Light-emitting substrate, display device
Patent Information
- Application Number
- CN202510549574.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2026-10-30
AI Technical Summary
[0002]相关技术中，发光基板包括驱动背板和凸出于驱动背板的连接电极，发光芯片可以通过芯片基板转印到驱动背板上，然而由于芯片基板边沿存在下垂问题，显示区边沿的发光芯片和连接电极不易连接
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Figure CN123021857A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of display technology, and in particular to a light-emitting substrate and a display device. Background Technology
[0002] In related technologies, the light-emitting substrate includes a driving backplate and a connecting electrode protruding from the driving backplate. The light-emitting chip can be transferred onto the driving backplate through the chip substrate. However, due to the sagging problem at the edge of the chip substrate, the light-emitting chip and the connecting electrode at the edge of the display area are not easy to connect.
[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention
[0004] This disclosure first provides a light-emitting substrate, wherein the light-emitting substrate includes a display area and a non-display area located around the display area, and the light-emitting substrate includes:
[0005] Drive backplane;
[0006] A connection electrode is located in the display area;
[0007] A redundant electrode is located in the non-display area. The redundant electrode and the connecting electrode protrude from the same side of the driving back plate, and with the driving back plate as the horizontal reference plane, the height of the redundant electrode is equal to the height of the connecting electrode.
[0008] Multiple light-emitting chips are located in the display area, and the light-emitting chips are connected to the connecting electrode.
[0009] In one exemplary embodiment of this disclosure, the light-emitting substrate further includes:
[0010] A support column is located in the non-display area. The support column and the connecting electrode protrude from the same side of the drive back plate. With the drive back plate as a horizontal reference plane, the height of the support column is greater than the height of the connecting electrode.
[0011] In one exemplary embodiment of this disclosure, the support post is located on the side of the redundant electrode away from the connecting electrode.
[0012] In one exemplary embodiment of this disclosure, the light-emitting substrate further includes:
[0013] A redundant light-emitting chip, wherein the redundant light-emitting chip is connected to the redundant electrode.
[0014] In one exemplary embodiment of this disclosure, the connecting electrode includes:
[0015] Connecting main body;
[0016] A first metal layer is located on the side of the connecting body facing the light-emitting chip. The melting point of the first metal layer is lower than the melting point of the connecting body, and the melting point of the redundant electrode is higher than the melting point of the first metal layer.
[0017] In one exemplary embodiment of this disclosure, the drive backplane includes drive lines, the connecting electrode is electrically connected to the drive lines, and the redundant electrode is insulated from the drive lines.
[0018] In one exemplary embodiment of this disclosure, the distance between the connecting electrode and its nearest connecting electrode is S1, the distance between the connecting electrode and its nearest redundant electrode is S2, and |S1-S2| / S1 is less than or equal to 10%.
[0019] In one exemplary embodiment of this disclosure, the light-emitting chip is a miniature light-emitting diode.
[0020] This disclosure also provides a method for manufacturing a light-emitting substrate, wherein the light-emitting substrate includes a display area and a non-display area, and the manufacturing method includes:
[0021] Provide a drive backplane;
[0022] A connecting electrode and a redundant electrode are formed on the driving back plate. The connecting electrode is located in the display area, and the redundant electrode is located in the non-display area. The redundant electrode and the connecting electrode protrude from the same side of the driving back plate, and with the driving back plate as a horizontal reference plane, the height of the redundant electrode is equal to the height of the connecting electrode.
[0023] A chip substrate is provided, on which a light-emitting chip and redundant light-emitting chips are formed on the same side;
[0024] The chip substrate and the driving backplate are arranged opposite to each other so that the electrode portion of the light-emitting chip abuts against the connecting electrode, and the electrode portion of the redundant light-emitting chip abuts against the redundant electrode.
[0025] Connect the light-emitting chip and the connecting electrode, and then separate the light-emitting chip and the chip substrate.
[0026] This disclosure also provides a display device, wherein the display device includes the above-described light-emitting substrate.
[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0029] Figure 1 This is a schematic diagram of the structure of light-emitting chip transfer in related technologies;
[0030] Figure 2 This is a schematic diagram of the structure of a light-emitting substrate in related technologies;
[0031] Figure 3 This is a schematic diagram of the structure of the light-emitting chip transfer in the light-emitting substrate of this disclosure;
[0032] Figure 4 This is a schematic diagram of the structure of the light-emitting substrate disclosed herein;
[0033] Figure 5 This is a schematic diagram of the structure of another exemplary embodiment of the light-emitting substrate disclosed herein;
[0034] Figure 6 This is a schematic diagram of the structure for transferring light-emitting chips in a light-emitting substrate in another exemplary embodiment of this disclosure;
[0035] Figure 7 This is a schematic diagram of the structure of the light-emitting substrate in another exemplary embodiment of the present disclosure;
[0036] Figure 8 This is a schematic diagram of the structure of another exemplary embodiment of the light-emitting substrate disclosed herein;
[0037] Figure 9 This is a schematic diagram of the structure of another exemplary embodiment of the light-emitting substrate disclosed herein;
[0038] Figure 10 This is a schematic diagram of the structure of another exemplary embodiment of the light-emitting substrate disclosed herein;
[0039] Figure 11 This is a schematic diagram of another exemplary embodiment of the light-emitting substrate disclosed herein. Detailed Implementation
[0040] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.
[0041] The terms “a,” “one,” and “the” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended meaning of inclusion and that there may be other elements / components / etc. in addition to the listed elements / components / etc.
[0042] In the description of this disclosure, unless otherwise expressly specified and limited, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term “multiple” refers to two or more; and the term “and / or” includes any and all combinations of one or more associated listed items. In particular, references to “the / described” object or “a” object are also intended to indicate one of a possible plurality of such objects.
[0043] Unless otherwise specified or stated, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, an integral connection, an electrical connection, or a signal connection; "connection" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.
[0044] Furthermore, it should be understood that the directional terms such as "upper," "lower," "inner," and "outer" described in the exemplary embodiments of this disclosure are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the exemplary embodiments of this disclosure. It should also be understood that, in the context of an element or feature being connected to one or more "upper," "lower," "inner," or "outer" elements, it can be directly connected to one or more "upper," "lower," "inner," or "outer" elements, or indirectly connected to one or more "upper," "lower," "inner," or "outer" elements through intermediate elements.
[0045] like Figure 1 The diagram shown illustrates the structure of a light-emitting chip transfer process in related technologies. The light-emitting substrate includes a driving backplate 1, connecting electrodes 2, and a light-emitting chip 3. The connecting electrodes 2 are electrically connected to the driving circuitry in the driving backplate 1. The light-emitting chip 3 is connected to a chip substrate 4. By arranging the chip substrate 4 and the driving backplate opposite each other, the electrode portion of the light-emitting chip and the connecting electrode 2 are brought into contact, allowing them to be connected via bonding or other processes. However, as... Figure 1 As shown, there is a sagging problem at the edge of the chip substrate 4, which causes the light-emitting chips located around the light-emitting substrate to have a displacement component parallel to the chip substrate 4, such as... Figure 2As shown, this is a schematic diagram of the structure of the light-emitting substrate in the related technology. The displacement component of the light-emitting chip 3 parallel to the chip substrate 4 makes it difficult for the light-emitting chip located around the light-emitting substrate to be aligned and connected with the connecting electrode 2.
[0046] Based on this, this exemplary embodiment provides a method for manufacturing a light-emitting substrate and a light-emitting substrate, such as... Figure 3 , 4 As shown, Figure 3 This is a schematic diagram of the structure for transferring light-emitting chips in the light-emitting substrate disclosed herein. Figure 4 This is a schematic diagram of the structure of the light-emitting substrate disclosed herein.
[0047] The light-emitting substrate includes a display area AA and a non-display area BB. The method for manufacturing the light-emitting substrate may include:
[0048] Provide a drive backplane 1;
[0049] A connecting electrode 2 and a redundant electrode 5 are formed on the driving back plate 1. The redundant electrode 5 is located in the non-display area BB, and the connecting electrode 2 is located in the display area. The redundant electrode 5 and the connecting electrode 2 protrude from the same side of the driving back plate 1, and with the driving back plate 1 as the horizontal reference plane, the height of the redundant electrode 5 is equal to the height of the connecting electrode 2.
[0050] A chip substrate 4 is provided, on which a light-emitting chip 3 and a redundant light-emitting chip 6 are formed.
[0051] The chip substrate 4 and the driving backplate 1 are arranged opposite to each other so that the electrode part of the light-emitting chip 3 and the connecting electrode 2 abut against each other, and the electrode part of the redundant light-emitting chip 6 and the redundant electrode 5 abut against each other.
[0052] The light-emitting chip 3 and the connecting electrode 2 can be connected, for example, by bonding or other processes.
[0053] Finally, the light-emitting chip 3 and the chip substrate 4 can be separated. For example, the light-emitting chip 3 and the chip substrate 4 can be debonded by laser irradiation.
[0054] like Figure 4 As shown, the light-emitting substrate includes: a driving backplate 1, a connecting electrode 2, a redundant electrode 5, and multiple light-emitting chips 3. The connecting electrode 2 is located in the display area AA; the redundant electrode 5 is located in the non-display area BB. The redundant electrode 5 and the connecting electrode 2 protrude from the same side of the driving backplate 1, and with the driving backplate 1 as the horizontal reference plane, the height of the redundant electrode 5 is equal to the height of the connecting electrode 2; the multiple light-emitting chips 3 are located in the display area AA, and the light-emitting chips 3 are connected to the connecting electrode 2.
[0055] In this exemplary embodiment, the redundant electrode 5 and the redundant light-emitting chip 6 abut against each other. The redundant electrode 5 can support the redundant light-emitting chip 6, thereby improving the problem of poor bonding of the light-emitting chip at the edge of the display area caused by sagging around the chip substrate.
[0056] In this exemplary embodiment, as Figure 4 As shown, the connecting electrode 2 may include a connecting body 21 and a first metal layer 22. The first metal layer 22 is located on the side of the connecting body 21 facing the light-emitting chip 3. The melting point of the first metal layer 22 is lower than the melting point of the connecting body 21, and the melting point of the redundant electrode 5 is higher than the melting point of the first metal layer 22. In this exemplary embodiment, the electrode portion of the light-emitting chip 3 may include a main electrode portion 31 and a second metal layer 32. The second metal layer 32 is located on the side of the main electrode portion 31 facing the connecting electrode 2, and the melting point of the second metal layer 32 is lower than the melting point of the main electrode portion 31. The light-emitting chip 3 and the connecting electrode 2 can be connected by melting the low-melting-point first metal layer 22 and second metal layer 32. The connecting body 21 and the main electrode portion 31 may be formed of metals such as gold and copper, and the first metal layer 22 and the second metal layer 32 may be formed of metals such as tin and indium.
[0057] In this exemplary embodiment, as Figure 4 As shown, since the melting point of the redundant electrode 5 is greater than that of the first metal layer 22, when the light-emitting chip 3 and the connecting electrode 2 are connected through the low-melting-point first metal layer 22 and second metal layer 32, the redundant electrode 5 is not connected to the redundant light-emitting chip 6. Correspondingly, when the light-emitting chip 3 and the chip substrate 4 are debonded by laser, the redundant light-emitting chip 6 and the chip substrate 4 are not debonded, and the redundant light-emitting chip 6 is peeled off with the chip substrate 4. In this exemplary embodiment, in order to better avoid the connection between the redundant electrode 5 and the redundant light-emitting chip 6, a low-melting-point metal layer may not be provided on the electrode portion of the redundant light-emitting chip 6.
[0058] In this exemplary embodiment, as Figure 5The diagram shown is a schematic representation of another exemplary embodiment of the light-emitting substrate disclosed herein. The redundant electrode 5 may include a redundant body 51 and a third metal layer 52. The third metal layer 52 is located on the side of the redundant body 51 facing the redundant light-emitting chip 6, and the melting point of the third metal layer 52 is lower than the melting point of the redundant body 51. The electrode portion of the redundant light-emitting chip 6 may include a redundant electrode portion 61 and a fourth metal layer 62. The fourth metal layer 62 is located on the side of the redundant electrode portion 61 facing the redundant electrode 5, and the melting point of the fourth metal layer 62 is lower than the melting point of the redundant electrode portion 61. When the light-emitting chip 3 and the connecting electrode 2 are connected by melting the low-melting-point first metal layer 22 and the second metal layer 32, the redundant light-emitting chip 6 and the redundant electrode 5 can also be connected by melting the low-melting-point third metal layer 52 and the fourth metal layer 62. Correspondingly, when the light-emitting chip 3 and the chip substrate 4 are debonded by laser, the redundant light-emitting chip 6 and the chip substrate 4 can also be debonded.
[0059] In this exemplary embodiment, the driving backplane includes driving circuitry. The connecting electrode 2 is electrically connected to the driving circuitry, and the driving circuitry is capable of providing a voltage signal to the connecting electrode 2 to drive the light-emitting chip 3 to emit light. The redundant electrode 5 is insulated from the driving circuitry. Therefore, even if the redundant light-emitting chip 6 is connected to the redundant electrode 5, the redundant light-emitting chip 6 will not emit light.
[0060] like Figure 6 , 7 As shown, Figure 6 This is a schematic diagram of the structure for transferring light-emitting chips in a light-emitting substrate in another exemplary embodiment of this disclosure. Figure 7 This is a schematic diagram of the structure of the light-emitting substrate in another exemplary embodiment of the present disclosure. When forming redundant electrodes 5 on the driving backplate 1, a support pillar 7 can also be formed on the same side of the driving backplate 1. The material of the support pillar 7 can be inorganic or organic, and the support pillar 7 can be formed by photolithography.
[0061] like Figure 7 As shown, the support post 7 is located in the non-display area BB. The support post 7 can support the chip substrate 4. This setting can also improve the yield of bonding of the edge-pressed light-emitting chip 3 in the display area AA. The support post 7 and the connecting electrode 2 protrude and are located on the same side of the driving back plate 1. With the driving back plate 1 as the horizontal reference plane, the height of the support post 7 is greater than the height of the connecting electrode 2.
[0062] In this exemplary embodiment, under the same manufacturing process, the height of the light-emitting chips protruding on different chip substrates 4 varies due to process errors. When the light-emitting chip and the connecting electrode come into contact, the support post 7 may not actually contact the chip substrate, resulting in limited support for the chip substrate 4 from the support post 7. Compared to the support post 7, since the light-emitting chips and redundant light-emitting chips on the same chip substrate have the same protrusion height, the redundant electrode 5 provides better support for the chip substrate 4 through the redundant light-emitting chip 6. In other exemplary embodiments, the position of the support post 7 can also be replaced by the redundant electrode 5.
[0063] In this exemplary embodiment, as Figure 7 As shown, the support post 7 can be located on the side of the redundant electrode 5 away from the connecting electrode 2. Compared to the support post 7, the redundant electrode 5 provides better support. In this exemplary embodiment, the redundant electrode 5 is positioned on the side closer to the connecting electrode 2, which allows the connecting electrode 2 to achieve a sufficient support effect.
[0064] In this exemplary embodiment, as Figure 8 The diagram shown is a structural schematic of another exemplary embodiment of the light-emitting substrate of this disclosure. When the light-emitting chip 3 and the chip substrate 4 are debonded using a laser, the redundant light-emitting chip 6 and the chip substrate 4 can also be debonded. The redundant light-emitting chip 6 and the redundant electrode 5 can be connected through a low-melting-point metal layer.
[0065] In this exemplary embodiment, as Figure 3-8 As shown, at least some of the light-emitting chips 3 can emit light of different colors; for example, some light-emitting chips can emit red light, some can emit green light, and some can emit blue light. It should be understood that in other exemplary embodiments, the light-emitting chips 3 can emit light of the same color, and the light-emitting substrate can achieve color conversion through a color transfer layer.
[0066] like Figure 9The diagram shown illustrates another exemplary embodiment of the light-emitting substrate disclosed herein. The light-emitting substrate includes a color transfer layer, which comprises a black matrix layer 81. The black matrix layer 81 has openings corresponding to the light-emitting chip. A filter layer 82 and a color gamut enhancement layer 83 are formed within the openings of the black matrix layer 81. The light-emitting chip 3 can emit blue light. The filter layer 82 may include a red filter and a green filter. The red filter converts blue light to red light, and the green filter converts green light to green light. The color gamut enhancement layer 83 can be an absorption-type color filter or a distributed Bragg reflector. The thickness of the filter layer 82 can be 1-10 μm; for example, the thickness of the filter layer 82 can be equal to 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm. The thickness of the color gamut enhancement layer 83 can be 1-5 μm; for example, the thickness of the color gamut enhancement layer 83 can be equal to 1 μm, 2 μm, 3 μm, 4 μm, or 5 μm. The thickness of the black matrix layer 81 can be 2-15um. For example, the thickness of the black matrix layer 81 can be equal to 2um, 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, 11um, 12um, 13um, 14um, 15um, etc.
[0067] In this exemplary embodiment, the light-emitting chip can be a miniature light-emitting diode. For example... Figure 3-9 As shown, the light-emitting chip can be a vertical light-emitting chip. For example... Figure 10 The diagram shown is a structural schematic of another exemplary embodiment of the light-emitting substrate disclosed herein. The light-emitting chip may also be a flip-chip.
[0068] like Figure 10 As shown, the light-emitting substrate achieves color display through a color transfer layer, such as... Figure 11 The diagram shown is a structural schematic of another exemplary embodiment of the light-emitting substrate disclosed herein. The flip-chip in this light-emitting substrate can emit light of different colors, thus eliminating the need for a color transfer layer.
[0069] In this exemplary embodiment, as Figure 3-11 As shown, the distance between the connecting electrode 2 and its nearest connecting electrode 2 is S1, and the distance between the connecting electrode 2 and its nearest redundant electrode 5 is S2, where |S1-S2| / S1 is less than or equal to 10%. For example, |S1-S2| / S1 can be equal to 0%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc. In this exemplary embodiment, the distance between adjacent connecting electrodes 2 and redundant electrodes 5 is equal to or approximately equal to the distance between adjacent connecting electrodes 2, which can improve the support effect of redundant electrodes 5.
[0070] In this exemplary embodiment, the light-emitting substrate can serve as either a backlight module for an LCD display or a display panel for an LED display.
[0071] This exemplary embodiment also provides a display device, which includes the above-described light-emitting substrate. This display panel can be applied to display devices such as mobile phones, tablets, and televisions.
[0072] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.
[0073] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is defined only by the appended claims.
Claims
1. A light-emitting substrate, wherein, The light-emitting substrate includes a display area and a non-display area surrounding the display area. The light-emitting substrate includes: Drive backplane; A connection electrode is located in the display area; A redundant electrode is located in the non-display area. The redundant electrode and the connecting electrode protrude from the same side of the driving back plate, and with the driving back plate as the horizontal reference plane, the height of the redundant electrode is equal to the height of the connecting electrode. Multiple light-emitting chips are located in the display area, and the light-emitting chips are connected to the connecting electrode.
2. The light-emitting substrate according to claim 1, wherein, The light-emitting substrate further includes: A support column is located in the non-display area. The support column and the connecting electrode protrude from the same side of the drive back plate. With the drive back plate as a horizontal reference plane, the height of the support column is greater than the height of the connecting electrode.
3. The light-emitting substrate according to claim 2, wherein, The support post is located on the side of the redundant electrode away from the connecting electrode.
4. The light-emitting substrate according to claim 1, wherein, The light-emitting substrate further includes: A redundant light-emitting chip, wherein the redundant light-emitting chip is connected to the redundant electrode.
5. The light-emitting substrate according to claim 1, wherein, The connecting electrode includes: Connecting main body; A first metal layer is located on the side of the connecting body facing the light-emitting chip. The melting point of the first metal layer is lower than the melting point of the connecting body, and the melting point of the redundant electrode is higher than the melting point of the first metal layer.
6. The light-emitting substrate according to claim 1, wherein, The drive backplane includes drive circuitry, the connecting electrode is electrically connected to the drive circuitry, and the redundant electrode is insulated from the drive circuitry.
7. The light-emitting substrate according to claim 1, wherein, The distance between the connecting electrode and its nearest connecting electrode is S1, and the distance between the connecting electrode and its nearest redundant electrode is S2, where |S1-S2| / S1 is less than or equal to 10%.
8. The light-emitting substrate according to claim 1, wherein, The light-emitting chip is a miniature light-emitting diode.
9. A method for manufacturing a light-emitting substrate, wherein, The light-emitting substrate includes a display area and a non-display area, and the manufacturing method includes: Provide a drive backplane; A connecting electrode and a redundant electrode are formed on the driving back plate. The connecting electrode is located in the display area, and the redundant electrode is located in the non-display area. The redundant electrode and the connecting electrode protrude from the same side of the driving back plate, and with the driving back plate as a horizontal reference plane, the height of the redundant electrode is equal to the height of the connecting electrode. A chip substrate is provided, on which a light-emitting chip and redundant light-emitting chips are formed on the same side; The chip substrate and the driving backplate are arranged opposite to each other so that the electrode portion of the light-emitting chip abuts against the connecting electrode, and the electrode portion of the redundant light-emitting chip abuts against the redundant electrode. Connect the light-emitting chip and the connecting electrode, and then separate the light-emitting chip and the chip substrate.
10. A display device, wherein, The display device includes the light-emitting substrate according to any one of claims 1-8.