Display panel, method for manufacturing display panel, and display device

Abstract

The application discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a pixel definition layer, an isolation structure and a light-emitting layer. The pixel definition part comprises a first subpart and a second subpart. The first included angle and the second included angle are both less than 90 DEG, so that the slope of the pixel definition part at the two step positions of the first subpart and the second subpart is relatively gentle. When the first electrode is prepared subsequently, the climbing reliability of the first electrode at the two step positions of the first subpart and the second subpart is relatively high. The problem that when the first included angle or the second included angle is 90 DEG, the first electrode is prone to crack at the step position of the first subpart or the second subpart, the first electrode is invalid, and the light-emitting unit or the pixel definition part is exposed by the crack, the light-emitting unit or the pixel definition part is damaged in the subsequent etching process, and the display panel produces dark spots is improved, and the use performance of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the performance of OLED display products.

[0006] A first aspect of this application provides a display panel, comprising: a substrate; a pixel defining layer located on one side of the substrate, the pixel defining layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel defining portion including a first portion and a second portion, the second portion being located on the side of the first portion away from the substrate, and the orthographic projection of the second portion onto the substrate being within the orthographic projection of the first portion onto the substrate; an isolation structure located on one side of the substrate, the isolation structure forming a plurality of isolation openings, the pixel openings and the isolation openings being in communication; and a light-emitting layer located on one side of the substrate, the light-emitting layer including light-emitting units at least partially located in the isolation openings, wherein the first portion has a bottom surface and a top surface disposed opposite to each other in the thickness direction of the display panel, and a first side surface connected between the bottom surface and the top surface, the top surface being located on the side of the bottom surface away from the substrate, the second portion having a second side surface facing the pixel opening, the angle between the first side surface and the bottom surface being a first angle, the angle between the second side surface and the top surface being a second angle, and the first angle and the second angle being less than 90°.

[0007] According to an embodiment of the first aspect of this application, the first side and the second side are spaced apart.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the second portion is in the form of a closed loop around the pixel opening.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the surface of the isolation structure facing the substrate is located within the orthogonal projection of the second portion of the substrate.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the first included angle is greater than or equal to the second included angle.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the first included angle is 30° to 60°.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the second included angle is 15° to 45°.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the display panel includes a display area and a non-display area adjacent to the display area, the substrate includes a signal line layer, a connection opening located in the non-display area is provided on the pixel limiting portion, and an isolation structure is located in the connection opening and electrically connected to the signal line layer.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a first electrode layer located on the side of the light-emitting layer away from the substrate, the first electrode layer including a plurality of first electrodes located within a plurality of isolation openings, the first electrodes being electrically connected to the isolation structure.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second electrode located between the substrate and the light-emitting unit, with at least a portion of the second electrode exposed through a pixel opening.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first layer and a second layer located on the side of the first layer away from the substrate, wherein the orthographic projection of the first layer onto the substrate is located within the orthographic projection of the second layer onto the substrate.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the first layer includes a conductive material.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the second layer includes a conductive material or an insulating material.

[0019] According to any of the foregoing embodiments of the first aspect of this application, both the first layer and the second layer comprise metallic materials, and the materials of the first layer and the second layer are different.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, wherein the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0021] A second aspect of this application provides a display panel, comprising: a substrate; a pixel defining layer located on one side of the substrate, the pixel defining layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel defining portion including a first portion and a second portion, the second portion being located on the side of the first portion away from the substrate, and the orthographic projection of the second portion onto the substrate being within the orthographic projection of the first portion onto the substrate; an isolation structure located on one side of the substrate, the isolation structure forming a plurality of isolation openings, the pixel openings and the isolation openings being connected; and a light-emitting layer located on one side of the substrate, the light-emitting layer including light-emitting units at least partially located in the isolation openings, wherein the first portion has a bottom surface and a top surface disposed opposite to each other in the thickness direction of the display panel, and a first side surface connected between the bottom surface and the top surface, the top surface being located on the side of the bottom surface away from the substrate, the second portion having a second side surface facing the pixel opening, the angle between the first side surface and the bottom surface being a first angle, the angle between the second side surface and the top surface being a second angle, the first side surface and the second side surface being disposed at intervals, and the first angle being greater than or equal to the second angle.

[0022] According to an embodiment of the second aspect of this application, the first included angle and the second included angle are less than 90°.

[0023] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, the method comprising:

[0024] A pixel-defining material layer is fabricated on a substrate;

[0025] An isolation structure is fabricated on a substrate, and the isolation structure encloses and forms multiple isolation openings;

[0026] A pixel definition material layer is patterned to obtain a pixel definition layer. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel opening and the isolation opening are connected. The pixel defining portion includes a first portion and a second portion. The second portion is located on the side of the first portion away from the substrate. The orthographic projection of the second portion on the substrate is located within the orthographic projection of the first portion on the substrate. The first portion has a bottom surface and a top surface that are disposed opposite to each other in the thickness direction of the display panel, and a first side surface connected between the bottom surface and the top surface. The top surface is located on the side of the bottom surface away from the substrate. The second portion has a second side surface facing the pixel opening. The angle between the first side surface and the bottom surface is a first angle, and the angle between the second side surface and the top surface is a second angle. The first angle and the second angle are less than 90°.

[0027] A light-emitting layer is prepared on the side of the pixel definition layer away from the substrate, and the light-emitting layer includes light-emitting units that are at least partially located in the isolation opening.

[0028] According to an embodiment of the third aspect of this application, the display panel includes a display area and a non-display area adjacent to the display area. Prior to the step of fabricating the isolation structure on the substrate, the method further includes:

[0029] The pixel definition material layer is patterned to form a connection opening in the non-display area and a groove in the display area. The connection opening penetrates the pixel definition material layer in the thickness direction, and the groove penetrates part of the pixel definition material layer in the thickness direction.

[0030] According to any of the foregoing embodiments of the third aspect of this application, prior to the step of patterning the pixel definition material layer to form a connection opening in the non-display area and a groove in the display area, the method further includes:

[0031] A first etch barrier layer is prepared on the side of the pixel definition material layer facing away from the substrate;

[0032] A halftone mask is used to pattern the first etch barrier layer to form a first opening in the non-display area and a second opening in the display area. The first opening penetrates the first etch barrier layer in the thickness direction, and the second opening penetrates part of the first etch barrier layer in the thickness direction.

[0033] According to any of the foregoing embodiments of the third aspect of this application, the material of the first etch barrier layer includes photoresist.

[0034] According to any of the foregoing embodiments of the third aspect of this application, the step of patterning a pixel definition material layer to form a connection opening in a non-display area and a groove in a display area includes:

[0035] The pixel-defined material layer is patterned through the first opening and the second opening to form a connection opening corresponding to the first opening and a groove corresponding to the second opening.

[0036] According to any of the foregoing embodiments of the third aspect of this application, the step of patterning a pixel definition material layer to obtain a pixel definition layer includes:

[0037] The pixel definition layer is formed by patterning the grooves of the pixel definition material layer through the isolation opening.

[0038] According to any of the foregoing embodiments of the third aspect of this application, the step of forming a pixel definition layer by patterning the groove of the pixel definition material layer through the isolation opening includes:

[0039] The grooves of the pixel definition material layer are patterned using a plasma etching process to form a pixel definition portion with a first included angle and a second included angle.

[0040] According to any of the foregoing embodiments of the third aspect of this application, the step of patterning the grooves of the pixel definition material layer using a plasma etching process includes:

[0041] The pixel definition material layer is patterned using a plasma etching process with a bias power of 1kW to 3kW.

[0042] According to any of the foregoing embodiments of the third aspect of this application, the step of fabricating an isolation structure on a substrate includes:

[0043] An isolation material layer is prepared on a substrate;

[0044] A second etch barrier layer is prepared on the side of the isolation material layer away from the substrate, and the second etch barrier layer is patterned to form a third opening;

[0045] The isolation material layer is patterned through a third opening to form an isolation structure.

[0046] According to any of the foregoing embodiments of the third aspect of this application, the material of the second etch barrier layer includes photoresist.

[0047] According to any of the foregoing embodiments of the third aspect of this application, after the step of fabricating the isolation structure on the substrate, the method further includes:

[0048] The second etch barrier layer is retained, and the pixel definition material layer is patterned to obtain the pixel definition layer.

[0049] An embodiment of the fourth aspect of this application provides a display device comprising a display panel of any of the above embodiments, or a display panel prepared by any of the preparation methods of the embodiments.

[0050] According to an embodiment of this application, the display panel includes a substrate, a pixel definition layer, an isolation structure, and a light-emitting layer. The pixel defining portion of the pixel definition layer encloses a pixel opening to accommodate light-emitting units, enabling normal light emission from the light-emitting units. Furthermore, the pixel defining portion defines the area where each light-emitting unit is located, reducing color mixing issues between light-emitting units. During the fabrication of the light-emitting layer, a significant drop occurs at the edge of the isolation structure, making connection difficult and resulting in breakage. This breakage forms mutually disconnected light-emitting units located within the isolation opening. This eliminates the need for a precision photomask, reducing the development and use of precision photomasks and lowering manufacturing costs. The pixel defining portion includes a first portion and a second portion. A first angle exists between the first side surface and the bottom surface of the first portion, and a second angle exists between the second side surface of the second portion and the top surface of the first portion. With both the first and second included angles less than 90°, the slope of the pixel defining portion at the two step positions in the first and second portions is relatively gentle. During the subsequent fabrication of the first electrode, the first electrode has high reliability in climbing the slope at the two step positions in the first and second portions. This improves the problem that when the first or second included angle is 90°, the first electrode is prone to cracking at the step positions in the first or second portions, leading to the failure of the first electrode and the exposure of the light-emitting unit or pixel defining portion by cracks. The light-emitting unit or pixel defining portion is then etched and damaged in subsequent etching processes, resulting in dark spots on the display panel. This improves the performance of the display panel. Attached Figure Description

[0051] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0052] Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application;

[0053] Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0054] Figure 3 This is a partial top view schematic diagram of a display panel provided in an embodiment of this application;

[0055] Figure 4 This is a partial cross-sectional view of the display panel in another embodiment;

[0056] Figure 5 This is a partial cross-sectional view of the display panel in yet another embodiment;

[0057] Figure 6 This is a flowchart of a method for manufacturing a display panel provided in an embodiment of this application;

[0058] Figures 7 to 12 This is a process diagram of the fabrication of a display panel provided in an embodiment of this application.

[0059] Explanation of reference numerals in the attached figures:

[0060] 10. Display panel; AA, display area; NA, non-display area;

[0061] 100. Substrate;

[0062] 200, Isolation structure; 210, First layer; 220, Second layer; 230, Third layer; 240, Isolation opening; 250, Second etch barrier layer; 251, Third opening;

[0063] 300, Light-emitting layer; 310, Light-emitting unit;

[0064] 400, First electrode layer; 410, First electrode;

[0065] 500, Pixel definition layer; 501, Pixel definition material layer; 510, Pixel defining portion; 511, First portion; 511a, First side surface; 511b, Bottom surface; 511c, Top surface; 512, Second portion; 512a, Second side surface; 520, Pixel opening; 521, Groove; 530, Second electrode; 540, Connection opening; 550, First etch barrier layer; 551, First opening; 552, Second opening;

[0066] 600, Signal Line Layer;

[0067] α, the first included angle; β, the second included angle. Detailed Implementation

[0068] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0069] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0070] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0071] This application provides a display panel, a method for manufacturing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for manufacturing the display panel, and the display device.

[0072] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0073] Please see Figures 1 to 3 , Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application; Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 3 This is a partial top view of a display panel provided in an embodiment of this application. The dashed lines in the figure are for illustrative purposes only and do not constitute a limitation on the structure.

[0074] like Figures 1 to 3As shown, a first aspect embodiment of this application provides a display panel 10, which includes: a substrate 100; a pixel definition layer 500 located on one side of the substrate 100, the pixel definition layer 500 including a pixel defining portion 510 and a pixel opening 520 formed by the pixel defining portion 510, the pixel defining portion 510 including a first portion 511 and a second portion 512, the second portion 512 being located on the side of the first portion 511 away from the substrate 100, and the orthographic projection of the second portion 512 on the substrate 100 being located within the orthographic projection of the first portion 511 on the substrate 100; and an isolation structure 200 located on one side of the substrate 100, the isolation structure 200 forming a plurality of isolation openings 240, the pixel opening 520 and the isolation openings 240. 40 connected; light-emitting layer 300, located on one side of substrate 100, light-emitting layer 300 includes light-emitting units 310 at least partially located in isolation opening 240, wherein, first portion 511 has a bottom surface 511b and a top surface 511c disposed opposite to each other in the thickness direction of display panel 10, and a first side surface 511a connected between bottom surface 511b and top surface 511c, top surface 511c is located on the side of bottom surface 511b away from substrate 100, second portion 512 has a second side surface 512a facing pixel opening 520, the included angle between the first side surface 511a and bottom surface 511b is a first included angle α, the included angle between the second side surface 512a and top surface 511c is a second included angle β, the first included angle α and the second included angle β are less than 90°.

[0075] like Figure 2 As shown, the two sides of the second included angle β are the extension surfaces of the top surface 511c and the second side surface 512a, respectively.

[0076] According to an embodiment of this application, the display panel 10 includes a substrate 100, a pixel definition layer 500, an isolation structure 200, and a light-emitting layer 300. The pixel defining portion 510 of the pixel definition layer 500 forms a pixel opening 520 to accommodate light-emitting units 310, enabling normal light emission from the light-emitting units 310. Furthermore, the pixel defining portion 510 defines the area where each light-emitting unit 310 is located, reducing color mixing issues between the light-emitting units 310. When the light-emitting layer 300 is fabricated, a large drop occurs at the edge of the isolation structure 200, making it difficult to connect and causing breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310 located within the isolation opening 240. This eliminates the need for a precision mask, reducing the development and use of precision masks and lowering manufacturing costs. The pixel limiting portion 510 includes a first portion 511 and a second portion 512. The first side surface 511a of the first portion 511 has a first included angle α with the bottom surface 511b, and the second side surface 512a of the second portion 512 has a second included angle β with the top surface 511c of the first portion 511. The first included angle α and the second included angle β are both less than 90°, making the slope of the pixel limiting portion 510 at the two step positions of the first portion 511 and the second portion 512 relatively gentle. When the first electrode 410 is subsequently manufactured, the first electrode 410 has higher climbing reliability at the two step positions of the first portion 511 and the second portion 512. This improves the problem that when the first included angle α or the second included angle β is 90°, the first electrode 410 is prone to cracks at the step positions of the first portion 511 or the second portion 512, which can lead to the failure of the first electrode 410 and the exposure of the light-emitting unit 310 or the pixel limiting portion 510 by cracks. The light-emitting unit 310 or the pixel limiting portion 510 is then etched and damaged in subsequent etching processes, resulting in dark spots on the display panel 10. This improves the performance of the display panel 10.

[0077] The step position of the first section 511 refers to the junction of the first side surface 511a and the top surface 511c of the first section 511. The step position of the second section 512 refers to the junction of the second side surface 512a of the second section 512 and the surface of the second section 512 facing away from the substrate 100.

[0078] There are many other ways to arrange the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate. Alternatively, the substrate 100 may be the substrate itself. Or the substrate 100 may include a buffer layer and a support plate on the side facing away from the substrate.

[0079] Optionally, the first part 511 and the second part 512 can be integrally formed or separately formed.

[0080] In some alternative embodiments, the first side 511a and the second side 512a are spaced apart.

[0081] In these optional embodiments, there is a top surface 511c of the first section 511 between the first side 511a and the second side 512a. When the first electrode 410 is subsequently fabricated, after the first electrode 410 climbs up the step position of the first section 511, it passes through the relatively flat top surface 511c, and then climbs up from the second side 512a of the second section 512 to the side of the second section 512 away from the substrate 100. The part of the top surface 511c between the first side 511a and the second side 512a can buffer the climbing of the first electrode 410 to improve the problem of stress concentration in the first electrode 410 leading to cracks.

[0082] Optionally, the first side 511a and the second side 512a are connected, with the end of the first side 511a away from the substrate 100 and the end of the second side 512a close to the substrate 100 connected, so that the sidewall of the pixel limiting portion 510 facing the pixel opening 520 is a two-segment broken line, and the slope on the first side 511a and the second side 512a of the first electrode 410 is relatively gentle, so as to improve the problem of stress concentration in the first electrode 410 causing cracks.

[0083] Optionally, the second portion 512 is in a closed loop around the pixel opening 520, so that the slope of the pixel limiting portion 510 around the pixel opening 520 is relatively gentle, so that the first electrode 410 climbs gently on the pixel limiting portion 510 around the pixel opening 520, further improving the problem of stress concentration in the first electrode 410 causing cracks.

[0084] In some alternative embodiments, the surface of the isolation structure 200 facing the substrate 100 is projected onto the substrate 100 in the orthographic projection of the second portion 512 within the orthographic projection of the substrate 100.

[0085] Optionally, the isolation structure 200 and the second side 512a are spaced apart.

[0086] In these optional embodiments, there is a section of surface of the second portion 512 facing away from the substrate 100 between the second side 512a of the second portion 512 and the isolation structure 200. During the subsequent fabrication of the first electrode 410, after the first side 511a and the second side 512a have climbed up, the first electrode 410 passes over a relatively flat surface, and then climbs up from the surface of the second portion 512 facing away from the substrate 100 to the sidewall of the isolation structure 200 and overlaps with it. The second side 512a and the isolation structure 200 are spaced apart, and a portion of the surface of the second portion 512 facing away from the substrate 100 is provided between the second side 512a and the isolation structure 200. This buffers the climbing motion of the first electrode 410, further improving the problem of stress concentration leading to cracks in the first electrode 410.

[0087] Optionally, the orthographic projection of the second side surface 512a onto the substrate 100 coincides with the edge of the orthographic projection of the isolation structure 200 onto the substrate 100. When etching to form the second side surface 512a, the isolation structure 200 is used as a mask for etching. The isolation structure 200 is self-aligned for etching, which simplifies the process and eliminates the need for additional masking, thus simplifying the fabrication process.

[0088] In some alternative embodiments, the first included angle α is greater than or equal to the second included angle β.

[0089] In these alternative embodiments, the second included angle β is smaller, and the slope of the second side 512a is gentler than the slope of the first side 511a, so that the slope of the first electrode 410 on the pixel limiting portion 510 gradually becomes gentler, further improving the problem of stress concentration in the first electrode 410 causing cracks.

[0090] In some alternative embodiments, the first included angle α is 30° to 60°. For example, the first included angle α is 30°, 40°, 50°, 60°, etc.

[0091] In these optional embodiments, a first included angle α greater than or equal to 30° can mitigate the problem that a small first included angle α leads to greater manufacturing difficulty in controlling its formation, and that a larger width of the pixel-defining portion 510 is required to maintain the thickness of the pixel-defining portion 510 and the first included angle α, resulting in a decrease in pixel density (Pixels Per Inch, PPI). A first included angle α less than or equal to 60° can mitigate the problem that a large first included angle α, i.e., a steep slope of the first side surface 511a, makes it difficult for the first electrode 410 to climb the slope on the first side surface 511a, easily leading to stress concentration.

[0092] In some alternative embodiments, the second included angle β is 15° to 45°. For example, the second included angle β is 15°, 25°, 35°, 45°, etc.

[0093] In these alternative embodiments, a second included angle β greater than or equal to 15° can mitigate the problem that a small second included angle β leads to significant manufacturing difficulties in controlling its formation. A second included angle β less than or equal to 45° can mitigate the problem that a large second included angle β, i.e., a steep slope on the second side surface 512a, makes it difficult for the first electrode 410 to climb the slope on the second side surface 512a, easily leading to stress concentration.

[0094] Please see Figure 1 and Figure 4 , Figure 4 This is a partial cross-sectional view of the display panel in another embodiment.

[0095] like Figure 1 and Figure 4 As shown, in some optional embodiments, the display panel 10 includes a display area AA and a non-display area NA adjacent to the display area AA, the substrate 100 includes a signal line layer 600, the pixel limiting portion 510 has a connection opening 540 located in the non-display area NA, and the isolation structure 200 is located in the connection opening 540 and electrically connected to the signal line layer 600.

[0096] In these optional embodiments, the isolation structure 200 is electrically connected to the signal line layer 600 through the connection opening 540 of the non-display area NA, so as to provide an electrical signal to the isolation structure 200 through the signal line layer 600 to drive the light-emitting unit 310 to emit light. Optionally, the pixel defining portion 510 has a stepped position on the side facing the connection opening 540.

[0097] Optionally, signal line layer 600 includes data signal lines, power supply voltage signal lines, etc.

[0098] Optionally, the second electrode 530 is located on the signal line layer 600, or the second electrode 530 is located on the side of the signal line layer 600 away from the substrate 100.

[0099] In some optional embodiments, the display panel 10 further includes: a first electrode layer 400 located on the side of the light-emitting layer 300 away from the substrate 100, the first electrode layer 400 including a plurality of first electrodes 410 located within a plurality of isolation openings 240, the first electrodes 410 being electrically connected to the isolation structure 200.

[0100] In these optional embodiments, the isolation structure 200 isolates the first electrode layer 400 to form mutually spaced first electrodes 410. The mutually spaced first electrodes 410 are electrically connected through the isolation structure 200 to form a full-surface electrode, ensuring the normal light emission of the light-emitting unit 310.

[0101] Optionally, the material of the pixel limiting part 510 may include inorganic or organic materials.

[0102] Optionally, the display panel 10 further includes a second electrode 530 located between the substrate 100 and the light-emitting unit 310. At least a portion of the second electrode 530 is exposed through the pixel opening 520 to serve as an electrode of the light-emitting unit 310, driving the light-emitting unit 310 to emit light. One of the first electrode 410 and the second electrode 530 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. This embodiment of the application illustrates the example by using the first electrode 410 as the cathode of the light-emitting unit 310 and the second electrode 530 as the anode of the light-emitting unit 310.

[0103] In some alternative embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 opposite to the substrate 100, wherein the orthographic projection of the first layer 210 onto the substrate 100 is within the orthographic projection of the second layer 220 onto the substrate 100.

[0104] In these optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 away from the substrate 100. The first layer 210 and the second layer 220 are stacked to form the isolation structure 200. The first layer 210, which is disposed close to the substrate 100, has its orthographic projection on the substrate 100 located within the orthographic projection of the second layer 220 on the substrate 100. The area of ​​the second layer 220 is larger than the area of ​​the first layer 210. The second layer 220 covers the surface of the first layer 210 that is close to the second layer 220. At this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When the light-emitting layer 300 is fabricated, a large drop is generated at the edge of the isolation structure 200, and the first layer 210 is recessed relative to the second layer 220. The light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, resulting in breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310, thereby reducing crosstalk of charge carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and fabricating the light-emitting unit 310 does not require the use of a precision mask, which can reduce the development and use of precision masks and reduce the fabrication cost.

[0105] Optionally, the first layer 210 includes a conductive material, such as a non-metallic conductive material or a metallic conductive material.

[0106] In some alternative embodiments, the second layer 220 includes a conductive material or an insulating material.

[0107] In these alternative embodiments, the second layer 220 includes a conductive material, such as a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, it is difficult to etch the second layer 220 during the wet etching process of the first layer 210 with an etching solution, thereby making it easier for the first layer 210 to be recessed relative to the second layer 220.

[0108] In some alternative embodiments, both the first layer 210 and the second layer 220 comprise metallic materials, and the materials of the first layer 210 and the second layer 220 are different.

[0109] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metallic materials, the first layer 210 can be wet-etched using an etching solution. By adjusting the etching solution, the etching rate of the second layer 220 can be made lower than that of the first layer 210. Because the etching rate of the first layer 210 is higher, even if the second layer 220 is etched to some extent during wet etching, the first layer 210 is etched faster, thus making the first layer 210 recessed relative to the second layer 220.

[0110] like Figure 2 As shown, optionally, the orthographic projection of the second side 512a on the substrate 100 coincides with the edge of the orthographic projection of the second layer 220 on the substrate 100. When etching to form the second side 512a, the second layer 220 of the isolation structure 200 is used as a mask for etching. The isolation structure 200 is self-aligned for etching, which is simple and does not require additional masking, thus simplifying the fabrication process.

[0111] Please see Figure 5 , Figure 5 This is a partial cross-sectional view of the display panel in yet another embodiment.

[0112] like Figure 5 As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100, wherein the orthographic projection of the first layer 210 onto the substrate 100 lies within the orthographic projection of the third layer 230 onto the substrate 100.

[0113] In these optional embodiments, to obtain the recessed first layer 210, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thus forming the recessed first layer 210. Because the first layer 210 has a faster etching rate, more etching waste is generated and can easily enter other parts of the display panel 10, causing adverse effects. After the third layer 230 is formed, the first layer 210 can adhere better to the third layer 230, and the generated etching waste falls onto the third layer 230, making it easier to clean.

[0114] Optionally, the display panel 10 may also include an encapsulation layer located on the side of the first electrode layer 400 opposite to the substrate 100.

[0115] Optionally, the light-emitting layer 300 includes at least one of an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL), but does not include structures such as the first electrode 410 and the second electrode 530.

[0116] like Figures 1 to 5As shown, a second aspect embodiment of this application provides a display panel 10, which includes: a substrate 100; a pixel defining layer 500 located on one side of the substrate 100, the pixel defining layer 500 including a pixel defining portion 510 and a pixel opening 520 formed by the pixel defining portion 510, the pixel defining portion 510 including a first portion 511 and a second portion 512, the second portion 512 being located on the side of the first portion 511 away from the substrate 100, and the orthographic projection of the second portion 512 on the substrate 100 being within the orthographic projection of the first portion 511 on the substrate 100; an isolation structure 200 located on one side of the substrate 100, the isolation structure 200 forming a plurality of isolation openings 240, the pixel openings 520 and the isolation openings 240 being connected; and a light-emitting layer 300. Located on one side of the substrate 100, the light-emitting layer 300 includes light-emitting units 310 located at least partially in the isolation opening 240. The first portion 511 has a bottom surface 511b and a top surface 511c disposed opposite to each other in the thickness direction of the display panel 10, and a first side surface 511a connected between the bottom surface 511b and the top surface 511c. The top surface 511c is located on the side of the bottom surface 511b away from the substrate 100. The second portion 512 has a second side surface 512a facing the pixel opening 520. The angle between the first side surface 511a and the bottom surface 511b is a first angle α, and the angle between the second side surface 512a and the top surface 511c is a second angle β. The first side surface 511a and the second side surface 512a are spaced apart, and the first angle α is greater than or equal to the second angle β.

[0117] According to an embodiment of this application, the display panel 10 includes a substrate 100, a pixel definition layer 500, an isolation structure 200, and a light-emitting layer 300. The pixel defining portion 510 of the pixel definition layer 500 forms a pixel opening 520 to accommodate light-emitting units 310, enabling normal light emission from the light-emitting units 310. Furthermore, the pixel defining portion 510 defines the area where each light-emitting unit 310 is located, reducing color mixing issues between the light-emitting units 310. When the light-emitting layer 300 is fabricated, a large drop occurs at the edge of the isolation structure 200, making it difficult to connect and causing breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310 located within the isolation opening 240. This eliminates the need for a precision mask, reducing the development and use of precision masks and lowering manufacturing costs. The pixel defining portion 510 includes a first portion 511 and a second portion 512. A first included angle α exists between the first side surface 511a and the bottom surface 511b of the first portion 511, and a second included angle β exists between the second side surface 512a of the second portion 512 and the top surface 511c of the first portion 511. A section of the top surface 511c of the first portion 511 exists between the first side surface 511a and the second side surface 512a. During the subsequent fabrication of the first electrode 410, after the first electrode 410 ascends from the stepped position of the first portion 511, it passes through the relatively flat top surface 511c, and then ascends from the second side surface 512a of the second portion 512 to the side of the second portion 512 facing away from the substrate 100. This portion of the top surface 511c between the first side surface 511a and the second side surface 512a can buffer the ascent of the first electrode 410, thereby mitigating the problem of stress concentration leading to cracks in the first electrode 410. The second included angle β is larger, and the slope of the second side 512a is gentler than the slope of the first side 511a, so that the slope of the first electrode 410 on the pixel limiting part 510 gradually becomes gentler, further improving the problem of stress concentration in the first electrode 410 causing cracks.

[0118] In this embodiment, other structures can be referred to the foregoing descriptions, and will not be repeated here.

[0119] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.

[0120] Please see Figures 6 to 12 And see Figures 1 to 5 , Figure 6 This is a flowchart of a method for manufacturing a display panel provided in an embodiment of this application; Figures 7 to 12 This is a process diagram of the fabrication of a display panel provided in an embodiment of this application.

[0121] like Figures 6 to 12 As shown, an embodiment of the third aspect of this application provides a method for manufacturing a display panel 10, the method comprising:

[0122] Step S01: Prepare a pixel definition material layer 501 on the substrate 100.

[0123] Step S02: An isolation structure 200 is prepared on the substrate 100, and the isolation structure 200 encloses and forms a plurality of isolation openings 240.

[0124] Step S03: Pattern the pixel definition material layer 501 to obtain a pixel definition layer 500. The pixel definition layer 500 includes a pixel defining portion 510 and a pixel opening 520 formed by the pixel defining portion 510. The pixel opening 520 is connected to the isolation opening 240. The pixel defining portion 510 includes a first portion 511 and a second portion 512. The second portion 512 is located on the side of the first portion 511 facing away from the substrate 100. The orthographic projection of the second portion 512 onto the substrate 100 is located within the orthographic projection of the first portion 511 onto the substrate 100. A portion 511 has a bottom surface 511b and a top surface 511c disposed opposite to each other in the thickness direction of the display panel 10, and a first side surface 511a connected between the bottom surface 511b and the top surface 511c. The top surface 511c is located on the side of the bottom surface 511b away from the substrate 100. A second portion 512 has a second side surface 512a facing the pixel opening 520. The angle between the first side surface 511a and the bottom surface 511b is a first angle α, and the angle between the second side surface 512a and the top surface 511c is a second angle β. The first angle α and the second angle β are less than 90°.

[0125] Step S04: Prepare a light-emitting layer 300 on the side of the pixel definition layer 500 facing away from the substrate 100. The light-emitting layer 300 includes light-emitting units 310 that are at least partially located in the isolation opening 240.

[0126] According to the preparation method of this application embodiment, a pixel defining material layer 501 is prepared in step S01. An isolation structure 200 is prepared in step S02. When the light-emitting layer 300 is prepared, a large drop occurs at the edge of the isolation structure 200, making it difficult to connect, thus causing breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310 located within the isolation opening 240. This eliminates the need for a precision mask, reducing the development and use of precision masks and lowering preparation costs. The pixel defining layer 500 is prepared in step S03. The pixel defining portion 510 of the pixel defining layer 500 encloses a pixel opening 520 to house the light-emitting units 310, enabling normal light emission from the light-emitting units 310. Furthermore, the pixel defining portion 510 defines the placement area of ​​each light-emitting unit 310, reducing color crosstalk between the light-emitting units 310. The light-emitting layer 300 is prepared in step S04. The pixel limiting portion 510 includes a first portion 511 and a second portion 512. The first side surface 511a of the first portion 511 has a first included angle α with the bottom surface 511b, and the second side surface 512a of the second portion 512 has a second included angle β with the top surface 511c of the first portion 511. The first included angle α and the second included angle β are both less than 90°, making the slope of the pixel limiting portion 510 at the two step positions of the first portion 511 and the second portion 512 relatively gentle. When the first electrode 410 is subsequently manufactured, the first electrode 410 has higher climbing reliability at the two step positions of the first portion 511 and the second portion 512. This improves the problem that when the first included angle α or the second included angle β is 90°, the first electrode 410 is prone to cracks at the step positions of the first portion 511 or the second portion 512, which can lead to the failure of the first electrode 410 and the exposure of the light-emitting unit 310 or the pixel limiting portion 510 by cracks. The light-emitting unit 310 or the pixel limiting portion 510 is then etched and damaged in subsequent etching processes, resulting in dark spots on the display panel 10. This improves the performance of the display panel 10.

[0127] Optionally, before step S01, the method further includes:

[0128] A second electrode 530 is fabricated on the substrate 100.

[0129] Optionally, before step S01, the method further includes:

[0130] A signal line layer 600 is fabricated on a substrate 100.

[0131] like Figure 7 and Figure 8 As shown, in some optional embodiments, the display panel 10 includes a display area AA and a non-display area NA adjacent to the display area AA. Before step S02, the method further includes:

[0132] The pixel definition material layer 501 is patterned to form a connection opening 540 located in the non-display area NA and a groove 521 located in the display area AA. The connection opening 540 penetrates the pixel definition material layer 501 in the thickness direction, and the groove 521 penetrates part of the pixel definition material layer 501 in the thickness direction.

[0133] In these optional embodiments, before fabricating the isolation structure 200, the pixel definition material layer 501 is first patterned to form a connection opening 540 in the non-display area NA and a groove 521 in the display area AA. The connection opening 540 extends through the pixel definition material layer 501, allowing the underlying signal line layer 600 to be exposed. During the subsequent fabrication of the isolation structure 200, the isolation structure 200 can fall into the connection opening 540 and contact the signal line layer 600, thus providing signal to the isolation structure 200. The groove 521 extends through a portion of the pixel definition material layer 501, leaving a thin layer of pixel definition material layer 501 above the second electrode 530 to avoid etching damage to the second electrode 530 during the subsequent fabrication of the isolation structure 200.

[0134] Optionally, the orthographic projection of the groove 521 onto the substrate 100 is located within the orthographic projection of the second electrode 530 onto the substrate 100, so that the second electrode 530 can be exposed after the pixel definition material layer 501 is further patterned at the groove 521.

[0135] In some optional embodiments, prior to the step of patterning the pixel definition material layer 501 to form the connection opening 540 located in the non-display area NA and the groove 521 located in the display area AA, the method further includes:

[0136] A first etch barrier layer 550 is prepared on the side of the pixel definition material layer 501 facing away from the substrate 100;

[0137] A halftone mask is used to pattern the first etch barrier layer 550 to form a first opening 551 located in the non-display area NA and a second opening 552 located in the display area AA. The first opening 551 penetrates the first etch barrier layer 550 in the thickness direction, and the second opening 552 penetrates part of the first etch barrier layer 550 in the thickness direction.

[0138] In these optional embodiments, a halftone mask is used to pattern the first etch barrier layer 550 to form a first opening 551 and a second opening 552. The first opening 551 penetrates the first etch barrier layer 550, allowing subsequent patterning of the pixel definition material layer 501 through the first opening 551 to form a connection opening 540 on the pixel definition material layer 501. The second opening 552 partially penetrates the first etch barrier layer 550, allowing subsequent patterning of the pixel definition material layer 501 through the second opening 552 to form a groove 521 on the pixel definition material layer 501.

[0139] Optionally, the halftone mask has a first region and a second region, which have different transmittances. For example, the transmittance of the first region is greater than that of the second region. When the first etch barrier layer 550 is patterned using the halftone mask, the first etch barrier layer 550 forms a first opening 551 at the corresponding position in the first region and a second opening 552 at the corresponding position in the second region.

[0140] Optionally, the material of the first etch barrier layer 550 may include photoresist (PR).

[0141] In some optional embodiments, the step of patterning the pixel definition material layer 501 to form the connection opening 540 located in the non-display area NA and the groove 521 located in the display area AA includes:

[0142] The pixel definition material layer 501 is patterned through the first opening 551 and the second opening 552 to form a connection opening 540 corresponding to the first opening 551 and a groove 521 corresponding to the second opening 552.

[0143] In these optional embodiments, patterning the pixel definition material layer 501 through the first opening 551 forms a connection opening 540 on the pixel definition material layer 501, allowing the underlying signal line layer 600 to be exposed through the connection opening 540. During the subsequent fabrication of the isolation structure 200, the isolation structure 200 can fall into the connection opening 540 and contact the signal line layer 600, thus providing signal to the isolation structure 200. Patterning the pixel definition material layer 501 through the second opening 552 forms a groove 521 on the pixel definition material layer 501, ensuring a thin layer of pixel definition material layer 501 remains above the second electrode 530, thus avoiding etching damage to the second electrode 530 during the subsequent fabrication of the isolation structure 200.

[0144] like Figure 10 and Figure 11As shown, in some optional embodiments, the step of patterning the pixel definition material layer 501 to obtain the pixel definition layer 500 includes:

[0145] The pixel definition layer 500 is formed by patterning the groove 521 of the pixel definition material layer 501 through the isolation opening 240.

[0146] In these optional embodiments, after the isolation structure 200 is fabricated, the pixel definition material layer 501 is patterned a second time to remove a thin layer of pixel definition material layer 501 at the groove 521, forming a pixel opening 520, so that the second electrode 530 is exposed through the pixel opening 520. The pixel definition material layer 501 is patterned twice, so that the formed pixel defining portion 510 has two stepped positions, namely a first included angle α and a second included angle β, which facilitates a smoother slope for the subsequent first electrode 410.

[0147] In some optional embodiments, the step of patterning the groove 521 of the pixel definition material layer 501 through the isolation opening 240 to form the pixel definition layer 500 includes:

[0148] The groove 521 of the pixel definition material layer 501 is patterned using a plasma etching process to form a pixel defining portion 510 with a first included angle α and a second included angle β.

[0149] In these optional embodiments, the pixel defining material layer 501 is etched using a plasma etching process through the isolation opening 240. Compared to the related art that uses photolithography (i.e., photoresist covering and etching the pixel defining material layer 501 through the opening of the photoresist), this embodiment results in a gentler slope on the sidewall of the pixel defining portion 510 towards the pixel opening 520. The absence of photolithography mitigates the problem of a steep sidewall slope on the pixel defining portion 510 towards the pixel opening 520, which is caused by etching process deviations in photolithography and affects the subsequent climbing of the first electrode 410 on the pixel defining portion 510, leading to pixel dark spots. Furthermore, it mitigates the problem of stress concentration and cracking in the first electrode 410 due to a steep slope in the pixel defining portion 510, which fails to provide effective protection for the pixel defining portion 510 and easily causes etching damage to the pixel defining portion 510 and the second electrode 530 in subsequent processes. In this embodiment, the isolation structure 200 serves as a mask for the plasma etching process. The isolation opening 240 and the groove 521 are self-aligned, making it difficult for process deviations to occur. The etching accuracy is high, preventing the problem of abnormal slope of the pixel limiting part 510 caused by the alignment deviation that may occur when using an additional photolithography process.

[0150] In some optional embodiments, the step of patterning the grooves 521 of the pixel definition material layer 501 using a plasma etching process includes:

[0151] The pixel definition material layer 501 is patterned using a plasma etching process with a bias power of 1kW to 3kW.

[0152] In these optional embodiments, a plasma etching process with a low bias power is used for etching, for example, a bias power of 1 kW, 2 kW, 2.5 kW, or 3 kW. A bias power greater than or equal to 1 kW can mitigate the problem of low plasma traction, poor plasma bombardment of the material, low etching rate, and reduced etching efficiency caused by an insufficient bias power. A bias power less than or equal to 3 kW can mitigate the problem of excessive plasma bombardment of the material, excessive longitudinal etching rate, and the tendency for a steep slope to form on the sidewall of the pixel defining portion 510 towards the pixel opening 520 during the etching of the pixel defining material layer 501, which affects the subsequent climbing of the first electrode 410 on the pixel defining portion 510 and results in pixel dark spots. The bias power is 1kW to 3kW, which makes the plasma etching of the material biased to isotropic, that is, the etching rate is similar in all directions (e.g., lateral and longitudinal). The sidewall slope of the pixel limiting part 510 is relatively gentle, which is beneficial to the subsequent climbing of the first electrode 410.

[0153] like Figure 9 and Figure 10 As shown, in some optional embodiments, the step of fabricating the isolation structure 200 on the substrate 100 includes:

[0154] An isolation material layer is prepared on substrate 100;

[0155] A second etch barrier layer 250 is prepared on the side of the isolation material layer away from the substrate 100, and the second etch barrier layer 250 is patterned to form a third opening 251.

[0156] The isolation material layer is patterned through the third opening 251 to form an isolation structure 200.

[0157] In these alternative embodiments, a second etch barrier layer 250 is used to cover and protect the areas where the isolation material layer needs to be retained, and then the isolation material layer is patterned to form the isolation structure 200.

[0158] Optionally, the material of the second etch barrier layer 250 includes photoresist.

[0159] In some alternative embodiments, after the step of fabricating the isolation structure 200 on the substrate 100, the method further includes:

[0160] The second etch barrier layer 250 is retained, and the pixel definition material layer 501 is patterned to obtain the pixel definition layer 500.

[0161] In these optional embodiments, after the isolation structure 200 is fabricated, the second etch barrier layer 250 is retained. In the subsequent etching process of the pixel definition material layer 501, the second etch barrier layer 250 always forms an etch protection for the isolation structure 200 to avoid the problem of etch damage to the isolation structure 200 caused by the subsequent etching process of the pixel definition material layer 501. At the same time, the pixel definition material layer 501 is etched by plasma etching process, without the need to add an additional photoresist process, simplifying the fabrication process.

[0162] Optionally, after patterning the pixel definition material layer 501 to obtain the pixel definition layer 500, the method further includes:

[0163] Remove the second etch barrier layer 250.

[0164] Optionally, patterning the isolation material layer includes first dry etching the isolation material layer, and then wet etching the isolation material layer using a wet etching solution. In the wet etching process, the second electrode 530 is easily etched and damaged. Therefore, before the etching process of the isolation structure 200 is completed, there is always a thin pixel definition material layer 501 above the second electrode 530 to protect the second electrode 530 and avoid the wet etching solution in the wet etching process of the isolation structure 200 from etching damage to the second electrode 530.

[0165] An embodiment of the fourth aspect of this application also provides a display device, including the display panel 10 of any of the above embodiments, or the display panel 10 prepared by the preparation method of any embodiment. Since the display device provided by the embodiment of the fourth aspect of this application includes the display panel 10 of any of the above embodiments, or the display panel 10 prepared by the preparation method of any embodiment, the display device provided by the embodiment of the fourth aspect of this application has the beneficial effects of the display panel 10 of any of the above embodiments, or the display panel 10 prepared by the preparation method of any embodiment, which will not be elaborated further here.

[0166] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0167] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; A pixel definition layer is located on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel defining portion includes a first portion and a second portion. The second portion is located on the side of the first portion away from the substrate. The orthographic projection of the second portion on the substrate is located within the orthographic projection of the first portion on the substrate. An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings, the pixel openings being connected to the isolation openings; A light-emitting layer is located on one side of the substrate, and the light-emitting layer includes light-emitting units at least partially located in the isolation opening. The first portion has a bottom surface and a top surface disposed opposite to each other in the thickness direction of the display panel, and a first side surface connected between the bottom surface and the top surface. The top surface is located on the side of the bottom surface away from the substrate. The second portion has a second side surface facing the pixel opening. The angle between the first side surface and the bottom surface is a first angle, and the angle between the second side surface and the top surface is a second angle. The first angle and the second angle are less than 90°.

2. The display panel according to claim 1, characterized in that, The first side and the second side are spaced apart; Preferably, the second portion forms a closed loop around the pixel opening.

3. The display panel according to claim 1, characterized in that, The surface of the isolation structure facing the substrate is located within the orthographic projection of the second portion of the substrate.

4. The display panel according to claim 1, characterized in that, The first included angle is greater than or equal to the second included angle.

5. The display panel according to claim 1, characterized in that, The first included angle is 30° to 60°; Preferably, the second included angle is 15° to 45°.

6. The display panel according to claim 1, wherein the display panel includes a display area and a non-display area adjacent to the display area, the substrate includes a signal line layer, the pixel defining portion has a connection opening located in the non-display area, and the isolation structure is located in the connection opening and electrically connected to the signal line layer.

7. The display panel according to claim 1, characterized in that, The display panel also includes: A first electrode layer is located on the side of the light-emitting layer opposite to the substrate. The first electrode layer includes a plurality of first electrodes located within a plurality of isolation openings. The first electrodes are electrically connected to the isolation structure. Preferably, the display panel further includes a second electrode located between the substrate and the light-emitting unit, with at least a portion of the second electrode exposed through the pixel opening.

8. The display panel according to claim 1, characterized in that, The isolation structure includes a first layer and a second layer located on the side of the first layer facing away from the substrate, wherein the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; Preferably, the first layer comprises a conductive material; Preferably, the second layer comprises a conductive material or an insulating material; Preferably, both the first layer and the second layer comprise metallic materials, and the materials of the first layer and the second layer are different; Preferably, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, wherein the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

9. A display panel, characterized in that, The display panel includes: substrate; A pixel definition layer is located on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel defining portion includes a first portion and a second portion. The second portion is located on the side of the first portion away from the substrate. The orthographic projection of the second portion on the substrate is located within the orthographic projection of the first portion on the substrate. An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings, the pixel openings being connected to the isolation openings; A light-emitting layer is located on one side of the substrate, and the light-emitting layer includes light-emitting units at least partially located in the isolation opening. The first portion has a bottom surface and a top surface disposed opposite to each other in the thickness direction of the display panel, and a first side surface connected between the bottom surface and the top surface. The top surface is located on the side of the bottom surface away from the substrate. The second portion has a second side surface facing the pixel opening. The angle between the first side surface and the bottom surface is a first angle, and the angle between the second side surface and the top surface is a second angle. The first side surface and the second side surface are spaced apart, and the first angle is greater than or equal to the second angle.

10. The display panel according to claim 9, characterized in that, The first included angle and the second included angle are less than 90°.

11. A method for manufacturing a display panel, characterized in that, The method includes: A pixel-defining material layer is fabricated on a substrate; An isolation structure is fabricated on the substrate, the isolation structure enclosing and forming a plurality of isolation openings; The pixel definition material layer is patterned to obtain a pixel definition layer. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel opening and the isolation opening are connected. The pixel defining portion includes a first portion and a second portion. The second portion is located on the side of the first portion away from the substrate. The orthographic projection of the second portion on the substrate is located within the orthographic projection of the first portion on the substrate. The first portion has a bottom surface and a top surface that are disposed opposite to each other in the thickness direction of the display panel, and a first side surface connected between the bottom surface and the top surface. The top surface is located on the side of the bottom surface away from the substrate. The second portion has a second side surface facing the pixel opening. The angle between the first side surface and the bottom surface is a first angle, and the angle between the second side surface and the top surface is a second angle. The first angle and the second angle are less than 90°. A light-emitting layer is prepared on the side of the pixel definition layer away from the substrate, the light-emitting layer including light-emitting units at least partially located in the isolation opening.

12. The preparation method according to claim 11, characterized in that, The display panel includes a display area and a non-display area adjacent to the display area. Prior to the step of fabricating the isolation structure on the substrate, the method further includes: The pixel definition material layer is patterned to form a connection opening in the non-display area and a groove in the display area. The connection opening penetrates the pixel definition material layer in the thickness direction, and the groove penetrates a portion of the pixel definition material layer in the thickness direction.

13. The preparation method according to claim 12, characterized in that, Before the step of patterning the pixel definition material layer to form the connection opening in the non-display area and the groove in the display area, the method further includes: A first etching barrier layer is prepared on the side of the pixel definition material layer facing away from the substrate; The first etch barrier layer is patterned using a halftone mask to form a first opening in the non-display area and a second opening in the display area. The first opening penetrates the first etch barrier layer in the thickness direction, and the second opening penetrates a portion of the first etch barrier layer in the thickness direction. Preferably, the material of the first etch barrier layer includes photoresist.

14. The preparation method according to claim 13, characterized in that, The step of patterning the pixel definition material layer to form a connection opening in the non-display area and a groove in the display area includes: The pixel definition material layer is patterned through the first opening and the second opening to form the connection opening corresponding to the first opening and the groove corresponding to the second opening.

15. The preparation method according to claim 12, characterized in that, The steps of patterning the pixel definition material layer to obtain the pixel definition layer include: The pixel definition layer is formed by patterning the groove of the pixel definition material layer through the isolation opening.

16. The preparation method according to claim 15, characterized in that, The step of patterning the groove of the pixel definition material layer through the isolation opening to form the pixel definition layer includes: The groove of the pixel definition material layer is patterned using a plasma etching process to form the pixel definition portion having the first included angle and the second included angle.

17. The preparation method according to claim 16, characterized in that, The steps of patterning the grooves in the pixel definition material layer using plasma etching include: The pixel definition material layer is patterned using a plasma etching process with a bias power of 1kW to 3kW.

18. The preparation method according to claim 11, characterized in that, The steps for fabricating the isolation structure on the substrate include: An isolation material layer is prepared on the substrate; A second etch barrier layer is prepared on the side of the isolation material layer facing away from the substrate, and the second etch barrier layer is patterned to form a third opening; The isolation material layer is patterned through the third opening to form an isolation structure; Preferably, the material of the second etch barrier layer includes photoresist.

19. The preparation method according to claim 18, characterized in that, After the step of fabricating the isolation structure on the substrate, the method further includes: The second etch barrier layer is retained, and the pixel definition material layer is patterned to obtain the pixel definition layer.

20. A display device, characterized in that, Includes the display panel according to any one of claims 1-10, or the display panel prepared by the preparation method according to any one of claims 11-19.

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