controls the instantaneous flow rate entering the cavitation unit of that stage.

[0083] Furthermore, such as Figures 7-10 As shown, it also includes an upper cover plate; it has a fifth surface and a sixth surface arranged opposite to each other along its thickness direction; the fifth surface of the upper cover plate is connected to the fourth surface of the flow channel partition 4; the upper cover plate is provided with an inlet manifold cavity 3-7 and an outlet manifold cavity 3-8; one end of the inlet manifold cavity 3-7 is connected to an external liquid supply device, and the other end of the inlet manifold cavity 3-7 is connected to a first pipeline; the interface on the inlet manifold cavity 3-7 that is connected to the first pipeline is the inlet manifold cavity inlet 3-5; the interface on the first pipeline that is connected to the inlet manifold cavity 3-7 is the inlet interface 4-4; the inlet manifold cavity inlet 3-5 and the inlet interface 4-4 are connected by a mortise and tenon structure and a circular sealing ring 4-1 to strengthen the sealing of the interface and prevent leakage.

[0084] One end of the outlet manifold 3-8 is connected to an external return liquid device, and the other end of the outlet manifold 3-8 is connected to a third pipeline; the interface on the outlet manifold 3-8 that connects to the third pipeline is the outlet manifold inlet 3-6; the interface on the third pipeline that connects to the outlet manifold 3-8 is the outlet interface 4-5; the outlet manifold inlet 3-6 and the outlet interface 4-5 are connected by a mortise and tenon structure and a circular sealing ring 4-1 to enhance the sealing of the interface and prevent leakage.

[0085] In some embodiments provided by the present invention, the upper cover plate 3 is made of aluminum alloy or stainless steel. The sixth side of the upper cover plate 3 is provided with a liquid inlet 3-2 and a liquid outlet 3-3. One end of the liquid inlet 3-2 is connected to the liquid inlet manifold 3-7; the other end of the liquid inlet 3-2 is connected to an external liquid supply device; one end of the liquid outlet 3-3 is connected to the liquid outlet manifold 3-8; and the other end of the liquid outlet 3-3 is connected to an external liquid return device.

[0086] In some embodiments provided by the present invention, the inlet manifold cavity 3-7 is arranged parallel to the distribution cavity 4-14, and the outlet manifold cavity 3-8 is arranged parallel to the collection cavity 4-15; the first pipeline is arranged perpendicular to the distribution cavity 4-14; the third pipeline is arranged perpendicular to the collection cavity 4-15; the inlet port 3-2 is staggered from the first pipeline, and the outlet port 3-3 is staggered from the third pipeline.

[0087] In some embodiments provided by the present invention, six first threaded blind holes are machined at the four edges of the thermally conductive substrate 5, located at the four corners of the thermally conductive substrate 5 and the midpoints of the two sides of the thermally conductive substrate 5 along the first direction; the flow channel partition 4 is provided with second threaded blind holes corresponding to the first threaded blind holes on the thermally conductive substrate 5; six countersunk through holes are machined at the four corners and the midpoints of the two sides along the first direction of the upper cover plate 3, and the countersunk through holes, the first threaded blind holes and the second threaded blind holes are correspondingly matched; the thermally conductive substrate 5, the flow channel partition 4 and the upper cover plate 3 are connected by six fastening screws 3-1.

[0088] Furthermore, such as Figures 4-6 As shown, it also includes a fixed pressure frame 1; having a seventh surface and an eighth surface arranged opposite to each other along its thickness direction; the seventh surface of the fixed pressure frame 1 abuts against the sixth surface of the upper cover plate 3; the fixed pressure frame 1 is connected to the module assembly of the fixed chip 6 via a spring screw assembly 2.

[0089] In some embodiments provided by the present invention, the module component includes a chip module 7; the fixing frame 1 is made of aluminum alloy and its external dimensions are larger than those of the upper cover plate 3 and the flow channel partition plate 4; the inner hole size is smaller than the planar size of the upper cover plate 3, and a circular groove 1-3 is cut at the countersunk through hole of the upper cover plate 3 to avoid interference when the upper cover plate 3 is installed with fastening screws; four mounting ears 1-1 extend outward from the four corners of the fixing frame 1. The mounting ears 1-1 are rounded rectangles, and a circular countersunk hole 1-2 is machined in the center of each mounting ear 1-1. The four holes are symmetrical about the center of the fixing frame 1, and the center distance between the through holes in the first direction and the second direction is 90mm.

[0090] In some embodiments provided by the present invention, the sixth side of the upper cover plate 3 is provided with protrusions 3-4 around it, and the middle of the fixing frame 1 is hollow; the inner edge of the protrusion 3-4 and the inner edge of the middle of the fixing frame have the same shape and size, so that the fixing frame 1 can lock the protrusion 3-4 of the upper cover plate 3 during assembly, thereby achieving the functions of fixing and limiting.

[0091] In some embodiments provided by the present invention, there are four sets of spring screw assemblies 2, one set at each corner. Each set of spring screw assembly 2 includes a fixing screw 2-1, a flat washer 2-2, a helical spring 2-3, and a limiting sleeve 2-4. When installing the spring screw assembly 2, the fixing screw 2-1 passes through the flat washer 2-2, the spring, and the limiting sleeve 2-4 in sequence, and then passes through the through hole of the mounting ear 1-1 of the fixing frame 1 and is screwed into the threaded hole of the fixing post on the chip module 7. When the fixing screw 2-1 is screwed until the upper and lower ends of the limiting sleeve 2-4 press against the end face of the flat washer 2-2 near the limiting sleeve 2-4 and the eighth face of the fixing frame 1, the helical spring 2-3 is precisely compressed to a set length, which can provide uniform and controllable contact pressure, ensuring that the heat-conducting substrate 5 and the chip 6 are tightly attached and that the chip 6 is not damaged by overpressure.

[0092] Furthermore, an electronic device includes a chip 6 and a heat dissipation plate device, the heat dissipation plate device being thermally connected to the chip 6.

[0093] The following is combined with Figure 27 and Figure 28 The specific working process and adaptive temperature control process of the heat dissipation cold plate device of the present invention are described. The low-temperature coolant enters from the outside, flows in parallel through distribution chambers 4-14 into each stage of cavitation units, completes enhanced heat exchange on the surface of chip 6, and is then collected and discharged by collection chambers 4-15. Detailed steps are as follows: (a) External liquid supply: The system water pump delivers the low-temperature coolant (about 30°C) cooled by the external heat exchanger (external liquid supply equipment) to the liquid inlet 3-2 on the upper cover plate 3.

[0094] (b) Coolant distribution: Coolant enters the inlet manifold cavity 3-7 in the upper cover plate 3, where the flow channel is turned and pressure is equalized from the vertical pipeline to the horizontal distribution surface, and then flows downward into the distribution cavity 4-14 in the flow channel partition plate 4.

[0095] (c) Parallel flow distribution: In the distribution chamber 4-14, the coolant diffuses laterally to all flow channels and then flows downward independently through 33 supply holes 4-6. Each supply hole 4-6 is protected by an isolation pipe when passing through the collection chamber 4-15 to ensure that the fresh coolant does not mix with the high-temperature coolant in the collection chamber 4-15. The supply hole 4-6 connected to the first-stage working chamber sends the low-temperature coolant into the inlet of the first-stage working chamber, the supply hole 4-6 connected to the second-stage working chamber sends the low-temperature coolant into the inlet of the second-stage working chamber, and the supply hole 4-6 connected to the third-stage working chamber sends the low-temperature coolant into the inlet of the third-stage working chamber.

[0096] (d) Flow regulation: After entering the inlet of each working chamber, the coolant first flows through the miniature piezoelectric proportional valve 4-3; the central controller independently adjusts the opening of each valve according to the data of the corresponding temperature measurement area to control the instantaneous flow rate entering the cavitation unit of that stage.

[0097] (e) Cavitation induction: The regulated coolant passes through the circular through-hole 4-2-3 on the microporous throttling plate at high speed, forming a strong shear and local low-pressure zone at the sharp edge of the orifice 4-2-3, inducing hydraulic cavitation and generating a large number of micron-sized cavitation bubbles.

[0098] (f) Enhanced heat transfer: The fluid carrying cavitation bubbles enters the gradually narrowing acceleration section (stable delivery of cavitation bubbles), the throat (maximum flow velocity, lowest static pressure), and the sudden expansion and collapse zone (sudden expansion of cross section, sudden increase in static pressure, and concentrated implosion of cavitation bubbles) in sequence; the high-speed micro-jet generated by the collapse impacts the surface of the heat-conducting substrate 5, instantly destroying the heat transfer boundary layer, achieving an order-of-magnitude increase in the local heat transfer coefficient, and the heat is efficiently transferred to the coolant.

[0099] (g) Reflux and collection: The high-temperature coolant (approximately 45~60℃) after heat exchange is discharged upward into the collection chamber 4-15 through the reflux holes 4-16 at the end of each working chamber.

[0100] (h) Drainage: The high-temperature coolant in the collecting chamber 4-15 flows laterally and converges, turns through the outlet manifold 3-8 of the upper cover plate 3, and is finally discharged from the outlet port 3-3 on the upper cover plate 3, returning to the external return equipment to complete the circulation.

[0101] In terms of temperature control, this device uses nine distributed temperature sensing components as the sensing basis, a centralized controller as the core decision-making unit, and 33 piezoelectric proportional valves as actuators to form a closed-loop feedback control with millisecond-level response, thereby achieving "cooling on demand".

[0102] The specific temperature control process is as follows: 1. Temperature sensing: Nine miniature thin-film thermocouple sensors embedded in the thermally conductive substrate 5 are 1 mm away from the first surface of the thermally conductive substrate 5, and directly sense the real-time temperature of the corresponding area of ​​the chip 6.

[0103] 2. Deviation Calculation: The central controller compares the temperature of each area (Tactual) with the preset target temperature (Ttarget, such as 65℃) and calculates the temperature difference e = Tactual - Ttarget.

[0104] 3. Algorithm decision: The centralized controller runs a PID (proportional-integral-derivative) control algorithm to calculate the control quantity u required for the corresponding branch piezoelectric proportional valve based on the magnitude and trend of the temperature difference e.

[0105] 4. Signal output and execution: The control quantity u is converted into a PWM (pulse width modulation) voltage signal, which drives the corresponding piezoelectric proportional valve to operate (response time < 1 millisecond), precisely changing the valve core position, thereby regulating the flow rate entering the cavitation unit of this stage.

[0106] 5. Heat Dissipation Response: Changes in flow rate cause instantaneous changes in cavitation intensity: increased flow rate results in more cavitation bubbles, more intense collapse, and enhanced heat dissipation capacity; conversely, decreased flow rate weakens cavitation. For localized hotspots, the system can independently increase the flow rate of the corresponding branch in that area to achieve targeted cooling.

[0107] 6. Feedback and Steady State: After enhanced heat dissipation, the temperature of chip 6 begins to drop, the sensor continuously provides new Tactual feedback, and the controller continuously corrects the output until the temperature difference e converges to the allowable range, and the system reaches dynamic equilibrium.

[0108] 7. Energy Efficiency Optimization: When the temperature in all areas is below the target value, the system enters energy-saving mode, uniformly reducing valve opening or water pump speed to reduce cavitation intensity and unnecessary pump power consumption.

[0109] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended application.

Claims

1. A heat dissipation cold plate device, characterized in that, Used for chip heat dissipation, including: A flow channel assembly having multiple flow channel grooves inside, the flow channel grooves extending along a first direction; Each of the flow channel grooves is provided with an isolation block, which divides the flow channel groove into multiple independent working chambers distributed along a first direction. Each of the working chambers is provided with an inlet and an outlet. Along the inlet to outlet direction of the working chamber, a cavitation induction component and a Venturi tube structure are sequentially provided in the working chamber. The cavitation induction component is used to induce hydraulic cavitation to generate cavitation bubbles. The Venturi tube structure has a gradually narrowing and then gradually increasing inner diameter along the inlet to outlet direction.

2. The heat dissipation cold plate device according to claim 1, characterized in that, The flow channel assembly includes: A thermally conductive substrate has a first surface and a second surface disposed opposite to each other along its thickness direction. The first surface is in contact with the chip. The second surface is provided with a plurality of flow channel grooves, and the groove openings of the flow channel grooves are located on the second surface. The flow channel baffle has a third side and a fourth side arranged opposite to each other along its thickness direction. The third side is in contact with the second side of the thermally conductive substrate to seal the opening of the flow channel groove. The third side of the flow channel baffle is provided with a plurality of isolation blocks, all of which are embedded in the flow channel groove.

3. The heat dissipation cold plate device according to claim 2, characterized in that, The flow channel partition is provided with an inlet pipe and an outlet pipe. The inlets of multiple working chambers are connected in parallel to the inlet pipe, and the outlets of multiple working chambers are connected in parallel to the outlet pipe.

4. The heat dissipation cold plate device according to claim 3, characterized in that, The liquid inlet pipeline includes a distribution chamber, a first pipeline, and a second pipeline; the distribution chamber is disposed inside the flow channel baffle. The first pipeline connects the distribution chamber to the external liquid supply device; The second conduit connects the distribution chamber and the working chamber.

5. The heat dissipation cold plate device according to claim 4, characterized in that, The liquid outlet pipeline includes a collecting chamber, a third pipeline, and a fourth pipeline; the collecting chamber is located inside the flow channel baffle; the third pipeline connects the collecting chamber to an external liquid return device; The fourth conduit connects the collecting chamber and the working chamber.

6. The heat dissipation cold plate device according to claim 5, characterized in that, The distribution chamber and the collection chamber are staggered. The second pipeline passes through the collection chamber, and the portion of the second pipeline inside the collection chamber is an isolation pipe. The first end of the isolation pipe is connected to the end of the collection chamber near the distribution chamber, and the second end of the isolation pipe is connected to the other end of the collection chamber. Alternatively, the fourth conduit may pass through the distribution cavity, and the portion of the fourth conduit located within the distribution cavity may be an isolation pipe, with the first end of the isolation pipe connected to the end of the distribution cavity near the collection cavity, and the second end of the isolation pipe connected to the other end of the distribution cavity.

7. The heat dissipation cold plate device according to any one of claims 2-6, characterized in that, Along the liquid inlet to liquid outlet direction of the working chamber, a flow regulating component is provided between the liquid inlet of the working chamber and the cavitation induction component, and the flow regulating component is used to regulate the flow rate in the working chamber.

8. The heat dissipation cold plate device according to claim 7, characterized in that, A first mounting groove is provided on the third surface of the flow channel baffle; the flow regulating component is placed in the first mounting groove.

9. The heat dissipation cold plate device according to claim 8, characterized in that, The flow regulating component is a piezoelectric proportional valve; the body of the piezoelectric proportional valve is embedded in the first mounting groove; the valve core of the piezoelectric proportional valve can extend and retract in the flow channel groove.

10. The heat dissipation cold plate device according to claim 9, characterized in that, A second mounting groove is provided on the third surface of the flow channel baffle; the cavitation inducing component is placed in the second mounting groove.

11. The heat dissipation cold plate device according to claim 10, characterized in that, The cavitation induction component includes a retainer and a microporous throttling plate assembly; the flow channel groove has a first part opposite to the second mounting groove, the retainer has a first end and a second end opposite to each other, the first end of the retainer is embedded in the second mounting groove, the second end of the retainer is in contact with or has a gap with the first part, and the microporous throttling plate assembly is connected between the first end and the second end of the retainer.

12. The heat dissipation cold plate device according to claim 11, characterized in that, The microporous throttling plate assembly is detachably connected to the cage.

13. The heat dissipation cold plate device according to claim 7, characterized in that, Along the liquid inlet to liquid outlet direction, the flow channel between the flow regulating component and the cavitation induction component is configured as a flat DC channel, and the sidewall of the flat DC channel is parallel to the first direction.

14. The heat dissipation cold plate device according to claim 13, characterized in that, The third surface of the flow channel partition is provided with a first protruding structure that protrudes in the direction of the flow channel groove along a first direction and a first recessed structure that extends upward away from the flow channel groove from the first protruding structure; the first protruding structure, the first recessed structure and the flow channel groove form the Venturi tube structure.

15. The heat dissipation cold plate device according to claim 1, characterized in that, Each of the flow channels is provided with at least three working chambers spaced apart along the first direction, and the working chamber located at or near the center along the first direction has a length along the first direction that is greater than the length of the other working chambers.

16. The heat dissipation cold plate device according to claim 2, characterized in that, The thermally conductive substrate is provided with multiple temperature measuring components for measuring the temperature of the chip; the multiple temperature measuring components are used to detect the temperature of different heat-generating areas of the chip.

17. The heat dissipation cold plate device according to claim 16, characterized in that, The flow channel is provided with a mounting hole at one end near the chip; the temperature measuring component is disposed in the mounting hole; the internal space of the mounting hole is isolated from the flow channel.

18. The heat dissipation cold plate device according to claim 5, characterized in that, It also includes an upper cover plate; having a fifth surface and a sixth surface arranged opposite to each other along its thickness direction; the fifth surface of the upper cover plate is connected to the fourth surface of the flow channel partition; the upper cover plate is provided with an inlet manifold cavity and an outlet manifold cavity; one end of the inlet manifold cavity is connected to the external liquid supply device, and the other end of the inlet manifold cavity is connected to the first pipeline; One end of the outlet manifold is connected to the external return liquid device, and the other end of the outlet manifold is connected to the third pipeline.

19. The heat dissipation cold plate device according to claim 18, characterized in that, It also includes a fixing frame; having a seventh and an eighth surface arranged opposite to each other along its thickness direction; the seventh surface of the fixing frame abuts against the sixth surface of the upper cover plate; the fixing frame is connected to the module assembly that fixes the chip via a spring screw assembly.

20. An electronic device, characterized in that, It includes a chip and a heat dissipation cold plate device as described in any one of claims 1-19, wherein the heat dissipation cold plate device is thermally connected to the chip.

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