Light emitting element package structure, display panel and preparation method thereof

Abstract

The application relates to a light-emitting element packaging structure, a display panel and a preparation method thereof. The light-emitting element packaging structure comprises a substrate for supporting and connecting various elements inside the display panel, wherein the substrate comprises a driving circuit layer; a raised connector arranged on a bearing surface of the substrate; a light-emitting element connected with the raised connector, wherein the light-emitting element comprises a light-emitting body and an electrode, and the electrode is connected with the driving circuit layer through the raised connector; and a light-blocking layer coated on the bearing surface of the substrate, wherein the light-blocking layer wraps the raised connector and the electrode, and the height of the upper surface of the light-blocking layer is less than or equal to the height of the lower surface of the light-emitting body. The application can avoid welding defects and light efficiency loss caused by uneven surfaces, and can reduce or even avoid the covering of a black film on the sidewall and surface of the light-emitting element during the coating process, thereby solving the light loss problem caused by the black film.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting element packaging structure, a display panel, and a method for manufacturing the same. Background Technology

[0002] With the continuous advancement of display technology, LED full-color displays have been widely used in various settings, including command centers, outdoor advertising screens, and conference centers, becoming an important tool for information display. Micro LED technology, in particular, is gradually becoming the future development direction of the display industry due to its advantages such as self-emissiveness, ultra-thinness, and low power consumption. As a miniaturized LED display technology, Micro LED allows each pixel to emit light independently, possessing characteristics such as high brightness, wide viewing angle, high contrast, and fast response, providing excellent display effects in various environments. To improve the blackening effect of Micro LED, reduce light leakage, and enhance contrast, many manufacturers have begun to develop blackening solutions for Micro LED displays, especially black film lamination technology.

[0003] In related technologies, a black film is typically applied to the surface of the LED chip to block light leakage and improve display contrast and color purity. The black film's function is to block background light and enhance black levels, significantly improving visual effects, especially in high-brightness, high dynamic range (HDR) display applications. To accommodate the small size and high density characteristics of Micro LEDs, the black film application technology must ensure the uniformity and precision of the film thickness.

[0004] However, in the aforementioned technologies, the black film coating process struggles to precisely control the film thickness. Due to the thinness of Micro LEDs, existing processes cannot achieve a sufficiently thin black film; an excessively thick film layer would negatively impact the LED's luminous efficacy and display brightness. Furthermore, air bubbles or uneven film layers may form during the black film application process, leading to unstable display performance. Summary of the Invention

[0005] Therefore, it is necessary to address the aforementioned technical issues by providing a light-emitting element packaging structure, display panel, and its fabrication method that can prevent excessively thick black film layers from affecting LED luminous efficacy and display brightness during the splicing process.

[0006] In a first aspect, this application provides a light-emitting element packaging structure, including:

[0007] A substrate is used to support and connect the various components inside the display panel. The substrate includes a driving circuit layer.

[0008] Elevating connectors are placed on the bearing surface of the substrate;

[0009] A light-emitting element is connected to a raised connector. The light-emitting element includes a light-emitting body and an electrode. The electrode is connected to the driving circuit layer through the raised connector.

[0010] A light-shielding layer is applied to the substrate's bearing surface and covers and elevates the connectors and electrodes. The height of the upper surface of the light-shielding layer is less than or equal to the height of the lower surface of the light-emitting body.

[0011] In one embodiment, the raised connector includes a raised insulating layer, the raised insulating layer having a connection through hole, and the connection through hole being filled with conductive metal.

[0012] Each electrode of the light-emitting element is connected to a conductive metal in a connecting via.

[0013] In one embodiment, the cross-sectional dimension of the shim connector is greater than or equal to the cross-sectional dimension of the light-emitting element, and the thickness of the shim connector is set to 8-10 μm.

[0014] In one embodiment, a light-emitting element is connected to a shim connector, the shim connector having two connection through holes, the distance between the two connection through holes being the same as the distance between the two electrodes in the light-emitting element.

[0015] In one embodiment, a light-emitting element is connected to two raised connectors, one of which has a connecting through hole, and a gap is provided between the two raised connectors.

[0016] In one embodiment, each electrode of the light-emitting element is provided with a solder layer, which is connected to the conductive metal by welding.

[0017] In one embodiment, the substrate further includes:

[0018] The substrate layer is used to support and connect the various components inside the display panel, and the driving circuit layer is placed on the surface of the substrate layer;

[0019] A substrate insulating layer is disposed on the surface of the driving circuit layer to protect the driving circuit layer and enhance its anti-interference performance. The substrate insulating layer is provided with connectors.

[0020] The conductive layer is disposed on the surface of the insulating layer of the substrate and is used to conduct current and provide a signal transmission path. The conductive layer is connected to the driving circuit layer through connectors.

[0021] In one embodiment, the light-emitting element packaging structure further includes a packaging layer, which is coated on the surface of the light-shielding layer and encapsulates the light-emitting body.

[0022] Secondly, this application also provides a display panel, including the light-emitting element encapsulation structure as described in any of the above.

[0023] Thirdly, this application also provides a method for manufacturing a display panel, applicable to the display panel as described above, comprising:

[0024] A substrate, a light-emitting element, and a shim connector are provided; wherein, a solder layer is provided on the electrodes of the light-emitting element, and a conductive metal is provided in the connection through hole of the shim connector;

[0025] The solder layer of the light-emitting element is bonded to the conductive metal of the shim connector to obtain the shim-raised light-emitting element;

[0026] After being raised, the light-emitting element is transferred to the substrate, and an electrical connection is formed between the raised light-emitting element and the substrate.

[0027] A light-shielding layer is applied to the side of the substrate connected to the raised light-emitting element and then encapsulated.

[0028] The aforementioned light-emitting element packaging structure, display panel, and manufacturing method, by providing a raised connector at the bottom of the light-emitting element, ensures that the spacing between all light-emitting elements and the upper surface of the substrate is the same, avoiding poor welding and light efficiency loss caused by uneven surfaces. This ensures the uniformity and consistency of the entire display panel surface. Furthermore, the raised connector increases the spacing between the light-emitting body of the light-emitting element and the substrate, reducing or even eliminating the black film covering the sidewalls and surface of the light-emitting element during the coating process, thus solving the light loss problem caused by the black film. At the same time, the raised connector also ensures good contact in the welding area, reducing component deformation or damage caused by high temperature and pressure changes during welding, thereby improving welding quality and reliable connection between components. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the light-emitting element packaging structure provided in one embodiment of this application;

[0031] Figure 2 for Figure 1 Enlarged schematic diagram of the packaging structure of the light-emitting element inside the A-ring;

[0032] Figure 3 This is a schematic diagram of the light-emitting element packaging structure provided in another embodiment of this application;

[0033] Figure 4 for Figure 3 Enlarged schematic diagram of the packaging structure of the light-emitting element within the B-ring;

[0034] Figure 5 This is a schematic flowchart of a display panel fabrication method provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 10-Substrate, 20-Elevation connector, 30-Light-emitting element, 40-Light-shielding layer;

[0037] 210 - Elevated insulation layer; 220 - Conductive metal;

[0038] 310 - Light-emitting body, 320 - Electrode, 330 - Solder layer. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] In some embodiments, a light-emitting element packaging structure is provided, which includes a substrate 10, a riser connector 20, a light-emitting element 30, and a light-shielding layer 40. The light-emitting element 30 is connected and fixed to the riser connector 20, and the riser connector 20 is connected to the substrate 10. After the light-emitting element 30 connected to the riser connector 20 is transferred to the substrate 10, and the light-emitting element 30 forms an electrical connection with the substrate 10 through the riser connector 20, the light-shielding layer 40 is applied to the side of the substrate 10 where the light-emitting element 30 is connected.

[0046] The substrate 10 includes a driving circuit layer, and the light-emitting element 30 includes a light-emitting body 310 and an electrode 320. The electrode 320 of the light-emitting element 30 is connected to the riser connector 20, and the electrode 320 is electrically connected to the driving circuit layer of the substrate 10 through the riser connector 20. The height of the upper surface of the light-shielding layer 40 is less than or equal to the height of the lower surface of the light-emitting body 310, and the light-shielding layer 40 is coated with a black coating, i.e., a black film. Furthermore, the light-emitting element encapsulation structure also includes an encapsulation layer, which is coated on the surface of the light-shielding layer 40 and encapsulates the light-emitting body 310.

[0047] The substrate 10 is a TFT (Thin Film Transistor) glass substrate 10, which is a glass substrate 10 containing TFT driving design circuitry layers. This substrate 10 not only provides physical support for the display panel but also serves as an electrical connection and signal transmission mechanism. The metal layer and conductive film of the TFT glass substrate 10 transmit electrical signals (such as voltage or current) from the display panel controller to the TFT unit of each pixel. Through these electrical signals, the TFT transistors control the on / off state of each pixel of the liquid crystal display, thereby displaying images or text. The thin film transistors on the TFT glass substrate 10 act as "switches." Each transistor controls one or more pixels. When a signal passes through, the transistor turns on, allowing current to flow, thereby activating the liquid crystal or LED material and changing its optical properties. When the transistor turns off, the current is cut off, and the display state remains unchanged. This electrical control method ensures that each pixel can display accurately according to the input signal.

[0048] In the above-mentioned light-emitting element packaging structure, by providing a raised connector 20 at the bottom of the light-emitting element 30, the spacing between all light-emitting elements 30 and the upper surface of the substrate 10 can be made the same, avoiding poor welding and light efficiency loss caused by uneven surface, thereby ensuring the uniformity and consistency of the entire display panel surface. In addition, the raised connector 20 also increases the spacing between the light-emitting body 310 of the light-emitting element 30 and the substrate 10, reducing or even avoiding the black film covering the sidewalls and surface of the light-emitting element 30 during the coating process, solving the light loss problem caused by the black film. At the same time, the raised connector 20 also ensures good contact in the welding area, reducing component deformation or damage caused by high temperature and pressure changes during the welding process, thereby improving welding quality and reliable connection between components.

[0049] In some embodiments, see Figure 1 and Figure 3 , Figure 1 This paper shows a schematic diagram of a light-emitting element packaging structure according to an embodiment of the present application. Figure 3A schematic diagram of a light-emitting element packaging structure according to another embodiment of this application is shown. In this light-emitting element packaging structure, the raised connector 20 includes a raised insulating layer 210, the raised insulating layer 210 has a connection through hole, and the connection through hole is filled with conductive metal 220. Each electrode 320 of the light-emitting element 30 is connected to a conductive metal 220 in a connection through hole.

[0050] The raised insulating layer 210 can be made of inorganic materials such as silicon oxide or silicon nitride, thereby ensuring the reliability and stability of the electrical connection and preventing short circuits between different electrical layers. During the fabrication of the raised insulating layer 210, through-holes, i.e., connection through-holes, need to be etched at the pad locations.

[0051] See Figure 2 and Figure 4 , Figure 2 This application shows Figure 1 An enlarged schematic diagram of the packaging structure of the light-emitting element within the A-ring. Figure 4 This application shows Figure 3 This is an enlarged schematic diagram of the light-emitting element (LED) package structure within the B-ring. The size of the raised insulating layer 210 is typically the same as or slightly larger than the size of the LED (LED) to ensure full coverage of the LED area and provide necessary electrical isolation. The conductive metal 220 can be made of materials such as copper or aluminum. The conductive metal 220 is filled into the connection vias to form a stable electrical connection. This ensures not only smooth current flow but also a strong bond with the LED 30, achieving a reliable connection. The thickness of the raised insulating layer 210 is typically 8 to 10 micrometers, effectively preventing electrical short circuits and ensuring the filling quality and stability of the conductive metal 220 within the vias.

[0052] Continue reading Figures 1 to 4 Each electrode 320 of the light-emitting element 30 is provided with a solder layer 330. The conductive metal 220 in the riser connector 20 is connected to the solder layer 330 of the electrode 320 by welding. The solder layer 330 is mainly used to realize the connection between the electrode 320 and the conductive metal 220, ensuring that the current can be smoothly transmitted to the light-emitting element 30, thereby realizing its light-emitting function.

[0053] Continue reading Figure 1 and Figure 3Each light-emitting element 30 is connected to a shim connector 20. The shim connector 20 has two through-holes, the spacing of which is the same as the spacing between the two electrodes 320 in the light-emitting element 30. That is, each through-hole in the shim connector 20 corresponds to one electrode 320. The dimensions and positions of the shim connector 20 and the through-holes need to be designed with great precision to ensure that the solder layer 330 can fully fill the through-holes during the soldering process, forming a strong electrical connection.

[0054] Continue reading Figure 2 and Figure 4 One light-emitting element 30 is connected to two raised connectors 20. One raised connector 20 has a connecting through hole. There is a gap between the two raised connectors 20, that is, a raised connector 20 is provided under each electrode 320. The raised connector 20 is welded and fixed to the electrode 320, which ensures the precise matching of the electrode 320 and the raised connector 20. This ensures that each electrode 320 has a raised connector 20 for support and ensures the precise alignment between the electrode 320 and the welding point, avoiding electrical faults caused by poor welding.

[0055] In some embodiments, the substrate 10 further includes a substrate layer, a substrate insulating layer, and a conductive layer. The substrate layer of the substrate 10 serves a supporting function, carrying and connecting the internal components of the display panel. The driving circuit layer is disposed on the surface of the substrate layer, and it is responsible for controlling and driving each pixel in the display panel, enabling it to display according to the input signal. The substrate 10 is also provided with a substrate insulating layer, which not only effectively protects the driving circuit from external interference, but also enhances the anti-interference capability of the overall circuit. Connectors are disposed on the substrate insulating layer to realize the connection and signal transmission between different circuit layers, ensuring signal stability and accuracy. A conductive layer is disposed on the outermost layer of the substrate 10. The main function of the conductive layer is to conduct current and provide a signal transmission path. It forms an electrical connection with the driving circuit layer through connection with the connectors, thereby realizing signal transmission.

[0056] In one exemplary embodiment, a light-emitting element packaging structure is provided. This packaging structure includes a substrate 10, a riser connector 20, a light-emitting element 30, a light-shielding layer 40, and a packaging layer. The light-emitting element 30 is connected and fixed to the riser connector 20, which is connected to the substrate 10. After the light-emitting element 30, connected to the riser connector 20, is transferred to the substrate 10 and an electrical connection is formed between the light-emitting element 30 and the substrate 10 via the riser connector 20, the light-shielding layer 40 is applied to the side of the substrate 10 where the light-emitting element 30 is connected, and the packaging layer then encapsulates the light-emitting element 30. The light-shielding layer 40 is a black coating, i.e., a black film.

[0057] The substrate 10 includes a driving circuit layer, a substrate layer, a substrate insulating layer, and a conductive layer. The substrate layer provides support, carrying and connecting the internal components of the display panel. The driving circuit layer, located on the surface of the substrate layer, controls and drives each pixel in the display panel, enabling it to display based on input signals. The substrate 10 also has a substrate insulating layer, which effectively protects the driving circuit from external interference and enhances the overall circuit's anti-interference capability. Connectors are provided on the substrate insulating layer to facilitate connections and signal transmission between different circuit layers, ensuring signal stability and accuracy. A conductive layer is located on the outermost layer of the substrate 10. The main function of the conductive layer is to conduct current and provide a signal transmission path. It connects to the driving circuit layer via connectors, thereby enabling signal transmission.

[0058] The light-emitting element 30 includes a light-emitting body 310 and electrodes 320. The electrodes 320 of the light-emitting element 30 are connected to the riser connector 20, and the electrodes 320 are electrically connected to the driving circuit layer of the substrate 10 through the riser connector 20. The height of the upper surface of the light-shielding layer 40 is less than or equal to the height of the lower surface of the light-emitting body 310. An encapsulation layer is coated on the surface of the light-shielding layer 40 and encapsulates the light-emitting body 310. Each electrode 320 of the light-emitting element 30 is provided with a solder layer 330, and the solder layer 330 is connected to the riser connector 20 by soldering.

[0059] The raised connector 20 includes a raised insulating layer 210 with connecting through-holes filled with conductive metal 220. Each electrode 320 of the light-emitting element 30 is connected to a conductive metal 220 within a connecting through-hole, and the conductive metal 220 is soldered to the solder layer 330. The raised insulating layer 210 can be made of inorganic materials such as silicon oxide or silicon nitride, thereby ensuring the reliability and stability of the electrical connection and preventing short circuits between different electrical layers. During the fabrication of the raised insulating layer 210, through-holes, i.e., connecting through-holes, need to be etched at the pad locations. The dimensions of the raised insulating layer 210 are typically the same as or slightly larger than the dimensions of the light-emitting element 30 (LED), and the thickness of the raised insulating layer 210 is typically 8 to 10 micrometers.

[0060] A raised connector 20 is connected to a light-emitting element 30. The raised connector 20 has two connecting through holes. The distance between the two connecting through holes is the same as the distance between the two electrodes 320 in the light-emitting element 30. That is, each connecting through hole in the raised connector 20 connected to the light-emitting element 30 corresponds to one electrode 320.

[0061] In one exemplary embodiment, a light-emitting element packaging structure is provided. This packaging structure includes a substrate 10, a riser connector 20, a light-emitting element 30, a light-shielding layer 40, and a packaging layer. The light-emitting element 30 is fixedly connected to the riser connector 20, and the riser connector 20 is connected to the substrate 10. After the light-emitting element 30, connected to the riser connector 20, is transferred to the substrate 10, and the light-emitting element 30 is connected to the substrate 10 via the riser connector 20, the light-shielding layer 40 is applied to the side of the substrate 10 where the light-emitting element 30 is connected, and the packaging layer then encapsulates the light-emitting element 30. The light-shielding layer 40 is a black coating, i.e., a black film.

[0062] The substrate 10 includes a driving circuit layer, a substrate layer, a substrate insulating layer, and a conductive layer. The substrate layer provides support, carrying and connecting the internal components of the display panel. The driving circuit layer, located on the surface of the substrate layer, controls and drives each pixel in the display panel, enabling it to display based on input signals. The substrate 10 also has a substrate insulating layer, which effectively protects the driving circuit from external interference and enhances the overall circuit's anti-interference capability. Connectors are provided on the substrate insulating layer to facilitate connections and signal transmission between different circuit layers, ensuring signal stability and accuracy. A conductive layer is located on the outermost layer of the substrate 10. The main function of the conductive layer is to conduct current and provide a signal transmission path. It connects to the driving circuit layer via connectors, thereby enabling signal transmission.

[0063] The light-emitting element 30 includes a light-emitting body 310 and electrodes 320. The electrodes 320 of the light-emitting element 30 are connected to the riser connector 20, and the electrodes 320 are electrically connected to the driving circuit layer of the substrate 10 through the riser connector 20. The height of the upper surface of the light-shielding layer 40 is less than or equal to the height of the lower surface of the light-emitting body 310. An encapsulation layer is coated on the surface of the light-shielding layer 40 and encapsulates the light-emitting body 310. Each electrode 320 of the light-emitting element 30 is provided with a solder layer 330, and the solder layer 330 is connected to the riser connector 20 by soldering.

[0064] The raised connector 20 includes a raised insulating layer 210 with connecting through-holes filled with conductive metal 220. Each electrode 320 of the light-emitting element 30 is connected to a conductive metal 220 within a connecting through-hole, and the conductive metal 220 is soldered to the solder layer 330. The raised insulating layer 210 can be made of inorganic materials such as silicon oxide or silicon nitride, thereby ensuring the reliability and stability of the electrical connection and preventing short circuits between different electrical layers. During the fabrication of the raised insulating layer 210, through-holes, i.e., connecting through-holes, need to be etched at the pad locations. The dimensions of the raised insulating layer 210 are typically the same as or slightly larger than the dimensions of the light-emitting element 30 (LED), and the thickness of the raised insulating layer 210 is typically 8 to 10 micrometers.

[0065] Two raised connectors 20 are connected to the same light-emitting element 30, that is, a raised connector 20 is provided below each electrode 320, one raised connector 20 has a connecting through hole, and a gap is provided between the two raised connectors 20.

[0066] In some embodiments, this application provides a display panel including a light-emitting element encapsulation structure as described in any of the above embodiments.

[0067] In one exemplary embodiment, such as Figure 5 As shown, this application provides a method for manufacturing a display panel, applicable to the display panel described above, comprising:

[0068] Step 502: Provide a substrate, a light-emitting element, and a shim connector; wherein, a solder layer is provided on the electrodes of the light-emitting element, and a conductive metal is provided in the connection through hole of the shim connector.

[0069] Step 504: Bond the solder layer of the light-emitting element to the conductive metal of the shim connector to obtain the shim-raised light-emitting element.

[0070] Step 506: The raised light-emitting element is transferred to the substrate, and the raised light-emitting element forms an electrical connection with the substrate.

[0071] Step 508: Apply a light-shielding layer to the side of the substrate connected to the raised light-emitting element and then encapsulate it.

[0072] For example, a substrate, a light-emitting element, and a mounting bracket are prepared in advance, ensuring that a solder layer has been formed on the electrodes of the light-emitting element and that the connecting vias of the mounting bracket are filled with conductive metal. The solder layer of the light-emitting element is bonded to the conductive metal of the mounting bracket, ensuring that the light-emitting element is firmly fixed to the mounting bracket, forming a mounted light-emitting element. The mounted light-emitting element is transferred from the mounting bracket to the substrate. At this time, the light-emitting element and the substrate are electrically connected, ensuring that the light-emitting element is firmly fixed on the substrate, and an electrical connection is established by soldering or other means. A light-shielding layer is applied to the side of the substrate where the mounted light-emitting element is connected. The application of the light-shielding layer needs to be uniform to ensure good encapsulation and effective protection of the light-emitting element. Then, encapsulation is performed using encapsulating adhesive.

[0073] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light-emitting element packaging structure, characterized in that, include: A substrate for supporting and connecting various components inside a display panel, the substrate including a driving circuit layer; A raised connector, which is mounted on the bearing surface of the substrate; A light-emitting element is connected to the raised connector. The light-emitting element includes a light-emitting body and an electrode. The electrode is connected to the driving circuit layer through the raised connector. A light-shielding layer is applied to the bearing surface of the substrate and covers the raised connector and the electrode. The height of the upper surface of the light-shielding layer is less than or equal to the height of the lower surface of the light-emitting body.

2. The light-emitting element packaging structure according to claim 1, characterized in that, The raised connector includes a raised insulating layer, the raised insulating layer has a connecting through hole, and the connecting through hole is filled with conductive metal; Each electrode of the light-emitting element is connected to the conductive metal within one of the connection vias.

3. The light-emitting element packaging structure according to claim 2, characterized in that, The cross-sectional dimension of the raised connector is greater than or equal to the cross-sectional dimension of the light-emitting element, and the thickness of the raised connector is set to 8-10 μm.

4. The light-emitting element packaging structure according to claim 2, characterized in that, A light-emitting element is connected to a raised connector, and the raised connector has two connecting through holes. The distance between the two connecting through holes is the same as the distance between the two electrodes in the light-emitting element.

5. The light-emitting element packaging structure according to claim 2, characterized in that, A light-emitting element is connected to two of the aforementioned raised connectors, one of the raised connectors having a connecting through hole, and a gap being provided between the two raised connectors.

6. The light-emitting element packaging structure according to claim 2, characterized in that, Each electrode of the light-emitting element is provided with a solder layer, which is connected to the conductive metal by welding.

7. The light-emitting element packaging structure according to claim 1, characterized in that, The substrate further includes: The substrate layer is used to support and connect the various components inside the display panel, and the driving circuit layer is disposed on the surface of the substrate layer; A substrate insulating layer is disposed on the surface of the driving circuit layer to protect the driving circuit layer and enhance its anti-interference performance. The substrate insulating layer is provided with connectors. A conductive layer is disposed on the surface of the insulating layer of the substrate for conducting current and providing a signal transmission path. The conductive layer is connected to the driving circuit layer through the connector.

8. The light-emitting element packaging structure according to claim 1, characterized in that, The light-emitting element packaging structure further includes a packaging layer, which is coated on the surface of the light-shielding layer and encapsulates the light-emitting body.

9. A display panel, characterized in that, Includes the light-emitting element packaging structure as described in any one of claims 1-8.

10. A method for manufacturing a display panel, used in the display panel of claim 9, characterized in that, include: A substrate, a light-emitting element, and a shim connector are provided; wherein, a solder layer is provided on the electrodes of the light-emitting element, and a conductive metal is provided in the connection through hole of the shim connector; The solder layer of the light-emitting element is bonded to the conductive metal of the shim connector to obtain the shim-raised light-emitting element; The raised light-emitting element is transferred to the substrate, and the raised light-emitting element forms an electrical connection with the substrate; A light-shielding layer is applied to the side of the substrate connected to the raised light-emitting element and then encapsulated.

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