Light emitting element array substrate and method of manufacturing the same

Abstract

A light emitting element array substrate and a manufacturing method thereof, the light emitting element array substrate includes a substrate, a driving circuit structure, a first insulating pattern layer, a second insulating pattern layer, at least one light emitting element, and a light absorbing insulating pattern layer. The driving circuit structure is disposed on the substrate. The first insulating pattern layer is disposed on the driving circuit structure. The second insulating pattern layer is disposed on the first insulating pattern layer. The at least one light emitting element is disposed on the second insulating pattern layer. The light absorbing insulating pattern layer is disposed on the second insulating pattern layer. The entity of the first insulating pattern layer, the entity of the second insulating pattern layer, and the entity of the light absorbing insulating pattern layer are located in a non-light transmission area of the substrate. The second opening of the second insulating pattern layer and the third opening of the light absorbing insulating pattern layer are located in a light transmission area of the substrate. The second opening of the second insulating pattern layer is located in the first opening of the first insulating pattern layer. The third opening of the light absorbing insulating pattern layer is located on the second opening of the second insulating pattern layer.

Description

Technical Field

[0001] This invention relates to a light-emitting element array substrate and its manufacturing method. Background Technology

[0002] Among various active-matrix displays, miniature light-emitting diode displays have advantages such as local dimming, high brightness, and longer lifespan, thus becoming the main development technology for the future panel industry.

[0003] Besides the reflective nature of the driving circuitry in micro-LED displays, mass transfer technology is challenging, requiring the addition of bonding pads and repair pads on the substrate. The materials used for the driving circuitry, bonding pads, and repair pads all include metals, which have high reflectivity. Therefore, a light-absorbing insulating pattern layer is needed in the micro-LED display panel to reduce its reflectivity. Generally, a light-absorbing insulating layer is first laminated onto the driving backplane and the micro-LEDs, then thinned and patterned to form the light-absorbing insulating pattern layer. However, the thickness of the light-absorbing insulating layer varies significantly across different areas, requiring multiple processes to pattern the desired pattern, making the manufacturing process for LED displays complex. Summary of the Invention

[0004] This invention provides a light-emitting element array substrate with excellent performance.

[0005] This invention provides a method for manufacturing a light-emitting element array substrate, which is simple in process.

[0006] The light-emitting element array substrate of the present invention includes a substrate, a driving circuit structure, a first insulating pattern layer, a second insulating pattern layer, at least one light-emitting element, and a light-absorbing insulating pattern layer. The substrate has a light-transmitting region and a non-light-transmitting region outside the light-transmitting region. The driving circuit structure is disposed on the non-light-transmitting region of the substrate. The first insulating pattern layer is disposed on the driving circuit structure. The second insulating pattern layer is disposed on the first insulating pattern layer. At least one light-emitting element is disposed on the second insulating pattern layer, located in the non-light-transmitting region of the substrate, and electrically connected to the driving circuit structure. The light-absorbing insulating pattern layer is disposed on the second insulating pattern layer. At least one light-emitting element is disposed in at least one recess of the light-absorbing insulating pattern layer. The solids of the first insulating pattern layer, the solids of the second insulating pattern layer, and the solids of the light-absorbing insulating pattern layer are located in the non-light-transmitting region of the substrate. A second opening of the second insulating pattern layer and a third opening of the light-absorbing insulating pattern layer are located in the light-transmitting region of the substrate. The second opening of the second insulating pattern layer is located within a first opening of the first insulating pattern layer. The third opening of the light-absorbing insulating pattern layer is located on the second opening of the second insulating pattern layer.

[0007] The method for manufacturing a light-emitting element array substrate of the present invention includes the following steps: providing a driving backplate, wherein the driving backplate includes a substrate, a driving circuit structure, a planarization layer, a first insulating pattern layer, and an insulating material layer, the driving circuit structure is disposed on the substrate, the planarization layer is disposed on the driving circuit structure, the first insulating pattern layer is disposed on the planarization layer and has a first opening, and the insulating material layer is disposed on the first insulating pattern layer and fills the first opening; bonding at least one light-emitting element to the driving backplate, so that at least one light-emitting element is electrically connected to the driving circuit structure; forming a light-absorbing insulating material layer on the driving backplate to cover the driving backplate and at least one light-emitting element; heating the driving backplate to cure the light-absorbing insulating material layer, wherein while heating the driving backplate, the planarization layer is also cured. The moisture in the insulating layer is converted into water vapor and enters the insulating material layer and the light-absorbing insulating material layer, causing deformation of the insulating material layer and the light-absorbing insulating material layer. After the insulating material layer and the light-absorbing insulating material layer have been deformed, the light-absorbing insulating material layer and the insulating material layer are patterned and the light-absorbing insulating material layer is thinned so that the light-absorbing insulating material layer forms a light-absorbing insulating pattern layer and the insulating material layer forms a second insulating pattern layer. The light-absorbing insulating pattern layer exposes at least one light-emitting surface of at least one light-emitting element. The second insulating pattern layer has a second opening and the light-absorbing insulating pattern layer has a third opening. The second opening of the second insulating pattern layer is located inside the first opening of the first insulating pattern layer, and the third opening of the light-absorbing insulating pattern layer is located on the second opening of the second insulating pattern layer. Attached Figure Description

[0008] Figures 1A-1G This is a cross-sectional schematic diagram of a method for manufacturing a light-emitting element array substrate according to an embodiment of the present invention.

[0009] Figures 2A-2F This is a cross-sectional schematic diagram of a partial manufacturing method of a light-emitting element array substrate according to another embodiment of the present invention.

[0010] Explanation of reference numerals in the attached figures: 10, 10A: Light-emitting element array substrate 110: Substrate 110a: Translucent area 110b: Non-transparent area 120: Drive circuit structure 130: Flattening layer 130s, 142s: Sidewall 140: First insulating pattern layer 140a, 150a, 170a: Entities 142: First Opening 150: Second insulating pattern layer 150': Insulating material layer 152: Second opening 160: Light-emitting element 162: Luminous surface 170: Light-absorbing insulating pattern layer 170': Light-absorbing insulating material layer 172: The Third Opening 174: Depression 180: Transparent encapsulation layer BP': Drive backplane R: Local T 130 T 140 T 150 : Film thickness W': Moisture W: Water vapor Detailed Implementation

[0011] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0012] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate element is present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may involve the presence of other elements between the two elements.

[0013] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.

[0014] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant technology and the invention, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined herein.

[0015] Figures 1A-1G This is a cross-sectional schematic diagram of a method for manufacturing a light-emitting element array substrate 10 according to an embodiment of the present invention.

[0016] Please refer to Figure 1A First, a drive backplane BP' is provided. The drive backplane BP' includes a substrate 110, a drive circuit structure 120, a planarization layer 130, a first insulating pattern layer 140, and an insulating material layer 150'. The drive circuit structure 120 is disposed on the substrate 110. The planarization layer 130 is disposed on the drive circuit structure 120. The first insulating pattern layer 140 is disposed on the planarization layer 130 and has a first opening 142. The insulating material layer 150' is disposed on the first insulating pattern layer 140 and fills the first opening 142.

[0017] In some embodiments, the substrate 110 may be made of glass, quartz, organic polymer, or opaque / reflective material (e.g., wafer, ceramic, or other suitable material), or other suitable material.

[0018] In some embodiments, the planarization layer 130 may be made of an organic material that readily absorbs moisture W'. However, the invention is not limited thereto, and in other embodiments, the planarization layer 130 may also be made of an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, etc.) or a stacked layer of inorganic and organic materials.

[0019] In some embodiments, the materials of the first insulating pattern layer 140 and the insulating material layer 150' are, for example, inorganic materials (e.g., silicon oxide, silicon nitride, silicon oxynitride, etc.). However, the present invention is not limited thereto, and in other embodiments, the materials of the first insulating pattern layer 140 and the insulating material layer 150' may also be organic materials, or a stacked layer of organic and inorganic materials.

[0020] Please refer to Figure 1ANext, at least one light-emitting element 160 is connected to the driving backplane BP', so that at least one light-emitting element 160 is electrically connected to the driving circuit structure 120. For example, in some embodiments, the driving circuit structure 120 may include a plurality of sub-pixel driving circuits (not shown), each sub-pixel driving circuit may include a first transistor (not shown), a second transistor (not shown), and a capacitor (not shown). The first terminal of the first transistor is electrically connected to a corresponding data line (not shown), the control terminal of the first transistor is electrically connected to a corresponding scan line (not shown), the second terminal of the first transistor is electrically connected to the control terminal of the second transistor, the first terminal of the second transistor is electrically connected to a corresponding power line (not shown), the capacitor is electrically connected to the second terminal of the first transistor and the first terminal of the second transistor, the first electrode of the light-emitting element 160 is electrically connected to the second terminal of the second transistor, and the second electrode of the light-emitting element 160 is electrically connected to a corresponding common line, but the present invention is not limited thereto. In some embodiments, the light-emitting element 160 is, for example, a miniature light-emitting diode, but the present invention is not limited thereto.

[0021] Please refer to Figure 1B Next, a light-absorbing insulating material layer 170' is formed on the driving backplate BP' to cover the driving backplate BP' and the light-emitting element 160. Please refer to... Figure 1C and Figure 1D Next, the backplate BP' is heated to cure the light-absorbing insulating material layer 170'. While the backplate BP' is being heated, the moisture W' in the planarization layer 130 is converted into water vapor W and enters the insulating material layer 150' and the light-absorbing insulating material layer 170', causing deformation of the insulating material layer 150' and the light-absorbing insulating material layer 170'.

[0022] Please refer to Figure 1D , Figure 1E and Figure 1F After the light-absorbing insulating material layer 170' and the insulating material layer 150' have been deformed, the light-absorbing insulating material layer 170' and the insulating material layer 150' are then patterned and the light-absorbing insulating material layer 170' is thinned so that the light-absorbing insulating material layer 170' forms a light-absorbing insulating pattern layer 170, and the insulating material layer 150' forms a second insulating pattern layer 150. The light-absorbing insulating pattern layer 170 exposes the light-emitting surface 162 of the light-emitting element 160. The second insulating pattern layer 150 has a second opening 152, and the light-absorbing insulating pattern layer 170 has a third opening 172. The second opening 152 of the second insulating pattern layer 150 is located inside the first opening 142 of the first insulating pattern layer 140, and the third opening 172 of the light-absorbing insulating pattern layer 170 is located on the second opening 152 of the second insulating pattern layer 150.

[0023] Please refer to Figures 1C-1FSpecifically, in some embodiments, the planarization layer 130 contains moisture W'. When the backplate BP' is heated to cure the light-absorbing insulating material layer 170', the moisture W' in the planarization layer 130 transforms into water vapor W. The significantly increased volume of water vapor W exerts pressure on the stack of the upper first insulating pattern layer 140 and insulating material layer 150'. A portion of the stack of the first insulating pattern layer 140 and insulating material layer 150' in the first opening 142 has a thinner film thickness. The water vapor W causes this thinner portion to rupture and enter the light-absorbing insulating material layer 170', forming bubbles B. Bubbles B cause a thinner portion of the light-absorbing insulating material layer 170' above the first opening 142. After patterning and thinning the light-absorbing insulating material layer 170', a light-absorbing insulating pattern layer 170 is formed, defining the light-transmitting area 110a.

[0024] Please refer to Figure 1G Next, a transparent encapsulation layer 180 is formed on the light-absorbing insulating pattern layer 170, the light-emitting element 160, and the light-transmitting area 110a, thereby completing the light-emitting element array substrate 10 of this embodiment. In some embodiments, the transparent encapsulation layer 180 may fill the third opening 172 and the second opening 152 to prevent the light-emitting element array substrate 10 from failing in reliability testing.

[0025] Please refer to Figure 1GThe light-emitting element array substrate 10 includes a substrate 110, a driving circuit structure 120, a first insulating pattern layer 140, a second insulating pattern layer 150, at least one light-emitting element 160, and a light-absorbing insulating pattern layer 170. The substrate 110 has a light-transmitting region 110a and a non-light-transmitting region 110b outside the light-transmitting region 110a. The driving circuit structure 120 is disposed on the non-light-transmitting region 110b of the substrate 110. Specifically, the opaque portion of the driving circuit structure 120 is located on the non-light-transmitting region 110b of the substrate 110, while the light-transmitting region 110a of the substrate 110 has a light-transmitting portion of the driving circuit structure 120. The first insulating pattern layer 140 is disposed on the driving circuit structure 120. The second insulating pattern layer 150 is disposed on the first insulating pattern layer 140. At least one light-emitting element 160 is disposed on the second insulating pattern layer 150, located in the non-light-transmitting region 110b of the substrate 110, and electrically connected to the driving circuit structure 120. A light-absorbing insulating pattern layer 170 is disposed on a second insulating pattern layer 150. At least one light-emitting element 160 is disposed in at least one recess 174 of the light-absorbing insulating pattern layer 170. The solid 140a of the first insulating pattern layer 140, the solid 150a of the second insulating pattern layer 150, and the solid 170a of the light-absorbing insulating pattern layer 170 are located in the non-transparent area 110b of the substrate 110. The second opening 152 of the second insulating pattern layer 150 and the third opening 172 of the light-absorbing insulating pattern layer 170 are located in the transparent area 110a of the substrate 110. The second opening 152 of the second insulating pattern layer 150 is located within the first opening 142 of the first insulating pattern layer 140, and the third opening 172 of the light-absorbing insulating pattern layer 170 is located on the second opening 152 of the second insulating pattern layer 150.

[0026] Please refer to Figure 1G The second opening 152 of the second insulating pattern layer 150 is located within the first opening 142 of the first insulating pattern layer 140. In some embodiments, the shape of the first opening 142 of the first insulating pattern layer 140 may be different from the shape of the second opening 152 of the second insulating pattern layer 150. In some embodiments, the first insulating pattern layer 140 has a sidewall 142s defining the first opening 142, and a portion of the solid 150a of the second insulating pattern layer 150 covers at least a portion of the sidewall 142s of the first insulating pattern layer 140.

[0027] The light-emitting element array substrate 10 further includes a planarization layer 130 disposed between the first insulating pattern layer 140 and the substrate 110. A portion of the solid 150a of the second insulating pattern layer 150 is located in the first opening 142 of the first insulating pattern layer 140 and contacts the planarization layer 130. In some embodiments, the third opening 172 of the light-absorbing insulating pattern layer 170 is substantially flush with the second opening 152 of the second insulating pattern layer 150.

[0028] In some embodiments, the film thickness T of the first insulating pattern layer 140 140 Film thickness T greater than or equal to 150 mm of the second insulating pattern layer 150 In some embodiments, the film thickness T of the planarization layer 130 130 Film thickness T greater than or equal to 150 mm of the second insulating pattern layer 150 Ten times that.

[0029] In some embodiments, the light-emitting element array substrate 10 further includes a transparent encapsulation layer 180, which covers the light-absorbing insulating pattern layer 170 and the light-emitting element 160 and fills the second opening 152 and the third opening 172 to contact the planarization layer 130.

[0030] It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals used to represent the same or similar components, and descriptions of the same technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0031] Figures 2A-2F This is a cross-sectional schematic diagram of a method for manufacturing a portion R of a light-emitting element array substrate 10A according to another embodiment of the present invention. Figures 2A-2F The manufacturing method of the light-emitting element array substrate 10A shown is similar to Figures 1A-1G The manufacturing methods of the light-emitting element array substrate 10 shown are similar, the difference being: in Figures 2A-2F In one embodiment, the first insulating pattern layer 140 has a sidewall 142s defining a first opening 142, and the sidewall 142s of the first insulating pattern layer 140 surrounds a sidewall 130s of the planarization layer 130.

Claims

1. A light-emitting element array substrate, comprising: A substrate having a light-transmitting area and a non-light-transmitting area outside the light-transmitting area; A driving circuit structure is disposed on the non-transparent area of ​​the substrate; A first insulating pattern layer is disposed on the drive circuit structure and has a first opening; A second insulating pattern layer is disposed on the first insulating pattern layer; At least one light-emitting element is disposed on the second insulating pattern layer, located in the non-transparent area of ​​the substrate, and electrically connected to the driving circuit structure; as well as A light-absorbing insulating pattern layer is disposed on the second insulating pattern layer, wherein the at least one light-emitting element is disposed in at least one recess of the light-absorbing insulating pattern layer; Wherein, a solid of the first insulating pattern layer, a solid of the second insulating pattern layer, and a solid of the light-absorbing insulating pattern layer are located in the non-transparent area of ​​the substrate; Wherein, a second opening of the second insulating pattern layer and a third opening of the light-absorbing insulating pattern layer are located in the light-transmitting area of ​​the substrate, the second opening of the second insulating pattern layer is located inside the first opening of the first insulating pattern layer, and the third opening of the light-absorbing insulating pattern layer is located on the second opening of the second insulating pattern layer.

2. The light-emitting element array substrate as claimed in claim 1, wherein, in a top view of the light-emitting element array substrate, the second opening of the second insulating pattern layer is located within the first opening of the first insulating pattern layer.

3. The light-emitting element array substrate as claimed in claim 1, wherein the shape of the first opening in the first insulating pattern layer is different from the shape of the second opening in the second insulating pattern layer.

4. The light-emitting element array substrate of claim 1, wherein the first insulating pattern layer has a sidewall defining the first opening, and a portion of the solid of the second insulating pattern layer covers at least a portion of the sidewall of the first insulating pattern layer.

5. The light-emitting element array substrate as described in claim 1, further comprising: A planarization layer is disposed between the first insulating pattern layer and the substrate; In this case, a portion of the entity of the second insulating pattern layer is located in the first opening of the first insulating pattern layer and contacts the flat layer.

6. The light-emitting element array substrate of claim 1, wherein the third opening of the light-absorbing insulating pattern layer is substantially flush with the second opening of the second insulating pattern layer.

7. The light-emitting element array substrate as claimed in claim 1, wherein the thickness of the first insulating pattern layer is greater than or equal to the thickness of the second insulating pattern layer.

8. The light-emitting element array substrate as described in claim 1, further comprising: A planarization layer is disposed between the first insulating pattern layer and the substrate; The thickness of one layer of the planarization layer is greater than or equal to ten times the thickness of one layer of the second insulating pattern layer.

9. The light-emitting element array substrate as described in claim 1, further comprising: A planarization layer is disposed between the first insulating pattern layer and the substrate; The first insulating pattern layer has a sidewall that defines the first opening, and the sidewall of the first insulating pattern layer surrounds a sidewall of the flat layer.

10. A method for manufacturing a light-emitting element array substrate, comprising: A drive backplane is provided, wherein the drive backplane includes a substrate, a drive circuit structure, a planarization layer, a first insulating pattern layer and an insulating material layer, the drive circuit structure is disposed on the substrate, the planarization layer is disposed on the drive circuit structure, the first insulating pattern layer is disposed on the planarization layer and has a first opening, and the insulating material layer is disposed on the first insulating pattern layer and fills the first opening. At least one light-emitting element is joined to the driving backplate so that the at least one light-emitting element is electrically connected to the driving circuit structure; A light-absorbing insulating material layer is formed on the drive backplate to cover the drive backplate and the at least one light-emitting element; The drive backplate is heated to solidify the light-absorbing insulating material layer. While the drive backplate is being heated, a moisture in the planarization layer is converted into water vapor and enters the insulating material layer and the light-absorbing insulating material layer, causing deformation of the insulating material layer and the light-absorbing insulating material layer. as well as After the insulating material layer and the light-absorbing insulating material layer have been deformed, the light-absorbing insulating material layer and the insulating material layer are patterned and the light-absorbing insulating material layer is thinned to form a light-absorbing insulating pattern layer and a second insulating pattern layer, wherein the light-absorbing insulating pattern layer exposes at least one light-emitting surface of the at least one light-emitting element, the second insulating pattern layer has a second opening, the light-absorbing insulating pattern layer has a third opening, the second opening of the second insulating pattern layer is located inside the first opening of the first insulating pattern layer, and the third opening of the light-absorbing insulating pattern layer is located on the second opening of the second insulating pattern layer.

11. The method of manufacturing a light-emitting element array substrate as claimed in claim 10, wherein, in a top view of the light-emitting element array substrate, the second opening of the second insulating pattern layer is located within the first opening of the first insulating pattern layer.

12. The method of manufacturing a light-emitting element array substrate as claimed in claim 10, wherein, in a top view of the light-emitting element array substrate, the shape of the first opening of the first insulating pattern layer is different from the shape of the second opening of the second insulating pattern layer.

13. The method of manufacturing a light-emitting element array substrate as claimed in claim 10, wherein the first insulating pattern layer has a sidewall defining the first opening, and a portion of a solid of the second insulating pattern layer covers at least a portion of the sidewall of the first insulating pattern layer.

14. The method of manufacturing a light-emitting element array substrate as claimed in claim 10, wherein a portion of a solid of the second insulating pattern layer is located in the first opening of the first insulating pattern layer and contacts the planarization layer.

15. The method of manufacturing a light-emitting element array substrate as claimed in claim 10, wherein the third opening of the light-absorbing insulating pattern layer is substantially flush with the second opening of the second insulating pattern layer.

16. The method for manufacturing a light-emitting element array substrate as claimed in claim 10, wherein the thickness of the first insulating pattern layer is greater than or equal to the thickness of the second insulating pattern layer.

17. The method for manufacturing a light-emitting element array substrate as claimed in claim 10, wherein the thickness of a film of the planarization layer is greater than or equal to ten times the thickness of a film of the second insulating layer.

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