Method for manufacturing display panel, display panel and display device

Abstract

Embodiments of the present application provide a preparation method of a display panel, a display panel and a display device. The preparation method comprises: forming a flexible screen body, the flexible screen body comprising a metal wire layer and a substrate, a planar layer and an array structure which are sequentially stacked, the substrate comprising a first bottom sublayer and a second bottom sublayer which are sequentially stacked, the metal wire layer being located in the planar layer and corresponding to a bending area; forming a first dam on the planar layer along a peripheral edge of the bending area; applying organic glue to form an organic encapsulation layer on a side of the array structure away from the substrate, and forming a first organic protection layer in a range surrounded by the first dam; pasting a support film on a side of the first bottom sublayer away from the array structure; forming a first opening penetrating through the support film and the first bottom sublayer, the first opening being aligned with two ends of the metal wire layer in the longitudinal direction and two ends of metal tracks in the metal wire layer in the longitudinal direction, and a projection of the first opening on the substrate falling within a projection range of the first dam on the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a method for manufacturing a display panel, a display panel, and a display device. Background Technology

[0002] As users demand a better viewing experience from display products, narrowing the bezels of display screens has become an important way to increase the screen-to-body ratio. Therefore, flexible display panels are commonly used in display products, and narrow bezels are achieved by bending the bending area of ​​the flexible display panel.

[0003] In existing technologies, the display panel's chips and circuit boards are all bonded to the flexible display panel, and are located on the same side of the flexible display panel as the bending area. Currently, in pursuit of extremely narrow bezels for display screens, the radius of the bending area is becoming smaller and smaller, which in turn increases the risk of breakage in the bending area. Summary of the Invention

[0004] In view of the above, embodiments of this application provide a method for manufacturing a display panel, a display panel, and a display device to at least partially solve the above problems.

[0005] According to a first aspect of the embodiments of this application, a method for manufacturing a display panel is provided, the method comprising:

[0006] A flexible screen is formed, comprising a display area, a bending area, and a bonding area distributed sequentially along its longitudinal direction. The flexible screen includes a metal wire layer and a substrate, a planarization layer, and an array structure stacked sequentially. The substrate includes a first bottom layer and a second bottom layer stacked sequentially along one side facing the array structure. The metal wire layer is located in the planarization layer and corresponds to the bending area. The array structure is located in the display area.

[0007] A first dam is formed on the flat layer along the periphery of the bending area, and the first dam and the array structure are located on the same side of the flat layer;

[0008] An organic adhesive is applied to form an organic encapsulation layer on the side of the array structure opposite to the substrate, and a first organic protective layer is formed within the area surrounded by the first dam.

[0009] A support film is attached to the side of the first bottom layer that is opposite to the array structure;

[0010] A first opening is formed through the support film and the first bottom layer, a portion of the surface of the second bottom layer is exposed in the first opening, the two ends of the first opening along the longitudinal direction are aligned with the two ends of the metal traces in the metal wire layer along the longitudinal direction, and the orthographic projection of the first opening on the substrate falls within the orthographic projection range of the first dam on the substrate.

[0011] According to a second aspect of the embodiments of this application, a display panel is provided, the display panel comprising:

[0012] A flexible screen body includes a display area, a bending area, and a bonding area distributed sequentially along its own longitudinal direction. The flexible screen body includes a metal wire layer and a substrate, a planarization layer, and an array structure stacked sequentially. The substrate includes a first bottom layer and a second bottom layer stacked sequentially along one side facing the array structure. The metal wire layer is located in the planarization layer and corresponds to the bending area. The array structure is located in the display area.

[0013] The first dam is set on the flat layer and distributed around the perimeter of the bending area, and the first dam and the array structure are located on the same side of the flat layer;

[0014] The first organic protective layer is located on the flat layer and within the area surrounded by the first dam;

[0015] A support film is attached to the side of the first bottom layer facing away from the array structure; wherein a first opening penetrates the support film and the first bottom layer, a portion of the surface of the second bottom layer is exposed in the first opening, the two ends of the first opening along the longitudinal direction are aligned with the two ends of the metal traces in the metal wire layer along the longitudinal direction, and the orthographic projection of the first opening on the substrate falls within the orthographic projection range of the first dam on the substrate.

[0016] According to a third aspect of the embodiments of this application, a display device is provided, the display device including the display panel described above, or the display panel prepared by the method for preparing the display panel described above.

[0017] According to the solution provided in the embodiments of this application, by setting a first dam in the bending area, the overflow of organic adhesive can be blocked when forming the first organic protective layer, which is conducive to forming a first organic protective layer with uniform thickness in the bending area, thereby making the thickness uniform and the bending stress uniform throughout the bending area, and making it less prone to breakage. Furthermore, since the first opening penetrates the first bottom layer, the strength of the substrate can be reduced, thereby reducing the bending compressive stress of the substrate at the position corresponding to the first opening, especially reducing the bending compressive stress of the second bottom layer, which facilitates bending. The first organic protective layer has good flexibility and can play a supporting and protective role for the flexible screen in the bending area to resist bending tensile stress. Therefore, by setting the first organic protective layer and the first opening on opposite sides of the bending area of ​​the flexible screen, the stress neutral layer can be located on or near the metal wire layer in the planar layer, so that the bending stress on the metal traces in the metal wire layer is small or non-existent, reducing the probability of metal trace breakage. In addition, by forming the first organic protective layer in the bending area and the organic encapsulation layer in the display area in the same coating process, the manufacturing steps of the display panel can be simplified. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of a partial cross-sectional structure of a display panel in related technologies;

[0020] Figure 2 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0021] Figure 3 This is a cross-sectional schematic diagram of a display panel according to an embodiment of this application;

[0022] Figure 4 This is a partial cross-sectional view of a display panel provided according to an embodiment of this application;

[0023] Figure 5 This is a schematic diagram showing the relative positions of metal traces and a first metal isolation line in a display panel according to an embodiment of this application;

[0024] Figure 6 This is a partial cross-sectional view of a display panel provided according to an embodiment of this application;

[0025] Figure 7This is a schematic diagram of the array structure of the display area in a display panel according to an embodiment of this application;

[0026] Figure 8 This is a schematic diagram of the structure of the initial polarizer in a method for manufacturing a display panel according to an embodiment of this application;

[0027] Figure 9 This is a schematic diagram of the structure of the initial support member in a method for manufacturing a display panel according to an embodiment of this application;

[0028] Figure 10 This is a schematic diagram of the structure of a display device according to an embodiment of this application.

[0029] Figure Labels

[0030] 11-Substrate, 111-First bottom layer, 112-Second bottom layer;

[0031] 14-Plank layer, 141-First planar layer, 142-Second planar layer, 143-Third planar layer;

[0032] 120 - Initial support, 121 - First protective film, 122 - Second protective film, 123 - Support film;

[0033] 130 - Initial polarizer, 131 - First protective layer, 132 - Second protective layer, 133 - Polarizer;

[0034] 151 - First dike, 152 - Second dike;

[0035] 161-First organic protective layer, 162-Second organic protective layer, 17-Composite tape, 18-Polarizing agent;

[0036] 101 - First opening, 102 - Gap;

[0037] 21-Organic encapsulation layer, 22-Inorganic encapsulation layer

[0038] 33-Metallic trace, 31-First metal isolation trace, 32-Second metal isolation trace

[0039] 50-Array structure, 51-Pixel defining layer, 52-Isolation structure, 521-First structural layer, 522-Second structural layer, 53-Light-emitting structure, 531-First electrode, 532-Light-emitting component, 533-Second electrode, 54-Protective structure;

[0040] 601 - Device body; 602 - Display panel;

[0041] Y - Vertical axis, A0 - Display area, B1 - Bending area, B2 - Binding area. Detailed Implementation

[0042] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0043] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in the embodiments of this application refers to and includes any or all possible combinations of one or more associated listed items.

[0044] It should be understood that in the description of the embodiments of this application, the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the scheme of the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0045] Furthermore, when an element or layer is referred to as being "on" another element or layer, "connected to," or "bonded to" another element or layer, the element or layer may be directly on the other element or layer, directly connected to, or directly bonded to the other element or layer, or there may be intermediate elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly bonded to" another element or layer, there are no intermediate elements or layers.

[0046] The terms First, Second, etc., are used to describe various elements, components, regions, layers, and / or parts, but these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or part from another element, component, region, layer, and / or part.

[0047] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] The specific implementation of the embodiments of this application will be further described below with reference to the accompanying drawings.

[0049] Figure 1 A partial cross-sectional structural diagram of a display panel in the related art is shown. The display panel includes a display area A0 and a non-display area A1. The display panel includes a support film 01, a flexible screen 02, and a polarizer 03 stacked sequentially. The polarizer is located in the display area A0, and the support film 01 and flexible screen 02 extend from the display area A0 to the non-display area A1. The non-display area A1 includes a bending area M, and the flexible screen 02 includes metal traces 33 located in the bending area. Those skilled in the art should understand that the neutral stress layer refers to the surface formed at all locations where the stress is zero when the material undergoes bending deformation. Therefore, to prevent the metal traces in the bending area from breaking, a protective adhesive 04 is provided on the side of the flexible screen in the bending area M facing away from the support film 01, and a support opening 011 corresponding to the bending area M is provided on the support film 01. By providing the protective adhesive 04 and the support opening 011, the stress in the bending area is reduced, and the neutral stress layer is located in the metal trace layer. However, due to the poor surface flatness of the flexible screen, the high viscosity of the adhesive, and the overflow of the adhesive, the thickness uniformity of the protective adhesive is easily poor, which can easily lead to uneven thickness in the bending area, excessive local bending stress, and problems such as insufficient roundness of the bending arc and breakage of metal traces.

[0050] To address the aforementioned technical problems, this application provides a method for manufacturing a display panel, referring to... Figure 2 , Figure 3 and Figure 7 The preparation method includes:

[0051] S201, A flexible screen is formed. The flexible screen includes a display area A0, a bending area B1 and a bonding area B2 distributed sequentially along its own longitudinal direction Y. The flexible screen includes a metal wire layer and a substrate 11, a planarization layer 14 and an array structure 50 stacked sequentially. The substrate 11 includes a first bottom layer 111 and a second bottom layer 112 stacked sequentially along the side facing the array structure. The metal wire layer is located in the planarization layer 14 and corresponds to the bending area B1. The array structure is located in the display area A0.

[0052] S202, a first dam 151 is formed on the flat layer 14 along the periphery of the bending area B1. The first dam 151 and the array structure are located on the same side of the flat layer 14; that is, the first dam 151 is a polygonal annular protrusion formed on the flat layer 14 along the edge of the bending area B1.

[0053] S203, apply organic adhesive to form an organic encapsulation layer 21 on the side of the array structure away from the substrate 11, and form a first organic protective layer 161 within the area surrounded by the first dam 151.

[0054] S204, attach the support film 123 to the side of the first bottom layer 111 that is away from the array structure;

[0055] S205, a first opening 101 is formed that penetrates the support film 123 and the first bottom layer 111. A portion of the surface of the second bottom layer 112 is exposed in the first opening 101. The two ends of the first opening 101 along the longitudinal direction are aligned with the two ends of the metal trace 33 in the metal line layer along the longitudinal direction. The orthographic projection of the first opening 101 on the substrate 11 falls within the orthographic projection range of the first dam 151 on the substrate 11.

[0056] Based on the above technical solution, by setting a first dam 151 in the bending zone B1, the overflow of organic adhesive can be blocked when the first organic protective layer 161 is formed. This is beneficial for forming a first organic protective layer 161 with uniform thickness in the bending zone B1, thereby making the thickness uniform and the bending stress uniform throughout the bending zone B1, and making it less prone to breakage. Furthermore, since the first opening 101 penetrates the first bottom layer 111, the strength of the substrate 11 can be reduced, thereby reducing the bending compressive stress of the substrate 11 at the position corresponding to the first opening 101, especially reducing the second... The bending compressive stress of the bottom layer 112 facilitates bending; the first organic protective layer 161 has good flexibility and can support and protect the flexible screen in the bending area B1 to resist bending tensile stress. Therefore, by setting the first organic protective layer 161 and the first opening 101 on opposite sides of the bending area B1 of the flexible screen, the stress-bearing neutral layer can be located on or near the metal wire layer in the planarization layer 14, so that the bending stress on the metal traces 33 in the metal wire layer is small or non-existent, reducing the probability of metal traces 33 breaking. In addition, by forming the first organic protective layer 161 of the bending area B1 and the organic encapsulation layer 21 of the display area A0 in the same coating process, the manufacturing steps of the display panel can be simplified.

[0057] Additionally, at the edge of the display area A0, the planarization layer 14 has a notch 102, and a portion of the surface of the substrate 11 is exposed in the notch 102. A second dam 152 can be formed on the substrate 11 in the area corresponding to the notch 102, and the organic encapsulation layer 21 is located within the area surrounded by the second dam 152.

[0058] In one possible implementation, step S201, forming a flexible screen, includes making the thickness of the first bottom layer 111 greater than the thickness of the second bottom layer 112. This can further reduce the bending compressive stress of the substrate 11 at the position corresponding to the first opening 101, and particularly reduce the bending compressive stress of the second bottom layer 112.

[0059] In one possible implementation, refer to Figure 3 After the first organic protective layer is formed and before the support film 123 is attached, the preparation method provided in this application further includes: S206, forming a second organic protective layer 162 on the side of the first organic protective layer 161 facing away from the substrate 11, the second organic protective layer 162 covering the first dam 151 and bonding with the side of the planarization layer 14 facing away from the substrate 11. That is, the second organic protective layer 162 is in contact with the side of the planarization layer 14 facing away from the substrate 11. In this way, the first organic protective layer 161 and the second organic protective layer 162 can jointly provide support and protection for the flexible screen of the bending region B1 to resist bending tensile stress. Furthermore, the first protective layer 131 and the second protective layer 132 are superimposed and correspond to the first opening 101 penetrating the first bottom layer 111, which reduces the bending compressive stress on the substrate 11, enhances the ability to resist bending tensile stress, and makes it easier for the neutral stress layer to be located on the metal wire layer in the planarization layer 14.

[0060] In one example, a first organic protective layer 161 and a second organic protective layer 162 are sequentially stacked on the bending region B1, and the thickness of the first bottom layer 111 is greater than the thickness of the second bottom layer 112. This allows the neutral stress layer to be positioned on top of the metal wire layer in the planarization layer 14, avoiding the risk of the traces in the metal wire layer easily breaking due to bending stress.

[0061] When forming the first organic protective layer 161, precision coating techniques, such as spraying, printing, or spin coating, can be used to achieve uniform distribution of the organic adhesive. Simultaneously, the coating thickness can be strictly controlled to ensure that the neutral stress layer is located within the metal wire layer of the flexible screen after bending, thereby effectively reducing the risk of breakage of the metal traces 33. The selection of the first organic protective layer 161 should consider its flexibility, adhesion, and weather resistance to ensure it provides good support and protection during bending.

[0062] In one possible implementation, step S203, applying organic adhesive to form an organic encapsulation layer 21 on the side of the array structure facing away from the substrate 11, and forming a first organic protective layer 161 within the area surrounded by the first dam 151, includes:

[0063] On the side of the array structure of display area A0 away from the substrate 11, and in the area surrounded by the first dam 151 on the planar layer, ultraviolet curing adhesive is applied simultaneously and left to stand for a preset time.

[0064] The adhesive is cured by ultraviolet light to obtain an organic encapsulation layer 21 and a first organic protective layer 161.

[0065] Thus, utilizing the properties of the UV-curable adhesive, it can flow freely within the area surrounded by the first dam 151 on the side of the array structure away from the substrate 11 within a preset standing time, achieving a self-leveling effect. This facilitates a smooth surface for the organic encapsulation layer 21 and ensures uniform thickness and a smooth surface for the first organic protective layer 161. Then, UV irradiation transforms the UV-curable adhesive from a liquid to a solid state, resulting in the organic encapsulation layer 21 and the first organic protective layer 161. The standing time can be preset to 1 minute. This method ensures uniform distribution of the organic encapsulation layer 21 and the first organic protective layer 161, and facilitates close contact between the organic encapsulation layer 21 and the array structure, as well as close contact between the first organic protective layer 161 and the first dam 151, preventing the formation of bubbles or voids and thus improving the protective effect.

[0066] In one example, during the application and settling of the UV-curing adhesive, the flexible screen is supported by a stage. The stage temperature can be maintained between 45°C and 55°C to improve the adhesive's fluidity and enhance the self-leveling effect. Additionally, the viscosity of the UV-curing adhesive can be reduced to further improve the self-leveling effect.

[0067] In one possible implementation, step S202, forming a first dam 151 along the periphery of the bending region B1 on the flat layer 14, includes:

[0068] An inorganic film layer is formed in the region corresponding to the bending region B1 of the planar layer 14; for example, an inorganic film layer can be formed in the region corresponding to the bending region B1 of the planar layer 14 by physical vapor deposition.

[0069] The inorganic film layer is patterned to obtain the first dam 151. For example, the inorganic film layer can be patterned by etching to obtain the first dam 151.

[0070] In one possible implementation, step S204, attaching the support film 123 to the side of the first bottom layer 111 facing away from the array structure, includes:

[0071] Provide initial support component 120, for reference. Figure 9 The initial support 120 includes a first protective film 121, a support film 123, and a second protective film 122;

[0072] After removing the first protective film 121, the support film 123 is adhered to the backlight side of the flexible screen, while the second protective film 122 is retained. In this way, the second protective film 122 can protect the support film 123.

[0073] After the support film 123 is attached, a first opening 101 corresponding to the bending area B1 can be formed on the support film 123 and the first bottom layer 111. The shape, size, and position of the first opening 101 need to be adapted to the first organic protective layer 161 to ensure that the support film 123 and the first organic protective layer 161 can work together to reduce the stress concentration in the bending area B1 during bending, making the display panel bend more smoothly. At the same time, it also helps the first organic protective layer 161 to play a better role in supporting and protecting the flexible screen from damage in the bending area B1. The first opening 101 can be formed by laser cutting, mechanical punching, or other methods. It is necessary to ensure that the edges of the opening are flat and burr-free to avoid damage to the flexible screen.

[0074] In one possible embodiment, S205, a first opening 101 is formed through the support membrane 123 and the first bottom layer 111, and a portion of the surface of the second bottom layer 112 is exposed in the first opening 101, including:

[0075] The laser cuts the support film 123 and the first bottom layer 111, and sinters the interface between the first bottom layer 111 and the second bottom layer 112 in the area corresponding to the first opening 101, so as to reduce the adhesion between the first bottom layer 111 and the second bottom layer 112.

[0076] Remove the second protective film 122, and remove part of the support film 123 and part of the first bottom layer 111 corresponding to the first opening 101.

[0077] As can be seen from the above, a laser can be used to simultaneously cut the first bottom layer 111 and the support film 123 to form the first opening 101, increasing the depth of the first opening 101, reducing the strength of the flexible screen in the bending region B1, and decreasing the bending stress. It should be understood that after laser sintering the area corresponding to the first opening 101, the adhesion between the first bottom layer 111 and the second bottom layer 112 decreases. Therefore, the first bottom layer 111 in the sintered area of ​​the first opening 101 is easily separated from the second bottom layer 112. Thus, when removing the second protective film 122, it can be removed by tearing. During the tearing process, a portion of the support film 123 corresponding to the first opening 101 and a portion of the first bottom layer 111 corresponding to the first opening 101 can be removed together.

[0078] In one possible embodiment, S201, forming a flexible screen includes:

[0079] Substrate 11 is provided.

[0080] A first metal isolation line 31, a first planarization layer 141, a metal line layer, a second planarization layer 142, and a third planarization layer 143 are sequentially formed on the substrate 11. The metal traces 33 in the metal line layer include a starting end and an ending end located at opposite ends of the bending region B1. Two first metal isolation lines 31 extend laterally along the flexible screen, with the center of one corresponding to the starting end of the metal trace 33, and the center of the other corresponding to the ending end of the metal trace 33. See [reference needed] for details. Figure 3 , Figure 4 and Figure 5 .

[0081] That is, the projection of the starting end of the metal trace 33 onto the substrate 11 lies within the projection range of one first metal isolation line 31 onto the substrate 11, and the projection of the ending end of the metal trace 33 onto the substrate 11 lies within the projection range of another first metal isolation line 31 onto the substrate 11. With this design, when the first opening 101 is formed by laser cutting, the laser cutting position corresponds precisely to the starting and ending ends of the metal trace 33. The first metal isolation line 31 can isolate the laser energy, preventing damage to the starting and ending ends of the metal trace 33. Furthermore, the first metal isolation line 31 can enhance the strength of the flexible screen at the bending start / end points, preventing stress concentration at the start and end points when the bending radius decreases.

[0082] In one example, the width of the first metal isolation line 31, that is, the length of the first metal isolation line 31 in the longitudinal direction of the flexible screen, can be matched with the laser cutting precision to ensure that the laser energy can be blocked when cutting the first opening 101.

[0083] In one possible embodiment, S201, forming a flexible screen, further includes:

[0084] Substrate 11 is provided.

[0085] A first metal isolation line 31, a first planarization layer 141, a metal line layer, a second planarization layer 142, a second metal isolation line 32, and a third planarization layer 143 are sequentially formed on the substrate 11. The metal traces 33 in the metal line layer include a starting end and an ending end located at opposite ends of the bending region B1. Two first metal isolation lines 31 extend laterally along the flexible screen, with the center of one corresponding to the starting end of the metal trace 33 and the center of the other corresponding to the ending end of the metal trace 33. The orthographic projection of the first metal isolation line 31 onto the substrate 11 overlaps with the orthographic projection of the second metal isolation line 32 onto the substrate 11. (See reference for details.) Figures 3 to 6 .

[0086] That is, the projection of the starting end of the metal trace 33 onto the substrate 11 lies within the projection range of one first metal isolation line 31 onto the substrate 11, and the projection of the ending end of the metal trace 33 onto the substrate 11 lies within the projection range of another first metal isolation line 31 onto the substrate 11. With this design, when the first opening 101 is formed by laser cutting, the laser cutting position corresponds precisely to the starting and ending ends of the metal trace 33. The first metal isolation line 31 can isolate the laser energy, preventing damage to the starting and ending ends of the metal trace 33. Furthermore, the first metal isolation line 31 and the second metal isolation line 32 are located on opposite sides of the metal trace layer. The second metal isolation line 32 can offset the positional change of the central stress layer from being located in the metal trace layer 33 due to the introduction of the first metal isolation line 31; that is, the central stress layer can remain located in the metal trace layer 33. In addition, both the first metal isolation line 31 and the second metal isolation line 32 can enhance the strength of the flexible screen at the starting and ending points of the bend, and prevent stress concentration at the starting and ending points when the bending radius decreases.

[0087] In one example, the length of the second metal isolation line 32 in the longitudinal direction of the flexible screen is greater than the length of the first metal isolation line 31 in the longitudinal direction of the flexible screen. This creates a stress gradient at the start and end points of the bend, preventing excessive stress concentration at these locations.

[0088] In one example, the width of the first metal isolation line 31, that is, the length of the first metal isolation line 31 in the longitudinal direction of the flexible screen, can be matched with the laser cutting precision to ensure that the laser energy can be blocked when cutting the first opening 101.

[0089] In one possible implementation, refer to Figure 3 The method for manufacturing a display panel, after removing the second protective film 122 and a portion of the support film 123 and a portion of the first bottom layer 111 corresponding to the first opening 101, further includes:

[0090] S208, the composite tape 17 is attached to the side of the support film 123 facing away from the flexible screen body, with the composite tape 17 located in the display area A0. The composite tape 17 can increase the heat dissipation capacity and impact resistance of the display area A0.

[0091] In one possible implementation, refer to Figure 3 After forming the organic encapsulation layer 21 and the first organic protective layer 161, and before attaching the support film 123, the method for preparing the display panel further includes:

[0092] An inorganic encapsulation layer 22 is formed on the side of the organic encapsulation layer 21 that is away from the substrate 11;

[0093] A polarizer 133 is attached to the side of the inorganic encapsulation layer 22 away from the substrate 11, and the polarizer 133 is located in the display area A0.

[0094] Specifically, the inorganic encapsulation layer 22 can be formed by physical vapor deposition or chemical vapor deposition. Since the inorganic encapsulation layer 22 comprises inorganic materials, it can effectively isolate water and oxygen, preventing moisture from entering the organic encapsulation layer 21. The inorganic encapsulation layer 22 and the organic encapsulation layer 21 together protect the light-emitting structure.

[0095] Specifically, attaching the polarizer 133 to the side of the inorganic encapsulation layer 22 away from the substrate 11 may include: providing an initial polarizer 130, with reference to... Figure 8 The initial polarizer 130 includes a first protective layer 131, a polarizer 133, and a second protective layer 132. After removing the second protective layer 132, the polarizer 133 is attached to the side of the inorganic encapsulation layer 22 facing away from the substrate 11, while the first protective layer 131 is retained. In this way, the first protective layer 131 can protect the polarizer 133.

[0096] After the composite tape 17 is applied, the first protective layer 131 on the polarizer 133 can be removed, and then a glass cover plate can be installed on the side of the polarizer 133 facing away from the flexible screen body; the glass cover plate can protect the polarizer 133. The glass cover plate can be attached to the polarizer 133 with transparent optical adhesive.

[0097] In addition, after forming the first opening 101, the method for manufacturing the display panel provided in this application further includes: fixing the chip and the printed circuit board in the bonding area B2, so that the chip and the metal traces 33 in the flexible screen are electrically connected, and the printed circuit board and the metal traces 33 in the flexible screen are electrically connected. The chip and the printed circuit board are not shown in the figures.

[0098] Secondly, this application provides a display panel, with reference to Figure 3 The display panel includes:

[0099] The flexible screen includes a display area A0, a bending area B1 and a bonding area B2 distributed sequentially along its own longitudinal direction. The flexible screen includes a metal wire layer and a substrate 11, a planarization layer 14 and an array structure stacked sequentially. The substrate 11 includes a first bottom layer 111 and a second bottom layer 112 stacked sequentially along the side facing the array structure. The metal wire layer is located in the planarization layer 14 and corresponds to the bending area B1. The array structure is located in the display area A0.

[0100] The first dam 151 is set on the flat layer 14 and distributed around the perimeter of the bending area B1. The first dam 151 and the array structure are located on the same side of the flat layer 14; that is, the first dam 151 is a polygonal annular protrusion formed on the flat layer 14 along the edge of the bending area B1.

[0101] The first organic protective layer 161 is located on the flat layer 14 and within the area surrounded by the first dam 151;

[0102] A support film 123 is attached to the side of the first bottom layer 111 facing away from the array structure; wherein, a first opening 101 penetrates the support film 123 and the first bottom layer 111, a portion of the surface of the second bottom layer 112 is exposed in the first opening 101, the two ends of the first opening 101 along the longitudinal direction are aligned with the two ends of the metal trace 33 in the metal line layer along the longitudinal direction, and the orthographic projection of the first opening 101 on the substrate 11 falls within the orthographic projection range of the first dam 151 on the substrate 11.

[0103] Based on the above technical solution, by setting a first dam 151 in the bending zone B1, the overflow of organic adhesive can be blocked when the first organic protective layer 161 is formed. This is beneficial for forming a first organic protective layer 161 with uniform thickness in the bending zone B1, thereby making the thickness uniform and the bending stress uniform throughout the bending zone B1, and making it less prone to breakage. Furthermore, since the first opening 101 penetrates the first bottom layer 111, the strength of the substrate 11 can be reduced, thereby reducing the bending compressive stress of the substrate 11 at the position corresponding to the first opening 101, especially reducing the second... The bending compressive stress of the bottom layer 112 facilitates bending; the first organic protective layer 161 has good flexibility and can support and protect the flexible screen in the bending area B1 to resist bending tensile stress. Therefore, by setting the first organic protective layer 161 and the first opening 101 on opposite sides of the bending area B1 of the flexible screen, the stress-bearing neutral layer can be located on or near the metal wire layer in the planarization layer 14, so that the bending stress on the metal traces 33 in the metal wire layer is small or non-existent, reducing the probability of metal traces 33 breaking. In addition, by forming the first organic protective layer 161 of the bending area B1 and the organic encapsulation layer 21 of the display area A0 in the same coating process, the manufacturing steps of the display panel can be simplified.

[0104] In one possible embodiment, reference Figure 3 The display panel also includes an organic encapsulation layer and an inorganic encapsulation layer 22, which are sequentially stacked on the side of the array structure facing away from the substrate 11 along a direction away from the substrate 11. Specifically, the inorganic encapsulation layer 22 can be formed by physical vapor deposition or chemical vapor deposition. Since the inorganic encapsulation layer 22 contains inorganic materials, it can effectively isolate water and oxygen, preventing moisture from entering the organic encapsulation layer 21. The inorganic encapsulation layer 22 and the organic encapsulation layer 21 together protect the light-emitting structure.

[0105] Additionally, at the edge of the display area A0, the planarization layer 14 has a notch 102, and a portion of the surface of the substrate 11 is exposed in the notch 102. A second dam 152 can be formed on the substrate 11 in the area corresponding to the notch 102, and the organic encapsulation layer 21 is located within the area surrounded by the second dam 152.

[0106] In one possible embodiment, the thickness of the first bottom layer 111 is greater than the thickness of the second bottom layer 112. This can further reduce the bending compressive stress of the substrate 11 at the location corresponding to the first opening 101, and particularly reduce the bending compressive stress of the second bottom layer 112.

[0107] In one example, the thickness of the first bottom layer 111 is 9 micrometers, and the thickness of the second bottom layer 112 is 6 micrometers.

[0108] In one possible embodiment, the display panel further includes a second organic protective layer 162, which is stacked on the side of the first organic protective layer 161 facing away from the substrate 11. The second organic protective layer 162 covers the first dam 151 and is bonded to the side of the planarization layer 14 facing away from the substrate 11. Thus, the first organic protective layer 161 and the second organic protective layer 162 can jointly provide support and protection for the flexible screen in the bending region B1 to resist bending tensile stress. Furthermore, the stacking of the first protective layer 131 and the second protective layer 132 corresponds to the first opening 101 penetrating the first bottom layer 111, which reduces the bending compressive stress on the substrate 11, enhances the resistance to bending tensile stress, and facilitates the placement of the neutral stress layer on the metal line layer in the planarization layer 14.

[0109] In one example, the combined thickness of the first organic protective layer 161 and the second organic protective layer 162 is 35 to 40 micrometers. For example, it can be 35 micrometers, 36 micrometers, 37 micrometers, 38 micrometers, 39 micrometers, 40 micrometers, 41 micrometers, 42 micrometers, 43 micrometers, 44 micrometers, or 45 micrometers.

[0110] In one possible embodiment, the display panel further includes a third organic protective layer stacked on the side of the second organic protective layer 162 facing away from the substrate 11, the third organic protective layer having a thickness of less than 30 micrometers. The third organic protective layer is not shown in the figures.

[0111] In one possible embodiment, reference Figure 3 , Figure 4 and Figure 5The flexible screen also includes a first metal isolation line 31. The planarization layer 14 includes a first planarization layer 141, a second planarization layer 142, and a third planarization layer 143. The first metal isolation line 31, the first planarization layer 141, the metal line layer, the second planarization layer 142, and the third planarization layer 143 are stacked sequentially on the substrate 11. The metal traces 33 in the metal line layer include a starting end and an ending end located at opposite ends of the bending region B1. The first metal isolation line 31 extends laterally along the flexible screen and there are two of them. The center of one of them corresponds to the starting end of the metal trace 33, and the center of the other corresponds to the ending end of the metal trace 33.

[0112] That is, the projection of the starting end of the metal trace 33 onto the substrate 11 lies within the projection range of one first metal isolation line 31 onto the substrate 11, and the projection of the ending end of the metal trace 33 onto the substrate 11 lies within the projection range of another first metal isolation line 31 onto the substrate 11. With this design, when the first opening 101 is formed by laser cutting, the laser cutting position corresponds precisely to the starting and ending ends of the metal trace 33. The first metal isolation line 31 can isolate the laser energy, preventing damage to the starting and ending ends of the metal trace 33. Furthermore, the first metal isolation line 31 can enhance the strength of the flexible screen at the bending start / end points, preventing stress concentration at the start and end points when the bending radius decreases.

[0113] In one example, the width of the first metal isolation line 31, i.e., the length of the first metal isolation line 31 in the longitudinal direction of the flexible screen, can be matched with the laser cutting precision to ensure that it can block the laser energy when cutting the first opening 101. For example, the width of the first metal isolation line 31 is 50 micrometers.

[0114] Furthermore, in one possible embodiment, refer to Figures 3 to 6The flexible screen also includes a second metal isolation line 32, located between the second flat layer 142 and the third flat layer 143. The orthographic projection of the first metal isolation line 31 on the substrate 11 overlaps with the orthographic projection of the second metal isolation line 32 on the substrate 11. That is, the projection of the starting end of the metal trace 33 on the substrate 11 lies within the projection range of one first metal isolation line 31 on the substrate 11, and the projection of the ending end of the metal trace 33 on the substrate 11 lies within the projection range of another first metal isolation line 31 on the substrate 11. With this design, when the first opening 101 is formed by laser cutting, the laser cutting position corresponds exactly to the starting and ending ends of the metal trace 33. The first metal isolation line 31 can isolate the laser energy, preventing the laser energy from damaging the starting and ending ends of the metal trace 33. Furthermore, the first metal isolation line 31 and the second metal isolation line 32 are located on opposite sides of the metal wire layer. The second metal isolation line 32 can offset the change in position of the central stress layer from being located in the metal trace layer 33 caused by the introduction of the first metal isolation line 31. That is, the central stress layer can still be located in the metal trace layer 33. In addition, both the first metal isolation line 31 and the second metal isolation line 32 can enhance the strength of the flexible screen at the beginning and end points of bending, preventing stress concentration at the beginning and end points when the bending radius decreases.

[0115] In one example, the length of the second metal isolation line 32 in the longitudinal direction of the flexible screen is greater than the length of the first metal isolation line 31 in the longitudinal direction of the flexible screen. This creates a stress gradient at the start and end points of the bend, preventing excessive stress concentration at these locations.

[0116] In one possible embodiment, the display panel further includes a chip and a printed circuit board, which are fixed in the bonding area B2 and are spaced apart along the longitudinal direction of the flexible screen. The chip and the metal traces 33 in the flexible screen are electrically connected, as are the metal traces 33 in the printed circuit board and the flexible screen 11.

[0117] In one possible embodiment, the display panel further includes a composite tape 17, which is attached to the side of the support film 123123 facing away from the flexible screen body 11. The composite tape 17 is located in the display area A0. The composite tape 17 can increase the heat dissipation capacity and impact resistance of the display area A0.

[0118] In one possible embodiment, the display panel further includes a polarizer 133 located in the display area A0 and stacked on the side of the inorganic encapsulation layer 22 away from the substrate 11.

[0119] Among them, reference Figure 7The array structure may include an isolation structure 52, multiple light-emitting structures 53, and multiple protective structures 54. The isolation structure 52 is disposed on one side of the substrate 11, and the isolation structure 52 encloses and forms multiple isolation openings. The light-emitting structures 53 are correspondingly disposed with the isolation openings, and a portion of the light-emitting structure 53 is located within the isolation opening. The protective structure 54 is disposed on the side of the corresponding light-emitting structure 53 facing away from the substrate 11, and the protective structure 54 overlaps with the sidewall of the isolation structure 52. The material of the protective structure 54 includes inorganic materials. In this way, the protective structure 54 can isolate water and oxygen, and can protect the light-emitting structure 53, reducing the impact of ultraviolet light on the light-emitting structure 53 when the organic encapsulation layer 21 is cured by ultraviolet light.

[0120] Furthermore, the display panel also includes a pixel defining layer 51, which is disposed between the substrate 11 and the isolation structure 52. The pixel defining layer 51 includes a plurality of pixel openings, which correspond to the isolation openings and are connected to the corresponding isolation openings. The orthographic projection of the pixel openings on the substrate 11 is located within the orthographic projection range of the corresponding isolation openings on the substrate 11. Some of the light-emitting structures 53 are located in the pixel openings.

[0121] In one example, the isolation structure 52 includes a first structural layer 521 and a second structural layer 522 stacked sequentially in a direction toward the substrate 11. The first structural layer 521 protrudes from the sidewall of the second structural layer 522 in a direction parallel to the substrate 11, and the second electrode 533 is electrically connected to the second structural layer 522. For example, the second electrode 533 and the second structural layer 522 are in conductive contact to achieve electrical connection. This allows the first structural layer 521 to extend beyond the sidewall of the second structural layer 522, forming an eaves-like structure. Therefore, during the deposition of the second electrode 533, the second electrode 533 will not be continuous near the eaves-like structure, but rather intermittent. Thus, the isolation structure 52 can reliably separate adjacent second electrodes 533.

[0122] In one possible embodiment, the light-emitting structure 53 includes a first electrode 531, a light-emitting component 532, and a second electrode 533 stacked sequentially along a direction away from the substrate 11. The first electrode 531 is disposed between the substrate 11 and the pixel defining layer 51, with a portion of the first electrode 531 exposed in the corresponding pixel opening. The light-emitting component 532 is stacked on the surface of the first electrode 531 exposed in the pixel opening. Thus, under the conductive effect of the first electrode 531 and the second electrode 533, the light-emitting component 532 can emit light, and the light emission range of the light-emitting component 532 is the range defined by the partition opening.

[0123] Among them, one of the first electrode 531 and the second electrode 533 can be an anode and the other can be a cathode.

[0124] The light-emitting component 532 may include organic light-emitting materials, and can be obtained by vapor deposition of organic materials using the vapor deposition apparatus provided in this application. The light-emitting component 532 may include one or more of the following: HIL (Hole Injection Layer), HTL (Hole Transfer Layer), EML (Emitting Layer), and ETL (Electron Transfer Layer). The organic light-emitting materials in the light-emitting component 532 are generally classified as: polymers, small-molecule organic compounds, and complex light-emitting materials. Polymers are typically conductive conjugated polymers or semiconductor conjugated polymers, which can be spin-coated, are simple to manufacture, and have low cost, but their purity is difficult to improve, and they are inferior to small-molecule organic compounds in terms of durability, brightness, and color. Organic small-molecule light-emitting materials are mainly organic dyes, which have advantages such as strong chemical modification capabilities, a wide selection range, easy purification, high quantum efficiency, and the ability to produce emission peaks of various colors such as red, green, blue, and yellow. However, most of them suffer from concentration quenching problems in the solid state. Coordination luminescent materials lie between organic and inorganic materials, possessing both the high fluorescence quantum efficiency of organic materials and the high stability of inorganic materials, and are considered a class of luminescent materials with great application potential.

[0125] In one possible embodiment, the plurality of light-emitting structures 53 includes a first light-emitting structure 53, a second light-emitting structure 53, and a third light-emitting structure 53, and the plurality of partition openings includes a first partition opening, a second partition opening, and a third partition opening. The first light-emitting structure 53 is correspondingly arranged with the first partition opening, the second light-emitting structure 53 is correspondingly arranged with the second partition opening, and the third light-emitting structure 53 is correspondingly arranged with the third partition opening. The first light-emitting structure 53 and the second light-emitting structure 53 emit different colors, the first light-emitting structure 53 and the third light-emitting structure 53 emit different colors, and the second light-emitting structure 53 and the third light-emitting structure 53 emit different colors. In this way, light-emitting structures 53 capable of emitting different colors can be arranged in different pixel openings. Thus, by setting multiple light-emitting structures 53, the display panel can display multiple display colors and effects.

[0126] In one example, after forming the second electrode 533, an inorganic protective layer can be formed on the side of the light-emitting structure 53 and the isolation structure 52 away from the substrate 11 by chemical vapor deposition; then, the excess inorganic protective layer is removed by patterned etching to obtain the protective structure 54 corresponding to the light-emitting structure 53. The etching method can be dry etching or wet etching.

[0127] Understandably, the substrate 11 is made of materials such as soft plastic or metal foil, suitable for flexible displays and wearable devices.

[0128] Fourthly, embodiments of this application also provide a display device, which includes a display panel, and the display panel may be the aforementioned display panel.

[0129] An exemplary display terminal, such as Figure 10 As shown, it includes a device body 601 and a display panel 602. The display panel 602 is disposed on the device body 601 and electrically connected to the device body 601. The display panel 602 is the display panel in the aforementioned embodiment, used to display static or dynamic images.

[0130] For example, the above-mentioned display device can be implemented in the form of various electronic devices such as mobile phones, tablet computers, handheld computers, wearable devices, and in-vehicle display devices.

[0131] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes, combinations, substitutions, adjustments and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The preparation method includes: A flexible screen is formed, comprising a display area (A0), a bending area (B1), and a bonding area (B2) distributed sequentially along its longitudinal direction. The flexible screen includes a metal wire layer and a substrate (11), a planarization layer (14), and an array structure stacked sequentially. The substrate (11) includes a first bottom layer (111) and a second bottom layer (112) stacked sequentially along one side facing the array structure. The metal wire layer is located in the planarization layer (14) and corresponds to the bending area (B1). The array structure is located in the display area (A0). A first dam (151) is formed on the flat layer (14) along the periphery of the bending area (B1), and the first dam (151) and the array structure are located on the same side of the flat layer (14). Organic adhesive is applied to form an organic encapsulation layer (21) on the side of the array structure opposite to the substrate (11), and a first organic protective layer (161) is formed within the area surrounded by the first dam (151). A support film (123) is attached to the side of the first bottom layer (111) opposite to the array structure; A first opening (101) is formed through the support film (123) and the first bottom layer (111), a portion of the surface of the second bottom layer (112) is exposed in the first opening (101), the two ends of the first opening (101) along the longitudinal direction are aligned with the two ends of the metal trace (33) in the metal wire layer along the longitudinal direction, and the orthographic projection of the first opening (101) on the substrate (11) falls within the orthographic projection range of the first dam (151) on the substrate (11).

2. The method for manufacturing a display panel according to claim 1, characterized in that, The process of forming a flexible screen includes: making the thickness of the first bottom layer (111) greater than the thickness of the second bottom layer (112).

3. The method for manufacturing a display panel according to claim 1, characterized in that, After the first protective layer is formed and before the support film (123) is adhered, the preparation method further includes: A second organic protective layer (162) is formed on the side of the first organic protective layer (161) away from the substrate (11), the second organic protective layer (162) covers the first dam (151) and is bonded to the side of the planar layer (14) away from the substrate (11).

4. The method for manufacturing a display panel according to claim 1, characterized in that, The application of organic adhesive to form an organic encapsulation layer (21) on the side of the array structure opposite to the substrate (11) and to form a first organic protective layer (161) within the area surrounded by the first dam (151) includes: UV-curable adhesive is simultaneously applied to the area of ​​the array structure in the display area (A0) facing away from the substrate (11) and the area surrounded by the first dam (151) on the flat layer, and left to stand for a preset time. The adhesive is cured by irradiation with ultraviolet light to obtain the organic encapsulation layer (21) and the first organic protective layer (161).

5. The method for manufacturing a display panel according to claim 1, characterized in that, The formation of the first dam (151) along the periphery of the bend (B1) on the flat layer (14) includes: An inorganic film layer is formed in the region corresponding to the bending region (B1) of the flat layer (14); The inorganic membrane layer is patterned to obtain the first dam (151).

6. The method for manufacturing a display panel according to claim 1, characterized in that, The step of attaching a support film (123) to the side of the first bottom layer (111) opposite to the array structure includes: An initial support member (120) is provided, which includes a first protective film (121), a support film (123), and a second protective film (122); After removing the first protective film (121), the support film (123) is pasted on the backlight side of the flexible screen, while the second protective film (122) is retained.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The formation of a first opening (101) penetrating the support membrane (123) and the first bottom layer (111), wherein a portion of the surface of the second bottom layer (112) is exposed in the first opening (101), includes: The support film (123) and the first bottom layer (111) are cut by controlled laser, and the interface between the first bottom layer (111) and the second bottom layer (112) is sintered in the area corresponding to the first opening (101) to reduce the adhesion between the first bottom layer (111) and the second bottom layer (112). Remove the second protective film (122), and remove part of the support film (123) and part of the first bottom layer (111) corresponding to the first opening (101).

8. The method for manufacturing a display panel according to claim 7, characterized in that, The process of forming the flexible screen includes: Provide substrate (11), A first metal isolation line (31), a first flat layer (141), a metal line layer, a second flat layer (142), and a third flat layer (143) are sequentially formed on the substrate (11). The metal trace (33) in the metal line layer includes a starting end and an ending end located at opposite ends of the bending region (B1). The first metal isolation line (31) extends laterally along the flexible screen and there are two of them. The center of one of them corresponds to the starting end of the metal trace (33), and the center of the other corresponds to the ending end of the metal trace (33).

9. The method for manufacturing a display panel according to claim 7, characterized in that, The process of forming the flexible screen includes: Provide substrate (11), A first metal isolation line (31), a first flat layer (141), a metal line layer, a second flat layer (142), a second metal isolation line (32), and a third flat layer (143) are sequentially formed on the substrate (11). The metal trace (33) in the metal line layer includes a starting end and an ending end located at opposite ends of the bending region (B1). The first metal isolation line (31) extends laterally along the flexible screen and there are two of them. The center of one of them corresponds to the starting end of the metal trace (33), and the center of the other corresponds to the ending end of the metal trace (33). The orthographic projection of the first metal isolation line (31) on the substrate (11) and the orthographic projection of the second metal isolation line (32) on the substrate (11) overlap.

10. A display panel, characterized in that, The display panel includes: A flexible screen body includes a display area (A0), a bending area (B1), and a bonding area (B2) distributed sequentially along its own longitudinal direction. The flexible screen body includes a metal wire layer and a substrate (11), a planarization layer (14), and an array structure stacked sequentially. The substrate (11) includes a first bottom layer (111) and a second bottom layer (112) stacked sequentially along one side facing the array structure. The metal wire layer is located in the planarization layer (14) and corresponds to the bending area (B1). The array structure is located in the display area (A0). The first dam (151) is set on the flat layer (14) and distributed around the perimeter of the bending area (B1). The first dam (151) and the array structure are located on the same side of the flat layer (14). The first organic protective layer (161) is located on the flat layer (14) and within the area surrounded by the first dam (151); A support film (123) is attached to the side of the first bottom layer (111) facing away from the array structure; wherein a first opening (101) penetrates the support film (123) and the first bottom layer (111), a portion of the surface of the second bottom layer (112) is exposed in the first opening (101), the two ends of the first opening (101) along the longitudinal direction are aligned with the two ends of the metal trace (33) in the metal wire layer along the longitudinal direction, and the orthographic projection of the first opening (101) on the substrate (11) falls within the orthographic projection range of the first dam (151) on the substrate (11).

11. The display panel according to claim 10, characterized in that, The thickness of the first bottom layer (111) is greater than the thickness of the second bottom layer (112).

12. The display panel according to claim 11, characterized in that, The thickness of the first bottom layer (111) is 9 micrometers, and the thickness of the second bottom layer (112) is 6 micrometers.

13. The display panel according to claim 10, characterized in that, The display panel further includes a second organic protective layer (162), which is stacked on the side of the first organic protective layer (161) away from the substrate (11), the second organic protective layer (162) covers the first dam (151), and is bonded to the side of the planarization layer (14) away from the substrate (11).

14. The display panel according to claim 13, characterized in that, The display panel also includes a third organic protective layer, which is stacked on the side of the second organic protective layer (162) away from the substrate (11), and the thickness of the third organic protective layer is less than 30 micrometers.

15. The display panel according to claim 10, characterized in that, The flexible screen also includes a first metal isolation line (31), and the planarization layer (14) includes a first planarization layer (141), a second planarization layer (142) and a third planarization layer (143), wherein the first metal isolation line (31), the first planarization layer (141), the metal line layer, the second planarization layer (142) and the third planarization layer (143) are stacked sequentially on the substrate (11); The metal traces (33) in the metal wire layer include a starting end and an ending end located at opposite ends of the bending area (B1). The first metal isolation line (31) extends laterally along the flexible screen and there are two of them. The center of one of them corresponds to the starting end of the metal trace (33), and the center of the other corresponds to the ending end of the metal trace (33).

16. The display panel according to claim 15, characterized in that, The flexible screen also includes a second metal isolation line (32), which is located between the second flat layer (142) and the third flat layer (143). The orthographic projection of the first metal isolation line (31) on the substrate (11) and the orthographic projection of the second metal isolation line (32) on the substrate (11) overlap.

17. The display panel according to claim 16, characterized in that, The length of the second metal isolation line (32) in the longitudinal direction of the flexible screen is greater than the length of the first metal isolation line (31) in the longitudinal direction of the flexible screen.

18. A display device, characterized in that, The display panel includes the display panel prepared by the method of any one of claims 1-9, or the display panel of any one of claims 10-17.

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