Display panel, preparation method of display panel and electronic device

Abstract

Embodiments of the present application provide a display panel, a preparation method of the display panel and an electronic device, and relate to the technical field of display. In the display panel, different light emitting devices in the same sub-pixel unit are connected in parallel. When the current on the light emitting device on a certain parallel branch is large, part of the current can be diverted through other parallel branches, so that the current sizes on the multiple parallel branches are basically consistent, thereby ensuring that the different light emitting devices in the same sub-pixel unit have the same display brightness, solving the problem of uneven display brightness of the light emitting devices in the same sub-pixel unit caused by process differences, and improving the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are considered the next generation of display technology after liquid crystal displays. Due to their excellent color and image quality, they are widely used in various consumer electronics products such as smartphones, televisions, laptops, desktop computers, automotive displays, and wearable devices, and have become the mainstream technology in display panels.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the current manufacturing process of OLED display products still needs further improvement. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above background, this application provides a display panel, a method for manufacturing the display panel, and an electronic device.

[0006] A first aspect of this application provides a display panel, the display panel comprising: substrate; An isolation structure is located on one side of the substrate and forms a plurality of isolation openings, wherein each isolation opening is divided by an isolation structure located within the isolation opening to form a plurality of isolation sub-openings; A light-emitting device is located within the isolation sub-opening. Light-emitting devices of the same color that are located in different isolation sub-openings within the same isolation opening form a sub-pixel unit. In the same sub-pixel unit, different light-emitting devices are connected in parallel.

[0007] In one possible implementation of this application, the display panel further includes a pixel defining layer, the pixel defining layer being located on the side of the isolation structure facing the substrate, and the isolation structure being located on the side of the pixel defining layer away from the substrate; The pixel defining layer has a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolator opening on the substrate. At least a portion of the light-emitting devices are located within the pixel opening. Preferably, the pixel defining layer is an inorganic pixel defining layer; Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride.

[0008] In one possible implementation of this application, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode stacked together; wherein the second electrode is electrically connected to the isolation structure. The first electrode is disposed on the side of the pixel defining layer near the substrate, and at least a portion of the first electrode is exposed through the pixel opening; In the same sub-pixel unit, the second electrodes of adjacent light-emitting devices are connected to each other; Preferably, the isolation opening includes 2-4 isolation sub-openings.

[0009] In one possible implementation of this application, the display panel further includes an electrode connection portion, wherein in the same sub-pixel unit, the second electrodes of adjacent light-emitting devices are connected through the electrode connection portion; The electrode connection portion and the second electrode are disposed in the same layer; Preferably, the electrode connection portion and the second electrode are made of the same material; Preferably, the display panel further includes a first connecting portion and a second connecting portion. On the side of the first isolating sub-opening away from the second isolating sub-opening, the first connecting portion covers the surface of the isolation structure facing the first isolating sub-opening; on the side of the second isolating sub-opening away from the first isolating sub-opening, the second connecting portion covers the surface of the isolation structure facing the second isolating sub-opening. Preferably, the first connecting portion is connected to the second electrode of the light-emitting device inside the first isolator opening, and the second connecting portion is connected to the second electrode of the light-emitting device inside the second isolator opening; Preferably, the first connecting portion, the second connecting portion, and the electrode connecting portion are disposed in the same layer.

[0010] In one possible implementation of this application, the electrode connection portion at least partially covers the surface of the isolation structure between adjacent light-emitting devices; The isolation opening includes an adjacent first isolation sub-opening and a second isolation sub-opening, and the electrode connection part includes a first electrode connection part, a third electrode connection part and a second electrode connection part connected in sequence; At the location of the isolation structure between the first isolator opening and the second isolator opening, the first electrode connection portion covers the surface of the isolation structure facing the first isolator opening, the second electrode connection portion covers the surface of the isolation structure facing the second isolator opening, and the third electrode connection portion is located on the side of the isolation structure away from the substrate; The second electrode of the light-emitting device inside the first isolator opening is connected to the first electrode connection part, and the second electrode of the light-emitting device inside the second isolator opening is connected to the second electrode connection part.

[0011] In one possible implementation of this application, the display panel further includes a filling layer disposed between the third electrode connection sub-part and the isolation structure; The filling layer, the light-emitting material layer of the light-emitting device in the first isolator opening, and the light-emitting material layer of the light-emitting device in the second isolator opening are all made of the same material.

[0012] In one possible embodiment of this application, the isolation structure includes a first isolation portion and a second isolation portion stacked together, the second isolation portion being disposed on the side of the first isolation portion away from the substrate, and the orthographic projection of the first isolation portion on the substrate being located within the orthographic projection of the second isolation portion on the substrate. Preferably, the first isolation part is a conductive isolation part, and the second electrode is connected to the surface of the first isolation part facing the corresponding insulator opening; Preferably, the isolation structure further includes a third isolation portion, wherein the third isolation portion, the first isolation portion, and the second isolation portion are stacked sequentially in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the third isolation portion is a conductive isolation portion, and the second electrode is also connected to the third isolation portion; Preferably, at the isolation structure location between the first isolator opening and the second isolator opening, the first electrode connection portion extends from the surface of the first isolation portion toward the first isolator opening to the surface of the second isolation portion toward the substrate; the second electrode connection portion extends from the surface of the first isolation portion toward the second isolator opening to the surface of the second isolation portion toward the substrate. Preferably, the material of the first isolation part includes aluminum, silver or copper, the material of the second isolation part includes titanium or molybdenum, and the material of the third isolation part includes molybdenum or titanium.

[0013] In one possible implementation of this application, the display panel further includes a first encapsulation layer, which includes a plurality of encapsulation units for encapsulating the light-emitting devices within the isolator opening; Within the same sub-pixel unit, the packaging units used to encapsulate adjacent light-emitting devices are connected to each other; The encapsulation unit at least covers the surface of the electrode connection portion; Preferably, the orthographic projection of the electrode connection portion on the substrate is located within the orthographic projection of the packaging unit on the substrate.

[0014] In one possible implementation of this application, the encapsulation units for encapsulating adjacent light-emitting devices belonging to different sub-pixel units are disconnected from each other; Preferably, the packaging units used to encapsulate adjacent light-emitting devices belonging to two sub-pixel units of different light-emitting colors are disconnected from each other; Preferably, the packaging units used to encapsulate adjacent light-emitting devices belonging to two sub-pixel units of the same emitting color are disconnected from each other.

[0015] In one possible implementation of this application, the display panel further includes a second encapsulation layer, the second encapsulation layer being located on the side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covering the encapsulation unit; Preferably, the second encapsulation layer includes a flat surface on the side away from the substrate; Preferably, the display panel further includes a third encapsulation layer, the third encapsulation layer being located on the side of the second encapsulation layer away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

[0016] A second aspect of this application also provides a display panel, the display panel comprising: substrate; An isolation structure is located on one side of the substrate and forms a plurality of isolation openings, wherein each isolation opening is divided by an isolation structure located within the isolation opening to form a plurality of isolation sub-openings; A light-emitting device is located within the isolation sub-opening. Light-emitting devices of the same color located in different isolation sub-openings within the same isolation opening form a sub-pixel unit, wherein the second electrode of the light-emitting device is connected to the isolation structure. In the same sub-pixel unit, the second electrodes of adjacent light-emitting devices are connected through an electrode connection portion, wherein the second electrode and the electrode connection portion are disposed in the same layer.

[0017] In one possible implementation of this application, the electrode connection portion at least partially covers the surface of the isolation structure between adjacent light-emitting devices; The isolation opening includes an adjacent first isolation sub-opening and a second isolation sub-opening, and the electrode connection part includes a first electrode connection part, a third electrode connection part and a second electrode connection part connected in sequence; At the location of the isolation structure between the first isolator opening and the second isolator opening, the first electrode connection portion covers the surface of the isolation structure facing the first isolator opening, the second electrode connection portion covers the surface of the isolation structure facing the second isolator opening, and the third electrode connection portion is located on the side of the isolation structure away from the substrate; The second electrode of the light-emitting device inside the first isolator opening is connected to the first electrode connection part, and the second electrode of the light-emitting device inside the second isolator opening is connected to the second electrode connection part.

[0018] A second aspect of this application also provides a method for manufacturing a display panel, the method comprising: Provide a substrate; An isolation structure and an isolation opening are formed on one side of the substrate, wherein each isolation opening includes multiple isolation sub-openings; Light-emitting devices are fabricated within the isolation sub-openings. A sub-pixel unit is formed by light-emitting devices of the same color from different isolation sub-openings in the same isolation opening, and different light-emitting devices in the same sub-pixel unit are connected in parallel.

[0019] In one possible implementation of this application, the step of fabricating a light-emitting device within the insulator opening includes: A light-emitting material layer is fabricated on the substrate on the side where the isolation structure is located; A continuously distributed conductive layer is formed on the side of the luminescent material layer away from the substrate and on the exposed surface of the isolation structure by physical vapor deposition. Fabricate an inorganic encapsulation material layer covering the conductive layer; The inorganic encapsulation material layer, the conductive layer, and the light-emitting material layer are patterned to form a light-emitting device located within the isolation sub-opening and an encapsulation unit for encapsulating the light-emitting device. An electrode connection portion is formed to connect the second electrodes of two adjacent light-emitting devices in the same sub-pixel unit, wherein the second electrode of the light-emitting device and the electrode connection portion are formed by the conductive layer.

[0020] A fourth aspect of this application also provides an electronic device, the electronic device comprising a display panel as described in any possible implementation of the first or second aspect, or a display panel prepared in any possible implementation of the third aspect. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram illustrating the distribution of isolation openings and isolation structures in this embodiment is provided. Figure 2 Example Figure 1 A schematic diagram showing the distribution of light-emitting devices at corresponding positions; Figure 3 Example Figure 1 One of the schematic diagrams of the cross-section at position AA in the middle; Figure 4 This embodiment illustrates a pixel circuit diagram that drives different light-emitting devices in the same sub-pixel unit. Figure 5 Example Figure 1 Schematic diagram of the cross section at position AA (second part); Figure 6 Example Figure 1 Schematic diagram of the cross-section at position AA (third one); Figure 7 A schematic cross-sectional view of an isolation structure is shown in the example; Figure 8 A schematic diagram illustrating the distribution of light-emitting devices, packaging units, and isolator openings is provided. Figure 9 Example Figure 8 One of the schematic diagrams of the cross-section at the CC position; Figure 10 Example Figure 8 Schematic diagram of the cross section at position DD; Figure 11 Example Figure 8 Schematic diagram of the cross section at position CC (2); Figure 12 A flowchart illustrating the display panel fabrication method provided in this embodiment is shown. Figure 13 Example Figure 12 Corresponding process flow diagram; Figure 14 Example Figure 12 The process flow diagram corresponding to step S130. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] In the description of this application, it should be noted that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] Increasing the density of light-emitting devices (i.e., pixel density) in display panels is a crucial way to improve display quality. However, current display panels manufactured using fine metal vapor deposition mask (FMM) technology are limited by technological constraints, preventing further increases in the density of light-emitting devices. Through long-term research, the inventors discovered that to address the technical challenge of limiting the density of light-emitting devices, an isolation structure can be incorporated into some display panels. During the full-layer vapor deposition of the light-emitting material layer and electrodes, the light-emitting material layer and electrodes can be separated at the isolation structure location. Through multiple vapor deposition and etching processes, light-emitting devices of different colors can be formed in different isolation openings. This process is also known as light-emitting device patterning.

[0026] The aforementioned display panel sequentially manufactures light-emitting devices of different colors by patterning them. Patterning the earlier-made devices may damage the structure at the location of later-made devices, and vice versa. This can cause some light-emitting devices in the display panel to malfunction, resulting in dark spots and affecting the display effect. While patterning can reduce the spacing between light-emitting devices, allowing a sub-pixel unit to be divided into multiple devices, and compensating for dark spots when one device in a sub-pixel unit fails to display, the remaining devices can compensate. However, the inventors discovered that different light-emitting devices within the same sub-pixel unit exhibit inconsistent brightness (i.e., the orange peel / mura phenomenon).

[0027] To solve the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0028] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A schematic diagram illustrating the distribution of isolation openings and isolation structures is provided. Figure 2 A schematic diagram illustrating the distribution of light-emitting devices is provided. Figure 3 Example Figure 1 A schematic diagram of the cross-section at position AA. Figure 4 A pixel circuit diagram driving different light-emitting devices in the same sub-pixel unit is illustrated. In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, and a light-emitting device 13. The substrate 11 has a multi-layer structure and includes at least a plurality of metal layers and an insulating layer located between adjacent metal layers. A pixel circuit is formed in the substrate 11 to provide driving signals for the light-emitting device 13.

[0029] An isolation structure 12 is located on one side of the substrate 11 and forms a plurality of isolation openings 1201. Each isolation opening 1201 is divided by the isolation structure 12 within the isolation opening 1201 to form a plurality of isolation sub-openings 12011. The plurality of isolation sub-openings 12011 formed by the division can have the same size or different sizes. Preferably, the plurality of isolation sub-openings 12011 formed by the division have the same size. At least a portion of the light-emitting device 13 is located within the isolation sub-opening 12011. The light-emitting device 13 and the isolation sub-opening 12011 correspond one-to-one, that is, one light-emitting device 13 is located within one isolation sub-opening 12011. The light-emitting devices 13 located in different isolation sub-openings 12011 within the same isolation opening 1201 have the same color. A plurality of light-emitting devices 13 located in the same isolation opening 1201 form a sub-pixel unit 30. For example, Figure 2 As shown, two light-emitting devices 13 located in the same isolation opening 1201 can form a sub-pixel unit 30.

[0030] In the same sub-pixel unit 30, multiple light-emitting devices 13 within the sub-pixel unit 30 are driven to emit light by the same pixel circuit. Due to differences in manufacturing processes, different light-emitting devices 13 in the same sub-pixel unit 30 have different bonding resistances, for example... Figure 4 As shown, the connection resistances of the two light-emitting devices 13 are Rc1 and Rc2, respectively. When they are driven to emit light using the same pixel circuit 20, the driving currents of the two light-emitting devices 13 will be different. To solve the above technical problem, as... Figure 4 As shown, multiple light-emitting devices 13 of the same sub-pixel unit 30 are connected in parallel. Specifically, this can be achieved by connecting the same electrodes of the multiple light-emitting devices 13 together. For example, the same electrodes of the multiple light-emitting devices 13 can be connected together through a conductive layer (such as a conductive metal layer) on the same layer as the electrode, or through other conductive layers on different layers from the electrode. Preferably, the same electrodes of the multiple light-emitting devices 13 are connected together through a conductive layer on the same layer as the electrode. In the same sub-pixel unit 30, if the current flowing through a certain light-emitting device 13 is large, the larger current can be diverted to other branches with smaller currents flowing through the light-emitting devices 13 through the above connection relationship.

[0031] In the above scheme, different light-emitting devices 13 in the same sub-pixel unit 30 are connected in parallel. When the current on the light-emitting device 12 in a certain parallel branch is large, some current can be diverted through other parallel branches, so that the current on multiple parallel branches is basically the same. This ensures that different light-emitting devices 13 in the same sub-pixel unit 30 have the same display brightness, solves the problem of uneven display brightness caused by process differences in the light-emitting devices 13 in the same sub-pixel unit 30, and improves the display effect of the display panel 1.

[0032] Further, please refer to Figure 5 In this embodiment, the display panel 1 further includes a pixel defining layer 15, which is located on one side of the substrate 11. An isolation structure 12 is located on the side of the pixel defining layer 15 away from the substrate 11. The pixel defining layer 15 includes a plurality of pixel openings 1501. In this embodiment, the pixel defining layer 15 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 15 is an inorganic pixel defining layer, meaning it includes inorganic materials. When the pixel defining layer 15 is an inorganic pixel defining layer, it can be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed by alternating layers of silicon oxide and silicon nitride.

[0033] In this embodiment, the pixel opening 1501 is connected to the corresponding isolator opening 12011. For example, the orthographic projection of the pixel opening 1501 on the substrate 11 is located within the orthographic projection of the isolator opening 12011 on the substrate 11. At least a portion of the light-emitting devices 13 are located within the corresponding pixel opening 1501.

[0034] Furthermore, please refer to again Figure 5 In the direction away from the substrate 11 (Z direction in the figure), the light-emitting device 13 includes a first electrode 131, a light-emitting material layer 132, and a second electrode 133 stacked together. The first electrode 131 is located on the side of the pixel defining layer 15 facing the substrate 11, and the pixel opening 1501 partially exposes the first electrode 131. The second electrode 133 is electrically connected to the isolation structure 12. Exemplarily, the second electrode 133 and the isolation structure 12 are electrically connected by an overlapping manner. The first electrode 131 can be electrically connected to the pixel circuit in the substrate 11. In this embodiment, the first electrode 131 can be the anode of the light-emitting device 13, and the second electrode 133 can be the cathode of the light-emitting device 13.

[0035] In this embodiment, a sub-pixel unit 30 is composed of multiple light-emitting devices 13. The more light-emitting devices 13 that make up the sub-pixel unit 30, the smaller the impact of the dark spot caused by the failure of a single light-emitting device 13 on the overall display effect of the display panel 1. However, the overall effective light-emitting area of ​​the sub-pixel unit 30 will decrease. To balance the conflict between the two, in this embodiment, a sub-pixel unit 30 can be composed of 2-4 light-emitting devices 13, that is, the number of isolation openings 1201 including isolation sub-openings 12011 is 2-4. For example, a sub-pixel unit 30 can be composed of 2 light-emitting devices 13; or, a sub-pixel unit 30 can be composed of 3 light-emitting devices 13; or, a sub-pixel unit 30 can be composed of 4 light-emitting devices 13.

[0036] Please refer to this again. Figure 5Furthermore, the display panel 1 also includes an electrode connection portion 14. In the same sub-pixel unit 30, the second electrodes 133 of adjacent light-emitting devices 13 are connected through the electrode connection portion 14 to realize the electrical connection of the second electrodes 133 of adjacent light-emitting devices 13. The electrode connection portion 14 can be disposed in the same layer as the second electrode 133 or in a different layer from the second electrode 133. Preferably, the electrode connection portion 14 and the second electrode 133 are disposed in the same layer. Wherein, being disposed in the same layer means that the electrode connection portion 14 and the second electrode 133 can be formed by the same process of film layer, and the electrode connection portion 14 and the second electrode 133 are made of the same material.

[0037] In this embodiment, the electrode connection portion 14 at least partially covers the surface of the isolation structure 12 between adjacent light-emitting devices 13.

[0038] For details, please refer to Figure 1 and Figure 5 The isolation opening 1201 includes an adjacent first isolation sub-opening 12011a and a second isolation sub-opening 12011b, and the electrode connection part 14 includes a first electrode connection part 141, a third electrode connection part 143 and a second electrode connection part 142 connected in sequence.

[0039] At the location of the isolation structure 12 between the first isolator opening 12011a and the second isolator opening 12011b, the first electrode connection portion 141 covers the surface of the isolation structure 12 facing the first isolator opening 12011a, the second electrode connection portion 142 covers the surface of the isolation structure 12 facing the second isolator opening 12011b, and the third electrode connection portion 143 is located on the side of the isolation structure 12 away from the substrate 11.

[0040] The second electrode 133 of the light-emitting device 13 in the first isolator opening 12011a is connected to the first electrode connection sub-part 141, and the second electrode 133 of the light-emitting device 13 in the second isolator opening 12011b is connected to the second electrode connection sub-part 142.

[0041] In this embodiment, the display panel 1 further includes a filling layer 17 disposed between the third electrode connection sub-part 143 and the isolation structure 12. The filling layer 17, the light-emitting material layer 132 of the light-emitting device 13 in the first isolation sub-opening 12011a, and the light-emitting material layer 132 of the light-emitting device 13 in the second isolation sub-opening 12011b are made of the same material and can be manufactured by the same process.

[0042] Further, please refer to Figure 6The display panel 1 also includes a first connecting portion 181 and a second connecting portion 182. On the side of the first isolator opening 12011a away from the second isolator opening 12011b, the first connecting portion 181 covers the surface of the isolation structure 12 facing the first isolator opening 12011a. On the side of the second isolator opening 12011b away from the first isolator opening 12011a, the second connecting portion 182 covers the surface of the isolation structure 12 facing the second isolator opening 12011b.

[0043] Optionally, the first connecting portion 181 is connected to the second electrode 132 of the light-emitting device 13 in the first isolator opening 12011a, and the second connecting portion 182 is connected to the second electrode 132 of the light-emitting device 13 in the second isolator opening 12011b.

[0044] Optionally, the first connecting part 181, the second connecting part 182, and the electrode connecting part 14 are arranged in the same layer.

[0045] In the above design, the second electrodes 133 of different light-emitting devices 13 are connected by the electrode connection part 14. Even if the second electrode 133 of one light-emitting device 13 is corroded, it is difficult to corrode the second electrode 133 of another light-emitting device 13 through the electrode connection part 14 because the electrode connection part 14 is relatively long.

[0046] In this embodiment, please refer again. Figure 5 The isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 stacked sequentially. The orthographic projection of the first isolation portion 121 on the substrate 11 lies within the orthographic projection of the second isolation portion 122 on the substrate 11. The second isolation portion 122 extends relative to the first isolation portion 121 toward the corresponding isolation opening 1201. In a cross-section perpendicular to the plane of the substrate 11 and passing through the center of the isolation opening 1201, the cross-section of the isolation structure 12 may be T-shaped. The first isolation portion 121 is a conductive isolation portion, and the second electrode 133 can also be electrically connected to the first isolation portion 121. For example, the second electrode 133 is electrically connected by overlapping with the first isolation portion 121.

[0047] Further, please refer to Figure 7In this embodiment, the isolation structure 12 further includes a third isolation portion 123. The third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are sequentially stacked in a direction away from the substrate 11. The orthographic projection of the first isolation portion 121 onto the substrate 11 may lie within the orthographic projection of the third isolation portion 123 onto the substrate 11. The cross-section of the isolation structure 12 may be I-shaped on a cross-section perpendicular to the plane of the substrate 11 and passing through the center of the isolation opening 1201. The third isolation portion 123 is a conductive isolation portion, and the second electrode 133 may also be electrically connected to the third isolation portion 123. For example, the second electrode 133 is electrically connected by overlapping with the third isolation portion 123.

[0048] Please refer to this again. Figure 5 At the isolation structure location between the first isolator opening 12011a and the second isolator opening 12011b, the first electrode connection portion 141 extends from the surface of the first isolation portion 121 facing the first isolator opening 12011a to the surface of the second isolation portion 122 facing the substrate 11. The second electrode connection portion 142 extends from the surface of the first isolation portion 121 facing the second isolator opening 12011b to the surface of the second isolation portion 122 facing the substrate 11.

[0049] Optionally, the first isolation part 121 may be made of aluminum, silver or copper, the second isolation part 122 may be made of titanium or molybdenum, and the third isolation part 123 may be made of molybdenum or titanium.

[0050] Further, please refer to Figure 8 , Figure 9 and Figure 10 The display panel 1 also includes a first encapsulation layer 161, which includes a plurality of encapsulation units 1611. The encapsulation units 1611 are used to encapsulate the light-emitting device 13 within the isolation sub-opening 12011.

[0051] like Figure 9 As shown, in the same sub-pixel unit 30, the encapsulation units 1611 used to encapsulate adjacent light-emitting devices 13 are connected together.

[0052] The encapsulation unit 1611 covers at least the surface of the electrode connection portion 14. This design prevents the electrode connection portion 14 from being exposed and corroded, which would affect the electrical connection of the second electrode 133 of the adjacent light-emitting device 13 in the same sub-pixel unit 30. The orthographic projection of the electrode connection portion 14 on the substrate 11 is located within the orthographic projection of the encapsulation unit 1611 on the substrate 11.

[0053] In this embodiment, as Figure 10As shown, the encapsulation units 1611 used to encapsulate adjacent light-emitting devices 13 belonging to different sub-pixel units 30 are disconnected from each other. For example, please refer again... Figure 2 The sub-pixel unit 30 includes a first sub-pixel unit 30a, a second sub-pixel unit 30b, and a third sub-pixel unit 30c formed by light-emitting devices 13 of different colors. The first sub-pixel unit 30a, the second sub-pixel unit 30b, and the third sub-pixel unit 30c are arranged along a first direction (X direction in the figure) to form a pixel unit. Multiple light-emitting devices 13 in the same sub-pixel unit 30 are arranged along a second direction (Y direction in the figure), and the first and second directions intersect; preferably, the first and second directions are perpendicular. In this embodiment, the first sub-pixel unit 30a, the second sub-pixel unit 30b, and the third sub-pixel unit 30c are strip-shaped.

[0054] In this embodiment, the packaging units 1611 used to encapsulate adjacent light-emitting devices 13 belonging to two sub-pixel units 30 of different light-emitting colors are disconnected from each other. For example, the packaging units 1611 used to encapsulate two adjacent light-emitting devices 13 belonging to the second sub-pixel unit 30b and the third sub-pixel unit 30c are disconnected from each other, so that the light-emitting devices 13 in the sub-pixel units 30 of different light-emitting colors are encapsulated independently.

[0055] In this embodiment, the packaging unit 1611 for encapsulating adjacent light-emitting devices 13 belonging to two sub-pixel units 30 of the same light-emitting color is disconnected from each other. For example, the packaging unit 1611 for encapsulating two adjacent light-emitting devices 13 belonging to different first sub-pixel units 30a is disconnected from each other, so that the light-emitting devices 13 in different sub-pixel units 30 of the same light-emitting color are encapsulated independently.

[0056] Further, please refer to Figure 11 In this embodiment, the display panel 1 further includes a second encapsulation layer 162, which is located on the side of the encapsulation unit 1611 away from the substrate 11. The second encapsulation layer 162 at least covers the encapsulation unit 1611 and fills the insulator opening 12011. Optionally, the second encapsulation layer 162 has a flat surface on the side away from the substrate 11.

[0057] Furthermore, the display panel 1 also includes a third encapsulation layer 163, which is located on the side of the second encapsulation layer 162 away from the substrate 11.

[0058] Optionally, the materials of the first encapsulation layer 161 and the third encapsulation layer 163 include inorganic encapsulation materials, and the material of the second encapsulation layer 162 includes organic encapsulation materials. That is, the first encapsulation layer 161 and the third encapsulation layer 163 are inorganic encapsulation layers, and the second encapsulation layer 162 is an organic encapsulation layer. For example, the first encapsulation layer 161 and the third encapsulation layer 163 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 162 can be formed by inkjet printing (IJP).

[0059] Based on the same inventive concept, please refer to Figure 1 , Figure 2 and Figure 3 This embodiment also provides a display panel. The display panel 1 includes a substrate 11, an isolation structure 12 and a light-emitting device 13. The substrate 11 has a multi-layer structure and includes at least a plurality of metal layers and an insulating layer located between adjacent metal layers. A pixel circuit 20 is formed in the substrate 11 to provide driving signals for the light-emitting device 13.

[0060] An isolation structure 12 is located on one side of the substrate 11 and forms a plurality of isolation openings 1201. Each isolation opening 1201 is divided by the isolation structure 12 within the isolation opening 1201 to form a plurality of isolation sub-openings 12011. The sizes of the plurality of isolation sub-openings 12011 formed by the division can be the same or different. Preferably, the sizes of the plurality of isolation sub-openings 12011 formed by the division are the same. At least a portion of the light-emitting device 13 is located within the isolation sub-opening 12011. The light-emitting device 13 and the isolation sub-opening 12011 are in one-to-one correspondence, that is, one light-emitting device 13 is located within one isolation sub-opening 12011. The light-emitting devices 13 located in different isolation sub-openings 12011 within the same isolation opening 1201 have the same color. A plurality of light-emitting devices 13 located in the same isolation opening 1201 form a sub-pixel unit 30. For example, Figure 2 As shown, two light-emitting devices 13 located in the same isolation opening 1201 can form a sub-pixel unit 30.

[0061] The second electrode of the light-emitting device 13 is electrically connected to the isolation structure 12. In the same sub-pixel unit 30, the second electrodes of adjacent light-emitting devices 13 are connected through electrode connection portions 14. The second electrode and the electrode connection portion 14 can be disposed in the same layer or in different layers. Preferably, the second electrode and the electrode connection portion 14 are disposed in the same layer. Distributing them in the same layer means that the electrode connection portion 14 and the second electrode can be formed by the same process, and the electrode connection portion 14 and the second electrode are made of the same material.

[0062] With this design, when the driving currents of different light-emitting devices 13 in the same sub-pixel unit 30 differ greatly, the larger driving current can be shunted by the electrode connection part 14, so that the driving currents of different light-emitting devices 13 are roughly the same, and different light-emitting devices 13 have the same luminous brightness, thus improving the display problem caused by uneven brightness.

[0063] Furthermore, the electrode connection portion 14 at least partially covers the surface of the isolation structure 12 between adjacent light-emitting devices 13.

[0064] For details, please refer again. Figure 1 and Figure 5 The isolation opening 1201 includes an adjacent first isolation sub-opening 12011a and a second isolation sub-opening 12011b, and the electrode connection part 14 includes a first electrode connection part 141, a third electrode connection part 143 and a second electrode connection part 142 connected in sequence.

[0065] At the location of the isolation structure 12 between the first isolator opening 12011a and the second isolator opening 12011b, the first electrode connection portion 141 covers the surface of the isolation structure 12 facing the first isolator opening 12011a, the second electrode connection portion 142 covers the surface of the isolation structure 12 facing the second isolator opening 12011b, and the third electrode connection portion 143 is located on the side of the isolation structure 12 away from the substrate 11.

[0066] The second electrode 133 of the light-emitting device 13 in the first isolator opening 12011a is connected to the first electrode connection sub-part 141, and the second electrode 133 of the light-emitting device 13 in the second isolator opening 12011b is connected to the second electrode connection sub-part 142.

[0067] In the above design, even if the second electrode of one light-emitting device 13 is corroded, it is difficult to corrode the second electrode of another light-emitting device 13 through the electrode connection portion 14 because the electrode connection portion 14 is relatively long.

[0068] Based on the same inventive concept, this embodiment also provides a method for manufacturing a display panel, please refer to... Figure 12 and Figure 13 ,in, Figure 12 A schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment is illustrated. Figure 13 Example Figure 12 The corresponding process flow diagram is shown below. Figure 12 and Figure 13 The method for manufacturing the display panel provided in this embodiment is described in detail.

[0069] Step S110: Provide a substrate 11.

[0070] The substrate 11 has a multi-layer structure, including at least a plurality of metal layers and an insulating layer located between adjacent metal layers. A pixel circuit is formed in the substrate 11 to provide driving signals for the light-emitting device 13.

[0071] In step S120, an isolation structure 12 and an isolation opening 1201 are fabricated on one side of the substrate 11.

[0072] In detail, step S120 can be implemented as follows: First, an isolation structure material layer is fabricated on the substrate 11. The isolation structure material layer may include multiple stacked metal layers. For example, the isolation structure material layer may include a molybdenum metal layer, an aluminum metal layer, and a titanium metal layer stacked sequentially. Next, the isolation structure material layer is patterned to form an isolation structure 12 with an undercut structure, based on the different etching rates of different metal layers for different etching materials. The isolation structure 12 then encloses an isolation opening. Each isolation opening includes multiple isolation sub-openings 12011.

[0073] Step S130: A light-emitting device is fabricated in the isolation sub-opening 12011. A sub-pixel unit is formed by light-emitting devices 13 of the same light-emitting color from different isolation sub-openings 12011 in the same isolation opening, and different light-emitting devices 13 in the same sub-pixel unit are connected in parallel.

[0074] In this embodiment, please refer to Figure 14 Step S130 can be implemented in the following way.

[0075] First, a light-emitting material layer 132 is placed on the substrate 11 on the side where the isolation structure 12 is located.

[0076] Specifically, the luminescent material layer 132 can be deposited on the entire surface by vapor deposition.

[0077] Next, a conductive layer 40 is fabricated on the side of the light-emitting material layer 132 away from the substrate 11 and on the exposed surface of the isolation structure by physical vapor deposition. The conductive layer 40 is continuously distributed on the surfaces of the light-emitting material layer 132 and the isolation structure 12.

[0078] Then, an inorganic encapsulation material layer 50 covering the conductive layer 40 is fabricated.

[0079] The inorganic encapsulation material layer 50 covering the conductive layer 40 can be fabricated by chemical vapor deposition.

[0080] Finally, the inorganic encapsulation material layer 132, the conductive layer 40 and the light-emitting material layer 50 are patterned to form a light-emitting device 13 located in the isolation sub-opening 12011 and an encapsulation unit 1611 for encapsulating the light-emitting device 13, and an electrode connection portion 14 connecting the second electrodes of two adjacent light-emitting devices in the same sub-pixel unit is formed.

[0081] The second electrode and the electrode connection portion of the light-emitting device are formed by a conductive layer 40.

[0082] Based on the same inventive concept, embodiments of this application also provide an electronic device, which includes the display panel provided in this application. The electronic device may include smartphones, tablets, in-vehicle display devices, smart wearable devices, televisions, laptops, and other devices with display functions.

[0083] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. In the display panel, different light-emitting devices in the same sub-pixel unit are connected in parallel. When the current on a light-emitting device in a certain parallel branch is large, some of the current can be diverted through other parallel branches, so that the current on multiple parallel branches is basically the same. This ensures that different light-emitting devices in the same sub-pixel unit have the same display brightness, solves the problem of uneven display brightness caused by process differences in light-emitting devices in the same sub-pixel unit, and improves the display effect of the display panel.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; An isolation structure is located on one side of the substrate and forms a plurality of isolation openings, wherein each isolation opening is divided by an isolation structure located within the isolation opening to form a plurality of isolation sub-openings; A light-emitting device is located within the isolation sub-opening. Light-emitting devices of the same color that are located in different isolation sub-openings within the same isolation opening form a sub-pixel unit. In the same sub-pixel unit, different light-emitting devices are connected in parallel.

2. The display panel as described in claim 1, characterized in that, The display panel further includes a pixel defining layer, which is located on the side of the isolation structure facing the substrate, and the isolation structure is located on the side of the pixel defining layer away from the substrate; The pixel defining layer has a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolator opening on the substrate. At least a portion of the light-emitting devices are located within the pixel opening. Preferably, the pixel defining layer is an inorganic pixel defining layer; Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride.

3. The display panel as described in claim 2, characterized in that, In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode stacked together; wherein the second electrode is electrically connected to the isolation structure. The first electrode is disposed on the side of the pixel defining layer near the substrate, and at least a portion of the first electrode is exposed through the pixel opening; In the same sub-pixel unit, the second electrodes of adjacent light-emitting devices are connected to each other; Preferably, the isolation opening includes 2-4 isolation sub-openings.

4. The display panel as described in claim 3, characterized in that, The display panel further includes an electrode connection portion, in which the second electrodes of adjacent light-emitting devices are connected through the electrode connection portion in the same sub-pixel unit; The electrode connection portion and the second electrode are disposed in the same layer; Preferably, the electrode connection portion and the second electrode are made of the same material.

5. The display panel as described in claim 4, characterized in that, The electrode connection portion at least partially covers the surface of the isolation structure between adjacent light-emitting devices; The isolation opening includes an adjacent first isolation sub-opening and a second isolation sub-opening, and the electrode connection part includes a first electrode connection part, a third electrode connection part and a second electrode connection part connected in sequence; At the location of the isolation structure between the first isolator opening and the second isolator opening, the first electrode connection portion covers the surface of the isolation structure facing the first isolator opening, the second electrode connection portion covers the surface of the isolation structure facing the second isolator opening, and the third electrode connection portion is located on the side of the isolation structure away from the substrate; The second electrode of the light-emitting device inside the first isolator opening is connected to the first electrode connection part, and the second electrode of the light-emitting device inside the second isolator opening is connected to the second electrode connection part.

6. The display panel as described in claim 5, characterized in that, The display panel further includes a filling layer disposed between the third electrode connection sub-part and the isolation structure; The filling layer, the light-emitting material layer of the light-emitting device in the first isolation sub opening, and the light-emitting material layer of the light-emitting device in the second isolation sub opening are all made of the same material. Preferably, the display panel further includes a first connecting portion and a second connecting portion, wherein on the side of the first isolating sub-opening away from the second isolating sub-opening, the first connecting portion covers the surface of the isolation structure facing the first isolating sub-opening; On the side of the second isolator opening away from the first isolator opening, the second connecting portion covers the surface of the isolation structure facing the second isolator opening; Preferably, the first connecting portion is connected to the second electrode of the light-emitting device inside the first isolator opening, and the second connecting portion is connected to the second electrode of the light-emitting device inside the second isolator opening; Preferably, the first connecting portion, the second connecting portion, and the electrode connecting portion are disposed in the same layer.

7. The display panel as described in claim 5, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion stacked together. The second isolation portion is disposed on the side of the first isolation portion away from the substrate. The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate. Preferably, the first isolation part is a conductive isolation part, and the second electrode is connected to the surface of the first isolation part facing the corresponding insulator opening; Preferably, the isolation structure further includes a third isolation portion, wherein the third isolation portion, the first isolation portion, and the second isolation portion are stacked sequentially in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the third isolation portion is a conductive isolation portion, and the second electrode is also connected to the third isolation portion; Preferably, at the isolation structure location between the first isolator opening and the second isolator opening, the first electrode connection portion extends from the surface of the first isolation portion toward the first isolator opening to the surface of the second isolation portion toward the substrate. The second electrode connection portion extends from the surface of the first isolation portion toward the opening of the second isolation portion to the surface of the second isolation portion toward the substrate; Preferably, the material of the first isolation part includes aluminum, silver or copper, the material of the second isolation part includes titanium or molybdenum, and the material of the third isolation part includes molybdenum or titanium.

8. The display panel as described in claim 5, characterized in that, The display panel further includes a first encapsulation layer, which includes a plurality of encapsulation units, the encapsulation units being used to encapsulate the light-emitting devices within the isolation sub-opening; Within the same sub-pixel unit, the packaging units used to encapsulate adjacent light-emitting devices are connected to each other; The encapsulation unit at least covers the surface of the electrode connection portion; Preferably, the orthographic projection of the electrode connection portion on the substrate is located within the orthographic projection of the packaging unit on the substrate.

9. The display panel as described in claim 8, characterized in that, The packaging units used to encapsulate adjacent light-emitting devices belonging to different sub-pixel units are disconnected from each other; Preferably, the packaging units used to encapsulate adjacent light-emitting devices belonging to two sub-pixel units of different light-emitting colors are disconnected from each other; Preferably, the packaging units used to encapsulate adjacent light-emitting devices belonging to two sub-pixel units of the same emitting color are disconnected from each other.

10. The display panel as claimed in claim 9, characterized in that, The display panel further includes a second encapsulation layer, which is located on the side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covers the encapsulation unit; Preferably, the second encapsulation layer includes a flat surface on the side away from the substrate; Preferably, the display panel further includes a third encapsulation layer, the third encapsulation layer being located on the side of the second encapsulation layer away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

11. A display panel, characterized in that, The display panel includes: substrate; An isolation structure is located on one side of the substrate and forms a plurality of isolation openings, wherein each isolation opening is divided by an isolation structure located within the isolation opening to form a plurality of isolation sub-openings; A light-emitting device is located within the isolation sub-opening. Light-emitting devices of the same color located in different isolation sub-openings within the same isolation opening form a sub-pixel unit, wherein the second electrode of the light-emitting device is connected to the isolation structure. In the same sub-pixel unit, the second electrodes of adjacent light-emitting devices are connected through an electrode connection portion, wherein the second electrode and the electrode connection portion are disposed in the same layer.

12. The display panel as claimed in claim 11, characterized in that, The electrode connection portion at least partially covers the surface of the isolation structure between adjacent light-emitting devices; The isolation opening includes an adjacent first isolation sub-opening and a second isolation sub-opening, and the electrode connection part includes a first electrode connection part, a third electrode connection part and a second electrode connection part connected in sequence; At the location of the isolation structure between the first isolator opening and the second isolator opening, the first electrode connection portion covers the surface of the isolation structure facing the first isolator opening, the second electrode connection portion covers the surface of the isolation structure facing the second isolator opening, and the third electrode connection portion is located on the side of the isolation structure away from the substrate; The second electrode of the light-emitting device inside the first isolator opening is connected to the first electrode connection part, and the second electrode of the light-emitting device inside the second isolator opening is connected to the second electrode connection part.

13. A method for manufacturing a display panel, characterized in that, The method includes: Provide a substrate; An isolation structure and an isolation opening are formed on one side of the substrate, wherein each isolation opening includes multiple isolation sub-openings; Light-emitting devices are fabricated within the isolation sub-openings. A sub-pixel unit is formed by light-emitting devices of the same color from different isolation sub-openings in the same isolation opening, and different light-emitting devices in the same sub-pixel unit are connected in parallel.

14. The method for manufacturing a display panel as described in claim 13, characterized in that, The step of fabricating a light-emitting device within the opening of the isolator includes: A light-emitting material layer is fabricated on the substrate on the side where the isolation structure is located; A continuously distributed conductive layer is formed on the side of the luminescent material layer away from the substrate and on the exposed surface of the isolation structure by physical vapor deposition. Fabricate an inorganic encapsulation material layer covering the conductive layer; The inorganic encapsulation material layer, the conductive layer, and the light-emitting material layer are patterned to form a light-emitting device located within the isolation sub-opening and an encapsulation unit for encapsulating the light-emitting device. An electrode connection portion is formed to connect the second electrodes of two adjacent light-emitting devices in the same sub-pixel unit, wherein the second electrode of the light-emitting device and the electrode connection portion are formed by the conductive layer.

15. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-12, or a display panel prepared by the method described in any one of claims 13-14.

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