Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation layer arranged on one side of the substrate, a plurality of first light-emitting units and a plurality of first encapsulation structures. The isolation layer comprises an isolation structure and a plurality of isolation openings formed by the isolation structure. The first light-emitting unit comprises a first electrode, a first light-emitting structure and a second electrode arranged in layers. The first encapsulation structure is arranged on the side of the first light-emitting unit away from the substrate. Part of the first encapsulation structure is located on the side of the isolation structure away from the substrate. The orthographic projection of the first electrode on the substrate is located in the orthographic projection of the corresponding first encapsulation structure on the substrate. The distance between the contour of the orthographic projection of the first encapsulation structure on the substrate and the contour of the orthographic projection of the first electrode on the substrate is greater than 15 microns. The display panel has good display effect.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising next-generation flat panel display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant aspects of fine metal mask-less technology and are provided for reference.

[0004] However, current OLED display panels still suffer from display defects. Summary of the Invention

[0005] Therefore, it is necessary to provide a display panel, a method for manufacturing the display panel, and a display device that improves upon the above-mentioned problems.

[0006] In a first aspect, this application provides a display panel, including:

[0007] substrate;

[0008] An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure.

[0009] Multiple first light-emitting units are disposed on one side of the substrate; each first light-emitting unit includes a first electrode, a first light-emitting structure and a second electrode stacked together, and each first light-emitting unit has a first encapsulation structure on the side facing away from the substrate;

[0010] A first packaging structure is disposed on the side of the corresponding first light-emitting unit away from the substrate. A portion of the first packaging structure is located on the side of the isolation structure away from the substrate. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first packaging structure on the substrate. The distance between the outline of the orthographic projection of the first packaging structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers.

[0011] In some embodiments, the surface of the first packaging structure facing away from the substrate has a first step;

[0012] The first step includes a first surface, a first discontinuity surface, and a second surface. The first surface is connected to the second surface through the first discontinuity surface. The first surface is located on the side of the second surface away from the substrate. The orthographic projection of the first discontinuity surface on the substrate is located outside the edge of the orthographic projection of the first electrode on the substrate.

[0013] In some embodiments, a protection zone is provided on the second surface, one boundary of the protection zone is connected to the first discontinuity surface, and the distance between the other boundary of the protection zone and the first discontinuity surface is greater than 15 micrometers.

[0014] In some embodiments, the isolation structure includes a first film layer and a second film layer stacked together, wherein the orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate; and the orthographic projection of the first film layer on the substrate and the orthographic projection of the first electrode on the substrate overlap.

[0015] Optionally, the surface of the first film layer facing away from the substrate has a second step, and the surface of the second film layer facing away from the substrate has a third step;

[0016] The second step includes a third surface, a second discontinuity surface, and a fourth surface. The third surface is connected to the fourth surface through the second discontinuity surface, and the third surface is located on the side of the fourth surface away from the substrate.

[0017] The third step includes a fifth surface, a third discontinuity surface, and a sixth surface; the fifth surface is connected to the sixth surface through the third discontinuity surface, and the fifth surface is located on the side of the sixth surface away from the substrate.

[0018] In some embodiments, the display panel further includes: a pixel defining layer disposed on one side of the substrate, the pixel defining layer including a plurality of pixel openings; the plurality of isolation openings being correspondingly connected to the plurality of pixel openings;

[0019] Optionally, the pixel defining layer has a fourth step on the side of its surface facing away from the substrate, the fourth step including a seventh surface, a fourth discontinuity surface, and an eighth surface; the seventh surface is connected to the eighth surface through the fourth discontinuity surface, and the seventh surface is located on the side of the eighth surface facing away from the substrate.

[0020] In some embodiments, the outline of the orthographic projection of the first packaging structure on the substrate has two first sides disposed opposite each other along a first direction, and the orthographic projection of the two first sides on the substrate is located outside the orthographic projection of the first electrode on the substrate.

[0021] Optionally, the outline of the orthographic projection of the first packaging structure on the substrate has two second sides disposed opposite each other along a second direction, and the orthographic projection of portions of the two second sides on the substrate overlaps with the orthographic projection of the first electrode on the substrate.

[0022] In some embodiments, the orthographic projection of the first packaging structure on the substrate is located outside the orthographic projection of the first electrode on the substrate.

[0023] In some embodiments, the display panel further includes a plurality of second light-emitting units and a second encapsulation structure disposed on one side of the substrate. The second light-emitting unit includes a third electrode, a second light-emitting structure, and a fourth electrode stacked together. The second encapsulation structure is disposed on the side of the corresponding second light-emitting unit facing away from the substrate.

[0024] The orthographic projection of the second packaging structure corresponding to the third electrode on the substrate is spaced apart from the orthographic projection of the first packaging structure corresponding to the first electrode on the substrate.

[0025] In some embodiments, the display panel further includes a plurality of third light-emitting units and a third encapsulation structure. The third light-emitting units are disposed on one side of the substrate and include a fifth electrode, a third light-emitting structure, and a sixth electrode stacked together. The third encapsulation structure is disposed on the side of the corresponding third light-emitting unit facing away from the substrate.

[0026] The orthographic projection of the third packaging structure corresponding to the fifth electrode on the substrate is spaced apart from the orthographic projection of the first packaging structure corresponding to the first electrode on the substrate.

[0027] Secondly, embodiments of this application provide a display panel, including:

[0028] substrate;

[0029] An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure.

[0030] Multiple first light-emitting units are disposed on one side of the substrate; each first light-emitting unit includes a first electrode, a first light-emitting structure, and a second electrode stacked together.

[0031] Multiple first packaging structures are provided on the side of the corresponding first light-emitting unit away from the substrate. A portion of the first packaging structure is located on the side of the isolation structure away from the substrate. The surface of the first packaging structure away from the substrate has a first step. The orthographic projection of the first packaging structure on the substrate covers the orthographic projection of the first step on the substrate.

[0032] In some embodiments, the distance between the outline of the orthographic projection of the first packaging structure on the substrate and the outline of the orthographic projection of the first step on the substrate is greater than 15 micrometers.

[0033] Optionally, the first step includes a first surface, a first discontinuity surface, and a second surface. The first surface is connected to the second surface through the first discontinuity surface. The first surface is located on the side of the second surface away from the substrate. The distance between the outline of the orthographic projection of the first discontinuity surface on the substrate and the outline of the orthographic projection of the first packaging structure on the substrate is greater than 15 micrometers.

[0034] Thirdly, embodiments of this application provide a method for manufacturing a display panel, comprising:

[0035] Provide substrate;

[0036] An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes;

[0037] A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate, and an isolation material layer is formed on the side of the pixel material layer facing away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings.

[0038] A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate. An encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate. A photoresist material layer is formed on the side of the encapsulation material layer facing away from the substrate. The photoresist material layer is subjected to a third patterning process to form a plurality of first photolithographic structures. The plurality of first photolithographic structures are correspondingly disposed with the plurality of first electrodes. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first photolithographic structure on the substrate. The distance between the outline of the orthographic projection of the first photolithographic structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers.

[0039] The encapsulation material layer and the light-emitting material layer are subjected to a fourth patterning process to form a first light-emitting structure in a plurality of first encapsulation structures and a plurality of first light-emitting units; wherein, the plurality of first light-emitting units are correspondingly arranged with the plurality of pixel openings; the plurality of first encapsulation structures are correspondingly arranged with the plurality of first light-emitting units; the plurality of first photolithography structures are correspondingly arranged with the plurality of first light-emitting units; the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first encapsulation structure on the substrate, and the distance between the outline of the orthographic projection of the first encapsulation structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers.

[0040] In some embodiments, the method further includes:

[0041] The plurality of first photolithographic structures are peeled off from the side of the first packaging structure away from the substrate.

[0042] In some embodiments, the method further includes:

[0043] An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of third electrodes;

[0044] A pixel material layer is formed on the side of the substrate and the third electrode facing away from the substrate, and an isolation material layer is formed on the side of the pixel material layer facing away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings.

[0045] A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate, and a photoresist material layer is formed on the side of the encapsulation material layer facing away from the substrate. The photoresist material layer is subjected to a third patterning process to form a plurality of second photolithographic structures. The plurality of second photolithographic structures are correspondingly disposed with the plurality of third electrodes, and the orthographic projection of the third electrode on the substrate is located within the orthographic projection of the corresponding second photolithographic structure on the substrate.

[0046] The encapsulation material layer and the light-emitting material layer are subjected to a fourth patterning process to form a second light-emitting structure in a plurality of second encapsulation structures and a plurality of second light-emitting units; wherein, the plurality of second light-emitting units are correspondingly arranged with the plurality of pixel openings; the plurality of second encapsulation structures are correspondingly arranged with the plurality of second light-emitting units; and the plurality of second photolithography structures are correspondingly arranged with the plurality of second light-emitting units.

[0047] In some embodiments, the method further includes:

[0048] The plurality of second photolithographic structures are peeled off from the side of the plurality of second packaging structures away from the substrate.

[0049] In some embodiments, the method further includes:

[0050] An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of fifth electrodes;

[0051] A pixel material layer is formed on the side of the substrate and the fifth electrode facing away from the substrate, and an isolation material layer is formed on the side of the pixel material layer facing away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings.

[0052] A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate, and a photoresist material layer is formed on the side of the encapsulation material layer facing away from the substrate. The photoresist material layer is subjected to a third patterning process to form a plurality of third photolithography structures. The plurality of third photolithography structures are correspondingly disposed with the plurality of fifth electrodes, and the orthographic projection of the fifth electrode on the substrate is located within the orthographic projection of the corresponding third photolithography structure on the substrate.

[0053] The encapsulation material layer and the light-emitting material layer are subjected to a fourth patterning process to form a third light-emitting structure in a plurality of third encapsulation structures and a plurality of third light-emitting units; wherein, the plurality of third light-emitting units are correspondingly arranged with the plurality of pixel openings; the plurality of third encapsulation structures are correspondingly arranged with the plurality of third light-emitting units; and the plurality of third photolithography structures are correspondingly arranged with the plurality of third light-emitting units.

[0054] In some embodiments, the method further includes:

[0055] The plurality of third photolithographic structures are peeled off from the side of the plurality of third packaging structures away from the substrate.

[0056] The display panel fabrication method provided in this application increases the coverage area of ​​the photoresist on the light-emitting unit by expanding the photoresist on the light-emitting unit. Even if the photoresist is missing, the light-emitting unit will not be affected because the photoresist is missing at the boundary of the photoresist. This ensures the light-emitting effect of the light-emitting unit and makes the display panel display well.

[0057] Thirdly, embodiments of this application provide a display device, including the display panel described in the first aspect or the display panel described in the second aspect. Attached Figure Description

[0058] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0059] Figure 1 One of the top views of the display panel provided in the embodiments of this application;

[0060] Figure 2 One of the partial cross-sectional views of the display panel provided in the embodiments of this application;

[0061] Figure 3 A second top view of the display panel provided in an embodiment of this application;

[0062] Figure 4 A second partial cross-sectional view of the display panel provided in an embodiment of this application;

[0063] Figure 5 A third partial cross-sectional view of the display panel provided in an embodiment of this application;

[0064] Figure 6One of the partial top views of the display panel provided in the embodiments of this application;

[0065] Figure 7 A second partial top view of the display panel provided in an embodiment of this application;

[0066] Figure 8 A third partial top view of the display panel provided in an embodiment of this application;

[0067] Figure 9 Fourth partial top view of the display panel provided in the embodiments of this application;

[0068] Figure 10 Fourth partial cross-sectional view of the display panel provided in the application embodiment;

[0069] Figure 11 One of the flowcharts for a method of manufacturing a display panel provided in an embodiment of this application;

[0070] Figure 12 Fifth partial cross-sectional view of the display panel provided in the application embodiment;

[0071] Figure 13 A second flowchart illustrating the method for manufacturing a display panel provided in this application embodiment;

[0072] Figure 14 The third flowchart illustrating the method for manufacturing a display panel provided in this application embodiment;

[0073] Figure 15 The fourth flowchart illustrating the method for manufacturing a display panel provided in this application embodiment;

[0074] Figure 16 The fifth flowchart illustrates the method for manufacturing a display panel as provided in the embodiments of this application.

[0075] Figure 17 A flowchart of the method for manufacturing a display panel provided in the embodiments of this application (number six);

[0076] Explanation of reference numerals in the attached figures:

[0077] 10. Display panel; 11. Substrate; 12. Isolation layer; 121. Isolation structure; 121a. First film layer; 121b. Second film layer; 122. Isolation opening; 13. Light-emitting unit; 131. First light-emitting unit; 131a. First electrode; 131b. First light-emitting structure; 131c. Second electrode; 132. Second light-emitting unit; 132a. Third electrode; 132b. Second light-emitting structure; 132c. Fourth electrode; 133. Third light-emitting unit; 133a. Fifth electrode; 133b. Third light-emitting structure; 133c. Sixth electrode; 14. Packaging structure; 141. First packaging structure; 142. Second packaging structure; 143. Third packaging structure; 15. Photoresist layer; 151. First photolithography. Structure; 16, Pixel-limited layer; 141a, First step; 141a1, First surface; 141a2, First discontinuity surface; 141a3, Second surface; 141a4, Protected area; 121aa, Second step; 121aa1, Third surface; 121aa2, Second discontinuity surface; 121aa3, Fourth surface; 121ba, Third step; 121ba1, Fifth surface; 121ba2, Third discontinuity surface; 121ba3, Sixth surface; 16a, Fourth step; 16a1, Seventh surface; 16a2, Fourth discontinuity surface; 16a3, Eighth surface; 141a, First edge; 141b, Second edge; 141b1, First sub-edge; 141b2, Second sub-edge; 141b3, Third sub-edge. Detailed Implementation

[0078] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0079] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0080] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0081] In related technologies, during the patterning of R, G, and B pixels in a display panel, a photoresist layer PR is typically formed on the pixel's encapsulation layer CVD1. During dry etching, the photoresist layer PR protects the CVD1 encapsulation layer that needs to be retained, while removing the unwanted CVD1. If the photoresist PR is missing during dry etching, the CVD1 that needs to be retained will be etched away, leading to CVD1 encapsulation failure, and even pixel failure, thereby reducing the display effect of the display panel.

[0082] In view of the above problems, this application provides a display panel, a method for manufacturing the display panel, and a display device to improve the problem of poor CVD1 encapsulation effect caused by the absence of photoresist PR.

[0083] The following describes the display panel 10 provided in the embodiments of this application.

[0084] refer to Figure 1 The top view shown and Figure 2 The cross-sectional view ( Figure 2 for Figure 1 (Partial cross-sectional view of AA' in the image), this application embodiment provides a display panel 10, which includes a substrate 11, an isolation layer 12, a plurality of light-emitting units 13, and a plurality of encapsulation structures 14; wherein, the isolation layer 12 is disposed on one side of the substrate 11, and includes an isolation structure 121 and a plurality of isolation openings 122 formed by the isolation structure 121; the plurality of light-emitting units 13 are disposed on one side of the substrate 11; each light-emitting unit 13 has an encapsulation structure 14 on the side facing away from the substrate 11; the plurality of light-emitting units 13 are used to emit light of different colors, and based on this, the plurality of light-emitting units 13 may include at least one first light-emitting unit 131, at least one second light-emitting unit 132, and at least one third light-emitting unit 133. It should be noted that, Figure 1 This refers to a display panel where all pixels have been etched and patterned. Additionally, Figure 2 , Figure 4 and Figure 5 The example shown is a pixel-limiting layer, which is only for illustrative purposes. In actual applications, the display panel may not include a pixel-limiting layer, and this example does not limit this.

[0085] The display panel 10 can be an organic light-emitting diode (OLED) display panel, a micro organic light-emitting diode (Micro OLED) display panel, a light-emitting diode (LED) display panel, a quantum dot light-emitting diode (QLED) display panel, a mini light-emitting diode (MiniLED) display panel, a micro light-emitting diode (Micro LED) display panel, or a liquid crystal display (LCD) display panel, etc. This application uses an OLED display panel as an example for illustration.

[0086] In some embodiments, multiple light-emitting units 13 may be arranged in an array. Each light-emitting unit 13 may include an emission layer (EML). The light-emitting unit 13 may also include one or more of the following: a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL). Alternatively, the light-emitting unit 13 may be a stacked light-emitting structure, i.e., it may include at least two light-emitting layers and a charge generation layer (CGL) located between adjacent light-emitting layers.

[0087] In some embodiments, multiple light-emitting units 13 are used to emit light of different colors. For example, three light-emitting units 13 may be a light-emitting unit emitting red light, a light-emitting unit emitting green light, and a light-emitting unit emitting blue light, respectively. In other examples, the multiple light-emitting units 13 may also include a light-emitting unit emitting white light. See also... Figure 1 The multiple light-emitting units 13 include a first light-emitting unit 131 that emits blue light, a second light-emitting unit 132 that emits green light, and a third light-emitting unit 133 that emits red light.

[0088] In some embodiments, the isolation structure 121 may refer to an undercut structure that is wider at the top and narrower at the bottom, capable of separating adjacent light-emitting units 1. The isolation structure 121 may be a structure formed by a single film layer or a structure formed by stacking multiple film layers. For example, the cross-sectional shape of the isolation structure 121 may be an inverted trapezoid, a "T" shape, or an "I" shape, etc., which are wider at the top and narrower at the bottom. The isolation structure 121 in the embodiments of this application may be a structure formed by two film layers. This is only an example and the number of film layers contained in the isolation structure 121 is not limited. For example, the isolation structure 121 may be a structure formed by three film layers.

[0089] Optionally, each isolation structure 121 includes a first film layer 121a and a second film layer 121b stacked along a direction away from the substrate 11, with the orthographic projection of the first film layer 121a onto the substrate 11 located within the orthographic projection of the second film layer 121b onto the substrate 11; at least a portion of the second electrodes 131c of the first light-emitting units 131 are in contact with the first film layer 121a. Thus, the second electrodes 131c can be electrically connected to the isolation structure 121. The first film layer 121a can be a conductive portion, and the second film layer 121b can be a blocking portion.

[0090] Optionally, at least one of the first film layer 121a and the second film layer 121b may be made of a conductive material. The material of at least one of the first film layer 121a and the second film layer 121b may include metals such as titanium, silver, copper, aluminum, and molybdenum, or alloys, or conductive oxides, such as any one or more of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), zinc gallium oxide, titanium tantalum oxide, tin oxide, cadmium oxide, and indium oxide. For example, the isolation structure 121 may be a ground wire isolation structure, i.e., a VSS isolation structure. In other examples, the material of at least one of the first film layer 121a and the second film layer 121b may be an insulating material; this embodiment of the application does not limit this.

[0091] Optionally, in embodiments where at least one of the first film layer 121a and the second film layer 121b is made of a conductive material, the second electrode 131c in the first light-emitting unit 13 can be electrically connected to the isolation structure 121. This facilitates the electrical connection of the second electrode 131c to the power line through the isolation structure 121, thereby optimizing the wiring layout of the display panel 10.

[0092] Optionally, see Figure 2The isolation layer 12 shown has a first film layer 121a in the isolation structure 121 with a lower surface (bottom surface) and an upper surface (top surface) that is a plane; and a second film layer 121b in the isolation structure 121 with a lower surface (bottom surface) and an upper surface (top surface) that is a plane. However, due to the influence of the manufacturing process, the lower surface (bottom surface) and upper surface (top surface) of the first film layer 121a, and the lower surface (bottom surface) and upper surface (top surface) of the second film layer 121b may be uneven and have a certain degree of roughness. This can affect the flatness of the lower surface (bottom surface) and upper surface (top surface) of the encapsulation structure 14 attached to the upper surface (top surface) of the second film layer 121b, which can lead to the photoresist attached to the upper surface of the encapsulation structure 14 being easily lost, thus affecting the encapsulation effect of the encapsulation structure.

[0093] In some embodiments, the encapsulation structure 14 is an inorganic film layer. The encapsulation structure 14 is a continuous film layer structure, which allows for a larger contact area between the encapsulation structure 14 and other film layers in the display panel 10, thereby improving the connection stability of the encapsulation structure 14 and enhancing the encapsulation reliability.

[0094] refer to Figure 3 The top view shown and Figure 4 The cross-sectional view ( Figure 4 for Figure 1 (Partial cross-sectional view of BB'), this application embodiment provides a display panel 10, which includes a substrate 11, an insulating layer 12, and a plurality of first light-emitting units 131 ( Figure 4 (Taking one first light-emitting unit 131 as an example) and multiple first packaging structures 141; wherein, the isolation layer 12 is disposed on one side of the substrate 11, and includes an isolation structure 121 and multiple isolation openings 122 formed by the isolation structure 121; multiple first light-emitting units 131 are disposed on one side of the substrate 11; each first light-emitting unit 131 includes a first electrode 131a, a first light-emitting structure 131b and a second electrode 131c stacked together, and the first packaging structure 141 is disposed on the side of the corresponding first light-emitting unit 131 away from the substrate 11; a portion of the first packaging structure 141 is located on the side of the isolation structure 121 away from the substrate 11, that is, a portion of the first packaging structure 141 is located on the side of the isolation structure 121 away from the substrate 11; the orthographic projection of the first electrode 131a on the substrate 11 is located within the orthographic projection of the corresponding first packaging structure 141 on the substrate 11, and the outline of the orthographic projection of the first packaging structure 141 on the substrate 11 (see Figure 4 The outline of the first electrode 131a projected onto the substrate 11 (see schematic diagram marked LL in the diagram) and the orthographic projection of the first electrode 131a onto the substrate 11 (see schematic diagram marked LL in the diagram). Figure 4 The distance between (see the diagram marked KK) Figure 4 The range of distances marked as u is greater than 15 micrometers.

[0095] In some embodiments, one of the first electrode 131a and the second electrode 131c can be an anode, and the other of the first electrode 131a and the second electrode 131c can be a cathode. This application describes an embodiment where the first electrode 131a is the anode and the second electrode 131c is the cathode.

[0096] In some embodiments, the first electrode 131a may be electrically connected to a pixel driving circuit, and the pixel driving circuit may be electrically connected to a first power line. The second electrode 131c may be electrically connected to a second power line. One of the first power line and the second power line is used to transmit a high voltage, and the other is used to transmit a low voltage. For example, the first power line is used to transmit a high voltage, and the second power line is used to transmit a low voltage.

[0097] In some embodiments, the distance between the outline of the orthographic projection of the first packaging structure 141 on the substrate 11 and the outline of the orthographic projection of the first electrode 131a on the substrate 11 is greater than 15 micrometers. This indicates that the boundary of the first packaging structure 141 (the boundary marked by the dashed line L in the figure) is extended outward relative to the first electrode 131a by a large distance. This means that even if the boundary of the photoresist layer to be coated on the first packaging structure 141 falls off during the fabrication of the display panel, resulting in the boundary of the first packaging structure 141 being etched away, the light-emitting effect of the first light-emitting unit will not be affected.

[0098] The display panel provided in this application embodiment has a first encapsulation structure with an outwardly expanding boundary corresponding to the first light-emitting unit in the display panel. Since the photoresist layer on the encapsulation layer is prone to be missing during the manufacturing process of the display panel, especially at the boundary of the photoresist layer, the boundary of the encapsulation layer under the photoresist layer is also over-etched and missing. Therefore, the outward expansion of the photoresist layer leads to the outward expansion of the corresponding encapsulation structure on the photoresist layer. This ensures that even if the first encapsulation structure is missing, it will not affect the first light-emitting unit. To a certain extent, it can guarantee the light-emitting effect of the first light-emitting unit, thereby improving the display effect of the display panel.

[0099] In some embodiments, see Figure 5 As shown, the first packaging structure 141 has a first step 141a on the side surface away from the substrate 11; the isolation structure 121 includes a first film layer 121a and a second film layer 121b stacked together, the orthographic projection of the first film layer 121a on the substrate 11 is located within the orthographic projection of the second film layer 121b on the substrate 11, and the orthographic projection of the first film layer 121a on the substrate 11 and the orthographic projection of the first electrode 131a on the substrate 11 overlap; optionally, the side surface of the first film layer 121a away from the substrate 11 has a second step 121aa, and the side surface of the second film layer 121b away from the substrate 11 has a third step 121ba;

[0100] The first step 141a includes a first surface 141a1, a first discontinuity surface 141a2, and a second surface 141a3. The first surface 141a1 is connected to the second surface 141a3 through the first discontinuity surface 141a2. The first surface 141a1 is located on the side of the second surface 141a3 away from the substrate 11. The orthographic projection of the first discontinuity surface 141a2 on the substrate 11 is located outside the edge of the orthographic projection of the first electrode 131a on the substrate 11, that is, there is a gap between the outline of the orthographic projection of the first electrode 131a on the substrate 11 and the outline of the orthographic projection of the first discontinuity surface 141a2 on the substrate 11. In the actual manufacturing process of the display panel, the photoresist layer that needs to be coated at the position of the first discontinuity surface 141a2 is prone to peeling off, resulting in the absence of the photoresist layer during etching, as well as the absence of etching of the encapsulation structure that needs to be protected under the photoresist layer. Therefore, the larger the distance between the outline of the orthogonal projection of the first electrode 131a on the substrate 11 and the outline of the orthogonal projection of the first discontinuity surface 141a2 on the substrate 11, the less likely it is to be affected by the absence of photoresist at the discontinuity position. This allows the encapsulation structure to effectively protect the light-emitting unit even in the case of etching absence. Therefore, the design of the encapsulation structure in the above display panel can improve the encapsulation effect of the encapsulation structure, thereby improving the display effect of the display panel.

[0101] The display panel provided in this application embodiment has a step on the first encapsulation structure corresponding to the first light-emitting unit. This step forms a discontinuity segment on the surface of the first encapsulation structure. During the fabrication process of the display panel, the photoresist layer corresponding to this discontinuity segment is prone to peeling off, leading to a high likelihood of photoresist layer loss. This, in turn, results in over-etching of the encapsulation structure. Based on this problem, the display panel provided in this application embodiment has an outward expansion design for the boundary of the first encapsulation structure relative to the first light-emitting unit. This design allows the photoresist layer covering the first encapsulation structure during the fabrication process to have a pulling effect at the discontinuity segment position. This can suppress the occurrence of photoresist loss at the discontinuity segment position and avoid the problem of poor encapsulation effect of the encapsulation structure caused by photoresist loss, thereby improving the display effect of the display panel.

[0102] Optionally, a protective zone 141a4 is provided on the second surface 14a3, one boundary of the protective zone 141a4 is connected to the first discontinuity surface 141a2, and the distance between the other boundary of the protective zone 141a4 and the first discontinuity surface 141a2 is greater than 15 micrometers.

[0103] During the fabrication of the display panel, when a photoresist layer is applied to the first encapsulation structure 141, the orthogonal projection of the photoresist layers correspondingly disposed on the first surface 141a1 and the second surface 141a3 onto the substrate 11 covers the orthogonal projection of the first surface 141a1 and the protection zone 141a4 onto the substrate 11. The second surface 141a3 is a flat surface, ensuring that the photoresist layer applied to the outwardly extended first encapsulation structure 141 is in a flat position. Furthermore, the distance between the edge of the first encapsulation structure 141, after etching, and the edge of the first encapsulation structure 141, away from the first discontinuity surface 141a2, is greater than 15 micrometers. This allows the edge of the first encapsulation structure 141 to avoid the discontinuity position on the first encapsulation structure 141, exerting a pulling effect on the photoresist layer at the discontinuity position. This can suppress the occurrence of missing photoresist layers at the discontinuity position, thus providing a certain degree of protection for the photoresist layer at the discontinuity position and also protecting the encapsulation structure at the discontinuity position, preventing over-etching of the encapsulation structure at the discontinuity position, which would affect the protective effect of the encapsulation structure on the light-emitting unit.

[0104] The display panel provided in this application embodiment has a protection zone formed on the second surface of the first packaging structure. The surface of the protection zone is a flat surface. When the flat surface is covered with a photoresist layer, the adhesion between the photoresist layer and the second surface is enhanced, allowing the packaging structure within the protection zone to be effectively protected by the photoresist and preserved, thus improving the packaging effect. In addition, there is a certain distance between the boundary of the protection zone and the discontinuity position on the packaging structure, ensuring that the packaging structure in the protection zone is not affected by the discontinuity position, which also plays a role in improving the packaging effect to a certain extent. Moreover, when the photoresist layer is attached to the protection zone on the second surface, the outwardly extending photoresist layer is in a flat position, and the distance between the edge of the photoresist layer and the first discontinuity surface is greater than 15 micrometers, the edge of the photoresist layer can avoid the discontinuity position on the first packaging structure, exerting a pulling effect on the photoresist layer at the discontinuity position, which can suppress the occurrence of photoresist layer loss at the discontinuity position, thus providing a certain degree of protection for the packaging structure at the discontinuity position.

[0105] The second step 121aa includes a third surface 121aa1, a second discontinuity surface 121aa2, and a fourth surface 121aa3. The third surface 121aa1 is connected to the fourth surface 121aa3 through the second discontinuity surface 121aa2. The third surface 121aa1 is located on the side of the fourth surface 121aa3 away from the substrate 11. Optionally, the orthographic projection of the second discontinuity surface 121aa2 on the substrate 11 is located outside the orthographic projection of the first electrode 131a on the substrate 11, that is, there is a gap between the outline of the orthographic projection of the first electrode 131a on the substrate 11 and the outline of the orthographic projection of the second discontinuity surface 121aa2 on the substrate 11. In the actual manufacturing process of the display panel, the photoresist layer that needs to be coated at the position of the second discontinuity surface 121aa is prone to peeling off, resulting in the absence of the photoresist layer during etching, which fails to protect the packaging structure under the photoresist layer. Therefore, the larger the distance between the outline of the orthographic projection of the first electrode 131a on the substrate 11 and the outline of the orthographic projection of the second discontinuity surface 121aa on the substrate 11, the less likely it is to be affected by the absence of photoresist at the discontinuity position, which can improve the packaging effect of the packaging structure and thus improve the display effect of the display panel.

[0106] The third step 121ba includes a fifth surface 121ba1, a third discontinuity surface 121ba2, and a sixth surface 121ba3. The fifth surface 121ba1 is connected to the sixth surface 121ba3 through the third discontinuity surface 121ba2, and the fifth surface 121ba1 is located on the side of the sixth surface 121ba3 facing away from the substrate 11. Optionally, the orthographic projection of the third discontinuity surface 121ba2 onto the substrate 11 is located outside the edge of the orthographic projection of the first electrode 131a onto the substrate 11, that is, there is a gap between the outline of the orthographic projection of the first electrode 131a onto the substrate 11 and the outline of the orthographic projection of the third discontinuity surface 121ba2 onto the substrate 11. In the actual manufacturing process of the display panel, the photoresist layer that needs to be coated at the position of the third discontinuity surface 121ba2 is prone to peeling off, resulting in the absence of the photoresist layer during etching, which fails to protect the packaging structure under the photoresist layer. Therefore, the larger the distance between the outline of the orthographic projection of the first electrode 131a on the substrate 11 and the outline of the orthographic projection of the third discontinuity surface 121ba2 on the substrate 11, the less likely it is to be affected by the absence of photoresist at the discontinuity position, which can improve the packaging effect of the packaging structure and thus improve the display effect of the display panel. In the actual manufacturing process of a display panel, the second step 121aa typically causes the third step 121ba, and the third step 121ba causes the first step 141a. The orthographic projections of the first discontinuity surface 141a2 in the first step 141a, the second discontinuity surface 121aa2 in the second step 121aa, and the third discontinuity surface 121ba2 in the third step 121ba onto the substrate 11 overlap. However, due to the influence of the manufacturing process, these three orthographic projections do not completely overlap. It should also be noted that, as mentioned above, photoresist is coated on the encapsulation structure during the manufacturing process of the display panel. During subsequent etching, this photoresist protects the encapsulation structure, preventing it from being etched away and achieving the effect of encapsulating the light-emitting unit. The photoresist is removed during subsequent manufacturing after it has served its purpose; therefore, the display panel product does not include photoresist. The use of photoresist in the embodiments of this application is merely an example to illustrate the encapsulation structure in the display panel described in the embodiments of this application and does not limit the presence of photoresist.

[0107] In some embodiments, see Figure 5As shown, the provided display panel 10 further includes: a pixel definition layer 16 disposed on one side of the substrate 11, the pixel definition layer 16 including a plurality of pixel openings 161; a plurality of isolation openings 122 correspondingly communicating with the plurality of pixel openings 161; the pixel definition layer (PDL) 16 provides good planar support for the subsequently formed isolation structure 121. The pixel definition layer 16 can be disposed between the isolation structure 121 and the substrate 11. The pixel definition layer 16 defines a plurality of pixel openings 161. The orthographic projection of the pixel openings 161 on the substrate 11 can be located within the orthographic projection of the isolation openings 122 on the substrate 11. The first light-emitting unit 131 can be at least partially located within the pixel openings 161. Thus, by providing the pixel definition layer 16, it is convenient to provide the first light-emitting unit 131 on the substrate 11.

[0108] Optionally, the pixel defining layer 16 has a fourth step 16a on the side of its surface facing away from the substrate 11. The fourth step 16a includes a seventh surface 16a1, a fourth discontinuity surface 16a2, and an eighth surface 16a3. The seventh surface 16a1 is connected to the eighth surface 16a3 through the fourth discontinuity surface 16a2, and the seventh surface 16a1 is located on the side of the eighth surface 16a3 facing away from the substrate 11. Optionally, the orthographic projection of the fourth discontinuity surface 16a2 onto the substrate 11 is located outside the edge of the orthographic projection of the first electrode 131a onto the substrate 11, that is, there is a gap between the outline of the orthographic projection of the first electrode 131a onto the substrate 11 and the outline of the orthographic projection of the fourth discontinuity surface 16a2 onto the substrate 11. In the actual manufacturing process of the display panel, the photoresist layer that needs to be coated at the position of the fourth discontinuity surface 16a2 is prone to peeling off, resulting in the absence of the photoresist layer during etching and the absence of the etching of the packaging structure that needs to be protected under the photoresist layer. Therefore, the larger the distance between the outline of the orthographic projection of the first electrode 131a on the substrate 11 and the outline of the orthographic projection of the fourth discontinuity surface 16a2 on the substrate 11, the less likely it is to be affected by the absence of photoresist at the discontinuity position, which can improve the packaging effect of the packaging structure and thus improve the display effect of the display panel. In the actual manufacturing process of a display panel, the fourth step 16a typically causes the second step 121aa, the second step 121aa causes the third step 121ba, and the third step 121ba causes the first step 141a. The orthographic projections of the first discontinuity surface 141a2 in the first step 141a, the second discontinuity surface 121aa2 in the second step 121aa, the third discontinuity surface 121ba2 in the third step 121ba, and the fourth discontinuity surface 16a2 in the fourth step 16a onto the substrate 11 overlap. However, due to the influence of the manufacturing process, these four orthographic projections do not completely overlap. It should be noted that the orthographic projections of all the aforementioned discontinuity surfaces onto the substrate refer to the orthographic projections of the discontinuity surfaces along the thickness direction of the substrate, which will not be elaborated here.

[0109] In some embodiments, see Figure 6 and Figure 7 The top view shown (using a first light-emitting unit 13 as an example) shows that the outline of the first packaging structure 141 projected onto the substrate 11 has a first direction (referring to...) Figure 6 or Figure 7 Two first sides 141a are arranged opposite each other in the Z direction, and the orthographic projections of the two first sides 141a on the substrate 11 are located outside the orthographic projection of the first electrode 131a on the substrate 11; specifically, the contour of either of the two first sides 141a and the orthographic projection of the first electrode 131a on the substrate 11 are separated along the second direction (referring to the Z direction). Figure 6 or Figure 7 Distance in the S direction (in the middle) Figure 7 If the distance d in the first encapsulation structure 141 is greater than 15 micrometers, it indicates that the first encapsulation structure 141 has been extended outward along the second direction relative to one end of the first electrode 131a, and the extension length is relatively long. This allows the first side 141a on the first encapsulation structure 141 to be far away from the discontinuity position on the first encapsulation structure 141 corresponding to the first electrode 131a. This indicates that during the fabrication of the display panel, the photoresist layer to be coated at the discontinuity position can adhere to the first encapsulation structure 141 with a large force, making it less prone to falling off and resulting in photoresist loss, thus improving the display effect of the display panel. It should be noted that since the first side 141a is a curve and the orthographic projection contour is also a curve, there are multiple distances between the first side 141a and the orthographic projection contour, and each distance is different. In this embodiment, the distance d between the first side 141a and the orthographic projection contour of the first electrode 131a on the substrate 11 along the second direction ( Figure 7 The distance d in the middle refers to the peak point of the first side 141a. Figure 7 The point o in the middle) and the peak point of the contour of the relative orthographic projection ( Figure 7 The distance between the two first sides 141a and the orthographically projected contour is the maximum distance between the two first sides 141a and the orthographically projected contour. Generally, the distances between the two first sides 141a and the orthographically projected contour are symmetrical and the same. However, due to the influence of the manufacturing process or other factors, the distances between the two first sides 141a and the orthographically projected contour may also be different, and both are greater than 15 micrometers.

[0110] Optionally, see Figure 6 As shown, the outline of the first packaging structure 141 projected onto the substrate 11 has a shape along the second direction ( Figure 6 The two second sides 141b arranged opposite each other in the S direction (in the image) have their orthogonal projections on the substrate 11 overlapping with the orthogonal projections of the first electrode 131a on the substrate 11. This indicates that the first packaging structure only exists in the second direction (in the image). Figure 6 There is an outward expansion in the S direction (in the first direction) Figure 6 The first electrode 131a is covered on the Z-direction of the pixel, which not only protects the pixel where the first electrode 131a is located, but also protects the portion of the pixel that extends outward in the second direction. This ensures that even if the photoresist around the pixel is missing, the display effect of the pixel will not be affected, thus ensuring a good display on the display panel. Specifically, Figure 6 In the structure shown, the second side 141b includes a first sub-side 141b1, a second sub-side 141b2, and a third sub-side 141b3, wherein the orthographic projection of the second sub-side 141b2 on the substrate 11 overlaps with a partial orthographic projection of the first electrode 131a on the substrate 11. Optionally, see [reference needed]. Figure 7 The structure shown has two curved sides 141b, and each side 141b includes a peak point (see [link]). Figure 7 The edge extending from the peak point overlaps with a portion of the orthographic projection of the first electrode 131a onto the substrate 11.

[0111] Optionally, see Figure 8 As shown, the orthographic projection of the first package structure 141 on the substrate 11 is located outside the orthographic projection of the first electrode 131a on the substrate 11. Specifically, the outline of the first package structure 141 and the outline of the orthographic projection of the first electrode 131a on the substrate 11 are located along the second direction (see reference). Figure 8 The distance (in the S direction) between the outline of the first package structure 141 and the outline of the orthographic projection of the first electrode 131a onto the substrate 11 along the first direction (participating in the S direction) and the outline of the first package structure 141 and the orthographic projection of the first electrode 131a onto the substrate 11. Figure 8 The distance between the contour of the first packaging structure 141 and the contour of the orthographic projection of the first electrode 131a onto the substrate 11 along the second direction (referring to the Z direction in the diagram) can be the same or different. In practical applications, the distance between the contour of the first packaging structure 141 and the contour of the first electrode 131a projected onto the substrate 11 along the second direction (referring to the Z direction in the diagram) can be the same or different. Figure 8 The distance in the S direction (participating) Figure 8 (d in the figure), and the outline of the first package structure 141 and the outline of the first electrode 131a projected onto the substrate 11 along the first direction (participating in the first direction). Figure 8 Distance in the Z direction (participating) Figure 8 The d' in the figure is greater than 15 micrometers.

[0112] Figures 6-8 The embodiments involve various design structures of the first packaging structure 141, realizing the outward expansion design of the first packaging structure 141 relative to the first light-emitting unit 13, which can protect the first light-emitting unit 13. Since the outward expansion distance of the first packaging structure 141 relative to the first light-emitting unit 13 is relatively long, the area of ​​the first packaging structure 141 is increased. In the etching process, even if there is a lack of photoresist, the first packaging structure 141 can still ensure that the effective area (e.g., the light-emitting area) of the first light-emitting unit 13 has sufficient photoresist protection, and does not affect the display effect of the first light-emitting unit 13.

[0113] In some embodiments, see Figure 9 and Figure 10 As shown ( Figure 10 for Figure 9The diagram includes a cross-sectional view of the first light-emitting unit 131 and the second light-emitting unit 132. In any of the above embodiments, the display panel further includes multiple second light-emitting units 132 and a second encapsulation structure 142, disposed on one side of the substrate 11. Each second light-emitting unit 132 includes a third electrode 132a, a second light-emitting structure 132b, and a fourth electrode 132c stacked together. The second encapsulation structure 142 is disposed on the side of the second light-emitting unit 132 facing away from the substrate 11. The orthographic projection of the second encapsulation structure 142 corresponding to the third electrode 132a onto the substrate 11 is spaced apart from the orthographic projection of the first encapsulation structure 141 corresponding to the first electrode 131a onto the substrate 11 by a distance (see [reference]). Figure 10 The distance indicated by m in the figure is such that the boundary of the first encapsulation structure 141 does not interfere with the adjacent second light-emitting unit 132, that is, there is enough space between the first encapsulation structure 141 and the adjacent second light-emitting unit 132 to improve the display effect of the display panel.

[0114] In some embodiments, see Figure 9 As shown, the display panel in any of the above embodiments further includes a plurality of third light-emitting units 133 and a third encapsulation structure 143, disposed on one side of the substrate 11. The third light-emitting unit 133 includes a fifth electrode 133a, a third light-emitting structure 133b, and a sixth electrode 133c stacked together. The third encapsulation structure 143 is disposed on the side of the third light-emitting unit 133 facing away from the substrate 11. The orthographic projection of the third encapsulation structure 143 corresponding to the fifth electrode 133a onto the substrate 11 is spaced apart from the orthographic projection of the first encapsulation structure 141 corresponding to the first electrode 131a onto the substrate 11 by a distance (see [reference]). Figure 10 The distance indicated by n in the figure is such that the boundary of the first encapsulation structure 141 does not interfere with the adjacent third light-emitting unit 133, that is, there is enough space between the first encapsulation structure 141 and the adjacent third light-emitting unit 133 to improve the display effect of the display panel.

[0115] The above Figure 9 In the display panel shown in the embodiment, the distance between the first light-emitting unit 131 and the adjacent second light-emitting unit 132 (e.g., Figure 9 The distance marked as m in the middle is less than the distance between the first light-emitting unit 131 and the adjacent first light-emitting unit 131 (see [reference]). Figure 3 (See the top view shown); the distance between the first light-emitting unit 131 and the adjacent third light-emitting unit 133 (e.g., Figure 9 The distance denoted as n in the diagram is less than the distance between the first light-emitting unit 131 and its adjacent first light-emitting unit 131; with this structural design, in the distribution of multiple light-emitting units 13, there is sufficient space between adjacent first light-emitting units 131, that is, adjacent first light-emitting units 131 along the second direction ( Figure 7 or Figure 8 There is sufficient space between the first light-emitting unit 131 (in the S direction) and the adjacent second light-emitting unit 132, so the boundary of the first encapsulation structure 141 corresponding to the first light-emitting unit 131 has an outward expansion design, which effectively protects the first light-emitting unit 131. However, when the distance between the first light-emitting unit 131 and the adjacent second light-emitting unit 132 is relatively close, the boundary of the second encapsulation structure on the second light-emitting unit 132 does not have an outward expansion design during fabrication. Similarly, when the distance between the first light-emitting unit 131 and the adjacent third light-emitting unit 133 is relatively close, the boundary of the third encapsulation structure on the second light-emitting unit 133 does not have an outward expansion design during fabrication. In other words, if the distance between two light-emitting units is relatively close, then when fabricating either one light-emitting unit, the encapsulation structure corresponding to that light-emitting unit does not have an outward expansion design, or the encapsulation structure corresponding to the other light-emitting unit does not have an outward expansion design, or neither of the encapsulation structures corresponding to the two light-emitting units has an outward expansion design. Conversely, if the distance between two light-emitting units is relatively far, then when fabricating either one light-emitting unit, the encapsulation structure corresponding to that light-emitting unit can have an outward expansion design (see [reference]). Figures 1-9 The design of the packaging structure of one light-emitting unit (or the packaging structure corresponding to another light-emitting unit) is carried out by epitaxial design, or both packaging structures corresponding to two light-emitting units are carried out by epitaxial design, so as to effectively protect the light-emitting unit and improve the light-emitting effect of the light-emitting unit.

[0116] The display panel described in any of the above embodiments partially expands the encapsulation structure on the light-emitting unit, thereby optimizing the missing photoresist on the encapsulation structure. Specifically, if there is a step on the encapsulation layer in the light-emitting unit, i.e., a discontinuity position, the display panel described in the above embodiments avoids the discontinuity position by designing the photoresist on the light-emitting unit to avoid the discontinuity position. That is, the photoresist attached to the encapsulation structure on the light-emitting unit is expanded outward until it reaches the platform of the encapsulation layer. This provides a certain degree of protection for the photoresist at the discontinuity position, making it less likely for the photoresist at the discontinuity position to fall off, thus solving the problem of missing photoresist to a certain extent. In addition, it also increases the protection area of ​​the light-emitting unit by the photoresist, so that even if the photoresist is missing during the fabrication process of the light-emitting unit, it will not affect the light-emitting effect of the light-emitting unit.

[0117] In some embodiments, this application provides a display panel 10, see [link to relevant documentation]. Figure 5The schematic diagram shows that the display panel 10 includes a substrate 11, an isolation layer 12, a plurality of first light-emitting units 131, and a plurality of first encapsulation structures 141. The isolation layer 12 is disposed on one side of the substrate 11 and includes an isolation structure 121 and a plurality of isolation openings 122 formed by the isolation structure 121. The plurality of first light-emitting units 131 are disposed on one side of the substrate 11. Each first light-emitting unit 131 includes a first electrode 131a, a first light-emitting structure 131b, and a second electrode 131c stacked together. The first encapsulation structure 141 is disposed on the side of the corresponding first light-emitting unit 131 away from the substrate 11, and a portion of the first encapsulation structure 141 is located on the side of the isolation structure away from the substrate 11. The surface of the first encapsulation structure 141 away from the substrate 11 has a first step 141a, and the orthographic projection of the first encapsulation structure 141 on the substrate 11 covers the orthographic projection of the first step on the substrate 11.

[0118] The structural design described in this embodiment can be found in the foregoing. Figure 5 For a detailed explanation of the structural design described in the embodiments, please refer to the foregoing content, which will not be repeated here.

[0119] In some embodiments, the distance between the outline of the orthographic projection of the first packaging structure 141 on the substrate 11 and the outline of the orthographic projection of the first step 141a on the substrate 11 is greater than 15 micrometers; optionally, the first step 141a includes a first surface 141a1, a first discontinuity surface 141a2, and a second surface 141a3, the first surface 141a1 being connected to the second surface 141a3 via the first discontinuity surface 141a2, the first surface 141a1 being located on the side of the second surface 141a3 facing away from the substrate 11; the distance between the outline of the orthographic projection of the first discontinuity surface 141a2 on the substrate 11 and the outline of the orthographic projection of the first packaging structure 141 on the substrate 11 is greater than 15 micrometers.

[0120] The above structural design allows the boundary of the first packaging structure 141 to extend to a position relatively far from the first step 141a. Since the packaging structure at the first step 141a is prone to loss due to photoresist peeling off, thus failing to provide protection, extending the boundary of the first packaging structure 141 to a position relatively far from the first step 141a allows the photoresist layer that needs to be attached to the first packaging structure 141 to be tightly attached to the position of the first step 141a, thereby protecting the first packaging structure 141 at the position of the first step 141a. Therefore, the above structural design is extremely suitable for structures with steps on the packaging structure, that is, it can provide good protection for structures with steps on the packaging structure, and the packaging effect can be improved.

[0121] In some embodiments, the isolation structure 121 includes a first film layer 121a and a second film layer 121b stacked together. The orthographic projection of the first film layer 121a on the substrate 11 lies within the orthographic projection of the second film layer 121b on the substrate 11. The orthographic projection of the first film layer 121a on the substrate 11 and the orthographic projection of the first electrode 131a on the substrate 11 overlap. The surface of the first film layer 121a facing away from the substrate 11 has a second step 121aa, and the surface of the second film layer 121b facing away from the substrate 11 has... The third step 121ba; the second step 121aa includes a third surface 121aa1, a second discontinuity surface 121aa2, and a fourth surface 121aa3. The third surface 121aa1 is connected to the fourth surface 121aa3 through the second discontinuity surface 121aa2, and the third surface 121aa1 is located on the side of the fourth surface 121aa3 away from the substrate 11. Optionally, the orthographic projection of the second discontinuity surface 121aa2 on the substrate 11 is located outside the orthographic projection of the first electrode 131a on the substrate 11. The third step 121ba includes a fifth surface 121ba1, a third discontinuity surface 121ba2, and a sixth surface 121ba3. The fifth surface 121ba1 is connected to the sixth surface 121ba3 through the third discontinuity surface 121ba2, and the fifth surface 121ba1 is located on the side of the sixth surface 121ba3 away from the substrate 11. Optionally, the orthographic projection of the third discontinuity 121ba2 surface onto the substrate 11 is located outside the edge of the orthographic projection of the first electrode 131a onto the substrate 11. Regarding the first step 141a, second step 121aa, and third step 121ba in the above embodiments, as described above... Figure 5 The embodiments are described in detail above, and will not be repeated here.

[0122] In some embodiments, see Figure 5 As shown, the provided display panel 10 further includes: a pixel defining layer 16 disposed on one side of the substrate 11, the pixel defining layer 16 including a plurality of pixel openings 161; a plurality of isolation openings 122 correspondingly communicating with the plurality of pixel openings 161; optionally, the side surface of the pixel defining layer 16 facing away from the substrate 11 has a fourth step 16a, the fourth step 16a including a seventh surface 16a1, a fourth discontinuity surface 16a2, and an eighth surface 16a3; the seventh surface 16a1 is connected to the eighth surface 16a3 through the fourth discontinuity surface 16a2, and the seventh surface 16a1 is located on the side of the eighth surface 16a3 facing away from the substrate 11. Optionally, the orthographic projection of the fourth discontinuity surface 16a2 on the substrate 11 is located outside the edge of the orthographic projection of the first electrode 131a on the substrate 11. Regarding the fourth step 16a in the above embodiment, in the foregoing Figure 5 The embodiments are described in detail above, and will not be repeated here.

[0123] In some embodiments, see Figure 6 and Figure 7 The top view shown shows that the outline of the first package structure 141 projected onto the substrate 11 has a first direction (participating in the top view). Figure 6 or Figure 7 Two first sides 141a are arranged opposite each other in the Z direction, and the orthographic projections of the two first sides 141a on the substrate 11 are located outside the orthographic projection of the first electrode 131a on the substrate 11; optionally, the outline of the orthographic projection of the first packaging structure 141 on the substrate 11 has a contour along the second direction (Z direction). Figure 6 Two second sides 141b are arranged opposite each other in the S direction, and the orthogonal projection of a portion of the two second sides 141b on the substrate 11 overlaps with the orthogonal projection of the first electrode 131a on the substrate 11.

[0124] Regarding the first side 141a and the second side 141b in the above embodiments, as described above... Figure 6 and Figure 7 The embodiments are described in detail above, and will not be repeated here.

[0125] In some embodiments, the orthographic projection of the first packaging structure 141 on the substrate 11 is located outside the orthographic projection of the first electrode 131a on the substrate 11. This structural design can also be found in the foregoing description, and will not be repeated here.

[0126] In some embodiments, the display panel based on any of the above embodiments, such as Figure 11 As shown, a method for manufacturing a display panel is also provided, the method comprising:

[0127] S1, Provide a substrate;

[0128] See Figure 2 , Figure 4 , Figure 5 A substrate 11 is provided, which can provide support for the remaining film layers to be applied subsequently.

[0129] S2. An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a first electrode;

[0130] See Figure 2 , Figure 4 , Figure 5 After providing the substrate 11, it may include forming an electrode material layer on one side of the substrate 11, performing a first patterning process on the electrode material layer to form a plurality of first electrodes; the first electrodes may be the anode in the first light-emitting unit.

[0131] S3. A pixel material layer is formed on the side of the substrate and the first electrode away from the substrate, and an isolation material layer is formed on the side of the pixel material layer away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer.

[0132] See Figure 2 , Figure 4 , Figure 5 After forming a first electrode on one side of the substrate 11, the process may include forming a pixel material layer and an isolation material layer sequentially on one side of the substrate and the side of the first electrode facing away from the substrate. First, the isolation material layer undergoes a second patterning process to form an isolation layer, and then the pixel material layer undergoes a second patterning process to form a pixel defining layer. The pixel defining layer includes multiple pixel openings, which are correspondingly connected to multiple isolation openings. It should be noted that the second patterning process performed on the isolation material layer and the second patterning process performed on the pixel material layer are different patterning processes.

[0133] S4. A light-emitting material layer is formed on the side of the isolation layer away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer away from the substrate, a photoresist material layer is formed on the side of the encapsulation material layer away from the substrate, and a third patterning process is performed on the photoresist material layer to form multiple first photolithography structures.

[0134] See Figure 2 , Figure 4 , Figure 5 After forming a pixel defining layer and an isolation layer on one side of the substrate, the process may include forming a light-emitting material layer, an encapsulation material layer, and a photoresist material layer sequentially on the side of the isolation layer facing away from the substrate, and then performing a third patterning process on the photoresist material layer to form multiple first photolithographic structures (see [reference]). Figure 12 The photoresist layer is marked as 151. In this layer, multiple first photolithography structures are correspondingly arranged with multiple first electrodes. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first photolithography structure on the substrate. The distance between the outline of the orthographic projection of the first photolithography structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers.

[0135] S5. Perform a fourth patterning process on the encapsulation material layer and the light-emitting material layer to form a first light-emitting structure in a plurality of first encapsulation structures and a first light-emitting structure in a plurality of first light-emitting units.

[0136] See Figure 2 , Figure 4 , Figure 5After forming a light-emitting material layer and an encapsulation material layer on the side of the isolation layer facing away from the substrate, the encapsulation material layer is first subjected to a fourth patterning process to form multiple first encapsulation structures. Then, the light-emitting material layer is subjected to a fourth patterning process to form a first light-emitting structure among multiple first light-emitting units. The multiple first light-emitting units are correspondingly arranged with multiple pixel openings; the multiple first encapsulation structures are correspondingly arranged with multiple first light-emitting units; and the multiple first photolithography structures are correspondingly arranged with multiple first light-emitting units. The multiple first photolithography structures are correspondingly arranged with the multiple first light-emitting structures, and the multiple first light-emitting structures are correspondingly arranged with multiple first electrodes. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first encapsulation structure on the substrate, and the distance between the outline of the orthographic projection of the first encapsulation structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers. It should be noted that the fourth patterning process performed on the encapsulation material layer and the fourth patterning process performed on the light-emitting material layer are different patterning processes.

[0137] The above embodiments relate to the fabrication process of the first light-emitting unit, and the first photolithographic structure used in this process can be found in the foregoing. Figure 12 The structural design shown ( Figure 12 (Taking a first light-emitting unit as an example for illustration), please refer to the aforementioned description for detailed structural design information, which will not be repeated here. Among them, Figure 12 The first photolithographic structure in ( Figure 12 The structure marked 15 (151) was expanded outward, and the first light-emitting unit ( Figure 12 The structure marked 131 in the middle plays a protective role, ensuring the display effect of the first light-emitting unit.

[0138] In some embodiments, such as Figure 13 As shown, the preparation method may also include:

[0139] S6. Peel off the multiple first photolithography structures from the side of the multiple first packaging structures away from the substrate.

[0140] After the first light-emitting unit is fabricated, each first photolithographic structure is peeled off from the side of the corresponding first packaging structure away from the substrate in preparation for the fabrication of other light-emitting units.

[0141] In some embodiments, such as Figure 14 As shown, the preparation method may also include:

[0142] S7. An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of third electrodes;

[0143] S8. A pixel material layer is formed on the side of the substrate and the third electrode away from the substrate, and an isolation material layer is formed on the side of the pixel material layer away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel limiting layer.

[0144] The isolation layer includes an isolation structure and multiple isolation openings formed by the isolation structure; the pixel limiting layer includes multiple pixel openings; the multiple pixel openings are connected to the multiple isolation openings accordingly;

[0145] S9. A light-emitting material layer is formed on the side of the pixel limiting layer away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer away from the substrate, a photoresist material layer is formed on the side of the encapsulation material layer away from the substrate, and a third patterning process is performed on the photoresist material layer to form multiple second photolithography structures.

[0146] In this configuration, multiple second photolithography structures are correspondingly arranged with multiple third electrodes, and the orthogonal projection of the third electrode on the substrate is located within the orthogonal projection of the corresponding second photolithography structure on the substrate.

[0147] S10. Perform a fourth patterning process on the encapsulation material layer and the light-emitting material layer to form a second encapsulation structure and a second light-emitting structure in a plurality of second light-emitting units.

[0148] Among them, multiple second light-emitting units are arranged corresponding to multiple pixel openings; multiple second packaging structures are arranged corresponding to multiple second light-emitting units; and multiple second photolithography structures are arranged corresponding to multiple second light-emitting units.

[0149] In this configuration, the orthogonal projection of the third electrode onto the substrate lies within the orthogonal projection of the corresponding second photolithographic structure onto the substrate. This indicates that the second photolithographic structure corresponding to the second light-emitting unit has not been externally expanded, and the corresponding second packaging structure has also not been externally expanded. This is merely one implementation method, and the second photolithographic structure corresponding to the second light-emitting unit can be based on the aforementioned... Figure 12 The structural design shown is expanded outwards.

[0150] The above embodiments relate to the fabrication process of the second light-emitting unit, which is basically the same as the fabrication process of the first light-emitting unit. Detailed steps can be found in the foregoing description and will not be repeated here. The difference between the fabrication process of the second light-emitting unit and the first light-emitting unit lies in the design structure of the second photolithographic structure corresponding to the second light-emitting unit and the first photolithographic structure corresponding to the first light-emitting unit. The first photolithographic structure corresponding to the first light-emitting unit has an outward expansion design, while the second photolithographic structure corresponding to the second light-emitting unit does not. This design method is merely an illustrative example; of course, it can be based on... Figure 11The method described in the embodiment prepares the second light-emitting unit, and the second photolithography structure corresponding to the second light-emitting unit is also designed to be expanded outward to protect the second light-emitting unit.

[0151] In some embodiments, such as Figure 15 As shown, the preparation method may also include:

[0152] S11. Peel off multiple second photolithographic structures from the side of multiple second packaging structures away from the substrate.

[0153] After the second light-emitting unit is fabricated, each second photolithographic structure is peeled off from the side of the corresponding second packaging structure away from the substrate in preparation for the fabrication of other light-emitting units.

[0154] In some embodiments, such as Figure 16 As shown, the preparation method may also include:

[0155] S12. An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of fifth electrodes;

[0156] S13. A pixel material layer is formed on the side of the substrate and the fifth electrode away from the substrate, and an isolation material layer is formed on the side of the pixel material layer away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel limiting layer.

[0157] The isolation layer includes an isolation structure and multiple isolation openings formed by the isolation structure; the pixel limiting layer includes multiple pixel openings; the multiple pixel openings are connected to the multiple isolation openings accordingly;

[0158] S14. A light-emitting material layer is formed on the side of the isolation layer away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer away from the substrate, a photoresist material layer is formed on the side of the encapsulation material layer away from the substrate, and a third patterning process is performed on the photoresist material layer to form multiple third photolithography structures.

[0159] Among them, multiple third photolithography structures are correspondingly arranged with multiple fifth electrodes, and the orthogonal projection of the fifth electrode on the substrate is located within the orthogonal projection of the corresponding third photolithography structure on the substrate.

[0160] S15. Perform a fourth patterning process on the encapsulation material layer and the light-emitting material layer to form a third encapsulation structure and a third light-emitting structure in a third light-emitting unit;

[0161] Among them, multiple third light-emitting units are set to correspond to multiple pixel openings; multiple third packaging structures are set to correspond to multiple third light-emitting units; and multiple third photolithography structures are set to correspond to multiple third light-emitting units.

[0162] In this configuration, the orthographic projection of the fifth electrode onto the substrate lies within the orthographic projection of the corresponding third photolithographic structure onto the substrate. This indicates that the third photolithographic structure corresponding to the third light-emitting unit has not been externally expanded, and the corresponding third packaging structure has also not been externally expanded. This is merely one implementation method, and the third photolithographic structure corresponding to the third light-emitting unit can be based on the aforementioned... Figure 12 The structural design shown is expanded outwards.

[0163] The above embodiments relate to the fabrication process of the third light-emitting unit, which is basically the same as the fabrication process of the first and second light-emitting units. Detailed steps can be found in the foregoing description and will not be repeated here. The difference between the fabrication process of the third light-emitting unit and the first light-emitting unit lies in the design structure of the third photolithographic structure corresponding to the third light-emitting unit and the first photolithographic structure corresponding to the first light-emitting unit. The first photolithographic structure corresponding to the first light-emitting unit has an outward expansion design, while the third photolithographic structure corresponding to the third light-emitting unit does not. This design method is merely an illustrative example; of course, it can be based on... Figure 11 The method described in the embodiment prepares the third light-emitting unit, and the third photolithography structure corresponding to the third light-emitting unit is also designed to be expanded outward to protect the third light-emitting unit.

[0164] In some embodiments, such as Figure 17 As shown, the preparation method may also include:

[0165] S16. Peel off multiple third photolithography structures from the side of multiple third packaging structures away from the substrate.

[0166] After the third light-emitting unit is fabricated, each third photolithographic structure is peeled off from the side of the corresponding third packaging structure away from the substrate to complete the fabrication of each light-emitting unit on the display panel.

[0167] Using the above Figures 11-13 In the process of fabricating the display panel using the method described in the embodiment, the photoresist on the light-emitting unit is expanded outward, increasing the coverage area of ​​the photoresist on the light-emitting unit. This ensures that even if the photoresist is missing, the light-emitting unit will not be affected because the photoresist loss occurs at the boundary of the photoresist. This ensures the light-emitting effect of the light-emitting unit and makes the display panel display well.

[0168] In some embodiments, this application also provides a display device, which includes the display panel 10 described in any of the foregoing embodiments. The display device can be an electronic paper device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, smart bracelet, smartwatch, supercomputer, navigator, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, clock, calculator, television monitor, computer monitor, automotive display (e.g., odometer display), cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic billboard or sign, projector, or other mobile or fixed terminal.

[0169] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0170] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0171] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure. Multiple first light-emitting units are disposed on one side of the substrate; The first light-emitting unit includes a first electrode, a first light-emitting structure, and a second electrode stacked together; Multiple first packaging structures are provided on the side of the corresponding first light-emitting unit away from the substrate. A portion of the first packaging structure is located on the side of the isolation structure away from the substrate. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first packaging structure on the substrate. The distance between the outline of the orthographic projection of the first packaging structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers.

2. The display panel according to claim 1, characterized in that, The first packaging structure has a first step on the side surface facing away from the substrate; The first step includes a first surface, a first discontinuity surface, and a second surface. The first surface is connected to the second surface through the first discontinuity surface. The first surface is located on the side of the second surface away from the substrate. The orthographic projection of the first discontinuity surface on the substrate is located outside the edge of the orthographic projection of the first electrode on the substrate.

3. The display panel according to claim 2, characterized in that, A protection zone is provided on the second surface, one boundary of the protection zone is connected to the first discontinuity surface, and the distance between the other boundary of the protection zone and the first discontinuity surface is greater than 15 micrometers.

4. The display panel according to claim 3, characterized in that, The isolation structure includes a first film layer and a second film layer stacked together, wherein the orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate; The orthographic projection of the first film layer on the substrate and the orthographic projection of the first electrode on the substrate overlap; Optionally, the surface of the first film layer facing away from the substrate has a second step, and the surface of the second film layer facing away from the substrate has a third step; The second step includes a third surface, a second discontinuity surface, and a fourth surface. The third surface is connected to the fourth surface through the second discontinuity surface, and the third surface is located on the side of the fourth surface away from the substrate. The orthographic projection of the second discontinuity surface on the substrate is located outside the edge of the orthographic projection of the first electrode on the substrate. The third step includes a fifth surface, a third discontinuity surface, and a sixth surface; the fifth surface is connected to the sixth surface through the third discontinuity surface, and the fifth surface is located on the side of the sixth surface away from the substrate; the orthographic projection of the third discontinuity surface on the substrate is located outside the edge of the orthographic projection of the first electrode on the substrate.

5. The display panel according to any one of claims 1-4, characterized in that, The display panel further includes: a pixel defining layer disposed on one side of the substrate, the pixel defining layer including a plurality of pixel openings; the plurality of isolation openings are correspondingly connected to the plurality of pixel openings; Optionally, the pixel defining layer has a fourth step on the side of its surface facing away from the substrate. The fourth step includes a seventh surface, a fourth discontinuity surface, and an eighth surface. The seventh surface is connected to the eighth surface through the fourth discontinuity surface. The seventh surface is located on the side of the eighth surface facing away from the substrate. The orthographic projection of the fourth discontinuity surface on the substrate is located outside the edge of the orthographic projection of the first electrode on the substrate.

6. The display panel according to any one of claims 1-4, characterized in that, The outline of the orthographic projection of the first packaging structure on the substrate has two first sides disposed opposite each other along a first direction, and the orthographic projection of the two first sides on the substrate is located outside the orthographic projection of the first electrode on the substrate. Optionally, the outline of the orthographic projection of the first packaging structure on the substrate has two second sides disposed opposite each other along a second direction, and the orthographic projection of portions of the two second sides on the substrate overlaps with the orthographic projection of the first electrode on the substrate.

7. The display panel according to any one of claims 1-4, characterized in that, The orthographic projection of the first packaging structure on the substrate is located outside the orthographic projection of the first electrode on the substrate.

8. The display panel according to any one of claims 1-4, characterized in that, The display panel also includes a plurality of second light-emitting units and a second encapsulation structure disposed on one side of the substrate. The second light-emitting unit includes a third electrode, a second light-emitting structure, and a fourth electrode stacked together. The second encapsulation structure is disposed on the side of the corresponding second light-emitting unit away from the substrate. The orthographic projection of the second packaging structure corresponding to the third electrode on the substrate is spaced apart from the orthographic projection of the first packaging structure corresponding to the first electrode on the substrate.

9. The display panel according to claim 7, characterized in that, The display panel also includes multiple third light-emitting units and a third encapsulation structure. The third light-emitting unit is disposed on one side of the substrate and includes a fifth electrode, a third light-emitting structure, and a sixth electrode stacked together. The third encapsulation structure is disposed on the side of the corresponding third light-emitting unit that is away from the substrate. The orthographic projection of the third packaging structure corresponding to the fifth electrode on the substrate is spaced apart from the orthographic projection of the first packaging structure corresponding to the first electrode on the substrate.

10. A display panel, characterized in that, include: substrate; An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure. Multiple first light-emitting units are disposed on one side of the substrate; The first light-emitting unit includes a first electrode, a first light-emitting structure, and a second electrode stacked together; Multiple first packaging structures are provided on the side of the corresponding first light-emitting unit away from the substrate. A portion of the first packaging structure is located on the side of the isolation structure away from the substrate. The surface of the first packaging structure away from the substrate has a first step. The orthographic projection of the first packaging structure on the substrate covers the orthographic projection of the first step on the substrate.

11. The display panel according to claim 10, characterized in that, The distance between the outline of the first packaging structure projected onto the substrate and the outline of the first step projected onto the substrate is greater than 15 micrometers. Optionally, the first step includes a first surface, a first discontinuity surface, and a second surface. The first surface is connected to the second surface through the first discontinuity surface. The first surface is located on the side of the second surface away from the substrate. The distance between the outline of the orthographic projection of the first discontinuity surface on the substrate and the outline of the orthographic projection of the first packaging structure on the substrate is greater than 15 micrometers.

12. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes; A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate, and an isolation material layer is formed on the side of the pixel material layer facing away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings. A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate. An encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate. A photoresist material layer is formed on the side of the encapsulation material layer facing away from the substrate. The photoresist material layer is subjected to a third patterning process to form a plurality of first photolithographic structures. The plurality of first photolithographic structures are correspondingly disposed with the plurality of first electrodes. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first photolithographic structure on the substrate. The distance between the outline of the orthographic projection of the first photolithographic structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers. The encapsulation material layer and the light-emitting material layer are subjected to a fourth patterning process to form a first light-emitting structure in a plurality of first encapsulation structures and a plurality of first light-emitting units; wherein, the plurality of first light-emitting units are correspondingly arranged with the plurality of pixel openings; the plurality of first encapsulation structures are correspondingly arranged with the plurality of first light-emitting units; the plurality of first photolithography structures are correspondingly arranged with the plurality of first light-emitting units; the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the corresponding first encapsulation structure on the substrate, and the distance between the outline of the orthographic projection of the first encapsulation structure on the substrate and the outline of the orthographic projection of the first electrode on the substrate is greater than 15 micrometers.

13. The preparation method according to claim 12, characterized in that, The method further includes: The plurality of first photolithographic structures are peeled off from the side of the first packaging structure away from the substrate.

14. The preparation method according to claim 13, characterized in that, The method further includes: An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of third electrodes; A pixel material layer is formed on the side of the substrate and the third electrode facing away from the substrate, and an isolation material layer is formed on the side of the pixel material layer facing away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings. A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate, and a photoresist material layer is formed on the side of the encapsulation material layer facing away from the substrate. The photoresist material layer is subjected to a third patterning process to form a plurality of second photolithographic structures. The plurality of second photolithographic structures are correspondingly disposed with the plurality of third electrodes, and the orthographic projection of the third electrode on the substrate is located within the orthographic projection of the corresponding second photolithographic structure on the substrate. The encapsulation material layer and the light-emitting material layer are subjected to a fourth patterning process to form a second light-emitting structure in a plurality of second encapsulation structures and a plurality of second light-emitting units; wherein, the plurality of second light-emitting units are correspondingly arranged with the plurality of pixel openings; the plurality of second encapsulation structures are correspondingly arranged with the plurality of second light-emitting units; and the plurality of second photolithography structures are correspondingly arranged with the plurality of second light-emitting units.

15. The preparation method according to claim 14, characterized in that, The method further includes: The plurality of second photolithographic structures are peeled off from the side of the plurality of second packaging structures away from the substrate.

16. The preparation method according to claim 15, characterized in that, The method further includes: An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of fifth electrodes; A pixel material layer is formed on the side of the substrate and the fifth electrode facing away from the substrate, and an isolation material layer is formed on the side of the pixel material layer facing away from the substrate. The isolation material layer and the pixel material layer are subjected to a second patterning process to form an isolation layer and a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings. A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate, an encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate, and a photoresist material layer is formed on the side of the encapsulation material layer facing away from the substrate. The photoresist material layer is subjected to a third patterning process to form a plurality of third photolithography structures. The plurality of third photolithography structures are correspondingly disposed with the plurality of fifth electrodes, and the orthographic projection of the fifth electrode on the substrate is located within the orthographic projection of the corresponding third photolithography structure on the substrate. The encapsulation material layer and the light-emitting material layer are subjected to a fourth patterning process to form a third light-emitting structure in a plurality of third encapsulation structures and a plurality of third light-emitting units; wherein, the plurality of third light-emitting units are correspondingly arranged with the plurality of pixel openings; the plurality of third encapsulation structures are correspondingly arranged with the plurality of third light-emitting units; and the plurality of third photolithography structures are correspondingly arranged with the plurality of third light-emitting units.

17. The preparation method according to claim 16, characterized in that, The method further includes: The plurality of third photolithographic structures are peeled off from the side of the plurality of third packaging structures away from the substrate.

18. A display device, characterized in that, It includes the display panel as described in any one of claims 1-9, or the display panel as described in claim 10 or 11, or the display panel obtained by the preparation method according to claims 11 to 17.

Images