Amoled display device, production process thereof, and display apparatus

Abstract

The application provides an AMOLED display device, a production process thereof and a display device, and the whole is thinned without reducing the thickness of the packaging substrate. The AMOLED display device comprises a driving back plate, a first surface of the driving back plate comprises a display area and a non-display area, the display area is provided with a pixel driving circuit and a light emitting device, the light emitting device is laminated on the pixel driving circuit, the non-display area is provided with a control circuit and a first wire, the light emitting device is electrically connected with the control circuit through the pixel driving circuit, a second surface is provided with a bonding pad, the second surface is provided with a second wire, the control circuit is electrically connected with the bonding pad through the first wire and the second wire; a packaging substrate is fixedly attached to the first surface of the driving back plate, a light filtering layer is arranged on a side surface of the packaging substrate close to the driving back plate, the light filtering layer is opposite to the light emitting device, and the orthographic projection of the light filtering layer in the driving back plate covers the orthographic projection of the light emitting device in the driving back plate.

Description

Technical Field

[0001] This invention relates to the field of AMOLED display device technology, specifically to an AMOLED display device, its manufacturing process, and a display apparatus. Background Technology

[0002] In the field of display technology, AMOLED (Active Matrix Organic Light Emitting Diode) display devices are widely used in smartphones, tablets, automotive displays, and other fields due to their advantages such as high contrast, wide color gamut, and thinness and flexibility. With the increasing demand for thinner and more portable consumer electronics, how to reduce module thickness while ensuring display performance and structural strength has become a key issue that the industry urgently needs to address.

[0003] Traditional AMOLED display modules typically employ a multi-layer stacked structure, including a cover glass (CG), optical adhesive layer (OCA), polarizer (POL), color filter layer, photoresist layer, driver backplane, and encapsulation substrate. Among these, the color filter layer and photoresist layer, as independent functional layers, need to be integrated into the module through a bonding process. This not only increases the overall thickness by 0.1-0.3mm but also leads to increased process complexity, reduced yield, and increased cost due to the multi-layer bonding. Summary of the Invention

[0004] In view of this, the present invention aims to provide an AMOLED display device, a display apparatus, and a process for producing an AMOLED display device, in order to solve the problem that existing AMOLED display devices cannot simultaneously achieve both thinness and lightness and meet mechanical structural strength requirements.

[0005] In a first aspect, this application proposes an AMOLED display device, comprising:

[0006] A driving backplane includes a first surface and a second surface opposite each other along the thickness direction. The first surface includes a display area and a non-display area. The display area is provided with a pixel driving circuit and a light-emitting device. The pixel driving circuit is disposed on the driving backplane, and the light-emitting device is stacked on the pixel driving circuit. The non-display area is provided with a control circuit and a first trace. The light-emitting device is electrically connected to the control circuit through the pixel driving circuit. The second surface is provided with a bonding pad and a second trace. The control circuit is electrically connected to the bonding pad through the first trace and the second trace.

[0007] The packaging substrate is bonded and fixed to the first surface of the driving backplate. A filter layer is provided on the side surface of the packaging substrate near the driving backplate. The filter layer is directly opposite the light-emitting device. The orthogonal projection of the filter layer in the driving backplate covers the orthogonal projection of the light-emitting device in the driving backplate.

[0008] According to the AMOLED display device of this application, a photoresist layer is also disposed on the surface of the packaging substrate near the driving backplane. The photoresist layer and the filter layer are in the same layer, and the photoresist layer surrounds the filter layer to form a closed ring.

[0009] According to the AMOLED display device of this application, the driving backplane includes a first sidewall, the two ends of the first sidewall are respectively connected to a first surface and a second surface, a third trace is provided on the first sidewall, the first trace and the second trace both extend to the two ends of the driving backplane, and the two ends of the third trace are respectively electrically connected to the first trace and the second trace.

[0010] Optionally, the first sidewall includes a straight wall surface and a first guide surface. The first guide surface connects the first surface and the straight wall surface. The two ends of the first guide surface are flush with the two ends of the first surface. The thickness of the area of ​​the drive back plate where the first guide surface is disposed is less than the thickness of the area of ​​the drive back plate where the first surface is disposed.

[0011] Optionally, the first sidewall also includes a second guide surface, which connects the second surface and the straight wall surface. The two ends of the second guide surface are flush with the two end edges of the second surface. The thickness of the area of ​​the drive back plate where the second guide surface is disposed is less than the thickness of the area of ​​the drive back plate where the second surface is disposed.

[0012] Optionally, the widths of the first, second, and third traces are all the same.

[0013] According to the AMOLED display device of this application, the thickness of the encapsulation substrate is 0.5mm to 1.0mm, and the encapsulation substrate and the driving backplane have the same shape.

[0014] According to the AMOLED display device of this application, the encapsulation substrate is provided with a first adhesive area, which is sleeved outside the filter layer, and a second adhesive area is provided on the driving backplate. The first adhesive area and the second adhesive area face each other and are sandwiched with a glass powder adhesive layer.

[0015] Secondly, this application proposes a process for an AMOLED display device, comprising the following steps:

[0016] Light-emitting devices and traces are fabricated on the driver backplane, and a filter layer is fabricated on the packaging substrate.

[0017] Align and bond the drive backplane and the packaging substrate;

[0018] Cut to obtain AMOLED display devices.

[0019] Thirdly, this application proposes a display device including the aforementioned AMOLED display device.

[0020] The technical solutions provided in this application have the following advantages compared with the prior art:

[0021] The AMOLED display device provided in this application is used in display devices. The encapsulation substrate and the driving backplane are directly bonded and fixed. The encapsulation substrate, as the outer substrate covering the light-emitting device, can meet some of the mechanical support functions required by the AMOLED display device. To meet the overall thickness requirements of the AMOLED display device, the filter layer is directly integrated on the encapsulation substrate, which reduces the thickness compared to setting a separate polarizer. This eliminates the need to further reduce the thickness of the encapsulation substrate, thus making the AMOLED display device thinner and lighter while meeting the overall thickness and mechanical strength requirements. This satisfies the market demand for thinner and lighter electronic products, such as mobile devices like smartphones. Furthermore, since there is no need to separately attach polarizers, optical adhesive layers, and glass covers, it saves materials and reduces processing steps. Attached Figure Description

[0022] Figure 1 The image shown is a perspective view of an AMOLED display device according to an embodiment of this application;

[0023] Figure 2 The image shown is a side view of an AMOLED display device according to an embodiment of this application;

[0024] Figure 3 The image shown is a front view of the driving backplane of an AMOLED display device according to an embodiment of this application;

[0025] Figure 4 The image shown is a front view of the packaging substrate of an AMOLED display device according to an embodiment of this application;

[0026] Figure 5 The image shown is a side view of the driving backplane of an AMOLED display device according to an embodiment of this application;

[0027] Figure 6 The image shown is a side view of the driving backplane of an AMOLED display device according to another embodiment of this application;

[0028] Figure 7 The image shown is a perspective view of a driving backplane of an AMOLED display device according to an embodiment of this application;

[0029] Figure 8 The image shown is a perspective view of a driving backplane of an AMOLED display device according to another embodiment of this application;

[0030] Figure 9 The image shown is a perspective view of the packaging substrate of an AMOLED display device according to an embodiment of this application;

[0031] Figure 10The diagram shown is a process flow diagram for manufacturing an AMOLED display device according to an embodiment of this application.

[0032] Figure label:

[0033] Drive backplate 10, first sidewall 11, first guide surface 111, second guide surface 112, straight wall surface 113, third trace 114, second bonding area 12, bonding pad 13, first surface 14, first trace 141, second surface 15, second trace 151, edge protection layer 17, light-emitting device 20, sub-pixel 21, encapsulation substrate 30, filter layer 31, sub-region 311, photoresist layer 32, first bonding area 33, control circuit 40. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] The core principle of AMOLED (Active-Matrix Organic Light-Emitting Diode) display devices is that organic materials emit light themselves, eliminating the need for a backlight module (unlike LCDs). Current end-users are continuously demanding thinner and lighter products. Current rigid screen solutions can only achieve thinner designs by reducing the thickness of the glass cover or by using flexible screens. However, reducing the thickness of the cover glass (e.g., from 0.5mm to below 0.3mm) in pursuit of thinness significantly reduces the module's impact resistance, greatly increasing the risk of glass breakage or damage to internal components during drop tests. While flexible substrates (such as PI substrates) can achieve bending characteristics, they suffer from high costs and insufficient PI pressure resistance, making it difficult to meet the reliability and cost requirements of mass production.

[0036] Therefore, this application proposes an AMOLED display device.

[0037] Figure 1 A 3D view of the AMOLED display device shown; Figure 2 The image shown is a side view of an AMOLED display device. Figure 3 The image shows a front view of the driving backplane of the AMOLED display device. Figures 1-3 As shown, the AMOLED display device according to an embodiment of this application includes a driving backplane 10 and a packaging substrate 30.

[0038] Specifically, the drive backplate 10 includes a first surface 14 and a second surface 15 opposite each other along the thickness direction (e.g., ...). Figures 5-8 As shown, the first surface 14 includes a display area and a non-display area. The display area is provided with a pixel driving circuit and a light-emitting device 20. The pixel driving circuit is disposed on the driving backplate 10, and the light-emitting device 20 is stacked on the pixel driving circuit. The non-display area is provided with a control circuit 40 and a first trace 141. The light-emitting device is electrically connected to the control circuit 40 through the pixel driving circuit. The second surface 15 is provided with a bonding pad 13 and a second trace 151. The encapsulation substrate 30 is attached and fixed to the first surface 14 of the driving backplate 10. A filter layer 31 is disposed on the side of the encapsulation substrate 30 close to the driving backplate 10. The filter layer 31 is directly opposite to the light-emitting device 20, and the orthogonal projection of the filter layer 31 in the driving backplate 10 covers the orthogonal projection of the light-emitting device 20 in the driving backplate 10.

[0039] In detail, the AMOLED display device in this application embodiment is a rigid AMOLED display device. The shape of the AMOLED display device can be rectangular, rounded rectangle, or circular, etc. That is, the shape of the driving backplate 10 can be rectangular, rounded rectangle, or circular, etc., and the shape of the encapsulation substrate 30 can be rectangular, rounded rectangle, or circular, etc.

[0040] The material of the drive backplate 10 can typically be glass, such as quartz glass, soda-lime glass, and aluminosilicate glass. Aluminosilicate glass is mainly used in mobile phones or televisions. Of course, the embodiments in this application are only illustrative and are not intended to limit the scope of the application.

[0041] The light-emitting device 20 includes a first electrode layer, a pixel definition layer, a functional layer, and a second electrode layer. The first electrode layer is disposed on the display area of ​​the driving backplane 10. The functional layer is disposed on the first electrode layer and includes at least one blue light emitter, at least one green light emitter, and at least one red light emitter. The pixel definition layer is disposed on the first electrode layer and separates each organic light-emitting device 20 to form the area of ​​each sub-pixel 21. The second electrode layer is disposed on the functional layer.

[0042] Pixel driver circuits are used to control blue, green, and red LEDs. A typical pixel driver circuit includes a driving circuit composed of switching transistors, driving transistors, and storage capacitors. Pixel driver circuits include 7T1C driver circuits, 8T1C driver circuits, etc.

[0043] The control circuit 40 is used to control the pixel driving circuit and typically includes a scan driver, a data driver, a timing controller, a power management circuit, etc. One of the first electrode layer and the second electrode layer is an anode layer, and the other is a cathode layer.

[0044] Blue light emitters can be organic light-emitting diodes (OLEDs), micro light-emitting diodes (Micro LEDs), quantum dot light-emitting diodes (QLEDs), etc. The same applies to green and red light emitters.

[0045] The first electrode layer is located on the first surface 14 of the display area of ​​the driving backplate 10. It is usually a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), which has high light transmittance and good conductivity so that current can be injected into the functional layer evenly. The first electrode layer is electrically connected to the pixel driving circuit.

[0046] The pixel definition layer is set on the first electrode layer, with some areas cut out to expose the first electrode layer below. The pixel definition layer is usually an organic insulating material, such as polyimide, and is formed into a patterned structure with specific openings through photolithography. The pixel definition layer divides the display area into multiple independent sub-pixel 21 regions (such as red, green, and blue sub-pixels 21), with each opening corresponding to a sub-pixel 21, to avoid crosstalk between adjacent sub-pixels 21.

[0047] The functional layer is located above the first electrode layer and fills the opening area of ​​the pixel definition layer. The functional layer includes at least one blue light emitter, at least one green light emitter and at least one red light emitter. The functional layer can be prepared by processes such as vapor deposition or inkjet printing.

[0048] The second electrode layer is usually a metal layer, such as aluminum, silver, magnesium-silver alloy, and aluminum-silver alloy. The second electrode layer covers the entire functional layer and is opposite to the first electrode layer. The second electrode layer is electrically connected to the pixel driving circuit.

[0049] like Figure 5 and Figure 6As shown, the non-display area of ​​the driving backplate 10 is arranged with a first trace 141, which is used to electrically connect the control circuit 40 and the second trace 151. The second trace 151 is electrically connected to the bonding pad 13, which is connected to the external driving circuit to obtain electrical signals and current. The control current and signals are transmitted to the pixel driving circuit through the control circuit 40, and the pixel driving circuit controls the light-emitting device 20. If the bonding pad 13 is also placed on the first surface 14, it will occupy additional space in the non-display area, resulting in an increase in the bezel width. It will also increase the overall thickness of the driving backplate 10 and the packaging substrate 30. By placing the bonding pad 13 on the second surface 15, the control circuit 40 can be electrically connected to the bonding pad 13 through the first trace 141 and the second trace 151 (wherein, the first trace 141 and the second trace 151 are connected through sidewall traces or edge vias), thereby compressing the width of the non-display area and increasing the screen ratio.

[0050] When forming the first trace 141 and the second trace 151, photolithography and etching processes can be used to etch trace channels on the insulating layer of the drive backplane 10, and then metal material is deposited to form the first trace 141 and the second trace 151, thereby electrically connecting them to the control circuit 40 and the bonding pads. Then, the first trace 141 and the second trace 151 are connected by means of metal vias or edge settings.

[0051] like Figure 4 and Figure 9 As shown, the encapsulation substrate 30 is bonded and fixed to the first surface 14 of the driving backplate 10. A filter layer 31 is disposed on the surface of the encapsulation substrate 30 near the driving backplate 10. The filter layer 31 divides the encapsulation substrate 30 into sub-regions 311 that are completely aligned with the functional layers in an array. Each sub-region 311 corresponds to a sub-pixel 21. For example, some sub-regions 311 are disposed above the red sub-pixel 21, some sub-regions 311 are disposed above the green sub-pixel 21, and some sub-regions 311 are disposed above the blue sub-pixel 21. The filter layer 31 is directly fabricated on the inner surface of the encapsulation substrate 30 (near the driving backplate 10), making the filter layer 31 a functional coating of the encapsulation substrate 30 rather than an independent substrate. This eliminates the need to increase the thickness of the AMOLED display device, reduces the number of interlayer interfaces and the amount of bonding material, and facilitates the thinning of the AMOLED display device. The filter layer 31 can use organic polymers (such as photoresist-based color filter materials) or nanofilms (such as quantum dot coatings), with a thickness of only micrometers. The filter layer 31 covers the entire orthographic projection of the display area, eliminating the need for additional extension in the non-display area. Therefore, without increasing the thickness of the encapsulation substrate 30, the independent filter and redundant adhesive layer are eliminated, thereby enabling a reduction in the thickness of the AMOLED display device structure without reducing the thickness of the encapsulation substrate 30.

[0052] According to the AMOLED display device of this application embodiment, the encapsulation substrate 30 and the driving backplate 10 are directly bonded and fixed. The encapsulation substrate 30, as the outer substrate covering the light-emitting device 20, can meet some of the mechanical support functions required by the AMOLED display device. In order to meet the overall thickness requirements of the AMOLED display device, the filter layer 31 is directly integrated on the encapsulation substrate 30, which reduces the thickness compared to setting a separate polarizer. There is no need to further reduce the thickness of the encapsulation substrate 30, thereby making the AMOLED display device thinner and lighter while meeting the overall thickness and mechanical strength requirements, which meets the market demand for thinner and lighter electronic products, such as mobile devices like mobile phones. In addition, since there is no need to separately attach polarizers, optical adhesive layers, and glass covers, it can save materials and reduce processing steps.

[0053] In actual use, halo phenomena are prone to occur at the edges of the display area. In order to hide the non-display area on the driving backplate 10 and achieve bezel light shielding, it is necessary to rely on multiple layers of materials such as additional black ink layer (BM), cover glass (CG) edge printing layer or optical adhesive (OCA) light shielding edge, which makes it impossible to further reduce the overall thickness of AMOLED display devices.

[0054] Therefore, this application proposes an AMOLED display device.

[0055] Figure 1 The image shown is a 3D view of an AMOLED display device. Figure 4 The image shown is a front view of the packaging substrate 30. Figure 1 and Figure 4 As shown, in the AMOLED display device according to the embodiment of this application, a photoresist layer 32 is also provided on the surface of the encapsulation substrate 30 near the driving backplate 10. The photoresist layer 32 and the filter layer 31 are in the same layer, and the photoresist layer 32 is disposed around the filter layer 31 to form a closed ring.

[0056] In detail, the photoresist layer 32 is disposed on the surface of the packaging substrate 30 near the driving backplate 10, and is in the same plane as the filter layer 31. The photoresist layer 32 surrounds the entire filter layer 31 to form a continuous closed ring, which can effectively block stray light (such as backlight leakage and substrate reflection) from the edge of the display area from entering the human eye, avoid edge halo, and improve display contrast (especially the purity of black screen). In the narrow bezel design, the ring-shaped photoresist layer 32 can hide the non-display area at the edge of the driving backplate 10, making the bezel appear narrower and the display area more transparent, thereby increasing the screen ratio. In traditional solutions, AMOLED display devices typically require additional black matrix (BM), cover glass (CG) edge printing layers, or optical adhesive (OCA) light-shielding edges to achieve bezel light-shielding and decorative effects. However, in this embodiment, by directly placing the photoresist layer 32 on the encapsulation substrate 30, the separate black matrix or cover glass printing layer is eliminated, reducing the stacking of multiple layers of materials such as CG, OCA, and POL (polarizer), thereby reducing the overall thickness of the AMOLED display device. Furthermore, the light filter layer 31 (especially color filter units made of organic materials) may warp or crack due to thermal expansion during high-temperature encapsulation or long-term use. The photoresist layer 32, as a rigid support structure surrounding the light filter layer 31, provides constraint for the light filter layer 31, maintaining its shape accuracy and extending its lifespan. In addition, during the bonding process between the driving backplane 10 and the encapsulation substrate 30, the closed ring of the photoresist layer 32 can serve as a visual alignment mark, ensuring precise alignment between the light filter layer 31 and the sub-pixels 21 of the underlying light-emitting device 20.

[0057] The shape of the closed ring of the photoresist layer 32 can be flexibly designed according to the shape of the display area and the packaging substrate 30, such as rounded corners, without the need for additional edge treatment. For example, if the shape of the display area is square and the shapes of the driving backplate 10 and the packaging substrate 30 are rectangular, the photoresist layer 32 can be set as a rectangular ring or a square ring. Similarly, if the shape of the display area is circular and the shapes of the driving backplate 10 and the packaging substrate 30 are square, the photoresist layer 32 can be set as a square ring. Furthermore, if the shape of the display area is circular and the shapes of the driving backplate 10 and the packaging substrate 30 are square, the photoresist layer 32 can be set as a circular ring. All the above descriptions of the shape of the photoresist layer 32 are based on the orthographic projection shape of the photoresist layer 10 onto the packaging substrate 30.

[0058] In some embodiments, the thickness of the photoresist layer 32 is the same as the thickness of the filter layer 31.

[0059] In some embodiments, the thickness of the photoresist layer 32 is greater than the thickness of the filter layer 31, so that when the filter layer 31 is stacked with the light-emitting device 20, the photoresist layer 32 can fill the gaps around the light-emitting device 20.

[0060] In some embodiments, the photoresist layer 32 and the filter layer 31 are formed using the same photolithography process. This eliminates the need for an additional independent light-shielding layer (as in conventional solutions where the black matrix BM layer needs to be fabricated separately), reducing the number of photomasks and process steps, and improving production efficiency.

[0061] In some embodiments, the encapsulation substrate 30 and the driving backplane 10 are bonded by glass powder melting. When the encapsulation substrate 30 and the driving backplane 10 are subjected to the glass powder melting process, the photoresist layer 32 can also play a role in blocking the glass powder. Especially when the thickness of the photoresist layer 32 is greater than the thickness of the filter layer 31, it can better prevent the glass powder from overflowing into the display area during the bonding process, thereby reducing the process difficulty and improving the yield of AMOLED display devices.

[0062] In some embodiments, the photoresist layer 32 is made of a black photosensitive resin material with carbon black as the main light-shielding filler, such as epoxy resin-based photosensitive resin, acrylic resin-based photosensitive resin, and polyimide-based photosensitive resin.

[0063] Figure 7 The figure shown is a perspective view of one embodiment of the drive backplate 10; Figure 8 The diagram shown is a perspective view of another embodiment of the drive backplane 10. Figure 7 and Figure 8 As shown, in the AMOLED display device according to the embodiment of this application, the driving backplate 10 includes a first sidewall 11, the two ends of the first sidewall 11 are respectively connected to a first surface and a second surface, a third trace 114 is provided on the first sidewall 11, the first trace 141 and the second trace 151 both extend to the two ends of the driving backplate 10, and the two ends of the third trace 114 are electrically connected to the first trace 141 and the second trace 151 respectively.

[0064] Specifically, when the drive backplate 10 is rectangular or other regular non-circular or non-elliptical shapes, the drive backplate 10 has multiple sidewalls connecting the first surface 14 and the second surface 15, wherein the sidewall where the third routing line 114 is disposed is the first sidewall 11. When the drive backplate 10 is circular or elliptical, the drive backplate 10 has one sidewall connecting the first surface 14 and the second surface 15, which is the first sidewall 11. For example, as... Figure 7 and Figure 8 As shown, the drive backplate 10 is rectangular and has four sidewalls. The first sidewall 11 extends along the width direction, and the other two sidewalls extend along the length direction.

[0065] The first sidewall 11 of the drive backplate 10 is perpendicular or inclined to the first surface (or the second surface). The first sidewall 11 is usually formed directly from the material of the drive backplate 10, such as glass, and then formed by edge cutting.

[0066] The first trace 141 is designed in a conventional planar layout on the first surface 14 and extends to the edge of the drive backplane 10. The third trace 114 extends vertically or obliquely along the first sidewall 11 and is formed by sidewall metallization processes (such as physical vapor deposition PVD, electrochemical plating, etc.). The second trace 151 is electrically connected to the bonding pad 13 on the second surface 15 and extends to the edge of the second surface 15 to connect with the third trace 114.

[0067] In the above embodiments, this configuration eliminates the need for additional vias on the driver backplane 10 to electrically connect the traces 16 on the first surface 14 to the bonding pads 13 on the second surface 15, which is beneficial for achieving a narrow bezel design (since vias require a safe distance from the display area). Simultaneously, by using a third trace 114 on the first sidewall 11 instead of a via, parasitic inductance can be reduced. Of course, using a third trace 114 on the first sidewall 11 allows for more traces 114 to be accommodated in the same space compared to vias, thus supporting higher resolutions.

[0068] It should be noted that the first trace 141, the second trace 151, and the third trace 114 are one-to-one correspondences. The drive backplane 10 is provided with multiple first traces 141, multiple second traces 151, and multiple third traces 114. The figures shown are only illustrative examples of the first traces 141, the second traces 151, and the third traces 114, and are not a limitation on the number of first traces 141, the second traces 151, and the third traces 114.

[0069] For example, in a specific embodiment, an atomic layer deposition (ALD) or chemical vapor deposition (CVD) can be used to form a 5-10 μm thick SiO2 or PI insulating layer on the sidewall to ensure that the portion of the trace 16 on the sidewall is insulated from the drive backplane 10; then, a Cr / Cu / Cr multilayer metal (2-5 μm thick) is deposited by magnetron sputtering.

[0070] In some embodiments, laser direct writing technology is used to form a third trace 114 on the first sidewall 11.

[0071] When the drive backplate 10 is a glass plate, the first sidewall 11 can be formed at a 90° right angle by laser cutting, or it can be cut to form an inclined first sidewall 11, such as 45°. The embodiments of this application can be set as needed. Of course, under normal conditions, it is more common for the first sidewall 11 to be formed at a 90° right angle by laser cutting.

[0072] In actual use, stress concentration is prone to occur at the right-angled edges of the driving backplate 10, especially when the driving backplate 10 is made of glass, which is prone to edge glass breakage due to mechanical or thermal stress. Therefore, this application proposes an AMOLED display device.

[0073] like Figure 5 and Figure 6 As shown, in some embodiments, the first sidewall 11 includes a straight wall surface 113 and a first guide surface 111. The first guide surface 111 connects the first surface 14 and the straight wall surface 113. The two ends of the first guide surface 111 are flush with the two end edges of the first surface 14. The thickness of the area of ​​the drive back plate 10 where the first guide surface 111 is disposed is less than the thickness of the area of ​​the drive back plate 10 where the first surface 14 is disposed.

[0074] Understandably, setting the first guide surface 111 can eliminate right-angle edges at the edges, avoiding glass breakage, third trace 114 breakage, or interface failure caused by mechanical or thermal stress, and reducing the risk of cracking. In addition, this also facilitates the setting of the edge protection layer 17 on the third trace 114. Of course, setting the first guide surface 111 can reduce the width of the non-display area (the space occupied by the bevel is less than the space occupied by the right-angle edge), which is also conducive to the setting of a narrow bezel (compared to the space required for the drive backplate 10 to form a right-angle edge).

[0075] like Figure 5 , Figure 6 as well as Figure 8 As shown, the first sidewall 11 also includes a second guide surface 112, which connects the second surface and the straight wall surface 113. The two ends of the second guide surface 112 are flush with the two ends of the second surface. The thickness of the area of ​​the drive back plate 10 where the second guide surface 112 is disposed is less than the thickness of the area of ​​the drive back plate 10 where the second surface is disposed.

[0076] In other words, in some embodiments, the AMOLED display device includes a first guide surface 111; in some embodiments, the AMOLED display device includes both a first guide surface 111 and a second guide surface 112.

[0077] Understandably, setting the second guide surface 112 helps to reduce right-angle collisions between the edge of the second surface 15 and other components (such as the metal frame), and reduces wear on the third trace 114 caused by friction or compression.

[0078] In addition, whether the stress comes from one side of the first surface 14 (e.g., touch pressing) or one side of the second surface 15 (e.g., housing compression), the deformation can be dispersed by the guide surfaces 11 on both sides, for example, when the AMOLED display device is used in a vehicle.

[0079] Of course, when machining the guide surface 11, micro-cracks on the edge of the drive back plate 10 can also be removed (the original right-angle edge is prone to residual cutting defects), thereby improving the product yield.

[0080] like Figure 7 and Figure 8 As shown, in some embodiments, the widths of the first trace 141, the second trace 151, and the third trace 114 are all the same. This allows the first trace 141, the second trace 151, and the third trace 114 to have consistent electrical characteristics such as resistance, capacitance, and inductance.

[0081] In some embodiments, the first trace 141, the second trace 151, and the third trace 114 also have the same thickness. This simplifies the manufacturing process, reduces local stress concentration, and improves the overall mechanical stability and durability of the drive backplate 10.

[0082] The first guide surface 111 can be either an arc surface or a plane. When the first guide surface 111 is an arc surface, such as... Figure 5 As shown, this design allows for more even distribution of external stresses (such as those caused by pressing, squeezing, and thermal expansion and contraction due to temperature changes), reducing the risk of breakage at the edges of the trace 16 due to stress concentration. The first guide surface 111, configured as an arc surface, effectively eliminates these initial defects through edge rounding treatment (such as CNC grinding and chemical polishing), improving edge strength and reducing the risk of edge breakage of the drive backplate 10 during subsequent assembly or use. The arc surface of the first guide surface 111 also provides sufficient bending space, ensuring that the bending radius of the trace 16 at the edge transition of the drive backplate 10 meets process standards, avoiding metal layer breakage or insulation layer damage caused by forced bending. The second guide surface 112 also has the above advantages, which will not be elaborated here.

[0083] like Figure 6 As shown, in some embodiments, the first guide surface 111 is configured as a plane inclined relative to the first surface 14, and the second guide surface 112 is configured as a plane inclined relative to the second surface 15. This simplifies the manufacturing process compared to using an arc surface, requiring only the removal of edge material at a fixed angle. Furthermore, the planar configuration of the first guide surface 111 (second guide surface 112) and the first surface 14 (second surface 15) fixes the angle (e.g., 30°, 45°, and 60°), allowing for uniform distribution of edge stress. Additionally, the planar first guide surface 111 and second guide surface 112 have planar or straight mating surfaces with components such as the metal frame and housing, facilitating tight fit through tolerance design (e.g., snap-fit ​​or adhesive connection between planar surfaces).

[0084] According to the AMOLED display device of the present application embodiment, the thickness of the encapsulation substrate 30 is 0.5mm to 1.0mm, and the encapsulation substrate 30 and the driving backplate 10 have the same shape.

[0085] The thickness of the packaging substrate 30 is 0.5mm to 1.0mm, which ensures that the packaging substrate 30 has sufficient rigidity to avoid breakage. Specifically, the thickness of the packaging substrate 30 can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm, etc. For example, when the thickness of the packaging substrate 30 is 0.5mm, it is suitable for applications such as mobile phones and tablets; as another example, when the thickness of the packaging substrate 30 is 1mm, it is suitable for display devices in automotive and industrial control environments.

[0086] It is understood that the packaging substrate 30 and the driving backplate 10 have the same shape. For example, in one embodiment, when the packaging substrate 30 is rectangular, the driving backplate 10 is also rectangular, and the width and length of the two are the same, so that the packaging substrate 30 and the driving backplate 10 form a rigid whole after being bonded together. When subjected to force (such as pressing or squeezing), the stress is evenly distributed, which significantly improves the resistance to mechanical damage, especially in vibration or impact scenarios such as automotive and industrial control.

[0087] like Figure 1 , Figure 3 as well as Figure 4 As shown, in the AMOLED display device according to the embodiment of this application, the encapsulation substrate 30 is provided with a first adhesive region 33, the first adhesive region 33 is sleeved outside the filter layer 31, and the driving backplate 10 is provided with a second adhesive region 12. The first adhesive region 33 and the second adhesive region 12 face each other and are sandwiched with a glass powder adhesive layer.

[0088] In the above embodiments, the first adhesive region 33 is located on the encapsulation substrate 30, and has a ring-shaped or frame-shaped structure, sleeved outside the filter layer 31 (when a photoresist layer 32 is provided on the encapsulation substrate 30, the first adhesive region 33 is sleeved outside the photoresist layer 32, that is, the photoresist layer 32 is located inside the adhesive region). The second adhesive region 12 is located on the driving backplate 10, and is completely aligned with the first adhesive region 33 of the encapsulation substrate 30, having a ring-shaped or frame-shaped structure (the first adhesive region 33 and the second adhesive region 12 are both ring-shaped or both frame-shaped). The first adhesive region 33 and the second adhesive region 12 are directly opposite each other and sandwiched with a glass powder adhesive layer. After the glass powder adhesive layer is cured, it forms a dense inorganic barrier, which can effectively prevent external moisture and oxygen from entering the interior of the AMOLED display device. Compared with organic adhesives, the glass powder has an extremely low shrinkage rate after curing, and is not prone to stress concentration due to changes in ambient temperature during long-term use, which can ensure that the bonding interface with the first adhesive region 33 and the second adhesive region 12 remains stable.

[0089] Both the packaging substrate 30 and the driving backplate 10 are made of glass.

[0090] Since the first trace 141 needs to be electrically connected to the third trace 114, the first trace 141 passes through the second bonding area 12. The first trace 141 needs to maintain good conductivity and surface cleanliness, and the coating of glass powder may damage the first trace 141. Therefore, this application proposes an AMOLED display device.

[0091] In some embodiments, the AMOLED display device further includes an edge protection layer 17, which covers the third trace 114 to prevent the third trace 114 from being directly exposed, oxidized, or short-circuited due to edge damage. The edge protection layer 17 can be photoresist or polyimide.

[0092] In this way, when producing AMOLED display devices, an edge protection layer 17 is first covered on the third trace 114, and then glass powder is coated on the second bonding area 12. When coating the glass powder, the third trace 114 can be avoided and a safe distance can be maintained.

[0093] There are two types of implementation examples for the process used to produce AMOLED display devices:

[0094] Example 1,

[0095] The process for manufacturing AMOLED display devices according to embodiments of this application includes the following steps:

[0096] Step S10: Fabricate light-emitting device 20 and trace 16 on the driving backplane 10;

[0097] Step S12: Fabricate a filter layer 31 on the packaging substrate 30 and cut the packaging substrate 30;

[0098] Step S14: Align and bond the driving backplate 10 and the encapsulation substrate 30 to obtain an AMOLED display device.

[0099] In step S10, a rigid driving backplate 10 is first prepared, and its surface is cleaned and pretreated. A light-emitting device 20 is fabricated on the driving backplate 10, including a first electrode layer, a pixel definition layer, a functional layer and a second electrode layer. Metal traces 16 (such as copper or aluminum) are fabricated on the driving backplate 10 by photolithography and metal etching processes.

[0100] In step S12, a filter layer 31 is prepared on the packaging substrate 30 by photolithography and coating processes. When the AMOLED display device is provided with a photoresist layer 32, a photoresist layer 32 also needs to be prepared on the packaging substrate 30. The packaging substrate 30 is cut using laser cutting or diamond cutting wheel to form a small packaging substrate 30. Before being bonded to the driving backplate 10, the packaging substrate 30 is cut first, which requires high precision, but can avoid the possibility of affecting the wiring 16 when cutting after bonding.

[0101] In step S14, glass powder mixed with flux is printed or coated on the second adhesive area 12 of the drive backplate 10, and glass powder mixed with flux is printed or coated on the first adhesive area 33 of the encapsulation substrate 30. After aligning the second adhesive area 12 and the first adhesive area 33, the mixture is heated and sintered (typically 300-500°C) to form a glass powder adhesive layer. The main components of the glass powder are SiO2, B2O3, etc.

[0102] Example 2,

[0103] like Figure 10 As shown, the process for manufacturing AMOLED display devices according to an embodiment of this application includes the following steps:

[0104] Step S22: Fabricate light-emitting device 20 and wiring 16 on driving backplate 10, and fabricate filter layer 31 on packaging substrate 30;

[0105] Step S24: Align and bond the drive backplane 10 and the packaging substrate 30;

[0106] Step S26: Cut to obtain AMOLED display device.

[0107] In step S22, a rigid driving backplate 10 is first prepared, and its surface is cleaned and pretreated. A light-emitting device 20 is fabricated on the driving backplate 10, including a first electrode layer, a pixel definition layer, a functional layer and a second electrode layer. Metal traces 16 (such as copper or aluminum) are fabricated on the driving backplate 10 by photolithography and metal etching processes.

[0108] A filter layer 31 is prepared on the packaging substrate 30 by photolithography and coating processes. When the AMOLED display device is provided with a photoresist layer 32, a photoresist layer 32 also needs to be prepared on the packaging substrate 30.

[0109] In step S24, glass powder mixed with flux is printed or coated on the second adhesive area 12 of the drive backplate 10, and glass powder mixed with flux is printed or coated on the first adhesive area 33 of the encapsulation substrate 30. After aligning the second adhesive area 12 and the first adhesive area 33, the mixture is heated and sintered (typically 300-500°C) to form a glass powder adhesive layer. The main components of the glass powder are SiO2, B2O3, etc.

[0110] In step S26, a large-area encapsulation substrate 30 is divided along a preset cutting line using a laser cutter or a diamond cutting wheel to form a single AMOLED display device.

[0111] The main difference between Embodiment 1 and Embodiment 2 is whether the large plate of the packaging substrate 30 is cut first and then fixed to the driving back plate 10, or whether it is fixed to the driving back plate 30 first and then the packaging substrate 30 is cut.

[0112] The display device according to the embodiments of this application includes the AMOLED display device described above.

[0113] According to the display device of this application embodiment, since the AMOLED display device directly integrates the filter layer 31 onto the encapsulation substrate 30, the thickness is reduced compared to setting a separate polarizer. This eliminates the need to further reduce the thickness of the encapsulation substrate 30, thereby making the AMOLED display device thinner and lighter while meeting overall thickness and mechanical strength requirements. This satisfies market demands for thinner and lighter display devices, such as mobile devices like smartphones. Furthermore, since there is no need to separately attach polarizers, optical adhesive layers, and glass covers, it saves materials and reduces processing steps.

[0114] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “” used herein may also indicate the inclusion of the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated, unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0115] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0116] In the above embodiments, the display device can be any product or component with display function, such as a television, monitor, advertising screen, mobile phone, watch, tablet computer, laptop computer, navigator, or vehicle dashboard.

[0117] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An AMOLED display device, characterized in that, include: A driving backplane includes a first surface and a second surface opposite each other along the thickness direction. The first surface includes a display area and a non-display area. The display area is provided with a pixel driving circuit and a light-emitting device. The pixel driving circuit is disposed on the driving backplane, and the light-emitting device is stacked on the pixel driving circuit. The non-display area is provided with a control circuit and a first trace. The light-emitting device is electrically connected to the control circuit through the pixel driving circuit. The second surface is provided with a bonding pad and a second trace. The control circuit is electrically connected to the bonding pad through the first trace and the second trace. An encapsulation substrate is attached and fixed to the first surface of the driving backplate. A filter layer is disposed on the side surface of the encapsulation substrate near the driving backplate. The filter layer is directly opposite the light-emitting device, and the orthogonal projection of the filter layer in the driving backplate covers the orthogonal projection of the light-emitting device in the driving backplate.

2. The AMOLED display device according to claim 1, characterized in that, A photoresist layer is also provided on the surface of the packaging substrate near the driving backplate. The photoresist layer and the filter layer are in the same layer. The photoresist layer surrounds the filter layer and forms a closed ring.

3. The AMOLED display device according to claim 1, characterized in that, The drive backplate includes a first sidewall, the two ends of which are connected to the first surface and the second surface, respectively. A third trace is provided on the first sidewall, and both the first trace and the second trace extend to the two ends of the drive backplate. The two ends of the third trace are electrically connected to the first trace and the second trace, respectively.

4. The AMOLED display device according to claim 3, characterized in that, The first sidewall includes a straight wall surface and a first guide surface. The first guide surface connects the first surface and the straight wall surface. The two ends of the first guide surface are flush with the two end edges of the first surface. The thickness of the area of ​​the drive back plate where the first guide surface is disposed is less than the thickness of the area of ​​the drive back plate where the first surface is disposed.

5. The AMOLED display device according to claim 4, characterized in that, The first sidewall also includes a second guide surface, which connects the second surface and the straight wall surface. The two ends of the second guide surface are flush with the two end edges of the second surface. The thickness of the area of ​​the drive back plate where the second guide surface is disposed is less than the thickness of the area of ​​the drive back plate where the second surface is disposed.

6. The AMOLED display device according to claim 3, characterized in that, The widths of the first trace, the second trace, and the third trace are all the same.

7. The AMOLED display device according to claim 1, characterized in that, The thickness of the packaging substrate is 0.5mm to 1.0mm, and the packaging substrate and the drive backplate have the same shape.

8. The AMOLED display device according to any one of claims 1-7, characterized in that, The encapsulation substrate is provided with a first adhesive area, which is sleeved outside the filter layer. The drive backplate is provided with a second adhesive area, and the first adhesive area and the second adhesive area are facing each other and sandwiched with a glass powder adhesive layer.

9. A process for producing an AMOLED display device as described in any one of claims 1-8, characterized in that, Includes the following steps: Light-emitting devices and traces are fabricated on the driver backplane, and a filter layer is fabricated on the packaging substrate. Align and bond the drive backplate and the packaging substrate; Cut to obtain AMOLED display devices.

10. A display device, characterized in that, Includes the AMOLED display device as described in any one of claims 1-8.

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