Glass substrate, LED display module and LED display screen

Abstract

The present application relates to the technical field of circuit board, solve the existing glass substrate easy to appear in the device fixing area of the substrate body after the electrical device is welded and fixed on the substrate body, provide a glass substrate, LED display module and LED display screen, the glass substrate comprises: a substrate body, the substrate body comprises a plurality of device fixing areas, and the electrical device is welded and fixed on the device fixing area; a plurality of anti-warping parts, the outer periphery of the device fixing area is arranged with the anti-warping part or the anti-warping part is arranged between the electrical device welded and fixed on the device fixing area and the device fixing area. The present application has the advantages of preventing the substrate body from warping.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and more particularly to glass substrates, LED display modules, and LED displays. Background Technology

[0002] Currently, electronic products widely use FR4 substrate as the body of traditional circuit boards. Taking LED displays as an example, for one type of LED display, the LED direct display module includes a circuit board using FR4 substrate. With the upgrading of Mini / Micro LED ultra-small pitch, high refresh rate, seamless splicing, thinness, transparent display and high-end rental / fixed installation scenarios, traditional circuit boards have encountered bottlenecks in terms of flatness, circuit limits, thermal expansion matching, insulation withstand voltage, thinness and lightness, and long-term reliability.

[0003] To overcome this bottleneck, LED direct-view display modules are increasingly adopting glass substrates. These glass substrates use ultra-thin glass as the basic carrier and are prepared through processes such as surface modification, metal line deposition, photolithography, micro-hole conduction, and chemical tempering to become a new type of LED display carrier substrate. They can replace traditional circuit boards using FR4 substrates and thus serve as the core substrate for Mini / Micro LED direct-view unit boards, COB / IMD packaging, transparent screens, curved screens, etc.

[0004] However, the thickness of the glass substrate is typically only 0.4–0.9 mm, and the coefficient of linear expansion of the substrate is inconsistent with that of the electrical components (such as IC devices) and solder soldered onto it. After the IC device is soldered to the device mounting area of ​​the substrate via surface mount technology (e.g., surface mount soldering), the back of the substrate facing the IC device is often subjected to soldering stress, causing it to deform under tension. This results in the substrate warping towards the lamp surface of the LED device (e.g., Mini / Micro LED) located on its front side. Furthermore, with increasing circuit complexity and IC device integration, IC devices are gradually transitioning to BGA (Ball Grid Array) packaging. In BGA packaging, the stress on the substrate is more concentrated, leading to more severe warping.

[0005] When a glass substrate warps after IC devices are mounted and soldered onto the substrate, it will adversely affect subsequent packaging and cutting processes. In the packaging process, due to the unevenness of the glass substrate, uneven stress on the glass substrate during molding / coating can easily lead to excessive stress in the device fixing area, causing chip cracking. Furthermore, in the cutting process, the unevenness caused by the warped glass substrate will prevent the glass substrate from being flattened, resulting in inconsistent process edge heights and inconsistent cutting strength. This can lead to problems such as incomplete cuts or cracks in some cutting positions.

[0006] Therefore, there is an urgent need to provide a glass substrate, LED display module, and LED display screen that can prevent warping of the substrate body. Summary of the Invention

[0007] To address the shortcomings of existing glass substrates, such as warping after electrical components are soldered and fixed to the device fixing area of ​​the substrate body, the present invention provides a glass substrate comprising: a substrate body, the substrate body including multiple device fixing areas, on which electrical components are soldered and fixed; and multiple anti-bending portions, wherein anti-bending portions are arranged on the outer periphery of the device fixing areas or between the electrical components soldered and fixed to the device fixing areas and the device fixing areas.

[0008] Furthermore, the anti-bending part is configured as a stress relief groove surrounding the device fixing area and recessed inside the substrate body.

[0009] Furthermore, the anti-bending portion is configured as multiple through holes or blind holes surrounding the device fixing area and recessed inside the substrate body, with adjacent through holes or blind holes spaced apart from each other.

[0010] Furthermore, the anti-bending part is provided as an additional conductive layer or a buffer layer, and a first conductive layer is provided on the device fixing area. The additional conductive layer or buffer layer is provided between the electrical device and the first conductive layer.

[0011] Furthermore, the anti-bending section is set as a strength reinforcement zone surrounding the device fixing area, and the strength reinforcement zone is obtained through a strength strengthening process.

[0012] Furthermore, the anti-bending part is provided as an insulating layer, and a first conductive layer is provided on the device fixing area. The insulating layer is provided between the electrical device and the first conductive layer, and conductive holes are provided in the insulating layer to electrically connect the electrical device and the first conductive layer.

[0013] Furthermore, the insulating layer is a single first insulating layer, and the conductive hole is a first conductive hole located in the first insulating layer, which electrically connects the electrical device to the first conductive layer; or, the insulating layer is a double-layered first insulating layer and a second insulating layer, with an intermediary conductive layer between the first insulating layer and the second insulating layer, and the conductive hole includes a first conductive hole and a second conductive hole located in the first insulating layer and a third conductive hole located in the second insulating layer, whereby the first conductive hole electrically connects the electrical device to the intermediary conductive layer, and the relatively interconnected second and third conductive holes electrically connect the electrical device to the first conductive layer.

[0014] Furthermore, the anti-bending part is configured as an adapter substrate, which includes a first welding surface and a second welding surface opposite to each other. After the electrical device is pre-welded onto the first welding surface, the second welding surface is welded onto the device fixing area. The device fixing area is provided with a first conductive layer. The adapter substrate includes an adapter conductive hole disposed therein, which electrically connects the electrical device to the first conductive layer.

[0015] To achieve another objective of the present invention, an LED display module is provided, comprising any of the above-mentioned glass substrates and multiple LED devices and electrical devices. The electrical devices are configured as IC devices. A first circuit layer and a second circuit layer are respectively provided on opposite sides of the device fixing area, and multiple TGV vias are provided inside the device fixing area to electrically connect the first circuit layer and the second circuit layer. The LED devices and IC devices are respectively arranged on opposite sides of the device fixing area and are electrically connected to the first circuit layer and the second circuit layer respectively.

[0016] To achieve another objective of the present invention, an LED display screen is provided, comprising any of the above-mentioned LED display modules.

[0017] The beneficial effects of this invention are as follows: The glass substrate, LED display module, and LED display screen provided by the present invention can, on the one hand, reduce or even eliminate the extension of welding stress beyond the device fixing area by providing anti-bending parts around the device fixing area, thereby releasing welding stress and reducing the impact of welding stress on the substrate body; on the other hand, the strength of the substrate body can be improved by providing anti-bending parts between the electrical device fixed by welding in the device fixing area and the device fixing area, thereby resisting the impact of welding stress on the substrate body, and thus preventing the substrate body from warping due to stress tension. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, and these are all within the protection scope of the present invention.

[0019] Figure 1 This is a schematic diagram of the overall structure of the glass substrate provided in Embodiment 1 of the present invention; Figure 2 This is a top view schematic diagram mainly showing the partial structure of the warped portion of the glass substrate in Embodiment 1; Figure 3 For corresponding Figure 2 A top view of a preferred embodiment of the structure; Figure 4 This is a top view schematic diagram mainly illustrating a portion of the structure of a warped portion in Embodiment 2 of the glass substrate; Figure 5 This is a top view schematic diagram mainly showing another part of the warped portion of the glass substrate in Embodiment 2; Figure 6 This is a partial sectional view of the structure of a warped portion of a glass substrate, as shown in Embodiment 3. Figure 7 This is a partial sectional view of another warped portion of the glass substrate in Embodiment 3. Figure 8 This is a partial side cross-sectional view of a warped portion of a glass substrate, as shown in Embodiment 5. Figure 9 This is a partial cross-sectional view of the structure of another warped portion of the glass substrate in Embodiment 5. Figure 10 This is a partial cross-sectional view of the structure of the warped portion of the glass substrate in Embodiment Six. Explanation of reference numerals in the attached figures: 1. Glass substrate; 11. Substrate body; 12. Device fixing area; 13. Electrical device; 14. Stress relief groove; 24. Through hole; 341. Additional conductive layer; 342. Buffer layer; 541. First insulating layer; 5411. First conductive hole; 5412. Second conductive hole; 542. Second insulating layer; 5421. Third conductive hole; 543. Intermediate conductive layer; 64. Adapter substrate; 641. Adapter conductive hole; 15. Flexible filling material; 16. First conductive layer; D. Spacing from the stress application area; W. Width of the stress relief groove. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element limited by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0021] refer to Figures 1 to 10 As an objective of this invention, a glass substrate 1 is provided, comprising a substrate body 11 and a plurality of anti-bending portions. The substrate body 11 includes a plurality of device fixing areas 12, on which electrical devices 13 are soldered and fixed. Anti-bending portions are arranged on the outer periphery of the device fixing areas 12, or anti-bending portions are arranged between the electrical devices 13 soldered and fixed to the device fixing areas 12 and the device fixing areas 12. It should be noted that the positions of each device fixing area 12 on the substrate body 11 can be arranged according to actual needs, for example, as... Figure 1 As shown, the positions of each device fixing area 12 on the substrate body 11 are arranged in a regular manner; and the size and shape of each device fixing area can be set according to actual needs; in addition, each glass device fixing area 12 is generally provided with multiple TGV through holes, so as to electrically connect the electrical devices 13, such as IC devices, and LED devices such as Mini LED, Micro LED lamp beads, or semiconductor devices such as GPU or CPU that are soldered and fixed on the two opposite surfaces of the device fixing area 12 through the TGV through holes.

[0022] As described above, the glass substrate 1 provided by the present invention can prevent warping that may occur when the electrical device 13 is welded and fixed to the device fixing area 12, due to the welding stress applied to the substrate body 11. On the one hand, anti-bending portions can be provided around each device fixing area 12 to reduce or even eliminate the extension of welding stress beyond the device fixing area 12, thereby releasing the welding stress and reducing its impact on the substrate body 11. On the other hand, anti-bending portions can be arranged between the electrical device 13 welded and fixed to each device fixing area 12 and the device fixing area 12, thereby increasing the strength of the substrate body 11 and resisting the impact of welding stress on the substrate body 11. Therefore, both aspects can prevent the substrate body 11 from warping due to stress tension.

[0023] The following describes in detail the different anti-bending portions of glass substrate 1, especially using multiple glass substrate embodiments. Without conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other, and all are within the protection scope of the present invention.

[0024] Please refer to the reference. Figures 1 to 3 As an embodiment of the glass substrate provided by the present invention, the anti-bending portion of the glass substrate 1 is configured as a stress relief groove 14 surrounding the device fixing area 12 and recessed inside the substrate body 11. The stress relief groove 14 can reduce or even eliminate the extension of welding stress beyond the device fixing area 12. In addition, in order to ensure that the depth of the stress relief groove 14 is less than the thickness of the substrate body 11 and does not significantly affect the strength of the substrate body 11, the stress relief groove 14 is set according to the thickness of the substrate body 11. In this embodiment, the depth of the stress relief groove 14 is 1 / 10 to 1 / 5 of the thickness of the substrate body 11. For a further improvement of this embodiment, laser modification of the substrate body 11 can be used to increase the strength at the location of the stress relief groove 14, thereby minimizing damage to the substrate body 11 and reducing the generation of microcracks. Furthermore, the shape of the stress relief groove 14 can be set according to the principle that the edge of the stress relief groove 14 is equidistant from the perimeter of the stress application area. Since the electrical components 13 of IC devices are usually regular rectangles, stress concentration may occur at the included corners. Therefore, the stress relief groove 14 can be set as a circle (not shown). Figure 2As shown, in the first embodiment of the glass substrate of the present invention, considering factors such as ease of processing, severity of stress concentration problems, and accuracy of shape adaptation with electrical device 13, the stress relief groove 14 is set as a rectangle. Assuming the side length of the stress-affected area is 1, the distance D from the stress-affected area can be specifically set according to Table 1 below for selection and use. The width W of the stress relief groove 14 can be specifically set according to Table 2 below. Therefore, according to the contents listed in Table 1 and Table 2, in this embodiment, it is preferable to set the value of the distance D to 0.3 to 0.5 and the value of the width W to 0.4 to 0.6. This combination setting can maximize the restraint of welding stress and reduce stress tension, thereby achieving the best warping suppression effect.

[0025] Table 1: Range of values ​​for spacing D and corresponding technical specifications Table 2: Range of values ​​for width W and corresponding technical specifications Please refer to the reference. Figure 3 Based on the first embodiment of the glass substrate 1 described above, as a preferred embodiment, a flexible filler material 15 can be filled into the stress relief groove 14. The flexible filler material 15 can be a flexible material with an expansion coefficient that is close to that of the substrate body 11, such as low-expansion modified polyimide or epoxy / siloxane modified adhesive. This can strengthen the strength of the substrate body 11 while reducing the welding stress caused by the inconsistent cooling rate between the electrical device 13 and the glass substrate 1 after being patch-welded.

[0026] Please refer to the reference. Figure 4 and Figure 5 As a second embodiment of the glass substrate provided by the present invention, the anti-bending portion of the glass substrate 1 is configured as a plurality of through holes 24 or blind holes surrounding the device fixing area 12 and recessed inside the substrate body 11. Adjacent through holes 24 or blind holes are spaced apart, preferably at equal intervals. The spacing value is inversely correlated with any one of the following: the hardness of the substrate body 11, the number of layers, the thickness, and the wiring density around the device fixing area 12. Figure 4 This shows the case where the spacing value is small. Figure 5The case with a larger spacing value is shown. Each through hole 24 or blind hole can reduce or even eliminate the extension of welding stress beyond the device fixing area 12. In addition, there is no limitation on whether to set any of the through holes 24 or blind holes to make electrical connections between the front and back sides of the device fixing area 12. When it is not necessary to achieve electrical connections between the front and back sides, the through holes 24 or blind holes can be filled with insulating reinforcing material. In this case, other lines can be routed through non-opening holes. When it is necessary to achieve electrical connections between the front and back sides, the through holes 24 or blind holes can be filled with copper or the hole walls can be copper plated and then filled with oil. This can reduce the welding stress and achieve circuit connection at the same time, and also reduce the impact of a large number of through holes 24 or blind holes on the strength of the substrate body 11.

[0027] Taking the LED display field as an example, electrical device 13 is a driver IC with a relatively large size, packaged in BGA. Since electrical device 13 is generally rectangular, its size typically refers to the diagonal length of the rectangular surface. This driver IC drives the LED chip, or flip-chip LED, and is responsible for precisely controlling the light emission of each LED pixel. Due to the large number of pins and high requirements for electrical performance and heat dissipation, the driver IC is well-suited for soldering onto the device mounting area 12 using BGA packaging. The LED chip can be directly manufactured or mounted on the other surface of the substrate 11 opposite to the device mounting area 12 using technologies such as mass transfer. Because the driver chip is typically larger than 1 cm or has multiple pins with a large pin spacing, the inconsistent thermal expansion coefficients of the driver chip and the substrate 11 lead to inconsistent deformation during cooling after soldering, resulting in soldering stress. Therefore, by using multiple through-holes 24 or blind holes to prevent bending, the extension of soldering stress beyond the device mounting area 12 can be reduced or even eliminated. Furthermore, to minimize the possibility of warping caused by stress pulling the substrate body 11 due to welding stress, when the substrate body 11 is a two-layer board, the anti-bending part is set as a through hole 24; when the substrate body 11 is a multi-layer board with more than two layers, the anti-bending part is set as a blind hole. Also, since the electrical device 13 using BGA packaging has a large size, the larger the size, the more routing positions are required, thus requiring more routing positions to be reserved. When the size exceeds a certain value, in order to reserve the required routing positions, the through holes 24 cannot be arranged too densely on the same circle. Through repeated experiments, the inventors have found that when the size of the electrical device 13 is less than or equal to 2cm, then... Figure 4 and Figure 5As shown, the number of turns of the through-hole 24 or blind via is set to a single turn or two turns arranged from near to far relative to the center point of the device fixing area 12; when the size of the electrical device 13 is greater than 2 cm, the number of turns of the through-hole 24 or blind via is set to three or more turns arranged from near to far relative to the center point of the device fixing area 12. Furthermore, since more wiring positions are required as the size of the electrical device 13 increases, it is preferable that the spacing between adjacent through-holes 24 or blind vias in each turn that gradually moves away from the center point of the device fixing area 12 gradually increases accordingly. This satisfies wiring requirements while avoiding excessive through-holes 24 or blind vias that would reduce the strength of the substrate body 11. Additionally, it should be noted that, except for the electrical device 13 being a BGA packaged device, similar devices that may be applied to the glass substrate 1 and have relatively large sizes are applicable to various glass substrate embodiments of the present invention.

[0028] Please refer to further details. Figure 6 and Figure 7 In the third embodiment of the glass substrate provided by the present invention, the anti-bending portion of the glass substrate 1 is provided as an additional conductive layer 341 or a buffer layer 342, and a first conductive layer 16, such as copper foil, is provided on the device fixing area 12. The additional conductive layer 341 or buffer layer 342 is disposed between the electrical device 13 and the first conductive layer 16. The additional conductive layer 341 can be understood as increasing the original thickness of the conventional first conductive layer 16, and the increased thickness is preferably the original thickness, thereby effectively doubling the thickness of the first conductive layer compared to the conventional thickness of the first conductive layer 16. The buffer layer 342 can be made of polyimide (PI) material. By using the additional conductive layer 341 or buffer layer 342, on the one hand, the cooling efficiency of the electrical device 13 can be improved, and on the other hand, after the electrical device 13 is surface-mounted, it plays a buffering and balancing role for the deformation difference caused by the difference in cooling efficiency between the electrical device 13 and the substrate body 11.

[0029] As a fourth embodiment of the glass substrate provided by the present invention, the anti-bending portion included in the glass substrate 1 is configured as a strength reinforcement region (not shown) surrounding the device fixing area 12. The strength reinforcement region is obtained through a strength enhancement process. Specifically, the strength enhancement process can adopt conventional localized regional reinforcement methods such as local high-temperature molten glass fiber doping or localized laser modification. In particular, the present invention can also use localized chemical tempering replacement to achieve the strength enhancement process. This localized chemical tempering replacement uses a low-temperature ion exchange method to immerse the area of ​​the substrate body 11 to be tempered in a molten salt containing potassium ions. Driven by the concentration gradient, Na+ to K+ ions are exchanged on the surface of the substrate body 11, forming surface compressive stress. At the same time, existing microcracks in the substrate body 11 can be repaired during ion exchange to improve the strength of the substrate body 11. The ion exchange temperature can be selected from 380℃ to 420℃, and the time can be selected from 30h to 45h. The specific area of ​​the strength reinforcement zone can be determined based on the size of the device fixing area 12 and the corresponding welding stress range. Taking the electrical device 13 as a rectangle and the device fixing area 12 as a rectangle as an example, the area of ​​the strength reinforcement zone can be set as a rectangle centered on the center of the rectangular surface of the electrical device 13, and the length and width of the strength reinforcement zone are respectively 3 to 5 times the length and width of the electrical device 13. Therefore, by setting the strength reinforcement zone, the overall strength of the relevant areas that may be subjected to welding stress can be improved, thereby reducing the deformation of the substrate body 11 that may be caused by surface mount welding and preventing the substrate body 11 from warping.

[0030] Please refer to further details. Figure 8 and Figure 9 As a fifth embodiment of the glass substrate provided by the present invention, the anti-bending portion of the glass substrate 1 is provided as an insulating layer, the device fixing area 12 is provided with a first conductive layer 16, the insulating layer is provided between the electrical device 13 and the first conductive layer 16, and the insulating layer is provided with conductive holes that electrically connect the electrical device 13 and the first conductive layer 16. By providing conductive holes in the insulating layer, the line leads connected to the electrical device 13 can be arranged through the insulating layer, reducing the number of TGV through holes provided on the substrate body 11 below the electrical device 13, ensuring the consistency of the substrate body 11 below the electrical device 13, thereby improving the strength of the substrate body 11.

[0031] Furthermore, the number of insulating layers can be determined based on actual conditions such as the number of circuit leads and the size of electrical components 13. The more insulating layers there are, the greater the reduction in the number of TGV vias, thus improving the strength of the substrate body 11. For example, Figure 8The case where the insulating layer is a single layer is shown. In this case, the conductive hole is set as the first conductive hole 5411 located in the first insulating layer 541. The first conductive hole 5411 electrically connects the electrical device 13 to the first conductive layer 16. In other words, a line lead connected to the electrical device 13 is the first conductive hole 5411 in the first insulating layer 541 that is electrically connected to the first conductive layer 16. Figure 9 The illustration shows a case where the insulating layer consists of two layers: a first insulating layer 541 and a second insulating layer 542 stacked together. An intermediary conductive layer 543 is provided between the first insulating layer 541 and the second insulating layer 542. The conductive holes include a first conductive hole 5411 and a second conductive hole 5412 located in the first insulating layer 541, and a third conductive hole 5421 located in the second insulating layer 542. The first conductive hole 5411 electrically connects the electrical device 13 to the intermediary conductive layer 543, and the relatively connected second conductive hole 5412 and third conductive hole 5421 electrically connect the electrical device 13 to the first conductive layer 16. In other words, one line lead connected to the electrical device 13 is the first conductive hole 5411, which is electrically connected to the intermediary conductive layer 543 and connected to the electrical device 13, and the other line lead connected to the electrical device 13 is the second conductive hole 5412 and the third conductive hole 5421, which are electrically connected to the first conductive layer 16 and relatively connected.

[0032] Please refer to further details. Figure 10As a sixth embodiment of the glass substrate provided by the present invention, the anti-bending portion of the glass substrate 1 is configured as a transition substrate 64. The transition substrate 64 includes a first welding surface and a second welding surface opposite to each other. After one or more electrical devices 13 are pre-welded to the first welding surface, the second welding surface is welded to the device fixing area 12. The device fixing area 12 is provided with a first conductive layer 16. The transition substrate 64 includes a transition conductive hole 641 disposed therein, which electrically connects the electrical device 13 to the first conductive layer 16. The transition substrate 64, which acts as a temporary substrate, can be made of, for example, glass of the same material as the glass substrate 1 or a low-expansion modified PI board. Both can reduce the stress caused by the difference in the coefficient of expansion between the transition substrate 64 and the substrate body 11, which is equivalent to increasing the strength of the substrate body 11. Thus, when the transition substrate 64 is welded to the device fixing area 12, the welding stress acting on the device fixing area 12 and the stress pulling on the substrate body 11 are reduced, effectively preventing the substrate body 11 from warping. In addition, preferably, after the electrical components 13 are soldered to the adapter substrate 64, the adapter substrate 64 that does not meet the usage requirements, i.e., the soldering is unqualified, can be screened out by means of power connection test, inspection camera photography, etc., so that it can be reworked or scrapped. After selection, the adapter substrate 64 that meets the usage requirements can be soldered to the substrate body 11. Compared with the electrical components 13 being directly soldered to the substrate body 11 and then screened, this not only reduces the possibility that the entire glass substrate 1 will need to be reworked or scrapped due to at least one unqualified electrical component 13, but also helps to improve the manufacturing yield of the glass substrate 1.

[0033] In summary, according to the various glass substrate embodiments provided by the present invention, the glass substrate 1 has advantages including at least one of the following: the relative strength of the glass substrate 1 is improved, the strength of the glass substrate 1 is locally reinforced in a controllable manner, the possibility of deformation of the substrate body 11 after the glass substrate 1 is patch-welded is reduced, the difficulty of subsequent processes is reduced, and the risk of subsequent breakage of the glass substrate 1 is reduced.

[0034] As another objective of this invention, an LED display module is provided, comprising a glass substrate according to any of the above glass substrate embodiments, and multiple LED devices and electrical devices. The LED display module can achieve any of the beneficial effects of the glass substrate 1 described above, which will not be repeated here. Specifically, the electrical device 13 is an IC device. A first circuit layer and a second circuit layer are respectively provided on opposite sides of the device fixing area 12, and multiple TGV vias (not shown) are opened inside the device fixing area 12 to electrically connect the first circuit layer and the second circuit layer. The LED devices and IC devices are respectively arranged on opposite sides of the device fixing area 12 and are respectively electrically connected to the first circuit layer and the second circuit layer. It should be noted that the first circuit layer and the second circuit layer are respectively the outermost circuit layers on opposite sides, and other multiple circuit layers may be provided in the intervening portion between the first circuit layer and the second circuit layer and their respective corresponding sides. Since the glass substrate 1 of the LED display module has multiple device fixing areas 12 and corresponding anti-bending parts, the glass substrate 1 will not be uneven due to warping after the electrical devices 13 are fixed by surface mounting on each device fixing area 12 of the substrate body 11 without warping. This prevents the glass substrate 1 from being unable to be flattened, ensuring consistent process edge height and consistent cutting strength. This avoids unfavorable situations such as incomplete cutting or cracking at some cutting positions, thus ensuring high flatness and regular outer edges of the LED display module, which is especially beneficial for the mutual alignment when splicing multiple LED display modules.

[0035] As another objective of this invention, an LED display screen is provided, which can be a Mini LED, MicroLED, QLED, MiP, or SMD display screen. This LED display screen includes multiple interconnected LED display modules of any of the above types. The LED display screen can achieve any of the beneficial effects described above for the LED display modules, which will not be repeated here. Because the anti-bending portion ensures the flatness of the glass substrate 1, uneven stress on the glass substrate 1 during molding / coating will not cause excessive stress in the device fixing area 12, leading to cracking. Furthermore, it avoids incomplete cuts and cracks at some cutting points during the cutting process. Therefore, for LED displays using single or multiple LED display modules, each LED device can uniformly emit light at a preset angle, resulting in excellent display effects. Especially for large-screen LED displays, when multiple LED display modules are spliced ​​together, it has the advantages of high splicing alignment and high overall consistency of the emitting surface.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A glass substrate, characterized in that, include: A substrate body, the substrate body including multiple device fixing areas, on which electrical devices are soldered and fixed; Multiple anti-bending parts are provided, either on the outer periphery of the device fixing area or between the electrical device welded and fixed in the device fixing area and the device fixing area.

2. The glass substrate according to claim 1, characterized in that, The anti-bending part is configured as a stress-relieving groove surrounding the device fixing area and recessed inside the substrate body.

3. The glass substrate according to claim 1, characterized in that, The anti-bending portion is configured as a plurality of through holes or blind holes surrounding the device fixing area and recessed inside the substrate body, with each pair of adjacent through holes or blind holes spaced apart from each other.

4. The glass substrate according to claim 1, characterized in that, The anti-bending part is provided as an additional conductive layer or a buffer layer, and a first conductive layer is provided on the device fixing area. The additional conductive layer or buffer layer is provided between the electrical device and the first conductive layer.

5. The glass substrate according to claim 1, characterized in that, The anti-bending part is set as a strength reinforcement area surrounding the fixing area of ​​the device, and the strength reinforcement area is obtained by strength strengthening process.

6. The glass substrate according to claim 1, characterized in that, The anti-bending part is provided as an insulating layer, and a first conductive layer is provided on the device fixing area. The insulating layer is provided between the electrical device and the first conductive layer, and conductive holes are provided in the insulating layer to electrically connect the electrical device and the first conductive layer.

7. The glass substrate according to claim 6, characterized in that, The insulating layer is a single layer, and the conductive hole is a first conductive hole located in the first insulating layer, which electrically connects the electrical device to the first conductive layer; or, the insulating layer is a double layer, a first insulating layer and a second insulating layer, arranged in a stacked manner, with an intermediary conductive layer between the first insulating layer and the second insulating layer, and the conductive hole includes a first conductive hole and a second conductive hole located in the first insulating layer and a third conductive hole located in the second insulating layer, where the first conductive hole electrically connects the electrical device to the intermediary conductive layer, and the relatively connected second conductive hole and third conductive hole electrically connect the electrical device to the first conductive layer.

8. The glass substrate according to claim 1, characterized in that, The anti-bending part is configured as an adapter substrate, which includes a first welding surface and a second welding surface opposite to each other. After the electrical device is pre-welded onto the first welding surface, the second welding surface is welded onto the device fixing area. The device fixing area is provided with a first conductive layer. The adapter substrate includes an adapter conductive hole disposed therein, which electrically connects the electrical device to the first conductive layer.

9. An LED display module, characterized in that, The device includes a glass substrate as described in any one of claims 1 to 8, as well as a plurality of LED devices and electrical devices. The electrical devices are configured as IC devices. A first circuit layer and a second circuit layer are respectively provided on opposite sides of the device fixing area. A plurality of TGV vias are provided inside the device fixing area to electrically connect the first circuit layer and the second circuit layer. The LED devices and the IC devices are respectively arranged on opposite sides of the device fixing area and are respectively electrically connected to the first circuit layer and the second circuit layer.

10. An LED display screen, characterized in that, Includes the LED display module as described in claim 9.

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