Display module and display device

Abstract

The present disclosure relates to the technical field of display, and discloses a display module and a display device. The display panel of the display module comprises a first area, a bending area and a second area. The first area and the second area are connected through the bending area. The second area is bent to the backlight side of the display module through the bending area. A first back plate is located on the second surface of the display panel of the first area. A second back plate is located on the second surface of the display panel of the second area. A buffer composite layer is located between the first back plate and the second back plate. The second back plate is fixed with the buffer composite layer through a first adhesive layer. The first adhesive layer comprises a plurality of independently arranged first sub-sections. The filling glue covers at least the first surface and the second surface of the bending area. The filling glue is at least partially located between adjacent first sub-sections. The display device comprises the above display module. The present disclosure can improve the packaging reliability of the bending area on the basis of realizing a narrow frame, avoid a series of display problems caused by glue pouring cavities, and improve the display effect.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, display devices have gradually become ubiquitous in people's lives. Among them, organic light-emitting diodes (OLEDs) are... OLED (Optical Display Panel) displays are widely used in smart products such as mobile phones, televisions, and laptops due to their advantages such as self-illumination, low power consumption, wide viewing angle, fast response time, and high contrast. Narrow bezels are currently an important development trend in display devices.

[0003] However, in existing technologies, while narrowing the bezels of display devices, the packaging reliability often fails to meet usage requirements. Therefore, ensuring sufficient packaging reliability of the bezel while achieving a narrow bezel, and avoiding a series of display problems, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a display module and a display device to solve the issues of insufficient packaging reliability in existing narrow-bezel display devices, which affect display performance and usability.

[0005] This disclosure provides a display module, including: The display panel includes a first area, a bending area, and a second area, which are connected by the bending area. The first area includes a display area, and the second area is bent to the backlight side of the display module through the bending area. The display panel includes a first surface and a second surface that are disposed opposite to each other. In the bending area, the radius of curvature of the first surface is greater than the radius of curvature of the second surface. A first back panel and a second back panel, wherein the first back panel is located on the second surface of the display panel in the first area, and the second back panel is located on the second surface of the display panel in the second area; A buffer composite layer is located between the first backplate and the second backplate; The first adhesive layer and the second back plate are fixed to the buffer composite layer through the first adhesive layer. The first adhesive layer includes multiple independently set first sub-segments. The filler adhesive covers at least the first and second surfaces of the bending area, and is at least partially located between adjacent first segments.

[0006] Based on the same inventive concept, this disclosure also provides a display device, which includes the above-described display module.

[0007] The technical solution provided in this disclosure has the following advantages compared with the prior art: The display module disclosed herein includes at least a display panel. A first region and a second region of the display panel are connected by a bending region, which is a flexible transition area of ​​the display panel. After bending, the second region can be flipped to the backlight side of the display module, housing the driving traces, bonding pins of the bonding region, and the flexible circuit board subsequently bonded to the bonding region on the backlight side of the display module. This reduces the width of the front-view bezel, achieving a narrow bezel design. The display module also includes a first backplate and a second backplate. The first backplate is located on the second surface of the display panel in the first region, and the second backplate is located on the second surface of the display panel in the second region. Both the first and second backplates can be high-support structures, bonded to the flexible substrate of the display panel via an adhesive layer, providing support beneath the flexible substrate. The bending region does not have a backplate, avoiding any impact on bending performance. A buffer composite layer can also be provided between the first and second backplates to buffer bending stress, absorb impact, and provide support and flattening. The second backplate and the buffer composite layer are bonded and fixed together by the first adhesive layer to ensure the stability of the second backplate in the module. The display module also includes a filler adhesive, which covers at least the first and second surfaces of the bending area. The filler adhesive can be filled into the bending area using a potting process to form a filler adhesive that covers at least the first and second surfaces of the bending area, thereby achieving the function of encapsulating the film structure of the display panel in the bending area and isolating it from moisture and external force damage.

[0008] This disclosure specifies that the first adhesive layer is not a continuous structure. Instead, it comprises multiple independently arranged first segments. The filler adhesive formed after potting not only covers the first and second surfaces of the bending area but also extends at least partially between adjacent first segments. By dividing the first adhesive layer into multiple independent first segments and creating gaps between adjacent segments, these gaps become transverse potting channels on the inner (R) side of the bending area, effectively adding multiple additional potting inlets. The gaps between the first segments connect the inner (R) and outer (R) sides of the bending area, allowing the adhesive to flow directly from the large cavity on the outer (R) side through the gaps between the first segments to the narrow cavity on the inner (R) side. This balances the pressure and flow rate on the inner and outer (R) sides, shortens the filling stroke of the adhesive on the inner (R) side, and prevents the formation of potting voids on the inner (R) side. While achieving a narrow bezel, this improves the encapsulation reliability of the bending area, avoids a series of display problems caused by potting voids, and enhances the display effect. Meanwhile, the segmented design of dividing the first adhesive layer into multiple independent first segments can retain the main adhesive area of ​​the first adhesive layer, ensuring the adhesive strength between the second backplate and the buffer composite layer. It will not cause adhesive failure or delamination due to the segmented design of multiple first segments. While achieving a high screen ratio display effect, it can also ensure the reliability of the packaging. Attached Figure Description

[0009] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0010] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of a planar structure of a display module provided in an embodiment of this disclosure; Figure 2 yes Figure 1 A schematic diagram of the planar structure of the display panel before bending; Figure 3 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction; Figure 4 yes Figure 1 A schematic diagram of a planar structure on one side of the backlight surface of a display module; Figure 5 yes Figure 4 A schematic diagram of a cross-sectional structure along the B-B' direction; Figure 6 Is Figure 4 The diagram shows a planar structure of a display module with a flexible circuit board bonded to its backlight surface. Figure 7 This is a schematic diagram of another planar structure of the display module provided in this embodiment; Figure 8 yes Figure 7 A schematic diagram of the planar structure of the display panel before bending; Figure 9 yes Figure 7 A schematic diagram of a planar structure on one side of the backlight surface of a display module; Figure 10 yes Figure 7 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 11 yes Figure 7 A schematic diagram of another planar structure of the display panel before bending; Figure 12 yes Figure 7 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 13This is a schematic diagram of another planar structure of the display module provided in this embodiment; Figure 14 yes Figure 13 A schematic diagram of the planar structure of the display panel before bending; Figure 15 yes Figure 13 A schematic diagram of a planar structure on one side of the backlight surface of a display module; Figure 16 This is a schematic diagram of another planar structure of the display module provided in this embodiment; Figure 17 yes Figure 16 A schematic diagram of the planar structure of the display panel before bending; Figure 18 yes Figure 16 A schematic diagram of a planar structure on one side of the backlight surface of a display module; Figure 19 yes Figure 16 A schematic diagram of another planar structure of the display panel before bending; Figure 20 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 21 yes Figure 16 A schematic diagram of another planar structure of the display panel before bending; Figure 22 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 23 yes Figure 18 A schematic diagram of a cross-sectional structure along the C-C' direction; Figure 24 yes Figure 18 A schematic diagram of a cross-sectional structure along the D-D' direction; Figure 25 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 26 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 27 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 28 yes Figure 27 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer; Figure 29 yes Figure 27 A schematic diagram of a cross-sectional structure along the E1-E1' direction; Figure 30 yes Figure 27 A schematic diagram of a cross-sectional structure along the E2-E2' direction; Figure 31 yes Figure 30 A schematic diagram of the path during the dispensing of the filler adhesive; Figure 32 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 33 yes Figure 32 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer; Figure 34 yes Figure 33 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked; Figure 35 yes Figure 32 A schematic diagram of a cross-sectional structure along the E3-E3' direction; Figure 36 yes Figure 35 A schematic diagram of the path during the dispensing of the filler adhesive; Figure 37 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 38 yes Figure 37 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer; Figure 39 yes Figure 38 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked; Figure 40 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 41 yes Figure 40 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer; Figure 42 yes Figure 41 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked; Figure 43 yes Figure 40 A schematic diagram of a cross-sectional structure along the E4-E4' direction; Figure 44 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 45 yes Figure 44 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer; Figure 46 yes Figure 45 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked; Figure 47 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module; Figure 48 yes Figure 47 A comparative diagram showing the disassembled display panel, second back panel, first adhesive layer, and buffer composite layer of the second zone; Figure 49 yes Figure 48 A schematic diagram of the structure of the second zone after the display panel, second back panel, first adhesive layer, and buffer composite layer are stacked; Figure 50 yes Figure 49 A schematic diagram of the stacked display panel and second back panel in the second central area; Figure 51 This is a schematic diagram of a planar structure of a display device provided in an embodiment of this disclosure. Detailed Implementation

[0012] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0013] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0014] Please refer to the reference. Figures 1-5 , Figure 1 This is a schematic diagram of a planar structure of a display module provided in an embodiment of this disclosure. Figure 2 yes Figure 1 A schematic diagram of the planar structure of the display panel before bending. Figure 3 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction. Figure 4 yes Figure 1 A schematic diagram of a planar structure on one side of the backlight surface of the display module (it should be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 4 (Transparency fill was applied) Figure 5 yes Figure 4 A cross-sectional structural diagram along the B-B' direction is shown. The display module 000 provided in this embodiment includes: The display panel 10 includes a first area 10A, a bending area 10W, and a second area 10B, which are connected by the bending area 10W. The first area 10A includes a display area AA, and the second area 10B is bent to the backlight side of the display module 000 by the bending area 10W. The display panel 10 includes a first surface 10-1 and a second surface 10-2 disposed opposite to each other. In the bending area, the radius of curvature of the first surface 10-1 is greater than the radius of curvature of the second surface 10-2. A first back plate 201 and a second back plate 202, wherein the first back plate 201 is located on the second surface 10-2 of the display panel 10 in the first region 10A, and the second back plate 202 is located on the second surface 10-2 of the display panel 10 in the second region 10B. Buffer composite layer 30 ( Figures 3-5 (Unfilled), located between the first backplate 201 and the second backplate 202; The first adhesive layer 40 and the second back plate 202 are fixed to the buffer composite layer 30 through the first adhesive layer 40. The first adhesive layer 40 includes a plurality of independently arranged first sub-segments 401. Filler 50 covers at least the first surface 10-1 and the second surface 10-2 of the bending area 10W, and filler 50 is at least partially located between adjacent first segments 401.

[0015] Specifically, the display module 000 provided in this embodiment includes at least a display panel 10, wherein the display panel 10 can be a flexible OLED (Organic Light Emitting Diode). OLED display panels have advantages such as self-emissiveness, all-solid-state properties, and high contrast, and can achieve flexible displays. For example, the display panel 10 in this embodiment can be made into a lightweight, bendable, and portable flexible display panel using a flexible substrate.

[0016] The display panel 10 includes at least a first area 10A, a bending area 10W, and a second area 10B. The first area 10A and the second area 10B are connected by the bending area 10W, and the second area 10B is bent to the backlight side of the display module 000 via the bending area 10W. It is understood that in this embodiment and subsequent embodiments, the backlight side of the display module 000 can be understood as the non-display side of the display module 000 that does not emit light, cannot display an image, and is away from the user; the light-emitting side of the display module 000 can be understood as the display side of the display module 000 that emits light, displays an image, and faces the user. Subsequent embodiments will not further explain this. For example, as... Figure 1As shown, the first area 10A is the main area of ​​the module, which may include a display area AA for presenting the display screen, and may also include a first non-display area NA1 surrounding the display area AA. The display area AA can be understood as the area facing the user and presenting and displaying the display screen, or it can be understood as the light-emitting area of ​​the display panel 10. The display area AA may be provided with multiple sub-pixels P. Figure 1 The example uses a long strip shape for sub-pixel P. In actual implementation, the shape and arrangement of sub-pixel P can be set according to actual needs. The first non-display area NA1 can be understood as the other areas of the display panel 10 surrounding the display area AA. In the flattened state of the display panel 10, i.e., the unbent state of the bending area 10W, such as... Figure 2 As shown, a portion of the first non-display area NA1 is located between the display area AA and the bending area 10W. After the bending area 10W of the display panel 10 is bent, the second area 10B bends through the bending area 10W to the backlight side of the display module 000. The first non-display area NA1 of the first area 10A and a portion of the bending area 10W can be understood as the display module 000 being located near the bending area 10W (e.g., Figure 1 The bottom border of the module is the final border that is presented to the user.

[0017] In this embodiment, the first non-display area NA1 may be equipped with a driving circuit, peripheral driving traces, and other structures. The second area 10B may include a bonding area for subsequent bonding of a driving chip or a flexible circuit board. Figure 2 and Figure 3 (Not shown in the diagram) The driver chip or flexible circuit board can achieve signal transmission with the display area AA of the display panel 10 through the bonding area of ​​the second area 10B, the driver circuit arranged in the first non-display area NA1, and the surrounding driver traces. The bending area 10W is a flexible transition area of ​​the display panel 10 that can be bent, connecting the first area 10A and the second area 10B. After the bending area 10W of the display panel 10 is bent, the second area 10B can be flipped to the backlight side of the display module 000, and the driver traces, the bonding pins of the bonding area and the flexible circuit board bonded to the subsequent bonding area can be stored on the backlight side of the display module 000. This can reduce the width of the front visible bezel, thereby achieving a narrow bezel design.

[0018] In this embodiment, as Figure 1 and Figure 3As shown, the display panel 10 includes a first surface 10-1 and a second surface 10-2 disposed opposite to each other. In the bending region 10W, the radius of curvature of the first surface 10-1 is greater than the radius of curvature of the second surface 10-2 (the radius of curvature is a physical quantity describing the degree of curvature of a surface, equal to the reciprocal of curvature; the smaller the radius of curvature, the more severe the curvature; the larger the radius of curvature, the smoother the surface). It can be understood that the display panel 10 is a multi-layered sheet structure with a certain thickness, having two opposing surfaces, namely the first surface 10-1 and... The second surface 10-2, after the bending area 10W of the display panel 10 is bent into a U-shape, is located on the inner side (concave surface) of the U-shape, and the first surface 10-1 is located on the outer side (convex surface) of the U-shape after bending. When bending, the degree of bending of the inner second surface 10-2 is more severe than that of the outer first surface 10-1, and the degree of bending of the outer first surface 10-1 is gentler than that of the inner second surface 10-2, which means that the radius of curvature of the first surface 10-1 is greater than that of the second surface 10-2.

[0019] For example, such as Figure 3 As shown, in this embodiment, the display panel 10 of the first area 10A facing the light-emitting surface of the display module 000 may also include a cover plate 60. Figure 1 (Not shown in the diagram) The cover plate 60 is made of glass or a flexible transparent material and is used to provide mechanical protection for the internal film layer. The cover plate 60 is stacked on one side of the light-emitting surface of the display panel 10 to isolate the display panel 10 from the external environment and provide protection for the display panel 10. The boundary of the cover plate 60 is further away from the display area AA than the boundary of the bending area 10W away from the display area AA. That is, the orthographic projection of the boundary of the bending area 10W away from the display area AA onto the cover plate 60 falls within the range of the cover plate 60 and is at a certain distance from the boundary of the cover plate 60, so as to achieve an all-round protective effect of the cover plate 60. Exemplarily, in some other optional embodiments, a polarizer 70 may also be included between the display panel 10 and the cover plate 60. The polarizer 70 is used to improve ambient light reflection and enhance display contrast.

[0020] For example, the display module 000 may further include a bending protective adhesive layer 80. The bending protective adhesive layer 80 is coated on a portion of the first surface 10-1 of the display panel 10 exposed by the polarizer 70. The bending protective adhesive layer 80 extends from the first non-display area NA1 of the display panel 10 to the second area 10B. The bending protective adhesive layer 80 can be a UV-curable adhesive, and its application range can extend at least from the first non-display area NA1 to the second area 10B. Within the first non-display area NA1, the bending protective adhesive layer 80 can at least completely cover the sidewall of the polarizer 70. This not only protects the circuit structure of the bending area 10W, alleviating bending stress and reducing the probability of breakage in the bending area 10W of the display panel 10, but also seals the sidewall of the polarizer 70, preventing moisture intrusion and ensuring a sealing and protective effect on the side of the polarizer 70.

[0021] It should be noted that the specific structure of the display panel 10 is not described in detail in this embodiment. For specific implementation, the structure of organic light-emitting diode (OLED) display panels in related technologies can be referred to for understanding. Optionally, the film layer structure of the display panel 10 in this embodiment may include a flexible substrate and film layers on top of the flexible substrate for realizing display functions, such as a thin-film transistor array layer including multiple conductive layers and insulating layers, a light-emitting functional layer for arranging light-emitting devices (not shown in the figure), and a thin-film encapsulation layer for encapsulation. The insulating layers included in the thin-film transistor array layer generally include an organic insulating layer for planarization and an inorganic insulating layer for insulating protection. Since the bending region 10W of the display panel 10 requires good bending performance, the rigid inorganic layers (such as the interlayer insulating layer of the driving array layer, the gate insulating layer, etc.) in the bending region 10W of the display panel 10 generally need to be hollowed out or patterned to reduce bending stress.

[0022] like Figure 1 and Figure 3 As shown, in this embodiment, the display module 000 may further include a first back plate 201 and a second back plate 202. The first back plate 201 is located on the second surface 10-2 of the display panel 10 in the first region 10A, and the second back plate 202 is located on the second surface 10-2 of the display panel 10 in the second region 10B. Both the first back plate 201 and the second back plate 202 can be structures with strong support performance, which can be achieved through an adhesive layer ( Figure 3 (Not shown) It is attached to one side of the flexible substrate included in the display panel 10 and serves as a support below the flexible substrate of the display panel 10. In an optional embodiment, the first back plate 201 and the second back plate 202 are separated from each other at the bending area 10W, that is, the bending area 10W is not provided with a back plate, which can avoid affecting the bending performance.

[0023] In this embodiment, a buffer composite layer 30 may also be provided between the first backplate 201 and the second backplate 202. The buffer composite layer 30 includes at least a super clean foam (SCF) layer, which buffers bending stress, absorbs impact, and provides support and flattening. The buffer composite layer 30 may include various membrane structures, such as a foam buffer layer, a metal support layer, a mesh adhesive layer, a metal heat sink, an adhesive layer, etc. (not shown in the attached drawings). In specific implementations, the structure of the buffer composite layer in related technologies and the actual requirements can be referred to.

[0024] In this embodiment, the second backplate 202 and the buffer composite layer 30 need to be bonded and fixed together by the first adhesive layer 40 to ensure the stability of the second backplate 202 in the module.

[0025] The display module 000 of this embodiment also includes a filler adhesive 50. The filler adhesive 50 at least covers the first surface 10-1 and the second surface 10-2 of the bending area 10W. For example, in the manufacturing process of the bending display module 000 provided in this embodiment, a LIPO injection process can be used to fill the bending area 10W with encapsulating adhesive, forming a filler adhesive 50 that at least covers the first surface 10-1 and the second surface 10-2 of the bending area 10W, achieving the function of encapsulating the film structure of the display panel 10 of the bending area 10W and isolating it from moisture and external force damage. For example, the filler adhesive 50 can be made by potting to more fully cover the bending area 10W, and during the potting process, it can more easily flow towards the cover plate 60 to more fully cover the first surface 10-1 and the second surface 10-2 of the bending area 10W. This embodiment does not elaborate on the potting process of the filler adhesive 50; for details, please refer to the potting process in related technologies for understanding. The final structure of the filler adhesive 50 can be as follows... Figure 3 As shown, the filler 50 covers at least the first surface 10-1 and the second surface 10-2 of the bending area 10W, and also covers part of the second area 10B and part of the first non-display area NA1 below the cover plate 60. It can provide more comprehensive protection for the bending area 10W during the process of the display module 000 being dropped or rolled. When the outer frame (metal frame) of the display module 000 is subjected to external impact, it provides a buffer space for the deformation of the outer frame and avoids stress transmission to the display panel 10 of the bending area 10W.

[0026] The applicant discovered that when the second area 10B is bent through the bending area 10W to the backlight side of the display module 000, the bending area 10W takes the form of an arc-shaped bend. The radius of curvature of the first surface 10-1 on the outer side is greater than the radius of curvature of the second surface 10-2 on the inner side. That is, the bending arc of the bending area 10W is such that the outer radius R1 is greater than the inner radius R2. Correspondingly, the cross-sectional area of ​​the space available for adhesive flow on the outer side of the bending area 10W (hereinafter referred to as R_outer side) is larger, while the cross-sectional area of ​​the space available for adhesive flow on the inner side of the bending area 10W (hereinafter referred to as R_inner side) is smaller. In other words, the cross-sectional area of ​​the space on the inner and outer sides of the bending arc is significantly different.

[0027] In existing technologies, a continuous first adhesive layer 40 is typically provided. During the dispensing process of the filler adhesive 50, this continuous first adhesive layer 40 completely blocks the dispensing path inside the R region, allowing the adhesive to flow only from both ends of the bending area 10W (e.g., ...). Figure 1 The two ends shown in the transverse direction fill the middle of the bending area 10W; because the cross-sectional area of ​​the cavity on the outside of R is larger and the flow resistance is smaller, the flow rate of the adhesive is faster and the filling speed of the adhesive is faster, while the cross-sectional area of ​​the space on the inside of R is smaller and the flow resistance is larger, the flow rate of the adhesive is slower and the filling speed of the adhesive is slower. The pressure difference between the inside and outside of R varies with the bending area 10W. Figure 1 The horizontal length shown accumulates continuously, with the bending zone 10W in... Figure 1 The longer the horizontal length shown, the greater the pressure difference between the inner and outer sides of R. This ultimately leads to the outer side of R being completely filled while the inner side remains empty, causing the filler adhesive to fail, moisture to invade, and consequently resulting in display defects, reducing product reliability and yield. Moisture can easily penetrate the light-emitting device through these voids, causing display defects and device failure.

[0028] It is understood that the cross-sectional area of ​​the space in this embodiment refers to the void area seen in the cross section along the direction perpendicular to the flow of the adhesive during dispensing. For example, if the adhesive flows along the length of the bend area outside R, the channel voids of the adhesive flow outside R are large, the cross-sectional area of ​​the space outside R is large, the flow resistance of the adhesive is small, and the filling is fast. If the adhesive flows along the length of the bend area inside R, the channel voids of the adhesive flow inside R are small, the cross-sectional area of ​​the space inside R is small, the flow resistance of the adhesive is large, and the filling is slow. Under the same dispensing pressure, the larger the cross-sectional area of ​​the adhesive flow channel, the smaller the flow resistance of the adhesive and the faster the flow. If the adhesive is only dispensed from both ends of the length of the bend area, voids are easily formed inside R.

[0029] To solve the above problems, such as Figure 4 and Figure 5 As shown (to clearly illustrate the multiple first segments 401 of the first adhesive layer), Figure 4(The filler adhesive 50 is not shown in the diagram). In this embodiment, the first adhesive layer 40 is not a continuous structure. The first adhesive layer 40 includes multiple independently arranged first segments 401. The filler adhesive 50 formed after potting not only covers the first surface 10-1 and the second surface 10-2 of the bending area 10W, but also is at least partially located between adjacent first segments 401. In this embodiment, by dividing the first adhesive layer 40 into multiple independent first segments 401, gaps are formed between adjacent first segments 401. These gaps become transverse potting channels on the inner side of the bending area 10W. The filler adhesive 50, in addition to being along the length direction of the bending area 10W (e.g., along the length direction of the bending area 10W), is also provided with a continuous structure. Figure 1 In addition to the lateral flow within the frame, the adhesive can also flow directly from the outside of the frame (R) to the inside of the frame (R) through the gaps between the first segments 401. This is equivalent to adding multiple additional glue inlets. The gaps between the first segments 401 effectively connect the inside and outside of the frame (R), allowing the adhesive to flow directly from the large cavity on the outside of the frame (R) through the gaps between the first segments 401 to the narrow cavity on the inside of the frame (R). This balances the pressure and flow rate on the inside and outside of the frame (R), shortens the filling stroke of the adhesive on the inside of the frame (R), and avoids the formation of glue voids on the inside of the frame (R). While achieving a narrow bezel, this improves the encapsulation reliability of the 10W bending area, avoids a series of display problems caused by glue voids, and improves the display effect. Furthermore, this embodiment uses a segmented design where the first adhesive layer 40 is divided into multiple independent first segments 401. This retains the main bonding area of ​​the first adhesive layer 40, ensuring the bonding strength between the second backplate 202 and the buffer composite layer 30. The segmented design of multiple first segments 401 prevents bonding failure and delamination problems, achieving a high screen-to-body ratio display while ensuring encapsulation reliability.

[0030] Understandable, Figure 3 The cross-sectional view shown can be understood as... Figure 4 The section has the cross-sectional shape at point 401 of the first sub-segment.

[0031] It should be noted that in the manufacturing process of the display module 000 in this embodiment, before the filling adhesive 50 is formed, the second area 10B of the display panel 10 has usually been bonded and attached to the flexible circuit board. Therefore, in order to avoid the already attached flexible circuit board affecting the flow of adhesive into the inner side of R through the gap between adjacent first segments 401, the flexible circuit board can be specially shaped, such as a partially hollowed-out flexible circuit board, so that the hollowed-out portion can expose at least part of the gap between adjacent first segments 401, or the second area 10B can only be partially bonded to the flexible circuit board, such as... Figure 6 As shown, Figure 6 Is Figure 4 The diagram shows a planar structure of a display module with its backlight surface bonded to a flexible circuit board. (It can be understood that this diagram is intended to clearly illustrate the positional arrangement of the first adhesive layer 40 and the flexible circuit board 90.) Figure 6 Transparency fill was applied, and Figure 6 The filler adhesive 50 (not shown in the figure) is used to ensure that the flexible circuit board 90 can avoid the gap between adjacent first segments 401. For details, please refer to the explanation of the following embodiments.

[0032] The applicant found that with the continuous development of display technology, people's demand for screen ratio is getting higher and higher. Since the left and right bezels of the display panel usually contain driving circuits (such as scanning driving circuits), packaging structures, wiring and cutting channel designs, it is difficult to further compress the width of the left and right bezels. As a result, even existing flexible OLED display devices cannot achieve a high-quality display effect with an extremely narrow bezel.

[0033] To solve the above problems, please refer to the following: Figures 7-9 , Figure 7 This is a schematic diagram of another planar structure of the display module provided in this embodiment. Figure 8 yes Figure 7 A schematic diagram of the planar structure of the display panel before bending. Figure 9 yes Figure 7 A schematic diagram of a planar structure on one side of the backlight surface of the display module (it should be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 9 (Transparency filling has been performed). The display module 000 provided in this embodiment includes a first side L1 extending along the first direction X and a second side L2 extending along the second direction Y. In the direction parallel to the light-emitting surface of the display module 000, the first direction X and the second direction Y are perpendicular to each other. The overall length of the exemplary first side L1 can be less than the overall length of the second side L2, that is, the first side L1 can be understood as the short side of the display module 000, and the second side L2 can be understood as the long side of the display module 000.

[0034] In the first direction X, the bending zone 10W is located on one side of the first zone 10A.

[0035] For example, the bending area 10W includes a first bending area 10W1 and a second bending area 10W2, and the second area 10B includes a first sub-area 10B1 and a second sub-area 10B2. In the first direction X, the first bending area 10W1 is located on one side of the first area 10A, and the first sub-area 10B1 is bent through the first bending area 10W1 to the backlight side of the display module 000; in the second direction Y, the second bending area 10W2 is located on one side of the first area 10A, and the second sub-area 10B2 is bent through the second bending area 10W2 to the backlight side of the display module 000.

[0036] In this embodiment, the display panel 10 on at least one side of the left and right borders of the display module 000 includes a first bending area 10W1. Figure 7 and Figure 8 Taking the left side of the display module 000 as an example, the first bending area 10W1 is located at the left side of the display module 000. The first bending area 10W1 at the left side of the display module 000 is connected to the first sub-area 10B1 of the second area 10B and the first area 10A in the first direction X. The first sub-area 10B1 connected to the first bending area 10W1 at the left side of the display module 000 may include a circuit setting area DA, which can be used to lay out traces and scan driving circuits. The first sub-area 10B1 at the left side of the display module 000, which includes the circuit setting area DA, is bent to the backlight side of the display module 000 through the first bending area 10W1.

[0037] To achieve a narrow bezel, the display panel 10 typically bends its lower bezel area and the driver chip or flexible circuit board 90 bonded to it to the back of the display panel 10 via a corresponding bending area at the lower bezel. Specifically, the second area 10B at the lower bezel includes a second sub-area 10B2, which is bent to the back of the display panel 10 via a corresponding second bending area 10W2. In this embodiment, to achieve an extremely narrow bezel effect, at least one side of the display area AA of the display panel 10 is also bent to the back of the display panel 10 via a first bending area 10W2. The bending area 10W1 connects to the first sub-area 10B1. The circuit setting area DA and scanning drive circuit included in the first sub-area 10B1 are also bent to the backlight side of the display module 000 through the corresponding first bending area 10W1. This can greatly reduce the bezel width occupied by the first non-display area NA1 on the left side of the display panel 10, and reduce the width of the left bezel on the light-emitting side of the display panel 10 facing the user. This can achieve a high-quality display effect with an extremely narrow bezel as much as possible, which is conducive to maximizing the screen ratio.

[0038] Furthermore, since the first bending area 10W1 at the left frame corresponding to the second side L2 of the display module 000 is relatively long in the second direction Y, the longer the first bending area 10W1 is in the second direction Y, the greater the pressure difference between the inner and outer sides of the first bending area 10W1 at the left frame, and the easier it is to form a cavity in the filler glue on the inner side. Therefore, the segmented design of the multiple first segments 401 of the first adhesive layer 40 in this embodiment is more suitable for the first bending area 10W1 corresponding to the second side L2 of the long side of the display module 000. While achieving a further reduction in the extremely narrow bezel on the left side of the display module, it can ensure that the longer first bending area 10W1 has sufficient encapsulation reliability, effectively avoid a series of display problems caused by filler glue cavities, and thus improve the display effect.

[0039] It is understood that in this embodiment Figures 7-9In the display module 000, the second bending area 10W2 at the bottom edge can have its corresponding first adhesive layer designed in segments or without segments. The specific design can be based on the actual length of the first side L1 of the short side of the display module 000. If the actual length of the first side L1 is greater than a certain threshold, the length of the second bending area 10W2 at the bottom edge of the display module 000 in the first direction X is longer. In this case, the first adhesive layer 40 corresponding to the second bending area 10W2 of the bottom edge can also be designed in segments (e.g., ...). Figure 9 Multiple first segments 401 at the second bending region 10W2 shown.

[0040] like Figure 10 As shown, Figure 10 yes Figure 7 Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 10 (Transparency fill was applied). If the actual length of the first side L1 is less than or equal to a certain threshold, then the length of the second bending area 10W2 at the bottom border of the display module 000 in the first direction X is shorter. When the filler glue is applied to form the filling glue in this area, the difference in the cross-sectional area of ​​the space between the inner R and outer R of the second bending area 10W2 at the bottom border is not significant. Therefore, the first adhesive layer 40 corresponding to the second bending area 10W2 of the bottom border does not need to be segmented and can maintain continuous full-surface bonding (e.g., ...). Figure 10 The first adhesive layer at the bottom border shown is a continuous, full-surface design.

[0041] In other alternative embodiments, please refer to the references. Figure 7 , Figure 11 and Figure 12 , Figure 11 yes Figure 7 A schematic diagram of another planar structure of the display panel before bending. Figure 12 yes Figure 7 Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 12(Transparency fill has been applied). To achieve an extremely narrow bezel effect, it can be further set in the first direction X, at least one side of the display area AA of the display panel 10 is also connected to the first sub-area 10B1 of the second area 10B through a first bending area 10W1. The first sub-area 10B1 not only includes the circuit setting area DA for routing traces and scanning drive circuits, but also includes a binding area corresponding to the second sub-area 10B2 at the bottom bezel. That is, the first sub-area 10B1 includes the circuit setting area DA and the first binding area BA1, and the second sub-area 10B2 includes the second binding area BA2. The display module 000 may include at least two flexible circuit boards 90, namely a first flexible circuit board 901 and a second flexible circuit board 902. The first flexible circuit board 901 is electrically connected to the first sub-area 10B1 through a first bonding area BA1, and the second flexible circuit board 902 is electrically connected to the second sub-area 10B2 through a second bonding area BA2. Together, they are hidden on the backlight side of the display module 000 as the bending area bends, thereby further reducing the bezel width occupied by the first non-display area NA1 on the left side of the display panel 10, which is beneficial to maximizing the screen ratio. If the first adhesive layer 40 corresponding to the first bending area 10W1 at the left bezel is designed in segments, then when the first sub-area 10B1 at the left bezel is bonded to the first flexible circuit board 901, the first flexible circuit board 901 also needs to avoid the gap between adjacent first sub-segments 401 (e.g., Figure 12 As shown), the adhesive 50 is provided to flow into the channel inside the R of the first bending zone 10W1.

[0042] For example, in this embodiment Figures 7-12 Taking the double-sided bending as an example, in actual implementation, the display module can also have a three-sided bending or four-sided bending structure, as long as the second area 10B at different positions is bent to the backlight side of the display module 000 through the corresponding bending area 10W to achieve the effect of an extremely narrow bezel.

[0043] Specifically, such as Figures 13-15 As shown, Figure 13 This is a schematic diagram of another planar structure of the display module provided in this embodiment. Figure 14 yes Figure 13 A schematic diagram of the planar structure of the display panel before bending. Figure 15 yes Figure 13 A schematic diagram of a planar structure on one side of the backlight surface of the display module (it should be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 15(Transparency filling has been applied). Taking a three-sided bending display module 000 as an example, the display module 000 includes a first side L1 extending along a first direction X and a second side L2 extending along a second direction Y. In directions parallel to the light-emitting surface of the display module 000, the first direction X and the second direction Y are perpendicular to each other. The overall length of the exemplary first side L1 can be less than the overall length of the second side L2; that is, the first side L1 can be understood as the short side of the display module 000, and the second side L2 can be understood as the long side of the display module 000. In the first direction X, the bending area 10W is located on one side of the first area 10A.

[0044] The bending area 10W includes the first bending area 10W1 and the second bending area 10W2, and the second area 10B includes the first sub-area 10B1 and the second sub-area 10B2; In the first direction X, the first bending area 10W1 and the second bending area 10W2 are located on opposite sides of the first area 10A; the first sub-area 10B1 is bent through the first bending area 10W1 to the backlight side of the display module 000, and the second sub-area 10B2 is bent through the second bending area 10W2 to the backlight side of the display module 000.

[0045] The bending zone 10W also includes the third bending zone 10W3, and the second zone 10B also includes the third sub-zone 10B3; In the second direction Y, the third bending area 10W3 is located on one side of the first area 10A, and the third sub-area 10B3 is bent through the third bending area 10W3 to the backlight side of the display module 000.

[0046] In this embodiment, the first sub-region 10B1 (left frame position) connected to the first bending area 10W1 and the second sub-region 10B2 (right frame position) connected to the second bending area 10W2 can be configured to each include a circuit setting area DA and a bonding area for routing traces, scanning drive circuits, and bonding flexible circuit boards. The first sub-region 10B1 includes a first circuit setting area DA1 and a first bonding area BA1. The first bonding area BA1 is used to bond the first flexible circuit board 901. The first sub-region 10B1 is bent to the display module through the first bending area 10W1. On the backlight side of group 000, the second sub-region 10B2 includes a second circuit setting area DA2 and a second bonding area BA2. The second bonding area BA2 is used to bond the second flexible circuit board 902. The second sub-region 10B2 is bent to the backlight side of the display module 000 through the second bending area 10W2. The third sub-region 10B3 (bottom border position) connected by the third bending area 10W3 may include the third bonding area BA3, which is used to bond the third flexible circuit board 903. It is bent to the backlight side of the display module 000 through the third bending area 10W3.

[0047] This embodiment can reduce the width of the left and right bezels on the light-emitting side of the display panel 10 facing the user, thereby achieving a high-quality display effect with bezels of equal width and extremely narrow bezels, which is beneficial to maximizing the screen-to-body ratio. The three-sided bent structure of the display panel 10 in this embodiment can achieve a high-quality display effect with extremely narrow bezels, where the bezels of the display module 000 are as equal as possible.

[0048] For example, in this embodiment, the first flexible circuit board 901 and the second flexible circuit board 902 can be understood as the secondary flexible circuit boards of the display module 000, and the third flexible circuit board 903 can be understood as the main flexible circuit board of the display module 000. The first flexible circuit board 901 and the second flexible circuit board 902 can both be connected to or plugged into the third flexible circuit board 903 to achieve electrical connection, thereby realizing the overall signal transmission between different flexible circuit boards in the module.

[0049] It should be noted that, in this embodiment, the first bending area 10W1 at the left frame and the second bending area 10W2 at the right frame are relatively long in the second direction Y, so the corresponding first adhesive layer 40 can be designed with multiple first segments 401. However, the third bending area 10W3 at the bottom frame is relatively short in the first direction X, and the difference in cross-sectional area between the inner and outer sides R is not significant. Therefore, the first adhesive layer 40 corresponding to the third bending area 10W3 of the bottom frame does not need to be designed with segments, maintaining continuous full-surface adhesion (e.g., Figure 15 The first adhesive layer at the bottom border shown is a continuous, full-surface design.

[0050] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figure 18 , Figure 16 This is a schematic diagram of another planar structure of the display module provided in this embodiment. Figure 17 yes Figure 16 A schematic diagram of the planar structure of the display panel before bending. Figure 18 yes Figure 16 A schematic diagram of a planar structure on one side of the backlight surface of the display module (it should be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 18 (Transparency fill has been applied). It is understood that, in order to clearly understand the design scheme of the display module and avoid redundant descriptions, the structures such as the bending area, flexible circuit board, and first adhesive layer in this embodiment and subsequent embodiments only illustrate the setting structure corresponding to one bending area on the left border, and only this one bending area is used as an example for illustration. When bending areas are also set at other border locations, the structure corresponding to the bending area on the left border can be referred to for understanding. Specifically, the display module 000 in this embodiment includes a flexible circuit board 90; The second zone 10B includes a bonding zone BA, where the flexible circuit board 90 is bonded and electrically connected to the display panel 10 in the bonding zone BA. Along the third direction J, the length L3 of the flexible circuit board 90 is less than the length L4 of the bending area 10W; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first area 10A and the bending area 10W.

[0051] This embodiment explains that in the manufacturing process of the display module 000, before the filling adhesive 50 is formed by potting, the second area 10B of the display panel 10 is usually already bonded and attached to the flexible circuit board 90. If the flexible circuit board 90 completely covers the backlight side structure of the bending area 10W, it is equivalent to adding an extra barrier layer, which prevents the filling adhesive 50 from flowing from the backlight side to the inner R side of the bending area 10W during potting, exacerbating the problem of insufficient filling and voids in the inner R side. In this embodiment, the length L3 of the flexible circuit board 90 in the third direction J is set to be less than the length L4 of the bending area 10W. The flexible circuit board 90 only occupies a part of the bending area 10W along its length, and the remaining area of ​​the bending area 10W is not obstructed by the flexible circuit board 90. This allows for areas unobstructed by the flexible circuit board 90 along the length of the bending area 10W, enabling the filler adhesive 50 to flow more smoothly from these areas to the gaps between adjacent first segments 401 of the first adhesive layer 40 and into the inner R side of the bending area 10W. This avoids increased potting resistance caused by the flexible circuit board 90 obstructing the area. At the same time, shortening the length of the flexible circuit board 90 in the third direction J also reduces material usage, lowers the rigid board stress during bending, and improves bending fatigue life.

[0052] It is understandable that the shape of the flexible circuit board 90 can be an irregular shape, such as... Figure 17 As shown, in this embodiment, the length L3 of the flexible circuit board 90 in the third direction J can be understood as the length of the longest position of the flexible circuit board 90 in the third direction J.

[0053] It should be noted that in this embodiment... Figure 17 and Figure 18 Taking the flexible circuit board 90 located at the lower end of the second zone 10B corresponding to the bending zone 10W as an example, in specific implementation, the flexible circuit board 90 can also be bound to other positions of the second zone 10B corresponding to the bending zone 10W, as long as the length L3 of the flexible circuit board 90 along the third direction J is less than the length L4 of the bending zone 10W.

[0054] In other embodiments, please refer to the references Figure 16 , Figure 19 and Figure 20 , Figure 19 yes Figure 16 A schematic diagram of another planar structure of the display panel before bending. Figure 20yes Figure 16 Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 20 (Transparency filling has been applied). The display module 000 in this embodiment includes a flexible circuit board 90; the flexible circuit board 90 includes at least two independent sub-circuit boards 900, which are arranged at intervals in a third direction J. Specifically, in a direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first region 10A and the bending region 10W.

[0055] The second zone 10B includes a bonding zone BA, which includes at least two bonding sub-zones BA0 spaced apart. The number of bonding sub-zones BA0 is the same as the number of sub-circuit boards 900. The sub-circuit boards 900 are respectively bonded to the corresponding bonding sub-zones BA0, thereby achieving the effect of bonding and electrical connection between the flexible circuit board 90 and the display panel 10 in the bonding zone BA.

[0056] This embodiment explains that in the manufacturing process of the display module 000, before the filling adhesive 50 is formed by potting, the second area 10B of the display panel 10 is usually already bonded and attached to the flexible circuit board 90. If the flexible circuit board 90 completely covers the backlight side structure of the bending area 10W, it is equivalent to adding an extra barrier layer, which prevents the filling adhesive 50 from flowing from the backlight side to the inner R side of the bending area 10W during potting, exacerbating the problem of insufficient filling and voids in the inner R side. In this embodiment, the flexible circuit board 90 bonded to the bonding area BA of the second region 10B is divided into at least two independent sub-circuit boards 900. These at least two sub-circuit boards 900 are arranged at intervals in the third direction J. A hollow space is formed between adjacent sub-circuit boards 900 in the third direction J as a potting channel. When the filler 50 is potted, it can pass through the gap area between the two adjacent sub-circuit boards 900, flow to the gap between the adjacent first segments 401 of the first adhesive layer 40, and enter the inner side of the bending area 10W. This can avoid the increase in potting resistance caused by the flexible circuit board 90 blocking the flow, which is conducive to significantly increasing the flow cross-sectional area of ​​the potting, reducing the flow resistance of the adhesive, and further improving the filling speed and filling amount of the inner side of the bending area 10W. At the same time, the design of the split flexible circuit board 90 can also disperse the bending stress, reduce the risk of the circuit board bending and breaking, and improve the structural reliability.

[0057] In other embodiments, please refer to the references Figure 16 , Figure 21 and Figure 22 , Figure 21 yes Figure 16 A schematic diagram of another planar structure of the display panel before bending. Figure 22 yes Figure 16Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 22 (Transparency fill has been applied), the display module 000 in this embodiment includes a flexible circuit board 90; On the third-party J, the bonding area BA includes at least two bonding sub-areas BA0 spaced apart, and the flexible circuit board 90 includes at least two pin areas 90A spaced apart. The pin areas 90A and the bonding sub-areas BA0 are bonded and electrically connected in a one-to-one correspondence. On the third-party J, the flexible circuit board 90 includes a cutout area 90K between two adjacent pin areas 90A, and the flexible circuit board 90 has a cutout area 90K. The first gap 40K is included between two adjacent first segments 401. The hollow area 90K exposes at least part of the first gap 40K's projection on the light-emitting surface of the display module 000.

[0058] This embodiment explains that in the manufacturing process of the display module 000, before the filling adhesive 50 is formed, the second area 10B of the display panel 10 is usually already bonded and attached to the flexible circuit board 90. If the flexible circuit board 90 completely covers the backlight side structure of the bending area 10W, it is equivalent to adding an extra barrier layer, preventing the filling adhesive 50 from flowing from the backlight side to the inner R of the bending area 10W during potting, exacerbating the problem of insufficient filling and voids in the inner R. In this embodiment, the bonding area BA is divided into multiple spaced bonding sub-areas BA0 along the third direction J, corresponding to the multiple pin areas 90A of the flexible circuit board 90 for partitioned bonding; the flexible circuit board 90 has a cutout area 90K between adjacent pin areas 90A, and the board material of the flexible circuit board 90 is removed from the cutout area 90K to form a transparent cutout structure. The cutout area 90K and the first gap 40K of the first adhesive layer 40 at least partially overlap in the direction perpendicular to the light-emitting surface of the display module 000, that is, the cutout area 90K can expose the first gap 40K below.

[0059] In this embodiment, the flexible circuit board 90 is bonded to multiple spaced bonding sub-regions BA0 of the second region 10B in a partitioned manner. The flexible circuit board 90 has no electrical function between adjacent pin regions 90A, and can be hollowed out to form a cutout region 90K. The cutout region 90K overlaps with the first gap 40K between adjacent first segments 401 in the first adhesive layer 40, so that when the filler 50 is poured, the glue can flow through the cutout region 90K into the first gap 40K, eliminating the obstruction of the glue channel by the flexible circuit board 90, reducing the glue pouring resistance, accelerating the filling speed inside R, further balancing the pressure inside and outside R, and also preserving the integrity of the flexible circuit board 90.

[0060] For example, such as Figure 22As shown, in the cutout area 90K, along the arrangement direction K of the first area 10A and the bending area 10W, the distance ΔL between the edge 90L of the flexible circuit board 90 facing the bending area 10W and the edge 40L of the first adhesive layer 40 away from the bending area 10W is greater than 0.

[0061] This embodiment explains that along the arrangement direction K of the first region 10A and the bending region 10W, the flexible circuit board 90 is further away from the bending region 10W at the edge 90L of the cutout area 90K facing the bending region 10W compared to the edge 40L of the first adhesive layer 40 which is farther away from the bending region 10W. The distance ΔL between the edge 90L of the flexible circuit board 90 facing the bending region 10W and the edge 40L of the first adhesive layer 40 which is farther away from the bending region 10W in the arrangement direction K of the first region 10A and the bending region 10W is greater than 0. This ensures that even if there are mounting tolerances, the flexible circuit board 90 will not extend into the potting channel of the first gap 40K in the cutout area 90K. This ensures that during potting, the glue 50 can flow smoothly into the first gap 40K within the cutout area 90K, reducing the resistance of the glue flowing to the inner side R, thereby increasing the filling speed and filling amount of the inner side R of the bending region 10W and avoiding the formation of filling voids.

[0062] For example, in this embodiment, the material of the first adhesive layer 40 that bonds the second backplate 202 to the buffer composite layer 30 includes double-sided tape or dispensing adhesive.

[0063] This embodiment explains that the material of the first adhesive layer 40 can be selected from two options: double-sided adhesive and dispensing. Double-sided adhesive has high die-cutting precision, and when designed in segments, the shape and spacing of the first segment 401 are well controllable. Moreover, the mounting process is mature and suitable for mass standardized production with stable yield. The dispensing process forms multiple segmented first segments 401 without the need for mold making. The shape, size and spacing of the first segment 401 can be flexibly adjusted through the program, which is suitable for customized or small-batch products. After the dispensing is cured, the bonding force with the second back plate 202 and the buffer composite layer 30 is stronger, which can further improve the structural stability. In specific implementation, the choice can be made flexibly according to the production line conditions and product requirements, thus providing greater flexibility.

[0064] In some other alternative embodiments, please continue to refer to the references. Figures 16-18 In this embodiment, along the third direction J, the length L4 of the bending area 10W is greater than or equal to 50mm; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first area 10A and the bending area 10W.

[0065] This embodiment explains that when a bending area 10W is provided on at least one side of the first area 10A of the display panel 10, if the dimension along the length direction of the bending area 10W is greater than or equal to 50mm, it can be understood as a scenario of long-side bending. For example, the long side of the side of a mainstream mobile phone can usually reach 110-150mm. If the design of the long side of the mainstream mobile phone includes a bending area, then the first adhesive layer between the second back panel and the buffer composite layer after bending needs to be set as a segmented design of multiple first sub-segments as described in the above embodiment.

[0066] For example, such as Figures 1-5 As shown, when a bending area 10W is provided on at least one side of the first area 10A of the display panel 10, the bending area 10W can also be provided at the bottom edge of the display panel 10. In this case, the arrangement direction K of the first area 10A and the bending area 10W is as follows: Figure 1 and Figure 2 In the vertical direction, the third direction J is Figure 1 and Figure 2 In the horizontal direction, if the bending area at the bottom edge is 10W... Figure 1 and Figure 2 If the length L4 on the third lateral direction J is greater than or equal to 50mm, the first adhesive layer between the second back plate and the buffer composite layer also needs to be set as a segmented design of multiple first sub-segments in the above embodiment.

[0067] When the bending area 10W in the display module 000 is short along its length, the adhesive can be fully filled by flowing in from both ends. This means the pressure difference between the inner and outer sides (R-shaped) of the shorter bending area is not significant, resulting in a low risk of voids. However, when the bending area 10W in the display module 000 is larger, reaching 50mm or more, the resistance to adhesive flow increases, and the flow velocity difference between the inner and outer sides (R-shaped) accumulates with increasing length, significantly increasing the risk of voids on the inner side (R-shaped). In this embodiment, when the bending area 10W is greater than or equal to 50mm, the first adhesive layer 40 is preferably configured as multiple independently spaced first segments 401. This segmented first adhesive layer 40 effectively counteracts the pressure and flow velocity differences caused by the long path, solving the problem of uneven adhesive filling that easily occurs with long-side bending, and ensuring product packaging reliability while achieving a narrow bezel. For short-side bending, the option can be selected according to requirements, facilitating selection based on actual design needs during product manufacturing.

[0068] In some other alternative embodiments, please continue to refer to the references. Figures 16-18In this embodiment, along the third direction J, the length of the first segment 401 is A, and the distance between two adjacent first segments 401 is B; A / B≥1; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first area 10A and the bending area 10W.

[0069] This embodiment explains that when the first adhesive layer 40 is segmented, there is a first gap 40K between adjacent first segments 401. The length A of a single first segment 401 along the third direction J is greater than or equal to the width B of the first gap 40K between adjacent first segments 401. This ensures that the effective bonding length of the segmented first adhesive layer 40 is not less than 50% of the total length of the first adhesive layer 40 in the third direction J, thereby ensuring the bonding reliability of the first adhesive layer 40 to the second back plate 202 and the buffer composite layer 30. If the distance B between two adjacent first segments 401 is too large, the proportion of the total length of the first adhesive layer 40 will be too large, such as A / B<1. The effective bonding area of ​​the first adhesive layer 40 will be insufficient, which will lead to a decrease in the bonding strength between the second back plate 202 and the buffer composite layer 30. During bending tests in the bending area 10W or module drop tests, delamination and peeling are likely to occur, affecting structural reliability. If the distance B between two adjacent first segments 401 is too small, the conduction area of ​​the first gap 40K between adjacent first segments 401 will be insufficient during potting, making it impossible to effectively balance the potting pressure on the inner and outer sides of R. The setting of this embodiment can ensure that there is sufficient bonding area between the second back plate 202 and the buffer composite layer 30, maintain sufficient bonding strength and structural stability, and avoid delamination failure. At the same time, the reserved first gap 40K still has sufficient adhesive conduction cross-sectional area, which can achieve good potting flow effect, taking into account both bonding reliability and potting performance.

[0070] For example, along the third direction J, the distance between two adjacent first segments 401 is B, where B ≥ 0.5 mm. If B is too small, the flow cross-sectional area of ​​the dispensing channel is insufficient, the flow resistance of the adhesive is high, and the first gap 40K between two adjacent first segments 401 is easily blocked by tiny impurities or film burrs in the adhesive, failing to effectively connect the inside and outside of R, thus failing to achieve the optimized dispensing effect. This embodiment limits the distance B between two adjacent first segments 401 to be greater than or equal to 0.5 mm, which can ensure that the dispensing channel has a sufficient flow cross-sectional area, reduce the flow resistance of the adhesive, and ensure that the filler 50 can smoothly flow from the outside of R to the inside of R through the first gap 40K during the dispensing process; at the same time, it can avoid the risk of blockage caused by tiny impurities due to an excessively narrow distance B, maintaining the stable conduction of the adhesive channel.

[0071] In some other alternative embodiments, please refer to the references. Figures 16-18 and Figure 23 , Figure 24 , Figure 23 yes Figure 18 A schematic diagram of a cross-sectional structure along the C-C' direction. Figure 24 yes Figure 18 A cross-sectional structural diagram along the D-D' direction is shown in this embodiment. In this embodiment, along the direction Z perpendicular to the light-emitting surface of the display module 000, the thickness D0 of the first adhesive layer 40 is greater than or equal to 0.1 mm.

[0072] This embodiment explains that the thickness D0 of the first adhesive layer 40 in the direction Z perpendicular to the light-emitting surface of the display module 000 needs to be at least 0.1 mm. If the thickness D0 of the first adhesive layer 40 is too thin (less than 0.1 mm), on the one hand, the bonding strength is insufficient, the adhesive layer adhesion is not strong enough, and bonding failure is likely to occur; on the other hand, it will cause the height dimension of the first gap 40K to be too small, the three-dimensional flow cross-sectional area of ​​the potting channel is insufficient, the amount of adhesive passing through is limited, and the guiding effect is not obvious. This embodiment limits the thickness D0 of the first adhesive layer 40 to be greater than or equal to 0.1 mm, which can ensure that the first adhesive layer 40 has sufficient bonding strength to achieve reliable bonding between the second back plate 202 and the buffer composite layer 30, and also enable the first gap 40K to form a three-dimensional potting channel with sufficient height, increase the amount of adhesive passing through per unit time, enhance the conduction effect of the inner and outer sides of R, more efficiently balance the potting pressure of the inner and outer sides of R, avoid the generation of filler voids, and ensure the encapsulation effect.

[0073] In some other alternative embodiments, please continue to refer to the references. Figures 16-18 and Figure 23 , Figure 24 In this embodiment, along the arrangement direction K of the first region 10A and the bending region 10W, the width W0 of the first adhesive layer 40 is less than or equal to 2mm.

[0074] If the width W0 of the first adhesive layer 40 along the arrangement direction K of the first region 10A and the bending region 10W is too wide, during the bonding of the second back panel 202 and the buffer composite layer 30, unavoidable bonding deviations may cause the first adhesive layer 40 to extend beyond the edge of the display panel 10 or the edge of the second back panel 202, resulting in adhesive overflow, contaminating other functional film layers, causing display defects, and affecting product yield. This embodiment limits the width W0 of the first adhesive layer 40 along the arrangement direction K of the first region 10A and the bending region 10W to less than or equal to 2mm. This allows for strict control of the first adhesive layer 40 within the bonding range of the second back panel 202 and the buffer composite layer 30, preventing adhesive overflow and ensuring product yield.

[0075] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figure 25 , Figure 25 yes Figure 16Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 25 (Transparency fill has been applied). In this embodiment, along the arrangement direction K of the first region 10A and the bending region 10W, the first sub-segment 401 includes a first side 401A and a second side 401B, with the second side 401B located on the side of the first side 401A away from the bending region 10W. Along the third direction J, the length LA of the first side 401A is greater than the length LB of the second side 401B; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first area 10A and the bending area 10W.

[0076] This embodiment explains that the lengths of the opposing first side 401A and second side 401B of the first sub-segment 401 are different. Specifically, along the arrangement direction K of the first region 10A and the bending region 10W, the first sub-segment 401 includes opposing first side 401A and second side 401B. The second side 401B is farther away from the bending region 10W than the first side 401A. The first side 401A, which is closer to the bending region 10W, has a longer length LA in the third direction J, while the second side 401B, which is farther away from the bending region 10W, has a shorter length LB in the third direction J. Overall, it has a trapezoidal shape that is wider near the bending region 10W and narrower away from the bending region 10W, making the adjacent first sub-segments 401... The first gap 40K has a flared shape, wider on the outside (wider on the side away from the bending area 10W) ​​and narrower on the inside (narrower on the side closer to the bending area 10W). When the adhesive enters the first gap 40K from the outside of R, the wide inlet can hold more adhesive, increase the amount of adhesive injected, and improve the flow efficiency. The narrowing channel can accelerate the flow of adhesive towards the inside of R, quickly guiding a large amount of adhesive to the inside of R, forming a flow rate gradient, and further improving the flow efficiency. At the same time, the first side 401A of the first sub-segment 401 near the bending area 10W has a longer length LA in the third direction J, which can better adapt to the arc structure of the bending side, optimize the rebound stress during bending, and help improve the adhesion and structural stability of the bond.

[0077] For example, such as Figure 16 , Figure 17 and Figure 26 As shown, Figure 26 yes Figure 16 Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 26 (Transparency fill has been applied). In this embodiment, the first side 401A and the second side 401B of the first sub-segment 401 are connected by the first hypotenuse 401X; the first hypotenuse 401X and the first side 401A form a first acute angle α1, which is 30 degrees to 60 degrees.

[0078] In this embodiment, along the arrangement direction K of the first region 10A and the bending region 10W, the first sub-segment 401 includes a first side 401A and a second side 401B. The second side 401B is farther away from the bending region 10W than the first side 401A. The first side 401A, which is closer to the bending region 10W, has a longer length LA in the third direction J, while the second side 401B, which is farther away from the bending region 10W, has a shorter length LB in the third direction J. The overall shape is a trapezoidal shape that is wider closer to the bending region 10W and narrower farther away from the bending region 10W. The first side 401A and the second side 401B are connected by a first inclined side 401X. The first acute angle α1 formed by the first inclined side 401X and the first side 401A is controlled between 30° and 60°. If the first acute angle α1 is too small (less than 30°), the length difference between the first side 401A and the second side 401B will be too large, and the bonding edge at the second side 401B will be too narrow, which will lead to insufficient bonding strength at the second side 401B and easy adhesion peeling. If the first acute angle α1 is too large (greater than 60°), the first inclined side 401X will be too steep and close to a right angle, which will not significantly improve the flow of the adhesive and will easily cause stress concentration at the corner close to the right angle, affecting the stability of the film layer. In this embodiment, the angle between the first inclined side 401X and the first side 401A is limited to the range of 30°-60°. This ensures that the second side 401B has sufficient bonding length and maintains adequate bonding strength, preventing the first segment 401 from failing to bond at the second side 401B. Furthermore, the different first inclined sides 401X of the two adjacent first segments 401 create a smooth flow guide for the adhesive, reducing flow resistance and guiding the adhesive to flow smoothly from the outside to the inside of the R region. At the same time, it avoids stress concentration at right-angle corners, improving the structural reliability and service life of the adhesive layer.

[0079] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figures 27-31 , Figure 27 yes Figure 16 Another planar structure diagram of the backlight side of the display module (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 27 (Transparency fill was applied) Figure 28 yes Figure 27 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer. Figure 29 yes Figure 27 A schematic diagram of a cross-sectional structure along the E1-E1' direction. Figure 30 yes Figure 27 A schematic diagram of a cross-sectional structure along the E2-E2' direction. Figure 31 yes Figure 30A schematic diagram of the path during the filling of the filler adhesive. In this embodiment, the buffer composite layer 30 includes a plurality of first openings 30K, and the first openings 30K penetrate the thickness of the buffer composite layer 30; along the arrangement direction K of the first region 10A and the bending region 10W, the buffer composite layer 30 includes a first edge 30L1 facing the bending region 10W, and a portion of the first edge 30L1 is recessed in a direction away from the bending region 10W to form the first opening 30K; The first gap 40K is included between two adjacent first sub-segments 401; The orthographic projection of the first opening 30K onto the light-emitting surface of the display module 000 and the orthographic projection of the first gap 40K onto the light-emitting surface of the display module 000 at least partially overlap.

[0080] This embodiment explains that the buffer composite layer 30 has a first edge 30L1 on the side facing the bending area 10W. The first edge 30L1 is recessed away from the bending area 10W at the position corresponding to the first gap 40K, forming a first opening 30K that penetrates the thickness of the buffer composite layer 30. That is, the buffer composite layer 30 is recessed a certain distance at the position corresponding to the first gap 40K to form the first opening 30K. The first opening 30K and the first gap 40K overlap in the direction Z perpendicular to the light-emitting surface of the display module 000. By creating the first opening 30K, it is equivalent to extending the glue channel further into the buffer composite layer 30. Figure 31 The direction of arrow G1 shown can be understood as the direction of adhesive flow. It can greatly expand the flow cross-sectional area of ​​the adhesive flow channel, reduce the obstruction of the adhesive by the edge of the buffer composite layer 30, and allow more filler adhesive 50 to quickly flow into the first gap 40K and the first opening 30K, and flow into the inner side of the bending area 10W, thereby increasing the adhesive filling speed and filling amount on the inner side of R, further reducing the risk of voids. In addition, the recessed first opening 30K in some areas will not damage the main structure of the buffer composite layer 30, and can still retain its function of buffering stress and supporting the film layer.

[0081] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figures 32-36 , Figure 32 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module. Figure 33 yes Figure 32 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer. Figure 34 yes Figure 33 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 32 and Figure 34 (Transparency fill was applied) Figure 35 yes Figure 32 A schematic diagram of a cross-sectional structure along the E3-E3' direction. Figure 36 yes Figure 35 A schematic diagram of the path during the filling of the filler. In this embodiment, along the arrangement direction K of the first area 10A and the bending area 10W, the second back plate 202 includes a third side 202A and a fourth side 202B, with the third side 202A located on the side of the fourth side 202B away from the bending area 10W. The first opening 30K includes a first bottom 30K1 extending along a third direction J. Along the arrangement direction K of the first region 10A and the bending region 10W, the first bottom 30K1 is located on the side of the third side 202A away from the fourth side 202B; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first region 10A and the bending region 10W.

[0082] This embodiment explains that the buffer composite layer 30 has a first edge 30L1 on the side facing the bending area 10W. The first edge 30L1 is recessed away from the bending area 10W at the position corresponding to the first gap 40K, forming a first opening 30K that penetrates the thickness of the buffer composite layer 30. That is, when the buffer composite layer 30 is recessed a certain distance from the position corresponding to the first gap 40K to form the first opening 30K, the recessed depth of the first opening 30K exceeds the position of the third side 202A of the second back plate 202 away from the bending area 10W. The first bottom 30K1 of the first opening 30K is further away from the bending area 10W than the third side 202A of the second back plate 202, so that the depth of the first opening 30K exceeds the third side 202A of the second back plate 202, which can further expand the flow cross-sectional area of ​​the adhesive flow channel. Figure 36 The direction of arrow G2 shown can be understood as the direction of glue flow. During glue pouring, the glue on the outside of R can flow directly into the inside of R without obstruction through the further constricted first opening 30K and first gap 40K, maximizing the flow efficiency and filling effect of glue pouring.

[0083] For example, such as Figure 16 , Figure 17 , Figure 32 , Figure 34 , Figure 35As shown, along the arrangement direction K of the first area 10A and the bending area 10W, the distance ΔD between the first bottom 30K1 and the third side 202A is greater than or equal to 0.1mm. The first bottom 30K1 of the first opening 30K is further away from the bending area 10W than the third side 202A of the second back plate 202. When the depth of the first opening 30K exceeds the third side 202A of the second back plate 202, the first bottom 30K1 of the first opening 30K is further recessed inward by at least 0.1mm away from the bending area 10W compared to the third side 202A of the second back plate 202. If the inward amount of the first opening 30K is insufficient, the third side 202A of the second back plate 202 may still block the first opening 30K during mounting offset, reducing the effective area of ​​the channel and reducing the guiding effect. In this embodiment, the distance ΔD between the first bottom 30K1 and the third side 202A is limited to be greater than or equal to 0.1mm, which provides sufficient tolerance margin. Even if there is a mounting offset of the buffer composite layer 30 or the second back plate 202, the third side 202A of the second back plate 202 will not block the first opening 30K. A certain distance is always maintained between the first bottom 30K1 of the first opening 30K and the third side 202A of the second back plate 202, which can ensure the stability of the potting channel.

[0084] For example, in this embodiment, the first bottom 30K1 of the first opening 30K is further recessed by at least 0.1mm in the direction away from the bending area 10W compared to the third side 202A of the second back plate 202. This further expands the potting channel formed by the first gap 40K of the first adhesive layer 40. Therefore, the thickness of the first adhesive layer 40 can be appropriately reduced. For example, the thickness of the first adhesive layer 40 can be set to be greater than or equal to 0.03mm. Then, for a display module of the same thickness, the thickness of the buffer composite layer 30 can be correspondingly increased, which is beneficial to enhancing the overall strength and reliability of the module.

[0085] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figures 37-39 , Figure 37 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module. Figure 38 yes Figure 37 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer. Figure 39 yes Figure 38 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 37 and Figure 39(Transparency filling was performed). In this embodiment, along the third direction J, the length L5 of the first opening 30K is less than the length L6 of the first gap 40K; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first area 10A and the bending area 10W; the orthographic projection of the first opening 30K on the light-emitting surface of the display module 000 is located within the range of the orthographic projection of the first gap 40K on the light-emitting surface of the display module 000.

[0086] This embodiment explains that along the third direction J, the size of the first opening 30K is smaller than the size of the first gap 40K, and the first opening 30K is set to fall entirely within the projection range of the first gap 40K. If the length L5 of the first opening 30K along the third direction J is greater than the length L6 of the first gap 40K, when slightly misaligned, both ends of the first opening 30K will extend beyond the range of the first gap 40K, and the bonding area of ​​the first segment 401 will be exposed within the range of the first opening 30K, affecting the bonding effect of the first segment 401. Therefore, this embodiment limits the length L5 of the first opening 30K to be smaller than the length L6 of the first gap 40K, and ensures that the first opening 30K falls entirely within the projection range of the first gap 40K. This ensures that the area of ​​the first opening 30K completely corresponds to the potting channel and does not intrude into the bonding area of ​​the first segment 401, which helps to ensure the complete fit and bonding strength of the bonding surface. It also maximizes the use of the space of the first gap 40K for drainage, balancing drainage effect and structural reliability.

[0087] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figures 40-43 , Figure 40 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module. Figure 41 yes Figure 40 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer. Figure 42 yes Figure 41 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 40 and Figure 42 (Transparency fill was applied) Figure 43 yes Figure 40A cross-sectional structural diagram along the E4-E4' direction is shown in this embodiment. The second back plate 202 includes a plurality of second openings 202K, which penetrate the thickness of the second back plate 202. Along the arrangement direction K of the first region 10A and the bending region 10W, the second back plate 202 includes opposing third side 202A and fourth side 202B. The third side 202A is located on the side of the fourth side 202B away from the bending region 10W. A portion of the third side 202A is recessed in the direction away from the bending region 10W to form the second opening 202K. The orthographic projection of the first gap 40K onto the light-emitting surface of the display module 000 at least partially overlaps with the orthographic projection of the second opening 202K onto the light-emitting surface of the display module 000.

[0088] This embodiment explains that the third side 202A of the second back plate 202, away from the bending area 10W, is recessed towards the bending area 10W at the position corresponding to the first gap 40K, forming a second opening 202K that penetrates the thickness of the second back plate 202. The second opening 202K and the first gap 40K overlap in the direction Z perpendicular to the light-emitting surface of the display module 000. The second opening 202K, located on the third side 202A of the second back plate 202 away from the bending area 10W at the position corresponding to the first gap 40K, can eliminate... The third side 202A of the second back plate 202 blocks the adhesive, allowing the channel through which the adhesive enters via the first gap 40K to extend further into the second back plate 202. This further increases the cross-sectional area through which the adhesive can flow, shortens the flow path, and reduces flow resistance, allowing the filler adhesive 50 to flow more smoothly into the inner R of the bending area 10W. Furthermore, the recessed second opening 202K preserves the continuous structure of the main body of the second back plate 202, without weakening its support and protection capabilities, and still provides sufficient support for the display panel 10.

[0089] For example, along the arrangement direction K of the first region 10A and the bending region 10W, the depth D1 of the second opening 202K is less than or equal to 0.2mm.

[0090] If the recess depth D1 of the second opening 202K is too large, excessive material will be removed from the edge of the second backplate 202, resulting in a reduction in the effective support area of ​​the second backplate 202 and a significant decrease in structural strength. This makes it prone to deformation and breakage when bent or subjected to external forces, thus losing its supporting and protective function for the display panel 10. In this embodiment, the depth D1 of the second opening 202K is limited to less than or equal to 0.2mm. This not only facilitates further expansion of the potting channel and improves the flow effect but also ensures that the second backplate 202 still has sufficient support width and structural strength, preventing support failure due to an excessively deep second opening 202K.

[0091] In other embodiments, please refer to the references Figure 16 , Figure 17and Figures 44-46 , Figure 44 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module. Figure 45 yes Figure 44 A comparative diagram showing the disassembly of the second backplate, the first adhesive layer, and the buffer composite layer. Figure 46 yes Figure 45 A schematic diagram of the structure after the second backplate, the first adhesive layer, and the buffer composite layer are stacked (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 44 and Figure 46 (Transparency filling was performed). In this embodiment, along the third direction J, the length L7 of the second opening 202K is less than the length L6 of the first gap 40K; wherein, in the direction parallel to the light-emitting surface of the display module 000, the third direction J is perpendicular to the arrangement direction K of the first area 10A and the bending area 10W. The orthographic projection of the second opening 202K onto the light-emitting surface of the display module 000 is located within the range of the orthographic projection of the first gap 40K onto the light-emitting surface of the display module 000.

[0092] This embodiment explains that along the third direction J, the size of the second opening 202K is smaller than the size of the first gap 40K, and the second opening 202K is set to fall entirely within the projection range of the first gap 40K. If the length L7 of the second opening 202K along the third direction J is greater than the length L6 of the first gap 40K, when slightly misaligned, both ends of the second opening 202K will extend beyond the range of the first gap 40K, and the bonding area of ​​the first segment 401 will be exposed within the range of the second opening 202K, affecting the bonding effect of the first segment 401. Therefore, this embodiment limits the length L7 of the second opening 202K to be less than the length L6 of the first gap 40K, and ensures that the second opening 202K falls entirely within the projection range of the first gap 40K. This ensures that the area of ​​the second opening 202K completely corresponds to the potting channel and does not intrude into the bonding area of ​​the first segment 401, which helps to ensure the complete adhesion and bonding strength of the bonding surface. It also maximizes the use of the space of the first gap 40K for flow guidance, balancing the flow guidance effect and structural reliability.

[0093] For example, such as Figure 16 , Figure 17 and Figures 44-46 As shown, along the third direction J, the length L7 of the second opening 202K is equal to the length L5 of the first opening 30K; the orthographic projection of the first opening 30K on the light-emitting surface of the display module 000 overlaps with the orthographic projection of the second opening 202K on the light-emitting surface of the display module 000.

[0094] In this embodiment, the first opening 30K of the buffer composite layer 30 and the second opening 202K of the second backplate 202 are of equal length along the third direction J. Furthermore, the orthographic projections of the first opening 30K onto the light-emitting surface of the display module 000 and the second opening 202K onto the light-emitting surface of the display module 000 can overlap and form a regular adhesive flow channel. If the lengths L7 and L5 of the second opening 202K and the first opening 30K are inconsistent or misaligned, steps and misalignments will form within the adhesive flow channel, increasing the resistance to adhesive flow and making it easy for adhesive air bubbles to accumulate at the steps, thus increasing the risk of voids. This embodiment, by setting the first opening 30K and the second opening 202K to be of equal length and aligned and overlapping, forms a regular, stepless adhesive channel, minimizing adhesive flow resistance, preventing adhesive air bubble accumulation, and improving the smoothness and uniformity of adhesive flow.

[0095] In other embodiments, please refer to the references Figure 16 , Figure 17 and Figures 47-49 , Figure 47 yes Figure 16 A schematic diagram of another planar structure on one side of the backlight surface of the display module. Figure 48 yes Figure 47 A comparative diagram showing the disassembled components of the display panel, second back panel, first adhesive layer, and buffer composite layer in the second zone. Figure 49 yes Figure 48 A schematic diagram of the structure of the second zone after the display panel, second back panel, first adhesive layer, and buffer composite layer are stacked (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 47 and Figure 49 (Transparency filling has been performed). In this embodiment, the display panel 10 of the second region 10B includes a plurality of third openings 10BK, which penetrate through the thickness of the display panel 10. Along the arrangement direction K of the first region 10A and the bending region 10W, the display panel 10 of the second region 10B includes a second edge 10L away from the bending region, and a portion of the second edge 10L is recessed in the direction away from the bending region 10W to form a third opening 10BK. The orthographic projection of the first gap 40K onto the light-emitting surface of the display module 000 at least partially overlaps with the orthographic projection of the third opening 10BK onto the light-emitting surface of the display module 000.

[0096] This embodiment explains the second edge 10BL of the second region 10B of the display panel 10. The second edge 10BL is the edge of the second region 10B away from the bending region 10W. The second edge 10BL is also recessed towards the bending region 10W at the position corresponding to the first gap 40K, forming a third opening 10BK that penetrates the thickness of the display panel 10. The third opening 10BK and the first gap 40K overlap in the direction Z perpendicular to the light-emitting surface of the display module 000. By opening the third opening 10BK at the position of the second edge 10BL of the second region 10B away from the bending region 10W, corresponding to the first gap 40K, the thickness of the display panel 10 can be reduced. The second edge 10BL blocks the adhesive, allowing the channel through the first gap 40K to extend further into the second backplate 202 and the display panel 10 of the second area 10B. This further increases the cross-sectional area through which the adhesive can flow, expands the depth of the adhesive channel in the direction Z perpendicular to the light-emitting surface of the display module 000, shortens the adhesive flow path, reduces flow resistance, and allows the filler adhesive 50 to flow more smoothly into the inner side of the bending area 10W. Furthermore, the recessed third opening 10BK can retain the main continuous structure of the display panel 10 of the second area 10B. The display panel 10 of the second area 10B is a non-display area, so it will not affect the normal light emission and wiring functions of the display area.

[0097] For example, such as Figure 16 , Figure 17 , Figure 47 , Figure 49 and Figure 50 As shown, Figure 50 yes Figure 49 A schematic diagram of the structure of the second display panel and the second back panel stacked in the middle area (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 50(Transparency filling has been applied). The orthographic projection of the third opening 10BK on the light-emitting surface of the display module 000 coincides with the orthographic projection of the second opening 202K on the light-emitting surface of the display module 000. In this embodiment, the projections of the third opening 10BK of the display panel 10 and the second opening 202K of the second back plate 202 in the direction Z perpendicular to the light-emitting surface of the display module 000 completely coincide, and their edges are aligned. If the third opening 10BK and the second opening 202K are misaligned, a stepped misalignment will be formed between the display panel 10 and the second back plate 202, which is prone to trapping air bubbles, and the stress distribution at the opening edges of different layers will be uneven, which is prone to causing film cracking. In this embodiment, the orthographic projection of the third opening 10BK on the light-emitting surface of the display module 000 coincides with the orthographic projection of the second opening 202K on the light-emitting surface of the display module 000. This forms a flush-type potting channel from the buffer composite layer 30 to the second back plate 202 and then to the display panel 10. The sidewalls are flat and without steps, which can avoid air bubble retention, improve filling uniformity, and the flush edges can make the stress distribution of each layer uniform, reducing the risk of film cracking caused by stress concentration. In addition, the third opening 10BK of the display panel 10 and the second opening 202K of the second back plate 202 can also complete the edge forming of the display panel 10 and the second back plate 202 simultaneously through a cutting process, which helps to simplify the process and improve process efficiency and alignment accuracy.

[0098] For example, such as Figure 16 , Figure 17 , Figure 47 , Figure 49 As shown, along the arrangement direction K of the first zone 10A and the bending zone 10W, the depth D2 of the third opening 10BK is less than or equal to 3mm. If the depth D2 of the third opening 10BK is too large, it will occupy too much wiring space in the second zone 10B, squeezing the area for bonding pads and drive traces in the second zone 10B, affecting the electrical connection and driving function between the display panel and the flexible circuit board, and even causing insufficient trace width and abnormal signal transmission. This embodiment limits the depth D2 of the third opening 10BK to less than or equal to 3mm, which improves the potting filling effect while ensuring that the second zone has sufficient space to lay drive traces and bonding pads, etc., to meet electrical performance requirements.

[0099] In some alternative embodiments, please refer to Figure 51 , Figure 51 This is a schematic diagram of a planar structure of a display device provided in an embodiment of the present disclosure. The display device 111 provided in this embodiment includes the display module 000 provided in the above-described embodiment of the present disclosure. Figure 51This embodiment uses a mobile phone as an example to illustrate the display device 111. It is understood that the display device 111 provided in this embodiment can be other display devices 111 with display functions, such as computers, televisions, and in-vehicle display devices. This disclosure does not impose specific limitations on this. The display device 111 provided in this embodiment has the beneficial effects of the display module 000 provided in this embodiment. For details, please refer to the specific descriptions of the display module 000 in the above embodiments. These descriptions will not be repeated here.

[0100] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0101] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that, include: The display panel includes a first area, a bending area, and a second area, which are connected by the bending area. The first area includes a display area, and the second area is bent to the backlight side of the display module through the bending area. The display panel includes a first surface and a second surface disposed opposite to each other. In the bending area, the radius of curvature of the first surface is greater than the radius of curvature of the second surface. A first back plate and a second back plate, wherein the first back plate is located on the second surface of the display panel in the first region, and the second back plate is located on the second surface of the display panel in the second region; A buffer composite layer is located between the first back plate and the second back plate; A first adhesive layer is used to fix the second back plate to the buffer composite layer. The first adhesive layer includes multiple independently arranged first sub-segments. A filler adhesive that at least covers the first and second surfaces of the bending region, and the filler adhesive is at least partially located between adjacent first segments.

2. The display module according to claim 1, characterized in that, The display module includes a first side extending along a first direction and a second side extending along a second direction; in a direction parallel to the light-emitting surface of the display module, the first direction and the second direction are perpendicular to each other; In the first direction, the bending area is located on one side of the first area.

3. The display module according to claim 2, characterized in that, The bending area includes a first bending area and a second bending area, and the second area includes a first sub-area and a second sub-area; In the first direction, the first bending area and the second bending area are located on opposite sides of the first area; the first sub-area bends through the first bending area to the backlight side of the display module, and the second sub-area bends through the second bending area to the backlight side of the display module.

4. The display module according to claim 3, characterized in that, The bending area further includes a third bending area, and the second area further includes a third sub-area; In the second direction, the third bending area is located on one side of the first area, and the third sub-area is bent to the backlight side of the display module through the third bending area.

5. The display module according to claim 2, characterized in that, The bending area includes a first bending area and a second bending area, and the second area includes a first sub-area and a second sub-area; In the first direction, the first bending area is located on one side of the first area, and the first sub-area bends through the first bending area to the backlight side of the display module; in the second direction, the second bending area is located on one side of the first area, and the second sub-area bends through the second bending area to the backlight side of the display module.

6. The display module according to claim 1, characterized in that, The display module also includes a flexible circuit board; The second area includes a bonding area, in which the flexible circuit board is bonded and electrically connected to the display panel; Along a third direction, the length of the flexible circuit board is less than the length of the bending area; wherein, in a direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first area and the bending area.

7. The display module according to claim 6, characterized in that, The flexible circuit board includes at least two independent sub-circuit boards, which are spaced apart in the third direction.

8. The display module according to claim 6, characterized in that, In the third direction, the bonding area includes at least two bonding sub-areas spaced apart, and the flexible circuit board includes at least two pin areas spaced apart, with the pin areas and the bonding sub-areas corresponding one-to-one for bonding and electrical connection. In the third direction, the flexible circuit board includes a cutout area between two adjacent pin areas, and the flexible circuit board in the cutout area is hollowed out; A first gap is included between two adjacent first sub-segments, and the hollow area at least exposes part of the first gap's projection onto the light-emitting surface of the display module.

9. The display module according to claim 8, characterized in that, In the cutout area, along the arrangement direction of the first area and the bending area, the distance between the edge of the flexible circuit board facing the bending area and the edge of the first adhesive layer away from the bending area is greater than 0.

10. The display module according to claim 1, characterized in that, The material of the first adhesive layer includes double-sided tape or dispensing adhesive.

11. The display module according to claim 1, characterized in that, Along a third direction, the length of the bending area is greater than or equal to 50 mm; wherein, in a direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first area and the bending area.

12. The display module according to claim 1, characterized in that, Along the third direction, the length of the first sub-segment is A, and the distance between two adjacent first sub-segments is B; A / B≥1; wherein, in the direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first area and the bending area.

13. The display module according to claim 12, characterized in that, B≥0.5mm.

14. The display module according to claim 1, characterized in that, Along the direction perpendicular to the light-emitting surface of the display module, the thickness of the first adhesive layer is greater than or equal to 0.1 mm.

15. The display module according to claim 1, characterized in that, Along the arrangement direction of the first region and the bending region, the width of the first adhesive layer is less than or equal to 2 mm.

16. The display module according to claim 1, characterized in that, Along the arrangement direction of the first region and the bending region, the first sub-segment includes a first side and a second side opposite to each other, and the second side is located on the side of the first side away from the bending region; Along a third direction, the length of the first side is greater than the length of the second side; wherein, in a direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first region and the bending region.

17. The display module according to claim 16, characterized in that, The first side and the second side are connected by a first hypotenuse; The first hypotenuse and the first side form a first acute angle, which is 30-60 degrees.

18. The display module according to claim 1, characterized in that, The buffer composite layer includes a plurality of first openings, the first openings penetrating the thickness of the buffer composite layer; along the arrangement direction of the first region and the bending region, the buffer composite layer includes a first edge facing the bending region, a portion of the first edge being recessed in a direction away from the bending region to form the first opening. A first gap is included between two adjacent first sub-segments; The orthographic projection of the first opening onto the light-emitting surface of the display module and the orthographic projection of the first gap onto the light-emitting surface of the display module at least partially overlap.

19. The display module according to claim 18, characterized in that, Along the arrangement direction of the first region and the bending region, the second back plate includes a third side and a fourth side opposite to each other, wherein the third side is located on the side of the fourth side away from the bending region; The first opening includes a first bottom extending along a third direction. Along the arrangement direction of the first area and the bending area, the first bottom is located on the side of the third side away from the fourth side; wherein, in a direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first area and the bending area.

20. The display module according to claim 19, characterized in that, Along the arrangement direction of the first region and the bending region, the distance between the first bottom and the third side is greater than or equal to 0.1 mm.

21. The display module according to claim 18, characterized in that, Along a third direction, the length of the first opening is less than the length of the first gap; wherein, in a direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first region and the bending region. The orthographic projection of the first opening onto the light-emitting surface of the display module is located within the range of the orthographic projection of the first gap onto the light-emitting surface of the display module.

22. The display module according to claim 18, characterized in that, The second back plate includes a plurality of second openings, the second openings penetrating the thickness of the second back plate; along the arrangement direction of the first region and the bending region, the second back plate includes opposing third and fourth sides, the third side being located on the side of the fourth side away from the bending region, and a portion of the third side is recessed in the direction away from the bending region to form the second opening; The orthographic projection of the first gap onto the light-emitting surface of the display module and the orthographic projection of the second opening onto the light-emitting surface of the display module at least partially overlap.

23. The display module according to claim 22, characterized in that, Along the arrangement direction of the first region and the bending region, the depth of the second opening is less than or equal to 0.2 mm.

24. The display module according to claim 22, characterized in that, Along a third direction, the length of the second opening is less than the length of the first gap; wherein, in a direction parallel to the light-emitting surface of the display module, the third direction is perpendicular to the arrangement direction of the first region and the bending region; The orthographic projection of the second opening onto the light-emitting surface of the display module is located within the range of the orthographic projection of the first gap onto the light-emitting surface of the display module.

25. The display module according to claim 24, characterized in that, Along the third direction, the length of the second opening is equal to the length of the first opening; the orthographic projection of the first opening onto the light-emitting surface of the display module overlaps with the orthographic projection of the second opening onto the light-emitting surface of the display module.

26. The display module according to claim 22, characterized in that, The display panel in the second region includes a plurality of third openings that penetrate the thickness of the display panel; along the arrangement direction of the first region and the bending region, the display panel in the second region includes a second edge away from the bending region, and a portion of the second edge is recessed in a direction away from the bending region to form the third opening; The projection of the first gap onto the light-emitting surface of the display module and the projection of the third opening onto the light-emitting surface of the display module at least partially overlap.

27. The display module according to claim 26, characterized in that, The orthographic projection of the third opening onto the light-emitting surface of the display module coincides with the orthographic projection of the second opening onto the light-emitting surface of the display module.

28. The display module according to claim 26, characterized in that, Along the arrangement direction of the first region and the bending region, the depth of the third opening is less than or equal to 3 mm.

29. A display device, characterized in that, Includes the display module as described in any one of claims 1-28.

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