Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation layer arranged on one side of the substrate, a dam arranged on the side, away from the substrate, of the isolation structure, a plurality of light-emitting units arranged on one side of the substrate, and an encapsulation structure arranged on the side, away from the substrate, of the light-emitting units; the isolation layer comprises an isolation structure and a plurality of isolation openings; the orthographic projection of the dam on the substrate is located in the orthographic projection of the isolation structure on the substrate; the dam is arranged between at least part of two adjacent isolation openings; the plurality of light-emitting units are arranged in correspondence with the plurality of isolation openings, and at least part of the light-emitting units is arranged in the corresponding isolation opening. The display panel can improve the photoresist missing problem and improve the display effect of the display panel by arranging the dam on the isolation layer.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising next-generation flat panel display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant aspects of fine metal mask-less technology and are provided for reference.

[0004] However, current OLED display panels still suffer from display defects. Summary of the Invention

[0005] Therefore, it is necessary to provide a display panel, a method for manufacturing the display panel, and a display device that improves upon the above-mentioned problems.

[0006] In a first aspect, this application provides a display panel, including:

[0007] substrate;

[0008] An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure.

[0009] A dam is provided on the side of the isolation structure opposite to the substrate, and the orthographic projection of the dam on the substrate is located within the orthographic projection of the isolation structure on the substrate; the dam is provided between at least two adjacent isolation openings;

[0010] Multiple light-emitting units are disposed on one side of the substrate; the multiple light-emitting units are correspondingly disposed with the multiple isolation openings, at least a portion of the light-emitting units are disposed in the corresponding isolation openings, and each light-emitting unit has an encapsulation structure on the side away from the substrate.

[0011] The display panel structure design described in this application embodiment allows for the protrusion of the light-emitting material layer or encapsulation material layer deposited later on the upper surface of the isolation structure by setting a dam, thereby forming an encapsulation dam. This allows the photoresist FP to be confined within the encapsulation dam, increasing the adhesion and contact area between the photoresist FP and the surface of the encapsulation structure.

[0012] In one embodiment, a dam is provided between any two adjacent isolation openings;

[0013] Optionally, the dam includes a dam structure and multiple inner dam zones enclosed by the dam structure. The multiple inner dam zones are correspondingly arranged with the multiple isolation openings. The dam structure is correspondingly arranged with the isolation structure. The orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the inner dam zone on the substrate.

[0014] In one embodiment, the dam is provided at least around the outer periphery of at least a portion of the isolation opening;

[0015] Optionally, the dike includes multiple sub-dikes, which are correspondingly arranged with respect to the multiple isolation openings.

[0016] Optionally, the sub-dam is constructed around at least a portion of the outer periphery corresponding to the isolation opening;

[0017] Optionally, the sub-dam includes a plurality of sub-sections, which are spaced apart and surround at least a portion of the periphery of the corresponding isolation opening.

[0018] In one embodiment, the plurality of sub-dams are configured in a one-to-one correspondence with the plurality of isolation openings;

[0019] Optionally, the plurality of sub-dams include a first sub-dam and a plurality of second sub-dams; the first sub-dam includes a first dam structure and a plurality of inner zones of the first dam formed by the enclosing first dam structure, the plurality of inner zones of the first dam being correspondingly arranged with the plurality of isolation openings, the first dam structure being correspondingly arranged with the isolation structure, and the orthographic projection of the isolation opening on the substrate being located within the orthographic projection of the inner zone of the first dam on the substrate; the plurality of second sub-dams are corresponding one-to-one with the plurality of isolation openings.

[0020] In one embodiment, in two adjacent isolation openings, there is a distance between the side of the dam closest to one isolation opening and the boundary of the isolation opening, and there is a distance between the side of the dam closest to the adjacent isolation opening and the boundary of the adjacent isolation opening.

[0021] Optionally, in two adjacent isolation openings, the distance between the side of the dam closest to one isolation opening and the boundary of the isolation opening is the same as the distance between the side of the dam closest to the adjacent isolation opening and the boundary of the adjacent isolation opening.

[0022] Optionally, in two adjacent isolation openings, the distance between the side of the dam closest to one isolation opening and the boundary of the isolation opening is greater than the distance between the side of the dam closest to the adjacent isolation opening and the boundary of the adjacent isolation opening.

[0023] In one embodiment, the dimension of the dam along the thickness direction of the substrate is greater than or equal to the dimension of the encapsulation structure along the thickness direction of the substrate; the dimension of the dam along the arrangement direction of the adjacent isolation openings is less than the dimension of the isolation structure along the arrangement direction of the adjacent isolation openings.

[0024] Optionally, the dimension of the dam along the thickness direction of the substrate is greater than or equal to 0.6 nanometers;

[0025] Optionally, the ratio of the dimension of the dam along the arrangement direction of the adjacent isolation opening to the dimension of the isolation structure along the arrangement direction of the adjacent isolation opening is greater than or equal to 1 / 5 and less than or equal to 3 / 5.

[0026] In one embodiment, the dam has an uneven structure on its side surface near the isolation opening, and the uneven structure contacts the encapsulation structure.

[0027] In one embodiment, the orthographic projection of the dam on the substrate at least partially surrounds the orthographic projection of the encapsulation structure on the substrate.

[0028] In one embodiment, the dam is made of metallic or inorganic materials.

[0029] In one embodiment, the display panel further includes: a pixel defining layer disposed on one side of the substrate, the pixel defining layer having a plurality of pixel openings; the plurality of isolation openings correspondingly communicating with the plurality of pixel openings; the orthographic projection of the pixel openings on the substrate is located within the orthographic projection of the isolation openings on the substrate.

[0030] Secondly, this application also provides a display panel, including:

[0031] substrate;

[0032] An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure.

[0033] A dam is located on the side of the isolation structure opposite to the substrate, and includes a dam structure and multiple inner dam areas enclosed by the dam structure. The multiple inner dam areas are correspondingly arranged with the multiple isolation openings. The dam structure is correspondingly arranged with the isolation structure. The orthographic projection of the dam structure on the substrate is located within the orthographic projection of the isolation structure on the substrate. The orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the inner dam area on the substrate.

[0034] Multiple light-emitting units are disposed on one side of the substrate; the multiple light-emitting units are correspondingly disposed with the multiple isolation openings, at least a portion of the light-emitting units are disposed in the corresponding isolation openings, and each light-emitting unit has an encapsulation structure on the side away from the substrate.

[0035] Thirdly, this application also provides a method for manufacturing a display panel, the method comprising:

[0036] Provide substrate;

[0037] An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes;

[0038] A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate. An isolation material layer is formed on the side of the pixel material layer facing away from the substrate. A dam material layer is formed on the side of the isolation material layer facing away from the substrate. The dam material layer, the isolation material layer, and the pixel material layer are subjected to a second patterning process to form a dam layer, an isolation layer, and a pixel defining layer. The orthographic projection of the dam on the substrate is located within the orthographic projection of the isolation structure on the substrate. The dam is disposed between at least two partially adjacent isolation openings. The isolation layer includes an isolation structure and a plurality of isolation openings enclosed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of isolation openings are correspondingly connected to the plurality of pixel openings. The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0039] A light-emitting material layer is formed on the side of the isolation layer away from the substrate, an electrode material layer is formed on the side of the light-emitting material layer away from the substrate, an encapsulation material layer is formed on the side of the electrode material layer away from the substrate, and a photoresist material layer is formed on the side of the encapsulation material layer away from the substrate. The photoresist material layer is subjected to a third patterning process to form multiple photolithographic structures.

[0040] The encapsulation material layer, the electrode material layer, and the light-emitting material layer are subjected to a fourth patterning process to form multiple encapsulation structures, multiple second electrodes, and multiple light-emitting structures; wherein, the multiple second electrodes are correspondingly disposed with the multiple isolation openings, the multiple light-emitting structures are correspondingly disposed with the multiple isolation openings, at least a portion of the second electrode is disposed within the corresponding isolation opening, and at least a portion of the light-emitting structure is disposed within the corresponding isolation opening.

[0041] In one embodiment, the second patterning process of the dam material layer, the isolation material layer, and the pixel material layer to form the dam layer, the isolation layer, and the pixel defining layer includes:

[0042] The dam material layer and the isolation material layer are subjected to a fifth graphical processing to form an intermediate dam layer and an intermediate isolation layer.

[0043] The intermediate layer of the dam is subjected to a sixth graphical processing to form the dam.

[0044] The isolation intermediate layer is subjected to a seventh graphical processing to form the isolation layer;

[0045] The pixel material layer is subjected to an eighth patterning process to form the pixel definition layer.

[0046] In one embodiment, the method further includes:

[0047] The plurality of photolithographic structures are peeled off from the side of the first packaging structure away from the substrate.

[0048] The display panel manufacturing method provided in this application embodiment sets a dam on the isolation layer, and the encapsulation structure on the isolation layer also has an encapsulation dam, thereby confining the photolithography structure within the area enclosed by the encapsulation dam, enhancing the contact area and adhesion between the photolithography structure and the encapsulation structure, improving the problem of missing photolithography structure, ensuring the light emission effect of the light-emitting unit, and making the display panel display well.

[0049] Fourthly, embodiments of this application provide a display device, including the display panel described in the first aspect, or the display panel described in the second aspect, or the display panel prepared according to the preparation method described in the third aspect. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 One of the partial top views of the display panel provided in the embodiments of this application;

[0052] Figure 2 One of the partial cross-sectional views of the display panel provided in the embodiments of this application;

[0053] Figure 3 A second partial top view of the display panel provided in an embodiment of this application;

[0054] Figure 4 A second partial cross-sectional view of the display panel provided in an embodiment of this application;

[0055] Figure 5 A third partial top view of the display panel provided in an embodiment of this application;

[0056] Figure 6 Fourth partial top view of the display panel provided in the embodiments of this application;

[0057] Figure 7 Fifth partial top view of the display panel provided in the embodiments of this application;

[0058] Figure 8 A third partial cross-sectional view of the display panel provided in an embodiment of this application;

[0059] Figure 9 A partial top view of the display panel provided in the embodiments of this application;

[0060] Figure 10 A partial top view of the display panel provided in an embodiment of this application;

[0061] Figure 11 Eighth partial top view of the display panel provided in the embodiments of this application;

[0062] Figure 12 Ninth partial top view of the display panel provided in the embodiments of this application;

[0063] Figure 13 Tenth partial top view of the display panel provided in the embodiments of this application;

[0064] Figure 14Eleventh partial top view of the display panel provided in the embodiments of this application;

[0065] Figure 15 Fourth partial cross-sectional view of the display panel provided in the embodiments of this application;

[0066] Figure 16 One of the flowcharts for a method of manufacturing a display panel provided in an embodiment of this application;

[0067] Figure 17 This is one of the process flow diagrams for the manufacturing method of the display panel provided in the embodiments of this application;

[0068] Figure 18 A second process flow diagram of the method for manufacturing a display panel provided in this application embodiment;

[0069] Figure 19 A second flowchart illustrating the method for manufacturing a display panel provided in this application embodiment;

[0070] Figure 20 The third flowchart illustrating the method for manufacturing a display panel provided in this application embodiment;

[0071] Figure 21 The third process flow diagram of the method for manufacturing the display panel provided in the embodiments of this application;

[0072] Explanation of reference numerals in the attached figures:

[0073] 10. Display panel; 11. Substrate; 12. Isolation layer; 121. Isolation structure; 122. Isolation opening

[0074] 121a, First membrane layer; 121b, Second membrane layer; 121c, Third membrane layer; 123, Isolation material layer; 123a, First membrane material layer; 123b, Second membrane material layer; 123c, Third membrane material layer; 124, Isolation intermediate layer; 13, Dam; 131, Dam structure; 132, Inner area of ​​dam; 133, Sub-dam; 133a, Sub-section; 133b, First sub-dam; 133b1, First dam structure; 133b2, Inner area of ​​first dam; 133c, Second sub-dam; 134, Dam layer; 14, Light-emitting unit; 141, First light-emitting unit 142. Second light-emitting unit; 143. Third light-emitting unit; 144. Light-emitting material layer; 145. Electrode material layer; 14a. First electrode; 14b. Light-emitting structure; 14c. Second electrode; 15. Encapsulation structure; 151. Encapsulation material layer; 16. Pixel limiting layer; 161. Pixel aperture; 162. Pixel material layer; 17. Photoresist material layer; 171. Photolithography structure; 181a. First light-emitting area; 181b. Second area; 182a. Third light-emitting area; 182b. Fourth area; 183a. Fifth light-emitting area; 183b. Sixth area. Detailed Implementation

[0075] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0076] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0078] In related technologies, the ViP structure uses full-surface vapor deposition and photolithography to pattern the R, G, and B pixels in the display panel. Typically, a photoresist layer (PR) is formed on the pixel's encapsulation layer CVD1. During dry etching, the PR protects the CVD1 encapsulation layer that needs to be retained and removes the unwanted CVD1. If the photoresist PR is missing during dry etching, the CVD1 that needs to be retained will be etched away, leading to CVD1 encapsulation failure and even pixel failure, thus reducing the display panel's display effect. Generally, the adhesion between the photoresist PR and the smooth inorganic encapsulation layer CVD1 is poor, easily leading to PR defects during the photolithography process after vapor deposition. These defects appear as crescent-shaped defects along the boundary between the pixel area and the VSS isolation pillar, causing the CVD1 film to be etched away in the subsequent dry etching process. Wet etching solutions and stripping solutions can then penetrate the pixel area, damaging the pixels and causing dark spots on the display panel, further reducing its display effect.

[0079] In view of the above problems, this application provides a display panel, a method for manufacturing the display panel, and a display device to improve the problems of poor CVD1 encapsulation effect and poor display caused by the absence of photoresist PR.

[0080] The following describes the display panel 10 provided in the embodiments of this application.

[0081] refer to Figure 1 The top view shown and Figure 2 The cross-sectional view ( Figure 2 and Figure 1(This description uses three light-emitting units as an example only.) This application provides a display panel 10, which includes a substrate 11, an isolation layer 12, a dam 13, and a plurality of light-emitting units 14. The isolation layer 12 is disposed on one side of the substrate 11 and includes an isolation structure 121 and a plurality of isolation openings 122 formed by the isolation structure 121. The dam 13 is disposed on the side of the isolation structure 121 away from the substrate 11, and the orthographic projection of the dam 13 on the substrate 11 is located within the orthographic projection of the isolation structure 121 on the substrate 11. A dam is provided between at least two adjacent isolation openings 122. The plurality of light-emitting units 14 are disposed on one side of the substrate 11, and the plurality of light-emitting units 14 are correspondingly disposed with the plurality of isolation openings 122. At least a portion of the light-emitting units 14 are disposed within the corresponding isolation openings 122. Each light-emitting unit 14 is provided with an encapsulation structure 15 on the side away from the substrate 11. This explains that when a portion of the light-emitting unit 14 is disposed within the corresponding isolation opening 122, another portion 181b is disposed on the side of the isolation structure 121 corresponding to the light-emitting unit 14 facing away from the substrate 11. In other words, the space between the encapsulation structure 15, the isolation structure 121, and the dam 13 is filled with light-emitting material, and the light-emitting material filling this space is the same as the light-emitting material contained within the same light-emitting unit. For example, Figure 2 The first light-emitting unit 141 shown contains a light-emitting material that emits red light. Figure 2 The light-emitting material filling the space between the encapsulation structure 15, the isolation structure 121, and the dam 13 corresponding to the first light-emitting unit 141 is also a light-emitting material that emits red light (i.e., Figure 2 The luminescent material contained in the first luminescent region marked 181a is the same as the luminescent material contained in the second region marked 181b; Figure 2 The luminescent material contained in the third luminescent region marked 182a is the same as the luminescent material contained in the fourth region marked 182b; Figure 2 (The luminescent material contained in the fifth luminescent region marked 183a is the same as the luminescent material contained in the sixth luminescent region marked 183b). Furthermore, the luminescent materials surrounding the first luminescent unit 141, the second luminescent unit 142, and the third luminescent unit 143 are different, for example... Figure 2 The light-emitting material surrounding the first light-emitting unit 141 is a light-emitting material that emits red light, the light-emitting material surrounding the second light-emitting unit 142 is a light-emitting material that emits green light, and the light-emitting material surrounding the second light-emitting unit 143 is a light-emitting material that emits blue light (i.e., Figure 2 The luminescent material contained in the second region of the I181b designation, the luminescent material contained in the fourth region of the I182b designation, and the luminescent material contained in the sixth region of the I183b designation are different. It should also be noted that... Figure 1This refers to a display panel where all pixels have been etched and patterned. It should be noted that... Figure 2 , Figure 4 and Figure 5 The example shown is a pixel limiting layer 16, which is only for illustrative purposes. In actual applications, the display panel may not include a pixel limiting layer, and this example does not limit this.

[0082] The display panel 10 can be an organic light-emitting diode (OLED) display panel, a micro organic light-emitting diode (Micro OLED) display panel, a light-emitting diode (LED) display panel, a quantum dot light-emitting diode (QLED) display panel, a mini light-emitting diode (MiniLED) display panel, a micro light-emitting diode (Micro LED) display panel, or a liquid crystal display (LCD) display panel, etc. This application uses an OLED display panel as an example for illustration.

[0083] In some embodiments, substrate 11 may provide support for subsequent layers of film.

[0084] In some embodiments, multiple light-emitting units 14 may be arranged in an array. Each light-emitting unit 14 may include an emission layer (EML). The light-emitting unit 13 may also include one or more of the following: a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL). Alternatively, the light-emitting unit 13 may be a stacked light-emitting structure, i.e., it may include at least two light-emitting layers and a charge generation layer (CGL) located between adjacent light-emitting layers.

[0085] In some embodiments, multiple light-emitting units 14 are used to emit light of different colors. For example, three light-emitting units 14 can be respectively a light-emitting unit emitting red light, a light-emitting unit emitting green light, and a light-emitting unit emitting blue light; as another example, multiple light-emitting units 14 may include multiple first light-emitting units 141, multiple second light-emitting units 142, and multiple third light-emitting units 143. This embodiment of the application uses the example of first light-emitting units 141 emitting red light, second light-emitting units 142 emitting green light, and third light-emitting units 143 emitting blue light for illustration. In other examples, multiple light-emitting units 14 may also include light-emitting units emitting white light. See also... Figure 1 and 2 The multiple light-emitting units 14 include a first light-emitting unit 141 that emits blue light, a second light-emitting unit 142 that emits green light, and a third light-emitting unit 143 that emits red light.

[0086] In some embodiments, the light-emitting unit 14 includes a first electrode 14a, a light-emitting structure 14b, and a second electrode 14c stacked together; one of the first electrode 14a and the second electrode 14c can be an anode, and the other of the first electrode 14a and the second electrode 14c can be a cathode. This application embodiment uses the example of the first electrode 14a being the anode and the second electrode 14c being the cathode. In this application embodiment, a portion of the second electrode 14c and the light-emitting structure 14b are disposed within the isolation opening 122 and on the side of the first electrode 14a facing away from the substrate 11; a portion of the second electrode 14c and the light-emitting structure 14b are disposed on the side of the isolation structure 121 facing away from the substrate 11.

[0087] In some embodiments, the first electrode 14a may be electrically connected to a pixel driving circuit, which may be electrically connected to a first power line. The second electrode 14c may be electrically connected to a second power line. One of the first and second power lines is used to transmit a high voltage, and the other is used to transmit a low voltage. For example, the first power line is used to transmit a high voltage, and the second power line is used to transmit a low voltage.

[0088] In some embodiments, the isolation structure 121 may refer to an undercut structure that is wider at the top and narrower at the bottom, capable of separating adjacent light-emitting units 14. The isolation structure 121 can be a structure formed by a single film layer or a structure formed by stacking multiple film layers. For example, the cross-sectional shape of the isolation structure 121 can be an inverted trapezoid, a "T" shape, or an "I" shape, etc., wider at the top and narrower at the bottom. In the embodiments of this application, the isolation structure 121 can be a structure formed by two film layers or a structure formed by three film layers. Figure 2 The isolation structure 121 in the text is only an example and does not limit the number of membrane layers contained in the isolation structure 121. For example, the isolation structure 121 can also be a structure formed by two membrane layers.

[0089] Optionally, each isolation structure 121 includes a first film layer 121a, a second film layer 121b, and a third film layer 121c stacked along a direction away from the substrate 11. The orthographic projection of the second film layer 121b onto the substrate 11 lies within the orthographic projection of the third film layer 121c onto the substrate 11, that is, the outer contour of the orthographic projection of the third film layer 121c onto the substrate 11 lies outside the outer contour of the orthographic projection of the second film layer 121b onto the substrate 11. This results in the isolation structure 121 forming an "I"-shaped structure, that is, the isolation structure 121 has an "eaves" and a "base". Thus, during the formation of the isolation opening 122, the isolation structure 121 can isolate the light-emitting unit 14 within two adjacent isolation openings 122, and can also isolate two adjacent isolation openings 122.

[0090] Optionally, at least one of the first film layer 121a, the second film layer 121b, and the third film layer 121c may be made of a conductive material. The material of at least one of the first film layer 121a, the second film layer 121b, and the third film layer 121c may include metals such as titanium, silver, copper, aluminum, and molybdenum, or alloys, or conductive oxides, such as any one or more of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), zinc gallium oxide, titanium tantalum oxide, tin oxide, cadmium oxide, and indium oxide. For example, the isolation structure 121 may be a ground wire isolation structure, i.e., a VSS isolation structure. In other examples, at least one of the first film layer 121a, the second film layer 121b, and the third film layer 121c may be made of an insulating material; this embodiment of the application does not limit this.

[0091] Optionally, in embodiments where at least one of the first film layer 121a, the second film layer 121b, and the third film layer 121c is made of a conductive material, the second electrode in the light-emitting unit 14 can be electrically connected to the isolation structure 121. This facilitates the electrical connection of the second electrode to the power line via the isolation structure 121, thereby optimizing the wiring layout of the display panel 10. For example, the material of the first film layer 121a may include at least one of titanium and molybdenum. For example, the material of the second film layer 121b may include at least one of aluminum, copper, and silver. For example, the material of the third film layer 121c may include at least one of titanium and molybdenum.

[0092] In embodiments where at least one of the first film layer 121a, the second film layer 121b, and the third film layer 121c is made of a conductive material, the second electrode (e.g., a cathode) of the light-emitting unit 14 can be electrically connected to the partition structure 121. This facilitates the electrical connection of the second electrode to the second power line via the partition structure 121, thereby optimizing the wiring layout of the display panel 1.

[0093] In embodiments where the material of the second film layer 121b is a conductive material, the second electrode can be electrically connected to the second film layer 121b. In this way, the second electrodes in the light-emitting units located in each isolation opening 122 can be connected into a whole through the second film layer 121b and connected to the second power line for applying power supply voltage to the second electrode, thereby optimizing the wiring layout of the display panel 1.

[0094] In embodiments where the material of the first film layer 121a is a conductive material, the second electrode of the light-emitting unit can be electrically connected to the first film layer 121a. This allows each second electrode to be connected to a second power line via the first film layer 121a, thereby optimizing the wiring layout of the display panel 1.

[0095] In embodiments where both the first film layer 121a and the second film layer 121b are made of conductive materials, the second electrode of the light-emitting unit can be electrically connected to at least one of the first film layer 121a and the second film layer 121b, thereby optimizing the wiring layout of the display panel 10. For example, the second electrode of the light-emitting unit can be connected to both the first film layer 121a and the second film layer 121b, thereby improving the connection stability between the second electrode and the partition structure 121. One of the first electrode 13 and the second electrode can be an anode, and the other of the first electrode and the second electrode can be a cathode. This application embodiment uses an anode as the first electrode and a cathode as an example for explanation.

[0096] In some embodiments, the encapsulation structure 15 is an inorganic film layer used to protect the light-emitting unit 14.

[0097] In some embodiments, the dam 13 can be made of metallic materials, such as Ag / Al / Mo / Ti / Zn / Cu, etc., or inorganic materials, such as SiN / SiO / SiON, etc. The cross-sectional shape of the dam 13 can be square, rectangular, triangular, trapezoidal, etc. Figure 2The example uses a rectangular cross-sectional shape for the dam 13, but this shape is not limited. The number of dams 13 placed between two adjacent isolation openings can be one or more. When there is only one dam 13 between two adjacent isolation openings, two adjacent pixels share one dam, meaning two adjacent isolation openings share the same dam 13. When there are multiple dams 13 between two adjacent isolation openings, individual pixels can be designed with their own dams, meaning each isolation opening corresponds to a separate dam.

[0098] In some embodiments, see Figure 2 As shown, the orthographic projection of the dam 13 on the substrate 11 lies within the orthographic projection of the isolation structure 121 on the substrate 11. This indicates that the dam 13 is not only disposed on the upper surface of the isolation structure 121, but its length does not exceed the range of the upper surface of the isolation structure 121. Consequently, when the encapsulation structure 15 is deposited on the side of the dam 13 facing away from the isolation structure 121, it can protrude at the location of the dam 13 to form an encapsulation dam. See [link to documentation]. Figure 18 The structure of the final step in the process flow shown makes the photoresist FP ( Figure 18 In section 171), the contact area between the photoresist FP and the packaging structure 15 is increased within the packaging dam of the packaging structure 15. This increases the adhesion of the photoresist FP to the packaging structure 15 by increasing the contact area. At the same time, the photoresist FP is also affected by the pressure of the packaging dam, which can enhance the adhesion between the photoresist FP and the surface of the packaging structure 15. This can prevent the photoresist FP from being missing, thereby improving the pixel failure problem caused by the lack of photoresist.

[0099] The display panel structure design described in this application embodiment allows for the protrusion of the light-emitting material layer or encapsulation material layer deposited later on the upper surface of the isolation structure by setting a dam, thereby forming an encapsulation dam. This allows the photoresist FP to be confined within the encapsulation dam, increasing the adhesion and contact area between the photoresist FP and the surface of the encapsulation structure.

[0100] In some embodiments, a dam 13 is provided between at least two partially adjacent isolation openings 122, including: a dam is provided between any two adjacent isolation openings 122. This design has two variations; the first is... (See...) Figure 1 The partial top view shown indicates that for any isolation opening 122, a retaining wall 13 is provided around it; the second type is, see [reference needed]. Figure 3The partial top view shown shows that for any isolation opening 122, a dam 13 is provided around 3 / 4 of its surrounding area. These two design structures ensure that a dam 13 is provided between every two adjacent isolation openings 122, that is, a dam 13 is provided between every two adjacent pixels. This can prevent the photoresist FP on these two pixels from being missing, improve the problem of pixels being easily damaged due to the lack of photoresist FP, and thus avoid displaying dark spots and improve the display effect.

[0101] In some embodiments, see Figure 3 , Figure 4 , Figure 5 , Figure 6 The partial top view of the display panel shown (using three pixels as an example) shows that at least the outer periphery of the partially isolated opening 122 is provided with a dam 13; there are four such design structures, which are described below.

[0102] Optionally, see Figure 1 The partial top view shown and the corresponding Figure 2 The partial cross-sectional view shown indicates that the dam 13 includes a dam structure 131 and multiple inner dam zones 132 enclosed by the dam structure 131. The multiple inner dam zones 132 are correspondingly arranged with multiple isolation openings 122. The dam structure 131 is correspondingly arranged with the isolation structure 121. The orthographic projection of the isolation opening 122 on the base plate 11 lies within the orthographic projection of the inner dam zone 132 on the base plate 11. This design structure includes a dam 13 between any two adjacent isolation openings 122. Essentially the same design, this system features a dam structure 131 surrounding each isolation opening 122, forming a ring around each opening. The area within this ring is the inner dam region 132. This design confines the photoresist FP within the inner dam region 132, completely covering the encapsulation structure within it. This increases the adhesion between the photoresist FP and the surface of the encapsulation structure within the inner dam region 132. (See [link to relevant documentation]). Figure 18 The surfaces of the photoresist FP and the packaging structure in the inner region 132 of the dam refer to the side surface of the packaging structure 15 near the inner region 132 of the dam, and the upper surface of the packaging structure 15 facing away from the substrate 11. Furthermore, the design of the dam structure 131 causes a portion of the packaging structure originally located on the side facing away from the isolation structure 121, or on the side of the light-emitting unit 14 on the isolation structure 121, to be located on the side of the dam structure 131 facing away from the substrate 11. This causes a portion of the packaging structure to protrude, increasing the contact area between the photoresist FP and the packaging structure, thereby improving the adhesion between the photoresist and the packaging structure. This also correspondingly reduces the thickness of the photoresist filling the inner region 132 of the dam, lowering photolithography costs.

[0103] Optionally, the dam 13 includes a plurality of sub-dams 133, corresponding to a plurality of isolation openings 122. The sub-dams 133 enclose the periphery of the corresponding isolation opening 122; optionally, the sub-dams 133 enclose at least a portion of the outer periphery of the corresponding isolation opening 122. For an example of a sub-dam 133 enclosing at least a portion of the outer periphery of a corresponding isolation opening 122, see [example missing]. Figure 3 The partial top view shown and the corresponding Figure 4 The cross-sectional view shown ( Figure 3 (Sectional view of section AA' in the middle) Figure 3 and Figure 4 Around any isolation opening 122, a 3 / 4 dam 13, or sub-dam 133, is designed, forming an arch-shaped dam. The number of isolation openings 122 is the same as the number of sub-dams 133. That is, each isolation opening 122 is provided with an independent sub-dam 133, which is used to protect the pixels or light-emitting units within the isolation opening 122 in the arrangement direction of adjacent isolation openings 122. For a cross-sectional view of the above structural design perpendicular to AA', please refer to... Figure 2 The cross-sectional view described above. It should be noted that... Figure 3 The top view shown indicates that sub-dam 133 has an opening. Figure 3 The opening in the middle is positioned to the left relative to the isolation opening. This opening direction can be any direction that the isolation opening faces; there are no restrictions on the opening direction. Figure 3 This is just an example.

[0104] For example, see Figure 5 The partial top view shown and the corresponding Figure 4 The cross-sectional view shown ( Figure 5 (Sectional view of section AA' in the middle) Figure 5 and Figure 4 A half-dam 13, or sub-dam 133, is designed around any isolation opening 122, forming a corner-shaped dam. The number of isolation openings 122 is the same as the number of sub-dams 133. That is, each isolation opening 122 is provided with an independent sub-dam 133, which is used to protect the pixels or light-emitting units within the isolation opening 122 in the arrangement direction of adjacent isolation openings 122. For a cross-sectional view of the above structural design perpendicular to AA', please refer to... Figure 4 The cross-sectional view described above. It should be noted that... Figure 5 The top view shown has two openings in sub-dam 133. Figure 5 The two openings in the diagram are, relative to the isolation opening, a left opening and a bottom opening. These two openings can be any two adjacent openings of the isolation opening; there are no restrictions on the opening directions. Figure 5 This is just an example.

[0105] For example, see Figure 6The partial top view shown and the corresponding Figure 4 The cross-sectional view shown ( Figure 6 (Sectional view of section AA' in the middle) Figure 6 and Figure 4 Each isolation opening 122 is surrounded by a 1 / 4 dam 13, or sub-dam 133, forming a linear dam. The number of isolation openings 122 is the same as the number of sub-dams 133, meaning each isolation opening 122 has an independent sub-dam 133 to protect the pixels or light-emitting units within that isolation opening 122 in the direction of its arrangement. Regarding the above structural design, sub-dams 133 are not provided in the direction perpendicular to AA'. However, in actual design, sub-dams 133 can be provided in the direction perpendicular to AA', but not in the direction of AA'. Figure 6 This is just an example.

[0106] Alternatively, the sub-dam 133 may be constructed around the corresponding isolation opening 122. For example, see [link to example]. Figure 7 The partial top view shown and the corresponding Figure 8 The cross-sectional view shown ( Figure 7 (Cross-sectional view of section BB' in the middle) Figure 7 and Figure 8 A ring of dams 13, or sub-dams 133, is designed around any isolation opening 122, forming a ring or circular dam. The number of isolation openings 122 is the same as the number of sub-dams 133, meaning that each isolation opening 122 has an independent sub-dam 133 to protect the pixels or light-emitting units within that isolation opening 122 in any arrangement direction of adjacent isolation openings 122. Furthermore, the spacing between the corresponding sub-dams 133 of adjacent isolation openings 122 is set. The spacing between different sub-dams 133 can be the same (due to manufacturing errors, "the same" here is actually approximately the same) or different. A cross-sectional view of the above structural design perpendicular to BB' can also be found... Figure 8 The cross-sectional view mentioned above.

[0107] Optionally, Figure 3 , Figure 5 , Figure 6 and Figure 7 The dams 13 described in the embodiments are all integral continuous structures. In practical applications, the dams 13 can also be point-like structures. Based on this, the dam 13 includes multiple sub-dams 133, and each sub-dam 133 can include multiple sub-sections 133a. The multiple sub-sections 133a are spaced apart, and the multiple sub-sections 133a surround at least part of the periphery of the corresponding isolation opening 122. The spacing between different sub-sections 133a can be the same (due to process errors, "the same" here is actually approximately the same) or different. For example, see Figure 9 , Figure 10 , Figure 11 , Figure 12 The partial top view shown. Figure 9 The structure of the dam 13 shown is similar to Figure 3 The structure of the dam 13 shown is the same, except that the sub-dam 133 includes multiple point-like sub-sections 133a, which are arranged in the three-quarters position around the isolation opening 122. For a detailed description of this type of design structure, please refer to the foregoing. Figure 3 The details of the embodiments are not repeated here; Figure 10 The structure of the dam 13 shown is similar to Figure 5 The structure of the dam 13 shown is the same, except that the sub-dam 133 includes multiple point-like sub-sections 133a, which are arranged at the half-section position around the isolation opening 122. For a detailed description of this type of design structure, please refer to the foregoing. Figure 5 The details of the embodiments are not repeated here; Figure 11 The structure of the dam 13 shown is similar to Figure 6 The structure of the dam 13 shown is the same, except that the sub-dam 133 includes multiple point-like sub-sections 133a, which are arranged in the 1 / 4 position around the isolation opening 122. For a detailed description of this type of design structure, please refer to the foregoing. Figure 6 The details of the embodiments are not repeated here; Figure 12 The structure of the dam 13 shown is similar to Figure 7 The structure of the dam 13 shown is the same, except that the sub-dam 133 includes multiple point-like sub-sections 133a, which are arranged in a ring around the isolation opening 122. For a detailed description of this type of design structure, please refer to the foregoing. Figure 7 The details of the embodiments are not repeated here.

[0108] Optionally, when the dam 13 includes a dam structure 131 and multiple inner zones 132 enclosed by the dam structure 131, for example, Figure 1 The dam 13 described in the embodiment is a continuous structure. In practical applications, the dam 13 can also be a point-like structure. Based on this, see [link to relevant documentation]. Figure 13 As shown, the dam 13 includes multiple sub-dams 133, and each sub-dam 133 may include multiple sub-sections 133a. The multiple sub-sections 133a are spaced apart, and the spacing between different sub-sections 133a can be the same (due to manufacturing errors, this "same" is actually approximately the same) or different. Optionally, the multiple sub-sections 133a are evenly distributed on the surface of the isolation structure 121 facing away from the substrate 11. Multiple sub-sections 133a are provided between adjacent isolation openings 122, and these sub-sections 133a are spaced apart. The spacing between different sub-sections 133a can be the same (due to manufacturing errors, this "same" is actually approximately the same). Regarding... Figure 13 , Figure 11 , Figure 10 , Figure 9 A partial cross-sectional view of the structure described in the embodiment can be found in [reference needed]. Figure 2 and Figure 4 .about Figure 12 A partial cross-sectional view of the structure described in the embodiment can be found in [reference needed]. Figure 8 .

[0109] Optionally, the above Figures 3-12 The design structure of the dam 13 shown illustrates a one-to-one correspondence between multiple sub-dams 133 and multiple isolation openings 122, i.e., one isolation opening 122 corresponds to one sub-dam 133. From the cross-sectional view, it can be seen that there can be one sub-dam 133 between each adjacent isolation opening 122. For example, see [reference needed]. Figures 3-6 , Figures 9-11 The number of sub-dams 133 set between adjacent isolation openings 122 can also be two, for example, see Figures 7-8 , Figure 12 .

[0110] Optionally, the multiple sub-dams 133 and multiple isolation openings 122 are not configured in a one-to-one correspondence, see [reference]. Figure 14 The partial top view shown and Figure 15 The partial cross-sectional view shown indicates that the multiple sub-dams 133 include a first sub-dam 133b and multiple second sub-dams 133c; the first sub-dam 133b includes a first dam structure 133b1 and multiple inner regions 133b2 formed by the enclosed first dam structure 133b1, the multiple inner regions 133b2 are correspondingly arranged with multiple isolation openings 122, the first dam structure 133b1 is correspondingly arranged with the isolation structure 121, and the orthographic projection of the isolation opening 122 on the substrate 11 is located within the orthographic projection of the inner region 133b2 on the substrate 11; the multiple second sub-dams 133c are correspondingly arranged with the multiple isolation openings 122 one by one. In this design structure, each isolation opening 122 corresponds to a second sub-dam 133c, and a first dam structure 133b1 is provided between each adjacent second sub-dam 133c; that is, a first dam structure 133b1 and a second sub-dam 133c are provided between each adjacent isolation opening 122. Figure 15 In cross-section, three dikes are provided between each adjacent isolation opening 122. This is only for illustrative purposes; any number of dikes may be provided between each adjacent isolation opening 122. Furthermore, the multiple dikes provided between each adjacent isolation opening 122 are spaced apart.

[0111] In some embodiments, the placement of the dam 13 between adjacent isolation openings 122 is described. There are three placement designs: the first is that the dam 13 can be placed at the center between adjacent isolation openings 122; the second is that the dam 13 can be placed close to one isolation opening 122 between adjacent isolation openings 122; and the third is that the dam 13 can be placed close to another isolation opening 122 between adjacent isolation openings 122. The following embodiments specifically illustrate the above three placement designs.

[0112] Optionally, see Figure 2 , Figure 3 , Figure 8 , Figure 15 In two adjacent isolation openings 122, there is a distance between the side of the dam 13 closest to one isolation opening 122 and the boundary of the isolation opening 122, and there is also a distance between the side of the dam 13 closest to the adjacent isolation opening 122 and the boundary of the adjacent isolation opening 122. This design means that when the dam 13 is placed on the upper surface of the isolation structure 121, there is a certain distance between it and the isolation opening 122, so that the light-emitting structure and the encapsulation structure 15 can be deposited at this distance later. This allows the photoresist FP to make maximum contact with the encapsulation structure 15 to protect the pixel or light-emitting unit.

[0113] Optionally, the dam 13 can be positioned at the center between two adjacent isolation openings 122. That is, in two adjacent isolation openings 122, the distance between the side of the dam 13 closest to one isolation opening 122 and the boundary of the isolation opening 122 is the same as the distance between the side of the dam 13 closest to the adjacent isolation opening and the boundary of the adjacent isolation opening 122 (due to manufacturing errors, this distance is approximately the same). See [reference needed]. Figure 2 The partial cross-sectional view shown.

[0114] Optionally, the dam 13 can be positioned offset from one of the adjacent isolation openings 122. That is, in the two adjacent isolation openings 122, the distance between the side of the dam 13 closest to one isolation opening 122 and the boundary of the isolation opening 122 is greater than the distance between the side of the dam 13 closest to the adjacent isolation opening and the boundary of the adjacent isolation opening 122. See [reference needed]. Figure 4 The partial cross-sectional view shown.

[0115] The design structure of the dam 13 position described in any of the above embodiments can cause the light-emitting material layer or encapsulation material layer deposited on the upper surface of the dam 13 to protrude, forming an encapsulation dam, so that the photoresist FP can be confined within the encapsulation dam, increasing the adhesion and contact area between the photoresist FP and the surface of the encapsulation structure.

[0116] In some embodiments, the thickness and length of the dam 13 are also designed. For example, the thickness of the dam 13, i.e., the dimension of the dam 13 along the substrate thickness direction, is greater than or equal to the dimension of the encapsulation structure 15 along the substrate thickness direction; optionally, the dimension of the dam 13 along the substrate thickness direction is greater than or equal to 0.6 nanometers; optionally, the dimension of the dam 13 along the substrate thickness direction may also be between 0.6 nanometers and 1.2 nanometers, and optionally, the dimension of the dam 13 along the substrate thickness direction may also be equal to 1.2 nanometers. This thickness design is because, generally, the dimension of the light-emitting unit 14 along the substrate thickness direction is relatively small, smaller than the dimension of the packaging structure 15 along the substrate thickness direction. Therefore, the dimension of the dam 13 along the substrate thickness direction can be approximately the same as the dimension of the packaging structure 15 along the substrate thickness direction, or the dimension of the dam 13 along the substrate thickness direction can be larger than the dimension of the packaging structure 15 along the substrate thickness direction. This allows the side surface of the dam 13 to contact the packaging structure 15. If the side surface of the dam 13 is provided with a burr structure, the adhesion between the packaging structure 15 and the dam 13 can be increased, thereby improving the packaging effect. In addition, the fact that the dimension of the dam 13 along the substrate thickness direction is larger than the dimension of the light-emitting unit 14 along the substrate thickness direction increases the contact area between the packaging structure 15 and the photoresist that needs to be covered later, thereby improving the adhesion of the photoresist and improving the problem of photoresist deficiency.

[0117] For example, regarding the length of the dam 13, the dimension of the dam 13 along the arrangement direction of the adjacent isolation openings 122 is smaller than the dimension of the isolation structure 121 along the arrangement direction of the adjacent isolation openings 122; wherein the arrangement direction along the adjacent isolation openings 122 is a horizontal direction relative to the cross-section, while the aforementioned direction along the substrate thickness can be a vertical direction relative to the cross-section. Optionally, the ratio of the dimension of the dam 13 along the arrangement direction of the adjacent isolation openings 122 to the dimension of the isolation structure 121 along the arrangement direction of the adjacent isolation openings 122 is greater than or equal to 1 / 5 and less than or equal to 3 / 5; for a simpler understanding, see [link to relevant documentation]. Figure 2 The cross-sectional view shows that the design of the above embodiment can be understood as follows: the length of the dam 13 set on the upper surface of the third film layer 121c in the isolation structure 121 is 1 / 5 to 3 / 5 of the length of the third film layer 121c. That is, the shortest length of the dam 13 is 1 / 5 of the length of the third film layer 121c, and the longest length is 3 / 5 of the length of the third film layer 121c. This design creates a distance between the dam 14 and the two ends of the third film layer 121c, which can enhance the adhesion between the surface of the packaging structure 15 and the photoresist FP within this distance, and can solve the problem of missing photoresist FP to a certain extent.

[0118] In some embodiments, the orthographic projection of the dam 13 on the substrate 11 lies within the orthographic projection of the isolation structure 121 on the substrate 11, and the orthographic projection of the dam 13 on the substrate 11 at least partially surrounds the orthographic projection of the encapsulation structure 15 on the substrate 11. This design is formed during subsequent etching of the light-emitting unit 14. In one case, the encapsulation structure 15 on the upper surface of the dam 13 is partially or completely etched away, so that the upper surface of the dam 13 retains a portion of the encapsulation structure 15 or has no encapsulation structure 15, such that the orthographic projection of the dam 13 on the substrate 11 at least partially surrounds the orthographic projection of the encapsulation structure 15 on the substrate 11. See [link to documentation]. Figure 18 The photoresist FP is confined within the encapsulation dam on the encapsulation structure. Therefore, during subsequent etching, the encapsulation dam and the light-emitting unit below the encapsulation dam are etched away. The orthographic projection of the dam 13 on the substrate 11 is located outside the orthographic projection of the encapsulation structure 15 on the substrate 11, indicating that the photoresist effectively protects the light-emitting unit within the isolation opening 122 and improves the display effect of the display panel.

[0119] In some embodiments, the side surface of the dam 13 near the isolation opening 122 is provided with an uneven structure, which contacts the encapsulation structure 15. The sidewall of the dam 13 may also be etched with burrs, creating an uneven structure on the sidewall of the dam 13, which can improve the adhesion of the encapsulation structure 15 on the sidewall of the dam 13. Correspondingly, the side surface of the encapsulation structure 15 deposited on the side of the dam 13 near the isolation opening 122 can also have a raised structure, thereby increasing the friction between the encapsulation structure 15 and the photoresist FP subsequently deposited on the encapsulation structure 15, thus increasing the adhesion between the photoresist FP and the encapsulation structure 15, making it less likely for the photoresist FP to fall off or be missing, preventing pixel damage, and improving the display effect of the display panel.

[0120] In some embodiments, the display panel 10 described in any of the above embodiments further includes: a pixel definition layer (PDL) 16 disposed on one side of the substrate 11, the pixel definition layer 16 including a plurality of pixel openings 161; the plurality of isolation openings 122 correspondingly communicating with the plurality of pixel openings 161; the plurality of pixel openings 161 and the plurality of isolation openings 122 correspondingly disposed; the orthographic projection of the pixel openings 161 on the substrate 11 lies within the orthographic projection of the isolation openings 122 on the substrate 11. The pixel definition layer 16 provides good planar support for the subsequently formed isolation structure 121. The pixel definition layer 16 may be disposed between the isolation structure 121 and the substrate 11. The pixel definition layer 16 defines the plurality of pixel openings 161. The orthographic projection of the pixel openings 161 on the substrate 11 may lie within the orthographic projection of the isolation openings 122 on the substrate 11. The light-emitting unit 14 may be at least partially located within the pixel openings 161. Thus, by providing the pixel definition layer 16, it is convenient to provide the light-emitting unit 14 on the substrate 11.

[0121] In some embodiments, a display panel is also provided, see [link to relevant documentation]. Figure 1 The partial top view shown and Figure 2 The partial cross-sectional view shown illustrates that the display panel includes: a substrate 11; an isolation layer 12 disposed on one side of the substrate 11, comprising an isolation structure 121 and a plurality of isolation openings 122 enclosed by the isolation structure 121; and a dam 13 disposed on the side of the isolation structure 121 away from the substrate 11, comprising a dam structure 131 and a plurality of inner dam areas 132 enclosed by the dam structure 131, wherein the plurality of inner dam areas 132 are correspondingly arranged with the plurality of isolation openings 122, and the dam structure 131 is correspondingly arranged with the isolation structure 121. The dam structure 131 is positioned such that its orthographic projection on the substrate 11 lies within the orthographic projection of the isolation structure 121 on the substrate 11; the isolation opening 122 is positioned within the orthographic projection of the inner area 132 of the dam on the substrate 11; a plurality of light-emitting units 14 are disposed on one side of the substrate 11; the plurality of light-emitting units 14 are correspondingly disposed with the plurality of isolation openings 122, at least a portion of the light-emitting units 14 is disposed within the corresponding isolation opening 122, and each light-emitting unit 14 has an encapsulation structure 15 on the side facing away from the substrate 11. The structure described in this embodiment is the same as that described above. Figure 1 , Figure 2 , Figure 13 The structures described in the embodiments are basically the same. For detailed descriptions, please refer to the foregoing content, which will not be repeated here.

[0122] The display panel described in any of the above embodiments, by adding a dam to the upper surface of the isolation structure, allows the photoresist PR to be applied to the encapsulation structure on the upper surface of the light-emitting unit after the subsequent pixel or light-emitting unit evaporation is completed. This creates an inner region within the dam where the photoresist PR is subjected to pressure from the encapsulation structure, enhancing the adhesion between the photoresist PR and the encapsulation structure. Furthermore, burrs are etched on the sidewalls of the dam, further improving the adhesion to the encapsulation structure and the friction between the encapsulation structure and the photoresist FP. This design can, to some extent, solve the problem of missing photoresist FP, improve pixel damage caused by missing photoresist FP, and thus improve the resulting display dark spot problem, thereby enhancing the display effect of the display panel.

[0123] In some embodiments, the display panel based on any of the above embodiments, such as Figure 16 As shown, a method for manufacturing a display panel is also provided, the method comprising:

[0124] S1, Provide substrate;

[0125] The substrate can provide support for the remaining film layers that are subsequently applied.

[0126] S2. An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a first electrode;

[0127] An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes; the first electrodes can be the anodes in the light-emitting unit.

[0128] S3. A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate; an isolation material layer is formed on the side of the pixel material layer facing away from the substrate; and a dam material layer is formed on the side of the isolation material layer facing away from the substrate.

[0129] A second patterning process is performed on the isolation material layer and the pixel material layer to form a dam layer, an isolation layer, and a pixel limiting layer.

[0130] In this process, the orthographic projection of the dam onto the substrate lies within the orthographic projection of the isolation structure onto the substrate; a dam is provided between at least two adjacent isolation openings; the isolation layer includes an isolation structure and multiple isolation openings enclosed by the isolation structures; the pixel defining layer includes multiple pixel openings; the multiple isolation openings are correspondingly connected to the multiple pixel openings; the orthographic projection of the pixel opening onto the substrate lies within the orthographic projection of the isolation opening onto the substrate. For example, the above process flow can be found in [reference needed]. Figure 17The process diagram shown illustrates a process where, taking an isolation structure comprising a stacked first film layer 121a, a second film layer 121b, and a third film layer 121c as an example, and assuming the first film layer 121a is made of Mo, the second film layer 121b of Al, and the third film layer 121c of Ti, an isolation material layer 123 (including the first film layer 123a, the second film layer 123b, the third film layer 123c, and a dam material layer 134) is sequentially deposited on the upper surface of the pixel defining layer 16. A second patterning process is then performed on the isolation material layer 123 and the pixel material layer 162 (see [reference]). Figure 17 (as shown in the graphical representation), forming a dam 13, an isolation layer 12, and a pixel-limiting layer 16.

[0131] S4. A light-emitting material layer is formed on the side of the isolation layer away from the substrate, an electrode material layer is formed on the side of the light-emitting material layer away from the substrate, an encapsulation material layer is formed on the side of the electrode material layer away from the substrate, a photoresist material layer is formed on the side of the encapsulation material layer away from the substrate, and a third patterning process is performed on the photoresist material layer to form multiple photolithographic structures.

[0132] The corresponding process flow for this step can be found in [link / reference]. Figure 18 The schematic diagram of the process shown indicates that a light-emitting material layer 144 is formed on the side of the isolation layer 12 facing away from the substrate 11, an electrode material layer 145 is formed on the side of the light-emitting material layer facing away from the substrate 11, an encapsulation material layer 151 is formed on the side of the electrode material layer 145 facing away from the substrate 11, and a photoresist material layer 17 is formed on the side of the encapsulation material layer 151 facing away from the substrate 11. A third patterning process is then performed on the photoresist material layer 17 (see...). Figure 18 The pattern shown forms multiple photolithographic structures 171. It should be noted that... Figure 18 The etching process involves multiple light-emitting units that emit light of the same color, therefore... Figure 18 The image shown is just one example of a photolithographic structure 171.

[0133] S5. Perform a fourth patterning process on the encapsulation material layer, electrode material layer, and light-emitting material layer to form multiple encapsulation structures, multiple second electrodes, and multiple light-emitting structures.

[0134] In this configuration, multiple second electrodes are correspondingly arranged with multiple isolation openings, multiple light-emitting structures are correspondingly arranged with multiple isolation openings, at least a portion of the light-emitting structure is disposed within the corresponding isolation opening, and at least a portion of the second electrode is disposed within the corresponding isolation opening.

[0135] In some embodiments, such as Figure 19 As shown, the above method also includes:

[0136] S6. Peel off multiple photolithographic structures from the side of the packaging structure away from the substrate.

[0137] After the light-emitting units for emitting light of the same color are fabricated, each photolithographic structure is peeled off from the side of the corresponding packaging structure away from the substrate in preparation for the fabrication of other light-emitting units.

[0138] In some embodiments, a method for "performing a second patterning process on the dam material layer, the isolation material layer, and the pixel material layer to form a dam layer, an isolation layer, and a pixel defining layer" as described in S3 above is also provided, such as... Figure 20 As shown, the method includes:

[0139] S31. Perform fifth graphic processing on the dam material layer and the isolation material layer to form the dam intermediate layer and the isolation intermediate layer;

[0140] S32. Perform the sixth graphic processing on the intermediate layer of the dam to form the dam layer;

[0141] S33. Perform the seventh graphical processing on the isolation intermediate layer to form the isolation layer;

[0142] S34. Perform the eighth patterning process on the pixel material layer to form a pixel-defined layer.

[0143] The above Figure 20 The process flow shown can be found in [reference]. Figure 21 The process shown involves performing a fifth graphic processing on the dam material layer 134 and the isolation material layer 123 to form a dam intermediate layer 135 and an isolation intermediate layer 124; then performing a sixth graphic processing on the dam intermediate layer 135 to form a dam 13; then performing a seventh graphic processing on the isolation intermediate layer 124 to form an isolation layer 12; and finally performing an eighth graphic processing on the pixel material layer 162 to form a pixel limiting layer 16.

[0144] Using the above Figures 16-21 In the process of fabricating the display panel using the method described in the embodiments, by setting a dam on the isolation layer, the encapsulation structure on the isolation layer also has an encapsulation dam, thereby confining the photolithography structure within the area enclosed by the encapsulation dam. This enhances the contact area and adhesion between the photolithography structure and the encapsulation structure, improves the problem of missing photolithography structures, ensures the light-emitting effect of the light-emitting unit, and makes the display panel display well.

[0145] In some embodiments, this application also provides a display device, which includes the display panel 10 described in any of the foregoing embodiments. The display device can be an electronic paper device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, smart bracelet, smartwatch, supercomputer, navigator, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, clock, calculator, television monitor, computer monitor, automotive display (e.g., odometer display), cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic billboard or sign, projector, or other mobile or fixed terminal.

[0146] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0147] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0148] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure. A dam is provided on the side of the isolation structure opposite to the substrate, and the orthographic projection of the dam on the substrate is located within the orthographic projection of the isolation structure on the substrate; the dam is provided between at least two adjacent isolation openings; Multiple light-emitting units are disposed on one side of the substrate; the multiple light-emitting units are correspondingly disposed with the multiple isolation openings, at least a portion of the light-emitting units are disposed in the corresponding isolation openings, and each light-emitting unit has an encapsulation structure on the side away from the substrate.

2. The display panel according to claim 1, characterized in that, A dam is provided between any two adjacent isolation openings; Optionally, the dam includes a dam structure and multiple inner dam zones enclosed by the dam structure. The multiple inner dam zones are correspondingly arranged with the multiple isolation openings. The dam structure is correspondingly arranged with the isolation structure. The orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the inner dam zone on the substrate.

3. The display panel according to claim 1, characterized in that, The dike is provided at least around the outer periphery of at least a portion of the isolation opening; Optionally, the dike includes multiple sub-dikes, which are correspondingly arranged with respect to the multiple isolation openings. Optionally, the sub-dam is constructed around at least a portion of the outer periphery corresponding to the isolation opening; Optionally, the sub-dam includes a plurality of sub-sections, which are spaced apart and surround at least a portion of the periphery of the corresponding isolation opening.

4. The display panel according to claim 3, characterized in that, The multiple sub-dams are configured in a one-to-one correspondence with the multiple isolation openings; Optionally, the plurality of sub-dams include a first sub-dam and a plurality of second sub-dams; the first sub-dam includes a first dam structure and a plurality of inner zones of the first dam formed by the enclosing first dam structure, the plurality of inner zones of the first dam being correspondingly arranged with the plurality of isolation openings, the first dam structure being correspondingly arranged with the isolation structure, and the orthographic projection of the isolation opening on the substrate being located within the orthographic projection of the inner zone of the first dam on the substrate; the plurality of second sub-dams are corresponding one-to-one with the plurality of isolation openings.

5. The display panel according to any one of claims 1-4, characterized in that, In two adjacent isolation openings, there is a distance between the side of the dam closest to one of the isolation openings and the boundary of the isolation opening, and there is a distance between the side of the dam closest to the adjacent isolation opening and the boundary of the adjacent isolation opening. Optionally, in two adjacent isolation openings, the distance between the side of the dam closest to one isolation opening and the boundary of the isolation opening is the same as the distance between the side of the dam closest to the adjacent isolation opening and the boundary of the adjacent isolation opening. Optionally, in two adjacent isolation openings, the distance between the side of the dam closest to one isolation opening and the boundary of the isolation opening is greater than the distance between the side of the dam closest to the adjacent isolation opening and the boundary of the adjacent isolation opening.

6. The display panel according to any one of claims 1-4, characterized in that, The dimension of the dam along the thickness direction of the substrate is greater than or equal to the dimension of the encapsulation structure along the thickness direction of the substrate; the dimension of the dam along the arrangement direction of the adjacent isolation openings is less than the dimension of the isolation structure along the arrangement direction of the adjacent isolation openings. Optionally, the dimension of the dam along the thickness direction of the substrate is greater than or equal to 0.6 nanometers; Optionally, the ratio of the dimension of the dam along the arrangement direction of the adjacent isolation opening to the dimension of the isolation structure along the arrangement direction of the adjacent isolation opening is greater than or equal to 1 / 5 and less than or equal to 3 / 5.

7. The display panel according to any one of claims 1-4, characterized in that, The dam has a raised and recessed structure on its side surface near the isolation opening, and the raised and recessed structure is in contact with the encapsulation structure.

8. The display panel according to any one of claims 1-4, characterized in that, The orthographic projection of the dam on the substrate at least partially surrounds the orthographic projection of the encapsulation structure on the substrate.

9. The display panel according to any one of claims 1-4, characterized in that, The materials used for the dam include metallic or inorganic materials.

10. The display panel according to claim 1, characterized in that, The display panel further includes: a pixel defining layer disposed on one side of the substrate, the pixel defining layer having a plurality of pixel openings; the plurality of isolation openings being correspondingly connected to the plurality of pixel openings; the orthographic projection of the pixel openings on the substrate being located within the orthographic projection of the isolation openings on the substrate.

11. A display panel, characterized in that, include: substrate; An isolation layer is disposed on one side of the substrate and includes an isolation structure and a plurality of isolation openings formed by the isolation structure. A dam is located on the side of the isolation structure opposite to the substrate, and includes a dam structure and multiple inner dam areas enclosed by the dam structure. The multiple inner dam areas are correspondingly arranged with the multiple isolation openings. The dam structure is correspondingly arranged with the isolation structure. The orthographic projection of the dam structure on the substrate is located within the orthographic projection of the isolation structure on the substrate. The orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the inner dam area on the substrate. Multiple light-emitting units are disposed on one side of the substrate; The plurality of light-emitting units are correspondingly arranged with the plurality of isolation openings, at least a portion of the light-emitting units are disposed within the corresponding isolation openings, and each light-emitting unit has an encapsulation structure on the side facing away from the substrate.

12. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; An electrode material layer is formed on one side of the substrate, and the electrode material layer is subjected to a first patterning process to form a plurality of first electrodes; A pixel material layer is formed on the side of the substrate and the first electrode facing away from the substrate. An isolation material layer is formed on the side of the pixel material layer facing away from the substrate. A dam material layer is formed on the side of the isolation material layer facing away from the substrate. The dam material layer, the isolation material layer, and the pixel material layer are subjected to a second patterning process to form a dam layer, an isolation layer, and a pixel defining layer. The orthographic projection of the dam on the substrate is located within the orthographic projection of the isolation layer on the substrate. The dam is disposed between at least two partially adjacent isolation openings. The isolation layer includes an isolation structure and a plurality of isolation openings enclosed by the isolation structure. The pixel defining layer includes a plurality of pixel openings. The plurality of isolation openings are correspondingly connected to the plurality of pixel openings. The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate. A light-emitting material layer is formed on the side of the isolation layer away from the substrate, an electrode material layer is formed on the side of the light-emitting material layer away from the substrate, an encapsulation material layer is formed on the side of the electrode material layer away from the substrate, and a photoresist material layer is formed on the side of the encapsulation material layer away from the substrate. The photoresist material layer is subjected to a third patterning process to form multiple photolithographic structures. The encapsulation material layer, the electrode material layer, and the light-emitting material layer are subjected to a fourth patterning process to form multiple encapsulation structures, multiple second electrodes, and multiple light-emitting structures; wherein, the multiple second electrodes are correspondingly disposed with the multiple isolation openings, the multiple light-emitting structures are correspondingly disposed with the multiple isolation openings, at least a portion of the second electrode is disposed within the corresponding isolation opening, and at least a portion of the light-emitting structure is disposed within the corresponding isolation opening.

13. The preparation method according to claim 12, characterized in that, The second patterning process, which involves applying a second patterning treatment to the dam material layer, the isolation material layer, and the pixel material layer to form a dam layer, an isolation layer, and a pixel defining layer, includes: The dam material layer and the isolation material layer are subjected to a fifth graphical processing to form an intermediate dam layer and an intermediate isolation layer. The intermediate layer of the dam is subjected to a sixth graphical processing to form the dam. The isolation intermediate layer is subjected to a seventh graphical processing to form the isolation layer; The pixel material layer is subjected to an eighth patterning process to form the pixel definition layer.

14. The preparation method according to claim 12 or 13, characterized in that, The method further includes: The plurality of photolithographic structures are peeled off from the side of the packaging structure away from the substrate.

15. A display device, characterized in that, This includes the display panel as described in any one of claims 1-11 or the display panel prepared by the preparation method described in any one of claims 12-14.

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