LED display screen and manufacturing method of LED display screen

Abstract

The application discloses an LED display screen and a manufacturing method thereof, and relates to the technical field of LED display, and the LED display screen comprises a substrate, a plurality of pixel units, an encapsulation layer, a light transmission layer and a transparent protective layer. The pixel units are arranged on the substrate, and the encapsulation layer is arranged on the substrate and covers the pixel units. The light transmission layer is arranged on the encapsulation layer, and the light transmission layer comprises a light transmission main body and a plurality of micro transmission parts. The micro transmission parts are uniformly distributed in the light transmission main body, the light transmission rate of the micro transmission parts is greater than that of the light transmission main body, the micro transmission parts are used for transmitting light to increase brightness when the screen is bright, the light transmission main body is made of black translucent material, is used for forming a black screen when the screen is dark, and transmits light when the screen is bright. The light transmission rate of the micro transmission part is large, which is beneficial to improving the brightness when the screen is bright. The light transmission rate of the light transmission main body is small, which not only can transmit light when the screen is bright, but also can improve the blackness when the screen is dark, so that the brightness and the blackness are synergistically optimized.

Description

Technical Field

[0001] This application relates to the field of LED display technology, specifically to an LED display screen and a method for manufacturing the LED display screen. Background Technology

[0002] COB (Chip On Board) LED (Light-Emitting Diode) and COG (Chip On Glass) LED displays, as active-emitting display technologies, have the advantages of high brightness and wide color gamut.

[0003] Some LED displays, in order to achieve a uniform and deep black effect when the screen is off, use a semi-transparent black polymer film bonded to the surface of the display module after the LED chips have been packaged and die-bonded. This film uses black dyes or carbon black particles contained within it to absorb incident light from the environment, reducing reflected light from the module surface, thereby improving display contrast and the visual effect when the screen is off. However, the semi-transparent black polymer film also absorbs and blocks light emitted by the LED chips, resulting in significant brightness attenuation and affecting overall luminous efficiency. Therefore, there is a problem that the brightness when the screen is on and the blackness when the screen is off cannot be optimized in a coordinated manner. Summary of the Invention

[0004] The main technical problem solved by this invention is that the brightness when the screen is on and the blackness when the screen is off cannot be optimized in a coordinated manner.

[0005] To achieve one of the above objectives, some embodiments of this application provide an LED display screen, including:

[0006] substrate;

[0007] A plurality of pixel units are disposed on the substrate, and each pixel unit includes a light-emitting chip that emits red light, blue light and green light respectively;

[0008] An encapsulation layer is disposed on the substrate and covers the pixel unit;

[0009] A light-transmitting layer is disposed on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and a plurality of micro-transmitting portions. The maximum width of the micro-transmitting portions is 1μm-20μm. The micro-transmitting portions are uniformly distributed in the light-transmitting main body. The light transmittance of the micro-transmitting portions is greater than that of the light-transmitting main body. The micro-transmitting portions are used to transmit light to increase brightness when the screen is on. The light-transmitting main body is made of a black semi-transparent material and is used to form a black screen when the screen is off and to transmit light when the screen is on.

[0010] A transparent protective layer is disposed on the light-transmitting layer.

[0011] In one embodiment, the micro-transmitting portion is a micropore provided on the light-transmitting body;

[0012] Alternatively, the micro-transmitting part is made of a transparent material, and the transparent micro-transmitting part array is distributed in the light-transmitting body.

[0013] In one embodiment, both the protective layer and the microtransmitting part are transparent adhesive materials, and the protective layer and the microtransmitting part are an integral structure.

[0014] In one embodiment, the micro-transmitting portion is the micropore, and the protective layer covers the micropore to seal it.

[0015] In one embodiment, the light-transmitting body is a semi-transparent black polyester film, and the thickness of the semi-transparent black polyester film is 25μm-150μm.

[0016] In one embodiment, the ratio of the total area of ​​the plurality of microtransmitters in the light-transmitting layer to the area of ​​the light-transmitting layer is 0.2-0.4.

[0017] In one embodiment, an adhesive layer is provided between the light-transmitting layer and the encapsulation layer, and the adhesive layer fixes the light-transmitting layer onto the encapsulation layer.

[0018] To achieve one of the above objectives, some embodiments of this application also provide a method for manufacturing an LED display screen, comprising:

[0019] Provide substrate;

[0020] A plurality of pixel units are disposed on a substrate, each pixel unit comprising a light-emitting chip that emits red light, blue light and green light respectively;

[0021] An encapsulation layer is disposed on the substrate so that the encapsulation layer covers the pixel unit;

[0022] A light-transmitting layer and a transparent protective layer are disposed on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and multiple micro-transmitting parts. The maximum width of the micro-transmitting parts is 1μm-20μm. The micro-transmitting parts are uniformly distributed in the light-transmitting main body. The light transmittance of the micro-transmitting parts is greater than that of the light-transmitting main body. The light-transmitting main body is made of black semi-transparent material. The protective layer is disposed on the light-transmitting layer.

[0023] In one embodiment, the provision of a light-transmitting layer and a transparent protective layer on the encapsulation layer includes:

[0024] Semi-transparent black polyester film is available;

[0025] Multiple uniformly distributed micropores are processed on the semi-transparent black polyester film to form a light-transmitting body;

[0026] The light-transmitting main body is bonded to the encapsulation layer;

[0027] A transparent adhesive material is applied to the light-transmitting body by pressing, spraying, or hot pressing. Part of the transparent adhesive material fills the micropores to form a protective layer on the light-transmitting body and a micro-transmitting part in the micropores.

[0028] In one embodiment, the provision of a light-transmitting layer and a transparent protective layer on the encapsulation layer includes:

[0029] Semi-transparent black polyester film is available;

[0030] Multiple uniformly distributed micropores are processed on the semi-transparent black polyester film to form a light-transmitting layer including a light-transmitting main body and multiple micro-transmitting parts, wherein the micropores are the micro-transmitting parts;

[0031] The light-transmitting layer is bonded to the encapsulation layer;

[0032] A transparent adhesive is disposed on the light-transmitting layer to form a protective layer on the light-transmitting layer, which seals the micropores.

[0033] According to the LED display screen and its manufacturing method described in the above embodiments, a light-transmitting layer is disposed on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and multiple micro-transmitting parts. The maximum width of the micro-transmitting parts is 1μm-20μm. The micro-transmitting parts are uniformly distributed in the light-transmitting main body, and the light transmittance of the micro-transmitting parts is greater than that of the light-transmitting main body. The micro-transmitting parts are used to transmit light to increase brightness when the screen is on. The light-transmitting main body is made of a black semi-transparent material and is used to form a black screen when the screen is off and to transmit light when the screen is on. The high light transmittance of the micro-transmitting parts is beneficial to improving the brightness when the screen is on, while the low light transmittance of the light-transmitting main body not only allows light to be transmitted when the screen is on but also improves the blackness when the screen is off, thereby achieving synergistic optimization of brightness and blackness. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of an LED display screen in one embodiment of this application;

[0035] Figure 2 This is a cross-sectional structural diagram of an LED display screen in one embodiment of this application;

[0036] Figure 3 As one embodiment of this application Figure 2 Enlarged view of A;

[0037] Figure 4 This is a schematic diagram of another cross-sectional structure of the LED display screen in one embodiment of this application;

[0038] Figure 5 As one embodiment of this application Figure 4 Enlarged view of C;

[0039] Figure 6 This is a flowchart of a method for manufacturing an LED display screen in one embodiment of this application;

[0040] Figure 7 This is a schematic diagram illustrating the manufacturing steps of an LED display screen in one embodiment of this application;

[0041] Figure 8 This is a flowchart illustrating the formation of a light-transmitting layer and a protective layer in one embodiment of this application;

[0042] Figure 9 This is another flowchart illustrating the formation of the light-transmitting layer and the protective layer in one embodiment of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 1-Substrate; 2-Light-emitting chip; 3-Encapsulation layer; 4-Light-transmitting layer; 401-Miniature transmissive part; 402-Light-transmitting body; 5-Protective layer. Detailed Implementation

[0045] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0046] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0047] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0048] To achieve a uniform and deep black effect when the screen is off, some LED displays use a semi-transparent black polymer film layer bonded to the surface of the display module after the LED chips have been packaged and die-bonded. This film layer uses black dye or carbon black particles to absorb incident light from the environment, reducing reflected light from the module surface, thereby improving display contrast and the visual effect when the screen is off. However, the semi-transparent black polymer film layer also absorbs and blocks light emitted by the LED chips, resulting in some layers having a light transmittance of only 30%-50%, leading to significant brightness reduction and affecting overall luminous efficiency. Therefore, there is a problem of inconsistent optimization between brightness when the screen is on and blackness when the screen is off. Even with brightness correction compensation through the driver circuit, the overall luminous efficiency remains low, leading to increased power consumption, increased heat accumulation, and a shortened lifespan of the LED display. On the other hand, reducing the thickness of the semi-transparent black polymer film layer or the amount of black dye added to improve brightness will result in obvious color differences and uneven patches on the module surface, leading to poor black screen consistency.

[0049] Furthermore, some LED displays employ an opaque light-blocking layer to absorb ambient incident light. To achieve display, windows are created in this layer, and the size of these windows directly affects the brightness. When the arrangement of these light-transmitting holes is periodic, interference with the display pixels can occur, causing optical defects such as moiré patterns. Moreover, the brightness is entirely limited by the window size; only the window area emits light, while light from the non-transparent areas is wasted, requiring higher backlight compensation. Sometimes, the window area must be aligned one-to-one with the light-emitting chip, which is not only difficult to operate but also results in light blockage and dark spots on the display screen if the alignment is misaligned.

[0050] Based on this, this application places the light-transmitting layer on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and multiple micro-transmitting parts. The maximum width of the micro-transmitting parts is 1μm-20μm. The micro-transmitting parts are uniformly distributed in the light-transmitting main body, and the light transmittance of the micro-transmitting parts is greater than that of the light-transmitting main body. The micro-transmitting parts are used to transmit light to increase brightness when the screen is on. The light-transmitting main body is a black semi-transparent material used to absorb light to form a black screen when the screen is off and to transmit light when the screen is on. The micro-transmitting parts do not need to be aligned with the light-emitting chip, which helps to reduce the manufacturing difficulty. Moreover, the high light transmittance of the micro-transmitting parts helps to improve the brightness when the screen is on. The low light transmittance of the light-transmitting main body not only transmits light when the screen is on but also improves the blackness when the screen is off, thereby achieving synergistic optimization of brightness and blackness.

[0051] The following describes some embodiments of the LED display screen and its manufacturing method provided in this application, with reference to the accompanying drawings.

[0052] Please see Figures 1 to 5This application provides an LED display screen in some embodiments, which mainly includes a substrate 1, a plurality of pixel units, an encapsulation layer 3, a light-transmitting layer 4 and a protective layer 5, as well as other functional components as needed, which are described in detail below.

[0053] In one embodiment, such as Figures 2-5 As shown, a number of pixel units are disposed on substrate 1. Each pixel unit includes a light-emitting chip 2 that emits red light, blue light and green light respectively. An encapsulation layer 3 is disposed on substrate 1 and covers each pixel unit.

[0054] In this embodiment, the substrate 1 can be made of a rigid material, such as, but not limited to, phenolic paper laminate, epoxy paper laminate, polyester glass mat laminate, epoxy glass cloth laminate, BT resin board, or glass plate; or the substrate 1 can be made of a flexible material, such as, but not limited to, polyester film, polyimide film, or fluorinated ethylene propylene film. In some examples, corresponding circuits can be integrated into or on the surface of the substrate 1 according to application requirements, such as, but not limited to, circuits connected to the light-emitting chip 2 and driving circuits. It should be understood that the number and arrangement of the pads on the front side of the substrate 1 in the above examples of this embodiment can be flexibly set according to application requirements. For example, multiple pads can be arranged in an array on the substrate 1, or pads in adjacent rows can be staggered. In some examples of this embodiment, the material of the pads can be, but not limited to, copper, silver, gold, etc.

[0055] In this embodiment, the light-emitting chip 2 can be, but is not limited to, an LED light-emitting chip. When it is an LED light-emitting chip, it can include, but is not limited to, ordinary-sized LEDs, and can also include micro LEDs, such as, but not limited to, Mini LEDs (Mini Light Emitting Diodes) and Micro LEDs (Micro Light Emitting Diodes). Multiple light-emitting chips 2 are mounted on the substrate 1. Specifically, the positive electrode of the light-emitting chip 2 can be soldered to the positive electrode pad on the surface of the substrate 1 using solder paste, and the negative electrode of the light-emitting chip 2 can be soldered to the negative electrode pad on the surface of the substrate 1 using solder paste.

[0056] In this embodiment, the encapsulation layer 3 covers the light-emitting chip 2 of each pixel unit, thus protecting the light-emitting chip 2 and improving its service life. In some embodiments, the encapsulation layer 3 may be made of a transparent adhesive material, and in some examples, the encapsulation layer 3 may also contain diffused particles or phosphors.

[0057] In one embodiment, such as Figures 1-5As shown, the light-transmitting layer 4 is disposed on the encapsulation layer 3. The light-transmitting layer 4 includes a light-transmitting main body 402 and multiple micro-transmitting parts 401. The maximum width of the micro-transmitting parts 401 is 1μm-20μm, and the micro-transmitting parts 401 are uniformly distributed in the light-transmitting main body 402. The light transmittance of the micro-transmitting parts 401 is greater than that of the light-transmitting main body 402. The micro-transmitting parts 401 are used to transmit light to increase brightness when the screen is on. The light-transmitting main body 402 is made of black semi-transparent material and is used to form a black screen when the screen is off and to transmit light when the screen is on. The protective layer 5 is transparent and is disposed on the light-transmitting layer 4.

[0058] It is understood that the light-transmitting layer 4 is a layer structure that is entirely transparent to light, and the micro-transmitting part 401 is a structure that allows light to pass through directly, and it is distributed in the light-transmitting body 402. To better allow light to pass through, the micro-transmitting part 401 and the light-transmitting body 402 do not overlap in the vertical direction, which is perpendicular to the surface of the substrate 1. This embodiment does not limit the shape of the micro-transmitting part 401; for example, it can be circular, square, elliptical, hexagonal, or other polygonal. This embodiment does not limit the specific arrangement of the micro-transmitting part 401 in the light-transmitting body 402; it can be manufactured in any manner. The transmittance of the micro-transmitting part 401 is greater than that of the light-transmitting main body 402, resulting in a higher brightness at the micro-transmitting part 401 compared to the overall brightness of the light-transmitting main body 402. This leads to a higher overall brightness in this application compared to the overall brightness of the light-transmitting main body 402. Furthermore, even when the portion relative to the light-transmitting main body 402 is made of a light-blocking material, the light-transmitting material in this application allows light to pass through. In other words, the brightening effect of the micro-transmitting part 401 is primary, while the brightening effect of the light-transmitting material is secondary; the combination of both contributes to the overall brightness improvement. In this application, the size of the micro-transmitting part 401 can be relatively small, controlled to be within a range that is indistinguishable to the human eye at normal viewing distances (typically ≥1.5m). Figure 5 As shown, the maximum width b of the micro-transmitting part can be 1μm-20μm. When viewed from the surface of the display screen, the presence of the micro-transmitting part 401 is not noticeable to the naked eye and will not affect the viewing experience. When the micro-transmitting part 401 is circular, in this embodiment, the maximum width b of the micro-transmitting part 401 is the diameter of the micro-transmitting part 401.

[0059] In this embodiment, the light-transmitting main body 402 is made of a black semi-transparent material, possessing both light-transmitting and light-absorbing properties. It can create a black screen effect when the screen is off. This embodiment does not limit the specific light transmittance of the black semi-transparent material; it can be smaller than that of the micro-transmitting part 401. The black semi-transparent material can be, but is not limited to, a semi-transparent black PET (Polyethylene Terephthalate) substrate containing black dye or carbon black particles. Alternatively, other polymer film materials such as PC (Polycarbonate), PMMA (Polymethyl Methacrylate), and PI (Polyimide) can be used, as long as they possess semi-transparent black optical properties and are processable. Preferably, the light-transmitting main body 402 can be a semi-transparent black polyester film (i.e., PET film). The thickness of the semi-transparent black polyester film is 25μm-150μm. Within this thickness range, it is beneficial for ensuring the blackness of the screen when it is off, and also beneficial for the light transmission of the screen when it is on. Of course, the thickness of the light-transmitting main body 402 can also be selected according to needs. In this embodiment, the protective layer 5 provides surface hardness and scratch resistance, forms physical protection for the LED display screen, and serves as an optical transmission medium, allowing light passing through the micro-transmission section 401 to be emitted with extremely low loss.

[0060] In this embodiment, the high transmittance of the micro-transmitting part 401 is beneficial for improving the brightness when the screen is on, reducing product power consumption and heat generation, and extending the lifespan of the light source. Furthermore, it eliminates the need to thin the semi-transparent black polymer film layer or reduce the amount of black dye added, which helps prevent color differences and uneven patches, improving the consistency of the black screen. The low transmittance of the light-transmitting body 402 not only allows light to pass through when the screen is on but also improves the blackness when the screen is off, thus achieving synergistic optimization of brightness and blackness. Moreover, in the light-transmitting layer 4, in addition to the micro-transmitting part 401, the light-transmitting body 402 can also transmit a portion of the light, which helps improve brightness. The limitation on the total area ratio of the micro-transmitting part 401 can be partially alleviated, allowing for more flexible size settings and lower requirements for dimensional accuracy. It also eliminates the need for alignment with the light-emitting chip 2, reducing manufacturing difficulty. Furthermore, the light transmission of the light-transmitting body 402 acts as a "background light," diluting the periodicity of the micro-transmitting part 401 array, visually weakening the moiré pattern and improving the display effect. In addition, the light-transmitting body 402 fills the dark areas between the light-transmitting holes, resulting in a smoother macroscopic brightness distribution.

[0061] In some embodiments, the specific arrangement of the micro-transmitting part 401 in the light-transmitting body 402 may be as follows:

[0062] One example, such as Figure 2 , Figure 3As shown, the micro-transmitting part 401 can be a micro-hole provided on the light-transmitting body 402. The micro-hole allows light to pass through directly, and its light transmittance is greater than that of the light-transmitting body 402, which is beneficial to improving the brightness when the screen is on. Moreover, the micro-hole is simple to manufacture, which justifies reducing the manufacturing difficulty.

[0063] Furthermore, the protective layer 5 can cover the micropores to seal them. The openings of the micropores are completely sealed, making the overall encapsulation structure a complete hermetically sealed enclosure on a macroscopic level, providing reliable long-term protection for the LED display and helping to extend its service life.

[0064] Another example, such as Figure 4 , Figure 5 As shown, the micro-transmitting part 401 is made of transparent material, and the array of transparent micro-transmitting parts 401 is distributed within the light-transmitting body 402. The light transmittance of the transparent material is also greater than that of the light-transmitting body 402, which is beneficial to improving the brightness when the screen is on. At this time, the equivalent light transmittance of the entire packaging structure can be increased from the aforementioned 30%-50% to 60%-80%. In addition, when the micro-transmitting part 401 is made of transparent material, the refractive index of the transparent material can be made equal to or less than a certain set value than that of the refractive index of the light-transmitting body 402 by selecting the transparent material. This can suppress the reflection interference of the sidewalls of the micro-transmitting part 401. The closer the refractive index of the transparent material is to that of the light-transmitting body 402, the weaker the diffraction and interference effects, which is beneficial to weakening moiré patterns. Furthermore, the overall packaging structure formed in this example also has better hermeticity.

[0065] Furthermore, both the protective layer 5 and the micro-transmitting part 401 are transparent adhesive materials, and the protective layer 5 and the micro-transmitting part 401 are an integral structure. The integral structure is simple to manufacture, allowing for the simultaneous formation of the protective layer 5 and the transparent micro-transmitting part 401, which improves processing efficiency. In addition, when the protective layer 5 and the micro-transmitting part 401 are an integral structure, it helps prevent the appearance of a separation interface between them, thus avoiding the occurrence of additional interference fringes due to the presence of such an interface.

[0066] In one embodiment, the ratio of the total area of ​​the plurality of micro-transmitting parts 401 in the light-transmitting layer 4 to the area of ​​the light-transmitting layer 4 can be 0.2-0.4. Because the light-transmitting main body 402 can also transmit light, the brightness is not limited only by the size of the area of ​​the micro-transmitting parts 401, which allows for a larger range of the total area of ​​the micro-transmitting parts 401 in the light-transmitting layer 4, and also facilitates the flexible design of the overall structure.

[0067] In one embodiment, an adhesive layer (not shown in the figure) may be provided between the light-transmitting layer 4 and the encapsulation layer 3, fixing the light-transmitting layer 4 to the encapsulation layer 3. Adhering the light-transmitting layer 4 to the encapsulation layer 3 is simple and quick to manufacture, improving processing efficiency. The adhesive layer can be an optical adhesive layer, such as OCA (Optically Clear Adhesive) optical adhesive or other liquid optical adhesives, which facilitates bonding without bubbles or impurities. However, this is not a limitation; the light-transmitting layer 4 can also be disposed on the adhesive layer in other ways.

[0068] The LED display screen provided in the above embodiment has a light-transmitting layer 4 disposed on the encapsulation layer 3. The light-transmitting layer 4 includes a light-transmitting main body 402 and a plurality of micro-transmitting parts 401. The micro-transmitting parts 401 are uniformly distributed in the light-transmitting main body 402, and the light transmittance of the micro-transmitting parts 401 is greater than that of the light-transmitting main body 402. The micro-transmitting parts 401 are used to transmit light to increase brightness when the screen is on. The light-transmitting main body 402 is made of black semi-transparent material and is used to absorb light to form a black screen when the screen is off and to transmit light when the screen is on. The high light transmittance of the micro-transmitting parts 401 is beneficial to improving the brightness when the screen is on, reducing product power consumption and heat generation, and extending the lifespan of the light source. Moreover, it is not necessary to reduce the thickness of the semi-transparent black polymer film layer or reduce the amount of black dye added, which helps to prevent color difference and uneven patches and improve the consistency of the black screen. The low light transmittance of the light-transmitting main body 402 not only transmits light when the screen is on, but also improves the blackness when the screen is off, thereby achieving synergistic optimization of brightness and blackness. Furthermore, in the light-transmitting layer 4, besides the micro-transmitting parts 401, the light-transmitting main body 402 can also transmit a portion of light, which helps to improve brightness. The limitation on the total area ratio of the micro-transmitting parts 401 can be partially alleviated, and the size setting of the micro-transmitting parts 401 is more flexible, with lower requirements for dimensional accuracy. In addition, the light transmission of the light-transmitting main body 402 acts as "background light," diluting the periodicity of the array of micro-transmitting parts 401, making the moiré pattern visually weaker and the display effect better. Moreover, the light transmission of the light-transmitting main body 402 fills the dark areas between the light-transmitting holes, resulting in a smoother macroscopic brightness distribution.

[0069] Please see Figures 6-9 In other embodiments of this application, a method for manufacturing an LED display screen is provided, and the structure of the LED display screen formed can be the same as that in the above embodiments.

[0070] In one embodiment, such as Figure 6 The manufacturing method of an LED display screen includes the following steps:

[0071] S1: Provide substrate.

[0072] The substrate 1 in this embodiment can be the same as the example in the above embodiments, and will not be described again here.

[0073] S2: A plurality of pixel units are disposed on the substrate, each pixel unit including a light-emitting chip that emits red light, blue light and green light respectively.

[0074] The specific arrangement of the light-emitting chip 2 on the substrate 1 can be the same as in the above embodiments, and will not be described again here.

[0075] S3: A packaging layer is provided on the substrate so that the packaging layer covers the pixel unit.

[0076] This embodiment does not limit the specific configuration of the encapsulation layer 3; any light-emitting chip 2 that can encapsulate a pixel unit can be used. The top surface of the formed encapsulation layer 3 is clean and flat, which is beneficial for the subsequent configuration of the light-transmitting layer 4.

[0077] S4: A light-transmitting layer and a transparent protective layer are provided on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and multiple micro-transmitting parts. The maximum width of the micro-transmitting parts is 1μm-20μm. The micro-transmitting parts are evenly distributed in the light-transmitting main body. The light transmittance of the micro-transmitting parts is greater than that of the light-transmitting main body. The light-transmitting main body is made of black semi-transparent material.

[0078] In this step, the protective layer 5 is placed on the light-transmitting layer 4. This embodiment does not limit the specific manufacturing method of the light-transmitting layer 4 and the protective layer 5 in this step; any method suitable for manufacturing can be used.

[0079] As a more specific embodiment, such as Figure 8 The process of setting a light-transmitting layer 4 and a transparent protective layer 5 on the encapsulation layer 3 may include the following steps:

[0080] S411: Provides semi-transparent black polyester film.

[0081] In this embodiment, the semi-transparent black polyester film is a semi-transparent black PET film containing black dye or carbon black particles, and its thickness can be 25μm-150μm.

[0082] S412: Multiple uniformly distributed micropores are processed on a semi-transparent black polyester film to form a light-transmitting body.

[0083] In one example, a uniformly distributed array of micropores can be fabricated on the thin film surface using laser drilling, mechanical punching, or photolithography. The micropores can be circular, square, elliptical, or hexagonal, with circular shapes being preferred. After fabrication, the thin film can be cleaned. For example, ultraviolet laser drilling with a wavelength of 355 nm can be used to fabricate micropores. By precisely controlling the laser energy, pulse frequency, and scanning speed, micropores with consistent diameters and smooth edges can be fabricated on the PET film.

[0084] S413: Adhere the light-transmitting main body to the encapsulation layer.

[0085] In one example, a semi-transparent black polyester film with micropores is bonded to the encapsulation layer 3 using an optical adhesive layer. The optical adhesive layer can be OCA optical adhesive or other liquid optical adhesives, and the bonding should be as free of bubbles and impurities as possible.

[0086] S414: A transparent adhesive material is applied to a light-transmitting body by means of pressing, spraying or hot pressing, and part of the transparent adhesive material is filled into the micropores to form a protective layer on the light-transmitting body and a micro-transmitting part in the micropores.

[0087] In one example, the film can be manufactured by pressing and curing: liquid epoxy resin is uniformly coated on the surface of a microporous semi-transparent black polyester film, and the resin is filled into the micropores by roller pressing or flat pressing. Then, it is heated and cured at 60℃-120℃ for 10-60 minutes to form an integral protective layer 5 and a micro-transmitting part 401.

[0088] In another example, a spray curing method can be selected: using precision spraying equipment, a transparent polymer resin solution is atomized and uniformly sprayed onto the surface of a microporous semi-transparent black polyester film, controlling the spraying thickness to be 5μm-30μm, and then cured into a film by hot air or infrared heating to form an integrated protective layer 5 and a micro-transmitting part 401.

[0089] In another example, a hot-pressing composite method can be selected: the transparent film and the microporous semi-transparent black polyester film are aligned and stacked, and hot-pressed composite is performed under the conditions of 120℃-160℃ temperature and 0.5MPa-2MPa pressure, with a holding time of 5-30 seconds, so that the transparent film is tightly bonded to the microporous semi-transparent black polyester film through the hot melt adhesive layer, and part of the transparent adhesive fills into the micropores, forming an integrated protective layer 5 and a micro-transmitting part 401.

[0090] In some embodiments, the protective layer 5 and the micro-transmitting part 401 can be made of high-transmittance polymer materials such as silicone resin, polycarbonate (PC), and polymethyl methacrylate (PMMA), in addition to epoxy resin, acrylic resin, and PET. The formation method is not limited to the above examples. Coating, spraying, hot pressing, and curtain coating processes can be flexibly selected according to the material characteristics, so as to flexibly adapt to different production equipment and process conditions.

[0091] As another more specific embodiment, such as Figure 9 The process of setting a light-transmitting layer 4 and a transparent protective layer 5 on the encapsulation layer 3 may include the following steps:

[0092] S421: Provides semi-transparent black polyester film.

[0093] The semi-transparent black polyester film in this embodiment can be the same as that in the specific embodiments described above.

[0094] S422: Multiple uniformly distributed micropores are processed on a semi-transparent black polyester film to form a light-transmitting layer including a light-transmitting main body and multiple micro-transmitting parts, wherein the micropores are micro-transmitting parts.

[0095] The micropores in this embodiment can be formed in the same way as in the specific embodiments described above.

[0096] S423: Adhere the light-transmitting layer to the encapsulation layer.

[0097] The specific bonding configuration of the light-transmitting layer 4 in this embodiment can also be the same as in the above specific embodiment.

[0098] S424: A transparent adhesive is placed on the light-transmitting layer to form a protective layer on the light-transmitting layer, which seals the micropores.

[0099] The main difference between this embodiment and the specific embodiments described above is that when the transparent adhesive material is provided on the light-transmitting layer 4, the transparent adhesive material can be prevented from filling the micropores or only partially filled by controlling the processing parameters. For example, the pressing pressure can be reduced. However, the formation of the micro-transmitting part 401 is not limited to the above example and can also be manufactured in other ways.

[0100] The LED display screen provided in the above embodiment has a light-transmitting layer 4 disposed on the encapsulation layer 3. The light-transmitting layer 4 includes a light-transmitting main body 402 and multiple micro-transmitting parts 401. The maximum width of the micro-transmitting parts is 1μm-20μm. The micro-transmitting parts 401 are uniformly distributed in the light-transmitting main body 402. The light transmittance of the micro-transmitting parts 401 is greater than that of the light-transmitting main body 402. The light-transmitting main body 402 is made of black semi-transparent material. The high light transmittance of the micro-transmitting parts 401 is beneficial to improving the brightness when the screen is on, reducing product power consumption and heat generation, and extending the lifespan of the light source. Furthermore, it eliminates the need to thin the semi-transparent black polymer film layer or reduce the amount of black dye added, which helps prevent color differences and uneven patches, improving the consistency of the black screen. The low light transmittance of the light-transmitting main body 402 not only allows light to be transmitted when the screen is on but also improves the blackness when the screen is off, thereby achieving synergistic optimization of brightness and blackness. Furthermore, in the light-transmitting layer 4, besides the micro-transmitting parts 401, the light-transmitting main body 402 can also transmit a portion of light, which helps to improve brightness. The limitation on the total area ratio of the micro-transmitting parts 401 can be partially alleviated, and the size setting of the micro-transmitting parts 401 is more flexible, with lower requirements for dimensional accuracy. In addition, the light transmission of the light-transmitting main body 402 acts as "background light," diluting the periodicity of the array of micro-transmitting parts 401, making the moiré pattern visually weaker and the display effect better. Moreover, the light transmission of the light-transmitting main body 402 fills the dark areas between the light-transmitting holes, resulting in a smoother macroscopic brightness distribution.

[0101] This document describes various exemplary embodiments with reference to them. However, those skilled in the art will recognize that changes and modifications can be made to the exemplary embodiments without departing from the scope of this document.

[0102] While the principles herein have been illustrated in various embodiments, numerous modifications to the structures, arrangements, proportions, elements, materials, and components, particularly suited to specific environments and operational requirements, may be used without departing from the principles and scope of this disclosure. These modifications and other alterations or alterations will be included within the scope of this document. Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the fundamental principles of this application.

Claims

1. An LED display screen, characterized in that, include: substrate; A plurality of pixel units are disposed on the substrate, and each pixel unit includes a light-emitting chip that emits red light, blue light and green light respectively; An encapsulation layer is disposed on the substrate and covers the pixel unit; A light-transmitting layer is disposed on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and a plurality of micro-transmitting portions. The maximum width of the micro-transmitting portions is 1μm-20μm. The micro-transmitting portions are uniformly distributed in the light-transmitting main body. The light transmittance of the micro-transmitting portions is greater than that of the light-transmitting main body. The micro-transmitting portions are used to transmit light to increase brightness when the screen is on. The light-transmitting main body is made of a black semi-transparent material and is used to form a black screen when the screen is off and to transmit light when the screen is on. A transparent protective layer is disposed on the light-transmitting layer.

2. The LED display screen as described in claim 1, characterized in that, The micro-transmitting part is a micro-hole provided on the light-transmitting body; Alternatively, the micro-transmitting part is made of a transparent material, and the transparent micro-transmitting part array is distributed in the light-transmitting body.

3. The LED display screen as described in claim 2, characterized in that, Both the protective layer and the micro-transmitting part are made of transparent adhesive material, and the protective layer and the micro-transmitting part are an integral structure.

4. The LED display screen as described in claim 2, characterized in that, The micro-transmitting part is the micropore, and the protective layer covers the micropore to seal it.

5. The LED display screen as described in any one of claims 1-4, characterized in that, The light-transmitting body is a semi-transparent black polyester film with a thickness of 25μm-150μm.

6. The LED display screen according to any one of claims 1-4, characterized in that, The ratio of the total area of ​​the plurality of microtransmitters in the light-transmitting layer to the area of ​​the light-transmitting layer is 0.2-0.

4.

7. The LED display screen according to any one of claims 1-4, characterized in that, An adhesive layer is provided between the light-transmitting layer and the encapsulation layer, and the adhesive layer fixes the light-transmitting layer onto the encapsulation layer.

8. A method for manufacturing an LED display screen, characterized in that, include: Provide substrate; A plurality of pixel units are disposed on a substrate, each pixel unit comprising a light-emitting chip that emits red light, blue light and green light respectively; An encapsulation layer is disposed on the substrate so that the encapsulation layer covers the pixel unit; A light-transmitting layer and a transparent protective layer are disposed on the encapsulation layer. The light-transmitting layer includes a light-transmitting main body and multiple micro-transmitting parts. The maximum width of the micro-transmitting parts is 1μm-20μm. The micro-transmitting parts are uniformly distributed in the light-transmitting main body. The light transmittance of the micro-transmitting parts is greater than that of the light-transmitting main body. The light-transmitting main body is made of black semi-transparent material. The protective layer is disposed on the light-transmitting layer.

9. The method for manufacturing an LED display screen as described in claim 8, characterized in that, The provision of a light-transmitting layer and a transparent protective layer on the encapsulation layer includes: Semi-transparent black polyester film is available; Multiple uniformly distributed micropores are processed on the semi-transparent black polyester film to form a light-transmitting body; The light-transmitting main body is bonded to the encapsulation layer; A transparent adhesive material is applied to the light-transmitting body by pressing, spraying, or hot pressing. Part of the transparent adhesive material fills the micropores to form a protective layer on the light-transmitting body and a micro-transmitting part in the micropores.

10. The method for manufacturing an LED display screen as described in claim 8, characterized in that, The provision of a light-transmitting layer and a transparent protective layer on the encapsulation layer includes: Semi-transparent black polyester film is available; Multiple uniformly distributed micropores are processed on the semi-transparent black polyester film to form a light-transmitting layer including a light-transmitting main body and multiple micro-transmitting parts, wherein the micropores are the micro-transmitting parts; The light-transmitting layer is bonded to the encapsulation layer; A transparent adhesive is disposed on the light-transmitting layer to form a protective layer on the light-transmitting layer, which seals the micropores.

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