Display panel, display module and display device

Abstract

The application provides a display panel, a display module and a display device. The display panel provided by the application is provided with an isolation structure. The orthographic projection of the isolation structure on an array substrate is located in a first bonding area and at least partially surrounds a first bonding terminal. The isolation structure is used to isolate water vapor and reduce the risk of water vapor invasion, thereby improving the reliability of packaging and the performance of the display panel. Meanwhile, a voltage signal is configured on the isolation structure to generate Joule heat. The Joule heat can drive away the water vapor that may be latent in the surrounding area, thereby reducing the risk of water vapor invasion.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, display module, and display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) is an active-matrix light-emitting device with a sandwich structure consisting of multiple organic layers and electrodes on both sides. Currently, AMOLED (Active-Matrix Organic Light-Emitting Diode) based displays have been commercialized in fields such as smartphones, watches, and laptops.

[0003] However, the performance of existing displays needs to be improved. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a display panel that can improve the packaging effect and improve the performance of the display panel.

[0005] For the purposes described above, this application provides a display panel comprising:

[0006] An array substrate includes a display area and a non-display area, at least a portion of the non-display area including a first bonding area, and the array substrate further includes a first bonding terminal located in the first bonding area;

[0007] COF substrate, the COF substrate includes a second bonding area, a second bonding terminal and a third bonding terminal, the second bonding terminal and the third bonding terminal are located in the second bonding area, and the second bonding terminal is connected to the first bonding terminal;

[0008] An isolation structure, wherein the orthographic projection of the isolation structure on the array substrate is located in the first bonding region and at least partially surrounds the first bonding terminal;

[0009] The third bonding terminal includes a first sub-terminal and a second sub-terminal. The isolation structure includes a first isolation portion and a second isolation portion. The first isolation portion and the second isolation portion are electrically connected. The first isolation portion and the second isolation portion are arranged along a first direction and extend along a second direction. The orthographic projections of the first isolation portion and the second isolation portion on the display panel are respectively disposed on both sides of the first bonding terminal. The first sub-terminal is connected to the first isolation portion, and the second sub-terminal is connected to the second isolation portion. Different voltage signals are respectively disposed on the first sub-terminal and the second sub-terminal to form a voltage difference between the first isolation portion and the second isolation portion, causing the isolation structure to generate Joule heating. The first direction and the second direction intersect.

[0010] In one embodiment, the array substrate further includes a third sub-terminal and a fourth sub-terminal, the third sub-terminal and the fourth sub-terminal being located in the first bonding area, the third sub-terminal and the fourth sub-terminal being arranged along the first direction and respectively disposed on both sides of the first bonding terminal, the first isolation portion being connected to the third sub-terminal through a via, the second isolation portion being connected to the fourth sub-terminal through a via, the third sub-terminal being connected to the first sub-terminal, and the fourth sub-terminal being connected to the second sub-terminal.

[0011] In one embodiment, the isolation structure further includes a third isolation portion and a fourth isolation portion, the third isolation portion and the fourth isolation portion extending along the first direction and arranged along the second direction, the first isolation portion, the third isolation portion, the second isolation portion and the fourth isolation portion being sequentially connected to form a ring surrounding the first bonding terminal;

[0012] Preferably, the third isolation portion and the fourth isolation portion have the same height, the first isolation portion and the second isolation portion have the same height, and the height of the third isolation portion is greater than the height of the first isolation portion;

[0013] Preferably, the display panel further includes an anisotropic conductive film located between the COF substrate and the array substrate; the height of the third isolation portion is greater than the height of the first isolation portion, and the height difference is less than or equal to half the diameter of the anisotropic conductive film.

[0014] In one embodiment, the third isolation portion or the fourth isolation portion is bonded to a corresponding position on the COF substrate;

[0015] Preferably, the third isolation portion or the fourth isolation portion is exposed to form a first exposed conductive portion, the COF substrate includes a second exposed conductive portion, the second exposed conductive portion is bonded to the first exposed conductive portion through anisotropic conductive film, and the two ends of the second exposed conductive portion are respectively connected to the first sub-terminal and the second sub-terminal through connecting lines.

[0016] In one embodiment, the array substrate includes a substrate and an active layer and a plurality of metal layers disposed on the substrate, wherein the isolation structure is located in one or more of the active layer and the plurality of metal layers;

[0017] Preferably, the isolation structure and the first bonding terminal are located in different film layers.

[0018] In one embodiment, the array substrate includes a plurality of first bonding terminals, which are spaced apart along a first direction; the COF substrate includes a plurality of second bonding terminals, which are spaced apart along the first direction, and each second bonding terminal is connected to a corresponding first bonding terminal.

[0019] In one embodiment, the distance between the isolation structure and the first bonding terminal is greater than the distance between two adjacent first bonding terminals.

[0020] In one embodiment, the orthographic projection of the isolation structure onto the array substrate surrounds the first bonding terminal to form a ring.

[0021] Based on the same inventive concept, this application also discloses a display module, which includes the aforementioned display panel.

[0022] Based on the same inventive concept, this application also discloses a display device, which includes the display module described above.

[0023] Compared with the prior art, the display panel provided in this application, by setting an isolation structure, the orthographic projection of the isolation structure on the array substrate is located in the first bonding area and at least partially surrounds the first bonding terminal. The isolation structure isolates moisture, reduces the risk of moisture intrusion, improves the reliability of the packaging, and enhances the performance of the display panel.

[0024] Meanwhile, by configuring a voltage signal on the isolation structure to generate Joule heat, the Joule heat can dissipate any potential moisture in the surrounding area, further reducing the risk of moisture intrusion. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a related display panel;

[0027] Figure 2 This is a partial structural schematic diagram of the array substrate in one embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the film layer structure of the array substrate in one embodiment of this application;

[0029] Figure 4 This is a schematic diagram of the film layer structure of the display panel in one embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the structure of a COF substrate in one embodiment of this application;

[0031] Figure 6 This is a schematic diagram of the structure of the display panel in one embodiment of this application;

[0032] Figure 7 This is a schematic diagram of the COF substrate structure in another embodiment of this application;

[0033] Figure 8 This is a partial structural diagram of the array substrate in another embodiment of this application;

[0034] Figure 9 This is a schematic diagram of the COF substrate structure in another embodiment of this application;

[0035] Figure 10 This is a partial structural schematic diagram of the array substrate in another embodiment of this application.

[0036] Marker explanation:

[0037] 100. Display panel;

[0038] 10. Array substrate; 11. Display area; 12. Non-display area; 13. First bonding area; 14. First bonding terminal; 15. Third sub-terminal; 16. Fourth sub-terminal; 17. Substrate; 18. Active layer;

[0039] 20. COF substrate; 21. Second bonding area; 22. Second bonding terminal; 23. Third bonding terminal; 24. First sub-terminal; 25. Second sub-terminal; 26. Second exposed conductive part; 27. Connecting line;

[0040] 30. Isolation structure; 31. First isolation part; 32. Second isolation part; 33. Third isolation part; 34. Fourth isolation part; 35. First exposed conductive part. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0042] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] Please refer to Figure 1 As shown, a related display panel 100 is provided. The display panel 100 includes an array substrate 10 and a COF (Chip On Film) substrate 20. The array substrate 10 includes a display area 11 and a non-display area 12. One of the non-display areas 12 includes a first bonding area 13. A driving module is provided on the COF substrate 20. The driving module is connected to a circuit board and is connected to the array substrate 10 through the first bonding area 13.

[0044] Through long-term research, the inventors discovered that water vapor can easily penetrate into the first bonding area 13, causing the membrane layer of the first bonding area 13 to peel. In the peeled area, the anisotropic conductive film particles are faint. Due to the large impedance of the corresponding terminals, the signals cannot be effectively transmitted, resulting in display abnormalities such as bright lines and yellowish screen.

[0045] Based on this, this application provides a display panel solution to solve the above problems.

[0046] Please refer to Figures 1-6 As shown, a display panel 100 provided in an embodiment of this application is shown. The display panel 100 includes an array substrate 10, a COF substrate 20 and an isolation structure 30.

[0047] The array substrate 10 includes a display area 11 and a non-display area 12. At least a portion of the non-display area 12 includes a first bonding area 13. The array substrate 10 also includes a first bonding terminal 14 located in the first bonding area 13. The COF substrate 20 includes a second bonding area 21, a second bonding terminal 22, and a third bonding terminal 23. The second bonding terminal 22 and the third bonding terminal 23 are located in the second bonding area 21. The second bonding terminal 22 is connected to the first bonding terminal 14. The orthographic projection of the isolation structure 30 on the array substrate 10 is located in the first bonding area 13 and at least partially surrounds the first bonding terminal 14.

[0048] The third bonding terminal 23 includes a first sub-terminal 24 and a second sub-terminal 25. The isolation structure 30 includes a first isolation portion 31 and a second isolation portion 32, which are electrically connected. The first isolation portion 31 and the second isolation portion 32 are arranged along a first direction (X direction in the figure) and extend along a second direction (Y direction in the figure). The orthographic projections of the first isolation portion 31 and the second isolation portion 32 on the display panel 100 are respectively disposed on both sides of the first bonding terminal 14. The first sub-terminal 24 is connected to the first isolation portion 31, and the second sub-terminal 25 is connected to the second isolation portion 32. Different voltage signals are respectively disposed on the first sub-terminal 24 and the second sub-terminal 25 to form a voltage difference between the first isolation portion 31 and the second isolation portion 32, causing the isolation structure 30 to generate Joule heating. The first direction and the second direction intersect. Optionally, the first direction and the second direction are at an angle of 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 85 degrees, or 90 degrees.

[0049] The display panel 100 provided in this embodiment has an isolation structure 30. The orthographic projection of the isolation structure 30 on the array substrate 10 is located in the first bonding area 13 and at least partially surrounds the first bonding terminal 14. The isolation structure 30 isolates moisture, reduces the risk of moisture intrusion, improves the reliability of the packaging, and improves the performance of the display panel 100.

[0050] Specifically, the isolation structure 30 can effectively isolate moisture and prevent the particles of the anisotropic conductive film from fading. This prevents the second bonding terminal 22 and the first bonding terminal 14 from failing to transmit signals effectively due to their large impedance, thereby preventing display abnormalities such as bright lines or yellowish screen on the display panel 100 and ensuring the normal display of the display panel 100.

[0051] Meanwhile, by configuring a voltage signal on the isolation structure 30, the isolation structure 30 generates Joule heat, which can dissipate any water vapor that may be lurking around, reducing the risk of water vapor intrusion.

[0052] Specifically, Joule heating is the heat generated when an electric current passes through a conductor, and its generation principle is mainly based on the following aspects:

[0053] Directed movement and collisions of electrons: When a potential difference exists between the two ends of a conductor, free electrons in the conductor will move in a directed manner under the influence of the electric field, forming an electric current. During this movement, electrons will continuously collide with atoms, ions, and other particles in the conductor.

[0054] Energy Conversion: When electrons collide, they transfer some of their kinetic energy to atoms or ions, intensifying their thermal motion. From a microscopic perspective, the directional kinetic energy of electrons is converted into the random thermal energy of atoms and ions. Frequent collisions between a large number of electrons and atoms / ions cause this energy conversion to accumulate continuously, which macroscopically manifests as conductor heating, producing Joule heating.

[0055] Optionally, the third bonding terminal 23 can be selectively configured with a voltage signal for the isolation structure 30. For example, when the display panel 100 is in standby mode or undergoing RA testing in a humid environment, configuring a voltage signal for the isolation structure 30 via the third bonding terminal 23 can dissipate any potential moisture in the surrounding area through Joule heating, reducing the risk of moisture intrusion. When the display panel 100 is in normal use, not configuring a voltage signal for the isolation structure 30 via the third bonding terminal 23 helps save energy and improve the display panel's battery life.

[0056] Optionally, the array substrate 10 includes the following structure:

[0057] Substrate: Generally made of materials such as glass or plastic, it provides mechanical support for the entire array substrate, while requiring good insulation and chemical stability to ensure that the substrate's performance is not affected under various environmental conditions.

[0058] Driving circuit: Composed of components such as thin-film transistors (TFTs), it controls the light emission of each OLED pixel. It includes row driving circuits and column driving circuits. The row driving circuit is responsible for scanning and activating pixels row by row, while the column driving circuit transmits data signals to the corresponding column pixels. Through their coordinated operation, precise control of the OLED pixels is achieved, thereby displaying accurate images.

[0059] Pixel electrode: Connected to the driving circuit, it is usually made of a transparent conductive material, such as indium tin oxide (ITO). Its function is to transmit the electrical signal output from the driving circuit to the OLED light-emitting layer, providing the required electric field for the light-emitting layer, so that the OLED material emits light under the action of the electric field.

[0060] Organic light-emitting layer: This is the core component of OLEDs, composed of organic light-emitting materials. When an appropriate voltage is applied to the pixel electrode, electrons and holes in the organic light-emitting layer combine to generate excitons. These excitons recombine and emit photons, thus achieving light emission. Depending on the light-emitting materials and structural design, different colors such as red, green, and blue can be emitted. Full-color display can be achieved through the combination of these three primary colors.

[0061] Common electrode: Opposite to the pixel electrode, it is usually a metal electrode, such as aluminum or silver. Together with the pixel electrode, it forms an electric field, placing the organic light-emitting layer in a suitable electric field environment. It also serves to collect charges and ensure smooth current flow.

[0062] Passivation layer: Covering the entire surface of the array substrate, it is generally made of inorganic or organic materials, such as silicon nitride or polyimide. Its main function is to protect the internal circuitry and light-emitting layer from the influence of the external environment, such as moisture and oxygen, preventing these substances from damaging the device performance and improving the stability and lifespan of the device.

[0063] Light-shielding layer: Located between pixels, it prevents light crosstalk between adjacent pixels and improves the contrast of the displayed image. It is usually made of materials such as black photoresist or metal, which can effectively block the propagation of light between pixels, so that the light emitted by each pixel can be accurately observed without affecting the display effect of surrounding pixels.

[0064] Planarization layer: Used to make the substrate surface smoother, facilitating the uniform deposition and fabrication of subsequent layers. Since structures such as driving circuits may create unevenness on the substrate surface, the planarization layer can fill these unevennesses, providing a smooth surface and ensuring the uniformity of subsequent thin films such as organic light-emitting layers, thereby improving display quality.

[0065] Optionally, the COF substrate 20 includes the following structure:

[0066] Flexible base film: It is usually made of materials such as polyimide (PI), which has good flexibility, insulation and high temperature resistance, and can provide support and protection for chips and circuits.

[0067] Metal layer: Typically a copper layer, formed into circuit patterns through processes such as deposition and etching, used to transmit electrical signals. To improve conductivity and reliability, other metals, such as nickel and gold, may also be included.

[0068] Solder resist: Coated on the surface of the substrate to prevent short circuits during soldering and to protect the circuit from the influence of the external environment.

[0069] Other materials, such as epoxy resin adhesive, are used to fix chips and other electronic components, as well as to connect the substrate to other parts.

[0070] COF substrate 20 directly encapsulates the chip on a thin-film substrate, enabling smaller size designs suitable for space-constrained electronic devices such as mobile phones and tablets. It reduces the use of traditional packaging materials, lowers overall weight, and makes electronic devices more portable. The flexible thin-film substrate allows COF packaging to adapt to the design requirements of special shapes such as curved displays, providing possibilities for innovative electronic product appearance. The soldering connection method reduces resistance and interference, improves the stability and reliability of signal transmission, and helps ensure the normal operation of electronic devices.

[0071] A bonding terminal typically consists of metal leads or contacts, an insulating shell, and a fixing device. The metal leads are crucial for achieving the electrical connection; they possess excellent conductivity, ensuring smooth current transmission. The insulating shell encloses the metal leads, preventing short circuits and also protecting them while enhancing structural stability. The fixing device, usually a screw, clip, or solder joint, securely attaches the bonding terminal to the circuit board or other equipment.

[0072] Bonding terminals establish electrical conductivity by connecting the pins or wires of electronic components to their own metal leads. Common connection methods include soldering, crimping, and plug-in bonding. For example, soldering melts the solder between the electronic component pins and the bonding terminal's metal leads through heating, forming a strong electrical and mechanical connection upon cooling. Crimping uses external force to press the wires or component pins into the specific structure of the bonding terminal, achieving tight contact and conductivity. Plug-in bonding terminals achieve electrical connection by inserting the component pins into the terminal's socket, utilizing elastic contact.

[0073] In the bonding process between the array substrate 10 and the COF substrate 20, the bonding terminals serve as a bridge to achieve electrical connection between the two. They connect the electrode lines on the array substrate 10 to the pins of the driver chip on the COF substrate 20, enabling the driver chip to provide the necessary driving signals and power to the OLED pixels, thereby controlling the OLED's light emission state and realizing image display.

[0074] The bonding terminals provide a reliable mechanical fixation for the array substrate 10 and the COF substrate 20. During the bonding process, specific processes (such as hot pressing, ultrasonic welding, etc.) are used to tightly bond the bonding terminals to the two substrates, ensuring that even if subjected to certain external forces or vibrations during subsequent use, there will be no relative displacement between the COF substrate 20 and the array substrate 10, thus guaranteeing the stability and reliability of the electrical connection.

[0075] Bonding terminals not only transmit drive signals and power, but also provide a certain degree of signal protection. For example, some bonding terminals have electromagnetic shielding capabilities, which can reduce the impact of external electromagnetic interference on signal transmission, prevent signal distortion or errors, and ensure that the display panel can receive accurate drive signals, thereby achieving high-quality image display.

[0076] Furthermore, the bonding process can be hot-press bonding or ultrasonic bonding, etc.

[0077] Hot-press bonding is a common bonding process that uses heat and pressure to cause physical and chemical changes in the materials (such as solder, anisotropic conductive adhesive, etc.) between the bonding terminals and the substrate, achieving a connection. During hot-press bonding, precise control of parameters such as temperature, pressure, and time is crucial to ensure bonding quality. Generally, the temperature is set according to the characteristics of the materials used, typically ranging from tens to hundreds of degrees Celsius; the pressure is adjusted based on the material and size of the substrate and bonding terminals, generally ranging from a few Newtons to tens of Newtons; and the time is also critical—too short a time may result in a weak connection, while too long a time may damage materials or equipment, typically ranging from a few seconds to tens of seconds.

[0078] Ultrasonic bonding utilizes the high-frequency vibration energy of ultrasound to cause violent movement of atoms on the substrate surface, thereby achieving metal-to-metal bonding at the microscopic level. The advantages of ultrasonic bonding include its ability to be performed at lower temperatures, reducing damage to heat-sensitive materials, and achieving high connection strength. In ultrasonic bonding, the frequency, power, and duration of the ultrasound waves are key parameters. The frequency is typically between tens and hundreds of kilohertz, the power is adjusted from a few watts to tens of watts depending on the specific situation, and the duration is generally between a few milliseconds and hundreds of milliseconds.

[0079] Furthermore, the metal portion of the bonding terminals is made of materials with good electrical and thermal conductivity, such as copper, gold, and silver. Copper has high conductivity and low cost, making it a commonly used basic material. To improve corrosion resistance and contact performance, precious metals such as gold or silver are usually plated onto the copper surface. Gold has high chemical stability, excellent conductivity, and oxidation resistance, ensuring long-term stable electrical connections, but its cost is relatively high. Silver also has good conductivity and is less expensive than gold, but its oxidation resistance is slightly worse; therefore, it is widely used in cost-sensitive applications with relatively mild operating environments.

[0080] The insulating shell is made of materials with good insulating properties, such as plastics or ceramics. Plastic materials have advantages such as light weight, low cost, and good processability, such as polyimide and epoxy resin. They can adapt to different bonding processes and environmental requirements while ensuring insulation performance. Ceramic materials have higher high temperature resistance, moisture resistance, and insulation performance, making them suitable for some high-end applications with extremely high reliability requirements. However, ceramics are more difficult to process and have a relatively higher cost.

[0081] Please refer to Figure 2 As shown, in one embodiment, the orthographic projection of the isolation structure 30 onto the array substrate 10 surrounds the first bonding terminal 14 to form a ring. This ring-shaped isolation structure 30 provides all-around protection for the first bonding terminal 14, preventing moisture from entering the annular area enclosed by the isolation structure 30. When different voltage signals are applied to the first sub-terminal 24 and the second sub-terminal 25, the annular isolation structure 30 generates Joule heating, forming a ring-shaped heating area that dissipates surrounding moisture. Preferably, the voltage signals applied to the first sub-terminal 24 and the second sub-terminal 25 can be set according to the resistance of the isolation structure 30 to keep the temperature of the isolation structure 30 below 5 degrees Celsius, thus avoiding damage to other film layers and structures due to excessive temperature.

[0082] Please refer to Figure 2 , 5 As shown in Figure 6, in one embodiment, the array substrate 10 includes a plurality of first bonding terminals 14, which are spaced apart along a first direction (X direction in the figure); the COF substrate 20 includes a plurality of second bonding terminals 22, which are spaced apart along the first direction, and each second bonding terminal 22 is connected to a corresponding first bonding terminal 14 to realize the transmission of different signals and improve the performance of the display panel 100.

[0083] Specifically, the first bonding terminal 14 includes a data signal terminal, which is connected to a sub-pixel in the display area 11. Further, the first bonding terminal 14 also includes a drive signal terminal, and the signal configured on the drive signal terminal includes one or more of the following: a clock signal, a positive power supply signal, a negative power supply signal, a reference signal, a constant high-level signal, and a constant low-level signal.

[0084] In one embodiment, the distance between the isolation structure 30 and the first bonding terminal 14 is greater than the distance between two adjacent first bonding terminals 14, thereby reducing signal interference between the isolation structure 30 and the first bonding terminal 14.

[0085] Please refer to Figures 2-6As shown, in one embodiment, the array substrate 10 further includes a third sub-terminal 15 and a fourth sub-terminal 16. The third sub-terminal 15 and the fourth sub-terminal 16 are located in the first bonding region 13. The third sub-terminal 15 and the fourth sub-terminal 16 are arranged along a first direction and are respectively disposed on both sides of the first bonding terminal 14. The first isolation portion 31 is connected to the third sub-terminal 15 through a via, and the second isolation portion 32 is connected to the fourth sub-terminal 16 through a via. The third sub-terminal 15 is connected to the first sub-terminal 24, and the fourth sub-terminal 16 is connected to the second sub-terminal 25.

[0086] Specifically, different voltage signals are configured on the first sub-terminal 24 and the second sub-terminal 25 respectively. The voltage signal on the first sub-terminal 24 is transmitted to the first isolation section 31 through the third sub-terminal 15, and the voltage signal on the second sub-terminal 25 is transmitted to the second isolation section 32 through the fourth sub-terminal 16, so as to form a voltage difference between the first isolation section 31 and the second isolation section 32.

[0087] Please refer to Figures 2-6 As shown, in one embodiment, the isolation structure 30 further includes a third isolation portion 33 and a fourth isolation portion 34. The third isolation portion 33 and the fourth isolation portion 34 extend along a first direction and are arranged along a second direction. The first isolation portion 31, the third isolation portion 33, the second isolation portion 32, and the fourth isolation portion 34 are sequentially connected to form an annulus surrounding the first bonding terminal 14. Moisture cannot enter the annular area surrounded by the isolation structure 30, thus achieving all-round protection for the first bonding terminal 14. Optionally, adjacent isolation portions 31, 33, 32, and 34 are transitioned by an arc angle.

[0088] Preferably, the third isolation section 33 and the fourth isolation section 34 have the same height, the first isolation section 31 and the second isolation section 32 have the same height, and the height of the third isolation section 33 is greater than the height of the first isolation section 31. The third isolation section 33 and the fourth isolation section 34 can form a dam to extend the water vapor intrusion path and improve the water vapor isolation effect.

[0089] Preferably, the display panel 100 further includes an anisotropic conductive film (ACF), which is located between the COF substrate 20 and the array substrate 10. The height of the third isolation portion 33 is greater than the height of the first isolation portion 31, and the height difference is less than or equal to half the diameter of the anisotropic conductive film. For example, the height difference is half, one-third, or one-quarter of the diameter of the anisotropic conductive film. The diameter of the anisotropic conductive film refers to the diameter of the conductive particles in the film. Excessive height difference prevents conductive particles in some areas from making good contact with the terminals, thereby increasing contact resistance and affecting the stability and reliability of signal transmission.

[0090] Anisotropic conductive films are transparent polymer bonding materials that simultaneously possess the three major properties of adhesion, conductivity, and insulation. They are typically composed of thermosetting resin adhesives and conductive particles. Thermosetting resins, such as epoxy resins, have high-temperature stability, low thermal expansion, and low moisture absorption. They can fix the relative positions of the electrodes between the IC chip and the substrate and provide compressive force to maintain the contact area between the electrodes and the conductive particles. The conductive particles are generally spherical, commonly including metal powders and polymer plastic spheres coated with metals, such as nickel, gold, nickel plated with gold, silver, and tin alloys.

[0091] Working principle: ACF is connected via a hot-pressing process. Under heating and pressurization, conductive particles are clamped by the upper and lower electrodes, and the insulating coating on their surface is destroyed, thus making the upper and lower electrodes (Z-axis direction) conductive and realizing the transmission of electrical signals. The conductive particles not clamped by the electrodes remain dispersed in the resin, maintaining horizontal insulation (X, Y axes) and preventing short circuits between adjacent electrodes.

[0092] Anisotropic conductive films provide stable conductive channels within extremely small welding areas, making them suitable for high-density electronic component connections with minute pitches, meeting the high-precision connection requirements of modern electronic devices. Anisotropic conductive films reduce the use of additional welding materials, resulting in more compact connections and facilitating miniaturization and thinner designs of electronic devices. Compared to traditional welding processes, the ACF (Anisotropic Conductive Film) connection process only requires hot pressing under specific temperature, pressure, and time conditions, eliminating the need for complex welding equipment and processes, resulting in high production efficiency and environmental friendliness. Anisotropic conductive films possess excellent adhesion stability, electrical properties, and environmental resistance, ensuring the reliability and stability of connections between electronic components under various operating environments.

[0093] Please refer to Figures 7-8 As shown, in one embodiment, the third isolation portion 33 is bonded to the corresponding position on the COF substrate 20, which helps to reduce the voltage difference between the first sub-terminal 24 and the second sub-terminal 25, and can detect bonding abnormalities in the semi-enclosed area. At the same time, the third isolation portion 33 generates Joule heat under the action of voltage signal, which dissipates moisture that may be lurking around and reduces the risk of moisture intrusion.

[0094] Preferably, the third isolation portion 33 is exposed to form the first exposed conductive portion 35, and the COF substrate 20 includes a second exposed conductive portion 26. The second exposed conductive portion 26 is bonded to the first exposed conductive portion 35 through anisotropic conductive film. The two ends of the second exposed conductive portion 26 are respectively connected to the first sub-terminal 24 and the second sub-terminal 25 through connecting lines 27, which can realize the detection of the three-sided bonding effect.

[0095] Please refer to Figures 9-10As shown, in one embodiment, the fourth isolation portion 34 is bonded to the corresponding position on the COF substrate 20, which helps to reduce the voltage difference between the first sub-terminal 24 and the second sub-terminal 25, and can detect bonding abnormalities in the semi-enclosed area. At the same time, the third isolation portion 33 generates Joule heat under the action of the voltage signal, which dissipates any moisture that may be lurking around and reduces the risk of moisture intrusion.

[0096] Preferably, the fourth isolation portion 34 is exposed to form the first exposed conductive portion 35, and the COF substrate 20 includes a second exposed conductive portion 26. The second exposed conductive portion 26 is bonded to the first exposed conductive portion through anisotropic conductive film. The two ends of the second exposed conductive portion 26 are respectively connected to the first sub-terminal 24 and the second sub-terminal 25 through connecting lines 27, which can realize the detection of the three-sided bonding effect.

[0097] Please refer to Figure 3 As shown, in one embodiment, the array substrate 10 includes a substrate 17 and an active layer 18 and multiple metal layers disposed on the substrate 17. An isolation structure 30 is located in one or more of the active layer 18 and the multiple metal layers, all of which can possess conductive properties to achieve a moisture isolation effect. Exemplarily, the isolation structure 30 is located in the active layer 18; or, it is located in one of the metal layers; or, it is distributed among multiple metal layers; or, it is distributed in both the active layer 18 and the metal layers. Preferably, the isolation structure 30 and the first bonding terminal 14 are located in different film layers.

[0098] Optionally, the array substrate 10 includes a first metal layer, a second metal layer, and a third metal layer sequentially stacked along a direction away from the substrate 17. The first metal layer typically forms the gate of a transistor in the pixel driving circuit; the first and second metal layers typically form the first and second plates of a storage capacitor in the pixel driving circuit; and the third metal layer typically forms the source / drain of the transistor, bridging lines, and metal power lines. An insulating layer is typically disposed between adjacent metal layers. This insulating layer prevents short circuits caused by direct contact between different metal layers, ensuring that the electrical characteristics of each metal layer are not interfered with and maintaining normal circuit function. Simultaneously, it reduces signal interference between adjacent metal layers, improving display quality.

[0099] Based on the same inventive concept, another embodiment of this application discloses a display module, which includes the display panel 100 in the above embodiment.

[0100] This embodiment provides a display module whose display panel 100 incorporates an isolation structure 30. The orthographic projection of the isolation structure 30 onto the array substrate 10 is located in the first bonding area 13 and at least partially surrounds the first bonding terminal 14. This isolation structure 30 isolates moisture, reducing the risk of moisture intrusion, improving packaging reliability, and enhancing the performance of the display panel 100. Furthermore, by configuring a voltage signal on the isolation structure 30, Joule heating is generated, which can dissipate any lurking moisture, further reducing the risk of moisture intrusion.

[0101] Based on the same inventive concept, another embodiment of this application discloses a display device, which includes the display module in the above embodiments. Furthermore, the display device includes mobile phones, VR devices, computers, televisions, in-vehicle display devices, etc.

[0102] This embodiment provides a display device whose display module includes a display panel 100. By setting an isolation structure 30, the orthographic projection of the isolation structure 30 on the array substrate 10 is located in the first bonding area 13 and at least partially surrounds the first bonding terminal 14. The isolation structure 30 is used to isolate moisture, reducing the risk of moisture intrusion. By configuring a voltage signal on the isolation structure 30, the isolation structure 30 generates Joule heat, which can dissipate any moisture that may be lurking around it, thereby improving the reliability of the packaging and the performance of the display device.

[0103] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0104] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0105] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: An array substrate includes a display area and a non-display area, at least a portion of the non-display area including a first bonding area, and the array substrate further includes a first bonding terminal located in the first bonding area; COF substrate, the COF substrate includes a second bonding area, a second bonding terminal and a third bonding terminal, the second bonding terminal and the third bonding terminal are located in the second bonding area, and the second bonding terminal is connected to the first bonding terminal; An isolation structure, wherein the orthographic projection of the isolation structure on the array substrate is located in the first bonding region and at least partially surrounds the first bonding terminal; The third bonding terminal includes a first sub-terminal and a second sub-terminal. The isolation structure includes a first isolation portion and a second isolation portion. The first isolation portion and the second isolation portion are electrically connected. The first isolation portion and the second isolation portion are arranged along a first direction and extend along a second direction. The orthographic projections of the first isolation portion and the second isolation portion on the display panel are respectively disposed on both sides of the first bonding terminal. The first sub-terminal is connected to the first isolation portion, and the second sub-terminal is connected to the second isolation portion. Different voltage signals are respectively disposed on the first sub-terminal and the second sub-terminal to form a voltage difference between the first isolation portion and the second isolation portion, so that the isolation structure generates Joule heating. The first direction intersects with the second direction.

2. The display panel according to claim 1, characterized in that, The array substrate further includes a third sub-terminal and a fourth sub-terminal, the third sub-terminal and the fourth sub-terminal are located in the first bonding area, the third sub-terminal and the fourth sub-terminal are arranged along the first direction and respectively disposed on both sides of the first bonding terminal, the first isolation portion is connected to the third sub-terminal through a via, the second isolation portion is connected to the fourth sub-terminal through a via, the third sub-terminal is connected to the first sub-terminal, and the fourth sub-terminal is connected to the second sub-terminal.

3. The display panel according to claim 2, characterized in that, The isolation structure further includes a third isolation portion and a fourth isolation portion, which extend along the first direction and are arranged along the second direction. The first isolation portion, the third isolation portion, the second isolation portion and the fourth isolation portion are sequentially connected to form a ring surrounding the first bonding terminal. Preferably, the third isolation portion and the fourth isolation portion have the same height, the first isolation portion and the second isolation portion have the same height, and the height of the third isolation portion is greater than the height of the first isolation portion; Preferably, the display panel further includes an anisotropic conductive film located between the COF substrate and the array substrate; the height of the third isolation portion is greater than the height of the first isolation portion, and the height difference is less than or equal to half the diameter of the anisotropic conductive film.

4. The display panel according to claim 3, characterized in that, The third isolation portion or the fourth isolation portion is bonded to a corresponding position on the COF substrate; Preferably, the third isolation portion or the fourth isolation portion is exposed to form a first exposed conductive portion, the COF substrate includes a second exposed conductive portion, the second exposed conductive portion is bonded to the first exposed conductive portion through anisotropic conductive film, and the two ends of the second exposed conductive portion are respectively connected to the first sub-terminal and the second sub-terminal through connecting lines.

5. The display panel according to claim 1, characterized in that, The array substrate includes a substrate and an active layer and a plurality of metal layers disposed on the substrate, wherein the isolation structure is located in one or more of the active layer and the plurality of metal layers; Preferably, the isolation structure and the first bonding terminal are located in different film layers.

6. The display panel according to claim 1, characterized in that, The array substrate includes a plurality of first bonding terminals, which are spaced apart along a first direction; the COF substrate includes a plurality of second bonding terminals, which are spaced apart along the first direction, and each second bonding terminal is connected to a corresponding first bonding terminal.

7. The display panel according to claim 6, characterized in that, The distance between the isolation structure and the first bonding terminal is greater than the distance between two adjacent first bonding terminals.

8. The display panel according to claim 1, characterized in that, The isolation structure, when projected onto the array substrate, surrounds the first bonding terminal to form a ring.

9. A display module, characterized in that, Includes the display panel as described in any one of claims 1-8.

10. A display device, characterized in that, Includes the display module as described in claim 9.

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