Display panel and display device

Abstract

The application provides a display panel and a display device. The display panel comprises a substrate, an inner pin pad and an outer pin pad. The outer pin pad comprises a connection structure and at least two pad units. Each pad unit comprises at least two pad elements. The connection structure comprises a first connection line and a second connection line. The first end of the first connection line and the first end of the second connection line are respectively connected to two pad elements of one of the pad units in a one-to-one manner. The second end of the first connection line and the second end of the second connection line are respectively connected to two pad elements of another of the pad units in a one-to-one manner. The connection between the two pad elements connected to the first connection line is a first connection line. The connection between the two pad elements connected to the second connection line is a second connection line. The first connection line and the second connection line are arranged in a cross manner. According to the embodiment of the application, the problem that the display panel in the related art cannot be compatible with different sizes of DDICs can be solved.

Description

Technical Field

[0001] This application relates to the field of OLED displays, and more specifically, to a display panel and a display device. Background Technology

[0002] With the development of the OLED (Organic Light-Emitting Diode) display industry, market demands for the overall appearance and performance of devices are increasing, requiring thinner designs, narrower bezels, and lower prices. To achieve the ultimate performance experience, both device space and cost space are being compressed. To address this, DDIC (Display Driver Integrated Circuit) manufacturers have developed smaller DDICs with more compact pad arrangements to accommodate the reduced device space. They have also reduced costs by eliminating redundant functions, thus enhancing the versatility of DDICs.

[0003] However, the display panels in the related technologies are not compatible with DDICs of different sizes. Summary of the Invention

[0004] This application provides a display panel and a display device to solve the problem in the related art that display panels are not compatible with DDICs of different sizes.

[0005] On one hand, this application provides a display panel, which includes a substrate, inner pin pads, and outer pin pads. The inner pin pads and outer pin pads are spaced apart on the substrate along a first direction. The outer pin pads include: at least two pad units spaced apart along the first direction, each pad unit including at least two pad individuals spaced apart along a second direction, the first direction and the second direction being at an angle; and a connection structure, in which adjacent pad units are electrically connected, the connection structure including a first connection line and a second connection line, the first end of the first connection line and the first end of the second connection line being connected one-to-one with two pad individuals of one of the pad units, the second end of the first connection line and the second end of the second connection line being connected one-to-one with two pad individuals of another pad unit, the first connection line and the second connection line being insulated from each other; wherein, the connection between two pad individuals connected to the first connection line is the first connection line, the connection between two pad individuals connected to the second connection line is the second connection line, and the first connection line and the second connection line are intersecting.

[0006] In some embodiments, the extension directions of the first connecting line and the extension directions of the second connecting line are arranged to intersect each other;

[0007] In some embodiments, the projections of the first connecting line on the substrate and the projections of the second connecting line on the substrate partially overlap.

[0008] In some embodiments, along the thickness direction of the substrate, the first connection line is at least partially located on the side of the second connection line away from the substrate.

[0009] In some embodiments, at least two individual pads of the pad unit are aligned in a first direction;

[0010] In some embodiments, the number of individual pads in the pad unit gradually decreases in the direction along the first direction toward the inner pin pad.

[0011] In some embodiments, the first connecting line has a first base segment and an upper convex segment connected together. The first base segment is disposed in the same layer as the second connecting line, and the upper convex segment protrudes in a direction away from the substrate and is at least partially disposed in a layer with the second connecting line, and the upper convex segment avoids the second connecting line; and / or, the second connecting line has a second base segment and a lower concave segment connected together. The second base segment is disposed in the same layer as the first connecting line, and the lower concave segment protrudes in a direction toward the substrate and is at least partially disposed in a layer with the first connecting line, and the lower concave segment avoids the first connecting line.

[0012] In some embodiments, the projection of the first connecting line on the substrate extends along the first connecting line, and the projection of the second connecting line on the substrate extends along the second connecting line; or, the projection of the first connecting line on the substrate extends along the first connecting line, and the second connecting line includes a first extension segment, a second extension segment, and a connecting segment. The first end of the first extension segment is connected to one of two adjacent pad units, the first end of the second extension segment is connected to the other pad unit, the connecting segment extends along a second direction, and the connecting segment is located on the side of one of the two adjacent pad units away from the other pad unit in the first direction. The second ends of the first extension segment and the second ends of the second extension segment are both connected to the connecting segment.

[0013] In some embodiments, the external pin pads are symmetrically arranged, and the axis of symmetry of the external pin pads extends along a first direction;

[0014] In some embodiments, the external pin pad includes at least three pad units and at least two connection structures, with a connection structure provided between every two adjacent pad units.

[0015] In some embodiments, the connection structure further includes an insulating layer, which is at least partially disposed between the first connecting line and the second connecting line.

[0016] In some embodiments, the first connecting line and / or the second connecting line are set at an angle to the first direction; and / or, the first direction and the second direction are perpendicular to each other.

[0017] In some embodiments, at least two pad units have different pad densities.

[0018] In some embodiments, the internal pin pads include at least two pad rows, which are spaced apart along a first direction, and each pad row includes at least two pad elements spaced apart along a second direction.

[0019] In some embodiments, the number of pads in the pad row gradually decreases in the direction approaching the outer pin pad along the first direction;

[0020] In some embodiments, the inner pin pads are symmetrically arranged, and the axis of symmetry of the inner pin pads extends along a first direction.

[0021] On the other hand, embodiments of this application provide a display device, which includes the display panel provided above.

[0022] This application provides a display panel and a display device. The display panel includes a substrate, inner pin pads, and outer pin pads. The outer pin pads include a connection structure and at least two pad units. Since the inner and outer pin pads are spaced apart along a first direction, and the at least two pad units are also spaced apart along the first direction, the spacing between each pad unit and the inner pin pad is different, thus enabling compatibility with the interfacing requirements of display driver chips with different output and input terminal spacings. Furthermore, because the first and second connections are intersected, the arrangement of at least two individual pads in each pad unit is different, thereby enabling compatibility with the interfacing requirements of display driver chips with different input terminal pin arrangements. Therefore, the display panel provided in this embodiment can adapt to various display driver chips. When products are upgraded, only the display driver chip selection needs to be changed to meet the driving requirements of the display panel. Before and after changing the display driver chip, it is not necessary to change the display panel, nor is it necessary to set up multiple display panels for different display driver chips, such as display driver chips with different output and input terminal spacings and display driver chips with different input terminal pin arrangements, thereby saving display panel development costs and meeting more complex market demands. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the original display driver chip in the relevant technology is shown;

[0025] Figure 2 This diagram illustrates the structure of a display driver chip with reduced dimensions in the related art.

[0026] Figure 3This diagram illustrates a structure in the related technology where the original display driver chip and the size-reduced display driver chip are stacked together.

[0027] Figure 4 This is a schematic diagram of the structure of a display panel according to one embodiment of this application;

[0028] Figure 5 An example is shown. Figure 4 A magnified view of a portion of region A in the middle;

[0029] Figure 6 Show Figure 5 Cross-sectional view along the AA direction;

[0030] Figure 7 Show Figure 5 Cross-sectional view along the BB direction;

[0031] Figure 8 A schematic diagram of the structure of a display panel according to another embodiment is shown;

[0032] Figure 9 This document presents a schematic diagram illustrating the structure of a display panel and a display driver chip of a display device according to some embodiments of this application.

[0033] The above figures include the following reference numerals:

[0034] 1. Display panel; 2. Display driver chip; 3. Output terminals; 4. Input terminals;

[0035] 10. Substrate; 11. Display unit; 12. Bending part; 13. Bonding part; 14. Buffer layer; 15. Support layer;

[0036] 20. Inner pin pad; 21. Pad bus; 22. Pad component;

[0037] 30. External lead pad; 31. Pad unit; 311. Pad unit; 32. Connection structure; 321. First connection line; 322. Second connection line; 3221. Second base segment; 3222. Recessed segment; 3223. First extension segment; 3224. Second extension segment; 3225. Connection segment; 323. Third connection line; 33. Insulating layer;

[0038] 41. First line; 42. Second line; 43. Third line;

[0039] X, first direction; Y, second direction; Z, thickness direction of the substrate;

[0040] W1, the width of the existing display driver chip;

[0041] W2, the width of the display driver chip after size reduction;

[0042] L1, the length of the original display driver chip;

[0043] L2, the length of the display driver chip after size reduction;

[0044] D1, the distance between the output and input terminals of the original display driver chip;

[0045] D2, the distance between the output and input terminals of the reduced-size display driver chip;

[0046] M1, light-emitting surface;

[0047] M2, backlit side. Detailed Implementation

[0048] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended only to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0050] In the OLED field, there is a close and inseparable relationship between display driver chips and display panels. The display panel is the physical medium for image display, while the display driver chip is responsible for converting the input image data into electrical signals (driving signals). Based on the electrical signals provided by the display driver chip, the display panel controls the brightness and color of each pixel to achieve image display.

[0051] To ensure the display driver chip can accurately transmit electrical signals to the display panel, the display driver chip includes output bumps (OLBs) and input bumps (ILBs). The display panel includes inner lead bonding pads (ILB pads) and outer lead bonding pads (OLBPads). The outer lead bonding pads are connected to the input bumps, and / or the inner lead bonding pads are connected to the output bumps, thereby enabling signal transmission between the display panel and the display driver chip. Specifically, both the output and input bumps include multiple pins, and both the inner and outer lead bonding pads include multiple pads. Pins are the concrete implementations of the output and input bumps, and pads are the concrete implementations of the inner and outer lead bonding pads. Pins and pads are the physical connection points between the display driver chip and the display panel. There is a one-to-one correspondence between the pins of the display driver chip's output bumps and the pads of the display panel's inner lead bonding pads, and / or a one-to-one correspondence between the pins of the display driver chip's input bumps and the pads of the display panel's outer lead bonding pads.

[0052] Currently, the inventors have discovered through long-term research that, in related technologies, as the size of display driver chips shrinks, in order to accommodate the original bumps on a smaller chip area, it is necessary to reduce the spacing between the bumps to adapt to the smaller chip size. For example, as... Figure 1 As shown, the original display driver chip has a width of W1 and a length of L1. Figure 2 As shown, the width of the scaled-down display driver chip is W2, and the length is L2 (W1≈W2, L1>L2). The distance between the output terminal 3 and the input terminal 4 of the original display driver chip is D1, while the distance between the output terminal 3 and the input terminal 4 of the scaled-down display driver chip is D2. The main difference between the bump arrangement of the original display driver chip and the scaled-down display driver chip lies in the significant difference between D1 and D2 (D1>D2). Figure 3As shown, by stacking and comparing the original display driver chip and the scaled-down display driver chip, it can be seen that the output terminals 3 of the original display driver chip and the scaled-down display driver chip can maintain central symmetry, and their output terminals 3 can correspond pin-to-pin. However, the coordinates of the input terminals 4 of the original display driver chip and the scaled-down display driver chip are completely different. This makes it impossible for the input terminals 4 of the scaled-down display driver chip to be connected to the external pin pads of the original display panel. As a result, the scaled-down display driver chip is no longer suitable for the original display panel. This is the fundamental reason why display panels in related technologies cannot be compatible with display driver chips of different sizes.

[0053] To address the related technical problems, embodiments of this application provide a display panel and a display device. The display panel provided in the embodiments of this application will be described first.

[0054] It should be noted that the display panel provided in this application embodiment can be applied to various devices, including display devices. For example, the display panel can be applied to medical devices, such as pacemakers, ultrasound equipment, and magnetic resonance imaging equipment, or it can be applied to automotive electronic devices, such as engine control, chassis control, body electronics, navigation systems, airbags, and tire pressure monitoring. In other words, the display panel provided in this application embodiment can be used in any device that requires a display driver chip. For ease of understanding, this application will subsequently use the application of the display panel in a display device as an example for explanation.

[0055] like Figures 4 to 9As shown, this application embodiment provides a display panel, which includes a substrate 10, inner lead pads 20, and outer lead pads 30. The inner lead pads 20 and outer lead pads 30 are disposed on the substrate 10 at intervals along a first direction. The outer lead pads 30 include a connection structure 32 and at least two pad units 31. The at least two pad units 31 are disposed at intervals along the first direction. Each pad unit 31 includes at least two pad cells 311 disposed at intervals along a second direction. The first direction and the second direction are arranged at an angle. Adjacent pad units 31 are electrically connected by the connection structure 32, which includes a first connection line 321 and a second connection line 322. The first end of the first connecting line 321 and the first end of the second connecting line 322 are connected one-to-one to two pad units 311 of one of the pad units 31. The second end of the first connecting line 321 and the second end of the second connecting line 322 are connected one-to-one to two pad units 311 of the other pad unit 31. The first connecting line 321 and the second connecting line 322 are insulated from each other. The connection between the two pad units 311 connected to the first connecting line 321 is the first connecting line 41, and the connection between the two pad units 311 connected to the second connecting line 322 is the second connecting line 42. The first connecting line 41 and the second connecting line 42 are arranged to cross each other.

[0056] The display panel provided in this embodiment includes a substrate 10, inner pin pads 20, and outer pin pads 30. The outer pin pads 30 include a connection structure 32 and at least two pad units 31. Since the inner pin pads 20 and outer pin pads 30 are spaced apart along a first direction, and the at least two pad units 31 are also spaced apart along the first direction, the spacing between each pad unit 31 and the inner pin pad 20 is different, thus enabling compatibility with the docking requirements of display driver chips 2 with different spacing between output terminals 3 and input terminals 4. Furthermore, since the first connection line 41 and the second connection line 42 are intersected, the arrangement of at least two pad units 311 in each pad unit 31 is different, thereby enabling compatibility with the docking requirements of display driver chips 2 with different pin arrangements at the input terminals 4. Therefore, the display panel provided in this embodiment can be adapted to various display driver chips 2. When the product is upgraded, only the display driver chip 2 needs to be selected to meet the driving requirements of the display panel. Before and after the display driver chip 2 is replaced, there is no need to replace the display panel. There is no need to set up multiple display panels for different display driver chips 2, such as display driver chips 2 with different spacing between output terminals 3 and input terminals 4 and display driver chips 2 with different pin arrangements of input terminals 4, so as to save display panel development costs and meet more complex market demands.

[0057] The display panel may also include a device layer and a light-emitting layer. The device layer is disposed on the light-emitting surface of the substrate 10 and includes multiple driving circuits. The light-emitting layer is disposed on the substrate 10 and includes a pixel defining layer and a light-emitting element. The pixel defining layer has multiple pixel openings, and a light-emitting element is disposed in each pixel opening. The pixel opening is the area where the light-emitting element emits light. The pixel defining layer prevents crosstalk between the light-emitting elements. The driving circuits are connected to the inner pin pads and the light-emitting elements respectively. The driving circuits receive signals from the inner pin pads to control the brightness and light-emitting state of the light-emitting elements.

[0058] Specifically, the inner pin pad 20 can be connected to the output terminal 3 of the display driver chip 2, and / or the input terminal 4 of the display driver chip 2 is connected to one of the at least two pad units 31, and the pins of the input terminal 4 are connected to at least two pad units 311 of the pad unit 31 in a one-to-one correspondence.

[0059] In addition, the insulation between the first connecting line 321 and the second connecting line 322 can prevent the signal transmission of the first connecting line 321 from interfering with the signal transmission of the second connecting line 322, thereby improving the accuracy of signal transmission between the display driver chip 2 and the display panel.

[0060] The substrate 10 serves as the basic support structure for the display panel, bearing all other components of the display panel and ensuring its stability and structural integrity. In some embodiments, the substrate 10 may be glass or flexible plastic.

[0061] It should be noted that the first direction is Figure 4 The X direction is shown, and the second direction is... Figure 4 Y direction shown.

[0062] It should be noted that the first end of the first connection line 321 and the first end of the second connection line 322 are connected one-to-one with two pad units 311 in one of the pad units 31. This means that pad unit A (i.e., the pad unit 311 connected to the first end of the first connection line 321) and pad unit B (i.e., the pad unit 311 connected to the first end of the second connection line 322) are not the same pad unit 311, and pad unit A and pad unit B belong to the same pad unit 31. The second end of the first connection line 321 and the second end of the second connection line 322 are connected one-to-one with two pad units 311 in another pad unit 31. This means that pad unit C (i.e., the pad unit 311 connected to the second end of the first connection line 321) and pad unit D (i.e., the pad unit 311 connected to the second end of the second connection line 322) are not the same pad unit 311, and pad unit C and pad unit D belong to the same pad unit 31. Furthermore, pad unit A (i.e., pad unit 31 including pad unit A and pad unit B) is arranged adjacent to pad unit B (i.e., pad unit 31 including pad unit C and pad unit D).

[0063] It should be noted that the insulation between the first connecting line 321 and the second connecting line 322 includes at least the following two embodiments:

[0064] (1) The first connecting line 321 and the second connecting line 322 are spaced apart. According to electrical safety standards, the spacing parameters between the first connecting line 321 and the second connecting line 322 are set in combination with the voltage level to prevent arc discharge between the first connecting line 321 and the second connecting line 322.

[0065] (2) The connection structure 32 also includes an insulating layer, which is at least partially disposed between the first connecting line 321 and the second connecting line 322.

[0066] Specifically, the first connection 41 between the two pad units 311 connected to the first connection line 321 refers to the connection between the geometric centers of the two pad units 311 connected to the first connection line 321. The second connection 42 between the two pad units 311 connected to the second connection line 322 refers to the connection between the geometric centers of the two pad units 311 connected to the second connection line 322.

[0067] It should be noted that the difference between the first connection 41 and the first connection 321 is as follows:

[0068] (1) The first connecting line 41 is a geometric structure generated by connecting two points, and the first connecting line 321 is a solid connection structure that connects two pad units 311.

[0069] (2) Under the premise that the positions of the two pad units 311 connected to the first connection line 321 remain unchanged, the first connection line 41 is unique, but the routing structure of the first connection line 321 has multiple embodiments.

[0070] Furthermore, the difference between the second connection 42 and the second connection 322 is as follows:

[0071] (1) The second connection line 42 is a geometric structure generated by the connection of two points, and the second connection line 322 is a solid connection structure that connects the two pad units 311.

[0072] (2) Under the premise that the positions of the two pad units 311 connected to the second connection line 322 remain unchanged, the second connection line 42 is unique, but the routing structure of the second connection line 322 has multiple embodiments.

[0073] like Figure 4 and Figure 5 As shown, in some embodiments, the extension direction of the first connecting line 321 and the extension direction of the second connecting line 322 intersect each other, and the projection of the first connecting line 321 on the substrate 10 and the projection of the second connecting line 322 on the substrate 10 partially overlap.

[0074] In some optional embodiments of this application, the extension direction of the first connecting line 321 and the extension direction of the second connecting line 322 are arranged to intersect each other, so that the layout of the first connecting line 321 and the second connecting line 322 is compact, reducing the wiring length of the first connecting line 321 and the second connecting line 322.

[0075] It should be noted that the extension direction of the first connecting line 321 refers to the trajectory of its extension. For example, when the first connecting line 321 is an arc structure, its extension direction is parallel to the arc structure, not parallel to the first connecting line 41. Similarly, the extension direction of the second connecting line 322 refers to its trajectory. For example, when the second connecting line 322 is an arc structure, its extension direction is parallel to the arc structure, not parallel to the second connecting line 42.

[0076] like Figure 6 and Figure 7 As shown, in some embodiments, along the thickness direction of the substrate 10, the first connecting line 321 is at least partially located on the side of the second connecting line 322 away from the substrate 10.

[0077] In some optional embodiments of this application, along the thickness direction of the substrate 10, the first connecting line 321 is at least partially located on the side of the second connecting line 322 away from the substrate 10, such that the first connecting line 321 and the second connecting line 322 avoid each other in the thickness direction of the substrate 10.

[0078] It should be noted that the thickness direction of substrate 10 is perpendicular to the first direction, and the thickness direction of substrate 10 is perpendicular to the second direction. Figure 4 The Z direction is shown.

[0079] Wherein, along the thickness direction of the substrate 10, the first connecting line 321 is at least partially located on the side of the second connecting line 322 away from the substrate 10, including at least the following two embodiments:

[0080] (1) Along the thickness direction of the substrate 10, a portion of the structure of the first connecting line 321 is located on the side of the second connecting line 322 away from the substrate 10.

[0081] (2) Along the thickness direction of the substrate 10, the entire structure of the first connecting line 321 is located on the side of the second connecting line 322 away from the substrate 10.

[0082] like Figure 4 As shown, in some embodiments, at least two pad units 311 of a pad unit 31 are aligned in a first direction.

[0083] In some optional embodiments of this application, the pad unit 31 can effectively utilize the space of the substrate 10, reduce the area of ​​the substrate 10 occupied by the pad unit 31, increase the screen ratio, and reduce the alignment accuracy requirements of the pad unit 311. In addition, when the pad unit 311 is connected to the pin, stress concentration points can be reduced, the reliability of the connection between the pad unit 311 and the pin can be improved, and the risk of breakage or short circuit can be reduced.

[0084] It should be noted that at least two pad units 311 of the pad unit 31 are aligned in the first direction, which means that at least two pad units 311 of the pad unit 31 are arranged linearly.

[0085] Specifically, such as Figure 4 As shown, Figure 4 Two rows of pad units 31 are shown, with at least two pad units 311 in each row of pad units 31 being flush in a first direction.

[0086] like Figure 4 As shown, in some embodiments, the number of pad units 311 of the pad unit 31 gradually decreases in the direction along the first direction close to the inner pin pad 20.

[0087] In some embodiments, the first connecting line 321 has a first base segment and an upper protruding segment connected to each other. The first base segment is disposed in the same layer as the second connecting line 322, and the upper protruding segment protrudes in a direction away from the substrate 10 and is at least partially disposed in a layer with the second connecting line 322. The upper protruding segment avoids the second connecting line 322.

[0088] In some optional embodiments of this application, by utilizing the upper convex segment to avoid the second connecting line 322 in the thickness direction of the substrate 10, the minimum distance between the second connecting line 322 and the first connecting line 321 can be increased, effectively reducing crosstalk between the first connecting line 321 and the second connecting line 322. Furthermore, more complex wiring can be implemented within a limited space, effectively increasing the wiring density between the second connecting line 322 and the first connecting line 321, thus saving space.

[0089] It should be noted that the first base segment and the second connecting line 322 being arranged in the same layer means that the first base segment and the second connecting line 322 are formed by patterning the same metal conductive layer. In the thickness direction of the substrate 10, the first base segment and the second connecting line 322 can be arranged flush, or a part of the structure of one of the first base segment and the second connecting line 322 protrudes from the other of the first base segment and the second connecting line 322.

[0090] The first base segment and the second connecting line 322 are flush in the thickness direction of the substrate 10.

[0091] The upper convex segment protrudes in a direction away from the substrate 10 and is at least partially layered with the second connecting line 322, including the following two embodiments:

[0092] (1) The upper protrusion protrudes in a direction away from the substrate 10, and in the thickness direction of the substrate 10, part of the structure of the upper protrusion is misaligned with the second connecting line 322.

[0093] (2) The upper convex section protrudes in a direction away from the substrate 10, and in the thickness direction of the substrate 10, the entire structure of the upper convex section is misaligned with the second connecting line 322.

[0094] Specifically, during the molding process, the first base segment and the second connecting line 322 can be formed by patterning the same metal conductive layer, and the upper convex segment can be formed by patterning another metal conductive layer. A through hole can be provided between the two metal conductive layers, and the upper convex segment extends from the through hole to the first base segment and connects with the first base segment.

[0095] like Figure 6 and Figure 7 As shown, in some embodiments, the second connecting line 322 has a second base segment 3221 and a recessed segment 3222 connected to each other. The second base segment 3221 is disposed in the same layer as the first connecting line 321. The recessed segment 3222 protrudes toward the substrate 10 and is at least partially disposed in a layer with the first connecting line 321. The recessed segment 3222 avoids the first connecting line 321.

[0096] In some optional embodiments of this application, by utilizing the recessed section 3222 to avoid the first connecting line 321 in the thickness direction of the substrate 10, the minimum distance between the second connecting line 322 and the first connecting line 321 can be increased, effectively reducing crosstalk between the first connecting line 321 and the second connecting line 322. Furthermore, more complex wiring can be implemented within a limited space, effectively increasing the wiring density between the second connecting line 322 and the first connecting line 321, thus saving space.

[0097] It should be noted that the second base segment 3221 and the first connecting line 321 being arranged in the same layer means that the second base segment 3221 and the first connecting line 321 are formed by patterning the same metal conductive layer. In the thickness direction of the substrate 10, the second base segment 3221 and the first connecting line 321 can be arranged flush, or a portion of the structure of one of the second base segment 3221 and the first connecting line 321 protrudes from the other of the second base segment 3221 and the first connecting line 321.

[0098] The recessed section 3222 protrudes toward the substrate 10 and is at least partially layered with the first connecting line 321, including the following two embodiments:

[0099] (1) The recessed section 3222 protrudes toward the substrate 10, and in the thickness direction of the substrate 10, part of the structure of the recessed section 3222 is misaligned with the first connecting line 321.

[0100] (2) The recessed section 3222 protrudes toward the substrate 10, and in the thickness direction of the substrate 10, the entire structure of the recessed section 3222 is misaligned with the first connecting line 321.

[0101] Specifically, during the molding process, the second base segment 3221 and the first connecting line 321 can be patterned through the same metal conductive layer to form the recessed segment 3222, which can be patterned through another metal conductive layer. A through hole can be provided between the two metal conductive layers, and the recessed segment 3222 extends from the through hole to the first base segment and connects with the second base segment 3221.

[0102] In some embodiments, the projection of the first connecting line 321 on the substrate 10 extends along the first connecting line 41, and the projection of the second connecting line 322 on the substrate 10 extends along the second connecting line 42.

[0103] like Figure 4 and Figure 5As shown, in some optional embodiments of this application, the first connecting line 321 and the second connecting line 322 adopt a straight structure, which can reduce reflection and interference during signal transmission, enable the signal to be transmitted in a more stable manner, maintain the integrity of the signal, and also has the advantages of simple structure and easy processing. Moreover, compared with a curved structure, it can avoid excessive heat concentration in a certain local area.

[0104] Of course, the above-described method for the first connecting line 321 and the second connecting line 322 is only one of the optional embodiments, but is not limited thereto.

[0105] like Figure 8 As shown, in some other alternative embodiments, the projection of the first connection line 321 on the substrate 10 may extend along the first connection line 41. The second connection line 322 includes a first extension segment 3223, a second extension segment 3224, and a connecting segment 3225. The first end of the first extension segment 3223 is connected to one of the two adjacent pad units 31. The first end of the second extension segment 3224 is connected to the other pad unit 31. The connecting segment 3225 extends along a second direction. The connecting segment 3225 is located on the side of one of the two adjacent pad units 31 facing away from the other pad unit 31 in the first direction. The second end of the first extension segment 3223 and the second end of the second extension segment 3224 are both connected to the connecting segment 3225.

[0106] In some optional embodiments of this application, the projections of the first connecting line 321 on the substrate 10 and the second connecting line 322 on the substrate 10 are staggered, so that the first connecting line 321 and the second connecting line 322 can be arranged in the same layer without interfering with each other, thereby reducing the thickness of the display panel.

[0107] like Figure 4 As shown, in some embodiments, the external pin pads 30 are symmetrically arranged, and the axis of symmetry of the external pin pads 30 extends along a first direction.

[0108] In some optional embodiments of this application, when the pad unit 311 is connected to the pin, the symmetrical arrangement of the outer pin pads 30 allows for a uniform stress distribution between the pad unit 311 and the pin. This uniform stress distribution along the axis of symmetry reduces stress concentration points, improves the reliability of the connection between the pad unit 311 and the pin, and reduces the risk of breakage or short circuits. The uniform stress distribution also improves the durability of the pad unit 311 and extends the product's lifespan.

[0109] In addition, the symmetrical arrangement of the external pin pads 30 can optimize the spatial layout, reduce the area of ​​the substrate 10 occupied by the pad unit 31, and improve the screen ratio, which is especially important for display devices that pursue a high screen ratio (such as smartphones, tablets, etc.).

[0110] In some embodiments, the external pin pad 30 includes at least three pad units 31 and at least two connection structures 32, with a connection structure 32 provided between every two adjacent pad units 31.

[0111] If the number of pad units 31 is N (N is an integer and N≥3), then the number of connection structures 32 can be selected as N-1.

[0112] like Figure 6 and Figure 7 As shown, in some embodiments, the connection structure 32 further includes an insulating layer 33, which is at least partially disposed between the first connecting line 321 and the second connecting line 322.

[0113] In some optional embodiments of this application, by providing an insulating layer 33, the first connecting line 321 and the second connecting line 322 are isolated by the insulating layer 33, so that the first connecting line 321 and the second connecting line 322 are insulated from each other. This allows the gap between the first connecting line 321 and the second connecting line 322 to be reduced while ensuring that the first connecting line 321 and the second connecting line 322 are insulated from each other, which helps to make the layout of the first connecting line 321 and the second connecting line 322 more compact.

[0114] It should be noted that the insulating layer 33 is at least partially disposed between the first connecting line 321 and the second connecting line 322, including at least the following two embodiments:

[0115] (1) Part of the structure of the insulating layer 33 is disposed between the first connecting line 321 and the second connecting line 322;

[0116] (2) The entire structure of the insulating layer 33 is arranged between the first connecting line 321 and the second connecting line 322.

[0117] In some embodiments, the first connecting line 41 and / or the second connecting line 42 are arranged at an angle to the first direction.

[0118] It should be noted that the first connecting line 41 and / or the second connecting line 42 are set at an angle to the first direction, including the following three embodiments:

[0119] (1) The first connecting line 41 is set at an angle to the first direction;

[0120] (2) The second connecting line 42 is set at an angle to the first direction;

[0121] (3) Both the first connecting line 41 and the second connecting line 42 are set at an angle to the first direction.

[0122] In some embodiments, the first direction and the second direction are perpendicular.

[0123] In some embodiments, at least two pad units 31 have different pad densities.

[0124] It should be noted that the pad density of pad unit 31 refers to the center distance between adjacent pad units 311 in pad unit 31.

[0125] In some optional embodiments of this application, at least two sets of pad units 31 have different pad densities, thereby enabling them to meet the docking requirements of display driver chips 2 with different pin densities of input terminals 4.

[0126] like Figure 4 As shown, in some embodiments, the inner pin pad 20 includes at least two pad rows 21, which are spaced apart along a first direction, and each pad row 21 includes at least two pad elements 22 spaced apart along a second direction.

[0127] In some optional embodiments of this application, the inner pin pad 20 can be connected to the output terminal 3 of the display driver chip 2, and the pins of the output terminal 3 can be connected one-to-one with at least two pads 22 of the inner pin pad 20.

[0128] It should be noted that the inner pin pad 20 includes a plurality of pads 22 arranged in an array, and the pad row includes at least two pads 22 arranged in a row along the second direction.

[0129] like Figure 4 As shown, in some embodiments, the number of pads 22 of the pad row 21 gradually decreases in the direction along the first direction close to the outer pin pad 30.

[0130] In some optional embodiments of this application, reducing the number of pads 22 on the pad row 21 in the direction close to the outer pin pad 30 along the first direction can increase the airflow channel, which is beneficial for heat to be dissipated by air convection and provides more space for heat dissipation.

[0131] like Figure 4 As shown, in some embodiments, the inner pin pads 20 are symmetrically arranged, and the axis of symmetry of the inner pin pads 20 extends along a first direction.

[0132] In some optional embodiments of this application, when the pad unit 311 is connected to the pin, the symmetrical arrangement of the outer pin pads 30 allows for a uniform stress distribution between the pad unit 311 and the pin. This uniform stress distribution along the axis of symmetry reduces stress concentration points, improves the reliability of the connection between the pad unit 311 and the pin, and reduces the risk of breakage or short circuits. The uniform stress distribution also improves the durability of the pad unit 311 and extends the product's lifespan.

[0133] In addition, the symmetrical arrangement of the external pin pads 30 can optimize the spatial layout, reduce the area of ​​the substrate 10 occupied by the pad unit 31, and improve the screen ratio, which is especially important for display devices that pursue a high screen ratio (such as smartphones, tablets, etc.).

[0134] Furthermore, since the axis of symmetry of the outer pin pad 30 and the axis of symmetry of the inner pin pad 20 extend in the same direction, the alignment process is simpler and more accurate when the display panel is connected to the display driver chip 2, reducing alignment errors.

[0135] In some embodiments, such as Figure 5 As shown, the connection structure 32 also includes a third connection line 323. One end of the third connection line 323 is connected to a pad unit 311 of one of the two adjacent pad units 31, and the other end of the third connection line 323 is connected to a pad unit 311 of the other pad unit 31. The connection between the two pad units 311 connected to the third connection line 323 is the third connection line 43. The first connection line 41 and the second connection line 42 do not cross the third connection line 43.

[0136] It should be noted that the difference between the third connection 43 and the third connection 323 is as follows:

[0137] (1) The third connection line 43 is a geometric structure generated by the connection of two points, and the third connection line 323 is a solid connection structure that connects the two pad units 311.

[0138] (2) Under the premise that the positions of the two pad units 311 connected to the third connection line 323 remain unchanged, the third connection line 43 is unique, but the routing structure of the third connection line 323 has multiple embodiments.

[0139] In some embodiments, such as Figure 9 As shown, the substrate 10 includes a display part 11, a bending part 12 and a bonding part 13 connected in sequence. The bonding part 13 and the display part 11 are disposed opposite to each other in the thickness direction of the substrate 10. The bonding part 13 is bent to the backlight surface M2 side of the substrate 10 through the bending part 12. The inner lead pad 20 and the outer lead pad 30 are both disposed on the side of the bonding part 13 away from the display part 11.

[0140] The display unit 11 is a component in the substrate 10 used to achieve the display effect. Normally, the side of the display unit 11 facing away from the binding part 13 is the light-emitting surface M1 of the display unit 11, which is used to display specific images or videos to the user.

[0141] It should be noted that, as Figure 9As shown, in addition to the display part 11, the bending part 12 and the bonding part 13, the substrate 10 may also include a buffer layer 14 and a support layer 15. The buffer layer 14 is used to achieve the buffering effect of the display device. There are two support layers 15, which are located on both sides of the buffer layer 14 to support the bonding part 13 and the display part 11.

[0142] Another embodiment of this application provides a display device, which includes the display panel provided above. Using the display device provided in this embodiment, since the inner pin pads 20 and outer pin pads 30 are spaced apart along a first direction, and at least two pad units 31 are spaced apart along the first direction, the spacing between each pad unit 31 and the inner pin pad 20 is different, thereby enabling compatibility with the docking requirements of display driver chips 2 with different spacing between output terminals 3 and input terminals 4. Furthermore, since the first connection 41 and the second connection 42 are intersected, the arrangement of at least two pad units 311 in each pad unit 31 is different, thereby enabling compatibility with the docking requirements of display driver chips 2 with different pin arrangements of the input terminals 4. Therefore, the display panel 1 of the display device provided in this embodiment can be adapted to various display driver chips 2. When the product is updated, only the display driver chip 2 needs to be replaced to meet the driving requirements of the display panel 1. Before and after the display driver chip 2 is replaced, there is no need to replace the display panel 1. There is no need to set up multiple display panels for different display driver chips 2 (for display driver chips 2 with different spacing between output terminals 3 and input terminals 4 and different pin arrangements of input terminals 4), so as to save display panel development costs and meet more complex market demands.

[0143] In this embodiment, the display device further includes a driver chip, which is disposed on the bonding portion 13 of the display panel 1. The driver chip includes a display driver chip 2 and a touch driver chip. The display driver chip 2 is used to store image data, generate driving voltage, and also improve image quality through customized algorithms. The internal pin pads 20 are connected to the output terminals 3 of the display driver chip 2, and / or, the input terminals 4 of the display driver chip 2 are connected to one of the at least two pad units 31, with the pins of the input terminal 4 corresponding to at least two pad units 311 of the pad unit 31. The touch driver chip mainly implements touch signal processing and is an essential component of a display device with touch functionality. Of course, the display driver chip 2 and the touch driver chip can also be integrated and disposed on the bonding portion 13.

[0144] It should be noted that the display device provided in this application embodiment has the beneficial effects of the display panel in any of the foregoing embodiments. For details, please refer to the foregoing description of the beneficial effects of the display panel. This application embodiment will not repeat the description.

[0145] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0146] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display panel, characterized in that, The display panel includes a substrate, inner lead pads, and outer lead pads. The inner lead pads and the outer lead pads are disposed on the substrate at a distance along a first direction. The outer lead pads include: At least two pad units are spaced apart along the first direction, and each pad unit includes at least two pad individuals spaced apart along the second direction, wherein the first direction and the second direction are arranged at an angle. The connection structure electrically connects two adjacent pad units. The connection structure includes a first connection line and a second connection line. The first end of the first connection line and the first end of the second connection line are connected to two individual pads of one of the pad units, and the second end of the first connection line and the second end of the second connection line are connected to two individual pads of the other pad unit. The first connection line and the second connection line are insulated from each other. The connection between the two pad units connected to the first connection line is the first connection line, and the connection between the two pad units connected to the second connection line is the second connection line. The first connection line and the second connection line are arranged to cross each other.

2. The display panel according to claim 1, characterized in that, The extension directions of the first connecting line and the extension directions of the second connecting line are intersecting each other; Preferably, the projections of the first connecting line on the substrate and the projections of the second connecting line on the substrate partially overlap; Preferably, along the thickness direction of the substrate, the first connecting line is at least partially located on the side of the second connecting line opposite to the substrate; Preferably, at least two of the individual pads of the pad unit are aligned in the first direction; Preferably, the number of individual pads in the pad unit gradually decreases in the direction along the first direction toward the inner pin pad.

3. The display panel according to claim 2, characterized in that, The first connecting line has a first base segment and an upper protruding segment connected to each other. The first base segment is disposed on the same layer as the second connecting line. The upper protruding segment protrudes in a direction away from the substrate and is at least partially disposed on a layer with the second connecting line. The upper protruding segment avoids the second connecting line. And / or, The second connecting line has a second base segment and a recessed segment connected to each other. The second base segment is disposed in the same layer as the first connecting line. The recessed segment protrudes toward the substrate and is at least partially disposed in a layer with the first connecting line. The recessed segment avoids the first connecting line.

4. The display panel according to claim 1, characterized in that, The projection of the first connecting line on the substrate extends along the first connecting line, and the projection of the second connecting line on the substrate extends along the second connecting line. or, The projection of the first connecting line on the substrate extends along the first connecting line. The second connecting line includes a first extension segment, a second extension segment, and a connecting segment. The first end of the first extension segment is connected to one of the two adjacent pad units. The first end of the second extension segment is connected to the other pad unit. The connecting segment extends along the second direction. The connecting segment is located on the side of one of the two adjacent pad units away from the other pad unit in the first direction. The second ends of the first extension segment and the second end of the second extension segment are both connected to the connecting segment.

5. The display panel according to claim 1, characterized in that, The external pin pads are symmetrically arranged, and the axis of symmetry of the external pin pads extends along the first direction; Preferably, the external pin pad includes at least three pad units, and the external pin pad includes at least two connection structures, with one connection structure provided between every two adjacent pad units.

6. The display panel according to any one of claims 1 to 5, characterized in that, The connection structure further includes an insulating layer, which is at least partially disposed between the first connecting line and the second connecting line.

7. The display panel according to any one of claims 1 to 5, characterized in that, The first connecting line and / or the second connecting line are set at an angle to the first direction; and / or, The first direction and the second direction are perpendicular.

8. The display panel according to any one of claims 1 to 5, characterized in that, At least two of the said pad units have different pad densities.

9. The display panel according to any one of claims 1 to 5, characterized in that, The inner pin pads include at least two pad rows, the at least two pad rows are spaced apart along the first direction, and each pad row includes at least two pad elements spaced apart along the second direction; Preferably, the number of pads in the pad row gradually decreases in the direction along the first direction toward the outer pin pad; Preferably, the inner pin pads are symmetrically arranged, and the axis of symmetry of the inner pin pads extends along the first direction.

10. A display device, characterized in that, The display device includes the display panel according to any one of claims 1 to 9.

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