Display panel and manufacturing method thereof

Abstract

The application discloses a display panel, comprising: a substrate; a first encapsulation layer arranged on one side of the substrate, the first encapsulation layer comprising a first silicon oxide film layer, a second silicon oxide film layer and a fluorine-containing silane microcapsule coating layer, the first silicon oxide film layer being of a porous structure, the second silicon oxide film layer being of a non-porous structure, the fluorine-containing silane microcapsule coating layer being arranged between the first silicon oxide film layer and the second silicon oxide film layer, the first silicon oxide film layer being arranged on the side of the fluorine-containing silane microcapsule coating layer close to the substrate, and the second silicon oxide film layer being arranged on the side of the fluorine-containing silane microcapsule coating layer away from the substrate; a second encapsulation layer arranged on the side of the first encapsulation layer away from the substrate, the second encapsulation layer being a polytetrafluoroethylene film layer; an organic layer arranged on the side of the second encapsulation layer away from the first encapsulation layer, the organic layer being polymethyl methacrylate; and a third encapsulation layer arranged on the side of the organic layer away from the second encapsulation layer, the third encapsulation layer being a third silicon oxide film layer.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a display panel and its manufacturing method. Background Technology

[0002] OLED (Organic Light-Emitting Diode) materials are extremely sensitive to moisture and oxygen. Exposure to air can cause severe failure of OLED display panels, resulting in black spots and shortened lifespan. Therefore, improving the encapsulation performance of OLED materials is crucial for extending the lifespan of OLED display panels.

[0003] Currently, OLED display panels primarily use thin-film encapsulation achieved through chemical vapor deposition to obtain an inorganic encapsulation layer, followed by inkjet printing to create an organic encapsulation layer. The organic ink used in inkjet printing contains moisture, and leakage from the organic encapsulation layer can damage the OLED display panel. Therefore, the integrity of the encapsulation layer in OLED display panels is crucial. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide a display panel and a method for manufacturing the same.

[0005] In one aspect, the present invention provides a display panel, comprising:

[0006] substrate;

[0007] A first encapsulation layer is disposed on one side of the substrate. The first encapsulation layer includes a first silicon oxide film layer, a second silicon oxide film layer, and a fluorinated silane microcapsule coating. The first silicon oxide film layer has a porous structure, the second silicon oxide film layer has a non-porous structure, and the fluorinated silane microcapsule coating is located between the first silicon oxide film layer and the second silicon oxide film layer. The first silicon oxide film layer is located on the side of the fluorinated silane microcapsule coating closer to the substrate, and the second silicon oxide film layer is located on the side of the fluorinated silane microcapsule coating away from the substrate.

[0008] The second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate, and the second encapsulation layer is a polytetrafluoroethylene film layer;

[0009] An organic layer is disposed on the side of the second encapsulation layer away from the first encapsulation layer, and the organic layer is polymethyl methacrylate;

[0010] The third encapsulation layer is disposed on the side of the organic layer away from the second encapsulation layer, and the third encapsulation layer is a third silicon oxide film layer.

[0011] As a further improvement of the present invention, the substrate includes a planar region and a bending region, and the projection of the fluorinated silane microcapsule coating on the substrate is located within the bending region.

[0012] As a further improvement of the present invention, the porosity of the first silicon oxide film is less than 30%, and the pore size of the pores on the first silicon oxide film is 50nm-100nm.

[0013] As a further improvement of the present invention, the polytetrafluoroethylene film layer includes a first surface and a second surface, both the first surface and the second surface are provided with a plurality of protrusions, and the plurality of protrusions on the first surface and the plurality of protrusions on the second surface are arranged alternately.

[0014] As a further improvement of the present invention, the thickness of the first silicon oxide film is 100nm-300nm.

[0015] On the other hand, the present invention provides a method for manufacturing a display panel, comprising:

[0016] Provide substrate;

[0017] A first silicon oxide film layer is deposited on the surface of the substrate by chemical vapor deposition, wherein the first silicon oxide film layer has a porous structure.

[0018] A fluorinated silane microcapsule coating is formed by impregnation on the surface of the first silicon oxide film layer;

[0019] A second silicon oxide film layer is deposited on the fluorine-containing silane microcapsule coating by chemical vapor deposition, and the second silicon oxide film layer has a non-porous structure.

[0020] A polytetrafluoroethylene film is deposited on the second silicon oxide film by chemical vapor deposition;

[0021] An organic layer is formed on the polytetrafluoroethylene film by inkjet printing;

[0022] A third silicon oxide film layer is deposited on the organic layer by chemical vapor deposition.

[0023] As a further improvement of the present invention, the step of forming a fluorinated silane microcapsule coating by impregnation on the surface of the first silicon oxide film layer includes:

[0024] Preparation of fluorinated silane microcapsules;

[0025] The fluorinated silane microcapsules were mixed with an ethanol solution and a surfactant, and then subjected to ultrasonic treatment to obtain a uniform suspension.

[0026] The suspension and the substrate on which the first silicon oxide film layer has been deposited are placed in a vacuum chamber, so that the suspension penetrates into the pores of the first silicon oxide film layer;

[0027] The suspension within the pores is dried and solidified under test and standard atmospheric pressure to form the fluorinated silane microcapsule coating.

[0028] As a further improvement of the present invention, the preparation of fluorinated silane microcapsules includes:

[0029] A fluorinated silane precursor and a hydrophobic substance are dissolved in an organic solvent to obtain an oil phase solution, and the oil phase solution is added to an emulsifier to obtain an emulsion.

[0030] The capsule wall reactant and the emulsion are mixed to obtain a mixed solution. The mixed solution is heated to 50-60°C and stirred to induce a cross-linking reaction.

[0031] The residual emulsifier was removed by centrifugal washing to obtain the fluorinated silane microcapsules.

[0032] The beneficial effects of this invention are as follows: by adding a second encapsulation film layer to the encapsulation film layer of the display panel, moisture intrusion into the display panel is effectively prevented; at the same time, by setting a fluorinated silane microcapsule coating in the first encapsulation film layer, cracks in the first encapsulation film layer can be repaired in time, fundamentally solving the problem of moisture intrusion into the display panel and effectively improving the service life of the display panel. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of an exemplary display panel of the present invention;

[0035] Figure 2 for Figure 1 An exemplary cross-sectional view along the AA direction;

[0036] Figure 3 for Figure 1 Another exemplary cross-sectional view along the AA direction;

[0037] Figure 4 This is a flowchart of an exemplary method for manufacturing a display panel according to the present invention;

[0038] Figure 5 This is a flowchart of an exemplary method for preparing a fluorinated silane microcapsule coating according to the present invention;

[0039] Figure 6 This is a flowchart of an exemplary method for preparing fluorinated silane microcapsules according to the present invention.

[0040] In the picture,

[0041] 10. Substrate; 20. First encapsulation layer; 21. First silicon oxide film layer; 22. Fluorosilane microcapsule coating; 23. Second silicon oxide film layer; 30. Second encapsulation layer; 31. Protrusion; 40. Organic layer; 50. Third encapsulation layer. Detailed Implementation

[0042] In related technologies, approximately 95% of the moisture failures in the encapsulation film layers of OLED display panels originate from the moisture in the organic ink material within the organic encapsulation film layer. This is a failure mode caused by internal moisture intrusion.

[0043] In existing technologies, multiple layers of organic and inorganic thin films are formed on both sides of the organic encapsulation layer through chemical vapor deposition to improve the waterproof performance of the encapsulation layer. In particular, the organic thin films are often made of materials with good hydrophobic properties, which further improves the waterproof performance of the encapsulation layer. However, this method may have a more significant effect on display panels that do not require bending or rolling, but the effect is less than satisfactory for flexible display panels that do require bending or rolling.

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0046] Furthermore, the terminology used in the description of this invention is for illustrative purposes only and is not intended to limit the scope of the invention. The terms "comprising" and / or "including" are used to specify the presence of said elements, steps, operations, and / or components, but do not exclude the presence or addition of one or more other elements, steps, operations, and / or components. The terms "first," "second," etc., may be used to describe various elements, do not represent an order, and do not limit these elements. Moreover, in the description of this invention, unless otherwise stated, "a plurality of" means two or more. These terms are used only to distinguish one element from another. These and / or other aspects become apparent in conjunction with the following drawings, and those skilled in the art will more readily understand the description of the embodiments of the invention. The drawings are used for illustrative purposes only to depict the embodiments of the invention. Those skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods shown in the invention can be employed without departing from the principles of the invention.

[0047] For ease of understanding, in the attached diagram, the X-axis represents the width of the display panel; the Y-axis represents the height of the display panel; and the Z-axis represents the thickness of the display panel, which is also the overlapping direction of the encapsulation film layers.

[0048] like Figure 1 , Figure 2 and Figure 3 As shown in the figure, a display panel according to an embodiment of the present invention includes a substrate 10, a first encapsulation layer 20, a second encapsulation layer 30, an organic layer 40, and a third encapsulation layer 50, which are sequentially stacked along the thickness direction of the display panel. Wherein:

[0049] The first encapsulation layer 20 is disposed on one side of the substrate 10, for example, the first encapsulation layer 20 is disposed on the upper side of the substrate 10. The first encapsulation layer 20 includes a first silicon oxide film layer 21, a second silicon oxide film layer 23, and a fluorinated silane microcapsule coating 22. The first silicon oxide film layer 22 has a porous structure, the second silicon oxide film layer 23 has a non-porous structure, the fluorinated silane microcapsule coating 22 is located between the first silicon oxide film layer 21 and the second silicon oxide film layer 23, and the first silicon oxide film layer 21 is located on the side of the fluorinated silane microcapsule coating 22 closer to the substrate 10, and the second silicon oxide film layer 23 is located on the side of the fluorinated silane microcapsule coating 22 away from the substrate 10.

[0050] Understandably, along the direction away from the substrate 10, the first silicon oxide film layer 21, the fluorinated silane microcapsule coating 22, and the second silicon oxide film layer 23 are sequentially stacked. The first silicon oxide film layer 21 has a porous structure. The fluorinated silane microcapsule coating 22 is impregnated into the pores of the first silicon oxide film layer 21. After the fluorinated silane microcapsule coating 22 cures, a dense second silicon oxide film layer 23 is deposited on top of the fluorinated silane microcapsule coating 22 using chemical vapor deposition. Thus, the second silicon oxide film layer 23 effectively seals the pores in the first silicon oxide film layer 21. Consequently, the first encapsulation layer 20 formed by the first silicon oxide film layer 21, the fluorinated silane microcapsule coating 22, and the second silicon oxide film layer 23 also has good density and can achieve a good waterproof effect. Simultaneously, a fluorinated silane microcapsule coating 22 is disposed between the first silicon oxide film layer 21 and the second silicon oxide film layer 23. When a crack appears in the first encapsulation layer 20, the fluorinated silane microcapsules in the fluorinated silane microcapsule coating 22 will rupture under the bending or rolling action of the display panel. The fluorinated silane microcapsules will self-repair the cracked area of ​​the first encapsulation layer 20 through their repair function, restoring the first encapsulation layer 20 to its intact state. In this way, even for flexible display panels that need to be bent or rolled, it can have a good waterproof effect.

[0051] The porosity of the first silicon oxide film layer 21 is less than 30%, and the pore size of the pores on the first silicon oxide film layer is 50nm-100nm.

[0052] For example, the porosity of the first silicon oxide film layer 21 may be 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, or 28%. Porosity within these ranges ensures, on the one hand, that there is a sufficiently large porosity to accommodate a sufficient amount of fluorinated silane microcapsules to adequately repair cracks appearing in the first encapsulation layer 20; on the other hand, it also avoids excessive pores on the first silicon oxide film layer 21, which could affect the hydrophobic properties of the first encapsulation layer 20.

[0053] For example, the pore sizes on the first silicon oxide film layer 21 are 55nm, 60nm, 65nm, 70nm, 75nm, 80nm, 85nm, 90nm, or 95nm. Pore sizes within the above ranges allow fluorosilane microcapsules to easily enter the pores; on the other hand, they limit the size of the fluorosilane microcapsules to an appropriate range, ensuring that the bending or rolling forces of the display panel can break them, thus repairing cracks appearing on the first encapsulation layer 20.

[0054] In use, the porosity and pore size of the first silicon oxide film 21 can be adjusted adaptively according to the situation. For example, when the size of the first silicon oxide film 21 is large, the porosity and pore size can be appropriately increased; when the size of the first silicon oxide film 21 is relatively small, the porosity and pore size can be appropriately reduced.

[0055] Furthermore, the thickness of the first silicon oxide film 21 is 100nm-300nm. For example, the thickness of the first silicon oxide film 21 can be 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm, 220nm, 250nm, 260nm, or 280nm. A first silicon oxide film 21 satisfying the above thickness range ensures that, on the one hand, the thickness of the first silicon oxide film 21 is not too large, making it unable to rupture the fluorinated silane microcapsules under bending or rolling forces; on the other hand, the thickness of the first silicon oxide film 21 is not too small, making it unable to form effective pores to accommodate the fluorinated silane microcapsules. In use, the thickness of the first silicon oxide film 21 can be adaptively selected, and is not limited to the thicknesses listed above.

[0056] The fluorinated silane microcapsule coating 22 can be understood, for example, as being formed through fluorinated silane microcapsules within the pores of the first silica film layer 21. The fluorinated silane microcapsules achieve self-repair of cracks through their hydrophobicity, stability, and reactivity. The fluorinated silane microcapsules include, for example, a core and a wall. The core is primarily a self-healing material, such as a fluorinated silane monomer and / or fluorosiloxane oligomer, which can form a hydrophobic siloxane network through hydrolysis-condensation reactions to repair cracks. The wall protects the core from humidity and / or mechanical stress, rupturing only when the first encapsulation layer 20 is damaged to release the repair agent within the core. The main material of the wall can be a polymer wall material or an inorganic wall material. The polymer wall material can be, for example, a resin-based wall material or a polyethylene-based wall material; the inorganic wall material can be, for example, silica and / or layered double hydroxides. The material of the first encapsulation layer 20 can be selected adaptively during use, and this application does not impose specific limitations on it.

[0057] Specifically, forming a fluorinated silane microcapsule coating 22 by impregnation on the surface of the first silicon oxide film layer 21 includes:

[0058] To prepare fluorinated silane microcapsules, a fluorinated silane precursor and a hydrophobic substance are dissolved in an organic solvent to obtain an oil phase solution. This oil phase solution is then added to an emulsifier to obtain an emulsion. The fluorinated silane precursor can be, for example, perfluorooctyltriethoxysilane or heptadecafluorodecyltrimethoxysilane; the hydrophobic substance can be, for example, polytetrafluoroethylene; the organic solvent can be, for example, dichloromethane or ethyl acetate; and the emulsifier can be, for example, a nonionic surfactant or a fluorocarbon surfactant. For instance, the fluorinated silane, polytetrafluoroethylene, and dichloromethane can be mixed to obtain an oil phase solution, which is then added to the emulsifier. The mixture is stirred at 10,000-20,000 rpm to obtain a homogeneous emulsion.

[0059] Next, the capsule wall reactant and emulsion are mixed to obtain a mixed solution. The mixed solution is heated to 50-60℃ and stirred to induce a cross-linking reaction. The capsule wall reactant can be organic wall materials such as resin-based wall materials and polyethylene, or inorganic wall materials such as silica and / or layered double hydroxides. While stirring at 200-500 rpm, the mixed solution is heated to 50-60℃, causing the silane to hydrolyze at the oil-water interface to generate Si-OH, which then condenses to form a cross-linked capsule wall. Stirring continues for 6-24 hours to allow the organic solvent to evaporate and the fluorinated silane microcapsules to solidify.

[0060] Finally, residual emulsifiers are removed by centrifugation and washing to obtain fluorinated silane microcapsules. For example, centrifugation at 3000-5000 rpm for 5 minutes, followed by washing three times with deionized water or ethanol, can remove residual emulsifiers and thus obtain pure fluorinated silane microcapsules.

[0061] Fluorosilane microcapsules are mixed with ethanol solution and surfactant, and then subjected to ultrasonic treatment to obtain a uniform suspension. The suspension and the substrate 10 with the first silicon oxide film layer 21 deposited are placed in a vacuum chamber, so that the suspension penetrates into the pores of the first silicon oxide film layer 21.

[0062] The pressure within the vacuum chamber can be maintained at, for example, 10⁻² Pa for 15 minutes, allowing the suspension to fully penetrate the pores of the first silica film layer 21. The pressure is then restored to standard atmospheric pressure. The impregnation time should not exceed 30 minutes to prevent the fluorinated silane microcapsules from rupturing due to the vacuum process. Maintaining the temperature at room temperature prevents excessive heat from softening the capsule walls of the fluorinated silane microcapsules.

[0063] The suspension within the pores is dried and cured at room temperature and standard atmospheric pressure to form a fluorinated silane microcapsule coating 22. For example, it can be air-dried at room temperature for 12 hours to slowly evaporate the organic solvent, reducing the risk of stress cracking of the fluorinated silane microcapsules.

[0064] The second silicon oxide film layer 23 has a non-porous structure, meaning it is a dense silicon oxide film layer. Its main function is to seal the openings of the pores in the first silicon oxide film layer 21. On one hand, it provides some protection to the fluorinated silane microcapsules within the pores, preventing them from rupturing due to bending or curling. On the other hand, it ensures the density of the first encapsulation layer 20, preventing moisture from entering the substrate 10 from the first encapsulation layer 20 and causing display panel failure.

[0065] See also Figure 2 or Figure 3 The second encapsulation layer 30 is disposed on the side of the first encapsulation layer 20 away from the substrate 10, and the second encapsulation layer 30 is a polytetrafluoroethylene (PTFE) film layer. That is, the second encapsulation layer 30 is located above the first encapsulation layer 20, specifically, the second encapsulation layer 30 is located above the second silicon oxide film layer 23. The third encapsulation layer is made of PTFE, for example, a PTFE film layer can be formed on the upper side of the second silicon oxide film layer 23 by chemical vapor deposition. PTFE has extremely high hydrophobic properties, and its contact angle can be as high as 160°, thereby effectively preventing moisture intrusion and preventing display panel failure.

[0066] Furthermore, the polytetrafluoroethylene (PTFE) film layer includes a first surface and a second surface, both of which are provided with a plurality of protrusions 31. The first surface is, for example, the surface close to the second silicon oxide film layer 23, and the second surface is, for example, the surface away from the second silicon oxide film layer 23. The radial dimensions of the plurality of protrusions 31 can be, for example, set to nanometer size, so that the plurality of nanometer-sized protrusions 31 can further improve the hydrophobic properties of the PTFE film layer and prevent moisture from penetrating into the display panel.

[0067] Preferably, multiple protrusions 31 are uniformly arranged on the first and second surfaces, and the polytetrafluoroethylene (PTFE) film can be stably connected to its adjacent film layers through the multiple protrusions 31 on the first and second surfaces, respectively. For example, the multiple protrusions 31 on the first surface can be "embedded" in the second silicon oxide film layer 23; the multiple protrusions on the second surface can be "embedded" in the organic layer 40. This not only improves the stability between the PTFE film layer and its adjacent film layers above and below, but also extends the invasion path of moisture into the substrate 10, hindering the invasion of moisture to a certain extent and improving the moisture barrier effect.

[0068] Furthermore, the multiple protrusions 31 on the first surface and the multiple protrusions 31 on the second surface are arranged alternately. This can extend the invasion path at various locations of the polytetrafluoroethylene film layer, so that the protrusions 31 can effectively block water vapor no matter where it invades.

[0069] Optionally, the specific structure of the protrusion 31 can be hemispherical, triangular, or square, or it can be set to other regular or irregular shapes. The key is to extend the water vapor intrusion path and improve the stability between the polytetrafluoroethylene membrane layer and adjacent membrane layers. This application does not impose any special limitations on this.

[0070] like Figure 2 or Figure 3 As shown, the organic layer 40 is disposed on the side of the second encapsulation layer 30 away from the first encapsulation layer 20, and the organic layer 40 is polymethyl methacrylate. That is, the organic layer 40 is located on the upper side of the second encapsulation layer 30. The organic layer 40 can be printed on the upper side of the second encapsulation layer by inkjet printing, for example, to serve as the light-emitting layer of the display panel and a key part of charge transport.

[0071] The third encapsulation layer 50 is disposed on the side of the organic layer 40 away from the second encapsulation layer 30, and the third encapsulation layer 50 is a third silicon oxide film layer. For example, the third encapsulation layer 50 is disposed on the upper side of the organic layer 40, or the third silicon oxide film layer can be deposited on the surface of the organic layer 40 by formation deposition. The third silicon oxide film layer is the same as the second silicon oxide film layer 23, both of which are non-porous structures. That is to say, a dense silicon oxide film layer is formed on the surface of the organic layer 40, thereby better encapsulating the display panel.

[0072] Preferably, the number of third silicon oxide film layers can be set to multiple to improve the encapsulation effect of the display panel. Simultaneously, the surface of the third silicon oxide film layer can be modified by physical or chemical methods to improve its waterproof or hydrophobic properties. Specifically, physical methods such as laser processing can be used to construct micro-nano rough structures on the surface of the third silicon oxide film layer to improve its hydrophobic properties; alternatively, chemical methods such as silanization can be used to form a hydrophobic molecular layer on the surface of the third silicon oxide film layer to improve its hydrophobic properties. The appropriate method can be selected based on a comprehensive consideration of cost or waterproofing requirements; this application does not impose specific limitations on this approach.

[0073] In one optional embodiment, the substrate 10 includes a planar region and a bending region, with the projection of the fluorinated silane microcapsule coating 22 onto the substrate 10 located within the bending region. It is understood that the substrate 10 is the substrate in a flexible display panel, where the planar region of the substrate 10 is the main display area and does not deform; while the bending region of the substrate 10 requires bending, flexing, or rolling to change the shape of the display panel. When the bending region of the substrate 10 undergoes multiple bends or rolls, cracks can easily appear during bending. By positioning the projection of the fluorinated silane microcapsule coating 22 onto the substrate 10 within the bending region, the fluorinated silane microcapsules can provide targeted repair for the cracks. When a crack occurs, the first silicon oxide film layer 21 at the corresponding location of the crack will squeeze the fluorinated silane microcapsules in the fluorinated silane microcapsule coating 22 under the stress of the crack, causing the capsule wall to rupture. At this time, the self-healing material of the core is exposed, and the crack is repaired in time through hydrolysis-condensation reaction to prevent moisture from entering the substrate 10 from the crack and causing the display panel to fail.

[0074] Figure 4 This is a flowchart illustrating an exemplary method for manufacturing a display panel according to the present invention, such as... Figure 4 As shown in the embodiment of the present invention, a method for manufacturing a display panel includes:

[0075] A substrate 10 is provided, which is, for example, a flexible substrate having a planar region and a bending region. Before depositing the first silicon oxide film layer 21, the substrate 10 can be cleaned to remove dust or impurities from its surface. This improves the deposition effect of the first silicon oxide film layer 21 and prevents bubbles from forming on the surface of the substrate 10, which could affect the display effect.

[0076] A first silicon oxide film 21 is deposited on the surface of the substrate 10 by chemical vapor deposition. The first silicon oxide film 21 has a porous structure. The chemical vapor deposition method used for the first silicon oxide film 21 can be, for example, low-pressure chemical vapor deposition (LPCVD) or plasma-enhanced chemical vapor deposition (PECVD). After forming the silicon oxide film on the surface of the substrate 10, a porous structure is obtained on the surface of the silicon oxide film by in-situ pore formation or chemical etching.

[0077] Specifically, when depositing the first silicon oxide film 21 by chemical vapor deposition, the silicon source can be selected from silane and / or silicon tetrachloride, and the oxidant can be oxygen or plasma-activated oxygen. If low-pressure chemical vapor deposition is used to prepare the silicon oxide film, the temperature can be set in the range of 600℃-800℃; if plasma-enhanced chemical vapor deposition is used, the temperature can be set in the range of 200℃-400℃. During the deposition process, the specific chemical vapor deposition method can be selected according to the specific requirements of the first silicon oxide film 21, and this application does not impose specific limitations on it.

[0078] For porous structures: If an in-situ pore-forming method is used to obtain a porous structure, a pore-forming agent can be mixed in during the deposition of the first silicon oxide film 21. After the first silicon oxide film 21 is deposited, organic matter can be removed by annealing or other methods, thereby forming a porous structure on the surface of the first silicon oxide film 21. If a porous structure is obtained by chemical etching, a dense first silicon oxide film 21 can be deposited first, and then some of the silicon dioxide on the first silicon oxide film 21 can be selectively dissolved by an acidic solution such as dilute hydrofluoric acid, thereby forming a porous structure on the surface of the first silicon oxide film 21. In use, a suitable method for forming a porous structure can be selected according to the processing conditions; this application does not impose specific limitations on it.

[0079] A fluorinated silane microcapsule coating 22 is formed by impregnation on the surface of a first silica film 21. Specifically, before impregnation, the first silica film 21 needs to be pretreated. For example, it can be ultrasonically cleaned with acetone, ethanol, and deionized water for 15 minutes in sequence to remove dust or contaminants from its surface, thereby enhancing its surface adhesion. Then, the first silica film 21 is dried with nitrogen gas until it is completely dry before the fluorinated silane microcapsule impregnation process can begin. The first silica film 21 is vertically immersed in a suspension containing fluorinated silane microcapsules and slowly pulled up at a constant speed of 0.5-1 mm / s, using capillary action to embed the fluorinated silane microcapsules into the pores of the first silica film 21. The fluorinated silane microcapsule coating 22 is then obtained through post-treatment such as curing and drying.

[0080] A second silicon oxide film 23 is deposited on the fluorinated silane microcapsule coating 22 by chemical vapor deposition. The second silicon oxide film 23 has a non-porous structure. The second silicon oxide film 23 can also be deposited by the same deposition method as the first silicon oxide film 21. For example, the second silicon oxide film 23 can be deposited by low-pressure chemical vapor deposition (LPCVD) or plasma-enhanced chemical vapor deposition (PECVD).

[0081] Specifically, when depositing the second silicon oxide film 23 on the surface of the fluorinated silane microcapsule coating 22 via chemical vapor deposition, the silicon source can be selected from silanes and / or silicon tetrachloride, and the oxidant can be oxygen or plasma-activated oxygen. If low-pressure chemical vapor deposition is used to prepare the second silicon oxide film 23, the temperature can be set in the range of 600℃-800℃. If plasma-enhanced chemical vapor deposition is used, the temperature can be set in the range of 200℃-400℃. However, considering the stability of the fluorinated silane microcapsules, plasma-enhanced chemical vapor deposition should be used whenever possible to prepare the second silicon oxide film 23. On the one hand, this ensures that the fluorinated silane microcapsules will not decompose due to excessively high temperatures during the deposition process; on the other hand, it also results in a more compact second silicon oxide film 23.

[0082] A polytetrafluoroethylene (PTFE) film is deposited on the second silicon oxide film 23 by chemical vapor deposition. The PTFE film can be deposited, for example, by plasma-enhanced chemical vapor deposition. For example, the second silicon oxide film 23 needs to be pretreated before deposition. Carbon tetrafluoride can be used as a precursor, and argon as an assist gas. The deposition temperature is set in the range of 80°C-120°C, and the radio frequency is set between 13-15 MHz. The PTFE film is then obtained through post-treatment such as fluorination.

[0083] An organic layer 40 is formed on a polytetrafluoroethylene (PTFE) film by inkjet printing. The process for forming the organic layer 40 by inkjet printing can utilize existing inkjet printing technologies. For example, a piezoelectric printhead can be used, with a nozzle diameter of 20-50 micrometers, a driving voltage of 20V-30V, a nozzle frequency of 1kHz-10kHz, and a printing temperature of 40℃-50℃. Finally, post-processing such as drying yields the organic layer 40.

[0084] A third silicon oxide film is deposited on the organic layer 40 by chemical vapor deposition. The third silicon oxide film can be deposited using the same deposition method as the first silicon oxide film 21. For example, the third silicon oxide film can be deposited by low-pressure chemical vapor deposition (LPCVD) or plasma-enhanced chemical vapor deposition (PECVD).

[0085] Specifically, when depositing a third silicon oxide film on the surface of the organic layer 40 via chemical vapor deposition, the silicon source can be selected from silanes and / or silicon tetrachloride, and the oxidant can be oxygen or plasma-activated oxygen. If low-pressure chemical vapor deposition is used to prepare the third silicon oxide film, the temperature can be set in the range of 600℃-800℃; if plasma-enhanced chemical vapor deposition is used to prepare the third silicon oxide film, the temperature can be set in the range of 200℃-400℃.

[0086] Preferably, the surface of the third silica film can be further modified using physical or chemical methods to improve its waterproof or hydrophobic properties. Specifically, physical methods such as laser processing can be used to construct micro-nano rough structures on the surface of the third silica film to enhance its hydrophobic properties; alternatively, chemical methods such as silanization can be used to form a hydrophobic molecular layer on the surface of the third silica film to improve its hydrophobic properties. The choice of method can be made based on a combination of factors, including cost and waterproofing requirements; this application does not impose specific limitations on these methods.

[0087] In one alternative implementation, such as Figure 5 and Figure 6 As shown, a fluorinated silane microcapsule coating 22 is formed by impregnation on the surface of the first silicon oxide film layer 21, comprising:

[0088] Preparation of fluorinated silane microcapsules.

[0089] Specifically, a fluorinated silane precursor and a hydrophobic substance are dissolved in an organic solvent to obtain an oil phase solution, which is then added to an emulsifier to obtain an emulsion. The fluorinated silane precursor can be, for example, perfluorooctyltriethoxysilane or heptadecafluorodecyltrimethoxysilane; the hydrophobic substance can be, for example, polytetrafluoroethylene; the organic solvent can be, for example, dichloromethane or ethyl acetate; and the emulsifier can be, for example, a nonionic surfactant or a fluorocarbon surfactant. For instance, a fluorinated silane, polytetrafluoroethylene, and dichloromethane can be mixed to obtain an oil phase solution, which is then added to the emulsifier, and the mixture is stirred at 10,000-20,000 rpm to obtain an emulsion.

[0090] Next, the capsule wall reactant and emulsion are mixed to obtain a mixed solution. The mixed solution is heated to 50-60℃ and stirred to induce a cross-linking reaction. The capsule wall reactant can be organic wall materials such as resin-based wall materials and polyethylene, or inorganic wall materials such as silica and / or layered double hydroxides. While stirring at 200-500 rpm, the mixed solution is heated to 50-60℃, causing the silane to hydrolyze at the oil-water interface to generate Si-OH, which then condenses to form a cross-linked capsule wall. Stirring continues for 6-24 hours to allow the organic solvent to evaporate and the fluorinated silane microcapsules to solidify.

[0091] Finally, residual emulsifiers are removed by centrifugation and washing to obtain fluorinated silane microcapsules. For example, centrifugation at 3000-5000 rpm for 5 minutes, followed by washing three times with deionized water or ethanol, can remove residual emulsifiers and thus obtain pure fluorinated silane microcapsules.

[0092] Fluorosilane microcapsules are mixed with ethanol solution and surfactant, and then subjected to ultrasonic treatment to obtain a uniform suspension. The suspension and the substrate 10 with the first silicon oxide film layer 21 deposited are placed in a vacuum chamber, so that the suspension penetrates into the pores of the first silicon oxide film layer 21.

[0093] The pressure inside the vacuum chamber can, for example, be maintained at 10. -2 The pressure is maintained at 180°C for 15 minutes to allow the suspension to fully penetrate the pores of the first silica film layer 21. Afterward, the pressure is restored to standard atmospheric pressure. The impregnation time should not exceed 30 minutes to prevent the fluorinated silane microcapsules from rupturing due to the vacuum process. Maintaining the temperature at room temperature prevents the capsule walls from softening due to excessive heat.

[0094] The suspension within the pores is dried and cured at room temperature and standard atmospheric pressure to form a fluorinated silane microcapsule coating 22. For example, it can be air-dried at room temperature for 12 hours to slowly evaporate the organic solvent, reducing the risk of stress cracking of the fluorinated silane microcapsules.

[0095] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0096] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are meant to be within the scope of the invention and form different embodiments.

[0097] Those skilled in the art will understand that although the invention has been described with reference to exemplary embodiments, various changes may be made and its elements may be substituted with equivalents without departing from the scope of the invention. Furthermore, many modifications may be made to adapt particular situations or materials to the teachings of the invention without departing from the essential scope of the invention.

Claims

1. A display panel, characterized in that, include: substrate; A first encapsulation layer is disposed on one side of the substrate. The first encapsulation layer includes a first silicon oxide film layer, a second silicon oxide film layer, and a fluorinated silane microcapsule coating. The first silicon oxide film layer has a porous structure, the second silicon oxide film layer has a non-porous structure, and the fluorinated silane microcapsule coating is located between the first silicon oxide film layer and the second silicon oxide film layer. The first silicon oxide film layer is located on the side of the fluorinated silane microcapsule coating closer to the substrate, and the second silicon oxide film layer is located on the side of the fluorinated silane microcapsule coating away from the substrate. The second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate, and the second encapsulation layer is a polytetrafluoroethylene film layer; An organic layer is disposed on the side of the second encapsulation layer away from the first encapsulation layer, and the organic layer is polymethyl methacrylate; The third encapsulation layer is disposed on the side of the organic layer away from the second encapsulation layer, and the third encapsulation layer is a third silicon oxide film layer.

2. The display panel as described in claim 1, characterized in that, The substrate includes a planar region and a bending region, and the projection of the fluorinated silane microcapsule coating on the substrate is located within the bending region.

3. The display panel as described in claim 1, characterized in that, The porosity of the first silicon oxide film is less than 30%, and the pore size on the first silicon oxide film is 50nm-100nm.

4. The display panel as described in claim 1, characterized in that, The polytetrafluoroethylene film layer includes a first surface and a second surface, and both the first surface and the second surface are provided with a plurality of protrusions, and the plurality of protrusions on the first surface and the plurality of protrusions on the second surface are arranged alternately.

5. The display panel as described in claim 1, characterized in that, The thickness of the first silicon oxide film is 100nm-300nm.

6. A method for manufacturing a display panel, characterized in that, include: Provide substrate; A first silicon oxide film layer is deposited on the surface of the substrate by chemical vapor deposition, and the first silicon oxide film layer has a porous structure. A fluorinated silane microcapsule coating is formed by impregnation on the surface of the first silicon oxide film layer; A second silicon oxide film layer is deposited on the fluorine-containing silane microcapsule coating by chemical vapor deposition, and the second silicon oxide film layer has a non-porous structure. A polytetrafluoroethylene film is deposited on the second silicon oxide film by chemical vapor deposition; An organic layer is formed on the polytetrafluoroethylene film by inkjet printing; A third silicon oxide film layer is deposited on the organic layer by chemical vapor deposition.

7. The preparation method according to claim 6, characterized in that, The process of forming a fluorinated silane microcapsule coating by impregnation on the surface of the first silicon oxide film includes: Preparation of fluorinated silane microcapsules; The fluorinated silane microcapsules were mixed with an ethanol solution and a surfactant, and then subjected to ultrasonic treatment to obtain a uniform suspension. The suspension and the substrate on which the first silicon oxide film layer has been deposited are placed in a vacuum chamber, so that the suspension penetrates into the pores of the first silicon oxide film layer; The suspension within the pores is dried and solidified under test and standard atmospheric pressure to form the fluorinated silane microcapsule coating.

8. The preparation method according to claim 7, characterized in that, The preparation of fluorinated silane microcapsules includes: A fluorinated silane precursor and a hydrophobic substance are dissolved in an organic solvent to obtain an oil phase solution, and the oil phase solution is added to an emulsifier to obtain an emulsion. The capsule wall reactant and the emulsion are mixed to obtain a mixed solution. The mixed solution is heated to 50-60°C and stirred to induce a cross-linking reaction. The residual emulsifier was removed by centrifugal washing to obtain the fluorinated silane microcapsules.

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