Display device

Abstract

A display device according to an example embodiment of the disclosure can include a substrate including a display area and a non-display area; a planarization layer disposed on the substrate and extending from the display area to the non-display area; an anode disposed on the planarization layer; a bank disposed on the planarization layer and configured to expose a portion of the anode corresponding to a light emitting area; an organic layer disposed in the light emitting area; a cathode disposed on the organic layer and extending to the non-display area; a protection layer disposed on the cathode; and an oxygen trapping portion disposed in the planarization layer under the bank, thereby enhancing reliability of the display device and improving durability of a light emitting element.

Description

Technical Field

[0001] This disclosure relates to a display device, and more specifically, to a display device in which the permeation of moisture and oxygen is minimized or reduced. Background Technology

[0002] Currently, as the world enters a fully mature information age, the field of display devices that visually display electrical information signals is developing rapidly, and research is underway to develop various performance characteristics of display devices, such as thinness, weight reduction, and low power consumption.

[0003] Representative display devices include liquid crystal displays (LCDs), electrowetting displays (EWDs), and organic light-emitting displays (OLEDs).

[0004] Among them, electroluminescent display devices, including organic light-emitting display devices, are self-emissive display devices and, unlike liquid crystal display devices, do not require a separate light source, thus allowing them to be manufactured with light weight and small thickness. Furthermore, electroluminescent display devices are advantageous not only in terms of power consumption due to low-voltage operation, but also in terms of color reproduction, response speed, viewing angle, and contrast, making them desirable for use in various fields.

[0005] In organic light-emitting display devices, the organic layers that make up the light-emitting elements are easily affected by heat, moisture, oxygen, etc. Therefore, it is important to develop display devices that can minimize or reduce the penetration of moisture and oxygen.

[0006] The descriptions provided in the background section should not be construed as prior art simply because they are mentioned in or associated with that section. The background section may include information describing one or more aspects of the subject matter art, and the descriptions in that section do not limit this disclosure. Summary of the Invention

[0007] One object of this disclosure is to provide a display device that can minimize or reduce the penetration of moisture and oxygen.

[0008] Another objective of this disclosure is to provide a display device capable of preventing or reducing dark spot defects by effectively collecting oxygen introduced through a damaged cathode.

[0009] Another objective of this disclosure is to provide a display device that can be easily applied without significantly altering existing manufacturing processes, while preventing or reducing the penetration of moisture and oxygen.

[0010] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0011] A display device according to an exemplary embodiment of the present disclosure may include: a substrate including a display area and a non-display area; a planarization layer disposed on the substrate and extending from the display area to the non-display area; an anode disposed on the planarization layer; a dam disposed on the planarization layer and exposing a portion of the anode corresponding to the light-emitting area, and extending to the non-display area; an organic layer disposed in the light-emitting area; a cathode disposed on the organic layer and extending to the non-display area; a protective layer disposed on the cathode; and an oxygen-capturing portion disposed in the planarization layer below the dam.

[0012] Further details of the implementation methods are included in the detailed description and accompanying drawings.

[0013] According to the present invention, the penetration of moisture and oxygen can be minimized or reduced by forming a groove pattern at the edge of the non-display area. Therefore, the reliability of the display device and the durability of the light-emitting element can be improved.

[0014] According to this disclosure, an oxygen trapping section is added to an insulating layer below, on the top surface of, or inside the black dam section to effectively collect oxygen introduced through a damaged cathode, thereby preventing or reducing dark spot defects. Therefore, the reliability and yield of the display device are improved, and stable performance is maintained even during long-term use. Furthermore, the display device can operate stably even in extreme environments such as high temperature, high humidity, and low temperature, and performance degradation can be prevented or reduced even in various environments.

[0015] This disclosure can be applied without significantly altering existing manufacturing processes, thereby providing the effects of increased productivity and reduced manufacturing costs.

[0016] In this disclosure, increased production volume reduces resource consumption in the manufacturing process, and consequently, reduces the use of fossil fuels. This results in reduced greenhouse gas emissions, contributing to the achievement of ESG (Environmental, Social, and Governance) objectives. This helps establish a sustainable manufacturing environment and provides a positive environmental aspect.

[0017] The effects of this disclosure are not limited to the examples above, and many more effects are included in this disclosure.

[0018] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0019] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a plan view of a display device according to the first embodiment of the present disclosure.

[0020] Figure 2 It is along Figure 1 The cross-sectional view taken by line A-A' in the diagram.

[0021] Figure 3 This is a cross-sectional view of a display device according to a second embodiment of the present disclosure.

[0022] Figure 4 This is a cross-sectional view of a display device according to a third embodiment of the present disclosure.

[0023] Figure 5 This is a plan view of a display device according to the fourth embodiment of the present disclosure.

[0024] Figure 6 It is along Figure 5 The cross-sectional view taken by line B-B' in the diagram.

[0025] Figure 7 This is a cross-sectional view of a display device according to the fifth embodiment of the present disclosure.

[0026] Figure 8 This is a cross-sectional view of a display device according to the sixth embodiment of the present disclosure.

[0027] Figure 9 This is a plan view of a display device according to the seventh embodiment of the present disclosure.

[0028] Figure 10 It is along Figure 9 The cross-sectional view taken by line C-C' in the diagram. Detailed Implementation

[0029] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the following detailed description of exemplary embodiments in conjunction with the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0030] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of other components unless used in conjunction with the term “only.” Unless otherwise expressly indicated, any reference to the singular may include the plural.

[0031] The component is interpreted to include a normal tolerance range, even if not explicitly stated.

[0032] When using terms such as “above,” “over,” “below,” and “beside” to describe the positional relationship between two parts, one or more parts may be positioned between the two parts, unless these terms are used with the terms “exactly” or “directly.”

[0033] When an element or layer is placed "on" another element or layer, the other layer or element can be directly inserted on or between the other element.

[0034] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from others. Therefore, in the technical concept of this disclosure, the first component referred to below may be the second component.

[0035] Throughout the disclosure, the same reference numerals generally denote the same elements.

[0036] The dimensions and thicknesses of each component shown in the accompanying drawings are for ease of description and this disclosure is not limited to the dimensions and thicknesses of the components shown.

[0037] Features of the various embodiments of this disclosure may be partially or completely adhered to or combined with each other, and may be interlocked and operated in technically different ways, and the embodiments may be performed independently of each other or in relation to each other.

[0038] Any implementation described as an "example" in this article is not necessarily to be interpreted as preferred or superior to other implementations.

[0039] When describing temporal relationships, discontinuous cases may be included if the temporal order is described as such as “after,” “following,” “next,” and “before,” unless more restrictive terms such as “just,” “immediately,” or “directly” are used.

[0040] Furthermore, when a component or layer is “connected,” “joined,” or “adhered” to another component or layer, unless otherwise stated, the component or layer may not only be directly connected or adhered to the other component or layer, but also indirectly connected or adhered to the other component or layer, with one or more intermediate components or layers “set” or “intercalated” between the components or layers. This should be understood to mean that components may be arranged to be in direct contact with each other, or may be arranged to be in direct contact with each other.

[0041] The terms “first element,” “second element,” and / or “third element” should be understood as one of the first, second, and third elements, or any or all combinations of the first, second, and third elements. For example, A, B, and / or C can refer to only A; only B; only C; any or some combinations of A, B, and C; or all of A, B, and C.

[0042] The term “at least one” should be understood to include any and all combinations of one or more of the associated listed items. For example, “at least one of the first element, the second element, and the third element” means a combination of all three listed elements, a combination of any two of the three elements, and each individual element, the first element, the second element, or the third element.

[0043] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It should also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, the terms “part” or “unit” can be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the functions described herein that would be understood by one of ordinary skill in the art.

[0044] In the following, various embodiments of this disclosure will be described in detail with reference to the accompanying drawings.

[0045] Figure 1 This is a plan view of a display device according to the first embodiment of the present disclosure.

[0046] Reference Figure 1 The display device 100 according to the first embodiment of the present disclosure may include a display panel, a flexible film 180 and a printed circuit board 170.

[0047] The display panel is a panel used to display images to the user.

[0048] The display panel can be simply configured by a substrate 111 and a packaging section, which includes a sealing member on the substrate 111 and a packaging substrate 160.

[0049] A display panel can include display elements for displaying images, driving elements for driving the display elements, and lines for transmitting various signals to the display elements and driving elements. The display elements can be defined in different ways depending on the type of display panel. For example, when the display panel is an organic light-emitting panel, the display element can be an organic light-emitting element comprising an anode, an organic light-emitting layer, and a cathode. Similarly, when the display panel is a liquid crystal display panel, the display element can be a liquid crystal display element.

[0050] In the following text, even if it is assumed that the display panel is an organic light-emitting display panel, the display panel is not limited to organic light-emitting display panels.

[0051] The display panel can include a display area AA and a non-display area NA.

[0052] Display area AA is the area in the display panel where the image is displayed.

[0053] In the display area AA, multiple sub-pixels SP constituting multiple pixels and circuitry for driving the multiple sub-pixels SP can be provided. The multiple sub-pixels SP are the smallest units constituting the display area AA, and display elements can be disposed in each of the multiple sub-pixels SP, and the multiple sub-pixels SP can constitute a pixel. For example, an organic light-emitting element including an anode, an organic light-emitting layer, and a cathode can be disposed in each of the multiple sub-pixels SP, but is not limited thereto. Furthermore, the circuitry for driving the multiple sub-pixels SP can include driving elements, lines, etc. For example, the circuitry can include thin-film transistors, storage capacitors, gate lines, data lines, etc., but is not limited thereto.

[0054] The non-display area NA is the area where no image is displayed.

[0055] Figure 1 The diagram shows a non-display area NA surrounding a display area AA with a rectangular shape. However, the shape and arrangement of the display area AA and the non-display area NA are not limited to these. Figure 1 The example shown.

[0056] The display area AA and the non-display area NA can have shapes suitable for the design of electronic devices that include display devices. For example, the display area AA can have various shapes, such as pentagons, hexagons, circles, and ellipses.

[0057] In the non-display area NA, various lines and circuits can be set up to drive the organic light-emitting elements of the display area AA. For example, in the non-display area NA, connection lines can be set up to send signals to multiple sub-pixels SP and circuits or driver ICs (such as gating driver ICs and data driver ICs) in the display area AA, but are not limited to this.

[0058] The display device 100 may include various additional components for generating various signals or driving pixels in the display area AA. Additional components for driving pixels may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, etc. The display device 100 may also include additional components related to functions other than pixel driving. For example, the display device 100 may include additional components providing touch sensing functions, user authentication functions (e.g., fingerprint recognition), multi-level pressure sensing functions, haptic feedback functions, etc. These additional components may be located in the non-display area NA and / or in external circuitry connected to a connection interface.

[0059] The flexible film 180 is a film in which various components are disposed on a flexible base film. For example, the flexible film 180 is a film used to provide signals to circuits in multiple sub-pixels SP and display area AA, and can be electrically connected to the display panel. The flexible film 180 is disposed at one end of the non-display area NA of the display panel to provide power voltage and data voltage to the circuits in the multiple sub-pixels SP and display area AA. The number of flexible films 180 can vary depending on the design, but is not limited thereto.

[0060] Furthermore, driver ICs, such as gating driver ICs and data driver ICs, can be disposed on the flexible film 180. Driver ICs are components that process data used to display images and drive signals used to process that data. Depending on the mounting method, driver ICs can be disposed using methods such as chip-on-glass (COG), chip-on-film (COF), or tape-on-package (TCP).

[0061] A printed circuit board 170 can be disposed at one end of the flexible film 180 and connected to the flexible film 180. The printed circuit board 170 is a component that provides signals to the driver IC. The printed circuit board 170 can provide various signals to the driver IC, such as drive signals and data signals. For example, a data driver for generating data signals can be mounted on the printed circuit board 170, and the generated data signals can be provided to the circuitry of multiple sub-pixels SP and the display panel via the flexible film 180. The number of printed circuit boards 170 can vary depending on the design, but is not limited to this.

[0062] In the first embodiment of this disclosure, a trench pattern 190 formed by removing a portion of the planarization layer can be disposed in the non-display area NA, and the cathode can extend partially onto the trench pattern 190. Therefore, in the first embodiment of this disclosure, the rate at which moisture and oxygen permeate into the side surface of the display panel can be slowed down. Consequently, the reliability of the display device 100 and the durability of the light-emitting elements can be improved.

[0063] The groove pattern 190 can be set into a frame shape along the three sides of the non-display area NA, excluding one side of the display panel. That is, refer to... Figure 1 Due to the configuration of the driver IC and the connection of the flexible film 180, the lower side of the display panel is not suitable for forming the groove pattern 190. Therefore, the groove pattern 190 can be provided on the edges of the three sides of the display panel other than the lower side. However, this disclosure is not limited to this, and for example, the groove pattern 190 can be provided in a rectangular frame shape along all four sides of the non-display area NA of the display panel.

[0064] As described above, the encapsulation portion may include an adhesive layer and an encapsulation substrate 160.

[0065] According to this disclosure, for example, a multi-layer packaging structure including a relatively thick packaging substrate 160 can be applied. In this case, rigidity and heat dissipation can be adequately ensured. However, this disclosure is not limited thereto.

[0066] Meanwhile, in the first embodiment of this disclosure, an oxygen trapping section is added to the insulating layer below the black embankment to collect oxygen introduced through the damaged cathode, thereby preventing or reducing dark spot defects. Figure 1 The first region A1 of the planarization layer, including the oxygen trapping section, is shown as an example. When the sub-pixels SP are arranged in a matrix, the first region A1 can be set to a grid shape, covering the portion of the display area AA corresponding to the boundary between the sub-pixels SP, and the portion inside the groove pattern 190 of the non-display area NA. However, this disclosure is not limited thereto.

[0067] In the following text, reference will be made to Figure 2 The first region A1 of the planarization layer, which includes a groove pattern 190 and an oxygen trapping section, is described in detail according to the first embodiment.

[0068] Figure 2 It is along Figure 1 The cross-sectional view taken by line A-A' in the diagram.

[0069] Figure 2 An exemplary cross-section of a portion of the left side of a display panel 110 on which a groove pattern 190 is formed is shown.

[0070] Reference Figure 2In the display panel 110 according to the first embodiment of the present disclosure, the driving element 120 may be disposed on the substrate 111.

[0071] In addition, the planarization layer 116 may be disposed on the drive element 120.

[0072] In addition, the light-emitting element 130 electrically connected to the driving element 120 can be disposed on the planarization layer 116, and the protective layer 118 can be disposed on the light-emitting element 130 to minimize or reduce the penetration of oxygen and moisture into the light-emitting element 130.

[0073] The adhesive layer 150 and the encapsulation substrate 160 may be sequentially disposed on the protective layer 118. However, the display panel 110 according to the first embodiment of this disclosure is not limited to such a stacked structure.

[0074] The adhesive layer 150 may be referred to as a sealing member, and the encapsulation substrate 160 may be referred to as a reinforcing substrate.

[0075] The substrate 111 can be a glass or plastic substrate.

[0076] When the substrate 111 is a plastic substrate, for example, a polyimide-based or polycarbonate-based material can be used to have flexibility.

[0077] Polyimide is widely used as a plastic substrate because it can be used in high-temperature processes and is a material that can be coated.

[0078] The buffer layer 112 can be disposed on the substrate 111.

[0079] Buffer layer 112 is a functional layer used to protect various electrodes and circuits from impurities such as alkali metal ions flowing from substrate 111 or the underlying layer. Buffer layer 112 may have a multilayer structure including a first buffer layer and a second buffer layer, but is not limited thereto. For example, buffer layer 112 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiples thereof.

[0080] The buffer layer 112 can slow down the diffusion of moisture and / or oxygen through the substrate 111. In addition, the buffer layer 112 may include multiple buffer layers and / or active buffer layers.

[0081] For example, the buffer layer 112 may extend to the end of the substrate 111 in the non-display area NA, but is not limited thereto.

[0082] A light shielding layer 125 can be disposed on the buffer layer 112. The purpose of forming the light shielding layer 125 is to prevent or reduce external light from flowing into the active layer 124 of the driving element 120 disposed thereon.

[0083] When the light shielding layer 125 is disposed on the buffer layer 112, the active buffer layer 113 can be disposed on the light shielding layer 125. The active buffer layer 113 protects the active layer 124 made of semiconductor of the driving element 120 and can block various types of defects introduced from the substrate 111.

[0084] The driving element 120 can be disposed on the active buffer layer 113.

[0085] For example, the driving element 120 may have the form in which an active layer 124, a gate insulating layer 115, a gate 121, a source 123 and a drain 122 are sequentially disposed, and may be electrically connected to the light-emitting element 130 to transmit current or signals to the light-emitting element 130.

[0086] The active layer 124 can be set on the active buffer layer 113.

[0087] The active layer 124 can be made of polycrystalline silicon (p-Si), and in this case, the predetermined region can be doped with impurities. Alternatively, the active layer 124 can be made of amorphous silicon (a-Si), and can be made of various organic semiconductor materials such as pentacene. Furthermore, the active layer 124 can be formed of oxide.

[0088] The gate insulating layer 115 can be disposed on the active layer 124.

[0089] The gate insulating layer 115 may be formed of an insulating inorganic material (such as silicon oxide (SiOx) or silicon nitride (SiNx)) or an insulating organic material. The gate insulating layer 115 may be disposed in an island shape below the gate 121 and on the active layer 124 below the source 123 and drain 122, but is not limited thereto, and may also be disposed on the entire surface of the substrate 111.

[0090] Gate 121, source 123, and drain 122 may be disposed on gate insulating layer 115, but are not limited thereto. Gate 121, source 123, and drain 122 may be disposed on different layers through interlayer insulating layers.

[0091] The gate 121, source 123 and drain 122 can be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au) or alloys thereof.

[0092] By selectively removing the gate insulating layer 115, a contact hole can be formed through which the source and drain regions of the active layer 124 are exposed.

[0093] The source and drain regions of the active layer 124 can be electrically connected to the source 123 and drain 122 respectively through contact holes.

[0094] A portion of the drain 122 can be electrically connected to the optical shielding layer 125 through another contact hole, and the active buffer layer 113 is removed from this other contact hole, but is not limited thereto.

[0095] An interlayer insulating layer 114 made of inorganic insulating material can be disposed on the gate 121, source 123 and drain 122 to cover the gate 121, source 123 and drain 122.

[0096] In addition, the color filter CF can be disposed on the interlayer insulating layer 114, but is not limited thereto, and the color filter CF can be omitted depending on the type of the light-emitting element 130.

[0097] The color filter CF for each subpixel can be any of red, green, and blue. Alternatively, if a white subpixel is implemented, a color filter CF may not be required. The arrangement of red, green, and blue can be formed in various ways.

[0098] In the case of bottom-emitting type, the color filter CF can be located below the anode 131.

[0099] The planarization layer 116 may be disposed on the drive element 120 constructed as described above.

[0100] The planarization layer 116 may have a multilayer structure comprising at least two layers.

[0101] For example, the planarization layer 116 may extend into the end of the substrate 111 in the non-display area NA, but is not limited thereto, and may be configured to be spaced at a predetermined distance from the end of the substrate 111.

[0102] The planarization layer 116 may have a thickness of about 2 μm, but is not limited to this.

[0103] The planarization layer 116 can be an outer coating layer, but is not limited to this.

[0104] The planarization layer 116 consists of two layers because the number of signal lines increases with the resolution of the display panel. As a result, it is difficult to arrange all the lines with minimal spacing on a single layer, thus forming an additional layer. This additional layer provides space for line arrangement and facilitates the design of line and electrode arrangements. Furthermore, when a dielectric material is used in the planarization layer 116, it can also be used to form capacitors between the metal layers.

[0105] A planarization layer 116 and an interlayer insulating layer 114 may be formed to expose a portion of the drain 122, and the drain 122 of the driving element 120 and the anode 131 of the light-emitting element 130 may be electrically connected through another contact hole.

[0106] The light-emitting element 130 can be disposed on the planarization layer 116. The light-emitting element 130 can be configured such that an anode 131, a plurality of organic layers 132, and a cathode 133 are disposed sequentially. The light-emitting element 130 may include an anode 131 disposed on the planarization layer 116, an organic layer 132 disposed on the anode 131, and a cathode 133 disposed on the organic layer 132.

[0107] The display device can be implemented as either a top-emitting or bottom-emitting type. In the top-emitting type, a reflective layer made of an opaque conductive material with high reflectivity, such as silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof, can be added below the anode 131, such that light emitted from the organic layer 132 is reflected by the anode 131 and guided upward, for example, in the direction of the top cathode 133. Conversely, in the case of the bottom-emitting type, the anode 131 can be made solely of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO). Hereinafter, the display panel 110 of this disclosure will be described under the assumption that it is a bottom-emitting type.

[0108] The embankment 117 can be provided in the remaining area other than the light-emitting area on the planarization layer 116. That is, the embankment 117 can have a embankment hole H that exposes the anode 131 corresponding to the light-emitting area.

[0109] According to a first embodiment of this disclosure, the embankment 117 can be formed of a black-based resin and can be used to improve reflective visibility. For example, the embankment 117 can be configured by dispersing a black dye in an organic material, but is not limited thereto, and can be formed of any black material as long as it is black. Furthermore, for example, the organic material can be a cardo-based polymer or a polymer including epoxy acrylates, but is not limited thereto.

[0110] As described above, since the embankment 117 comprises a black material, the embankment 117 can reduce external light reflection, especially diffuse reflection, which would have occurred if the embankment 117 were made of a transparent material.

[0111] Furthermore, the embankment 117 can be formed of multiple layers. For example, the lower embankment layer can be formed of a black material, but the upper embankment layer disposed thereon can be formed of a transparent material. In addition, the upper embankment layer may include spacers.

[0112] The embankment 117 may have a thickness of about 1 μm, but is not limited to this.

[0113] The organic layer 132 can be disposed on the anode 131 exposed by the embankment 117. The organic layer 132 may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc.

[0114] For example, the organic layer 132 may be disposed on the dam 117 (disposed on the dam hole H including the dam 117), but is not limited thereto, and some organic layers 132 may be disposed only on the anode 131.

[0115] The organic layer 132 can extend into the non-display area NA.

[0116] The cathode 133 can be disposed on the organic layer 132.

[0117] In the case of a top-emitting type, the cathode 133 may comprise a transparent conductive material. For example, the cathode 133 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. In the case of a bottom-emitting type, the cathode 133 may comprise any of a metallic material formed of a metal material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or alloys thereof. Alternatively, the cathode 133 may be configured by laminating a layer made of a transparent conductive material (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO)) and a layer made of a metallic material (e.g., gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or alloys thereof), but is not limited thereto.

[0118] The cathode 133 can extend into the non-display area NA.

[0119] The cathode 133 may extend partially into the trench pattern 190 to be spaced a predetermined distance from the end of the planarization layer 116 in the non-display area NA, but is not limited thereto.

[0120] Furthermore, the cathode 133 can be configured to cover the side surface of the organic layer 132 in the non-display area NA. The organic layer 132 can be configured to be spaced apart from the end of the cathode 133 by a predetermined distance, but is not limited thereto.

[0121] A protective layer 118 may be disposed on the light-emitting element 130. The protective layer 118 extends into the non-display area NA and may be disposed in the non-display area NA at a predetermined distance from the end of the planarization layer 116 and the end of the cathode 133. However, this disclosure is not limited thereto.

[0122] A cover layer (not shown) made of a material with high refractive index and high light absorption can be provided between the light-emitting element 130 and the protective layer 118 to reduce diffuse reflection of external light.

[0123] According to a first embodiment of the present invention, a portion of the planarization layer 116 is removed from the non-display area NA, so that the trench pattern 190 can be disposed in the non-display area NA.

[0124] For example, the groove pattern 190 can be set in a non-display area NA located outside the display area AA.

[0125] Meanwhile, when viewed from above, the groove pattern 190 can be positioned along the non-display area NA of the display panel 110. For example, the groove pattern 190 can be formed on the edges of three sides of the display panel 110, and in this case, the groove pattern 190 may not be formed on the underside of the display panel 110 to which the flexible film is attached. However, this disclosure is not limited thereto, and the groove pattern 190 can be formed on all four edges of the display panel 110.

[0126] For example, the trench pattern 190 can be formed by removing the planarization layer 116 of the non-display area NA located outside the display area AA through a photolithography process, but this disclosure is not limited thereto.

[0127] Figure 2 The illustration shows a case where one groove pattern 190 is provided as an example, but this disclosure is not limited thereto. That is, the groove pattern 190 can be provided as two or more groove patterns, and is not limited to this. Figure 2 The number of groove patterns shown is 190.

[0128] The groove pattern 190 can be used to slow down or partially block the penetration of moisture and oxygen introduced from the outside through the planarization layer 116 (which is an organic membrane).

[0129] Furthermore, the electric field line 135 may be provided in the trench pattern 190. For example, the electric field line 135 may be a low-potential electric field line for applying a negative voltage to the cathode 133, but this disclosure is not limited thereto.

[0130] For example, the power line 135 can be configured to cover the inside of the trench pattern 190. The power line 135 can also be configured to cover the side surface of the planarization layer 116 exposed by the trench pattern 190.

[0131] For example, power lines 135 may be arranged along the groove pattern 190 on the non-display areas NA on the left, right and top sides of the display panel 110, but this disclosure is not limited thereto.

[0132] For example, the cathode 133 may extend into the non-display area NA to cover the interior of the power line 135. In this case, the interior of the power line 135 is defined as the side adjacent to the display area AA, and may be the side facing the exterior adjacent to the non-display area NA.

[0133] As described above, electric field lines 135 and cathodes 133 formed of metallic material are deposited in the trench pattern 190 to cover the side surface of the planarization layer 116 within the trench pattern 190, thereby minimizing or reducing the penetration of moisture and oxygen.

[0134] Furthermore, an outer structure 117' with an island shape can be disposed outside the trench pattern 190 to cover the exterior of the power lines 135. In this case, the outer structure 117' can be an outer embankment made of the organic material constituting the embankment 117. Therefore, the embankment 117 and the outer structure 117' can be configured to be separate from each other relative to the trench pattern 190.

[0135] The outer structure 117' can be configured to be spaced a predetermined distance from the edge of the adhesive layer 150 and the encapsulation substrate 160. That is, in the first exemplary embodiment of this disclosure, the outer structure 117' is formed as a tapered portion covering the power lines 135 and the planarization layer 116, and is removed from the remaining area. Therefore, the water transfer velocity (WTV) can be suppressed or reduced.

[0136] On the other hand, in the non-display area NA on the lower side where the groove pattern 190 is not formed, the embankment 117 may not be divided into the outer structure 117' and may extend along the planarization layer 116 to the non-display area NA, but this disclosure is not limited thereto.

[0137] Furthermore, in the non-display area NA, the organic layer 132 can be disposed on the embankment 117.

[0138] The organic layer 132 extends into the non-display area NA, and the edge of the organic layer 132 may be disposed on the inside compared to the edge of the embankment 117, but this disclosure is not limited thereto.

[0139] In the non-display area NA, the cathode 133 can be disposed on the organic layer 132.

[0140] The cathode 133 may extend into the trench pattern 190 to cover the interior of the exposed power lines 135, but this disclosure is not limited thereto.

[0141] The cathode 133 can contact the exposed top surface of the electric field line 135, and can therefore receive low-potential electricity from the electric field line 135.

[0142] Furthermore, in the first embodiment of this disclosure, an oxygen capture section 140 is added to a planarization layer 116 beneath the black embankment section 117.

[0143] Typically, when a cathode is deposited on an organic light-emitting display panel and then exposed to moisture, trace amounts of moisture react with reactive groups present on the surface of the black diaphragm, forming acidic components. As a result, the cathode may be damaged, especially when oxygen (O2) seeps into the panel through the damaged cathode, potentially causing display defects such as dark spots.

[0144] Therefore, in the first embodiment of this disclosure, to solve this problem, an oxygen trapping section 140 is added to the insulating layer below the black embankment 117, such as the planarization layer 116 below the embankment 117. Thus, in this disclosure, oxygen introduced into the interior due to damage to the cathode 133 can be effectively collected, thereby reducing display defects and improving reliability.

[0145] As mentioned above, in Figure 1 The diagram illustrates, as an example, a first region A1 of a planarization layer 116 including an oxygen trapping section 140. When sub-pixels SP are arranged in a matrix, the first region A1 can be arranged in a grid pattern in the portion of the display area AA corresponding to the boundary between the sub-pixels SP and in the portion of the non-display area NA located inside the trench pattern 190. However, the arrangement shape of the first region A1 is not limited to a grid shape and can be configured in various shapes.

[0146] Furthermore, when the first region A1 is configured with a grid shape, the oxygen trapping section 140 is evenly distributed below the dam 117 to effectively cover paths where oxygen might be introduced, such as the gap between the cathode 133 and the dam 117. Therefore, the oxygen trapping section 140 can rapidly collect oxygen near the path of oxygen permeation, thereby effectively blocking oxygen.

[0147] Therefore, the planarization layer 116 can be divided into a first region A1 including the oxygen trapping section 140 and a second region A2 excluding the oxygen trapping section 140. The first region A1 is mainly disposed below the embankment 117, and the electrical characteristics of the light-emitting area where the light-emitting element 130 is formed and the circuit area where circuits such as thin-film transistors (TFTs) are disposed may be degraded due to the presence of the oxygen trapping section 140. Therefore, the corresponding region can be set as the second region A2 excluding the oxygen trapping section 140. That is, the first region A1 can be disposed below the display area AA (excluding the light-emitting area and the circuit area) and the non-display area NA (excluding the trench pattern 190) of the embankment 117, but this disclosure is not limited thereto.

[0148] The oxygen capture unit 140 may include cerium dioxide (CeO2), barium-calcium (BaCa) based metal oxides, carbon molecular sieves, or alkaline earth metals (such as barium (Ba), magnesium (Mg), strontium (Sr), and beryllium (Be)). However, this disclosure is not limited thereto.

[0149] Furthermore, as described above, the protective layer 118 may be disposed on the light-emitting element 130.

[0150] For example, the protective layer 118 can be made of inorganic insulating material.

[0151] The protective layer 118 can slow down the penetration of moisture from the top and inhibit the occurrence of defects caused by dents or foreign matter.

[0152] To slow down moisture penetration, the protective layer 118 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof, but is not limited thereto.

[0153] The adhesive layer 150 and the encapsulation substrate 160 can be disposed on the protective layer 118.

[0154] The adhesive layer 150 and the encapsulation substrate 160 may extend to the non-display area NA to cover a portion of the planarization layer 116, the trench pattern 190, and the protective layer 118.

[0155] The adhesive layer 150, together with the protective layer 118 and the encapsulation substrate 160, can protect the light-emitting element 130 from external moisture, oxygen, impact, etc.

[0156] The adhesive layer 150 may also include a hygroscopic agent. The hygroscopic agent may be hygroscopic particles that absorb moisture and oxygen to minimize or reduce the penetration of moisture and oxygen into the light-emitting element 130.

[0157] The encapsulation substrate 160 can be disposed on the adhesive layer 150. The encapsulation substrate 160, together with the adhesive layer 150, can protect the light-emitting element 130. The encapsulation substrate 160 can protect the light-emitting element 130 from external moisture, oxygen, impact, etc.

[0158] For example, the packaging substrate 160 may be formed of an iron / nickel alloy Invar, but is not limited thereto. The packaging structure disclosed herein may be a multilayer film structure including a thin-film metal film, a barrier film such as an aluminum foil, and multiple adhesive films and a reinforcing substrate such as an aluminum sheet.

[0159] As described above, the multilayer packaging structure consisting of the adhesive layer 150 and the packaging substrate 160 can be disposed on the protective layer 118, but this disclosure is not limited thereto. The packaging substrate 160 can be removed.

[0160] For example, the adhesive layer 150 of this disclosure may include a first adhesive layer facing the substrate 111, a second adhesive layer facing the packaging substrate 160, and a barrier layer disposed between the first adhesive layer and the second adhesive layer, but this disclosure is not limited thereto.

[0161] Each of the first and second adhesive layers can be made of a polymer material with adhesive properties.

[0162] To facilitate heat dissipation from the substrate 111, at least the first adhesive layer in the first and second adhesive layers can be formed from a mixture of particles comprising adhesive polymer material and metallic material. Therefore, the heat dissipation effect on the substrate 111 can be improved because the rate at which the driving heat generated from the substrate 111 is dissipated through the adhesive layer 150 can be increased.

[0163] In addition, to prevent moisture from penetrating into the pixel unit, the first adhesive layer may be formed from a mixture that further includes hygroscopic inorganic fillers.

[0164] The second adhesive layer may not include absorbent inorganic fillers, thus reducing the amount of expensive absorbent inorganic fillers used and lowering the manufacturing cost of adhesive layer 150. Furthermore, since the adhesion of the second adhesive layer can be improved compared to the first adhesive layer, the reliability of the adhesion between substrate 111 and encapsulation substrate 160 can be further enhanced.

[0165] Since the first and second adhesive layers are formed with a multi-layer structure, the advantage is that the reliability of reducing warping caused by bending of the display panel can also be improved.

[0166] The barrier layer can be formed from metallic materials.

[0167] A barrier layer can be introduced to achieve a laminated structure to enhance the bond with the first and second adhesive layers and reduce warping.

[0168] Since the adhesive layer 150 according to the first embodiment of this disclosure includes a first adhesive layer and a second adhesive layer separated by a barrier layer, it can be implemented to have a thickness of approximately twice that of a single layer of adhesive material without any processing defects. Therefore, since the package substrate 160 fixed by the adhesive layer 150 can be configured to have a greater thickness, rigidity can be easily increased and heat dissipation can be improved.

[0169] For example, the encapsulation substrate 160 may include any of a plastic polymer such as glass and PET.

[0170] Furthermore, in this disclosure, the protective layer may extend into the trench pattern to cover the cathode, as will be described in detail with reference to the accompanying drawings.

[0171] Figure 3 This is a cross-sectional view of the display device 210 according to the second embodiment of the present disclosure.

[0172] Figure 3 The second embodiment of this disclosure differs from the one described above in the construction of the protective layer 218. Figure 1 and Figure 2The first embodiment differs from the second, but is otherwise substantially the same; therefore, redundant descriptions will be omitted. Furthermore, the same reference numerals will be used for the same parts, and references can be made to... Figure 1 and Figure 2 The same reference numerals and corresponding parts are described.

[0173] Reference Figure 3 According to a second exemplary embodiment of this disclosure, a portion of the planarization layer 116 is removed from the non-display area NA, so that the trench pattern 190 can be set.

[0174] In this case, the power line 135 can be set in the groove pattern 190.

[0175] For example, the power line 135 can be configured to cover the inside of the trench pattern 190. The power line 135 can also be configured to cover the side surface of the planarization layer 116 exposed by the trench pattern 190.

[0176] In addition, for example, the cathode 133 may extend into the non-display area NA to cover the interior of the power line 135.

[0177] In addition, an outer structure 117' with an island shape can be provided on the outside of the trench pattern 190 to cover the outside of the power line 135.

[0178] Furthermore, in the non-display area NA, the organic layer 132 can be disposed on the embankment 117.

[0179] In the non-display area NA, the cathode 133 can be disposed on the organic layer 132.

[0180] The cathode 133 may extend into the trench pattern 190 to cover the interior of the exposed power lines 135, but this disclosure is not limited thereto.

[0181] In a second exemplary embodiment of this disclosure, the oxygen capture section 140 may be added to the planarization layer 116 below the embankment 117 in the same manner as in the first exemplary embodiment described above.

[0182] The oxygen capture unit 140 can be disposed in the first region A1 of the planarization layer 116.

[0183] For example, when the subpixel SP is set as a matrix, the first region A1 can be set as a grid in the portion of the display region AA corresponding to the boundary between the subpixel SP and in the portion of the non-display region NA located inside the groove pattern 190.

[0184] The protective layer 218 can be disposed above the light-emitting element 130.

[0185] For example, the protective layer 218 can be made of inorganic insulating material.

[0186] Here, in the second embodiment of this disclosure, the protective layer 218 may extend into the trench pattern 190 to cover the cathode 133, but this disclosure is not limited thereto.

[0187] The protective layer 218 can cover the cathode 133 within the trench pattern 190, thereby effectively preventing moisture from penetrating into the display device. When the protective layer 218 extends into the trench pattern 190, it can minimize or reduce the penetration of moisture from the external environment into the display device, thereby further improving the durability and long-term stability of the display device.

[0188] As described above, in the second exemplary embodiment of this disclosure, the protective layer 218 extends into the trench pattern 190 to cover the cathode 133, thereby effectively blocking external moisture penetration. Therefore, the durability, performance, and reliability of the display device can be improved.

[0189] Furthermore, the method of extending the protective layer can be modified in various ways, and this disclosure is not limited thereto. Extending the protective layer can improve performance and reliability while extending the lifespan of the display device. Therefore, embodiments of this disclosure can be appropriately adjusted according to the manufacturing process or usage environment to achieve optimal results.

[0190] Furthermore, according to this disclosure, the cathode can extend into the outer structure to cover the interior of the trench pattern, and a protective layer can be formed to cover both the outer structure and the cathode, as will be described in detail with reference to the accompanying drawings.

[0191] Figure 4 This is a cross-sectional view of the display device 310 according to the third embodiment of the present disclosure.

[0192] The structure of the cathode 333 and the protective layer 318 of the light-emitting element 330 is the same as described above. Figure 1 and Figure 2 The first embodiment differs in construction, but other constructions are substantially the same; therefore, redundant descriptions will be omitted. The same reference numerals will be used for the same elements, and references can be made to... Figures 1 to 3 The same reference numerals and corresponding elements are described.

[0193] Reference Figure 4 In the third embodiment of this disclosure, the trench pattern 190 is formed in the non-display area NA, and the power lines 135 may be disposed in the trench pattern 190. Furthermore, the island-shaped outer structure 117' may be disposed on the outer side of the trench pattern 190.

[0194] In the third embodiment of this disclosure, the cathode 333 can cover the interior of the electric field line 135 and extend to cover the top surface of the electric field line 135 exposed inside the trench pattern 190. Furthermore, the cathode 333 can extend to the outer structure 117' located outside the trench pattern 190, so that the cathode 333 can not only cover the electric field line 135 but also a portion of the interior areas of the trench pattern 190 and the outer structure 117', thereby effectively preventing moisture from penetrating from the external environment.

[0195] Furthermore, in the third embodiment of this disclosure, the protective layer 318 can be configured to cover the outer structure 117' together with the cathode 333. The protective layer 318 can be formed of an inorganic insulating material and can completely cover the upper and side surfaces of the cathode 333 and the outer structure 117' to more effectively prevent moisture penetration from the external environment. In particular, when the protective layer 318 is configured to continuously cover the top surface of the cathode 333 and the outer structure 117', moisture penetration into the display device can be more effectively prevented, thereby ensuring long-term reliability.

[0196] As described above, in the third exemplary embodiment of this disclosure, the cathode 333 is configured to extend into the outer structure 117', including the inner side of the trench pattern 190, and the protective layer 318 is configured to cover the outer structure 117' and the cathode 333 to maximize the durability and reliability of the display device.

[0197] As described above, the oxygen capture section 140 can be added to the planarization layer 116 below the dike section 117.

[0198] Furthermore, in the third embodiment of this disclosure, the oxygen trapping unit 340 may be additionally disposed in the protective layer 318. For ease of description, the oxygen trapping unit 140 added to the planarization layer 116 may be referred to as the first oxygen trapping unit 140, and the oxygen trapping unit 340 disposed in the protective layer 318 may be referred to as the second oxygen trapping unit 340.

[0199] As described above, according to the third embodiment of this disclosure, oxygen permeation can be more effectively prevented by the second oxygen trapping section 340 disposed in the protective layer 318 and the external structure 117′ disposed in the planarization layer 116 below the dike section 117, wherein the protective layer 318 is formed to cover the first oxygen trapping section 140.

[0200] Furthermore, according to this disclosure, considering that cathode damage caused by acidification of the black embankment mainly occurs outside the display area, an oxygen trapping section can be added only to the insulating layer below the black embankment area outside the display area, which will be described in detail with reference to the accompanying drawings.

[0201] Figure 5 This is a plan view of a display device according to the fourth embodiment of the present disclosure.

[0202] Figure 6 It is along Figure 5 The cross-sectional view taken by line B-B' in the diagram.

[0203] In addition to the location of the oxygen capture unit 140, Figure 5 and Figure 6 The fourth embodiment shown is essentially the same as described above. Figure 1 and Figure 2 The first embodiment shown is the same. Therefore, repeated descriptions of the same parts will be omitted. The same reference numerals will be used for the same elements, and can be referred to... Figures 1 to 4 Description of the same reference numerals and corresponding elements.

[0204] Reference Figure 5 and Figure 6 The display device 400 according to the fourth embodiment of the present disclosure may include a display panel 410, a flexible film 180, and a printed circuit board 170.

[0205] The driving element 120 can be disposed on the substrate 111, and the planarization layer 416 can be disposed on the driving element 120.

[0206] The embankment 117 can be set in an area other than the light-emitting area on the planarization layer 416.

[0207] Similar to the embodiments described above, the embankment 117 according to the fourth embodiment of this disclosure can be formed from a black-based resin.

[0208] Similar to the above embodiments, a portion of the planarization layer 416 can be removed from the non-display area NA, and the trench pattern 190 can be set in the non-display area NA.

[0209] For example, the groove pattern 190 can be set in a non-display area NA located outside the display area AA.

[0210] The groove pattern 190 may be arranged in a frame shape along three sides of the non-display area NA, excluding one side of the display panel 410. However, this disclosure is not limited to this, and for example, the groove pattern 190 may alternatively be arranged in a rectangular frame shape along all four sides of the non-display area NA of the display panel 410.

[0211] In addition, the power line 135 can be configured to cover the inside of the trench pattern 190.

[0212] An island-shaped external structure 117' covering the outside of the power lines 135 may be disposed outside the trench pattern 190. Additionally, the cathode 133 may extend into the non-display area NA to cover the interior of the power lines 135. Alternatively, the cathode 133 may cover the interior of the trench pattern 190 and extend into the external structure 117', but this disclosure is not limited thereto.

[0213] Furthermore, a fourth embodiment of this disclosure is characterized in that the oxygen trapping unit 440 is additionally disposed in the planarization layer 416 below the embankment 117. Specifically, in the fourth embodiment of this disclosure, considering that damage to the cathode 133 caused by acidification of the embankment 117 mainly occurs at the outer periphery of the display area AA, the oxygen trapping unit 440 can be selectively disposed only in the planarization layer 416 located at the outer periphery of the display area AA below the embankment 117. Therefore, oxygen permeation caused by damage to the cathode 133 mainly occurring outside the display area AA can be effectively prevented or reduced, while reducing the amount of oxygen trapping unit 440 used and improving the reliability of the display device 400.

[0214] Furthermore, as described above, the planarization layer 416 can be divided into a first region A1 including the oxygen trapping section 440 and a second region A2 excluding the oxygen trapping section 440. Figure 5 The diagram exemplarily illustrates a first region A1 including an oxygen trapping unit 440. When the subpixels SP are arranged in a matrix, the first region A1 can be set as a rectangular frame shape along the outer periphery of the display region AA, while being located inside the groove pattern 190. However, the configuration shape of the first region A1 is not limited to a rectangular frame shape and can be changed to various shapes.

[0215] Furthermore, according to this disclosure, oxygen trapping units can be added not only in the leveling layer but also in the dike section. Details will now be described with reference to the accompanying drawings.

[0216] Figure 7 This is a cross-sectional view of a display device according to the fifth embodiment of the present disclosure.

[0217] Figure 7 The fifth embodiment of this disclosure shown above is similar to the one described above. Figure 1 and Figure 2 The difference in the first embodiment shown is that an oxygen capture unit 540 is added to the dike 517, and the other configurations are basically the same, so redundant descriptions will be omitted.

[0218] The same reference numerals will be used for the same elements, and can be referenced. Figures 1 to 6 Description of the same reference numerals and corresponding elements.

[0219] Reference Figure 7In the display panel 510 according to the fifth exemplary embodiment of the present disclosure, the embankment 517 may be disposed in the area of ​​the planarization layer 116 other than the light-emitting area.

[0220] According to the fifth embodiment of this disclosure, the embankment 517 may be made of a black-based resin.

[0221] Meanwhile, an outer structure 517' with an island shape can be disposed outside the trench pattern 190 to cover the outside of the power line 135.

[0222] In this case, in the fifth embodiment of this disclosure, the oxygen trapping unit 540 may be additionally provided in the dike portion 517 and the outer structure 517'. The oxygen trapping unit 540 provided in the dike portion 517 and the outer structure 517' can be used to prevent oxygen from permeating through the damaged cathode 133. In particular, the oxygen trapping unit 540 in the dike portion 517 and the outer structure 517' can directly absorb and block oxygen from permeating the damaged cathode 133. Therefore, dark spot defects caused by oxygen permeation can be prevented more effectively, and the long-term reliability of the display device can be improved.

[0223] At the same time, this disclosure is not limited thereto, and the oxygen capture unit 540 may additionally be provided only in the dike 517 or only in the external structure 517'.

[0224] Furthermore, in the fifth embodiment of this disclosure, an oxygen-capturing section 140 may be added to the planarization layer 116 below the black embankment section 517. For ease of description, the oxygen-capturing section 140 added to the planarization layer 116 may be referred to as the first oxygen-capturing section 140, and the oxygen-capturing section 540 provided in the embankment section 517 and the outer structure 517' may be referred to as the second oxygen-capturing section 540.

[0225] As described above, according to the fifth embodiment of this disclosure, oxygen permeation can be more effectively prevented by a first oxygen trapping portion 140 added to the planarization layer 116 below the dike portion 517 and a second oxygen trapping portion 540 provided in the dike portion 517 and the outer structure 517'. Oxygen introduced from the outside can be transferred to the interior of the display panel 510 through the dike portion 517 and the planarization layer 116 via the damaged cathode 133. The second oxygen trapping portion 540 can primarily block oxygen from passing through the dike portion 517 and the outer structure 517', and the first oxygen trapping portion 140 can secondarily block oxygen from passing through the planarization layer 116. With this dual-blocking structure, the transmission of oxygen introduced from the outside into the display panel 510 can be effectively suppressed, thereby preventing dark spot defects and deterioration of the light-emitting element 130 and improving the long-term reliability and lifespan of the display device.

[0226] Furthermore, according to this disclosure, instead of adding a second oxygen trapping section to the dike and the external structure, a trapping section layer including the second oxygen trapping section can be deposited on the top surface of the dike and the external structure, and more details thereof will be described with reference to the accompanying drawings.

[0227] Figure 8 This is a cross-sectional view of a display device according to the sixth embodiment of the present disclosure.

[0228] Figure 8 The sixth embodiment of this disclosure shown is substantially the same as described above. Figure 1 and Figure 2 The first embodiment shown is the same, except that the oxygen trapping section 640 is added to the top surface of the embankment 117 and the outer structure 117'. Therefore, redundant descriptions will be omitted. The same reference numerals will be used for the same elements, and references can be made to... Figures 1 to 7 Description of the same reference numerals and corresponding elements.

[0229] Reference Figure 8 The display panel 610 according to the sixth exemplary embodiment of the present disclosure may include a substrate 111, and a light-emitting element 130, a dam 117 and an external structure 117′ disposed above the substrate 111.

[0230] In this case, in the sixth embodiment of this disclosure, the oxygen trapping section 140 can be added to the planarization layer 116 below the embankment 117. For ease of description, the oxygen trapping section 140 added to the planarization layer 116 can be referred to as the first oxygen trapping section 140.

[0231] Furthermore, in the sixth exemplary embodiment of this disclosure, the capturing layer 645 may be additionally disposed on the top surface of the embankment 117 and the outer structure 117'. In this case, the capturing layer 645 includes a second oxygen capturing section 640 and can effectively remove oxygen introduced from the outside, thereby extending the lifespan of the light-emitting element 130.

[0232] The capture layer 645 can be formed of an inorganic insulating material.

[0233] For example, physical vapor deposition (PVD), chemical vapor deposition (CVD), or atomic layer deposition (ALD) can be used to deposit the trapping layer 645, and the trapping layer 645 may include a metal that is highly reactive with oxygen or a compound with excellent oxygen trapping function. Furthermore, for example, the second oxygen trapping layer 640 may include cerium dioxide (CeO2), barium-calcium (BaCa) based metal oxides, carbon molecular sieves, or alkaline earth metals (such as barium (Ba), magnesium (Mg), strontium (Sr), and beryllium (Be)). However, this disclosure is not limited thereto.

[0234] For example, the trapping layer 645 may be configured to surround the upper and side surfaces of the dike 117 and the outer structure 117', but this disclosure is not limited thereto. The trapping layer 645 may be configured only on the top surface of the dike 117 and the outer structure 117'.

[0235] In the sixth configuration of this disclosure, the organic layer 132 may be disposed on the side and top surfaces of the capture layer 645. The cathode 133 may be disposed on the organic layer 132. Furthermore, the cathode 133 may extend into the trench pattern 190 to cover the interior of the exposed power lines 135 and the top and side surfaces of the capture layer 645, but this disclosure is not limited thereto.

[0236] As described above, according to the sixth embodiment of this disclosure, oxygen permeation can be more effectively prevented by the first oxygen trapping portion 140 added to the planarization layer 116 below the embankment 117 and the trapping portion layer 645 disposed on the top surface of the embankment 117 and the outer structure 117'. This dual-barrier structure effectively suppresses the transmission of oxygen introduced from the outside of the display panel 610 into the interior, thereby preventing or reducing dark spot defects and deterioration of the light-emitting element 130, and improving the long-term reliability and lifespan of the display device.

[0237] Furthermore, in the sixth exemplary embodiment of this disclosure, the oxygen removal function can be performed using a trapping layer 645 disposed on the top surface, without including separate oxygen trapping sections in the dike 117 and the outer structure 117'. This structure simplifies the manufacturing process and allows for more flexible adjustment of the oxygen trapping section material.

[0238] Furthermore, in the sixth embodiment of this disclosure, the oxygen removal performance can be adjusted by adjusting the deposition thickness of the capture layer 645, and the oxygen removal effect can be further enhanced by forming the capture layer 645 in a multilayer structure as needed.

[0239] Furthermore, according to this disclosure, oxygen trapping sections are added across the entire area of ​​the planarization layer, and the amount of oxygen trapping sections added to each area can be adjusted. Details will now be described with reference to the accompanying drawings.

[0240] Figure 9 This is a plan view of a display device according to the seventh embodiment of the present disclosure.

[0241] Figure 10 It is along Figure 9 The cross-sectional view taken by line C-C' in the diagram.

[0242] Apart from the difference in the amount of oxygen trapping portions 740a and 740b added to the first region A1 and the second region A2 of the planarization layer 716, Figure 9 and Figure 10The seventh embodiment of this disclosure shown is substantially the same as described above. Figure 1 and Figure 2 The first embodiment shown is the same. Therefore, redundant descriptions will be omitted. The same reference numerals are used to denote the same elements, and can be referred to... Figures 1 to 8 The same reference numerals and corresponding elements are described.

[0243] Reference Figure 9 and Figure 10 The display device 700 according to the seventh exemplary embodiment of the present disclosure may include a display panel 710, a flexible film 180, and a printed circuit board 170.

[0244] The driving element 120 can be disposed on the substrate 111.

[0245] In addition, a planarization layer 716 may be provided on the drive element 120.

[0246] For example, the planarization layer 716 may extend to the end of the substrate 111 in the non-display area NA, but this disclosure is not limited thereto, and the planarization layer 716 may be configured to be spaced apart from the end of the substrate 111 by a predetermined distance.

[0247] The embankment 117 can be set in the remaining area other than the light-emitting area on the planarization layer 716.

[0248] Similar to the embodiments described above, the embankment 117 according to the seventh embodiment of this disclosure can be formed of a black-based resin. Furthermore, according to the seventh exemplary embodiment of this disclosure, a portion of the planarization layer 716 can be removed from the non-display area NA, and the trench pattern 190 can be disposed in the non-display area NA. Additionally, the island-shaped outer structure 117' can be disposed outside the trench pattern 190 to cover the outer side of the power lines 135.

[0249] Meanwhile, the seventh embodiment of this disclosure is characterized in that oxygen capture units 740a and 740b are added to the planarization layer 716 below the dike 117 and the outer structure 117'.

[0250] In this case, the planarization layer 716 according to the seventh exemplary embodiment of the present disclosure can be divided into a first region A1 and a second region A2.

[0251] For example, the second region A2 may correspond to the light-emitting region in which the light-emitting element 130 is disposed and the circuit region in which a circuit such as a thin-film transistor TFT is disposed.

[0252] Additionally, the first region A1 may correspond to the display region AA, which does not include the light-emitting region and the circuit region, and the non-display region NA, which does not include the groove pattern 190.

[0253] In this case, the first oxygen trapping unit 740a can be disposed in the first region A1 of the planarization layer 716, and the second oxygen trapping unit 740b can be disposed in the second region A2 of the planarization layer 716.

[0254] The first oxygen capture unit 740a disposed in the first region A1 may be disposed at a higher density than the second oxygen capture unit 740b disposed in the second region A2, but this disclosure is not limited thereto.

[0255] The first oxygen capture unit 740a provided in the first region A1 can be provided in a larger quantity than the second oxygen capture unit 740b provided in the second region A2.

[0256] The seventh embodiment of this disclosure provides a structure in which oxygen trapping portions 740a and 740b are added to the planarization layer 716 throughout the entire area, and the amounts of oxygen trapping portions 740a and 740b added to the first region A1 and the second region A2 are adjusted differently. Therefore, oxygen permeation can be blocked more effectively, and the setting of the oxygen trapping portions can be flexibly adjusted according to the requirements of each region. That is, the position and amount of oxygen trapping portions added to each region can be set to optimize the performance of the display device. The planarization layer can be divided into several regions, and the amount of oxygen trapping portions added to each region can be adjusted differently for each region. For example, a relatively large amount of oxygen trapping portions can be placed in regions where oxygen permeation is more critical, and a smaller amount of oxygen trapping portions can be placed in regions where oxygen permeation is less critical, thereby achieving effective oxygen barrier.

[0257] Exemplary embodiments of this disclosure can also be described as follows: A display device according to an exemplary embodiment of the present disclosure may include: a substrate including a display area and a non-display area; a planarization layer disposed on the substrate and extending from the display area to the non-display area; an anode disposed on the planarization layer; a dam disposed on the planarization layer and exposing a portion of the anode corresponding to the light-emitting area, and extending to the non-display area; an organic layer disposed in the light-emitting area; a cathode disposed on the organic layer and extending to the non-display area; a protective layer disposed on the cathode; and an oxygen trapping portion disposed in the planarization layer below the dam.

[0258] According to another aspect of the invention, the display device may further include at least one trench pattern disposed in a non-display area and configured by removing a planarization layer.

[0259] According to another aspect of this disclosure, the display device may also include power lines configured to cover the inner side of the groove pattern.

[0260] According to another aspect of this disclosure, the power lines can be configured as side surfaces exposed by the trench pattern that are covered by a planarization layer.

[0261] According to another aspect of this disclosure, the cathode can extend in a trench pattern to cover the interior of the power lines.

[0262] According to another aspect of this disclosure, the display device may also include an external structure arranged in an island shape outside the groove pattern to cover the outside of the power lines.

[0263] According to another aspect of this disclosure, the embankment and external structure may be made of a black-based resin.

[0264] According to another aspect of this disclosure, the oxygen capture unit may be disposed in a portion of the upper surface of the planarization layer excluding the anode.

[0265] According to another aspect of this disclosure, the oxygen capture unit may be disposed in the first region of the planarization layer, and may not be disposed in the second region other than the first region.

[0266] According to another aspect of this disclosure, the first region may correspond to the portion of the display region corresponding to the boundary between the sub-pixels and the portion of the non-display region located inside the groove pattern.

[0267] According to another aspect of this disclosure, the second region may correspond to the light-emitting region and the circuit region in which the circuit of the thin-film transistor is disposed, and the first region may correspond to the portion of the display region other than the light-emitting region and the circuit region, as well as a portion of the non-display region other than the trench pattern.

[0268] According to another aspect of this disclosure, the oxygen capture unit may include cerium dioxide (CeO2); barium-calcium (BaCa) based metal oxides; carbon molecular sieves or alkaline earth metals of barium (Ba), magnesium (Mg), strontium (Sr) and beryllium (Be).

[0269] According to another aspect of this disclosure, the protective layer may be made of an inorganic insulating material, and the protective layer may extend into the trench pattern to cover the cathode.

[0270] According to another aspect of this disclosure, the cathode may be configured to extend into the trench pattern and further into the outer structure, and the protective layer may be configured to cover the outer structure, including the cathode.

[0271] According to another aspect of this disclosure, the display device may further include another oxygen capture unit disposed in the protective layer.

[0272] According to another aspect of this disclosure, the oxygen capture unit may be disposed only in the planarization layer located below the embankment outside the display area.

[0273] According to another aspect of this disclosure, the display device may also include another oxygen capture unit disposed in the dike section.

[0274] According to another aspect of this disclosure, the display device may further include a capture layer, which is configured to surround the upper and side portions of the embankment, and the capture layer may include another oxygen capture layer.

[0275] According to another aspect of this disclosure, the oxygen capture unit may include a first oxygen capture unit disposed in a first region of the planarization layer and a second oxygen capture unit disposed in a second region of the planarization layer, and the first oxygen capture unit may be disposed at a higher density than the second oxygen capture unit.

[0276] According to another aspect of this disclosure, the second region may correspond to the light-emitting region and the circuit region in which the circuit of the thin-film transistor is disposed, and the first region may correspond to the portion of the display region other than the light-emitting region and the circuit region, and the portion of the non-display region other than the trench pattern.

[0277] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in various forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are exemplary in all embodiments and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

[0278] Cross-reference to related applications

[0279] This application claims priority to Korean Patent Application No. 10-2025-0056907, filed with the Korean Ministry of Intellectual Property on April 30, 2025, the disclosure of which is incorporated herein by reference.

Claims

1. A display device, the display device comprising: A substrate, the substrate including a display area and a non-display area; A planarization layer is disposed above the substrate and extends from the display area to the non-display area; Anode, wherein the anode is disposed on the planarization layer; A dam portion is disposed on the planarization layer, the dam portion exposing the portion of the anode corresponding to the light-emitting area and extending into the non-display area; An organic layer is disposed in the light-emitting region; A cathode, which is disposed on the organic layer and extends into the non-display area; A protective layer is disposed on the cathode; as well as An oxygen capture unit is disposed in the planarization layer below the embankment.

2. The display device according to claim 1, further comprising: At least one trench pattern is disposed in the non-display area and configured by removing the planarization layer.

3. The display device according to claim 2, further comprising: Power lines, wherein the power lines are configured to cover the inside of the groove pattern in the at least one groove pattern.

4. The display device according to claim 3, wherein, The power lines are configured to cover the side surfaces exposed through the trench pattern of the planarization layer.

5. The display device according to claim 3, wherein, The cathode extends into the trench pattern to cover the interior of the power line.

6. The display device according to claim 3, further comprising: An external structure, arranged in an island shape outside the trench pattern, to cover the outside of the power lines.

7. The display device according to claim 6, wherein, The embankment and the external structure are made of black-based resin.

8. The display device according to claim 1, wherein, The oxygen capture section is disposed in a portion of the planarization layer, and the anode is not included on the upper surface of the portion of the layer.

9. The display device according to claim 1, wherein, The oxygen capture unit is disposed in the first region of the planarization layer, but not in the second region of the planarization layer other than the first region.

10. The display device according to claim 9, wherein, The first region corresponds to the portion of the display region that corresponds to the boundary between the sub-pixels and the portion of the non-display region located inside the groove pattern disposed in the non-display region.

11. The display device according to claim 9, wherein, The second region corresponds to the light-emitting region and the circuit region, wherein the circuit region is provided with a thin-film transistor circuit, and The first region corresponds to the portion of the display area excluding the light-emitting area and the circuit area, and the portion of the non-display area excluding the groove pattern.

12. The display device according to claim 1, wherein, The oxygen capture unit includes cerium dioxide; barium-calcium based metal oxide; carbon molecular sieve; or alkaline earth metals of barium, magnesium, strontium, and beryllium.

13. The display device according to claim 1, wherein, The protective layer is made of inorganic insulating material, and The protective layer extends into the trench pattern to cover the cathode, and the trench pattern is disposed in the non-display area.

14. The display device according to claim 6, wherein, The cathode is configured to extend into the trench pattern and further into the external structure, and The protective layer is configured to cover the outer structure, including the cathode.

15. The display device according to claim 1, further comprising: Another oxygen trapping unit is disposed in the protective layer.

16. The display device according to claim 1, wherein, The oxygen capture unit is located only in the planarization layer below the embankment outside the display area.

17. The display device according to claim 1, further comprising: Another oxygen capture unit is disposed in the dike section.

18. The display device according to claim 1, further comprising: A capture layer, wherein the capture layer is configured to surround the upper and side portions of the dike. The capture layer includes another oxygen capture section.

19. The display device according to claim 1, wherein, The oxygen capture unit includes a first oxygen capture unit disposed in a first region of the planarization layer and a second oxygen capture unit disposed in a second region of the planarization layer, and The first oxygen capture unit is provided with a higher density than the second oxygen capture unit.

20. The display device according to claim 19, wherein, The second region corresponds to the light-emitting region and the circuit region, wherein a thin-film transistor circuit is disposed in the circuit region, and The first region corresponds to the portion of the display region excluding the light-emitting region and the circuit region, and the portion of the non-display region excluding the groove pattern disposed in the non-display region.

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