An integrated circuit substrate taping device and taping method

Abstract

The application discloses an integrated circuit substrate patching device and patching method, and particularly relates to the technical field of electrical component assembly manufacturing, which comprises a workbench, a conveying roller frame and a substrate piece. The top of the workbench is respectively provided with a patcher and a vacuum positioning frame, and the vacuum positioning frame is used for air flow adsorption of the substrate piece. A stable mounting assembly is arranged at the joint of the conveying roller frame and the workbench, and the stable mounting assembly is used for driving the substrate piece to move away along the direction perpendicular to the surface of the conveying roller frame, and stably mounting the substrate piece in the vacuum positioning frame. The stable mounting assembly comprises a displacement frame arranged between the conveying roller frame and the workbench, and a supporting frame movably connected to one side of the displacement frame. The substrate piece is taken out from the conveying roller frame by the clamping block in the horizontal conveying section, and the patching surface of the substrate piece faces upward at this time. When the pre-stable frame travels in the first sliding groove and the second sliding groove to the overturning section, the clamping block and the substrate piece are overturned around the horizontal shaft as a whole.

Description

Technical Field

[0001] This invention relates to the field of electrical component assembly manufacturing technology, and more specifically to an integrated circuit substrate mounting apparatus and mounting method. Background Technology

[0002] As integrated circuit products continue to evolve towards higher density, double-sided mounting technology has become the mainstream technical path for improving substrate space utilization and increasing wiring integration. It is widely used in the surface mount processing of various printed circuit boards and semiconductor packaging substrates. In the double-sided mounting production process, after the substrate completes the first side mounting, it needs to undergo a posture change so that the unmounted side faces upwards before it can enter the positioning and mounting process of the second side. The operational stability of the substrate picking and flipping process directly determines the substrate mounting accuracy and the final product yield. In the existing technology, after the substrate completes single-sided mounting on the conveyor rollers, it is mostly completed by lateral clamping and translation or lifting and translation. When the substrate is picked up and transferred, and the picking action is parallel to the roller surface of the conveyor roller frame, the clamping or lifting components are prone to relative sliding friction with the substrate surface. This may cause scratches, component displacement, or even detachment of the precision components, surface pads, and wiring layers already mounted on the substrate. At the same time, after the substrate has completed single-sided mounting, the mounted surface usually has trace amounts of foreign matter such as solder paste splatter particles and dust attached to it. Such foreign matter is difficult to effectively detach during the transfer process by gravity alone. If it enters the mounting station with the substrate, the loose particles on the surface may fall into the adsorption area of ​​the vacuum chuck, thereby affecting the mounting positioning accuracy and the reliability of the solder connection. Summary of the Invention

[0003] The purpose of this invention is to provide an integrated circuit substrate mounting apparatus and mounting method to address the aforementioned shortcomings in the technology.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an integrated circuit substrate mounting device and mounting method, comprising a worktable, a conveyor roller frame and a substrate, wherein a mounter and a vacuum positioning frame are respectively mounted on the top of the worktable, and the vacuum positioning frame is used to achieve airflow adsorption on the substrate; a stabilizing component is provided at the connection between the conveyor roller frame and the worktable, and the stabilizing component is used to drive the substrate away in a direction perpendicular to the surface of the conveyor roller frame, and to stably place the substrate contained therein in the vacuum positioning frame; The stabilizing assembly includes a displacement frame installed between the conveyor roller frame and the worktable, and a support frame movably connected to one side of the displacement frame. Two symmetrical clamping blocks are slidably connected to one side of the support frame, and the clamping blocks are designed with a toothed structure. The middle part of the clamping block is slightly arc-shaped, and the section extending from the middle to both sides is kept horizontal. An airflow box is installed between the conveyor roller frame and the worktable, and the airflow box is located below the movement path of the displacement frame. A stabilizing component is provided between the worktable and the conveyor roller frame, and the stabilizing component is used to enable the displacement frame to have multiple displacement paths during the process of moving towards the vacuum positioning frame; The airflow box is equipped with a flow-dividing component, which is used to keep the base plate inside the displacement frame stable during the displacement of the displacement frame along multiple paths.

[0005] Preferably, the stabilizing assembly includes a centering frame fixedly connected to the top of the worktable and the conveyor roller frame, and a concentric shaft column movably connected to the middle of the interior of the displacement frame. The end of the concentric shaft column forms an opening with the interior of the displacement frame. One side of the support frame extends to the opening and is fixedly connected to the concentric shaft column, so that the support frame and one side of the displacement frame are stably connected. A rack frame is fixedly connected to the side of the centering frame away from the displacement frame, and one end of the concentric shaft extends to the outside of the displacement frame and is fitted with a first gear that meshes with the rack frame. A first electric push rod is fixedly connected to the side of the centering frame near the vacuum positioning frame. One end of the first electric push rod is fixedly connected to the top of the displacement frame, and the first electric push rod is used to drive the displacement frame to move back and forth. The support frame has two sets of symmetrical elastic components on one side, and the elastic components are used to make the clamping block maintain adaptive contact with one side of the base plate.

[0006] Preferably, a first sliding groove is provided on one side of the centering frame for guiding the movement of the concentric shaft column, and a second sliding groove is provided on the top of the centering frame that communicates with the interior of the first sliding groove. The second sliding groove and the first sliding groove together form a C-shaped structure on the centering frame. An L-shaped pre-stabilizing frame is fixedly connected to one end of the concentric shaft near the first gear. The pre-stabilizing frame is located inside the first slide groove and slides in cooperation with the first slide groove.

[0007] Preferably, each set of elastic components includes a side guard frame slidably connected to one side of the support frame and two guide posts fixedly connected to one side of the clamping block, and the clamping block and the two guide posts are movably connected inside the side guard frame. The side guard frame has two sliding connections inside, which are used to guide the movement of the two guide posts. Each guide post and each limiting ring is fixedly connected with a return spring.

[0008] Preferably, one end of each displacement limiting ring frame is movably connected to a central bearing ring, one end of the central bearing ring is fixedly connected to an external threaded ring cylinder, and the inside of the side guard ring frame is fixedly connected to an internal threaded ring that helically engages with the external threaded ring cylinder, and the displacement path of the displacement limiting ring frame inside the side guard ring frame is constrained through the external threaded ring cylinder.

[0009] Preferably, the flow splitting assembly includes an air outlet pipe and an air inlet pipe fixedly connected to the outside of the airflow box, and the air inlet pipe and the air outlet pipe communicate with the inside of the airflow box. A partition curved block is fixedly connected inside the airflow box, and the partition curved block is designed with an arc shape. The two ends of the partition curved block extend to the opening positions of the air inlet pipe and the air outlet pipe located inside the airflow box, respectively. An internal toothed ring frame is movably connected inside the airflow box, and the internal toothed ring frame and the partition curved block divide the airflow inside the airflow box into two flow channels. A blower is fixedly connected to the outside of the airflow box, and the air outlet of the blower is connected to the inside of the air inlet pipe.

[0010] Preferably, a second gear is movably connected inside the airflow box. The second gear is located at the opening of the air inlet pipe and the air outlet pipe. The second gear is engaged with the internal gear ring frame, and the engagement point of the internal gear ring frame and the second gear is periodically and intermittently closed to restrict the flow path of the airflow inside the airflow box. The second gear and the partition block together form a curved flow guide channel. A servo motor is fixedly connected to the outside of the airflow box, and the output end of the servo motor extends into the interior of the airflow box and is fixedly connected to one end of the second gear.

[0011] A method for mounting an integrated circuit substrate using a mounting apparatus includes the following steps: S1. Before operation, according to the specifications of the substrate, rotate the external threaded ring cylinder to feed along the internal threaded ring. Drive the limiting ring frame to slide horizontally through the middle bearing ring. Adjust the compression of the reset spring and preset the upper limit of the clamping force of the clamping block to adapt to different substrate clamping requirements and reduce the risk of edge crushing. S2. The feeding mechanism inside the conveyor roller frame vertically lifts the base plate component. The second electric push rod pushes the side guard return frame to feed. Two sets of clamping blocks come together to clamp the edge of the base plate. The horizontal sections at both ends of the clamping blocks bear the main clamping force, and the arc section in the middle provides auxiliary constraint. The guide column and the reset spring form an elastic yielding to achieve contact with the contoured surface and reduce material picking friction and edge chipping risk. S3. The first electric push rod drives the displacement frame to move horizontally. The pre-stabilizing frame slides along the first slide groove to maintain a horizontal posture. When it reaches the C-shaped slide groove connection, the first gear meshes with the rack frame, driving the support frame and the clamping block to rotate synchronously, completing the horizontal-flipping-reset horizontal posture conversion, so that the substrate component with the attached surface turns downward, and simultaneously uses inertia to achieve the initial detachment of surface particles. S4. When the substrate moves to the top of the airflow box, the blower delivers air through the air inlet pipe. The servo motor drives the second gear to mesh periodically with the internal gear ring frame. In conjunction with the partition block, two differential airflows are formed. After they converge, a pulsating airflow is generated to blow upwards to sweep the substrate surface. The gap in the middle of the clamping block guides the airflow to diffuse, improves the uniformity of cleaning, and reduces the impact of dust particles on the mounting accuracy. S5. When the displacement frame moves directly above the vacuum positioning frame, the vacuum positioning frame starts to absorb negative pressure. The clamping block retracts slowly and synchronously to release the substrate, completing the impact-free bonding and positioning. Then, the placeer performs component placement on the unattached side of the substrate, realizing continuous double-sided placement processing.

[0012] The technical effects and advantages provided by the present invention in the above technical solution are as follows: 1. This invention uses a clamping block to remove the substrate from the conveyor roller frame in the horizontal conveying section. At this time, the substrate with the patch side facing up is removed. When the pre-stabilizing frame moves along the first and second slide grooves to the flipping section, the clamping block and the substrate together complete the flipping around the horizontal axis. The patch side changes from facing up to facing down, and the unpatched side changes from facing down to facing up. This material handling method makes the extraction movement direction of the substrate perpendicular to the roller surface of the conveyor roller frame, avoiding relative sliding friction between the substrate and the material handling during the material handling process, reducing the risk of scratches on the substrate surface. At the same time, the substrate can fully contact the airflow output from the airflow box during the flipping process. The acceleration change generated by the flipping causes the small amount of loose particles attached to the patch side to fall off under the combined action of gravity and inertia, providing a clean foundation for the stable bonding of the substrate and the vacuum positioning frame. This further realizes the damage-free posture conversion of the substrate, ensures the continuous operation of the double-sided patching process, and helps to improve the patching quality of the substrate. 2. The present invention uses the smooth structure at both ends of the clamping block to adhere to the upper and lower surfaces of the substrate edge with low surface pressure, bearing the main clamping positive pressure. The arc-shaped section in the middle of the clamping block only provides an auxiliary locking function, and the contact area is much smaller than the smooth areas at both ends. This structure allows the smooth end face and the locking structure to detach from the substrate surface simultaneously under the action of elastic restoring force when the substrate is completed for tooling handover and the clamping block opens to release the substrate. It is not easy to produce hooking or sticking phenomena, the release process is smooth, and the substrate surface is not easy to leave clamping marks or internal stress, further improving the patch molding quality of the substrate. 3. The present invention achieves a stable contact between the clamping block and the outer side of the substrate by means of the elastic retraction of the guide post and the reset spring, thereby enabling the clamping block to passively conform to the edge contour of the substrate. This transforms the contact form from rigid line contact to elastic surface contact, and the clamping force is evenly distributed along the edge of the substrate, reducing the risk of edge chipping or inner layer cracking caused by local point contact, and ensuring the structural integrity of the substrate during transportation and flipping. 4. This invention increases or decreases the distance between the moving limiting ring frame and the guide post by adjusting the elastic tension of the return spring between the guide post and the limiting ring frame. This adjusts the elastic energy storage of the return spring, thereby limiting the fit between the clamping block and the base plate by the elastic force of the return spring. This prevents the base plate edge from being crushed. The clamping block is locked with the outside of the base plate by the teeth with elastic depth limiting. When the direction of gravity on the base plate changes during the movement, the circumferential and axial constraint force of the clamping block on the base plate remains reliable. 5. This invention utilizes the periodic alternation and intermittent closure of the meshing positions of the second gear and the internal gear ring carrier. During the closure of the meshing point, the airflow delivered by the intake pipe is momentarily intercepted in a local area. After being compressed, the airflow accelerates through the unclosed channel. This channel is jointly formed by the guide channel, the tooth spacing of the internal gear ring carrier, and the outer gap of the partition block. The non-meshing area between the internal gear ring carrier and the second gear forms two different guide paths inside the airflow box, causing the airflow to be pulsatingly and alternately distributed to the short path and the long path. The two airflows are in different phases. The collision of position and velocity at the intersection generates strong turbulent mixing induced by velocity and pressure differences, causing the airflow pressure and velocity output from the exhaust pipe to exhibit periodic pulsating characteristics. When this pulsating airflow acts upward on the clamping block and the bottom surface of the substrate, it can apply intermittent pulse impact force to the micro dust adhering to the surface of the patch, causing the weakly adhesive dust particles to detach from the substrate surface under the action of pressure pulses, further improving the surface cleanliness of the substrate before it is limited by the vacuum positioning frame, reducing substrate scratches caused by dust particles, and helping to improve the quality of patch processing. 6. The present invention forms a gap channel between the clamping block and the substrate by making the contact area between the middle part of the clamping block and the substrate much smaller than the smooth areas at both ends. When the airflow output from the air outlet pipe approaches the clamping block and the substrate vertically upward, it will not stagnate or scatter disorderly below the clamping block. Instead, it will be smoothly divided into two streams by the arc surface and accelerate along the arc surface to the middle section of the clamping block. The variable incident angle and flow velocity can avoid the formation of a local continuous low flow dead zone. At the same time, an air curtain barrier is formed around the substrate. When the particles pass through the air curtain, they are deflected or blown upward by the airflow, which helps to improve the mounting and positioning efficiency of the substrate. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of section A in the image; Figure 3 This is an exploded view of the stabilization component of the present invention; Figure 4 For the present invention Figure 3 Enlarged view of section B in the image; Figure 5 This is a schematic diagram of the structure of the reset spring of the present invention; Figure 6 This is a schematic diagram of the assembly of the support frame and the side guard frame of the present invention; Figure 7This is an exploded view of the current splitter component of the present invention; Figure 8 This is a schematic diagram of the pre-stabilized frame in its first motion state according to the present invention; Figure 9 This is a schematic diagram of the second motion state of the pre-stabilized frame of the present invention.

[0015] Explanation of reference numerals in the attached figures: 1. Workbench; 11. Conveyor roller frame; 12. Substrate component; 13. Vacuum positioning frame; 14. Placer; 2. Stabilizing assembly; 21. Displacement frame; 22. Support frame; 23. Clamping block; 24. Airflow box; 3. Stabilizing assembly; 31. Centering frame; 32. First slide rail; 33. Second slide rail; 34. First electric push rod; 35. Concentric shaft column; 36. Pre-stabilizing frame; 37. First gear; 38. Rack frame; 4. Flow divider assembly; 41. Inlet pipe; 42. Outlet pipe; 43. Blower; 44. Divider block; 45. Internal gear ring frame; 46. Second gear; 47. Flow guide channel; 48. Servo motor; 5. Elastic component; 51. Side guard ring; 52. Guide post; 53. Return spring; 54. Limiting ring; 55. Middle bearing ring; 56. External threaded ring cylinder; 57. Internal threaded ring; 58. Second electric push rod. Detailed Implementation

[0016] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0017] This invention provides, for example Figures 1-5 The integrated circuit substrate mounting apparatus and mounting method shown include a worktable 1, a conveyor roller frame 11 and a substrate 12. A mounter 14 and a vacuum positioning frame 13 are respectively mounted on the top of the worktable 1. The vacuum positioning frame 13 is used to achieve airflow adsorption on the substrate 12. A stabilizing component 2 is provided at the connection between the conveyor roller frame 11 and the worktable 1. The stabilizing component 2 is used to drive the substrate 12 away in a direction perpendicular to the surface of the conveyor roller frame 11 and to stably place the substrate 12 contained inside it into the vacuum positioning frame 13. The stabilizing assembly 2 includes a displacement frame 21 installed between the conveyor roller frame 11 and the worktable 1, and a support frame 22 movably connected to one side of the displacement frame 21. Two symmetrical clamping blocks 23 are slidably connected to one side of the support frame 22, and the clamping blocks 23 are designed with a toothed structure. The middle part of the clamping block 23 is slightly arc-shaped, and the sections extending to both sides of the middle part remain horizontal. An airflow box 24 is installed between the conveyor roller frame 11 and the worktable 1, and the airflow box 24 is located below the moving path of the displacement frame 21. The specific structures and working principles of the conveyor roller frame 11, vacuum positioning frame 13, and chip mounter 14 are all existing technologies and will not be elaborated upon in this application. The current conventional process for chip mounting of circuit boards is as follows: The conveyor roller frame 11 transports the substrate 12 that has been single-sided mounted to the corresponding station of the vacuum positioning frame 13, causing the substrate 12 to move closer to the displacement frame 21; the small feeder at the bottom of the conveyor roller frame 11, after aligning with the substrate 12 to be processed using a vision positioning system, pushes the substrate 12 upward through the gap between the rollers, vertically lifting and extracting the substrate 12 from the conveyor roller frame 11; then, the clamping block 23 connected to the end of the displacement frame 21 clamps the substrate 12 and precisely transfers the substrate 12 according to the preset process trajectory. The vacuum positioning frame 13 generates a vacuum adsorption force inside, which stably adsorbs and fixes the substrate 12 held by the clamping block 23 to the limiting position. The two sets of linear motors above the conveyor roller frame 11 constitute a motion drive unit. The industrial computer and PLC system uniformly schedule the actions of each mechanism to complete the motion trajectory planning, speed control and process sequence matching, to ensure the stability of the whole machine operation, and realize the alignment and cooperation between the vacuum positioning frame 13 and the pick-and-place machine 14. The high-resolution industrial camera equipped with the pick-and-place machine 14, along with the light source system, collects the position images of the substrate pads and components. After the position deviation is calculated by the algorithm, it is fed back to the control system to automatically compensate for the placement coordinates and complete the double-sided placement operation of the substrate 12.

[0018] refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, a stabilizing assembly 3 is provided between the workbench 1 and the conveyor roller frame 11. The stabilizing assembly 3 is used to enable the displacement frame 21 to have multiple displacement paths during the movement towards the vacuum positioning frame 13. The stabilizing assembly 3 includes a centering frame 31 fixedly connected to the top of the workbench 1 and the conveyor roller frame 11 and a concentric shaft column 35 movably connected to the middle of the interior of the displacement frame 21. The end of the concentric shaft column 35 forms an opening with the interior of the displacement frame 21. One side of the support frame 22 extends to the opening and is fixedly connected to the concentric shaft column 35, so that the support frame 22 and one side of the displacement frame 21 are stably connected. A rack frame 38 is fixedly connected to the side of the centering frame 31 away from the displacement frame 21. One end of the concentric column 35 extends to the outside of the displacement frame 21 and is fitted with a first gear 37 that meshes with the rack frame 38. A first electric push rod 34 is fixedly connected to the side of the centering frame 31 near the vacuum positioning frame 13. One end of the first electric push rod 34 is fixedly connected to the top of the displacement frame 21, and the first electric push rod 34 is used to drive the displacement frame 21 to move back and forth. A first slide groove 32 is opened on one side of the centering frame 31 for guiding the movement of the concentric shaft column 35. A second slide groove 33 is opened on the top of the centering frame 31 and communicates with the interior of the first slide groove 32. The second slide groove 33 and the first slide groove 32 together form a C-shaped structure on the centering frame 31. An L-shaped pre-stabilizing frame 36 is fixedly connected to one end of the concentric shaft column 35 near the first gear 37. The pre-stabilizing frame 36 is located inside the first slide groove 32 and slides in cooperation with the first slide groove 32. Two sets of elastic components 5 are provided on one side of the support frame 22, and the elastic components 5 are used to make the clamping block 23 keep in adaptive contact with one side of the base plate 12; each set of elastic components 5 includes a side guard frame 51 slidably connected to one side of the support frame 22 and two guide posts 52 fixedly connected to one side of the clamping block 23, and the clamping block 23 and the two guide posts 52 are movably connected inside the side guard frame 51. The side guard frame 51 has two sliding connections inside, which are used to guide the movement of the two guide posts 52. Each guide post 52 and each limiting ring frame 54 are fixedly connected with a return spring 53. Each displacement limiting ring frame 54 has a central bearing ring 55 movably connected to one end, and an external threaded ring cylinder 56 fixedly connected to one end of the central bearing ring 55. An internal threaded ring 57 that helically engages with the external threaded ring cylinder 56 is fixedly connected inside the side guard ring frame 51, and the displacement path of the displacement limiting ring frame 54 within the side guard ring frame 51 is constrained by the external threaded ring cylinder 56. The guide post 52 adopts a T-shaped structure design, with one end of its post penetrating the interior of the displacement limiting ring frame 54. Together, the two form an I-shaped mating structure. The return spring 53 is fixedly connected to the flange of the guide post 52 and the limiting ring frame 54. The return spring 53 is sleeved on the outside of the guide post 52 and can expand and contract along the axial space between the guide post 52 and the limiting ring frame 54. At the same time, the guide post 52 and the side guard frame 51 form a sliding fit relationship. Due to the structural limit constraint, the guide post 52 cannot be dislodged from the inside of the side guard frame 51 and can only move in a directional direction along the inside of the side guard frame 51.

[0019] refer to Figure 1 , Figure 2 and Figure 7As shown, the airflow box 24 is equipped with a flow-dividing component 4, which is used to stabilize the base plate 12 inside the displacement frame 21 during the displacement along multiple paths. The flow-dividing component 4 includes an air outlet pipe 42 and an air inlet pipe 41, which are respectively fixedly connected to the outside of the airflow box 24 and communicate with the inside of the airflow box 24. A partitioned curved block 44 is fixedly connected inside the airflow box 24 and is designed as a curved structure. The two ends of the partitioned curved block 44 extend to the opening positions of the air inlet pipe 41 and the air outlet pipe 42 inside the airflow box 24, respectively. An internal toothed ring frame 45 is movably connected inside the airflow box 24, and the internal toothed ring frame 45 and the partitioned curved block 44 divide the airflow inside the airflow box 24 into two flow channels. A blower 43 is fixedly connected to the outside of the airflow box 24, and the air outlet of the blower 43 is connected to the inside of the air inlet pipe 41. A second gear 46 is also movably connected inside the airflow box 24. The second gear 46 is located at the opening position of the air inlet pipe 41 and the air outlet pipe 42. The second gear 46 is engaged with the internal gear ring frame 45, and the engagement point of the internal gear ring frame 45 and the second gear 46 is periodically and intermittently closed to restrict the flow path of the airflow inside the airflow box 24. The second gear 46 and the partition block 44 together form a curved flow guide channel 47. A servo motor 48 is fixedly connected to the outside of the airflow box 24, and the output end of the servo motor 48 extends into the inside of the airflow box 24 and is fixedly connected to one end of the second gear 46.

[0020] A method for mounting an integrated circuit substrate using a mounting apparatus, characterized by comprising the following steps: S1. Before operation, according to the specifications of the substrate 12, rotate the external threaded ring 56 to screw along the internal threaded ring 57 for feeding. Drive the limiting ring frame 54 to slide horizontally through the middle bearing ring 55, adjust the compression of the reset spring 53, preset the upper limit of the clamping force of the clamping block 23, adapt to different substrate clamping requirements, and reduce the risk of edge crushing. S2. The feeding mechanism inside the conveyor roller frame 11 vertically lifts the base plate 12. The second electric push rod 58 pushes the side guard return frame 51 to feed. The two sets of clamping blocks 23 move closer to clamp the edge of the base plate. The horizontal sections at both ends of the clamping blocks 23 bear the main clamping force, and the arc section in the middle provides auxiliary constraint. The guide column 52 and the reset spring 53 form an elastic yield, realizing the contact of the contour surface and reducing the risk of material picking friction and edge chipping. S3. The first electric push rod 34 drives the displacement frame 21 to move horizontally, and the pre-stabilizing frame 36 slides along the first slide groove 32 to maintain a horizontal posture. When it reaches the C-shaped slide groove connection, the first gear 37 meshes with the rack frame 38, driving the support frame 22 and the clamping block 23 to rotate synchronously, completing the horizontal-flipping-reset horizontal posture conversion, so that the substrate 12 with the attached surface turns downward, and simultaneously uses inertia to achieve the initial detachment of surface particles. S4. The substrate 12 moves to the top of the airflow box 24. The blower 43 delivers air through the air inlet pipe 41. The servo motor 48 drives the second gear 46 to mesh periodically with the internal gear ring frame 45. The splitting block 44 splits the airflow to form two differential airflows. After they converge, they generate a pulsating airflow that blows upward to sweep the substrate surface. The gap in the middle of the clamping block 23 guides the airflow to diffuse, improving the uniformity of cleaning and reducing the impact of dust particles on the mounting accuracy. S5. The displacement frame 21 moves to the top of the vacuum positioning frame 13. The vacuum positioning frame 13 starts negative pressure adsorption. The clamping block 23 simultaneously and slowly retracts to release the substrate 12, completing the impact-free bonding and positioning. Then the placeer 14 performs component placement on the unattached side of the substrate, realizing continuous double-sided placement processing.

[0021] Working principle: When using: refer to Figure 1 , Figure 5 and Figure 6 As shown, when it is necessary to vertically lift and extract the substrate 12 from the conveyor roller frame 11, and to complete the stable adsorption and alignment of the substrate 12 with the vacuum positioning frame 13 to achieve double-sided continuous bonding operation: First, a small feeder inside the conveyor roller frame 11 pushes the base plate 12 upward through the gap between the rollers, vertically lifting and extracting the base plate 12 from the conveyor roller frame 11. The second electric push rod 58 outputs driving force, pushing the side guard frame 51 along the side of the support frame 22 towards the outside of the base plate 12, causing the clamping block 23 to move synchronously and pre-make contact with the edge of the base plate 12. The smooth structures at both ends of the clamping block 23 are attached to the upper and lower surfaces of the edge of the base plate 12 with low surface pressure, bearing the main clamping positive pressure. The arc-shaped section in the middle of the clamping block 23 only provides an auxiliary locking function, and the contact area is much smaller than the smooth areas at both ends. After the clamping block 23 contacts the base plate 12, it is subjected to squeezing force and generates relative displacement along the inside of the side guard frame 51. The guide post 52 moves synchronously with the clamping block 23 and completes the guided sliding along the inside of the limiting ring frame 54, causing the return spring 53 to compress synchronously. The reset spring 53 is arranged between the guide post 52 and the limiting ring frame 54. After being compressed, it applies a reverse thrust to the end of the guide post 52 based on its own elasticity, pushing the guide post 52 to drive the clamping block 23 to reset in the reverse direction, so that the clamping block 23 and the edge of the substrate 12 are in a stable contact state. Similarly, the other set of clamping blocks 23 moves closer to the other side of the substrate 12 under the drive of the corresponding second electric push rod 58. The two sets of clamping blocks 23 together form a stable clamping constraint on the outside of the substrate 12. The elastic yielding structure of the guide post 52 and the reset spring 53 can realize the passive conformal adaptation of the clamping block 23 to the edge contour of the substrate 12, so that the contact form is changed from rigid line contact to elastic surface contact. The clamping force is evenly distributed along the edge of the substrate 12, which can reduce the risk of edge chipping or inner layer cracking caused by local point contact, and ensure the structural integrity of the substrate 12 during the transfer and flipping process. refer to Figure 1 , Figure 5 and Figure 6 As shown, secondly, the contact clamping force between the clamping block 23 and the base plate 12 is determined by the preload pressure of the return spring 53, rather than by the rigid stroke end limit. When it is necessary to adjust the preload pressure of the return spring 53, the external threaded ring cylinder 56 is rotated to engage with the inner threaded ring 57 along the side guard ring 51 for feeding. The outer wall of the external threaded ring cylinder 56 and the inner wall of the inner threaded ring 57 form a threaded transmission engagement. The middle bearing ring 55 rotates synchronously with the external threaded ring cylinder 56 and maintains a free-spinning engagement with the end of the displacement limiting ring frame 54. This free-spinning structure can ensure smooth engagement transmission between the external threaded ring cylinder 56 and the inner threaded ring 57, while maintaining the stability of the displacement limiting ring frame 54 within the side guard ring 51. During the engagement process, the external threaded ring cylinder 56 moves axially along the inner threaded ring 57, and the middle bearing ring is pulled or pushed. 55 drives the limiting ring frame 54 to slide horizontally along the inside of the side guard frame 51; the limiting ring frame 54 is constrained by the upper and lower limiting structures inside the side guard frame 51 and can only move back and forth in the horizontal direction. After the limiting ring frame 54 moves, the distance between it and the guide post 52 increases or decreases accordingly, so that the elastic compression of the return spring 53 is adjusted synchronously, thereby changing the elastic energy storage and output elastic force of the return spring 53. This structure can limit the clamping and fitting degree of the clamping block 23 on the base plate 12 through the spring force, and avoid excessive pressure causing the edge of the base plate 12 to be crushed; the clamping block 23 forms a constraint on the outside of the base plate 12 in the form of elastic depth limiting locking. When the direction of gravity changes during the transfer of the base plate 12, the circumferential and axial clamping constraints can remain stable and reliable. refer to Figure 1 , Figure 3 , Figure 8 and Figure 9As shown, next, after the clamping block 23 completes the clamping and limiting of the substrate 12, during the transfer to the vacuum positioning frame 13, the first electric push rod 34 performs a telescopic action, driving the displacement frame 21 to move along the side of the centering frame 31 to the outside of the vacuum positioning frame 13; the displacement frame 21 simultaneously drives the concentric shaft column 35 and the pre-stabilizing frame 36 to slide along the inside of the first slide groove 32, and the top of the pre-stabilizing frame 36 slides against the inner wall of the first slide groove 32, thereby maintaining the concentric shaft column 35 and the... The smooth operation of the displacement frame 21 allows the clamping block 23 to move smoothly horizontally towards the airflow box 24 along the side of the centering frame 31. After the pre-stabilizing frame 36 slides out of the first slide groove 32 and enters the second slide groove 33, the pre-stabilizing frame 36 and the second slide groove 33 maintain contact on only one side. The first gear 37 meshes with the rack frame 38 and rolls along the top surface of the rack frame 38. The first gear 37 rotates synchronously with the horizontal movement, causing the side of the pre-stabilizing frame 36 that is in contact with the first slide groove 32 to gradually move away. On the other side, driven by the first gear 37, the first slide 32 slowly approaches and adheres to the other inner wall of the first slide 32. During this movement, the pre-stabilizing frame 36 completes the attitude flip in the connection area between the first slide 32 and the second slide 33. The concentric shaft column 35 rotates synchronously, driving the support frame 22 to rotate along the side of the centering frame 31. As the clamping block 23 moves on the top of the airflow box 24, it completes the motion conversion of horizontal conveying, attitude flipping and returning to horizontal. The substrate 12 flips synchronously with the clamping block 23: when the clamping block 23 takes out the substrate 12 from the conveying roller frame 11 in the horizontal conveying section, the substrate 12 has the attached surface facing up; after entering the flipping section, the clamping block 23 and the substrate 12 together flip around the horizontal axis. The attached surface gradually turns from facing up to facing down, and the unattached surface gradually turns from facing down to facing up. The acceleration change generated during the flipping process can cause the small amount of loose particles attached to the attached surface to fall off under the combined action of gravity and inertia, achieving the initial cleaning of the attached surface. refer to Figure 1 , Figure 2 , Figure 3 , Figure 7 , Figure 8 and Figure 9As shown, immediately after the clamping block 23 drives the base plate 12 to complete the horizontal-flipping-horizontal motion trajectory, it continues to move along the top of the airflow box 24. At this time, the blower 43 starts, drawing in outside air through the air inlet. The air is pressurized and accelerated inside the blower 43, gaining higher energy, and is pushed along the internal flow channel to the air outlet, forming a high-speed airflow that is ejected. The ejected airflow is collected by the air inlet pipe 41 and then transported into the airflow box 24. After the airflow contacts the top of the partition block 44, it completes the initial diversion. The meshing and closing area of ​​the second gear 46 and the internal gear ring frame 45 can prevent the reverse flow of the diverted airflow. After the servo motor 48 starts, it drives the second gear 46 to rotate between the partition block 44 and the internal gear ring frame 45. The second gear 46 and the internal gear ring frame 45 form a meshing transmission, driving the internal gear ring frame 45 to make a circular motion along the inside of the airflow box 24 and the outside of the partition block 44. The meshing positions alternate periodically and close intermittently. During the closing of the meshing point, the airflow delivered by the intake pipe 41 is momentarily intercepted in a local area. After being compressed, the airflow accelerates through the unclosed channel. This channel is composed of the guide channel 47, the tooth spacing of the internal gear ring 45, and the outer gap of the partition block 44. The area where the internal gear ring 45 and the second gear 46 are not meshed forms two different guide paths inside the airflow box 24, so that the airflow is pulsedly and alternately distributed to the short path and the long path. After the airflow is delivered along different paths, the airflow guided by the guide channel 47 arrives at the exhaust pipe 42 first, while the airflow delivered through the gap between the internal gear ring 45 and the partition block 44 arrives later. The spatial path difference is converted into a time phase difference. When the two airflows meet at the inlet of the exhaust pipe 42, they are not synchronous and at the same speed, but there is a definite speed difference and arrival time difference, which modulates the continuous incoming airflow into a periodic pulsed split state. refer to Figure 1 and Figure 3As shown, the two airflows collide at their intersection with different phases and velocities, generating strong turbulent mixing induced by velocity and pressure differences. This causes the airflow pressure and velocity output from the outlet pipe 42 to exhibit periodic pulsating characteristics. When this pulsating airflow acts upward on the bottom surface of the clamping block 23 and the substrate 12, it can apply intermittent pulse impact force to the micro-dust particles already attached to the patch surface, causing the weaker adhesively adhering dust particles to detach from the substrate surface under the pressure pulse. At the same time, the contact area between the middle of the clamping block 23 and the substrate 12 is much smaller than that of the smooth areas at both ends, and a gap exists between them. When the airflow output from the outlet pipe 42 approaches the clamping block 23 and the substrate 12 vertically upward, it will not stagnate or scatter disorderly below the clamping block 23, but will instead smoothly split into two streams through the arc-shaped curved surface, accelerating along the arc surface in the middle region of the clamping block 23. The variable incident angle and flow rate can avoid the formation of localized low-flow dead zones, and the uniformity of cleaning coverage is better than that of steady-state laminar flow purging. After the pre-stabilizing frame 36 re-fits with the inner wall of the first slide 32, the first slide 32 once again forms a lateral limit on the pre-stabilizing frame 36. The first electric push rod 34 continues to extend and retract, driving the pre-stabilizing frame 36 to move horizontally along the inside of the first slide 32. The displacement frame 21 simultaneously drives the support frame 22 and the clamping block 23 to move closer to the side of the vacuum positioning frame 13. Relying on the vacuum adsorption effect of the vacuum positioning frame 13 and the slow retraction and release of the clamping block 23, the substrate 12 can be stably fitted with the vacuum positioning frame 13, and the substrate posture conversion can be completed without damage, ensuring the continuous development of the double-sided bonding process of the substrate 12 and helping to improve the bonding processing quality.

[0022] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An integrated circuit substrate mounting apparatus, comprising a worktable (1), a conveyor roller frame (11), and a substrate (12), wherein a mounter (14) and a vacuum positioning frame (13) are respectively mounted on the top of the worktable (1), and the vacuum positioning frame (13) is used to achieve airflow adsorption on the substrate (12), characterized in that: The connection between the conveyor roller frame (11) and the worktable (1) is provided with a stabilizing component (2), and the stabilizing component (2) is used to drive the substrate (12) away in a direction perpendicular to the surface of the conveyor roller frame (11), and to stably place the substrate (12) contained inside it in the vacuum positioning frame (13). The stabilizing assembly (2) includes a displacement frame (21) installed between the conveyor roller frame (11) and the worktable (1) and a support frame (22) movably connected to one side of the displacement frame (21). Two symmetrical clamping blocks (23) are slidably connected to one side of the support frame (22), and the clamping blocks (23) are set with tooth structure. The middle part of the clamping block (23) is slightly arc-shaped, and the section extending from the middle to both sides is kept horizontal. An airflow box (24) is installed between the conveyor roller frame (11) and the worktable (1), and the airflow box (24) is located below the moving path of the displacement frame (21). A stabilizing component (3) is provided between the worktable (1) and the conveying roller frame (11), and the stabilizing component (3) is used to enable the displacement frame (21) to have multiple displacement paths during the movement towards the vacuum positioning frame (13); The airflow box (24) is provided with a flow splitting component (4) inside, and the flow splitting component (4) is used to keep the base plate (12) inside the displacement frame (21) stable during the displacement of the displacement frame (21) along multiple paths.

2. The integrated circuit substrate mounting device according to claim 1, characterized in that: The stabilizing assembly (3) includes a centering frame (31) fixedly connected to the top of the workbench (1) and the conveying roller frame (11) and a concentric shaft column (35) movably connected to the middle of the interior of the displacement frame (21). The end of the concentric shaft column (35) forms an opening with the interior of the displacement frame (21). One side of the support frame (22) extends to the opening and is fixedly connected to the concentric shaft column (35), so that the support frame (22) and one side of the displacement frame (21) are stably connected. The centering frame (31) is fixedly connected to a rack frame (38) on the side away from the displacement frame (21), and one end of the concentric shaft column (35) extends to the outside of the displacement frame (21) and is fitted with a first gear (37) that meshes with the rack frame (38). The centering frame (31) is fixedly connected to a first electric push rod (34) on the side near the vacuum positioning frame (13). One end of the first electric push rod (34) is fixedly connected to the top of the displacement frame (21), and the first electric push rod (34) is used to drive the displacement frame (21) to move back and forth. The support frame (22) has two sets of symmetrical elastic components (5) on one side, and the elastic components (5) are used to make the clamp (23) maintain adaptive contact with one side of the base plate (12).

3. The integrated circuit substrate mounting device according to claim 2, characterized in that: The centering frame (31) has a first groove (32) on one side for guiding the movement of the concentric column (35), and the centering frame (31) has a second groove (33) on the top that communicates with the interior of the first groove (32). The second groove (33) and the first groove (32) together form a C-shaped structure on the centering frame (31). The concentric shaft (35) is fixedly connected to an L-shaped pre-stabilizing frame (36) at one end near the first gear (37). The pre-stabilizing frame (36) is located inside the first slide groove (32) and slides in cooperation with the first slide groove (32).

4. The integrated circuit substrate mounting apparatus according to claim 2, characterized in that: Each set of elastic components (5) includes a side guard frame (51) slidably connected to one side of the support frame (22) and two guide posts (52) fixedly connected to one side of the clamping block (23), and the clamping block (23) and the two guide posts (52) are movably connected inside the side guard frame (51); The side guard frame (51) is internally slidably connected to two limiting ring frames (54) for guiding the movement of two guide posts (52), and a return spring (53) is fixedly connected between each guide post (52) and each limiting ring frame (54).

5. The integrated circuit substrate mounting apparatus according to claim 4, characterized in that: Each of the displacement limiting ring frames (54) has a central bearing ring (55) movably connected to one end, and an external threaded ring cylinder (56) is fixedly connected to one end of the central bearing ring (55). An internal threaded ring (57) that is helically engaged with the external threaded ring cylinder (56) is fixedly connected inside the side guard ring frame (51), and the displacement path of the displacement limiting ring frame (54) inside the side guard ring frame (51) is constrained through the external threaded ring cylinder (56).

6. The integrated circuit substrate mounting apparatus according to claim 4, characterized in that: The diversion component (4) includes an outlet pipe (42) and an inlet pipe (41) fixedly connected to the outside of the airflow box (24), and the inlet pipe (41) and the outlet pipe (42) communicate with the inside of the airflow box (24). A partition block (44) is fixedly connected inside the airflow box (24), and the partition block (44) is designed as a curved structure. The two ends of the partition block (44) extend to the opening positions of the inlet pipe (41) and the outlet pipe (42) located inside the airflow box (24). An internal toothed ring frame (45) is movably connected inside the airflow box (24), and the internal toothed ring frame (45) and the partition block (44) divide the airflow inside the airflow box (24) into two channels. A blower (43) is fixedly connected to the outside of the airflow box (24), and the air outlet of the blower (43) is connected to the inside of the air inlet pipe (41).

7. The integrated circuit substrate mounting apparatus according to claim 6, characterized in that: The airflow box (24) is also movably connected to a second gear (46). The second gear (46) is located at the opening of the air inlet pipe (41) and the air outlet pipe (42). The second gear (46) is engaged with the internal gear ring frame (45), and the engagement point of the internal gear ring frame (45) and the second gear (46) is periodically closed to restrict the flow path of the airflow inside the airflow box (24). The second gear (46) and the partition block (44) together form a curved flow channel (47). The airflow box (24) is fixedly connected to a servo motor (48), and the output end of the servo motor (48) extends into the airflow box (24) and is fixedly connected to one end of the second gear (46).

8. The bonding method of an integrated circuit substrate bonding apparatus according to claim 7, characterized in that, Includes the following steps: S1. Before operation, according to the specifications of the substrate (12), rotate the external threaded ring cylinder (56) and screw it along the internal threaded ring (57) to feed. Drive the limiting ring frame (54) to slide horizontally through the middle bearing ring (55), adjust the compression amount of the reset spring (53), preset the upper limit of the clamping force of the clamping block (23), adapt to different substrate clamping requirements, and reduce the risk of edge crushing. S2, The feeding mechanism inside the conveyor roller frame (11) vertically lifts the base plate (12), the second electric push rod (58) pushes the side guard frame (51) to feed, the two sets of clamping blocks (23) come together to clamp the edge of the base plate, the horizontal sections at both ends of the clamping blocks (23) bear the main clamping force, the middle arc section provides auxiliary constraint, the guide column (52) and the reset spring (53) form an elastic yield, realize the contact of the contour surface, and reduce the risk of material picking friction and edge chipping; S3. The first electric push rod (34) drives the displacement frame (21) to move horizontally, and the pre-stabilizing frame (36) slides along the first slide groove (32) to maintain a horizontal posture. When it reaches the C-shaped slide groove connection, the first gear (37) meshes with the rack frame (38), driving the support frame (22) and the clamping block (23) to rotate synchronously, completing the horizontal-flipping-reset horizontal posture conversion, so that the substrate (12) with the attached surface turns downward, and the surface particles are initially removed by inertia. S4. The substrate (12) moves to the top of the airflow box (24). The blower (43) blows air through the air inlet pipe (41). The servo motor (48) drives the second gear (46) to periodically mesh with the internal gear ring frame (45). The splitting block (44) splits the airflow to form two differential airflows. After they converge, they generate a pulsating airflow that blows upward to sweep the substrate surface. The gap in the middle of the clamping block (23) guides the airflow to diffuse, improving the uniformity of cleaning and reducing the impact of dust particles on the mounting accuracy. S5. The displacement frame (21) moves to the top of the vacuum positioning frame (13). The vacuum positioning frame (13) starts negative pressure adsorption, and the clamping block (23) slowly retracts to release the substrate component (12), completing the impact-free bonding and positioning. Then the chip mounter (14) performs component mounting on the unattached side of the substrate to achieve continuous double-sided chip mounting processing.

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