Display screen, method for manufacturing display screen, and display device

Abstract

The application discloses a display screen, a preparation method of the display screen and a display device. The display screen comprises a screen body, a driving chip and a packaging structure. The screen body has a light-emitting side and a backlight side. The screen body comprises a binding terminal and sequentially connected first flat portions, a bending portion and second flat portions. At least part of the bending portion is bent to the backlight side. The second flat portions are located on the backlight side, and the binding terminal is arranged on the second flat portions. The driving chip is electrically connected to the binding terminal, and the driving chip is used for driving the screen body to emit light. The packaging structure is arranged on the backlight side of the screen body, and is used for packaging the driving chip and at least part of the screen body. The packaging structure comprises at least one packaging layer. The at least one packaging layer comprises first portions and second portions. The second portions are arranged around the first portions, and the first portions and the second portions form an accommodating groove. The driving chip and the binding terminal are located in the accommodating groove, and one end of the second portion, which is away from the first portion, is connected to the second flat portions.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display screen, a method for manufacturing the display screen, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a display screen, a method for manufacturing the display screen, and a display device that can improve the performance of the display screen.

[0005] This application provides a display screen, including a screen body, a driver chip, and a packaging structure. The screen body has a light-emitting side and a backlight side. The screen body includes a bonding terminal and a first straight portion, a bent portion, and a second straight portion connected in sequence. At least a portion of the bent portion is bent to the backlight side. The second straight portion is located on the backlight side, and the bonding terminal is disposed on the second straight portion. The driver chip is electrically connected to the bonding terminal and is used to drive the screen body to emit light. The packaging structure is disposed on the backlight side of the screen body and is used to encapsulate the driver chip and at least a portion of the screen body. The packaging structure includes at least one encapsulation layer. The at least one encapsulation layer includes a first portion and a second portion. The second portion is disposed around the first portion and forms a receiving groove with the first portion. The driver chip and the bonding terminal are located in the receiving groove. One end of the second portion away from the first portion is connected to the second straight portion.

[0006] In some embodiments, the encapsulation layer further includes a third portion connected to the second portion, the third portion covering the second flat portion;

[0007] Preferably, the third part is arranged around the second part.

[0008] In some embodiments, the packaging structure includes a first packaging layer for packaging a driver chip and at least a portion of the screen body. The first packaging layer includes a first portion, a second portion, and a third portion.

[0009] Preferably, the first encapsulation layer includes at least two sub-layers, which are stacked along the thickness direction of the screen body, and at least one sub-layer includes a first part, a second part, and a third part;

[0010] Preferably, the material of the first encapsulation layer includes metal;

[0011] Preferably, the material of the first encapsulation layer includes an inert metal;

[0012] Preferably, the material of the first encapsulation layer includes at least one of titanium and aluminum.

[0013] In some embodiments, the packaging structure further includes a second packaging layer, which is stacked with the first packaging layer along the thickness direction of the screen body. The second packaging layer is used to encapsulate the driver chip and at least part of the screen body.

[0014] Preferably, the second encapsulation layer includes a first part, a second part, and a third part;

[0015] Preferably, at least one of the first encapsulation layer and the second encapsulation layer is configured to conduct heat outward;

[0016] Preferably, the second encapsulation layer is located on the side of the first encapsulation layer that faces away from the second flat portion;

[0017] Preferably, the thermal conductivity of the second encapsulation layer is greater than that of the first encapsulation layer;

[0018] Preferably, the material of the second encapsulation layer includes graphene;

[0019] Preferably, the thickness of the first encapsulation layer is greater than or equal to the thickness of the second encapsulation layer;

[0020] Preferably, the ratio Z of the thickness of the first encapsulation layer to the thickness of the second encapsulation layer satisfies: 1≤Z≤3.

[0021] In some embodiments, the orthographic projection of the packaging structure is located within the orthographic projection of the second straight portion in a plane perpendicular to the thickness direction of the screen body.

[0022] Preferably, at least one encapsulation layer of the encapsulation structure is disposed as a single layer in the second straight portion;

[0023] Preferably, the display screen further includes a flexible circuit board, which is electrically connected to the screen body and connected to the driver chip through the screen body.

[0024] In some embodiments, the display screen further includes a connector, at least a portion of which is located between the driver chip and the bonding terminal for connecting the driver chip and the bonding terminal, the connector being located within a receiving groove;

[0025] Preferably, the connector includes anisotropic conductive adhesive;

[0026] Preferably, the connector has a first groove on the side facing the second flat portion, and the bonding terminal is disposed in the first groove; and / or, the connector has a second groove on the side away from the second flat portion, and at least a portion of the driving chip is disposed in the second groove;

[0027] Preferably, the second part includes a first sub-segment and a second sub-segment, the first sub-segment being connected between the second sub-segment and the first part, the first sub-segment being disposed around at least part of the driver chip, and the second sub-segment being disposed around the connector;

[0028] Preferably, the connector includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The first surface is located on the side of the connector facing the second flat portion, and the second surface is located on the side of the connector away from the second flat portion. Along the direction from the second surface to the first surface, the side surface is inclined away from the binding terminal.

[0029] Preferably, the second segment covers the side surface.

[0030] A second aspect of this application provides a method for manufacturing a display screen, comprising:

[0031] Provide a screen and driver chip;

[0032] The driver chip is moved to the side of the screen body away from the second straight part of the bonding terminal, and the driver chip and the bonding terminal are connected.

[0033] An encapsulation structure is formed on the backlight side of the screen. The encapsulation structure is used to encapsulate the driver chip and at least part of the screen. The encapsulation structure includes at least one encapsulation layer. The encapsulation layer includes a first part and a second part. The second part is disposed around the first part and forms a receiving groove with the first part. The driver chip and bonding terminals are located in the receiving groove. One end of the second part away from the first part is connected to a second flat part.

[0034] In some embodiments, during the step of forming an encapsulation structure on the backlight side of the screen, the encapsulation layer further includes a third portion, which is connected to the second portion and covers the second flat portion.

[0035] Preferably, the step of forming the encapsulation structure on the backlight side of the screen includes:

[0036] A first encapsulation layer is formed on the backlight side of the screen, the first encapsulation layer including a first part, a second part and a third part;

[0037] Preferably, the step of forming the first encapsulation layer on the backlight side of the screen includes:

[0038] The first encapsulation layer is formed on the backlight side of the screen using a sputtering process;

[0039] Preferably, after the step of forming the first encapsulation layer on the backlight side of the screen, the method further includes:

[0040] A second encapsulation layer is formed on the backlight side of the screen, and the second encapsulation layer includes a first part, a second part and a third part;

[0041] Preferably, the step of forming a second encapsulation layer on the backlight side of the screen includes:

[0042] A second encapsulation layer is formed on the backlight side of the screen using a chemical vapor deposition process.

[0043] In some embodiments, before the step of transferring the driver chip to the side of the screen body away from the second flat portion of the bonding terminal and connecting the driver chip and the bonding terminal, the method further includes:

[0044] A connector is formed on the backlight side of the screen, and at least a portion of the connector is located on the side of the bonding terminal facing away from the second flat portion;

[0045] The steps of transferring the driver chip to the side of the screen body away from the second flat section and connecting the driver chip and the bonding terminal include:

[0046] The driver chip is moved to the side of the connector facing away from the second flat section, so that the driver chip and the bonding terminal are connected through the connector;

[0047] Preferably, the step of transferring the driver chip to the side of the connector opposite to the second flat portion includes:

[0048] The driver chip is moved to the side of the connector that faces away from the second flat section;

[0049] Pressure is applied to the driver chip so that the bonding terminal and at least a portion of the driver chip are embedded in the connector, the bonding terminal being located in a first groove of the connector and at least a portion of the driver chip being located in a second groove of the connector.

[0050] A third aspect of this application provides a display device, including a display screen of any of the above-mentioned types or a display screen formed by any of the above-mentioned manufacturing methods.

[0051] This application provides a display screen, including a screen body, a driver chip, and a packaging structure. The screen body has a light-emitting side and a backlight side. The screen body includes bonding terminals and a first straight portion, a bent portion, and a second straight portion connected in sequence. The second straight portion can be bent at least partially to the backlight side through the bent portion. The bonding terminals disposed on the second straight portion can be connected to the driver chip on the backlight side, thereby helping to increase the display area of ​​the screen body and improve the display effect of the display screen. The packaging structure is disposed on the backlight side and includes at least one packaging layer. The packaging layer includes a first part and a second part. The second part is disposed around the first part and forms a receiving groove with the first part. The driver chip and the bonding terminals are located in the receiving groove, and the end of the second part away from the first part is connected to the second straight portion. Therefore, the first part, the second part, and the second straight portion are equivalent to covering the driver chip and the bonding terminals, thereby effectively encapsulating the driver chip and the bonding terminals, reducing the risk of affecting the connection reliability of the driver chip and the bonding terminals due to the intrusion of moisture and other impurities, and helping to improve the performance of the display screen. Attached Figure Description

[0052] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 A cross-sectional schematic diagram of a display screen provided for some embodiments of this application;

[0054] Figure 2 Another cross-sectional view of the display screen provided in some embodiments of this application;

[0055] Figure 3 Another cross-sectional schematic diagram of a display screen provided for some embodiments of this application;

[0056] Figure 4 Another cross-sectional schematic diagram of a display screen provided for some embodiments of this application;

[0057] Figure 5 for Figure 1 Enlarged view of section AA;

[0058] Figure 6 A flowchart illustrating a method for manufacturing a display screen according to some embodiments of this application;

[0059] Figure 7 Another flowchart illustrating a method for manufacturing a display screen provided in some embodiments of this application;

[0060] Figure 8Another flowchart illustrating a method for manufacturing a display screen provided in some embodiments of this application;

[0061] Figure 9 Another flowchart illustrates a method for manufacturing a display screen according to some embodiments of this application.

[0062] The attached icons are numbered as follows:

[0063] Screen body 100; bonding terminal 110; first straight part 120; bending part 130; second straight part 140;

[0064] Driver chip 200;

[0065] Encapsulation structure 300; encapsulation layer 310; first encapsulation layer 310a; second encapsulation layer 310b; first part 311; second part 312; first sub-segment 3121; second sub-segment 3122; third part 313; sublayer 314;

[0066] Connector 400; First surface 410; Second surface 420; Side surface 430;

[0067] Receiving groove K1; First groove K2; Second groove K3; Light-emitting side S1; Backlight side S2. Detailed Implementation

[0068] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0069] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable tolerance range. "Parallel" is not parallel in the strict sense, but within the allowable tolerance range.

[0070] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0071] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0072] Currently, in displays, after the screen body and driver chip are bonded together, the connection between the driver chip and the screen body is usually encapsulated by applying UV adhesive. However, due to factors such as coating precision, UV coating equipment cannot guarantee a sealed connection between the UV adhesive and the driver chip. There is usually a gap between the UV adhesive and the driver chip, and impurities such as moisture can easily penetrate into the connection between the driver chip and the screen body through this gap, affecting the reliability of the connection and thus impacting the performance of the display.

[0073] To solve at least part of the above-mentioned technical problems, this application provides a display screen, a method for manufacturing the display screen, and a display device. The structure of the display screen will be described in detail below with reference to the accompanying drawings.

[0074] Please see Figure 1The first aspect of this application provides a display screen, including a screen body 100, a driver chip 200, and a packaging structure 300. The screen body 100 has a light-emitting side S1 and a backlight side S2. The screen body 100 includes a bonding terminal 110 and a first straight portion 120, a bent portion 130, and a second straight portion 140 connected in sequence. At least a portion of the bent portion 130 is bent to the backlight side S2, and the second straight portion 140 is located on the backlight side S2. The bonding terminal 110 is disposed on the second straight portion 140. The driver chip 200 is electrically connected to the bonding terminal 110 and is used to drive the screen body 100. Light emission; the encapsulation structure 300 is disposed on the backlight side S2 of the screen 100. The encapsulation structure 300 is used to encapsulate the driver chip 200 and at least part of the screen 100. The encapsulation structure 300 includes at least one encapsulation layer 310. The at least one encapsulation layer 310 includes a first part 311 and a second part 312. The second part 312 is disposed around the first part 311 and forms a receiving groove K1 with the first part 311. The driver chip 200 and the bonding terminal 110 are located in the receiving groove K1. One end of the second part 312 away from the first part 311 is connected to the second straight part 140.

[0075] The screen 100 may include a display panel. In this embodiment, the display panel may be an organic light-emitting diode (OLED) display panel, or other types of display panels, such as micro light-emitting diode (Micro-LED) or quantum light-emitting diode (QLED) display panels.

[0076] The screen body 100 is a flexible screen body, which includes a first straight portion 120, a bent portion 130, and a second straight portion 140 connected in sequence. At least a portion of the bent portion 130 is bent from the light-emitting side S1 to the backlight side S2, and the second straight portion 140 is located on the backlight side S2. The screen body 100 also includes a bonding terminal 110, which can be electrically connected to the connection pin of the driver chip 200. The driver chip 200 can be connected to the driving circuit of the screen body 100 through the bonding terminal 110 to drive the screen body 100 to emit light.

[0077] The bonding terminal 110 is disposed on the second flat portion 140, and can be located on the surface of the second flat portion 140 opposite to the first flat portion 120. The bonding terminal 110 is electrically connected to the driver chip 200 on the backlight side S2 of the screen body 100, thereby reducing the space occupied on the light-emitting side S1 of the screen body 100, which helps to increase the display area of ​​the screen body 100 on the light-emitting side S1 and reduce the non-display area of ​​the screen body 100 on the light-emitting side S1, thereby improving the display effect of the display screen. There are various ways to electrically connect the bonding terminal 110 and the driver chip 200. For example, the bonding terminal 110 can be soldered to the driver chip 200, or the bonding terminal 110 can be electrically connected to the driver chip 200 through conductive adhesive. This embodiment does not limit this.

[0078] The encapsulation structure 300 is used for the driver chip 200 and at least a portion of the screen 100. The encapsulation structure 300 is disposed on the backlight side S2 of the screen 100, and it can cover the driver chip 200 and the connection portion between the driver chip 200 and the bonding terminal 110. Optionally, the encapsulation structure 300 can further cover the remaining portion of the screen 100 except for the bonding terminal 110; for example, the encapsulation structure 300 can also cover the second straight portion 140, and even the bend portion 130.

[0079] Specifically, the packaging structure 300 includes at least one packaging layer 310, which includes a first portion 311 and a second portion 312. The first portion 311 is located on the side of the driver chip 200 facing away from the second flat portion 140. The second portion 312 is connected to the first portion 311 and surrounds it. Therefore, the second portion 312 and the first portion 311 together form a receiving groove K1, with the opening of the receiving groove K1 facing the second flat portion 140. Furthermore, the end of the second portion 312 away from the first portion 311 is connected to the second flat portion 140, at which point the second flat portion 140 effectively covers the opening of the receiving groove K1. The driver chip 200 and the bonding terminal 110 are placed in the receiving groove K1. The first part 311, the second part 312 and the second straight part 140 can cover the driver chip 200 and the bonding terminal 110 to effectively encapsulate the driver chip 200 and the bonding terminal 110, reduce the risk of affecting the connection reliability of the driver chip 200 and the bonding terminal 110 due to the intrusion of impurities such as moisture, and help improve the performance of the display screen.

[0080] Please continue reading. Figure 1 In some embodiments, the encapsulation layer 310 further includes a third portion 313 connected to the second portion 312, and the third portion 313 covers the second straight portion 140.

[0081] The third part 313 can be connected to the end of the second part 312 away from the first part 311. It can cover at least a portion of the surface of the second flat part 140 to increase the contact area between the encapsulation layer 310 and the screen body 100, and improve the encapsulation effect of the encapsulation structure 300 on the driver chip 200 and the bonding terminal 110.

[0082] Preferably, the third portion 313 is arranged around the second portion 312 to further improve the encapsulation effect of the driver chip 200 and the bonding terminal 110.

[0083] Please see Figure 2 In some embodiments, the packaging structure 300 includes a first packaging layer 310a, which is used to package the driver chip 200 and at least a portion of the screen 100. The first packaging layer 310a includes a first portion 311, a second portion 312 and a third portion 313.

[0084] The first encapsulation layer 310a includes a first portion 311, a second portion 312, and a third portion 313. The first portion 311 is located on the side of the driver chip 200 facing away from the second flat portion 140. The second portion 312 is disposed around the first portion 311 and can form a receiving groove K1 with the first portion 311. The driver chip 200 and the bonding terminal 110 are located in the receiving groove K1. The second flat portion 140 can cover the opening of the receiving groove K1, so as to encapsulate the driver chip 200 and the bonding terminal 110 together with the first portion 311 and the second portion 312. In addition, the third portion 313 is connected to the end of the second portion 312 away from the first portion 311 and is attached to the surface of the second flat portion 140 to cover part of the second flat portion 140, thereby increasing the contact area between the first encapsulation layer 310a and the second flat portion 140 and improving the encapsulation effect of the driver chip 200 and the bonding terminal 110.

[0085] Preferably, the first encapsulation layer 310a includes at least two sub-layers 314, which are stacked along the thickness direction of the screen body 100, and at least one sub-layer 314 includes a first part 311, a second part 312 and a third part 313.

[0086] Specifically, in the first encapsulation layer 310a, the materials of at least two sublayers 314 can be the same or different. At least one sublayer 314 including a first portion 311, a second portion 312, and a third portion 313 can mean that all sublayers 314 in the first encapsulation layer 310a include the first portion 311, the second portion 312, and the third portion 313, or it can mean that one or more of the multiple sublayers 314 in the first encapsulation layer 310a include the first portion 311, the second portion 312, and the third portion 313. This embodiment does not impose any limitations on this.

[0087] It should be noted that in the encapsulation structure 300, the second part 312 and the third part 313 can be directly connected to the second straight part 140, or the second part 312 and the third part 313 can also be indirectly connected to the second straight part 140 through the remaining sub-layer 314. This embodiment does not limit this.

[0088] In these embodiments, the first encapsulation layer 310a includes at least two sub-layers 314 stacked together. By encapsulating the driver chip 200 and the bonding terminal 110 through at least two sub-layers 314, the encapsulation reliability of the driver chip 200 and the bonding terminal 110 can be further improved.

[0089] Preferably, the material of the first encapsulation layer 310a includes metal. The first encapsulation layer 310a made of metal has good encapsulation capabilities and can better resist the intrusion of impurities such as moisture into the driver chip 200 and the bonding terminal 110, thereby helping to further improve the connection reliability of the driver chip 200 and the bonding terminal 110 and improve the performance of the display screen.

[0090] Preferably, the material of the first encapsulation layer 310a includes an inert metal. Inert metals have good chemical stability and are highly resistant to impurities such as moisture at room temperature or high temperature, thereby reducing the impact of oxidation or corrosion on encapsulation performance.

[0091] In addition, inert metals have good thermal conductivity, which can dissipate the heat generated at the driver chip 200 and bonding terminal 110 to the outside, thereby reducing the operating temperature of the driver chip 200 and extending its service life.

[0092] Preferably, the material of the first encapsulation layer 310a includes at least one of titanium and aluminum, so that the first encapsulation layer 310a has good encapsulation capability.

[0093] It should be noted that the material of the first encapsulation layer 310a including metal can mean that some sublayers 314 of the first encapsulation layer 310a are made of metal, while the remaining sublayers 314 are made of other materials, or it can mean that all sublayers 314 of the first encapsulation layer 310a are made of metal. This embodiment does not limit this. For example, the first encapsulation layer 310a may include two sublayers 314, wherein the material of one sublayer 314 may include titanium, and the material of the other sublayer 314 may include aluminum. In this case, the first encapsulation layer 310a is equivalent to a stacked structure formed by stacking titanium and aluminum metals.

[0094] Please see Figure 3In some embodiments, the packaging structure 300 further includes a second packaging layer 310b, which is stacked with the first packaging layer 310a along the thickness direction of the screen 100. The second packaging layer 310b is used to package the driver chip 200 and at least a portion of the screen 100. The second packaging layer 310b can further package the driver chip 200 and at least a portion of the screen 100, improving the packaging effect and thereby further improving the connection reliability between the driver chip 200 and the bonding terminal 110.

[0095] It should be noted that the second encapsulation layer 310b may be located on the side of the first encapsulation layer 310a facing the second flat portion 140, or it may be located on the side of the first encapsulation layer 310a away from the second flat portion 140. This embodiment does not impose any restrictions on this.

[0096] Preferably, the second encapsulation layer 310b includes a first portion 311, a second portion 312, and a third portion 313.

[0097] Specifically, in the second encapsulation layer 310b, the first portion 311 and the second portion 312 can be enclosed to form a receiving groove K1. The driver chip 200 and the bonding terminal 110 are located in the receiving groove K1 to encapsulate the driver chip 200 and the bonding terminal 110. The third portion 313 is connected to the end of the second portion 312 away from the corresponding first portion 311. It can cover part of the second flat portion 140, thereby increasing the contact area between the first encapsulation layer 310a and the second flat portion 140 and improving the encapsulation effect of the driver chip 200 and the bonding terminal 110.

[0098] It should be noted that when the second encapsulation layer 310b is located on the side of the first encapsulation layer 310a facing the second flat portion 140, the first portion 311 and the second portion 312 of the second encapsulation layer 310b can directly contact the driver chip 200 and the bonding terminal 110, and its third portion 313 can directly contact the surface of the second flat portion 140. The first portion 311, the second portion 312 and the third portion 313 of the first encapsulation layer 310a can be indirectly connected to the driver chip 200 and the screen 100 through the second encapsulation layer 310b. Similarly, when the second encapsulation layer 310b is located on the side of the first encapsulation layer 310a away from the second flat portion 140, the first portion 311 and the second portion 312 of the first encapsulation layer 310a can directly contact the driver chip 200 and the bonding terminal 110, and its third portion 313 can directly contact the surface of the second flat portion 140. The first portion 311, the second portion 312 and the third portion 313 of the second encapsulation layer 310b can be indirectly connected to the driver chip 200 and the screen 100 through the first encapsulation layer 310a.

[0099] Preferably, at least one of the first encapsulation layer 310a and the second encapsulation layer 310b is configured to conduct heat outwards. The first encapsulation layer 310a and the second encapsulation layer 310b can have both good encapsulation performance and thermal conductivity performance. On the one hand, it improves the encapsulation effect of the driver chip 200 and the bonding terminal 110. On the other hand, it can dissipate the heat generated at the driver chip 200 and the bonding terminal 110 outwards, reduce the operating temperature of the driver chip 200, and extend the service life of the driver chip 200.

[0100] Preferably, the second encapsulation layer 310b is located on the side of the first encapsulation layer 310a facing away from the second flat portion 140. The material of the first encapsulation layer 310a includes a metallic material, and it is located on the side of the second encapsulation layer 310b facing the second flat portion 140, which can directly contact the driver chip 200 and the bonding terminal 110, thus helping to improve the encapsulation reliability of the driver chip 200 and the bonding terminal 110.

[0101] Preferably, the thermal conductivity of the second encapsulation layer 310b is greater than that of the first encapsulation layer 310a, so as to better dissipate the heat generated at the driver chip 200 and the bonding terminal 110, further reduce the operating temperature of the driver chip 200, and improve the service life of the driver chip 200.

[0102] Preferably, the material of the second encapsulation layer 310b includes graphene, which gives the second encapsulation layer 310b good thermal conductivity. At the same time, the two-dimensional network molecular structure of graphene can effectively isolate impurities such as water vapor, giving it good encapsulation capability.

[0103] In some optional embodiments, the material of the first encapsulation layer 310a includes metal, and the material of the second encapsulation layer 310b includes graphene. The thermal conductivity of the metal is approximately 237 W / mK, and the thermal conductivity of the graphene is approximately 5300 W / mK. In this embodiment, the first encapsulation layer 310a and the second encapsulation layer 310b, stacked together, jointly cover the driver chip 200 and the bonding terminal 110. This ensures the encapsulation reliability of the driver chip 200 and the bonding terminal 110, while also effectively dissipating the heat generated by the driver chip 200 in a timely manner, thereby reducing the operating temperature of the driver chip 200 and extending its service life.

[0104] Preferably, the thickness of the first encapsulation layer 310a is greater than or equal to the thickness of the second encapsulation layer 310b. The first encapsulation layer 310a is in direct contact with the driver chip 200 and the bonding terminal 110, and its thickness is greater than that of the second encapsulation layer 310b, which can effectively improve the encapsulation reliability of the driver chip 200 and the bonding terminal 110.

[0105] Preferably, the ratio Z of the thickness of the first encapsulation layer 310a to the thickness of the second encapsulation layer 310b satisfies: 1≤Z≤3.

[0106] As an example, the thickness ratio of the first encapsulation layer 310a and the second encapsulation layer 310b can be 1, 1.3, 1.5, 1.7, 2, 2.3, 2.5, 2.7, 3 or any other value between the aforementioned two values. This embodiment does not impose any restrictions on this.

[0107] In these embodiments, by optimizing the design of the thickness of the first packaging layer 310a and the thickness of the second packaging layer 310b, it is helpful to improve the risk reliability of the packaging structure 300 to the driver chip 200 and the bonding terminal 110, and also to improve the thermal conductivity of the packaging structure 300 and extend the service life of the driver chip 200.

[0108] Please see Figures 1-3 In some embodiments, the orthographic projection of the encapsulation structure 300 is located within the orthographic projection of the second straight portion 140 in a plane perpendicular to the thickness direction of the screen body 100. That is, the orthographic projection of the encapsulation structure 300 is located outside the orthographic projection of the bent portion 130 in a plane perpendicular to the thickness direction of the screen body 100, which can reduce the influence of the encapsulation structure 300 on the bending performance of the bent portion 130.

[0109] Please see Figure 4 Preferably, at least one encapsulation layer 310 of the encapsulation structure 300 is disposed as a single layer in the second flat portion 140, which helps to improve the encapsulation reliability of the encapsulation structure 300 for the second flat portion 140 and the bonding terminal 110 and the driver chip 200 located on one side of the second flat portion 140.

[0110] Preferably, the display screen further includes a flexible circuit board, which is electrically connected to the screen body 100 and connected to the driver chip 200 through the screen body 100. Compared to the flexible circuit board being directly connected to the driver chip 200, the flexible circuit board is indirectly connected to the driver chip 200 through the screen body 100, which does not need to pass through the packaging structure 300. Therefore, it helps to improve the integrity of the packaging structure 300 and enhance the packaging reliability of the packaging structure 300 for the driver chip 200 and the bonding terminal 110.

[0111] Optionally, the flexible circuit board is located on the backlight side S2 of the screen 100, which helps to further increase the display area of ​​the screen 100.

[0112] Optionally, the flexible circuit board is located on the backlight side S2 of the screen 100 and is covered by the third part 313 of the encapsulation structure 300.

[0113] Please see Figure 5In some embodiments, the display screen further includes a connector 400, at least a portion of which is located between the driver chip 200 and the bonding terminal 110 for connecting the driver chip 200 and the bonding terminal 110. The connector 400 is located within a receiving groove K1. The connector 400 is used to achieve an electrical connection between the driver chip 200 and the bonding terminal 110 to improve the connection reliability between the driver chip 200 and the bonding terminal 110.

[0114] The connector 400 can be made of various materials. For example, the connector 400 can be solder or conductive adhesive.

[0115] Preferably, the connector 400 includes anisotropic conductive adhesive, which has high-density electrical connectivity, helping to improve the connection reliability between the driver chip 200 and the bonding terminal 110. Furthermore, the anisotropic conductive adhesive also features low-temperature curing, stress buffering, and bending resistance, and its molding process is simple, reducing its impact on the driver chip 200 and the bonding terminal 110.

[0116] Preferably, the connector 400 has a first groove K2 on the side facing the second straight portion 140, and the binding terminal 110 is disposed in the first groove K2; and / or, the connector 400 has a second groove K3 on the side away from the second straight portion 140, and at least a portion of the driving chip 200 is disposed in the second groove K3.

[0117] In some embodiments, the connector 400 has a first groove K2 on the side facing the second flat portion 140, and the bonding terminal 110 is located in the first groove K2. On the one hand, the connector 400 can encapsulate the bonding terminal 110, reducing the risk of moisture and other impurities intruding into the bonding terminal 110 and affecting its performance. On the other hand, placing the bonding terminal 110 in the first groove K2 also helps to increase the contact area between the bonding terminal 110 and the connector 400, improve the reliability of the connection between the bonding terminal 110 and the driver chip 200 through the connector 400, and also helps to reduce the impedance between the bonding terminal 110 and the driver chip 200.

[0118] In some embodiments, the connector 400 has a second groove K3 on the side opposite to the second straight portion 140, and at least a portion of the driver chip 200 is located in the second groove K3. On the one hand, the connector 400 can encapsulate at least a portion of the driver chip 200, reducing the risk of moisture and other impurities intruding into the driver chip 200 and affecting its performance. On the other hand, placing at least a portion of the driver chip 200 in the first groove K2 also helps to increase the contact area between the driver chip 200 and the connector 400, improve the reliability of the connection between the bonding terminal 110 and the driver chip 200 through the connector 400, and also helps to reduce the impedance between the bonding terminal 110 and the driver chip 200.

[0119] In some other embodiments, the connector 400 may have a first groove K2 on the side facing the second flat portion 140 and a second groove K3 on the side facing away from the second flat portion 140, the bonding terminal 110 is located in the first groove K2, and at least a portion of the drive chip 200 is located in the second groove K3.

[0120] Preferably, the second part 312 includes a first sub-segment 3121 and a second sub-segment 3122. The first sub-segment 3121 is connected between the second sub-segment 3122 and the first part 311. The first sub-segment 3121 is disposed around at least part of the driver chip 200, and the second sub-segment 3122 is disposed around the connector 400.

[0121] Specifically, the connector 400 is located within the receiving groove K1, at least partially between the driver chip 200 and the bonding terminal 110. Therefore, the second part 312 may include a first sub-segment 3121 and a second sub-segment 3122. The first sub-segment 3121 is connected between the second sub-segment 3122 and the first part 311 and is arranged around at least part of the driver chip 200. The second sub-segment 3122 may be connected between the first sub-segment 3121 and the third part 313 and is arranged around the connector 400. Thus, the driver chip 200, the connector 400, and the bonding terminal 110 can be effectively encapsulated through the first part 311, the first sub-segment 3121, the second sub-segment 3122, and the third part 313 to further improve the encapsulation reliability.

[0122] Preferably, the connector 400 includes a first surface 410, a second surface 420, and a side surface 430 connecting the first surface 410 and the second surface 420. The first surface 410 is located on the side of the second surface 420 of the connector 400 facing the second straight portion 140, and the second surface 420 is located on the side of the connector 400 away from the second straight portion 140, in the direction from the second surface 420 to the first surface 410. The side surface 430 is inclined to the side away from the binding terminal 110.

[0123] Specifically, the first surface 410 can contact the bonding terminal 110, and the second surface 420 can contact the driving chip 200. When the connector 400 is provided with a first groove K2 and a second groove K3, the first groove K2 is formed on the first surface 410, and the second groove K3 is formed on the second surface 420.

[0124] In these embodiments, the side surface 430 of the connector 400 is inclined. During the fabrication of the encapsulation structure 300, the inclined side surface 430 helps to reduce the difficulty of the encapsulation layer 310 climbing uphill, reduce the risk of the encapsulation layer 310 breaking at the side surface 430, thereby improving the continuity of the encapsulation layer 310 and enhancing the encapsulation performance of the encapsulation structure 300.

[0125] Preferably, the second segment 3122 covers the side surface 430. During the fabrication of the encapsulation structure 300, the inclined side surface 430 helps to improve the continuity of the second segment 3122, reduce the risk of the second segment 3122 breaking at the side surface 430, and improve the encapsulation performance of the encapsulation layer 310.

[0126] Please see Figure 6 The second aspect of this application provides a method for manufacturing a display screen, comprising:

[0127] S10. A screen body 100 and a driver chip 200 are provided. Specifically, the screen body 100 may have a light-emitting side S1 and a backlight side S2. The screen body 100 includes a bonding terminal 110 and a first straight portion 120, a bent portion 130, and a second straight portion 140 connected in sequence. At least a portion of the bent portion 130 is bent to the backlight side S2, and the second straight portion 140 is located on the backlight side S2. The bonding terminal 110 is disposed on the second straight portion 140. The driver chip 200 may have connection pins.

[0128] S20. The driver chip 200 is transferred to the side of the bonding terminal 110 of the screen body 100 away from the second flat portion 140, and the driver chip 200 and the bonding terminal 110 are connected. Specifically, after the driver chip 200 is transferred to the side of the bonding terminal 110 away from the second flat portion 140, the side of the driver chip 200 with the connection pins faces the bonding terminal 110, which helps to realize the electrical connection between the driver chip 200 and the bonding terminal 110.

[0129] S30. An encapsulation structure 300 is formed on the backlight side S2 of the screen 100. The encapsulation structure 300 is used to encapsulate the driver chip 200 and at least a portion of the screen 100. The encapsulation structure 300 includes at least one encapsulation layer 310. The encapsulation layer 310 includes a first portion 311 and a second portion 312. The second portion 312 is disposed around the first portion 311 and forms a receiving groove K1 with the first portion 311. The driver chip 200 and the bonding terminal 110 are located in the receiving groove K1. One end of the second portion 312 away from the first portion 311 is connected to the second straight portion 140.

[0130] In these embodiments, after the driver chip 200 is transferred to the side of the bonding terminal 110 away from the second flat portion 140 and the driver chip 200 and the bonding terminal 110 are connected, an encapsulation structure 300 is formed on the backlight side S2 of the screen 100. The encapsulation structure 300 includes at least one encapsulation layer 310. The encapsulation layer 310 includes a first portion 311 and a second portion 312. The second portion 312 is disposed around the first portion 311 and forms a receiving groove K1 with the first portion 311. The end of the second portion 312 away from the first portion 311 is... Connected to the second flat portion 140, the second flat portion 140 is equivalent to covering the opening of the receiving groove K1, and the driver chip 200 and the bonding terminal 110 are placed in the receiving groove K1. The first portion 311, the second portion 312 and the second flat portion 140 can cover the driver chip 200 and the bonding terminal 110 to effectively encapsulate the driver chip 200 and the bonding terminal 110, reduce the risk of affecting the connection reliability of the driver chip 200 and the bonding terminal 110 due to the intrusion of impurities such as moisture, and help improve the performance of the display screen.

[0131] In some embodiments, during the step of forming the encapsulation structure 300 on the backlight side S2 of the screen 100, the encapsulation layer 310 further includes a third portion 313, which is connected to the second portion 312 and covers a portion of the second flat portion 140. The third portion 313 may be connected to the end of the second portion 312 away from the first portion 311, and may cover at least a portion of the surface of the second flat portion 140 to increase the contact area between the encapsulation layer 310 and the screen 100, thereby improving the encapsulation effect of the encapsulation structure 300 on the driver chip 200 and the bonding terminal 110.

[0132] Please see Figure 7 Preferably, the step of forming the encapsulation structure 300 on the backlight side S2 of the screen 100 includes:

[0133] S31. A first encapsulation layer 310a is formed on the backlight side S2 of the screen 100. The first encapsulation layer 310a includes a first part 311, a second part 312 and a third part 313.

[0134] In these embodiments, in the first encapsulation layer 310a, the first portion 311 and the second portion 312 can be enclosed to form a receiving groove K1. The driver chip 200 and the bonding terminal 110 are located within the receiving groove K1. The second flat portion 140 can cover the opening of the receiving groove K1 to encapsulate the driver chip 200 and the bonding terminal 110 together with the first portion 311 and the second portion 312. Furthermore, the third portion 313 of the first encapsulation layer 310a is connected to the end of the corresponding second portion 312 away from the first portion 311. It is attached to the surface of the second flat portion 140 to cover part of the second flat portion 140, thereby increasing the contact area between the first encapsulation layer 310a and the second flat portion 140 and improving the encapsulation effect of the driver chip 200 and the bonding terminal 110.

[0135] Preferably, the step of forming the first encapsulation layer 310a on the backlight side S2 of the screen 100 includes:

[0136] A first encapsulation layer 310a is formed on the backlight side S2 of the screen body 100 using a sputtering process.

[0137] In these embodiments, the first encapsulation layer 310a is formed on the backlight side S2 of the screen 100 using a sputtering process, which helps to improve the uniformity and density of the first encapsulation layer 310a, while also helping to reduce impurity contamination in the first encapsulation layer 310a and giving the first encapsulation layer 310a excellent adhesion, thereby improving the encapsulation effect of the first encapsulation layer 310a on the driver chip 200 and the bonding terminal 110.

[0138] Preferably, after the step of forming the first encapsulation layer 310a on the backlight side S2 of the screen 100, the method further includes:

[0139] S32. A second encapsulation layer 310b is formed on the backlight side S2 of the screen 100. The second encapsulation layer 310b includes a first part 311, a second part 312 and a third part 313.

[0140] In these embodiments, after the first encapsulation layer 310a is formed on the backlight side S2 of the screen 100, a second encapsulation layer 310b is further formed to further encapsulate the driver chip 200 and the bonding terminal 110.

[0141] Preferably, the step of forming the second encapsulation layer 310b on the backlight side S2 of the screen 100 includes:

[0142] A second encapsulation layer 310b is formed on the backlight side S2 of the screen 100 using a chemical vapor deposition process.

[0143] In these embodiments, the use of chemical vapor deposition to form the second encapsulation layer 310b helps to form a dense second encapsulation layer 310b, thereby improving the encapsulation capability of the second encapsulation layer 310b. Furthermore, the use of chemical vapor deposition to form the second encapsulation layer 310b also helps to improve the uniformity of the second encapsulation layer 310b and the bonding force between the second encapsulation layer 310b and the first encapsulation layer 310a, reducing the risk of encapsulation failure due to delamination between the second encapsulation layer 310b and the first encapsulation layer 310a.

[0144] Please see Figure 8 In some embodiments, before the step of transferring the driver chip 200 to the side of the bonding terminal 110 of the screen 100 opposite to the second straight portion 140 and connecting the driver chip 200 and the bonding terminal 110, the method further includes:

[0145] S40, a connector 400 is formed on the backlight side S2 of the screen body 100, at least a portion of the connector 400 is located on the side of the bonding terminal 110 facing away from the second straight portion 140.

[0146] The steps of transferring the driver chip 200 to the side of the bonding terminal 110 of the screen body 100 away from the second straight portion 140 and connecting the driver chip 200 and the bonding terminal 110 include:

[0147] S21. The driver chip 200 is moved to the side of the connector 400 facing away from the second straight portion 140, so as to connect the driver chip 200 and the bonding terminal 110 through the connector 400.

[0148] In these embodiments, a connector 400 is first formed on the backlight side S2 of the screen 100, such that at least a portion of the connector 400 covers the bonding terminal 110. Then, the driver chip 200 is transferred to the side of the connector 400 away from the second flat portion 140, so as to connect the bonding terminal 110 and the driver chip 200 through the connector 400, which helps to improve the connection reliability between the bonding terminal 110 and the driver chip 200.

[0149] Please see Figure 9 Preferably, the step of transferring the driver chip 200 to the side of the connector 400 facing away from the second straight portion 140 includes:

[0150] S211. Transfer the driver chip 200 to the side of the connector 400 facing away from the second straight section 140.

[0151] S212, Apply pressure to the driver chip 200 so that the bonding terminal 110 and at least a portion of the driver chip 200 are embedded in the connector 400, the bonding terminal 110 is located in the first groove K2 of the connector 400, and at least a portion of the driver chip 200 is located in the second groove K3 of the connector 400.

[0152] In these embodiments, after the driver chip 200 is transferred to the side of the connector 400 opposite to the second straight portion 140, pressure is applied to the driver chip 200, and the force between the driver chip 200 and the bonding terminal 110 causes the connector 400 to deform, so that at least a portion of the driver chip 200 and the bonding terminal 110 can be embedded in the connector 400. The bonding terminal 110 is located in the first groove K2 of the connector 400, and at least a portion of the driver chip 200 is located in the second groove K3 of the connector 400. At this time, the connector 400 can, on the one hand, bond the bonding terminal 110 and at least a portion of the driver chip 200. The driver chip 200 is packaged separately to reduce the risk of moisture and other impurities intruding into the bonding terminal 110 and the driver chip 200. On the other hand, placing the bonding terminal 110 in the first groove K2 and placing at least part of the driver chip 200 in the second groove K3 also helps to increase the contact area between the bonding terminal 110 and the connector 400 and the contact area between the driver chip 200 and the connector 400, thereby improving the reliability of the connection between the bonding terminal 110 and the driver chip 200 through the connector 400. At the same time, it also helps to reduce the impedance between the bonding terminal 110 and the driver chip 200.

[0153] In some alternative embodiments, the connector 400 may be heated and softened before pressure is applied to the driver chip 200 to reduce the difficulty of deformation of the connector 400.

[0154] A third aspect of this application provides a display device, including a display screen according to any of the above-described embodiments or a display screen formed by any of the above-described manufacturing methods. Since this display device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0155] The display device can be any device with display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), as well as non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0156] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0157] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display screen, characterized in that, include: The screen body has a light-emitting side and a backlight side. The screen body includes a binding terminal and a first straight part, a bent part and a second straight part connected in sequence. At least part of the bent part is bent to the backlight side. The second straight part is located on the backlight side. The binding terminal is disposed on the second straight part. A driver chip, which is electrically connected to the bonding terminal, is used to drive the screen to emit light; The encapsulation structure is disposed on the backlight side of the screen body. The encapsulation structure is used to encapsulate the driver chip and at least part of the screen body. The encapsulation structure includes at least one encapsulation layer. The at least one encapsulation layer includes a first part and a second part. The second part is disposed around the first part and forms a receiving groove with the first part. The driver chip and the bonding terminal are located in the receiving groove. One end of the second part away from the first part is connected to the second flat part.

2. The display screen according to claim 1, characterized in that, The encapsulation layer further includes a third portion, which is connected to the second portion and covers the second flat portion. Preferably, the third portion is arranged around the second portion.

3. The display screen according to claim 2, characterized in that, The packaging structure includes a first packaging layer, which is used to encapsulate the driver chip and at least a portion of the screen. The first packaging layer includes a first portion, a second portion, and a third portion. Preferably, the first encapsulation layer includes at least two sub-layers, which are stacked along the thickness direction of the screen body, and at least one of the sub-layers includes the first part, the second part, and the third part; Preferably, the material of the first encapsulation layer includes metal; Preferably, the material of the first encapsulation layer includes an inert metal; Preferably, the material of the first encapsulation layer includes at least one of titanium and aluminum.

4. The display screen according to claim 3, characterized in that, The packaging structure further includes a second packaging layer, which is stacked with the first packaging layer along the thickness direction of the screen body. The second packaging layer is used to encapsulate the driver chip and at least part of the screen body. Preferably, the second encapsulation layer includes the first portion, the second portion, and the third portion; Preferably, at least one of the first encapsulation layer and the second encapsulation layer is configured to conduct heat outward; Preferably, the second encapsulation layer is located on the side of the first encapsulation layer opposite to the second flat portion; Preferably, the thermal conductivity of the second encapsulation layer is greater than that of the first encapsulation layer; Preferably, the material of the second encapsulation layer includes graphene; Preferably, the thickness of the first encapsulation layer is greater than or equal to the thickness of the second encapsulation layer; Preferably, the ratio Z of the thickness of the first encapsulation layer to the thickness of the second encapsulation layer satisfies: 1≤Z≤3.

5. The display screen according to any one of claims 1-4, characterized in that, In a plane perpendicular to the thickness direction of the screen, the orthographic projection of the packaging structure lies within the orthographic projection of the second straight portion; Preferably, at least one encapsulation layer of the encapsulation structure is disposed as a single layer in the second flat portion; Preferably, the display screen further includes a flexible circuit board, which is electrically connected to the screen body and connected to the driver chip through the screen body.

6. The display screen according to any one of claims 1-4, characterized in that, The display screen further includes a connector, at least a portion of which is located between the driver chip and the bonding terminal for connecting the driver chip and the bonding terminal, and the connector is located within the receiving groove; Preferably, the connector comprises anisotropic conductive adhesive; Preferably, the connector has a first groove on the side facing the second straight portion, and the binding terminal is disposed within the first groove; and / or, The connector has a second groove on the side opposite to the second straight portion, and at least a portion of the driver chip is disposed in the second groove; Preferably, the second portion includes a first sub-segment and a second sub-segment, the first sub-segment being connected between the second sub-segment and the first portion, the first sub-segment being disposed around at least a portion of the driver chip, and the second sub-segment being disposed around the connector; Preferably, the connector includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The first surface is located on the side of the connector facing the second flat portion, and the second surface is located on the side of the connector away from the second flat portion. Along the direction from the second surface to the first surface, the side surface is inclined away from the bonding terminal. Preferably, the second segment covers the side surface.

7. A method for manufacturing a display screen, characterized in that, include: Provide a screen and driver chip; The driver chip is moved to the side of the screen body opposite to the second straight part of the bonding terminal, and the driver chip and the bonding terminal are connected. An encapsulation structure is formed on the backlight side of the screen body. The encapsulation structure is used to encapsulate the driver chip and at least a portion of the screen body. The encapsulation structure includes at least one encapsulation layer. The encapsulation layer includes a first portion and a second portion. The second portion is disposed around the first portion and forms a receiving groove with the first portion. The driver chip and the bonding terminal are located in the receiving groove. One end of the second portion away from the first portion is connected to the second flat portion.

8. The preparation method according to claim 7, characterized in that, In the step of forming an encapsulation structure on the backlight side of the screen, the encapsulation layer further includes a third part, which is connected to the second part and covers the second flat portion; Preferably, the step of forming an encapsulation structure on the backlight side of the screen includes: A first encapsulation layer is formed on the backlight side of the screen, the first encapsulation layer comprising the first portion, the second portion and the third portion; Preferably, the step of forming the first encapsulation layer on the backlight side of the screen includes: The first encapsulation layer is formed on the backlight side of the screen using a sputtering process; Preferably, after the step of forming the first encapsulation layer on the backlight side of the screen, the method further includes: A second encapsulation layer is formed on the backlight side of the screen, the second encapsulation layer including the first part, the second part and the third part; Preferably, the step of forming the second encapsulation layer on the backlight side of the screen includes: The second encapsulation layer is formed on the backlight side of the screen using a chemical vapor deposition process.

9. The preparation method according to claim 7, characterized in that, Before the step of transferring the driver chip to the side of the screen body away from the second flat portion of the bonding terminal and connecting the driver chip and the bonding terminal, the method further includes: A connector is formed on the backlight side of the screen, and at least a portion of the connector is located on the side of the bonding terminal facing away from the second flat portion; The step of transferring the driver chip to the side of the screen body away from the second flat portion of the bonding terminal and connecting the driver chip and the bonding terminal includes: The driver chip is moved to the side of the connector opposite to the second flat portion, so as to connect the driver chip and the bonding terminal through the connector; Preferably, the step of transferring the driver chip to the side of the connector opposite to the second flat portion includes: The driver chip is moved to the side of the connector that faces away from the second flat portion; Pressure is applied to the driver chip so that the bonding terminal and at least a portion of the driver chip are embedded in the connector, the bonding terminal being located in a first groove of the connector and at least a portion of the driver chip being located in a second groove of the connector.

10. A display device, characterized in that, This includes the display screen as described in any one of claims 1-6 or the display screen formed by the preparation method of any one of claims 7-9.

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