Display module, preparation method thereof and display device

Abstract

The application discloses a display module, a preparation method thereof and a display device. The preparation method of the display module comprises the following steps: attaching a support film layer to a display panel from a side of the display panel away from a display functional layer, wherein a groove is formed in a side of the support film layer away from the display panel; the non-display area of the display panel comprises a binding area arranged along a second direction, and the normal projection of the groove on the display panel at least partially overlaps the binding area; placing the side of the display panel attached with the support film layer on a binding platform; and binding and connecting a chip of a binding piece to a bonding pad of a bonding pad assembly of the binding area through a bump, wherein the bonding pad assembly comprises a plurality of bonding pads arranged at intervals along a first direction. The application optimizes the appearance of the support film layer by overlapping the groove with the projection of the binding area, reduces the stress concentration of the screen body caused by the deformation of the adhesive layer at high temperature, inhibits the generation of wire cracks in the binding process, and guarantees the stability of the binding process and the yield of the display module.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display module and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display panels and other flat panel display devices using light-emitting diode (LED) devices are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED products needs to be improved. Summary of the Invention

[0004] This application provides a display module and its manufacturing method, as well as a display device, which can provide high support performance for the bonding area and is not prone to deformation at high temperatures during the bonding process, which could lead to cracks on the substrate and breakage of the leads.

[0005] In a first aspect, embodiments of this application provide a method for manufacturing a display module, including:

[0006] A support film layer is attached to the substrate of the display panel on the side away from the display functional layer. A groove is formed on the side of the support film layer away from the substrate. The display panel has a display area and a non-display area surrounding the display area. The non-display area includes a bonding area disposed on one side of the display area along a second direction. The orthographic projection of the groove on the substrate at least partially overlaps with the bonding area.

[0007] The side of the display panel with the support film layer attached is facing the bonding platform and placed on the bonding platform;

[0008] The chip of the bonding component is bonded to the pads of the pad assembly in the bonding area via bumps. The pad assembly and the display functional layer are disposed on the same side of the substrate. The pad assembly includes a plurality of pads spaced apart along a first direction. The bonding component includes a chip and a bonding part connected to the chip. The bonding part includes bumps that are connected to the chip along the chip thickness direction. The first direction intersects with the second direction.

[0009] The method for manufacturing a display module provided in the first aspect of this application involves attaching a support film layer to the side of the substrate of the display panel away from the display functional layer, and forming a groove on the side of the support film layer away from the substrate. The orthographic projection of the groove on the substrate at least partially overlaps with the bonding area of ​​the non-display area. This optimizes the spatial matching relationship between the local morphology of the support film layer and the bonding area, solves the problem of screen deformation and cracking caused by high-temperature deformation of the adhesive layer, and ensures the stability of the bonding process and the yield of the display module.

[0010] According to any embodiment of the first aspect of this application, after the step of bonding the chip of the bonding member to the pad of the pad assembly in the bonding area via bumps, the method further includes:

[0011] Fill the groove with reinforcing material, and the reinforcing material will solidify to form a reinforcing part.

[0012] According to any embodiment of the first aspect of this application, before the step of placing the display panel with the support film layer attached facing the bonding stage and on the bonding stage, the method further includes:

[0013] Fill the groove with reinforcing material, and the reinforcing material will solidify to form a reinforcing part.

[0014] According to any embodiment of the first aspect of this application, the step of filling the groove with reinforcing material further includes:

[0015] Reinforcing material is dripped into the groove using a dispensing process.

[0016] According to any embodiment of the first aspect of this application, the step of placing the side of the display panel with the support film layer attached onto the bonding platform further includes:

[0017] The binding platform includes a protrusion that aligns with and fills a groove.

[0018] According to any embodiment of the first aspect of this application, before the step of attaching the support film layer to the side of the substrate of the display panel away from the display functional layer, the method further includes:

[0019] A groove is created on one side of the supporting membrane layer;

[0020] According to any embodiment of the first aspect of this application, the step of attaching a support film layer to the side of the substrate of the display panel away from the display functional layer further includes:

[0021] A groove is formed on the side of the supporting film layer away from the substrate;

[0022] Secondly, embodiments of this application provide a display module having a display area and a non-display area surrounding the display area. The non-display area includes a bonding area disposed on one side of the display area along a second direction. The display module further includes: a display panel including a substrate and a display functional layer, the substrate including a flexible material, the display functional layer being located on one side of the substrate and in the display area; and a support film layer located on the side of the substrate away from the display functional layer, the support film layer including a groove and a reinforcement portion, the orthographic projection of the groove on the substrate at least partially overlapping the bonding area, and the reinforcement portion at least partially filling the groove.

[0023] According to any embodiment of the second aspect of this application, the reinforcing part includes an organic material;

[0024] According to any embodiment of the second aspect of this application, the reinforcing portion includes epoxy resin;

[0025] According to any embodiment of the second aspect of this application, the reinforcing part includes a mixture of organic materials doped with inorganic material powder;

[0026] According to any embodiment of the second aspect of this application, the reinforcing part includes an epoxy resin mixture doped with ceramic powder;

[0027] According to any embodiment of the second aspect of this application, the reinforcing part includes an epoxy resin mixture doped with metal powder;

[0028] According to any embodiment of the second aspect of this application, the display module further includes a bonding member, which includes a chip and a bonding portion connected to the chip, wherein the orthographic projection of the chip on the substrate is located within the orthographic projection of the groove on the substrate.

[0029] According to any embodiment of the second aspect of this application, the bonding area is located within the orthogonal projection of the groove onto the substrate;

[0030] According to any embodiment of the second aspect of this application, the display module further includes a pad assembly located on one side of the substrate and in the bonding region, the pad assembly including a plurality of pads spaced apart along a first direction;

[0031] According to any embodiment of the second aspect of this application, the bonding portion includes a bump, the bump is connected to the chip along the chip thickness direction, and the bonding member is located in the bonding area and is bonded to the pad through the bump;

[0032] Thirdly, embodiments of this application provide a display device, including the display module provided in any of the embodiments of the second aspect of this application. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic flowchart of a method for manufacturing a display module according to the first aspect of this application;

[0035] Figures 2a to 2c This is a schematic diagram of the process steps of a method for manufacturing a display module provided in the first aspect embodiment of this application;

[0036] Figure 3 This is a schematic flowchart of another method for manufacturing a display module provided in the first aspect of this application;

[0037] Figures 4a to 4b This is a schematic diagram of the process steps of another method for manufacturing a display module provided in the first aspect embodiment of this application;

[0038] Figure 5 This is a schematic flowchart of another method for manufacturing a display module provided in the first aspect of this application;

[0039] Figures 6a to 6b This is a schematic diagram of the process steps of another method for manufacturing a display module provided in the first aspect embodiment of this application;

[0040] Figure 7 This is a schematic flowchart of another method for manufacturing a display module provided in the first aspect of this application;

[0041] Figure 8 This is a schematic diagram of the process steps of another method for manufacturing a display module provided in the first aspect embodiment of this application;

[0042] Figure 9 This is a schematic flowchart of another method for manufacturing a display module provided in the first aspect of this application;

[0043] Figures 10a to 10b This is a schematic diagram of the process steps of another method for manufacturing a display module provided in the first aspect embodiment of this application;

[0044] Figure 11 This is a schematic flowchart of another method for manufacturing a display module provided in the first aspect of this application;

[0045] Figures 12a to 12b This is a schematic diagram of the process steps of another method for manufacturing a display module provided in the first aspect embodiment of this application;

[0046] Figure 13 This is a schematic diagram of the overall structure of a display module provided in the second aspect embodiment of this application;

[0047] Figure 14 yes Figure 13 A schematic diagram of the cross-sectional structure along the AA direction.

[0048] Marker explanation:

[0049] 200 - Display Module;

[0050] 100 - Display panel; 110 - Display function layer;

[0051] AA - Display area; NA - Non-display area; BA - Binding area;

[0052] 10-Substrate; 11-Pad assembly; 111-Pad;

[0053] 20 - Supporting membrane layer; 21 - Groove;

[0054] 30 - Bonding component; 31 - Chip; 32 - Bonding part; 321 - Bump;

[0055] 40 - Reinforcing section; 40' - Reinforcing material;

[0056] 50 - Binding platform; 51 - Protrusion;

[0057] X - First direction; Y - Second direction. Detailed Implementation

[0058] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0059] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0060] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations of the invention that fall within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0061] Among related technologies, with the rapid development of flexible display technology, flexible display modules such as organic light-emitting diodes (OLEDs) are increasingly widely used in the consumer electronics field.

[0062] However, in the manufacturing process of display modules, the reliability of the chip-on-pi (COP) bonding process has become a key factor restricting product yield.

[0063] In traditional processes, the backing protective film (BPF) of flexible display modules is usually bonded to the substrate of the display panel using an adhesive layer. Its core function is to provide mechanical support for the display panel and disperse external stress.

[0064] However, during the high-temperature bonding process, the adhesive layer of BPF will soften significantly and increase its fluidity due to the mismatch of thermal expansion coefficients and the decrease in modulus, resulting in uneven distribution of adhesive layer thickness in local areas.

[0065] Especially with the continuous shrinking of integrated circuit (IC) dimensions, the bonding pressure per unit area has further increased, making the deformation problem of the adhesive layer at high temperatures more prominent.

[0066] This deformation is directly transmitted to the screen of the display panel, causing local warping or denting of the screen near the bonding area, which in turn leads to microcracks in the metal traces due to stress concentration.

[0067] Such cracks can not only cause abnormal signal transmission in the display functional layer, such as poor display phenomena like bright lines and dark lines, but also reduce the mechanical reliability of the module and shorten the product's service life.

[0068] On the one hand, the BPF adhesive layer needs to have a certain degree of flexibility to adapt to the bending requirements of the display module. However, the glass transition temperature of the material itself is low. Under the high temperature environment required for the bonding process, the elastic modulus of the adhesive layer drops sharply and the fluidity increases significantly, resulting in a significant weakening of its support capacity for the screen.

[0069] On the other hand, as the demand for high-resolution displays drives IC chips toward miniaturization and high density, the layout of bonding components in the bonding area becomes more compact, and the alignment accuracy requirements between the chip and the pad also increase accordingly.

[0070] However, in the existing technology, the BPF adhesive layer is not structurally optimized for the stress characteristics of the bonding area, which causes the adhesive layer to flow outwards under pressure at high temperatures, and cannot effectively constrain the contact stress between the bonding component and the screen.

[0071] This uneven stress distribution will further exacerbate the deformation of the screen, causing misalignment or poor contact between the chip bumps and the pads during the bonding process.

[0072] Furthermore, since the display functional layer and the pad assembly are both located on the same side of the substrate, the pressure applied during the bonding process will directly act on the weak areas of the BPF adhesive layer through the substrate, forming local stress concentration points, which will eventually trigger a chain reaction of trace cracks.

[0073] To complicate matters further, the structural design of the support film in traditional processes fails to coordinate with the spatial distribution of the bonding area. For example, the bonding area is typically located in the non-display area on one side of the display area along the second direction, and the BPF adhesive layer is not grooved or otherwise shaped during die-cutting.

[0074] This allows the adhesive layer to maintain its full thickness within the projection area of ​​the bonding region, making this area the core source of deformation at high temperatures. Simultaneously, the contact interface between the bonding stage and the support film experiences microscopic slippage due to the softening of the adhesive layer, leading to uncontrollable localized displacement of the screen during the bonding process.

[0075] In view of the need to solve the above-mentioned technical problems and technical requirements, this application provides a display panel, a method for manufacturing the same, and a display device.

[0076] The following is combined with Figures 1 to 14The present application provides a detailed description of the display panel, its manufacturing method, and the display device provided in the embodiments.

[0077] Figure 1 The diagram shows a flow chart of a method for manufacturing a display module according to an embodiment of the first aspect of this application. Figures 2a to 2c A schematic flowchart of a method for manufacturing a display module according to an embodiment of the first aspect of this application is shown.

[0078] Figure 1 The diagram shows a flow chart of a method for manufacturing a display module 200 according to an embodiment of the first aspect of this application. Figures 2a to 2c A schematic flowchart of a method for preparing a display module 200 according to an embodiment of the first aspect of this application is shown.

[0079] Please see Figure 1 and Figures 2a to 2c In a first aspect, embodiments of this application provide a method for manufacturing a display module 200, comprising:

[0080] Step S10: A support film layer 20 is attached to the side of the substrate 10 of the display panel 100 away from the display functional layer 110. The support film layer 20 has a groove 21 on the side away from the substrate 10. The display panel 100 has a display area AA and a non-display area NA surrounding the display area AA. The non-display area NA includes a bonding area BA disposed on the side of the display area AA along the second direction Y. The orthographic projection of the groove 21 on the substrate 10 at least partially overlaps with the bonding area BA.

[0081] Step S20: Place the display panel 100 with the support film layer 20 attached facing the bonding stage 50 and place it on the bonding stage 50;

[0082] Step S30: The chip 31 of the bonding member 30 is bonded to the pad 111 of the pad assembly 11 in the bonding area BA via bumps 321. The pad assembly 11 and the display functional layer 110 are disposed on the same side of the substrate 10. The pad assembly 11 includes a plurality of pads 111 spaced apart along the first direction X. The bonding member 30 includes a bonding part 32 connecting the chip 31 to the chip 31. The bonding part 32 includes bumps 321. The bumps 321 are connected to the chip 31 along the thickness direction of the chip 31. The first direction X intersects with the second direction Y.

[0083] The method for fabricating the display module 200 provided in the first aspect of this application involves attaching a support film layer 20 to the side of the substrate 10 of the display panel 100 away from the display functional layer 110, and forming a groove 21 on the side of the support film layer 20 away from the substrate 10. The orthographic projection of the groove 21 on the substrate 10 at least partially overlaps with the bonding area BA of the non-display area NA. This optimizes the spatial matching relationship between the local morphology of the support film layer 20 and the bonding area BA, solves the problem of screen deformation and cracking caused by high temperature deformation of the adhesive layer, and ensures the stability of the bonding process and the yield of the display module 200.

[0084] The first aspect of the embodiments of this application has at least the following beneficial effects:

[0085] First, the groove 21 design directly reduces the thickness of the adhesive layer 20 corresponding to the bonding area BA, thereby reducing the risk of local deformation caused by increased adhesive layer fluidity at high temperatures.

[0086] Secondly, after the side of the display panel 100 attached to the support film layer 20 faces the bonding platform 50, the support film layer 20 corresponding to the groove 21 area forms a local rigid support when it comes into contact with the bonding platform 50, which avoids uneven force on the screen body caused by the softening of the adhesive layer, thereby suppressing the wiring cracks caused by pressure concentration during the bonding process.

[0087] Furthermore, when the chip 31 of the bonding member 30 is bonded to the pad assembly 11 of the bonding area BA via the bump 321, the groove 21 and the pad assembly 11 are arranged at intervals along the first direction X in a coordinated manner, which further disperses the stress distribution during the bonding process and improves the alignment accuracy and connection reliability of the chip 31 and the pad 111.

[0088] In step S10, when the support film layer 20 is attached to the side of the substrate 10 of the display panel 100 away from the display functional layer 110, the groove 21 opened on the side of the support film layer 20 away from the substrate 10 has a spatial layout that precisely matches the non-display area NA bonding area BA of the display panel 100.

[0089] The display area AA of the display panel 100 is the core area for the function display, and the non-display area NA is arranged around the display area AA. The bonding area BA is located on the side of the display area AA along the second direction Y. The design of the groove 21 on the substrate 10 at least partially overlapping with the bonding area BA makes the adhesive layer thickness of the support film layer 20 in the bonding area BA locally thinned.

[0090] The direct effect of this groove 21 morphology is to reduce the risk of increased fluidity caused by the decrease in modulus of the adhesive layer during high-temperature bonding by physically removing the adhesive layer material corresponding to the bonding area BA, thereby reducing the transmission of adhesive layer deformation to the screen structure.

[0091] In step S20, when the side of the display panel 100 attached to the support film layer 20 is placed facing the binding platform 50, the contact interface between the support film layer 20 and the binding platform 50 corresponding to the groove 21 area forms a local rigid support area.

[0092] Because the adhesive layer inside the groove 21 is removed beforehand, this area will not undergo fluid deformation due to softening of the adhesive layer at high temperatures, thus avoiding uneven stress on the screen caused by local collapse or expansion of the supporting film layer 20. This structural feature allows the pressure of the bonding platform 50 on the screen to be evenly transmitted to the ungrooved area at the edge of the groove 21, effectively dispersing pressure concentration points and suppressing the risk of cracks in the metal traces due to excessive local stress.

[0093] In step S30, when the chip 31 of the bonding member 30 is bonded to the pad 111 of the pad assembly 11 in the bonding area BA through the bump 321, the layout of the pad assembly 11 arranged at intervals along the first direction X and the spatial position of the groove 21 work together.

[0094] The pad assembly 11 and the display functional layer 110 are both disposed on the same side of the substrate 10. The bonding member 30 includes a chip 31 and a bonding part 32 connected to the chip 31. The design of the bump 321 connecting to the chip 31 along the thickness direction of the chip 31 ensures the vertical transmission of force during the bonding process.

[0095] The first direction X and the second direction Y in the display module 200 provided in the first aspect embodiment of this application can be any direction, as long as the first direction X and the second direction Y intersect.

[0096] For example, the first direction X and the second direction Y are perpendicular to each other, so that the overlapping area of ​​the projection of the groove 21 can cover part or all of the extension range of the pad assembly 11. This spatial matching relationship further disperses the lateral stress when the chip 31 bump 321 contacts the pad 111 during the bonding process. At the same time, the rigid support at the position of the groove 21 reduces the screen displacement caused by the deformation of the adhesive layer, thereby improving the alignment accuracy between the chip 31 and the pad 111.

[0097] For example, when bonding pressure is applied, the colloid of the support film layer 20 without grooves at the edge of the groove 21 can provide a stable lateral restraint force to prevent the screen from shifting in the second direction Y, while the spacing of the pads 111 in the first direction X reduces the stress peak borne by a single pad 111 by increasing the contact point density.

[0098] Figure 3 The diagram shows a flow chart of another method for manufacturing a display module 200 according to an embodiment of the first aspect of this application. Figures 4a to 4b The process steps of another method for manufacturing a display module 200 provided in the first aspect embodiment of this application are shown.

[0099] Please see Figure 3 and Figures 4a to 4b In some embodiments, step S30 is followed by:

[0100] Step S40: Fill the groove 21 with reinforcing material 40'. After the reinforcing material 40' is cured, it forms the reinforcing part 40.

[0101] In these embodiments, the mechanical properties of the bonding region BA are further optimized by filling the groove 21 of the support film layer 20 with reinforcing material 40' and curing it to form a reinforcing portion 40. After curing, the reinforcing material 40' forms a high-modulus reinforcing portion 40.

[0102] First, after the reinforcing part 40 fills the groove 21, it restores the local structural continuity of the supporting film layer 20. At the same time, due to its material properties, it has stable modulus at high temperature and strong resistance to deformation, which can effectively offset the stress relaxation caused by the softening of the adhesive layer during the bonding process.

[0103] When the binding platform 50 comes into contact with the reinforcing part 40, a more rigid support interface is formed in this area, avoiding the risk of local collapse caused by the cavity of the groove 21 and ensuring that the screen body is evenly distributed.

[0104] Secondly, the reinforcing part 40 and the support film layer 20 colloid in the ungrooved area form a gradient modulus transition. Under the action of high temperature and pressure, the high modulus characteristics of the reinforcing part 40 can constrain the lateral flow of the colloid layer and reduce the displacement deviation of the screen in the second direction Y, thereby improving the alignment accuracy of the chip 31 bump 321 and the pad 111 arranged at intervals along the first direction X.

[0105] In addition, after the reinforcement 40 is cured, it is tightly bonded to the substrate 10 and the support film layer 20. The filler inside it can enhance the stress dispersion ability, reduce the risk of interface peeling caused by the difference in thermal expansion coefficient in the bonding area BA, and further suppress crack propagation.

[0106] Figure 5 The diagram shows a flow chart of another method for manufacturing a display module 200 according to an embodiment of the first aspect of this application. Figures 6a to 6b The process steps of another method for manufacturing a display module 200 provided in the first aspect embodiment of this application are shown.

[0107] Please see Figure 5 and Figures 6a to 6b In some optional embodiments, step S20 is further included before:

[0108] Step S40: Fill the groove 21 with reinforcing material 40'. After the reinforcing material 40' is cured, it forms the reinforcing part 40.

[0109] In these optional embodiments, step S40 is performed before step S20, in which reinforcing material 40' is filled into the groove 21 and cured to form a reinforcing part 40. The core is to optimize the initial contact state between the binding platform 50 and the screen by constructing a rigid support interface in advance.

[0110] The reinforcing part 40, formed by the curing of the reinforcing material 40' in the groove 21, completes structural reinforcement before the support film layer 20 is attached to the binding platform 50.

[0111] Compared to the embodiment where filling occurs after step S30, the reinforcing part 40 here already has a complete support function when the binding platform 50 is placed.

[0112] On the one hand, the high modulus of the reinforcing part 40 offsets the potential deformation risk in the groove 21 area before bonding, ensuring that the contact surface between the supporting membrane layer 20 and the bonding platform 50 is uniformly rigid, and avoiding local collapse caused by the cavity of the groove 21.

[0113] On the other hand, after the reinforcing part 40 is cured, it forms a continuous and gradient mechanical interface with the adhesive layer in the ungrooved area of ​​the supporting film layer 20. Its high cross-linking density can effectively constrain the lateral flow of the adhesive layer during the high-temperature bonding process and prevent the screen from shifting in the second direction Y.

[0114] In addition, the filler in the reinforcing part 40 reduces the difference in the coefficient of thermal expansion between the supporting film layer 20 and the substrate 10 by enhancing the thermal stability of the material, thereby reducing the risk of interface peeling when bonding pressure is applied.

[0115] This design, through step 40 of pre-filling reinforcing material 40', enables the bonding stage 50 to directly contact the reinforcing part 40, further dispersing the stress concentration of the spacing of the pads 111 in the first direction X, while ensuring that the alignment accuracy of the chip 31 bump 321 and the pads 111 is locked in the initial contact stage, avoiding the accumulation of errors in subsequent processes.

[0116] In some alternative embodiments, a dispensing process is used to drip reinforcing material 40' into the groove 21.

[0117] In these alternative embodiments, the injection amount and distribution of the reinforcing material 40' are precisely controlled by the dispensing process, which significantly improves the uniformity of the groove filling and the structural integrity.

[0118] For example, the dispensing process injects the reinforcing material 40' point by point along the contour of the groove 21 through a high-precision nozzle, ensuring that the reinforcing material 40' fully wets the bottom and sidewalls of the groove 21, avoiding voids or unfilled areas caused by insufficient material flow.

[0119] After the reinforcing material 40' is cured, the reinforcing part 40 formed is tightly bonded to the adhesive layer in the ungrooved area of ​​the supporting film layer 20. The uniformly dispersed filler inside enhances the compressive modulus of the reinforcing part 40 through physical cross-linking. At the same time, the high filler content reduces the thermal expansion coefficient of the material, making it consistent with the thermal deformation trend of the supporting film layer 20 and the substrate 10.

[0120] When pressure is applied to the bonding stage 50, the high modulus of the reinforcing part 40 can effectively suppress the lateral creep of the adhesive layer at the edge of the groove 21 and reduce the displacement deviation of the screen in the second direction Y, thereby ensuring that the chip 31 bump 321 is precisely aligned with the pads 111 arranged at intervals along the first direction X.

[0121] In addition, the localized and precise filling characteristics of the dispensing process prevent the reinforcing material 40' from overflowing into non-target areas, thus maintaining the overall flexibility of the support film layer 20 and achieving mechanical balance through the localized rigidification of the reinforcing part 40 in the groove 21.

[0122] Figure 7 The diagram shows a flow chart of another method for manufacturing a display module 200 according to an embodiment of the first aspect of this application. Figure 8 The process steps of another method for manufacturing a display module 200 provided in the first aspect embodiment of this application are shown.

[0123] Please see Figure 7 and Figure 8 In some embodiments, step S20 further includes:

[0124] Step S21: The binding platform 50 includes a protrusion 51, which is aligned with and fills the groove 21.

[0125] In these embodiments, by designing the binding platform 50 to include a protrusion 51 that aligns with and fills the groove 21, the synergistic optimization of mechanical support and stress distribution during the binding process is achieved.

[0126] The shape and size of the protrusion 51 are strictly matched with the groove 21 of the support film layer 20. When the display panel 100 is placed on the bonding platform 50 with the side of the support film layer 20 attached to it, the protrusion 51 is embedded in the groove 21 and forms a physical fit with it.

[0127] First, after the protrusion 51 fills the groove 21, it directly replaces the adhesive layer support function of the original groove 21 area. The high modulus characteristics of the protrusion 51 can provide rigid support during the high-temperature bonding process, avoiding local collapse or deformation caused by the softening of the adhesive layer.

[0128] Secondly, the tight fit between the protrusion 51 and the groove 21 forms a uniform contact interface between the binding platform 50 and the screen body, so that the binding pressure is evenly distributed along the ungrooved area of ​​the edge of the groove 21, reducing the risk of screen body warping caused by pressure concentration.

[0129] Furthermore, after the protrusion 51 is embedded in the groove 21, the contact between its sidewall and the inner wall of the groove 21 can restrict the lateral flow of the adhesive layer of the support film layer 20 in the second direction Y, thereby suppressing the displacement deviation of the screen body during the bonding process and ensuring that the chip 31 bump 321 is precisely aligned with the pads 111 arranged at intervals along the first direction X.

[0130] Figure 9 The diagram shows a flow chart of another method for manufacturing a display module 200 according to an embodiment of the first aspect of this application. Figures 10a to 10b The process steps of another method for manufacturing a display module 200 provided in the first aspect embodiment of this application are shown.

[0131] Please see Figure 9 and Figures 10a to 10b In some embodiments, step S10 is further included before:

[0132] Step S50: A groove 21 is formed on one side of the support film layer 20;

[0133] In these embodiments, by pre-forming grooves 21 before attaching the support film layer 20 to the substrate 10, high-precision control of the groove morphology and optimization of process compatibility are achieved.

[0134] The support film layer 20 is processed with grooves 21 separately before it is bonded to the substrate 10, which can avoid processing errors caused by the flexible characteristics of the substrate 10 material after bonding.

[0135] The size, position and depth of the groove 21 can be strictly calibrated during the independent processing stage to ensure the matching accuracy of its projection with the subsequent bonding area BA.

[0136] First, when the support film layer 20 independently processes the groove 21, its flatness is not affected by the bonding stress of the substrate 10, and the geometric accuracy of the edge of the groove 21 is significantly improved, thereby reducing the interface gap when the subsequent reinforcing material 40' is filled or the protrusion 51 is fitted.

[0137] Secondly, pre-cutting the groove 21 can avoid mechanical damage to the display function layer 110 or the pad assembly 11 that may be caused by post-attachment processing.

[0138] When the support film layer 20 is attached to the substrate 10 in step S10, the groove 21 has been pre-positioned. The accuracy of the overlap between its projection and the bonding area BA is directly related to the uniformity of the pressure distribution on the subsequent bonding stage 50.

[0139] For example, during the high-temperature bonding process, the precisely thinned area of ​​the groove 21 can completely cover the extension range of the pad assembly 11, so that the support film layer 20 transmits stress only through the ungrooved area under bonding pressure, while the rigid cavity formed in the groove 21 due to the lack of adhesive layer can effectively block the lateral flow of adhesive layer and suppress the displacement of the screen in the second direction Y.

[0140] In addition, the process design of independently processed groove 21 simplifies the complexity of multi-step coordination. For example, the pre-processing of groove 21 can be completed during the mass production stage of the support film layer 20, thereby improving the overall preparation efficiency.

[0141] Figure 11 The diagram shows a flow chart of another method for manufacturing a display module 200 according to an embodiment of the first aspect of this application. Figures 12a to 12b The process steps of another method for manufacturing a display module 200 provided in the first aspect embodiment of this application are shown.

[0142] Please see Figure 11 and Figures 12a to 12b In some optional embodiments, step S10 further includes:

[0143] Step S50: A groove 21 is formed on the side of the support film layer 20 away from the substrate 10;

[0144] In these optional embodiments, the implementation of step S50 is performed synchronously in step S10, thereby improving processing efficiency and morphological accuracy through the process steps of integrating the groove 21 for processing and attaching the support film layer 20.

[0145] The creation of the groove 21 is carried out in conjunction with the process of attaching the support film layer 20 to the substrate 10. The key function is that the support film layer 20 is processed with the groove 21 while it is attached to the substrate 10. The rigid support of the substrate 10 can be used to avoid the positional deviation of the groove 21 caused by the deformation of the film layer during separate processing, and ensure the overlap accuracy of the orthographic projection of the groove 21 on the substrate 10 and the bonding area BA.

[0146] Secondly, the synchronous process reduces the risk of alignment errors caused by independent processing steps. For example, after attachment, no secondary positioning is required to directly ensure the spatial matching between the groove 21 and the bonding area BA. After the groove 21 is formed, the transition between its edge and the ungrooved area of ​​the support film layer 20 is smoother, reducing the interface stress concentration when the reinforcing material 40' fills or the protrusion 51 fits.

[0147] Furthermore, during the high-temperature bonding process, the rigid cavity formed by the thinning of the adhesive layer in the groove 21 region can effectively block the lateral flow of the adhesive layer in the second direction Y. Meanwhile, the tight fit between the support film layer 20 and the substrate 10 during synchronous processing further suppresses the influence of processing thermal stress on the display functional layer 110.

[0148] For example, when the bonding stage 50 applies pressure, the precise positioning of the groove 21 allows the adhesive layer in the ungrooved area to uniformly bear the vertical pressure. At the same time, the local rigid interface formed in the groove 21 constrains the high-temperature creep of the adhesive layer, thereby reducing the screen displacement and improving the alignment accuracy between the chip 31 bump 321 and the pads arranged at intervals along the first direction X.

[0149] Figure 13 This illustration shows the overall structure of a display module 200 provided in a second aspect embodiment of this application. Figure 14 It shows Figure 13 Cross-sectional structure along the AA direction.

[0150] Please see Figures 13 to 14 Secondly, embodiments of this application provide a display module 200, which has a display area AA and a non-display area NA surrounding the display area AA. The non-display area NA includes a binding area BA disposed on one side of the display area AA along the second direction Y. The display module 200 also includes a display panel 100 and a support film layer 20.

[0151] The display panel 100 includes a substrate 10 and a display functional layer 110. The substrate 10 includes a flexible material, and the display functional layer 110 is located on one side of the substrate 10 and in the display area AA.

[0152] The support film layer 20 is located on the side of the substrate 10 away from the display functional layer 110. The support film layer 20 includes a groove 21 and a reinforcing portion 40. The orthographic projection of the groove 21 on the substrate 10 at least partially overlaps with the bonding region BA, and the reinforcing portion 40 at least partially fills the groove 21.

[0153] The display module 200 provided in the second aspect embodiment of this application effectively suppresses stress concentration and high-temperature deformation in the bonding area BA through the structural collaborative design of the display panel 100 and the support film layer 20.

[0154] The display module 200 has a display area AA and a non-display area NA surrounding the display area AA, wherein the non-display area NA includes a bonding area BA disposed along one side of the second direction Y, and the display panel 100 includes a substrate 10 made of flexible material and a display functional layer 110 located on one side of the substrate 10 and distributed in the display area AA.

[0155] The support film layer 20 is disposed on the side of the substrate 10 away from the display functional layer 110. The key feature is that the support film layer 20 includes a groove 21 and a reinforcing portion 40 that is at least partially filled in the groove 21, and the orthographic projection of the groove 21 on the substrate 10 at least partially overlaps with the bonding region BA.

[0156] The design of the groove 21 and the reinforcement part 40 solves the problems of screen deformation and wiring cracks caused by the high temperature softening of the adhesive layer in the traditional support film layer 20 through the dual optimization of spatial morphology and material properties.

[0157] The groove 21 directly reduces the thickness of the adhesive layer 20 at the corresponding position in the bonding area BA, thereby reducing the risk of increased flowability caused by the decrease in modulus of the adhesive layer during high-temperature bonding.

[0158] When the bonding pressure is applied to the display module 200, the local rigid interface formed by the thinning of the adhesive layer in the groove 21 area can evenly disperse the vertical pressure, preventing the deformation of the adhesive layer from being transmitted to the substrate 10 and the display functional layer 110, thereby suppressing local warping or depression of the screen.

[0159] The reinforcing part 40 at least partially fills the groove 21, and its material properties form a rigid support layer after curing, further enhancing the compressive stability of the groove 21 area.

[0160] The reinforcing part 40 and the adhesive layer in the ungrooved area of ​​the support film layer 20 form a gradient modulus transition through interfacial bonding. During the high-temperature bonding process, the high cross-linking density of the reinforcing part 40 can constrain the lateral flow of the adhesive layer and reduce the displacement deviation of the screen in the second direction Y, thereby ensuring that the chip 31 bump 321 of the bonding member 30 is precisely aligned with the pads 111 arranged at intervals along the first direction X in the bonding area BA.

[0161] Furthermore, the overlapping design of the orthographic projection of the groove 21 on the substrate 10 and the bonding area BA ensures that the deformation suppression range of the support film layer 20 precisely covers the extended area of ​​the pad assembly 11, while the filling of the reinforcement portion 40 reduces the risk of interface peeling in the bonding area BA due to the difference in thermal expansion coefficients through the stress dispersion effect of the internal filler.

[0162] In some embodiments, the reinforcing portion 40 comprises an organic material.

[0163] In these embodiments, the organic materials exhibit a small change in modulus due to temperature and are not easily deformed.

[0164] In some alternative embodiments, the reinforcing portion 40 comprises epoxy resin.

[0165] In some alternative embodiments, the reinforcing portion 40 comprises a mixture of organic materials doped with inorganic material powder;

[0166] In these alternative embodiments, inorganic material powder is further doped into the organic material to further reduce the influence of temperature changes on modulus changes, making the reinforcing part 40 less prone to deformation.

[0167] In some alternative embodiments, the reinforcing portion 40 comprises an epoxy resin mixture doped with ceramic powder.

[0168] In some alternative embodiments, the reinforcing portion 40 comprises an epoxy resin mixture doped with metal powder.

[0169] Please continue reading. Figures 13 to 14 In some embodiments, the display module 200 further includes a bonding member 30, which includes a chip 31 and a bonding portion 32 connected to the chip 31. The orthographic projection of the chip 31 on the substrate 10 is located within the orthographic projection of the groove 21 on the substrate 10.

[0170] In these embodiments, the orthographic projection of the chip 31 on the substrate 10 is completely within the orthographic projection range of the groove 21, and the mechanical properties of the bonding region BA and the depth of the force on the chip 31 are achieved through precise positioning.

[0171] The groove 21 covers the projection area of ​​the chip 31, which locally reduces or even completely removes the thickness of the adhesive layer corresponding to the support film layer 20 below the chip 31. The high-modulus support layer formed by the reinforcement part 40 filling the groove 21 directly acts on the pressure transmission path when the chip 31 is bonded.

[0172] When the bonding pressure is applied to the pad assembly 11 through the chip 31 bump 321, the rigid support of the reinforcement part 40 can effectively offset the stress relaxation caused by the softening of the adhesive layer at high temperature, and avoid local deformation of the screen caused by the collapse of the support film layer 20 under the chip 31.

[0173] Meanwhile, the complete overlap between the chip 31 projection and the groove 21 ensures that the bonding pressure is evenly distributed in the ungrooved area around the reinforcement 40, reducing the risk of poor contact or interface peeling between the pad 111 and the bump 321 due to pressure concentration.

[0174] In addition, the filler inside the reinforcing part 40 reduces the thermal stress difference between the substrate 10 and the supporting film layer 20 by enhancing the thermal expansion matching of the material, thereby suppressing the propagation of trace cracks caused by the accumulation of thermal deformation.

[0175] Please continue reading. Figures 13 to 14 In some alternative embodiments, the bonding region BA is located within the orthographic projection of the groove 21 onto the substrate 10.

[0176] In these alternative embodiments, the binding region BA is further positioned within the groove 21, such that the area where the mechanical strength is increased by setting the groove 21 fully covers the binding region BA, further ensuring full coverage of the improvement effect.

[0177] Please continue reading. Figures 13 to 14In some embodiments, the display module 200 further includes a pad assembly 11 located on one side of the substrate 10 and in the bonding region BA. The pad assembly 11 includes a plurality of pads 111 spaced apart along a first direction X.

[0178] In these embodiments, the pads 111 in the pad assembly 11 are uniformly distributed within the bonding region BA to form the pad assembly 11, which further helps to improve the stress concentration problem within the bonding region BA.

[0179] Please continue reading. Figures 13 to 14 In some embodiments, the bonding portion 32 includes a bump 321, which is connected to the chip 31 along the thickness direction of the chip 31. The bonding member 30 is located in the bonding area BA and is bonded to the pad 111 through the bump 321.

[0180] In these embodiments, the bonding part 32 serves as a connection component for the chip 31 within the bonding member 30. The bump 321 of the bonding part 32 is bonded to the pad 111, thereby achieving mutual connection between the chip 31, the pad 111, and the array lines within the display panel 100. The bump 321 is connected to the chip 31 along the thickness direction of the chip 31, which can further reduce the bonding area BA.

[0181] Thirdly, embodiments of this application provide a display device, including the display panel provided in any of the embodiments of the second aspect of this application.

[0182] The display device provided in the third aspect of this application includes the display panel provided in any of the second aspect embodiments described above. Therefore, the display device provided in the third aspect of this application has the beneficial effects of the display panel provided in any of the second aspect embodiments, which will not be repeated here.

[0183] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0184] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0185] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A method for manufacturing a display module, characterized by, include: A support film layer is attached to the side of the substrate of the display panel away from the display functional layer. The support film layer has a groove on the side away from the substrate. The display panel has a display area and a non-display area surrounding the display area. The non-display area includes a bonding area disposed on one side of the display area along a second direction. The orthographic projection of the groove on the substrate at least partially overlaps with the bonding area. The display panel with the supporting film layer attached is placed on the bonding platform with the side facing the platform. The chip of the bonding member is bonded to the pads of the pad assembly in the bonding area via bumps. The pad assembly and the display functional layer are disposed on the same side of the substrate. The pad assembly includes a plurality of pads spaced apart along a first direction. The bonding member includes the chip and a bonding portion connected to the chip. The bonding portion includes the bumps. The bumps are connected to the chip along the chip thickness direction. The first direction intersects with the second direction.

2. The method of claim 1, wherein the display module is prepared by the steps of: The step of bonding the chip of the bonding component to the pads of the pad assembly in the bonding area via bumps further includes: ​ The groove is filled with reinforcing material, which solidifies to form a reinforcing part. Preferably, the step of placing the display panel with the side having the support film layer attached facing the bonding platform and placing it on the bonding platform further includes: The groove is filled with reinforcing material, which solidifies to form a reinforcing part. Preferably, the step of filling the groove with reinforcing material further includes: The reinforcing material is dripped into the groove using a dispensing process.

3. The method for preparing a display module according to claim 1, characterized in that, The step of placing the side of the display panel with the support film layer attached onto the bonding platform also includes: The binding platform includes a protrusion that aligns with and fills the groove.

4. The method for preparing a display module according to claim 1, characterized in that, The step of attaching the support film layer to the substrate of the display panel on the side opposite to the display functional layer also includes: The groove is formed on one side of the supporting membrane layer; Preferably, the step of attaching a support film layer to the side of the substrate of the display panel opposite to the display functional layer further includes: The groove is formed on the side of the support film layer away from the substrate.

5. A display module, characterized in that, The display module has a display area and a non-display area surrounding the display area, the non-display area including a binding area disposed on one side of the display area along a second direction, and the display module further includes: A display panel includes a substrate and a display functional layer, wherein the substrate comprises a flexible material and the display functional layer is located on one side of the substrate and in the display area; A support film layer is located on the side of the substrate opposite to the display functional layer. The support film layer includes a groove and a reinforcing portion. The orthographic projection of the groove on the substrate at least partially overlaps with the bonding region, and the reinforcing portion at least partially fills the groove.

6. The display module according to claim 5, characterized in that, The reinforcing part includes organic materials; Preferably, the reinforcing portion comprises epoxy resin; Preferably, the reinforcing part comprises an organic material mixture doped with inorganic material powder; Preferably, the reinforcing part comprises an epoxy resin mixture doped with ceramic powder; Preferably, the reinforcing part comprises an epoxy resin mixture doped with metal powder.

7. The display module according to claim 5, characterized in that, The display module further includes a bonding component, which includes a chip and a bonding portion connected to the chip, wherein the orthographic projection of the chip on the substrate is located within the orthographic projection of the groove on the substrate; Preferably, the bonding area is located within the orthographic projection of the groove onto the substrate.

8. The display module according to claim 7, characterized in that, The display module further includes a pad assembly located on one side of the substrate and in the bonding area, the pad assembly including a plurality of pads spaced apart along the first direction.

9. The display module according to claim 8, characterized in that, The bonding portion includes a bump that is connected to the chip along the chip thickness direction. The bonding member is located in the bonding area and is bonded to the pad through the bump.

10. A display device, characterized in that, The display module includes any one of claims 5 to 9.

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