Display panel and display device

Abstract

A display panel and a display device are provided. The display panel comprises: a substrate (1); a plurality of light emitting devices (2) located on one side of the substrate (1); each of the plurality of light emitting devices (2) comprises: a first electrode (201); the first electrode (201) comprises: a reflecting part (2011), and a covering part (2012) located on the side of the reflecting part (2011) away from the substrate (1); the covering part (2012) covers the front surface and the side surface of the side of the reflecting part (2011) away from the substrate (1); the covering part (2012) comprises: a first structure layer (20121), and a second structure layer (20122) located between the first structure layer (20121) and the reflecting part (2011); the thickness of the covering part covering the front surface of the reflecting part is less than the thickness of the reflecting part.

Description

[0001] This application is a divisional application. The original application has the application number 202280004768.9 and the original application date is November 30, 2022. The original application is entitled "Display Panel and Method for Manufacturing the Same Thereof, Display Device". The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of display technology, and more particularly to display panels and display devices. Background Technology

[0003] Organic Light Emitting Diode (OLED) microdisplays, as one type of OLED technology, have a basic structure of: a first electrode + an emissive layer + a second electrode. The first electrode provides holes, and the second electrode provides electrons. Holes and electrons combine in the emissive layer to form excitons, which then excite the emissive layer to emit light. For top-emitting OLED displays, a reflective sublayer is required for the first electrode. This reflective sublayer typically includes an aluminum layer. In traditional first electrode structures, after the first electrode pattern is fabricated, the sides of the reflective sublayer are exposed, making it prone to aluminum layer migration, bulging, and corrosion defects. This affects the injection efficiency of the first electrode, the OLED's luminous efficacy, and increases power consumption. Even large particles can directly cause short circuits between the second and first electrodes, resulting in a high incidence of dot-line defects. Summary of the Invention

[0004] This disclosure provides a display panel, which includes: Substrate; Multiple light-emitting devices are located on one side of a substrate. Each of the multiple light-emitting devices includes a first electrode. The first electrode includes a reflective portion and a covering portion located on the side of the reflective portion away from the substrate. The covering portion covers the front and side surfaces of the reflective portion on the side away from the substrate. The covering portion includes a first structural layer and a second structural layer located between the first structural layer and the reflective portion. The thickness of the covering portion covering the front surface of the reflective portion is less than the thickness of the reflective portion.

[0005] In some embodiments, the reflective portion includes: a third structural layer, a reflective sub-layer, and a fourth structural layer stacked on one side of a substrate; the thickness of the first reflective sub-layer is greater than the thickness of the third structural layer and the thickness of the fourth structural layer, respectively.

[0006] In some embodiments, the second structural layer covers the surface and side of the reflective sublayer facing away from the substrate, as well as the side of the fourth structural layer; The orthographic projection of the reflective sublayer onto the substrate lies within the orthographic projection of the third structural layer onto the substrate.

[0007] In some embodiments, the display panel further includes: a planarization layer located between the substrate and the light-emitting device; a first electrode located on the side of the planarization layer away from the substrate; and a cover portion including a first planarization area in contact with the planarization layer.

[0008] In some embodiments, the reflective portion includes a third structural layer; the planarization layer includes a first region; the orthographic projection of the first region onto the substrate is located between the orthographic projections of adjacent third structural layers onto the substrate. The first region includes: a first surface facing away from the substrate, and a first side surface; the remaining region of the planarization layer outside the first region includes a second surface facing away from the substrate; the first side surface connects the first surface and the second surface. The distance between the first surface and the substrate is smaller than the distance between the second surface and the substrate. The first flat region is projected onto the substrate in the orthographic projection of the first region onto the substrate.

[0009] In some embodiments, the reflective portion further includes a fourth structural layer and a first cover layer located on the fourth structural layer away from the reflective sublayer; The distance between the first surface and the second surface is greater than the thickness of the first covering layer of the covering portion.

[0010] In some embodiments, the distance between the first surface and the second surface is less than the thickness of the reflective portion.

[0011] In some embodiments, the included angle between the first side and the first surface is greater than 90 degrees. .

[0012] In some embodiments, the display panel further includes a plurality of partition structures; the partition structures overlap in the region between the orthographic projection of the substrate and the orthographic projection of the adjacent first electrode on the substrate.

[0013] In some embodiments, the partition structure includes a first partition groove structure; the first partition groove structure is located in a first region; The first partition groove structure is located between the orthographic projections of the adjacent first electrode on the substrate.

[0014] In some embodiments, in the direction perpendicular to the substrate, the depth of the first partition groove structure is greater than the distance between the first surface and the second surface.

[0015] In some embodiments, the display panel further includes a pixel definition layer; the pixel definition layer includes an opening area corresponding to a light-emitting device, the orthographic projection of the opening area onto the substrate falls within the orthographic projection of the first electrode onto the substrate; the pixel definition layer covers the edge of the first electrode. The maximum thickness of the pixel definition layer is less than the maximum thickness of the first electrode.

[0016] In some embodiments, the partition structure includes a second partition groove structure; The display panel also includes a pixel definition layer; the pixel definition layer includes a second partition groove structure; the orthographic projection of the second partition groove structure onto the substrate is located between the orthographic projections of the adjacent first electrode onto the substrate. The pixel definition layer also includes an opening area that corresponds to a light-emitting device, and the orthographic projection of the opening area onto the substrate falls within the orthographic projection of the first electrode onto the substrate.

[0017] In some embodiments, the maximum thickness of the pixel definition layer is greater than the maximum thickness of the first electrode.

[0018] In some embodiments, the pixel definition layer includes: a first pixel definition sublayer, a second pixel definition sublayer, and a third pixel definition sublayer stacked in a direction perpendicular to the substrate. The maximum thickness of the first pixel-defined sub-layer is greater than the maximum thickness of the second pixel-defined sub-layer, and the maximum thickness of the second pixel-defined sub-layer is greater than the maximum thickness of the third pixel-defined sub-layer. The maximum thickness of the first pixel-defined sublayer is greater than the maximum thickness of the first electrode; The depth of the second partition groove structure is greater than the total thickness of the third pixel definition sub-layer and the second pixel definition sub-layer, but less than the maximum thickness of the pixel definition layer. The third pixel definition sublayer includes a first opening region, and the second pixel definition sublayer includes a second opening region; the orthographic projection of the first opening region onto the substrate falls within the orthographic projection of the second opening region onto the substrate.

[0019] In some embodiments, the orthographic projection of the first structural layer onto the substrate covers the orthographic projection of the second structural layer onto the substrate.

[0020] In some embodiments, the first structural layer includes: a first sub-layer covering the reflective portion, and a second sub-layer located on the side of the first sub-layer facing away from the reflective portion; the thickness of the second sub-layer is greater than the thickness of the first sub-layer.

[0021] In some embodiments, the angle between the side surface of the reflective portion and the plane of the substrate is greater than 0°. And less than or equal to 70 .

[0022] In some embodiments, the first structural layer is a metal oxide, and the reflective portion includes a metallic material.

[0023] This disclosure provides a display device, which includes a display panel provided in this disclosure. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present disclosure; Figure 2 This is a schematic diagram of another display panel structure provided in an embodiment of the present disclosure; Figure 3 A graph showing the test results of the reflectivity of a display panel provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 5 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 6 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 7 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 8 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 9 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 10 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 11 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure; Figure 12 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure; Figure 13 A schematic flowchart illustrating another method for manufacturing a display panel according to an embodiment of this disclosure; Figure 14 A schematic flowchart illustrating another method for manufacturing a display panel according to an embodiment of this disclosure; Figure 15 A schematic flowchart illustrating another method for manufacturing a display panel according to an embodiment of this disclosure; Figure 16 This is a schematic diagram of the structure formed by over-etching the reflective portion in a method for manufacturing a display panel according to an embodiment of this disclosure. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0027] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0028] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0029] In related technologies, for top-emitting OLED displays, the first electrode includes a reflective sublayer and a hole transport sublayer located on the reflective sublayer. The reflective sublayer typically includes an aluminum layer. Traditional first electrode fabrication processes usually employ a single etching process, where the first electrode pattern is formed after the deposition of each film layer. After the first electrode pattern is created, the sides of the reflective sublayer are exposed, easily leading to defects such as aluminum layer migration, bulging, and corrosion loss. One solution to avoid aluminum layer migration, bulging, or corrosion loss is to cover the sides of the aluminum layer with a hole transport sublayer. However, the hole transport sublayer is typically indium tin oxide (Intin oxide), which directly contacts the aluminum layer on the sides. This causes oxygen diffusion at the interface, forming an aluminum oxide insulating layer, significantly affecting ohmic properties and resulting in a severe degradation of OLED device performance.

[0030] This disclosure provides a display panel, such as... Figure 1 As shown, the display panel includes: Substrate 1; Multiple light-emitting devices 2 are located on one side of the substrate 1; each light-emitting device 2 includes: a first electrode 201; as shown in the figure Figure 1As shown, the first electrode 201 includes a reflective portion 2011 and a covering portion 2012 located on the side of the reflective portion 2011 away from the substrate 1. The covering portion 2012 covers the front side a and the side side e of the reflective portion 2011 away from the substrate 1. The covering portion 2012 includes a first structural layer 20121 and a second structural layer 20122 located between the first structural layer 20121 and the reflective portion 2011. The second structural layer 20122 is used to prevent the reflective portion 2011 from contacting the first structural layer 20121.

[0031] The display panel provided in this embodiment includes a first electrode with a cover portion covering the side of the reflective portion. This prevents migration bulging or corrosion defects on the side of the reflective portion, improves the flatness of the front and side surfaces of the first electrode, increases the injection efficiency of the first electrode, improves the luminous efficiency of the light-emitting device, and thus reduces the power consumption of the display panel. Furthermore, since the cover portion includes a second structural layer located between the first structural layer and the reflective portion, it prevents the reflective portion from contacting the first structural layer. Typically, the first structural layer is a metal oxide, and the reflective portion is made of a metallic material. Contact between the two forms an oxide insulating layer. The second structural layer prevents the reflective portion from contacting the first structural layer, thus preventing the formation of an oxide insulating layer between the reflective portion and the first structural layer, thereby avoiding impact on the ohmic characteristics of the first electrode and the performance of the light-emitting device.

[0032] In some embodiments, such as Figure 2 As shown, the light-emitting device 2 further includes: a light-emitting functional layer 202 located on the side of the first electrode 201 away from the substrate 1, and a second electrode 203 located on the side of the light-emitting functional layer away from the first electrode 201.

[0033] In practice, the second electrode includes a transparent electrode.

[0034] In a specific implementation, the first electrode is, for example, the anode of the light-emitting device, and the second electrode is, for example, the cathode of the light-emitting device.

[0035] It should be noted that in the display panel provided in this embodiment, the first electrode of the light-emitting device includes a first structural layer providing holes and a reflective portion, and the second electrode is a transparent electrode, i.e., the light-emitting device is a top-emitting light-emitting device. The light emitted by the light-emitting functional layer is reflected by the reflective portion and then emitted from the second electrode.

[0036] In some embodiments, such as Figure 1 As shown, the reflective part 2011 includes: a third structural layer 20111, a reflective sub-layer 20112, and a fourth structural layer 20113 stacked together.

[0037] It should be noted that, in specific implementation, a third and fourth structural layer are provided to protect the reflective sublayer. The fourth structural layer, in particular, is crucial because the cover layer needs to cover the sides of the reflective portion. Therefore, the pattern of the reflective portion must be formed first, followed by the pattern of the cover layer. Typically, an etching process is used to form the pattern of the reflective portion. Since the etching process requires an etching solution, placing the fourth structural layer on the side of the reflective sublayer facing away from the substrate prevents the front side of the reflective sublayer from contacting the etching solution and causing damage.

[0038] In some embodiments, such as Figure 1 As shown, the cross-section of the reflective part 2011 perpendicular to the substrate 1 is an isosceles trapezoid.

[0039] In the display panel provided in this embodiment, the side of the reflective portion of the first electrode is an inclined plane with an angle greater than 0 with the plane of the substrate, which facilitates the covering portion to cover the side of the reflective portion to protect the side of the reflective portion and prevent migration bulging or corrosion loss from occurring on the side of the reflective portion.

[0040] In some embodiments, such as Figure 1 As shown, the angle c between the side surface of the reflective portion 2011 and the plane of the substrate 1 is greater than 0. And less than or equal to 70 .

[0041] In the display panel provided in this embodiment, the angle between the side surface of the reflective portion of the first electrode and the plane of the substrate is greater than 0°. And less than or equal to 70 This means that the included angle is relatively small, which is conducive to the continuous film formation of the covering part on the side of the reflective part, so as to protect the side of the reflective part and avoid migration bulging or corrosion loss on the side of the reflective part.

[0042] In some embodiments, the orthographic projection of the first structural layer onto the substrate covers the orthographic projection of the second structural layer onto the substrate.

[0043] In some embodiments, such as Figure 1 As shown, the orthographic projection of the first structural layer 20121 onto the substrate 1 coincides with the orthographic projection of the second structural layer 20122 onto the substrate 1.

[0044] In practical implementation, after forming the pattern of the reflective sublayer, the second structural layer and the first structural layer can be formed sequentially. Then, the first and second structural layers are patterned to form the pattern of the cover portion. In this cover portion pattern, the orthographic projection of the first structural layer onto the substrate coincides with the orthographic projection of the second structural layer onto the substrate. That is, the patterns of the first and second structural layers are formed in a single patterning process. This prevents the reflective portion from contacting the first structural layer, forming an oxide insulating layer, while avoiding additional steps in the fabrication of the first electrode, thus saving costs.

[0045] In some embodiments, the second structural layer comprises a refractory material.

[0046] The display panel provided in this embodiment includes a second structural layer comprising a refractory material, which makes it less likely for the second structural layer to react with the reflective part to form an insulating layer. This allows the second structural layer to block the reflective part from contacting the first structural layer to form an oxide insulating layer.

[0047] In some embodiments, the refractory material is, for example, a material with a melting point greater than 1650°C. Materials.

[0048] In some embodiments, the third and fourth structural layers also include layers with a melting point greater than 1650°C. Refractory materials.

[0049] The display panel provided in this embodiment of the disclosure also includes third and fourth structural layers with melting points greater than 1650°C. The refractory metal material allows the third and fourth structural layers to protect the reflector layer and prevent damage. In particular, the fourth structural layer includes materials with melting points greater than 1650°C. The refractory metal material can prevent the etching solution from contacting the reflector layer directly and damaging it.

[0050] In some embodiments, when the second structural layer, the third structural layer, and the fourth structural layer all comprise refractory metal materials, for example, the second structural layer, the third structural layer, and the fourth structural layer comprise one or a combination of the following materials: titanium (Ti), tungsten (W), molybdenum (Mo), cobalt (Co), chromium (Cr), platinum (Pt), titanium nitride (TiN), and titanium tungsten (TiW).

[0051] In some embodiments, the material of the reflective sublayer 20112 includes aluminum (Al).

[0052] In some embodiments, the first structural layer is a transparent film layer. This allows light emitted from the light-emitting functional layer to reach the reflective sublayer and be reflected.

[0053] In some embodiments, the material of the first structural layer includes indium tin oxide (ITO).

[0054] In specific implementations, the reflective portion includes a stacked third structural layer, a reflective sub-layer, and a fourth structural layer, for example, Ti / Al / Ti or Ti / Al / TiN; the cover portion includes a second structural layer and a first structural layer, for example, Ti / ITO or TiN / ITO; the first electrode includes a reflective portion and a cover portion, for example, Ti / Al / Ti+Ti / ITO, Ti / Al / TiN+Ti / ITO, Ti / Al / TiN+TiN / ITO, or Ti / Al / Ti+TiN / ITO.

[0055] It should be noted that the display panel provided in this embodiment has poor light transmittance in the second and fourth structural layers. In order to avoid affecting the light transmittance of the surface of the light-emitting device facing away from the substrate, it is necessary to provide a thinner second and fourth structural layer.

[0056] In some embodiments, the thickness of the first structural layer is greater than the thickness of the second structural layer.

[0057] In some embodiments, the thickness of the second structural layer is greater than or equal to 10 angstroms and less than or equal to 15 angstroms.

[0058] In some embodiments, the thickness of the first reflective sublayer is greater than the thickness of the third structural layer and the thickness of the fourth structural layer, respectively.

[0059] In some embodiments, the thickness of the third structural layer is greater than 50 angstroms.

[0060] In some embodiments, the thickness of the fourth structural layer is greater than or equal to 10 angstroms and less than or equal to 15 angstroms.

[0061] In some embodiments, the thickness of the reflective sublayer is greater than or equal to 700 angstroms. This ensures the reflectivity of the reflective sublayer.

[0062] In some embodiments, the thickness of the first structural layer is greater than or equal to 120 angstroms and less than or equal to 100 angstroms. This ensures the flatness of the front and side surfaces of the first electrode away from the substrate while maintaining the transmittance of the first structural layer.

[0063] In a specific implementation, taking the first electrode comprising a reflective portion and a covering portion, for example, Ti / Al / TiN+TiN / ITO, the thicknesses of each film layer are as follows: Ti thickness is 100 Å, Al thickness is 730 Å, TiN thickness is 10 Å, and ITO thickness is 150 Å. The reflectivity test results of the above first electrode structure are as follows... Figure 3 As shown, the first electrode structure has a reflectivity of 84% for light with a wavelength of 460 nanometers, which meets the reflectivity requirements.

[0064] In some embodiments, such as Figure 4 As shown, the first structural layer 20121 includes: a first sub-layer 201211 covering the reflective portion, and a second sub-layer 201212 located on the side of the first sub-layer 201211 away from the reflective portion.

[0065] It should be noted that, in order to avoid affecting the light transmittance of the surface of the light-emitting device facing away from the substrate, the thickness of the second structural layer cannot be too thick. Therefore, the thickness uniformity of a thinner second structural layer is poor, which in turn affects the thickness uniformity of the single-layer first structural layer formed on the second structural layer.

[0066] The display panel provided in this embodiment includes a first structural layer comprising a first sublayer and a second sublayer, i.e., the first sublayer is formed first, and then the second sublayer is formed. Since the material of the first structural layer can be used to create a thicker film layer while ensuring light transmittance, a thicker first sublayer can be created to planarize the front and side surfaces of the second structural layer. Then, forming the second sublayer on the side of the film layer with higher planarity can improve the planarity of the first electrode surface.

[0067] In some embodiments, the thickness of the second sublayer is greater than the thickness of the first sublayer.

[0068] In some embodiments, the thickness of the first structural layer is less than or equal to 200 angstroms; The thickness of the first sublayer is greater than 50 angstroms; The thickness of the second sublayer is less than 150 angstroms.

[0069] In some embodiments, such as Figure 5 As shown, the reflective part 2011 also includes a first cover layer 20114 located on the fourth structural layer 20113 away from the reflective sublayer 20112.

[0070] In some embodiments, the material of the first covering layer includes indium tin oxide.

[0071] It should be noted that, in order to avoid affecting the light transmittance of the surface of the light-emitting device facing away from the substrate, the thickness of the fourth structural layer cannot be too thick. Therefore, the thickness uniformity of a thinner fourth structural layer is poor, which in turn affects the thickness uniformity of the cover portion formed on the fourth structural layer.

[0072] The display panel provided in this embodiment includes a first cover layer covering the fourth structural layer. Since the material of the first cover layer can be made into a thicker film layer while ensuring light transmittance, a thicker first cover layer can be made to planarize the fourth structural layer.

[0073] In some embodiments, the thickness of the first covering layer is greater than 50 angstroms.

[0074] It should be noted that in related technologies, to ensure the flatness of the film layer, when the material of the fourth structural layer is TiN, the thickness of TiN is usually required to be around 18 angstroms, and when the material of the fourth structural layer is Ti, the thickness of Ti is usually required to be around 30 angstroms, which affects the light transmittance. The display panel provided in this disclosure, because a first cover layer is provided to planarize the fourth structural layer, the thickness of the fourth structural layer can be reduced to 10 angstroms or even less than 10 angstroms. This improves the light transmittance of the side of the reflective sublayer away from the substrate while ensuring the flatness of the reflective surface.

[0075] In specific implementation, such as Figure 5 As shown, the cross-section of the reflective part 2011 is an isosceles trapezoid. The first cover layer 20114 covers the surface of the fourth structural layer 20113 away from the substrate 1. The orthographic projection of the fourth structural layer 20113 on the substrate 1 covers the orthographic projection of the first cover layer 20114 on the substrate 1.

[0076] It should be noted that, Figure 5 This example illustrates the concept of setting a first structural layer in the covering section. Of course, in actual implementation, it is also possible to... Figure 5 The first structural layer is formed in two stages, namely, the first structural layer includes a first sub-layer and a second sub-layer.

[0077] In specific implementations, the display panel provided in the embodiments of this disclosure can be a micro organic light-emitting diode (MicroOLED) display panel.

[0078] In practical implementation, the substrate of the Micro OLED display panel is, for example, a silicon-based substrate; such as Figure 2 As shown, the display panel further includes: a planarization layer 3 located between the substrate 1 and the light-emitting device 2, and a driving circuit layer 7 located between the substrate 1 and the planarization layer 3. The material of the planarization layer includes, for example, silicon oxide; the driving circuit layer is, for example, an integrated circuit, and includes pixel driving circuits electrically connected to the light-emitting devices one-to-one; the pixel driving circuits may include, for example, complementary metal-oxide-semiconductor transistors.

[0079] In practical implementation, the driving circuit layer of the Micro OLED display panel uses an integrated circuit including complementary metal-oxide-semiconductor transistors, resulting in a smaller pixel driving circuit size, thereby improving the resolution of the display panel; a resolution greater than 3000 pixel density (PPI) can be achieved for the Micro OLED display panel. That is, the display panel provided in this disclosure embodiment is a high-resolution display panel.

[0080] In some embodiments, such as Figure 2As shown, the first electrode 201 is located on the side of the planarization layer 3 away from the substrate 1; like Figure 1 As shown, the covering portion 2012 includes a first flat region d covering the planarization layer 3.

[0081] In some embodiments, such as Figure 2 As shown, the display panel also includes a pixel definition layer 4; the pixel definition layer 4 includes an opening area 401 corresponding to the light-emitting device 2, and the orthographic projection of the opening area 401 onto the substrate 1 falls within the orthographic projection of the first electrode 201 onto the substrate 1. That is, the opening area 401 corresponds to the light-emitting area of ​​the light-emitting device 2.

[0082] In some embodiments, such as Figure 2 As shown, the display panel also includes an encapsulation layer 6 located on the side of the light-emitting device 2 facing away from the substrate 1.

[0083] In specific implementations, the encapsulation layer may include, for example, an inorganic encapsulation layer / organic encapsulation layer / inorganic encapsulation layer stacked together.

[0084] In practice, the display panel includes multiple sub-pixels, and each sub-pixel includes a light-emitting device.

[0085] In some embodiments, such as Figure 6 As shown, the light-emitting device 2 is a white light-emitting device; the display panel also includes: a color filter 8 located on the side of the light-emitting device 2 away from the substrate, and a light-shielding layer 9 located between adjacent color filters 8.

[0086] It should be noted that due to the high resolution of Micro OLED display panels, while traditional fine metal masks (FMMs) can only achieve a maximum resolution of around 800 PPI, it is difficult to use FMMs for the deposition of organic light-emitting layers in a side-by-side (SBS) configuration. Therefore, when the light-emitting device is a white light-emitting device, a full-surface deposition process can be used to achieve high-resolution display. The display panel also includes a color filter, so that the light emitted by the white light-emitting device can be emitted with the same color as the sub-pixels after passing through the color filter, thus achieving full-color display.

[0087] In specific implementation, such as Figure 6 As shown, the multiple sub-pixels include, for example, multiple blue sub-pixels B, multiple red sub-pixels R, and multiple green sub-pixels G. Accordingly, the color filter 8 includes: a blue color filter corresponding to the blue sub-pixels B, a red color filter corresponding to the red sub-pixels R, and a green color filter corresponding to the green sub-pixels G.

[0088] In a specific implementation, the light-emitting functional layer includes at least one light-emitting unit, and the light-emitting unit includes an organic light-emitting layer.

[0089] In specific implementation, such as Figure 6 As shown, the light-emitting functional layer 202 of the light-emitting device 2 includes only one light-emitting unit. That is, the light-emitting device uses a single organic light-emitting layer structure to achieve white light emission, and the organic light-emitting layer can achieve white light by combining a variety of different light-emitting materials.

[0090] Alternatively, in some embodiments, such as Figure 7 As shown, the light-emitting functional layer 202 includes a plurality of light-emitting units 202-1 and a charge-generating layer 202-2 located between the light-emitting units 202-1; the plurality of light-emitting units 202-1 are stacked between the first electrode 201 and the second electrode 203.

[0091] It should be noted that when a light-emitting device consists of only one light-emitting unit, and white light is achieved using a single organic light-emitting layer, the brightness of the light-emitting device is usually not high. If a display panel including this light-emitting device is used to achieve high brightness display, the power consumption of the display panel needs to be increased, which will affect the lifespan of the display panel.

[0092] The display panel provided in this embodiment includes a light-emitting device comprising multiple light-emitting units, each of which includes an organic light-emitting layer. Thus, the light emitted by the light-emitting device is the superposition of multiple light-emitting units, which can improve the brightness of the light-emitting device and thereby reduce the power consumption of the display panel and extend its service life.

[0093] It should be noted that, Figure 7 The example provided illustrates a light-emitting device 2 comprising two stacked light-emitting units 202-1. In some embodiments, such as... Figure 7 As shown, the light-emitting device 2 includes: a first light-emitting unit 202-1-1, and a second light-emitting unit 202-1-2 located on the side of the first light-emitting unit 202-1-1 facing away from the substrate 1; The first light-emitting unit 202-1-1 includes: a red organic light-emitting layer r' and a green organic light-emitting layer g' located on the side of the red organic light-emitting layer r' away from the substrate 1; The second light-emitting unit 202-1-2 includes: a blue light-emitting organic light-emitting layer b'.

[0094] In practice, the charge generation layer is used to generate electrons and holes, thereby providing electrons to the first light-emitting unit and holes to the second light-emitting unit.

[0095] In some embodiments, such as Figure 7As shown, the first light-emitting unit 202-1-1 further includes: a hole injection layer 2021 located between the red organic light-emitting layer r' and the first electrode 201, a hole transport layer 2022 located between the red organic light-emitting layer r' and the hole injection layer 2021, and an electron transport layer 2023 located between the green organic light-emitting layer g' and the charge generation layer 202-2; the second light-emitting unit 202-1-2 further includes: a hole injection layer 2021 located between the blue organic light-emitting layer b' and the charge generation layer 202-2, two hole transport layers 2022 located between the blue organic light-emitting layer b' and the hole injection layer 2021, an electron transport layer 2023 located between the blue organic light-emitting layer b' and the second electrode 203, a hole blocking layer 2024 located between the blue organic light-emitting layer b' and the electron transport layer 2023, and an electron injection layer 2025 located between the electron transport layer 2023 and the second electrode 203.

[0096] In practice, the hole injection layer, hole transport layer, electron transport layer, hole blocking layer, electron injection layer, and charge generation layer can all be prepared using a full-surface vapor deposition process.

[0097] In some embodiments, the hole injection layer, hole transport layer, electron transport layer, hole blocking layer, electron injection layer, and charge generation layer corresponding to different sub-pixels can be integrally connected, that is, the hole injection layer, hole transport layer, electron transport layer, hole blocking layer, electron injection layer, and charge generation layer are common layers.

[0098] Alternatively, in some embodiments, such as Figures 9-11 As shown, the display panel also includes a plurality of partition structures 10; the partition structure 10 overlaps in the area between the orthographic projection of the substrate 1 and the orthographic projection of the adjacent first electrode 201 on the substrate 1.

[0099] In practice, the partition structure is located in the area between the light-emitting areas of the sub-pixels, which is used to break the charge generation layer formed by the whole surface vapor deposition at the partition structure.

[0100] It should be noted that the charge generation layer has a high lateral conductivity. If the charge generation layer is continuous between adjacent sub-pixels, it can easily lead to color cross-contamination between sub-pixels. The display panel provided in this embodiment is provided with a partition structure that breaks the charge generation layer formed by vapor deposition across the entire surface at the partition structure to avoid color cross-contamination between sub-pixels.

[0101] In practice, the partition structure can be, for example, a tall fence (TF), a hole between pixels (Dig on wafer (DOW), or an undercut.

[0102] In some embodiments, such as Figure 8 , Figure 9 , Figure 10 , Figure 11 As shown, the planarization layer 3 includes a first region 302; the orthographic projection of the first region 302 onto the substrate 1 is located between the orthographic projections of the adjacent first electrode 201 onto the substrate 1.

[0103] In some embodiments, such as Figure 8 As shown, the first region 302 includes a first surface j parallel to the plane of the substrate 1 and a first side surface f; the remaining regions of the planarization layer 3 outside the first region 302 include a second surface i facing away from the substrate 1 and parallel to the plane of the substrate 1; the first side surface f connects the first surface j and the second surface i. The distance between the first surface j and the substrate 1 is less than the distance between the second surface i and the substrate 1.

[0104] It should be noted that during the formation of the reflective sublayer, etching processes are required for the fourth structural layer, the reflective sublayer, and the third structural layer. To avoid etching residues in these layers, an over-etching process is necessary. This involves removing a portion of the planarization layer during the etching process, resulting in a first region where the planarization layer has been partially removed. A partition trench structure is then formed in this first region to act as a partition.

[0105] In some embodiments, such as Figure 8 As shown, the distance between the first surface j and the second surface i is greater than the thickness of the first flat area d of the covering portion 2012.

[0106] In some embodiments, such as Figure 8 As shown, the distance between the first surface j and the second surface i is less than the thickness of the reflective part 2011.

[0107] In some embodiments, such as Figure 8 As shown, the angle between the first side surface f and the first surface j is greater than 90 degrees. .

[0108] In a specific implementation, the angle between the first side and the first surface can be equal to the angle between the side of the reflective part and the first surface.

[0109] In practice, h1 is greater than or equal to 200 angstroms and less than or equal to 300 angstroms.

[0110] In some embodiments, such as Figure 8As shown, the orthographic projection of the first planarization region onto the substrate 1 lies within the orthographic projection of the first region 302 onto the substrate 1. That is, the cover extends to cover the area of ​​the planarization layer removed by the etching process, i.e., the first region, thereby improving the coverage effect of the cover.

[0111] In some embodiments, the partition structure is a partition groove structure formed by a DOW; such as Figure 9 As shown, the partition structure 10 includes a first partition groove structure 1001; the first partition groove structure 1001 is located in the first region 302; the orthographic projection of the first partition groove structure 1001 onto the substrate 1 is located between the orthographic projections of the adjacent first electrode 201 onto the substrate 1. That is, the first partition groove structure 1001 is formed in the first region 302 of the planarization layer 3.

[0112] In practice, a first isolation groove structure is formed in the planarization layer, and the pixel definition layer formed subsequently also forms a groove structure at the isolation groove structure. In this way, the charge generation layer formed by the whole surface vapor deposition is disconnected in the area corresponding to the first isolation groove structure.

[0113] In some embodiments, such as Figure 9 As shown, in the direction perpendicular to the substrate, the depth h3 of the first partition groove structure 1001 is greater than the distance h1 between the first surface and the second surface.

[0114] In practice, the depth h3 of the first partition groove structure is, for example, greater than or equal to 600 angstroms and less than or equal to 1200 angstroms.

[0115] In specific implementation, such as Figure 9 As shown, the width of the first region 302 is, for example, 1 micrometer to 1.2 micrometers; the width h2 of the first partition groove structure 1001 is, for example, greater than or equal to 0.45 micrometers and less than or equal to 0.55 micrometers; the distance h5 between the first partition groove structure 1001 and the edge of the first surface is, for example, 0.15 micrometers; and the distance h4 between the first partition groove structure 1001 and the edge of the second surface is, for example, 0.3 micrometers.

[0116] In some embodiments, such as Figure 9 As shown, pixel definition layer 4 covers the edge of the first electrode 201.

[0117] In some embodiments, the maximum thickness of the pixel definition layer is less than the maximum thickness of the first electrode.

[0118] In practice, the thickness of the pixel definition layer is less than the thickness of the first electrode. For example, the ratio of the thickness of the pixel definition layer to the thickness of the first electrode is greater than or equal to 1 / 3 and less than or equal to 1 / 2.

[0119] In some embodiments, such as Figure 9As shown, the orthographic projection of the first partition groove structure 1001 onto the substrate 1 is located within the orthographic projection of the first region 302 onto the substrate 1.

[0120] In some embodiments, such as Figure 9 As shown, the first partition groove structure 1001 has a rectangular shape in the cross section perpendicular to the substrate 1, that is, the side of the first partition groove structure 1001 is perpendicular to its bottom surface.

[0121] Of course, in specific implementation, it can also be like this: Figure 10 As shown, the first partition groove structure 1001 has a non-rectangular shape in the cross-section perpendicular to the substrate 1. For example... Figure 10 In the inverted trapezoidal shape, in the direction away from the substrate 1, the width of the first partition groove structure 1001 in the cross-section perpendicular to the substrate 1 gradually decreases, that is... Figure 10 The width h2 of the first partition groove structure 1001 furthest from the substrate 1 is smaller than the width h9 of the first partition groove structure 1001 closest to the substrate 1. The shape of the first partition groove structure in the cross section perpendicular to the substrate is an inverted trapezoid, which is more conducive to the break of the charge generation layer at the first partition groove structure.

[0122] Alternatively, in some embodiments, the partition structure is a partition groove structure formed by an undercut; such as Figure 11 As shown, the partition structure 10 includes a second partition groove structure 1002; the pixel definition layer 4 includes a second partition groove structure 1002; the orthographic projection of the second partition groove structure 1002 onto the substrate 1 is located between the orthographic projections of the adjacent first electrode 201 onto the substrate 1.

[0123] In some embodiments, such as Figure 11 As shown, the maximum thickness of the pixel definition layer 4 is greater than the maximum thickness of the first electrode 201.

[0124] In some embodiments, such as Figure 11 As shown, the pixel definition layer 4 includes: a first pixel definition sublayer 402, a second pixel definition sublayer 403, and a third pixel definition sublayer 404 stacked in a direction perpendicular to the substrate 1; The maximum thickness of the first pixel definition sublayer 402 is greater than the maximum thickness of the second pixel definition sublayer 403, and the maximum thickness of the second pixel definition sublayer 403 is greater than the maximum thickness of the third pixel definition sublayer 404. The maximum thickness of the first pixel definition sublayer 402 is greater than the maximum thickness of the first electrode 201; The depth h3 of the second partition groove structure 1002 is greater than the total thickness of the third pixel definition sub-layer 404 and the second pixel definition sub-layer 403, but less than the maximum thickness of the pixel definition layer 4.

[0125] That is, the second partition groove structure penetrates the third pixel definition sublayer and the second pixel definition sublayer, but does not penetrate the first pixel definition sublayer. In the region of the second partition groove structure, the first pixel definition sublayer only removes a portion of the area in the direction perpendicular to the substrate.

[0126] In some embodiments, such as Figure 11 As shown, the third pixel definition sublayer 404 includes a first opening region 4041, and the second pixel definition sublayer 403 includes a second opening region 4031. The width h6 of the first opening region 4041 is smaller than the width h7 of the second opening region 4031, meaning that the orthographic projection of the first opening region 4041 onto the substrate 1 falls within the orthographic projection of the second opening region 4031 onto the substrate 1. This is more conducive to isolating the charge generation layer.

[0127] In specific implementation, for example, the width h6 of the first opening region 4041 is smaller than the width h8 between adjacent first electrodes 201, and the orthographic projection of the first opening region 4041 onto the substrate 1 falls into the region between the orthographic projections of adjacent first electrodes 201 onto the substrate 1; the width h7 of the second opening region 4031 is greater than the width h8 between adjacent first electrodes 201.

[0128] In specific implementation, h8 is, for example, greater than or equal to 0.78 micrometers and less than or equal to 0.88 micrometers; h6 is, for example, greater than or equal to 0.43 micrometers and less than or equal to 0.53 micrometers; h7-h6 is, for example, greater than or equal to 0.08 micrometers and less than or equal to 0.12 micrometers; h3 is, for example, greater than or equal to 800 angstroms and less than or equal to 1000 angstroms. Figure 12 The width h9 between adjacent opening regions 401 is greater than or equal to 1.7 micrometers and less than or equal to 1.8 micrometers.

[0129] In practice, the materials of the first pixel definition sublayer and the third pixel definition sublayer include silicon oxide, and the material of the second pixel definition sublayer includes silicon nitride.

[0130] Based on the same inventive concept, this disclosure provides a method for manufacturing a display panel, such as... Figure 12 As shown, it includes: S101, Provide a substrate; S102, A pattern of multiple reflective portions is formed on one side of the substrate; S103. A pattern of multiple covering portions is formed on the side of the reflective portion away from the substrate; wherein, the covering portion covers the front and side surfaces of the reflective portion away from the substrate, and the covering portion includes: a first structural layer, and a second structural layer located between the first structural layer and the reflective portion; the second structural layer is used to block the reflective portion from contacting the first structural layer.

[0131] The method for fabricating a display panel provided in this disclosure involves first forming a pattern for the reflective portion during the fabrication of the first electrode, followed by forming a covering portion that covers the front and sides of the reflective portion. This avoids migration bulging or corrosion defects on the sides of the reflective portion, improves the flatness of the front of the first electrode, increases the injection efficiency of the first electrode, improves the luminous efficiency of the light-emitting device, and thus reduces the power consumption of the display panel. Furthermore, since the covering portion includes a second structural layer located between the first structural layer and the reflective portion, it prevents the reflective portion from contacting the first structural layer to form an oxide insulating layer, thereby avoiding impact on the ohmic characteristics of the first electrode and the performance of the light-emitting device.

[0132] In some embodiments, such as Figure 13 As shown, step S102 forms a pattern of multiple reflective portions on one side of the substrate; specifically, it includes: S1021. A third structural layer 20111, a reflective sub-layer 20112, and a fourth structural layer 20113 are sequentially formed on one side of the substrate 1. S1022, Etching process is performed on the fourth structural layer 20113, the reflective sub-layer 20112, and the third structural layer 20111 to form a pattern of multiple reflective parts 2011.

[0133] In some embodiments, such as Figure 14 As shown, after the third structural layer 20111, the reflective sublayer 20112, and the fourth structural layer 20113 are sequentially formed on one side of the substrate 1, the substrate further includes: A first cover layer 20114 is formed on the side of the fourth structural layer 20113 facing away from the reflective sublayer 20112; The etching process performed on the fourth structural layer 20113, the reflective sublayer 20112, and the third structural layer 20111 to form a pattern of multiple reflective parts 2011 specifically includes: The first cover layer 20114, the fourth structural layer 20113, the reflective sublayer 20112, and the third structural layer 20111 are etched to form a pattern of multiple reflective parts 2011.

[0134] In some embodiments, such as Figure 13 As shown, step S103 forms a pattern of multiple covering portions on the side of the reflective portion away from the substrate, specifically including: S1031, A second structural layer 20122 is formed on the side of the reflective portion 2011 away from the substrate 1, and a first structural layer 20121 is formed on the side of the second structural layer 20122 away from the substrate. S1032, Perform a patterning process on the first structural layer 20121 and the second structural layer 20122 to form a pattern of multiple covering parts 2012.

[0135] In some embodiments, such as Figure 13 As shown, a single-layer ITO layer is formed on the side of the second structural layer 20122 away from the substrate as the first structural layer 20121.

[0136] Alternatively, in some embodiments, such as Figure 15 As shown, step S1031 forms a first structural layer on the side of the second structural layer away from the substrate, specifically including: S10311, A first sublayer 201211 is formed on the side of the second structural layer 20122 away from the substrate 1; S10312, A second sublayer 201212 is formed on the side of the first sublayer away from the second structural layer 20122.

[0137] In some embodiments, before forming a pattern of multiple reflective portions on one side of the substrate, the method further includes: Forming a planarization layer; The fourth structural layer, the reflective sublayer, and the third structural layer are etched to form patterns of multiple reflective portions, specifically including: The fourth structural layer, the reflective sublayer, and the third structural layer are over-etched to form patterns of multiple reflective parts, and part of the planarization layer is removed.

[0138] This involves etching the fourth structural layer, the reflective sublayer, and the third structural layer while simultaneously removing part of the planarization layer; in other words, an over-etching process is used to form the pattern of the reflective portion. This avoids leaving residues in the fourth structural layer, the reflective sublayer, and the third structural layer, thereby improving the pattern fabrication yield of the reflective portion in the first electrode.

[0139] In practice, the fourth structural layer, the reflective sublayer, and the third structural layer are over-etched to form patterns of multiple reflective parts, and part of the planarization layer is removed, as shown in the following diagram. Figure 16 As shown, the area where the planarization layer 3 is removed is the first region 302. In a specific implementation, the overcut depth is, for example, greater than or equal to 200 angstroms and less than or equal to 300 angstroms, that is, the distance h1 between the surface of the first region 302 parallel to the substrate and the surfaces of the remaining regions parallel to the substrate is greater than or equal to 200 angstroms and less than or equal to 300 angstroms.

[0140] In specific implementation, when the reflective part also includes a first cover layer, an over-etching process is performed on the first cover layer, the fourth structural layer, the reflective sub-layer, and the third structural layer.

[0141] In some embodiments, after forming the pattern of multiple covering portions on the side of the reflective portion away from the substrate in step S103, the method further includes: A first partition groove structure is formed in the planarization layer and in the region between the first electrodes; specifically, the first partition groove structure is located in the first region; The steps involve sequentially forming a pixel definition layer, a light-emitting functional layer, a second electrode, an encapsulation layer, and a color filter on the side of the cover portion where the pattern faces away from the substrate.

[0142] Alternatively, in some embodiments, after forming the pattern of multiple covering portions on the side of the reflective portion away from the substrate in step S103, the method further includes: A pixel definition layer pattern is formed on the side of the cover portion facing away from the substrate; the pixel definition layer includes a second partition groove structure; A light-emitting functional layer, a second electrode, an encapsulation layer, and a color filter are sequentially formed on the side of the pixel definition layer away from the substrate.

[0143] The specific structures of the pixel definition layer, light-emitting functional layer, encapsulation layer, and color filter are described in the display panel embodiment section and will not be repeated here.

[0144] This disclosure provides a display device, which includes a display panel provided in this disclosure.

[0145] The display device provided in this disclosure includes any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure. Implementation of this display device can refer to the embodiments of the display panel described above; repeated details will not be repeated.

[0146] In summary, the display panel, its fabrication method, and display device provided in this disclosure include a cover portion covering the side of the reflective portion as the first electrode. This prevents migration bulging or corrosion defects on the side of the reflective portion, improves the flatness of the front and side surfaces of the first electrode, increases the injection efficiency of the first electrode, improves the luminous efficiency of the light-emitting device, and thus reduces the power consumption of the display panel. Furthermore, since the cover portion includes a second structural layer located between the first structural layer and the reflective portion, it prevents the reflective portion from contacting the first structural layer to form an oxide insulating layer, thereby avoiding affecting the ohmic characteristics of the first electrode and the performance of the light-emitting device.

[0147] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0148] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations to the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A display panel, wherein, The display panel includes: Substrate; Multiple light-emitting devices are located on one side of the substrate. Each light-emitting device includes a first electrode. The first electrode includes a reflective portion and a covering portion located on the side of the reflective portion away from the substrate. The covering portion covers the front and side surfaces of the reflective portion on the side away from the substrate. The covering portion includes a first structural layer and a second structural layer located between the first structural layer and the reflective portion. The thickness of the covering portion covering the front surface of the reflective portion is less than the thickness of the reflective portion.

2. The display panel according to claim 1, wherein, The reflective portion includes a third structural layer, a reflective sub-layer, and a fourth structural layer stacked on one side of the substrate; the thickness of the reflective sub-layer is greater than the thickness of the third structural layer and the thickness of the fourth structural layer, respectively.

3. The display panel according to claim 2, wherein, The second structural layer covers the surface and side of the reflective sublayer facing away from the substrate, as well as the side of the fourth structural layer; The orthographic projection of the reflective sublayer onto the substrate lies within the orthographic projection of the third structural layer onto the substrate.

4. The display panel according to any one of claims 1 to 3, wherein, The display panel further includes: a planarization layer located between the substrate and the light-emitting device; the first electrode is located on the side of the planarization layer away from the substrate, and the cover includes a first planar region in contact with the planarization layer.

5. The display panel according to claim 4, wherein, The reflective portion includes a third structural layer; the planarization layer includes a first region; the orthographic projection of the first region onto the substrate is located between the orthographic projections of adjacent third structural layers onto the substrate. The first region includes a first surface facing away from the substrate and a first side surface; the remaining region of the planarization layer outside the first region includes a second surface facing away from the substrate; the first side surface connects the first surface and the second surface; The distance between the first surface and the substrate is smaller than the distance between the second surface and the substrate. The first flat region is projected onto the substrate in the same way as the first region in the same way as the substrate.

6. The display panel according to claim 5, wherein, The reflective portion further includes a fourth structural layer and a first cover layer located on the fourth structural layer away from the reflective sublayer; The distance between the first surface and the second surface is greater than the thickness of the first covering layer.

7. The display panel according to claim 5 or 6, wherein, The distance between the first surface and the second surface is less than the thickness of the reflective portion.

8. The display panel according to claim 5 or 6, wherein, The angle between the first side and the first surface is greater than 90 degrees. .

9. The display panel according to any one of claims 4 to 8, wherein, The display panel also includes a plurality of partition structures; the partition structures overlap in the area between the orthographic projection of the substrate and the orthographic projection of the adjacent first electrode on the substrate.

10. The display panel according to claim 9, wherein, The partition structure includes a first partition groove structure; the first partition groove structure is located in the first region; The first partition groove structure is located between the orthographic projections of the adjacent first electrode on the substrate.

11. The display panel according to claim 10, wherein, In the direction perpendicular to the substrate, the depth of the first partition groove structure is greater than the distance between the first surface and the second surface.

12. The display panel according to claim 10 or 11, wherein, The display panel further includes a pixel definition layer; the pixel definition layer includes an opening area corresponding to each of the light-emitting devices, and the orthographic projection of the opening area on the substrate falls within the orthographic projection of the first electrode on the substrate. The pixel definition layer covers the edge of the first electrode; The maximum thickness of the pixel definition layer is less than the maximum thickness of the first electrode.

13. The display panel according to claim 9, wherein, The partition structure includes a second partition groove structure; The display panel further includes a pixel definition layer; the pixel definition layer includes a second partition groove structure; the orthographic projection of the second partition groove structure on the substrate is located between the orthographic projections of the adjacent first electrode on the substrate; The pixel definition layer also includes an opening area corresponding to each of the light-emitting devices, wherein the orthographic projection of the opening area onto the substrate falls within the orthographic projection of the first electrode onto the substrate.

14. The display panel according to claim 13, wherein, The maximum thickness of the pixel definition layer is greater than the maximum thickness of the first electrode.

15. The display panel according to claim 13, wherein, The pixel definition layer includes: a first pixel definition sublayer, a second pixel definition sublayer, and a third pixel definition sublayer stacked in a direction perpendicular to the substrate. The maximum thickness of the first pixel definition sub-layer is greater than the maximum thickness of the second pixel definition sub-layer, and the maximum thickness of the second pixel definition sub-layer is greater than the maximum thickness of the third pixel definition sub-layer. The maximum thickness of the first pixel definition sublayer is greater than the maximum thickness of the first electrode; The depth of the second partition groove structure is greater than the total thickness of the third pixel definition sub-layer and the second pixel definition sub-layer, but less than the maximum thickness of the pixel definition layer; The third pixel definition sublayer includes a first opening region, and the second pixel definition sublayer includes a second opening region; the orthographic projection of the first opening region onto the substrate falls within the orthographic projection of the second opening region onto the substrate.

16. The display panel according to any one of claims 1 to 15, wherein, The orthographic projection of the first structural layer onto the substrate covers the orthographic projection of the second structural layer onto the substrate.

17. The display panel according to any one of claims 1 to 16, wherein, The first structural layer includes: a first sub-layer covering the reflective portion, and a second sub-layer located on the side of the first sub-layer facing away from the reflective portion; the thickness of the second sub-layer is greater than the thickness of the first sub-layer.

18. The display panel according to any one of claims 1 to 17, wherein, The angle between the side surface of the reflective portion and the plane of the substrate is greater than 0. And less than or equal to 70 .

19. The display panel according to any one of claims 1 to 18, wherein, The first structural layer is a metal oxide, and the reflective part includes a metallic material.

20. A display device, wherein, The display device includes a display panel according to any one of claims 1 to 18.

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