Display panel and electronic device

Abstract

The application provides a display panel and an electronic device, the display panel comprising a light-emitting substrate and an encapsulation structure; the light-emitting substrate comprising a substrate and a plurality of light-emitting devices, the substrate having a first surface and a second surface opposite to each other, and the plurality of light-emitting devices being arranged on the first surface; the encapsulation structure comprising a first encapsulation layer and a second encapsulation layer, the first encapsulation layer covering a side of the light-emitting substrate to be encapsulated, the first encapsulation layer being made of inorganic material, and the second encapsulation layer being made of organic material and inorganic particles, the organic material being in a porous structure, the organic material covering a side of the first encapsulation layer away from the light-emitting substrate, and the inorganic particles being filled in at least part of the pores of the organic material, the inorganic particles being capable of blocking the voids in the organic material to prevent external gas from penetrating through the second encapsulation layer. The display panel effectively prevents harmful substances such as water and oxygen from entering the light-emitting substrate, and improves the bending or rolling performance of the display panel.

Description

Technical Field

[0001] This invention belongs to the field of display panel technology, and particularly relates to a display panel and an electronic device. Background Technology

[0002] Bending and deforming display panels is a current and future trend in display technology. However, current OLEDs typically encapsulate the light-emitting device with a polytetrafluoroethylene (Thin Film Encapsulation, TFE) encapsulation layer. This encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer stacked sequentially. The first inorganic layer and the second inorganic layer are both rigid layers, making it difficult to achieve bending and deformation. Summary of the Invention

[0003] The purpose of this invention is to provide a display panel and electronic device that solves the technical problem that current encapsulation layers cannot achieve bending and deformation.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] In a first aspect, a display panel is provided, including a light-emitting substrate and a packaging structure;

[0006] The light-emitting substrate includes a substrate and a plurality of light-emitting devices. The substrate has a first side and a second side facing away from each other. The plurality of light-emitting devices are disposed on the first side and are spaced apart from each other. The side of the light-emitting substrate on which the light-emitting devices are disposed is the side of the light-emitting substrate to be packaged.

[0007] The encapsulation structure includes a first encapsulation layer and a second encapsulation layer. The first encapsulation layer covers the side of the light-emitting substrate to be encapsulated. The first encapsulation layer is made of an inorganic material, and the second encapsulation layer is made of an organic material and inorganic particles. The organic material has a porous structure and covers the side of the first encapsulation layer opposite to the light-emitting substrate. The inorganic particles fill at least a portion of the pores in the organic material and can block the voids in the organic material to prevent external gas from passing through the second encapsulation layer.

[0008] In some embodiments of the first aspect, the inorganic particles include at least one of SiNx, SiNO, SiO and Al2O3.

[0009] In some embodiments of the first aspect, the side of the second encapsulation layer facing away from the first encapsulation layer is parallel to the first surface of the substrate.

[0010] In some embodiments of the first aspect, the inorganic particles fill some of the pores of the organic material by atomic layer deposition or molecular layer deposition.

[0011] In some embodiments of the first aspect, at least some of the inorganic particles come into contact with each other to form a network structure.

[0012] In some embodiments of the first aspect, the second encapsulation layer has a plurality of the mesh structures.

[0013] In some embodiments of the first aspect, the mesh structure extends along a direction inclined to the first surface and the normal to the first surface.

[0014] In some embodiments of the first aspect, the density of the inorganic particles in the organic material gradually decreases along the direction toward the first encapsulation layer.

[0015] In some embodiments of the first aspect, the second encapsulation layer has a light-emitting region opposite to the light-emitting device and a gap region opposite to the gap between two adjacent light-emitting devices, wherein the density of inorganic particles in the light-emitting region is greater than the density in the gap region.

[0016] In some embodiments of the first aspect, the second encapsulation layer includes a plurality of stacked encapsulation units, each of the encapsulation units including an organic thin film layer and an inorganic thin film layer, wherein the ratio of the thickness of the organic thin film layer to the thickness of the inorganic thin film layer is 2-10.

[0017] In some embodiments of the first aspect, the thickness of the second encapsulation layer is 0.4µm-12µm.

[0018] In some embodiments of the first aspect, the thickness of the first encapsulation layer is 50 nm to 2 μm.

[0019] In a second aspect, an electronic device is provided, including a display panel as described in the above embodiments.

[0020] The technical advantages of this invention compared to existing technologies are as follows: The molecular structure and chemical properties of organic materials themselves determine the upper limit of their ability to block water and oxygen. Even in dense organic materials, there are still certain gaps between molecules, forming a porous structure, through which water and oxygen molecules can potentially permeate. This second encapsulation layer fills at least some of the pores in the organic material with inorganic particles, which can block the diffusion path of water and oxygen molecules in the second encapsulation layer, thereby effectively preventing harmful substances such as water and oxygen from entering the interior of the light-emitting substrate. At the same time, it has little impact on the flexibility of the organic material, eliminates the need for an outermost organic layer, reduces the stress on the display panel, thereby improving the bending or rolling performance of the display panel, achieving a thinner encapsulation structure, and also improving the mechanical strength and hardness of the second encapsulation layer. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a cross-sectional view of a display panel provided in one embodiment of the present invention;

[0023] Figure 2 This is a top sectional view of the display panel at the second encapsulation layer provided in another embodiment of the present invention;

[0024] Figures 3 to 6 These are cross-sectional views of the display panel provided in different embodiments of the present invention.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10. Light-emitting substrate; 11. Substrate; 12. Light-emitting device; 20. Packaging structure; 20a. Light-emitting area; 20b. Spacing area; 21. First packaging layer; 22. Second packaging layer; 221. Organic material; 222. Inorganic particles; 222a. Mesh structure; 22a. Packaging unit; 22a1. Organic thin film layer; 22a2. Inorganic thin film layer. Detailed Implementation

[0027] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] In the description of this invention, it should be understood that the terms "length", "width", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0031] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0032] This invention provides a display panel and an electronic device. The electronic device includes the display panel and includes, but is not limited to, mobile phones, tablet computers, watches, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), dashcams, security equipment, wearable devices, virtual reality (VR) / augmented reality (AR) devices, etc. The display panel is used to display images or light effects and can be either OLED or LCD. The following embodiments use an OLED display panel as an example for description.

[0033] In this embodiment of the invention, the display panel includes a light-emitting substrate 10 and an encapsulation structure 20.

[0034] Please see Figure 1 The light-emitting substrate 10 includes a substrate 11 and a plurality of light-emitting devices 12. The substrate 11 can be a flexible substrate, and its material can be selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), ultra-thin glass (UTG), etc. The substrate 11 is used to support the light-emitting devices 12. Specifically, the substrate 11 has a first side and a second side facing away from each other, the first side and the second side being parallel. The plurality of light-emitting devices 12 are disposed on the first side, with adjacent light-emitting devices 12 spaced apart. The plurality of light-emitting devices 12 can be arranged in an array to facilitate processing and display. The side of the light-emitting substrate 10 where the light-emitting devices 12 are disposed is the packaging side of the light-emitting substrate 10, and the packaging structure 20 is disposed on the packaging side of the light-emitting substrate 10.

[0035] The encapsulation structure 20 includes a first encapsulation layer 21 and a second encapsulation layer 22 stacked together.

[0036] The first encapsulation layer 21 covers the encapsulated side of the light-emitting substrate 10. The first encapsulation layer 21 can be of uniform or non-uniform thickness; there are no restrictions here, as long as it can completely cover the exposed portion of the first surface of the light-emitting device 12 and the substrate 11. The first encapsulation layer 21 is made of an inorganic material, which can be indium tin oxide (ITO). The first inorganic layer needs to have good transparency to ensure that the light emitted by the light-emitting device 12 can be effectively transmitted, and also has excellent conductivity to facilitate the injection of holes from the anode into the organic layer, providing a stable current path for the device and achieving efficient light emission. The surface of the substrate 11 may have some microscopic unevenness. The first inorganic layer can fill these tiny bumps and depressions, providing a smoother surface, which is conducive to the uniform growth of the subsequent organic functional layers and reduces problems such as uneven light emission caused by surface defects. At the same time, the first inorganic layer can also act as a barrier to prevent external moisture and oxygen from corroding the light-emitting device 12 and the substrate 11, improving the stability and lifespan of the device.

[0037] The second encapsulation layer 22 is made of organic material 221 and inorganic particles 222. The organic material 221 has a porous structure and covers the side of the first encapsulation layer 21 facing away from the light-emitting substrate 10. The organic material 221 has a certain degree of flexibility and elasticity, which can buffer external stress and reduce damage to the internal light-emitting device 12 or other functional layers caused by factors such as thermal expansion and contraction and mechanical vibration. The organic material 221 can also fill the gaps on the substrate 11. The inorganic particles 222 fill at least part of the pores in the organic material 221. The inorganic particles 222 can block the voids in the organic material 221 to prevent external gas from passing through the second encapsulation layer 22.

[0038] The molecular structure and chemical properties of the organic material 221 itself determine the upper limit of its ability to block water and oxygen. Even in dense organic material 221, there are still gaps between its molecules, forming a porous structure, through which water and oxygen molecules may diffuse. The second encapsulation layer 22 fills at least some of the pores in the organic material 221 with inorganic particles 222, which can block the diffusion path of water and oxygen molecules in the second encapsulation layer 22, thereby effectively preventing harmful substances such as water and oxygen from entering the interior of the light-emitting substrate 10. At the same time, it has little impact on the flexibility of the organic material 221, and can eliminate the need for the outermost organic layer, reducing the stress on the display panel and thus improving the bending or rolling performance of the display panel. This achieves the thinning of the encapsulation structure 20 and also improves the mechanical strength and hardness of the second encapsulation layer 22.

[0039] In some embodiments, the thickness of the second encapsulation layer 22 is 0.4µm-12µm. Within this thickness range, the second encapsulation layer 22 can have good flexibility without significantly affecting the thinning of the display panel. Specifically, when better flexibility and elasticity of the display panel are required for better cushioning, the thickness of the organic material 221 in the second encapsulation layer 22 can be set to be larger. Conversely, to improve production efficiency or reduce costs, while minimizing stress-induced cracking and detachment, the thickness of the organic material 221 in the second encapsulation layer 22 can be reduced.

[0040] In some embodiments, the thickness of the first encapsulation layer 21 is 50 nm to 2 μm. The inorganic material of the first encapsulation layer 21 itself has a dense crystalline or amorphous structure. Within this thickness range, it can form an effective physical barrier, greatly hindering the penetration of small molecules such as water vapor and oxygen, and controlling the transmittance to an extremely low level, thereby significantly improving the stability and lifespan of the display panel. Within this thickness range, the encapsulation structure 20 can maintain the stability of its chemical structure and performance under various environmental conditions and device operating states, and can have high hardness and wear resistance.

[0041] In some embodiments, the inorganic particles 222 include at least one of SiNx, SiNO, SiO, and Al2O3. These inorganic particles 222 have a dense structure and can form an additional barrier in the organic material 221. SiO, with its good chemical stability and low water permeability, effectively blocks the penetration of water vapor and oxygen when doped into the organic layer, reducing the erosion of the water-oxygen light-emitting substrate 10 and thus improving the stability and lifespan of the device. Al2O3 also has excellent barrier properties; it can fill the micropores in the organic layer, making the structure of the organic layer more dense and further reducing the water and oxygen permeability. Moreover, Al2O3 maintains good stability under high temperature and humid conditions, helping to maintain the long-term barrier effect of the encapsulation structure 20. Inorganic particles 222 such as SiNx have high hardness and strength, and their doping into the organic material 221 can enhance the mechanical properties of the organic layer. SiNO has a relatively dense structure, effectively blocking the penetration of small molecules such as water vapor and oxygen. SiNO can combine well with various organic materials and can be uniformly dispersed in the organic layer without causing phase separation or other adverse reactions in the organic materials. SiNO has a certain degree of hardness and strength. Adding it to the organic material 221 can improve the mechanical properties of the organic material 221 to a certain extent, enhance its scratch resistance and wear resistance, make the encapsulation structure 20 more robust, and better protect the internal light-emitting substrate 10 from the influence of external mechanical stress.

[0042] Please see Figure 1 In some embodiments, the side of the second encapsulation layer 22 facing away from the first encapsulation layer 21 is parallel to the first surface of the substrate 11. That is, the side of the second encapsulation layer 22 facing away from the first encapsulation layer 21 is a plane, which is parallel to the first surface of the substrate 11. This encapsulation structure 20 makes the light-emitting surface of the display panel flat, facilitating manufacturing processes. The organic layer can be obtained through common encapsulation processes such as coating and vapor deposition. Furthermore, the flat plane provides a smooth optical interface for the light-emitting substrate 10, reducing light scattering and refraction during propagation.

[0043] In some embodiments, the second encapsulation layer 22 has a uniform thickness, meaning that the cross-section of the light-emitting surface of the display panel is serrated. The height of the second encapsulation layer 22 corresponding to the location of the light-emitting device 12 is higher than the height of the second encapsulation layer 22 corresponding to the interval between two adjacent light-emitting devices 12. This increases the surface area of ​​the light-emitting surface of the display panel.

[0044] In some embodiments, inorganic particles 222 fill some of the pores of organic material 221 by atomic layer deposition or molecular layer deposition.

[0045] Atomic layer deposition (ALD) and molecular layer deposition (MLD) are two techniques for precisely depositing ultrathin films on material surfaces. ALD works by alternating chemical reactions between gaseous reactants and a solid surface. By precisely controlling the pulse sequence and timing of the reactant gases, the reaction proceeds layer by layer at the atomic scale, thus achieving precise control over film growth. MLD is also a layer-by-layer deposition technique based on surface chemical reactions, but the reactants used in MLD are typically organic molecules or organometallic compounds. Film growth is achieved through intermolecular chemical reactions, with a greater emphasis on constructing organic or organic-inorganic hybrid films.

[0046] Atomic layer deposition (ALD) and molecular layer deposition (MLD) are deposition techniques based on the atomic or molecular scale, enabling precise control over the amount and distribution of inorganic particles 222 within the pores of the organic material 221. These two techniques can form a uniform inorganic particle 222 film on the inner surface of the pores of the organic material 221. This achieves relatively uniform filling for both micropores and larger pores, avoiding problems of insufficient or excessive filling in certain areas, thereby improving the overall performance and reliability of the encapsulation structure 20. Furthermore, during ALD and MLD processes, the inorganic particles 222 are tightly bonded to the surface of the organic material 221 through chemical bonding or physical adsorption. This tight interface effectively improves the stability of the encapsulation structure 20, enhancing its resistance to external environmental factors (such as moisture and oxygen). Simultaneously, given the varying pore sizes of the organic material 221, ALD and MLD technologies can effectively fill nanoscale micropores. This is crucial for improving the barrier performance of the encapsulation structure 20, because even very small pores can become channels for harmful substances such as water vapor and oxygen to enter. By filling these tiny pores, the sealing effect of the encapsulation structure 20 can be significantly improved.

[0047] The following description uses the example of filling the pores in the organic material 221 with inorganic Al2O3 particles 222 via atomic layer deposition. The steps for preparing the second encapsulation layer 22 include:

[0048] S1. An organic layer is prepared on the light-emitting substrate 10 on which the first encapsulation layer 21 is formed to form a substrate to be filled. The organic layer is made of organic material 221. The methods for forming the organic layer include, but are not limited to, vacuum evaporation, solution spin coating, chemical vapor deposition, etc.

[0049] S2. Place the substrate to be filled into the atomic layer deposition reaction chamber and seal the reaction chamber.

[0050] S3, Atomic Layer Deposition Cycle:

[0051] S31, Trimethylaluminum (TMA) Pulse: Open the inlet valve of trimethylaluminum (TMA) and introduce TMA gas into the reaction chamber at a certain flow rate (e.g., 1-10 sccm). The pulse time is usually controlled between 0.1-1 s. TMA molecules diffuse to the surface of the organic layer and adsorb onto the active sites on the surface of the organic layer and the surface inside the pores. TMA reacts with active groups such as hydroxyl groups on the surface of the organic layer to form chemical bonds, thereby fixing it to the surface.

[0052] S32. Inert Gas Purging: Close the TMA inlet valve and introduce an inert gas (such as nitrogen or argon) at a high flow rate (e.g., 100-500 sccm) to purge the reaction chamber for 5-30 seconds. The purpose is to remove unreacted TMA gas and any potential byproducts, ensuring that only TMA molecules adsorbed on the surface of the organic layer remain in the chamber.

[0053] S33, Water (H2O) Pulse: Open the water vapor (H2O) inlet valve to introduce water vapor into the reaction chamber at a certain flow rate (e.g., 1-10 sccm). The pulse duration is usually between 0.1-1 s. The water vapor reacts chemically with TMA molecules adsorbed on the surface of the organic layer to produce byproducts such as alumina (Al2O3) and methane (CH4).

[0054] S34. Second inert gas purging: Close the water vapor inlet valve and purge the reaction chamber again with inert gas to remove unreacted water vapor and generated byproducts (such as methane). The purging parameters are similar to those in step two, and the time is 5-30 seconds.

[0055] S4. Repeat step S3 above until the deposition of inorganic particles 222 meets the requirements.

[0056] In other embodiments, inorganic particles 222 may also be filled into the porous structure of organic material 221 by chemical vapor deposition (such as infiltration or selective vapor reaction), which is not limited here.

[0057] Please see Figure 2 and Figure 3In some embodiments, at least some of the inorganic particles 222 contact each other to form a network structure 222a. This network structure 222a can be a planar network structure 222a or a three-dimensional network structure 222a, without limitation. One or more of this network structure 222a can be formed. Besides this network structure 222a, other inorganic particles 222 can form single-point, linear, or planar structures, without limitation. The inorganic particles 222 in the network structure 222a are interconnected, forming intricate paths. When water vapor and oxygen molecules attempt to enter the encapsulation structure 20, they need to travel along these tortuous paths, greatly increasing their diffusion distance. Furthermore, while there may be some large pores in the original organic layer through which water vapor and oxygen molecules can pass relatively easily, the addition of inorganic particles 222 fills these large pores, making the remaining pore size smaller. According to the principle of gas diffusion, the diffusion rate of molecules in small pores will be significantly reduced because the collision frequency between molecules and pore walls increases, hindering their free movement. Meanwhile, some inorganic particles 222 possess large specific surface areas and surface energies, exhibiting strong adsorption of water vapor and oxygen molecules. Some can even react chemically with water vapor or oxygen, transforming them into other harmless substances. Therefore, the mesh structure 222a formed by the inorganic particles 222 enhances barrier performance, more effectively preventing harmful substances such as water vapor and oxygen from entering the OLED. Secondly, the mesh structure 222a formed by the interconnected inorganic particles 222 enhances the mechanical strength of the second encapsulation layer 22, better withstanding external pressure, impact, and vibration, reducing the possibility of encapsulation layer cracking or damage due to mechanical stress, and improving the stability and reliability of the OLED device. The mesh structure 222a also limits the thermal expansion and deformation of the organic layer at high temperatures, reducing interface damage between the second encapsulation layer 22 and the internal structure caused by thermal stress, and improving the performance stability of the device under different temperature environments. In addition, appropriate distribution of inorganic particles 222 and mesh structure 222a allow light to propagate more uniformly within the encapsulation layer, reducing light reflection and loss, improving light extraction efficiency, and making the OLED display brighter and clearer.

[0058] The formation of the network structure 222a can be achieved by adjusting deposition parameters, such as deposition temperature, deposition rate, proportion of reactant gases, deposition time, and vacuum level.

[0059] Please see Figure 3For example, the second encapsulation layer 22 has multiple mesh structures 222a. These mesh structures 222a are planar, and can be flat, curved, or irregular; no limitation is made here. The multiple mesh structures 222a can be stacked and spaced apart, or arranged irregularly. Given the same diffusion rate of inorganic particles 222, the arrangement of multiple mesh structures 222a is equivalent to setting up multiple layers of barriers. This forces harmful substances such as water vapor and oxygen to pass through these mesh structures 222a sequentially. Each layer provides physical barrier and adsorption, effectively reducing the amount of harmful substances reaching the light-emitting substrate 10. The multiple mesh structures 222a are distributed within the organic material 221, allowing for a more uniform dispersion of the barrier effect and preventing a decrease in barrier performance due to potential local defects or inhomogeneities in a single mesh structure 222a. Simultaneously, the multiple mesh structures 222a can more evenly distribute the stress applied from the outside within the organic material 221. When the display panel is subjected to external forces such as tension, compression, or bending, multiple mesh structures 222a can cooperate to distribute stress to different areas, reducing the stress on each mesh structure 222a, decreasing the risk of structural damage, and improving the overall stability of the organic layer. Furthermore, if a mesh structure 222a is damaged to some extent during use, other undamaged mesh structures 222a can still maintain a certain barrier function, playing a role in repair and compensation. This helps extend the lifespan of OLED devices and improve their reliability.

[0060] Optionally, each mesh structure 222a can extend at an angle to the first surface and in the direction normal to the first surface. This allows the angled mesh structure 222a to better conform to the deformation of the substrate 11 when the display panel bends. Compared to a mesh structure 222a parallel to the substrate 11, the angled mesh structure 222a exhibits more uniform relative displacement between its parts during bending, reducing the likelihood of localized stress concentration. This is because the angle allows the mesh structure 222a to adapt to the curvature changes of the substrate 11 through its own deformation during bending, much like having multiple "joints" that can rotate flexibly, thus reducing the risk of breakage or damage due to bending and improving the device's flexibility. Since the mesh structure 222a has a certain angle with the substrate 11, stress diffuses along the angled direction during transmission, preventing stress concentration in a single plane. The angled mesh structure 222a also makes the diffusion path of water and oxygen molecules more tortuous and lengthy. When water and oxygen molecules enter the device, they need to constantly change direction along the inclined mesh structure 222a, significantly increasing their actual diffusion distance compared to a mesh structure 222a parallel to the substrate 11. The inclined mesh structure 222a also increases the scattering probability of water and oxygen molecules with inorganic particles 222. Because the mesh structure 222a has a certain tilt angle with the substrate 11, water and oxygen molecules are more likely to collide with inorganic particles 222 during diffusion, thus changing their direction of motion. This scattering effect makes the diffusion of water and oxygen molecules in the organic layer more disordered, further hindering their linear propagation, reducing the number of water and oxygen molecules that can successfully pass through the organic layer, and enhancing the barrier effect against water and oxygen.

[0061] To form an inclined network structure 222a from the organic particles in the organic material 221, the substrate to be filled can be placed at a certain angle in the reaction chamber of atomic layer deposition for deposition. The angle of inclination can be adjusted according to the required inclination of the network structure 222a, or it can be achieved by electric field induction, which is not limited here.

[0062] Please see Figure 4In some embodiments, the density of inorganic particles 222 in the organic material 221 gradually decreases along the direction toward the first encapsulation layer 21. That is, the particle size or filling amount of inorganic particles 222 gradually decreases along the direction toward the first encapsulation layer 21 in the normal direction of the first surface of the substrate 11. The light-emitting device 12 on the light-emitting substrate 10 is relatively fragile. The low density of inorganic particles 222 near the light-emitting substrate 10 means that this area is relatively soft. During the encapsulation process, this reduces the physical damage to the light-emitting device 12 that may be caused by the aggregation of inorganic particles 222. It also reduces the impact of stress caused by differences in thermal expansion coefficients on the device, improving the device's reliability. Furthermore, some inorganic particles 222 may cause fluorescence quenching in the light-emitting device 12. The low density of inorganic particles 222 near the light-emitting substrate 10 reduces this quenching effect, which is beneficial for maintaining the luminous efficiency and performance of the light-emitting device 12. The inorganic particles 222, located further away from the light-emitting substrate 10, have a high density and can form a dense barrier layer on the surface of the encapsulation structure 20. This effectively blocks the intrusion of harmful substances such as water and oxygen from the outside, protecting the internal light-emitting device 12 and other structures, and improving the stability and lifespan of the encapsulation structure 20. The areas closer to the light-emitting substrate 10, with higher organic content, have better adhesion to the substrate, ensuring a tight connection between the encapsulation layer and the substrate 10. Meanwhile, the high-density inorganic particle 222 areas further away from the substrate 10 provide better mechanical strength and wear resistance, making the entire encapsulation structure 20 more robust and durable. The areas closer to the light-emitting device 12 have a low inorganic particle 222 density, reducing the absorption and scattering of light emitted by the device, thus improving light extraction efficiency and enhancing the brightness and uniformity of the light emission. This density distribution creates a refractive index gradient that guides light propagation in a specific direction, reducing internal reflection and allowing more light to be effectively transmitted from the device 12 to the outside, improving the optical performance and visual effect of the device 12.

[0063] The formation of a second encapsulation layer 22 in which the density of inorganic particles 222 gradually changes can be achieved by adjusting the precursor concentration, changing the deposition temperature, controlling the deposition time, and adjusting the reaction gas flow rate ratio.

[0064] Please see Figure 5In some embodiments, the second encapsulation layer 22 has a light-emitting region 20a opposite to the light-emitting device 12 and a gap region opposite to the gap between two adjacent light-emitting devices 12. The density of inorganic particles 222 in the light-emitting region 20a is greater than that in the gap region. That is, the gap region of the second encapsulation layer 22 is thicker, while the light-emitting region 20a is thinner. The density of inorganic particles 222 is higher in the thinner part of the second encapsulation layer 22, and the sealing effect is smaller in the thicker part of the second encapsulation layer 22. The density of inorganic particles 222 can be measured by particle size and filling amount. The high density of inorganic particles 222 in the light-emitting region 20a can enhance the mechanical strength of the light-emitting region 20a, provide better support and protection for the light-emitting device 12, and reduce damage to the device caused by external pressure or deformation. The low density of inorganic particles 222 in the spacer regions 20b reduces the impact on the flexibility of the organic material 221 in the spacer regions 20b. Therefore, these spacer regions 20b can provide a certain degree of flexible buffering. When the encapsulation structure 20 is subjected to external forces such as bending or stretching, the spacer regions 20b can deform to a certain extent, thereby improving the flexibility of the entire encapsulation structure 20. Since the light-emitting device 12 is a water and oxygen sensitive component, the high density of inorganic particles 222 in the light-emitting region 20a can form a denser barrier layer, reducing the diffusion channels of water and oxygen molecules, effectively blocking the corrosion of water and oxygen on the light-emitting device 12, and improving the stability and lifespan of the device.

[0065] When the second encapsulation layer 22 is formed by atomic deposition, a barrier mesh can be set above the substrate to be filled. The barrier mesh has a high-density region and a low-density region. The high-density region has a larger mesh density, while the low-density region has a smaller mesh sealing. The high-density region is opposite to the gap region in the deposition direction, and the low-density region is opposite to the light-emitting region 20a in the deposition direction.

[0066] Please see Figure 6In some embodiments, the second encapsulation layer 22 includes multiple stacked encapsulation units 22a, each encapsulation unit 22a including an organic thin film layer 22a1 and an inorganic thin film layer 22a2. Both the organic thin film layer 22a1 and the inorganic thin film layer 22a2 are planar, and the thickness ratio of the organic thin film layer 22a1 to the inorganic thin film layer 22a2 is 2-10. Because multiple encapsulation units 22a are stacked, the organic thin film layer 22a1 and the inorganic thin film layer 22a2 are arranged alternately. The organic thin film layer 22a1 has good flexibility and deformability. When the encapsulation structure 20 is subjected to external force, the organic thin film layer 22a1 can adapt to the external force through its own stretching, bending, and other deformations, thereby absorbing and dispersing energy and reducing damage to the entire encapsulation structure 20. Because the organic thin film layer 22a1 has a relatively large thickness and accounts for a large proportion in the second encapsulation layer 22, it can provide the main flexibility for the encapsulation structure 20. Furthermore, the organic thin film layer 22a1 can deform within the gaps of the inorganic thin film layer 22a2, preventing the inorganic thin film layer 22a2 from directly bearing excessive stress, thereby improving the flexibility of the entire second encapsulation layer 22. The inorganic thin film layer 22a2 has excellent barrier properties, effectively blocking the penetration of small molecules such as water and oxygen. Its dense crystal structure and small intermolecular gaps make it difficult for water and oxygen molecules to pass through. Although the inorganic thin film layer 22a2 is relatively thin, it still plays a crucial barrier role in the encapsulation unit 22a, reducing the erosion of the internal light-emitting device 12 by water and oxygen. The stacked arrangement of multiple encapsulation units 22a means that water and oxygen molecules need to pass through multiple inorganic thin film layers 22a2 and organic thin film layers 22a1 during the penetration process. In this way, water and oxygen molecules need to constantly change their paths when passing through the encapsulation layer, increasing the difficulty of penetration and thus improving the overall barrier performance. This thickness ratio range provides a good balance between flexibility and barrier properties, ensuring that the encapsulation layer has sufficient flexibility to adapt to different application scenarios while effectively blocking water and oxygen to protect the internal light-emitting device 12. If the organic thin film layer 22a1 is too thick, although the flexibility will be better, the barrier properties may decrease; if the inorganic thin film layer 22a2 is too thick, although the barrier properties will be improved, the flexibility will be significantly affected.

[0067] The above descriptions are merely several specific embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that, Including the light-emitting substrate and packaging structure; The light-emitting substrate includes a substrate and a plurality of light-emitting devices. The substrate has a first side and a second side facing away from each other. The plurality of light-emitting devices are disposed on the first side and are spaced apart from each other. The side of the light-emitting substrate on which the light-emitting devices are disposed is the side of the light-emitting substrate to be packaged. The encapsulation structure includes a first encapsulation layer and a second encapsulation layer. The first encapsulation layer covers the side of the light-emitting substrate to be encapsulated. The first encapsulation layer is made of an inorganic material, and the second encapsulation layer is made of an organic material and inorganic particles. The organic material has a porous structure and covers the side of the first encapsulation layer opposite to the light-emitting substrate. The inorganic particles fill at least a portion of the pores in the organic material and can block the voids in the organic material to prevent external gas from passing through the second encapsulation layer.

2. The display panel as described in claim 1, characterized in that, The inorganic particles include at least one of SiNx, SiNO, SiO and Al2O3.

3. The display panel as described in claim 1, characterized in that, The side of the second encapsulation layer facing away from the first encapsulation layer is parallel to the first surface of the substrate.

4. The display panel as described in claim 1, characterized in that, The inorganic particles fill some of the pores in the organic material using atomic layer deposition or molecular layer deposition methods.

5. The display panel as described in claim 1, characterized in that, At least some of the inorganic particles come into contact with each other to form a network structure.

6. The display panel as described in claim 5, characterized in that, The second encapsulation layer has multiple mesh structures.

7. The display panel as described in claim 5 or 6, characterized in that, The mesh structure extends along directions inclined to the first surface and the normal to the first surface.

8. The display panel as described in claim 1, characterized in that, The density of the inorganic particles in the organic material gradually decreases along the direction toward the first encapsulation layer.

9. The display panel as claimed in claim 1, characterized in that, The second encapsulation layer has a light-emitting region opposite to the light-emitting device and a gap region opposite to the gap between two adjacent light-emitting devices, wherein the density of inorganic particles in the light-emitting region is greater than the density in the gap region.

10. The display panel as claimed in claim 1, characterized in that, The second encapsulation layer includes multiple stacked encapsulation units, each of which includes an organic thin film layer and an inorganic thin film layer, wherein the ratio of the thickness of the organic thin film layer to the thickness of the inorganic thin film layer is 2-10.

11. The display panel as claimed in claim 1, characterized in that, The thickness of the second encapsulation layer is 0.4um-12um.

12. The display panel as claimed in claim 1, characterized in that, The thickness of the first encapsulation layer is 50nm-2um.

13. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1 to 12.

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