Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation layer arranged on one side of the substrate and comprising an isolation structure and a plurality of isolation openings formed by the isolation structure; the isolation structure comprises a first film layer and a second film layer arranged in a stack; a plurality of light emitting units arranged on one side of the substrate; the plurality of light emitting units comprise at least one first light emitting unit, at least one second light emitting unit and at least one third light emitting unit; the first film layer comprises a first sub-film layer corresponding to the first light emitting unit, a second sub-film layer corresponding to the second light emitting unit and a third sub-film layer corresponding to the third light emitting unit; the area of a region formed by the first sub-film layer is smaller than the area of a region formed by the second sub-film layer, and the area of the region formed by the second sub-film layer is smaller than the area of a region formed by the third sub-film layer. The display panel can improve the yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] VIP (Visionox Intelligent Pixelation) is an innovative vertical evaporation technology for OLEDs without a mask, designed to replace the traditional fine metal mask (FMM) evaporation process. The fabrication of display panels involves multiple process technologies. VIP technology uses semiconductor photolithography to pattern pixels and wet etching to remove the cathode material from the sub-pixels.

[0003] However, while removing the cathode material, the wet etching solution will also etch the isolation layer, which may affect the success rate of the rear pixel cathode bonding, thus leading to a decrease in the yield of the display panel. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel, a method for manufacturing the display panel, and a display device that can improve the yield of the display panel, in response to the above-mentioned technical problems.

[0005] In a first aspect, this application provides a display panel, the display panel comprising:

[0006] substrate;

[0007] An isolation layer is disposed on one side of a substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure; the isolation structure includes a first film layer and a second film layer stacked together, wherein the orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate;

[0008] Multiple light-emitting units are disposed on one side of a substrate; each light-emitting unit includes a first electrode, a light-emitting structure, and a second electrode stacked together; the multiple light-emitting units include at least one first light-emitting unit, at least one second light-emitting unit, and at least one third light-emitting unit, wherein the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are used to emit light of different colors; the first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit; the area of ​​the region enclosed by the first sub-film layer is smaller than the area of ​​the region enclosed by the second sub-film layer, and the area of ​​the region enclosed by the second sub-film layer is smaller than the area of ​​the region enclosed by the third sub-film layer;

[0009] Multiple encapsulation structures are provided, with each encapsulation structure located on the side of the corresponding light-emitting unit away from the substrate.

[0010] In one embodiment, a portion of the encapsulation structure is disposed on the sidewall of the isolation structure, including:

[0011] Optionally, the thickness of the encapsulation structure on the sidewall of the first sub-film layer is less than the thickness of the encapsulation structure on the side of the first light-emitting unit away from the substrate, the thickness of the encapsulation structure on the sidewall of the second sub-film layer is less than the thickness of the encapsulation structure on the side of the second light-emitting unit away from the substrate, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer is less than the thickness of the encapsulation structure on the side of the third light-emitting unit away from the substrate.

[0012] Optionally, the thickness of the encapsulation structure on the sidewall of the first sub-film layer, the thickness of the encapsulation structure on the sidewall of the second sub-film layer, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer are the same.

[0013] In one embodiment, the second electrode in the first light-emitting unit is electrically connected to the first sub-film layer, the second electrode in the second light-emitting unit is electrically connected to the second sub-film layer, and the second electrode in the third light-emitting unit is electrically connected to the third sub-film layer.

[0014] In one embodiment, the display panel further includes:

[0015] A pixel defining layer is disposed on one side of the substrate, and the pixel defining layer includes a plurality of pixel openings; a plurality of isolation openings are correspondingly connected to the plurality of pixel openings.

[0016] Secondly, this application provides a method for manufacturing a display panel, the method comprising:

[0017] Provide substrate;

[0018] An electrode material layer is formed on one side of a substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes;

[0019] A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate. An isolation material layer is formed on the side of the pixel material layer facing away from the substrate. A photoresist material layer is formed on the side of the isolation material layer facing away from the substrate. The photoresist material layer is subjected to a second patterning process to form a photoresist layer. The isolation material layer is subjected to a third patterning process to form an isolation layer. The pixel material layer is subjected to a fourth patterning process to form a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The isolation structure includes a first film layer and a second film layer stacked together. The orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings.

[0020] A light-emitting material layer is formed on the side of the isolation layer facing away from the substrate, and an encapsulation material layer is formed on the side of the light-emitting material layer facing away from the substrate. The encapsulation material layer and the light-emitting material layer are subjected to a fifth patterning process to form an encapsulation layer and multiple light-emitting units. The multiple light-emitting units include at least one first light-emitting unit, at least one second light-emitting unit, and at least one third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are used to emit light of different colors. The first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit. The area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer.

[0021] In one embodiment, the photoresist layer includes at least one first photolithographic region, at least one second photolithographic region, and at least one third photolithographic region. The light transmittance of the first photolithographic region is greater than that of the second photolithographic region, and the light transmittance of the second photolithographic region is greater than that of the third photolithographic region. The first photolithographic region corresponds to a first light-emitting unit, the second photolithographic region corresponds to a second light-emitting unit, and the third photolithographic region corresponds to a third light-emitting unit.

[0022] In one embodiment, the method further includes:

[0023] The transmittance of the first, second, and third photolithographic regions is determined according to the fabrication order of the first, second, and third light-emitting units.

[0024] In one embodiment, the isolation material layer undergoes a third patterning process to form an isolation layer, including:

[0025] The isolation material layer is subjected to a sixth patterning process to form an intermediate isolation material layer; the surface of the intermediate isolation material layer facing away from the pixel material layer includes a first surface, a second surface, a third surface and a fourth surface, the distance between the first surface and the pixel material layer is smaller than the distance between the second surface and the pixel material layer, and the distance between the second surface and the pixel material layer is smaller than the distance between the third surface and the pixel material layer;

[0026] The intermediate isolation material layer is patterned a third time to form an isolation layer.

[0027] In one embodiment, the thickness of the encapsulation structure on the sidewall of the first sub-film layer, the thickness of the encapsulation structure on the sidewall of the second sub-film layer, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer are the same.

[0028] Thirdly, this application also provides a display device, including a display panel as described in any of the first aspects above.

[0029] The aforementioned display panel, its fabrication method, and display device, wherein the display panel comprises: a substrate; an isolation layer disposed on one side of the substrate and including an isolation structure and a plurality of isolation openings enclosed by the isolation structure; the isolation structure includes a first film layer and a second film layer stacked together, wherein the orthographic projection of the first film layer on the substrate lies within the orthographic projection of the second film layer on the substrate; a plurality of light-emitting units disposed on one side of the substrate; each light-emitting unit includes a first electrode, a light-emitting structure, and a second electrode stacked together; the plurality of light-emitting units includes at least one first light-emitting unit, at least one second light-emitting unit, and at least one third light-emitting unit, wherein the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are used to emit light of different colors; the first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit; the area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer; and a plurality of encapsulation structures disposed on the side of the corresponding light-emitting unit facing away from the substrate. In this way, since the area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer, after wet etching processes at different frequencies, the areas enclosed by the first, second, and third sub-film layers can be made approximately the same, thereby ensuring the success rate of cathode bonding of each light-emitting unit and improving the yield of the display panel. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is one of the partial cross-sectional views of the display panel in one embodiment;

[0032] Figure 2 This is a second partial cross-sectional view of the display panel in another embodiment;

[0033] Figure 3 This is a flowchart illustrating a method for manufacturing a display panel in another embodiment;

[0034] Figure 4 This is a schematic diagram of the fabrication process of a display panel fabrication method in another embodiment;

[0035] Figure 5 This is a flowchart illustrating a method for manufacturing a display panel in another embodiment;

[0036] Explanation of reference numerals in the attached figures:

[0037] 10. Display panel; 11. Substrate; 12. Isolation layer; 13. Light-emitting unit; 14. Packaging structure;

[0038] 121. Isolation structure; 121a. First membrane layer; 121b. Second membrane layer; 122. Isolation opening;

[0039] 131. First light-emitting unit; 132. Second light-emitting unit; 133. Third light-emitting unit;

[0040] 134. First electrode; 135. Light-emitting structure; 136. Second electrode;

[0041] 121a1, First sub-film layer; 121a2, Second sub-film layer; 121a3, Third sub-film layer;

[0042] 15. Pixel limiting layer; 151. Pixel opening. Detailed Implementation

[0043] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. It should be understood that many specific details are set forth in the following description to provide a full understanding of this application; however, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0045] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, without excluding other elements or objects.

[0046] In the description of this application, it should be understood that the terms "thickness", "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0048] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0050] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0051] The manufacturing process of display panels involves multiple process technologies. VIP technology uses semiconductor lithography to pattern pixels, and wet etching removes the cathode material of the sub-pixels. However, while removing the cathode material, the wet etching solution also etches the isolation layer. With the wet etching process of three color pixels, the length of the isolation layer (SA) for the first color is SA-1, for the second color it is SA-2, and for the third color it is SA-3. As the display panel manufacturing process shows, the first color requires one VEE wet etching, the second color requires two VEE wet etchings, and the third color requires three VEE wet etchings. Therefore, the isolation layer recedes with the manufacturing process, causing the length of the SA on the isolation layer to increase with the frequency of the wet etching process, i.e., SA-1 < SA-2 < SA-3. An excessively long SA can prevent the pixel cathode from attaching to the isolation layer, affecting the success rate of cathode attachment for subsequent pixels (i.e., the second and third pixels), thus reducing the yield of the display panel.

[0052] To address the aforementioned problems, this application provides a display panel that can improve the yield of the display panel, a method for manufacturing the display panel, and a display device. The embodiments will be described below with reference to the accompanying drawings.

[0053] This application provides a display panel 10, such as Figure 1 As shown, the display panel 10 includes a substrate 11, an isolation layer 12, a plurality of light-emitting units 13, and a plurality of encapsulation structures 14; wherein, the isolation layer 12 is disposed on one side of the substrate 11 and includes an isolation structure 121 and a plurality of isolation openings 122 formed by the isolation structure 121; the isolation structure 121 includes a first film layer 121a and a second film layer 121b stacked together, wherein the orthographic projection of the first film layer 121a on the substrate 11 is located within the orthographic projection of the second film layer 121b on the substrate 11. Multiple light-emitting units 13 are disposed on one side of the substrate 11. Each light-emitting unit 13 includes a first electrode 134, a light-emitting structure 135, and a second electrode 136 stacked together. Each light-emitting unit 13 includes at least one first light-emitting unit 131, at least one second light-emitting unit 132, and at least one third light-emitting unit 133, which emit light of different colors. A first film layer 121a includes a first sub-film layer 121a1 corresponding to the first light-emitting unit 131, a second sub-film layer 121a2 corresponding to the second light-emitting unit 132, and a third sub-film layer 121a3 corresponding to the third light-emitting unit 133. The area enclosed by the first sub-film layer 121a1 is smaller than the area enclosed by the second sub-film layer 121a2, and the area enclosed by the second sub-film layer 121a2 is smaller than the area enclosed by the third sub-film layer 121a3. Multiple encapsulation structures 14 are disposed on the side of the corresponding light-emitting unit 13 facing away from the substrate 11.

[0054] The display panel 10 can be an organic light-emitting diode (OLED) display panel, a micro organic light-emitting diode (Micro OLED) display panel, a light-emitting diode (LED) display panel, a quantum dot light-emitting diode (QLED) display panel, a mini light-emitting diode (MiniLED) display panel, a micro light-emitting diode (Micro LED) display panel, or a liquid crystal display (LCD) display panel, etc. This application uses an OLED display panel as an example for illustration.

[0055] For example, an isolation layer 12 is provided on one side of the substrate 11. The isolation layer 12 includes a plurality of isolation openings 122, and the light-emitting unit 13 is located within the isolation openings 122. Optionally, at least one of the first film layer 121a and the second film layer 121b can be made of a conductive material. The material of at least one of the first film layer 121a and the second film layer 121b can include metals such as titanium, silver, copper, aluminum, and molybdenum, or alloys, or conductive oxides, such as any one or more of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), zinc gallium oxide, titanium tantalum oxide, tin oxide, cadmium oxide, and indium oxide. This application embodiment does not limit this.

[0056] In some embodiments, multiple light-emitting units 13 may be arranged in an array. Each light-emitting unit 13 may include an emission layer (EML). The light-emitting unit 13 may also include one or more of the following: a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL). Alternatively, the light-emitting unit 13 may be a stacked light-emitting structure, i.e., including at least two emission layers and a charge generation layer (CGL) located between adjacent emission layers. Multiple light-emitting units 13 are used to emit light of different colors. For example, such as... Figure 1 As shown, the plurality of light-emitting units 13 include a first light-emitting unit 131 that emits red light, a second light-emitting unit 132 that emits green light, and a third light-emitting unit 133 that emits blue light. For ease of understanding, this embodiment of the present application will be described using this as an example.

[0057] Optionally, the first electrode 134 is the anode and the second electrode 136 is the cathode. This embodiment of the application will be described using this as an example.

[0058] like Figure 1 As shown, the first film layer 121a includes a first sub-film layer 121a1 corresponding to the first light-emitting unit 131, a second sub-film layer 121a2 corresponding to the second light-emitting unit 132, and a third sub-film layer 121a3 corresponding to the third light-emitting unit 133. The area enclosed by the first sub-film layer 121a1 is the area of ​​the first sub-film layer 121a1 after the VSS wet etching process and before the VEE process of the display panel, as shown in the figure. Figure 1 As shown in S1, the area of ​​the region enclosed by the second sub-film layer 121a2 is also the area of ​​the second sub-film layer 121a2, as shown in S1. Figure 1 As shown in S2, the area of ​​the region enclosed by the third sub-membrane layer 121a3 is also the area of ​​the third sub-membrane layer 121a3, as shown in S2. Figure 1As shown in S3. Since the area enclosed by the first sub-film layer 121a1 is smaller than the area enclosed by the second sub-film layer 121a3, and the area enclosed by the second sub-film layer 121a2 is smaller than the area enclosed by the third sub-film layer 121a2, that is, SA-1 corresponding to the first light-emitting unit 131 is greater than SA-2 corresponding to the second light-emitting unit 132, and SA-2 corresponding to the second light-emitting unit 132 is greater than SA-3 corresponding to the third light-emitting unit 133, i.e., SA-1>SA-2>SA-3.

[0059] During the fabrication of the sub-pixels of the three light-emitting units 13, the wet etching solution removes the cathode material while simultaneously etching the first film layer 121a. The fabrication of the three sub-pixels requires three VEE processes. Since SA-1>SA-2>SA-3, after the first VEE process, SA-1=SA-2>SA-3. After the second VEE process, SA-1=SA-2=SA-3. After the third VEE process, the sub-pixels of the three light-emitting units 13 are patterned, and SA-1=SA-2=SA-3. Therefore, the success rate of cathode bonding of each sub-pixel is improved, thereby improving the yield of the display panel 10.

[0060] In the above embodiments, the display panel 10 includes: a substrate 11; an isolation layer 12 disposed on one side of the substrate 11, and including an isolation structure 121 and a plurality of isolation openings 122 formed by the isolation structure 121; the isolation structure 121 includes a first film layer 121a and a second film layer 121b stacked together, the orthographic projection of the first film layer 121a on the substrate 11 being located within the orthographic projection of the second film layer 121b on the substrate 11; a plurality of light-emitting units 13 disposed on one side of the substrate 11; the light-emitting unit 13 includes a first electrode 134, a light-emitting structure 135 and a second electrode 136 stacked together; the plurality of light-emitting units 13 includes at least one first light-emitting unit 131, at least one second light-emitting unit 132 and at least one third light-emitting unit 133. The first light-emitting unit 131, the second light-emitting unit 132, and the third light-emitting unit 133 are used to emit light of different colors; the first film layer 121a includes a first sub-film layer 121a1 corresponding to the first light-emitting unit 131, a second sub-film layer 121a2 corresponding to the second light-emitting unit 132, and a third sub-film layer 121a3 corresponding to the third light-emitting unit 133; the area enclosed by the first sub-film layer 121a1 is smaller than the area enclosed by the second sub-film layer 121a2, and the area enclosed by the second sub-film layer 121a2 is smaller than the area enclosed by the third sub-film layer 121a3; a plurality of encapsulation structures 14 are disposed on the side of the corresponding light-emitting unit 13 away from the substrate 11. In this way, since the area enclosed by the first sub-film layer 121a1 is smaller than the area enclosed by the second sub-film layer 121a2, and the area enclosed by the second sub-film layer 121a2 is smaller than the area enclosed by the third sub-film layer 121a3, after wet etching processes at different frequencies, the areas enclosed by the first sub-film layer 121a1, the second sub-film layer 121a2, and the third sub-film layer 121a3 can be made approximately the same, thereby ensuring that the success rate of cathode bonding of each light-emitting unit 13 is consistent and improving the yield of the display panel 10.

[0061] In some embodiments, such as Figure 2 As shown, a portion of the encapsulation structure 14 is disposed on the sidewall of the isolation structure 121.

[0062] Optionally, the thickness h1 of the encapsulation structure 14 disposed on the sidewall of the first sub-film layer 121a1 is less than the thickness k1 of the encapsulation structure 14 disposed on the side of the first light-emitting unit 131 away from the substrate 11, the thickness h2 of the encapsulation structure 14 disposed on the sidewall of the second sub-film layer 121a2 is less than the thickness k2 of the encapsulation structure 14 disposed on the side of the second light-emitting unit 132 away from the substrate 11, and the thickness h3 of the encapsulation structure 14 disposed on the sidewall of the third sub-film layer 121a3 is less than the thickness k3 of the encapsulation structure 14 disposed on the side of the third light-emitting unit 133 away from the substrate 11.

[0063] Optionally, the encapsulation structure 14 is an inorganic film layer, such as a CVD1 encapsulation layer (Chemical Vapor Deposition). By forming the encapsulation structure 14, the penetration of water vapor and oxygen is prevented, protecting the first light-emitting unit 131, the second light-emitting unit 132, and the third light-emitting unit 133, thereby ensuring the manufacturing quality of the display panel 10.

[0064] Optionally, the thickness h1 of the encapsulation structure 14 on the sidewall of the first sub-film layer 121a1, the thickness h2 of the encapsulation structure 14 on the sidewall of the second sub-film layer 121a2, and the thickness h3 of the encapsulation structure 14 on the sidewall of the third sub-film layer 121a3 are the same.

[0065] Since SA-1=SA-2=SA-3, the thickness of the encapsulation structure 14 on the sidewall of the first sub-film layer 121a1, the thickness of the encapsulation structure 14 on the sidewall of the second sub-film layer 121a2, and the thickness of the encapsulation structure 14 on the sidewall of the third sub-film layer 121a3 are the same or approximately the same. Therefore, the encapsulation effect of each sub-pixel CVD1 is comparable, and the encapsulation performance of each sub-pixel is improved.

[0066] In the embodiments of this application, the second electrode 136 in the first light-emitting unit 131 is electrically connected to the first sub-film layer 121a1, the second electrode 136 in the second light-emitting unit 132 is electrically connected to the second sub-film layer 121a2, and the second electrode 136 in the third light-emitting unit 133 is electrically connected to the third sub-film layer 121a3.

[0067] The first sub-film layer 121a1, the second sub-film layer 121a2, and the third sub-film layer 121a3 are used as conductive materials. The second electrode 136 in the first light-emitting unit 131 is the cathode and is electrically connected to the first sub-film layer 121a1. The second electrode 136 in the second light-emitting unit 132 is the cathode and is electrically connected to the second sub-film layer 121a2. The second electrode 136 in the third light-emitting unit 133 is the cathode and is electrically connected to the third sub-film layer 121a3, thereby ensuring the success rate of cathode connection of each light-emitting unit 13.

[0068] In the optional embodiments of this application, please continue to refer to Figure 2 The display panel 10 also includes a pixel defining layer 15 disposed on one side of the substrate 11. The pixel defining layer 15 includes a plurality of pixel openings 151; a plurality of isolation openings 122 are correspondingly connected to the plurality of pixel openings 151.

[0069] The pixel limiting layer 15 forms a sub-pixel region by enclosing multiple pixel openings 151, which effectively prevents signal interference between adjacent pixels, such as color mixing or brightness penetration, and ensures the purity of displayed colors and image accuracy.

[0070] In the embodiments of this application, based on the display panel 10 described in the above embodiments, a method for manufacturing the display panel 10 is also provided, such as... Figure 3 As shown, the method includes:

[0071] Step 301: Provide a substrate.

[0072] Provide such as Figure 1 The substrate shown serves as the basic framework of the display panel and can provide support for other film layers that are subsequently applied.

[0073] Step 302: An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes.

[0074] See Figure 1 After providing the substrate, an electrode material layer is formed on one side of the substrate. The electrode material layer is then subjected to a first patterning process to form multiple first electrodes, each of which can be the anode in each light-emitting unit. Optionally, a transparent conductive material (such as indium tin oxide, ITO) can be deposited on the substrate surface using vacuum evaporation or sputtering processes to form a uniform electrode material layer. This layer is used to inject holes and form electrical connections with subsequent organic functional layers (such as hole transport layers and light-emitting layers).

[0075] Step 303: A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate; an isolation material layer is formed on the side of the pixel material layer facing away from the substrate; a photoresist material layer is formed on the side of the isolation material layer facing away from the substrate; a second patterning process is performed on the photoresist material layer to form a photoresist layer; a third patterning process is performed on the isolation material layer to form an isolation layer; and a fourth patterning process is performed on the pixel material layer to form a pixel defining layer.

[0076] The isolation layer includes an isolation structure and multiple isolation openings formed by the isolation structure. The isolation structure includes a first film layer and a second film layer stacked together. The orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate. The pixel defining layer includes multiple pixel openings. The multiple pixel openings are correspondingly connected to the multiple isolation openings.

[0077] A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate. The pixel material layer is then subjected to a fourth patterning process to form a pixel defining layer. An isolation material layer is then formed on the side of the pixel material layer facing away from the substrate. The isolation material layer is then subjected to a third patterning process to form an isolation layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The isolation structure includes a first film layer and a second film layer stacked together. The orthographic projection of the first film layer onto the substrate lies within the orthographic projection of the second film layer onto the substrate. The first film layer is close to the pixel defining layer, and the second film layer is on the side of the first film layer facing away from the substrate.

[0078] A photoresist material layer is formed on the side of the isolation material layer facing away from the substrate, wherein the photoresist can be a positive photoresist material. The photoresist material layer is then subjected to a second patterning process to form a photoresist layer.

[0079] Step 304: A light-emitting material layer is formed on the side of the isolation layer away from the substrate, and an encapsulation material layer is formed on the side of the light-emitting material layer away from the substrate. The encapsulation material layer and the light-emitting material layer are subjected to a fifth patterning process to form an encapsulation layer and multiple light-emitting units.

[0080] The plurality of light-emitting units include at least one first light-emitting unit, at least one second light-emitting unit, and at least one third light-emitting unit, wherein the first, second, and third light-emitting units are used to emit light of different colors; the first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit; the area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer. The colors of each light-emitting unit and each sub-film layer are as described in the above-described display panel embodiment, and will not be repeated here.

[0081] Furthermore, a light-emitting material layer is formed on the side of the isolation layer away from the substrate, and an encapsulation material layer is formed on the side of the light-emitting material layer away from the substrate. The encapsulation material layer and the light-emitting material layer are subjected to a fifth patterning process to form an encapsulation layer and multiple light-emitting units, thereby completing the fabrication of each light-emitting unit on the display panel.

[0082] The above-described method for fabricating a display panel involves multiple patterning processes to obtain multiple light-emitting units. Simultaneously, the first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit. The area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer. Therefore, after wet etching processes at different frequencies, the areas enclosed by the first, second, and third sub-film layers can be made approximately the same, thereby ensuring the success rate of cathode bonding for each light-emitting unit and improving the yield of the display panel.

[0083] In an optional embodiment of this application, the photoresist layer includes at least one first photolithographic region, at least one second photolithographic region, and at least one third photolithographic region. The light transmittance of the first photolithographic region is greater than that of the second photolithographic region, and the light transmittance of the second photolithographic region is greater than that of the third photolithographic region. The first photolithographic region corresponds to the first light-emitting unit, the second photolithographic region corresponds to the second light-emitting unit, and the third photolithographic region corresponds to the third light-emitting unit.

[0084] Optionally, the first photolithography region corresponds to the first light-emitting unit, i.e., the first photolithography region is located on the side of the first light-emitting unit facing away from the substrate; the second photolithography region corresponds to the second light-emitting unit, i.e., the second photolithography region is located on the side of the second light-emitting unit facing away from the substrate; and the third photolithography region corresponds to the third light-emitting unit, i.e., the third photolithography region is located on the side of the third light-emitting unit facing away from the substrate. The transmittance of the first photolithography region is greater than that of the second photolithography region, and the transmittance of the second photolithography region is greater than that of the third photolithography region. Since the light transmittance is higher in the region with higher transmittance, less photoresist remains after the VSS photolithography process. Conversely, the light transmittance is even lower in the region with lower transmittance, resulting in a larger thickness of remaining photoresist after the VSS photolithography process. In other words, after the VSS photolithography process, the thickness of the remaining photoresist in the first photolithography region < the thickness of the remaining photoresist in the second photolithography region < the thickness of the remaining photoresist in the third photolithography region.

[0085] For example, such as Figure 4 As shown in Figure A, which is a schematic diagram of the structure of the display panel after VSS film deposition, from left to right, these are the first photolithography area corresponding to the first light-emitting unit, the second photolithography area corresponding to the second light-emitting unit, and the third photolithography area corresponding to the third light-emitting unit. Different photolithography areas are selected with different transmittances, such that the transmittance of the first photolithography area is greater than that of the second photolithography area, and the transmittance of the second photolithography area is greater than that of the third photolithography area. After the VSS photolithography process, the remaining photoresist thickness of the first, second, and third photolithography areas can be as follows: Figure 4 As shown in Figure B, there is no remaining photoresist in the first lithography region, the remaining photoresist in the second lithography region is approximately 0.1 μm, and the remaining photoresist in the third lithography region is approximately 0.2 μm.

[0086] In the embodiments of this application, the step of performing a third patterning process on the isolation material layer to form the isolation layer is as follows: Figure 5 As shown, it includes:

[0087] Step 501: Perform a sixth patterning process on the isolation material layer to form an intermediate isolation material layer.

[0088] Please continue to refer to the following: Figure 4In Figure C, the surface of the side of the intermediate isolation material layer facing away from the pixel material layer includes a first surface, a second surface, a third surface and a fourth surface, the distance between the first surface and the pixel material layer is less than the distance between the second surface and the pixel material layer, and the distance between the second surface and the pixel material layer is less than the distance between the third surface and the pixel material layer.

[0089] The distance between the first surface and the pixel material layer is the remaining thickness a of the first sub-film layer corresponding to the first light-emitting unit, the distance between the second surface and the pixel material layer is the remaining thickness b of the second sub-film layer corresponding to the second light-emitting unit, and the distance between the second surface and the pixel material layer is the remaining thickness c of the third sub-film layer corresponding to the third light-emitting unit. Since after the yellow light process, the thickness of the remaining photoresist in the first photolithography region < the thickness of the remaining photoresist in the second photolithography region < the thickness of the remaining photoresist in the third photolithography region, therefore, after the VSS dry etching process, the remaining thickness a of the first sub-film layer corresponding to the first light-emitting unit < the remaining thickness b of the second sub-film layer corresponding to the second light-emitting unit < the remaining thickness c of the third sub-film layer corresponding to the third light-emitting unit.

[0090] Step 502: performing a third patterning process on the intermediate isolation material layer to form an isolation layer.

[0091] Optionally, after the above process, a VSS wet etching process is performed. Since a < b < c, after wet etching, the length of the SA corresponding to the first light-emitting unit > the length of the SA corresponding to the second light-emitting unit > the length of the SA corresponding to the third light-emitting unit, as shown in Figure 4 Figure D. A pixel region opening is performed to obtain the structure as shown in Figure 4 Figure E. At this time, three VEE processes can be continued. It can be known from the above embodiments that after the three VEE processes, the lengths of the SA corresponding to the first light-emitting unit, the second light-emitting unit and the third light-emitting unit can be ensured to be the same or approximately the same.

[0092] In an embodiment, the above method for manufacturing a display panel further includes: determining the light transmittance of the first photolithography region, the second photolithography region and the third photolithography region according to the manufacturing sequence of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit.

[0093] Because the later the light-emitting unit is fabricated, the more likely the first layer of the isolation layer will be etched laterally as the VEE process frequency increases, thus affecting the bonding success rate between the second electrode and the first layer of the light-emitting unit. Therefore, to improve the bonding success rate between the second electrode and the first layer of the light-emitting unit, the transmittance of the later-fabricated light-emitting unit needs to be lower. This results in a shorter SA (Alternating Shortness) for the later-fabricated light-emitting units after VSS wet etching. This ensures that the SA of the three light-emitting units is consistent, i.e., identical or nearly identical, during subsequent VEE processes. This guarantees the bonding success rate between the second electrode and the first layer of the three light-emitting units, ensuring the yield rate of the display panel.

[0094] In the embodiments of this application, the thickness of the encapsulation structure on the sidewall of the first sub-film layer, the thickness of the encapsulation structure on the sidewall of the second sub-film layer, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer are the same.

[0095] It should be understood that the thickness of the encapsulation structure on the sidewall of the first sub-film layer, the thickness of the encapsulation structure on the sidewall of the second sub-film layer, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer are equal or approximately equal. That is, the sidewall encapsulation effect of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit is comparable, and the encapsulation performance is better.

[0096] Furthermore, the solution to the problem provided by this display panel manufacturing method is similar to the solution described in the above-mentioned display panel. Therefore, the specific limitations in one or more embodiments can be found in the above-mentioned limitations of the display panel, and will not be repeated here.

[0097] In embodiments of this application, a display device is also provided, which includes the display panel 10 described in any of the foregoing embodiments. The display device can be an electronic paper device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, smart bracelet, smartwatch, supercomputer, navigator, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, clock, calculator, television monitor, computer monitor, automotive display (e.g., odometer display), cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic billboard or sign, projector, or other mobile or fixed terminal.

[0098] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0099] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0100] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings enclosed by the isolation structure; the isolation structure includes a first film layer and a second film layer stacked together, wherein the orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate; Multiple light-emitting units are disposed on one side of the substrate; each light-emitting unit includes a first electrode, a light-emitting structure, and a second electrode stacked together; the multiple light-emitting units include at least one first light-emitting unit, at least one second light-emitting unit, and at least one third light-emitting unit, wherein the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are used to emit light of different colors; the first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit; the area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer; Multiple encapsulation structures are provided on the side of the corresponding light-emitting unit away from the substrate.

2. The display panel according to claim 1, characterized in that, A portion of the encapsulation structure is disposed on the sidewall of the isolation structure, including: Optionally, the thickness of the encapsulation structure disposed on the sidewall of the first sub-film layer is less than the thickness of the encapsulation structure disposed on the side of the first light-emitting unit away from the substrate, the thickness of the encapsulation structure disposed on the sidewall of the second sub-film layer is less than the thickness of the encapsulation structure disposed on the side of the second light-emitting unit away from the substrate, and the thickness of the encapsulation structure disposed on the sidewall of the third sub-film layer is less than the thickness of the encapsulation structure disposed on the side of the third light-emitting unit away from the substrate. Optionally, the thickness of the encapsulation structure on the sidewall of the first sub-film layer, the thickness of the encapsulation structure on the sidewall of the second sub-film layer, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer are the same.

3. The display panel according to claim 1 or 2, characterized in that, The second electrode in the first light-emitting unit is electrically connected to the first sub-film layer, the second electrode in the second light-emitting unit is electrically connected to the second sub-film layer, and the second electrode in the third light-emitting unit is electrically connected to the third sub-film layer.

4. The display panel according to claim 1 or 2, characterized in that, The display panel also includes: A pixel defining layer is disposed on one side of the substrate, and the pixel defining layer includes a plurality of pixel openings; the plurality of isolation openings are correspondingly connected to the plurality of pixel openings.

5. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes; A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate. An isolation material layer is formed on the side of the pixel material layer facing away from the substrate. A photoresist material layer is formed on the side of the isolation material layer facing away from the substrate. The photoresist material layer is subjected to a second patterning process to form a photoresist layer. The isolation material layer is subjected to a third patterning process to form an isolation layer. The pixel material layer is subjected to a fourth patterning process to form a pixel defining layer. The isolation layer includes an isolation structure and a plurality of isolation openings formed by the isolation structure. The isolation structure includes a first film layer and a second film layer stacked together. The orthographic projection of the first film layer on the substrate is located within the orthographic projection of the second film layer on the substrate. The pixel defining layer includes a plurality of pixel openings. The plurality of pixel openings are correspondingly connected to the plurality of isolation openings. A light-emitting material layer is formed on the side of the isolation layer opposite to the substrate, and an encapsulation material layer is formed on the side of the light-emitting material layer opposite to the substrate. The encapsulation material layer and the light-emitting material layer are subjected to a fifth patterning process to form an encapsulation layer and a plurality of light-emitting units. The plurality of light-emitting units include at least one first light-emitting unit, at least one second light-emitting unit, and at least one third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are used to emit light of different colors. The first film layer includes a first sub-film layer corresponding to the first light-emitting unit, a second sub-film layer corresponding to the second light-emitting unit, and a third sub-film layer corresponding to the third light-emitting unit. The area enclosed by the first sub-film layer is smaller than the area enclosed by the second sub-film layer, and the area enclosed by the second sub-film layer is smaller than the area enclosed by the third sub-film layer.

6. The method for manufacturing a display panel according to claim 5, characterized in that, The photoresist layer includes at least one first photolithographic region, at least one second photolithographic region, and at least one third photolithographic region. The light transmittance of the first photolithographic region is greater than that of the second photolithographic region, and the light transmittance of the second photolithographic region is greater than that of the third photolithographic region. The first photolithographic region corresponds to the first light-emitting unit, the second photolithographic region corresponds to the second light-emitting unit, and the third photolithographic region corresponds to the third light-emitting unit.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The method further includes: The transmittance of the first photolithography region, the second photolithography region, and the third photolithography region is determined according to the fabrication order of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit.

8. The method for manufacturing a display panel according to claim 5, characterized in that, The third patterning process of the insulating material layer to form the insulating layer includes: The isolation material layer is subjected to a sixth patterning process to form an intermediate isolation material layer; the surface of the intermediate isolation material layer facing away from the pixel material layer includes a first surface, a second surface, a third surface and a fourth surface, the distance between the first surface and the pixel material layer is less than the distance between the second surface and the pixel material layer, and the distance between the second surface and the pixel material layer is less than the distance between the third surface and the pixel material layer; The intermediate isolation material layer is subjected to the third patterning process to form an isolation layer.

9. The method for manufacturing a display panel according to claim 5, characterized in that, The thickness of the encapsulation structure on the sidewall of the first sub-film layer, the thickness of the encapsulation structure on the sidewall of the second sub-film layer, and the thickness of the encapsulation structure on the sidewall of the third sub-film layer are the same.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-4.

Images