Display module and display device

Abstract

The present disclosure relates to the technical field of display, and in particular to a display module and a display device. The display module comprises a display panel, the display panel comprises a display area and a non-display area on at least one side of the display area, and the display panel comprises a first insulating substrate, a second insulating substrate and a light-emitting functional layer which are sequentially stacked; a driving circuit structure is arranged on a side of the first insulating substrate away from the light-emitting functional layer, and a projection of the driving circuit structure on the first insulating substrate at least partially overlaps the display area; and a first conductive via is at least through the first insulating substrate, the first conductive via is filled with a conductive material, one end of the first conductive via is connected with at least one first conductive layer of the light-emitting functional layer, and the other end of the first conductive via forms an electrical connection with the driving circuit structure.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, mobile terminal devices (such as smartphones and tablets) are gradually moving towards full-screen displays, and high screen-to-body ratio has become a key competitive focus for current display products. Full-screen display devices have a higher screen-to-body ratio, meaning that all four sides have an ultra-narrow bezel design, with narrower top, bottom, and side bezels, thus bringing users a more aesthetically pleasing visual experience and a more refined appearance.

[0003] In full-screen display technology, reducing the width of the bottom bezel (the area below the display area in the non-display area of ​​the display panel) is crucial for improving the screen-to-body ratio. Currently, the pad bending process is limited by its bending radius, making it difficult to completely eliminate the bezel size occupied by the bending area. In existing technologies, the pad bending area typically accounts for more than 40% of the overall width of the bottom bezel, becoming a major bottleneck restricting further narrowing of the bottom bezel. Therefore, how to effectively reduce or even eliminate the impact of the pad bending process on the bottom bezel width to achieve an extremely narrow bottom bezel or even a bezel-less full-screen display has become a pressing technical problem to be solved in this field. Summary of the Invention

[0004] This application provides a display module and a display device, aiming to solve the problem of how to achieve a full-screen display with an extremely narrow bottom bezel.

[0005] A first aspect of this application provides a display module, the display module comprising: The display panel includes a display area and a non-display area on at least one side of the display area. The display panel includes: a first insulating substrate, a second insulating substrate, and a light-emitting functional layer stacked sequentially. A driving circuit structure is disposed on the side of the first insulating substrate away from the light-emitting functional layer, and the orthographic projection of the driving circuit structure on the first insulating substrate at least partially overlaps with the display area. The first conductive via penetrates at least the first insulating substrate and is filled with a conductive material. One end of the first conductive via is connected to at least one first conductive layer of the light-emitting functional layer, and the other end is electrically connected to the driving circuit structure.

[0006] In one optional embodiment, the light-emitting functional layer further includes at least one organic insulating layer located between the at least one first conductive layer and the second insulating substrate; The first conductive via penetrates the first insulating substrate, the second insulating substrate, and the at least one organic insulating layer, and forms an electrical connection with the at least one first conductive layer.

[0007] In one alternative embodiment, the orthographic projection of the first conductive via on the first insulating substrate is located within the non-display area.

[0008] In one optional embodiment, the light-emitting functional layer includes a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer stacked sequentially, wherein the first source / drain metal layer is disposed close to the first insulating substrate. The at least one first conductive layer is disposed in the same layer as at least one of the following: a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer.

[0009] In an optional embodiment, the display panel further includes a second conductive layer disposed between the first insulating substrate and the second insulating substrate, and the second conductive layer is electrically connected to the at least one first conductive layer through a second conductive via. The orthographic projection of the second conductive layer on the first insulating substrate covers the orthographic projection of the first conductive via on the first insulating substrate. The first conductive via at least penetrates the first insulating substrate and forms an electrical connection with the second conductive layer.

[0010] In one alternative embodiment, in the orthographic projection on the first insulating substrate, the second conductive via is located within the non-display area and does not overlap with the first conductive via.

[0011] In one alternative embodiment, the first conductive via penetrates the first insulating substrate and the second conductive layer, and the first conductive via further includes a groove extending into the second insulating substrate, wherein the conductive material fills the groove and is electrically connected to the second conductive layer through the hole wall of the second conductive layer.

[0012] In one optional embodiment, the driving circuit structure includes a carrier substrate and a driving chip, wherein the carrier substrate has the same stacked structure as the display panel in the non-display area; The carrier substrate includes at least a third insulating substrate, a fourth insulating substrate, and a third conductive layer stacked in sequence, wherein the conductive material of the first conductive via is in direct contact with the third conductive layer to form an electrical connection. The carrier substrate includes a bonding area, in which the third conductive layer is disposed away from the first insulating substrate relative to the fourth insulating substrate, and the driving chip is bonded to the third conductive layer.

[0013] In one alternative embodiment, the carrier substrate further includes a bending region located on at least one side of the bonding region, the orthographic projection of the bending region on the first insulating substrate at least partially overlapping the display region; Within the bending area, the end of the carrier substrate away from the bonding area is bent toward the side closer to the display panel to form a bending portion, and the third conductive layer of the bending portion is electrically connected to the conductive material of the first conductive via on the side closer to the first insulating substrate.

[0014] A second aspect of this application provides a display device, the display device including a display module as described in any one of the first aspects of this application.

[0015] Beneficial effects: This application provides a display module and a display device. The display module includes: a display panel, the display panel including a display area and a non-display area on at least one side of the display area, the display panel including: a first insulating substrate, a second insulating substrate and a light-emitting functional layer stacked sequentially; a driving circuit structure, the driving circuit structure being disposed on the side of the first insulating substrate opposite to the light-emitting functional layer, the orthographic projection of the driving circuit structure on the first insulating substrate at least partially overlapping the display area; a first conductive via, the first conductive via at least penetrating the first insulating substrate, the first conductive via being filled with a conductive material, one end of the first conductive via being connected to at least one first conductive layer of the light-emitting functional layer, and the other end being electrically connected to the driving circuit structure.

[0016] In the display module provided in this application, the driving circuit structure is disposed on the side of the first insulating substrate away from the light-emitting functional layer, and its orthographic projection at least partially overlaps with the display area. It is directly electrically connected to the first conductive layer of the light-emitting functional layer through a first conductive via penetrating the first insulating substrate. This arrangement avoids the need for bending and bonding processes in the non-display area, eliminates the limitation of the bending radius on the bezel width, effectively reduces the bottom bezel width, and achieves a higher screen-to-body ratio. Simultaneously, the vertical interconnection of the conductive vias shortens the signal transmission path and improves the electrical performance of the display module.

[0017] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a display module structure that connects the driving circuit structure and the light-emitting functional layer through a second conductive layer, according to an embodiment of this application. Figure 2 This is a schematic diagram of a display module structure that connects the driving circuit structure and the light-emitting functional layer through a first conductive via according to an embodiment of this application; Figure 3 This is a schematic diagram of a display module structure with a drive circuit structure for setting a carrier substrate, according to an embodiment of this application; Figure 4 This is a schematic diagram of a display module structure with a bent area on a substrate according to an embodiment of this application; Figure 5 This is a schematic diagram of a carrier substrate structure formed from a display panel according to an embodiment of this application; Figure 6 This is a schematic diagram of the hierarchical structure of the light-emitting functional layer in the display area according to an embodiment of this application; Figure 7 This is a schematic diagram of a display module structure in which a second conductive layer connects a driving circuit structure with a carrier substrate and a light-emitting functional layer, according to an embodiment of this application. Figure 8 This is a schematic diagram of a display module structure in which a second conductive layer connects a drive circuit structure to a carrier substrate with a bending region and a light-emitting functional layer, according to an embodiment of this application. Figure 9 This is a top view schematic diagram of a driving circuit structure and a light-emitting functional layer connected through a second conductive layer, as proposed in an embodiment of this application. Figure 10 This is a top view schematic diagram of a drive circuit structure and a light-emitting functional layer connected through a first conductive via according to an embodiment of this application; Figure 11 This is a top view schematic diagram of a carrier substrate structure formed on a display panel according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached drawings: 11, First insulating substrate; 12, Second insulating substrate; 13, Light-emitting functional layer; 131, First conductive layer; 132, Second conductive layer; 14, Buffer layer; 21, First conductive via; 211, First conductive structure; 212, Second conductive structure; 22, Second conductive via; 31, Supporting substrate; 311, Third insulating substrate; 312, Fourth insulating substrate; 313, Third conductive layer; 314, Driver chip; 315, Flexible circuit board; 41, Adhesive layer; 51, Cutting metal wire; A1, Bonding area; A2, Bending area; AA, Display area; BB, Non-display area; 42. Thin-film transistor; 421. Active layer; 4211. First region; 4212. Second region; 4213. Channel region; 422. First gate layer; 4231. First source; 4232. First drain; 424. First transition electrode; 425. Second transition electrode; 101. First gate insulating layer; 102. Second gate insulating layer; 103. Interlayer insulating layer; 104. Passivation layer; 105. First planarization layer; 106. Second planarization layer; 107. Third planarization layer; 201 1. First electrode plate; 202. Second electrode plate; 301. First electrode; 302. Organic light-emitting layer; 303. Second electrode; 304. Pixel definition layer; 401. First encapsulation layer; 402. Second encapsulation layer; 403. Third encapsulation layer; 501. First touch insulating layer; 502. Second touch insulating layer; 503. First touch electrode; 504. Second touch electrode; 601. First color filter insulating layer; 602. Second color filter insulating layer; 610. Light-shielding layer; 611. Color filter layer. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0023] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0024] With the continuous development of display technology, mobile terminal devices (such as smartphones and tablets) are gradually moving towards full-screen displays, and high screen-to-body ratio has become a key competitive focus for current display products. Full-screen display devices have a higher screen-to-body ratio, meaning that all four sides have an ultra-narrow bezel design, with narrower top, bottom, and side bezels, thus bringing users a more aesthetically pleasing visual experience and a more refined appearance.

[0025] In full-screen display technology, reducing the width of the bottom bezel (the area below the display area in the non-display area of ​​the display panel) is crucial for improving the screen-to-body ratio. Currently, the width of the bottom bezel is mainly determined by several functional areas, including the Fanout routing area, packaging area, touch interface hole area, and Pad Bending area. Pad Bending technology refers to bending a flexible circuit board or flexible substrate to the back of the display panel in the non-display area to connect driver chips or external signal lines.

[0026] With the application of FIP (Fanout in Panel) technology, the width of the bottom bezel caused by fanout traces has been effectively reduced. However, the Pad Bending process is limited by its bending radius, making it difficult to completely eliminate the bezel size occupied by the bending area. In existing technologies, the Pad Bending area typically accounts for more than 40% of the overall bottom bezel width, becoming a major bottleneck restricting further narrowing of the bottom bezel. Therefore, how to effectively reduce or even eliminate the impact of the Pad Bending process on the bottom bezel width to achieve ultra-narrow bottom bezels or even bezel-less full-screen displays has become a pressing technical problem to be solved in this field.

[0027] In view of this, embodiments of this application propose a display module, Figure 3 This application provides a schematic diagram of a display module structure with a drive circuit structure for mounting a substrate, as shown in one embodiment. Figure 3As shown, the display module includes a display panel and a driving circuit structure. The display panel includes a display area AA and a non-display area BB located on at least one side of the display area AA. The display area AA is used for image display, and the non-display area BB is used for arranging peripheral wiring and bonding structures. Specifically, the display panel includes a first insulating substrate 11, a second insulating substrate 12, and a light-emitting functional layer 13 stacked sequentially. The first insulating substrate 11 and the second insulating substrate 12 serve as insulating support layers, supporting the functional layers thereon and providing electrical isolation. Within the display area, the light-emitting functional layer 13 includes multiple sub-pixels, which emit light in response to driving signals to achieve image display.

[0028] The driving circuit structure is disposed on the side of the first insulating substrate 11 opposite to the light-emitting functional layer 13, i.e., on the back side of the display panel. The driving circuit structure includes a carrier substrate 31, a driving chip 314, and a flexible circuit board 315. The driving chip 314 and the flexible circuit board 315 are bonded to the carrier substrate 31. The driving chip 314 is electrically connected to the first conductive layer 131 of the light-emitting functional layer 13 through traces on the flexible circuit board 315 and the first conductive via 14. The driving circuit structure generates a driving signal through the driving chip 314, which is transmitted to the first conductive layer 131 of the light-emitting functional layer 13 to control the light-emitting functional layer 13 to emit light, thereby realizing the display of the image on the display panel.

[0029] In this embodiment, the display module is further provided with a first conductive via 21. The first conductive via 21 penetrates at least through the first insulating substrate 11. The first conductive via 21 is filled with conductive material. One end of the first conductive via 21 is connected to at least one first conductive layer 131 of the light-emitting functional layer 13, and the other end is electrically connected to the driving circuit structure. The orthographic projection of the driving circuit structure on the first insulating substrate 11 at least partially overlaps with the display area. By placing the driving circuit structure on the back side of the display panel and ensuring its orthographic projection on the first insulating substrate 11 at least partially overlaps with the display area, this embodiment eliminates the need for a pad bending portion in the non-display area of ​​the display panel to fold the driving chip 314 to the back side. This eliminates the limitation of the bending radius on the bezel width, effectively reducing the width occupied by the non-display area on the light-emitting surface of the display panel, achieving an ultra-narrow bezel or even bezel-less full-screen display effect, significantly improving the screen ratio and visual experience. Meanwhile, the driving signal is directly transmitted to the light-emitting functional layer 13 through the first conductive via 14 that vertically penetrates the first insulating substrate 11. This eliminates the need for long-distance winding or bending of the cabling, significantly shortening the signal transmission path and reducing parasitic capacitance and resistance. This helps to reduce signal transmission loss and delay, and improve the electrical performance, display uniformity, and long-term reliability of the display module.

[0030] In some alternative implementations, Figure 1 This illustration shows a schematic diagram of a display module structure according to an embodiment of this application, in which the driving circuit structure and the light-emitting functional layer are connected by a second conductive layer. Figure 7 This illustration shows a schematic diagram of a display module structure in which a second conductive layer connects a driving circuit structure with a carrier substrate and a light-emitting functional layer, according to an embodiment of this application. Figure 1 and Figure 7As shown, the display panel further includes a second conductive layer 132, which is disposed between the first insulating substrate 11 and the second insulating substrate 12, and electrically connected to at least one first conductive layer 131 through a second conductive via 22. The orthographic projection of the second conductive layer 132 on the first insulating substrate 11 covers the orthographic projection of the first conductive via 21 on the first insulating substrate 11. The first conductive via 21 penetrates at least the first insulating substrate 11 and is electrically connected to the second conductive layer 132. In this embodiment, by disposing of the second conductive layer 132 between the first insulating substrate 11 and the second insulating substrate 12, and electrically connecting it to the light-emitting functional layer 13 (through the second conductive via 22) and the driving circuit structure (through the first conductive via 21), vertical interconnection between the driving circuit structure and the light-emitting functional layer 13 can be achieved. This design, using the second conductive layer 132 as an intermediate transition layer, combined with the first conductive via 21 penetrating the first insulating substrate 11, significantly shortens the signal transmission path, which helps to reduce signal loss and delay, and improves the electrical performance of the display module.

[0031] In some alternative implementations, Figure 9 This illustration shows a top view of an embodiment of the present application that connects a driving circuit structure and a light-emitting functional layer through a second conductive layer, as shown in the diagram. Figure 9 As shown, to avoid adverse effects of the second conductive via 22 on the light emission of the display area, the second conductive via 22 is located within the non-display area in the orthographic projection on the first insulating substrate 11. Furthermore, to avoid mutual interference between the first conductive via 21 and the second conductive via 22, the second conductive via 22 does not overlap with the first conductive via 21 in the orthographic projection on the first insulating substrate 11. The first conductive via 21 is connected to the second conductive via 22 located within the non-display area BB via a connecting line of the second conductive layer. Through these arrangements, it can be ensured that the second conductive via 22 does not affect the light emission uniformity of the display area, while avoiding signal crosstalk between the two conductive vias, further improving the display quality and reliability of the display module.

[0032] In some optional embodiments, when the display panel is provided with a second conductive layer 132, the first conductive via 21 may penetrate only the first insulating substrate 11, so that the conductive material filled therein forms an electrical connection with the surface of the second conductive layer 132 facing the first insulating substrate 11, so as to realize the transmission of driving signals.

[0033] To further improve the reliability of electrical connections, such as Figure 1As shown, in some alternative embodiments, the first conductive via 21 penetrates the first insulating substrate 11 and the second conductive layer 132, and further extends into the interior of the second insulating substrate 12 to form a groove segment. The conductive material fills the groove segment and forms an electrical connection with the second conductive layer 132 through the hole wall of the second conductive layer 132 (i.e., the inner wall of the through hole formed when penetrating the second conductive layer 132). Compared to the method of contacting only the surface, in this embodiment, the conductive material contacts the hole wall of the second conductive layer 132, resulting in a larger contact area, which is beneficial for reducing contact resistance and improving the stability and long-term reliability of signal transmission.

[0034] In some optional embodiments, in order to ensure the reliability of the electrical connection between the second conductive layer 132 and the first conductive via 21, the distance from the first conductive via 21 to the edge of the pattern of the second conductive layer 132 in the orthographic projection of the first insulating substrate 11 is greater than or equal to 5 μm.

[0035] In some alternative implementations, Figure 2 This illustration shows a schematic diagram of a display module structure that connects the driving circuit structure and the light-emitting functional layer through a first conductive via, according to an embodiment of this application. Figure 2 As shown, the light-emitting functional layer 13 further includes at least one organic insulating layer, which is located between the at least one first conductive layer 131 and the second insulating substrate 12. The first conductive via 21 sequentially penetrates the first insulating substrate 11, the second insulating substrate 12, and the at least one organic insulating layer, and forms an electrical connection with the at least one first conductive layer 131. Compared to Figure 1 In the illustrated embodiment, signal transfer requires a second conductive layer 132. In this embodiment, the insulating layer between the first conductive layer 131 and the second insulating substrate 12 is an organic material layer. A first conductive via 21 penetrating the first insulating substrate 11, the second insulating substrate 12, and the organic insulating layer can be directly formed through a single drilling and filling process. This eliminates the need for an additional second conductive layer 132 and a second conductive via 22, thus achieving direct electrical connection between the driving circuit structure and the light-emitting functional layer 13. This arrangement ensures a short signal transmission path and low loss while simplifying the film structure and fabrication process, which helps reduce manufacturing costs and improve production efficiency.

[0036] It is easy to understand that, Figure 10 This paper presents a top view schematic diagram of a structure connecting a driving circuit and a light-emitting functional layer via a first conductive via, as proposed in an embodiment of this application. Figure 10As shown, since the first conductive via 21 needs to penetrate at least a portion of the film layer (e.g., an organic insulating layer) of the light-emitting functional layer 13 to be electrically connected to the first conductive layer 131, in order to avoid damage to the light-emitting area (i.e., the sub-pixel area) of the light-emitting functional layer 13 or adverse effects on the light emission uniformity during drilling and filling, the orthographic projection of the first conductive via 21 on the first insulating substrate 11 is located within the non-display area BB (see...). Figure 10 This configuration ensures that the fabrication process of the first conductive via 21 will not affect the normal light emission of the display area, which is beneficial to ensuring the display quality and yield of the display panel.

[0037] In some optional embodiments, the display panel further includes a buffer layer 14 disposed between the first insulating substrate 11 and the second insulating substrate 12. To reduce manufacturing complexity, the orthographic projection of the buffer layer 14 onto the first insulating substrate 11 does not overlap with the first conductive via 21.

[0038] In some alternative embodiments, the carrier substrate 31 can be a standalone flexible chip-on-film (COF). The driver chip 314 is pre-bonded to the flexible film, and then the flexible film is attached to the side of the first insulating substrate 11 opposite to the light-emitting functional layer 13, and electrically connected to the first conductive via 21 through anisotropic conductive adhesive (ACF) or conductive paste. This embodiment can use standardized COF components, the process is mature, and it helps to reduce manufacturing costs.

[0039] In other alternative implementations, such as Figure 3 As shown, the carrier substrate 31 can also be a structure derived from the display panel, meaning that the carrier substrate 31 and the display panel have the same stacked structure in the non-display area. Specifically, the carrier substrate 31 includes at least a third insulating substrate 311, a fourth insulating substrate 312, and a third conductive layer 313 stacked sequentially, wherein the conductive material of the first conductive via 21 directly contacts the third conductive layer 313 to form an electrical connection. The carrier substrate 31 includes a bonding area A1, in which the third conductive layer 313 is disposed away from the first insulating substrate 311 relative to the fourth insulating substrate 312, and the driving chip 314 and the flexible circuit board 315 are bonded to the third conductive layer 313. Through the above arrangement, the driving signal generated by the driving chip 314 is transmitted sequentially through the third conductive layer 313 and the conductive material of the first conductive via 21 to the first conductive layer 131, realizing signal transmission between the driving circuit structure and the light-emitting functional layer 13.

[0040] Compared to solutions using a separate COF as the carrier substrate, in this embodiment, the carrier substrate 31 and the display panel have the same laminated structure and material system (e.g., both use polyimide substrates and the same conductive layer material). After being bonded to the back of the display panel, their coefficients of thermal expansion are essentially the same. Therefore, during the operation of the display module, even if the temperature changes, no significant thermal mismatch stress will be generated between the carrier substrate 31 and the display panel. This effectively avoids problems such as film peeling, via connection cracking, or poor contact caused by differences in thermal expansion and contraction, significantly improving the pass rate of the display module in reliability tests such as thermal shock and its long-term stability. In addition, since the two have the same laminated structure and material, they have similar flexibility moduli at the bonding interface. When the display module is bent or subjected to external impact, the carrier substrate 31 and the display panel can deform together, further improving the mechanical reliability of the overall structure. This is especially suitable for flexible display modules or display products that need to withstand a certain degree of deformation.

[0041] In some alternative implementations, such as Figure 3 As shown, the display module further includes an adhesive layer 41, which is disposed between the third insulating substrate 311 and the first insulating substrate 11, for fixing the carrier substrate 31 to the back side of the display panel. Optionally, the adhesive layer 41 can be a non-conductive adhesive film (NCF). Compared with anisotropic conductive adhesive (ACF), NCF does not contain conductive particles, eliminating the need for precise control of conductive particle capture and compression during the lamination process. This also avoids the potential risk of short circuits between adjacent conductive lines, thus improving the yield of the bonding process and product reliability. Bonding the carrier substrate 31 to the display panel using NCF ensures a stable connection between the two while effectively reducing resistance fluctuations at the bonding interface, further guaranteeing the stability of the drive signal transmission from the third conductive layer 313 to the first conductive layer 131 via the first conductive via 21.

[0042] In some alternative implementations, Figure 4 This application provides a schematic diagram of a display module structure with a bent area on a substrate, as shown in an embodiment of the present application. Figure 4As shown, the carrier substrate 31 further includes a bending region A2 located on at least one side of the bonding region A1. Within the bending region A2, the carrier substrate 31 bends towards the side closer to the display panel, causing the third conductive layer 313 to form face-to-face contact with the first conductive via 21 and achieve electrical connection. The orthographic projection of the bending region A2 onto the first insulating substrate 11 at least partially overlaps with the display area. In other words, the bending region A2 is located within the orthographic projection range of the display area onto the first insulating substrate 11, rather than within the non-display area (i.e., the bezel area). Through this arrangement, the bending region A2 of the carrier substrate 31 occupies the space below the display area without additionally occupying the bezel area of ​​the display panel on the light-emitting surface, thus not increasing the bezel width of the display module.

[0043] In this embodiment, the bending area A2 is located below the display area, making full use of the space in the thickness direction of the display panel and eliminating the constraint of the bending radius on the bezel size. This facilitates the realization of ultra-narrow bezels or even bezel-less full-screen designs. Simultaneously, the bending of the carrier substrate 31 allows the third conductive layer 313 to form face-to-face contact with the first conductive via 21, resulting in a large contact area and high alignment tolerance. This helps reduce contact resistance, improves signal transmission reliability, and enhances the long-term stability of the display module. Specifically, within the bending area A2, the end of the carrier substrate 31 furthest from the bonding area A1 is bent towards the side closer to the display panel to form a bending portion. The third conductive layer 313 of the bending portion, near the first insulating substrate 11, forms an electrical connection with the conductive material of the first conductive via 21.

[0044] Optionally, since the third conductive layer 313 and the first conductive via 21 within the bending area A2 are positioned face-to-face, i.e., perpendicular to each other, they can be directly connected without long-distance traces or additional transition structures. Therefore, the third conductive layer 313 can be bonded to the conductive material within the first conductive via 21 using a low-temperature, low-pressure ACF (anisotropic conductive adhesive) bonding process. This process achieves reliable electrical connection without requiring high-temperature and high-pressure conditions, avoiding thermal damage to the flexible substrate, organic light-emitting materials, and organic insulating layers in the display panel caused by high temperatures. Simultaneously, low-pressure bonding helps reduce physical impact on the film structure, further improving the process yield and structural integrity of the display module.

[0045] In some alternative embodiments, the bending radius of the bent portion is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.

[0046] In some alternative implementations, Figure 8This illustration shows a schematic diagram of a display module structure comprising a driving circuit structure for a second conductive layer connecting a carrier substrate with a bending region and a light-emitting functional layer, as proposed in an embodiment of this application. Figure 8 As shown, when the display panel is provided with the second conductive layer 132, the driving circuit structure includes a carrier substrate 31 with a bending region A2. The second conductive layer 132 is electrically connected to the light-emitting functional layer 13 (through the second conductive via 22) and the bending region A2 of the carrier substrate 31 (through the first conductive via 21), thereby realizing the vertical interconnection between the driving circuit structure and the light-emitting functional layer 13.

[0047] In some alternative embodiments, the carrier substrate 31, which is derived from the display panel, can be a structure cut from the non-display area of ​​the display panel. Figure 5 This illustration shows a schematic diagram of a carrier substrate structure formed from a display panel according to an embodiment of this application. Figure 11 This application illustrates a top view schematic diagram of a carrier substrate structure formed on a display panel according to an embodiment of the present application, as shown below. Figure 5 and Figure 11 As shown, before cutting, the carrier substrate 31 is part of the display panel located in the non-display area; that is, the carrier substrate 31 and the display panel are an integral structure and have not yet been physically separated. At this time, the first insulating substrate 11 and the third insulating substrate 311 are of the same layer (i.e., they are formed from the same material layer and are connected to each other as one unit before cutting), the second insulating substrate 12 and the fourth insulating substrate 312 are of the same layer, and the third conductive layer 313 and one of the conductive layers of the light-emitting functional layer 13 (e.g., at least one first conductive layer 131 or a second conductive layer 132) are of the same layer. In other words, the stacked structure of the carrier substrate 31 is actually an extension of the stacked structure of the display panel in the non-display area, and the two have the same film layer stack and material composition before cutting.

[0048] Through the aforementioned same-layer arrangement, the substrate 31 and the display panel are an integral structure before cutting. There are no dissimilar materials or additional adhesive layers at their interface, ensuring structural integrity and process consistency before cutting. See also... Figure 11The conductive material filling the first conductive via 21 includes a first conductive structure 211 and a second conductive structure 212. Before cutting, the first conductive structure 211 and the second conductive structure 212 located in the non-display area BB can only be connected by the cutting metal line 51. By cutting the cutting metal line 51, the carrier substrate 31 and the display panel are separated. When the carrier substrate 31 is cut and separated from the display panel and then attached to the back side of the display panel, the first conductive structure 211 fills the first conductive via 21 of the display panel to form an electrical connection with the first conductive layer 131 of the display panel, and the second conductive structure 132 forms an electrical connection with the third conductive layer 313 of the carrier substrate (e.g., ...). Figure 3 (As shown). In this embodiment, the carrier substrate 31 and the display panel are perfectly matched in material and structure, which is beneficial for achieving high-precision alignment and bonding and reliable electrical connection, while further ensuring a high degree of consistency between the two in terms of thermal expansion behavior and flexible modulus. In addition, the same-layer cutting method can make full use of the non-display area material in the existing display panel process, eliminating the need to separately prepare the carrier substrate 31, simplifying the production process and reducing material costs.

[0049] In some alternative implementations, Figure 6 This illustration shows a schematic diagram of the hierarchical structure of a light-emitting functional layer within a display area according to an embodiment of this application. Figure 6 This example illustrates the structure of a sub-pixel in the display area. In this example, multiple transistors in the pixel circuit are of the same type; for example, all transistors in the pixel circuit can be low-temperature polycrystalline silicon (LTPS) thin-film transistors (LTPS) or all can be oxide (OPS) thin-film transistors (OSTs). In other examples, the multiple transistors in the pixel circuit can be both LTPS and OPS. Furthermore, this example illustrates a display panel integrating a mutual capacitance touch structure to form an FMLOC structure.

[0050] In some alternative implementations, such as Figure 6 As shown, the light-emitting functional layer 13 includes a plurality of sub-pixels in the display area. At least one of the plurality of sub-pixels includes a thin-film transistor 42, a pixel capacitor, a first transfer electrode 424, a second transfer electrode 425, and a light-emitting element. The first transfer electrode 424, the second transfer electrode 425, and the light-emitting element are located sequentially on the side of the thin-film transistor 42 away from the substrate 11. The light-emitting element is electrically connected to the thin-film transistor 42 through the second transfer electrode 245 and the first transfer electrode 424.

[0051] In some examples, Figure 6The illustration uses an example where each sub-pixel includes a thin-film transistor 42 and a pixel capacitor. In some examples, the circuit structure of the light-emitting functional layer in the display area may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer disposed on the second insulating substrate 12. The multiple display area metal layers of the display structure layer in this example may include: a first gate metal layer, a second gate metal layer, a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer. A first gate insulating layer 101 may be disposed between the semiconductor layer and the first gate metal layer; a second gate insulating layer 102 may be disposed between the first and second gate metal layers; an interlayer insulating layer 103 may be disposed between the second gate metal layer and the first source / drain metal layer; a passivation layer 104 and a first planarization layer 105 may be disposed between the first and second source / drain metal layers; a second planarization layer 106 may be disposed between the second and third source / drain metal layers; and a third planarization layer 107 may be disposed on the side of the third source / drain metal layer away from the second insulating substrate 12. The first gate insulating layer 101, the second insulating layer 102, the interlayer insulating layer 103, and the passivation layer 104 may be inorganic insulating layers, while the first planarization layer 105 and the second planarization layer 106 may be organic insulating layers. However, this embodiment is not limited to these. In other examples, a buffer layer may also be disposed on the side of the semiconductor layer near the substrate. The buffer layer can prevent harmful substances in the substrate from penetrating the interior of the display panel and can also increase the adhesion of the film layers in the display panel to the substrate. In other examples, a bottom shielding metal layer (BSM) can be disposed on the side of the buffer layer near the substrate. This BSM can be configured to at least partially cover the active layer of the thin-film transistor in the pixel circuitry to prevent external light from affecting the performance of the thin-film transistor. In other examples, a passivation layer can be omitted between the first and second source / drain metal layers, and only a first planarization layer can be disposed between them.

[0052] In some alternative implementations, such as Figure 6As shown, the semiconductor layer of the display area may include at least: an active layer 421 of the thin-film transistor 42, wherein the active layer 421 may include: a first region 4211, a second region 4212, and a channel region 4213 located between the first region 4211 and the second region 4212. The first gate metal layer may include at least: a first gate layer 422 of the thin-film transistor 42, and a first electrode 201 of the pixel capacitor. The orthographic projection of the first gate layer 422 of the thin-film transistor 42 onto the second insulating substrate 12 may cover the orthographic projection of the channel region 4213 of the active layer 421 onto the second insulating substrate 12. The second gate metal layer may include at least: a second electrode 202 of the pixel capacitor. The orthographic projections of the second electrode 202 and the first electrode 201 of the pixel capacitor onto the second insulating substrate 12 may at least partially overlap, for example, they may coincide. The first source-drain metal layer may include at least: a first source 4231 and a first drain 4232 of the thin-film transistor 42. The interlayer insulating layer 103 may have multiple vias (e.g., including a first pixel via and a second pixel via) in the display area. The interlayer insulating layer 103, the second gate insulating layer 102, and the first gate insulating layer 101 within the first pixel via can be removed, exposing at least a portion of the surface of the first region 4211 of the active layer 421. The interlayer insulating layer 103, the second gate insulating layer 102, and the first gate insulating layer 101 within the second pixel via can be removed, exposing at least a portion of the surface of the second region 4212 of the active layer 421. The first source 4231 of the thin-film transistor 42 can be electrically connected to the first region 4211 of the active layer 421 through the first pixel via, and the first drain 4232 can be electrically connected to the second region 4212 of the active layer 421 through the second pixel via. The second source / drain metal layer may include at least a first transition electrode 424. The first transition electrode 424 can be electrically connected to the first drain 4232 of the thin-film transistor 42 of the pixel circuit through a third pixel via formed by the passivation layer 104 and the first planarization layer 105. The third source-drain metal layer may include at least a second transition electrode 425. The second transition electrode 425 can be electrically connected to the first transition electrode 424 located in the second source-drain metal layer through a fourth pixel via formed by the second planarization layer 106. The second transition electrode 231 can be electrically connected to the first electrode 301 (e.g., anode) of the light-emitting element through a fifth pixel via formed by the third planarization layer 107. In this example, the electrical connection between the pixel circuit and the light-emitting element can be achieved through the first transition electrode 424 and the second transition electrode 425.

[0053] In some alternative implementations, the gate lines of the display area may be located, for example, in the first gate metal layer; the data lines 31 of the display area may be located, for example, in the second or third source-drain metal layer; and the high-potential power lines of the display area may be located, for example, in at least one of the second and third source-drain metal layers. This embodiment is not limited in this respect. The circuit structure layer of this example may include three source-drain metal layers, which can avoid arranging too many traces in a single source-drain metal layer, thereby facilitating the realization of a narrow bezel structure.

[0054] In some alternative implementations, such as Figure 6 As shown, the sub-pixel may further include a pixel definition layer 304 and multiple light-emitting elements. For example, each light-emitting element may include a stacked first electrode 301, an organic light-emitting layer 302, and a second electrode 303. The first electrode 301 of the light-emitting element can be an anode, and the first electrode 301 can be disposed on the third planarization layer 107 and electrically connected to the second transition electrode 425 through a fifth pixel via formed in the third planarization layer 107. The pixel definition layer 304 is disposed on the first electrode 301 and the third planarization layer 107, and the pixel definition layer 304 may have multiple pixel openings, one pixel opening exposing at least a portion of the surface of a corresponding first electrode 301. At least a portion of the organic light-emitting layer 302 can be disposed within a pixel opening and connected to the corresponding first electrode 301. The second electrode 303 can be disposed on the organic light-emitting layer 302 and connected to the organic light-emitting layer 302. The organic light-emitting layer 302 can emit light of a corresponding color under the drive of the first electrode 301 and the second electrode 303. An isolation pillar layer can also be provided on the side of the pixel definition layer 304 away from the substrate 10. The isolation pillar layer may include multiple isolation pillars (PS).

[0055] In some optional embodiments, the organic light-emitting layer 302 of the light-emitting element may include an emitting layer (EML) and one or more films selected from the following: a hole injection layer (HIL), a hole transport layer (HTL), a hole block layer (HBL), an electron block layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first electrode 301 and the second electrode 303, the light-emitting characteristics of the organic material can be utilized to emit light at the required grayscale.

[0056] In some examples, the light-emitting layers of different colored light-emitting elements can be different. For example, a red light-emitting element includes a red light-emitting layer, a green light-emitting element includes a green light-emitting layer, and a blue light-emitting element includes a blue light-emitting layer. To reduce process complexity and improve yield, the hole injection layer and hole transport layer on one side of the light-emitting layer can be common layers, as can the electron injection layer and electron transport layer on the other side. In some examples, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer can be fabricated in a single process (single vapor deposition process or single inkjet printing process), and isolation can be achieved through surface steps of the formed film layers or through surface treatment. For example, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer corresponding to adjacent sub-pixels can be isolated. In some examples, the organic light-emitting layer can be formed by vapor deposition using a fine metal mask (FMM) or an open mask, or by inkjet printing.

[0057] In some alternative implementations, such as Figure 6 As shown, the sub-pixel may further include a first encapsulation layer 401, a second encapsulation layer 402, and a third encapsulation layer 403 stacked together. The first encapsulation layer 401 and the third encapsulation layer 403 may be made of inorganic materials, while the second encapsulation layer 402 may be made of organic materials. The second encapsulation layer 402 may be disposed between the first encapsulation layer 401 and the third encapsulation layer 403 to prevent external moisture from entering the light-emitting element. However, this embodiment is not limited to this. For example, the encapsulation structure layer may adopt a five-layer stacked structure of inorganic / organic / inorganic / organic / inorganic.

[0058] In some alternative implementations, such as Figure 6 As shown, at least one of the plurality of sub-pixels further includes a touch structure layer located on the side of the light-emitting element away from the second insulating substrate 12. The touch structure layer includes a first touch insulating layer 501, a first touch electrode 503, a second touch insulating layer 502 and a second touch electrode 504 stacked sequentially. The first touch insulating layer 501 is disposed close to the light-emitting element.

[0059] In some alternative implementations, such as Figure 6As shown, the sub-pixel further includes a color filter layer, which is disposed on the side of the touch structure layer away from the substrate 11. The color filter layer includes: a color filter layer 611, the orthographic projection of the color filter layer 611 on the second insulating substrate 12 at least partially overlapping the orthographic projection of the organic light-emitting layer 302 on the second insulating substrate 12; a light-shielding layer 610, which is co-layered with and surrounds the color filter layer 611; a first color filter insulating layer 601 and a second color filter insulating layer 602, which are disposed on opposite sides of the color filter layer 611, wherein the first color filter insulating layer 601 is disposed close to the touch structure layer.

[0060] In some optional embodiments, the at least one first conductive layer 131 may be disposed in the same layer as at least one of the following: a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer. In other words, the first conductive layer 131 may be part of an existing source / drain metal layer in the display panel, without the need to add an additional independent conductive layer, which helps to simplify the film structure and reduce the manufacturing process.

[0061] Optionally, to reduce the overlap resistance, there can be multiple first conductive layers 131, and the multiple first conductive vias 21 are connected in parallel with multiple different first conductive layers 131. Specifically, one end of each of the multiple first conductive vias 21 is electrically connected to the corresponding first conductive layer 131, and the other end of each is electrically connected to the driving circuit structure, thereby forming multiple parallel signal transmission paths. Through the above parallel arrangement, multiple first conductive vias 21 simultaneously undertake signal transmission tasks, effectively reducing the total resistance on the signal transmission path, which is beneficial to reducing signal transmission loss and heat generation, and improving the working stability and reliability of the display module under high current drive. At the same time, the multiple first conductive vias 21 form a redundant connection structure. Even if individual first conductive vias 21 experience poor contact due to process fluctuations or long-term use, the remaining first conductive vias 21 can still maintain signal transmission, further improving the reliability and service life of the display module.

[0062] This application provides a display module and a display device. The display module includes: a display panel, the display panel including a display area and a non-display area on at least one side of the display area, the display panel including: a first insulating substrate, a second insulating substrate and a light-emitting functional layer stacked sequentially; a driving circuit structure, the driving circuit structure being disposed on the side of the first insulating substrate opposite to the light-emitting functional layer, the orthographic projection of the driving circuit structure on the first insulating substrate at least partially overlapping the display area; a first conductive via, the first conductive via at least penetrating the first insulating substrate, the first conductive via being filled with a conductive material, one end of the first conductive via being connected to at least one first conductive layer of the light-emitting functional layer, and the other end being electrically connected to the driving circuit structure.

[0063] In the display module provided in this application, the driving circuit structure is disposed on the side of the first insulating substrate away from the light-emitting functional layer, and its orthographic projection at least partially overlaps with the display area. It is directly electrically connected to the first conductive layer of the light-emitting functional layer through a first conductive via penetrating the first insulating substrate. This arrangement avoids the need for bending and bonding processes in the non-display area, eliminates the limitation of the bending radius on the bezel width, effectively reduces the bottom bezel width, and achieves a higher screen-to-body ratio. Simultaneously, the vertical interconnection of the conductive vias shortens the signal transmission path and improves the electrical performance of the display module.

[0064] Based on the same inventive concept, this application discloses a display device, which includes a display module as described in the embodiments of this application.

[0065] In this embodiment, the display device is a product with image display functionality. Optionally, the display device can be used to display static images, such as pictures and photographs; the display device can also be used to display dynamic images, such as videos and game screens.

[0066] In some alternative implementations, the display device includes, but is not limited to, laptops, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, car displays, navigators, cockpit controllers and / or displays, displays of camera views, electronic photographs, electronic billboards or signs, projectors, packaging and aesthetic structures, etc.

[0067] It should be noted that, in addition to the display module, the display device also includes other necessary components and parts. Taking a monitor as an example, the display device may also include a housing, circuit board, power cord, etc. Those skilled in the art can make corresponding additions according to the specific usage requirements of the display device, which will not be elaborated here.

[0068] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0069] In the description of this specification, it should be understood that the terms "center," "thickness," "upper," "lower," "front," "rear," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0070] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0071] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0072] The foregoing application provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0073] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this disclosure. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0074] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this disclosure may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0075] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0076] The above provides a detailed description of a display module and display device provided by this disclosure. Specific examples have been used to illustrate the principles and implementation methods of this disclosure. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this disclosure. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this disclosure. Therefore, the content of this specification should not be construed as a limitation of this disclosure.

Claims

1. A display module, characterized in that, The display module includes: The display panel includes a display area and a non-display area on at least one side of the display area. The display panel includes: a first insulating substrate, a second insulating substrate, and a light-emitting functional layer stacked sequentially. A driving circuit structure is disposed on the side of the first insulating substrate away from the light-emitting functional layer, and the orthographic projection of the driving circuit structure on the first insulating substrate at least partially overlaps with the display area. The first conductive via penetrates at least the first insulating substrate and is filled with a conductive material. One end of the first conductive via is connected to at least one first conductive layer of the light-emitting functional layer, and the other end is electrically connected to the driving circuit structure.

2. The display module according to claim 1, characterized in that, The light-emitting functional layer further includes at least one organic insulating layer located between the at least one first conductive layer and the second insulating substrate; The first conductive via penetrates the first insulating substrate, the second insulating substrate, and the at least one organic insulating layer, and forms an electrical connection with the at least one first conductive layer.

3. The display module according to claim 2, characterized in that, The orthographic projection of the first conductive via on the first insulating substrate is located within the non-display area.

4. The display module according to claim 2, characterized in that, The light-emitting functional layer includes a first source / drain metal layer, a second source / drain metal layer and a third source / drain metal layer stacked sequentially, with the first source / drain metal layer disposed close to the first insulating substrate. The at least one first conductive layer is disposed in the same layer as at least one of the following: a first source / drain metal layer, a second source / drain metal layer, and a third source / drain metal layer.

5. The display module according to claim 1, characterized in that, The display panel further includes a second conductive layer, which is disposed between the first insulating substrate and the second insulating substrate, and the second conductive layer is electrically connected to the at least one first conductive layer through a second conductive via. The orthographic projection of the second conductive layer on the first insulating substrate covers the orthographic projection of the first conductive via on the first insulating substrate. The first conductive via at least penetrates the first insulating substrate and forms an electrical connection with the second conductive layer.

6. The display module according to claim 5, characterized in that, In the orthographic projection on the first insulating substrate, the second conductive via is located within the non-display area and does not overlap with the first conductive via.

7. The display module according to claim 5, characterized in that, The first conductive via penetrates the first insulating substrate and the second conductive layer, and the first conductive via also includes a groove extending into the second insulating substrate. The conductive material fills the groove and is electrically connected to the second conductive layer through the hole wall of the second conductive layer.

8. The display module according to claim 1, characterized in that, The driving circuit structure includes a carrier substrate and a driving chip. The carrier substrate has the same stacking structure as the display panel in the non-display area. The carrier substrate includes at least a third insulating substrate, a fourth insulating substrate, and a third conductive layer stacked in sequence, wherein the conductive material of the first conductive via is in direct contact with the third conductive layer to form an electrical connection. The carrier substrate includes a bonding area, in which the third conductive layer is disposed away from the first insulating substrate relative to the fourth insulating substrate, and the driving chip is bonded to the third conductive layer.

9. The display module according to claim 8, characterized in that, The carrier substrate further includes a bending region located on at least one side of the bonding region, and the orthographic projection of the bending region on the first insulating substrate at least partially overlaps with the display region; Within the bending area, the end of the carrier substrate away from the bonding area is bent toward the side closer to the display panel to form a bending portion, and the third conductive layer of the bending portion is electrically connected to the conductive material of the first conductive via on the side closer to the first insulating substrate.

10. A display device, characterized in that, The display device includes the display module as described in any one of claims 1-9.

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